TW202017087A - Conveying method and device of chip stripping-folding process, and equipment using the same by using a second conveying module to convey the strip-like chip on the temporary placement portion to be placed in a material basket for collection - Google Patents

Abstract

The present invention provides a conveying method and device of chip stripping-folding process, and equipment using the same. The conveying method includes: placing a strip-like chip after stripping-folding on a positioning portion of a positioning device; performing a first conveying step for using a first conveying module to convey the strip-like chip on the positioning portion to a temporary placement portion of a placement seat; and performing a second conveying step for using a second conveying module to convey the strip-like chip on the temporary placement portion to be placed in a material basket for collection. Thus, the strip-like chip may be conveyed and collected after stripping-folding.

Description

Method and device for conveying wafer peeling process and equipment using the same

The present invention relates to a conveying method, device and equipment using the device, in particular to a wafer stripping method used in the process of wafer-type resistors for stripping wafers to be stripped into strip-shaped wafers for transportation and collection Process transportation method, device and equipment using the device.

According to the general wafer-type resistance, usually a chip wafer is used to process a multi-layer electroplated layer, and then stripped into a strip wafer, and then stripped from the strip wafer into a granular resistor, such stripped from the chip wafer The equipment for strip wafers is generally called a stacker, and the equipment for stripping wafers into granular resistors is generally called a pelletizer; the process for stripping wafers into strips can be obtained by referring to the applicant, for example Patent Nos. M448052 "Wafer Stripping Device", M445766 "Wafer Transfer Device", M445761 "Wafer Collection Device", M445762 "Wafer Stacking Device" and other patent cases; such In the process of peeling a wafer into a strip wafer, the wafer is often placed on a swing seat in a peeling mechanism in the M448052 "wafer peeling device", for example, and pushed by a pushing mechanism to make the wafer wafer After the front end is positioned by a transport device, the connecting rod driven by the eccentric wheel drives the swing seat of the peeling mechanism to swing up and down, so that the portion of the chip wafer that is positioned by the transport device is stripped into a strip shape Wafer; wherein, the conveying device is, for example, the conveying wheel in the M445766 "wafer conveying device", the conveying wheel is driven by a driving mechanism and can be intermittently rotated; a plurality of insertion grooves are provided on the circumference of the conveying wheel to convey The wheel forms a feed side and a discharge side; the material enters the insertion groove on the feed side of the transfer wheel, and is transferred to the discharge side through the transfer wheel to be grabbed by a collection device and stacked for collection; wherein, the collection device such as the first M445761 "wafer collection device", which uses a retrieving mechanism to extract the strip-shaped wafers from the discharge side of the conveying wheel, and then sucks the material into the material frame for collection.

However, in the prior art of No. M445761 "Wafer Collection Device", the retrieving mechanism extracts the strip wafer from the discharge side of the transfer wheel, and moves across the discharge side of the transfer wheel to barb out and extract the strip wafer. This method is only applicable if the positioning method of the peeling mechanism adopts the conveying wheel method. Since the groove on the circumference of the conveying wheel is provided with a radial outward opening, it can cross the discharge side of the conveying wheel However, if the positioning method is not the transfer wheel method, it cannot be implemented. Secondly, in the prior art, the retrieving mechanism must first extract the strip wafer from the discharge side of the transfer wheel before changing the material. The mechanism draws and puts it into the material frame for collection. The transfer efficiency of the strip wafers is low, and it is not suitable for high-efficiency production needs. There is still room for improvement.

It is an object of the present invention to provide a transfer method for a wafer peeling process that can be used to transport stripped wafers after peeling.

Another object of the present invention is to provide a transfer device for a wafer stripping process that can be used to transfer stripped wafers after stripping.

Another object of the present invention is to provide an apparatus for carrying out the transfer method of the wafer peeling process.

Still another object of the present invention is to provide an apparatus using the conveying device of the wafer peeling process.

The transport method of the wafer peeling process according to the purpose of the present invention includes: leaving the stripped wafers on a positioning portion of a positioning device; performing a first transport step, using a first transport module to The strip wafer on the positioning part is transported and placed in a temporary part of a placement base; a second transport step is to transport the strip wafer on the temporary part with a second transport module in a Collect in the feed box.

According to another object of the present invention, a wafer peeling process transfer device includes: a strip device for transferring a stripped wafer left by a positioning portion of a positioning device to a material frame, including: a placement base on which There is a temporary part; a first conveying module is provided with two brackets spaced apart, and a bracket is provided on the bracket, the bracket can be displaced between the positioning part and the placement of the positioning device Between the temporary part of the seat; a second conveying module is provided with two suction nozzles spaced apart, and the suction nozzle can be displaced between the temporary part of the placement seat and the material frame.

A transport device for a wafer peeling process according to another object of the present invention includes: a device for performing the transport method of the wafer peeling process as described above.

According to a further object of the present invention, a wafer peeling process transfer device, using the wafer peeling process transfer device as described above, includes a stripping device for stripping a wafer to be stripped into the strip wafer, and placing A loading mechanism for a sheet wafer, a hemming mechanism for peeling the sheet wafer into the wafer to be stripped, and a transport mechanism for transporting the sheet wafer or the wafer to be stripped.

The method, device and equipment for wafer peeling process of the embodiment of the present invention and the equipment using the device, although the stripped wafer after the peeling is left on the positioning part of the positioning device, the first conveying die is executed The first transfer step of transferring the strip wafer on the positioning part into the temporary part of the placement seat, and using a second transfer module to transfer the strip wafer on the temporary part After the second transfer step of collecting in a material frame is transferred, the transfer and collection of the strip wafer can be successfully completed, so that the positioning method of the peeling process does not need to adopt the transfer wheel method, which increases the application opportunities of the transfer.

Please refer to FIG. 1, the wafer used for peeling in the embodiment of the present invention is a rectangular sheet-shaped wafer A, which has a rectangular area and a resistance portion A1 with a layered plating layer on the surface, which is stripped according to stripping In the order of folding, the front end of the resistance portion A1 in the X-axis direction forms a scrap portion A2 without build-up plating layer, the rear end of the resistance portion A1 in the X-axis direction forms a gripping portion A3 without build-up plating layer, and the resistance portion A1 Each side of the Y-axis is formed with a side section A4 and A5 that are narrower than the scrap section A2 and the clamping section A3 and have no build-up plating layer; in the embodiment of the present invention, the side sections A4 and A5 are respectively made Each division includes the inner sides A41, A51 near the resistance portion A1, and the outer sides A42, A52 outside the resistance portion A1; wherein, the outer sides A42, A52 include the resistance portion A1, the scrap portion A2, and the clip The side portion of the holding portion A3, and the inner sides A41 and A51 include only the side portion of the resistance portion A1; the boundary between each portion is as shown in FIGS. The lower surface of A is engraved with groove-shaped line marks A6, and the line marks A6 of the lower surface of the resistance portion A1 are in the form of rectangular grids arranged in a matrix (not shown), each rectangular grid is a resistive element, In the future, it will be stripped into grid-shaped resistance elements.

Please refer to FIGS. 3 and 4. Before stripping into the strip wafer A8, the embodiment of the present invention first executes the outer edges A42 and A52 of the chip wafer A and the scrap part A2 as the parts to be stripped , And execute a procedure of peeling off the part to be stripped by folding, so that the chip wafer A strips the part to be stripped, the chip wafer A forms a part including only the resistance part A1, the clamping part A3 and The wafer A7 to be stripped on the inner side A41, A51. The wafer peeling process in the embodiment of the present invention is to strip the wafer A7 to be stripped to include a part of the resistance portion A1 together with the two inner sides A41, A51 Strip wafer A8 in the strip region.

Please refer to FIGS. 4 and 5. The embodiment of the present invention can be illustrated by the stacker shown in the figure. The stacker is a device for performing a wafer peeling process, which is provided with a peeling mechanism B, which is used to strip wafers Before A7 is fed into the stripping mechanism B to be stripped into the strip-shaped wafer A8, the wafer-shaped wafer A is placed in a stocking mechanism C, and is extracted and transferred to a lifting seat D1 of a transport mechanism D to In a hemming mechanism E, and in the hemming mechanism E, the flake wafer A is peeled into the wafer A7 to be stripped, and then the carrier D1 of the transport mechanism D transfers the wafer A7 to be stripped And passing the hemming mechanism E, the pendulum B1 placed in the debonding mechanism B is stripped into the strip wafer A8; and the stripped wafer A8 after the stripping is sent to a collection device F Collected in a box F1 in

Please refer to FIGS. 4 and 6, the peeling mechanism B includes: a swing base B1 and a pushing clip B2 that can be moved back and forth at the rear end of the swing base B1 according to the transport direction of the wafer A7 to be peeled off on the swing base B1 The swing seat B1 is pivotally mounted on the two side seats B31 on both sides of a carrier B3 with two pivot arms B11 and B12 on both sides respectively via a pivot portion B111. A supply is provided between the two pivot arms B11 and B12 The wafer A7 to be stripped is placed in the conveying path B13 which can be pushed by the push clip B2; the side of the carrier B3 is elevated by a side seat B33 and a rear side seat B34 standing on a base B32, The base B32 under the swing seat B1 is provided with a material box B4 for holding the supporting part A3 where the wafer A7 to be stripped is dropped; a positioning device G is provided at the front end of the conveying path B13 of the swing seat B1 , The oscillating base B1 is driven by an eccentric wheel B6 driven by a driving member B5 to link a connecting rod B7 to drive the oscillating base B1 to swing up and down, by placing the wafer A7 to be stripped behind the oscillating base B1, the The clamping part A3 at the rear end of the wafer A7 to be stripped is clamped by the pushing clip B2 and pushed forward along the straight push flow path until the front end of the wafer A7 to be stripped is positioned by the positioning device G and driven by the eccentric wheel B6 The connecting rod B7 drives the swing seat B1 to swing up and down, so that the portion of the wafer A7 to be stripped by the positioning device G is stripped into the strip-shaped wafer A8.

Referring to FIG. 7, the positioning device G of the wafer peeling process in the embodiment of the present invention includes: an upper positioning mechanism G1 and a lower positioning mechanism G2, in which: the upper positioning mechanism G1 is provided with a pedestal G11 and a An upper positioning module G12 disposed on the seat frame G11; wherein, the seat frame G11 includes an upper seat frame G111 and two side frames G112 and G113 located on both sides of the upper seat frame G111, and the seat frame G11 uses the two sides The frames G112 and G113 are respectively fixed on the two side seats B31 of the carrier B3; a space G114 is formed between the two side frames G112 and G113; the upper positioning module G12 includes a drive disposed above the upper seat frame G111 A pressing die G122 that can be moved up and down is driven by the driving member G121 in the space G114 between the component G121 and the two side frames G112 and G113.

Please refer to FIG. 8, the lower positioning mechanism G2 is provided with a mold base G21 of approximately rectangular cube shape, the mold base G21 is disposed on a first rib B35 of the carrier B3 disposed horizontally between the two side seats B31, It is located between the two side seats B31 and is correspondingly positioned in front of the swinging seat B in the conveying direction; the upper surface of the mold base G21 is provided with a Y-axis elongated convex positioning portion G211, so that A positioning section is formed between the alignment portion G211 and the front side surface G212 of the mold base G21, and has a horizontally long planar positioning portion with a width approximately equal to the X-axis width of the strip wafer A8 and lower than that of the alignment portion G211 G213; the Y-axis length of the strip-shaped wafer A8 is longer than that of the mold base G21 and the positioning portion G213, so that the inside edges A41, A51 of the strip-shaped wafer A8 are exposed to both of the mold base G21 and the positioning portion G213 Outside the side.

Referring to FIGS. 8 and 9, the positioning portion G211 forms a lower front, upper, and rear rib G214 inclined backward by an angle of θ toward the side of the positioning portion G213, and the positioning portion G211 faces the positioning portion G213. The other side forms an inclined outer edge G215.

Referring to FIG. 10, when the to-be-stripped wafer A7 is pushed forward from the swing seat B1, the strip-shaped wafer A8 at the front end to be peeled will move forward to the lower positioning mechanism G2 of the positioning device G In the positioning part G213 of the mold base G21, the front end of the strip-shaped wafer A8 is in contact with the rib G214 to stop; please refer to FIG. 10, and then the upper positioning mechanism G1 drives the stamper G122 to lower, so that the pressure A pressing surface G1221 of the mold G122 abuts the upper surface of the mold base G21 in the lower positioning mechanism G2, and a positioning groove G1222 on the pressing surface G1221 is used to cover the alignment portion G211. The bottom surface of a die G1224 between the buckle groove G1222 of the G122 and the front side G1223 abuts but does not press against the strip-shaped wafer A8 on the positioning portion G213, so that the strip-shaped wafer A8 is restrained and restricted above the positioning portion G213 Position the bottom surface of the die G1224, and then drive the pendulum base B1 to oscillate up and down, and strip the frontmost strip wafer A8, and the strip wafer A8 after the stripping is left at the positioning Between the upper part G213 and the bottom surface of the mold G1224, and after the stamper G122 rises, the strip wafer A8 remains on the positioning part G213.

Referring to FIGS. 8 and 11, the strip wafer A8 left on the positioning portion G213 will be transferred to the material frame F1 via a transfer device H; wherein, the transfer device H includes: a placement seat H1, which is provided at A side of the carrier B3 is horizontally disposed on a second rib B36 between the two side seats B31, and is located between the two side seats B31, and is correspondingly located in a fixed position forward of the swinging seat B in the transport direction, And located between the mold base G21 and the material frame F1 in the X-axis linear transfer path of the strip wafer A8, the mold base G21, the placement seat H1, and the material frame F1 are linearly spaced along the X-axis The mold base G21, the placement base H1, and the material frame F1 each provide the strip-shaped wafer A8 to be placed in the Y axis direction; the placement base H1 is on the side near the mold base G21. The surface is provided with two temporary portions H11 which are spaced apart and have two concave portions H11 at the two ends of the placement seat H1, which can be used to suspend the strip wafer A8 in the center and place the two temporary portions H11 at both ends When being held, the placement seat H1 is respectively provided with a slot H12 under the two inner sides A41 and A51 of the two ends of the strip-shaped wafer A8 corresponding to the exposed sides of the strip-shaped wafer A8, the strip-shaped wafer A8 The two inner sides A41 and A51 of the two ends are respectively exposed above the slot H12 when placed, and the slot H12 on both sides of the placement seat H1 are respectively connected to the ribs G35 on both sides of the die base G21 Each of the opened slots B351 is on the same X-axis linear movement path; two sensing elements H13 arranged in the Y-axis spaced apart at a distance from the placement base H1 are located, and their positions are respectively closer to the two sides of the temporary portion H11 And extend upward to the upper surface of the placement seat H1 to detect the strip-shaped wafer A8 placed in the two temporary portions H11; outside the grooves H12 on both sides of the placement seat H1, respectively The two side seats B31 on both sides of the carrier B3 are provided with air pressure nozzles B37, which can be used to clean the temporary part H11 when the strip wafer A8 is not placed; the placement between the two temporary parts H11 A hollow blow-out space H14 is provided on the seat H1, and the blow-off space H14 is correspondingly located below when the strip-shaped wafer A8 is placed between the two temporary portions H11.

Please refer to Figs. 8, 11, and 12, the conveying device H is further provided with: a first conveying module H2, which is arranged on a vertically standing movable seat H3 which can be displaced in the X-axis direction, including being horizontal in the Y-axis direction A first seat H21 extended, and a driving member H22 fixed on the moving seat H3 and linked with it, the drive member H22 can drive the first seat H21 to move up and down along the Z axis, the first Two brackets H23 standing upright on a rack H21 with a spaced-apart vertical Z axis facing up, the spacing between the two brackets H23 is just about the two inner sides A41, A51 of the two ends of the strip wafer A8 The distance between the two brackets H23 is provided below the first seat frame H21 is a jet seat H24, which is fixed on the rear side seat B34 with a fixing member H241, the fixing member H241 is provided with an air valve H242, the air valve H242 is located just under the blowing space H14, and can face upwardly on the two temporary portions H11 on both sides of the placement seat H1, the strip wafer A8 transverse to the blowing space H14 The air-hanging part is blown from bottom to top; each bracket H23 has an upper end facing the side of the mold base G21, and a bracket H25 horizontally arranged in the Y axis is recessed in the bracket H25. There is a suction port H251 (please also refer to FIG. 13), the suction can be provided by the pneumatic connector H252 provided under the first seat H21 to provide suction, and the X and Z cross sections of the receiving portion H25 are L-shaped grooves. There is a bearing part H253 with an angle α between the front high and the back and the horizontal plane, and a rib H254 inclined at an angle β with the front, back and top (please also refer to FIG. 14); the X axial displacement of the moving seat H3 can be linked to the The first frame H21 and the two brackets H23 on it move the two brackets H23 between the slot H12 on both sides of the placement seat H1 and the slot B351 on both sides of the mold base G21 On the path; a second conveying module H4, which is arranged on the moving seat H3, includes a second seat frame H41 extending horizontally in the Y axis, and a drive fixed on the moving seat H3 and interlocking therewith H42, the driving member H42 can drive the second seat frame H41 to move up and down in the Z-axis direction, the second seat frame H41 has two suction nozzles H43 standing down with a vertical Z axis spaced apart at intervals, The two nozzles H43 are located above the two brackets H23, and the distance between the two nozzles H43 is just about the distance between the two inner sides A41, A51 at both ends of the strip wafer A8, so that the two nozzles H43 are below Each corresponding to the two temporary portions H11 on the two sides of the seat H1; the X-axis displacement of the moving seat H3 can link the second seat H41 and the second suction nozzle H43 thereon to make the second suction nozzle H43 is displaced on the moving path between the two temporary portions H11 and the material frame F1 on the two sides of the placement seat H1; the suction nozzle H43 of the second conveying module H4 and the first conveying module H2 The receiving portion H25 is synchronized with the horizontal displacement of the X axis by the moving seat H3 However, the Z-axis displacement can be performed separately, but when the second conveying module H4 and the first conveying module H2 are displaced, the suction nozzle H43 and the receiving portion H25 remain positioned in the Y-axis direction. The two nozzles H43 or the two supporting parts H25 also maintain a fixed distance respectively; the mobile seat H3 and the transport mechanism D are both arranged on a fixed seat K, and the lifting seat D1 is arranged on the back side of the fixed seat K An X-axis horizontal slide rail K1 is reciprocated along the X-axis by a first belt K2 that can be driven; the moving seat H3 is attached to the front side of the fixed seat K and can be used as the X-axis The sliding cylinder K3 moves horizontally and is reciprocated in the X axis by a second belt K4 that can be driven by a driving member (not shown), so that only a driving source can make the first The suction nozzle H43 of the second conveying module H4 and the receiving portion H25 of the first conveying module H2 synchronize linear displacement in the X axis by the moving seat H3; wherein, the moving seat H3 and the conveying mechanism D may also Set on different fixed bases and operate independently.

Referring to FIG. 15, the strip-shaped wafer A8 of the positioning part G213 on the mold base G21 of the lower positioning mechanism G2 of the positioning device G that is left by peeling will be transported through the following two steps, including: a first In a conveying step, the first conveying module H2 advances the bracket H23 along the X-axis receiving path L1 to below the positioning portion G213, and extracts the strip-shaped wafer A8 in such a manner that the receiving portion H25 is sucked and received. The bracket H23 returns the receiving portion H25 to the return path L2 located above the receiving path L1 along the X axis to the temporary portion H11 of the placement seat H1, and the strip wafer A8 is placed on the In the temporary part H11, at this time, the strip-shaped chip A8 is detected by the sensing element H13 and sucked by the negative pressure supplied by the pneumatic connector H252; a second conveying step, when the carrier H23 follows the receiving path L1 When advancing below the positioning portion G213, the suction nozzle H43 of the second conveying module H4 will simultaneously move along the X-axis unloading path L3 above the temporary portion H11 of the placement seat H1 to suck the temporary portion H11 The strip wafer A8 on the top; when the carriage H23 returns to the temporary portion H11 of the placement seat H1 via the return path L2, the suction nozzle H43 of the second transport module H4 will extract the temporary The strip-shaped wafer A8 on the placement portion H11 is simultaneously displaced in the X-axis direction to the stock frame F1 for placement and collection.

Referring to FIG. 16, the height of the receiving portion H25 of the bracket H23 of the first transport module H2 is lower than the temporary portion H11 of the placement seat H1 and the positioning portion G213 of the mold base G21, so the receiving The path L1 includes a horizontal linear stroke L11 that is displaced horizontally below the positioning portion G213, and a vertical displacement stroke L12 that vertically lifts the strip wafer A8 from below the positioning portion G213; the return path L2 includes a horizontal displacement to A horizontal linear stroke L21 above the temporary portion H11 of the placement seat H1, and a vertical displacement stroke L22 that vertically drops the strip-shaped wafer A8 from above the temporary portion H11.

Referring to FIG. 17, when the suction nozzle H43 of the second transport module H4 extracts the strip wafer A8 on the temporary portion H11, it moves horizontally above the temporary portion H11 and stays at the height position, With the air valve H242 facing upwards, the suspended portion of the strip-shaped wafer A8 on the temporary portion H11 on both sides of the placement seat H1 is blown from below to make the strip-shaped wafer A8 on the one hand The air is blown up by the air valve H242, and on the other hand is sucked by the suction nozzle H43 under negative pressure, which increases the speed of extraction of the suction nozzle H43 of the second conveying module H4, and the bottom port of the suction nozzle H43 is connected to the temporary The opening of the portion H11 is maintained at a width where the remaining gap is unlikely to fall over when the strip wafer A8 floats.

In the embodiment of the present invention, the method and device for transferring the wafer peeling process and the equipment using the device, although the strip wafer A8 after the peeling is left on the positioning part G213 of the positioning device G, the first The transfer module H2 transfers the strip wafer A8 on the positioning part G213 to the first transfer step in the temporary part H11 of the placement seat H1, and uses a second transfer module H4 to transfer the temporary After the strip wafer A8 on the placement part H11 is transferred to the second transfer step collected in a material frame F, the transfer and collection of the strip wafer can be successfully completed, so that the positioning method of the stripping process does not need to be transferred Wheel mode, increase the application opportunities for transportation.

However, the above are only the preferred embodiments of the present invention, which should not be used to limit the scope of the implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the invention, All of them are still covered by the patent of the present invention.

A: Chip wafer A1: Resistor part A2: Scrap part A3: Clamping part A4: Side part A41: Inside side A42: Outside side A5: Side side part A51: Inside side A52: Outside side A6: Line mark A7: Strip wafer A8: Strip wafer B: Stripping mechanism B1: Swing seat B11: Pivot arm B111: Pivot part B12: Pivot arm B13: Conveyor B2: Push clip B3: Carrier B31: Side Seat B32: Base B33: Side seat B34: Rear seat B35: First rib B351: Inter-slot B36: Second rib B4: Material box B5: Drive part B6: Eccentric wheel B7: Connecting rod C: Material Mechanism D: Transport mechanism D1: Lifting seat E: Folding mechanism F: Collecting device F1: Material frame G: Positioning device G1: Upper positioning mechanism G11: Seat frame G111: Upper seat frame G112: Side frame G113: Side frame G114: Space G12: upper positioning module G121: driver G122: stamper G1221: pressing surface G1222: buckle groove G1223: front side G1224: countermolding G2: lower positioning mechanism G21: mold base G211: alignment part G212: front side G213 : Positioning part G214: Rib G215: Outer edge H: Transport device H1: Placement seat H11: Temporary part H12: Between slots H13: Induction element H14: Air blowing space H2: First transport module H21: First seat Frame H22: Drive part H23: Bracket H24: Jet seat H241: Fixing part H242: Air valve H25: Supporting part H251: Suction port H252: Air pressure joint H253: Carrying part H254: Rib H3: Moving seat H4: Second conveyance Module H41: Second seat frame H42: Driver H43: Nozzle K: Fixing seat K1: Slide rail K2: First belt K3: Sliding cylinder K4: Second belt L1: Acceptance path L11: Horizontal linear stroke L12: Vertical Displacement stroke L2: Return path L21: Horizontal linear stroke L22: Vertical displacement stroke L3: Unload path

FIG. 1 is a schematic perspective view of a chip wafer in an embodiment of the present invention. FIG. 2 is an enlarged schematic perspective view of a portion of a chip wafer in an embodiment of the present invention. FIG. 3 is a three-dimensional exploded schematic view of a chip wafer in an embodiment of the present invention. FIG. 4 is a three-dimensional exploded schematic view of a wafer to be stripped in an embodiment of the present invention. FIG. 5 is a schematic perspective view of equipment in a wafer peeling process in an embodiment of the present invention. 6 is a perspective schematic view of a peeling mechanism in an embodiment of the present invention. 7 is an exploded perspective view of the positioning device in the embodiment of the present invention. 8 is an exploded perspective view of the positioning module on the upper and lower positioning modules and the placement base of the conveying device in the embodiment of the present invention. 9 is a schematic diagram (1) of the peeling and positioning operation of the wafer to be stripped in the embodiment of the present invention. 10 is a schematic diagram (2) of the peeling positioning operation of the wafer to be stripped in the embodiment of the present invention. FIG. 11 is a schematic diagram of a conveying device and a conveying mechanism in an embodiment of the present invention. 12 is a schematic perspective view of the first and second conveying modules of the conveying device in the embodiment of the present invention. FIG. 13 is an enlarged schematic perspective view of the supporting portion on the bracket of the first conveying module in the embodiment of the present invention. FIG. 14 is an enlarged schematic side view of the supporting portion of the bracket of the first conveying module in the embodiment of the present invention. 15 is a schematic diagram of the conveying path of the first and second conveying modules in the embodiment of the present invention. 16 is a detailed schematic diagram of the conveying path of the first conveying module in the embodiment of the present invention. FIG. 17 is an enlarged schematic view of a part of a strip wafer extracted by a suction nozzle in a second conveying module in an embodiment of the present invention.

H: conveying device

H2: First transport module

H21: first stand

H22: drive parts

H23: bracket

H24: Jet Block

H241: fixing

H242: Air valve

H25: Supporting Department

H252: pneumatic connector

H3: Mobile seat

H4: Second transport module

H41: Second seat

H42: driver

H43: Nozzle

K3: sliding cylinder

K4: second belt

Claims (17)

A method for transporting a wafer peeling process includes: leaving stripped wafers on a positioning portion of a positioning device; performing a first transport step, and using a first transport module to place the wafers on the positioning portion The strip-shaped wafer is transported and placed in a temporary part of a placement base; a second transporting step, the strip-shaped wafer on the temporary part is transported and collected in a material frame by a second transport module . The method for transferring a wafer peeling process as described in item 1 of the patent application scope, wherein, in the first transfer step, the first transfer module advances through a receiving path to support the strip wafer under the positioning portion, and then Return to the temporary part of the placement base through a return path located above the receiving path, and place the strip-shaped wafer in the temporary part. The transfer method of the wafer peeling process as described in item 2 of the patent application scope, wherein the receiving path includes a horizontal linear stroke that is horizontally displaced to below the positioning portion, and a strip that is vertically lifted from below the positioning portion The vertical displacement of the wafer. The transfer method of the wafer peeling process as described in item 2 of the patent application scope, wherein the return path includes a horizontal linear stroke that is horizontally displaced above the temporary portion of the placement base, and a path from the temporary portion The vertical displacement stroke of the strip-shaped wafer is dropped vertically. The transfer method of the wafer peeling process described in item 1 of the patent application scope, wherein the first transfer step and the second transfer step are performed simultaneously. The transfer method of the wafer peeling process as described in item 1 of the patent application scope, wherein, in the second transfer step, the second transfer module moves horizontally above the temporary portion to remain at the height position, and By blowing air from the bottom up, the strip-shaped wafer is floated on the one hand, and sucked by a suction nozzle to extract the strip-shaped wafer on the other hand. The method for transferring a wafer peeling process as described in item 1 of the scope of the patent application, wherein, when the strip-shaped wafer is not placed, the temporary part is cleaned by air jet. A conveying device for wafer peeling process, used for conveying stripped wafers left by a positioning part on a positioning device to a material frame, including: a placement seat on which a temporary part is provided; a first part A conveying module is provided with two brackets spaced apart, and a bracket is provided on the bracket, and the bracket can be displaced between the positioning part of the positioning device and the temporary part of the placement base; A second conveying module is provided with two suction nozzles spaced apart, and the suction nozzle can be displaced between the temporary part of the placement base and the material frame. As described in Item 8 of the patent application scope, the transfer device of the wafer peeling process, wherein the receiving portion of the bracket of the first transfer module is provided with a suction port, which can provide suction force. The conveying device of the wafer peeling process as described in item 8 of the patent scope, wherein the first conveying module is provided on a movable base capable of displacement, including a first base frame, and fixed on the movable base A driving member connected to the upper part and connected with the driving member can drive the first seat frame to be displaced, and the first bracket is provided with the two brackets. As described in Item 10 of the patent application scope, a conveying device for a wafer peeling process, wherein an air jet seat is provided under the first seat frame between the two brackets, and an air valve is provided to blow air upward. The conveying device of the wafer peeling process as described in item 8 of the patent application scope, wherein the second conveying module is provided on a movable seat capable of displacement, including a second seat frame, and fixed on the movable seat A driving member linked to the upper part and connected with the driving member can drive the second seat frame to be displaced, and the second suction frame is provided with the two suction nozzles. The conveying device of the wafer peeling process described in item 8 of the patent application scope, wherein the two nozzles are located above the two brackets. The conveying device of the wafer peeling process as described in item 8 of the patent application scope, wherein the first conveying module and the second conveying module are co-located on a movable seat capable of displacement, the suction nozzle and the bracket The joint is synchronized with the horizontal displacement of the X axis. The transfer device of the wafer peeling process described in item 8 of the patent application range, wherein the placement seat is located between the mold base and the material frame in the X-axis linear transfer path of the strip wafer, the mold base, The placement base and the material frame are arranged in a sequence of X-axis linear intervals, and the mold base, the placement base and the material frame each provide the strip-shaped wafers to be placed in the Y-axis direction. A conveying device for a wafer peeling process includes: a device for performing the conveying method of the wafer peeling process as described in any one of items 1 to 5 of the patent application. An apparatus for a wafer peeling process, using the conveying device of the wafer peeling process as described in any one of claims 8 to 16, including peeling a wafer to be stripped into the strip wafer Folding mechanism, a feeding mechanism for placing a piece of wafer, a hemming mechanism for peeling the sheet wafer into the wafer to be stripped, a transport mechanism for carrying the sheet wafer or the wafer to be stripped .

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