TW202017449A - Printed circuit board and power copper surface configuration method thereof - Google Patents

Abstract

A printed circuit board and a power copper configuration method thereof. The method includes the following steps. First and second power providing elements, a power sink element, a confluence copper portion, first and second ground copper portions are disposed. Whether currents of first and second power providing elements are flowing to a power sink element through a confluence copper portion is determined. When currents of both the first and the second power providing elements are flowing to the power sink element through the confluence copper portion, whether the confluence copper portion is met an average current layout design of the printed circuit board according to at least one of a first toleration difference value and a second toleration difference value and an average current. When the confluence copper portion is met the average current layout design of the printed circuit board, the power copper configuration method is ended.

Description

Printed circuit board and its power copper configuration method

The invention relates to a printed circuit board, and in particular to a printed circuit board and a method for configuring a copper surface of a power supply.

In the printed circuit board, the power network transmission design is roughly divided into three parts, namely the power supply component, the transmission channel and the power extraction component. When designing for multiple power supply components to be connected to the same power draw component, the printed circuit board wiring engineer will determine the placement of each power supply component and power draw component according to factors such as institutional requirements, the amount of current drawn, etc. And connect with power copper.

However, due to the different layout paths, the equivalent resistance of each power supply element to the middle channel of the same power draw element may be different. The source of the equivalent resistance includes the copper surface of the power source as the channel and the series connection element. Under the condition that the output voltage of the power supply element is the same, when the equivalent resistance of the intermediate channel from each power supply element to the same power draw element is different, the output current of each power supply element may have an uneven condition, that is, the power supply The load of the components is uneven.

The invention provides a printed circuit board and a method for configuring a copper surface of a power supply, which can avoid or suppress an uneven output current of a power supply component.

或者

其中，第一容許差異值對應第一電源提供元件的電流，並且第二容許差異值對應該第二電源提供元件的電流。或者，當第一電源提供元件的電流與平均電流的差值的絕對值小於等於第一容許差異值且第二電源提供元件的電流與平均電流的差值的絕對值小於等於第二容許差異值時，第一電源提供元件、第二電源提供元件、電源汲取元件、第一電源銅面部份、第二電源銅面部份、第三電源銅面部份、匯流銅面部份、第一接地銅面部份、第二接地銅面部份符合均流佈局設計。The printed circuit board of the present invention includes a first power supply element, a second power supply element, a power extraction element, a first power copper surface portion, a second power copper surface portion, a third power copper surface portion, and a busbar copper The surface portion, the first grounded copper surface portion, and the second grounded copper surface portion. The copper portion of the first power supply is electrically connected to the first power supply element. The copper portion of the second power supply is electrically connected to the second power supply component. The copper portion of the third power supply is electrically connected to the power extraction component. The copper part of the bus is electrically connected to the copper part of the first power supply, the copper part of the second power supply and the copper part of the third power supply. The currents provided by the first power supply element and the second power supply element are respectively The copper portion of the first power supply and the copper portion of the second power supply flow to the copper portion of the bus, and then to the power extraction component through the copper portion of the bus. The first ground copper portion is electrically connected to the first power supply element and the power extraction element. And, the second ground copper plane is electrically connected to the second power supply element and the power draw element, wherein the first power supply element, the second power supply element, the power draw element, the first power copper plane portion, and the second power source The copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground copper surface portion, and the second ground copper surface portion are designed to conform to the current sharing layout of the printed circuit board. When the first sum of the equivalent resistances of the first power copper plane part and the first ground copper plane part and the second sum of the equivalent resistances of the second power copper plane part and the second ground copper plane part meet the following In case of inequality, determine the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, The first grounded copper plane part and the second grounded copper plane part are designed according to the current sharing layout:

or

The first allowable difference value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element. Or, when the absolute value of the difference between the current of the first power supply element and the average current is less than or equal to the first allowable difference and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the second allowable difference , The first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first The part of the grounded copper plane and the part of the second grounded copper plane conform to the current sharing layout design.

The method for disposing the power copper surface of the printed circuit board of the present invention includes a first power copper surface portion electrically connected to the first power supply element and a second power copper surface electrically connected to the second power supply element Part, the third power copper plane part electrically connected to the power draw element, the busbar copper plane electrically connected to the first power copper plane part, the second power copper plane part and the third power copper plane part Part, a first ground copper plane part electrically connected to the first power supply element and the power draw element, and a second ground copper plane part electrically connected to the second power supply element and the power draw element. The configuration method of the copper surface of the power supply includes the following steps. Configure the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, and the first ground The copper surface part and the second grounded copper surface part. Determine whether the current of the first power supply component flows from the busbar copper surface part to the power drawer component. The busbar copper surface part is electrically connected to the first power copper plane part, the second power copper plane part and the third power copper plane Partly. It is determined whether the current of the second power supply component flows from the copper surface part of the bus to the power draw component. When the currents of the first power supply element and the second power supply element both flow from the bus copper part to the power draw element, the first is determined according to at least one of the first allowable difference value and the second allowable difference value and the average current Power supply element, second power supply element, power extraction element, first power copper surface portion, second power copper surface portion, third power copper surface portion, bus copper surface portion, first ground copper surface portion Whether the portion of the second ground copper plane conforms to the current-sharing layout design of the printed circuit board, wherein the first allowable difference value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element. When the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground When the copper surface portion and the second grounded copper surface portion meet the current-sharing layout design of the printed circuit board, the power copper surface configuration method is ended.

The printed circuit board and the method for configuring the copper surface of the power supply according to the embodiments of the present invention can determine the first power supply element, the second power supply element, and the power supply based on at least one of the first allowable difference value and the second allowable difference value and the average current Whether the extraction components, the first power copper plane part, the second power copper plane part, the third power copper plane part, the busbar copper plane part, the first ground copper plane part, the second ground copper plane part meet Design of current sharing layout of printed circuit board. Thereby, the situation that the output current of the first power supply element and the second power supply element are uneven can be avoided or suppressed.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

FIG. 1A to FIG. 1C are schematic layout diagrams of layers of a printed circuit board according to a first embodiment of the present invention. Please refer to FIGS. 1A to 1C. In this embodiment, only three layers of the printed circuit board are illustrated, that is, the first layer printed circuit board 110, the second layer printed circuit board 120, and the third layer printed circuit board. 130, but in other embodiments, the printed circuit board may have other layers of printed circuit boards.

In the printed circuit board, at least a first power supply element VRM1, a second power supply element VRM2 and a power draw element Sink are arranged, wherein the first power supply element VRM1 and the second power supply element VRM2 are used to provide current. Here, the first power supply element VRM1, the second power supply element VRM2 and the power draw element Sink are respectively plug-in type, that is, the first power supply element VRM1, the second power supply element VRM2 and the power draw element Sink penetrate the first The layered printed circuit board 110, the second layer printed circuit board 120 and the third layer printed circuit board 130. In other embodiments, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink may be surface mount, that is, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink The top layer (for example, the first layer of the printed circuit board 110) and the bottom layer (for example, the third layer of the printed circuit board 130) in the printed circuit board can be respectively configured, and the first power supply element VRM1 and the second power supply element VRM2 can be Configured in different layers of printed circuit boards.

Please refer to FIG. 1A. In the first printed circuit board 110, a copper surface electrically connected to the first power supply element VRM1 and the second power supply element VRM2 is arranged, but the copper surface and the power draw element Sink are in the first The layered printed circuit board 110 can be regarded as electrical insulation. In this embodiment, the copper surface of the first printed circuit board 110 can be roughly divided into a first power copper surface portion 111, a second power copper surface portion 113 and a busbar copper surface portion 115. The first power supply copper surface portion 111 is electrically connected to the first power supply element VRM1 and the busbar copper surface portion 115 to serve as a path for the current flowing from the first power supply element VRM1 to the busbar copper surface portion 115, etc. The effective resistance is R11.

The second power supply copper surface portion 113 is electrically connected to the second power supply element VRM2 and the busbar copper surface portion 115 to serve as a path for the current flowing from the second power supply element VRM2 to the busbar copper surface portion 115, etc. The effective resistance is R21. Please refer to FIG. 1B. In the second-layer printed circuit board 120, a copper surface (including a third power copper surface portion 121) electrically connected to the power sink element Sink is disposed, wherein the third power copper surface portion 121 passes through The plurality of through holes VA11 penetrating from the first layer printed circuit board 110 to the second layer printed circuit board 120 are electrically connected to the bus copper surface portion 115 as a flow from the bus copper surface portion 115 to the power sink element Sink The path of current.

Referring to FIG. 1C, the third-layer printed circuit board 130 is provided with a copper surface electrically connected to the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink, which is roughly divided into a first ground The copper surface portion 131 and the second ground copper surface portion 133. The first ground copper portion 131 is electrically connected to the first power supply element VRM1 and the power draw element Sink to serve as a path for the current flowing from the power draw element Sink to the first power supply element VRM1, and its equivalent resistance is R12 . The second ground copper portion 133 is electrically connected to the second power supply element VRM2 and the power draw element Sink to serve as a path for current flowing from the power draw element Sink to the second power supply element VRM2, and its equivalent resistance is R22 .

Among them, the first power copper surface portion 111, the second power copper surface portion 113, the busbar copper surface portion 115 and the third power copper surface portion 121 are used to provide (or transmit) high voltage (such as power supply voltage) to The power draw element Sink, and the first ground copper plane portion 131 and the second ground copper plane portion 133 are used to provide (or transmit) a low voltage (eg, ground voltage) to the power draw element Sink.

In this embodiment, the printed circuit board shown in FIGS. 1A to 1C is simulated through a layout program, and the current sharing operation is performed to balance the output loads of the first power supply element VRM1 and the second power supply element VRM2. In other words, in the layout program, the first power supply element VRM1, the second power supply element VRM2, the power sink element Sink, the first power copper surface portion 111, the second power copper surface portion 113, and the third power source are determined first The positions of the copper surface portion 121, the bus copper surface portion 115, the first ground copper surface portion 131, and the second ground copper surface portion 133. Among them, the layout program judges the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, the first power copper surface portion 111, the second power copper surface portion 113, the third power copper surface portion 121 , The location of the busbar copper portion 115, the first ground copper surface portion 131, and the second ground copper surface portion 133 conform to the current sharing layout design of the printed circuit board to determine whether to reconfigure the first power supply element VRM1, the first Two power supply components VRM2, power sink component Sink, first power copper surface portion 111, second power copper surface portion 113, third power copper surface portion 121, bus copper surface portion 115, first ground copper surface Positions of the portion 131 and the second ground copper portion 133.

In the embodiment of the present invention, the currents of the first power supply element VRM1 and the second power supply element VRM2 flow through the first power copper plane part 111 and the second power copper plane part 113 to the busbar copper plane part, respectively The current position of 115, and then flows to the power sink element Sink through the current position of the bus copper portion 115. Then, the layout program can calculate the current drawn by the power sink element Sink, and set a first allowable difference value corresponding to the current of the first power supply element VRM1 and a second allowable difference value corresponding to the current of the second power supply element VRM2, The current drawn by the power supply element Sink is the sum of the current of the first power supply element VRM1 and the current of the second power supply element VRM2.

The first allowable difference value is the absolute value of the maximum tolerable difference between the current and average current of the first power supply element VRM1, and the second allowable difference value is tolerable between the current and average current of the second power supply element VRM2 The absolute value of the largest difference, where the average current is half of the current drawn by the power supply Sink. At this time, the layout program can determine the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, the first power copper portion 111, and the second power supply according to the first allowable difference value and the second allowable difference value Whether the positions of the copper surface portion 113, the third power copper surface portion 121, the busbar copper surface portion 115, the first ground copper surface portion 131, and the second ground copper surface portion 133 conform to the current sharing layout of the printed circuit board design.

For example, assume that the current drawn by the power sink element Sink is 45A, the average current is 22.5A, and the first allowable difference value and the second allowable difference value are 2A. At this time, when the currents of the first power supply element VRM1 and the second power supply element VRM2 are greater than or equal to 20.5A and less than or equal to 24.5A, the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, First power copper surface portion 111, second power copper surface portion 113, third power copper surface portion 121, bus copper surface portion 115, first ground copper surface portion 131, second ground copper surface portion The current position of 133 conforms to the current sharing layout design of the printed circuit board; when at least one of the first power supply element VRM1 and the second power supply element VRM2 has a current less than 20.5A or greater than 24.5A, the first power supply element VRM1 , The second power supply element VRM2, the power draw element Sink, the first power copper surface portion 111, the second power copper surface portion 113, the third power copper surface portion 121, the bus copper surface portion 115, the first ground The current positions of the copper surface portion 131 and the second ground copper surface portion 133 do not conform to the current sharing layout design of the printed circuit board. Then, the layout program can reconfigure the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, the first power copper surface portion 111, the second power copper surface portion 113, and the third power copper surface portion Part 121, the position of the busbar copper part 115, the first ground copper plane part 131, the second ground copper plane part 133, and/or the first allowable difference value and the second allowable difference value (such as High is 3A).

或者

。Alternatively, the layout program can also calculate the first sum of the equivalent resistances of the first power copper surface portion 111 and the first ground copper surface portion 131 (that is, R11+R12), and the second power copper surface portion 113 and The second sum of the equivalent resistances of the second grounded copper surface portion 133 (ie R21+R22). Then, the layout program may determine the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, and the first power supply element VRM1 according to one of the first sum and second sum and the first allowable difference value and the second allowable difference value A power copper surface portion 111, a second power copper surface portion 113, a third power copper surface portion 121, a bus copper surface portion 115, a first ground copper surface portion 131, a second ground copper surface portion 133 Whether the location of the device is in line with the current sharing layout design of the printed circuit board. In other words, the first power supply element VRM1, the second power supply element VRM2, and the Power sink element Sink, first power copper surface portion 111, second power copper surface portion 113, third power copper surface portion 121, bus copper surface portion 115, first ground copper surface portion 131, second Whether the position of the grounded copper surface part 133 conforms to the current sharing layout design of the printed circuit board, the current sharing resistance ratio interval can refer to the following inequality:

or

.

或

時（亦即

或

），則第一電源提供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的當下位置符合印刷電路板的均流佈局設計；反之，則第一電源提供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的當下位置不符合印刷電路板的均流佈局設計。接著，佈局程式可重新配置第一電源提供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的位置、及/或調高第一容許差異值及第二容許差異值（例如調高為3A）。For example, assume that the current drawn by the power sink element Sink is 45A, the average current is 22.5A, and the first allowable difference value and the second allowable difference value are 2A. At this time, when

or

Time (ie

or

), the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, the first power copper surface portion 111, the second power copper surface portion 113, the third power copper surface portion 121, the bus The current positions of the copper surface portion 115, the first ground copper surface portion 131, and the second ground copper surface portion 133 conform to the current sharing layout design of the printed circuit board; otherwise, the first power supply component VRM1, the second power supply Element VRM2, power sink element Sink, first power copper surface portion 111, second power copper surface portion 113, third power copper surface portion 121, bus copper surface portion 115, first ground copper surface portion 131 3. The current position of the second grounded copper surface portion 133 does not conform to the current sharing layout design of the printed circuit board. Then, the layout program can reconfigure the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, the first power copper surface portion 111, the second power copper surface portion 113, and the third power copper surface portion Part 121, the location of the copper plane 115, the first ground copper plane 131, and the second ground copper plane 133, and/or increase the first allowable difference value and the second allowable difference value (for example, increase For 3A).

In this embodiment, the first power copper surface portion 111 and the second power copper surface portion 113 are disposed in the first layer printed circuit board 110, but in other embodiments, the first power copper surface portion 111 and The second power copper surface portion 113 may be disposed in different layers of printed circuit boards, for example, in the first layer printed circuit board 110 and the second layer printed circuit board 120 respectively, and the embodiments of the present invention are not limited thereto. It should be noted that the first power supply element VRM1, the second power supply element VRM2 and the power draw element Sink are arranged (such as plug-in or surface mount), the first power copper surface 111 and the second power copper surface The arrangement of the part 113 in the same layer or different layers can produce different permutations and combinations according to requirements, as long as the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, and the first power copper portion 111 , The second power copper surface portion 113, the third power copper surface portion 121, the busbar copper surface portion 115, the first ground copper surface portion 131, and the second ground copper surface portion 133 conform to the current sharing of the printed circuit board The layout design falls within the scope of the present invention.

FIG. 2A to FIG. 2C are schematic diagrams of layouts of various layers of a printed circuit board according to a second embodiment of the present invention. Please refer to FIGS. 1A to 1C and 2A to 2C, wherein the printed circuit boards shown in FIGS. 2A to 2C are similar to the printed circuit boards shown in FIGS. 1A to 1C, and the same or similar components use the same or similar Label. In this embodiment, the first layer printed circuit board 210, the second layer printed circuit board 220 and the third layer printed circuit board 230 are shown, and the first power supply element VRM1 and the second power supply element VRM2 are plug-ins, respectively Type, but the power sink element Sink is surface mount. That is, the first power supply element VRM1 and the second power supply element VRM2 penetrate the first layer printed circuit board 210, the second layer printed circuit board 220, and the third layer printed circuit board 230, but the power sink component Sink is only configured The top layer of the printed circuit board (for example, the first layer of printed circuit board 210).

The first layer printed circuit board 210 is provided with a copper surface electrically connected to the first power supply element VRM1 and the second power supply element VRM2, but the copper surface and the power draw element Sink are on the first layer printed circuit board 210 Can be regarded as electrical insulation. In this embodiment, the copper surface of the first layer printed circuit board 210 can be roughly divided into a first power copper surface portion 211, a second power copper surface portion 213, and a busbar copper surface portion 215. The first power supply copper surface portion 211 is electrically connected to the first power supply element VRM1 and the busbar copper surface portion 215 to serve as a path for current flowing from the first power supply element VRM1 to the busbar copper surface portion 215.

The second power supply copper surface portion 213 is electrically connected to the second power supply element VRM2 and the busbar copper surface portion 215 to serve as a path for current flowing from the second power supply element VRM2 to the busbar copper surface portion 215. In the second layer printed circuit board 220, a third power copper surface portion 221 is arranged. The third power copper surface portion 221 is electrically connected to the bus copper portion 115 through a plurality of through holes VA21 (corresponding to the second through holes) penetrating from the first layer printed circuit board 120 to the second layer printed circuit board 220, and The third power copper surface part 221 is electrically connected to the power sink element Sink through a plurality of through holes VA22 (corresponding to the first through holes) penetrating from the first layer printed circuit board 210 to the second layer printed circuit board 220 as The path of the current flowing from the copper portion 115 to the power sink Sink.

The third layer printed circuit board 230 is provided with a copper surface connected to the first power supply element VRM1 and the second power supply element VRM2, which is roughly divided into a first ground copper surface portion 231 and a second ground copper surface portion 233 copies. The first ground copper surface portion 231 is electrically connected to the first power supply element VRM1, and the first ground copper surface portion 231 penetrates from the first layer printed circuit board 210 to the third layer printed circuit board 230 through a plurality of The through hole VA23 (corresponding to the third through hole) is electrically connected to the power draw element Sink to serve as a path for the current flowing from the power draw element Sink to the first power supply element VRM1. The second ground copper surface portion 233 is electrically connected to the second power supply element VRM2, and the second ground copper surface portion 233 also passes through from the first layer printed circuit board 210 to the third layer printed circuit board 230 The through holes VA23 are electrically connected to the power sink element Sink to serve as a path for the current flowing from the power sink element Sink to the second power supply element VRM2.

Among them, the first power copper surface portion 211, the second power copper surface portion 213, the busbar copper surface portion 215 and the third power copper surface portion 221 are used to provide (or transmit) a high voltage (such as power supply voltage) to The power draw element Sink, and the first ground copper plane portion 231 and the second ground copper plane portion 233 are used to provide (or transmit) a low voltage (eg, ground voltage) to the power draw element Sink.

FIG. 3 is a schematic layout diagram of a first layer printed circuit board of a printed circuit board according to a third embodiment of the present invention. Please refer to FIG. 3, in this embodiment, only the first layer printed circuit board 310 is shown, and other layers in the printed circuit board can refer to the third layer printed circuit board 130 shown in FIG. 1 or the first layer shown in FIG. 2 The three-layer printed circuit board 230, and the structure of other layers in the printed circuit board can be understood with reference to FIG. 1 or FIG. 2, which will not be repeated here. Wherein, the first power supply element VRM1, the second power supply element VRM2 and the power draw element Sink can be plug-in type or surface mount type respectively, which can be determined according to the circuit design.

In the first layer printed circuit board 310, the first layer printed circuit board 310 is provided with a copper surface electrically connected to the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink. In this embodiment, the copper surface of the first printed circuit board 310 can be roughly divided into a first power copper surface portion 311, a second power copper surface portion 313, a busbar copper surface portion 315, and a third power copper surface Section 317.

The first power supply copper surface portion 311 is electrically connected to the first power supply element VRM1 and the busbar copper surface portion 315 to serve as a path for current flowing from the first power supply element VRM1 to the busbar copper surface portion 315. The second power supply copper surface portion 313 is electrically connected to the second power supply element VRM2 and the busbar copper surface portion 315 to serve as a path for the current flowing from the second power supply element VRM2 to the busbar copper surface portion 315. The third power copper surface portion 317 is electrically connected to the power sink element Sink and the bus copper portion 315 to serve as a path for the current flowing from the bus copper portion 315 to the power sink element Sink. Among them, the first power copper surface portion 311, the second power copper surface portion 313, the busbar copper surface portion 315 and the third power copper surface portion 317 are used to provide (or transmit) a high voltage (such as power supply voltage) to Power sink component Sink.

In other embodiments, the first-layer printed circuit board 310 may be configured with at least one of a first ground copper surface portion (such as 131 or 231) and a second ground copper surface portion (such as 133 or 233), but the present invention The embodiment is not limited to this.

4A-4B are schematic cross-sectional views of a printed circuit board according to a fourth embodiment of the invention. Please refer to FIGS. 4A and 4B. In this embodiment, a 4-layer printed circuit board is illustrated, that is, a first-layer printed circuit board 410, a second-layer printed circuit board 420, and a fourth-layer printed circuit board 430. And the third layer of the printed circuit board 440, wherein "first", "second", "third" and "fourth" are used to distinguish the printed circuit boards of different layers, rather than indicating the order of the printed circuit boards. In addition, the power supply element VRMn and the power draw element Sink are respectively surface-mounted.

Referring to FIG. 4A, in this embodiment, the first power copper surface portion and the second power copper surface portion respectively include a copper surface 411 disposed on the first layer printed circuit board 410 and a second layer printed circuit board 420. The copper surface 421 and the through holes VA41 electrically connected to the copper surfaces 411 and 421 (only shown here as one, but in fact may be multiple), and the copper surfaces 411 and 421 are electrically connected to each other. The copper surface 411 may be electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element) through a serial element (such as a resistor Rn), and the copper surface 421 is electrically connected to the busbar copper portion 425. At this time, the equivalent resistance of the power supply element VRMn to the bus copper portion 425 must take into account the resistance value of the series element (eg, resistor Rn).

The third power copper surface portion includes a copper surface 423 disposed on the second layer printed circuit board 420 and a copper surface 441 on the third layer printed circuit board 440 and a through hole VA42 electrically connecting the copper surfaces 423 and 441 (only depicted here It is shown as one, but in fact it can be more than one), copper planes 423 and 441 are electrically connected to each other. The copper surface 423 is electrically connected to the bus copper portion 425, and the copper surface 441 can be electrically connected to the power sink element Sink through a serial element (eg, resistor Rs). At this time, the equivalent resistance of the copper section 425 to the power sink element Sink must take into account the resistance value of the series element (eg, resistor Rs).

The first ground copper surface portion and the second ground copper surface portion respectively include a copper surface 413 disposed on the first layer printed circuit board 410, a copper surface 431 on the fourth layer printed circuit board 430, and a third layer printed circuit board 440 The copper surface 443 and the through holes VA43, VA44 electrically connected to the copper surfaces 413, 431, and 443, that is, the copper surfaces 413, 431, and 443 are electrically connected to each other. The copper surface 413 is electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper surface 443 is electrically connected to the power draw element Sink.

4C to 4D are schematic cross-sectional views of a printed circuit board according to a fifth embodiment of the invention. Please refer to FIG. 4A to FIG. 4D, wherein the same or similar elements use the same or similar reference numerals. Please refer to FIG. 4C. In this embodiment, the power supply element VRMn and the power draw element Sink are respectively plug-in types.

The first power copper surface portion and the second power copper surface portion respectively include a copper surface 411 disposed on the first layer printed circuit board 410, a copper surface 421 of the second layer printed circuit board 420, and a fourth layer printed circuit board 430 The copper surface 433 and the electrical connection VA41 of the copper surfaces 411, 421 and 433 (only shown here as one, but in fact can be more than one), that is, the copper surfaces 411, 421 and 433 are electrically connected to each other . The copper surfaces 411 and 433 are electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper surface 421 is electrically connected to the busbar copper portion 425.

The third power copper surface portion includes a copper surface 415 disposed on the first layer printed circuit board 410, a copper surface 423 on the second layer printed circuit board 420, a copper surface 435 on the fourth layer printed circuit board 430, and electrically connected copper The perforations VA42 of the surfaces 415, 423 and 435 (only shown here as one, but in fact can be multiple), that is, the copper surfaces 415, 423 and 435 are electrically connected to each other. The copper surface 423 is electrically connected to the bus copper portion 425, and the copper surfaces 415 and 435 are electrically connected to the power sink element Sink.

The first ground copper surface portion and the second ground copper surface portion respectively include copper surfaces 427, 429 disposed on the second layer printed circuit board 420, copper surface 431 of the fourth layer printed circuit board 430, and the third layer printed circuit The copper surfaces 443, 445 of the board 440 and the electrically connected copper surfaces 427, 429, 431, 443, and 445 of the through holes VA43, VA44, that is, the copper surfaces 427, 429, 431, 443, and 445 are electrically connected to each other. The copper faces 427 and 445 are electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper faces 429 and 443 are electrically connected to the power draw element Sink.

FIG. 5 is a flowchart of a method for configuring a copper surface of a printed circuit board according to an embodiment of the invention. Referring to FIG. 5, in this embodiment, the printed circuit board includes a first power copper surface portion electrically connected to the first power supply element, and a second power copper surface portion electrically connected to the second power supply element , A third power copper plane part electrically connected to the power draw element, a first ground copper plane part electrically connected to the first power supply element and the power draw element, and the second power supply element and the power draw element The part of the second ground copper plane electrically connected.

The configuration method of the copper surface of the power supply includes the following steps. In step S510, the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, and the busbar copper are first arranged The surface portion, the first grounded copper surface portion, and the second grounded copper surface portion. In step S520, it is judged whether the current of the first power supply element flows from the current position of the busbar copper surface part to the power draw element, and the current position of the busbar copper surface part is electrically connected to the first power copper plane part and the second The copper part of the power supply and the copper part of the third power supply. When the judgment result of step S520 is “No”, then step S550 is executed; when the judgment result of step S520 is “Yes”, then step S530 is executed.

In step S530, it is determined whether the current of the second power supply element flows from the current position of the busbar copper surface portion to the power supply drain element. When the judgment result of step S530 is "NO", then step S550 is executed; when the judgment result of step S530 is "YES", then step S540 is executed next. In step S540, when the currents of the first power supply element and the second power supply element both flow from the current position of the bus copper portion to the power draw element, according to at least the first allowable difference value and the second allowable difference value One and the average current determine the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion Whether the first ground copper plane part and the second ground copper plane part (that is, the current layout configuration) conform to the current sharing layout design of the printed circuit board, where the first allowable difference value corresponds to the current of the first power supply component And the second allowable difference value corresponds to the current of the second power supply element.

When the judgment result in step S540 is "No", then step S550 is performed; when the judgment result in step S540 is "Yes", then the power copper plane configuration method is then ended. In step S550, the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, and the third power copper surface portion may be readjusted (or configured) Parts, the location of the busbar copper surface portion, the first ground copper surface portion, and the second ground copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher. After step S550, step S520 is then performed to re-determine whether the portion of the copper surface located in the new position/readjusted difference value conforms to the current sharing layout design of the printed circuit board.

6 is a flowchart of a method for configuring a copper surface of a printed circuit board according to another embodiment of the present invention. FIG. 6 is used to further illustrate FIG. 5, but the embodiment of the present invention is not limited thereto. Please refer to FIG. 6. In this embodiment, the method for configuring the copper surface of the power supply includes the following steps. In step S610, the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, and the busbar copper are first arranged The surface portion, the first grounded copper surface portion, and the second grounded copper surface portion. In step S620, the first allowable difference value and the second allowable difference value are set first, that is, under the condition that the current drawn by the power supply element is fixed, the maximum tolerable value between the current of the element provided by the first power supply and the average current The absolute value of the difference is set as the first allowable difference value, and the absolute value of the maximum tolerable difference between the current and the average current of the second power supply element is set as the second allowable difference value.

In step S630, the current sharing resistance ratio interval is calculated, which is the ratio range of the first sum and the second sum when the first allowable difference value and the second allowable difference value are satisfied, which is used to judge whether the standard of current sharing layout design is met . In step S640, it is determined whether the current of the first power supply component flows from the bus copper portion to the power draw element. The bus copper portion is electrically connected to the first power copper surface portion, the second power copper surface portion and the first 3. The copper part of the power supply. If yes, then proceed to step S650; if not, then proceed to step S680. In step S680, the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, and the third power copper surface portion may be readjusted (or configured) Parts, the location of the busbar copper surface portion, the first ground copper surface portion, and the second ground copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher.

In step S650, it is judged whether the current of the second power supply element flows from the copper surface part of the bus to the power draw element. If yes, then proceed to step S660; if not, then proceed to step S680. In step S660, the first sum of the equivalent resistances of the first power copper surface portion and the first grounded copper surface portion, and the second sum of the equivalent resistances of the second power copper surface portion and the second grounded copper surface portion are calculated .

In step S670, it is determined whether the ratio of the first summation and the second summation meets the current sharing resistance ratio interval. If yes, then the method for configuring the copper surface of the power supply is ended; if not, then step S680 is performed. After step S680, step S620 is then performed to re-determine whether the portion of the copper surface at the new position/readjusted difference value conforms to the current-sharing layout design of the printed circuit board.

7 is a flowchart of a method for configuring a copper surface of a printed circuit board according to yet another embodiment of the present invention. Among them, FIG. 7 is used to further illustrate FIG. 5, but the embodiment of the present invention is not limited thereto. Please refer to FIG. 7. In this embodiment, the method for configuring the copper surface of the power supply includes the following steps. In step S710, the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, and the busbar copper will be arranged first The surface portion, the first grounded copper surface portion, and the second grounded copper surface portion. In step S720, the first allowable difference value and the second allowable difference value are first set, that is, under the condition that the current drawn by the power supply element is fixed, the maximum tolerable value between the current of the element provided by the first power supply and the average current The absolute value of the difference is set as the first allowable difference value, and the absolute value of the maximum tolerable difference between the current and the average current of the second power supply element is set as the second allowable difference value.

In step S730, it is judged whether the current of the first power supply component flows from the bus copper portion to the power draw element, and the bus copper portion is electrically connected to the first power copper surface portion, the second power copper surface portion and the first 3. The copper part of the power supply. If yes, then proceed to step S740; if not, then proceed to step S770. In step S770, the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, and the third power copper surface portion may be readjusted (or configured) Parts, the location of the busbar copper surface portion, the first ground copper surface portion, and the second ground copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher.

In step S740, it is determined whether the current of the second power supply element flows from the copper busbar portion to the power draw element. If yes, then proceed to step S750; if not, then proceed to step S770. In step S750, the currents of the first power supply element and the second power supply element are calculated.

In step S760, it is determined whether the current of the first power supply element/the second power supply element meets the first allowable difference value/the second allowable difference value. If yes, then the method for configuring the copper surface of the power supply is ended; if not, then step S770 is performed. After step S770, step S720 is then performed to re-determine whether the portion of the copper surface at the new position/readjusted difference value conforms to the current-sharing layout design of the printed circuit board.

Among them, the sequence of steps S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760, and S770 are for illustration. The embodiments of the invention are not limited thereto. In addition, the order of steps S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760, and S770 can be referred to FIG. 1A to FIG. 1C, FIG. 2A to FIG. 2C, FIG. 3, and FIG. 4A to FIG. 4D are shown in the embodiments, which will not be repeated here.

In summary, the printed circuit board and the method for configuring the copper surface of the power supply according to the embodiments of the present invention can determine whether the part of the copper surface of the bus meets the printing according to at least one of the first allowable difference value and the second allowable difference value and the average current Circuit board layout design. Thereby, the situation that the output current of the first power supply element and the second power supply element are uneven can be avoided or suppressed.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

110, 210, 310, 410: first layer printed circuit board 111, 211, 311: copper surface part of the first power supply 113, 213, 313: Copper surface part of the second power supply 115, 215, 315, 425: part of the copper surface 120, 220, 420: second layer printed circuit board 121, 221, 317: copper surface part of the third power supply 130, 230, 440: third layer printed circuit board 131, 231: the first grounded copper surface part 133, 233: the second grounded copper surface part 411, 413, 415, 421, 423, 427, 429, 431, 433, 435, 441, 443, 445: copper surface 430: Fourth layer printed circuit board R11, R12, R21, R22: equivalent resistance Rn, Rs: resistance Sink: power draw components VA11, VA21, VA22, VA23, VA41, VA42, VA43, VA44: perforated VRM1: the first power supply component VRM2: second power supply component VRMn: power supply component S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760, S770: Steps

FIG. 1A to FIG. 1C are schematic layout diagrams of layers of a printed circuit board according to a first embodiment of the present invention. FIG. 2A to FIG. 2C are schematic diagrams of layouts of various layers of a printed circuit board according to a second embodiment of the present invention. FIG. 3 is a schematic layout diagram of a first layer printed circuit board of a printed circuit board according to a third embodiment of the present invention. 4A-4B are schematic cross-sectional views of a printed circuit board according to a fourth embodiment of the invention. 4C to 4D are schematic cross-sectional views of a printed circuit board according to a fifth embodiment of the invention. FIG. 5 is a flowchart of a method for configuring a copper surface of a printed circuit board according to an embodiment of the invention. 6 is a flowchart of a method for configuring a copper surface of a printed circuit board according to another embodiment of the present invention. 7 is a flowchart of a method for configuring a copper surface of a printed circuit board according to yet another embodiment of the present invention.

S510, S520, S530, S540, S550: steps

Claims (15)

A printed circuit board includes: a first power supply element; a second power supply element; a power draw element; a first power copper surface part, electrically connected to the first power supply element; a second power copper The surface portion is electrically connected to the second power supply component; a third power copper surface portion is electrically connected to the power draw element; a busbar copper surface portion is electrically connected to the first power copper surface portion, The second power supply copper surface portion and the third power supply copper surface portion, the current provided by the first power supply element and the second power supply element respectively pass through the first power supply copper surface portion and the second power supply The copper plane part flows to the busbar copper plane part, and then flows to the power draw component through the busbar copper plane part; a first ground copper plane part, electrically connected to the first power supply element and the power supply A drawing element; and a second grounded copper surface portion, electrically connected to the second power supply element and the power drawing element, and the first power supply element, the second power supply element, the power drawing element, the first A power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground copper surface portion and the second ground copper surface portion are It conforms to a current-sharing layout design of the printed circuit board, wherein when a first sum of equivalent resistances of the first power copper surface portion and the first ground copper surface portion and the second power copper surface portion and When a second sum of equivalent resistances of the second grounded copper plane part meets the following inequality, the first power supply element, the second power supply element, the power draw element, and the first power copper plane part are determined , The second power copper plane part, the third power copper plane part, the busbar copper plane part, the first ground copper plane part and the second ground copper plane part are designed in accordance with the current sharing layout :

or

Wherein the first allowable difference value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element, or, when the current of the first power supply element and the average current When the absolute value of the difference is less than or equal to the first allowable difference and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the second allowable difference, the first power supply element, The second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground The copper surface portion and the second grounded copper surface portion conform to the current sharing layout design. The printed circuit board according to item 1 of the patent application scope, wherein the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, and the second power copper surface portion The part, the third power copper plane part, the busbar copper plane part, the first ground copper plane part and the second ground copper plane part conform to a layout design of the printed circuit board. The printed circuit board as described in item 1 of the patent application scope, wherein when the first power supply element, the second power supply element and the power extraction element are of a plug-in type, the copper surface portion of the first power supply and the first A power supply element is electrically connected on a first layer printed circuit board, the second power supply copper portion is electrically connected to the second power supply element on the first layer printed circuit board, and the third power copper portion It is electrically connected to the power-supplying element on a second layer printed circuit board, the busbar copper surface part and the first power copper surface part and the second power copper surface part are on the first layer printed circuit board Electrically connected, and the busbar copper surface portion and the third power copper surface portion are electrically connected through a plurality of through holes penetrating from the first layer printed circuit board to the second layer printed circuit board. The printed circuit board of claim 3, wherein the first ground copper plane portion, the first power supply element, the second ground copper plane portion and the second power supply element and the power draw The components are electrically connected on a third layer printed circuit board. The printed circuit board according to item 1 of the scope of the patent application, wherein when the first power supply element and the second power supply element are of the plug-in type and the power extraction element is of the surface mount type, the first power copper portion It is electrically connected to the first power supply element on a first layer printed circuit board, and the copper surface portion of the second power supply element is electrically connected to the second power supply element on the first layer printed circuit board. The third power copper surface portion of the two-layer printed circuit board and the power-supplying element located on the first-layer printed circuit board penetrate through the plurality of layers from the first-layer printed circuit board to the second-layer printed circuit board The first through hole is electrically connected, the bus copper portion is electrically connected to the first power copper surface portion and the second power copper surface portion on the first layer printed circuit board, and the bus copper surface portion The copper surface portion of the third power supply is electrically connected through a plurality of second through holes penetrating from the first layer printed circuit board to the second layer printed circuit board. The printed circuit board according to item 5 of the patent application scope, wherein the first ground copper plane part, the first power supply element, the second ground copper plane part and the second power supply element are on a third layer The printed circuit board is electrically connected, and the first ground copper surface portion and the second ground copper surface portion and the power draw element pass through from the first layer printed circuit board to the third layer printed circuit board A third perforation is electrically connected. The printed circuit board as described in item 1 of the patent application scope, wherein when the first power supply element, the second power supply element and the power extraction element are surface-mounted, the copper surface portion of the first power supply and the The first power supply element is electrically connected on a first layer printed circuit board, the copper portion of the second power supply is electrically connected to the second power supply element on the first layer printed circuit board, and the third power copper surface Part is electrically connected to the power draw element on the first layer printed circuit board, the bus copper part, the first power copper part, the second power copper part and the third power copper part Some are electrically connected on the first layer printed circuit board. The printed circuit board according to item 1 of the patent application scope, wherein when the first power supply element, the second power supply element, and the power draw element are surface-mount, the copper surface portion of the first power supply and the The second power copper surface portion has a plurality of copper surfaces on a first layer printed circuit board and a second layer printed circuit board which are electrically connected to each other, and the third power copper surface portion has a second layer on the second layer Printed circuit board and a third layer printed circuit board and a plurality of copper surfaces electrically connected to each other, the first power copper surface portion, the first power supply element, the second power copper surface portion and the second The power supply element is electrically connected to the first printed circuit board, the busbar copper surface portion, the first power copper surface portion, the second power copper surface portion and the third power copper surface portion are located at the The second layer printed circuit board is electrically connected, and the copper portion of the third power supply is electrically connected to the power draw element on the third layer printed circuit board. The printed circuit board according to item 8 of the patent application scope, wherein the first ground copper surface portion and the second ground copper surface portion respectively include the first layer printed circuit board and a fourth layer printed circuit board And a plurality of copper surfaces of the third layer printed circuit board electrically connected to each other, the first ground copper surface portion is electrically connected to the first power supply element at the first layer printed circuit board, the first ground The copper surface portion is electrically connected to the power draw element on the third layer printed circuit board, and the second ground copper surface portion is electrically connected to the second power supply element on the first layer printed circuit board. The two grounded copper planes are electrically connected to the third layer of the printed circuit board. The printed circuit board as described in item 1 of the patent application scope, wherein when the first power supply element, the second power supply element and the power extraction element are of the plug-in type, the copper surface portion of the first power supply and the first The two power supply copper surfaces individually have a plurality of copper surfaces that are located on a first layer printed circuit board, a second layer printed circuit board, and a third layer printed circuit board and are electrically connected to each other. It has a plurality of copper planes located on the first layer printed circuit board, the second layer printed circuit board and the third layer printed circuit board and electrically connected to each other, the first power copper plane part, the first power source The supply element, the second power supply copper surface portion and the second power supply element are electrically connected on the first layer printed circuit board and the third layer printed circuit board, the busbar copper surface portion, the first power supply copper The surface portion, the second power copper surface portion and the third power copper surface portion are electrically connected on the second layer printed circuit board, the third power copper surface portion and the power draw element are in the first The layered printed circuit board and the third layer printed circuit board are electrically connected. The printed circuit board according to item 10 of the patent application scope, wherein the first ground copper surface portion and the second ground copper surface portion respectively include the second layer printed circuit board and the third layer printed circuit board And a fourth layer printed circuit board and a plurality of copper surfaces electrically connected to each other, the first ground copper surface portion and the first power supply element are on the second layer printed circuit board and the fourth layer printed circuit board Electrically connected, the first grounded copper surface portion and the power draw element are electrically connected to the second layer printed circuit board and the fourth layer printed circuit board, the second grounded copper surface portion and the second power supply Provide elements are electrically connected on the second layer printed circuit board and the fourth layer printed circuit board, the second ground copper surface portion and the power draw element are printed on the second layer printed circuit board and the fourth layer The circuit board is electrically connected. A method for configuring a power supply copper surface of a printed circuit board. The printed circuit board includes a first power supply copper surface portion electrically connected to a first power supply element, and a second power supply element electrically connected to a second power supply element A power copper surface portion, a third power copper surface portion electrically connected to a power draw element, a first ground copper surface portion electrically connected to the first power supply element and the power draw element, and A second ground copper plane part electrically connected to the second power supply element and the power draw element, the power copper plane configuration method includes: The first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, and a busbar A surface portion, the first grounded copper surface portion and the second grounded copper surface portion; Judging whether the current of the first power supply component flows from the busbar copper part to the power drawer component, the busbar copper part is electrically connected to the first power copper plane part and the second power copper plane part And the copper part of the third power supply; Judging whether the current of the second power supply component flows from the bus copper part to the power draw component; When the current of the first power supply element and the second power supply element both flow from the bus copper part to the power draw element, according to at least one of a first allowable difference value and a second allowable difference value And an average current to judge the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion , Whether the part of the busbar copper plane, the first grounded copper plane part and the second grounded copper plane part conform to a current sharing layout design of the printed circuit board, wherein the first allowable difference value corresponds to the first power supply Providing the current of the element, and the second allowable difference value corresponds to the current of the second power supply element; When the first power supply element, the second power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper When the plane part, the first ground copper plane part and the second ground copper plane part conform to the current sharing layout design of the printed circuit board, the power copper plane configuration method ends. The method for configuring a copper surface of a power supply as described in item 12 of the patent application scope further includes when the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, and the second The power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground copper surface portion and the second ground copper surface portion do not conform to the current sharing layout of the printed circuit board At design time, at least one of the following actions is performed: reconfiguration of the first power supply element, the second power supply element, the power draw element, the copper portion of the first power supply, the copper portion of the second power supply, The positions of the third power copper plane part, the busbar copper plane part, the first ground copper plane part and the second ground copper plane part, and increase the first allowable difference value and the second allowable Difference value. The method for configuring a copper surface of a power supply according to item 12 of the patent application scope, wherein the first power supply element and the second power supply element are determined based on at least one of the first allowable difference value and the second allowable difference value and the average current Power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground copper surface portion The step of determining whether the second grounded copper plane part complies with the current sharing layout design of the printed circuit board includes: calculating one of the equivalent resistances of the first power copper plane part and the first ground copper plane part A first sum and a second sum of the equivalent resistances of the copper surface portion of the second power supply and the second ground copper surface portion; determine whether the ratio of the first sum and the second sum meets an average according to the following inequality Current resistance ratio:

or

When the ratio of the first sum and the second sum meets the ratio of the current sharing resistance, the first power supply element, the second power supply element, the power draw element, the copper portion of the first power supply, the first The second power copper plane part, the third power copper plane part, the busbar copper plane part, the first ground copper plane part and the second ground copper plane part conform to the current sharing layout of the printed circuit board Design; and when the ratio of the first summation and the second summation does not satisfy the ratio of current sharing resistance, the first power supply element, the second power supply element, the power draw element, the first power copper surface Parts, the second power copper plane part, the third power copper plane part, the busbar copper plane part, the first ground copper plane part and the second ground copper plane part do not conform to the printed circuit board The current sharing layout design. The method for configuring a copper surface of a power supply according to item 12 of the patent application scope, wherein the first power supply element and the second Power supply element, the power extraction element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the busbar copper surface portion, the first ground copper surface portion The step of determining whether the portion of the second grounded copper plane conforms to the current sharing layout design of the printed circuit board includes: When the absolute value of the difference between the current of the first power supply element and the average current is less than or equal to the first allowable difference and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the first When the two allowable difference values, the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion Parts, the busbar copper surface portion, the first ground copper surface portion and the second ground copper surface portion conform to the current sharing layout design of the printed circuit board; and When the absolute value of the difference between the current of the first power supply element and the average current is greater than the first allowable difference or the absolute value of the difference between the current of the second power supply element and the average current is greater than the second allowable When the difference value, the first power supply element, the second power supply element, the power draw element, the first power copper plane part, the second power copper plane part, the third power copper plane part, The busbar copper surface portion, the first ground copper surface portion and the second ground copper surface portion do not conform to the current sharing layout design of the printed circuit board.

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