TW202028395A - Reflow-compatible dicing tape - Google Patents

Reflow-compatible dicing tape Download PDF

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TW202028395A
TW202028395A TW108144249A TW108144249A TW202028395A TW 202028395 A TW202028395 A TW 202028395A TW 108144249 A TW108144249 A TW 108144249A TW 108144249 A TW108144249 A TW 108144249A TW 202028395 A TW202028395 A TW 202028395A
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carbons
radiation
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adhesive layer
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TWI753328B (en
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浅沼匠
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日商古河電氣工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

The purpose of the present invention is to provide a reflow-compatible dicing tape having excellent contamination resistance by preventing the occurrence of outgassing from a radiation-curing adhesive layer. A reflow-compatible dicing tape according to the present invention is provided with a base material layer and a radiation-curing adhesive layer provided on said base material layer. After a silicon wafer is bonded to the radiation-curing adhesive layer, the layered body is irradiated with radiation and is then heat-treated for 10 minutes at 210 DEG C. After said heat treatment, the bonded surface of the silicon wafer is measured by X-ray photoelectron spectroscopy when the silicon wafer is peeled from the radiation-curing adhesive layer. The carbon content at this time is 30 mol% or less.

Description

迴焊對應切割膠帶Cutting tape for reflow

本發明有關於半導體製造步驟所使用的迴焊對應切割膠帶。The present invention relates to a dicing tape corresponding to reflow used in semiconductor manufacturing steps.

近年來，半導體的結構中伴隨著性能提升，晶片以及電連接點的高密度化更為進展。以前電連接使用導線，為了提升連接可靠性而進展為藉由焊錫連接，在連接步驟內使用有使焊球熔融的步驟（迴焊步驟）。於迴焊步驟中，由於對晶片施加超過200℃的高溫，作為支撐體的切割膠帶，亦必須有可耐受超過200℃高溫的耐熱性。In recent years, with the improvement of performance in the structure of semiconductors, the density of wafers and electrical connection points has advanced. In the past, wires were used for electrical connection. In order to improve connection reliability, it has been developed to be connected by solder. In the connection step, a step of melting the solder ball (reflow step) is used. In the reflow step, since a high temperature exceeding 200°C is applied to the wafer, the dicing tape as a support must also have heat resistance that can withstand high temperatures exceeding 200°C.

作為可對應超過200℃的高溫的切割膠帶，例如是專利文獻1揭示一種膠帶，其使用有藉由照射能量線以誘發交聯反應而於硬化後具有耐熱性的黏著劑層。如同專利文獻1，藉由在迴焊步驟前照射能量線以使黏著劑層的樹脂成分進行交聯反應，能夠改善膠（黏著劑）殘留於被著體的矽晶圓的貼合面，亦即所謂的膠殘留。As a dicing tape that can handle a high temperature exceeding 200° C., for example, Patent Document 1 discloses a tape that uses an adhesive layer that has heat resistance after curing by inducing a cross-linking reaction by irradiating energy rays. As in Patent Document 1, by irradiating energy rays before the reflow step to cause the resin component of the adhesive layer to undergo a cross-linking reaction, it is possible to improve the adhesive (adhesive) remaining on the bonding surface of the silicon wafer to be adhered. The so-called glue residue.

但是，如照射能量線以使黏著劑層的樹脂成分進行交聯反應，黏著劑層所含的光聚合起始劑分裂並低分子化，成為釋氣（outgas）的原因。如於能量線照射後經由迴焊步驟並實施將矽晶圓單片化的切割步驟，由於因從黏著劑發生的釋氣所致的浮起，具有晶片無法固定而由切割膠帶剝離而使得晶片飛散此種不良產生的情形。However, if energy rays are irradiated to cause the resin component of the adhesive layer to undergo a cross-linking reaction, the photopolymerization initiator contained in the adhesive layer is split and reduced in molecular weight, which causes outgas. For example, after the energy ray is irradiated, the reflow step and the dicing step of singulating the silicon wafer are carried out. Due to the floating caused by outgassing from the adhesive, the chip cannot be fixed and peeled off by the dicing tape, causing the chip Disperse the occurrence of such defects.

根據上述，亦施行有將經由迴焊步驟的膠帶在切割步驟之前由矽晶圓剝離，並將另外的切割步驟用膠帶貼合於矽晶圓。此種膠帶的黏貼替換，由於會招致產量的惡化，廢棄物亦增加，因而希望改善。 [先前技術文獻] [專利文獻]According to the above, it is also implemented to peel the tape that has passed through the reflow step from the silicon wafer before the dicing step, and to attach the tape to the silicon wafer for another dicing step. The adhesive replacement of this kind of tape will cause the deterioration of the yield and increase the waste, so improvement is desired. [Prior Technical Literature] [Patent Literature]

[專利文獻1] 日本專利公表第2009-538389號公報[Patent Document 1] Japanese Patent Publication No. 2009-538389

[發明所要解決的課題] 本發明是基於前述問題點而成者，本發明的目的為提供一種迴焊對應切割膠帶，抑制從放射線硬化型黏著劑層的釋氣的產生並具有優良的耐污染性。 [用於解決課題的手段][Problems to be Solved by Invention] The present invention is based on the aforementioned problems. The object of the present invention is to provide a dicing tape corresponding to reflow, which suppresses the generation of outgassing from the radiation-curable adhesive layer and has excellent contamination resistance. [Means used to solve the problem]

本發明者為了達成上述目的，對於耐熱性黏著片的物性、材料等進行努力研究。其結果，對於包含放射線硬化型黏著劑的膠帶，如為將被著體的矽晶圓貼合於放射線硬化型黏著劑層之後，照射放射線，並於210℃、10分鐘的加熱處理後，將前述矽晶圓從前述放射線硬化型黏著劑層剝離後之際的前述矽晶圓的貼合面以X線光電子能譜法測定之際的碳量為30mol%以下的放射線硬化型黏著劑層，發現能夠達成上述目的，完成本發明。In order to achieve the above-mentioned object, the inventors made diligent research on the physical properties and materials of the heat-resistant adhesive sheet. As a result, for tapes containing radiation-curing adhesives, for example, after bonding a silicon wafer to be adhered to a radiation-curing adhesive layer, irradiate it with radiation and heat it at 210°C for 10 minutes. When the silicon wafer is peeled from the radiation-curing adhesive layer, the bonding surface of the silicon wafer is a radiation-curing adhesive layer with a carbon content of 30 mol% or less when measured by X-ray photoelectron spectroscopy, It was found that the above object can be achieved, and the present invention has been completed.

本發明的構成要旨如下所述。 [1] 一種迴焊對應切割膠帶，具備基材層以及設置於該基材層上的放射線硬化型黏著劑層，將矽晶圓貼合於前述放射線硬化型黏著劑層之後，照射放射線後於210℃進行10分鐘的加熱處理，於該加熱處理後將前述矽晶圓從前述放射線硬化型黏著劑層剝離後之際的前述矽晶圓的貼合面以X線光電子能譜法測定之際的碳量為30mol%以下。 [2] 如[1]所記載的迴焊對應切割膠帶，前述放射線硬化型黏著劑層包含具有乙烯性不飽和鍵的聚合性化合物、具有與該具有乙烯性不飽和鍵的聚合性化合物的聚合物以及/或是陽離子以及/或是陰離子反應的環狀結構的化合物、與光聚合起始劑。 [3] 如[2]所記載的迴焊對應切割膠帶，前述具有乙烯性不飽和鍵的聚合性化合物的聚合物包含（甲基）丙烯酸系聚合物，前述（甲基）丙烯酸系聚合物為包含（甲基）丙烯酸以及/或是（甲基）丙烯酸酯的單體的聚合物。 [4] 如[2]或[3]所記載的迴焊對應切割膠帶，前述光聚合起始劑為肟脂化合物。 [5] 如[2]至[4]的任意一項所記載的迴焊對應切割膠帶，前述光聚合起始劑的分子量為400以上。 [6] 如[1]至[5]的任意一項所記載的迴焊對應切割膠帶，前述放射線硬化型黏著劑層為紫外線硬化型黏著劑層。 [7] 如[1]至[6]的任意一項所記載的迴焊對應切割膠帶，前述放射線硬化型黏著劑層的，以1000mJ/cm2 照射波長350nm的放射線後於210℃進行10分鐘的加熱處理後的，根據JIS Z2037測定的黏著力為0.3N/25mm寬以上、2.0N/25mm寬以下。The gist of the present invention is as follows. [1] A dicing tape corresponding to reflow, including a substrate layer and a radiation-curing adhesive layer provided on the substrate layer. After bonding a silicon wafer to the radiation-curing adhesive layer, it is irradiated with radiation. Heat treatment at 210°C for 10 minutes, after the heat treatment, when the silicon wafer is peeled from the radiation-curable adhesive layer, the bonding surface of the silicon wafer is measured by X-ray photoelectron spectroscopy The carbon content is less than 30mol%. [2] The dicing tape for reflow as described in [1], wherein the radiation-curable adhesive layer contains a polymerizable compound having an ethylenically unsaturated bond, and polymerized with the polymerizable compound having an ethylenically unsaturated bond And/or a compound having a cyclic structure that reacts with a cation and/or anion, and a photopolymerization initiator. [3] In the dicing tape for reflow as described in [2], the polymer of the polymerizable compound having an ethylenically unsaturated bond includes a (meth)acrylic polymer, and the (meth)acrylic polymer is A polymer containing (meth)acrylic acid and/or (meth)acrylic acid ester monomers. [4] In the dicing tape for reflow as described in [2] or [3], the photopolymerization initiator is an oxime compound. [5] In the dicing tape for reflow as described in any one of [2] to [4], the molecular weight of the photopolymerization initiator is 400 or more. [6] In the dicing tape for reflow as described in any one of [1] to [5], the radiation-curable adhesive layer is an ultraviolet-curable adhesive layer. [7] The dicing tape for reflow as described in any one of [1] to [6], for the aforementioned radiation-curable adhesive layer, irradiate radiation with a wavelength of 350 nm at 1000 mJ/cm 2 and then perform 10 minutes at 210°C After the heat treatment, the adhesive force measured according to JIS Z2037 is 0.3N/25mm wide or more and 2.0N/25mm wide or less.

本發明藉由在迴焊步驟前對貼合於矽晶圓的切割膠帶的放射線硬化型黏著劑層，預先照射放射線，而使構成該放射線硬化型黏著劑層的主成分的分子量藉由交聯反應等上升。即使在切割晶片中包含低分子成分，在構成放射線硬化型黏著劑層的主成分的分子量上昇之際，該低分子成分進入主骨骼而能夠降低揮發成分。因此，本發明的迴焊對應切割膠帶能夠降低釋氣成分。 [發明的效果]In the present invention, the radiation-curing adhesive layer of the dicing tape attached to the silicon wafer is irradiated with radiation before the reflow step, so that the molecular weight of the main component constituting the radiation-curing adhesive layer is cross-linked Reactions etc. rise. Even if low-molecular components are included in the dicing wafer, when the molecular weight of the main components constituting the radiation-curable adhesive layer increases, the low-molecular components enter the main skeleton to reduce volatile components. Therefore, the dicing tape corresponding to reflow of the present invention can reduce outgassing components. [Effects of the invention]

依照本發明的態樣，迴焊步驟後將矽晶圓由切割膠帶剝離之際，由於能夠防止放射線硬化型黏著劑層的黏著劑殘留於矽晶圓，亦即所謂膠殘留，亦能夠防止從放射線硬化型黏著劑層的釋氣產生所致的矽晶圓的由切割膠帶的浮起，因此能夠防止晶片飛散。According to the aspect of the present invention, when the silicon wafer is peeled from the dicing tape after the reflow step, since the adhesive of the radiation-curing adhesive layer can be prevented from remaining on the silicon wafer, the so-called glue residue can also be prevented from The floating of the silicon wafer from the dicing tape caused by the outgassing of the radiation-curable adhesive layer can prevent the wafer from scattering.

對於本發明的迴焊對應切割膠帶，說明如下。本發明的迴焊對應切割膠帶，具備基材層以及設置於該基材層上的放射線硬化型黏著劑層。放射線硬化型黏著劑層能夠藉由在基材層上塗佈放射線硬化型黏著繼而形成。The dicing tape corresponding to the reflow of the present invention is described as follows. The dicing tape for reflow of the present invention includes a substrate layer and a radiation-curing adhesive layer provided on the substrate layer. The radiation-curing adhesive layer can be formed by coating a radiation-curing adhesive on the base layer.

本發明的迴焊對應切割膠帶的放射線硬化型黏著劑層，以1000mJ/cm2 照射波長350nm的放射線後於210℃進行10分鐘的加熱處理後的，根據JIS Z2037測定的黏著力並沒有特別限制，但由確實防止切割步驟中晶片無法固定而晶片飛出亦即所謂晶片飛散、包含搬運的步驟中的剝離等的觀點，其下限值較佳為0.3N/25mm寬以上，特佳為0.5N/25mm寬以上。而且，由確實防止迴焊對應切割膠帶的剝離之際放射線硬化型黏著劑層部分附著於被著體上、亦即膠殘留的觀點，上述黏著力的上限值較佳為2.0N/25mm寬以下，特佳為1.5N/25mm寬以下。The radiation-curable adhesive layer of the dicing tape for reflow of the present invention is irradiated with radiation with a wavelength of 350 nm at 1000 mJ/cm 2 and heated at 210°C for 10 minutes. The adhesive force measured according to JIS Z2037 is not particularly limited. , But from the viewpoint of surely preventing the wafer from being fixed and the wafer flying out during the dicing step, that is, the so-called wafer flying, and peeling during the transportation step, the lower limit is preferably 0.3N/25mm width or more, particularly preferably 0.5 N/25mm wide and above. Furthermore, from the viewpoint of reliably preventing the radiation-curable adhesive layer from partially adhering to the substrate when peeling off the dicing tape for reflow, that is, adhesive residue, the upper limit of the adhesive force is preferably 2.0N/25mm width Below, 1.5N/25mm width or less is particularly preferred.

作為基材層的材料並沒有特別的限定，但是，由於基材層會被與放射線硬化型黏著劑層共同加熱，因此會被加熱至210℃以上。因此，基材層有必要具備對於上述加熱條件的充分耐熱性。根據上述，作為較佳的基材層，舉出聚對苯二甲酸乙二酯（PET）膜、聚對苯二甲酸萘酯（PEN）膜、聚醚碸（PES）膜、聚醚醯亞胺（PEI）膜、聚碸（PSF）膜、聚苯硫醚（PPS）膜、聚醚醚酮（PEEK）膜、聚芳酯（PAR）膜、芳香族聚醯胺膜、聚醯亞胺膜或液晶聚合物（PCP）膜等。其中，由切割步驟時的卡盤（chuck）性的觀點，特佳為聚醚醚酮（PEEK）膜。The material of the base layer is not particularly limited. However, since the base layer is heated together with the radiation-curable adhesive layer, it is heated to 210°C or higher. Therefore, it is necessary for the base layer to have sufficient heat resistance to the above heating conditions. According to the above, as a preferable substrate layer, there are polyethylene terephthalate (PET) film, polyethylene terephthalate (PEN) film, polyether ether (PES) film, polyether cyanide Amine (PEI) film, poly (PSF) film, polyphenylene sulfide (PPS) film, polyether ether ketone (PEEK) film, polyarylate (PAR) film, aromatic polyamide film, polyimide Film or liquid crystal polymer (PCP) film, etc. Among them, a polyether ether ketone (PEEK) film is particularly preferred from the viewpoint of chuck properties during the cutting step.

基材層的厚度能夠依據使用條件適當選擇，例如是較佳為5～250μm的範圍內。藉由使基材層的厚度於上述數值範圍內，能夠防止迴焊對應切割膠帶的折斷、開裂等，得到優良的操作性。The thickness of the substrate layer can be appropriately selected depending on the usage conditions, and for example, it is preferably in the range of 5 to 250 μm. By setting the thickness of the base material layer within the above-mentioned numerical range, it is possible to prevent breakage, cracks, etc. of the dicing tape corresponding to reflow, and to obtain excellent operability.

在將放射線硬化型黏著劑層貼合於被著體後，對放射線硬化型黏著劑層進行放射線照射後於210℃進行10分鐘的加熱處理，於該加熱處理之後，將前述被著體從前述放射線硬化型黏著劑層剝離後之際的前述矽晶圓的貼合面以X線光電子能譜（X-ray photoelectron spectroscopy）法測定之際的碳量為30mol%以下。作為放射線照射的條件，舉出以1000mJ/cm2 照射波長350nm的放射線。After the radiation-curing adhesive layer is bonded to the body, the radiation-curing adhesive layer is irradiated with radiation, and then heated at 210°C for 10 minutes. After the heat treatment, the body is removed from the body After the radiation-curable adhesive layer is peeled off, the bonding surface of the silicon wafer has a carbon content of 30 mol% or less when measured by X-ray photoelectron spectroscopy. As a condition of radiation irradiation, irradiation with a radiation having a wavelength of 350 nm at 1000 mJ/cm 2 is mentioned.

放射線硬化型黏著劑層在進行放射線照射後於210℃進行10分鐘的加熱處理，被著體的剝離面的碳量也降低至30mol%以下。因此，防止放射線硬化型黏著劑層的黏著劑殘留於被著體，也防止被著體的從切割膠帶的浮起。被著體的剝離面的碳量如為30mol%以下，並沒有特別限制，特佳為25mol%以下。The radiation-curable adhesive layer was heated at 210°C for 10 minutes after irradiation with radiation, and the carbon content of the peeled surface of the adherend was also reduced to 30 mol% or less. Therefore, the adhesive of the radiation-curable adhesive layer is prevented from remaining on the adherend, and the adherend is also prevented from floating from the dicing tape. The carbon amount of the peeling surface of the adherend is not particularly limited as long as it is 30 mol% or less, but is particularly preferably 25 mol% or less.

尚且，上述被著體的剝離面的碳量，是表示附著於被著體的剝離面的成分總量中的碳的比率。In addition, the amount of carbon on the peeling surface of the adherend means the ratio of carbon in the total amount of components attached to the peeling surface of the adherend.

放射線硬化型黏著劑層包含黏著劑作為黏著成分。黏著劑包含作為主成分的具有乙烯性不飽和鍵的聚合性化合物、具有與具有乙烯性不飽和鍵的聚合性化合物以及/或是陽離子以及/或是陰離子反應的環狀結構的化合物、以及光聚合起始劑。The radiation-curable adhesive layer contains an adhesive as an adhesive component. The adhesive includes a polymerizable compound having an ethylenically unsaturated bond as a main component, a compound having a cyclic structure that reacts with a polymerizable compound having an ethylenically unsaturated bond and/or a cation and/or anion, and a light Polymerization initiator.

具有乙烯性不飽和鍵的聚合性化合物 作為黏著劑的主成分所調配的具有乙烯性不飽和鍵的聚合性化合物並沒有特別的限制，可使用調配有習知的感光性組合物者。作為具有乙烯性不飽和鍵的聚合性化合物，例如是舉出乙烯、丙烯、丁烯、異丁烯、氯化乙烯、氯化亞乙烯、氟化亞乙烯、四氟乙烯等的不飽和脂肪族烴；（甲基）丙烯酸、α-氯（甲基）丙烯酸、衣康酸、馬來酸、檸康酸、富馬酸、雙環庚烯二甲酸（himic acid）、巴豆酸、異巴豆酸、乙酸乙烯酯、乙酸烯丙酯、肉桂酸、山梨酸、甲基富馬酸等的具有乙烯性不飽和鍵的羧酸；琥珀酸單[2-（甲基）丙烯醯氧基乙基]、鄰苯二甲酸單[2-（甲基）丙烯醯氧基乙基]、ω-羧基聚己內酯單（甲基）丙烯酸酯等的於兩末端具有羧基與羥基的聚合物的單（甲基）丙烯酸酯；羥基乙基（甲基）丙烯酸酯．蘋果酸酯、羥基丙基（甲基）丙烯酸酯．蘋果酸酯、二環戊二烯．蘋果酸酯或是具有1個羥基與2個以上的（甲基）丙烯醯基的多官能（甲基）丙烯酸酯等的不飽和多元酸；（甲基）丙烯酸-2-羥基乙酯、（甲基）丙烯酸-2-羥基丙酯、（甲基）丙烯酸縮水甘油酯、下述化合物No.A1～No.A4、（甲基）丙烯酸甲酯、（甲基）丙烯酸丁酯、（甲基）丙烯酸異丁酯、（甲基）丙烯酸第三丁酯、（甲基）丙烯酸環己酯、（甲基）丙烯酸正辛酯、（甲基）丙烯酸異辛酯、（甲基）丙烯酸異壬酯、（甲基）丙烯酸硬脂酸酯、（甲基）丙烯酸月桂酯、（甲基）丙烯酸甲氧基乙酯、（甲基）丙烯酸二甲基胺基甲酯、（甲基）丙烯酸二甲基胺基乙酯、（甲基）丙烯酸胺基丙酯、（甲基）丙烯酸二甲基胺基丙酯、（甲基）丙烯酸乙氧基乙酯、（甲基）丙烯酸聚（乙氧基）乙酯、（甲基）丙烯酸丁氧基乙氧基乙酯、（甲基）丙烯酸乙基己酯、（甲基）丙烯酸苯氧基乙酯、（甲基）丙烯酸四氫呋喃、（甲基）丙烯酸乙烯酯、（甲基）丙烯酸烯丙酯、（甲基）丙烯酸苄酯、乙二醇二（甲基）丙烯酸酯、二乙二醇二（甲基）丙烯酸酯、三乙二醇二（甲基）丙烯酸酯、聚乙二醇二（甲基）丙烯酸酯、丙二醇二（甲基）丙烯酸酯、1,4-丁二醇二（甲基）丙烯酸酯、1,6-己二醇二（甲基）丙烯酸酯、三羥甲基乙烷三（甲基）丙烯酸酯、三羥甲基丙烷三（甲基）丙烯酸酯、二新戊四醇六（甲基）丙烯酸酯、二新戊四醇五（甲基）丙烯酸酯、新戊四醇四（甲基）丙烯酸酯、新戊四醇三（甲基）丙烯酸酯、三環癸烷二羥甲基二（甲基）丙烯酸酯、三[（甲基）丙烯醯基乙基]異氰脲酸酯、聚酯（甲基）丙烯酸酯寡聚物等的（甲基）丙烯酸與醇或苯酚的酯之（甲基）丙烯酸酯。Polymeric compound with ethylenically unsaturated bond The polymerizable compound having an ethylenically unsaturated bond blended as the main component of the adhesive is not particularly limited, and a conventional photosensitive composition can be used. Examples of polymerizable compounds having ethylenically unsaturated bonds include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butene, isobutylene, chlorinated ethylene, chlorinated vinylene, fluorinated vinylene, and tetrafluoroethylene; (Meth)acrylic acid, α-chloro(meth)acrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, himic acid, crotonic acid, isocrotonic acid, vinyl acetate Ester, allyl acetate, cinnamic acid, sorbic acid, methyl fumaric acid and other carboxylic acids with ethylenically unsaturated bonds; succinic acid mono[2-(meth)acryloyloxyethyl], o-benzene Mono(methyl) dicarboxylic acid mono[2-(meth)acryloyloxyethyl], ω-carboxy polycaprolactone mono(meth)acrylate and other polymers having carboxyl and hydroxyl groups at both ends Acrylate; Hydroxyethyl (meth)acrylate. Malate, hydroxypropyl (meth)acrylate. Malate, dicyclopentadiene. Malate or an unsaturated polybasic acid such as polyfunctional (meth)acrylate having one hydroxyl group and two or more (meth)acrylic acid groups; (meth)acrylic acid-2-hydroxyethyl, ( 2-hydroxypropyl meth)acrylate, glycidyl (meth)acrylate, the following compounds No.A1～No.A4, methyl (meth)acrylate, butyl (meth)acrylate, (methyl) ) Isobutyl acrylate, tert-butyl (meth)acrylate, cyclohexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate Esters, (meth)acrylate stearate, (meth)acrylate, lauryl (meth)acrylate, methoxyethyl (meth)acrylate, dimethylaminomethyl (meth)acrylate, dimethacrylate (meth)acrylate Methylaminoethyl, (meth)aminopropyl (meth)acrylate, dimethylaminopropyl (meth)acrylate, ethoxyethyl (meth)acrylate, poly(ethoxy) (meth)acrylate Yl) ethyl, butoxy ethoxy ethyl (meth) acrylate, ethylhexyl (meth) acrylate, phenoxy ethyl (meth) acrylate, tetrahydrofuran (meth) acrylate, (methyl) ) Vinyl acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol two (Meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol Di(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, dineopentaerythritol hexa(meth)acrylate, two new Pentaerythritol penta(meth)acrylate, neopentaerythritol tetra(meth)acrylate, neopentaerythritol tri(meth)acrylate, tricyclodecane dimethylol di(meth)acrylate , Tris[(meth)acryloylethyl]isocyanurate, polyester(meth)acrylate oligomer, etc. (meth)acrylic acid and alcohol or phenol ester (meth)acrylate .

[化1]

Figure 02_image001
[化1]
Figure 02_image001

[化2]

Figure 02_image003
[化2]
Figure 02_image003

[化3]

Figure 02_image005
[化3]
Figure 02_image005

[化4]

Figure 02_image007
[化4]
Figure 02_image007

而且，作為其他的具有乙烯性不飽和鍵的聚合性化合物，例如是舉出（甲基）丙烯酸鋅、（甲基）丙烯酸鎂等的（甲基）丙烯酸的金屬鹽；馬來酸酐、衣康酸酐、檸康酸酐、甲基四氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、三烷基四氫鄰苯二甲酸酐、5-（2,5-二氧代四氫呋喃基）-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二烯基琥珀酸酐、甲基雙環庚烯二甲酸酐等的不飽和多元酸的酸酐；（甲基）丙烯醯胺、亞甲基雙-（甲基）丙烯醯胺、二亞乙基三胺參（甲基）丙烯醯胺、亞二甲苯基雙（甲基）丙烯醯胺、α-氯（甲基）丙烯醯胺、N-2-羥基乙基（甲基）丙烯醯胺等的（甲基）丙烯酸與胺化合物的醯胺；丙烯醛等的不飽和醛；（甲基）丙烯腈、α-氯丙烯腈、二氰化亞乙烯、氰化烯丙酯等的不飽和腈；苯乙烯、4-甲基苯乙烯、4-乙基苯乙烯、4-甲氧基苯乙烯、4-羥基苯乙烯、4-氯苯乙烯、二乙烯基苯、乙烯基甲苯、乙烯基苯甲酸、乙烯基苯酚、乙烯基磺酸、4-乙烯基苯磺酸、乙烯基苄基甲基醚、乙烯基苄基縮水甘油醚等的不飽和芳香族化合物；甲基乙烯基酮等的不飽和酮；乙烯基胺、烯丙基胺、N-乙烯基吡咯烷酮、乙烯基哌啶等的不飽和胺化合物；烯丙基醇、巴豆醇等乙烯基醇；乙烯基甲基醚、乙烯基乙基醚、正丁基乙烯基醚、異丁基乙烯基醚、烯丙基縮水甘油醚等的乙烯基醚；馬來醯亞胺、N-苯基馬來醯亞胺、N-環己基馬來醯亞胺等的不飽和醯亞胺類；茚、1-甲基茚等的茚類；1,3-丁二烯、異戊二烯、氯丁二烯等的脂肪族共軛二烯類；聚苯乙烯、聚（甲基）丙烯酸甲酯、聚（甲基）丙烯酸正丁酯、聚矽氧烷等的聚合物分子鏈的末端具有單（甲基）丙烯醯基的巨單體類；乙烯基氯化物、亞乙烯基氯化物、二乙烯基琥珀酸酯、二烯丙基鄰苯二甲酸酯、三烯丙基磷酸酯、三烯丙基異氰脲酸酯、乙烯基硫醚、乙烯基咪唑、乙烯基噁唑啉、乙烯基咔唑、乙烯基吡咯烷酮、乙烯基吡啶、羥基含有乙烯基單體以及聚異氰酸酯的乙烯基胺基甲酸酯化合物、羥基含有乙烯基單體以及聚環氧化合物的乙烯基環氧化合物。此些化合物可以單獨使用，亦可以併用2種以上。尚且，「（甲基）丙烯酸」是表示丙烯酸以及/或是甲基丙烯酸，「（甲基）丙烯酸酯」是表示丙烯酸酯以及/或是甲基丙烯酸酯。Furthermore, as other polymerizable compounds having ethylenically unsaturated bonds, for example, metal salts of (meth)acrylic acid such as zinc (meth)acrylate and magnesium (meth)acrylate; maleic anhydride, itaconic Acid anhydride, citraconic acid anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5-(2,5-dioxotetrahydrofuranyl)-3 -Methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecenyl succinic anhydride, methyl bicycloheptene dimethyl Anhydrides of unsaturated polybasic acids such as acid anhydrides; (meth)acrylamide, methylene bis-(meth)acrylamide, diethylenetriamine, (meth)acrylamide, xylylene Amide of (meth)acrylic acid and amine compounds such as bis(meth)acrylamide, α-chloro(meth)acrylamide, N-2-hydroxyethyl(meth)acrylamide, etc.; acrolein Unsaturated aldehydes such as (meth)acrylonitrile, α-chloroacrylonitrile, vinylidene dicyanide, allyl cyanide, etc.; styrene, 4-methylstyrene, 4-ethyl Styrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyl toluene, vinyl benzoic acid, vinyl phenol, vinyl sulfonic acid, 4-vinyl Unsaturated aromatic compounds such as benzenesulfonic acid, vinyl benzyl methyl ether, and vinyl benzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinyl amine, allyl amine, N-ethylene Unsaturated amine compounds such as methylpyrrolidone and vinylpiperidine; vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl Vinyl ethers such as ethers and allyl glycidyl ether; unsaturated imines such as maleimines, N-phenylmaleimines, N-cyclohexylmaleimines, etc.; indene, Indenes such as 1-methylindene; aliphatic conjugated dienes such as 1,3-butadiene, isoprene, and chloroprene; polystyrene, poly(methyl)acrylate, Macromonomers with mono(meth)acrylic acid groups at the end of the polymer molecular chain such as poly(n-butyl)acrylate and polysiloxane; vinyl chloride, vinylidene chloride, diethylene Succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl sulfide, vinyl imidazole, vinyl oxazoline, vinyl Carbazole, vinyl pyrrolidone, vinyl pyridine, vinyl urethane compound containing vinyl monomer and polyisocyanate in hydroxyl group, vinyl epoxy compound containing vinyl monomer and polyepoxy compound in hydroxyl group. These compounds may be used alone or in combination of two or more kinds. Furthermore, "(meth)acrylic acid" means acrylic acid and/or methacrylic acid, and "(meth)acrylate" means acrylate and/or methacrylate.

而且，做為其他的具有乙烯性不飽和鍵的聚合性化合物，例如可舉出，使環氧化合物與不飽和單羧酸反應，使生成的羥基與多元酸以及/或是多元酸酐反應所得的多元酸改質不飽和單羧酸化環氧化合物。Moreover, as other polymerizable compounds having ethylenically unsaturated bonds, for example, an epoxy compound is reacted with an unsaturated monocarboxylic acid, and the resulting hydroxyl group is reacted with a polybasic acid and/or a polybasic acid anhydride. Polybasic acid upgrades unsaturated monocarboxylated epoxy compound.

作為可用於製備多元酸改質不飽和單羧酸化環氧化合物的環氧化合物，例如是上述具有與陽離子以及/或是陰離子反應的環狀結構的化合物之環氧化合物。而且，作為可用於製備多元酸改質不飽和單羧酸化環氧化合物的不飽和單羧酸，例如是舉出（甲基）丙烯酸、巴豆酸、肉桂酸、山梨酸、羥基乙基（甲基）丙烯酸酯．蘋果酸酯、羥基乙基（甲基）丙烯酸酯．蘋果酸酯、羥基丙基（甲基）丙烯酸酯．蘋果酸酯、羥基丙基（甲基）丙烯酸酯．蘋果酸酯、二環戊二烯．蘋果酸酯等。As an epoxy compound that can be used to prepare a polybasic acid-modified unsaturated monocarboxylated epoxy compound, for example, the epoxy compound of the above-mentioned compound having a cyclic structure that reacts with cations and/or anions. Moreover, as unsaturated monocarboxylic acids that can be used to prepare polybasic acid-modified unsaturated monocarboxylated epoxy compounds, for example, (meth)acrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl (methyl) )Acrylate. Malate, hydroxyethyl (meth)acrylate. Malate, hydroxypropyl (meth)acrylate. Malate, hydroxypropyl (meth)acrylate. Malate, dicyclopentadiene. Malate and so on.

作為可用於製備多元酸改質不飽和單羧酸化環氧化合物的多元酸，舉出聯苯四甲酸、四氫鄰苯二甲酸、琥珀酸、聯鄰苯二甲酸、馬來酸、偏苯三甲酸、均苯四甲酸、2,2’-3,3’-二苯甲酮四甲酸、六氫鄰苯二甲酸、甲基四氫鄰苯二甲酸、5-降冰片烯-2,3-二羧酸(nadic acid)、甲基-5-降冰片烯-2,3-二羧酸、三烷基四氫鄰苯二甲酸(methylnadic acid)、六氫鄰苯二甲酸、5-（2,5-二氧代四氫呋喃基）-3-甲基-3-環己烯-1,2-二羧酸、三烷基四氫鄰苯二甲酸-馬來酸加成物、十二烯基琥珀酸、甲基雙環庚烯二甲酸等。而且，作為多元酸酐，舉出上述的多元酸的酸酐、乙二醇雙偏苯三酸酐、甘油參偏苯三酸酐等。Examples of polybasic acids that can be used to prepare polybasic acid-modified unsaturated monocarboxylated epoxy compounds include biphenyltetracarboxylic acid, tetrahydrophthalic acid, succinic acid, diphthalic acid, maleic acid, and trimellitic acid. Formic acid, pyromellitic acid, 2,2'-3,3'-benzophenone tetracarboxylic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, 5-norbornene-2,3- Dicarboxylic acid (nadic acid), methyl-5-norbornene-2,3-dicarboxylic acid, trialkyltetrahydrophthalic acid (methylnadic acid), hexahydrophthalic acid, 5-(2 ,5-Dioxotetrahydrofuranyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic acid, trialkyltetrahydrophthalic acid-maleic acid adduct, dodecenyl Succinic acid, methyl bicycloheptene dicarboxylic acid, etc. Moreover, as a polybasic acid anhydride, the acid anhydride of the said polybasic acid, ethylene glycol bistrimellitic anhydride, glycerin trimellitic anhydride, etc. are mentioned.

在製備多元酸改質不飽和單羧酸化環氧化合物之際的環氧化合物、不飽和單羧酸、多元酸以及/或是多元酸酐的反應莫耳比，例如是較佳成為以下比例：在具有相對於環氧化合物的1個環氧基加成0.1～1個上述不飽和單羧酸的羧基之結構的環氧加成物中，相對於該環氧加成物的1個羥基，上述多元酸以及/或是多元酸酐為0.1～1個。環氧化合物、不飽和單羧酸、多元酸以及/或是多元酸酐的反應，可依照常法施行。The reaction molar ratio of the epoxy compound, the unsaturated monocarboxylic acid, the polybasic acid and/or the polybasic acid anhydride when preparing the polybasic acid-modified unsaturated monocarboxylated epoxy compound is, for example, preferably the following ratio: In an epoxy adduct having a structure in which 0.1 to 1 carboxyl group of the above-mentioned unsaturated monocarboxylic acid is added to 1 epoxy group of the epoxy compound, the above-mentioned The number of polybasic acids and/or polybasic acid anhydrides is 0.1 to 1. The reaction of epoxy compounds, unsaturated monocarboxylic acids, polybasic acids and/or polybasic acid anhydrides can be carried out according to conventional methods.

具有乙烯性不飽和鍵的聚合性化合物的聚合物 作為調配為黏著劑的主成分的具有乙烯性不飽和鍵的聚合性化合物的聚合物，例如是可舉出上述的具有乙烯性不飽和鍵的聚合性化合物的聚合物或共聚物。其中，由分子量的控制容易而容易進行黏著力的調整的觀點，較佳為包含（甲基）丙烯酸以及/或是上述（甲基）丙烯酸酯的單體之（甲基）丙烯酸酯共聚物。Polymer of polymerizable compound with ethylenically unsaturated bond As the polymer of the polymerizable compound having an ethylenically unsaturated bond formulated as the main component of the adhesive, for example, the polymer or copolymer of the polymerizable compound having an ethylenically unsaturated bond mentioned above can be mentioned. Among them, from the viewpoint of easy control of molecular weight and easy adjustment of adhesive force, a (meth)acrylate copolymer containing (meth)acrylic acid and/or the monomer of (meth)acrylate is preferred.

具有與陽離子以及/或是陰離子反應的環狀結構的化合物 作為調配為黏著劑的主成分的具有與陽離子以及/或是陰離子反應的環狀結構的化合物，例如是舉出環氧化合物、縮水甘油醚類等的具有具有氧原子的三元環結構的化合物。作為環氧化合物，舉出苯酚酚醛清漆型環氧化合物、聯苯酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、二環戊二烯酚醛清漆型環氧化合物等的酚醛清漆型環氧化合物；雙酚型環氧化合物、具有多官能環氧基的聚苯基甲烷型環氧化合物等的環氧化合物、3,4-環氧基-6-甲基環己基甲基-3,4-環氧基-6-甲基環己烷羧酸酯、3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、1-環氧基乙基-3,4-環氧基環己烷等的脂環式環氧化合物；鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯、二聚酸縮水甘油酯等的縮水甘油酯類；四縮水甘油基胺基二苯基甲烷、三縮水甘油基對胺基苯酚、N,N-二縮水甘油基苯胺等的縮水甘油基胺類；1,3-二縮水甘油基-5,5-二甲基乙內醯脲、三縮水甘油基異氰脲酸酯等的雜環式環氧化合物；二環戊二烯二氧化物等的二氧化物化合物；萘型環氧化合物；三苯基甲烷型環氧化合物；二環戊二烯型環氧化合物等。Compounds having a cyclic structure that reacts with cations and/or anions As the main component of the adhesive, the compound having a cyclic structure that reacts with cations and/or anions includes, for example, epoxy compounds, glycidyl ethers, and other compounds having a three-membered ring structure having an oxygen atom . Examples of epoxy compounds include phenol novolac type epoxy compounds, biphenol novolac type epoxy compounds, cresol novolac type epoxy compounds, bisphenol A novolac type epoxy compounds, and dicyclopentadiene novolac Novolac type epoxy compounds such as type epoxy compounds; Epoxy compounds such as bisphenol type epoxy compounds, polyphenylmethane type epoxy compounds with polyfunctional epoxy groups, 3,4-epoxy-6 -Methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate Acid ester, 1-epoxyethyl-3,4-epoxycyclohexane and other alicyclic epoxy compounds; diglycidyl phthalate, diglycidyl tetrahydrophthalate, Glycidyl esters such as glycidyl dimer acid; glycidyl amines such as tetraglycidylamino diphenylmethane, triglycidyl p-aminophenol, N,N-diglycidylaniline; 1,3-Diglycidyl-5,5-dimethylhydantoin, triglycidyl isocyanurate and other heterocyclic epoxy compounds; dicyclopentadiene dioxide and other two Oxide compound; naphthalene type epoxy compound; triphenylmethane type epoxy compound; dicyclopentadiene type epoxy compound, etc.

作為縮水甘油醚類，舉出乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、1,8-辛二醇二縮水甘油醚、1,10-癸二醇二縮水甘油醚、2,2-二甲基-1,3-丙二醇二縮水甘油醚、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、四乙二醇二縮水甘油醚、六乙二醇二縮水甘油醚、1,4-環己烷二甲醇二縮水甘油醚、1,1,1-三（縮水甘油基氧基甲基）丙烷、1,1,1-三（縮水甘油基氧基甲基）乙烷、1,1,1-三（縮水甘油基氧基甲基）甲烷、1,1,1,1-四（縮水甘油基氧基甲基）甲烷等。Examples of glycidyl ethers include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8- Caprylyl glycol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene two Alcohol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, 1,1,1-tris (glycidyl oxygen Methyl)propane, 1,1,1-tris(glycidyloxymethyl)ethane, 1,1,1-tris(glycidyloxymethyl)methane, 1,1,1,1 -Tetra (glycidyloxymethyl) methane and so on.

而且，作為調配為黏著劑的主成分的具有與陽離子以及/或是陰離子反應的環狀結構的化合物，例如是舉出氧雜環丁烷等的具有氧原子的四元環結構的化合物等。此些的化合物可單獨使用，亦可併用2種以上。Moreover, as a compound which has a cyclic structure which reacts with a cation and/or an anion which is formulated as a main component of an adhesive, the compound etc. which have a four-membered ring structure which has an oxygen atom, such as oxetane, are mentioned, for example. These compounds may be used alone or in combination of two or more kinds.

光聚合起始劑 光聚合起始劑是藉由對具有乙烯性不飽和鍵的聚合性化合物照射活性能量線而使具有乙烯性不飽和鍵的聚合性化合物光硬化之際，發揮促進光硬化的效果。Photopolymerization initiator The photopolymerization initiator exhibits the effect of accelerating photocuring when the polymerizable compound having the ethylenically unsaturated bond is photocured by irradiating the polymerizable compound having the ethylenically unsaturated bond with active energy rays.

作為光聚合起始劑，可適當選擇公知的聚合起始劑，例如是α-羥基苯乙酮、α-胺基烷基苯酮、二苯甲酮、苯基聯苯基酮、1-羥基-1-苯甲醯基環己烷、苯偶姻、苄基二甲基縮醛、1-苄基-1-二甲基胺基-1-（4’-嗎啉基苯甲醯基）丙烷、2-嗎啉基-2-（4’-甲基巰基）苯甲醯基丙烷、噻噸酮、1-氯-4-丙氧基噻噸酮、異丙基噻噸酮、二乙基噻噸酮、乙基蒽醌、4-苯甲醯基-4’-甲基二苯基硫醚、苯偶姻丁醚、2-羥基-2-苯甲醯基丙烷、2-羥基-2-（4’-異丙基）苯甲醯基丙烷、4-丁基苯甲醯基三氯甲烷、4-苯氧基苯甲醯基二氯甲烷、苯甲醯基甲酸甲酯、1,7-雙（9’-吖啶基）庚烷、9-正丁基-3,6-雙（2’-嗎啉基苯甲醯基）咔唑、2-甲基-4,6-雙（三氯甲基）-s-三嗪、2-苯基-4,6-雙（三氯甲基）-s-三嗪、2-壬基-4,6-雙（三氯甲基）-s-三嗪、2,2-雙（2-氯苯基）-4,5,4’,5’-四苯基-1-2’-二咪唑、4,4-偶氮雙異丁腈、三苯基膦、過氧化苯甲醯等。此些之中，較佳為α-羥基苯乙酮、α-胺基烷基苯酮。As the photopolymerization initiator, known polymerization initiators can be appropriately selected, such as α-hydroxyacetophenone, α-aminoalkyl phenone, benzophenone, phenylbiphenyl ketone, 1-hydroxy -1-benzylcyclohexane, benzoin, benzyldimethyl acetal, 1-benzyl-1-dimethylamino-1-(4'-morpholinylbenzyl) Propane, 2-morpholinyl-2-(4'-methylmercapto)benzylpropane, thioxanthone, 1-chloro-4-propoxythioxanthone, isopropylthioxanthone, diethyl Thioxanthone, ethylanthraquinone, 4-benzyl-4'-methyldiphenyl sulfide, benzoin butyl ether, 2-hydroxy-2-benzylpropane, 2-hydroxy- 2-(4'-isopropyl) benzyl propane, 4-butyl benzyl chloroform, 4-phenoxy benzyl dichloromethane, methyl benzyl formate, 1 ,7-bis(9'-acridinyl)heptane, 9-n-butyl-3,6-bis(2'-morpholinylbenzyl)carbazole, 2-methyl-4,6- Bis(trichloromethyl)-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-nonyl-4,6-bis(trichloromethyl) )-S-triazine, 2,2-bis(2-chlorophenyl)-4,5,4',5'-tetraphenyl-1-2'-diimidazole, 4,4-azobisiso Butyronitrile, triphenylphosphine, benzyl peroxide, etc. Among these, α-hydroxyacetophenone and α-aminoalkylphenone are preferred.

作為α-胺基烷基苯酮，例如是下述式的化合物， [化5]

Figure 02_image009
（式中，R1 以及R2 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R1 以及R2 可連結形成3～6元環的雜環。 R3 以及R4 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、碳數1～4的烷氧基、胺基、碳數1～4的烷基硫基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R3 以及R4 可連結形成3～6元環的環狀烷。 R5 、R6 、R7 以及R8 個別獨立表示：氫原子、鹵素原子、氰基、硝基、羧基、羥基；以鹵素原子取代或是無取代的碳數1～8的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基。 R9 、R10 、R11 、R12 以及R13 個別獨立表示：氫原子、鹵素原子、氰基、硝基、羧基、羥基；以鹵素原子取代或是無取代的碳數1～8的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基、-OR14 、-O-CO-O-R15 、-NR16 R17 、-SR18 。而且，R9 、R10 、R11 、R12 以及R13 中的至少一個為選自硝基、-OR14 、-O-CO-O-R15 、-NR16 R17 、-SR18 之組群的基。 R14 、R15 、R16 、R17 以及R18 個別獨立表示：以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、碳數1～4的烷氧基、胺基、碳數1～4的烷基硫基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基；碳數2～12的雜環含有基、三烷基矽基或三芳基矽基，上述烷基以及芳基烷基中的亞甲基鏈可被-O-、-S-、-NR19 -、-CO-、-CO-O-、-O-CO-或是-O-CO-O-取代，上述烷基的末端可為不飽和鍵。 R19 表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。）The α-aminoalkylphenone is, for example, a compound of the following formula, [Chemical 5]
Figure 02_image009
(In the formula, R 1 and R 2 each independently represent: a hydrogen atom; an alkyl group having 1 to 12 carbons substituted or unsubstituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; with a carbon number of 1 to 4 The alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; substituted with a C1-C4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group or Unsubstituted arylalkyl with 7 to 30 carbons; alkenyl with 2 to 12 carbons. R 1 and R 2 may be connected to form a 3- to 6-membered heterocyclic ring. R 3 and R 4 each independently represent: hydrogen Atoms; substituted or unsubstituted alkyl groups having 1 to 12 carbon atoms with hydroxyl, carboxyl, halogen, cyano or nitro groups; alkyl groups having 1 to 4 carbon atoms, hydroxyl groups, carboxyl groups, halogen atoms, cyano groups or Nitro-substituted or unsubstituted phenyl groups; alkyl groups with 1 to 4 carbons, hydroxyl groups, alkoxy groups with 1 to 4 carbons, amino groups, alkylthio groups with 1 to 4 carbons, carboxyl groups, and halogens Atom, cyano or nitro substituted or unsubstituted arylalkyl with 7 to 30 carbons; alkenyl with 2 to 12 carbons. R 3 and R 4 can be joined to form a 3- to 6-membered cyclic alkane R 5 , R 6 , R 7 and R 8 each independently represent: a hydrogen atom, a halogen atom, a cyano group, a nitro group, a carboxyl group, a hydroxyl group; a halogen atom substituted or unsubstituted alkyl group having 1 to 8 carbon atoms; An arylalkyl group with 7 to 30 carbons substituted or unsubstituted with an alkyl group having 1 to 4 carbons, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group. R 9 , R 10 , R 11 , R 12 And R 13 each independently represents: hydrogen atom, halogen atom, cyano group, nitro group, carboxyl group, hydroxyl group; alkyl group having 1 to 8 carbon atoms substituted or unsubstituted with halogen atom; alkyl group having 1 to 4 carbon atoms , Hydroxyl, carboxyl, halogen atom, cyano or nitro substituted or unsubstituted C7-30 arylalkyl, -OR 14 , -O-CO-OR 15 , -NR 16 R 17 , -SR 18. Moreover, at least one of R 9 , R 10 , R 11 , R 12 and R 13 is selected from the group consisting of nitro, -OR 14 , -O-CO-OR 15 , -NR 16 R 17 , and -SR 18 Group of groups: R 14 , R 15 , R 16 , R 17 and R 18 each independently represent: an alkyl group having 1 to 12 carbon atoms substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group or an unsubstituted ; Phenyl substituted or unsubstituted with hydroxyl, carboxyl, halogen, cyano or nitro; alkyl with 1 to 4 carbons, hydroxyl, alkoxy with 1 to 4 carbons, amine group, carbon number 1-4 alkylthio, carboxyl, halogen atom, cyano or nitro substituted or unsubstituted arylalkyl with 7-30 carbons; alkenyl with 2-12 carbons; 2-12 carbons The heterocyclic ring contains a group, trialkylsilyl or triarylsilyl, the methylene chain in the above alkyl and arylalkyl groups can be -O-, -S-, -NR 19 -, -CO-, -CO-O-, -O-CO- or -OC O-O-substitution, the end of the above-mentioned alkyl group may be an unsaturated bond. R 19 represents: a hydrogen atom; an alkyl group with 1 to 12 carbons substituted or unsubstituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; an alkyl group with a carbon number of 1 to 4, a hydroxyl group, a carboxyl group, and a halogen Atom, cyano or nitro substituted or unsubstituted phenyl; substituted with C1-C4 alkyl, hydroxyl, carboxyl, halogen atom, cyano or nitro group or unsubstituted C7-30 Arylalkyl; alkenyl having 2-12 carbons. )

下述式的化合物， [化6]

Figure 02_image011
（式中，R1 以及R2 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R1 以及R2 可個別連結形成3～6元環的雜環。 R3 以及R4 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、碳數1～4的烷氧基、胺基、碳數1～4的烷基硫基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R3 以及R4 可連結形成3～6元環的環狀烷， R5 、R6 、R7 、R8 、R9 、R10 、R11 以及R12 個別獨立表示：氫原子、鹵素原子、氰基、硝基、羥基；以鹵素原子取代或是無取代的碳數1～8的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基。 X表示單鍵或n價的有機基、氧原子、硫原子或氮原子， n為2～6的數，n個的基相互為相同。）The compound of the following formula, [Chemical Formula 6]
Figure 02_image011
(In the formula, R 1 and R 2 each independently represent: a hydrogen atom; an alkyl group having 1 to 12 carbons substituted or unsubstituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; with a carbon number of 1 to 4 The alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; substituted with a C1-C4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group or Unsubstituted arylalkyl with 7 to 30 carbons; alkenyl with 2 to 12 carbons. R 1 and R 2 may be connected individually to form a 3- to 6-membered heterocyclic ring. R 3 and R 4 each independently represent: Hydrogen atom; substituted or unsubstituted alkyl group having 1 to 12 carbons with hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group; with alkyl group having 1 to 4 carbons, hydroxyl group, carboxyl group, halogen atom, cyano group Or nitro-substituted or unsubstituted phenyl; with C1-C4 alkyl, hydroxyl, C1-C4 alkoxy, amino, C1-C4 alkylthio, carboxy, Halogen, cyano or nitro substituted or unsubstituted arylalkyl with 7-30 carbons; alkenyl with 2-12 carbons. R 3 and R 4 can be connected to form a 3-6 membered ring Alkyl, R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 and R 12 each independently represent: hydrogen atom, halogen atom, cyano group, nitro group, hydroxyl group; substituted by halogen atom or none Substituted alkyl group having 1 to 8 carbon atoms; substituted or unsubstituted arylalkyl group having 1 to 4 carbon atoms, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group or unsubstituted carbon number 7-30. X represents a single bond or an n-valent organic group, an oxygen atom, a sulfur atom, or a nitrogen atom, n is a number from 2 to 6, and n groups are the same as each other.)

舉出下述的化合物。 [化7]

Figure 02_image013
（式中，R1 以及R2 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R1 以及R2 可個別連結形成3～6元環的雜環。 R3 以及R4 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、碳數1～4的烷氧基、胺基、碳數1～4的烷基硫基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R3 以及R4 可連結形成3～6元環的環狀烷。 R5 、R6 、R7 以及R8 個別獨立表示：氫原子、鹵素原子、氰基、硝基、羥基；以鹵素原子取代或是無取代的碳數1～8的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基。 R9 以及R10 個別獨立表示：氫原子、羥基、羧基、鹵素原子或碳數1～4的烷基，n為2以上的情形為相同或不同， n表示1～12的數， X為二價的有機基， Y為下述式（I-1）或（I-2）表示的結構， 上述烷基以及芳基烷基、以及伸烷基中的亞甲基鏈可被-O-、-S-、-CO-、-CO-O-、-O-CO-或是-O-CO-O-取代。） [化8]
Figure 02_image015
（式中，R1’ 以及R2’ 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R1’ 以及R2’ 可個別連結形成3～6元環的雜環。 R3’ 以及R4’ 個別獨立表示：氫原子；以羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數1～12的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的苯基；以碳數1～4的烷基、羥基、碳數1～4的烷氧基、胺基、碳數1～4的烷基硫基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基；碳數2～12的烯基。R3’ 以及R4’ 可連結形成3～6元環的環狀烷。 R5’ 、R6’ 、R7’ 以及R8’ 個別獨立表示：氫原子、鹵素原子、氰基、硝基、羥基；以鹵素原子取代或是無取代的碳數1～8的烷基；以碳數1～4的烷基、羥基、羧基、鹵素原子、氰基或硝基取代或是無取代的碳數7～30的芳基烷基， 上述烷基以及芳基烷基，以及伸烷基中的亞甲基鏈可被-O-、-S-、-CO-、-CO-O-、-O-CO-或是-O-CO-O-取代。） [化9]
Figure 02_image017
（式中，R12 以及R13 個別獨立表示氫原子、氰基、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R14 、R15 、R16 、R17 、R18 、R19 、R20 以及R21 個別獨立表示氫原子、鹵素原子、硝基、氰基、羥基、羧基、R22 、OR23 、SR24 、NR25 R26 、COR27 、SOR28 、SO2 R29 或CONR30 R31 ，R16 以及R18 可互相結合形成環， R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 以及R31 個別獨立表示碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， X2 表示單鍵或CO， X3 表示氧原子、硫原子、硒原子、CR32 R33 、CO、NR34 或PR35 ， R32 、R33 、R34 以及R35 個別獨立表示碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R12 、R13 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 以及R35 中的碳數1～20的烷基或碳數7～30的芳基烷基中的亞甲基，可被鹵素原子、硝基、氰基、羥基、羧基或雜環基取代，該烷基或芳基烷基中的亞甲基鏈可被-O-中斷，）The following compounds are mentioned. [化7]
Figure 02_image013
(In the formula, R 1 and R 2 each independently represent: a hydrogen atom; an alkyl group having 1 to 12 carbons substituted or unsubstituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; with a carbon number of 1 to 4 The alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; substituted with a C1-C4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group or Unsubstituted arylalkyl with 7 to 30 carbons; alkenyl with 2 to 12 carbons. R 1 and R 2 may be connected individually to form a 3- to 6-membered heterocyclic ring. R 3 and R 4 each independently represent: Hydrogen atom; substituted or unsubstituted alkyl group having 1 to 12 carbons with hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group; with alkyl group having 1 to 4 carbons, hydroxyl group, carboxyl group, halogen atom, cyano group Or nitro-substituted or unsubstituted phenyl; with C1-C4 alkyl, hydroxyl, C1-C4 alkoxy, amino, C1-C4 alkylthio, carboxy, Halogen, cyano or nitro substituted or unsubstituted arylalkyl with 7-30 carbons; alkenyl with 2-12 carbons. R 3 and R 4 can be connected to form a 3-6 membered ring Alkyl. R 5 , R 6 , R 7 and R 8 each independently represent: a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group; an alkyl group having 1 to 8 carbon atoms substituted or unsubstituted with a halogen atom; An alkyl group having 1 to 4 carbons, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group or an unsubstituted arylalkyl group having 7 to 30 carbons. R 9 and R 10 each independently represent: a hydrogen atom, Hydroxyl group, carboxyl group, halogen atom or C1-C4 alkyl group, n is the same or different when n is 2 or more, n represents the number from 1 to 12, X is a divalent organic group, Y is the following formula (I -1) or (I-2), the above-mentioned alkyl group, arylalkyl group, and the methylene chain in the alkylene group may be -O-, -S-, -CO-, -CO-O -, -O-CO- or -O-CO-O- substitution.) [化8]
Figure 02_image015
(Wherein, R 1 'and R 2' individually represent independently: a hydrogen atom; hydroxyl, a carboxyl group, a halogen atom, a cyano group or a nitro group or unsubstituted alkyl group having 1 to 12 carbon atoms; a carbon number of 1 ～4 alkyl, hydroxy, carboxy, halogen, cyano or nitro substituted or unsubstituted phenyl; substituted with C 1～4 alkyl, hydroxy, carboxy, halogen atom, cyano or nitro carbon atoms or unsubstituted arylalkyl group having 7 to 30; an alkenyl group having a carbon number of 1 .R 2 ~ 12 'and R 2' may be individually connected to form a 3- to 6-membered heterocyclic ring, R 3 'and R. 4 'independently represent individual: a hydrogen atom; hydroxyl, a carboxyl group, a halogen atom, a cyano group or a nitro group or unsubstituted alkyl group having 1 to 12 carbon atoms; the alkyl group having 1 to to 4 carbon atoms, a hydroxyl group, a carboxyl group , Halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; C1-C4 alkyl group, hydroxyl group, C1-C4 alkoxy group, amino group, C1-C4 alkyl group thio group, a carboxyl group, a halogen atom, a cyano group or a nitro group or unsubstituted carbon atoms, arylalkyl group having 7 to 30; an alkenyl group having a carbon number of the .R 2 ~ 12 3 'and R 4' may be linked to form a 3 to 6-membered ring cyclic alkyl R 5 ', R 6', R 7 ' and R 8' independently represent individual: a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group; a halogen atom or a substituted None Substituted C1-C8 alkyl group; substituted or unsubstituted C1-C4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group or unsubstituted C7-30 arylalkyl group, The above-mentioned alkyl and arylalkyl, and the methylene chain in the alkylene can be -O-, -S-, -CO-, -CO-O-, -O-CO- or -O-CO -O-Replacement.) [化9]
Figure 02_image017
(In the formula, R 12 and R 13 each independently represent a hydrogen atom, a cyano group, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an aryl alkyl group having 7 to 30 carbons, or a carbon number 2 ~20 heterocyclic group, R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 and R 21 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 22 , OR 23 , SR 24 , NR 25 R 26 , COR 27 , SOR 28 , SO 2 R 29 or CONR 30 R 31 , R 16 and R 18 can be combined with each other to form a ring, R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 and R 31 each independently represent an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, and an arylalkyl group having 7 to 30 carbons Or a heterocyclic group with 2 to 20 carbon atoms, X 2 represents a single bond or CO, X 3 represents an oxygen atom, a sulfur atom, a selenium atom, CR 32 R 33 , CO, NR 34 or PR 35 , R 32 , R 33 , R 34 and R 35 each independently represent an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons, R 12 , The number of carbons in R 13 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 and R 35 is 1～ The methylene group in an alkyl group of 20 or an arylalkyl group having 7 to 30 carbons may be substituted by a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group. The methylene chain can be interrupted by -O-,)

而且，作為光聚合起始劑，可使用肟酯化合物。藉由使光聚合起始劑為肟酯化合物，能夠確實降低釋氣的產生。Furthermore, as a photopolymerization initiator, an oxime ester compound can be used. When the photopolymerization initiator is an oxime ester compound, the generation of outgassing can be reliably reduced.

作為肟酯化合物，例如是下述式的化合物， [化10]

Figure 02_image019
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN， R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 以及R13 所表示的取代基的氫原子，可進而被OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、CN、鹵素原子或COOR21 取代， R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R21 、R22 以及R23 所表示的取代基的氫原子，可進而被CN、鹵素原子、羥基或羧基取代， R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次， R24 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R12 與R13 以及R22 與R23 可個別一併形成環， R3 以及R4 個別獨立表示R11 、OR11 、SR11 、COR11 、CONR12 R13 、NR12 COR11 、OCOR11 、COOR11 、SCOR11 、OCSR11 、COSR11 、CSOR11 、CN或鹵素原子， a以及b個別獨立表示0～4的整數， X表示氧原子、硫原子、硒原子、CR31 R32 、CO、NR33 或PR34 ， R31 、R32 、R33 以及R34 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基或碳數7～30的芳基烷基， R31 、R32 、R33 以及R34 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R31 、R32 、R33 以及R34 可個別獨立的與相鄰的任意苯環一併形成環， R5 表示OH、COOH或下述通式（II）表示的基。 [化11]
Figure 02_image021
（式中，Z1 為連結鍵，表示-O-、-S-、-NR22 -、-NR22 CO-、-SO2 -、-CS-、-OCO-或-COO-， Z2 為連結鍵，表示以1～3的R6 取代的碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， Z2 所表示的連結鍵的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR22 -、-NR22 COO-、-OCONR22 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次，Z2 所表示的連結鍵的伸烷基部分，可為分支側鏈，亦可為環狀伸烷基， R6 表示OR41 、SR41 、CONR42 R43 、NR42 COR43 、OCOR41 、COOR41 、SCOR41 、OCSR41 、COSR41 、CSOR41 、CN或鹵素原子， R41 、R42 以及R43 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基或碳數7～30的芳基烷基，R41 、R42 以及R43 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R42 與R43 可一併形成環， c表示1～3的整數。））As the oxime ester compound, for example, a compound of the following formula: [Chemical Formula 10]
Figure 02_image019
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the number of carbon atoms is 1-20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons or the heterocyclic group with 2 to 20 carbons, and the hydrogen atom of the substituents represented by R 11 , R 12 and R 13 , Which can then be OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, halogen atom or COOR 21 substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, and a carbon number 6 The hydrogen atom of the substituent represented by R 21 , R 22 and R 23 may be further substituted by CN or halogen. Atom, hydroxyl or carboxyl group, the alkylene part of the substituent represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 can be replaced by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- Interrupt 1 to 5 times, R 24 represents hydrogen atom, carbon number 1 -20 alkyl, 6-30 aryl, 7-30 arylalkyl, or 2-20 heterocyclic group, R 11 , R 12 , R 13 , R 21 , R 22 And the alkyl part of the substituent represented by R 23 may be a branched side chain or a cyclic alkyl group, and R 12 and R 13 and R 22 and R 23 may form a ring together, respectively, R 3 and R 4 independently represents R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , CN or halogen atom, a and b each independently represent an integer from 0 to 4, X represents an oxygen atom, a sulfur atom, a selenium atom, CR 31 R 32 , CO, NR 33 or PR 34 , and R 31 , R 32 , R 33 and R 34 each independently represent A hydrogen atom, an alkyl group with 1 to 20 carbons, an aryl group with 6 to 30 carbons, or an arylalkyl group with 7 to 30 carbons, where R 31 , R 32 , R 33 and R 34 represent The alkyl part of the substituent may be a branched side chain or a cyclic alkyl group. Moreover, R 31 , R 32 , R 33 and R 34 may independently form a ring together with any adjacent benzene ring. R 5 represents a group represented by OH, COOH, or the following general formula (II). [化11]
Figure 02_image021
(In the formula, Z 1 is a connecting bond, which means -O-, -S-, -NR 22 -, -NR 22 CO-, -SO 2 -, -CS-, -OCO- or -COO-, and Z 2 is The linking bond means an alkyl group with 1 to 20 carbons, an aryl group with 6 to 30 carbons, an arylalkyl group with 7 to 30 carbons, or a heterocyclic ring with 2 to 20 carbons substituted with 1 to 3 R 6 The alkylene moiety of the link represented by Z 2 can be defined by -O-, -S-, -COO-, -OCO-, -NR 22 -, -NR 22 COO-, -OCONR 22 -, -SCO-, -COS-, -OCS- or -CSO- are interrupted 1 to 5 times, the alkylene part of the link represented by Z 2 may be a branched side chain or a cyclic alkylene group, R 6 represents OR 41 , SR 41 , CONR 42 R 43 , NR 42 COR 43 , OCOR 41 , COOR 41 , SCOR 41 , OCSR 41 , COSR 41 , CSOR 41 , CN or halogen atom, R 41 , R 42 and R 43 individually An alkyl group independently representing a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons or an arylalkyl group having 7 to 30 carbons, and the substituents represented by R 41 , R 42 and R 43 The part may be a branched side chain or a cyclic alkyl group, and R 42 and R 43 may form a ring together, and c represents an integer of 1 to 3.))

下述式的化合物， [化12]

Figure 02_image023
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，烷基、芳基、芳基烷基以及雜環基的氫原子，可進而被OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、CN、鹵素原子、-CR21 =CR22 R23 、-CO-CR21 =CR22 R23 、羧基、環氧基取代，R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，上述R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的伸烷基部分的亞甲基，可藉由不飽和鍵、醚鍵、硫醚鍵、酯鍵、硫酯鍵、醯亞胺鍵或胺基甲酸酯鍵中斷1～5次，上述取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，上述取代基的烷基末端亦可為不飽和鍵，而且，R12 與R13 以及R22 與R23 可個別一併形成環，R3 可與相鄰的苯環一併形成環，R4 以及R5 個別獨立表示R11 、OR11 、SR11 、COR11 、CONR12 R13 、NR12 COR11 、OCOR11 、COOR11 、SCOR11 、OCSR11 、COSR11 、CSOR11 、CN、鹵素原子或羥基，a以及b個別獨立為0～3。）The compound of the following formula, [formation 12]
Figure 02_image023
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the carbon number is 1-20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons or the heterocyclic group with 2 to 20 carbons, the hydrogen of alkyl, aryl, arylalkyl and heterocyclic groups Atoms, which can then be OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, -C(=N-OR 21 )- R 22 , -C(=N-OCOR 21 )-R 22 , CN, halogen atom, -CR 21 =CR 22 R 23 , -CO-CR 21 =CR 22 R 23 , carboxyl, epoxy substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons. , The methylene group of the alkylene moiety of the substituents represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 can be formed by unsaturated bonds, ether bonds, thioether bonds, and ester bonds , Thioester bond, imine bond or urethane bond interrupted 1 to 5 times, the alkyl part of the above substituent may be a branched side chain or a cyclic alkyl group, the alkyl group of the above substituent The terminal can also be an unsaturated bond, and R 12 and R 13 and R 22 and R 23 can form a ring together, and R 3 can form a ring together with an adjacent benzene ring. R 4 and R 5 represent independently. R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , CN, halogen atom or hydroxyl group, a and b Individually independent is 0～3.)

下述式的化合物， [化13]

Figure 02_image025
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，烷基、芳基、芳基烷基以及雜環基的氫原子，可進而被OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、CN、鹵素原子、-CR21 =CR22 R23 、-CO-CR21 =CR22 R23 、羧基、環氧基取代，R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，上述R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的伸烷基部分亞甲基，可藉由不飽和鍵、醚鍵、硫醚鍵、酯鍵、硫酯鍵、醯亞胺鍵或胺基甲酸酯鍵中斷1～5次，上述取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，上述取代基的烷基末端亦可為不飽和鍵，而且，R12 與R13 以及R22 與R23 可個別一併形成環，R3 以及R4 個別獨立表示R11 、OR11 、SR11 、COR11 、CONR12 R13 、NR12 COR11 、OCOR11 、COOR11 、SCOR11 、OCSR11 、COSR11 、CSOR11 、CN、鹵素原子或羥基，a以及b個別獨立為0～4。X表示氧原子、硫原子、硒原子、CR31 R32 、CO、NR33 或PR34 ，R31 、R32 、R33 以及R34 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R3 可與經由-X-鄰接的苯環的碳原子的1個結合形成環結構，或是R3 與R4 可一併形成環，R31 、R33 以及R34 可個別獨立的與相鄰的任意苯環一併形成環。）The compound of the following formula, [Chemical Formula 13]
Figure 02_image025
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the carbon number is 1-20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons or the heterocyclic group with 2 to 20 carbons, the hydrogen of alkyl, aryl, arylalkyl and heterocyclic groups Atoms, which can then be OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, -C(=N-OR 21 )- R 22 , -C(=N-OCOR 21 )-R 22 , CN, halogen atom, -CR 21 =CR 22 R 23 , -CO-CR 21 =CR 22 R 23 , carboxyl, epoxy substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons. , The alkylene partial methylene group of the substituents represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 may be through unsaturated bonds, ether bonds, thioether bonds, ester bonds, The thioester bond, imine bond or urethane bond is interrupted 1 to 5 times. The alkyl part of the above substituent may be a branched side chain or a cyclic alkyl group. The alkyl end of the above substituent It may also be an unsaturated bond, and R 12 and R 13 and R 22 and R 23 may form a ring together. R 3 and R 4 each independently represent R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , CN, halogen atom or hydroxyl group, a and b are each independently 0-4. X represents an oxygen atom, a sulfur atom, Selenium atom, CR 31 R 32 , CO, NR 33 or PR 34 , R 31 , R 32 , R 33 and R 34 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 3 can be combined with one of the carbon atoms of the benzene ring adjacent to -X- to form a ring structure, or R 3 and R 4 can form a ring together, and R 31 , R 33 and R 34 can be independently adjacent to each other. Any of the benzene rings form a ring together.)

下述式的化合物， [化14]

Figure 02_image027
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN， R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 以及R13 所表示的基的氫原子，可進而被R21 、OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、NR22 COR21 、OCOR21 、COOR21 、SCOR21 、OCSR21 、COSR21 、CSOR21 、羥基、硝基、CN、鹵素原子或COOR21 取代， R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R21 、R22 以及R23 所表示的基的氫原子，可進而被羥基、硝基、CN、鹵素原子、羥基或羧基取代， R11 、R12 、R13 、R21 、R22 以及R23 所表示的基的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 CO-、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-而以不與氧原子相鄰的條件中斷1～5次， R24 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 、R13 、R21 、R22 以及R23 所表示的基的烷基部分，可為分支側鏈，亦可為環狀烷基， R3 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R3 所表示的基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R3 與R7 、R3 與R8 、R4 與R5 、R5 與R6 以及R6 與R7 可個別一併形成環， R3 所表示的基的氫原子，可進而被R21 、OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、NR22 COR21 、OCOR21 、COOR21 、SCOR21 、OCSR21 、COSR21 、CSOR21 、羥基、硝基、CN、鹵素原子或COOR21 取代， R4 、R5 、R6 以及R7 個別獨立表示R11 、OR11 、SR11 、COR14 、CONR15 R16 、NR12 COR11 、OCOR11 、COOR14 、SCOR11 、OCSR11 、COSR14 、CSOR11 、羥基、CN或鹵素原子，R4 與R5 、R5 與R6 以及R6 與R7 可個別一併形成環， R14 、R15 以及R16 表示氫原子或碳數1～20的烷基，R14 、R15 以及R16 所表示的基的烷基部分，可為分支側鏈，亦可為環狀烷基，R8 表示R11 、OR11 、SR11 、COR11 、CONR12 R13 、NR12 COR11 、OCOR11 、COOR11 、SCOR11 、OCSR11 、COSR11 、CSOR11 、羥基、CN或鹵素原子， n表示0或1。）The compound of the following formula, [Chemical Formula 14]
Figure 02_image027
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the number of carbon atoms is 1-20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons or the heterocyclic group with 2 to 20 carbons, the hydrogen atoms of the groups represented by R 11 , R 12 and R 13 , It can be further used by R 21 , OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, NR 22 COR 21 , OCOR 21 , COOR 21 , SCOR 21 , OCSR 21 , COSR 21 , CSOR 21 , hydroxyl, nitro, CN, halogen atom or COOR 21 substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom and an alkyl group with 1 to 20 carbon atoms , An aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons. The hydrogen atoms of the groups represented by R 21 , R 22 and R 23 may be further Hydroxy, nitro, CN, halogen atom, hydroxy or carboxyl substitution, the alkylene part of the group represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 can be replaced by -O-,- S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- The condition not adjacent to the oxygen atom is interrupted 1 to 5 times, R 24 represents a hydrogen atom, an alkyl group with 1 to 20 carbons, an aryl group with 6 to 30 carbons, an arylalkyl group with 7 to 30 carbons, or carbon A heterocyclic group of 2-20, the alkyl part of the group represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 may be a branched side chain or a cyclic alkyl group, R 3 represents a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons, the group represented by R 3 The alkyl part of can be a branched side chain or a cyclic alkyl group, and R 3 and R 7 , R 3 and R 8 , R 4 and R 5 , R 5 and R 6, and R 6 and R 7 They can form a ring together individually, and the hydrogen atom of the group represented by R 3 can be further replaced by R 21 , OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, NR 22 COR 21 , OC OR 21 , COOR 21 , SCOR 21 , OCSR 21 , COSR 21 , CSOR 21 , hydroxyl, nitro, CN, halogen atom or COOR 21 substitution, R 4 , R 5 , R 6 and R 7 independently represent R 11 , OR 11 , SR 11 , COR 14 , CONR 15 R 16 , NR 12 COR 11 , OCOR 11 , COOR 14 , SCOR 11 , OCSR 11 , COSR 14 , CSOR 11 , hydroxyl, CN or halogen atom, R 4 and R 5 , R 5 and R 6 and R 6 and R 7 may individually form a ring together. R 14 , R 15 and R 16 represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and R 14 , R 15 and R 16 represent groups The alkyl part of can be a branched side chain or a cyclic alkyl group. R 8 represents R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , hydroxyl, CN or halogen atom, n represents 0 or 1. )

下述式的化合物， [化15]

Figure 02_image029
（式中，R1 以及R2 表示R、OR、COR、SR、CONR’R’’或CN，R、R’以及R’’表示烷基、芳基、芳烷基或雜環基，此些可被鹵素原子或雜環基取代，此些中的烷基以及芳烷基的伸烷基部分，可藉由不飽和鍵、醚鍵、硫醚鍵或酯鍵中斷，而且，R’與R’’可一併形成環。R3 以及R4 個別獨立表示R、OR、SR、氰基、鹵素原子或羥基，a以及b個別獨立為0～4。X表示氧原子、硫原子、硒原子、碳原子、N-R5 或P-R12 ，R5 以及R12 表示烷基，該烷基可被-O-、-S-、-C-O-O-、-O-CO-、-CO-S-或-S-CO-中斷，X為碳原子時，R3 與R4 可一併形成環，或是R3 經由-X-與鄰接的苯環的碳原子的1個鍵結而形成環結構，X為氧原子、硫原子、硒原子或P-R12 時，R3 可經由-X-與鄰接的苯環的碳原子的1個鍵結而形成環結構，R3 與R4 可一併形成環，R5 以及R12 個別獨立可與鄰接的苯環一併形成環。）The compound of the following formula, [Chemical Formula 15]
Figure 02_image029
(In the formula, R 1 and R 2 represent R, OR, COR, SR, CONR'R" or CN, and R, R'and R" represent an alkyl group, an aryl group, an aralkyl group or a heterocyclic group. These may be substituted by a halogen atom or a heterocyclic group. The alkylene part of the alkyl group and the aralkyl group in these can be interrupted by an unsaturated bond, an ether bond, a thioether bond or an ester bond, and R'and R" can form a ring together. R 3 and R 4 independently represent R, OR, SR, cyano, halogen atom, or hydroxyl group, and a and b are independently 0-4. X represents oxygen atom, sulfur atom, selenium Atom, carbon atom, NR 5 or PR 12 , R 5 and R 12 represent an alkyl group, and the alkyl group may be -O-, -S-, -COO-, -O-CO-, -CO-S- or- When S-CO- is interrupted, when X is a carbon atom, R 3 and R 4 can form a ring together, or R 3 can form a ring structure through a bond of -X- with the adjacent carbon atom of the benzene ring, X When it is an oxygen atom, a sulfur atom, a selenium atom or PR 12 , R 3 can form a ring structure via a bond of -X- with the adjacent carbon atom of the benzene ring, and R 3 and R 4 can form a ring together. R 5 and R 12 may independently form a ring together with the adjacent benzene ring.)

下述式的化合物， [化16]

Figure 02_image031
（式中，X表示鹵素原子或烷基，R1 、R2 以及R3 個別獨立表示R、OR、COR、SR、CONRR’或CN，R以及R’表示烷基、芳基、芳烷基或雜環基，此些可被鹵素原子及/或雜環基取代，此些中的烷基以及芳烷基的伸烷基部分，可藉由不飽和鍵、醚鍵、硫醚鍵或酯鍵中斷，而且，R與R’可一併形成環。Y1 表示氧原子、硫原子、硒原子，A表示雜環基，m表示0～4的整數，p表示0～5的整數，q表示0或1。）The compound of the following formula, [formation 16]
Figure 02_image031
(In the formula, X represents a halogen atom or an alkyl group, R 1 , R 2 and R 3 each independently represent R, OR, COR, SR, CONRR' or CN, and R and R'represent an alkyl group, an aryl group, an aralkyl group Or heterocyclic groups, these may be substituted by halogen atoms and/or heterocyclic groups, and the alkylene portion of the alkyl group and aralkyl group in these can be formed by unsaturated bonds, ether bonds, thioether bonds or esters The bond is interrupted, and R and R'can form a ring together. Y 1 represents an oxygen atom, a sulfur atom, a selenium atom, A represents a heterocyclic group, m represents an integer from 0 to 4, p represents an integer from 0 to 5, and q Represents 0 or 1.)

下述式的化合物， [化17]

Figure 02_image033
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R11 、R12 以及R13 所表示的取代基的氫原子，可被OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、CN、鹵素原子或COOR21 取代， R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R21 、R22 以及R23 所表示的取代基的氫原子，可被CN、鹵素原子、羥基或羧基取代， R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次，R24 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R12 與R13 以及R22 與R23 可個別一併形成環， R3 、L1 、L2 以及L3 個別獨立表示R11 、OR11 、SR11 、COR14 、CONR15 R16 、NR12 COR11 、OCOR11 、COOR14 、SCOR11 、OCSR11 、COSR14 、CSOR11 、羥基、硝基、CN或鹵素原子，L1 與R3 、R3 與L2 以及L2 與L3 可個別一併形成環，R14 、R15 以及R16 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R4 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基，R4 所表示的基的烷基部分，可為分支側鏈，亦可為環狀烷基，R4 所表示的基的氫原子，可進而被R21 、OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、NR22 COR21 、OCOR21 、COOR21 、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、SCOR21 、OCSR21 、COSR21 、CSOR21 、羥基、硝基、CN、鹵素原子或COOR21 取代，X為直接鍵結、CO或下述通式（I-A）所表示的基。 [化18]
Figure 02_image035
（式中，Z1 以及Z2 為連結鍵，表示單鍵、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， Z1 以及Z2 所表示的連結鍵的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次，Z2 所表示的連結鍵的伸烷基部分，可為分支側鏈，亦可為環狀伸烷基， R5 表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R11 、R12 以及R13 與上述通式（I）相同。）） [化19]
Figure 02_image037
（式中，R6 、R7 以及R8 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN，R11 、R12 以及R13 與上述通式（I）相同， R9 表示OH、COOH或下述通式（II-A）表示的基， Y表示氧原子、硫原子、硒原子、CR31 R32 、CO、NR33 或PR34 ， α表示1～10的整數，R31 、R32 、R33 以及R34 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基或碳數7～30的芳基烷基， R31 、R32 、R33 以及R34 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，R31 、R32 、R33 以及R34 可個別獨立的與相鄰的任意苯環一併形成環。 [化20]
Figure 02_image039
（式中，Z3 為連結鍵，表示-O-、-S-、-NR22 -、-NR22 CO-、-SO2 -、-CS-、-OCO-或-COO-， Z4 表示連結鍵，表示以1～3個R10 取代的碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， Z4 所表示的連結鍵的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次，Z4 表示的連結鍵的伸烷基部分，可為分支側鏈，亦可為環狀伸烷基，R10 表示OR41 、SR41 、CONR42 R43 、NR42 COR43 、OCOR41 、COOR41 、SCOR41 、OCSR41 、COSR41 、CSOR41 、CN或鹵素原子，R41 、R42 以及R43 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基或碳數7～30的芳基烷基，R41 、R42 以及R43 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，R42 與R43 可一併形成環，a表示1～3的整數。R22 以及R24 與上述通式（I）相同。）The compound of the following formula, [化17]
Figure 02_image033
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the carbon number is 1-20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons or the heterocyclic group with 2 to 20 carbons, the hydrogen atom of the substituents represented by R 11 , R 12 and R 13 , Can be OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, halogen atom or COOR 21 substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbons, and a carbon number of 6 to The aryl group of 30, the arylalkyl group of 7 to 30 carbons, or the heterocyclic group of 2 to 20 carbons, and the hydrogen atoms of the substituents represented by R 21 , R 22 and R 23 may be replaced by CN, halogen atoms, Hydroxy or carboxyl substitution, the alkylene part of the substituent represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 can be replaced by -O-, -S-, -COO-, -OCO -, -NR 24 -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- Interrupt 1 to 5 times, R 24 represents hydrogen atom, carbon number 1 to 20 The alkyl group, the aryl group with 6 to 30 carbons, the arylalkyl group with 7 to 30 carbons, or the heterocyclic group with 2 to 20 carbons, R 11 , R 12 , R 13 , R 21 , R 22 and R The alkyl part of the substituent represented by 23 may be a branched side chain or a cyclic alkyl group. Moreover, R 12 and R 13 and R 22 and R 23 may form a ring together, respectively, R 3 , L 1 , L 2 and L 3 independently represent R 11 , OR 11 , SR 11 , COR 14 , CONR 15 R 16 , NR 12 COR 11 , OCOR 11 , COOR 14 , SCOR 11 , OCSR 11 , COSR 14 , CSOR 11 , hydroxyl , Nitro group, CN or halogen atom, L 1 and R 3 , R 3 and L 2 and L 2 and L 3 can form a ring together. R 14 , R 15 and R 16 each independently represent a hydrogen atom and carbon number 1. -20 alkyl group, aryl group having 6-30 carbons, arylalkyl group having 7-30 carbons or heterocyclic group having 2-20 carbons, R 4 represents a hydrogen atom, an alkyl group having 1-20 carbons , C6-30 aryl, C7-30 arylalkyl or C2- For the heterocyclic group of 20, the alkyl portion of the group represented by R 4 may be a branched side chain or a cyclic alkyl group. The hydrogen atom of the group represented by R 4 may be further replaced by R 21 , OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, NR 22 COR 21 , OCOR 21 , COOR 21 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , SCOR 21 , OCSR 21 , COSR 21 , CSOR 21 , hydroxyl, nitro, CN, halogen atom or COOR 21 substitution, X is a direct bond , CO or the group represented by the following general formula (IA). [化18]
Figure 02_image035
(In the formula, Z 1 and Z 2 are connecting bonds, representing a single bond, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an aryl alkyl group having 7 to 30 carbons, or a carbon number of 2 to The heterocyclic group of 20, the alkylene moiety of the link represented by Z 1 and Z 2 can be represented by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO -, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- are interrupted 1 to 5 times, the alkylene part of the link represented by Z 2 may be a branched side chain or Cyclic alkylene, R 5 represents R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 11 , R 12 and R 13 are the same as the above general formula (I).)) [Chemical Formula 19 ]
Figure 02_image037
(In the formula, R 6 , R 7 and R 8 independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 11 , R 12 and R 13 are the same as the above general formula (I) , R 9 represents OH, COOH or the group represented by the following general formula (II-A), Y represents oxygen atom, sulfur atom, selenium atom, CR 31 R 32 , CO, NR 33 or PR 34 , and α represents 1-10 R 31 , R 32 , R 33 and R 34 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, or an arylalkyl group having 7 to 30 carbons, R The alkyl part of the substituent represented by 31 , R 32 , R 33 and R 34 may be a branched side chain or a cyclic alkyl group. R 31 , R 32 , R 33 and R 34 may be independently associated with each other. Any adjacent benzene rings together form a ring. [化20]
Figure 02_image039
(In the formula, Z 3 is a connecting bond, which means -O-, -S-, -NR 22 -, -NR 22 CO-, -SO 2 -, -CS-, -OCO- or -COO-, Z 4 means The linking bond means an alkyl group with 1 to 20 carbons, an aryl group with 6 to 30 carbons, an arylalkyl group with 7 to 30 carbons, or a heterocyclic ring with 2 to 20 carbons substituted with 1 to 3 R 10 Group, the alkylene part of the linking bond represented by Z 4 can be defined by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- are interrupted 1 to 5 times, the alkylene part of the link represented by Z 4 may be a branched side chain or a cyclic alkylene, R 10 Represents OR 41 , SR 41 , CONR 42 R 43 , NR 42 COR 43 , OCOR 41 , COOR 41 , SCOR 41 , OCSR 41 , COSR 41 , CSOR 41 , CN or halogen atom, R 41 , R 42 and R 43 are independent Represents a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons or an arylalkyl group having 7 to 30 carbons, and the alkyl part of the substituent represented by R 41 , R 42 and R 43 , May be a branched side chain or a cyclic alkyl group, R 42 and R 43 may form a ring together, and a represents an integer of 1 to 3. R 22 and R 24 are the same as the above general formula (I).)

下述式的化合物， [化21]

Figure 02_image041
（式中，R1 以及R2 個別獨立氫原子、鹵素原子、硝基、氰基、碳數1～20的烴基或碳數2～20的雜環含有基， R3 、R4 、R5 、R6 、R7 、R8 以及R9 （以下亦記載為R3 ～R9 ）個別獨立表示氫原子、鹵素原子、硝基、氰基、羥基、羧基、R10 、OR10 、SR10 、NR11 R12 、COR10 、SOR10 、SO2 R10 或CONR11 R12 ， R10 、R11 以及R12 個別獨立表示碳數1～20的烴基或碳數2～20的雜環含有基，R11 與R12 可鍵結形成環， R1 、R2 、R10 、R11 以及R12 所表示的碳數1～20的烴基或碳數2～20的雜環含有基的氫原子可被鹵素原子、硝基、氰基、羥基、NR11 R12 、羧基、（甲基）丙烯醯基、環氧基、乙烯基、巰基、異氰酸酯基、羧基或雜環含有基取代，碳數2～20的烴基或碳數2～20的雜環含有基中的亞甲基可被-O-、-CO-、-COO-、-OCO-、-NR13 -、-NR13 CO-、-S-、-SO2 -、-SCO-、或-COS-取代， R13 表示氫原子、碳數1～20的烴基，R3 與R4 、R4 與R5 、R5 與R6 、R6 與R7 以及R8 與R9 可結合形成環。）The compound of the following formula, [Chemical Formula 21]
Figure 02_image041
(In the formula, R 1 and R 2 are independently hydrogen atom, halogen atom, nitro group, cyano group, hydrocarbon group with 1 to 20 carbons or heterocyclic group containing 2 to 20 carbons, R 3 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 (hereinafter also described as R 3 to R 9 ) each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 10 , OR 10 , SR 10 , NR 11 R 12 , COR 10 , SOR 10 , SO 2 R 10 or CONR 11 R 12 , R 10 , R 11 and R 12 each independently represent a hydrocarbon group with 1 to 20 carbons or a heterocyclic ring with 2 to 20 carbons Group, R 11 and R 12 can be bonded to form a ring, R 1 , R 2 , R 10 , R 11 and R 12 represent a hydrocarbon group with 1 to 20 carbons or a heterocyclic ring with 2 to 20 carbons. Atoms can be substituted by halogen atoms, nitro groups, cyano groups, hydroxyl groups, NR 11 R 12 , carboxyl groups, (meth)acrylic groups, epoxy groups, vinyl groups, mercapto groups, isocyanate groups, carboxyl groups or heterocyclic groups, carbon The methylene group in the hydrocarbon group with 2-20 or the heterocyclic ring-containing group with 2-20 carbon can be -O-, -CO-, -COO-, -OCO-, -NR 13 -, -NR 13 CO- , -S-, -SO 2 -, -SCO-, or -COS- substituted, R 13 represents a hydrogen atom, a hydrocarbon group with 1 to 20 carbon atoms, R 3 and R 4 , R 4 and R 5 , R 5 and R 6. R 6 and R 7 and R 8 and R 9 can be combined to form a ring.)

下述式的化合物， [化22]

Figure 02_image043
（式中，R1 、R2 以及R3 表示R、OR、COR、SR、CONRR’或CN，R4 表示氫原子或甲基，R以及R’表示烷基、芳基、芳烷基或雜環基，此些可被鹵素原子或雜環基取代，此些中的烷基以及芳烷基的伸烷基部分，可藉由不飽和鍵、醚鍵、硫醚鍵或酯鍵中斷，而且，R與R’可一併形成環。X表示相同或不同的鹵素原子或烷基，Y1 表示氧原子、硫原子或硒原子，Y2 表示烷二基，該烷二基的主鏈的碳原子可被氧原子取代，a表示0～4的數，q表示0或1。）The compound of the following formula, [Chemical Formula 22]
Figure 02_image043
(In the formula, R 1 , R 2 and R 3 represent R, OR, COR, SR, CONRR' or CN, R 4 represents a hydrogen atom or a methyl group, and R and R'represent an alkyl group, an aryl group, an aralkyl group or Heterocyclic groups, these can be substituted by halogen atoms or heterocyclic groups, the alkylene part of the alkyl group and aralkyl group in these can be interrupted by unsaturated bond, ether bond, thioether bond or ester bond, Moreover, R and R'may form a ring together. X represents the same or different halogen atom or alkyl group, Y 1 represents an oxygen atom, sulfur atom or selenium atom, and Y 2 represents an alkanediyl group. The main chain of the alkanediyl group The carbon atom of can be replaced by an oxygen atom, a represents a number from 0 to 4, and q represents 0 or 1.)

下述式的化合物， [化23]

Figure 02_image045
（式中，R1 以及R2 個別獨立表示R11 、OR11 、COR11 、SR11 、CONR12 R13 或CN， R11 、R12 以及R13 個別獨立表示氫原子、碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 以及R13 所表示的取代基的氫原子，可進而被OR21 、COR21 、SR21 、NR22 R23 、CONR22 R23 、-NR22 -OR23 -、-NCOR22 -OCOR23 -、-C(=N-OR21 )-R22 、-C(=N-OCOR21 )-R22 、CN、鹵素原子或COOR21 取代， R21 、R22 以及R23 個別獨立表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R21 、R22 以及R23 所表示的取代基的氫原子，可進而被CN、鹵素原子、羥基或羧基取代， R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的伸烷基部分，可藉由-O-、-S-、-COO-、-OCO-、-NR24 -、-NR24 COO-、-OCONR24 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次， R24 表示氫原子、碳數1～20的烷基、碳數6～30的芳基、碳數7～30的芳基烷基或碳數2～20的雜環基， R11 、R12 、R13 、R21 、R22 以及R23 所表示的取代基的烷基部分，可為分支側鏈，亦可為環狀烷基，而且，R12 與R13 以及R22 與R23 可個別一併形成環， Z1 為連結鍵，表示單鍵、-O-、-S-、-NR22 -、-NR22 CO-、-SO2 -、-CS-、-OCO-或-COO-， Z2 為連結鍵，表示單鍵、碳數1～20的烷二基、碳數6～30的芳二基、碳數7～30的芳烷二基或碳數2～20的2價的雜環基， Z2 所表示的連結鍵的伸烷基部分可藉由-O-、-S-、-COO-、-OCO-、-NR22 -、-NR22 COO-、-OCONR22 -、-SCO-、-COS-、-OCS-或-CSO-中斷1～5次，Z2 所表示的連結鍵的伸烷基部分可為分支側鏈，亦可為環狀伸烷基， X表示下述化學式（1-A）或（1-B）所表示的連結鍵。） [化24]
Figure 02_image047
（式（1-A）及（1-B）中，*表示連結鍵。）The compound of the following formula, [Chemical Formula 23]
Figure 02_image045
(In the formula, R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, R 11 , R 12 and R 13 each independently represent a hydrogen atom, and the number of carbon atoms is 1-20 Alkyl group, cycloalkyl group having 3-20 carbons, cycloalkylalkyl group having 4-20 carbons, aryl group having 6-30 carbons, arylalkyl group having 7-30 carbons, or carbon number 2 to The heterocyclic group of 20, the hydrogen atom of the substituent represented by R 11 , R 12 and R 13 may be further substituted by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 -, -NCOR 22 -OCOR 23 -, -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, halogen atom or COOR 21 substitution, R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbons, an aryl group having 6 to 30 carbons, an arylalkyl group having 7 to 30 carbons, or a heterocyclic group having 2 to 20 carbons, R The hydrogen atom of the substituent represented by 21 , R 22, and R 23 may be further substituted by CN, a halogen atom, a hydroxyl group or a carboxyl group, and the substitution represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 The alkylene part of the group can be controlled by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO- is interrupted 1 to 5 times, R 24 represents a hydrogen atom, an alkyl group with 1 to 20 carbons, an aryl group with 6 to 30 carbons, an arylalkyl group with 7 to 30 carbons, or a carbon number 2 to 20 heterocyclic groups, the alkyl part of the substituent represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 may be a branched side chain or a cyclic alkyl group, and , R 12 and R 13 and R 22 and R 23 can form a ring together. Z 1 is a linking bond, representing a single bond, -O-, -S-, -NR 22 -, -NR 22 CO-, -SO 2 -, -CS-, -OCO- or -COO-, Z 2 is a connecting bond, which represents a single bond, alkanediyl group having 1 to 20 carbons, an aryldiyl group having 6 to 30 carbons, and 7-30 carbons The alkylene moiety of the connecting bond represented by Z 2 can be represented by -O-, -S-, -COO-, -OCO-, -NR 22 -, -NR 22 COO-, -OCONR 22 -, -SCO-, -COS-, -OCS- or -CSO- interrupt 1 to 5 times, the alkylene part of the link represented by Z 2 can be Is a branched side chain, or a cyclic alkylene group, X represents a connecting bond represented by the following chemical formula (1-A) or (1-B). ) [化24]
Figure 02_image047
(In formulas (1-A) and (1-B), * represents the connecting key.)

下述式的化合物， [化25]

Figure 02_image049
（式中，R1 以及R2 個別獨立表示氫原子、鹵素原子、硝基、氰基、碳數1～20的烴基或含有雜環的碳數2～20的基， R1 及R2 表示的碳數1～20的烴基或R1 及R2 表示的含有雜環的碳數2～20的基的氫原子可被鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、CH2 =CH2 -O-、巰基、異氰酸酯基或雜環含有基取代，R1 及R2 表示的碳數1～20的烴基或R1 及R2 表示的含有雜環的碳數2～20的基中的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR3 -、-NR3 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-或-CSO-取代， R3 表示氫原子或碳數1～20的烴基， n表示0或1。式中的*表示以*部分與鄰接的基結合。）The compound of the following formula, [Chemical Formula 25]
Figure 02_image049
(In the formula, R 1 and R 2 independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group with 1 to 20 carbons or a group with 2 to 20 carbons containing a heterocyclic ring, and R 1 and R 2 represent The hydrogen atom of the hydrocarbon group with 1 to 20 carbons or the group with 2 to 20 carbons represented by R 1 and R 2 can be substituted by halogen atoms, nitro groups, cyano groups, hydroxyl groups, amino groups, carboxyl groups, and methyl groups. Acrylic group, acrylic group, epoxy group, vinyl group, CH 2 =CH 2 -O-, mercapto group, isocyanate group or heterocyclic group containing substituted, R 1 and R 2 represent a C 1-20 hydrocarbon group or The methylene group in the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 1 and R 2 may be -O-, -CO-, -COO-, -OCO-, -NR 3 -, -NR 3 CO-, -S-, -CS-, -SO 2 -, -SCO-, -COS-, -OCS- or -CSO- substituted, R 3 represents a hydrogen atom or a hydrocarbon group with 1 to 20 carbons, n represents 0 Or 1. The * in the formula means that the * part is combined with the adjacent group.)

下述式的化合物， [化26]

Figure 02_image051
（式中，R1 、R2 、R3 、R4 、R5 、R6 、R7 、R8 、R9 、R10 、R11 以及R12 （以下亦記載為R1 ～R12 ）個別獨立表示下述通式（II）表示的基、氫原子、鹵素原子、硝基、氰基、羥基、羧基、R13 、OR13 、SR13 、NR14 R15 、COR13 、SOR13 、SO2 R13 或CONR14 R15 ， R13 、R14 以及R15 個別獨立表示碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基、碳數7～20的芳基烷基或碳數2～20的雜環基， R13 、R14 以及R15 所表示的碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基、碳數7～20的芳基烷基或碳數2～20的雜環基的氫原子，可被鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯基醚基、巰基、異氰酸酯基或雜環含有基取代，R13 、R14 以及R15 所表示的碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數7～20的芳基烷基或碳數2～20的雜環基中的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR16 -、-NR16 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-或-CSO-取代， R16 表示氫原子、碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基或碳數7～20的芳基烷基， 環A1 以及環A2 縮合形成碳數30以下的芳香環， R1 、R2 、R3 、R4 、R5 、R6 、R7 、R8 、R9 以及R10 （以下亦記載為R1 ～R10 ）的至少一個為下述通式（II）表示的基， m為A1 的可能取代基的數以下的正的整數， m≧2的情形，複數存在的R11 個別可不同， n為A2 的可能取代基的數以下的正的整數， n≧2的情形，複數存在的R12 個別可不同， R1 與R2 、R2 與R3 、R3 與R4 、R4 與R5 、R6 與R7 、R7 與R8 、R8 與R9 、R9 與R10 、R11 與R12 可結合形成環，m≧2的情形R11 與R11 可結合形成環，n≧2的情形R12 與R12 可結合形成環， [化27]
Figure 02_image053
（式中，R17 以及R18 個別獨立表示氫原子、鹵素原子、硝基、氰基、碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基、碳數7～20的芳基烷基或碳數2～20的雜環基， R17 以及R18 所表示的碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基、碳數7～20的芳基烷基或碳數2～20的雜環基的氫原子，可被鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯基醚基、巰基、異氰酸酯基或雜環含有基取代，R17 以及R18 所表示的碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數7～20的芳基烷基或碳數2～20的雜環基的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR19 -、-NR19 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-或-CSO-取代， R19 表示氫原子、碳數1～20的烷基、碳數3～20的環烷基、碳數4～20的環烷基烷基、碳數6～20的芳基或碳數7～20的芳基烷基， k表示0或1。））The compound of the following formula, [化26]
Figure 02_image051
(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 and R 12 (hereinafter also referred to as R 1 to R 12 ) Each independently represents a group represented by the following general formula (II), hydrogen atom, halogen atom, nitro group, cyano group, hydroxyl group, carboxyl group, R 13 , OR 13 , SR 13 , NR 14 R 15 , COR 13 , SOR 13 , SO 2 R 13 or CONR 14 R 15 , R 13 , R 14 and R 15 each independently represent an alkyl group having 1 to 20 carbons, a cycloalkyl group having 3 to 20 carbons, and a cycloalkyl alkyl group having 4 to 20 carbons Group, an aryl group having 6 to 20 carbons, an arylalkyl group having 7 to 20 carbons or a heterocyclic group having 2 to 20 carbons, and the alkane having 1 to 20 carbons represented by R 13 , R 14 and R 15 Group, C3-20 cycloalkyl group, C4-20 cycloalkylalkyl group, C6-20 aryl group, C7-20 arylalkyl group or C2-20 The hydrogen atom of the heterocyclic group can be replaced by a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, a carboxyl group, a methacryl group, an acryl group, an epoxy group, a vinyl group, a vinyl ether group, a mercapto group, an isocyanate group Group or heterocyclic ring-containing group substitution, R 13 , R 14 and R 15 represent a C 1-20 alkyl group, a C 3-20 cycloalkyl group, a C 4-20 cycloalkyl alkyl group, The methylene group in the arylalkyl group with 7 to 20 carbons or the heterocyclic group with 2 to 20 carbons can be -O-, -CO-, -COO-, -OCO-, -NR 16 -,- NR 16 CO-, -S-, -CS-, -SO 2 -, -SCO-, -COS-, -OCS- or -CSO- substituted, R 16 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, Cycloalkyl groups having 3 to 20 carbons, cycloalkylalkyl groups having 4 to 20 carbons, aryl groups having 6 to 20 carbons or arylalkyl groups having 7 to 20 carbons, ring A 1 and ring A 2 are condensed Formation of an aromatic ring with 30 or less carbon atoms, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 (hereinafter also referred to as R 1 ～R 10 ) At least one is a group represented by the following general formula (II), m is a positive integer less than the number of possible substituents of A 1 , in the case of m≧2, the plural R 11 may be different individually, and n is A 2 A positive integer below the number of possible substituents. In the case of n≧2, R 12 in the plural may be different individually, R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 , R 11 and R 12 can be combined to form a ring, and when m≧2, R 11 and R 11 can be combined to form a ring, n ≧2 situation R 12 and R 12 can be combined to form a ring, [化27]
Figure 02_image053
(In the formula, R 17 and R 18 independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, an alkyl group having 1 to 20 carbons, a cycloalkyl group having 3 to 20 carbons, and a ring having 4 to 20 carbons. Alkylalkyl groups, aryl groups having 6 to 20 carbons, arylalkyl groups having 7 to 20 carbons, or heterocyclic groups having 2 to 20 carbons, and alkyl groups having 1 to 20 carbons represented by R 17 and R 18 Group, C3-20 cycloalkyl group, C4-20 cycloalkylalkyl group, C6-20 aryl group, C7-20 arylalkyl group or C2-20 The hydrogen atom of the heterocyclic group can be replaced by a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, a carboxyl group, a methacryl group, an acryl group, an epoxy group, a vinyl group, a vinyl ether group, a mercapto group, an isocyanate group Substitution with a group or heterocyclic group, R 17 and R 18 represents an alkyl group having 1 to 20 carbons, a cycloalkyl group having 3 to 20 carbons, a cycloalkyl alkyl group having 4 to 20 carbons, and a carbon number of 7 The methylene group of ～20 arylalkyl groups or heterocyclic groups with 2～20 carbons can be -O-, -CO-, -COO-, -OCO-, -NR 19 -, -NR 19 CO- , -S-, -CS-, -SO 2 -, -SCO-, -COS-, -OCS- or -CSO- substituted, R 19 represents a hydrogen atom, an alkyl group having 1 to 20 carbons, and a carbon number of 3 to 20 cycloalkyl, carbon 4-20 cycloalkylalkyl, carbon 6-20 aryl or carbon 7-20 arylalkyl, k represents 0 or 1.))

舉出下述式的化合物等。 [化28]

Figure 02_image055
（式中，R1 、R2 、R3 、R4 、R5 、R6 、R7 、R8 、R9 以及R10 （以下亦記載為R1 ～R10 ）個別獨立表示下述通式（II）表示的基、氫原子、鹵素原子、硝基、腈基、氰基、羥基、羧基、醛基、磺基、R13 、OR13 、SR13 、NR14 R15 、COR13 、SOR13 、SO2 R13 或CONR14 R15 ， R13 、R14 以及R15 個別獨立表示碳數1～20的烴基或碳數2～20的雜環含有基， R13 、R14 以及R15 所表示的碳數1～20的烴基或碳數2～20的雜環含有基的氫原子，可被下述通式（II）表示的基、腈基、鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯基醚基、巰基、異氰酸酯基或雜環含有基取代，R13 、R14 以及R15 所表示的碳數1～20的烴基或碳數2～20的雜環含有基中的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR16 -、-NR16 CO-、-S-、-SO2 -、-SCO-或-COS-取代， R16 表示氫原子、碳數1～20的烴基， R11 以及R12 個別獨立表示氫原子、鹵素原子、硝基、氰基、碳數1～20的烴基或碳數2～20的雜環含有基， R11 以及R12 所表示的碳數1～20的烴基或碳數2～20的雜環含有基的氫原子，可被鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯基醚基、巰基、異氰酸酯基或雜環含有基取代，R11 以及R12 所表示的碳數1～20的烴基或碳數2～20的雜環含有基中的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR17 -、-NR17 CO-、-S-、-SO2 -、-SCO-或-COS-、-OCS-取代， R17 表示氫原子、碳數1～20的烴基， R1 ～R10 中的至少一個為下述通式（II）表示的基， R2 與R3 、R3 與R4 、R4 與R5 、R6 與R7 、R7 與R8 、R8 與R9 、R9 與R10 可結合形成環， m表示0或1。 [化29]
Figure 02_image057
（式中，R21 以及R22 個別獨立表示氫原子、鹵素原子、硝基、氰基、碳數1～20的烴基或碳數2～20的雜環含有基， R21 以及R22 所表示的碳數1～20的烴基或碳數2～20的雜環含有基的氫原子，可被鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯基醚基、巰基、異氰酸酯基或雜環含有基取代，R21 以及R22 所表示的碳數1～20的烴基或碳數2～20的雜環含有基中的亞甲基，可被-O-、-CO-、-COO-、-OCO-、-NR23 -、-NR23 CO-、-S-、-CS-、-SO2 -、-SCO-或-COS-取代， R23 表示氫原子、碳數1～20的烴基， n表示0或1。））The compound of the following formula etc. are mentioned. [化28]
Figure 02_image055
(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 (hereinafter also referred to as R 1 to R 10 ) individually and independently represent the following general The group represented by formula (II), hydrogen atom, halogen atom, nitro group, nitrile group, cyano group, hydroxyl group, carboxyl group, aldehyde group, sulfo group, R 13 , OR 13 , SR 13 , NR 14 R 15 , COR 13 , SOR 13 , SO 2 R 13 or CONR 14 R 15 , R 13 , R 14 and R 15 each independently represent a hydrocarbon group with 1 to 20 carbons or a heterocyclic group containing 2 to 20 carbons, R 13 , R 14 and R The hydrogen atom of the hydrocarbon group with 1 to 20 carbons or the heterocyclic ring with 2 to 20 carbons represented by 15 can be represented by the following general formula (II), nitrile group, halogen atom, nitro group, cyano group , Hydroxyl, amine, carboxyl, methacrylic, acryl, epoxy, vinyl, vinyl ether, mercapto, isocyanate or heterocyclic containing group substitution, R 13 , R 14 and R 15 The methylene group in the hydrocarbon group with 1-20 carbons or the heterocyclic ring-containing group with 2-20 carbons can be represented by -O-, -CO-, -COO-, -OCO-, -NR 16 -,- NR 16 is substituted with CO-, -S-, -SO 2 -, -SCO- or -COS-, R 16 represents a hydrogen atom, a hydrocarbon group with 1 to 20 carbon atoms, and R 11 and R 12 each independently represent a hydrogen atom and a halogen atom , a nitro group, a cyano group, a hydrocarbon group having a carbon number of 1 to 20 carbon atoms or a heterocyclic group containing 2 to 20, R 11, and heterocycle represented by R 12 carbon atoms or a hydrocarbon group having 1 to 20 carbon atoms is 2 to 20 Hydrogen atoms containing groups can be replaced by halogen atoms, nitro groups, cyano groups, hydroxyl groups, amino groups, carboxyl groups, methacrylic groups, acrylic groups, epoxy groups, vinyl groups, vinyl ether groups, mercapto groups, and isocyanate groups. Or a heterocyclic ring-containing group is substituted, and the methylene group in the C 1-20 hydrocarbon group or the C 2-20 heterocyclic group represented by R 11 and R 12 may be -O-, -CO-,- COO-, -OCO-, -NR 17 -, -NR 17 CO-, -S-, -SO 2 -, -SCO- or -COS-, -OCS- substituted, R 17 represents a hydrogen atom, carbon number 1～ The hydrocarbon group of 20, at least one of R 1 to R 10 is a group represented by the following general formula (II), R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 can be combined to form a ring, and m represents 0 or 1. [化29]
Figure 02_image057
(In the formula, R 21 and R 22 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbons or a heterocyclic group containing 2 to 20 carbons, and R 21 and R 22 represent The hydrogen atom of the hydrocarbon group with 1-20 carbons or the heterocyclic ring with 2-20 carbons can be substituted by halogen atoms, nitro groups, cyano groups, hydroxyl groups, amino groups, carboxyl groups, methacrylic acid groups, and acrylic acid groups , Epoxy group, vinyl group, vinyl ether group, mercapto group, isocyanate group or heterocyclic group containing group substitution, R 21 and R 22 represented by C 1-20 hydrocarbon group or C 2-20 heterocyclic group containing group The methylene group can be -O-, -CO-, -COO-, -OCO-, -NR 23 -, -NR 23 CO-, -S-, -CS-, -SO 2 -, -SCO -Or -COS-substituted, R 23 represents a hydrogen atom, a hydrocarbon group with 1 to 20 carbon atoms, and n represents 0 or 1.))

上述光聚合起始劑中，藉由將亦成為釋氣的原因的光聚合起始劑分裂予以防止而可以確實抑制釋氣的產生之觀點，較佳為分子量高的光聚合起始劑，具體而言較佳為分子量400以上的光聚合起始劑，特佳為分子量500以上的光聚合起始劑。光聚合起始劑的分子量的上限值並沒有特別的限制，例如是舉出10000以下。Among the above-mentioned photopolymerization initiators, a photopolymerization initiator with a high molecular weight is preferably a photopolymerization initiator having a high molecular weight by preventing the splitting of the photopolymerization initiator, which is also a cause of outgassing, and can surely suppress the generation of outgassing. In particular, a photopolymerization initiator having a molecular weight of 400 or more is preferable, and a photopolymerization initiator having a molecular weight of 500 or more is particularly preferable. The upper limit of the molecular weight of the photopolymerization initiator is not particularly limited, and for example, it is 10,000 or less.

光聚合起始劑的調配量並沒有特別的限制，可適當選擇，例如是在黏著劑100質量%中較佳為0.1～10質量%，特佳為1～5重量%。The compounding amount of the photopolymerization initiator is not particularly limited and can be appropriately selected. For example, it is preferably 0.1 to 10% by weight, and particularly preferably 1 to 5% by weight in 100% by weight of the adhesive.

黏著劑中視需要可添加塑化劑、顏料、染料、抗老化劑、抗靜電劑、用於彈性模數等的黏著劑層的物性改善所添加的填充劑等的各種添加劑作為任意成分。Various additives such as plasticizers, pigments, dyes, anti-aging agents, antistatic agents, and fillers used to improve the physical properties of the adhesive layer for elastic modulus can be added as optional components to the adhesive.

放射線硬化型黏著劑層的厚度並沒有特別限制，較佳為1～50μm，特佳為5～25μm。放射線硬化型黏著劑層的厚度未滿1μm，會有對被著體的追隨性受損而在迴焊步驟後的切割固著力降低的情形。另一方面，放射線硬化型黏著劑層的厚度超過50μm，會有黏著劑本身破壞而於被著體附著殘留的黏著劑而產生膠殘留的情形。The thickness of the radiation-curable adhesive layer is not particularly limited, but is preferably 1 to 50 μm, particularly preferably 5 to 25 μm. If the thickness of the radiation-curable adhesive layer is less than 1 μm, the followability to the adherend may be impaired and the cutting adhesion after the reflow step may decrease. On the other hand, if the thickness of the radiation-curable adhesive layer exceeds 50 μm, the adhesive itself may be destroyed and the remaining adhesive may adhere to the adherend, resulting in glue residue.

作為放射線的種類，因應放射線硬化型黏著劑層所含的黏著劑的種類而適當設定。作為放射線，例如是舉出紫外線、電子線等。對於本發明的迴焊對應切割膠帶，此些的放射線中特佳為紫外線。亦即是，作為放射線硬化型黏著劑層特佳為紫外線硬化型黏著劑層，作為黏著劑，特佳為紫外線硬化型黏著劑。The type of radiation is appropriately set according to the type of adhesive contained in the radiation-curable adhesive layer. Examples of radiation include ultraviolet rays, electron rays, and the like. For the dicing tape corresponding to reflow of the present invention, among these radiations, ultraviolet rays are particularly preferred. That is, as the radiation-curable adhesive layer, an ultraviolet-curable adhesive layer is particularly preferred, and as the adhesive, an ultraviolet-curable adhesive is particularly preferred.

紫外線的產生方式並沒有特別的限制，可適當採用以往公知的產生方式。作為具體的紫外線的產生方式，例如是放電燈方式（電弧燈）、閃光方式、雷射方式等。此些方式中，由產業上生產的觀點，以放電燈方式為佳；放電燈方式中，由紫外線的照射效率的觀點，特佳為使用高壓水銀燈、金屬鹵素燈等的照射方法。The generation method of ultraviolet rays is not particularly limited, and conventionally known generation methods can be appropriately adopted. As a specific method of generating ultraviolet rays, there are, for example, a discharge lamp method (arc lamp), a flash method, a laser method, and the like. Among these methods, from the viewpoint of industrial production, the discharge lamp method is preferred; in the discharge lamp method, from the viewpoint of the irradiation efficiency of ultraviolet rays, the irradiation method using a high-pressure mercury lamp, a metal halide lamp, etc. is particularly preferred.

關於紫外線的波長，紫外區域的波長並沒有特別的限制，由一般光硬化所使用的波長以及前述照射方法使用的紫外線產生源的波長的觀點，較佳為250nm～400nm的範圍內。Regarding the wavelength of the ultraviolet rays, the wavelength of the ultraviolet region is not particularly limited. From the viewpoint of the wavelength used for general photocuring and the wavelength of the ultraviolet generating source used in the aforementioned irradiation method, it is preferably in the range of 250 nm to 400 nm.

紫外線的照射量，只要是藉由紫外線照射而可以產生光聚合起始劑的效果之照射量，並沒有特別的限制。具體而言，例如是較佳為10～3000mJ/cm2 ，特佳為50～2000mJ/cm2 。紫外線的照射量未滿10mJ/cm2 的情形，會有黏著劑未充分硬化的情形。而且，紫外線的照射量超過3000mJ/cm2 的情形，黏著劑的光硬化過度進行，會有放射線硬化型黏著劑層破裂之虞。The irradiation amount of ultraviolet rays is not particularly limited as long as the irradiation amount can produce the effect of the photopolymerization initiator by ultraviolet irradiation. Specifically, for example, it is preferably 10 to 3000 mJ/cm 2 , and particularly preferably 50 to 2000 mJ/cm 2 . When the amount of ultraviolet radiation is less than 10mJ/cm 2 , the adhesive may not be cured sufficiently. In addition, when the irradiation amount of ultraviolet rays exceeds 3000 mJ/cm 2 , the photocuring of the adhesive proceeds excessively, and the radiation-curable adhesive layer may crack.

作為本發明的迴焊對應切割膠帶的被著體，例如是可舉出矽晶圓。 實施例As the object to be adhered to the dicing tape for reflow of the present invention, for example, a silicon wafer can be cited. Example

以下說明本發明的實施例，但是實施例所記載的材料或調配量等，只要不是特定的限定記載，此發明的範圍並不僅限定於此些實施例，其僅為單純的說明例。Hereinafter, examples of the present invention will be described. However, the scope of the present invention is not limited to these examples as long as the materials, blending amounts, and the like described in the examples are not specifically limited. They are merely illustrative examples.

實施例1 作為光聚合起始劑，使用α-羥基苯乙酮（Irugacure 184，BASF社製）。將α-羥基苯乙酮，與相對於（甲基）丙烯酸丁酯單體100質量份調配（甲基）丙烯酸單體5質量份而合成的丙烯酸系共聚物（Mw=70萬），以α-羥基苯乙酮：丙烯酸共聚物的質量比5：100混合，製備放射線硬化型的黏著劑。將此黏著劑塗佈於50μm的PEEK膜，使黏著劑中的溶媒於120℃揮發而製作成為放射線硬化型黏著劑層（厚度20μm）的迴焊對應切割膠帶。Example 1 As the photopolymerization initiator, α-hydroxyacetophenone (Irugacure 184, manufactured by BASF) was used. Acrylic copolymer (Mw=700,000) synthesized by blending α-hydroxyacetophenone with 5 parts by mass of (meth)acrylic monomer with respect to 100 parts by mass of butyl (meth)acrylate monomer, with α -Hydroxyacetophenone: acrylic copolymer is mixed at a mass ratio of 5:100 to prepare a radiation-curing adhesive. This adhesive was applied to a 50μm PEEK film, and the solvent in the adhesive was volatilized at 120°C to produce a radiation-curable adhesive layer (thickness 20μm) corresponding to dicing tape for reflow.

實施例2 作為光聚合起始劑使用肟酯化合物。作為肟酯化合物，使用下述化合物（分子量355）。 [化30]

Figure 02_image059
Example 2 An oxime ester compound was used as a photopolymerization initiator. As the oxime ester compound, the following compound (molecular weight 355) was used. [化30]
Figure 02_image059

實施例2所使用的肟酯化合物如下述製備。 於二氯乙烷92g與氯化鋁21.7g（163mmol）的溶液於6℃加入下述醇20.73g（6.5mmol），其次於6℃以下滴加丙醯氯9.0g（97mmol）。攪拌1小時後將反應液注入冰水中，添加乙酸乙酯以進行油水分離，以水清洗有機層。以無水硫酸鎂乾燥有機層後，脫溶媒並得到醯化體a17.5g。 [化31]

Figure 02_image061
The oxime ester compound used in Example 2 was prepared as follows. To a solution of 92 g of dichloroethane and 21.7 g (163 mmol) of aluminum chloride was added 20.73 g (6.5 mmol) of the following alcohol at 6°C, followed by dropwise addition of 9.0 g (97 mmol) of propyl chloride below 6°C. After stirring for 1 hour, the reaction solution was poured into ice water, ethyl acetate was added for oil-water separation, and the organic layer was washed with water. After drying the organic layer with anhydrous magnesium sulfate, the solvent was removed to obtain 17.5 g of anhydride a. [化31]
Figure 02_image061

肟化 於所得的醯化體a的13.0g（35mmol）、濃鹽酸3.6g（35mmol）與二甲基甲醯胺30g的溶液中，添加亞硝酸異丁酯5.4g（52mmol），於室溫攪拌3.5小時。攪拌後，於反應液添加乙酸乙酯與水進行油水分離，以水清洗有機層。於固體的析出的有機層添加己烷，進行過濾。將所得的固體減壓乾燥，得到肟體a7.8g。 [化32]

Figure 02_image063
The oximation was carried out in a solution of 13.0 g (35 mmol), 3.6 g (35 mmol) of concentrated hydrochloric acid, and 30 g of dimethylformamide, and 5.4 g (52 mmol) of isobutyl nitrite was added at room temperature. Stir for 3.5 hours. After stirring, ethyl acetate and water were added to the reaction solution to separate oil and water, and the organic layer was washed with water. Hexane was added to the solid precipitated organic layer, and it filtered. The obtained solid was dried under reduced pressure to obtain 7.8 g of oxime body a. [化32]
Figure 02_image063

肟酯化 使所得的肟體a的5.0g（13mmol）、吡啶2.1g（27mmol）與二甲基甲醯胺12g的溶液為-10℃以下的狀態，滴加醋酸酐1.6g（15mmol），且滴加後於5℃攪拌2小時。攪拌後，於反應液添加乙酸乙酯與水進行油水分離，以水清洗有機層。以無水硫酸鎂乾燥有機層後，脫溶媒並得到上述的肟酯化合物3.5g。Oxime esterification A solution of 5.0 g (13 mmol) of oxime a, 2.1 g (27 mmol) of pyridine, and 12 g of dimethylformamide was brought to a state of -10°C or less, 1.6 g (15 mmol) of acetic anhydride was added dropwise, Then it was stirred at 5°C for 2 hours. After stirring, ethyl acetate and water were added to the reaction solution to separate oil and water, and the organic layer was washed with water. After drying the organic layer with anhydrous magnesium sulfate, the solvent was removed to obtain 3.5 g of the above-mentioned oxime ester compound.

將上述所得的肟酯化合物，與相對於（甲基）丙烯酸丁酯單體100質量份調配（甲基）丙烯酸單體5質量份而合成的丙烯酸系共聚物（Mw=70萬），以肟酯化合物：丙烯酸共聚物的質量比5：100混合，製備放射線硬化型的黏著劑。將此黏著劑塗佈於50μm的PEEK膜，使黏著劑中的溶媒於120℃揮發而製作成為放射線硬化型黏著劑層（厚度20μm）的迴焊對應切割膠帶。The oxime ester compound obtained above and the acrylic copolymer (Mw=700,000) synthesized by blending 5 parts by mass of (meth)acrylic monomer with respect to 100 parts by mass of butyl (meth)acrylate monomer, and oxime Ester compound: acrylic copolymer is mixed at a mass ratio of 5:100 to prepare a radiation-curable adhesive. This adhesive was applied to a 50μm PEEK film, and the solvent in the adhesive was volatilized at 120°C to produce a radiation-curable adhesive layer (thickness 20μm) corresponding to dicing tape for reflow.

實施例3 除了將作為光聚合起始劑而調配的實施例2的肟酯化合物變更為下述的肟酯化合物（分子量445，Irugacure OXE01，BASF公司製）以外，與實施例2相同的製作迴焊對應切割膠帶。 [化33]

Figure 02_image065
Example 3 Except that the oxime ester compound of Example 2 formulated as a photopolymerization initiator was changed to the following oxime ester compound (molecular weight 445, Irugacure OXE01, manufactured by BASF Corporation), the same preparation as Example 2 was performed. Welding corresponds to cutting tape. [化33]
Figure 02_image065

實施例4 除了將作為光聚合起始劑而調配的實施例2的肟酯化合物變更為下述的肟酯化合物（分子量515）以外，與實施例2相同的製作迴焊對應切割膠帶。尚且，實施例4的肟酯化合物如下製備。於氮氣體環境下，置入氯化鋁10.4g（78mmol）以及二氯乙烷33.0g，於冰冷下徐徐滴加醯氯36mmol，接著徐徐滴加硝基咔唑化合物30mmol以及二氯乙烷33.0g，於5℃攪拌30分鐘。將反應液浸入至冰水，進行油水分離。脫溶媒並得到醯化體。於氮氣流下，置入所得的醯化體20mmol、鹽酸羥基胺2.1g（30mmol）以及二甲基甲醯胺16.9g，於80℃攪拌1小時。冷卻至室溫進行油水分離。餾去溶媒並於殘留物中添加乙酸丁酯25.4g，接續添加乙酸酐2.45g（24mmol）於90℃攪拌1小時，冷卻至室溫。經由以5%氫氧化鈉水溶液中和、油水分離、脫溶媒、從乙酸乙酯的再結晶，得到目的物的下述肟酯化合物。 [化34]

Figure 02_image067
Example 4 Except that the oxime ester compound of Example 2 formulated as a photopolymerization initiator was changed to the following oxime ester compound (molecular weight 515), a dicing tape for reflow was produced in the same manner as in Example 2. Furthermore, the oxime ester compound of Example 4 was prepared as follows. In a nitrogen atmosphere, place 10.4g (78mmol) of aluminum chloride and 33.0g of dichloroethane, slowly add 36mmol of chlorinated chloride under ice cooling, and then slowly add 30mmol of nitrocarbazole compound and 33.0g of dichloroethane. g, stir at 5°C for 30 minutes. The reaction solution was immersed in ice water for oil-water separation. Remove the solvent and obtain the acylated body. Under a nitrogen stream, 20 mmol of the obtained acetonitrile, 2.1 g (30 mmol) of hydroxylamine hydrochloride, and 16.9 g of dimethylformamide were placed, and the mixture was stirred at 80°C for 1 hour. Cool to room temperature for oil-water separation. The solvent was distilled off, and 25.4 g of butyl acetate was added to the residue, followed by 2.45 g (24 mmol) of acetic anhydride, stirred at 90°C for 1 hour, and cooled to room temperature. After neutralization with a 5% sodium hydroxide aqueous solution, oil-water separation, solvent removal, and recrystallization from ethyl acetate, the target oxime ester compound described below was obtained. [化34]
Figure 02_image067

比較例1 除了使作為光聚合起始劑而調配的實施例1的α-羥基苯乙酮的調配量成為α-羥基苯乙酮：丙烯酸共聚物的質量比10：100以外，與實施例1相同的製作切割膠帶。Comparative example 1 The preparation was the same as that of Example 1, except that the blending amount of the α-hydroxyacetophenone of Example 1 formulated as a photopolymerization initiator was 10:100 by mass ratio of α-hydroxyacetophenone: acrylic acid copolymer Cutting tape.

（1）以X線光電子能譜法（XPS）測定的碳量 將製作的迴焊對應切割膠帶貼合於矽晶圓並以1000J/cm2 照射紫外線（波長365nm）後，於210℃進行10分鐘熱處理。其次，將迴焊對應切割膠帶由矽晶圓剝離後，針對矽晶圓的貼合迴焊對應切割膠帶的面，以X線光電子能譜法（XPS）測定附著成分總量中的碳量，並如下述評價。尚且，XPS的裝置使用PHI Quantes（ULVAC-PHI公司製），激發X線為單色化Al-Kα線，脫出角度為45°，以寬能譜掃描(wide scan)方式於1350～0eV的範圍進行測定。分析區域為100μm直徑。 ○：碳量30mol%以下 ×：碳量超過30mol%(1) Measure the amount of carbon by X-ray photoelectron spectroscopy (XPS), attach the reflow-compatible dicing tape to the silicon wafer and irradiate it with ultraviolet rays (wavelength 365nm) at 1000J/cm 2 , then perform 10 Minute heat treatment. Secondly, after peeling the dicing tape corresponding to reflow from the silicon wafer, the surface of the dicing tape corresponding to the bonding reflow of the silicon wafer is measured by X-ray photoelectron spectroscopy (XPS) to measure the amount of carbon in the total amount of attached components. And evaluate as follows. Moreover, the XPS device uses PHI Quantes (manufactured by ULVAC-PHI), the excitation X-ray is a monochromatic Al-Kα line, the exit angle is 45°, and the wide scan mode is used at 1350～0eV. The range is determined. The analysis area is 100 μm in diameter. ○: The carbon content is less than 30 mol% ×: The carbon content exceeds 30 mol%

（2）釋氣降低性 上述於210℃進行10分鐘熱處理之際的釋氣的產生的有無，以目視或光學顯微鏡觀察上述熱處理後的放射線硬化型黏著劑層產生的氣泡，並進行評價。 ○：幾乎無氣泡的產生 △：具有若干氣泡 ×：具有顯著的氣泡(2) Outgassing reduction The presence or absence of outgassing during the heat treatment at 210° C. for 10 minutes was observed and evaluated by visual observation or an optical microscope for bubbles generated in the radiation-curable adhesive layer after the heat treatment. ○: Almost no bubbles are generated △: There are some bubbles ×: There are significant bubbles

（3）晶片飛散防止性 上述於210℃進行10分鐘熱處理後，測定將矽晶圓單片化的切割步驟時的從切割膠帶剝離的晶片個數，並如下述評價。 ◎：沒有從切割膠帶剝離的晶片 ○：具有從切割膠帶剝離的晶片，其比例為1%以下 △：從切割膠帶剝離的晶片的比例為超過1%、5%以下 ×：從切割膠帶剝離的晶片的比例超過5%(3) Wafer scattering prevention After the above heat treatment at 210°C for 10 minutes, the number of wafers peeled from the dicing tape in the dicing step of singulating the silicon wafer was measured and evaluated as follows. ◎: No wafer peeled from the dicing tape ○: There are wafers peeled from the dicing tape, and the ratio is 1% or less △: The ratio of wafers peeled from the dicing tape is more than 1% and less than 5% ×: The ratio of wafers peeled from the dicing tape exceeds 5%

評價結果表示於表1。The evaluation results are shown in Table 1.

[表1]   實施例1 實施例2 實施例3 實施例4 比較例1 以X線光電子能譜法測定的碳量 ○ ○ ○ ○ × 釋氣降低性 △ ○ ○ ○ × 晶片飛散防止性 △ △ ○ ◎ × 根據表1，藉由X線光電子能譜法測定之際的碳量為30mol%以下的實施例1～4，能夠得到釋氣降低性，且從切割膠帶剝離的晶片的比例降低至5%以下。特別是，根據實施例1與實施例2～4的比較，如使用肟酯化合物作為光聚合起始劑，能夠進而降低釋氣。而且，根據實施例2與實施例3、4的比較，分子量如為400以上，亦即如光聚合起始劑的肟酯化合物的分子量大，能夠進而降低從切割膠帶剝離的晶片的比例。[Table 1] Example 1 Example 2 Example 3 Example 4 Comparative example 1 Carbon content measured by X-ray photoelectron spectroscopy ○ ○ ○ ○ × Outgassing △ ○ ○ ○ × Chip scattering prevention △ △ ○ ◎ × According to Table 1, in Examples 1 to 4 in which the carbon content at the time of measurement by X-ray photoelectron spectroscopy was 30 mol% or less, the outgassing reduction property was obtained, and the ratio of wafers peeled from the dicing tape was reduced to 5% or less . In particular, according to the comparison between Example 1 and Examples 2 to 4, if an oxime ester compound is used as a photopolymerization initiator, outgassing can be further reduced. Furthermore, according to the comparison between Example 2 and Examples 3 and 4, if the molecular weight is 400 or more, that is, the molecular weight of the oxime ester compound as the photopolymerization initiator is large, the ratio of wafers peeled from the dicing tape can be further reduced.

另一方面，藉由X線光電子能譜法測定之際的碳量超過30mol%的比較例1，無法得到釋氣降低性，從切割膠帶剝離的晶片的比例超過5%。On the other hand, in Comparative Example 1 where the amount of carbon at the time of measurement by X-ray photoelectron spectroscopy exceeded 30 mol%, the outgassing reduction property could not be obtained, and the ratio of wafers peeled from the dicing tape exceeded 5%.

無。no.

無。no.

Claims (7)

一種迴焊對應切割膠帶，具備基材層以及設置於該基材層上的放射線硬化型黏著劑層，將矽晶圓貼合於前述放射線硬化型黏著劑層之後，照射放射線後於210℃進行10分鐘的加熱處理，於該加熱處理後將前述矽晶圓從前述放射線硬化型黏著劑層剝離後之際的前述矽晶圓的貼合面以X線光電子能譜法測定之際的碳量為30mol%以下。A dicing tape corresponding to reflow, including a substrate layer and a radiation-curing adhesive layer provided on the substrate layer. After bonding a silicon wafer to the radiation-curing adhesive layer, it is irradiated at 210°C. 10 minutes of heat treatment. After the heat treatment, the silicon wafer is peeled off from the radiation-curable adhesive layer. The bonding surface of the silicon wafer is measured by X-ray photoelectron spectroscopy. It is 30 mol% or less. 如請求項1所記載的迴焊對應切割膠帶，其中前述放射線硬化型黏著劑層包含具有乙烯性不飽和鍵的聚合性化合物、具有與該具有乙烯性不飽和鍵的聚合性化合物的聚合物以及/或是陽離子以及/或是陰離子反應的環狀結構的化合物、與光聚合起始劑。The dicing tape for reflow as described in claim 1, wherein the radiation-curable adhesive layer contains a polymerizable compound having an ethylenically unsaturated bond, a polymer having a polymerizable compound having an ethylenically unsaturated bond, and / Or a compound of a cyclic structure that reacts with a cation and/or an anion, and a photopolymerization initiator. 如請求項2所記載的迴焊對應切割膠帶，其中前述具有乙烯性不飽和鍵的聚合性化合物的聚合物包含（甲基）丙烯酸系聚合物，前述（甲基）丙烯酸系聚合物為包含（甲基）丙烯酸以及/或是（甲基）丙烯酸酯的單體的聚合物。The dicing tape for reflow as described in claim 2, wherein the polymer of the polymerizable compound having an ethylenically unsaturated bond contains a (meth)acrylic polymer, and the (meth)acrylic polymer contains ( A polymer of meth)acrylic acid and/or (meth)acrylate monomers. 如請求項2或3所記載的迴焊對應切割膠帶，其中前述光聚合起始劑為肟脂化合物。The dicing tape corresponding to reflow as described in claim 2 or 3, wherein the photopolymerization initiator is an oxime compound. 如請求項2至4的任意一項所記載的迴焊對應切割膠帶，其中前述光聚合起始劑的分子量為400以上。The dicing tape corresponding to reflow as described in any one of claims 2 to 4, wherein the molecular weight of the photopolymerization initiator is 400 or more. 如請求項1至5的任意一項所記載的迴焊對應切割膠帶，其中前述放射線硬化型黏著劑層為紫外線硬化型黏著劑層。The dicing tape corresponding to reflow as described in any one of claims 1 to 5, wherein the radiation-curable adhesive layer is an ultraviolet-curable adhesive layer. 如請求項1至6的任意一項所記載的迴焊對應切割膠帶，其中前述放射線硬化型黏著劑層的，以1000mJ/cm2 照射波長350nm的放射線後於210℃進行10分鐘的加熱處理後的，根據JIS Z0237測定的黏著力為0.3N/25mm寬以上、2.0N/25mm寬以下。The dicing tape for reflow as described in any one of claims 1 to 6, wherein the radiation-curable adhesive layer is irradiated with radiation with a wavelength of 350 nm at 1000 mJ/cm 2 and heated at 210°C for 10 minutes , The adhesive force measured according to JIS Z0237 is 0.3N/25mm wide or more and 2.0N/25mm wide or less.
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