TW202025404A - Packaging carrier tape base material and preparation method thereof - Google Patents

Packaging carrier tape base material and preparation method thereof Download PDF

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Publication number
TW202025404A
TW202025404A TW108111772A TW108111772A TW202025404A TW 202025404 A TW202025404 A TW 202025404A TW 108111772 A TW108111772 A TW 108111772A TW 108111772 A TW108111772 A TW 108111772A TW 202025404 A TW202025404 A TW 202025404A
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carrier tape
cured
patent application
preparation
sheet
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TW108111772A
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TWI754139B (en
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汪青
劉東亮
劉潛發
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大陸商廣東生益科技股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2311/12—Copper
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    • B32B2425/00—Cards, e.g. identity cards, credit cards
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    • B32B2553/00—Packaging equipment or accessories not otherwise provided for

Abstract

The invention provides a packaging carrier tape base material and a preparation method thereof. The packaging carrier tape substrate sequentially comprises a curing sheet, a glue film and metal foil which are laminated together from top to bottom, wherein the roughness of the side, away from the glue film, of the curing sheet is 3-10 [mu]m. By utilizing the packaging carrier tape base material, the height of UV glue is within the range of 500-580 [mu]m, application requirements can be well met, finally, binding force of a module and a card is 90 N or above, and the binding requirements of the module and the card can also be met.

Description

一種封裝載帶基材及其製備方法 Packaging carrier tape substrate and preparation method thereof

本發明屬於封裝基材技術領域，關於一種封裝載帶基材及其製備方法。 The invention belongs to the technical field of packaging substrates, and relates to a packaging carrier tape substrate and a preparation method thereof.

智慧卡封裝載帶基材係智慧卡模組封裝用的關鍵專用基礎材料，其功能係保護晶片、並作為積體電路晶片及外界介面。廣泛應用於金融、移動支付、社會保障、電信、衛生、教育、交通、公共安全等領域。隨著銀行晶片卡在世界範圍內得到大力推廣並逐漸代替傳統磁卡、具備金融功能的社保卡的普及、以及隨著移動支付功能的普及，智慧卡的應用愈來愈廣泛。 The smart card packaging carrier tape base material is the key dedicated base material for smart card module packaging. Its function is to protect the chip and serve as an integrated circuit chip and external interface. It is widely used in finance, mobile payment, social security, telecommunications, health, education, transportation, public safety and other fields. With the popularization of bank chip cards worldwide and gradually replacing traditional magnetic cards, social security cards with financial functions, and the popularization of mobile payment functions, the application of smart cards has become more and more widespread.

在智慧卡製造工藝中，有一個UV膠封裝工序，主要的目的在於保護智慧卡晶片及金線。CN102543899A提供一種柔性封裝基板及其製作方法，包含壓合在一起的固化片、膠膜及銅箔，前述膠膜位於固化片與銅箔之間，前述膠膜及固化片上有通孔；其提供的封裝基板後續高溫烘烤時不會發黏，但隨著智慧卡的逐漸發展，智慧卡行業標準對UV膠的高度要求愈加嚴格，通常的範圍在500-580μm，而一般製備工藝中，UV膠在材料表面不能有效鋪開，經常會導致出現UV膠高度超標的問題，通 常的解決方法一般為減少UV膠的用量或降低其中某一層的高度以確保最後的高度符合應用要求；另外在製卡工序中，模組藉由熱熔膠與塑膠卡片貼合，通常會出現結合力偏低的問題，無法達到目前愈來愈嚴格的行業標準，即無法達到結合力大於90N的要求。 In the smart card manufacturing process, there is a UV glue packaging process, the main purpose is to protect the smart card chip and gold wire. CN102543899A provides a flexible packaging substrate and a manufacturing method thereof, including a cured sheet, an adhesive film and copper foil pressed together, the foregoing adhesive film is located between the cured sheet and the copper foil, and the foregoing adhesive film and cured sheet have through holes; The package substrate will not become sticky during subsequent high-temperature baking. However, with the gradual development of smart cards, the smart card industry standards have stricter requirements on the height of UV glue. The usual range is 500-580 μm . , UV glue cannot be spread effectively on the surface of the material, which often leads to the problem of excessive UV glue height. The usual solution is to reduce the amount of UV glue or reduce the height of one of the layers to ensure that the final height meets the application requirements; In the card manufacturing process, the module is laminated with the plastic card by hot melt adhesive, which usually has the problem of low binding force, which cannot meet the increasingly stringent industry standards, that is, cannot meet the requirement of binding force greater than 90N.

因此，必須開發一種新的封裝載帶基材的製備方法，以解決UV膠封裝過程中模組高度超標的問題。 Therefore, it is necessary to develop a new method for preparing the packaging carrier tape substrate to solve the problem of the module height exceeding the standard during the UV glue packaging process.

本發明的目的在於提供一種封裝載帶基材及其製備方法，本發明提供的封裝載帶基材可有效地解決UV膠封裝過程中模組高度超標的問題，並且同時可提高模組與卡片的結合力。 The purpose of the present invention is to provide a package carrier tape substrate and a preparation method thereof. The package carrier tape substrate provided by the present invention can effectively solve the problem of the module height exceeding the standard during the UV glue encapsulation process, and at the same time can improve the module and the card The binding power.

為達此目的，本發明採用以下技術手段：第一態樣，本發明提供一種封裝載帶基材，其特徵係其由上至下依次包含壓合在一起的固化片、膠膜及金屬箔。 To achieve this objective, the present invention adopts the following technical means: In the first aspect, the present invention provides a package carrier tape substrate, which is characterized by comprising a cured sheet, an adhesive film and a metal foil pressed together from top to bottom. .

其中，前述固化片遠離前述膠膜一側的粗糙度為3-10μm，例如3.5μm、4μm、4.5μm、5μm、5.5μm、6μm、6.5μm、7μm、7.5μm、8μm、8.5μm、9μm、9.5μm等。 Wherein, the roughness of the side of the cured film away from the adhesive film is 3-10 μm , such as 3.5 μm , 4 μm , 4.5 μm , 5 μm , 5.5 μm , 6 μm , 6.5 μm , 7 μ m, 7.5 μ m, 8 μ m, 8.5 μ m, 9 μ m, 9.5 μ m, etc.

在本發明中，前述固化片遠離前述膠膜一側係指固化片未與膠膜壓合在一起的表面；固化片共有兩個表面，一面與膠膜進行壓合， 另一面的粗糙度為3-10μm。 In the present invention, the side of the curing sheet far away from the adhesive film refers to the surface of the curing sheet that is not pressed together with the adhesive film; the curing sheet has two surfaces, one side is pressed against the adhesive film, and the roughness of the other side is 3-10 μ m.

區別於先前技術中通常採用的方法為減少某一層的高度或者減少UV膠的用量的方法而言，本發明藉由將固化片的粗糙度(Rz)控制在3-10μm範圍內，可有效地解決UV膠封裝過程中的模組高度超標問題，同時可提高模組與卡片的結合力；原因為：未經粗化處理的固化片表面，其表面能通常較低，UV膠液在材料表面不能有效地擴散鋪開，從而導致UV膠高度超標進而使得整個模組高度超標，而藉由粗化處理以提高材料的表面能，可使得UV膠液在材料表面有效地擴散、滲透、浸潤，不會出現UV膠高度超標的問題。 Different from the method commonly used in the prior art, which is to reduce the height of a certain layer or reduce the amount of UV glue, the present invention controls the roughness (Rz) of the cured sheet within the range of 3-10 μm , Effectively solve the problem of module height exceeding the standard in the UV glue encapsulation process, and at the same time improve the binding force between the module and the card; the reason is: the surface energy of the cured film without roughening treatment is usually low, and the UV glue is The surface of the material cannot be spread and spread effectively, which leads to the UV glue height exceeding the standard and the entire module height exceeding the standard. The roughening treatment can improve the surface energy of the material, which can make the UV glue effectively diffuse, penetrate, and penetrate the surface of the material. Infiltration, there will be no problem of excessive UV glue height.

本發明中固化片的粗糙度在3-10μm範圍內，當粗糙程度小於3μm時，仍會出現UV膠高度超標的問題，而粗糙度過大會出現膠液擴散面積太大，可能會存在露出晶片或金線的風險，同時由於膠液擴散面積過大亦可能會影響附近的線路。 The roughness of the cured sheet in the present invention is in the range of 3-10 μm . When the roughness is less than 3 μm , the problem of the UV glue height exceeding the standard will still occur. There is a risk of exposing the chip or gold wire, and at the same time, due to the excessive spread of the glue liquid, it may also affect the nearby circuits.

理想地，前述固化片兩側的粗糙度均為3-10μm，例如3.5μm、4μm、4.5μm、5μm、5.5μm、6μm、6.5μm、7μm、7.5μm、8μm、8.5μm、9μm、9.5μm等。 Ideally, the roughness on both sides of the aforementioned cured sheet is 3-10 μm , for example, 3.5 μm , 4 μm , 4.5 μm , 5 μm , 5.5 μm , 6 μm , 6.5 μm , 7 μm. m, 7.5 μ m, 8 μ m, 8.5 μ m, 9 μ m, 9.5 μ m, etc.

本發明的一側或兩側可以均進行粗糙度處理，只要確保最後得到之固化片遠離膠膜一側具有3-10μm粗糙度即可。 One side or both sides of the present invention can be treated with roughness, as long as the cured sheet finally obtained has a roughness of 3-10 μm on the side away from the adhesive film.

理想地，前述固化片由半固化黏結片完全固化得到。 Ideally, the aforementioned cured sheet is obtained by completely curing the semi-cured adhesive sheet.

理想地，前述半固化黏結片包含玻璃纖維布以及浸潤於玻璃纖維布上的樹脂組合物。 Ideally, the aforementioned semi-cured adhesive sheet includes a glass fiber cloth and a resin composition impregnated on the glass fiber cloth.

在本發明中，前述玻璃纖維片可以但不限於以下型號： 106、1078、1080、3313、2116等。 In the present invention, the aforementioned glass fiber sheets can be but not limited to the following models: 106, 1078, 1080, 3313, 2116, etc.

理想地，前述樹脂組合物為環氧樹脂組合物。 Ideally, the aforementioned resin composition is an epoxy resin composition.

理想地，前述膠膜包含膠黏劑。 Ideally, the aforementioned adhesive film contains an adhesive.

理想地，前述膠膜及固化片上衝有通孔。 Ideally, through holes are punched in the aforementioned adhesive film and cured sheet.

理想地，前述金屬箔為銅箔。 Ideally, the aforementioned metal foil is copper foil.

理想地，前述銅箔包含壓延銅箔或電解銅箔。 Ideally, the aforementioned copper foil includes rolled copper foil or electrolytic copper foil.

第二態樣，本發明提供一種如第一態樣所述之封裝載帶基材的製備方法，其中，前述製備方法包含如下步驟：(1)將固化片進行粗糙化處理，使其一側的粗糙度為3-10μm(例如3.5μm、4μm、4.5μm、5μm、5.5μm、6μm、6.5μm、7μm、7.5μm、8μm、8.5μm、9μm、9.5μm等)；(2)在固化片另一側依次設置膠膜及金屬箔，得到前述封裝載帶基材。 In a second aspect, the present invention provides a method for preparing a package carrier tape substrate as described in the first aspect, wherein the foregoing preparation method includes the following steps: (1) roughening the cured sheet to make one side The roughness is 3-10 μ m (for example, 3.5 μ m, 4 μ m, 4.5 μ m, 5 μ m, 5.5 μ m, 6 μ m, 6.5 μ m, 7 μ m, 7.5 μ m, 8 μ m , 8.5 μm , 9 μm , 9.5 μm, etc.); (2) An adhesive film and a metal foil are sequentially arranged on the other side of the cured sheet to obtain the aforementioned package carrier tape substrate.

在本發明中，前述粗糙化處理的方式包含噴砂、磨板、機械轉印、電暈或等離子處理中的任意一種或至少兩種的組合，理想為噴砂方式。 In the present invention, the aforementioned roughening treatment method includes any one or a combination of at least two of sandblasting, polishing, mechanical transfer, corona or plasma treatment, and sandblasting is ideal.

噴砂處理的粗糙度控制精度較高，而磨板粗化處理的均勻性相對較差，且容易磨穿，電暈及等離子粗化方式處理的粗糙度通常較低且有一定的時效性，因此本發明理想為噴砂處理。 The roughness control precision of sandblasting treatment is high, while the uniformity of the grinding plate roughening treatment is relatively poor, and it is easy to wear through. The roughness of corona and plasma roughening treatment is usually low and has a certain time effect, so this The ideal invention is sandblasting.

理想地，在步驟(1)中，固化片的兩側均進行粗糙化處理，使其粗糙度各自獨立地為3-10μm，例如3.5μm、4μm、4.5μm、5μm、5.5μm、6μm、6.5μm、7μm、7.5μm、8μm、8.5 μm、9μm、9.5μm等。 Ideally, in step (1), both sides of the cured sheet are roughened so that their roughness is independently 3-10 μm , such as 3.5 μm , 4 μm , 4.5 μm , 5 μm. m, 5.5 μ m, 6 μ m, 6.5 μ m, 7 μ m, 7.5 μ m, 8 μ m, 8.5 μ m, 9 μ m, 9.5 μ m, etc.

理想地，前述固化片的製備方法為：由半固化片在100-250℃(例如120℃、150℃、180℃、200℃、230℃等)下處理0.01-2.5h(例如0.05h、0.1h、0.5h、1h、1.5h、2h等)後得到。 Ideally, the preparation method of the aforementioned cured sheet is: treating the prepreg at 100-250°C (such as 120°C, 150°C, 180°C, 200°C, 230°C, etc.) for 0.01-2.5h (such as 0.05h, 0.1h, etc.) 0.5h, 1h, 1.5h, 2h, etc.).

理想地，在步驟(2)中，藉由熱壓的方式在前述固化片遠離粗糙化處理的一側依次設置膠膜及金屬箔。 Ideally, in step (2), the adhesive film and the metal foil are sequentially arranged on the side of the cured sheet away from the roughening treatment by hot pressing.

理想地，在步驟(2)中，在前述固化片遠離粗糙化處理的一側藉由熱壓的方式設置膠膜後進行衝孔，接著再藉由熱壓的方式設置金屬箔。 Ideally, in step (2), an adhesive film is placed on the side of the cured sheet away from the roughening treatment by hot pressing and then punching is performed, and then the metal foil is placed by hot pressing.

理想地，兩次前述熱壓的溫度各自獨立地為50-150℃，例如80℃、100℃、120℃等，壓力各自獨立地為0.01-1MPa，例如0.05MPa、0.1MPa、0.5MPa、0.8MPa等。 Ideally, the temperature of the two aforementioned hot pressings is each independently 50-150°C, such as 80°C, 100°C, 120°C, etc., and the pressure is each independently 0.01-1MPa, such as 0.05MPa, 0.1MPa, 0.5MPa, 0.8 MPa etc.

步驟(2)中，前述膠膜的設置方式為：在前述固化片上塗布黏合劑後壓合離型膜，前述離型膜在熱壓金屬箔前除去。 In step (2), the aforementioned adhesive film is arranged as follows: after coating the adhesive on the curing sheet, the release film is pressed and the release film is removed before the metal foil is hot pressed.

作為本發明理想的技術手段，前述製備方法包含如下步驟：(1)由半固化片在100-250℃下處理0.01-2.5h後得到固化片，接著將固化片藉由噴砂、磨板、機械轉印、電暈或等離子處理中的任意一種或至少兩種的組合的處理方式進行粗糙化處理，使其兩側的粗糙度為3-10μm；(2)在固化片一側塗布黏合劑後熱壓離型膜，接著進行衝孔，去掉離型膜後再藉由熱壓的方式設置金屬箔，得到前述封裝載帶基材，其中兩 次前述熱壓的溫度各自獨立地為50-150℃，壓力各自獨立地為0.01-1MPa。 As an ideal technical means of the present invention, the aforementioned preparation method includes the following steps: (1) A cured sheet is obtained after processing the prepreg at 100-250°C for 0.01-2.5h, and then the cured sheet is sandblasted, polished, and mechanically transferred. , Corona or plasma treatment, or a combination of at least two treatments, roughen the roughness on both sides of it to 3-10 μm ; (2) After coating the adhesive on one side of the cured sheet The release film is hot pressed, then punched, the release film is removed and then the metal foil is placed by hot pressing to obtain the aforementioned package carrier tape substrate, wherein the temperature of the two hot pressings is independently 50-150 °C, the pressure is each independently 0.01-1 MPa.

相對於先前技術，本發明具有以下功效：將固化片的粗糙度(Rz)控制在3-10μm範圍內，可有效地解決UV膠封裝過程中的模組高度超標問題，同時可提高模組與卡片的結合力；利用本發明提供的封裝載帶基材使UV膠高度在500-580μm範圍內，能夠充分地滿足應用要求，最後模組與卡片的結合力在90N以上，亦可滿足模組與卡片的結合要求。 Compared with the prior art, the present invention has the following effects: the roughness (Rz) of the cured film is controlled in the range of 3-10 μm , which can effectively solve the problem of module height exceeding the standard in the UV glue packaging process, and can improve the mold The binding force between the group and the card; using the packaging carrier tape substrate provided by the present invention to make the UV glue height in the range of 500-580 μm , which can fully meet the application requirements, the final binding force between the module and the card is above 90N, which is also It can meet the combination requirements of modules and cards.

以下藉由具體實施方式來進一步說明本發明的技術手段。所屬技術領域中具有通常知識者應該明瞭，前述實施例僅是幫助理解本發明，不應視為對本發明的具體限制。 The technical means of the present invention will be further explained by specific embodiments below. Those with ordinary knowledge in the technical field should understand that the foregoing embodiments are only to help understand the present invention and should not be regarded as specific limitations to the present invention.

實施例1 Example 1

一種封裝載帶基材，製備方法如下：(1)先用環氧樹脂組合物，在上膠機上將106型號玻璃纖維布浸漬，接著經過上膠機的烘箱得到半固化黏結片，接著將半固化黏結片在190℃烘烤1.5h得到固化片，接著對固化片進行噴砂粗化處理，控制其兩側的粗糙度Rz值均為3μm；(2)在固化片一側塗布黏合劑後熱壓(50℃/1MPa)離型膜，接著 進行衝孔，去掉離型膜後再藉由熱壓(150℃/0.01MPa)的方式設置金屬箔，得到封裝載帶基材。 A packaging carrier tape substrate, the preparation method is as follows: (1) First, with epoxy resin composition, dipping 106 model glass fiber cloth on the gluing machine, and then passing through the oven of the gluing machine to obtain a semi-cured adhesive sheet, and then The semi-cured adhesive sheet was baked at 190°C for 1.5 hours to obtain a cured sheet, and then the cured sheet was sandblasted and roughened to control the roughness Rz value of both sides to be 3 μm ; (2) Coating and bonding on one side of the cured sheet After the preparation, the release film is hot pressed (50°C/1MPa), and then punched. After the release film is removed, the metal foil is set by hot pressing (150°C/0.01MPa) to obtain the package carrier tape substrate.

實施例2 Example 2

一種封裝載帶基材，製備方法如下：(1)先用環氧樹脂組合物，在上膠機上將1080型號玻璃纖維布浸漬，接著經過上膠機的烘箱得到半固化黏結片，接著將半固化黏結片在200℃烘烤1h得到固化片，接著對固化片進行噴砂粗化處理，控制其兩側的粗糙度Rz值均為6.5μm；(2)在固化片一側塗布黏合劑後熱壓(100℃/0.3MPa)離型膜，接著進行衝孔，去掉離型膜後再藉由熱壓(150℃/0.01MPa)的方式設置金屬箔，得到封裝載帶基材。 A packaging carrier tape substrate. The preparation method is as follows: (1) Firstly, with epoxy resin composition, impregnate the 1080 model glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a semi-cured adhesive sheet, and then The semi-cured adhesive sheet was baked at 200°C for 1 hour to obtain a cured sheet, and then the cured sheet was sandblasted and roughened to control the roughness Rz value of both sides to be 6.5 μm ; (2) Coating adhesive on one side of the cured sheet After hot pressing (100°C/0.3MPa) the release film, then punching, remove the release film, and then set the metal foil by hot pressing (150°C/0.01MPa) to obtain the package carrier tape substrate.

實施例3 Example 3

一種封裝載帶基材，製備方法如下：(1)先用環氧樹脂組合物，在上膠機上將2116型號玻璃纖維布浸漬，接著經過上膠機的烘箱得到半固化黏結片，接著將半固化黏結片在100℃烘烤2.5h得到固化片，接著對固化片進行噴砂粗化處理，控制其一側的粗糙度Rz值為10μm；(2)在固化片另一側塗布黏合劑後熱壓(80℃/0.5MPa)離型膜，接著進行衝孔，去掉離型膜後再藉由熱壓(90℃/0.4MPa)的方式設置金屬箔，得到封裝載帶基材。 A packaging carrier tape substrate, the preparation method is as follows: (1) First, use epoxy resin composition, impregnate 2116 model glass fiber cloth on the gluing machine, and then pass through the oven of the gluing machine to obtain a semi-cured adhesive sheet, and then The semi-cured adhesive sheet was baked at 100°C for 2.5 hours to obtain a cured sheet, and then the cured sheet was sandblasted and roughened to control the roughness Rz value of one side to 10 μm ; (2) Coating and bonding on the other side of the cured sheet After the preparation, the release film is hot pressed (80°C/0.5MPa), and then punched. After the release film is removed, the metal foil is set by hot pressing (90°C/0.4MPa) to obtain the package carrier tape substrate.

實施例4 Example 4

一種封裝載帶基材，製備方法如下： (1)先用環氧樹脂組合物，在上膠機上將2116型號玻璃纖維布浸漬，接著經過上膠機的烘箱得到半固化黏結片，接著將半固化黏結片在250℃烘烤0.01h得到固化片，接著對固化片的一側進行等離子粗化處理，控制粗糙度Rz值為3.5μm；(2)在固化片另一側塗布黏合劑後熱壓(100℃/0.3MPa)離型膜，接著進行衝孔，去掉離型膜後再藉由熱壓(100℃/0.3MPa)的方式設置金屬箔，得到封裝載帶基材。 A packaging carrier tape substrate, the preparation method is as follows: (1) First use epoxy resin composition, impregnate the 2116 model glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain the semi-cured adhesive sheet, and then The semi-cured adhesive sheet is baked at 250°C for 0.01h to obtain a cured sheet, and then plasma roughening is performed on one side of the cured sheet to control the roughness Rz value to 3.5 μm ; (2) Coating adhesive on the other side of the cured sheet After hot pressing (100°C/0.3MPa) the release film, then punching, remove the release film, and then set the metal foil by hot pressing (100°C/0.3MPa) to obtain the package carrier tape substrate.

實施例5 Example 5

一種封裝載帶基材，製備方法如下：(1)先用環氧樹脂組合物，在上膠機上將2116型號玻璃纖維布浸漬，接著經過上膠機的烘箱得到半固化黏結片，接著將半固化黏結片在180。℃烘烤2h得到固化片，接著對固化片的一側進行磨板粗化處理，控制粗糙度Rz值為7μm；(2)在固化片另一側塗布黏合劑後熱壓(80℃/0.5MPa)離型膜，接著進行衝孔，去掉離型膜後再藉由熱壓(80℃/0.5MPa)的方式設置金屬箔，得到封裝載帶基材。 A packaging carrier tape substrate, the preparation method is as follows: (1) First, use epoxy resin composition, impregnate 2116 model glass fiber cloth on the gluing machine, and then pass through the oven of the gluing machine to obtain a semi-cured adhesive sheet, and then Semi-cured adhesive sheet in 180. Bake at ℃ for 2h to obtain a cured sheet, and then roughen one side of the cured sheet to control the roughness Rz value to 7 μm ; (2) Apply adhesive on the other side of the cured sheet and press (80°C) /0.5MPa) release film, followed by punching, after removing the release film, set the metal foil by hot pressing (80°C/0.5MPa) to obtain the package carrier tape substrate.

實施例6-7 Example 6-7

與實施例1的區別僅在於，在本實施例中，粗糙化處理的方式為電暈的方式(實施例6)、機械轉印的方式(實施例7)。 The only difference from Example 1 is that in this example, the method of roughening treatment is a corona method (Example 6) and a mechanical transfer method (Example 7).

對比例1 Comparative example 1

與實施例2的區別僅在於，在本對比例中，不進行粗糙化處理，固化片本身的粗糙度Rz為2μm。 The only difference from Example 2 is that in this comparative example, no roughening treatment is performed, and the roughness Rz of the cured sheet itself is 2 μm .

對比例2 Comparative example 2

與實施例3的區別僅在於，在本對比例中，經過噴砂處理後，固化片的粗糙度為12μm。 The only difference from Example 3 is that, in this comparative example, the roughness of the cured sheet is 12 μm after sandblasting.

性能測試： Performance Testing:

對實施例1-7及對比例1-2提供的封裝載帶基材進行性能測試，方法如下：(1)UV膠高度：利用千分尺進行測量；(2)模組與卡片的結合力：對利用封裝載帶基材製備好的卡片進行處理，將卡片背面挖空，露出模組，使用推力機反向推出模組，記錄其推力即為模組與卡片的結合力。 The performance test of the packaging carrier tape substrates provided in Examples 1-7 and Comparative Examples 1-2 is as follows: (1) UV glue height: measured with a micrometer; (2) module and card binding force: right The card prepared by the packaging carrier tape substrate is used for processing, the back of the card is hollowed out to expose the module, and the module is pushed out by a thrust machine, and the thrust is recorded as the binding force between the module and the card.

對實施例及對比例的測試結果見表1。 The test results of the examples and comparative examples are shown in Table 1.

Figure 108111772-A0202-12-0009-2
Figure 108111772-A0202-12-0009-2
Figure 108111772-A0202-12-0010-3
Figure 108111772-A0202-12-0010-3

在實際應用過程中，要求UV膠的高度滿足500-580μm的應用要求，且模組與卡片的結合力必須大於90N。 In the actual application process, the height of the UV glue is required to meet the application requirements of 500-580 μm , and the binding force between the module and the card must be greater than 90N.

由實施例及性能測試可知，利用本發明提供的封裝載帶基材使UV膠高度在500-580μm範圍內，能夠充分地滿足應用要求，模組與卡片的結合力在90N以上，亦可滿足模組與卡片的結合要求。 It can be seen from the examples and performance tests that the UV glue height is within the range of 500-580 μm by using the packaging carrier tape substrate provided by the present invention, which can fully meet the application requirements, and the binding force between the module and the card is above 90N, which is also It can meet the combination requirements of modules and cards.

在實施例4及6中，雖然等離子處理及電暈處理均能滿足應用要求，但在實際應用過程中，粗糙度以及表面能保持具有時效性，通常僅能保持一周左右；而在實施例5及7中，雖然UV膠的高度以及模組與卡片的結合力可以滿足應用要求，但實際固化片上有個別點被磨穿，因此，由實施例1及實施例4-7的對比可知，在本發明中，理想為噴砂的粗糙化處理方式，在相同粗糙度情況下，噴砂處理方式結合力更好，控制精度較高，而其他物理處理方式均勻性較差，有磨穿固化片的風險，而其他化學法處理方式得到的粗糙度通常較低且具有一定的時效性。 In Examples 4 and 6, although both plasma treatment and corona treatment can meet the application requirements, in the actual application process, the roughness and surface energy are maintained with timeliness, usually only for about one week; and in Example 5 In and 7, although the height of the UV glue and the binding force between the module and the card can meet the application requirements, there are individual points on the actual cured film that are worn through. Therefore, from the comparison of Examples 1 and 4-7, it can be seen that In the present invention, the ideal sandblasting roughening treatment method, under the same roughness, the sandblasting treatment method has better binding force and higher control accuracy, while other physical treatment methods have poor uniformity and risk of wearing through the cured film. The roughness obtained by other chemical treatment methods is usually low and has a certain time effect.

由實施例1及對比例1-2的對比可知，本發明中的固化片的粗糙度在3-10μm範圍內時，始足以充分地滿足應用要求。 From the comparison of Example 1 and Comparative Examples 1-2, it can be seen that when the roughness of the cured sheet of the present invention is in the range of 3-10 μm , it is sufficient to fully meet the application requirements.

申請人聲明，本發明藉由上述實施例來說明本發明的封裝載帶基材及其製備方法，但本發明並不局限於上述詳細方法，即不意味著本發明必須依賴上述詳細方法始得以實施。所屬技術領域中具有通常知識者應該明瞭，對本發明的任何改進，對本發明產品各原料的等效替換及輔助成分的添加、具體方式的選擇等，均落在本發明的保護範圍及公開範圍之內。 The applicant declares that the present invention uses the above-mentioned embodiments to illustrate the package carrier tape substrate of the present invention and its preparation method, but the present invention is not limited to the above detailed method, which does not mean that the present invention must rely on the above detailed method to be able to achieve Implement. Those with ordinary knowledge in the technical field should understand that any improvement to the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc., fall within the scope of protection and disclosure of the present invention. Inside.

Claims (17)

一種封裝載帶基材，其特徵係，由上至下依次包含壓合在一起的固化片、膠膜及金屬箔；其中，前述固化片遠離前述膠膜一側的粗糙度為3-10μm。 A packaging carrier tape substrate, which is characterized by comprising a cured sheet, an adhesive film and a metal foil pressed together from top to bottom; wherein the roughness of the side of the curing sheet away from the adhesive film is 3-10 μ m. 如申請專利範圍第1項所記載之封裝載帶基材，其中，前述固化片由半固化黏結片完全固化得到。 The packaging carrier tape substrate described in item 1 of the scope of the patent application, wherein the cured sheet is obtained by completely curing the semi-cured adhesive sheet. 如申請專利範圍第2項所記載之封裝載帶基材，其中，前述半固化黏結片包含玻璃纖維布以及浸潤於玻璃纖維布上的樹脂組合物。 The packaging carrier tape substrate described in the second item of the scope of patent application, wherein the semi-cured adhesive sheet includes a glass fiber cloth and a resin composition impregnated on the glass fiber cloth. 如申請專利範圍第3項所記載之封裝載帶基材，其中，前述樹脂組合物為環氧樹脂組合物。 The packaging carrier tape substrate as described in item 3 of the scope of patent application, wherein the aforementioned resin composition is an epoxy resin composition. 如申請專利範圍第1至4項中任一項所記載之封裝載帶基材，其中，前述膠膜包含膠黏劑。 The packaging carrier tape substrate described in any one of items 1 to 4 in the scope of patent application, wherein the aforementioned adhesive film contains an adhesive. 如申請專利範圍第1至4項中任一項所記載之封裝載帶基材，其中，前述膠膜及固化片上衝有通孔。 Such as the packaging carrier tape substrate described in any one of items 1 to 4 in the scope of the patent application, wherein the adhesive film and the cured sheet are punched with through holes. 如申請專利範圍第1至4項中任一項所記載之封裝載帶基材，其中，前述金屬箔為銅箔。 The packaging carrier tape substrate as described in any one of the first to fourth items of the patent application, wherein the aforementioned metal foil is copper foil. 如申請專利範圍第7項所記載之封裝載帶基材，其中，前述銅箔包含壓延銅箔或電解銅箔。 The package carrier tape substrate as described in claim 7 wherein the copper foil includes rolled copper foil or electrolytic copper foil. 如申請專利範圍第1至8項中任一項所記載之封裝載帶基材的製備方法，其中，前述製備方法包含如下步驟：(1)將固化片進行粗糙化處理，使其一側的粗糙度為3-10μm； (2)在固化片另一側依次設置膠膜及金屬箔，得到前述封裝載帶基材。 As described in any one of items 1 to 8 of the scope of patent application, the method for preparing a substrate for packaging carrier tape, wherein the foregoing preparation method comprises the following steps: (1) roughening the cured sheet to make one side The roughness is 3-10 μm ; (2) An adhesive film and a metal foil are sequentially arranged on the other side of the cured sheet to obtain the aforementioned package carrier tape substrate. 如申請專利範圍第9項所記載之製備方法，其中，前述粗糙化處理的方式包含噴砂、磨板、機械轉印、電暈或等離子處理中的任意一種或至少兩種的組合。 The preparation method described in item 9 of the scope of patent application, wherein the aforementioned roughening treatment method includes any one or a combination of at least two of sandblasting, polishing, mechanical transfer, corona or plasma treatment. 如申請專利範圍第9或10項所記載之製備方法，其中，在步驟(1)中，固化片的兩側均進行粗糙化處理，使其粗糙度各自獨立地為3-10μm。 As the preparation method described in item 9 or 10 of the scope of patent application, wherein in step (1), both sides of the cured sheet are roughened so that their roughness is independently 3-10 μm. 如申請專利範圍第9或10項所記載之製備方法，其中，前述固化片的製備方法為：由半固化黏結片在100-250℃下處理0.01-2.5h後得到。 The preparation method described in item 9 or 10 of the scope of patent application, wherein the preparation method of the aforementioned cured sheet is obtained by treating the semi-cured adhesive sheet at 100-250° C. for 0.01-2.5 h. 如申請專利範圍第9或10項所記載之製備方法，其中，在步驟(2)中，藉由熱壓的方式在前述固化片遠離粗糙化處理的一側依次設置膠膜及金屬箔。 The preparation method as described in item 9 or 10 of the scope of patent application, wherein in step (2), the adhesive film and the metal foil are sequentially arranged on the side of the cured sheet away from the roughening treatment by hot pressing. 如申請專利範圍第13項所記載之製備方法，其中，在前述固化片遠離粗糙化處理的一側藉由熱壓的方式設置膠膜後進行衝孔，接著再藉由熱壓的方式設置金屬箔。 The preparation method as described in item 13 of the scope of patent application, wherein, the side of the cured sheet away from the roughening treatment is provided by hot pressing and then punching is performed, and then the metal is disposed by hot pressing Foil. 如申請專利範圍第14項所記載之製備方法，其中，兩次前述熱壓的溫度各自獨立地為50-150℃，壓力各自獨立地為0.01-1MPa。 The preparation method as described in item 14 of the scope of patent application, wherein the temperature of the two aforementioned hot pressings are each independently 50-150°C, and the pressure is each independently 0.01-1 MPa. 如申請專利範圍第9或10項所記載之製備方法，其中，步驟(2)中，前述膠膜的設置方式為：在前述固化片上塗布黏合劑後壓合離型膜，前述離型膜在熱壓金屬箔前除去。 As the preparation method described in item 9 or 10 of the scope of the patent application, in step (2), the above-mentioned adhesive film is arranged as follows: the adhesive is coated on the curing sheet and then the release film is pressed, and the release film is Remove the metal foil before hot pressing. 如申請專利範圍第9或10項所記載之製備方法，其中，前述製備方法包含如下步驟：(1)由半固化黏結片在100-250℃下處理0.01-2.5h後得到固化片，接著將固化片藉由噴砂、磨板、機械轉印、電暈或等離子處理中的任意一種或至少兩種的組合的處理方式進行粗糙化處理，使其兩側的粗糙度為3-10μm；(2)在固化片一側塗布黏合劑後熱壓離型膜，接著進行衝孔，除去離型膜後再藉由熱壓的方式設置金屬箔，得到前述封裝載帶基材，其中兩次前述熱壓的溫度各自獨立地為50-150℃，壓力各自獨立地為0.01-1MPa。 As the preparation method described in item 9 or 10 of the scope of patent application, the aforementioned preparation method includes the following steps: (1) A cured sheet is obtained after a semi-cured adhesive sheet is processed at 100-250°C for 0.01-2.5h, and then The cured film is roughened by any one or a combination of at least two of sandblasting, grinding, mechanical transfer, corona or plasma treatment, so that the roughness on both sides is 3-10 μm ; (2) After coating the adhesive on one side of the cured sheet, the release film is hot pressed, and then punched, the release film is removed, and the metal foil is set by hot pressing to obtain the aforementioned package carrier tape substrate. The temperature of the aforementioned hot pressing is each independently 50-150°C, and the pressure is each independently 0.01-1 MPa.
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