TW202018291A - Electrochemical sensor strip and manufacturing method thereof - Google Patents
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本發明係關於一種電化學式感測試片及其製造方法,尤其關於一種測量用電路及反應用電路分別位於不同的基板的電化學感測試片。 The invention relates to an electrochemical sensing test piece and a manufacturing method thereof, in particular to an electrochemical sensing test piece where measurement circuits and reaction circuits are respectively located on different substrates.
電化學式感測試片(Electrochemical Sensor Strip)已被成熟地應用於各種流體的檢測上,而其基本原理為利用一化學試劑(Reagent),使其與一待測流體中之一待分析物產生一電化學作用,並產生一電性的輸出信號,此電性的輸出信號與待測流體之待分析物有關。其中,當待測流體為人的血液,而待分析物為血醣時,那麼即可利用一葡萄糖氧化酵素及其他複合物來作為化學試劑。 Electrochemical Sensor Strip (Electrochemical Sensor Strip) has been maturely applied to the detection of various fluids, and its basic principle is to use a chemical reagent (Reagent) to make it with one of the analytes in a fluid to be tested Electrochemical action and produce an electrical output signal, which is related to the analyte of the fluid to be measured. Wherein, when the fluid to be measured is human blood and the analyte is blood glucose, then a glucose oxidase and other complexes can be used as chemical reagents.
圖1顯示習知電化學感測試片的外觀示意圖。圖2顯示圖1之電化學感測試片的分解圖。如圖1及圖2所示,電化學感測試片100為一血糖測試片,其包含有電極基板110、流道板120以及頂板130。電極基板110包含一電路佈局112及一基板111,且其係藉由印刷技術於一基板111上印刷電路佈局112所形成,而電路佈局112具有多個電極及電路。流道板120界定出一開口
122,其係由貫穿流道板120之上下表面來形成。為了使血液能夠更順利地流動,可於頂板130之對應流道板120的開口122的位置處設置一排氣口135。
FIG. 1 shows a schematic diagram of the appearance of a conventional electrochemical sensing test piece. Fig. 2 shows an exploded view of the electrochemical sensing test piece of Fig. 1. As shown in FIGS. 1 and 2, the electrochemical
製造電化學感測試片100時,需要將電極基板110、流道板120以及頂板130貼合在一起。使流道板120位於電極基板110及頂板130之間,且電極基板110、流道板120以及頂板130共同定義出一流道150。流道150的位置對應流道板120的開口122的位置,且具有一入口125及一排氣口135。於操作時,使用者將血液滴於入口125處,血液從入口125進入流道150,因毛細現象血液會於流道150中流動,流道150中的氣體則從排氣口135排出。
When manufacturing the electrochemical
圖3顯示習知電化學式感測試片之製造方法的流程圖。如圖3所示,習知電化學式感測試片之製造方法包含以下步驟。步驟S01,提供一電極基板110,電極基板110包括一電路佈局112及一基板111,如圖3(a)。步驟S02,提供一流道板120,如圖3(b)。步驟S03,提供一頂板130,如圖3(c)。步驟S04,將流道板120貼合於電極基板110上,形成一疊層板,如圖3(d)。步驟S05,將化學試劑(Reagent)塗布或噴於流道150內的電路佈局112的至少一部分,如圖3(e)。步驟S06,將頂板130貼合於步驟S04所製得的疊層板上,更具體而言將頂板130貼合於流道板120上,如圖3(f)。步驟S07,對步驟S06所製得的疊層板進行外型裁切,而形成電化學感測試片100,如圖3(g)。
FIG. 3 shows a flowchart of a conventional manufacturing method of an electrochemical sensor test piece. As shown in FIG. 3, the manufacturing method of the conventional electrochemical sensor test piece includes the following steps. In step S01, an
然而,依據習知技術之電化學感測試片100尚存在有更一步改善的空
間。
However, there is still room for further improvement of the electrochemical
本發明一實施例之目的在於,提供一種電化學感測試片及其製造方法,電化學感測試片的測量用電路及反應用電路在不同的製造步驟形成。於一實施例中,測量用電路及反應用電路的材料和製造方法也不同。 An object of an embodiment of the present invention is to provide an electrochemical sensing test piece and a method for manufacturing the same. The measurement circuit and the reaction circuit of the electrochemical sensing test piece are formed in different manufacturing steps. In one embodiment, the materials and manufacturing methods of the measurement circuit and the reaction circuit are also different.
依據本發明一實施例,電化學感測試片包含一頂板、一電極基板及一流道板。電極基板包含有一底板及一反應用電路其設於該底板的表面。流道板包含有一測量用電路設於該流道板的表面,界定有一開口及至少一貫穿孔,且位於該頂板及該電極基板之間,該電極基板、該流道板及該頂板界定出對應該開口的一流道。該測量用電路填充於該至少一貫穿孔內,該測量用電路通過該至少一貫穿孔電連接該反應用電路。 According to an embodiment of the present invention, the electrochemical sensing test piece includes a top plate, an electrode substrate, and a flow channel plate. The electrode substrate includes a bottom plate and a reaction circuit disposed on the surface of the bottom plate. The flow channel plate includes a measuring circuit provided on the surface of the flow channel plate, defining an opening and at least one through hole, and is located between the top plate and the electrode substrate. The electrode substrate, the flow channel plate and the top plate define a pair The first-rate way that should be spoken. The measuring circuit is filled in the at least one through hole, and the measuring circuit is electrically connected to the reaction circuit through the at least one through hole.
於一實施例中,該反應用電路係以一剝離技術對一反應用導電薄膜進行剝離來形成,而且該反應用電路的一線路的邊緣的精度範圍約為≦10μm。較佳的情況是,剝離技術為一雷射剝離技術。 In one embodiment, the reaction circuit is formed by peeling off a conductive film for reaction by a peeling technique, and the accuracy of a line edge of the reaction circuit is about ≦10 μm. Preferably, the stripping technique is a laser stripping technique.
於一實施例中,該反應用電路的材料相異於該測量用電路的材料,該測量用電路包含一第一測量電極及一第二測量電極,該反應用電路包含一第一反應電極及一第二反應電極,而且該至少一貫穿孔包含一第一貫穿孔 及一第二貫穿孔。其中,該第一反應電極及該第二反應電極分別設於該電極基板,該第一測量電極及該第二測量電極分別設於該流道板,且該第一測量電極通過該第一貫穿孔電連接於該第一反應電極,該第二測量電極通過該第二貫穿孔電連接於該第二反應電極。 In an embodiment, the material of the reaction circuit is different from the material of the measurement circuit. The measurement circuit includes a first measurement electrode and a second measurement electrode. The reaction circuit includes a first reaction electrode and A second reaction electrode, and the at least one through hole includes a first through hole And a second through hole. Wherein, the first reaction electrode and the second reaction electrode are respectively provided on the electrode substrate, the first measurement electrode and the second measurement electrode are respectively provided on the flow channel plate, and the first measurement electrode passes through the first penetration The perforation is electrically connected to the first reaction electrode, and the second measurement electrode is electrically connected to the second reaction electrode through the second through hole.
於一實施例中,該反應用電路包含多條線路,而且每一線路皆為直線。 In one embodiment, the reaction circuit includes multiple lines, and each line is a straight line.
於一實施例中,該反應用電路的材料為貴金屬,而該測量用電路的材料為相異於貴金屬的導電材料。 In one embodiment, the material of the reaction circuit is a precious metal, and the material of the measurement circuit is a conductive material different from the precious metal.
依據本發明一實施例,電化學感測試片的製造方法包含以下步驟。提供一電極基板,該電極基板包含有一底板及一反應用電路其設於該底板的表面。將該流道板貼於該電極基板上,該流道板界定有一開口及至少一貫穿孔。將一測量用電路形成於該流道板的表面,並使該測量用電路填充於該至少一貫穿孔,以使該測量用電路通過該至少一貫穿孔電連接至該反應用電路。將一頂板貼於該流道板上,藉以該流道板位於該頂板及該電極基板之間,且使該電極基板、該流道板及該頂板界定出對應該開口的一流道。 According to an embodiment of the invention, a method for manufacturing an electrochemical sensor test piece includes the following steps. An electrode substrate is provided. The electrode substrate includes a bottom plate and a reaction circuit disposed on the surface of the bottom plate. The flow channel plate is pasted on the electrode substrate. The flow channel plate defines an opening and at least one through hole. A measuring circuit is formed on the surface of the flow channel plate, and the measuring circuit is filled in the at least one through hole, so that the measuring circuit is electrically connected to the reaction circuit through the at least one through hole. A top plate is attached to the flow channel plate, whereby the flow channel plate is located between the top plate and the electrode substrate, and the electrode substrate, the flow channel plate, and the top plate define a flow path corresponding to the opening.
於一實施例中,該提供一電極基板的步驟包含以下步驟。將一反應用導電薄膜形成於一底板上。以一剝離技術對該反應用導電薄膜的一部分進行剝離,以形成該反應用電路,其中該剝離技術使該反應用電路的一線路的邊緣的精度範圍約為≦10μm。 In one embodiment, the step of providing an electrode substrate includes the following steps. A conductive thin film for reaction is formed on a bottom plate. A part of the reaction conductive film is peeled off by a peeling technique to form the reaction circuit, wherein the peeling technique makes the accuracy of the edge of a line of the reaction circuit about ≦10 μm.
於一實施例中,該以一剝離技術對該反應用導電薄膜進行剝離,以形成該反應用電路的步驟,包含以下步驟:在該反應用導電薄膜中形成至少一間隔部,且該間隔部為直線,使得該反應用電路的每一線路皆為直線。 In one embodiment, the step of peeling the reaction conductive film with a peeling technique to form the reaction circuit includes the following steps: forming at least one spacer in the reaction conductive film, and the spacer It is a straight line, so that each line of the reaction circuit is a straight line.
於一實施例中,該剝離技術為一雷射剝離技術。 In one embodiment, the stripping technique is a laser stripping technique.
於一實施例中,電化學測試片的製造方法更包含以下步驟:將一化學試劑薄膜形成於該流道內,其中,該將一化學試劑薄膜形成於該流道內的步驟,在該將一測量用電路形成於該流道板的表面的步驟之前,且在該將一頂板貼於該流道板上之後。 In one embodiment, the manufacturing method of the electrochemical test strip further includes the following steps: forming a chemical reagent film in the flow channel, wherein the step of forming a chemical reagent film in the flow channel A measuring circuit is formed on the surface of the flow channel plate before the step, and after the top plate is attached to the flow channel plate.
依據本發明一實施例,使測量用電路及反應用電路分別位於不同的基板而且製造步驟不同,於一實施例中,更使測量用電路及反應用電路的材料和製造方法也不同,因此,反應用電路可以使用測量效果較好且製造成本較高的材料及剝離方法。於一實施例中,可以利用能夠製造出線路的邊緣的製程公差範圍約為≦10μm的剝離技術,形製得反應用電路,如此能夠在不減損測量精度的情況下,降低製造的成本。 According to an embodiment of the present invention, the measurement circuit and the reaction circuit are located on different substrates and the manufacturing steps are different. In one embodiment, the materials and manufacturing methods of the measurement circuit and the reaction circuit are also different. Therefore, The reaction circuit can use materials and peeling methods that have better measurement effects and higher manufacturing costs. In one embodiment, a stripping technique with a process tolerance range of about ≦10 μm that can produce the edge of the circuit can be used to form a reaction circuit, which can reduce the manufacturing cost without compromising measurement accuracy.
100‧‧‧電化學感測試片 100‧‧‧Electrochemical test piece
110‧‧‧電極基板 110‧‧‧Electrode substrate
111‧‧‧一基板 111‧‧‧One substrate
112‧‧‧電路佈局 112‧‧‧ Circuit layout
120‧‧‧流道板 120‧‧‧Runner board
122‧‧‧的開口 122‧‧‧ opening
125‧‧‧入口 125‧‧‧ entrance
130‧‧‧頂板 130‧‧‧Top plate
135‧‧‧排氣口 135‧‧‧Exhaust
150‧‧‧流道 150‧‧‧Flower
200‧‧‧電化學感測 200‧‧‧Electrochemical sensing
210‧‧‧電極基板 210‧‧‧Electrode substrate
211‧‧‧底板 211‧‧‧Bottom plate
212‧‧‧反應用電路 212‧‧‧Reaction circuit
212a‧‧‧第一線路 212a‧‧‧ First line
212b‧‧‧第二線路 212b‧‧‧Second line
212c‧‧‧第三線路 212c‧‧‧ Third Line
212d‧‧‧第四線路 212d‧‧‧ Fourth Line
213‧‧‧間隔部 213‧‧‧Space
220‧‧‧流道板 220‧‧‧Runner board
221‧‧‧測量用電路 221‧‧‧Measurement circuit
222‧‧‧開口 222‧‧‧ opening
223‧‧‧第一貫穿孔 223‧‧‧First through hole
224‧‧‧第二貫穿孔 224‧‧‧Second through hole
230‧‧‧頂板 230‧‧‧Top plate
235‧‧‧排氣口 235‧‧‧Exhaust
241‧‧‧第一測量電極 241‧‧‧ First measuring electrode
242‧‧‧第二測量電極 242‧‧‧Second measuring electrode
250‧‧‧流道 250‧‧‧Flower
圖1顯示習知電化學式感測試片的外觀的示意圖。 FIG. 1 is a schematic diagram showing the appearance of a conventional electrochemical sensor test piece.
圖2顯示圖1之電化學式感測試片的分解圖。 FIG. 2 shows an exploded view of the electrochemical sensor test piece of FIG. 1.
圖3顯示習知電化學式感測試片之製造方法的流程圖。 FIG. 3 shows a flowchart of a conventional manufacturing method of an electrochemical sensor test piece.
圖4顯示本發明一實施例之電化學式感測試片之製造方法的流程圖。 FIG. 4 shows a flowchart of a method for manufacturing an electrochemical sensor test piece according to an embodiment of the invention.
圖5顯示本發明一實施例之電極基板的俯視圖。 FIG. 5 shows a top view of an electrode substrate according to an embodiment of the invention.
圖6顯示本發明一實施例之流道板的俯視圖。 FIG. 6 shows a top view of a runner plate according to an embodiment of the invention.
圖7顯示本發明一實施例之一步驟的疊層板的俯視圖。 FIG. 7 shows a top view of a laminated board in one step according to an embodiment of the invention.
圖4顯示本發明一實施例之電化學式感測試片之製造方法的流程圖。圖4(a)~4(g)顯示依本發明一實施例電化學感測試片之製造方法各步驟的示意圖。依本發明一實施例電化學感測試片可以利用下述步驟S02、步驟S04、步驟S06、步驟S08、步驟S10、步驟S12、步驟S14及步驟S16來製造。 FIG. 4 shows a flowchart of a method for manufacturing an electrochemical sensor test piece according to an embodiment of the invention. 4(a) to 4(g) are schematic diagrams showing steps of a method for manufacturing an electrochemical sensor test piece according to an embodiment of the invention. According to an embodiment of the present invention, the electrochemical sensing test piece can be manufactured using the following steps S02, S04, S06, S08, S10, S12, S14, and S16.
步驟S02:提供一電極基板210,且電極基板210包含有一底板211及一反應用電路212其設於底板211的表面,如圖4(a)所示。圖5顯示本發明一實施例之電極基板的俯視圖。如圖5所示,於一實施例中,反應用電路212包含多條線路及至少一條的間隔部,且兩相鄰線路間形成有一間隔部213。於一實施例中,多條線路包含一第一線路212a及一第二線路212b,且第一線路212a及第二線路212b間形成有一間隔部213。於一實施例中,多條線路更包含一第三線路212c及一第四線路212d,且兩相鄰線路間分別形成有一間隔部213。
Step S02: An
於一實施例中,步驟S02包含:一沈積步驟,將一反應用導電薄膜形成於底板211上;以及一剝離步驟,以一剝離技術對該反應用導電薄膜的一部分進行剝離,以形成反應用電路212,其中該剝離技術使反應用電路212的每一線路212a-212b的邊緣的精度範圍約為≦10μm。於一實施例中,將該反應用導電薄膜的一部分剝離後,該被剝離的部分,形成在該反應用導電薄膜中的至少一間隔部213,且間隔部213為直線,使得反應用電路212的每一線路212a-212b皆為直線。如此特徵,能夠簡化剝離步驟,能夠減少製程時間及成本。
In one embodiment, step S02 includes: a deposition step, forming a reactive conductive film on the bottom plate 211; and a peeling step, using a peeling technique to peel off a part of the reactive conductive film to form the
於一實施例中,該剝離技術為雷射剝離技術。利用雷射剝離法能夠製造出具有較小線寬的電極,相較於習知印刷技術,能夠更進一步縮小電化學感測試片的尺寸。此外,當利用印刷技術形成由碳所構成的電路佈局112時,電路佈局112之一電極的側邊,會形成類似於鋸齒狀(sawtooth)的不規則邊緣,然而此不規則邊緣會影響測量的準確性。利用雷射剝離法所形成之反應用電路212的側邊,較不易產生鋸齒狀之側邊,因此可得到較準確的量測值。更具體而言,使用適當的雷射光束時,能夠使反應用電路212的每一線路212a-212b的邊緣的精度範圍約為≦10μm,而可以得到較準確的量測值。
In one embodiment, the stripping technique is a laser stripping technique. The laser stripping method can be used to manufacture an electrode with a smaller line width. Compared with the conventional printing technology, the size of the electrochemical sensing test piece can be further reduced. In addition, when the
步驟S04:提供一流道板220,並對流道板220進行衝壓,以使流道板220界定有一開口222及至少一貫穿孔,如圖4(b)所示。圖6顯示本發明一實
施例之流道板的俯視圖。如圖6所示,至少一貫穿孔包含一第一貫穿孔223及一第二貫穿孔224。第一貫穿孔223、第二貫穿孔224及開口222彼此不連通,而且第一貫穿孔223及第二貫穿孔224貫穿流道板220的整個厚度,亦即從流道板220上表面延伸至下表面,並且第一貫穿孔223及第二貫穿孔224位置分別能夠露出第一線路212a及一第二線路212b,較佳的情況是第一貫穿孔223及第二貫穿孔224的孔徑分別位於第一線路212a及一第二線路212b的線寬內。
Step S04: providing a first-
步驟S06:將一流道板220貼於電極基板210上,形成一疊層板,如圖4(c)所示。
Step S06: Paste the
步驟S08:將一測量用電路221形成於流道板220的一表面,並使測量用電路221填充於該至少一貫穿孔,以使測量用電路221通過該至少一貫穿孔電連接至反應用電路212,如圖4(d)所示。
Step S08: forming a measuring
步驟S10:於反應用電路212上塗布測試用的至少一化學試劑(Reagent),如圖4(e)所示。較佳的情況是,流道板220的開口222的位置對應反應用電路212的位置。
Step S10: Apply at least one chemical reagent (Reagent) for testing on the
步驟S12:將一頂板230貼於流道板220上,藉以流道板220位於頂板230及電極基板210之間,且使電極基板210、流道板220及頂板230界定出對應開口222的一流道。頂板230上形成有一排氣口235,如圖4(f)所示。
Step S12: affix a
步驟S14:對步驟S12所製得的疊層板進行外型裁切,而形成多個電化學感測試片200,如圖4(g)所示。前述步驟S10、S12及S14,係於本領域具有通常知識者所能完成,且可以採用目前已知或未來發展之技術,因此省略
其相關說明。
Step S14: shape cutting the laminated board prepared in step S12 to form a plurality of electrochemical
依據一實施例的電化學感測試片200,流道板220位於頂板230及電極基板210之間,藉以使電極基板210、流道板220及頂板230定義出一流道250。測量用電路221設於流道板220上。測量用電路221填充於該至少一貫穿孔內電連接反應用電路212。於一實施例中,反應用電路212的材料相異於測量用電路221的材料。於反應用電路212上塗布有至少一化學試劑。於一實施例中,化學試劑為一葡萄糖酵素、一尿酸酵素、一膽固醇酵素、一ketone酮體酵素或一血紅素酵素。
According to the electrochemical
圖7顯示本發明一實施例之步驟S08的疊層板的俯視圖。如圖7所示,於步驟S08的疊層板中,於一實施例中,反應用電路212包含一第一反應電極(線路)212a及一第二反應電極(線路)212b,該等分別位於底板211。測量用電路221包含有一第一測量電極241及一第二測量電極242位於流道板220且適於耦接一電化學感測裝置。第一測量電極241通過第一貫穿孔223電連接於第一反應電極212a,第二測量電極242通過第二貫穿孔224電連接於第二反應電極212b。當頂板230覆蓋於流道板220時,露出第一及二測量電極241及242的至少一部分,用以電連於一電化學感測試裝置。再請參照圖4(f),頂板230上更定義有一開口用以作為排氣口235。
7 shows a top view of the laminated board in step S08 according to an embodiment of the invention. As shown in FIG. 7, in the laminated board of step S08, in one embodiment, the
此外,本發明不限定測量用電路221的形成方式,亦不限定其材料,僅要是能夠電導的材料即可。測量用電路221可以利用印刷(screen printing)
來形成,此時測量用電路221的材料可以為石墨、銀漿、或鋁漿等。此外,測量用電路221亦可以利用蒸鍍(vapor-deposited)及電鍍,配合蝕刻(etching)、雕刻(scribing)或其他分分離技術等方式來加以形成,此時測量用電路221的材料可以為銅、鈦、鎳、金、白金、鈀、銠、釕、或銥等金屬。從製造簡便且節省成本的角度來看,較佳地是使用印刷技術印刷石墨或導電漿,來形成測量用電路221。於一實施例中,反應用電路212的材料相異於測量用電路221的材料。於一實施例中,反應用電路212的材料可以為鈀〈Palladium〉、金等貴金屬。於一實施例中,反應用電路212的材料亦可以為碳,且其可以藉由印刷方式來加以形成。
In addition, the present invention does not limit the formation method of the measuring
於本發明中,不限定電化學感測片200的檢測項目,只要是檢測項目可以應用電化學原理方式進行檢測即可,例如包括心血管疾病血脂檢測、總膽固醇(T-Cholesterol)檢測、高密度脂蛋白膽固醇檢測(high density lipoprotein cholesterol,HDL-C)、低密度脂蛋白膽固醇(low density lipoprotein cholesterol,LDL-C)、三酸甘油脂(Triglyceride,TG)、相關於心肌哽塞之LDH、CK-MB、CPK、GOT等檢測、相關於痛風指標的Uric acid檢測、以及相關於肝功能的GOT、GPT檢測等。而且,多功能檢測的好處之一在於能夠排除非特異性干擾(Non-Specific interaction)。
In the present invention, the detection items of the
於一實施例中,於操作電化學感測試片200時,電化學感測試裝置透過該些量測電極241及242使第一及二反應電極212a與212b間形成一電壓差,電化學感測試裝置再利用該些電壓差,量測例如血液等之檢體的一測
量值。
In one embodiment, when the electrochemical
依據本發明一實施例,測量用電路221及反應用電路212的材料不同,且利用不同的步驟來形成。如此設計,測量用電路221的功能可以簡化至將來自反應用電路212的電訊號傳遞至電化學感測裝置即可,因此可以使用成本較佳的導電材料,例如銅或石墨。而,反應用電路212使用具有較佳量測效果的材料,例如金,因此能夠減少金的使用而減少製造的成本。反應用電路212可以使用較小面積的底板211,如此反應用導電薄膜的面積較小,而能夠減少金等之貴金屬的使用量。請參照圖4(a)及圖4(b),底板211的長度小於流道板220的長度,較佳地底板211的長度小於流道板220的長度的四分之一。此外,利用雷射剝離技術去除不需要的部分時,也可以去除較少的量,減少浪費。另外,為了節省製造時間,反應用電路212可以採用簡單的圖案。較佳地,間隔部213為直線,使得反應用電路212的每一線路212a-212b皆為直線,藉以簡化製程而能夠減少製造成本。
According to an embodiment of the present invention, the materials of the
於一實施例中,於基板上形成金屬薄膜後,以雷雕金屬技術,用雷射蝕刻並定義電極圖案。其缺點是金屬浪費,而且雷射蝕刻的時間會隨圖案複雜度而增加。然而,依據本發明的電極基板的電路較為簡單,僅需要形成一條或以上的長條狀的間隔部,因此製造時間較短。利用雷射雕刻技術與傳統油墨技術的比較,可以參考下表。雷射雕刻較不會有溢墨現象、較不會斷線,而且可以製得線路之邊緣的精度(製程公差)範圍約為2μm。因此,所測得之血糖值的準確度,會高於採用油墨印刷技術所測得的準確 度。 In one embodiment, after the metal thin film is formed on the substrate, laser etching metal technology is used to etch and define the electrode pattern by laser. The disadvantage is that the metal is wasted, and the laser etching time will increase with the complexity of the pattern. However, the circuit of the electrode substrate according to the present invention is relatively simple, and only one or more elongated spacers need to be formed, so the manufacturing time is shorter. The comparison between laser engraving technology and traditional ink technology can refer to the table below. Laser engraving is less likely to have ink spillage and less broken lines, and the accuracy (process tolerance) of the edge of the line can be made to be about 2μm. Therefore, the accuracy of the measured blood glucose value will be higher than the accuracy measured by the ink printing technology degree.
另外,不同的雷射光線,會有不同的精度效果,不同之雷射光線之波長,以及利用它所製得之線路邊緣的精度,如下表3。較佳的情況是,使用紫外線(UV)或準分子紫外線(Excimer UV),藉以使所製得的電路之邊緣的精度(製程公差)範圍約為≦10μm。 In addition, different laser rays will have different accuracy effects, different wavelengths of laser rays, and the accuracy of the edge of the line made using it, as shown in Table 3 below. Preferably, ultraviolet (UV) or excimer ultraviolet (Excimer UV) is used, so that the accuracy (process tolerance) of the edge of the circuit produced is about ≦10 μm.
應了解的是,本發明不限制反應用電路的製造方法,只要形成的線路的邊緣的精度(製程公差)範圍約為≦10μm即可,還可以使用以下技術來 製造。於一實施例中,使用半導體黃光製程的技術,需底片或光罩等來定義電極圖案。於一實施例,採用化學鍍金的技術,更具體而言,利用印刷技術將一金屬化引體形成於基板之即將形成一電路佈局的區域,在於該金屬化引體上形成一金屬層,藉以形成該電路佈局。依據這些技術,都可以使反應用電路之邊緣的精度(製程公差)範圍約為≦10μm。 It should be understood that the present invention does not limit the manufacturing method of the reaction circuit, as long as the accuracy (process tolerance) of the edge of the formed line is about ≦10 μm, the following techniques can also be used manufacture. In one embodiment, a semiconductor yellow light process technology is used, which requires a negative film or a photomask to define the electrode pattern. In one embodiment, a technique of electroless gold plating is used, more specifically, a metallization primer is formed on a region of the substrate where a circuit layout is to be formed by printing technology, in which a metal layer is formed on the metallization primer, thereby This circuit layout is formed. According to these techniques, the accuracy (process tolerance) of the edge of the reaction circuit can be approximately ≦10 μm.
綜上所述,依據本發明一實施例,能夠使測量用電路221及反應用電路212的製造步驟不同,較佳地測量用電路221及反應用電路212的材料和製造方法也不同,因此,反應用電路212可以使用測量效果較好且製造成本較高的材料及剝離方法,例如使用金為材料,且利用雷射剝離法製造線路的邊緣的製程公差範圍約為≦10μm,如此能夠在不減損測量精度的情況下,降低製造的成本。
In summary, according to an embodiment of the present invention, the manufacturing steps of the
220‧‧‧流道板 220‧‧‧Runner board
222‧‧‧開口 222‧‧‧ opening
223‧‧‧第一貫穿孔 223‧‧‧First through hole
224‧‧‧第二貫穿孔 224‧‧‧Second through hole
Claims (11)
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