TW202030818A - Variable pitch multi-needle head for transfer of semiconductor devices - Google Patents

Abstract

A direct transfer apparatus includes a dot matrix transfer head, which includes an impact wire housing and a plurality of impact wires disposed within the impact wire housing and extending out of the impact wire housing. Aguide head is attached to the impact wire housing. The guide head includes multiple holes configured to arrange the plurality of impact wires in a matrix configuration, the matrix configuration being a matched-pitch configuration.

Description

Variable-pitch multi-needle head for transferring semiconductor devices

The present invention relates to a variable-pitch multi-needle head, in particular to a variable-pitch multi-needle head for transferring semiconductor devices.

Semiconductor devices are electrical components that use semiconductor materials such as silicon, germanium, and gallium arsenide. Semiconductor devices are generally manufactured as a single discrete device or integrated circuit (IC). Examples of single discrete devices include electric drive components. For example, light emitting diodes (LED), diodes, transistors, resistors, capacitors, fuses, etc.

The manufacture of semiconductor devices generally involves a complex manufacturing process involving a large number of steps. The finished product manufactured is a "packaged" semiconductor device. The modifier "package" refers to the housing and protection features built into the finished product, and the interface that allows the components in the package to be combined into the final circuit.

The conventional manufacturing process of semiconductor devices starts with the processing of semiconductor wafers. The wafer is cut into a large number of "unpackaged" semiconductor devices. The modifier "unpackaged" refers to unencapsulated semiconductor devices that do not have protective properties. In this context, unpackaged semiconductor devices may be referred to as semiconductor device die, or simply as "die". A single semiconductor wafer can be cut to form dies of various sizes, so that 100,000 or even more than 1,000,000 dies (depending on the original size of the semiconductor) can be formed from the semiconductor wafer, and each die has a specific quality. Then, the unpackaged die is "packaged" through a conventional manufacturing process, which is briefly discussed below. The operation between wafer processing and packaging can be referred to as "die preparation".

In some instances, grain preparation may include grain sorting through a "pick and place process." Through this process, the cut dies are picked up individually and sorted into boxes. The sorting can be performed according to the forward voltage capacity of the crystal grains, the average power of the crystal grains, and/or the wavelength of the crystal grains.

Generally speaking, the packaging process requires the die to be installed in a plastic or ceramic package (for example, a mold or a housing). The packaging process also includes connecting die contacts with pins/wires for bonding/interconnection with the final circuit. The packaging of semiconductor devices is generally accomplished by sealing the die. The purpose of sealing is to prevent the die from being contaminated by the environment (for example, dust).

Then, the product manufacturer places the packaged semiconductor device in the product circuit. Since the packaging has been carried out, the device is ready to be "inserted" into the circuit component of the product. In addition, although the packaging of the device can block it from elements that may cause degradation or damage to the device. However, packaged devices are inherently much larger than the die inside the package (for example, in some cases, the thickness is about 10 times and the area is about 10 times. Therefore, the volume is about 100 times). Therefore, the thickness of the composed circuit element cannot be less than the package of the semiconductor device.

As described above, a single semiconductor wafer can be cut, and 100,000 or more than 1,000,000 dies can be formed from the semiconductor wafer. Therefore, these machines for transferring semiconductor dies require very high precision. Therefore, the transfer mechanism generally has specific design goals and strict restrictions to ensure precision and accuracy. However, these transfer mechanisms generally lack variability and adaptability to different applications or manufacturing purposes. For example, the transfer mechanism is used to transfer the crystal grains of a specific product, which can be reconfigured or adjusted later to transfer the crystal grains of another product. Reconfiguration is time-consuming and inefficient, and sometimes requires the removal and modification of machine parts.

The present invention generally relates to the direct transfer of semiconductor device die from a certain substrate to another substrate (for example, a die substrate (for example, tape, semiconductor wafer on tape, etc.), a circuit substrate (for example, flexible or rigid , Metal or plastic printed circuit board, circuit surface), another die (ie, the die is stacked on the die, and the lower die acts as a "substrate" to accommodate the transferred die)) Institutions also involve the general process of achieving this purpose. In one embodiment, the transfer mechanism can be used to directly transfer unpackaged dies from a substrate such as "wafer tape" to a product substrate such as a circuit substrate. Compared with similar products produced by conventional methods, direct transfer of unpackaged die can greatly reduce the thickness of the final product, as well as the time and/or cost required to manufacture the product substrate.

For ease of description, the term "substrate" refers to any substance on which a process or operation is performed. In addition, the term "product" refers to the expected output of a process or operation, regardless of its completion status. Therefore, the product substrate refers to any substance on which a process or operation is performed in order to obtain the expected output. Wafer tape can also be referred to as a semiconductor device die substrate, or simply a die substrate in this text.

In one embodiment, the transfer mechanism can directly transfer the semiconductor device die from the wafer tape to the product substrate without the need to "package" the die. The transfer mechanism can be vertically arranged above the wafer tape and can drive the collision line to press the product substrate on the die through the wafer tape. This die pressing process can peel the die from the wafer tape from the side of the die until the die is separated from the wafer tape and attached to the product substrate. That is, by reducing the adhesive force between the die and the wafer tape, and increasing the adhesive force between the die and the product substrate, the transfer of the die can be completed.

The transfer machine can hold the product substrate used to hold "unpackaged" dies (for example, LEDs transferred from wafer tape). In order to reduce the size of products using crystal grains, the crystal grains are very small and thin. For example, the height of the crystal grains may be about 12 to 50 microns, and the lateral dimension thereof may range from about 100 to 400 microns, or above or below this range. However, the embodiment of the transfer machine described herein may be sufficient to transfer crystal grains with a size larger than the above-mentioned size. However, the embodiments of the transfer machine described herein are particularly suitable for transferring micro LEDs in the size range described above. Due to the relatively small size of the die, the transfer machine includes components for accurately aligning the wafer tape carrying the die and the product substrate to ensure accurate placement and/or avoid product material waste. In one embodiment, the component that aligns the product substrate with the die on the wafer tape may include a set of frames. The wafer tape and the product substrate are respectively fixed in the frame and separately transported to the alignment position, so that the specific die on the wafer tape is transferred to a specific point on the product substrate.

The frame conveying the product substrate can be moved in various directions, including the horizontal direction and/or the vertical direction, and even the direction that can be transferred to the curved surface. The frame that transports the wafer tape can also move in all directions. A system consisting of gears, rails, motors, and/or other components can be used to fix and transport the frame that carries the product substrate and the wafer tape, respectively, to align the product substrate with the wafer tape and place the die on The correct position of the product substrate. Each frame system can also be moved to the extraction position to assist in the extraction of wafer tape and product substrates when the transfer process is completed.

In one embodiment, the transfer mechanism may include a multi-needle transfer head, which is similar to a print head used in a dot matrix printer. Therefore, it may also be referred to as a "dot transfer head" hereinafter. The dot matrix transfer head may include a plurality of collision lines (also referred to herein as “needles” or “pins”), and the collision lines may be driven simultaneously or individually in sequence. The multiple collision lines can be used to directly transfer multiple semiconductor device dies from a first substrate such as a wafer tape to a second substrate such as a product substrate. The dot matrix transfer head may further include a housing, and the housing may include a driving assembly for controlling the driving of a plurality of collision lines. The dot matrix transfer head may further include an unfolding unit. The unfolding unit can be used to disperse multiple collision lines at specified intervals. In one embodiment, the deployment unit may be used as a part of the housing. However, in another embodiment, the deployment unit can be detachably attached to the housing. The dot matrix transfer head may further include a guide or a guide head, which may be attached to the side of the unfolding unit and/or the housing. The guide can be used to maintain the lateral position of multiple collision lines during the transfer process. In one embodiment, the guide may be in contact with the surface of the wafer tape. However, in other embodiments, the guide may be arranged near the surface of the wafer tape without any direct contact or only intermittent direct contact.

In one embodiment, the multiple collision lines may adopt a multi-pitch lattice configuration (referred to herein as “multi-pitch”). The term "pitch" as used herein refers to the spacing between objects or points. However, when the term “pitch” is used to refer to the arrangement of multiple collision lines, it means that the multiple collision lines may be aligned or misaligned with one or more other components (for example, die to be transferred). For example, in one embodiment, the multi-pitch configuration can arrange multiple collision lines at a constant interval. In this embodiment, the multiple collision lines may be arranged evenly spaced apart from each other, instead of being aligned with the circuit trace or the semiconductor device die. Therefore, when the semiconductor device dies on the wafer tape or the circuit traces on the product substrate are not evenly spaced (that is, there are multiple different pitches between the dies or tracers), the multiple sections of the multiple collision lines Distance configuration is more useful. Therefore, the term "multi-pitch" is used. For example, the multiple collision lines are evenly spaced from each other, which can increase the probability that at least one of the multiple collision lines is aligned with at least one of the semiconductor device die or the circuit trace. The guide head can be attached to multiple collision lines in a multi-pitch configuration to realize a multi-pitch configuration.

Additionally, and/or alternatively, in an embodiment, the plurality of collision lines may be arranged in a matching pitch configuration. In such an embodiment, the plurality of collision lines may be aligned with a predetermined pitch of circuit traces on the product substrate or a predetermined pitch of semiconductor device die on the wafer tape. Which component is aligned with can be determined according to the circuit trace or the semiconductor device die which is easier to achieve more uniform spacing. For example, if the circuit traces are more evenly spaced than the semiconductor device dies when fixed in a frame, when arranged in a matching pitch configuration, the multiple collision lines can be aligned with the circuit traces.

This application incorporates the following patent applications by reference in their entirety: Submitted on November 12, 2015, with the title "Apparatus for Transfer of Semiconductor Devices". Now, it is issued as US Patent No. 9,633,883, US Patent Application No. 14/939,896; and, filed on May 12, 2018, entitled “Method and Apparatus for Multiple Direct Transfers of Semiconductor Devices”, US No. 15/978,094 patent application.

Figure 1 illustrates an embodiment of an apparatus 100 (or "direct transfer apparatus"), which can be used to directly transfer unpackaged semiconductor device die from wafer tape 102 to product substrate 104, or similar Ground, transfer other electrical components from the carrier substrate (ie, the substrate that carries one or more electrical components) to the product substrate. Wafer tape can also be referred to as a semiconductor device die substrate, or simply a die substrate in this text. The apparatus 100 may include a product substrate conveying mechanism 106 and a wafer tape conveying mechanism 108. The product substrate conveying mechanism 106 may include a product substrate frame 110, and the wafer tape conveying mechanism may include a wafer tape frame 112. In one embodiment, the product substrate frame 110 and the wafer tape frame 112 can respectively stretch the product substrate and the wafer tape to expand the stretched circuit traces and semiconductor device dies through the stretching force. However, for example, in the case where the material of the product substrate has minimal relative stretch/flexibility characteristics, stretching is not required. The device 100 may further include a transfer mechanism 114, such as a dot matrix transfer head (labeled 114 herein). As shown in the figure, it can be vertically arranged above the wafer tape 102. In an embodiment, the dot matrix transfer head 114 may be located at a position almost in contact with the wafer tape 102.

The dot matrix transfer head 114 may further include a guide head 116, and one collision line 118(1) among multiple collision lines (118(1), 118(2),... 118(n); collectively referred to as 118 herein). ) Insert one of the plurality of holes 120 of the guide head to maintain the position of each collision line 118 during the transfer operation. For example, the guide head 116 can arrange multiple collision lines 118 in an m x n matrix configuration. In this embodiment, the plurality of collision wires 118 can be inserted into the plurality of holes 120 of the guide head 116, so as to guide the plurality of collision wires 118 in a m x n matrix configuration (for example, a 12x2 matrix configuration, including twelve columns). , Two rows of holes) in the drive. Additionally, the guide head 116 can be easily replaced with another guide head having the same or different porous configuration. For example, the first guide head can be attached to the dot matrix transfer head 114 having a 12x2 matrix configuration for the first circuit design. When transferring in a second circuit design different from the first circuit design, a second guide head having an 8×3 matrix or other configuration can be attached to the dot matrix transfer head 100 to replace the first guide head. In one embodiment, the guide head 106 includes a bottom side and an attachment side opposite to the bottom side, and the guide head 116 is detachably attached to the dot matrix transfer head 114 through the attachment side.

The multiple collision wires 118 may be connected with the actuator 122. The actuator 122 may include a motor (not shown) connected to a plurality of collision wires 118, and the motor is used to drive the plurality of collision wires 118 toward the wafer tape 102 according to a predetermined/programmed time. In such an embodiment, the actuator 122 and/or the device 100 may be communicatively coupled with a controller (not shown) that is used to activate/control the actuator 122 and/or other functions described herein . In one embodiment, the multiple collision lines 118 can be used to directly transfer the unpackaged semiconductor device die 124 from the wafer tape 102 to the product substrate 104, so that at least one semiconductor device die 124 is connected to at least one circuit trace. 126 touch and bond. Since the dot matrix transfer head 114 includes multiple collision lines 118, the dot matrix transfer head 114 can be configured and programmed to transfer multiple semiconductor device dies 124 at the same time. Additionally, and/or alternatively, the dot matrix transfer head 114 may use multiple collision lines 118 to transfer multiple semiconductor device dies 124 in sequence. Figure 1 shows three collision lines 118. However, in an embodiment, the dot matrix transfer head 114 may include two or more collision lines 118. For example, the plurality of collision lines 118 may include collision lines of 2, 3, 6, 12, 24, etc., and the number may also be between or greater than the number of examples.

Regardless of the number, each of the plurality of collision lines can be independently driven to drive a single collision line of the plurality of collision lines 118 individually and/or in one or more groups. That is, for example, the dot matrix transfer head 114 may drive a single collision line 118(1) at a time, drive two or more collision lines at a time (for example, 118(1) and 118(n)), and/or drive at a time All the collision lines in the plurality of collision lines 118. In this embodiment, the use of a set of multiple collision lines 118 can make the transfer mechanism more efficient than a mechanism using a single collision line. For example, when the dot matrix transfer head 114 moves on the product substrate, the transfer mechanism using multiple collision lines 118 can transfer more than one die at a time. Transferring multiple dies through a set of multiple collision wires 118 or a set of multiple pins 118 can greatly shorten the total transfer time and reduce the moving distance of the transfer mechanism that needs to be moved in other ways. In one embodiment, the multiple collision lines 118 can be driven simultaneously or sequentially. However, in another embodiment, as described above, one or more (not all) of the multiple collision lines can be driven simultaneously or substantially simultaneously.

FIG. 2 illustrates a schematic top view of an embodiment of the direct transfer device 100 in which multiple collision lines 202 are arranged in a multi-pitch configuration, and an embodiment of the semiconductor device die 204 and the circuit trace 206. As shown in Figure 2, in a multi-pitch configuration, each of the collision lines 202 in a row can be evenly spaced from each other. However, in an alternative embodiment, the multiple collision lines 202 may be unevenly spaced in a multi-pitch configuration. In a multi-pitch configuration, the multiple collision lines 202 may be close to each other. This multi-pitch configuration arranges one of the multiple collision lines 202 in close proximity to the other collision line. As mentioned above, the reason for adopting the multi-pitch configuration is that the multiple collision lines can accommodate semiconductor device dies and/or circuit traces arranged at a variety of different pitches (or “intervals”). Since only one collision line in a row is continuously adjacent to another collision line, if the semiconductor device dies or circuit traces used in the transfer process are fixed in their respective frames with uneven spacing, a multi-pitch configuration can be used. As described above, a guide head can be attached, and multiple collision lines 202 can be arranged in the configuration shown in FIG. 2 through multiple holes of the guide head, thereby realizing a multi-pitch configuration. Additionally, and/or alternatively, in one embodiment, the plurality of collision lines 202 may be attached to a transfer mechanism to arrange the plurality of collision lines 202 in a multi-pitch configuration. In a multi-pitch configuration, the plurality of collision lines 202 may be spaced, for example, 0.1 mm to 2 mm, 0.25 mm to 1 mm, 0.35 mm to 0.75 mm, 0.4 mm to 0.6 mm.

In one embodiment, the semiconductor device die 204 can be transferred to a position where the collision line 202, the semiconductor device die 204, and the circuit trace 206 are all aligned to drive the collision line 202 to the semiconductor device die 204, so that the collision line is in Pressure is applied to the semiconductor device die 204 to make it contact and bond with the circuit trace 206. This position is shown in position A. Additionally, and/or alternatively, in one embodiment, the three components (impact line, semiconductor device die, and circuit trace) can be transferred without being completely aligned. For example, in one embodiment, if the components are aligned within the tolerance threshold, the semiconductor device die 204 may also be transferred. Positions B and C show that the three components are not aligned through the central axis, but the possible positions of the semiconductor device die 204 can still be transferred. This tolerance can be determined according to the quality constraints of the final product.

FIG. 3 illustrates a schematic top view of an embodiment of the direct transfer device 100 in which a plurality of collision lines 302 are arranged in a matching pitch configuration, and an embodiment of the semiconductor device die 304 and the circuit trace 306. As shown in Figure 3, in the matched ending configuration, each impact line 302 is aligned with another type of component. In the particular embodiment shown in FIG. 3, the plurality of collision lines 302 are aligned with the circuit traces 306 in a matched pitch configuration. Additionally, and/or alternatively, in one embodiment, the plurality of collision lines 302 may be aligned with the semiconductor device die 304. In one embodiment, the plurality of collision lines 302 may be aligned with another component that is more evenly spaced from each other. For example, if the spacing between each piece of circuit trace 306 is more uniform, the multiple collision lines 302 will be aligned with the circuit trace 306 in a matching pitch configuration. However, if the semiconductor device dies 304 are spaced more uniformly, the multiple collision lines 302 will be aligned with the semiconductor device dies 304 in a matching pitch configuration. The matching pitch configuration can make two of the components basically remain stationary between two transfer operations, and at the same time, adjust the third component as needed. For example, if the multiple collision lines 302 are aligned with the circuit traces 306 in a matched pitch configuration, the semiconductor device die 302 may be the only component that needs to be adjusted for transfer. Therefore, there is no need to move the transfer mechanism, wafer tape, and product substrate to a position aligned with the three components, and only one component (for example, a wafer with semiconductor device dies arranged on it) needs to be adjusted between two transfer operations. Tape) to ensure that all three components are fully aligned. As described above, the guide head can be attached, and the multiple collision lines 302 can be arranged in the matching pitch configuration shown in FIG. 3 through the multiple holes of the guide head, thereby achieving the matching pitch configuration. Additionally, and/or alternatively, in one embodiment, a guide head that can be adjusted between a matching pitch and a multi-pitch configuration can be used without the need to replace the guide head. Further, in an embodiment, the plurality of collision wires 302 may be attached to the transfer mechanism to arrange the plurality of collision wires 302 in a matching pitch configuration.

In one embodiment, a multi-pitch or matching pitch configuration can be selected based at least in part on the pitch of the circuit traces on the product substrate and/or the pitch of the semiconductor device die on the wafer tape. Additionally, and/or alternatively, in one embodiment, the plurality of collision lines may be grouped, the first partial collision line arrangement may be arranged in a multi-matching configuration, and the second partial collision line arrangement may be arranged in a matching pitch configuration. In one embodiment, the direct transfer device can automatically switch the guide head, and configure multiple collision lines in a multi-pitch or matching-pitch configuration. Additionally, and/or alternatively, the operator can modify the guide head on the dot matrix transfer head to place the needle in the desired configuration.

The above process is shown in Figure 4. For ease of description, at least a part of the process 400 is performed by the direct transfer device 100. However, in an embodiment, the process 400 may be performed by another device and/or an external controller, computing resource, or an operator. It should be noted that any and/or all steps can be performed by the operator. However, due to the nature of the application, the size of the product components and the expected working speed, these steps are best performed by the processing function of the electronic device. Additionally, and/or alternatively, in one embodiment, any and/or all steps may be fully automated and performed by the direct transfer device 100.

In step 402, the pitch of one of the components is determined. For example, semiconductor device dies and/or circuit traces. That is, the interval between each semiconductor device die and/or each circuit trace is determined.

In step 404, it is determined how to configure multiple collision lines based at least in part on the determined semiconductor device die and/or circuit trace pitch. In such an embodiment, it can be determined whether the multiple collision lines are configured in a matching pitch configuration or a multi-pitch configuration. The determining step can be based at least in part on which configuration can more effectively transfer the semiconductor device die from the wafer tape to the product substrate.

In step 406, the multiple collision lines are configured in a matching pitch configuration or a multi-pitch configuration. In an alternative embodiment, the collision line may be configured in a completely different configuration (for example, a circular pattern, a mixed pattern, etc.). Therefore, the plurality of collision lines can be arranged in a specific configuration by attaching the guide head, thereby arranging the plurality of collision lines.

FIG. 5 illustrates a schematic top view of a plurality of collision lines 502 arranged in a multi-pitch configuration, and an exemplary movement of the transferable semiconductor device die 504 direct transfer apparatus 100 according to an implementation. Figure 5 illustrates the possible advantages of using a multi-pitch dot matrix transfer head instead of the one-click wire transfer mechanism, or a multi-collision line mechanism with a fixed collision line. For example, FIG. 5 shows the advantage of arranging multiple collision lines 502 in a multi-pitch configuration when the distance between the semiconductor device die 504 and the circuit trace 506 is not uniform. Separating the multiple collision lines 502 in such a manner that one immediately follows the other can increase the chance that the collision lines align with at least one other component. In some instances, the chance of the collision line being aligned with the two other components can be increased to facilitate the transfer operation. For example, positions A and B represent positions where the transfer operation can be performed without any adjustment of any parts. In one embodiment, the transfer mechanism can transfer multiple semiconductor device dies 504 at the same time. Position C may represent a position where the transfer head and/or another component may need to be adjusted. In this example, the transfer mechanism may require slight adjustments to the dot matrix transfer head and wafer tape to perform the transfer operation at position C. In one embodiment, the transfer mechanism may preferentially perform transfer operations that only require slight adjustments. Then, carry out the transfer operation that requires substantial adjustment. For example, in one embodiment, the transfer mechanism may transfer semiconductor device die 504 at positions A, B, and C. Then, make a larger adjustment (or "bounce") to the next row and adjust the parts to complete the transfer operation at position D. This process is further explained with reference to Figure 7 below.

6 illustrates a schematic top view of a plurality of collision lines 602 arranged in a matching pitch configuration, and an exemplary movement of the direct transfer apparatus 100 for a transferable semiconductor device die 604 according to an embodiment. FIG. 6 shows the advantage of arranging multiple collision lines 602 in a matching pitch configuration when the spacing of the semiconductor device die 604 or the circuit trace 606 is substantially uniform. In the specific example shown in FIG. 6, the intervals of the circuit traces 606 are relatively uniform, and the multiple collision lines 602 are aligned therewith. However, in one embodiment, the multiple collision lines 602 may be aligned with the semiconductor device die 604. As shown in FIG. 6, aligning the multiple collision lines 602 with the circuit trace 606 can reduce the amount of adjustment required to complete the transfer of the semiconductor device die 604. For example, positions A and C in Figure 6 show the positions where the transfer can be completed immediately without any adjustments. At position B, the slight adjustment of a semiconductor device die 604 is the only adjustment operation required to complete the transfer of the semiconductor device die 604. As mentioned above, the transfer mechanism can give priority to transfer operations that require only minor adjustments. Then, carry out the transfer operation that requires substantial adjustment. In one embodiment, the transfer mechanism can make slight adjustments to the slow-moving axis, and at the same time make large adjustments to the fast-moving axis to "jump" to position D.

FIG. 7 illustrates an adjustment method 700 performed by the device 100 for determining the direct transfer of semiconductor device die according to an embodiment of the present application. For ease of description, at least a part of the process 700 is performed by the direct transfer device 100. However, in an embodiment, the process 700 may be performed by other devices and/or external controllers or computing resources. It should be noted that any and/or all steps can be performed by the operator. However, due to the nature of the application, the size of the product components and the expected working speed, these steps are best performed by the processing function of the electronic device. Additionally, and/or alternatively, in one embodiment, any and/or all steps may be fully automated and performed by the direct transfer device 100.

The method 700 (and each process described herein) is shown as a logical flow chart, where each operation represents a series of operations that can be implemented by hardware, software, or a combination thereof. In the context of software, the operations represent computer-executable instructions stored in one or more computer-readable media. When the instructions are executed by one or more processors, the operations are performed. Generally speaking, computer executable instructions include routines, programs, objects, components, data structures, etc. that perform specific functions or use specific abstract data types.

The computer calibration medium may include non-transitory computer calibration storage media, which may include hard disks, floppy disks, optical disks, CD-ROMs, DVDs, read-only memory (ROM), random access memory (RAM), EPROMS, EEPROMS, flash memory, magnetic or optical cards, solid-state memory devices, or other types of storage media suitable for storing electronic instructions. In addition, in some embodiments, the computer-readable medium may include a computer-readable temporary signal (compressed or uncompressed). Examples of computer-readable signals (regardless of whether they are modulated by a carrier) include, but are not limited to, signals that instruct computer systems hosting or executing computer programs to be accessed through configuration, including signals downloaded through the Internet or other networks. Finally, unless otherwise stated, the order in which the operations are described should not be considered restrictive. Any number of the operations can be combined in any order and/or in parallel to implement the process.

In 702, the device can determine the location of one or more components. In one embodiment, the device can determine the location of each component. The term "component" used above includes, but is not limited to, transfer head (for example, dot matrix transfer head), wafer tape and each semiconductor device die arranged on the wafer tape, as well as the product substrate and the product substrate Each piece of circuit trace or expected transfer position. Therefore, in step 702, the device may determine the position of each of these components. More specifically, in step 702, the device can determine the position directly below the transfer head, as shown in Fig. 2-5. The device can determine the position of each collision line, and can determine where to arrange the multiple circuit traces and the multiple semiconductor device dies around. Before any transfer operation is completed, step 702 can be completed to enable the transfer device to locate the circuit trace and the position of the semiconductor device die and draw. In this embodiment, the device knows the positions of the circuit traces and semiconductor device dies, and only needs to determine the relative position of the transfer head with respect to the known positions of other components. However, in another embodiment, the device can instantly determine the location of the component. That is, when the transfer head moves over the substrate, one or more sensors can "predict" and determine the position of the part when the transfer process is completed.

In step 704, the device can determine whether there is any position where the transfer operation can be performed without any adjustment. That is, once the transfer head moves to a specific position, it can be determined whether there is any position where the collision line, the semiconductor device die and the transfer position (such as the circuit trace, as an example transfer position in this article) are sufficiently aligned to complete the semiconductor device die Transfer. As mentioned above, the collision line, semiconductor device die, and circuit trace do not need to be completely aligned through the central axis. However, in one embodiment, the device can determine whether it is aligned within a certain tolerance threshold. This tolerance threshold can be determined according to the limiting conditions of the final product quality. If the device determines that the three components are sufficiently aligned within the threshold range, the process will continue to step 706.

In step 706, the apparatus may drive at least one and/or all collision lines that are sufficiently aligned with the semiconductor device die and circuit traces. For example, if the device determines that the first, third, and fourth collision lines are sufficiently aligned with other components, the transfer head can drive the first, third, and fourth collision lines simultaneously or sequentially.

Once the device has transferred all semiconductor device dies that can be transferred without adjustment, the device may determine in step 708 whether there are other semiconductor device dies that can be transferred at the current location. If other semiconductor device dies can be transferred without slight adjustment, the transfer head can move to the next position. Alternatively, if the entire wafer tape of the semiconductor device die has been transferred, the process will end after step 710 is completed. However, if there are still semiconductor device dies that need to be transferred, the process can be restarted from step 702, as indicated by the optional arrows from step 710 to step 702. Alternatively, since the device determines the position of the component and transfers possible semiconductor device die without adjustment, the device can skip steps 702 and 704. Since there is no other possible transfer position without adjustment, it can be executed according to the "No" path after step 704. In this embodiment, the "yes" path after step 708 can be performed after step 712, as shown in FIG.

Returning to step 704, if the device determines that the three components are not sufficiently aligned within the threshold range, the process will proceed to step 712. In step 712, the apparatus may determine the transfer position of the semiconductor device that requires the least amount of adjustment. Therefore, the device will determine the next transfer operation that requires the least amount of movement and can be completed in the least amount of time. However, in one embodiment, in step 712, the device may determine a series of movements that can optimize the amount of adjustment required to complete the remaining transfer operation at the specified position (ie, the cross section of the wafer tape).

In step 714, the device may adjust one or more components so that the three components are fully aligned to complete the transfer operation. In the multi-pitch configuration described above, the device can adjust up to all three components. The device can simultaneously adjust all three components in a multi-pitch configuration to limit the movement distance of any one component required for the alignment of the three components. Therefore, the time between two transfer operations is shortened. However, the device can hold one or more components stationary. Moving one or more other components relative to the first component is similar to the example shown in FIG. 4. In the above-mentioned matching pitch configuration, the device can keep two of the components stationary and only slightly adjust the other component, similar to the example shown in FIG. 5.

In step 716, once the adjustment is completed and at least one semiconductor device die is transferred, the apparatus can determine whether there are other semiconductor device die that can be transferred after the adjustment is performed.

In step 718, the apparatus may drive at least one and/or all collision lines that are sufficiently aligned with the semiconductor device die and circuit traces.

The process may return to step 708 to determine whether there are other semiconductor device die to be transferred at a position close to the transfer head.

As mentioned above, in one embodiment, the device can prioritize large and small adjustments on different moving axes. For example, the small adjustment performed in step 714 (or the adjustment where the required adjustment distance is lower than the predetermined distance threshold) can be performed on the slow moving axis of the device, and the large adjustment (or the required adjustment distance is higher than the predetermined distance) The adjustment of the threshold. For example, switching columns, or moving the transfer head to the next position in step 710) can be performed on the fast moving axis. In this way, the capacity of the device can be optimized and the time between two transfer operations can be shortened. However, in one embodiment, the process can be performed in the opposite way, with small movements on the fast moving axis and large movements on the slow moving axis. This method has advantages when a large number of small adjustments are required, and the total time required for small adjustments is greater than the time required for large adjustments. It should be noted that in the specific example of this application, "small" and "large" movements can be in the order of micrometers, and "fast" and "slow" movements can be in the order of milliseconds. For example, a small adjustment may be about 0.45mm +/-50 microns or less, and a large adjustment may be about 2mm. In addition, the "fast" movement can be 0.1 to 10 milliseconds, and the slow movement can be 10 to 30 milliseconds. The number described is only an example, and does not limit the functions or actions described. to sum up

In the above, a number of embodiments have been described in terms of structural features/or method behavior. However, it should be understood that the claims are not limited to the specific features or behaviors described. Rather, the described features and behaviors are illustrative forms of implementing the claimed subject matter. In addition, the term "may" used herein refers to one or more embodiments, not the possibility of specific features used in all embodiments.

100, 200, 300, 500, 600: direct transfer device 102: Wafer tape 104: product substrate 106: Product substrate conveying mechanism 108: Wafer tape conveying mechanism 110: product substrate frame 112: Wafer tape frame 114: Transfer mechanism (dot matrix transfer head) 116: guide head 118(1), 118(2), 118(n), 202, 302, 502, 602: collision line 120: hole 122: Actuator 124, 204, 304, 504, 604: semiconductor device die 126, 206, 306, 506, 606: circuit trace 400, 700: method (process) 402, 404, 406, 702, 704, 706, 708, 710, 712, 714, 716, 718: steps

Detailed description is given with reference to the drawings. In the drawings, the leftmost number of the reference number indicates the figure where the reference number first appears. The use of the same reference numbers in different drawings indicates similar or identical items. In addition, the drawings may be considered to provide an approximate description of the relative dimensions of a single component in a single figure. However, the drawings are not drawn to scale, and the relative dimensions of a single part between a single drawing and different drawings may be different from the drawings. In particular, certain drawings may show parts as specific sizes or shapes. In other figures, for clarity, the proportions of the same parts may be larger or have different shapes.

Figure 1 is a schematic diagram of an embodiment of a direct transfer device in a pre-transfer position.

Figure 2 illustrates a schematic top view of a multi-pitch configuration direct transfer device, circuit traces and semiconductor device dies.

Figure 3 illustrates a schematic top view of a matching pitch transfer device, circuit traces and semiconductor device dies.

Figure 4 illustrates the method of determining the multiple collision lines of the direct transfer device.

FIG. 5 illustrates a schematic top view of multiple collision lines arranged in a multi-pitch configuration, and an exemplary movement of a transferable semiconductor device die transfer apparatus according to an embodiment of the present application.

FIG. 6 illustrates a schematic top view of a plurality of collision lines arranged in a matching pitch configuration, and an exemplary movement of a transferable semiconductor device die transfer apparatus according to an embodiment of the present application.

FIG. 7 illustrates an adjustment method for determining a die transfer device for transferring a semiconductor device according to an embodiment of the present application.

100: Direct transfer device

102: Wafer tape

104: product substrate

106: Product substrate conveying mechanism

108: Wafer tape conveying mechanism

110: product substrate frame

112: Wafer tape frame

114: transfer mechanism (dot transfer head)

116: guide head

118(1), 118(2), 118(n): collision line

120: hole

122: Actuator

124: Semiconductor device die

126: circuit trace

Claims (20)

A device that can be used to directly transfer one semiconductor device die among a plurality of semiconductor device die from a first substrate to a second substrate; the first substrate has a first side and a second side, and the semiconductor device die The particles are arranged on the first side of the first substrate; the device includes: A first frame for holding the first substrate; A second frame for holding the second substrate at a position adjacent to the first side of the first substrate; and The transfer mechanism includes a plurality of collision lines arranged adjacent to the first frame and extending in a direction toward the second side of the first substrate, wherein the plurality of collision lines are arranged in multiple pitches Configuration, the multi-pitch configuration evenly spaced multiple collision lines from each other. The device of claim 1, further comprising a guide head configured to arrange the plurality of collision lines in a first matrix configuration. Such as the device of claim 2, wherein the first matrix is configured as an m x n matrix, and m and n include any real numbers. The device of claim 1, wherein the device includes one or more inductors for determining the interval between one or more components, and the component includes at least the plurality of collision lines, the semiconductor device die, and the The circuit traces on the second substrate. Such as the device of claim 2, wherein the guiding head is the first guiding head and is configured to be interchangeable with the second guiding head. The device of claim 5, wherein the second guiding head is configured to arrange the plurality of collision lines in a second matrix configuration, the second matrix configuration being different from the first matrix configuration. The device of claim 1, wherein the plurality of collision lines are configured to be configured in a substantially circular pattern. Such as the device of claim 1, wherein the multiple collision lines are configured to match the pitch configuration. A direct transfer device can be used to transfer semiconductor device die from a first substrate to a circuit trace arranged on a second substrate; the first substrate has a first side and a second side, and the semiconductor device die Arranged on the first side of the first substrate; the direct transfer device includes: Lattice transfer head, including: Impact line housing, and A plurality of collision lines are arranged in the collision line housing and extend to the outside of the collision line housing, the plurality of collision lines are arranged in a matrix configuration, and the matrix configuration is a matching pitch configuration. The direct transfer device of claim 9, wherein the matching pitch configuration includes a layout alignment arrangement of the plurality of collision lines and the semiconductor device die or one of the circuit traces. The direct transfer device of claim 10, wherein the plurality of collision lines are aligned based at least in part on the semiconductor device die or the one of the more evenly spaced circuit traces. For example, the direct transfer device of claim 9 further includes a guide head configured to match the pitch configuration to fix multiple collision lines. For example, the direct transfer device of claim 12, wherein the guiding head is the first guiding head and is configured to be interchangeable with the second guiding head, and the second guiding head is configured to be fixed in a multi-pitch configuration Multiple collision lines. The direct transfer device of claim 9, wherein the direct transfer device is configured to adjust the semiconductor device die relative to all the semiconductor device dies when the multiple collision lines are aligned with the circuit traces in the matching pitch configuration. Describe the positions of multiple collision lines and circuit traces. A device that can be used to directly transfer semiconductor device die from wafer tape to circuit traces on the product substrate; the device includes: A first frame for holding the wafer tape, the wafer tape having a first side and a second side, and the semiconductor device die is arranged on the first side of the wafer tape; A second frame for holding the product substrate adjacent to the first side of the wafer tape; and The multiple collision lines are fixed in the dot matrix transfer head at the first end of the multiple collision lines, and the multiple collision lines are fixed in the dot matrix transfer head, so that the multiple collision lines are configured to match the pitch configuration. The device of claim 15, wherein the first frame and the second frame are used to stretch the wafer tape and the product substrate, respectively. Such as the device of claim 15, wherein the matching pitch configuration includes an m x n matrix configuration. The device of claim 17, wherein the m x n configuration is configured to substantially match the interval between the circuit traces. The device of claim 15, further comprising a first guide head configured to be interchangeable with the second guide head, and the second guide head is used for arranging the multiple collision lines in a multi-pitch configuration. The device of claim 15, wherein the dot matrix transfer head is configured to be adjustable between the matching pitch and the multi-pitch configuration.

Images