CN110690126A - Method for resisting bending of substrate and packaging process of filter product - Google Patents
Method for resisting bending of substrate and packaging process of filter product Download PDFInfo
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- CN110690126A CN110690126A CN201910918948.8A CN201910918948A CN110690126A CN 110690126 A CN110690126 A CN 110690126A CN 201910918948 A CN201910918948 A CN 201910918948A CN 110690126 A CN110690126 A CN 110690126A
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- substrate
- transparent carrier
- glue
- baking
- filter product
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- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000012858 packaging process Methods 0.000 title claims abstract description 27
- 238000005452 bending Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000004033 plastic Substances 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000002834 transmittance Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for resisting bending of a substrate, which comprises the following steps: pretreatment before baking: the back surface of the substrate is adhered to the transparent carrier through UV glue; baking the substrate adhered with the transparent carrier; ultraviolet light irradiation: the substrate is placed under ultraviolet light for irradiation, so that the UV glue is cured; stripping: the UV glue and the transparent carrier were peeled off from the substrate. The invention also discloses a packaging process of the filter product, which comprises the following steps: plastic package, pretreatment before baking, substrate film pasting, ultraviolet irradiation, stripping and cutting. The invention can prevent the problem of overlarge substrate warpage in the packaging process, thereby avoiding yield loss and potential quality problems of subsequent packaging procedures.
Description
Technical Field
The present invention relates to the field of filter product packaging technology, and more particularly, to a method for resisting substrate bending and a filter product packaging process.
Background
In the conventional semiconductor packaging process, the substrate used in the packaging process is warped under the heating and pressing conditions of different process steps, and the warping phenomenon is mainly caused by the difference of the thermal expansion coefficients of various materials in the whole package. For the packaging of filter products, the process flow is similar to that of other products, but the packaging process is different.
In the conventional packaging, a cavity is not required to be formed on the chip generally, so that the chip can be subjected to plastic packaging in an injection molding mode during the plastic packaging, the temperature can reach about 175 ℃, and the pressure can reach about 80 tons. The filter product needs to form a cavity in the packaging process for sound wave transmission, so that the traditional injection molding plastic packaging process cannot be used, and finally, the product plastic packaging is carried out by using a preformed resin film and applying a vacuum laminating process, and the cavity is formed on the chip in the process.
The traditional filter product packaging comprises the following main process steps: plastic packaging, namely performing plastic packaging on a filter product on the substrate by using a preformed resin film through a vacuum laminating process; baking, namely putting the substrate subjected to plastic packaging into an oven, baking and curing, wherein in the baking process, the temperature can reach 150-180 ℃, the heated product is deformed and bent due to inconsistent thermal expansion between the product structure and each material, and the deformation and bending amount of the substrate can reach 5-20 mm; the substrate is adhered with a film, the substrate is fixedly adsorbed on a vacuum workbench, a cutting adhesive tape is adhered to one surface of a filter product, the periphery of the cutting adhesive tape is adhered to an iron ring, so that the product can be carried by the iron ring to avoid direct contact with the product, if the deformation and the bending of the baked substrate are large (particularly exceeding 5 mm), the vacuum workbench of an adhering machine cannot well fix the filter product, the film can be displaced during adhering, and air bubbles exist between the filter product and the cutting adhesive tape, so that the yield loss and even the quality problem in the packaging process are caused; and cutting, namely cutting the substrate after film pasting by using a wheel cutter or laser, and dividing the single filter product on the substrate into independent individuals.
The vacuum laminating process can complete plastic package of products under the conditions of low temperature (40-90 ℃) and low pressure (1-10 kilograms). Due to the special structural requirements of the product, in a packaging process after the product is packaged in a plastic package, for example, the product is baked after being packaged in the plastic package, the temperature of a baking process after the product is packaged in the plastic package can reach 150-180 ℃, and the product is heated and is easy to deform and bend due to inconsistent thermal expansion between the product structure and various materials.
The substrate warping too much may cause the vacuum platform to be unable to suck in the subsequent steps; or if the adhesive tape is barely absorbed, air bubbles may be generated between the substrate and the dicing tape, which may affect the post-process operation, cause yield loss and potential quality problems during the packaging process, and even cause the packaging process to be inoperable.
There are several methods in the industry to reduce substrate warpage, such as increasing substrate core thickness, balancing the distribution and specific gravity of the metal in each layer of the substrate, and using various magnetic or non-magnetic metal carriers to reduce and prevent substrate warpage during the packaging process. However, due to the special structure of the filter product, the conventional existing methods and tools for reducing and preventing substrate warpage are not suitable for packaging the filter product.
Therefore, the inventor customizes the packaging process of the current filter product, fully considers the practical situation in the packaging process, develops a method for resisting the bending of the substrate and the packaging process of the filter product, and the method can be popularized in the packaging process of other products.
Disclosure of Invention
The present invention is directed to a method for preventing substrate warpage, which can prevent the substrate from warping too much during the packaging process, thereby avoiding yield loss and potential quality problems in the subsequent packaging process.
In order to solve the technical problems, the technical solution of the invention is as follows:
a method of resisting bending of a substrate, comprising: pretreatment before baking: the back surface of the substrate is adhered to the transparent carrier through UV glue; baking the substrate adhered with the transparent carrier; ultraviolet light irradiation: the substrate is placed under ultraviolet light for irradiation, so that the UV glue is cured; stripping: the UV glue and the transparent carrier were peeled off from the substrate.
Further, the transparent carrier is prepared from an organic resin material, and the light transmittance of the transparent carrier is greater than or equal to 80%.
Furthermore, the thickness of the transparent carrier is 1-5 mm.
Further, the thickness of UV glue is 5 ~ 50 um.
A plastic package process of a filter product comprises the following steps: plastic package, pretreatment before baking, substrate film pasting, ultraviolet irradiation, stripping and cutting; the method comprises the following specific steps:
step (1), plastic package: carrying out plastic package on a filter product on the substrate;
step (2), pretreatment before baking: the substrate after being molded is pasted on the transparent carrier through UV glue;
step (3), baking: baking the substrate pretreated before baking;
step (4), substrate film pasting: the plastic package surface of the filter product is attached to the cutting adhesive tape at a fixed position;
step (5), ultraviolet irradiation: irradiating the substrate under ultraviolet light, wherein the ultraviolet light penetrates through the transparent carrier to enable the UV glue to be cured;
step (6), stripping: peeling the UV glue and the transparent carrier from the substrate:
step (7), cutting: and cutting the substrate.
Further, in the step (2), the transparent carrier is prepared from an organic resin material.
Further, in the step (2), the thickness of the transparent carrier is 1-5 mm.
Further, in the step (2), the thickness of the UV glue is 5-50 um.
Further, in the step (4), an iron ring is further included, and the periphery of the cutting adhesive tape is attached to the iron ring.
Further, in the step (2), the light transmittance of the transparent carrier is greater than or equal to 80%.
After the scheme is adopted, the packaging process of the current filter product is customized, so that the actual conditions of baking and heating, substrate film sticking, carrier peeling and the like in the packaging process are fully considered, and a foundation is laid for the smooth follow-up process. The invention has the following advantages:
1. by adopting the method, the warping of the substrate can be effectively limited and prevented, and the substrate can be deformed and bent to be less than 3 mm;
2. the transparent carrier can be recycled and reused after being stripped from the substrate, thereby not only reducing the production cost, but also meeting the requirements of environmental protection.
Drawings
FIG. 1 is a schematic flow diagram of a method of resisting substrate bowing;
FIG. 2 is a schematic view of a substrate attached to a transparent carrier by UV glue;
fig. 3 is a schematic flow chart of a plastic packaging process of a filter product.
Description of the reference symbols
The plastic sealing surface 41 of the filter product 4.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples. The present invention discloses a method for resisting substrate bending during a baking process of a substrate, as shown in FIG. 1, comprising the following steps: pretreatment before baking: the back surface of the substrate 3 is adhered to the transparent carrier 1 through the UV glue 2; the substrate 3 and the transparent carrier 1 are baked together. Ultraviolet light irradiation: the substrate 3 is placed under ultraviolet light, which passes through the transparent carrier 1, so that the UV glue 2 is cured. Stripping: the UV paste 2 and the transparent carrier 1 were peeled off from the substrate 3, and the transparent carrier 1 was recovered.
The method can effectively avoid the bending deformation of the substrate 3 in the packaging process by adding three steps of pretreatment before baking, ultraviolet irradiation and stripping. As shown in fig. 2, a filter product 4 is disposed on a substrate 3, a transparent carrier 1 is attached to a substrate surface 31 of the substrate 3 through a UV adhesive 2, the transparent carrier 1 is fixed on the substrate 3, the substrate 3 is maintained at a smaller warpage by high-temperature baking after plastic encapsulation, and is attached to a dicing tape along with the substrate 3, and the transparent carrier 1 is peeled off from the substrate 3 before a dicing process and recycled.
In this embodiment, the UV glue 2 (ultraviolet light curing glue) has the characteristics of high temperature resistance and static electricity resistance. In the process of baking the substrate 3 and the transparent carrier 1 which are adhered by the UV adhesive 2 together, the baking temperature can reach 150-180 ℃, the UV adhesive 2 has the characteristic of high temperature resistance, and has good cohesiveness at the temperature of 150-200 ℃, so that the reliable adhesion between the transparent carrier 1 and the substrate 3 is ensured. The UV glue 2 may be purchased directly from a commercial source, for example, from the japanese gulf river electrical products.
Further, the transparent carrier 1 is made of an organic resin material having characteristics of bending resistance, high temperature resistance, and static electricity resistance. For example, high molecular weight polymers such as epoxy resins and acrylic resins. Of course, the transparent carrier 1 may be made of other materials as long as they satisfy the characteristics of bending resistance, high temperature resistance and static electricity resistance, which are not described herein.
Further, the light transmittance of the transparent carrier 1 is greater than or equal to 80%, so that the ultraviolet light can pass through the transparent carrier 1 in the subsequent process.
Further, the thickness of the transparent carrier 1 is 1-5 mm. The thickness of the transparent carrier 1 is too thin to resist the deformation and bending of the substrate 3, and the thickness of the transparent carrier 1 is too thick, which causes inconvenience to the subsequent substrate film-attaching process.
Further, the thickness of UV glue 2 is 5 ~ 50 um. The UV glue 2 is too thin to have sufficient adhesion and thus the transparent carrier 1 cannot be fixed on the substrate 3. The thickness of the UV adhesive 2 is too thick, so that the UV adhesive 2 is not easy to completely react, and is not beneficial to the subsequent stripping process.
As shown in fig. 3, a plastic package process of a filter product includes the following steps: plastic package, pretreatment before baking, substrate film pasting, ultraviolet irradiation, stripping and cutting; the method comprises the following specific steps.
Step (1), plastic package: and (3) performing plastic packaging on the filter product 4 on the substrate 3 by using a preformed resin film and applying a vacuum laminating process.
Step (2), pretreatment before baking: the substrate 3 after being molded is adhered to the transparent carrier 1 through the UV glue 2, and the transparent carrier 1 is positioned on the substrate surface 31 of the substrate 3.
Step (3), baking: baking the substrate 3 pretreated before baking; in the baking process, because the UV glue 2 has good adhesion, when the substrate 3 is bent due to baking, the transparent carrier 1 can effectively inhibit the substrate 3 from bending, and the substrate 3 is controlled to maintain a smaller warpage.
Step (4), substrate film pasting: the plastic cover 41 (the other side of the substrate surface 31 with respect to the substrate 3) of the filter product 4 is attached to the dicing tape at a fixed position on the vacuum table.
Step (5), ultraviolet irradiation: and (3) placing the substrate 3 in a UV glue-dissolving machine, and irradiating under ultraviolet light with proper dosage, wherein the ultraviolet light penetrates through the transparent carrier 1, so that the UV glue 2 is cured.
Step (6), stripping: the transparent carrier 1 is peeled off from the substrate 3 by an external force, and the transparent carrier 1 is recovered so that the transparent carrier 1 can be reused at the next production.
Step (7), cutting: and cutting the substrate 3 by using a wheel cutter or laser, and dividing the single filter product 4 on the substrate 3 into independent individuals.
Further, the transparent carrier 1 is made of a high temperature resistant and antistatic organic resin material.
Further, the thickness of the transparent carrier 1 is 1-5 mm.
Further, the thickness of UV glue 2 is 5 ~ 50 um.
Further, in the step (4), an iron ring is further included, and the periphery of the cutting adhesive tape is attached to the iron ring, so that the product can be carried by the iron ring to avoid direct contact with the product.
Further, in the step (2), the light transmittance of the transparent carrier 1 is not less than 80%.
The transparent carrier 1 can be followed filter product 4 and toasted and the base plate pad pasting process together, in toasting the process, because there is transparent carrier 1's existence, can effectively restrain the crooked deformation of base plate 3 (being filter product 4 nearly no warpage's phenomenon promptly), if the crooked great (especially exceed 5 mm) of deformation of base plate 3, the vacuum table of pad pasting machine may leak the vacuum, fixed filter product 4 that can not be fine, the displacement can produce during the pad pasting, and there is the bubble between filter product 4 and the cutting sticky tape, thereby influence the subsequent handling, cause the yield loss of cutting process in the packaging process, even quality problems. The method can effectively limit and prevent the substrate 3 from warping, can ensure that the substrate 3 deforms and bends less than 3mm, namely ensures that the filter product 4 does not deform and bend, and is beneficial to smoothly finishing the substrate film pasting process. After the substrate lamination process is completed and the filter product 4 has been fixed, the transparent carrier 1 is removed from the substrate 3. Then, the filter product 4 enters a cutting process along with the iron ring and the cutting tape, and a normal cutting process is performed.
While the invention has been described with reference to specific preferred embodiments, it is not intended to limit the design of the invention, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method of resisting substrate bowing, comprising: the method comprises the following steps: pretreatment before baking: the back surface of the substrate is adhered to the transparent carrier through UV glue; baking the substrate adhered with the transparent carrier; ultraviolet light irradiation: the substrate is placed under ultraviolet light for irradiation, so that the UV glue is cured; stripping: the UV glue and the transparent carrier were peeled off from the substrate.
2. A method of resisting bending of a substrate as recited in claim 1, wherein: the transparent carrier is prepared from an organic resin material, and the light transmittance of the transparent carrier is more than or equal to 80%.
3. A method of resisting bending of a substrate as recited in claim 1, wherein: the thickness of the transparent carrier is 1-5 mm.
4. A method of resisting bending of a substrate as recited in claim 1, wherein: the thickness of the UV glue is 5-50 um.
5. A packaging process of a filter product is characterized in that: the method comprises the following steps: plastic package, pretreatment before baking, substrate film pasting, ultraviolet irradiation, stripping and cutting; the method comprises the following specific steps:
step (1), plastic package: carrying out plastic package on a filter product on the substrate;
step (2), pretreatment before baking: the substrate after being molded is pasted on the transparent carrier through UV glue;
step (3), baking: baking the substrate pretreated before baking;
step (4), substrate film pasting: the plastic package surface of the filter product is attached to the cutting adhesive tape at a fixed position;
step (5), ultraviolet irradiation: irradiating the substrate under ultraviolet light, wherein the ultraviolet light penetrates through the transparent carrier to enable the UV glue to be cured;
step (6), stripping: peeling the UV glue and the transparent carrier from the substrate:
step (7), cutting: and cutting the substrate.
6. The process of claim 5, further comprising: in the step (2), the transparent carrier is prepared from an organic resin material.
7. The process of claim 5, further comprising: in the step (2), the thickness of the transparent carrier is 1-5 mm.
8. The process of claim 5, further comprising: in the step (2), the thickness of the UV glue is 5-50 um.
9. The process of claim 5, further comprising: in the step (4), an iron ring is further included, and the periphery of the cutting adhesive tape is attached to the iron ring.
10. The process of claim 5, further comprising: in the step (2), the light transmittance of the transparent carrier is greater than or equal to 80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910918948.8A CN110690126A (en) | 2019-09-26 | 2019-09-26 | Method for resisting bending of substrate and packaging process of filter product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910918948.8A CN110690126A (en) | 2019-09-26 | 2019-09-26 | Method for resisting bending of substrate and packaging process of filter product |
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| CN110690126A true CN110690126A (en) | 2020-01-14 |
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| CN201910918948.8A Pending CN110690126A (en) | 2019-09-26 | 2019-09-26 | Method for resisting bending of substrate and packaging process of filter product |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102134452A (en) * | 2009-12-16 | 2011-07-27 | 日东电工株式会社 | Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet |
| CN103021880A (en) * | 2011-09-22 | 2013-04-03 | 株式会社东芝 | Manufacture method for semiconductor device |
| CN105118788A (en) * | 2011-09-27 | 2015-12-02 | 台湾积体电路制造股份有限公司 | Method for three dimensional integrated circuit fabrication |
| CN106373896A (en) * | 2015-07-24 | 2017-02-01 | 南茂科技股份有限公司 | Chip packaging process and chip package |
| CN109666415A (en) * | 2018-12-29 | 2019-04-23 | 络派科技(深圳)有限公司 | A kind of UV adhesive tape for electronic equipment heating removing |
-
2019
- 2019-09-26 CN CN201910918948.8A patent/CN110690126A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102134452A (en) * | 2009-12-16 | 2011-07-27 | 日东电工株式会社 | Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet |
| CN103021880A (en) * | 2011-09-22 | 2013-04-03 | 株式会社东芝 | Manufacture method for semiconductor device |
| CN105118788A (en) * | 2011-09-27 | 2015-12-02 | 台湾积体电路制造股份有限公司 | Method for three dimensional integrated circuit fabrication |
| CN106373896A (en) * | 2015-07-24 | 2017-02-01 | 南茂科技股份有限公司 | Chip packaging process and chip package |
| CN109666415A (en) * | 2018-12-29 | 2019-04-23 | 络派科技(深圳)有限公司 | A kind of UV adhesive tape for electronic equipment heating removing |
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Application publication date: 20200114 |