TW202029860A - Circuit board printing device and method - Google Patents

Abstract

An circuit board printing device for circuit board printing. The Circuit board printing device includes at least one printing unit. The printing units are spliced together. Each printing unit is used to carry out the printing of a single circuit board circuit. Each printing unit includes a controller, a printing work stand, a transport rack connecting printing work shelves of the printing work stand, and storage tubs disposed on one side of the transport rack. The controller is used to control the printing and transportation of the circuit board to produce the required board. The invention also provides a circuit board printing method. The Circuit board printing device controls all the printing units splicing and completes the whole process of printing and transportation through the controllers, and fully automatic mass production of the circuit board, and reduces the cost and avoiding heavy use of heavy metals.

Description

Circuit board circuit printing equipment and method

The invention relates to a circuit board circuit printing equipment and method.

In the current circuit board production process, there are always three major pain points: one is the long production cycle, which requires a lot of time and cost due to the many and complex production processes; the second is the high resource occupancy rate, which requires mass production due to the many production processes. Materials and equipment cost a lot of production input; third, a large amount of heavy metals such as copper, nickel, lead and other organic materials are used in the production process, which will bring great harm to the environment and front-line workers.

With the continuous development of the conductive glue industry, the conductivity of conductive glue continues to increase. The conductivity of graphene conductive glue even exceeds the conductivity of copper, which provides the printing and printing of all circuit board processes. good conditions.

In view of the foregoing, it is necessary to provide a circuit board circuit printing device.

In addition, it is necessary to provide a circuit board circuit printing method.

A circuit board circuit printing equipment used for circuit printing of circuit boards. The circuit board circuit printing equipment includes at least one printing unit, the at least one printing unit is spliced and connected, and each printing unit is used to complete a monolithic circuit board circuit Each printing unit includes a controller, a printing work rack, a transport rack connected to the print work rack, and a bucket provided on one side of the transport rack, and the controller is used to control the printing of the circuit board And transportation, get the required circuit board.

A circuit board circuit printing method, the circuit board circuit printing method includes the following steps:

Import the circuit board layout diagram into the controller of each printing unit;

Put the opened circuit board into the feed port of the printing unit, and the circuit board is transported laterally from the transport rack layer under the feed port to the drilling working layer;

After the drilling working layer drills a circuit layer on one side of the circuit board, flip the circuit board and then drill the other circuit layer of the circuit board, and then transfer the circuit board to Circuit printing working layer;

Perform circuit printing on the circuit board, and then the circuit board is transported to the solder resist printing working layer;

Perform solder resist printing on the circuit board, and then the circuit board is transported to the white oil printing working layer;

Perform white oil printing on the circuit board on the white oil printing working layer, and then transport the circuit board to the tin liquid printing working layer; and

Perform tin liquid printing on the circuit board on the tin liquid printing working layer, and then the circuit board is transported to the shipping working layer and shipped out from the shipping port.

When printing circuit boards with more than two circuit layers, the circuit board circuit printing method further includes the following steps: before the solder resist printing working layer is printed and transported to the white oil printing working layer, the circuit The board is transported to the adhesive printing working layer for adhesive printing and then pressed.

The circuit board circuit printing equipment can automatically mass produce circuit boards through the above printing steps, which facilitates production, reduces costs and avoids the use of heavy metals in large quantities.

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

In order to make the objectives, technical solutions, and advantages of the present invention clearer and clearer, the circuit board circuit printing equipment and method of the present invention will be described in further detail and related descriptions below in conjunction with the drawings and embodiments.

As shown in FIG. 1, in a preferred embodiment, the present invention provides a circuit board circuit printing device 100 to realize circuit printing on the circuit board 200.

In this embodiment, the circuit board circuit printing device 100 includes a plurality of printing units 30 which can be spliced to form the circuit board circuit printing device 100. Each printing unit 30 is used to complete the entire process of circuit printing on a single-layer circuit board 20. The printing unit 30 includes a controller 40, a printing work rack 50, a transport rack 60 and a container 70.

The controller 40 is used to control the printing process, report the splicing situation, and determine the main control right when the printing units 30 are spliced with each other, so as to control the printing and transportation of the circuit board 200 to obtain the required circuit board 200 . The printing work frame 50 is connected to the transport frame 60. The container 70 is arranged on one side of the printing transport rack 60.

It can be understood that the number of printing units 30 constituting the circuit board circuit printing device 100 can be increased or decreased according to actual needs. For example, the circuit board circuit printing device 100 can also include only one printing unit 30.

As shown in FIG. 2, the printing work frame 50 includes seven printing work layers 51 and a delivery port 59 arranged in parallel. The printing work layer 51 includes a drilling work layer 52, a circuit printing work layer 53, and solder resist printing. The working layer 54, the adhesive printing working layer 55, the white oil printing working layer 56, the tin liquid printing working layer 57 and the shipping working layer 58. The drilling working layer 52 is arranged at the top end, the shipping working layer 58 is arranged at the bottom end, and the shipping working layer 58 is connected to the shipping port 59.

As shown in FIG. 3, each printing work layer 51 is equipped with a flipping mechanism 511. The flipping mechanism 511 includes a flipping frame 512 and a rotating shaft 513 located in the middle of the flipping frame 512. The rotating shaft 513 The turning of the circuit board 200 is completed by driving the power mechanism to rotate a predetermined angle such as 180°.

The transportation rack 60 includes 7 transportation rack layers 61 arranged in parallel, a plurality of support columns 63 supporting the transportation rack layers 61, and a transmission mechanism 65. The support column 63 that supports the upper transport rack layer 61 and the next transport rack layer 61 is longitudinally connected. The transmission mechanism 65 is arranged on the support column 63 and is driven by the power mechanism to move back and forth along the upper and lower support columns 63, thereby The circuit board 200 is transferred between the transport racks 61, and the top surface of the transport rack 61 of the top layer is provided with a feed port 62.

As shown in FIGS. 2 to 3, the seven transport rack layers 61 are spliced and connected with a corresponding printing work layer 51 of the printing work rack 50. Each transport rack layer 61 and the corresponding printing work layer 51 constitute a printing unit layer 31. For example, the transport rack layer 61 and the shipping working layer 58 constitute a printing unit layer 31.

A sliding rail 64 is provided on the printing work layer 51 and the transportation rack layer 61 on each printing unit layer 31, and the sliding rail 64 penetrates the printing work rack 50 and the transportation rack 60. The slide rail 64 is driven by a power mechanism (not shown) to laterally transmit the circuit board 200 on the transport shelf 61 to the corresponding printing layer 51 or to transfer the circuit board 200 on the printing layer 51 laterally. Transfer to the corresponding transport shelf 61.

In this embodiment, the adhesive printing working layer 55 is equipped with a pressing device 514, and the pressing device 514 is driven by a power mechanism to press the circuit board 200 of more than two layers.

In this embodiment, there are a plurality of the holding buckets 70, and the plurality of holding buckets 70 are correspondingly arranged on one side of the printing working layer 51 according to the printing process, and are respectively used for holding graphene conductive glue and conductive glue. Silver paste, solder resist, adhesive, white oil, tin liquid. Specifically, the container 70 corresponding to the circuit printing working layer 53 contains graphene conductive glue and conductive silver paste, and the container 70 corresponding to the solder resist printing working layer 54 contains solder resist, and corresponding to the adhesive printing working layer 55. The containing bucket 70 contains the adhesive, the containing bucket 70 corresponding to the white oil printing working layer 56 contains white oil, and the containing bucket 70 corresponding to the tin liquid printing working layer 57 contains liquid tin.

In this embodiment, the controller 40 controls the completion of various printing processes of the printing unit 30 and the transmission of the circuit board 200, and reports the docking status of the printing units 30 during mutual splicing. The situation includes that each printing unit 30 controls the splicing of the bus bar, the splicing of the printing material pipes, and the docking of mechanical buckles.

The controller 40 will also determine which controller 40 is the overall main controller (not shown) after the plurality of printing units 30 are spliced with each other according to a predetermined rule.

Specifically, in this embodiment, the controllers 40 of several printing units 30 will take the initiative to hand over the main control right to the controller 40 of the printing unit 30 that is in the first place according to the splicing order, and the controller 40 will be the master. The controller leads the other controllers 40. The main controller electronically numbers each spliced printing unit 30, for example, numbers from small to large in order from the first to the last in the splicing sequence, which is convenient for printing When the circuit board circuit printing device 100 has only one printing unit 30, the controller 40 of the printing unit 30 is responsible for the overall program control of the printing unit 30.

In this embodiment, the controller 40 imports a GERBER file with a printed distribution map of the circuit layer, and the distribution model of the preset circuit layer printing distribution map is: 2*number of spliced printing units/GERBER defined circuit Number of layers=X, when X>1, it means that X lines of the circuit board circuit printing device 100 can print the circuit board 200 at the same time; when X<1, it means that the circuit board circuit printing device 100 points The circuit board 200 is printed X times.

The circuit board circuit printing device 100 can also fill the substrate 21 of the circuit board 200. As shown in FIG. 5, a multi-layer circuit board 200 includes a plurality of single-layer circuit boards 20. Generally, the base material 21 of a single-layer circuit board 200 is attached with two upper and lower circuit layers 22. For the two-layer circuit For the circuit board 200 above layer 22, it is necessary to add a filling base material with drilled holes between the circuit layers 22 of the circuit board 200, and the circuit board circuit printing device 100 follows the printing of the circuit board 200 In the process, the printing unit 30 provides a filling substrate.

In this embodiment, as shown in FIG. 6, the GERBER file defines the number of circuit layers 22 of the circuit board 200 to be printed as 12, and the number of splicing printing units in the circuit board circuit printing device 100 is 8. Model: 2*8/12=4/3, that is, 4/3 sets of 12-layer circuit boards 200 can be printed at the same time each time.

Specifically, the circuit board 200 of the 12-layer circuit layer 22 is divided into 6 single-layer circuit boards 20, and each printing unit 30 completes the printing of the upper and lower circuit layers 22 of the single-layer circuit board 20. After the adhesive printing of the single-layer circuit board 20 is completed and before pressing, a filling machine (not shown) is used to provide a filling substrate between the circuit layers 22 of all two adjacent single-layer circuit boards 20, Then proceed to the pressing step.

Specifically, a filling substrate 1 is provided between the second and third circuit layers 22, a filling substrate 2, and a sixth and seventh circuit layers 22 are provided between the fourth and fifth circuit layers 22. A filling substrate 3 is provided between, a filling substrate 4 is provided between the 8th and 9th layer circuit layers 22, and a filling substrate 5 is provided between the 10th and 11th circuit layers 22.

Of course, the above circuit board circuit printing distribution model is only an implementation mode. Based on the above distribution model, the user can also flexibly define settings by himself.

Referring to FIG. 4 and FIG. 6, an embodiment of the present invention provides a circuit board circuit printing method.

Specifically, in step S1, the GERBER file containing the printed distribution map of the circuit layer is imported into the controller 40 of each printing unit 30.

Then, the controller 40 determines the number of printing units 30 required according to the circuit layer printing distribution map of the GERBER file and numbers all the printing units 30, and at the same time determines the main controller according to a preset rule, for example, the first printing unit 30 As the main controller, the controller 40 of the printing unit 30 controls the splicing of the controllers 40 of all the printing units 30, including the splicing of the busbars, the splicing of the printing material pipes, and the docking of mechanical buckles. The printing unit 30 is spliced Then, a circuit board circuit printing device 100 is formed.

During printing, the controller 40 prints according to the circuit layer printing distribution map preset in the GERBER file and the distribution model (2*the number of spliced printing units/the number of GERBER defined circuit board layers=X). The main controller communicates with other controllers 40 to distribute and coordinate the printing jobs of several printing units 30.

In step S2, the opened circuit board 200 is put into the feeding port 62 of the corresponding printing unit 30 in layers. Each single-layer circuit board 20 is attached with two circuit layers 22 above and below. Specifically, the single-layer circuit board 20 with the first to second circuit layers 22 is put into the feed port 62 of the first printing unit 30, and the single-layer circuit with the third to fourth circuit layers 22 The board 20 is put into the feeding port 62 of the second bit printing unit 30, and so on, the single-layer circuit boards 20 of the last two circuit layers 22 are put into the feeding port 62 of the last bit printing unit 30.

Then the controller 40 of each printing unit 30 controls the slide rail 64 on the printing unit layer 31 to transfer the single-layer circuit board 20 from the transport rack 61 below the feed opening 62 to the drilling working layer. 52.

It can be understood that each printing unit performs various printing tasks on the two circuit layers 22 of the corresponding single-layer circuit board 20.

In step S3, after the drilling working layer 52 of each printing unit 30 drills the upper circuit layer 22 of the corresponding single-layer circuit board 20, the control power mechanism of the controller 40 drives the copying mechanism 511 from the The bottom of the circuit printing working layer 53 protrudes, and the rotating shaft 513 of the copying mechanism 511 rotates a predetermined angle, such as 180°, to complete the turning of the single-layer circuit board 20, and then the drilling working layer 52 faces the The lower circuit layer 22 of the single-layer circuit board 20 is drilled.

Then the controller 40 of each printing unit 30 respectively controls the slide rail 64 to transfer the single-layer circuit board 20 from the drilling working layer 52 to the same layer of the transport rack 61, and controls the support column 63 The transmission mechanism 65 transports the single-layer circuit board 20 down to the next transport shelf 61, and then the single-layer circuit board 20 is laterally transmitted to the circuit printing working layer 53 by the sliding rail 64.

In step S4, the circuit printing working layer 53 of each printing unit 30 performs circuit printing on the single-layer circuit board 20. The specific process is the same as that in step S3. After the printing is completed, the single-layer circuit board 20 is transported to the resistance. Flux printing working layer 54.

In step S5, the solder resist printing working layer 54 of each printing unit 30 performs solder resist printing on the single-layer circuit board 20. The specific process is the same as step S3. After the printing is completed, the single-layer circuit board 20 is transported to the The working layer 55 is printed with the adhesive.

In step S6, the adhesive printing working layer 55 of each printing unit 30 performs adhesive printing on all single-layer circuit boards 20, and only prints the second to penultimate circuit layers 22, that is, the first printing unit and the last The bit printing unit 30 only prints the circuit layer 22 on one side of the single-board circuit board 20, and other printing units 30 need to print the upper and lower circuit layers 22 of the single-board circuit board 20. The specific process is the same as step S3.

After the adhesive printing is completed, the pressing device 514 on the adhesive printing working layer 55 of all the printing units 30 is driven by the power mechanism to press all the single-layer circuit boards 20, and then become a multi-layer circuit board 200. The circuit board 200 is transported to the white oil printing working layer 56 of the first printing unit.

Of course, the circuit board 200 can also be configured to be transported to the white oil printing working layer 56 of any printing unit 30 from the second to the last bit.

Specifically, only the circuit board 200 with two or more circuit layers 22 is printed and laminated with adhesive, while for the single-layer circuit board 20 with one or two circuit layers 22, under the control of the controller 40, After step S5 is completed, the single-layer circuit board 20 is directly transported to the white oil printing working layer 56 by the transmission mechanism 65.

In step S7, white oil printing is performed on the circuit board 200 on the white oil printing working layer 56. The specific process is the same as that of step S3. In step S6, only the top and bottom layers of the circuit board 200 are printed. The circuit board 200 is transported to the tin liquid printing working layer 57.

In step S8, liquid tin printing is performed on the circuit board 200 on the liquid tin printing working layer. The specific process is the same as that in step S3. In step S8, only the top and bottom layers of the circuit board 200 are printed. The circuit board 200 is transported to the seventh shipping layer 58 and shipped out from the shipping port 59.

Under the control of the main controller and the respective controllers 40, the circuit board circuit printing device 100 can automatically perform the above printing steps to mass-produce the circuit board 200, which facilitates production, reduces costs and avoids the use of heavy metals.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them, although the present invention has been described in detail with reference to preferred embodiments.

A person of ordinary skill in the art should understand that the technical solution of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solution of the present invention. Moreover, based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

100: Circuit board circuit printing equipment 200: circuit board 20: Single layer circuit board 30: Printing unit 40: Controller 50: printing work shelf 60: Transport rack 70: Bucket 21: Substrate 22: Line layer 1, 2, 3, 4, 5: Fill the substrate 31: Printing unit layer 51: Printing working layer 52: Drilling working layer 53: Line printing working layer 54: Solder resist printing working layer 55: Adhesive printing working layer 56: White oil printing working layer 57: tin liquid printing working layer 58: Shipping working layer 59: Shipping port 511: Piracy Organization 512: copy frame 513: Rotating Axis 515: pressing device 61: Transport shelf 62: Inlet 63: Support column 64: Slide 65: transmission mechanism S1, S2, S3, S4, S5, S6, S7, S8: steps

FIG. 1 is a three-dimensional schematic diagram of a circuit board circuit printing equipment in an embodiment of the present invention. Fig. 2 is a three-dimensional schematic diagram of a printing unit of the circuit board circuit printing equipment shown in Fig. 1. Fig. 3 is another perspective view of the printing unit of the circuit board circuit printing device shown in Fig. 1. 4 is a working flow chart of the printed circuit board of the printing unit of the circuit board circuit printing device shown in FIG. 1. FIG. 5 is a three-dimensional schematic diagram of a substrate filled between circuit layers of a circuit board in an embodiment of the present invention. Fig. 6 is a working flow chart of the printed circuit board circuit layer of the circuit board circuit printing device in an embodiment of the present invention.

no

100: Circuit board circuit printing equipment

30: Printing unit

40: Controller

50: printing work shelf

60: Transport rack

70: Bucket

Claims (8)

A circuit board circuit printing device is used for circuit printing of circuit boards. The improvement is that the circuit board circuit printing device includes at least one printing unit, the at least one printing unit is spliced and connected, and each printing unit is used to complete a single For the printing of circuit board circuits, each printing unit includes a controller, a printing work rack, a transport rack connected to the printing work rack, and a bucket provided on one side of the transport rack. The controller is used to control the Print and transport circuit boards to obtain the required circuit boards. As for the circuit board circuit printing equipment described in item 1 of the scope of patent application, the printing work rack includes a plurality of printing work layers and shipping ports, and the printing work layer includes a drilling work layer, a circuit printing work layer, and a solder resist The printing working layer, the adhesive printing working layer, the white oil printing working layer, the tin liquid printing working layer and the shipping working layer, the drilling working layer is the top layer, the shipping working layer is the bottom layer, and the shipping working layer The layer is connected to the outgoing port. According to the circuit board circuit printing equipment described in item 2 of the scope of patent application, the transportation rack includes a plurality of transportation racks arranged in parallel, a plurality of support columns supporting the transportation racks, and a transmission mechanism to support adjacent transportation The support columns of the rack layers are connected longitudinally, and the transmission mechanism is arranged on the support column and is driven by the power mechanism to move back and forth along the upper and lower support columns, so as to transfer the circuit board between different transportation rack layers. The top surface is equipped with a feed port. As for the circuit board circuit printing equipment described in item 3 of the scope of the patent application, the printing unit includes a plurality of printing unit layers, and the printing unit layer is composed of the printing working layer and the same layer of the transportation rack layer. A slide rail is provided on the printing unit layer, and the slide rail penetrates the printing work rack and the transport rack. As for the circuit board circuit printing equipment described in item 2 of the scope of patent application, each printing working layer is equipped with a plate turning mechanism. The plate turning mechanism includes a plate turning frame and a rotating shaft located in the middle of the plate turning frame. The rotating shaft is driven to rotate by a power mechanism to complete the flip of the circuit board, and the adhesive printing layer is equipped with a pressing device, and the pressing device is driven by the power mechanism to press and bond more than two layers of circuit boards. As for the circuit board circuit printing equipment described in item 3 of the scope of patent application, there are multiple bins, and the multiple bins are correspondingly arranged on one side of the transport shelf. A circuit board circuit printing method, which is improved in that the circuit board circuit printing method includes the following steps: Import the circuit board layout diagram into the controller of each printing unit; Put the opened circuit board into the feed port of the printing unit, and the circuit board is transported laterally from the transport rack layer under the feed port to the drilling working layer; After the drilling working layer drills a circuit layer on one side of the circuit board, flip the circuit board and then drill the other circuit layer of the circuit board, and then transfer the circuit board to Circuit printing working layer; Perform circuit printing on the circuit board, and then the circuit board is transported to the solder resist printing working layer; Perform solder resist printing on the circuit board, and then the circuit board is transported to the white oil printing working layer; Perform white oil printing on the circuit board on the white oil printing working layer, and then transport the circuit board to the tin liquid printing working layer; and Perform tin liquid printing on the circuit board on the tin liquid printing working layer, and then the circuit board is transported to the shipping working layer and shipped out from the shipping port. For example, the circuit board circuit printing method described in item 7 of the scope of patent application, when printing circuit boards with more than two circuit layers, the circuit board circuit printing method further includes the following steps: Before the solder resist printing working layer is printed and transported to the white oil printing working layer, the circuit board is transported to the adhesive printing working layer for adhesive printing and then pressing.

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