CN111491446A - Circuit board line printing equipment and method - Google Patents
Circuit board line printing equipment and method Download PDFInfo
- Publication number
- CN111491446A CN111491446A CN201910082555.8A CN201910082555A CN111491446A CN 111491446 A CN111491446 A CN 111491446A CN 201910082555 A CN201910082555 A CN 201910082555A CN 111491446 A CN111491446 A CN 111491446A
- Authority
- CN
- China
- Prior art keywords
- printing
- circuit board
- layer
- working layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model provides a circuit board line printing equipment for the line printing of circuit board, circuit board line printing equipment includes at least one printed unit, and at least one printed unit concatenation is connected, and each printed unit is used for accomplishing the printing of a monolithic circuit board circuit, and each printed unit includes controller, printing work frame, connects the transportation frame of printing work frame and sets up in the bucket that holds of transportation frame one side, and the controller is used for the printing and the transportation of control circuit board, obtains required circuit board. The invention also comprises a circuit board circuit printing method. The circuit board line printing equipment controls all the printing units to be spliced through the controller and finishes the whole process of printing and transportation, and the circuit boards are produced in full-automatic batches, so that the cost is reduced, and heavy metal is prevented from being used in large quantities.
Description
Technical Field
The invention relates to a circuit board line printing device and a circuit board line printing method.
Background
In the current production process of circuit boards, three pain points exist all the time: firstly, the production period is long, and because the production procedures are multiple and complex, a lot of time cost is needed; secondly, the resource occupancy rate is high, and due to the fact that production processes are multiple, mass production of data and equipment is needed, and the production investment cost is high; thirdly, a large amount of heavy metals such as copper, nickel, lead and the like and other organic materials are needed in the production process, which brings great harm to the environment and workers at the same time.
With the continuous development of the conductive glue industry, the conductivity of the conductive glue is continuously improved, and the conductivity of the graphene conductive glue even exceeds that of copper, so that good conditions are provided for realizing printing and printing of all processes of a circuit board.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a circuit board line printing apparatus.
In addition, it is necessary to provide a circuit board wiring printing method.
The utility model provides a circuit board line printing equipment for the line printing of circuit board, circuit board line printing equipment includes at least one printed unit, at least one printed unit concatenation is connected, and each printed unit is used for accomplishing the printing of a monolithic circuit board circuit, and each printed unit includes controller, printing work frame, connects the transportation frame of printing work frame with set up in the bucket that holds of transportation frame one side, the controller is used for controlling the printing and the transportation of circuit board obtain required circuit board.
A circuit board wiring printing method, comprising the steps of:
a controller for directing a circuit pattern of the circuit board to each of the printed units;
feeding the cut circuit board into a feeding hole of the printing unit, and transversely conveying the circuit board to a drilling working layer from a conveying frame layer below the feeding hole;
after the drilling working layer drills a circuit layer on one surface of the circuit board, the circuit board is turned over and then another circuit layer of the circuit board is drilled, and then the circuit board is transmitted to a circuit printing working layer;
performing line printing on the circuit board, and then transporting the circuit board to a solder resist printing working layer;
performing solder resist printing on the circuit board, and then transporting the circuit board to a white oil printing working layer;
carrying out white oil printing on the circuit board on the white oil printing working layer, and then transporting the circuit board to a tin liquor printing working layer; and
and carrying out tin liquor printing on the circuit board on the tin liquor printing working layer, and then transporting the circuit board to a shipment working layer and transporting the circuit board out from a shipment port.
When the circuit board with more than two circuit layers is printed, the circuit board circuit printing method further comprises the following steps: and before the solder resist printing working layer is transported to the white oil printing working layer after printing, the circuit board is transported to the adhesive printing working layer for adhesive printing and then is pressed.
The circuit board line printing equipment can automatically produce circuit boards in batches through the printing steps, is convenient to produce, reduces the cost and avoids using heavy metals in large quantities.
Drawings
Fig. 1 is a schematic perspective view of a circuit board circuit printing apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view of a printing unit of the circuit board wiring printing apparatus of fig. 1.
Fig. 3 is another perspective view of a printing unit of the circuit board wiring printing apparatus shown in fig. 1.
Fig. 4 is a flowchart of the operation of a printed unit printed circuit board of the circuit board wiring printing apparatus shown in fig. 1.
Fig. 5 is a schematic perspective view of a substrate filled between circuit layers of a circuit board according to an embodiment of the invention.
FIG. 6 is a flow chart of the operation of the printed circuit board trace layer of the circuit board trace printing device according to one embodiment of the present invention.
Main element symbols and description of working steps
Circuit board line printing apparatus 100
Single-layer circuit board 20
Filling substrates 1, 2, 3, 4, 5
Printed unit layer 31
Printing the working layer 51
Working layer 53 for circuit printing
Solder resist print job layer 54
Adhesive printed layer 55
White oil printing working layer 56
Tin liquid printing working layer 57
Plate-turning mechanism 511
Turning plate frame 512
Feed port 62
Steps S1, S2, S3, S4, S5, S6, S7,
S8
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the circuit board line printing apparatus and method of the present invention will be described in further detail and related descriptions with reference to the accompanying drawings and embodiments.
As shown in fig. 1, in a preferred embodiment, the present invention provides a circuit board circuit printing apparatus 100 for implementing circuit printing on a circuit board 200.
In the present embodiment, the circuit board trace printing apparatus 100 includes a plurality of printing units 30, and the plurality of printing units 30 can be spliced to form the circuit board trace printing apparatus 100. Each print unit 30 is used to complete the entire process of printing the circuit on a single-layer circuit board 20. The printing unit 30 includes a controller 40, a printing work frame 50, a transport frame 60, and a tub 70.
The controller 40 is used to control the printing process, report the splicing condition and determine the main control right when several printed units 30 are spliced with each other, thereby controlling the printing and transportation of the circuit board 200 to obtain the required circuit board 200. The printing work frame 50 is connected to the transport frame 60. The tub 70 is disposed at one side of the printing transport frame 60.
It is understood that the number of the printed units 30 constituting the circuit board trace printing apparatus 100 can be increased or decreased according to actual needs, for example, the circuit board trace printing apparatus 100 may also include only one printed unit 30.
As shown in fig. 2, the printing work frame 50 includes 7 printing work layers 51 and a delivery port 59, which are arranged in parallel, and the printing work layers 51 include a drilling work layer 52, a circuit printing work layer 53, a solder resist printing work layer 54, an adhesive printing work layer 55, a white oil printing work layer 56, a tin liquor printing work layer 57 and a delivery work layer 58. Wherein the drilling working layer 52 is arranged at the topmost end, the delivery working layer 58 is arranged at the bottommost end, and the delivery working layer 58 is connected with the delivery port 59.
As shown in fig. 3, a turning mechanism 511 is installed on each print working layer 51, the turning mechanism 511 includes a turning plate frame 512 and a rotating shaft 513 located in the middle of the turning plate frame 512, and the rotating shaft 513 is driven by a power mechanism to rotate by a predetermined angle, for example, 180 ° to complete the turning of the circuit board 200.
The transportation frame 60 comprises 7 transportation frame layers 61 arranged in parallel, a plurality of supporting columns 63 for supporting the transportation frame layers 61 and a transmission mechanism 65. Support the support column 63 of last transportation frame layer 61 and next transportation frame layer 61 and vertically link to each other, transport mechanism 65 is located on the support column 63 and by power unit drive along upper and lower support column 63 reciprocating motion to transmit circuit board 200 between different transportation frame layers 61, the top layer the top surface of transportation frame layer 61 is equipped with feed inlet 62.
As shown in fig. 2 to 3, the 7 transport frame layers 61 are connected to a corresponding printing work layer 51 of the printing work frame 50 by splicing. Each transport frame layer 61 and the corresponding printing work layer 51 constitute a printing unit layer 31. For example, the transport frame layer 61 and the shipping work layer 58 form a printed unit layer 31.
A slide rail 64 is arranged on the printing working layer 51 and the transportation frame layer 61 on each printing unit layer 31, and the slide rail 64 penetrates through the printing working frame 50 and the transportation frame 60. The sliding rails 64 are driven by a power mechanism (not shown) to transversely transfer the circuit boards 200 on the transport frame layers 61 to the corresponding print working layers 51 or transversely transfer the circuit boards 200 on the print working layers 51 to the corresponding transport frame layers 61.
In this embodiment, the adhesive printing working layer 55 is provided with a pressing device 514, and the pressing device 514 is driven by a power mechanism to press the two or more circuit boards 200.
In this embodiment, the plurality of holding buckets 70 are disposed on one side of the printing working layer 51 according to a printing process, and are respectively used for holding graphene conductive glue, conductive silver paste, solder resist, adhesive, white oil, and tin liquid. Specifically, the holding bucket 70 corresponding to the circuit printing working layer 53 holds graphene conductive glue and conductive silver paste, the holding bucket 70 corresponding to the solder resist printing working layer 54 holds solder resist, the holding bucket 70 corresponding to the adhesive printing working layer 55 holds adhesive, the holding bucket 70 corresponding to the white oil printing working layer 56 holds white oil, and the holding bucket 70 corresponding to the tin liquid printing working layer 57 holds tin liquid.
In this embodiment, the controller 40 controls the completion of various printing processes of the printing units 30 and the transfer of the circuit boards 200, and reports the docking state of the printing units 30 when they are spliced with each other, including the splicing of control buses of the printing units 30, the splicing of printing material tubes, the docking of mechanical snaps, and the like.
The controller 40 also determines which controller 40 is the master controller (not shown) of the printing unit 30 as a whole according to predetermined rules.
Specifically, in this embodiment, the controllers 40 of the plurality of printing units 30 actively give the main control right to the controller 40 of the printing unit 30 located at the first position according to the splicing sequence, and the controller 40 serves as the main controller to lead the other controllers 40, and the main controller electronically numbers each spliced printing unit 30, for example, numbers the first position to the last position in the splicing sequence from small to large in sequence, so as to facilitate the overall control of printing; when the circuit board line printing apparatus 100 has only one printing unit 30, the controller 40 of the printing unit 30 is responsible for the overall process control of the printing unit 30.
In this embodiment, the controller 40 is introduced with a GERBER file having a line layer printing distribution diagram, and the distribution model of the preset line layer printing distribution diagram is: 2, the number of printed units spliced/GERBER defines the number of line layers as X, and when X >1, it indicates that the circuit board line printing apparatus 100 can simultaneously perform X lines to print the circuit board 200; when X <1, it means that the circuit board line printing apparatus 100 completes printing the circuit board 200 in X times.
The circuit board line printing apparatus 100 may also fill the base material 21 of the circuit board 200. As shown in fig. 5, a multi-layer circuit board 200 includes a plurality of single-layer circuit boards 20, and generally, a substrate 21 of a single-layer circuit board 200 is attached with an upper and a lower circuit layers 22, and for a circuit board 200 with two or more circuit layers 22, a filling substrate with holes drilled between the circuit layers 22 of the circuit board 200 is required, and the circuit board circuit printing apparatus 100 provides the filling substrate through the printing unit 30 according to a printing process of the circuit board 200.
In this embodiment, as shown in fig. 6, the GERBER file defines that the number of circuit layers 22 of the circuit board 200 to be printed is 12, the number of printed units spliced in the circuit board circuit printing device 100 is 8, and according to the distribution model: 2 × 8/12 ═ 4/3, i.e., 4/3 sets of 12 layers of circuit boards 200 can be printed simultaneously at a time.
Specifically, the circuit board 200 with 12 circuit layers 22 is divided into 6 single-layer circuit boards 20, and each printing unit 30 completes the printing of the upper and lower circuit layers 22 of the single-layer circuit board 20. After the adhesive of the single-layer circuit board 20 is printed and before the pressing, a filling machine (not shown) is used to provide a filling substrate between the circuit layers 22 of all the two adjacent single-layer circuit boards 20, and then the pressing step is performed.
Specifically, the filling substrate 1 is provided between the 2 nd and 3 rd wiring layers 22, the filling substrate 2 is provided between the 4 th and 5 th wiring layers 22, the filling substrate 3 is provided between the 6 th and 7 th wiring layers 22, the filling substrate 4 is provided between the 8 th and 9 th wiring layers 22, and the filling substrate 5 is provided between the 10 th and 11 th wiring layers 22.
Of course, the above circuit board line printing distribution model is only one implementation way, and on the basis of the above distribution model, a user can also define settings flexibly.
Referring to fig. 4 and 6, an embodiment of the invention provides a circuit board circuit printing method.
Specifically, in step S1, the GERBER file containing the line-level print profile is imported into the controller 40 of each print unit 30.
Then, the controller 40 determines the number of the required printing units 30 according to the line layer printing distribution diagram of the GERBER file and numbers all the printing units 30, and determines a main controller according to a preset rule, for example, the controller 40 of the first printing unit 30 is used as the main controller to guide the controllers 40 of all the printing units 30 to splice, including splicing of control buses of all the printing units 30, splicing of printing raw material pipes and butting of mechanical fasteners, and the printing units 30 are spliced to form the circuit board line printing device 100.
During printing, the controller 40 prints according to the line layer printing distribution map preset by the GERBER file and the distribution model (2 × number of printed units spliced/GERBER defines the number of circuit board layers as X). The master controller communicates with the other controllers 40 to distribute and coordinate the print jobs of the plurality of print units 30.
In step S2, the cut circuit boards 200 are layered and fed into the corresponding feed openings 62 of the print unit 30. Two circuit layers 22 are attached to each single-layer circuit board 20 on top and bottom. Specifically, the single-layer circuit board 20 attached with the 1 st to 2 nd layer wiring layers 22 is put into the feed port 62 of the first-position printed unit 30, the single-layer circuit board 20 attached with the 3 rd to 4 th layer wiring layers 22 is put into the feed port 62 of the second-position printed unit 30, and so on, the single-layer circuit board 20 of the last two layer wiring layers 22 is put into the feed port 62 of the last printed unit 30.
The controller 40 of each print unit 30 then controls the slide rails 64 on the corresponding print unit layer 31 to laterally transport the single-layer circuit boards 20 from the transport rack layer 61 below the feeding hole 62 to the drilling work layer 52.
It will be appreciated that each print unit then performs each print job on the two circuit layers 22 of the corresponding single-layer circuit board 20.
In step S3, after the drilling operation layer 52 of each printed circuit board 30 drills the upper circuit layer 22 of the corresponding single-layer circuit board 20, the control power mechanism of the controller 40 drives the flipping mechanism 511 to extend from the bottom of the circuit printing operation layer 53, and the rotating shaft 513 of the flipping mechanism 511 rotates by a predetermined angle, for example, 180 °, to complete the flipping of the single-layer circuit board 20, and then the drilling operation layer 52 drills the lower circuit layer 22 of the single-layer circuit board 20.
Then, the controller 40 of each print unit 30 controls the slide rails 64 to transversely transfer the single-layer circuit board 20 from the drilling operation layer 52 to the same transport rack layer 61, controls the transmission mechanism 65 of the support columns 63 to downwardly transport the single-layer circuit board 20 to the next transport rack layer 61, and transversely transfers the single-layer circuit board 20 to the line printing operation layer 53 by the slide rails 64.
In step S4, the single-layer circuit board 20 is printed by the wire printing work layer 53 of each printing unit 30 in the same manner as in step S3, and the single-layer circuit board 20 is transported to the solder resist printing work layer 54 after the printing is completed.
In step S5, the solder resist printing work layer 54 of each printing unit 30 performs solder resist printing on the single-layer circuit board 20 in the same manner as in step S3, and the single-layer circuit board 20 is transported to the adhesive printing work layer 55 after the printing is completed.
In step S6, the adhesive printing working layer 55 of each printing unit 30 performs adhesive printing on all the single-layer circuit boards 20, and only the 2 nd to the 2 nd layer of the circuit layers 22 are printed, i.e. the first printing unit and the last printing unit 30 only print one side of the circuit layer 22 of the single-board circuit board 20, and the other printing units 30 need to print the upper and lower side of the circuit layer 22 of the single-board circuit board 20, and the specific process is the same as the step S3.
After the adhesive printing is completed, the pressing device 514 on the adhesive printing working layer 55 of all the printing units 30 is driven by the power mechanism to press all the single-layer circuit boards 20, and after the pressing, a multi-layer circuit board 200 is formed, and the circuit board 200 is transported to the white oil printing working layer 56 of the first printing unit.
Of course, the circuit board 200 may be provided so as to be transported to the white oil printing work layer 56 of any one of the second to last printing units 30.
Specifically, only the circuit boards 200 of two or more wiring layers 22 are subjected to adhesive printing and pressing, and the single-layer circuit board 20 of one or two wiring layers 22 is directly transported to the white oil printing work layer 56 by the transport mechanism 65 under the control of the controller 40 after completion of step S5.
In step S7, the circuit board 200 is white printed on the white ink printing work layer 56 in the same manner as in step S3, in which step S6 only prints the top and bottom layers of the circuit board 200, and the circuit board 200 is transported to the molten tin printing work layer 57 after printing.
In step S8, the solder printing is performed on the circuit board 200 at the solder printing operation layer, the process is the same as step S3, in which step S8 only prints the top layer and the bottom layer of the circuit board 200, and the circuit board 200 is transported to the 7 th shipment layer 58 and then transported out from the shipment port 59 after the printing is completed.
The circuit board line printing apparatus 100 may fully automatically perform the printing steps under the control of the main controller and the respective controllers 40 to mass-produce the circuit boards 200, thereby facilitating production, reducing cost, and avoiding the use of heavy metals in large quantities.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited, although the present invention is described in detail with reference to the preferred embodiments.
It will be understood by those skilled in the art that various modifications and equivalent arrangements can be made without departing from the spirit and scope of the present invention. Moreover, based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without any creative effort will fall within the protection scope of the present invention.
Claims (8)
1. The utility model provides a circuit board line printing equipment for the line printing of circuit board, its characterized in that, circuit board line printing equipment includes at least one printed unit, at least one printed unit concatenation is connected, and each printed unit is used for accomplishing the printing of a monolithic circuit board circuit, and each printed unit includes controller, printing work frame, connection the transportation frame of printing work frame with set up in the bucket that holds of transportation frame one side, the controller is used for controlling the printing and the transportation of circuit board obtain required circuit board.
2. The circuit board wiring printing apparatus of claim 1, wherein said print working frame comprises a plurality of print working layers and a shipment port, said print working layers comprising a drilling working layer, a wiring printing working layer, a solder resist printing working layer, an adhesive printing working layer, a white oil printing working layer, a tin liquor printing working layer and a shipment working layer, said drilling working layer being a top layer, said shipment working layer being a bottom layer, said shipment working layer connecting said shipment port.
3. The apparatus for circuit board routing according to claim 2, wherein the transportation frame comprises a plurality of transportation frame layers arranged in parallel, a plurality of support columns supporting the transportation frame layers, and a transmission mechanism, wherein the support columns supporting adjacent transportation frame layers are connected in a longitudinal direction, the transmission mechanism is disposed on the support columns and driven by a power mechanism to reciprocate along the upper and lower support columns, so as to transport the circuit boards between different transportation frame layers, and the top surface of the transportation frame layer on the top layer is provided with the feeding hole.
4. The apparatus of claim 3, wherein the printed unit comprises a plurality of printed unit layers, the printed unit layers are formed by splicing the printed working layer and the transport frame layer of the same layer, and each printed unit layer is provided with a slide rail which passes through the printed working layer and the transport frame.
5. The apparatus according to claim 2, wherein each print layer is provided with a turning mechanism, the turning mechanism comprises a turning frame and a rotating shaft located in the middle of the turning frame, the rotating shaft is driven by a power mechanism to rotate to turn the circuit board, the adhesive printing layer is provided with a pressing device, and the pressing device is driven by the power mechanism to press more than two layers of circuit boards.
6. The apparatus of claim 3, wherein the plurality of buckets are disposed at a side of the transportation frame.
7. A circuit board wiring printing method, characterized by comprising the steps of:
a controller for directing a circuit pattern of the circuit board to each of the printed units;
feeding the cut circuit board into a feeding hole of the printing unit, and transversely conveying the circuit board to a drilling working layer from a conveying frame layer below the feeding hole;
after the drilling working layer drills a circuit layer on one surface of the circuit board, the circuit board is turned over and then another circuit layer of the circuit board is drilled, and then the circuit board is transmitted to a circuit printing working layer;
performing line printing on the circuit board, and then transporting the circuit board to a solder resist printing working layer;
performing solder resist printing on the circuit board, and then transporting the circuit board to a white oil printing working layer;
carrying out white oil printing on the circuit board on the white oil printing working layer, and then transporting the circuit board to a tin liquor printing working layer; and
and carrying out tin liquor printing on the circuit board on the tin liquor printing working layer, and then transporting the circuit board to a shipment working layer and transporting the circuit board out from a shipment port.
8. The circuit board wiring printing method of claim 7, when printing on a circuit board having two or more wiring layers, further comprising the steps of:
and before the solder resist printing working layer is transported to the white oil printing working layer after printing, the circuit board is transported to the adhesive printing working layer for adhesive printing and then is pressed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910082555.8A CN111491446A (en) | 2019-01-28 | 2019-01-28 | Circuit board line printing equipment and method |
| TW108106573A TW202029860A (en) | 2019-01-28 | 2019-02-26 | Circuit board printing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910082555.8A CN111491446A (en) | 2019-01-28 | 2019-01-28 | Circuit board line printing equipment and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111491446A true CN111491446A (en) | 2020-08-04 |
Family
ID=71813561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910082555.8A Pending CN111491446A (en) | 2019-01-28 | 2019-01-28 | Circuit board line printing equipment and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111491446A (en) |
| TW (1) | TW202029860A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10129094A1 (en) * | 2001-06-16 | 2003-02-27 | Stork Gmbh | Substrates printing device e.g. for printed circuit boards, has print heads arranged in upper and lower print mechanisms |
| US20030181038A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
| JP2004345118A (en) * | 2003-05-20 | 2004-12-09 | Dainippon Printing Co Ltd | Screen printing apparatus and squeegee for screen printing |
| TWM267799U (en) * | 2004-07-16 | 2005-06-11 | Colead Entpr Co Ltd | Inkjet printing device of printed circuit board |
| CN105142358A (en) * | 2015-08-24 | 2015-12-09 | 苏州玄禾物联网科技有限公司 | Anti-static grounding system for surface mount technology (SMT) production lines |
| CN105966066A (en) * | 2016-06-29 | 2016-09-28 | 中山市泰拓数码科技有限公司 | Cyclic feeding digital jet printing machine |
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| CN107241863A (en) * | 2016-12-09 | 2017-10-10 | 百强电子（深圳）有限公司 | Automatic processing equipment and method for photoelectric printed circuit board |
| CN108738242A (en) * | 2018-05-25 | 2018-11-02 | 东莞市鹏利节能设备有限公司 | A kind of PCB circuit board printing technology and its production line |
-
2019
- 2019-01-28 CN CN201910082555.8A patent/CN111491446A/en active Pending
- 2019-02-26 TW TW108106573A patent/TW202029860A/en unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10129094A1 (en) * | 2001-06-16 | 2003-02-27 | Stork Gmbh | Substrates printing device e.g. for printed circuit boards, has print heads arranged in upper and lower print mechanisms |
| US20030181038A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
| JP2004345118A (en) * | 2003-05-20 | 2004-12-09 | Dainippon Printing Co Ltd | Screen printing apparatus and squeegee for screen printing |
| TWM267799U (en) * | 2004-07-16 | 2005-06-11 | Colead Entpr Co Ltd | Inkjet printing device of printed circuit board |
| CN105142358A (en) * | 2015-08-24 | 2015-12-09 | 苏州玄禾物联网科技有限公司 | Anti-static grounding system for surface mount technology (SMT) production lines |
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| CN105966066A (en) * | 2016-06-29 | 2016-09-28 | 中山市泰拓数码科技有限公司 | Cyclic feeding digital jet printing machine |
| CN107241863A (en) * | 2016-12-09 | 2017-10-10 | 百强电子（深圳）有限公司 | Automatic processing equipment and method for photoelectric printed circuit board |
| CN108738242A (en) * | 2018-05-25 | 2018-11-02 | 东莞市鹏利节能设备有限公司 | A kind of PCB circuit board printing technology and its production line |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202029860A (en) | 2020-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8555783B2 (en) | Apparatus for depositing viscous material including transport system with upper and lower tracks | |
| CN102132641B (en) | Electronic component mounting system | |
| CN106455293B (en) | A kind of production method having a size of 500mm*800mm or more multilayer large scale High speed rear panel | |
| CN102172112B (en) | Electronic component mounting system | |
| KR101404244B1 (en) | Apparatus for rivetting | |
| JP2015083364A (en) | Screen printer and component mounting line | |
| CN102172111A (en) | Electronic component mounting system and electronic component mounting method | |
| CN102172113A (en) | Electronic component mounting system and electronic component mounting method | |
| CN104936427A (en) | Electronic component mounting system and electronic component mounting method | |
| CN102325427B (en) | Printed circuit board solder resist ink coating technology and coating apparatus | |
| CN106416451A (en) | Substrate carrier apparatus and substrate work system configured to include same | |
| CN103026808A (en) | Electronic component mounting system and electronic component mounting method | |
| CN207835938U (en) | A kind of PCB dual platens printing transfer matic | |
| CN101579971A (en) | Method of separating a scraper and a paste, and a screen printing device thereof | |
| JP6244551B2 (en) | Component mounting line and component mounting method | |
| JP6201149B2 (en) | Component mounting line and component mounting method | |
| CN111491446A (en) | Circuit board line printing equipment and method | |
| US10585426B2 (en) | Production management device and production status display method | |
| CN104472029A (en) | Work system and work machines for substrates | |
| JP2012227407A (en) | Substrate production line | |
| CN110497701B (en) | Vertical circuit board printer and printing method thereof | |
| CN102686043B (en) | Component installing system | |
| JP6118813B2 (en) | Substrate working system and viscous fluid supply method | |
| CN202799414U (en) | Chip mounter | |
| JP2004006510A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200804 |