TW202030179A - Ultraviolet absorbing encapsulant for light emitting device and light emitting device including the same - Google Patents
Ultraviolet absorbing encapsulant for light emitting device and light emitting device including the same Download PDFInfo
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- TW202030179A TW202030179A TW109102330A TW109102330A TW202030179A TW 202030179 A TW202030179 A TW 202030179A TW 109102330 A TW109102330 A TW 109102330A TW 109102330 A TW109102330 A TW 109102330A TW 202030179 A TW202030179 A TW 202030179A
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- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 39
- 150000001875 compounds Chemical class 0.000 claims abstract description 46
- -1 indole derivative compound Chemical class 0.000 claims description 45
- 238000002834 transmittance Methods 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 31
- 239000000565 sealant Substances 0.000 claims description 17
- 239000006096 absorbing agent Substances 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 230000031700 light absorption Effects 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 150000001565 benzotriazoles Chemical class 0.000 claims description 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- 150000008366 benzophenones Chemical class 0.000 claims description 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical class OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 3
- 150000003918 triazines Chemical class 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000012760 heat stabilizer Substances 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 1
- 229930195734 saturated hydrocarbon Natural products 0.000 claims 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims 1
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 abstract description 22
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 abstract description 15
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 abstract description 15
- 230000000903 blocking effect Effects 0.000 abstract description 8
- 230000000704 physical effect Effects 0.000 abstract description 6
- 230000000052 comparative effect Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000002745 absorbent Effects 0.000 description 8
- 239000002250 absorbent Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 150000002475 indoles Chemical class 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XFOFBPRPOAWWPA-UHFFFAOYSA-N 6-hydroxyhexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCO XFOFBPRPOAWWPA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- BJUPYZYXKQSFRJ-UHFFFAOYSA-N (2-hydroxy-3-phenoxybutyl) 2-methylprop-2-enoate Chemical compound CC(OC1=CC=CC=C1)C(O)COC(=O)C(C)=C BJUPYZYXKQSFRJ-UHFFFAOYSA-N 0.000 description 1
- ANEJEEOZPSVNPX-UHFFFAOYSA-N (4-hydroxycyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCC(O)CC1 ANEJEEOZPSVNPX-UHFFFAOYSA-N 0.000 description 1
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- OLQFXOWPTQTLDP-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCO OLQFXOWPTQTLDP-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- HVTQDSGGHBWVTR-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-phenylmethoxypyrazol-1-yl]-1-morpholin-4-ylethanone Chemical compound C(C1=CC=CC=C1)OC1=NN(C=C1C=1C=NC(=NC=1)NC1CC2=CC=CC=C2C1)CC(=O)N1CCOCC1 HVTQDSGGHBWVTR-UHFFFAOYSA-N 0.000 description 1
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 1
- VXZBYIWNGKSFOJ-UHFFFAOYSA-N 2-[4-[5-(2,3-dihydro-1H-inden-2-ylamino)pyrazin-2-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC=1N=CC(=NC=1)C=1C=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2 VXZBYIWNGKSFOJ-UHFFFAOYSA-N 0.000 description 1
- AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- FNBNJFFUNDJRAY-UHFFFAOYSA-N CC1=C(CP(C2=CC=CC=C2)=O)C(=CC(=C1)C)C Chemical compound CC1=C(CP(C2=CC=CC=C2)=O)C(=CC(=C1)C)C FNBNJFFUNDJRAY-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical class OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- KAOQCJIKVJCWDU-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCC(CO)CC1 KAOQCJIKVJCWDU-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KIBLHEASAQAHEB-UHFFFAOYSA-N cyclohexanol;2-methylprop-2-enoic acid Chemical class CC(=C)C(O)=O.OC1CCCCC1 KIBLHEASAQAHEB-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZZSKMNCIAKKVRB-UHFFFAOYSA-N morpholin-4-yl-(2-nitrophenyl)methanone Chemical compound [O-][N+](=O)C1=CC=CC=C1C(=O)N1CCOCC1 ZZSKMNCIAKKVRB-UHFFFAOYSA-N 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
本申請案主張基於2019年1月28日申請的韓國專利申請案第10-2019-0010387號的優先權益，所述申請案的全部內容以引用的方式併入本文中。This application claims priority rights based on Korean Patent Application No. 10-2019-0010387 filed on January 28, 2019, and the entire content of the application is incorporated herein by reference.
本發明是關於一種用於防止發光元件劣化的封膠體，且更特定言之，是關於用於發光元件之紫外光吸收封膠體以及包括其之發光元件，所述紫外光吸收封膠體可藉由應用具有紫外光阻擋功能的吲哚類化合物作為封膠體來改良發光元件的物理性質及使用壽命特性。The present invention relates to a molding compound used to prevent the deterioration of light-emitting devices, and more specifically, to a UV-absorbing molding compound used for light-emitting devices and light-emitting devices including the same. The UV-absorbing molding compound can be used by Indole compounds with ultraviolet light blocking function are used as encapsulants to improve the physical properties and service life characteristics of light-emitting elements.
發光元件，特定言之有機發光元件（organic light emitting device；OLED）為一種輻射元件，且由於其具有廣視角及良好對比度的優勢以及快速回應時間、亮度、良好操作電壓及回應速度特性以及可能的多色而廣泛用於廣泛多種領域中。Light-emitting device, in particular organic light emitting device (OLED) is a kind of radiating device, and because of its advantages of wide viewing angle and good contrast, fast response time, brightness, good operating voltage and response speed characteristics and possible Multicolor and widely used in a wide variety of fields.
然而，若此類有機發光元件暴露於氧氣、水分以及紫外光，則由於存在物理性質及使用壽命因劣化現象而下降的問題，必須引入密封構件至元件中以保護有機發光元件免受氧氣、水分以及紫外線侵害。特定言之，由於發光元件在使用期間暴露於光，因此其亦應具有耐光性及耐熱性。However, if such organic light-emitting elements are exposed to oxygen, moisture, and ultraviolet light, the physical properties and service life are reduced due to deterioration, and a sealing member must be introduced into the element to protect the organic light-emitting elements from oxygen and moisture. And UV damage. In particular, since the light-emitting element is exposed to light during use, it should also have light resistance and heat resistance.
就此而言，在所屬領域中，已進行藉由使用UV吸收劑來防止元件受UV損害的研究，所述UV吸收劑諸如二苯甲酮類（benzophenone-based）吸收劑、苯并三唑類（benzotriazole-based）吸收劑、三唑類（triazole-based）吸收劑、三嗪類（triazine-based）吸收劑、水楊酸類（salicylate-based）吸收劑、氰基丙烯酸酯類（cyanoacrylate-based）吸收劑、草醯苯胺類（oxanilide-based）吸收劑、受阻胺類（hindered amine-based）吸收劑以及金屬錯合物鹽類吸收劑（光穩定劑），且目前已公佈大量文獻。In this regard, in the field, research has been conducted to prevent elements from being damaged by UV by using UV absorbers, such as benzophenone-based absorbers, benzotriazoles (Benzotriazole-based) absorbent, triazole-based absorbent, triazine-based absorbent, salicylate-based absorbent, cyanoacrylate-based ) Absorbents, oxanilide-based absorbents, hindered amine-based absorbents and metal complex salt absorbents (light stabilizers), and a large number of documents have been published.
然而，由於此等UV吸收劑主要僅吸收260奈米至380區域內的UV，因此存在其並不阻擋超出上述區域的區域中的UV（例如380奈米至430奈米）的問題。因此，存在研發能夠阻擋甚至在260奈米至380奈米或大於380奈米區域內的UV的吸收率的用於發光元件的封膠體的需要，由此完全防止受UV損害。However, since these UV absorbers mainly only absorb UV in the region from 260 nm to 380, there is a problem that they do not block UV in the region beyond the above region (for example, 380 nm to 430 nm). Therefore, there is a need to develop a molding compound for a light-emitting element that can block UV absorption even in the region of 260 nm to 380 nm or more than 380 nm, thereby completely preventing UV damage.
[技術問題][technical problem]
因此，本發明的一個目的是提供一種用於發光元件之紫外光吸收封膠體以及包括其之發光元件，所述紫外光吸收封膠體可藉由應用吲哚類化合物作為封膠體來改良發光元件的物理性質及使用壽命特性，所述吲哚類化合物具有紫外光阻擋功能且因此具有極佳耐熱及耐光可靠性。 [技術解決方案]Therefore, an object of the present invention is to provide a UV-absorbing encapsulant for light-emitting devices and a light-emitting device including the same. The UV-absorbing encapsulant can improve the performance of light-emitting devices by using indole compounds as the encapsulant. Physical properties and service life characteristics, the indole compound has a UV light blocking function and therefore has excellent heat resistance and light resistance reliability. [Technical Solution]
為實現上述目的，本發明提供用於發光元件之紫外光吸收封膠體，其特徵在於所述紫外光吸收封膠體包括由下式1表示的吲哚類衍生化合物且具有以下等式1的初始透射率及以下等式2的耐光/耐熱透射率。
[式1]
在式1中，R1 及R4 至R7 各自獨立地為由氫、羥基、鹵基、具有1個至5個碳原子的烷基以及具有1個至5個碳原子的烷氧基所組成的族群中選出的任一者，R2 及R3 各自獨立地為具有4個至10個碳原子的直鏈、分支鏈或環狀烴基且具有1個至3個或不具有氮原子及氧原子中的至少一者，且在等式1及等式2中，T0 為在相關波長下的初始透射率，且T1 為在相關波長下在曝光之後的透射率。In Formula 1, R 1 and R 4 to R 7 are each independently composed of hydrogen, a hydroxyl group, a halogen group, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. R 2 and R 3 are each independently a linear, branched, or cyclic hydrocarbon group having 4 to 10 carbon atoms and having 1 to 3 or no nitrogen atoms and At least one of the oxygen atoms, and in Equation 1 and Equation 2, T 0 is the initial transmittance at the relevant wavelength, and T 1 is the transmittance after exposure at the relevant wavelength.
另外，本發明提供一種包括用於發光元件之紫外光吸收封膠體的發光元件。 [有利效應]In addition, the present invention provides a light-emitting element including an ultraviolet light absorbing molding compound for the light-emitting element. [Beneficial effect]
根據本發明的用於發光元件之紫外線吸收封膠體以及包括其之發光元件具有藉由應用吲哚類化合物作為封膠體來改良發光元件的物理性質及使用壽命特性的優勢，其中吲哚類化合物具有紫外光阻擋功能，由此帶來極佳耐熱及耐光可靠性。According to the present invention, the ultraviolet absorbing encapsulant for light-emitting elements and the light-emitting element including the same have the advantage of improving the physical properties and service life characteristics of the light-emitting element by using indole compounds as the encapsulant, wherein the indole compounds have UV light blocking function, which brings excellent heat resistance and light resistance reliability.
下文中，將詳細描述本發明。Hereinafter, the present invention will be described in detail.
根據本發明的用於發光元件的紫外線吸收封裝材料的特徵在於包括由下式1表示的吲哚類衍生化合物且具有以下等式1的初始透射率及以下等式2的耐光/耐熱透射率。
[式1]
在式1中，R1 及R4 至R7 各自獨立地為由氫、羥基、鹵基、具有1個至5個碳原子的烷基以及具有1個至5個碳原子的烷氧基所組成的族群中選出的任一者，R2 及R3 各自獨立地為具有4個至10個碳原子的直鏈、分支鏈或環狀烴基且具有1個至3個或不具有氮原子及氧原子中的任一者，且在等式1及等式2中，T0 為在相關波長下的初始透射率，且T1 為在相關波長下在曝光之後的透射率。In Formula 1, R 1 and R 4 to R 7 are each independently composed of hydrogen, a hydroxyl group, a halogen group, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. R 2 and R 3 are each independently a linear, branched, or cyclic hydrocarbon group having 4 to 10 carbon atoms and having 1 to 3 or no nitrogen atoms and Any one of oxygen atoms, and in Equation 1 and Equation 2, T 0 is the initial transmittance at the relevant wavelength, and T 1 is the transmittance after exposure at the relevant wavelength.
如上文所提及，迄今為止，已使用諸如二苯甲酮類化合物、苯并三唑類化合物、三唑類化合物、三嗪類化合物、水楊酸類化合物、氰基丙烯酸酯類化合物、草醯苯胺類化合物、受阻胺類化合物以及金屬錯合物鹽類化合物（光穩定劑）的UV吸收劑來阻擋發光元件的UV吸收率。然而，由於此等UV吸收劑主要僅吸收260奈米至380奈米區域內的UV，因此存在無法阻擋超出所述區域的區域中的UV（例如400奈米至430奈米）的問題。因此，本發明的申請人已發明一種能夠藉由阻擋甚至在260奈米至380奈米或大於380奈米的UV區域內的吸收率來完全防止受UV損害的用於發光元件的封膠體。As mentioned above, so far, compounds such as benzophenone compounds, benzotriazole compounds, triazole compounds, triazine compounds, salicylic acid compounds, cyanoacrylate compounds, and oxalic acid compounds have been used. Aniline compounds, hindered amine compounds, and metal complex salt compounds (light stabilizers) are UV absorbers to block the UV absorbance of the light-emitting element. However, since these UV absorbers mainly only absorb UV in the region of 260 nanometers to 380 nanometers, there is a problem that they cannot block UV in regions beyond the region (for example, 400 nanometers to 430 nanometers). Therefore, the applicant of the present invention has invented a encapsulant for light-emitting devices that can completely prevent UV damage by blocking the absorption rate even in the UV region from 260 nm to 380 nm or more.
選擇405奈米作為等式1及等式2中的量測波長的原因是在400奈米附近存在降低可靠性的性質（黃化元件損害等）且因此應阻擋相關部分，且為了維持RGB白平衡且增大透射率，430奈米或高於430奈米的藍色波長範圍中的透射率應為高。亦即，由於吸收400奈米附近的光為重要的（其影響可靠性），且為了確保430奈米或大於430奈米處的透射率。如上文所描述選擇405奈米作為量測波長。The reason for choosing 405 nm as the measurement wavelength in Equation 1 and Equation 2 is that there are properties that reduce reliability (yellowing component damage, etc.) near 400 nm, and therefore related parts should be blocked, and in order to maintain RGB white To balance and increase the transmittance, the transmittance in the blue wavelength range of 430 nm or higher should be high. That is, it is important to absorb light near 400 nm (which affects reliability), and to ensure the transmittance at 430 nm or more. As described above, 405 nm is selected as the measurement wavelength.
在式1中，R1 及R4 至R7 各自獨立地為由氫、羥基、鹵基、具有1個至5個碳原子的烷基以及具有1個至5個碳原子的烷氧基所組成的族群中選出的任一者。R1 較佳為具有1個至5個碳原子的烷基，更佳為甲基，且R4 至R7 較佳為氫。In Formula 1, R 1 and R 4 to R 7 are each independently composed of hydrogen, a hydroxyl group, a halogen group, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. Any one selected from the formed ethnic group. R 1 is preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group, and R 4 to R 7 are preferably hydrogen.
另外，在式1中，R2 及R3 各自獨立地為具有4個至10個碳原子的直鏈、分支鏈或環狀烴基且具有1個至3個或不具有氮原子及氧原子中的任一者。較佳地，R2 及R3 各自獨立地為苯基或為包括以下中的至少一者的飽和或不飽和（或可聚合基團）烴基：氰基（-CN基）、烷基、烷氧基、羰基、羧基、羥基、醯胺基、酯基、醚基、丙烯酸酯基以及鹵基。In addition, in Formula 1, R 2 and R 3 are each independently a linear, branched, or cyclic hydrocarbon group having 4 to 10 carbon atoms and having 1 to 3 or not having nitrogen atoms and oxygen atoms. Any one of. Preferably, R 2 and R 3 are each independently a phenyl group or a saturated or unsaturated (or polymerizable group) hydrocarbon group including at least one of the following: cyano (-CN group), alkyl, alkane Oxy, carbonyl, carboxy, hydroxyl, amide, ester, ether, acrylate, and halogen.
在式1中，R2
及R3
的特定實例包括
因此，作為上述取代基所應用於的根據本發明的吲哚類衍生化合物，可例示由式1a至式1j表示的化合物及其異構體。
[式1a]
同時，除了吲哚類化合物以外，根據本發明的用於發光元件之紫外光吸收封膠體可更包括至少一種UV吸收劑，諸如二苯甲酮類化合物、三唑類化合物、苯并三唑類化合物、三嗪類化合物、水楊酸類化合物、氰基丙烯酸酯類化合物、草醯苯胺類化合物、受阻胺類化合物以及金屬錯合物鹽類化合物（光穩定劑）。因此，若額外包括除了吲哚類化合物以外的單獨UV吸收劑，則額外UV吸收劑的含量按100重量份的吲哚類化合物計可以是0.05重量份至5重量份。若額外UV吸收劑的含量按100重量份的吲哚類化合物計小於0.05重量份，則阻擋效果可能並不顯著。若額外UV吸收劑的含量按100重量份的吲哚類化合物計超出5重量份，則原液體的黏度可增大且可發生沈澱現象，且原液體的長期穩定性可能下降。At the same time, in addition to indole compounds, the ultraviolet light absorbing sealant for light emitting elements according to the present invention may further include at least one UV absorber, such as benzophenone compounds, triazole compounds, and benzotriazoles. Compounds, triazine compounds, salicylic acid compounds, cyanoacrylate compounds, oxaniline compounds, hindered amine compounds and metal complex salt compounds (light stabilizers). Therefore, if a separate UV absorber other than the indole compound is additionally included, the content of the additional UV absorber may be 0.05 to 5 parts by weight based on 100 parts by weight of the indole compound. If the content of the additional UV absorber is less than 0.05 parts by weight based on 100 parts by weight of the indole compound, the blocking effect may not be significant. If the content of the additional UV absorber exceeds 5 parts by weight based on 100 parts by weight of the indole compound, the viscosity of the original liquid may increase, precipitation may occur, and the long-term stability of the original liquid may decrease.
同時，除了上述（包含吲哚類化合物的）UV吸收劑以外，根據本發明的用於發光元件之紫外光吸收封膠體亦可包括單官能丙烯酸酯單體、多官能丙烯酸酯單體以及反應起始劑。At the same time, in addition to the above-mentioned UV absorbers (containing indole compounds), the UV-absorbing encapsulant for light-emitting elements according to the present invention may also include monofunctional acrylate monomers, multifunctional acrylate monomers, and reaction initiators. Beginner.
單官能丙烯酸酯單體含有一個丙烯酸酯官能團，且可藉由以下例示（但不限於）：甲基丙烯酸苯甲酯、甲基丙烯酸2-羥乙酯、甲基丙烯酸4-羥丁酯、甲基丙烯酸2-羥丙酯、甲基丙烯酸2-羥丁酯、甲基丙烯酸6-羥己酯、1,4-環己烷二甲醇單甲基丙烯酸酯、甲基丙烯酸1-氯-2-羥丙酯、二乙二醇單甲基丙烯酸酯、1,6-己二醇單甲基丙烯酸酯、甲基丙烯酸2-羥基-3-苯氧基丙酯、甲基丙烯酸4-羥基環己酯、甲基丙烯酸2-羥基-3-苯氧基丁酯、甲基丙烯酸4-羥基環己酯以及包括其兩者或大於兩者的混合物。Monofunctional acrylate monomers contain one acrylate functional group, and can be exemplified by (but not limited to) benzyl methacrylate, 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate, methyl 2-hydroxypropyl acrylate, 2-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate, 1,4-cyclohexanedimethanol monomethacrylate, 1-chloro-2-methacrylate Hydroxypropyl ester, diethylene glycol monomethacrylate, 1,6-hexanediol monomethacrylate, 2-hydroxy-3-phenoxypropyl methacrylate, 4-hydroxycyclohexane methacrylate Esters, 2-hydroxy-3-phenoxybutyl methacrylate, 4-hydroxycyclohexyl methacrylate, and mixtures including two or more of them.
多官能丙烯酸酯單體可包括兩個或大於兩個丙烯酸酯官能團，且同時可包括多環脂環族構架或多環芳族構架，且可藉由以下例示（但不限於）：二季戊四醇六丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、異冰片基二甲醇二(甲基)丙烯酸酯（isobornyldimethanol di(meth)acrylate）、二環戊烯基二甲醇二(甲基)丙烯酸酯以及包括其兩者或大於兩者的混合物。The multifunctional acrylate monomer can include two or more than two acrylate functional groups, and can include a polycyclic alicyclic framework or a polycyclic aromatic framework at the same time, and can be exemplified by (but not limited to) the following: dipentaerythritol hexa Acrylate, triethylene glycol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, isobornyldimethanol di(meth)acrylate, Dicyclopentenyldimethanol di(meth)acrylate and mixtures including two or more thereof.
另外，反應起始劑可藉由以下例示（但不限於）：二苯基(2,4,6-三甲基苯甲醯基)膦氧化物、具有與其相同或類似性質（亦即，具有365奈米至400奈米的光吸收波長範圍）的反應起始劑以及包括其兩者或大於兩者的混合物。In addition, the reaction initiator can be exemplified by (but not limited to) the following: diphenyl (2,4,6-trimethylbenzyl) phosphine oxide, having the same or similar properties (that is, having 365nm to 400nm light absorption wavelength range) reaction initiator and a mixture of two or more.
同時，將相對於構成封膠體的每一組分的含量予以描述。按封膠體的總重量計，UV吸收劑（包含吲哚類化合物）的含量可以是0.5重量%至9重量%，較佳為1重量%至7重量%，單官能丙烯酸酯單體的含量可以是3重量%至95重量%，較佳為40重量%至80重量%，多官能丙烯酸酯單體的含量可以是3重量%至95重量%，較佳為15重量%至60重量%，且起始劑的含量可以是0.1重量%至5重量%，較佳為1重量%至3重量%。然而，此等含量中的每一者僅針對本發明經最佳化且不限於上述數值範圍。若可實現本發明的目的，則不特別限制構成封膠體的每一組分的含量。At the same time, it will be described relative to the content of each component constituting the molding compound. Based on the total weight of the sealant, the content of UV absorbers (including indole compounds) can be 0.5% to 9% by weight, preferably 1% to 7% by weight, and the content of monofunctional acrylate monomers can be It is 3% to 95% by weight, preferably 40% to 80% by weight, the content of the multifunctional acrylate monomer may be 3% to 95% by weight, preferably 15% to 60% by weight, and The content of the initiator may be 0.1% to 5% by weight, preferably 1% to 3% by weight. However, each of these contents is optimized only for the present invention and is not limited to the above numerical range. If the purpose of the present invention can be achieved, the content of each component constituting the molding compound is not particularly limited.
另外，根據本發明的用於發光元件之紫外光吸收封膠體可更包括由下述者所組成的族群中選出的一或多個添加劑：抗氧化劑、熱穩定劑、界面活性劑、流平劑以及消泡劑。在此情況下，只要添加劑不抑制吲哚類化合物的效果的表現，便可非限制性地使用添加劑。In addition, the ultraviolet light-absorbing encapsulant for light-emitting elements according to the present invention may further include one or more additives selected from the group consisting of antioxidants, heat stabilizers, surfactants, and leveling agents And defoamer. In this case, as long as the additive does not inhibit the performance of the effect of the indole compound, the additive may be used without limitation.
同時，根據本發明的用於發光元件之紫外光吸收封膠體在紫外光（特別是處於405奈米至430奈米波長範圍中的UV）以及光或熱條件下具有極佳耐熱/耐光可靠性，由此降低發光元件的物理性質，且最終改良發光元件的使用壽命特性。如上文所描述的本發明的用於發光元件之紫外光吸收封膠體具有以下等式1的初始透射率及等式2的耐光/耐熱透射率。
[等式1]
在等式1及等式2中，T0 為在相關波長下的初始透射率，且T1 為在相關波長下在曝光之後的透射率。In Equation 1 and Equation 2, T 0 is the initial transmittance at the relevant wavelength, and T 1 is the transmittance after exposure at the relevant wavelength.
本發明的用於發光元件之紫外光吸收封膠體應基本上滿足上述等式1（若透射率在405奈米下小於20%，則全部屬於等式1的範圍內），且在耐光/耐熱可靠性（耐光性、耐熱性）之後，應同時滿足等式2（在可靠性之後，當在405奈米下存在大量變化時，耐光/耐熱透射率超出10%）。The UV-absorbing encapsulant for light-emitting elements of the present invention should basically satisfy the above equation 1 (if the transmittance is less than 20% at 405 nm, all belong to the range of equation 1), and be light/heat resistant After reliability (light resistance, heat resistance), Equation 2 should be satisfied at the same time (after reliability, when there is a large change at 405 nm, the light resistance/heat resistance transmittance exceeds 10%).
此處，用於發光元件之紫外光吸收封膠體的UV初始透射率在405奈米至430奈米的波長下可以是例如60%至100%，較佳為80%至95%，如等式1中所示。Here, the initial UV transmittance of the UV-absorbing encapsulant used for the light-emitting element can be, for example, 60% to 100%, preferably 80% to 95% at a wavelength of 405 nm to 430 nm, as shown in the equation Shown in 1.
另外，可例如藉由以下來確認耐光透射率（耐光性）：經由根據KS C IEC 61646標準的UV處理實驗（280奈米至400奈米），根據暴露於日光的情況測試劣化程度，以量測暴露之前及之後的透射率變化。此時，可在於60℃、15千瓦時/平方米（kwh/m2 ）下暴露於光的條件下利用所述標準藉由應用2500瓦氙弧燈來量測耐光性，且在此條件下，耐光性應滿足如等式2中所示的10%或小於10%，且較佳可為7%或小於7%。此時，未能滿足10%或小於10%意謂405奈米的阻擋效能因曝光而降低，使得元件的使用壽命可能縮短。In addition, the light resistance transmittance (light resistance) can be confirmed by, for example, the following: UV treatment test (280 nm to 400 nm) according to the KS C IEC 61646 standard, and the degree of deterioration according to exposure to sunlight, to measure Measure the change in transmittance before and after exposure. At this time, the light resistance can be measured by applying a 2500 watt xenon arc lamp under the condition of exposure to light at 60°C and 15 kWh/m 2 (kwh/m 2 ). , The light resistance should satisfy 10% or less than 10% as shown in Equation 2, and may preferably be 7% or less. At this time, failure to meet 10% or less than 10% means that the blocking efficiency of 405 nm is reduced due to exposure, which may shorten the service life of the device.
另外，可例如在於120℃的溫度下加熱500小時至1,000小時的條件下量測耐熱透射率（耐熱性），且在此條件下，耐熱性可為10%或小於10%，較佳為7%或小於7%，如等式2中所示。同時，在等式2中，術語耐光/耐熱透射率出於描述的便利性使用，且其陳述耐光透射率及耐熱透射率應用於同一等式。In addition, the heat-resistant transmittance (heat resistance) can be measured under the condition of heating at a temperature of 120°C for 500 hours to 1,000 hours, for example, and under this condition, the heat resistance can be 10% or less, preferably 7 % Or less than 7%, as shown in Equation 2. Meanwhile, in Equation 2, the term light-resistant/heat-resistant transmittance is used for convenience of description, and it states that the light-resistant transmittance and the heat-resistant transmittance are applied to the same equation.
同時，本發明提供一種包括上文所描述的用於發光元件之紫外光吸收封膠體的發光元件。亦即，根據本發明的紫外光吸收封膠體適用於諸如發光元件（light emitting device；LED）及有機發光元件（organic light emitting device；OLED）的習知發光元件，且考慮到元件的使用壽命藉由除了因氧氣及水分受損以外亦因來自外部的光受損而降低的事實而較佳應用於有機發光元件。另外，除封膠體以外的發光元件及有機發光元件的基本組態符合其習知基本組態。At the same time, the present invention provides a light-emitting element including the ultraviolet light-absorbing encapsulant for light-emitting elements described above. That is, the ultraviolet light absorbing encapsulant according to the present invention is suitable for conventional light emitting devices such as light emitting devices (LEDs) and organic light emitting devices (OLEDs), and takes into account the service life of the devices. It is preferably applied to organic light-emitting devices due to the fact that it is reduced due to damage due to oxygen and moisture and also due to damage from external light. In addition, the basic configuration of light-emitting elements and organic light-emitting elements other than the molding compound conforms to the conventional basic configuration.
另外，將簡要地描述一種製造包含紫外光吸收封膠體的發光元件的方法。首先，用於發光元件之紫外光吸收封膠體經由諸如驟蒸發、噴墨印刷或旋塗的塗佈方法塗佈在LED或OLED上，且UV固化，且隨後模製成薄板或類似物，接合至基底，且經熱固化以製造包括封膠體的發光元件。In addition, a method of manufacturing a light-emitting element including an ultraviolet light absorbing molding compound will be briefly described. First, the ultraviolet light-absorbing encapsulant used for the light-emitting element is coated on the LED or OLED by a coating method such as rapid evaporation, inkjet printing or spin coating, and UV cured, and then molded into a thin plate or the like, and bonded To the substrate, and thermally cured to manufacture a light-emitting element including a molding compound.
下文中，提供較佳實例以有助於理解本發明，但以下實例僅為對本發明的說明。對所屬領域的技術人員而言顯而易見的是，可在本發明的範疇及精神內進行各種改變及修改，且此等改變及修改在隨附申請專利範圍的範疇內。 實例1：製造紫外光吸收封膠體Hereinafter, preferred examples are provided to help understand the present invention, but the following examples are only illustrative of the present invention. It is obvious to those skilled in the art that various changes and modifications can be made within the scope and spirit of the present invention, and these changes and modifications are within the scope of the appended patent application. Example 1: Manufacturing UV-absorbing sealant
將56.87重量%的苯甲基甲基丙烯酸酯單體、作為多官能丙烯酸酯單體的37.92重量%的三羥甲基丙烷三丙烯酸酯（TRIMETHYLOLPROPANE TRIACRYLATE）、作為起始劑的2.84重量%的二苯基(2,4,6-三甲基苯甲醯基)膦氧化物以及2.37重量%的由式1a表示的吲哚類衍生化合物添加至裝備有攪拌器的三頸燒瓶中，隨後在氮氣氛圍及50℃的溫度下以550轉/分鐘（rpm）攪拌5小時。在使用旋塗機（ACE-200，東亞貿易公司（DongAh Trade Corpý））以880轉/分鐘的速度在玻璃基底上攪拌所獲得化合物23秒之後，所述化合物在25℃的溫度下藉由LED固化機以395奈米的波長在氮氣氛圍下於1,500毫焦/平方公分（mJ/cm2
）的光量下經固化，以製造厚度為8微米的用於發光元件之紫外光吸收封膠體。
[式1a]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1b表示的吲哚類衍生化合物。
[式1b]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1c表示的吲哚類衍生化合物。
[式1c]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1d表示的吲哚類衍生化合物。
[式1d]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1e表示的吲哚類衍生化合物。
[式1e]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1f表示的吲哚類衍生化合物。
[式1f]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1g表示的吲哚類衍生化合物。
[式1g]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1h表示的吲哚類衍生化合物。
[式1h]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1i表示的吲哚類衍生化合物。
[式1i]
以與實例1相同的方式製造用於發光元件之紫外光吸收封膠體，不同之處在於式1a的吲哚類衍生化合物變為由式1j表示的吲哚類衍生化合物。
[式1j]
以與實例1相同的方式製造用於發光元件的封膠體，不同之處在於式1a的吲哚類衍生化合物變為三嗪類UV吸收劑（巴斯夫（BASF）Tinuvin-460）。 比較例2：製造封膠體A encapsulant for a light-emitting element was manufactured in the same manner as in Example 1, except that the indole-based derivative compound of Formula 1a was changed to a triazine-based UV absorber (BASF Tinuvin-460). Comparative Example 2: Manufacturing of sealant
以與實例1相同的方式製造用於發光元件的封膠體，不同之處在於式1a的吲哚類衍生化合物變為苯并三唑類UV吸收劑（巴斯夫Tinuvin-P）。 比較例3：製造封膠體The encapsulant for the light-emitting element was manufactured in the same manner as in Example 1, except that the indole-based derivative compound of Formula 1a was changed to a benzotriazole-based UV absorber (BASF Tinuvin-P). Comparative Example 3: Manufacturing of sealant
以與實例1相同的方式製造用於發光元件的封膠體，不同之處在於式1a的吲哚類衍生化合物變為二苯甲酮類UV吸收劑（巴斯夫Chimassorb-81）。 實驗實例1：評估用於有機發光元件的封膠體的初始透射率The encapsulant for the light-emitting element was manufactured in the same manner as in Example 1, except that the indole-based derivative compound of Formula 1a was changed to a benzophenone-based UV absorber (BASF Chimassorb-81). Experimental example 1: Evaluation of the initial transmittance of the molding compound used for the organic light emitting device
使用UV可見光譜儀（演進（Evolution）600）在透射模式下於300奈米至800奈米下量測實例1至實例10及比較例1至比較例3中製備的封膠體的樣本的透射率，且結果展示於下表1中。
表1：
作為評估根據實例1至實例10及比較例1至比較例3製備的封膠體的初始透射率的結果，確認與比較例1至比較例3的封膠體相比，本發明的吲哚類衍生化合物所應用於的實例1至實例10的封膠體具有顯著優良初始透射率，且由此，可見若將本發明的吲哚類衍生化合物應用於封膠體，則其阻擋400奈米附近的光。 實驗實例2：評估用於有機發光元件的封膠體的耐光透射率As a result of evaluating the initial transmittance of the molding compounds prepared according to Examples 1 to 10 and Comparative Examples 1 to 3, it was confirmed that the indole-derived compound of the present invention was compared with the molding compounds of Comparative Examples 1 to 3 The molding compounds used in Examples 1 to 10 have remarkably excellent initial transmittance, and from this, it can be seen that if the indole-derived compound of the present invention is applied to the molding compound, it will block light around 400 nm. Experimental example 2: Evaluation of light resistance transmittance of encapsulants used for organic light emitting devices
經由使用耐光測試儀（大松萊伯科技（Daesong Labtech），韓國）根據KS C IEC 61646標準（280奈米至400奈米）的UV處理測試，量測當根據實例1至實例10及比較例1至比較例3製備的封膠體暴露於日光時的劣化程度，以量測暴露之前及之後的透射率變化。此時，藉由使用2500瓦氙弧燈根據所述標準在60℃的溫度及15千瓦時/平方米的光量下暴露於光來評估每一封裝材料的耐光透射率，且結果展示於下表2中。 實驗實例3：評估用於有機發光元件的封膠體的耐熱透射率After using a lightfastness tester (Daesong Labtech, South Korea) according to the KS C IEC 61646 standard (280nm to 400nm) UV treatment test, the measurement should be based on Example 1 to Example 10 and Comparative Example 1. The degree of deterioration of the molding compound prepared in Comparative Example 3 when exposed to sunlight is used to measure the change in transmittance before and after exposure. At this time, the light resistance of each packaging material was evaluated by exposing it to light at a temperature of 60°C and a light quantity of 15 kWh/m 2 using a 2500 watt xenon arc lamp according to the standard, and the results are shown in the following table 2 in. Experimental example 3: Evaluation of heat-resistant transmittance of encapsulants for organic light-emitting devices
對於根據實例1至實例10及比較例1至比較例3製備的封膠體，藉由使用高溫烘箱（傑奧特（JEIO Tech），韓國）在空氣中於120℃下加熱500小時來評估每一封膠體的耐熱透射率，且結果展示於下表2中。
表2：
經由在實驗實例2及實驗實例3中評估根據實例1至實例10及比較例1至比較例3製備的封膠體的耐光性及耐熱性的結果，確認本發明的吲哚類衍生化合物所應用於的實例1至實例10的封膠體甚至在抵抗熱/抵抗光之後在短波長下（亦即，在405奈米至430奈米下）具有極佳光阻擋效果。According to the results of evaluating the light resistance and heat resistance of the molding compounds prepared according to Examples 1 to 10 and Comparative Examples 1 to 3 in Experimental Example 2 and Experimental Example 3, it is confirmed that the indole derivative compound of the present invention is applied to The encapsulants of Examples 1 to 10 have excellent light blocking effects even at short wavelengths (ie, at 405 nm to 430 nm) after resisting heat/light.
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