TW202018123A - Plated glass substrate manufacturing method and glass substrate - Google Patents

Abstract

Provided is a plated glass substrate manufacturing method with which a plating film can be formed on a glass substrate using a molecular bonding technique. This method for manufacturing a plated glass substrate comprises: a washing step in which a glass substrate is washed; a pretreatment step in which the glass substrate treated in the washing step is subjected to a pretreatment for molecular bonding; a heat treatment step in which the glass substrate treated in the pretreatment step is subjected to a heat treatment; a catalyst imparting step in which a catalyst is imparted to the glass substrate treated in the heat treatment step; a catalyst activation step in which the catalyst imparted to the glass substrate treated in the catalyst imparting step is activated; and an electroless plating step in which the glass substrate treated in the catalyst activation step is subjected to electroless plating.

Description

Method for manufacturing glass substrate after plating treatment and glass substrate

The invention relates to a method for manufacturing a glass substrate after plating treatment and a glass substrate.

Patent Document 1 describes an electroless plating method on a glass substrate, which does not perform the etching treatment using harmful fluoride, but can perform pre-plating treatment of the glass substrate to form a plating layer, it will cause The adhesion to the substrate is good, and blistering does not occur during plating to obtain a plating layer with good electrical characteristics.

This method of electroless plating on a glass substrate is: first, when electroless copper plating is performed on a glass substrate, after degreasing treatment, sensitization treatment and catalyst activation treatment, it contains 0.1 to 15 g/L of polymer. Ethylene glycol is used for electroless copper plating in the electroless copper plating bath. Second, when electroless nickel plating is performed on the glass substrate, after degreasing treatment, sensitization treatment and catalyst activation treatment, use Electroless nickel plating is carried out in the electroless nickel plating bath of carboxylic acid of the bit agent.

Patent Document 2 describes a method of manufacturing electrical and electronic equipment using molecular bonding technology. The manufacturing method of this electrical and electronic device includes: a step of applying a first pretreatment followed by a first molecule to a metal body; a step of forming an insulating film to be adhered to the metal body by following the first molecule; The step of applying a second pretreatment to the second molecule on the surface of the film; the step of applying electroless plating on the insulating film and forming the conductor that will be adhered to the insulating film by following the second molecule; The step of applying electrolytic plating to form a circuit pattern; and the step of packaging the semiconductor element in the circuit pattern.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2005-256122

Patent Document 2: Japanese Patent No. 5624703

In the past, it has been quite difficult to plate a glass substrate using molecular bonding technology.

An object of the present invention is to provide a method for manufacturing a glass substrate after a plating process that can use a molecular bonding technique to form a plating film on a glass substrate and a glass substrate that uses a molecular bonding technique to form a plating film.

The present invention includes: a washing step to wash a glass substrate; a pretreatment step to apply a pretreatment for molecular bonding to the glass substrate treated by the washing step; a heat treatment step to The glass substrate treated by the pretreatment step is subjected to heat treatment; the catalyst supply step is to supply a catalyst to the glass substrate treated by the heat treatment step; the catalyst activation step is to allow the catalyst to use the catalyst The glass substrate treated after the supply step is activated; and the electroless plating step is to apply electroless plating to the glass substrate treated by the catalyst activation step.

According to the present invention, it is possible to provide a method of manufacturing a glass substrate after a plating process that can use a molecular bonding technique to form a plating film on a glass substrate, and a glass substrate that uses a molecular bonding technique to form a plating film.

10‧‧‧Glass substrate after plating

12‧‧‧Glass substrate

13‧‧‧Molecular junction membrane

14, 16‧‧‧Metal plating film

FIG. 1 is an explanatory view showing a cross section of glass manufactured by a method of manufacturing a glass substrate after plating according to an embodiment of the present invention.

FIG. 2 is a flowchart showing the steps of the manufacturing method of the glass substrate after the plating process.

FIG. 3 is a graph showing the influence of the heat treatment step included in the manufacturing method of the glass substrate after the plating treatment on the peel strength.

Next, with reference to the attached drawings, the embodiment of the present invention will be described in order to understand the present invention. In addition, in the drawings, parts that are not related to description will be omitted.

As shown in FIG. 1, a method for manufacturing a glass substrate 10 after plating according to an embodiment of the present invention can form a metal plating film 14 on a glass substrate 12 by forming a molecular bonding film 13 by molecular bonding. 16.

That is, the method of manufacturing the glass substrate 10 after plating can produce the glass substrate 10 after plating, the glass substrate 10 after plating is provided with: a glass substrate 12 and a molecular bonding film 13 Is bonded to the glass substrate 12 by molecular bonding; and the metal plating layer 14 is bonded to the molecular bonding film 13 by molecular bonding.

Here, the glass substrate 12 in this embodiment is, for example, general soda glass (whiteboard glass, etc.), borosilicate glass, lead glass, flint glass, optical glass, quartz glass, and the like.

Moreover, the metal plating coating film is a coating film such as copper plating, nickel plating, and gold plating. However, the metal plating film is not limited to these metal plating films.

Hereinafter, the manufacturing method of the glass substrate 10 after the plating process (plating method of the glass substrate) will be described.

The glass substrate after the plating process is manufactured as shown in FIG. 2 according to the following steps Pa1 to Pa7.

(Washing process Pa1)

This step is a step of washing the glass substrate 12 (see FIG. 1).

Specifically, the glass substrate 12 is washed with a solvent containing ethanol and dried.

After that, the glass substrate 12 is soaked in an acidic cleaning agent, rinsed with pure water, and then dried.

(Pre-treatment process Pa2)

This step is a step applied to the pretreatment for molecular bonding.

Specifically, the glass substrate 12 washed in the washing step Pa1 is repeatedly processed at least twice for the treatment before molecular bonding. The previous treatment consists of: immersing the glass substrate 12 in 6-(3-aminopropyltriethoxysilane)-1,3,5-triazine-2,4-azido (hereinafter referred to as "P- TES".) The solution is then dried (P-TES treatment); ultraviolet radiation is applied to the dried glass substrate 12; and ethanol is used to rinse the glass substrate 12 after the ultraviolet irradiation.

In addition, the molecular bonding agent is not limited to P-TES, and any molecular bonding agent may be used.

(Heat treatment process Pa3)

This step is a step of applying heat treatment to the glass substrate 12 after the pre-treatment step Pa2 and after the pre-treatment at a predetermined heat treatment temperature and heat treatment time.

The heat treatment temperature is preferably 80 to 250°C, and the heat treatment time is preferably 5 to 60 minutes.

(Catalyst supply process Pa4)

This step is a step of supplying a catalyst to the glass substrate 12 after the heat treatment in the heat treatment step Pa3.

Specifically, the glass substrate 12 is subjected to pre-soak treatment and catalyst treatment in order to supply the catalyst (Pd). The catalyst liquid system is Cataposit 44 (made by Rohm and Haas Electronic Materials Co., Ltd.).

(Catalyst activation process Pa5)

This step is a step of activating the catalyst by subjecting the glass substrate 12 after the catalyst is supplied in the catalyst supply step Pa4 to the treatment with a promoting liquid to remove Sn colloids.

The used promotion liquid is 19E (made by Rohm and Haas Electronic Materials Co., Ltd.).

(Electroless plating process Pa6)

This step is a step of applying electroless plating to the glass substrate 12 after activation of the catalyst by the catalyst activation step Pa5.

The applicable metal plating is copper plating and nickel plating.

The metal plating film 14 and the glass substrate 12 formed by the electroless plating step Pa6 are strongly bonded through the molecular bonding film 13 by molecular bonding.

(Electrolytic plating process Pa7)

This step is a step of applying electrolytic plating to the glass substrate 12 after forming the metal plating film 14 in the electroless plating step Pa6.

The applicable metal plating is copper plating, nickel plating and gold plating.

Specifically, by immersing the glass substrate in an acid-based cleaning solution and washing it, acid activation that suppresses the poor adhesion with the plating film 14 is performed, and then electrolysis is applied By plating, a metal plating film 16 is further formed on the metal plating film 14.

In addition, depending on the required appearance of the metal plating film, the electrolytic plating Pa7 may be omitted.

(Example)

Next, a test example for confirming the effect of the manufacturing method of the glass substrate 10 after the plating treatment according to the present embodiment (that is, the excellent characteristic of the peel strength of the metal plating film) is shown, and after the plating treatment The manufacturing method of the glass substrate 10 is further described.

The inventors conducted tests in order to evaluate the effect of the presence or absence of the heat treatment step Pa3 on the peel strength of the metal plating film.

First, a plurality of sodium-based white glass (carrier slides) are prepared as the glass substrate 12. For these glass substrates, metal plating is performed according to the above steps Pa1 to Pa7.

At this time, the heat treatment temperatures in the heat treatment step Pa3 are 80°C, 110°C, 150°C, 200°C, and 250°C, respectively, and the heat treatment time is 5 minutes, 15 minutes, 30 minutes, and 60 minutes for each heat treatment temperature. Sample 1~20.

Next, as the sample R (comparative example), the heat treatment step Pa3 was omitted in the manufacturing method steps Pa1 to Pa7 of the glass substrate after the plating process described above to prepare a sample after the plating process.

The size (length×width×thickness) of the glass substrate 12 is 75 mm×25 mm×1.0 mm.

The molecular bonding agent is the aforementioned P-TES.

Electroless plating process Pa6 metal plating is copper plating. The thickness of the copper plating is about 0.3 μm.

In the electrolytic plating process Pa7, the metal plating is copper plating. The thickness of the copper plating is about 18 μm.

The treatment of each of Samples 1 to 20 and Sample R in the washing step Pa1 and the pretreatment step Pa2 will be performed at room temperature of 23±3°C.

About the prepared samples 1-20 and the sample R (comparative example), the peeling test of the plating film was implemented based on JIS Z 0237:2009. In addition, a dynamometer ZTA-50N (manufactured by IMADA Co., Ltd.) was mounted on a vertical electric measuring table MX2-500N (manufactured by IMADA Co., Ltd.) to constitute a peel tester.

Figure 3 shows the test results of samples 1-20 and sample R. The horizontal axis of FIG. 3 is the heat treatment time, and the vertical axis is the peel strength (N/cm).

From the test results, it is understood that when the heat treatment step Pa3 is performed, the peel strength of the plating film can be improved compared to the case where the heat treatment step Pa3 is not performed.

In addition, the conditions when heating the glass substrate in the heat treatment step Pa3 are that the heat treatment temperature is 80 to 250° C. and the heat treatment time is 5 to 60 minutes.

In this way, according to the manufacturing method of the glass substrate 10 after the plating process according to the present embodiment, a glass substrate excellent in characteristics related to the peel strength of the metal plating film can be obtained through a series of steps and using molecular bonding technology材10.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and changes and the like that do not exceed the intended conditions also completely fall within the scope of application of the present invention.

Pa1‧‧‧ washing process

Pa2‧‧‧Pretreatment process

Pa3‧‧‧heat treatment process

Pa4‧‧‧catalyst supply process

Pa5‧‧‧catalyst activation process

Pa6‧‧‧electroless plating process

Pa7‧‧‧electrolytic plating process

Claims (4)

A method for manufacturing a glass substrate after plating treatment includes: The washing process is to wash the glass substrate; The pretreatment process is to apply the pretreatment for molecular bonding to the glass substrate treated by the cleaning process; The heat treatment process is to apply heat treatment to the glass substrate treated by the pretreatment process; The catalyst supply step is to supply a catalyst to the glass substrate treated by the heat treatment step; The catalyst activation step is to activate the glass substrate after the catalyst is processed by the catalyst supply step; and The electroless plating step is to apply electroless plating to the glass substrate treated by the catalyst activation step. For example, the method for manufacturing a glass substrate after plating treatment in item 1 of the patent application scope, wherein the pretreatment process includes: Immerse the glass substrate treated in this washing step in 6-(3-aminopropyltriethoxysilane)-1,3,5-triazine-2,4-azide solution and dry it Treatment; and Irradiation of ultraviolet rays to the treatment of the glass substrate after drying For example, the method for manufacturing a glass substrate after plating treatment in item 2 of the patent application scope, wherein the heat treatment temperature in the heat treatment process is 80 to 250°C, and the heat treatment time is 5 to 60 minutes. A glass substrate after plating treatment, including: Glass substrate The molecular bonding film is bonded to the glass substrate by molecular bonding; and The metal plating layer is bonded to the molecular bonding film by molecular bonding.

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