TW202015119A - Metal removing device, substrate treating apparatus, and substrate treating method - Google Patents

Abstract

A metal removing device includes (200) removes metal (M) contained in a treatment liquid used for treating a substrate (W). The metal removing device (200) includes a magnetic field generating section (220) and a trapping section (210). The magnetic field generating section (220) causes a magnetic field to act on the treatment liquid supplied from a treatment liquid supply source. The trapping section captures the metal (M) moving in the treatment liquid under action of the magnetic field.

Description

Metal removal device, substrate processing device and substrate processing method

The invention relates to a metal removal device, a substrate processing device and a substrate processing method.

In the substrate processing apparatus, a processing liquid is supplied to the substrate and processed. If a foreign substance is contained in the treatment liquid, the yield will be deteriorated, and therefore a treatment is performed to remove the foreign substance in the treatment liquid using a filter (for example, Patent Document 1). In the semiconductor substrate cleaning device of Patent Document 1, a filter adsorbs metal impurities.

[Prior Technical Literature] [Patent Literature]

Patent Literature 1: Japanese Patent Laid-Open No. 08-8223

However, in the filter, the metal contained in the treatment liquid may not be removed.

In view of the above problems, an object of the present invention is to provide a metal removal device, a substrate processing device, and a substrate processing method, which can remove metals in a processing liquid.

The metal removing device of the present invention removes the metal contained in the processing liquid, and the processing liquid treats the substrate. The metal removal device includes a magnetic field generation unit and a collection unit. The above-mentioned magnetic field generating unit applies a magnetic field to the processing liquid supplied from the processing liquid supply source. The trapping part is trapped by the magnetic field to trap the metal moving in the processing liquid.

In one embodiment, the metal removal device further includes piping. The piping is connected to the processing liquid supply source. The collecting part is arranged in the piping.

In one embodiment, the piping has a circulation part. The circulation unit is configured to circulate the processing liquid and is adjacent to the collection unit. The flow velocity of the treatment liquid in the collection section is slower than the flow velocity of the treatment liquid in the circulation section.

In one embodiment, the piping system is formed of a non-magnetic material.

In one embodiment, the piping system is formed of perfluoroalkoxy ethylene.

In one embodiment, the collecting portion is arranged at a location where the diameter of the piping changes.

In one embodiment, the piping further has a bent portion. The collecting part is arranged at the curved part.

In one embodiment, in the collection portion, the inner peripheral surface of the pipe has a concave-convex shape.

In one embodiment, the collecting part can be detached from the piping. Alternatively, the magnetic field generating portion disposed on the outer peripheral surface of the piping may be detachable.

In one embodiment, the magnetic field generating section includes an electromagnet. The magnetic field generating unit can switch whether to apply a magnetic field to the processing liquid.

In one embodiment, the metal removal device further includes piping and a processing liquid storage unit. The piping is connected to the processing liquid supply source. The processing liquid storage unit is connected to the piping. The processing liquid storage unit stores the processing liquid. The collection unit is disposed in the processing liquid storage unit.

In one embodiment, the treatment liquid system has no polarity or low polarity.

In one embodiment, the treatment liquid contains isopropyl alcohol.

The substrate processing apparatus of the present invention includes the metal removing apparatus described above. The substrate processing device processes the substrate by the processing liquid passing through the metal removal device.

The substrate processing method of the present invention includes the following steps: the step of supplying the processing liquid from the processing liquid supply source to the piping; the use of the magnetic field generated by the magnetic field generating section to capture the metal moving in the processing liquid to remove the processing liquid The step of the above-mentioned metal contained in; and the step of processing the substrate by the above-mentioned processing liquid from which the above-mentioned metal has been removed.

In one embodiment, the above-mentioned substrate processing method further includes a discharging step, which discharges by releasing the captured metal.

According to the metal removal device of the present invention, the metal in the treatment liquid can be removed.

1‧‧‧Processing unit

2‧‧‧Supply Regulation Department

4‧‧‧fluid tank

5‧‧‧Processing liquid chamber

10‧‧‧ chamber

11‧‧‧Rotating chuck

12‧‧‧ nozzle

13‧‧‧Supply piping

14‧‧‧ Nozzle moving unit

16‧‧‧Cup

19‧‧‧Different piping

20‧‧‧Valve

21‧‧‧Flowmeter

22‧‧‧Flow regulating valve

23‧‧‧Valve

51‧‧‧ Once filter

52‧‧‧One time filter

53~55, 59, 62, 64, 66, 68

56‧‧‧Flow regulating valve

57、58‧‧‧Treatment liquid tank

60‧‧‧Flow regulating valve

61‧‧‧Secondary filter

63‧‧‧Secondary filter

65‧‧‧Secondary filter

67‧‧‧Secondary filter

70‧‧‧Drain tank

100‧‧‧Substrate processing device

110‧‧‧Chuck components

111‧‧‧rotating base

112‧‧‧rotating motor

200‧‧‧Metal removal device

210‧‧‧Capture Department

220, 220a, 220b

230, 230a, 230b, 230c, 230d, 230e‧‧‧ piping

232‧‧‧Perimeter

233‧‧‧Inner peripheral surface

234‧‧‧Circulation Department

235‧‧‧Bend

240‧‧‧Process liquid supply source

250‧‧‧Processing liquid storage

A1‧‧‧Rotation axis

A2‧‧‧Rotation axis

CR‧‧‧Central Robot

d1, d2‧‧‧Pipe diameter

H‧‧‧Magnetic field

IR‧‧‧ Index Robot

L1, L2‧‧‧ data

LP‧‧‧Loading port

M‧‧‧Metal

TW‧‧‧Tower

W‧‧‧Substrate

FIG. 1 is a diagram showing a substrate processing apparatus.

2(a) and (b) are schematic cross-sectional views showing a metal removing device.

FIG. 3 is a diagram showing the result of metal trapping in the metal removing device in the embodiment of the present invention.

4 is a schematic cross-sectional view showing a metal removing device.

5(a) to (d) are schematic cross-sectional views showing a metal removing device.

6 is a schematic cross-sectional view showing a metal removing device.

7 is a plan view showing a substrate processing apparatus.

8 is a diagram showing piping of a substrate processing apparatus.

9 is a diagram showing the piping of the processing liquid chamber.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are given the same reference symbols without repeating the description. In addition, in the embodiment of the present invention, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction.

<Embodiment 1>

1, a substrate processing apparatus 100 according to an embodiment of the present invention will be described. First, the substrate processing apparatus 100 will be described with reference to FIG. 1. FIG. 1 is a diagram showing a substrate processing apparatus 100. As shown in FIG. 1, the substrate processing apparatus 100 processes the substrate W with a processing liquid. Specifically, the substrate processing apparatus 100 is a monolithic type that processes the substrate W piece by piece. The substrate W is substantially disc-shaped.

The substrate processing apparatus 100 includes a processing unit 1, a supply regulator 2, and a metal removal device 200.

The processing unit 1 discharges the processing liquid toward the substrate W to process the substrate W. Specifically, the processing unit 1 includes a chamber 10, a rotating chuck 11, a nozzle 12, and a supply Piping 13, nozzle moving unit 14 and cup 16.

The chamber 10 has a substantially box shape. The chamber 10 houses the substrate W, the rotating chuck 11, the nozzle 12, a part of the supply pipe 13, the nozzle moving unit 14 and the cup 16. The rotary chuck 11 rotates while holding the substrate W. Specifically, the rotary chuck 11 rotates the substrate W about the rotation axis A1 while holding the substrate W horizontally in the chamber 10.

The rotating chuck 11 includes a plurality of chuck members 110, a rotating base 111, and a rotating motor 112. The plurality of chuck members 110 hold the substrate W in a horizontal posture. The rotating base 111 is substantially disc-shaped, and supports a plurality of chuck members 110 in a horizontal posture. The rotation motor 112 rotates the rotation base 111 to rotate the substrate W held by the plurality of chuck members 110 around the rotation axis A1.

The nozzle 12 discharges the processing liquid toward the substrate W. The treatment liquid is, for example, non-polar or low-polar. The treatment liquid contains, for example, isopropyl alcohol (IPA).

The supply pipe 13 is connected to the nozzle 12. The supply pipe 13 supplies the processing liquid toward the nozzle 12.

The supply adjustment unit 2 adjusts the supply amount of the processing liquid toward the nozzle 12. The supply regulator 2 is arranged on the supply pipe 13 outside the chamber 10. In addition, the supply regulator 2 may be disposed on the supply pipe 13 inside the chamber 10.

Specifically, the supply regulator 2 sets the supply amount of the processing liquid to the nozzle 12 to zero, that is, stops the supply of the processing liquid to the nozzle 12. The supply regulator 2 sets the supply amount of the processing liquid to the nozzle 12 to be greater than zero, and then supplies the processing liquid to the nozzle 12. The supply regulator 2 regulates the flow rate of the processing liquid supplied to the nozzle 12.

More specifically, the supply regulator 2 includes a valve 20, a flow meter 21, and a flow rate adjustment valve 22. The start and stop of the supply of the processing liquid to the nozzle 12 are borrowed Switched by the valve 20. Specifically, the valve 20 is an on-off valve, and can be switched between an open state and a closed state. The open state refers to a state where the processing liquid flowing into the supply pipe 13 toward the nozzle 12 passes. The closed state refers to a state where the supply of the processing liquid from the supply pipe 13 to the nozzle 12 is stopped.

The flow meter 21 detects the flow rate of the processing liquid supplied to the nozzle 12. The flow rate adjustment valve 22 adjusts the flow rate of the processing liquid supplied to the nozzle 12. When the valve 20 is in an open state, the processing liquid is supplied from the supply pipe 13 to the nozzle 12 at a flow rate corresponding to the opening degree of the flow rate adjustment valve 22. As a result, the processing liquid is discharged from the nozzle 12. The opening degree indicates the opening degree of the flow regulating valve 22.

The cup 16 has a substantially cylindrical shape. The cup 16 receives the processing liquid discharged from the substrate W.

The nozzle moving unit 14 rotates around the axis of rotation A2 to move the nozzle 12 horizontally. Specifically, the nozzle moving unit 14 moves the nozzle 12 horizontally between the processing position and the standby position of the nozzle 12. The processing position indicates the position above the substrate W. The standby position indicates a position outside the rotating chuck 11 and the cup 16. In addition, the nozzle moving unit 14 can also vertically move the nozzle 12.

The metal removing device 200 removes the metal contained in the processing liquid for processing the substrate W. The substrate processing apparatus 100 processes the substrate W using the processing liquid after passing through the metal removing apparatus 200.

2 (a) and 2 (b), the metal removal device 200 in the embodiment of the present invention will be described. 2(a) and 2(b) are schematic cross-sectional views showing the metal removing device 200. FIG.

As shown in FIGS. 2( a) and 2 (b ), the metal removal device 200 includes a trap 210, a magnetic field generator 220 and a pipe 230.

The piping 230 is for circulating the processing liquid for processing the substrate W. The processing liquid flows in the piping 230 from the left side to the right side in the figure. That is, the left side of the figure is the upstream side, and the right side of the figure is the downstream side. The flow rate of the treatment liquid is, for example, 0.64 m/sec. The treatment liquid contains metal M as an impurity. The metal is, for example, aluminum, chromium, iron, and zinc. The metal removal device 200 removes the metal contained in the processing liquid. The piping 230 is connected to the processing liquid supply source. The piping 230 has a circulation part 234 through which the processing liquid circulates. The circulation unit 234 is adjacent to the collection unit 210. The piping 230 is formed of a non-magnetic material, for example. In detail, the piping 230 is formed of, for example, perfluoroalkoxyethylene.

The magnetic field generating unit 220 is, for example, a neodymium magnet. The magnetic field generator 220a is an N-pole magnet. The magnetic field generating part 220b is a magnet of S pole. The magnetic field generator 220 is attached to the outer peripheral surface 232 of the pipe 230, for example. In detail, the magnetic field generation part 220a and the magnetic field generation part 220b are attached to the outer peripheral surface 232 of the pipe 230 so that the pipe 230 is sandwiched between the magnetic field generation part 220a and the magnetic field generation part 220b. Therefore, the magnetic field generation unit 220 causes the magnetic field H to act on the processing liquid in the collection unit 210. The magnetic flux density is, for example, 200 mT. Furthermore, the magnetic field generating unit 220 may be an electromagnet. When the magnetic field generator 220 is an electromagnet, it can be easily switched whether the magnetic field H acts on the processing liquid.

The collection unit 210 is arranged in the piping 230. Specifically, the collecting part 210 constitutes a part of the piping 230. In detail, the collection part 210 represents the part of the piping 230 where the magnetic field generation part 220 is arranged. In the collection part 210, the processing liquid supplied from the processing liquid supply source is circulated. As shown in FIG. 2( a ), the metal M contained in the processing liquid moves toward the trap 210 due to the magnetic field H. Therefore, as shown in FIG. 2( b ), the collector 210 receives the action of the magnetic field H to capture the metal M moving in the processing liquid.

Next, a substrate processing method according to an embodiment of the present invention will be described. The substrate processing method includes a supply step, a removal step, and a processing step. Supply step In the step, as shown in FIG. 2(a), the processing liquid is supplied from the processing liquid supply source to the piping 230. In the removal step, as shown in FIG. 2(b), the metal generated in the processing liquid is captured by the magnetic field generated by the magnetic field generating unit 220 to remove the metal contained in the processing liquid. In the processing step, the substrate W is processed by the processing liquid after removing the metal. According to the substrate processing method of the embodiment of the present invention, the substrate W can be processed by the metal removal processing liquid. Therefore, the yield can be improved. In addition, preferably, the substrate processing method further includes a discharge step. In the discharging step, discharging is performed by releasing the captured metal. The discharge of metal will be described later with reference to FIGS. 8 and 9.

With reference to Fig. 3, the metal trapping result of the metal removing device in the embodiment of the present invention will be described. FIG. 3 is a diagram showing the result of metal trapping in the metal removing device in the embodiment of the present invention. In FIG. 3, the horizontal axis shows the metal contained in the treatment liquid. In FIG. 3, the vertical axis shows the amount of metal contained in the treatment liquid. The unit of the vertical axis is E10 atomos/cm ² . In FIG. 3, the data L1 shows data in a case where the magnetic field generating part is not provided in the piping. In FIG. 3, the data L2 shows the data in the case where the magnetic field generating unit 220 is provided in the piping 230. As measurement conditions, the treatment liquid is IPA, the magnetic flux density is 200 mT, the flow rate of the treatment liquid is 0.64 m/sec, and the diameter of the pipe 230 is 10 mm.

As shown in FIG. 3, compared with the data L1, it can be confirmed that the amount of metal contained in the processing liquid in the data L2 is reduced. In particular, it was confirmed that aluminum (Al), chromium (Cr), iron (Fe), and zinc (Zn) decreased. Although aluminum is weak as a magnetic substance, it was confirmed that aluminum was removed from the treatment liquid. This is because aluminum agglomerates with strong magnetic iron and is captured by the trapping unit 210 together with iron.

As described above with reference to FIGS. 1 to 3, the trapping section 210 receives the action of the magnetic field H to trap the metal moving in the processing liquid. Therefore, the processing can be removed Metal in the liquid. As a result, the purity of the treatment liquid can be improved, and further the yield can be improved.

In addition, the collection unit 210 is arranged in the piping 230. Therefore, the metal in the processing liquid flowing in the piping 230 can be removed. As a result, the purity of the treatment liquid can be improved, and the yield can be improved.

In addition, the piping 230 is formed of a non-magnetic material. Therefore, it does not prevent the magnetic field generation unit 220 from applying the magnetic field to the processing liquid in the collection unit 210. Therefore, the magnetic field generation unit 220 can cause the magnetic field to act on the processing liquid in the collection unit 210. As a result, the collecting part 210 can capture the metal moving in the processing liquid by the magnetic field H.

In addition, the treatment liquid system has no polarity or low polarity. Therefore, the magnetic field generation unit 220 can cause the magnetic field to act on the processing liquid in the collection unit 210. As a result, metals in the treatment liquid that cannot be removed by the ion exchange filter can be captured.

<Embodiment 2>

In the metal removal device 200 described with reference to FIGS. 1 to 3, the collection unit 210 is disposed in the piping 230, but the collection unit 210 may be disposed in the processing liquid storage unit 250.

4, a metal removal device 200 according to Embodiment 2 of the present invention will be described. FIG. 4 is a schematic cross-sectional view showing the metal removing device 200. The metal removal device 200 of the second embodiment differs from the metal removal device 200 of the first embodiment mainly in that the trapping unit 210 is arranged in the processing liquid storage unit 250. The differences between Embodiment 2 and Embodiment 1 will be mainly described below.

As shown in FIG. 4, the metal removal device 200 includes a processing liquid supply source 240 and a processing liquid storage part 250 in addition to the trap part 210, the magnetic field generation part 220, and the piping 230.

The magnetic field generating unit 220 is attached to the outer peripheral surface of the processing liquid storage unit 250.

The piping 230 is connected to the processing liquid supply source 240.

The processing liquid supply source 240 supplies the processing liquid to the processing liquid accommodating portion 250 via the piping 230. The processing liquid supply source 240 is, for example, a tank.

The processing liquid storage unit 250 is connected to the piping 230. The processing liquid accommodating unit 250 stores the processing liquid. The processing liquid storage unit 250 is, for example, a tank smaller than the processing liquid supply source 240. The flow rate of the processing liquid in the processing liquid storage section 250 is close to zero.

The collection unit 210 is disposed in the processing liquid storage unit 250. The flow rate of the processing liquid in the processing liquid storage section 250 is close to zero. Therefore, the collection unit 210 easily captures the metal moving in the processing liquid by the magnetic field H. As a result, the metal in the treatment liquid can be removed.

<Embodiment 3>

In the metal removal device 200 described with reference to FIGS. 1 to 3, the collecting part 210 is arranged on the linear part of the pipe 230, but the collecting part 210 may be arranged other than the linear part of the pipe 230.

5 (a) to (d), a metal removal device 200 according to Embodiment 3 of the present invention will be described. 5(a) to (d) are schematic cross-sectional views showing the metal removing device 200. FIG. The metal removal device 200 of the third embodiment differs from the metal removal device 200 of the first embodiment mainly in that the collecting portion 210 is arranged at a point other than the linear portion of the pipe 230. The differences between Embodiment 3 and Embodiment 1 will be mainly described below. In addition, in FIGS. 5( a) to 5 (d ), in order to simplify the diagram, the magnetic field generating unit 220 is omitted.

As shown in FIG. 5(a), the diameter of the piping 230 increases from d1 to d2. The collecting part 210 is arranged at a position where the diameter of the pipe 230 changes. At the position where the diameter of the piping 230 changes, the flow rate of the treatment liquid decreases. That is, the The flow rate is slower than the flow rate of the processing liquid in the circulation section 234. Therefore, the collecting part 210 easily captures the metal moving in the processing liquid by the magnetic field H.

As shown in FIG. 5( b ), the piping 230 has a bent portion 235. The bent portion 235 is where the piping 230 bends. The collection part 210 is arranged in the curved part 235. In the bent portion 235, the flow rate of the processing liquid is reduced due to pressure loss. That is, the flow rate of the processing liquid in the collection part 210 is slower than the flow rate of the processing liquid in the circulation part 234. Therefore, the collecting part 210 easily captures the metal moving in the processing liquid by the magnetic field H. As a result, the metal in the treatment liquid can be removed.

As shown in FIG. 5(c), the piping 230 has a bent portion 235. The bent portion 235 is where the piping 230 bends. In the bent portion 235, the piping 230 is recessed. The collection part 210 is arranged in the curved part 235. In the bent portion 235, the flow rate of the processing liquid is reduced due to pressure loss. That is, the flow rate of the processing liquid in the collection part 210 is slower than the flow rate of the processing liquid in the circulation part 234. Therefore, the collecting part 210 easily captures the metal moving in the processing liquid by the magnetic field H. As a result, the metal in the treatment liquid can be removed.

As shown in FIG. 5(d), the piping 230 has a plurality of bent portions 235. The bent portion 235 is where the piping 230 bends. The collecting part 210 is arranged on each of the plural bending parts 235. In the bent portion 235, the flow rate of the processing liquid is reduced due to pressure loss. That is, the flow rate of the processing liquid in the collection part 210 is slower than the flow rate of the processing liquid in the circulation part 234. Therefore, the collecting part 210 easily captures the metal moving in the processing liquid by the magnetic field H. As a result, the metal in the treatment liquid can be removed.

<Embodiment 4>

Furthermore, the inner peripheral surface 233 of the piping 230 may have a concave-convex shape.

Referring to FIG. 6, a metal removal device 200 according to Embodiment 4 of the present invention Be explained. FIG. 6 is a schematic cross-sectional view showing the metal removing device 200. The metal removal device 200 of the fourth embodiment differs from the metal removal device 200 of the first embodiment mainly in that the inner peripheral surface 233 of the pipe 230 has a concave-convex shape. The differences between Embodiment 4 and Embodiment 1 are mainly explained below.

As shown in FIG. 6, in the collection part 210, the inner peripheral surface 233 of the pipe 230 has a concave-convex shape. Therefore, the collecting part 210 easily captures the metal moving in the processing liquid by the magnetic field H. As a result, the metal in the treatment liquid can be removed.

<Embodiment 5>

The substrate processing apparatus 100 according to Embodiment 5 of the present invention will be described with reference to FIGS. 7 to 9. Embodiment 5 is different from Embodiment 1 in that it has a plurality of processing units 1. The differences between Embodiment 5 and Embodiment 1 will be mainly described below.

First, referring to FIG. 7, the substrate processing apparatus 100 will be described. 7 is a plan view showing the substrate processing apparatus 100. As shown in FIG. 7, the substrate processing apparatus 100 includes a plurality of loading ports LP, an index robot IR, a central robot CR, a plurality of processing units 1, a plurality of fluid tanks 4, and a processing liquid chamber 5.

Each loading port LP is stacked to accommodate a plurality of substrates W. The indexing robot IR transfers the substrate W between the loading port LP and the central robot CR. The central robot CR transfers the substrate W between the index robot IR and the processing unit 1. Each processing unit 1 discharges a processing liquid toward the substrate W to process the substrate W. Each fluid tank 4 contains a fluid machine. The processing liquid chamber 5 contains the processing liquid.

Specifically, the plurality of processing units 1 form a plurality of towers TW arranged in a plan view around the central robot CR (four towers in Embodiment 5) TW). Each tower TW includes a plurality of processing units 1 stacked up and down (three processing units 1 in Embodiment 5). The plurality of fluid tanks 4 respectively correspond to the plurality of towers TW. The processing liquid in the processing liquid chamber 5 is supplied to all the processing units 1 included in the tower TW corresponding to the fluid tank 4 through any fluid tank 4.

In addition, in the fifth embodiment, the substrate processing apparatus 100 is provided with the rotary chuck 11, the nozzle 12, and the supply regulator 2 in each chamber 10. Each chamber 10 accommodates the rotary chuck 11, the nozzle 12, and the supply regulator 2.

Next, the supply of the processing liquid to the nozzle 12 will be described with reference to FIGS. 8 and 9. FIG. 8 is a diagram showing the piping of the substrate processing apparatus 100. FIG. 9 is a diagram showing the piping of the processing liquid chamber 5. As shown in FIG. 8, the substrate processing apparatus 100 is attached to each tower TW, and includes a supply pipe 13, a branch pipe 19, a supply regulator 2, and a valve 23 for each processing unit 1. The supply regulator 2 is housed in the fluid tank 4 corresponding to the tower TW. One part of each supply pipe 13 is accommodated in the chamber 10, and the other part of each supply pipe 13 is accommodated in the fluid tank 4. The divergent piping 19 shows the diverging piping from the supply piping 13. The branch piping 19 is connected to the drain tank 70 (FIG. 9) of the processing liquid chamber 5 via the valve 23. By opening and closing the valve 23, it is controlled whether the processing liquid in the branch piping 19 is discharged. For example, by opening the valve 23, the processing liquid in the branch piping 19 is discharged to the drain tank 70.

As shown in FIG. 9, the processing liquid chamber 5 includes a plurality of primary filters, a plurality of secondary filters, a plurality of valves, a plurality of flow regulating valves, a plurality of processing liquid tanks, a plurality of pipes, and a liquid discharge tank 70. The plurality of primary filters includes a primary filter 51 and a primary filter 52. The plural secondary filters include a secondary filter 61, a secondary filter 63, a secondary filter 65, and a secondary filter 67. The plural valves include a valve 53, a valve 54, a valve 55, a valve 59, a valve 62, a valve 64, a valve 66, and a valve 68. Multiple flow adjustments The whole valve includes a flow adjustment valve 56 and a flow adjustment valve 60. The plurality of processing liquid tanks includes a processing liquid tank 57 and a processing liquid tank 58. The plurality of pipes include pipe 230a, pipe 230b, pipe 230c, pipe 230d, and pipe 230e.

The piping 230a shows piping connected to the upstream side of the primary filter 51. The piping 230b shows piping connected to the downstream side of the primary filter 52 and connected to the upstream side of the processing liquid tank 57 and the processing liquid tank 58. The piping 230c shows piping connected to the downstream side of the processing liquid tank 57 and the processing liquid tank 58. The piping 230d shows the diverging piping connected to the upstream side of the secondary filter 61, the secondary filter 63, the secondary filter 65, and the secondary filter 67. The piping 230e shows the diverging piping connected to the upstream side of the fluid tank 4.

The processing liquid (IPA) circulates in the pipe 230a and is supplied to the primary filter 51. The primary filter 51 and the primary filter 52 remove foreign substances from the processing liquid flowing through the piping. The primary filter 51 is connected to the primary filter 52. The primary filter 51 is connected to the drain tank 70 via the valve 53. The primary filter 52 is connected to the drain tank 70 via the valve 54. The metal removing device 200 is arranged at any place in the piping 230a, for example. Therefore, the treatment liquid from which the metal has been removed by the metal removal device 200 is supplied into the primary filter 51.

The primary filter 52 is connected to the processing liquid tank 57 and the processing liquid tank 58 via the piping 230b. The processing liquid is contained in the processing liquid tank 57 and the processing liquid tank 58. The treatment liquid tank 57 is connected to the drain tank 70 via a valve 55 and a flow rate adjustment valve 56. The treatment liquid tank 58 is connected to the drain tank 70 via a valve 59 and a flow rate adjustment valve 60. The metal removing device 200 is disposed at any part of the piping 230b, for example. Therefore, the processing liquid whose metal has been removed by the metal removing device 200 is supplied into the processing liquid tank 57 and the processing liquid tank 58.

The processing liquid tank 57 is connected to the secondary filter 65 and the secondary filter 67 via the piping 230c and the piping 230d. The processing liquid tank 58 is connected to the secondary filter 61 and the secondary filter 63 via the piping 230c and the piping 230d. The piping 230d is a piping where piping 230c diverges. The secondary filter 65 and the secondary filter 67 remove foreign substances from the processing liquid flowing through the piping. The metal removal device 200 is disposed at any part of the piping 230c, for example. In addition, the metal removing apparatus 200 is arrange|positioned at any part of piping 230d, for example. Therefore, the treatment liquid from which the metal has been removed by the metal removal device 200 is supplied into the secondary filter 61, the secondary filter 63, the secondary filter 65, and the secondary filter 67.

The secondary filter 61, the secondary filter 63, the secondary filter 65, and the secondary filter 67 are respectively connected to the fluid tank 4 via the piping 230e. The piping 230e is a divergent piping. The metal removal device 200 is disposed at any part of the divergent piping 230e, for example. Therefore, the processing liquid whose metal has been removed by the metal removing device 200 is supplied in the fluid tank 4.

In addition, the metal removal device 200 is disposed in each of the primary filter 51, the primary filter 52, the secondary filter 61, the secondary filter 63, the secondary filter 65, and the secondary filter 67, for example. In detail, the magnetic field generation part is attached to the housing of each of the primary filter 51, the primary filter 52, the secondary filter 61, the secondary filter 63, the secondary filter 65, and the secondary filter 67 220. Therefore, the metal that cannot be removed in the filter can be removed by the metal removal device 200.

Refer to Figure 8 again. As shown in FIG. 8, the metal removal device 200 is arranged at any position in the piping connected to the upstream side of the supply regulator 2 in the fluid tank 4. In addition, the metal removing device 200 is arranged at any position in the supply pipe 13 up to the nozzle 12 arranged on the downstream side of the flow control valve 22. Therefore, the nozzle 12 The processing liquid from which the metal has been removed by the metal removing device 200 is discharged toward the substrate W.

Furthermore, it is preferable that the trapping part 210 can be detached from the piping 230. For example, the collection unit 210 may be connected to the pipe 230 via a joint, and may be detachable. In this case, it is preferable to provide a bypass line by using a three-way valve, whereby the trap part 210 can be removed without stopping the flow of the processing liquid. In addition, it is preferable that the magnetic field generating portion 220 disposed on the outer peripheral surface 232 of the pipe 230 is detachable. By removing the magnetic field generating part 220, the magnetic field can be eliminated. As a result, the metal captured by the collection unit 210 can be released from the collection unit 210. In this case, it is preferable to discharge the metal released from the trap part 210 to the drain tank 70.

In addition, when the magnetic field generating section 220 is an electromagnet, by stopping the current supplied to the electromagnet, the magnetic field H can be prevented from acting on the processing liquid. Therefore, the metal captured by the collection unit 210 can be released from the collection unit 210. Preferably, the metal released from the trap 210 is discharged to the drain tank 70.

Taking the metal removal device 200 disposed in the supply piping 13 shown in FIG. 8 as an example, the discharge of the captured metal will be described. First, by stopping the current supplied to the electromagnet, the magnetic field H is not applied to the processing liquid. As a result, the metal captured by the collection unit 210 can be released from the collection unit 210. At this time, by opening the valve 23, the processing liquid in the branch piping 19 is discharged to the drain tank 70. That is, the metal released from the trap 210 is discharged to the drain tank 70.

The embodiment of the present invention has been described above with reference to the drawings (FIGS. 1 to 9 ). However, the present invention is not limited to the above-mentioned embodiments, as long as it does not exceed the scope of the substance, it can be implemented in various aspects. In order to facilitate understanding, each component is schematically shown in the drawings subjectively, and considering the convenience of making the drawing, the thickness, length, number, etc. of each component shown in the drawings are different from the actual ones. In addition, the above The materials, shapes, sizes, etc. of the constituent elements shown in the embodiments are only examples, and are not particularly limited, and various changes can be made within a range that does not substantially deviate from the effects of the present invention.

200‧‧‧Metal removal device

210‧‧‧Capture Department

220, 220a, 220b

230‧‧‧Piping

232‧‧‧Perimeter

233‧‧‧Inner peripheral surface

234‧‧‧Circulation Department

H‧‧‧Magnetic field

M‧‧‧Metal

Claims (16)

A metal removal device that removes metals contained in a processing liquid for processing a substrate, the metal removal device includes: A magnetic field generating part which causes the magnetic field to act on the processing liquid supplied from the processing liquid supply source; and The catching part catches the metal moving in the processing liquid by the action of the magnetic field. The metal removal device according to claim 1, further comprising piping, the piping is connected to the processing liquid supply source, The collecting part is arranged in the piping. The metal removal device according to claim 2, wherein the piping has a circulation part, The circulation part is for the treatment liquid to circulate and is adjacent to the collection part, The flow velocity of the treatment liquid in the collection section is slower than the flow velocity of the treatment liquid in the circulation section. The metal removal device according to claim 2 or 3, wherein the piping is formed of a non-magnetic material. The metal removal device according to claim 2 or 3, wherein the piping is formed of perfluoroalkoxy ethylene. The metal removal device according to claim 2 or 3, wherein the collecting part is arranged at a location where the diameter of the piping changes. The metal removal device according to claim 2 or 3, wherein the piping further has a curved bent portion, and the collecting portion is arranged at the curved portion. The metal removal device according to claim 2 or 3, wherein the inner peripheral surface of the pipe has a concave-convex shape in the collection section. The metal removal device according to claim 2 or 3, wherein the above-mentioned trapping part can be The piping is detachable, or the magnetic field generating portion disposed on the outer peripheral surface of the piping is detachable. The metal removal device according to any one of claims 1 to 3, wherein the magnetic field generating section includes an electromagnet, and can switch whether or not to apply a magnetic field to the processing liquid. The metal removal device according to claim 1, further comprising a pipe connected to the processing liquid supply source, and a processing liquid accommodating part connected to the piping and accommodating the processing liquid, and the collecting part is disposed in the processing liquid accommodating unit. The metal removal device according to any one of claims 1 to 3, wherein the treatment liquid is non-polar or low-polar. The metal removal device according to any one of claims 1 to 3, wherein the treatment liquid contains isopropyl alcohol. A substrate processing apparatus provided with the metal removing apparatus according to any one of claims 1 to 13, The substrate is processed by the processing liquid passing through the metal removal device. A substrate processing method, which includes the following steps: The step of supplying the processing liquid from the processing liquid supply source to the piping; The step of removing the metal contained in the processing liquid by capturing the metal moving in the processing liquid by using the magnetic field generated by the magnetic field generating unit; and The step of processing the substrate by the above processing liquid from which the above metal has been removed. The substrate processing method according to claim 15, which further includes a discharging step, which discharges by releasing the captured metal.

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