TWI730365B - Printed circuit board and power copper surface configuration method thereof - Google Patents

Abstract

A printed circuit board and a power copper configuration method thereof. The method includes the following steps. First and second power providing elements, a power sink element, a confluence copper portion, first and second ground copper portions are disposed. Whether currents of first and second power providing elements are flowing to a power sink element through a confluence copper portion is determined. When currents of both the first and the second power providing elements are flowing to the power sink element through the confluence copper portion, whether the confluence copper portion is met an average current layout design of the printed circuit board according to at least one of a first toleration difference value and a second toleration difference value and an average current. When the confluence copper portion is met the average current layout design of the printed circuit board, the power copper configuration method is ended.

Description

Printed circuit board and its power supply copper surface configuration method

The invention relates to a printed circuit board, and more particularly to a printed circuit board and a method for configuring the copper surface of the power supply.

In the printed circuit board, the power network transmission design is roughly divided into three parts, namely, power supply components, transmission channels, and power draw components. When designing that multiple power supply components are connected to the same power draw component, the printed circuit board layout engineer will determine the location of each power supply component and power draw component according to factors such as institutional requirements, the size of the current draw, and so on. And connect with the copper surface of the power supply.

However, due to the different layout paths, the equivalent resistances of the intermediate channels from each power supply component to the same power draw component may be different. The sources of the equivalent resistance include the power copper surface as the channel and the series connection components. Under the condition that the output voltage of the power supply component is the same, when the equivalent resistance of the intermediate channel from each power supply component to the same power draw component is different, the output power of each power supply component is different. The flow may be uneven, that is, the load of the power supply components is uneven.

The invention provides a printed circuit board and a power supply copper surface configuration method thereof, which can avoid or suppress the uneven output current of power supply components.

The printed circuit board of the present invention includes a first power supply element, a second power supply element, a power draw element, a first power supply copper surface portion, a second power supply copper surface portion, a third power supply copper surface portion, and a bus copper Surface part, first grounded copper surface part, and second grounded copper surface part. The copper surface of the first power supply is electrically connected to the first power supply element. The copper surface of the second power supply is electrically connected to the second power supply element. The copper surface of the third power supply is electrically connected to the power draw element. The bus copper surface part is electrically connected to the first power copper surface part, the second power copper surface part and the third power copper surface part. The current provided by the first power supply component and the second power supply component are respectively passed through The first power supply copper surface portion and the second power supply copper surface portion flow to the bus copper surface portion, and then flow to the power draw element through the bus copper surface portion. The first grounded copper surface is electrically connected to the first power supply element and the power draw element. And, the second grounded copper surface portion is electrically connected to the second power supply element and the power draw element, wherein the first power supply element, the second power supply element, the power draw element, the first power copper surface portion, and the second power source The copper surface part, the third power copper surface part, the bus copper surface part, the first grounding copper surface part, and the second grounding copper surface part are designed to conform to the current-sharing layout of the printed circuit board. When the first sum of the equivalent resistances of the first power supply copper surface part and the first grounding copper surface part and the second sum of the equivalent resistances of the second power supply copper surface part and the second grounding copper surface part meet the following In the case of inequality, judge the first power supply component, the second power supply component, the power draw component, the first power copper surface part, the second power copper surface part, the third power copper surface part, the bus copper surface part, The first grounded copper surface part and the second grounded copper surface part are designed to comply with the current-sharing layout:

or

The first allowable difference value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element. Or, when the absolute value of the difference between the current of the first power supply element and the average current is less than or equal to the first allowable difference value and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the second allowable difference value When, the first power supply component, the second power supply component, the power draw component, the first power copper surface part, the second power copper surface part, the third power copper surface part, the bus copper surface part, the first The grounded copper surface part and the second grounded copper surface part conform to the current-sharing layout design.

In the method for configuring the power copper surface of a printed circuit board of the present invention, the printed circuit board includes a first power copper surface portion electrically connected to the first power supply element, and a second power copper surface electrically connected to the second power supply element Part, the third power copper surface part that is electrically connected to the power draw component, the bus copper surface that is electrically connected to the first power copper surface part, the second power copper surface part, and the third power copper surface part Part, the part of the first grounded copper surface electrically connected to the first power supply component and the power draw component, and The part of the second grounded copper surface electrically connected with the second power supply element and the power draw element. The method for configuring the copper surface of the power supply includes the following steps. Configure the first power supply component, the second power supply component, the power draw component, the first power copper surface part, the second power copper surface part, the third power copper surface part, the bus copper surface part, and the first ground Copper surface part, second grounding copper surface part. Determine whether the current of the first power supply component flows from the bus copper surface to the power draw component, and the bus copper surface is electrically connected to the first power copper surface, the second power copper surface, and the third power copper surface Part. It is determined whether the current of the second power supply component flows from the bus copper surface portion to the power draw component. When the currents of the first power supply component and the second power supply component flow from the bus copper surface to the power draw component, determine the first according to at least one of the first allowable difference value and the second allowable difference value and the average current Power supply component, second power supply component, power draw component, first power copper surface part, second power copper surface part, third power copper surface part, bus copper surface part, first ground copper surface part Whether the second grounded copper surface part complies with the current-sharing layout design of the printed circuit board, where the first allowable difference value corresponds to the current of the first power supply component, and the second allowable difference value corresponds to the current of the second power supply component. When the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, and the first ground When the copper surface part and the second grounding copper surface part conform to the current-sharing layout design of the printed circuit board, the power supply copper surface configuration method is ended.

The printed circuit board and its power supply copper surface configuration method of the embodiment of the present invention can be judged based on at least one of the first allowable difference value and the second allowable difference value and the average current. Disconnect the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, and the first ground Whether the copper surface part and the second grounding copper surface part conform to the current-sharing layout design of the printed circuit board. In this way, the uneven output current of the first power supply element and the second power supply element can be avoided or suppressed.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

110, 210, 310, 410: the first layer of printed circuit board

111, 211, 311: the copper surface part of the first power supply

113, 213, 313: copper surface part of the second power supply

115, 215, 315, 425: confluence copper surface part

120, 220, 420: second layer printed circuit board

121, 221, 317: third power copper surface part

130, 230, 440: third layer printed circuit board

131, 231: the first ground copper surface part

133, 233: the second ground copper surface part

411, 413, 415, 421, 423, 427, 429, 431, 433, 435, 441, 443, 445: copper surface

430: The fourth layer of printed circuit board

R11, R12, R21, R22: equivalent resistance

Rn, Rs: resistance

Sink: Power draw component

VA11, VA21, VA22, VA23, VA41, VA42, VA43, VA44: perforation

VRM1: The first power supply component

VRM2: The second power supply component

VRMn: power supply element

S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760, S770: steps

1A to 1C are schematic diagrams of the layout of each level of the printed circuit board according to the first embodiment of the present invention.

2A to 2C are schematic diagrams of the layout of each level of the printed circuit board according to the second embodiment of the present invention.

3 is a schematic diagram of the layout of the first layer printed circuit board of the printed circuit board according to the third embodiment of the present invention.

4A to 4B are schematic cross-sectional views of a printed circuit board according to a fourth embodiment of the invention.

4C to 4D are schematic cross-sectional views of a printed circuit board according to a fifth embodiment of the invention.

FIG. 5 is a flowchart of a method for configuring a power copper surface of a printed circuit board according to an embodiment of the present invention.

6 is a flowchart of a method for configuring a power copper surface of a printed circuit board according to another embodiment of the present invention.

FIG. 7 is a flowchart of a method for configuring the power copper surface of a printed circuit board according to another embodiment of the present invention.

1A to 1C are schematic diagrams of the layout of each level of the printed circuit board according to the first embodiment of the present invention. 1A to 1C, in this embodiment, only three layers of the printed circuit board are shown for illustration, that is, the first layer of printed circuit board 110, the second layer of printed circuit board 120, and the third layer of printed circuit board 130, but in other embodiments, the printed circuit board may have other layers of printed circuit boards.

In the printed circuit board, at least a first power supply element VRM1, a second power supply element VRM2, and a power sink element Sink are configured, wherein the first power supply element VRM1 and the second power supply element VRM2 are used to provide current. Here, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink are plug-in types, respectively, that is, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink penetrate the first Layer printed circuit board 110, second layer printed circuit board 120, and third layer printed circuit board 130. In other embodiments, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink may be surface-mounted, that is, the first power supply element VRM1, the second power supply element VRM2, and the power draw element Sink It can be respectively arranged on the top layer (for example, the first layer printed circuit board 110) and the bottom layer of the printed circuit board. The bottom layer (for example, the third layer printed circuit board 130), and the first power supply element VRM1 and the second power supply element VRM2 can be arranged in different layers of printed circuit boards.

1A, in the first layer of the printed circuit board 110, there is a copper surface electrically connected to the first power supply element VRM1 and the second power supply element VRM2, but this copper surface and the power draw element Sink are in the first The layer printed circuit board 110 can be regarded as electrical insulation. In this embodiment, the copper surface of the first-layer printed circuit board 110 can be roughly divided into a first power supply copper surface portion 111, a second power supply copper surface portion 113, and a bus copper surface portion 115. The first power supply copper surface part 111 is electrically connected to the first power supply element VRM1 and the bus copper surface part 115, and serves as a path for the current flowing from the first power supply element VRM1 to the bus copper surface part 115, etc. The effective resistance is R11.

The second power supply copper surface part 113 is electrically connected to the second power supply element VRM2 and the bus copper surface part 115, and serves as a path for the current flowing from the second power supply element VRM2 to the bus copper surface part 115, etc. The effective resistance is R21. 1B, in the second layer of the printed circuit board 120, a copper surface (including the third power copper surface portion 121) electrically connected to the power sink component Sink is configured, wherein the third power copper surface portion 121 penetrates A plurality of through holes VA11 penetrated from the first-layer printed circuit board 110 to the second-layer printed circuit board 120 are electrically connected to the bus copper surface portion 115 to serve as a flow from the bus copper surface portion 115 to the power sink component Sink The path of the current.

1C, in the third layer of the printed circuit board 130, there is configured a copper surface electrically connected to the first power supply element VRM1, the second power supply element VRM2, and the power sink element Sink, which is roughly divided into the first ground The copper surface portion 131 and the second grounded copper surface portion 133. The first grounded copper surface portion 131 and the first power supply component The VRM1 and the power sink element Sink are electrically connected to serve as a path for the current flowing from the power sink element Sink to the first power source element VRM1, and its equivalent resistance is R12. The second grounded copper surface portion 133 is electrically connected to the second power supply element VRM2 and the power draw element Sink to serve as a path for the current flowing from the power draw element Sink to the second power supply element VRM2, and its equivalent resistance is R22 .

Among them, the first power supply copper surface portion 111, the second power supply copper surface portion 113, the bus copper surface portion 115 and the third power supply copper surface portion 121 are used to provide (or transmit) a high voltage (such as a power supply voltage) to The power sink element Sink, and the first grounded copper surface portion 131 and the second grounded copper surface portion 133 are used to provide (or transmit) a low voltage (for example, ground voltage) to the power sink element Sink.

In this embodiment, the layout program is used to simulate the printed circuit boards shown in FIGS. 1A to 1C first, and perform current sharing actions to balance the output loads of the first power supply component VRM1 and the second power supply component VRM2. In other words, in the layout program, the first power supply component VRM1, the second power supply component VRM2, the power sink component Sink, the first power copper surface part 111, the second power copper surface part 113, and the third power supply are first determined in the layout program. The positions of the copper surface portion 121, the bus copper surface portion 115, the first grounded copper surface portion 131, and the second grounded copper surface portion 133. Among them, the layout program determines that the first power supply component VRM1, the second power supply component VRM2, the power draw component Sink, the first power copper surface portion 111, the second power copper surface portion 113, and the third power copper surface portion 121 、Whether the positions of the bus copper surface part 115, the first grounded copper surface part 131, and the second grounded copper surface part 133 conform to the current-sharing layout design of the printed circuit board to determine whether to reconfigure the first power supply element VRM1, Two power supply Provide component VRM2, power sink component Sink, first power copper surface part 111, second power copper surface part 113, third power copper surface part 121, bus copper surface part 115, first ground copper surface part 131. The position of the second grounding copper surface part 133.

In the embodiment of the present invention, the currents of the first power supply element VRM1 and the second power supply element VRM2 respectively flow through the first power supply copper surface portion 111 and the second power supply copper surface portion 113 to the bus copper surface portion The current position of 115 and the current position of the bus copper surface portion 115 flows to the power sink element Sink. Then, the layout program can calculate the current drawn by the power source component Sink, and set the first allowable difference value corresponding to the current of the first power supply element VRM1 and set the second allowable difference value corresponding to the current of the second power supply element VRM2, The current of the power sink element Sink is the sum of the current of the first power supply element VRM1 and the current of the second power supply element VRM2.

The first allowable difference value is the absolute value of the maximum tolerable difference between the current of the first power supply element VRM1 and the average current, and the second allowable difference value is the tolerable maximum difference between the current of the second power supply element VRM2 and the average current The absolute value of the maximum difference, where the average current is half of the current drawn by the power supply element Sink. At this time, the layout program can determine the first power supply component VRM1, the second power supply component VRM2, the power draw component Sink, the first power copper surface part 111, and the second power supply according to the first allowable difference value and the second allowable difference value. Are the positions of the copper surface part 113, the third power copper surface part 121, the bus copper surface part 115, the first ground copper surface part 131, and the second ground copper surface part 133 in line with the current-sharing layout of the printed circuit board? design.

For example, suppose that the current of the sink component of the power supply is 45A, and the average The current is 22.5A, and the first allowable difference value and the second allowable difference value are 2A. At this time, when the currents of the first power supply element VRM1 and the second power supply element VRM2 are both greater than or equal to 20.5A and less than or equal to 24.5A, the first power supply element VRM1, the second power supply element VRM2, the power draw element Sink, The first power copper surface part 111, the second power copper surface part 113, the third power copper surface part 121, the bus copper surface part 115, the first ground copper surface part 131, the second ground copper surface part The current position of 133 conforms to the current-sharing layout design of the printed circuit board; when the current of at least one of the first power supply element VRM1 and the second power supply element VRM2 is less than 20.5A or greater than 24.5A, the first power supply element VRM1 , The second power supply component VRM2, the power draw component Sink, the first power copper surface part 111, the second power copper surface part 113, the third power copper surface part 121, the bus copper surface part 115, the first ground The current positions of the copper surface portion 131 and the second grounded copper surface portion 133 do not conform to the current sharing layout design of the printed circuit board. Then, the layout program can reconfigure the first power supply component VRM1, the second power supply component VRM2, the power draw component Sink, the first power supply copper surface part 111, the second power supply copper surface part 113, and the third power supply copper surface part. The position of the part 121, the bus copper surface part 115, the first grounded copper surface part 131, the second grounded copper surface part 133, and/or the first allowable difference value and the second allowable difference value (e.g., adjust The height is 3A).

Alternatively, the layout program can calculate the first sum of the equivalent resistances of the first power copper surface part 111 and the first grounding copper surface part 131 (ie R11+R12), and the second power copper surface part 113 and The second sum of the equivalent resistances of the second grounded copper surface portion 133 (that is, R21+R22). Then, the layout program can determine the first power supply component VRM1, the second power supply component VRM2, the power drain component Sink, and the first allowable difference value and one of the second allowable difference value according to the first sum and the second sum. A power supply copper surface portion 111, a second power supply copper surface portion 113, a third power supply copper surface portion 121, a bus copper surface portion 115, a first grounded copper surface portion 131, and a second grounded copper surface portion 133 Whether the position accords with the current-sharing layout design of the printed circuit board. In other words, the first power supply element VRM1, the second power supply element VRM2 can be determined according to whether the ratio of the first sum to the second sum is within the current-sharing resistance ratio interval that satisfies the first allowable difference value and the second allowable difference value. Power sink component Sink, first power copper surface portion 111, second power copper surface portion 113, third power copper surface portion 121, bus copper surface portion 115, first ground copper surface portion 131, second power copper surface portion 113 Whether the position of the grounded copper surface part 133 conforms to the current-sharing layout design of the printed circuit board, and the current-sharing resistance ratio range can be shown by referring to the following inequality:

or

或

時(亦即 0.837

1.195或0.837

1.195)，則第一電源提 供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的當下位置符合印刷電路板的均流佈局設計；反之，則第一電源提供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的當下位置不符合印刷電路板的均流佈局設計。接著，佈局程式可重新配置第一電源提供元件VRM1、第二電源提供元件VRM2、電源汲取元件Sink、第一電源銅面部份111、第二電源銅面部份113、第三電源銅面部份121、匯流銅面部份115、第一接地銅面部份131、第二接地銅面部份133的位置、及/或調高第一容許差異值及第二容許差異值(例如調高為3A)。 For example, suppose that the current of the power sink element Sink is 45A, the average current is 22.5A, and the first allowable difference value and the second allowable difference value are 2A. At this time, when

or

Hour (i.e. 0.837

1.195 or 0.837

1.195), the first power supply component VRM1, the second power supply component VRM2, the power draw component Sink, the first power copper surface part 111, the second power copper surface part 113, the third power copper surface part 121, The current positions of the bus copper surface 115, the first ground copper surface 131, and the second ground copper surface 133 conform to the current-sharing layout design of the printed circuit board; otherwise, the first power supply component VRM1 and the second power supply Provide component VRM2, power sink component Sink, first power copper surface part 111, second power copper surface part 113, third power copper surface part 121, bus copper surface part 115, first ground copper surface part 131. The current position of the second grounding copper surface portion 133 does not conform to the current-sharing layout design of the printed circuit board. Then, the layout program can reconfigure the first power supply component VRM1, the second power supply component VRM2, the power draw component Sink, the first power supply copper surface part 111, the second power supply copper surface part 113, and the third power supply copper surface part. Part 121, bus copper surface part 115, first grounded copper surface part 131, second grounded copper surface part 133, and/or increase the first allowable difference value and the second allowable difference value (e.g. increase 3A).

In this embodiment, the first power supply copper surface portion 111 and the second power supply copper surface portion 113 are disposed in the first layer printed circuit board 110, but in other embodiments, the first power supply copper surface portion 111 and The second power copper surface portion 113 may be configured in different layers of printed circuit boards, such as the first layer printed circuit board 110 and the second layer printed circuit board 120, respectively, and the embodiment of the present invention is not limited thereto. It should be noted that the arrangement of the first power supply component VRM1, the second power supply component VRM2, and the power sink component Sink (such as plug-in type or surface mount type), and the first power supply copper surface part 111 and the second power supply copper surface The disposition of the part 113 on the same layer or different layers can produce different permutations and combinations according to requirements, as long as the first power supply element VRM1, second power supply component VRM2, power draw component Sink, first power copper surface part 111, second power copper surface part 113, third power copper surface part 121, bus copper surface part 115, first The grounded copper surface portion 131 and the second grounded copper surface portion 133 conform to the current-sharing layout design of the printed circuit board, and both fall within the scope of the present invention.

2A to 2C are schematic diagrams of the layout of each level of the printed circuit board according to the second embodiment of the present invention. Please refer to Figures 1A to 1C and Figures 2A to 2C, where the printed circuit board shown in Figures 2A to 2C is similar to the printed circuit board shown in Figures 1A to 1C, wherein the same or similar components use the same or similar Label. In this embodiment, the first-layer printed circuit board 210, the second-layer printed circuit board 220, and the third-layer printed circuit board 230 are shown, and the first power supply component VRM1 and the second power supply component VRM2 are plug-ins, respectively Type, but the power sink component Sink is surface-mounted. That is, the first power supply element VRM1 and the second power supply element VRM2 penetrate the first layer printed circuit board 210, the second layer printed circuit board 220, and the third layer printed circuit board 230, but the power sink element Sink is only configured On the top layer of the printed circuit board (for example, the first layer of printed circuit board 210).

In the first layer printed circuit board 210, a copper surface electrically connected to the first power supply element VRM1 and the second power supply element VRM2 is arranged, but this copper surface and the power sink element Sink are on the first layer printed circuit board 210 It can be regarded as electrical insulation. In this embodiment, the copper surface of the first-layer printed circuit board 210 can be roughly divided into a first power copper surface portion 211, a second power copper surface portion 213, and a bus copper surface portion 215. The first power supply copper surface portion 211 is electrically connected to the first power supply element VRM1 and the bus copper surface portion 215, and serves as a flow from the first power supply element VRM1 to Converge the current path of the copper surface portion 215.

The second power supply copper surface portion 213 is electrically connected to the second power supply element VRM2 and the bus copper surface portion 215, and serves as a path for the current flowing from the second power supply device VRM2 to the bus copper surface portion 215. In the second layer printed circuit board 220, a third power supply copper surface portion 221 is arranged. The third power copper surface portion 221 is electrically connected to the bus copper surface portion 215 through a plurality of through holes VA21 (corresponding to the second through holes) that penetrate from the first layer printed circuit board 210 to the second layer printed circuit board 220, and The third power copper surface portion 221 is electrically connected to the power sink element Sink through a plurality of through holes VA22 (corresponding to the first through holes) penetrating from the first layer printed circuit board 210 to the second layer printed circuit board 220. The bus copper surface portion 215 flows to the path of the current of the power sink element Sink.

In the third layer printed circuit board 230, a copper surface connected to the first power supply element VRM1 and the second power supply element VRM2 is arranged, which is roughly divided into a first grounded copper surface portion 231 and a second grounded copper surface portion Parts 233. The first grounded copper surface portion 231 is electrically connected to the first power supply element VRM1, and the first grounded copper surface portion 231 penetrates from the first layer printed circuit board 210 to the third layer printed circuit board 230. The through hole VA23 (corresponding to the third through hole) is electrically connected to the power sink element Sink to serve as a path for the current flowing from the power source sink element Sink to the first power supply element VRM1. The second grounded copper surface portion 233 is electrically connected to the second power supply component VRM2, and the second grounded copper surface portion 233 also penetrates through the first layer printed circuit board 210 to the third layer printed circuit board 230. A through hole VA23 is electrically connected to the power sink element Sink to flow from the power source sink element to the second power source Provides a path for the current of the component VRM2.

Among them, the first power supply copper surface portion 211, the second power supply copper surface portion 213, the bus copper surface portion 215, and the third power supply copper surface portion 221 are used to provide (or transmit) a high voltage (such as a power supply voltage) to The power sink component Sink, and the first grounded copper surface portion 231 and the second grounded copper surface portion 233 are used to provide (or transmit) a low voltage (such as a ground voltage) to the power sink component Sink.

3 is a schematic diagram of the layout of the first layer printed circuit board of the printed circuit board according to the third embodiment of the present invention. Please refer to FIG. 3, in this embodiment, only the first layer printed circuit board 310 is shown, and other layers in the printed circuit board can refer to the third layer printed circuit board 130 shown in FIG. 1 or the third layer printed circuit board 130 shown in FIG. The three-layer printed circuit board 230, and the structure of other layers in the printed circuit board can be understood with reference to FIG. 1 or FIG. 2, which will not be repeated here. Among them, the first power supply element VRM1, the second power supply element VRM2, and the power sink element Sink may be plug-in type or surface-mounted type, respectively, which may be determined according to the circuit design.

In the first layer printed circuit board 310, the first layer printed circuit board 310 is provided with a copper surface electrically connected to the first power supply element VRM1, the second power supply element VRM2, and the power sink element Sink. In this embodiment, the copper surface of the first-layer printed circuit board 310 can be roughly divided into a first power copper surface portion 311, a second power copper surface portion 313, a bus copper surface portion 315, and a third power copper surface portion. Part 317.

The first power supply copper surface portion 311 is electrically connected to the first power supply element VRM1 and the bus copper surface portion 315, and serves as a path for the current flowing from the first power supply device VRM1 to the bus copper surface portion 315. The second power copper surface part 313 and The second power supply component VRM2 and the bus copper surface portion 315 are electrically connected to serve as a path for the current flowing from the second power supply component VRM2 to the bus copper surface portion 315. The third power copper surface portion 317 is electrically connected to the power sink component Sink and the bus copper surface portion 315 to serve as a path for the current flowing from the bus copper surface portion 315 to the power sink component Sink. Among them, the first power copper surface portion 311, the second power copper surface portion 313, the bus copper surface portion 315, and the third power copper surface portion 317 are used to provide (or transmit) a high voltage (such as a power supply voltage) to Power draw component Sink.

In other embodiments, the first layer printed circuit board 310 may be configured with at least one of the first grounded copper surface portion (such as 131 or 231) and the second grounded copper surface portion (such as 133 or 233), but the present invention The embodiment is not limited to this.

4A to 4B are schematic cross-sectional views of a printed circuit board according to a fourth embodiment of the invention. 4A and 4B, in this embodiment, a 4-layer printed circuit board is shown for illustration, that is, the first layer printed circuit board 410, the second layer printed circuit board 420, and the fourth layer printed circuit board 430 And the third layer printed circuit board 440, where "first", "second", "third" and "fourth" are used to separate different layers of printed circuit boards, rather than indicating the order of the printed circuit boards. In addition, the power supply element VRMn and the power sink element Sink are respectively surface-mounted as an example.

4A, in this embodiment, the first power copper surface portion and the second power copper surface portion respectively include the copper surface 411 disposed on the first layer of printed circuit board 410, and the second layer of printed circuit board 420 The copper surface 421 and the through hole VA41 electrically connecting the copper surfaces 411 and 421 (only one is shown here, but there can be more than one), and the copper surfaces 411 and 421 are electrically connected to each other. The copper surface 411 can be connected to components (e.g. electrical The resistor Rn) is electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper surface 421 is electrically connected to the bus copper surface portion 425. At this time, the equivalent resistance of the power supply element VRMn to the bus copper surface 425 must consider the resistance value of the series-connected element (for example, the resistor Rn).

The third power copper surface portion includes the copper surface 423 of the second layer printed circuit board 420, the copper surface 441 of the third layer printed circuit board 440, and the through holes VA42 that are electrically connected to the copper surfaces 423 and 441 (only shown here) Shown as one, but in fact there can be more than one), and the copper surfaces 423 and 441 are electrically connected to each other. The copper surface 423 is electrically connected to the bus copper surface portion 425, and the copper surface 441 can be electrically connected to the power sink element Sink through a series connection element (such as a resistor Rs). At this time, the equivalent resistance of the bus copper surface portion 425 to the power sink element Sink must consider the resistance value of the series-connected element (for example, the resistor Rs).

The first grounded copper surface portion and the second grounded copper surface portion respectively include the copper surface 413 disposed on the first layer printed circuit board 410, the copper surface 431 of the fourth layer printed circuit board 430, and the third layer printed circuit board 440 The copper surface 443 and the through holes VA43, VA44 that are electrically connected to the copper surfaces 413, 431, and 443, that is, the copper surfaces 413, 431, and 443 are electrically connected to each other. The copper surface 413 is electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper surface 443 is electrically connected to the power sink element Sink.

4C to 4D are schematic cross-sectional views of a printed circuit board according to a fifth embodiment of the invention. Please refer to FIG. 4A to FIG. 4D, wherein the same or similar components use the same or similar reference numerals. Please refer to FIG. 4C. In this embodiment, the power supply element VRMn and the power draw element Sink are respectively plug-in type as an example.

The first power supply copper surface part and the second power supply copper surface part respectively include a copper surface 411 disposed on the first layer printed circuit board 410, a copper surface 421 of the second layer printed circuit board 420, and a fourth layer printed circuit board 430 The copper surface 433 and the through hole VA41 that electrically connect the copper surfaces 411, 421, and 433 (only one is shown here, but there can be more than one), that is, the copper surfaces 411, 421, and 433 are electrically connected to each other . The copper surfaces 411 and 433 are electrically connected to the power supply element VRMn (which can be the first power supply element or the second power supply element), and the copper surface 421 is electrically connected to the bus copper surface portion 425.

The third power copper surface part includes the copper surface 415 of the first layer printed circuit board 410, the copper surface 423 of the second layer printed circuit board 420, the copper surface 435 of the fourth layer printed circuit board 430, and the electrical connection copper The through holes VA42 of the faces 415, 423, and 435 (only one is shown here, but there can be more than one), that is, the copper faces 415, 423, and 435 are electrically connected to each other. The copper surface 423 is electrically connected to the bus copper surface portion 425, and the copper surfaces 415 and 435 are electrically connected to the power sink component Sink.

The first grounded copper surface portion and the second grounded copper surface portion respectively include the copper surfaces 427 and 429 of the second layer printed circuit board 420, the copper surface 431 of the fourth layer printed circuit board 430, and the third layer printed circuit The copper surfaces 443 and 445 of the board 440 and the through holes VA43 and VA44 that are electrically connected to the copper surfaces 427, 429, 431, 443 and 445, that is, the copper surfaces 427, 429, 431, 443 and 445 are electrically connected to each other. The copper surfaces 427 and 445 are electrically connected to the power supply element VRMn (which may be the first power supply element or the second power supply element), and the copper surfaces 429 and 443 are electrically connected to the power sink element Sink.

FIG. 5 is a flowchart of a method for configuring a power copper surface of a printed circuit board according to an embodiment of the present invention. Please refer to Figure 5, in this embodiment, the printed circuit board includes and The first power copper surface portion electrically connected to the first power supply element, the second power copper surface portion electrically connected to the second power supply element, and the third power copper surface portion electrically connected to the power draw element , The first grounded copper surface portion electrically connected with the first power supply element and the power draw element, and the second grounded copper surface portion electrically connected with the second power supply element and the power draw element.

The method for configuring the copper surface of the power supply includes the following steps. In step S510, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, the third power supply copper surface portion, and the busbar are first configured. Surface part, first grounded copper surface part, and second grounded copper surface part. In step S520, it is determined whether the current of the first power supply component flows from the current position of the bus copper surface part to the power draw component, and the current position of the bus copper surface part is electrically connected to the first power copper surface part and the second power supply component. The copper surface part of the power supply and the third copper surface part of the power supply. When the judgment result of step S520 is "No", then step S550 is executed; when the judgment result of step S520 is "YES", then step S530 is executed.

In step S530, it is determined whether the current of the second power supply element flows from the current position of the bus copper surface to the power draw element. When the judgment result of step S530 is "No", then step S550 is executed next; when the judgment result of step S530 is "YES", then step S540 is executed next. In step S540, when the currents of the first power supply component and the second power supply component flow from the current position of the bus copper surface portion to the power draw component, according to at least the first allowable difference value and the second allowable difference value One and the average current to determine the first power supply component, the second power supply component, the power draw component, the first power supply copper surface part, the second power supply copper surface part, and the third power supply Whether the copper surface part, the bus copper surface part, the first ground copper surface part, and the second ground copper surface part (that is, the current layout configuration) conform to the current-sharing layout design of the printed circuit board, among which the first allowable difference The value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element.

When the judgment result of step S540 is "No", then step S550 is performed; when the judgment result of step S540 is "Yes", then the power supply copper surface configuration method is then ended. In step S550, the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, and the third power copper surface portion can be re-adjusted (or configured) The position of the busbar copper surface portion, the first grounded copper surface portion, the second grounded copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher. After step S550, step S520 is then executed to re-determine whether the part of the bus copper surface at the new position/re-adjusted difference value conforms to the current-sharing layout design of the printed circuit board.

6 is a flowchart of a method for configuring a power copper surface of a printed circuit board according to another embodiment of the present invention. Wherein, FIG. 6 is used to further illustrate FIG. 5, but the embodiment of the present invention is not limited thereto. Referring to FIG. 6, in this embodiment, the method for configuring the copper surface of the power supply includes the following steps. In step S610, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, the third power supply copper surface portion, and the busbar are first configured. Surface part, first grounded copper surface part, and second grounded copper surface part. In step S620, the first allowable difference value and the second allowable difference value are set first, that is, under the condition that the current of the power source drawing element is fixed, the maximum tolerable difference between the current of the first power supply element and the average current is set. difference The absolute value of the difference is set as the first allowable difference value, and the absolute value of the tolerable maximum difference between the current of the second power supply element and the average current is set as the second allowable difference value.

In step S630, calculate the current-sharing resistance ratio interval, which is the ratio range of the first sum to the second sum when the first allowable difference value and the second allowable difference value are satisfied, which is used as a criterion for judging whether the current-sharing layout design is met . In step S640, it is determined whether the current of the first power supply component flows from the bus copper surface portion to the power draw component, and the bus copper surface portion is electrically connected to the first power copper surface portion, the second power copper surface portion, and the second power supply copper surface portion. Three power supply copper surface part. If yes, proceed to step S650; if not, proceed to step S680. In step S680, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, and the third power supply copper surface portion can be re-adjusted (or configured) The position of the busbar copper surface portion, the first grounded copper surface portion, the second grounded copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher.

In step S650, it is determined whether the current of the second power supply component flows from the bus copper surface portion to the power draw component. If yes, proceed to step S660; if not, proceed to step S680. In step S660, calculate the first sum of the equivalent resistances of the first power supply copper surface portion and the first grounded copper surface portion, and the second sum of the equivalent resistances of the second power supply copper surface portion and the second grounded copper surface portion .

In step S670, it is determined whether the ratio of the first total and the second total meets the current-sharing resistance ratio interval. If yes, then end the power supply copper surface configuration method; if not, then proceed to step S680. After step S680, step S620 is then executed, To re-determine whether the part of the bus copper surface at the new position/re-adjusting the difference value conforms to the current-sharing layout design of the printed circuit board.

FIG. 7 is a flowchart of a method for configuring the power copper surface of a printed circuit board according to another embodiment of the present invention. Wherein, FIG. 7 is used to further illustrate FIG. 5, but the embodiment of the present invention is not limited thereto. Referring to FIG. 7, in this embodiment, the method for configuring the copper surface of the power supply includes the following steps. In step S710, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, the third power supply copper surface portion, and the bus copper are first configured. Surface part, first grounded copper surface part, and second grounded copper surface part. In step S720, the first allowable difference value and the second allowable difference value are first set, that is, under the condition that the current of the power source drawing element is fixed, the maximum tolerable difference between the current of the first power supply element and the average current is set. The absolute value of the difference is set as the first allowable difference value, and the absolute value of the tolerable maximum difference between the current of the second power supply element and the average current is set as the second allowable difference value.

In step S730, it is determined whether the current of the first power supply component flows from the bus copper surface portion to the power draw component, and the bus copper surface portion is electrically connected to the first power copper surface portion, the second power copper surface portion, and the first power supply copper surface. Three power supply copper surface part. If yes, proceed to step S740; if not, proceed to step S770. In step S770, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, and the third power supply copper surface portion can be re-adjusted (or configured) The position of the busbar copper surface portion, the first grounded copper surface portion, the second grounded copper surface portion, and/or the first allowable difference value and the second allowable difference value can be adjusted higher.

In step S740, it is determined whether the current of the second power supply element flows from the bus copper surface portion to the power draw element. If yes, proceed to step S750; if not, proceed to step S770. In step S750, the currents of the first power supply element and the second power supply element are calculated.

In step S760, it is determined whether the current of the first power supply element/the second power supply element meets the first allowable difference value/the second allowable difference value. If yes, then end the power supply copper surface configuration method; if not, then proceed to step S770. After step S770, step S720 is then executed to re-determine whether the part of the bus copper surface at the new position/re-adjusted difference value conforms to the current-sharing layout design of the printed circuit board.

Among them, the sequence of steps S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760 and S770 is for illustration. The embodiments of the invention are not limited thereto. And, the sequence of steps S510, S520, S530, S540, S550, S610, S620, S630, S640, S650, S660, S670, S680, S710, S720, S730, S740, S750, S760 and S770 can be referred to FIGS. 1A to 1 1C, FIG. 2A to FIG. 2C, FIG. 3, and FIG. 4A to FIG. 4D are shown in the embodiments, which will not be repeated here.

In summary, the printed circuit board and its power supply copper surface configuration method of the embodiment of the present invention can determine whether the bus copper surface part is in line with printing according to at least one of the first allowable difference value and the second allowable difference value and the average current. The current sharing layout design of the circuit board. In this way, the uneven output current of the first power supply element and the second power supply element can be avoided or suppressed.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

S510, S520, S530, S540, S550: steps

Claims (15)

A printed circuit board includes: a first power supply component; a second power supply component; a power draw component; a first power supply copper surface part electrically connected to the first power supply component; a second power supply copper The surface part is electrically connected to the second power supply element; a third power copper surface part is electrically connected to the power draw element; a bus copper surface part is electrically connected to the first power copper surface part, The second power supply copper surface portion and the third power supply copper surface portion, the current provided by the first power supply component and the second power supply component pass through the first power supply copper surface portion and the second power supply respectively The copper surface part flows to the bus copper surface part, and then flows to the power draw element through the bus copper surface part; a first grounded copper surface part electrically connects the first power supply element and the power source Drawing element; and a second grounded copper surface portion electrically connected to the second power supply element and the power draw element, and the first power supply element, the second power supply element, the power draw element, the first A power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, the first ground copper surface portion and the second ground copper surface portion are It conforms to a current-sharing layout design of the printed circuit board, where a first sum of the equivalent resistances of the first power copper surface part and the first grounding copper surface part and the second power copper surface part and When a second sum of the equivalent resistance of the second grounded copper surface part meets the following inequality, it is determined that the first power supply component, the second power supply component, the power draw component, and the first power supply copper surface part , The second power copper surface part, the third power copper surface part, the bus copper surface part, the first grounded copper surface part and the second grounded copper surface part are in line with the current sharing layout design :

or

Wherein, the first allowable difference value corresponds to the current of the first power supply element, and the second allowable difference value corresponds to the current of the second power supply element, or when the current of the first power supply element and the average current When the absolute value of the difference is less than or equal to the first allowable difference value and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the second allowable difference value, the first power supply element, The second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, and the first ground The copper surface part and the second grounded copper surface part conform to the current sharing layout design. The printed circuit board described in item 1 of the scope of patent application, wherein the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, and the second power supply copper surface portion The third power copper surface part, the bus copper surface part, the first grounded copper surface part and the second grounded copper surface part conform to a layout design of the printed circuit board. For the printed circuit board described in item 1 of the scope of patent application, when the first power supply element, the second power supply element, and the power draw element are plug-in type, the first power supply copper surface portion and the first power supply A power supply element is electrically connected to a first layer printed circuit board, the second power supply copper surface portion is electrically connected to the second power supply element on the first layer printed circuit board, and the third power supply copper surface portion The part is electrically connected to a second-layer printed circuit board with the power draw element, and the bus copper surface portion is on the first-layer printed circuit board with the first power copper surface portion and the second power copper surface portion The bus copper surface portion and the third power copper surface portion are electrically connected through a plurality of through holes penetrating from the first layer printed circuit board to the second layer printed circuit board. The printed circuit board described in item 3 of the scope of patent application, wherein the first grounded copper surface portion, the first power supply component, the second grounded copper surface portion, the second power supply component and the power draw The components are electrically connected to a third-layer printed circuit board. The printed circuit board according to claim 1, wherein when the first power supply element and the second power supply element are plug-in type and the power draw element is surface mount type, the first power supply copper face The first power supply element is electrically connected to a first layer printed circuit board, and the second power supply copper surface portion is electrically connected to the second power supply element on the first layer printed circuit board, and is located on a first layer printed circuit board. The third power copper surface portion of the two-layer printed circuit board and the power draw element located on the first-layer printed circuit board penetrate from the first-layer printed circuit board to the second-layer printed circuit board. The first through hole is electrically connected, the bus copper surface portion is electrically connected to the first power copper surface portion and the second power copper surface portion on the first layer printed circuit board, and the bus copper surface portion The portion and the third power copper surface portion are electrically connected through a plurality of second through holes penetrating from the first-layer printed circuit board to the second-layer printed circuit board. The printed circuit board according to item 5 of the scope of patent application, wherein the first grounded copper surface portion, the first power supply element, the second grounded copper surface portion and the second power supply element are on a third layer The printed circuit board is electrically connected, and the first grounded copper surface portion and the second grounded copper surface portion and the power draw element penetrate through the first layer printed circuit board to the third layer printed circuit board. The third hole is electrically connected. For the printed circuit board described in claim 1, wherein when the first power supply component, the second power supply component, and the power draw component are surface-mounted, the first power supply copper surface part and the The first power supply element is electrically connected to a first layer printed circuit board, the second power supply copper surface portion is electrically connected to the second power supply element on the first layer printed circuit board, and the third power supply copper surface The part is electrically connected with the power draw element on the first layer printed circuit board, the bus copper surface portion, the first power copper surface portion, the second power copper surface portion, and the third power copper surface portion Part of it is electrically connected to the first-layer printed circuit board. For the printed circuit board described in claim 1, wherein when the first power supply component, the second power supply component, and the power draw component are surface-mounted, the first power supply copper surface portion and the The second power copper surface portion has a plurality of copper surfaces located on a first layer printed circuit board and a second layer printed circuit board and electrically connected to each other, and the third power copper surface portion has a plurality of copper surfaces located on the second layer A printed circuit board and a third layer of printed circuit board and a plurality of copper surfaces electrically connected to each other, the first power supply copper surface portion, the first power supply element, the second power supply copper surface portion and the second The power supply component is electrically connected to the first layer printed circuit board, and the bus copper surface portion, the first power copper surface portion, the second power copper surface portion and the third power copper surface portion are in the The second layer printed circuit board is electrically connected, and the third power supply copper surface part and the power draw element are electrically connected on the third layer printed circuit board. For the printed circuit board described in item 8 of the scope of patent application, the first grounded copper surface portion and the second grounded copper surface portion respectively include the first layer printed circuit board and a fourth layer printed circuit board And a plurality of copper surfaces of the third layer printed circuit board that are electrically connected to each other, a portion of the first grounded copper surface and the first power supply element are electrically connected to the first layer of printed circuit board, and the first ground The copper surface portion is electrically connected with the power draw element on the third layer printed circuit board, the second grounded copper surface portion and the second power supply element are electrically connected on the first layer printed circuit board, and the The part of the two grounded copper surfaces is electrically connected to the power draw element on the third layer printed circuit board. For the printed circuit board described in item 1 of the scope of patent application, when the first power supply component, the second power supply component, and the power draw component are plug-in type, the first power supply copper surface portion and the first power supply The two power copper surface portions respectively have a plurality of copper surfaces located on a first-layer printed circuit board, a second-layer printed circuit board and a third-layer printed circuit board and electrically connected to each other. The third power supply copper surface The part has a plurality of copper surfaces which are located on the first layer printed circuit board, the second layer printed circuit board and the third layer printed circuit board and are electrically connected to each other. The first power supply copper surface part, the first power supply Provide components, the second power supply copper surface portion and the second power supply component are electrically connected to the first layer printed circuit board and the third layer printed circuit board, the bus copper surface portion, the first power supply copper The surface part, the second power copper surface part, and the third power copper surface part are electrically connected to the second layer printed circuit board, and the third power copper surface part and the power draw element are connected to the first The layer printed circuit board and the third layer printed circuit board are electrically connected. For the printed circuit board described in item 10 of the scope of patent application, the first grounded copper surface portion and the second grounded copper surface portion respectively include the second layer printed circuit board and the third layer printed circuit board And a fourth layer of printed circuit board and a plurality of copper surfaces electrically connected to each other, the first grounded copper surface part and the first power supply element are on the second layer of printed circuit board and the fourth layer of printed circuit board Electrically connected, the first grounded copper surface portion and the power draw element are electrically connected on the second layer printed circuit board and the fourth layer printed circuit board, and the second grounded copper surface portion is electrically connected to the second power source Provide components to be electrically connected to the second layer printed circuit board and the fourth layer printed circuit board, and the second ground copper surface part and the power draw component are printed on the second layer printed circuit board and the fourth layer The circuit board is electrically connected. A method for configuring the power copper surface of a printed circuit board. The printed circuit board includes a first power copper surface portion electrically connected to a first power supply element, and a second power supply element electrically connected to a second power supply element. A power copper surface portion, a third power copper surface portion electrically connected to a power draw element, a first grounded copper surface portion electrically connected to the first power supply element and the power draw element, and A second grounded copper surface portion electrically connected to the second power supply element and the power draw element, the power supply copper surface configuration method includes: Configure the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, and a bus copper Surface portion, the first grounded copper surface portion and the second grounded copper surface portion; Determine whether the current of the first power supply component flows from the bus copper surface portion to the power draw component, and the bus copper surface portion is electrically connected to the first power copper surface portion and the second power copper surface portion And the copper surface part of the third power supply; Judging whether the current of the second power supply component flows from the bus copper surface portion to the power draw component; When the currents of the first power supply element and the second power supply element flow from the bus copper surface portion to the power draw element, at least one of a first allowable difference value and a second allowable difference value And an average current to determine the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, and the third power supply copper surface portion 1. Whether the bus copper surface part, the first grounded copper surface part and the second grounded copper surface part comply with a current-sharing layout design of the printed circuit board, wherein the first allowable difference value corresponds to the first power supply Provide the current of the component, and the second allowable difference value corresponds to the current of the second power supply; When the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper When the surface portion, the first grounded copper surface portion, and the second grounded copper surface portion conform to the current sharing layout design of the printed circuit board, the power supply copper surface configuration method is ended. For example, the power supply copper surface configuration method described in item 12 of the scope of patent application further includes when the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, and the second power supply component The power copper surface portion, the third power copper surface portion, the bus copper surface portion, the first grounded copper surface portion, and the second grounded copper surface portion do not conform to the current sharing layout of the printed circuit board When designing, perform at least one of the following actions: reconfigure the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, the second power copper surface portion, The position of the third power copper surface portion, the bus copper surface portion, the first grounded copper surface portion and the second grounded copper surface portion, and the first allowable difference value and the second allowable value are increased Difference value. For example, the power supply copper surface configuration method described in item 12 of the scope of patent application, wherein the first power supply element and the second power supply element are determined based on at least one of the first allowable difference value and the second allowable difference value and the average current. Power supply components, the power draw components, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, the first ground copper surface portion And whether the second grounding copper surface part conforms to the current-sharing layout design of the printed circuit board includes: calculating an equivalent resistance of the first power supply copper surface part and the first grounding copper surface part The first sum and a second sum of the equivalent resistances of the second power copper surface part and the second grounding copper surface part; judge whether the ratio of the first sum and the second sum satisfies a uniformity according to the following inequality Current resistance ratio:

or

When the ratio of the first sum to the second sum satisfies the current-sharing resistance ratio, the first power supply component, the second power supply component, the power draw component, the first power copper surface portion, and the first power supply component The second power copper surface part, the third power copper surface part, the bus copper surface part, the first ground copper surface part and the second ground copper surface part conform to the current sharing layout of the printed circuit board Design; and when the ratio of the first sum and the second sum does not meet the current-sharing resistance ratio, the first power supply element, the second power supply element, the power draw element, the first power copper surface The second power copper surface part, the third power copper surface part, the bus copper surface part, the first grounded copper surface part and the second grounded copper surface part do not conform to the printed circuit board The current sharing layout design. For example, the power supply copper surface configuration method described in item 12 of the scope of patent application, wherein the first power supply element and the second power supply element are determined based on at least one of the first allowable difference value and the second allowable difference value and the average current. Power supply components, the power draw components, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the bus copper surface portion, the first ground copper surface portion The steps for determining whether the portion of the second grounding copper surface conforms to the current-sharing layout design of the printed circuit board include: When the absolute value of the difference between the current of the first power supply element and the average current is less than or equal to the first allowable difference value and the absolute value of the difference between the current of the second power supply element and the average current is less than or equal to the first In the second allowable difference value, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, and the third power supply copper surface portion Parts, the bus copper surface portion, the first grounded copper surface portion, and the second grounded copper surface portion comply with the current sharing layout design of the printed circuit board; and When the absolute value of the difference between the current of the first power supply element and the average current is greater than the first allowable difference value or the absolute value of the difference between the current of the second power supply element and the average current is greater than the second allowable difference For the difference value, the first power supply component, the second power supply component, the power draw component, the first power supply copper surface portion, the second power supply copper surface portion, the third power supply copper surface portion, The bus copper surface portion, the first grounded copper surface portion, and the second grounded copper surface portion do not conform to the current sharing layout design of the printed circuit board.

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