TW202020193A - 遮罩移送系統及框架一體型遮罩的製造方法 - Google Patents

遮罩移送系統及框架一體型遮罩的製造方法 Download PDF

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Publication number
TW202020193A
TW202020193A TW108127573A TW108127573A TW202020193A TW 202020193 A TW202020193 A TW 202020193A TW 108127573 A TW108127573 A TW 108127573A TW 108127573 A TW108127573 A TW 108127573A TW 202020193 A TW202020193 A TW 202020193A
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TW
Taiwan
Prior art keywords
mask
frame
temperature
tray
unit
Prior art date
Application number
TW108127573A
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English (en)
Chinese (zh)
Inventor
李炳一
Original Assignee
南韓商Tgo科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 南韓商Tgo科技股份有限公司 filed Critical 南韓商Tgo科技股份有限公司
Publication of TW202020193A publication Critical patent/TW202020193A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
TW108127573A 2018-08-07 2019-08-02 遮罩移送系統及框架一體型遮罩的製造方法 TW202020193A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0091930 2018-08-07
KR1020180091930A KR102236540B1 (ko) 2018-08-07 2018-08-07 마스크의 이송 시스템 및 프레임 일체형 마스크의 제조 방법

Publications (1)

Publication Number Publication Date
TW202020193A true TW202020193A (zh) 2020-06-01

Family

ID=69414887

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108127573A TW202020193A (zh) 2018-08-07 2019-08-02 遮罩移送系統及框架一體型遮罩的製造方法

Country Status (3)

Country Link
KR (1) KR102236540B1 (ko)
TW (1) TW202020193A (ko)
WO (1) WO2020032509A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220396867A1 (en) * 2020-12-22 2022-12-15 Chengdu Boe Optoelectronics Technology Co., Ltd. Film Mask, Manufacturing Method Thereof, Display Panel, and Display Device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200183547Y1 (ko) * 1997-12-24 2000-06-01 김영환 반도체 다이 본딩장치
KR100534580B1 (ko) * 2003-03-27 2005-12-07 삼성에스디아이 주식회사 표시장치용 증착 마스크 및 그의 제조방법
KR100671658B1 (ko) * 2005-01-05 2007-01-19 삼성에스디아이 주식회사 마스크 프레임 및 이를 사용한 마스크 고정방법
KR101588891B1 (ko) * 2009-07-21 2016-01-27 엘지디스플레이 주식회사 섀도 마스크의 제조방법과 이를 이용한 유기전계발광소자의 제조방법
KR101309864B1 (ko) * 2010-02-02 2013-09-16 엘지디스플레이 주식회사 마스크 어셈블리
WO2014119548A1 (ja) * 2013-02-04 2014-08-07 シャープ株式会社 蒸着装置および蒸着方法
JP2015127441A (ja) * 2013-12-27 2015-07-09 大日本印刷株式会社 蒸着マスク装置の製造方法

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Publication number Publication date
WO2020032509A1 (ko) 2020-02-13
KR102236540B1 (ko) 2021-04-06
KR20200016622A (ko) 2020-02-17

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