TW202029421A - Packaging structure of optical sensing chip having a transparent cover plate covering a light-sensing element and a light-emitting element - Google Patents

Abstract

A packaging structure of optical sensing chip includes a substrate, a light-sensing element, a light-emitting element, and a transparent cover plate. The substrate has a concave portion. The light-sensing element is arranged in the concave portion and is electrically connected to the substrate. The light-emitting element is arranged in the concave portion and is electrically connected to the substrate or the light-sensing element. The transparent cover plate is arranged on the substrate, and covers the light-sensing element and the light-emitting element.

Description

Optical sensing chip packaging structure

The present invention relates to a chip packaging structure; in particular, it refers to an optical sensing chip packaging structure.

1 is a structural diagram of a conventional optical sensor chip package structure 100, which is composed of a substrate 120, a light sensor element 140, a light emitting element 160, and a transparent adhesive layer 180, wherein the light sensor element 140 is disposed on the substrate In a recess 122 of 120, the light-emitting element 160 is disposed on the light-sensing element 140; the transparent adhesive layer 180 is disposed in the recess 122 and covers the light-sensing element 140 and the light-emitting element 160.

However, the transparent adhesive layer 180 of the optical sensor chip package structure 100 is directly exposed to the outside, so it is easy to get dust or dirt, which causes the sensing result of the light sensor element 140 to be inaccurate. For example, when the optical sensor chip package structure 100 passes through the SMT tin furnace, there will be furnace dust attached to the transparent adhesive layer 180 of the optical sensor chip package structure 100. In addition, when a person picks up the optical sensor chip package structure 100, it is easy to touch or press the transparent adhesive layer 180 of the optical sensor chip package structure 100, which may cause the sensing result of the light sensor element 140 to be inaccurate. Even the optical sensor chip package structure 100 fails as a whole.

In summary, the problems existing in the conventional optical sensor chip package structure still need to be overcome.

In view of this, the purpose of the present invention is to provide an optical sensor chip package structure, which utilizes a transparent cover to cover the light sensor element and the light emitting element to prevent dust or dirt from adhering to the light sensor element or the light emitting element. It can prevent people from touching or pressing the light sensing element or the light emitting element to protect the optical sensing chip package structure.

In order to achieve the above objective, the present invention provides an optical sensing chip package structure, which includes a substrate, a light sensing element, a light emitting element and a transparent cover. The substrate has a concave portion, and the light sensing element is arranged in the concave portion and is electrically connected to the substrate. The light emitting element is arranged in the recess and is electrically connected to the substrate or the light sensing element. The transparent cover plate is arranged on the substrate and covers the light sensing element and the light emitting element.

The effect of the present invention is to cover the light-sensing element and the light-emitting element with a transparent cover to prevent dust or dirt from adhering to the light-sensing element or the light-emitting element, and to prevent people from touching or pressing the light-sensing element or The light-emitting element is used to protect the optical sensor chip package structure, and further improve the sensing accuracy of the light sensor element and the overall reliability of the optical sensor chip package structure.

In order to explain the present invention more clearly, the following preferred embodiments are described in detail in conjunction with the drawings. Please refer to FIG. 2, which is an optical sensor chip package structure 200 a according to the first embodiment of the present invention, which includes a substrate 220, a light sensor element 240, a light emitting element 260 and a transparent cover 280. In the embodiment of the present invention, the substrate 220 has a recess 222. The substrate 220 has a plurality of circuit contacts 224; the light sensing element 240 is disposed in the recess 222 of the substrate 220, and is electrically connected to the contacts 224 of the substrate 220 through the wires 241. In the embodiment of the present invention, the substrate 220 includes a bottom wall 221 and a side wall 223, wherein the bottom wall 221 and the side wall 223 are connected to form a recess 222. In the embodiment of the present invention, the contact 224 is disposed at the top of the side wall 223, and one end of the wire 241 is connected to the light sensing element 240, and the other end is connected to the contact 224.

The light emitting element 260 is disposed on the light sensing element 240 and is electrically connected to the substrate 220 or the light sensing element 240. In the embodiment of the present invention, the light-emitting element 260 is disposed on the light-sensing element 240, and is electrically connected to the light-sensing element 240 through a wire 261. In FIG. 2, one end of the wire 261 is connected to the light-emitting element 260, and the other end is connected to the light sensing element 240.

In the embodiment of the present invention, the light-emitting element 260 has a light-emitting surface 262, and the light-sensing element 240 has a light-sensing surface 242. The light-sensing surface 242 of the light-sensing element 240 is used to sense the light emitted by the light-emitting element 260. The light. In an application of this embodiment, the optical sensor chip package structure 200a can be used to sense whether a target is located in front of the optical sensor chip package structure 200a, or the optical sensor chip package structure 200a can be used to detect a target object Whether it moves relative to the optical sensor chip package structure 200a can be used as an optical ruler. In the embodiment of the present invention, the light emitting element 260 is a point light source, for example, a light emitting diode or a laser light source, but it is not limited thereto. In the embodiment of the present invention, the light-emitting surface 262 of the light-emitting element 260 is approximately in the same direction as the light-sensing surface 242 of the light-sensing element 240, that is, the light-emitting surface 262 of the light-emitting element 260 is the same as the light-sensing surface of the light-sensing element 240. The surfaces 242 all face the transparent cover 280, so that when the light emitted from the light-emitting surface 262 of the light-emitting element 260 is reflected by the target, the incident light and the reflected light can have a smaller angle to obtain a more accurate measurement value.

The transparent cover 280 is disposed on the substrate 220 and covers the light sensing element 240 and the light emitting element 260. In the embodiment of the present invention, there is a distance d between the light sensing surface 242 and a bottom surface of the transparent cover, and the distance d is less than or equal to 0.8 mm. If the distance d is larger, the light emitted by the light emitting element 260 will have a larger diffusion area after reflection, thus causing the signal interference of the light sensing element 240 to increase; on the contrary, if the distance d is smaller, the light emitted by the light emitting element 260 will increase. The diffused area of the emitted light after being reflected is smaller, so the light sensing element 240 can obtain a better signal resolution, thereby improving the measurement accuracy of the optical sensing chip package structure 200a.

In the embodiment of the present invention, the transparent cover 280 includes a grating 282, and the grating 282 is disposed on the upper surface 281 of the transparent cover 280. Since the grating 282 is fixed on the upper surface 281 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed to each other. In other words, the grating 282 has been aligned, and there is no need to adjust the relative position of the grating 282 to the light sensing element 240 and the light emitting element 260. Therefore, the optical sensor chip package structure 200a provided by the embodiment of the present invention can have better measurement stability and reproducibility than the traditional optical sensor chip package structure and the grating are separately and independently arranged.

Please refer to FIG. 3, which is an optical sensor chip package structure 200 b according to the second embodiment of the present invention, which includes a substrate 220, a light sensor element 240, a light emitting element 260 and a transparent cover 280. The optical sensor chip package structure 200b of the second embodiment of the present invention is similar to the optical sensor chip package structure 200a of the first embodiment. The difference between the two lies in the contacts 224a, 224b and grating 282 of the optical sensor chip package structure 200b The position of is different from the optical sensor chip package structure 200a.

In the embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 224a, 224b; the light sensing element 240 is disposed in the recess 222 of the substrate 220, and is electrically connected to the contacts 224a of the substrate 220 through wires 241. In the embodiment of the present invention, the contact 224a is disposed on the bottom wall 221, and one end of the wire 241 is connected to the light sensing element 240, and the other end is connected to the contact 224a.

The light-emitting element 260 is disposed on the light-sensing element 240, and is electrically connected to the contact 224b of the substrate 220 through a wire 261. In FIG. 3, the contact 224b is disposed on the bottom wall 221, and one end of the wire 261 is connected to the light emitting element 260, and the other end is connected to the contact 224b of the substrate 220 for electrical connection.

In the embodiment of the present invention, the transparent cover 280 includes a grating 282, and the grating 282 is disposed on the lower surface 283 of the transparent cover 280. Since the grating 282 is fixed on the lower surface 283 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed to each other. In other words, the grating 282 has been aligned, and there is no need to adjust the relative position of the grating 282 to the light sensing element 240 and the light emitting element 260. Therefore, the optical sensor chip package structure 200b provided by the embodiment of the present invention can have better measurement stability and reproducibility compared to the traditional optical sensor chip package structure and the grating separately and independently arranged.

Please refer to FIG. 4, which is an optical sensor chip package structure 200c according to the third embodiment of the present invention, which includes a substrate 220, a light sensor element 240, a light emitting element 260, and a transparent cover 280. The optical sensor chip package structure 200c of the third embodiment of the present invention is similar to the optical sensor chip package structure 200b of the second embodiment. The difference between the two lies in the contacts 224a, 224b and grating 282 of the optical sensor chip package structure 200c The setting of is different from the optical sensor chip package structure 200b.

In the embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 224a, 224b; the light sensing element 240 is disposed in the recess 222 of the substrate 220, and is electrically connected to the contacts 224a of the substrate 220 through wires 241. In the embodiment of the present invention, the contact 224a is disposed at the top end of the side wall 223, and one end of the wire 241 is connected to the light sensing element 240, and the other end is connected to the contact 224a.

The light-emitting element 260 is disposed on the light-sensing element 240, and is electrically connected to the contact 224b of the substrate 220 through a wire 261. In FIG. 4, the contact 224b is disposed at the top of the side wall 223, and one end of the wire 261 is connected to the light-emitting element 260, and the other end is connected to the contact 224b of the substrate 220 for electrical connection.

In the embodiment of the present invention, the transparent cover 280 includes a grating 282, and the gratings 282 are respectively disposed on the upper surface 281 and the lower surface 283 of the transparent cover 280. Since the grating 282 is fixed on the upper surface 281 and the lower surface 283 of the transparent cover 280, the relative positions of the grating 282, the light sensing element 240 and the light emitting element 260 are fixed to each other. In other words, the grating 282 has been aligned, and there is no need to adjust the relative position of the grating 282 to the light sensing element 240 and the light emitting element 260. Therefore, the optical sensor chip package structure 200c provided by the embodiment of the present invention can have better measurement stability and reproducibility compared to the traditional optical sensor chip package structure and the grating separately and independently arranged.

Please refer to FIG. 5, which is an optical sensor chip package structure 300a according to the fourth embodiment of the present invention, which includes a substrate 320, a light sensor element 340, a light emitting element 360 and a transparent cover 380. In the embodiment of the present invention, the substrate 320 has a recess and a partition 325. The partition 325 is arranged in the recess, so that the recess is divided into a first accommodating space 322a and a second accommodating space 322b; the light emitting element 360 is arranged in In the first accommodating space 322a, and the light sensing element 340 is disposed in the second accommodating space 322b. In the embodiment of the present invention, the partition 325 is an opaque partition. The substrate 220 has a plurality of circuit contacts 324a and 324b; the light sensing element 340 is electrically connected to the contacts 324a of the substrate 320 through wires 341. In the embodiment of the present invention, the substrate 320 includes a bottom wall 321 and a side wall 323, wherein the bottom wall 321 and the side wall 323 are connected to form a recess. In the embodiment of the present invention, the contact 324a is disposed on the bottom wall 321, and one end of the wire 341 is connected to the light sensing element 340, and the other end is connected to the contact 324a.

The light-emitting element 360 is electrically connected to the substrate 320. In the embodiment of the present invention, the light-emitting element 360 is electrically connected to the contact point 324b of the substrate 320 through the wire 361. In FIG. 5, the contact point 324b is provided on the bottom wall 321, and one end of the wire 361 is connected to the light emitting element 360, and the other end is connected to the contact point 324b of the substrate 320.

The transparent cover 380 is disposed on the substrate 320 and covers the light sensing element 340 and the light emitting element 360. In the embodiment of the present invention, the transparent cover 380 includes a grating 382 which is disposed on the upper surface 381 of the transparent cover 380. Since the grating 382 is fixed on the upper surface 381 of the transparent cover 380, the relative positions of the grating 382, the light sensing element 340 and the light emitting element 360 are fixed to each other. In other words, the grating 382 has already been aligned, and there is no need to adjust its relative position to the light sensing element 340 and the light emitting element 360. Therefore, compared with the traditional optical sensor chip package structure and the grating are separately and independently arranged, the optical sensor chip package structure 300a provided by the embodiment of the present invention can have better measurement stability and reproducibility.

Please refer to FIG. 6, which is an optical sensor chip package structure 300 b according to a fifth embodiment of the present invention, which includes a substrate 320, a light sensor element 340, a light emitting element 360 and a transparent cover 380. The optical sensor chip package structure 300b of the fifth embodiment of the present invention is similar to the optical sensor chip package structure 300a of the fourth embodiment. The difference between the two lies in the positions of the contacts 324a and 324b of the optical sensor chip package structure 300b. In the optical sensor chip package structure 300a; in addition, the transparent cover 380 of the optical sensor chip package structure 300b does not include a grating.

In the embodiment of the present invention, the substrate 220 has a plurality of circuit contacts 324a and 324b; the light sensing element 340 is electrically connected to the contacts 324a of the substrate 320 through wires 341. In the embodiment of the present invention, the substrate 320 includes a bottom wall 321 and a side wall 323, wherein the bottom wall 321 and the side wall 323 are connected to form a recess. In the embodiment of the present invention, the contact point 324a is disposed at the top end of the side wall 323, and one end of the wire 341 is connected to the light sensing element 340, and the other end is connected to the contact point 324a.

The light-emitting element 360 is electrically connected to the substrate 320. In the embodiment of the present invention, the light-emitting element 360 is electrically connected to the contact point 324b of the substrate 320 through the wire 361. In FIG. 6, the contact point 324 b is disposed at the top of the side wall 323, and one end of the wire 361 is connected to the light emitting element 360, and the other end is connected to the contact point 324 b of the substrate 320.

According to the embodiment of the present invention, the optical sensor chip package structure provided by the embodiment of the present invention utilizes a transparent cover to cover the light sensor element and the light emitting element to prevent dust or dirt from adhering to the light sensor element or the light emitting element , And can prevent people from contacting or pressing the light sensing element or light emitting element to protect the optical sensing chip package structure, and further improve the sensing accuracy of the light sensing element and the overall reliability of the optical sensing chip package structure .

The above are only the preferred and feasible embodiments of the present invention. Any equivalent changes made by applying the specification of the present invention and the scope of the patent application should be included in the patent scope of the present invention.

[Prior Art] 100: Optical sensor chip package structure 120: substrate 122: recess 140: light sensing element 160: light-emitting element 180: transparent glue layer [this invention] 200a, 200b, 200c, 300a, 300b: optical sensor chip package structure 220, 320: base plate 221, 321: bottom wall 222: recess 223, 323: side wall 224, 224a, 224b, 324a, 324b: contact 240, 340: light sensing element 241, 261, 341, 361: Wire 242, 342: Light sensing surface 260, 360: light emitting element 262, 362: light emitting surface 280, 380: transparent cover 281, 381: upper surface 282, 382: grating 283, 383: lower surface 322a: first accommodation space 322b: second accommodation space 325: Partition d: distance

Figure 1 is a structural diagram of a conventional optical sensor chip package structure; 2 is a structural diagram of the optical sensor chip package structure of the first embodiment of the present invention; 3 is a structural diagram of the optical sensor chip package structure according to the second embodiment of the present invention; 4 is a structural diagram of an optical sensor chip package structure according to a third embodiment of the present invention; FIG. 5 is a structural diagram of an optical sensor chip package structure according to a fourth embodiment of the present invention; 6 is a structural diagram of an optical sensor chip package structure according to a fifth embodiment of the present invention.

200a: Optical sensor chip package structure

220: substrate

221: Bottom Wall

222: recess

223: Sidewall

224: Contact

240: light sensing element

241, 261: wire

242: light sensing surface

260: Light-emitting element

262: Glossy Surface

280: Transparent cover

281: upper surface

282: Raster

283: lower surface

d: distance

Claims (10)

An optical sensing chip packaging structure, including: A substrate with a recess; A light sensing element arranged in the recess and electrically connected to the substrate; A light-emitting element arranged in the recess and electrically connected to the substrate or the light sensing element; and A transparent cover plate is arranged on the substrate and covers the light sensing element and the light emitting element. The optical sensor chip package structure according to claim 1, wherein the light-emitting element has a light-emitting surface, and the light-emitting surface faces the transparent cover. The optical sensor chip package structure according to claim 1, wherein the light sensor element has a light sensor surface, and the light sensor surface faces the transparent cover. The optical sensing chip package structure according to claim 3, wherein the light sensing surface and a bottom surface of the transparent cover have a distance, and the distance is less than or equal to 0.8 mm. The optical sensor chip package structure according to claim 1, wherein the light-emitting element is connected to a wire, and one end of the wire is connected to the light-sensing element, so that the light-emitting element and the light-sensing element are electrically connected. The optical sensor chip package structure according to claim 1, wherein the light-emitting element is connected to a wire, and one end of the wire is connected to the substrate, so that the light-emitting element and the substrate are electrically connected. The optical sensor chip package structure according to claim 1, wherein the light emitting element is disposed on the light sensor element. The optical sensor chip package structure according to claim 1, wherein the substrate has a partition, and the partition is disposed in the recess, so that the recess is divided into a first accommodating space and a second accommodating space The light-emitting element is arranged in the first accommodating space, and the light sensing element is arranged in the second accommodating space. The optical sensor chip package structure according to claim 8, wherein the partition is an opaque partition. The optical sensor chip package structure according to claim 1, wherein the transparent cover includes a grating located on an upper surface, a lower surface or a combination of the transparent cover.

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