TW202028379A - Resin composition for electrode formation, chip type electronic component and manufacturing method thereof - Google Patents

Abstract

The present invention provides a low-temperature sintered resin composition for electrode formation excellent in bonding properties, resistance to humidity and heat resistance, and the like. The resincomposition for electrode formation is based on (A) thermosetting resin, (B) radical initiator, (C) silver fine particles with a thickness or short diameter of 1 to 200 nm, and (D) average excluding(C) component Silver powder with a particle size of 2 to 20 [mu]m is an essential component. (A) Thermosetting resins include (A1) hydroxyl-containing (meth) acrylate compounds or hydroxyl-containing(meth) acrylamide compounds, (A2) normal temperature The following is at least one selected from liquid bismaleimide resin and (A3) polybutadiene, and its thixotropic index (the ratio of the viscosityof 2 rpm to the viscosity of 20 rpm at 25 DEG C) is 1 .1-2.0.

Description

Resin composition for electrode formation, chip-type electronic part and manufacturing method thereof

The present invention relates to a resin composition for forming an electrode, a wafer-type electronic component using the resin composition for forming an electrode to form an electrode, and a manufacturing method thereof. The present invention particularly relates to a resin composition for forming an electrode for forming an external electrode of a chip-type electronic component for surface mounting, a chip-type electronic component using the resin composition, and a manufacturing method thereof.

Chip-type electronic components such as chip inductors, chip resistors, chip-type multilayer ceramic capacitors, and chip thermistors mainly include: a chip-shaped body including a ceramic sintered body, an internal electrode arranged in the internal electrode, and a connection with the internal electrode The external electrodes provided on both ends of the wafer-shaped blank are mounted by welding the external electrodes to the substrate.

Generally, the external electrode is formed by coating a resin slurry on the surface of a wafer molded with a sealing resin, hardening it to form a base electrode, and then performing a plating process.

The part where the electrode is formed at the first end is coated with a resin slurry by a dipping method and pre-dried to form an external electrode. Next, a resin slurry is applied to the part where the second electrode is formed by a dipping method and pre-dried to form an external electrode. The low-temperature active silver particles are sintered by pre-drying, thereby forming the outer shape of the external electrode. After that, heating is further performed to harden the thermosetting resin component to form an external electrode that becomes the base of the plating process.

In this chip-type electronic component, the external electrode is used to connect the chip-type electronic component with the circuit on the substrate, so its goodness has a greater impact on the electrical characteristics, reliability, and mechanical characteristics of the product.

Recently, the electronicization of various products continues to develop, and many chip-type electronic components are also mounted in automotive products. For these electronic components, higher environmental resistance and high reliability are required than before. Specifically, electronic parts with a small and stable resistance value change rate in an environmental resistance test are required.

Therefore, the resin paste used for electrode formation is also required to have excellent adhesion and resistance stability after humidity treatment.

For example, Patent Document 1 discloses a method of sintering the metal powder in a resin paste formed by kneading a metal powder such as Ag with an inorganic bonding material such as glass frit and an organic vehicle to form a base electrode. Patent Document 2 discloses a method of forming a base electrode using a resin slurry in which a thermosetting resin such as epoxy resin and metal particles such as Ag are dispersed.

However, in the method of Patent Document 1, since a heat treatment at a high temperature of 600° C. or higher is required, the resin in the sealing material or the self-melting film of the wire may be deteriorated. In the method of Patent Document 2, if the moisture resistance test is performed, the bonding strength between the green body and the external electrode may deteriorate and the external electrode may peel off.

Therefore, there is disclosed a method of using a resin slurry containing metal fine particles with a sintering temperature of 250°C or less and firing at a low temperature of 250°C or less (Patent Document 3). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 10-284343 [Patent Document 2] Japanese Patent Laid-Open No. 2005-116708 [Patent Document 3] Japanese Patent Laid-Open No. 2014-225590

[The problem to be solved by the invention]

However, if only the resin paste containing metal particles is used, not only the volume resistance value is high, but also there are defects in the coating appearance such as corners or pinholes, or it is suitable for moisture absorption resistance test, high temperature resistance test, etc. In the environmental test, it may not be possible to obtain sufficient reliability for the high level (for example, the change rate of the resistance value is within 10%, etc.).

Therefore, the present invention provides a low-temperature sintering type electrode-forming resin composition having excellent adhesion, moisture resistance, resistance stability after heat treatment, etc., and excellent coating appearance. The resin composition for electrode formation can also be applied to automotive-grade environmental resistance (super moisture resistance, super heat resistance). [Technical means to solve the problem]

The present invention has discovered that the resin used as the thermosetting resin in the resin composition for electrode formation is combined with a specific resin to satisfy the environmental resistance performance of the vehicle level, thereby completing the present invention.

That is, one aspect of the resin composition for forming an electrode of the present invention is characterized in that it contains (A) a thermosetting resin, (B) a radical initiator, and (C) a thickness or short diameter of 1 to 200 nm silver particles and (D) silver powder with an average particle size of 2-20 μm other than the above-mentioned (C) component, and its thixotropic ratio (the ratio of the viscosity at 25°C at 2 rpm to the viscosity at 20 rpm) It is 1.1 to 2.0.

In addition, in one aspect of the present invention, the (A) thermosetting resin may be (A1) a (meth)acrylate compound or (meth)acrylamide compound having a hydroxyl group, and (A2) a liquid at room temperature. Shaped bismaleimide resin, (A3) polybutadiene. Furthermore, a branched diol having 5 to 10 carbon atoms may be included as the (E) solvent.

Furthermore, in one aspect of the present invention, for the cured product, the 1% weight reduction temperature may be 280°C or higher and 400°C or lower, the lower limit may be 320°C or higher, the lower limit may be 340°C or higher, and the lower limit may be 350°C or higher . If the 1% weight loss temperature is in this range, a resin composition for electrode formation with a small and stable change rate of the resistance value in the moisture absorption resistance test and the high temperature standing test is obtained. The 1% weight reduction temperature can be controlled, for example, by adjusting the types and blending ratios of components contained in the resin composition for forming electrodes. In this embodiment, for example, after curing 10 mg of the resin composition for electrode formation at 200°C for 1 hour, TG/DTA (thermogravity) is performed in a nitrogen or air atmosphere at a temperature increase rate of 10°C/min. /Differential thermal analysis) measurement, whereby the 1% weight loss temperature of the resin composition for electrode formation can be measured.

One aspect of the chip-type electronic component of the present invention is a chip-type electronic component having a cuboid-shaped chip-type electronic component body including a ceramic sintered body. Furthermore, at least one of the internal electrode formed inside the chip-type electronic component body and the external electrode formed on the end surface of the chip-type electronic component body is a sintered body of the resin composition for forming the electrode.

One aspect of the method for manufacturing a wafer-type electronic component of the present invention is to form a specific electrode pattern layer by printing using the resin composition for electrode formation on the surface of a ceramic layer. The next step of the method for manufacturing a wafer-type electronic component of the present invention is to place another ceramic layer on the electrode pattern layer, and use the resin composition for electrode formation on the surface of the other ceramic layer to form a specific For the electrode pattern layer, this operation is repeated to make the ceramic layer and the electrode pattern layer alternately stacked. The final step of the manufacturing method of the chip-type electronic component of the present invention is to sinter the laminated body, thereby forming a chip-type electronic component body having internal electrodes formed by the above-mentioned electrode pattern, and use the chip-type electronic component The end surface of the blank forms an external electrode.

One aspect of the method for manufacturing a wafer-type electronic component of the present invention is to apply the resin composition for electrode formation to the end surface of a wafer-type electronic component body by printing or dipping, and sinter the coated electrode to form The resin composition is used to thereby form the external electrode. [Effects of Invention]

The resin composition for forming an electrode of the present invention has a small resistance value change rate in the moisture absorption resistance test and the high temperature standing test. Furthermore, since silver particles are prepared, it can be sintered at a low temperature, and the obtained sintered body is suitable for forming electrodes of electronic parts.

In addition, according to the chip-type electronic component and the manufacturing method thereof of the present invention, since the electrode is formed using the resin composition for forming an electrode, it is possible to obtain an electrode with a strong fixation strength to the green body under a high humidity and high heat environment. Chip-type electronic parts have become highly reliable products.

One aspect of the resin composition for forming an electrode of the present invention includes the above-mentioned constitution. Hereinafter, the resin composition for forming an electrode according to an embodiment of the present invention will be described.

The (A) thermosetting resin used in this embodiment is not particularly limited, and a plurality of specific thermosetting resins can be used in combination. As the resin used in the (A) thermosetting resin, (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound, (A2) a liquid and a main chain at room temperature Bismaleimide resin with aliphatic hydrocarbon group and (A3) polybutadiene resin.

The (A1) (meth)acrylic acid ester compound or (meth)acrylamide compound having a hydroxyl group used in this embodiment is (meth)acrylic acid having one or more (meth)acrylic groups in one molecule. Ester or (meth)acrylamide, and contains a hydroxyl group.

Here, the (meth)acrylate having a hydroxyl group can be obtained by reacting a polyol compound with (meth)acrylic acid or a derivative thereof. A known chemical reaction can be used for this reaction. The (meth)acrylate having a hydroxyl group is usually 0.5 to 5 times moles of acrylate or acrylic with respect to the polyol compound.

In addition, (meth)acrylamide having a hydroxyl group can be obtained by reacting an amine compound having a hydroxyl group with (meth)acrylic acid or a derivative thereof. The method for producing (meth)acrylamides by reacting (meth)acrylate and amine compound is generally because the double bond of (meth)acrylate is extremely reactive, so amine and cyclopentyl are added to the double bond in advance. Diene, alcohol, etc. are used as protecting groups, and heating is performed after the completion of amination to remove the protecting groups.

In addition, by allowing the (meth)acrylate compound or (meth)acrylamide compound to contain a hydroxyl group, when an electrode is formed, sinterability is promoted by a reduction effect, and adhesiveness is improved.

In addition, the hydroxyl group referred to herein is an alcoholic group in which the hydrogen atom of the aliphatic hydrocarbon group is substituted. The content of the hydroxyl group can be 1 to 50 per molecule. If the content of the hydroxyl group is within this range, there is no hindrance to the sinterability caused by excessive hardening, and the sinterability can be promoted.

As such a (meth)acrylate compound or (meth)acrylamide compound which has a hydroxyl group (A1), the compound represented by the following general formula (1)-(4) is mentioned, for example.

(式中，R¹ 表示氫原子或甲基，R² 表示碳數1～100之2價之脂肪族烴基或具有環狀結構之脂肪族烴基)[化1]

(In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a divalent aliphatic hydrocarbon group having 1 to 100 carbon atoms or an aliphatic hydrocarbon group having a cyclic structure)

(式中，R¹ 及R² 分別表示與上述相同者)[化2]

(In the formula, R ¹ and R ² respectively represent the same as above)

(式中，R¹ 表示與上述相同者，n表示1～50之整數)[化3]

(In the formula, R ¹ represents the same as above, and n represents an integer of 1-50)

(式中，R¹ 及n分別表示與上述相同者)[化4]

(In the formula, R ¹ and n respectively represent the same as above)

As this (A1) (meth)acrylate compound or (meth)acrylamide compound, the compound represented by the said general formula (1)-(4) can be used individually or in combination of 2 or more types. Furthermore, the carbon number of R ^{2 in} the general formulae (1) and (2) may be 1-100, or 1-36. If the carbon number of R ² is in this range, the sinterability will not be hindered by excessive hardening.

(A2) The bismaleimide resin used in this embodiment is liquid at room temperature and has an aliphatic hydrocarbon group in the main chain. The main chain has an aliphatic hydrocarbon group with 1 or more carbons, and the main chain is connected It is composed of two maleimide groups. Here, the aliphatic hydrocarbon group may be in any form of linear, branched, and cyclic, and the carbon number may be 6 or more, the carbon number may be 12 or more, and the carbon number may be 24 or more. In addition, the aliphatic hydrocarbon group can be directly or indirectly bonded to the maleimide group, and may be directly bonded to the maleimide group.

(式中，Q表示碳數6以上之2價之直鏈狀、支鏈狀或環狀之脂肪族烴基，P為選自O、CO、COO、CH₂ 、C(CH₃ )₂ 、C(CF₃ )₂ 、S、S₂ 、SO及SO₂ 之2價之原子或有機基、或包含至少1個以上該等原子或有機基之有機基，m表示1～10之整數)。The (A2) maleimide resin may be a compound represented by the following general formula (5) [化5]

(In the formula, Q represents a bivalent linear, branched or cyclic aliphatic hydrocarbon group with 6 or more carbons, and P is selected from O, CO, COO, CH ₂ , C(CH ₃ ) ₂ , C (CF ₃ ) ₂ , S, S ₂ , SO and SO ₂ divalent atoms or organic groups, or organic groups containing at least one of these atoms or organic groups, and m represents an integer of 1-10).

Here, the divalent atom represented by P includes O, S, etc., and the divalent organic group includes CO, COO, CH ₂ , C(CH ₃ ) ₂ , C(CF ₃ ) ₂ , S ₂ , SO , SO ₂ etc., and organic groups containing at least one of these atoms or organic groups. As the organic group containing the above-mentioned atom or organic group, one having a hydrocarbon group with 1 to 3 carbons, a benzene ring, a cyclic ring, a urethane bond, etc., as a structure other than the above, is used as P in this case , The group represented by the following chemical formula can be exemplified.

[化6]

(式中，R³ ～R⁶ 表示碳數6以上之2價之直鏈狀、支鏈狀或環狀之脂肪族烴基) 再者，R³ ～R⁶ 較佳為碳數6～20，較佳為6～12。Furthermore, (A2) the maleimide resin may be a bismaleimide resin that is liquid at room temperature represented by the following general formula (6). [化7]

(In the formula, R ³ to R ⁶ represent a divalent linear, branched or cyclic aliphatic hydrocarbon group with 6 or more carbons.) Furthermore, R ³ to R ^{6 are} preferably 6 to 20 carbons. Preferably it is 6-12.

In this embodiment, a bismaleimide resin with an aliphatic hydrocarbon group in the main chain is used as the (A2) bismaleimide resin to obtain excellent heat resistance, low stress, and good adhesive strength after moisture absorption. One of the necessary conditions for the resin composition for electrode formation. In order to effectively obtain this characteristic, it is preferable to use as the component (A2) a bismaleimide resin that utilizes an aliphatic hydrocarbon group to extend the imine and is liquid at room temperature as represented by the general formula (5).

The number average molecular weight of the (A2) bismaleimide resin converted from polystyrene may be 500 or more and 10,000 or less, or 500 or more and 5,000 or less. If the number average molecular weight is in this range, the moisture absorption resistance is excellent, and the adhesive strength during heating can be improved. If the number average molecular weight is less than 500, flexibility is reduced, and heat resistance is also reduced. If the number average molecular weight exceeds 10,000, the workability during the preparation of the composition and the workability during use tend to decrease.

The (A3) polybutadiene used in this embodiment is a polymer obtained by polymerizing 1,3-butadiene, and also includes a modified compound. The (A3) polybutadiene may be (A31) epoxy-modified compound of polybutadiene, or (A32) polybutadiene polymer having a (meth)acryloyl group at the end.

(A31) The epoxy-modified compound of polybutadiene can be epoxidized polybutadiene with an epoxy equivalent of 50 to 500 (g/eq). If the epoxy equivalent is less than 50, the viscosity will increase and the workability of the resin composition will tend to decrease. If it exceeds 500, the adhesive strength will tend to decrease when heated. In addition, epoxy equivalent is calculated|required by perchloric acid method. As the epoxidized polybutadiene, one having a hydroxyl group in the molecule can be used. As the epoxidized polybutadiene, for example, Epolead PB4700 and GT401 (both trade names) commercially available by Daicel Co., Ltd., and JP-100 and JP-200 (both Product name).

(A32) The polybutadiene polymer having a (meth)acryloyl group at the end can be obtained by introducing a polybutadiene polymer with a hydroxyl group at the molecular end and isocyanate 2-(meth)acryloyloxyethylene Ester etc. are obtained by carrying out a urethane reaction. Alternatively, it can be obtained by reacting a polybutadiene polymer with a hydroxyl group introduced into the molecular terminal with a diisocyanate such as hexamethylene diisocyanate, and then reacting with (meth)acrylic acid.

As a polybutadiene polymer having a (meth)acryloyl group at the end, for example, BAC-15, BAC-45, SPBDA-S30 (all trade names) commercially available from Osaka Organic Chemical Industry, and Nippon Soda TE-2000, TEAI-1000, GI-3000 (all trade names) commercially available from Co., Ltd. By including this (A3) polybutadiene, the resin composition for electrode formation can improve the adhesion of the electrode to the chip component terminal.

The (A3) polybutadiene may have a number average molecular weight of 500 to 10,000. If the molecular weight is in this range, the adhesiveness is good and the viscosity can be controlled to an appropriate viscosity, so workability becomes good. The number average molecular weight is a value determined by gel permeation chromatography using a calibration curve of standard polystyrene (hereinafter referred to as GPC method).

In addition, the components (A1) to (A3) described above can be blended in specific amounts as described below to prepare (A) thermosetting resin. That is, (A) thermosetting resin used in this embodiment, when (A) thermosetting resin is 100% by mass, (A1) a (meth)acrylate compound having a hydroxyl group or (meth)acrylic acid The amide compound is 0 to 75% by mass, (A2) the bismaleimide resin that is liquid at room temperature and has an aliphatic hydrocarbon group in the main chain is 10 to 90% by mass, and (A3) the epoxidized polybutadiene is 10 to 90% by mass.

Furthermore, (A1) the (meth)acrylate compound or (meth)acrylamide compound which has a hydroxyl group may be 0-50 mass %. Furthermore, (A1) the (meth)acrylate compound or (meth)acrylamide compound which has a hydroxyl group may be 20 mass% or less, and may be 0 mass %. When (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound is 0% by mass, (A2) a bismaleic compound that is liquid at room temperature and has an aliphatic hydrocarbon group in the main chain The ratio [(A2)/(A3)] of the blending amount of the imine resin to the blending amount of (A3) epoxidized polybutadiene may be 1 or more. If the components of (A1)～(A3) are within this range, the heat resistance, moisture resistance and adhesion are good, and it can be used especially for moisture absorption resistance test, high temperature resistance test and other environmental resistance requirements with higher levels For vehicle use.

If the blending amount of the (A1) component is more than 75% by mass, the resin composition for electrode formation may have poor heat resistance and moisture resistance. If the blending amount of component (A2) is less than 10% by mass, the resin composition for electrode formation may have poor heat resistance and moisture resistance. If it is more than 90% by mass, the resin composition for electrode formation may be bonded Poor strength. In addition, if the blending amount of component (A3) is less than 10% by mass, the adhesive strength of the resin composition for electrode formation may be inferior. If it is more than 90% by mass, the resin composition for electrode formation may easily remain. There is a concern that the strength of the reaction component is poor.

In addition, as the (A) thermosetting resin, thermosetting resins other than the above-mentioned (A1) to (A3) components may also be used. Examples of thermosetting resins that can be used here include epoxy resins, Bismaleimide resin, polybutadiene resin, phenol resin, etc. However, when the (A) thermosetting resin is 100% by mass, the thermosetting resin other than the components (A1) to (A3) may be 20% by mass or less, or 10% by mass or less.

The (B) radical initiator used in this embodiment can be used without particular limitation as long as it is a polymerization catalyst generally used in radical polymerization.

As the (B) radical initiator, it can be the decomposition start temperature in the rapid heating test (place 1 g of the sample on the electric heating plate, and conduct the decomposition start temperature measurement test at 4°C/min.) Be 40～140℃. If the decomposition start temperature is less than 40°C, the storage property at room temperature of the adhesive thermosetting resin composition may become poor. If it exceeds 140°C, the curing time may become extremely long. Furthermore, the decomposition start temperature may be the temperature at which the mass is reduced by 1% from the mass before heating the sample as the decomposition start temperature.

Specific examples of free radical initiators satisfying this condition include, for example, 1,1-bis(tert-butylperoxy)-2-methylcyclohexane and tert-butyl peroxyneodecanoate , Dicumyl peroxide, etc. These may be used alone, or two or more of them may be mixed and used for curability control.

The compounding amount of the (B) radical initiator may be 0.1-10 parts by mass relative to 100 parts by mass of the above-mentioned (A) thermosetting resin. If the blending amount exceeds 10 parts by mass, the viscosity of the resin composition may change over time and the workability may decrease. If it is less than 0.1 parts by mass, the curability may be significantly reduced.

The (C) silver fine particles used in this embodiment can be used without particular limitation as long as they are silver fine particles with a thickness or a short diameter of 1 to 200 nm. Examples of the shape of the (C) silver fine particles include plate shape, dendritic shape, rod shape, linear shape, spherical shape, and the like. Here, if it is a plate shape, the thickness may satisfy the above-mentioned range, and if it is a dendritic, rod-like, linear, or spherical shape, the shortest diameter of the cross-sectional diameter may satisfy the above-mentioned range.

For the above (C) silver fine particles, (C1) plate-type silver fine particles can be used. Since the plate-shaped silver particles tend to accumulate in the short-axis direction, they have the following advantages: when the electrode-forming resin composition is formed into a film on both ends of electronic parts by dip coating, less surface irregularities can be obtained The smooth electrode surface.

The central particle size of the plate-shaped silver particles can be 0.3-15 μm. In one embodiment of the present invention, by setting the center particle diameter of the plate-shaped silver fine particles within this range, the dispersibility to the resin component can be improved. Here, the central particle size refers to the 50% cumulative value (50% particle size) in the volume-based particle size distribution curve measured by a laser diffraction particle size distribution measuring device.

In addition, the thickness is 10 to 200 nm, and further may be 10 to 100 nm. The thickness is measured by data processing of observation images obtained by a transmission electron microscope (TEM) or a scanning electron microscope (SEM). Furthermore, the average thickness of the thickness may be within the above-mentioned range. The average thickness is calculated as the number average thickness in the following manner.

Arrange the thickness measured according to the observation image of [n+1] (n+1, for example, 50 to 100) plate-shaped silver particles in order from thick to thin, and the range (maximum thickness: x ₁ , minimum thickness: x _{n + 1)} is divided into n parts, the thickness of each segment is set to _{[x j, x j + 1} ] (j = 1,2, ......, n). The division in this case becomes equal division on the logarithmic scale. In addition, based on a logarithmic scale, the representative thickness in each thickness interval is represented by the following formula.

[Number 1]

Further, when _{r j (j = 1,2, ......} , n) is set to the interval _{[x j, x j + 1} ] corresponding to the relative amount (% difference), and the total of the entire interval is 100 %, the average μ on the logarithmic scale can be calculated using the following formula.

[Number 2]

The μ is a value on a logarithmic scale and does not have a unit of thickness, so in order to change back to a unit of thickness, calculate 10 ^μ , which is 10 to the power of μ. This 10 ^μ is the number average thickness.

In addition, the long side in the direction perpendicular to the thickness direction may be in the range of 8 to 150 times the thickness, or 10 to 50 times. Furthermore, the short side in the direction perpendicular to the thickness direction may be in the range of 1 to 100 times the thickness, or 3 to 50 times.

The plate-shaped silver particles can be self-sintered at 100-250°C. By including the silver particles self-sintered at 100-250°C, the fluidity of the silver particles is improved during thermal hardening. As a result, the contacts between the silver particles become more and the area of the contacts becomes larger. The sex is significantly improved. The lower the self-sintering temperature, the better the sinterability, so the sintering temperature of the plate-shaped silver particles can be 100-200°C. Furthermore, self-sintering here means that even if no pressure or additives are added, it can be sintered by heating at a temperature lower than the melting point.

Examples of such plate-shaped silver microparticles include: M612 (trade name; center particle size 6-12 μm, particle thickness 60-100 nm, melting point 250°C) manufactured by Tokusen Kogyo Co., Ltd., M27 (trade name; center Particle size 2～7 μm, particle thickness 60～100 nm, melting point 200℃), M13 (trade name; center particle diameter 1～3 μm, particle thickness 40～60 nm, melting point 200℃), N300 (trade name; center The particle size is 0.3-0.6 μm, the particle thickness is 50 nm or less, and the melting point is 150°C). These plate-shaped silver particles can be used alone or in combination. Especially in order to increase the filling rate, the plate-shaped silver particles can be used in combination with relatively large silver particles such as M27 and M13 among the above-mentioned plate-shaped silver particles and smaller particles such as N300.

(C1) The plate-shaped silver fine particles preferably have a particle thickness of 200 nm or less, a tap density (TD) of 3.0 to 7.0 g/cm ³ , and a specific surface area (BET) of 2.0 to 6.0 m ² /g.

The (C) silver fine particles can be (C2) spherical silver fine particles. The particle size of the spherical silver particles used in this embodiment may be 10 to 200 nm. The spherical silver particles can generally be formed by providing a coating layer formed of an organic compound on the metal surface of the silver particles, or by dispersing the silver particles in an organic compound. In this form, the silver particles contained can make the metal surfaces not directly contact each other, so the aggregation of the silver particles can be reduced, and the silver particles can be kept in a dispersed state. Furthermore, the particle size is measured by data processing of observation images obtained by a transmission electron microscope (TEM) or a scanning electron microscope (SEM). Furthermore, the average particle diameter of (C2) spherical silver fine particles may be within the above-mentioned range. The average particle diameter is calculated as the number average particle diameter of the particle diameters measured from observation images of 50 to 100 spherical silver particles. The number average particle diameter may be calculated as the average value in the same manner as the calculation of the average thickness described above.

The aforementioned (C1) plate-shaped silver particles and (C2) spherical silver particles can be used in combination, and when used in combination, the blending ratio can be 100:0-10:90. If the blending ratio of (C1) plate-shaped silver microparticles and (C2) spherical silver microparticles is within this range, the coating appearance and fixing strength become good.

The (D) silver powder used in this embodiment is a silver powder other than the (C) component. (D) The average particle diameter of the silver powder is 0.2-20 μm, as long as it is a silver powder that is an inorganic filler added to the resin adhesive to impart conductivity. In this embodiment, the tap density of (D) silver powder can be 2.0-7.0 g/cm ³ .

By adding the silver powder of the component (D) in addition to the silver particles of the component (C), the bonding strength between the terminals of the chip parts and the electrodes can be further improved. In addition, as the shape of the silver particles used here, for example, a flake shape, a resin shape, a rod shape, a linear shape, a spherical shape, a plate shape, etc. can be mentioned. Furthermore, the average particle size of the silver powder of component (D) refers to the 50% cumulative value (50% particle size) in the volume-based particle size distribution curve measured by a laser diffraction particle size distribution measuring device. Especially if (D1) flaky silver powder is used, good on-resistance is obtained. Furthermore, the (D) component silver powder can be used by mixing (D1) flake-shaped silver powder and (D2) spherical silver powder. The mixing ratio of (D1) flaky silver powder and (D2) spherical silver powder can be 100:0-10:90. If the blending ratio of (D1) flaky silver powder and (D2) spherical silver powder is in this range, the fixation strength and on-resistance become good.

Furthermore, regarding the ratio of the (C) component to the (D) component, the mass ratio of the (C) component: (D) component may be 10:90-50:50. If the ratio of the (C) component to the (D) component is too small, the sinterability may decrease and the resistance value may increase, and if it is too large, the viscosity may increase significantly and the coating properties to electronic parts may be impaired.

The resin composition for electrode formation of this embodiment uses the above-mentioned components (A) to (D) as essential components. The thixotropic ratio of the resin composition for electrode formation obtained in this way (viscosity of 2 rpm at 25°C) The ratio of viscosity to 20 rpm) is 1.1 to 2.0. The thixotropic ratio can be 1.1 to 1.5, or 1.2 to 1.4. If the thixotropy ratio is in the range of 1.1 to 2.0, the coating appearance is excellent, and the adhesion, moisture resistance, and resistance of resistance after heat treatment are excellent. On the other hand, if the thixotropy ratio is less than 1.1, the workability may be reduced due to wire drawing during dip coating in the manufacture of electronic parts. If the thixotropy ratio exceeds 2.0, edges and corners may occur during dip coating. , When used as external electrodes of electric and electronic parts, the dimensional stability may decrease, and in either case, the yield rate of electronic parts may deteriorate.

In this embodiment, the resin composition for forming an electrode may further include a high-viscosity solvent having a viscosity of 200 cP or more as the (E) solvent. The viscosity of the (E) solvent can be 250 cP or more, or 300 cP or more. As such a high-viscosity solvent, for example, a diol having a hydrocarbon skeleton as the main chain may be used, and a branched diol having 5 to 10 carbon atoms may also be used. Furthermore, (E) the viscosity of the solvent can be 600 cP or less, or 500 cP or less. By containing this (E) solvent, it is easy to adjust to the said thixotropic ratio.

As the diol having the above-mentioned hydrocarbon skeleton as the main chain, various well-known ones can be used without particular limitation. As such a diol, as long as it is a branched diol having a total carbon number of 5-10, it may also be a 2-alkyl-1,3-hexanedi having an alkyl group with a carbon number of 1 to 4 as a substituent. alcohol. Specific compounds of molecular chain diols include, for example, 2-ethyl-1,3-hexanediol, 2-butyl-2-ethyl-1,3-propanediol, and 2,4-diethyl 1,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-methyl-1,8-octanediol, neopentyl glycol, etc., Use two or more kinds in combination. Among them, those having a boiling point of about 140 to 260°C are preferred. In particular, it is preferably selected from 2-ethyl-1,3-hexanediol, 2-butyl-2-ethyl-1,3-propanediol and 2,4-diethyl-1,5-pentane At least one of the group consisting of alcohol. Furthermore, regarding the above-mentioned 2-alkyl-1,3-hexanediol having an alkyl group having 1 to 4 carbon atoms as a substituent, specific examples of the alkyl group include methyl, ethyl, propyl, Isopropyl, butyl, isobutyl, etc.

For example, the viscosity of 2-ethyl-1,3-hexanediol at 20°C is a high viscosity of 323 cP. In normal electrode pastes, when using such a high-viscosity solvent, if the viscosity is too high, the printability and workability may decrease. In contrast, if the above-mentioned (E) solvent is used in the electrode paste of this embodiment, even if (C) silver particles and (D) silver powder are contained in the concentration specified in this embodiment, the desired Thixotropy ratio, to obtain an electrode with good coating appearance.

Furthermore, by making the resin composition for forming an electrode contain the above-mentioned solvent, when the resin composition for forming an electrode is dip-coated in the manufacturing step of an electronic component, the surface of the dip tank is flattened by a doctor blade. The viscosity change rate (thickness increase rate) of the resin composition for formation becomes 200% or less, and continuous workability becomes good.

The resin composition for electrode formation of this embodiment can be formulated with the above-mentioned components (A) to (D) in the following ratios, and when the total of the components (A) to (D) is 100% by mass, (A) thermosetting 1-15% by mass of (C) silver particles, 5-40% by mass, (D) 50-90% by mass of silver powder, 0.1-10 parts by mass relative to 100 parts by mass of (A) thermosetting resin (B ) Free radical initiator. In addition, when the (E) solvent is contained, when the total of the components (A) to (D) is 100 parts by mass, the (E) solvent may be contained in an amount of 1 to 10 parts by mass. With such a composition, heat resistance, moisture resistance, adhesiveness, and environmental resistance become better.

The resin composition for electrode formation of the present embodiment contains the above-mentioned components (A) to (D). In addition to these components, the resin composition represented by (E) solvent may be appropriately blended as required. Additives such as accelerators, rubber, silicone and other low-stress agents, coupling agents, adhesion imparting agents, titanate coupling agents, pigments, dyes, defoamers, surfactants, diluents, etc.

The resin composition for electrode formation of this embodiment fully mixes each component of the said (A)-(D), additives, such as a coupling agent, if necessary, (E) a solvent, etc. are fully mixed. Next, the resin composition for forming an electrode of this embodiment is kneading the mixed resin composition by a disperser, a kneader, a three-roll mill, or the like. Finally, the resin composition for forming an electrode of this embodiment can be prepared by defoaming the kneaded resin composition.

The resin composition for electrode formation obtained in this way can be used to form electrodes of electrical and electronic parts, and its thixotropy ratio (the ratio of the viscosity at 25°C at 2 rpm to the viscosity at 20 rpm) can be 1.1 to 2.0 , Can be 1.1 to 1.5, or 1.2 to 1.4. If the thixotropy ratio is in this range, the coating appearance is excellent, and the adhesiveness, moisture resistance, resistance stability after heat treatment, etc. are excellent.

If the thixotropy ratio is less than 1.1, the workability may be reduced due to wire drawing during dip coating in the manufacture of electronic parts. If the thixotropy ratio exceeds 2.0, edges and corners may occur during dip coating, which may be used as electrical components. , In the case of external electrodes of electronic parts, the dimensional stability may decrease. In any case, the yield rate of electronic parts may deteriorate.

In addition, the thickness of the cured product of the electrode-forming resin composition formed as the external electrode of the electronic component may be 5-100 μm. If the film thickness is less than 5 μm, there is a risk of poor spreadability to the required part, lack of uniformity of the coating film, and pinholes. If it exceeds 100 μm, it may sag during curing and may lack uniformity of the coating film. .

Although the surface of the dipping tank is flattened by a doctor blade during the process of dipping and coating the resin composition for forming electrodes in the manufacturing steps of electronic parts, the efficiency of continuous operation requires the use of the resin composition for forming electrodes. The viscosity change rate (thickness increase rate) is 200% or less.

The cured product of the electrode-forming resin composition of the present embodiment obtained in this way has excellent environmental resistance (super moisture resistance, super heat resistance), high thermal conductivity, and excellent heat dissipation at the automotive parts level. Therefore, when the resin composition for electrode formation is used to form the internal electrode or the external electrode of an electronic component, the visible characteristics are significantly improved. For example, when used as an external electrode of an inductor, since the coil is directly bonded to the metal, and the body other than the coil can be bonded to the body by the resin to exhibit high bonding force, it can help reduce the resistance value And improve the reliability in the vehicle level.

Next, a description will be given of the wafer-type electronic component and its manufacturing method of this embodiment. The chip-type electronic component of this embodiment is a chip-type electronic component having a cuboid-shaped chip-type electronic component body including a ceramic sintered body, internal electrodes formed in the chip-type electronic component body and the chip-type electronic component At least one of the external electrodes on the end surface of the green body is a sintered body of the resin composition for electrode formation of the above embodiment. The volume resistivity of the sintered body obtained at this time is preferably 1×10 ^-4 Ω·cm or less. Furthermore, the lower the volume resistivity, the better the characteristics of electronic parts, so the volume resistivity can be 1×10 ^-5 Ω·cm or less. If the volume resistivity exceeds 1×10 ^-4 Ω·cm, the reliability of the product may deteriorate. If the resin composition for electrode formation is not sufficiently sintered, the volume resistivity may exceed 1×10 ^-4 Ω·cm.

When manufacturing the chip-type electronic component of this embodiment, the resin composition for electrode formation of this embodiment is used to form a specific electrode pattern layer by printing on the surface of a ceramic layer. The next step of the method for manufacturing a chip-type electronic component of this embodiment is to place another ceramic layer on the electrode pattern layer, and use the resin composition for electrode formation of this embodiment on the surface of the other ceramic layer to be printed A specific electrode pattern layer is formed, and this operation is repeated, so that the ceramic layer and the electrode pattern layer are alternately laminated.

The next step of the method of manufacturing a wafer-type electronic component of this embodiment is to sinter the obtained laminate, thereby producing a wafer-type electronic component blank having internal electrodes formed by electrode patterns. The final step of the method of manufacturing a wafer-type electronic component of this embodiment is to form an external electrode on the end surface of the wafer-type electronic component blank to obtain a wafer-type electronic component. In this case, the resin composition for electrode formation of this embodiment can be used for the formation of external electrodes.

When manufacturing other chip-type electronic parts of this embodiment, the electrode-forming resin composition of this embodiment is applied to the end surface of the chip-type electronic part body by printing or dipping, and the coated electrode is formed by sintering The resin composition is used to form external electrodes to obtain wafer-type electronic parts. At this time, in this embodiment, the resin composition for forming an electrode can be sintered by heating as before, and furthermore, sufficient conductivity can be ensured even if it is sintered at 100 to 300°C. In addition, the continuous workability during dip coating of the resin composition for electrode formation is good, and the electrode can be formed efficiently. [Example]

Next, the present embodiment will be described in further detail with examples, but the present embodiment is not limited to these examples.

(Examples 1 to 12, Comparative Examples 1 to 4) Each component was mixed according to the composition described in Tables 1 to 3 and kneaded with a roller to obtain a resin composition for forming an electrode. The blending amount of each component in Tables 1 to 3 is expressed in parts by mass. The obtained resin composition was evaluated according to the following method. The results are shown in Tables 1 to 3. In addition, the materials used in the examples and comparative examples are those having the following characteristics.

[(A) Ingredient] (A1) Acrylic resin: Hydroxyethyl acrylamide (manufactured by Kohjin Co., Ltd., trade name: HEAA) (A21) Dimaleimide expanded bismaleimide (manufactured by Designer molecules, trade name: BMI-1500; number average molecular weight 1500) (A22) Dimaleimide-extended bismaleimide (manufactured by Designer molecules, trade name: BMI-689; number average molecular weight 689) (A31) Epoxidized polybutadiene resin (manufactured by Japan Soda Co., Ltd., trade name: JP-200) (A32) Terminal acrylate type polybutadiene resin (manufactured by Soda Corporation, trade name: TE-2000)

Thermosetting resin except (A1)～(A3) Epoxy resin: Bisphenol F type liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: YL983U) Phenol resin: Bisphenol F (manufactured by Honshu Chemical Industry Co., Ltd., trade name: Bisphenol F)

[(B) Ingredient] Free radical initiator: Dicumyl peroxide (manufactured by Nippon Oil & Fats Co., Ltd., trade name: Percumyl D; decomposition temperature in rapid heating test: 126°C)

[(C) Ingredient] Plate-shaped silver particles (manufactured by Tokusen Kogyo Co., Ltd., trade name: M13; center particle size: 2 μm, thickness: 50 nm or less) Spherical silver particles (manufactured by DOWA Electronics, trade name: Ag nano powder-1; average particle diameter: 20 nm)

[Component (D)] Silver powder A (shape: flake, average particle size: 4.0 μm, thickness: 0.3 μm or more, tap density: 5.5 g/cm ³ ) silver powder B (shape: flake, average particle size: 3.0 μm, thickness: 0.3 μm or more, tap density: 3.8 g/cm ³ ) Silver powder C (shape: spherical, average particle size: 2.4 μm, tap density: 5.0 g/cm ³ )

[(E) Ingredient] Solvent: 2-ethyl-1,3-hexanediol (manufactured by Tokyo Chemical Industry Co., Ltd.) [Other ingredients] Dilution solvent: Butyl carbitol (manufactured by Tokyo Chemical Industry Co., Ltd.) Hardening accelerator: 1-benzyl-2-phenylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., trade name: 1B2PZ) Additive: Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-503)

[Table 1] Example 1 2 3 4 5 6 composition (A) Ingredient (A1) Acrylic resin 25 25 25 (A21) Dimaleimide extended bismaleimide resin 50 50 25 (A22) Dimaleimide extended bismaleimide resin 25 50 25 (A31) Epoxidized polybutadiene resin 50 50 (A32) Acrylic type polybutadiene resin 50 50 50 50 Epoxy resin Phenol resin (B) Ingredient Free radical initiator 5 5 5 5 5 5 (C) Ingredients Plate type silver particles 250 250 250 250 250 Spherical silver particles 250 (D) Ingredients Silver powder A 750 750 750 750 750 Silver powder B 750 Silver Powder C (E) Ingredients 2-alkyl-1,3-hexanediol 50 50 50 50 50 50 other Dilution solvent Hardening accelerator additive 5 5 5 5 5 5 characteristic Viscosity (Pa·s) 30 25 35 25 25 twenty two Thixotropy ratio 1.4 1.4 1.6 1.5 1.7 1.3 Volume resistivity (×10 ^-6 Ω·cm) 10 10 10 10 10 10 Coating appearance good good good good good good Fixing strength (N) 30 28 35 38 37 37 1% weight reduction temperature (TG/DTA)(℃) 348 352 352 352 352 352 Water absorption rate of hardened material (%) 0.08 0.10 0.10 0.10 0.10 0.10 Change rate of resistance value after heat resistance energization test 1(%) 150℃ 500 hours 100 100 100 100 100 100 1000 hours 100 100 100 100 100 100 2000 hours 100 100 100 100 100 100 3000 hours 100 100 100 100 100 100 The rate of change of the resistance value after the humidity resistance test is 2(%) 85℃/85% 500 hours 100 100 100 100 100 100 1000 hours 100 99 99 99 99 99 2000 hours 99 98 98 98 98 98 3000 hours 98 97 97 97 97 97

[Table 2] Example 7 8 9 10 11 12 composition (A) Ingredient (A1) Acrylic resin 25 (A21) Dimaleimide extended bismaleimide resin 50 35 30 50 (A22) Dimaleimide extended bismaleimide resin 50 50 (A31) Epoxidized polybutadiene resin (A32) Acrylic type polybutadiene resin 50 50 50 40 70 50 Epoxy resin Phenol resin (B) Ingredient Free radical initiator 5 5 5 5 5 5 (C) Ingredients Plate type silver particles 250 250 250 250 250 Spherical silver particles 250 (D) Ingredients Silver powder A 750 750 750 750 Silver powder B Silver Powder C 750 750 (E) Ingredients 2-alkyl-1,3-hexanediol 50 50 50 50 50 40 other Dilution solvent 10 Hardening accelerator additive 5 5 5 5 5 5 characteristic Viscosity (Pa·s) 26 29 15 33 26 25 Thixotropy ratio 1.3 1.2 1.8 1.3 1.4 2.0 Volume resistivity (×10 ^-6 Ω·cm) 10 12 12 10 10 14 Coating appearance good good good good good can Fixing strength (N) 36 35 30 33 37 38 1% weight reduction temperature (TG/DTA)(℃) 352 352 352 340 345 352 Water absorption rate of hardened material (%) 0.10 0.10 0.10 0.11 0.11 0.10 Change rate of resistance value after heat resistance energization test (1%) 150℃ 500 hours 100 100 100 101 100 100 1000 hours 100 100 100 102 100 100 2000 hours 100 100 100 103 101 100 3000 hours 100 100 100 105 102 100 The rate of change of the resistance value after the humidity resistance test is 2(%) 85℃/85% 500 hours 100 100 100 101 100 100 1000 hours 99 99 99 102 101 99 2000 hours 98 98 98 104 102 98 3000 hours 97 97 97 106 104 97

[table 3] Comparative example 1 2 3 4 composition (A) Ingredient (A1) Acrylic resin 100 25 (A21) Dimaleimide extended bismaleimide resin (A22) Dimaleimide extended bismaleimide resin 25 (A31) Epoxidized polybutadiene resin (A32) Acrylic type polybutadiene resin 50 Epoxy resin 100 100 Phenol resin 20 20 (B) Ingredient Free radical initiator 5 5 (C) Ingredients Plate type silver particles 250 Spherical silver particles 400 (D) Ingredients Silver powder A 1000 750 1000 600 Silver powder B Silver Powder C (E) Ingredients 2-alkyl-1,3-hexanediol other Dilution solvent 50 50 100 100 Hardening accelerator 1 1 additive 5 5 characteristic Viscosity (Pa·s) 10 11 20 15 Thixotropy ratio 3.5 3 3.8 3.5 Volume resistivity (×10 ^-6 Ω·cm) 90 13 80 20 Coating appearance bad bad bad bad Fixing strength (N) 30 33 35 38 1% weight reduction temperature (TG/DTA)(℃) 320 261 275 300 Water absorption rate of hardened material (%) 0.21 1.2 1.2 1.2 Change rate of resistance value after heat resistance energization test 1(%) 150℃ 500 hours ＞110 103 103 103 1000 hours ＞110 108 108 108 2000 hours ＞110 ＞110 ＞110 ＞110 3000 hours ＞110 ＞110 ＞110 ＞110 The rate of change of the resistance value after the humidity resistance test is 2(%) 85℃/85% 500 hours ＞110 ＞110 ＞110 ＞110 1000 hours ＞110 ＞110 ＞110 ＞110 2000 hours ＞110 ＞110 ＞110 ＞110 3000 hours ＞110 ＞110 ＞110 ＞110

＜Evaluation method＞ [Viscosity] Use E-type viscometer (3° cone) to measure the value at 25°C and 2 rpm. [Thixotropic ratio] Use an E-type viscometer (3° cone) to measure the viscosity at 25°C, 2 rpm and 20 rpm, and compare the viscosity at 2 rpm to the viscosity at 20 rpm (viscosity at 2 rpm/viscosity at 20 rpm) Set to thixotropic ratio.

[Volume resistivity] The resin composition for electrode formation was applied to a glass substrate (thickness 1 mm) by a screen printing method with a thickness of 5 mm × 50 mm and a thickness of 30 μm, and cured at 200° C. for 60 minutes. Using the product name "MCP-T600" (manufactured by Mitsubishi Chemical Corporation), the resistance of the obtained wiring was measured by the four-terminal method.

[Appearance of coating] The resin composition for electrode formation is formed into a film on both ends of the wafer-type electronic component body by dip coating, and it is heated and cured at 200° C. for 60 minutes to produce an electronic component. Among the electronic parts obtained at this time, the dimensional stability cannot be obtained due to the step difference of the resin composition for electrode formation, etc., was designated as NG. Whether the dimensional stability is obtained is determined by observing the electrode cross-section with a microscope, and the difference between the unevenness of the surface is less than 40 μm as "good", and the difference between the unevenness of the surface is 40-100 μm as "good", and the difference is more than 100 μm is judged as "bad".

[1% weight reduction temperature] After curing 10 mg of the electrode-forming resin composition obtained in each example and each comparative example at 200°C for 1 hour, a TG/DTA7200 thermogravimetric analyzer (manufactured by SII NanoTechnology Co., Ltd.) was used as the measuring device. The compressed air is heated at a temperature of 10°C/min in the range of room temperature (25°C) to 600°C, and the temperature at which the weight of the sample used is reduced by 1% is determined by this. [Water absorption rate of hardened material] Using a hardened product with a film thickness of 200 μm and a size of 500 mm square, the initial weight is used as a basis, and the weight is measured after being placed in a 85°C, 85% high temperature and humidity bath for 168 hours to obtain the result.

[Fixed Strength] The resin composition for electrode formation was formed into a film on both ends of a wafer-type electronic component body by dip coating, and the film was heated and cured at 200°C for 60 minutes. Ni and Sn are plated on it and mounted on the substrate by soldering to make electronic parts. Push the electronic part horizontally at 20 mm/min, measure the shear strength, and set the load at the time of failure as the fixing strength (N).

[Change rate of resistance value after heat resistance energization test 1] The resin composition for electrode formation was formed into a film on both ends of the wafer-type electronic component body by dip coating, and the film was heated and cured at 200°C for 60 minutes. Ni and Sn are plated on it and mounted on the substrate by soldering to make electronic parts. Put the electronic component in a constant temperature bath (temperature 150°C), perform an energization test (1A) in this state, calculate the initial value after 500 hours, after 1000 hours, after 2000 hours, after 3000 hours The relative value.

[Change rate of resistance value after humidity resistance test 2] The resin composition for electrode formation was formed into a film on both ends of the wafer-type electronic component body by dip coating, and the film was heated and cured at 200°C for 60 minutes. Ni and Sn are plated on it and mounted on the substrate by soldering to make electronic parts.

Put the electronic component in a constant temperature and humidity chamber (temperature 85°C, humidity 85%), and perform an energization test (1A) in this state, and calculate the initial value after 500 hours, after 1000 hours, and after 2000 hours. The relative value after 3000 hours.

From the above results, it can be seen that an electronic component using the resin composition for forming an electrode of the present embodiment can obtain a highly reliable electronic component with good properties.

Claims (12)

A resin composition for forming an electrode, characterized in that it contains (A) a thermosetting resin, (B) a radical initiator, (C) silver particles with a thickness or short diameter of 1 to 200 nm, and (D ) Silver powder with an average particle size of 2-20 μm other than the above (C) component, and The thixotropy ratio (the ratio of the viscosity at 25°C at 2 rpm to the viscosity at 20 rpm) is 1.1 to 2.0. The resin composition for forming an electrode according to claim 1, wherein the above-mentioned (A) thermosetting resin comprises (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound, (A2) At least one of bismaleimide resin and (A3) polybutadiene that is liquid at room temperature. The resin composition for forming an electrode according to claim 2, wherein the above-mentioned (A) thermosetting resin is based on the above-mentioned (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound by 0 to 75 mass %, the above (A2) bismaleimide resin is 10 to 90% by mass, and the above (A3) polybutadiene is 10 to 90% by mass. The resin composition for forming an electrode according to any one of claims 1 to 3, wherein the (A1) (meth)acrylate compound or (meth)acrylamide compound is selected from the following general formulas (1) to (4) Acrylic resin of at least one compound, [化1]

(In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a divalent aliphatic hydrocarbon group having 1 to 100 carbon atoms or an aliphatic hydrocarbon group having a cyclic structure) [化2]

(In the formula, R ¹ and R ² respectively represent the same as the above) [化3]

(In the formula, R ¹ represents the same as above, and n represents an integer of 1-50) [Chemical 4]

(In the formula, R ¹ and n each represent the same as the above). The resin composition for forming an electrode according to any one of claims 1 to 3, wherein the above-mentioned (A2) bismaleimide resin is a compound represented by the following general formula (5) or (6), [化5]

(In the formula, Q represents a bivalent linear, branched or cyclic aliphatic hydrocarbon group with 6 or more carbons, and P is selected from O, CO, COO, CH ₂ , C(CH ₃ ) ₂ , C (CF ₃ ) ₂ , S, S ₂ , SO and SO ₂ divalent atoms or organic groups, or organic groups containing at least one of these atoms or organic groups, m represents an integer from 1 to 10) [化6]

(In the formula, R ³ to R ⁶ represent a divalent linear, branched or cyclic aliphatic hydrocarbon group with 6 or more carbon atoms). The resin composition for forming an electrode according to any one of claims 1 to 3, wherein the resin composition for forming an electrode further comprises a branched diol having 5 to 10 carbon atoms as the (E) solvent. The resin composition for forming an electrode according to any one of claims 1 to 3, which contains the (A) thermosetting resin 1 to (A) when the total of the components (A) to (D) is 100% by mass 15% by mass, the above (C) silver fine particles 5-40% by mass, the above (D) silver powder 50-90% by mass, and relative to the above (A) thermosetting resin 100 mass parts, containing the above (B) radical The starting agent is 0.1-10 parts by mass. The resin composition for forming an electrode according to claim 6, which contains 1 to 10 parts by mass of the component (E) when the total of the components (A) to (D) is 100 parts by mass. A chip-type electronic part, characterized in that: the chip-type electronic part has a cuboid-shaped chip-type electronic part blank containing a ceramic sintered body, and internal electrodes located inside the chip-type electronic part and the chip-type electronic part blank At least one of the external electrodes on the end surface of the body is a sintered body of the resin composition for forming an electrode according to any one of claims 1 to 8. A method for manufacturing a wafer-type electronic component, characterized in that: using the resin composition for forming an electrode as in any one of claims 1 to 8 to print a specific electrode pattern layer on the surface of a ceramic layer; Furthermore, another ceramic layer is placed on the electrode pattern layer, and a specific electrode pattern layer is printed on the surface of the other ceramic layer using the resin composition for forming an electrode according to any one of claims 1 to 7, and this is repeated. Operation to alternately stack the ceramic layer and the electrode pattern layer; The laminated body obtained by sintering is thereby made into a wafer-type electronic component body having internal electrodes formed by the above-mentioned electrode pattern layer; and An external electrode is formed on the end surface of the wafer-type electronic component blank. The method of manufacturing a chip-type electronic component according to claim 10, wherein the formation of the external electrode is by printing or dipping the resin composition for forming an electrode as in any one of claims 1 to 8 to the chip type The end surface of the electronic part body is sintered and the applied resin composition for forming the electrode is sintered. A method for manufacturing a wafer-type electronic part, characterized in that: the resin composition for forming an electrode as in any one of claims 1 to 8 is applied to the end surface of a wafer-type electronic part blank by printing or dipping, and The applied resin composition for forming an electrode is sintered, thereby forming an external electrode.