TW202027188A - 基板溫度測定裝置和半導體製造裝置 - Google Patents

基板溫度測定裝置和半導體製造裝置 Download PDF

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Publication number
TW202027188A
TW202027188A TW108147655A TW108147655A TW202027188A TW 202027188 A TW202027188 A TW 202027188A TW 108147655 A TW108147655 A TW 108147655A TW 108147655 A TW108147655 A TW 108147655A TW 202027188 A TW202027188 A TW 202027188A
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TW
Taiwan
Prior art keywords
substrate
substrate temperature
temperature measuring
measuring device
heat
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TW108147655A
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English (en)
Chinese (zh)
Inventor
後藤亮介
小野田正敏
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日商日新離子機器股份有限公司
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Publication of TW202027188A publication Critical patent/TW202027188A/zh

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW108147655A 2019-01-08 2019-12-25 基板溫度測定裝置和半導體製造裝置 TW202027188A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019001480 2019-01-08
JP2019-001480 2019-01-08
JP2019114375A JP2020112536A (ja) 2019-01-08 2019-06-20 基板温度測定装置
JP2019-114375 2019-06-20

Publications (1)

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TW202027188A true TW202027188A (zh) 2020-07-16

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TW108147655A TW202027188A (zh) 2019-01-08 2019-12-25 基板溫度測定裝置和半導體製造裝置

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JP (1) JP2020112536A (ja)
TW (1) TW202027188A (ja)

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JP2020112536A (ja) 2020-07-27

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