TW202011453A - Exposure apparatus and method of manufacturing article - Google Patents

Exposure apparatus and method of manufacturing article Download PDF

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TW202011453A
TW202011453A TW108129976A TW108129976A TW202011453A TW 202011453 A TW202011453 A TW 202011453A TW 108129976 A TW108129976 A TW 108129976A TW 108129976 A TW108129976 A TW 108129976A TW 202011453 A TW202011453 A TW 202011453A
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concave portion
original
stage
item
exposure apparatus
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TW108129976A
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Chinese (zh)
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TWI764034B (en
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本間将人
河原泉
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日商佳能股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides an exposure apparatus which exposes a substrate while scanning an original and the substrate, comprising: a stage that includes a first surface in which a first concave portion and a second concave portion to be supplied with a purge gas are formed, and is movable while holding the original; and a member including a second surface facing the first surface, wherein the first concave portion is provided in the first surface of the stage so as to define a first space in which the original is arranged, and at least one second concave portion is provided outside the first concave portion in the first surface of the stage so as to define a second space having a smaller volume than the first space.

Description

曝光裝置及製造物品的方法Exposure device and method of manufacturing articles

本發明關於一種曝光裝置以及一種製造物品的方法。The invention relates to an exposure device and a method for manufacturing an article.

作為在液晶面板或半導體設備的製造方法(光刻方法)中所使用的裝置的一種類型,存在一種曝光裝置,其將由照明光學系統所照射的原版的圖案投影到基板上並曝光基板。已知的是,在曝光裝置中所使用的原版(遮罩或標線片)由於,例如,與存在於原版周圍的大氣中的酸、鹼或有機雜質反應而模糊。同樣已知的是,原版的模糊由於大氣中的水分而加速。當原版以此方式模糊時,會發生像是曝光不足等的問題,這可能使得難以將原版的圖案精確地轉印到基板上。據此,在曝光裝置中,理想的是用其雜質及濕度已被調整(減少)的沖洗氣體來填充原版被佈置於其中的空間。日本專利公開第2015-228519號提出一種佈置,其中,保持原版的原版台的可移動區域被以板覆蓋,且對由板所形成的內部空間供應具有減少的雜質及濕度的沖洗氣體。As a type of apparatus used in a manufacturing method (lithography method) of a liquid crystal panel or a semiconductor device, there is an exposure apparatus that projects the pattern of the original plate irradiated by the illumination optical system onto the substrate and exposes the substrate. It is known that the original plate (mask or reticle) used in the exposure device is blurred due to, for example, reaction with acid, alkali or organic impurities existing in the atmosphere around the original plate. It is also known that the original blur is accelerated by moisture in the atmosphere. When the original is blurred in this way, problems such as underexposure may occur, which may make it difficult to accurately transfer the pattern of the original to the substrate. Accordingly, in the exposure apparatus, it is desirable to fill the space in which the original plate is arranged with the flushing gas whose impurities and humidity have been adjusted (reduced). Japanese Patent Publication No. 2015-228519 proposes an arrangement in which the movable area of the original platen holding the original plate is covered with a plate, and the internal space formed by the plate is supplied with a flushing gas having reduced impurities and humidity.

在曝光裝置中,從運行成本等的觀點來看,理想的是減少沖洗氣體的使用量。然而,日本專利公開第2015-228519號中所描述的發明具有以板覆蓋原版台的整個可移動區域的佈置,使得由板所形成的內部空間相較於原版的體積為非常大的。因此,為了防止外部空氣侵入到由板所形成的內部空間中,需要對內部空間連續地供應大量的沖洗氣體,這對於減少沖洗氣體的使用量而言為不利的。In the exposure apparatus, it is desirable to reduce the amount of flushing gas used from the viewpoint of operating cost and the like. However, the invention described in Japanese Patent Publication No. 2015-228519 has an arrangement in which the entire movable area of the original platen table is covered with a plate, so that the internal space formed by the plate is very large compared to the volume of the original plate. Therefore, in order to prevent outside air from intruding into the internal space formed by the plates, it is necessary to continuously supply a large amount of flushing gas to the internal space, which is disadvantageous for reducing the amount of flushing gas used.

舉例而言,在被用來填充原版被放置於其中的空間的沖洗氣體的量的方面,本發明提供了一種有利技術。For example, the present invention provides an advantageous technique in terms of the amount of flushing gas used to fill the space in which the original plate is placed.

根據本發明的一面向,提供一種曝光裝置,其在掃描原版及基板的同時曝光基板,曝光裝置包括:台,其包括第一表面,且能夠在保持原版的同時移動,在第一表面中形成有待被供應沖洗氣體的第一凹入部分及第二凹入部分;以及構件,包括面向第一表面的第二表面,其中,第一凹入部分被設置於台的第一表面中,以便限定原版被佈置於其中的第一空間,並且至少一個第二凹入部分在台的第一表面中被設置於第一凹入部分外部,以便限定第二空間,其具有比第一空間更小的體積。According to an aspect of the present invention, there is provided an exposure device that exposes a substrate while scanning an original plate and a substrate. The exposure device includes: a stage including a first surface and capable of moving while maintaining the original plate and formed in the first surface A first concave portion and a second concave portion to be supplied with flushing gas; and a member including a second surface facing the first surface, wherein the first concave portion is provided in the first surface of the stage to define The first space in which the original plate is arranged, and at least one second concave portion is provided outside the first concave portion in the first surface of the stage so as to define a second space having a smaller size than the first space volume.

從例示性實施例參照所附圖式的以下描述,本發明的更多特徵將變得清楚明瞭。Further features of the present invention will become clear from the following description of exemplary embodiments with reference to the attached drawings.

下面將參照所附圖式描述本發明的例示性實施例。應注意的是,相同的標號在所有圖式中表示相同的構件,且將不再給出其重複描述。Exemplary embodiments of the present invention will be described below with reference to the drawings. It should be noted that the same reference numerals denote the same components in all drawings, and repeated descriptions thereof will not be given.

<第一實施例> [曝光裝置的佈置] 將描述根據本發明的第一實施例。圖1是示出此實施例的曝光裝置100的整體佈置的視圖。此實施例的曝光裝置100是步進掃描式曝光裝置,其在掃描原版M及基板W的同時曝光基板W,從而將原版M的圖案轉印到基板上。曝光裝置100亦被稱作掃描曝光裝置或掃描儀。在此實施例中,例如,原版M是由石英所製成的遮罩(標線片),在其上已形成待轉印到基板W上的多個曝光區域中的每一個曝光區域上的電路圖案。基板W是塗佈有光致抗蝕劑的晶圓,且例如,可使用單晶矽基板等。<First embodiment> [Layout of Exposure Device] The first embodiment according to the present invention will be described. FIG. 1 is a view showing the overall arrangement of the exposure apparatus 100 of this embodiment. The exposure apparatus 100 of this embodiment is a step-and-scan exposure apparatus which exposes the substrate W while scanning the original plate M and the substrate W, thereby transferring the pattern of the original plate M onto the substrate. The exposure device 100 is also called a scanning exposure device or a scanner. In this embodiment, for example, the original M is a mask (reticle) made of quartz on which each of the multiple exposure areas to be transferred onto the substrate W has been formed Circuit pattern. The substrate W is a wafer coated with photoresist, and for example, a single crystal silicon substrate or the like can be used.

曝光裝置100可包括照明光學系統1、可在保持原版M的同時移動的原版台2、投影光學系統3、可在保持基板W的同時移動的基板台4、以及控制單元5。控制單元5由,例如,包括CPU及記憶體的電腦所形成,且電連接到裝置中的各個單元,從而全面地控制裝置的整體操作。在此處,在以下描述中,假設平行於從照明光學系統1發射並入射到原版M的光的光軸的方向是Z方向,且假設在垂直於光軸的平面上彼此正交的兩個方向分別是X方向及Y方向。The exposure apparatus 100 may include an illumination optical system 1, an original plate stage 2 that can move while holding the original plate M, a projection optical system 3, a substrate table 4 that can move while holding the substrate W, and a control unit 5. The control unit 5 is formed by, for example, a computer including a CPU and a memory, and is electrically connected to each unit in the device, thereby comprehensively controlling the overall operation of the device. Here, in the following description, it is assumed that the direction parallel to the optical axis of the light emitted from the illumination optical system 1 and incident on the original M is the Z direction, and two orthogonal to each other on a plane perpendicular to the optical axis are assumed The directions are the X direction and the Y direction, respectively.

照明光學系統1使從光源6(例如,水銀燈、ArF準分子雷射或KrF準分子雷射等)發射的光成形為,例如,帶狀或弓狀狹縫形的光,並用此狹縫形的光照射原版M的一部分。透射通過原版M的一部分的光作為反映出原版M的這一部分的圖案的圖案光進入投影光學系統3。投影光學系統3具有預定投影放大率,並藉由使用圖案光來將原版M的圖案投影到基板(更具體地說,基板上的抗蝕劑)上。原版M及基板W分別由原版台2及基板台4所保持,並經由投影光學系統3被佈置於光學共軛位置(投影光學系統3的物面及像面)中。控制單元5以與投影光學系統的投影放大率匹配的速度比相對地彼此同步地掃描原版台2及基板台4(在此實施例中,假設原版M的掃描方向及基板W的掃描方向是X方向(第一方向))。利用此佈置,可將原版M的圖案轉印到基板上。The illumination optical system 1 shapes the light emitted from the light source 6 (for example, mercury lamp, ArF excimer laser, or KrF excimer laser, etc.) into, for example, light in the form of a band or bow slit, and uses this slit shape Part of the original M. The light transmitted through a part of the original plate M enters the projection optical system 3 as pattern light reflecting the pattern of this part of the original plate M. The projection optical system 3 has a predetermined projection magnification and uses the pattern light to project the pattern of the original plate M onto the substrate (more specifically, the resist on the substrate). The original plate M and the substrate W are held by the original plate table 2 and the substrate table 4, respectively, and are arranged in an optical conjugate position (object plane and image plane of the projection optical system 3) via the projection optical system 3. The control unit 5 scans the original stage 2 and the substrate stage 4 in synchronization with each other at a speed ratio matching the projection magnification of the projection optical system (in this embodiment, it is assumed that the scanning direction of the original M and the scanning direction of the substrate W are X Direction (first direction)). With this arrangement, the pattern of the original plate M can be transferred onto the substrate.

[原版台的周邊佈置] 一般而言,已知的是,在曝光裝置中所使用的原版M由於,例如,與在存在於原版M周圍的大氣中的酸、鹼或有機雜質反應而模糊。同樣已知的是,原版M的此模糊由於大氣中的水分而加速。當原版M以此方式模糊時,會發生像是曝光不足等問題,這可能使得難以將原版M的圖案精確地轉印到基板上。據此,在曝光裝置中,理想的是用其雜質及濕度已被調整(減少)的沖洗氣體來填充原版M被佈置於其中的空間。此外,在曝光裝置中,從運行成本等的觀點來看,理想的是減少沖洗氣體的使用量。因此,本實施例的曝光裝置100被構造成用沖洗氣體填充原版M被佈置於其中的空間,並能夠在此時減少沖洗氣體的使用量。在此處,沖洗氣體是被調整以減少酸、鹼、有機雜質以及濕度的氣體,且亦可使用,例如,潔淨的乾燥空氣或氮氣。[Peripheral layout of the original platform] In general, it is known that the original plate M used in the exposure device is blurred by, for example, reacting with acids, alkalis, or organic impurities present in the atmosphere around the original plate M. It is also known that this blur of the original M is accelerated by moisture in the atmosphere. When the master M is blurred in this way, problems such as underexposure may occur, which may make it difficult to accurately transfer the pattern of the master M to the substrate. Accordingly, in the exposure apparatus, it is desirable to fill the space in which the original plate M is arranged with the flushing gas whose impurities and humidity have been adjusted (reduced). In addition, in the exposure apparatus, it is desirable to reduce the amount of flushing gas used from the viewpoint of operating cost and the like. Therefore, the exposure apparatus 100 of the present embodiment is configured to fill the space in which the original plate M is arranged with flushing gas, and can reduce the amount of flushing gas used at this time. Here, the flushing gas is a gas adjusted to reduce acids, alkalis, organic impurities, and humidity, and can also be used, for example, clean dry air or nitrogen.

將在下文描述根據此實施例的曝光裝置100的詳細佈置。圖2A及2B是示出此實施例的曝光裝置100中的原版台2的周邊佈置的視圖。圖2A是示出曝光裝置100中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a(第一供應單元)的視圖。圖2B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。The detailed arrangement of the exposure apparatus 100 according to this embodiment will be described below. 2A and 2B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 100 of this embodiment. 2A is a diagram showing the peripheral arrangement (XZ section) of the original plate 2 in the exposure apparatus 100, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a (first supply unit) View. FIG. 2B is a view of the original platen 2 of this embodiment when viewed from above (+Z direction side).

首先,將描述原版台2的佈置。如圖2A及2B所示,原版台2的上表面(第一表面20)形成有第一凹入部分20a及第二凹入部分20b,從稍後將描述的供應單元8a向第一凹入部分20a及第二凹入部分20b供應沖洗氣體。第一凹入部分20a被設置於原版台2的上表面(第一表面20),以便限定原版M被佈置於其中的第一空間(原版佈置空間)。當從上方觀察原版台2時,第一凹入部分20a可被形成為具有大於原版M的尺寸,並具有等於或大於原版M的厚度的深度。First, the arrangement of the original stage 2 will be described. As shown in FIGS. 2A and 2B, the upper surface (first surface 20) of the original platen 2 is formed with a first concave portion 20a and a second concave portion 20b, which are recessed from the supply unit 8a, which will be described later, toward the first The part 20a and the second concave part 20b supply flushing gas. The first concave portion 20a is provided on the upper surface (first surface 20) of the original platen 2 so as to define a first space (original plate arrangement space) in which the original plate M is arranged. When the original plate stage 2 is viewed from above, the first concave portion 20a may be formed to have a size larger than that of the original plate M and have a depth equal to or greater than the thickness of the original plate M.

每一個第二凹入部分20b在原版台2的上表面(第一表面20)中被設置於第一凹入部分20a外部,以便限定具有比第一空間更小的體積的第二空間。在此實施例中,設置多個第二凹入部分20b,以便在掃描曝光期間在原版台2的掃描方向(±X方向,或可在下文中簡稱作“掃描方向”)上包夾第一凹入部分20a。亦即,第二凹入部分20b在原版台的上表面中被設置於第一凹入部分20a的掃描方向上(在±X方向側上)。Each second concave portion 20b is provided outside the first concave portion 20a in the upper surface (first surface 20) of the original platen 2 so as to define a second space having a smaller volume than the first space. In this embodiment, a plurality of second concave portions 20b are provided so as to sandwich the first concave in the scanning direction (±X direction, or may be referred to as "scanning direction" hereinafter) of the original stage 2 during scanning exposure Into part 20a. That is, the second concave portion 20b is provided in the scanning direction (on the ±X direction side) of the first concave portion 20a in the upper surface of the original platen.

當從上方觀察原版台2時,第二凹入部分20b被佈置成使得掃描方向(X方向)上的長度小於垂直於掃描方向的方向(±Y方向,或可在下文中簡稱作“垂直方向”)上的長度。亦即,第二凹入部分20b是沿著垂直方向(Y方向)在原版台2的上表面中延伸的凹槽部分。此實施例的第二凹入部分20b具有矩形形狀,其縱向方向是垂直方向(Y方向),但其形狀不限於此,且可具有彎曲形狀。When the original platen 2 is viewed from above, the second concave portion 20b is arranged such that the length in the scanning direction (X direction) is smaller than the direction perpendicular to the scanning direction (±Y direction, or may be referred to as "vertical direction" hereinafter) ) On the length. That is, the second concave portion 20b is a groove portion extending in the upper surface of the original platen 2 in the vertical direction (Y direction). The second concave portion 20b of this embodiment has a rectangular shape whose longitudinal direction is the vertical direction (Y direction), but its shape is not limited thereto, and may have a curved shape.

在此處,將描述原版台2的詳細佈置。原版台2可包括,例如,保持原版M的保持部分21、以及形成原版台2的上表面(第一表面20)的第一板22。Here, the detailed layout of the original stage 2 will be described. The original plate stage 2 may include, for example, a holding portion 21 that holds the original plate M, and a first plate 22 that forms the upper surface (first surface 20) of the original plate stage 2.

保持部分21由基部21a、第一突出部分21b及第二突出部分21c所形成,且可藉由像是線性馬達的驅動機構(未示出)在至少±X方向上被驅動。基部21a被構造成藉由真空抽吸(vacuum suction)、靜電吸引(electrostatic attraction)等來保持原版M的周邊區域,並在原版M的中心區域(電路圖案被形成的區域)被佈置的部分中形成開口,使得透射通過原版M的光進入投影光學系統。開口可設置有,例如,像是玻璃的透明構件。The holding portion 21 is formed of a base portion 21a, a first protruding portion 21b, and a second protruding portion 21c, and can be driven in at least ±X direction by a driving mechanism (not shown) like a linear motor. The base 21a is configured to maintain the peripheral area of the original plate M by vacuum suction, electrostatic attraction, etc., and in the portion where the central area of the original plate M (the area where the circuit pattern is formed) is arranged An opening is formed so that light transmitted through the original plate M enters the projection optical system. The opening may be provided with, for example, a transparent member like glass.

每一個第一突出部分21b是在原版M的周邊中從基部21a向上(在+Z方向上)突出的部分,使得將基部21a作為底部並將第一突出部分21b作為側壁來限定第一凹入部分20a(第一空間)。第一突出部分21b可佈置成具有等於或大於原版M的厚度的高度。每一個第二突出部分21c是在第一突出部分21b外部從基部21a向上(在+Z方向上)突出的部分,使得將基部21a作為底部並將第一突出部分21b及第二突出部分21c作為側壁來限定第二凹入部分20b(第二空間)。第二突出部分21c可佈置成具有與第一突出部分21b相同的高度。亦即,第二凹入部分20b可佈置為具有與第一凹入部分20a相同的深度。在此處,第二凹入部分20b的深度可等於或小於第一凹入部分20a的深度。Each first protruding portion 21b is a portion protruding upward (in the +Z direction) from the base 21a in the periphery of the original M, so that the first recess 21b is used as a bottom and the first protruding portion 21b is used as a side wall to define a first recess Part 20a (first space). The first protruding portion 21b may be arranged to have a height equal to or greater than the thickness of the original plate M. Each second protruding portion 21c is a portion protruding upward (in the +Z direction) from the base 21a outside the first protruding portion 21b, so that the base 21a is used as the bottom and the first protruding portion 21b and the second protruding portion 21c are used as The side wall defines a second concave portion 20b (second space). The second protruding portion 21c may be arranged to have the same height as the first protruding portion 21b. That is, the second concave portion 20b may be arranged to have the same depth as the first concave portion 20a. Here, the depth of the second concave portion 20b may be equal to or less than the depth of the first concave portion 20a.

第一板22是包括垂直於從照明光學系統1發射的光的光軸方向的第一表面20的構件,並藉由第一表面20形成原版台2的上表面。第一板22被連接到保持部分21的第一突出部分21b及第二突出部分21c的端部,且被佈置為包括延伸區域22a,每一個延伸區域22a沿著掃描方向從第二突出部分21c的端部延伸。此外,第一板22在形成第一凹入部分20a(第一空間)的部分處以及在形成第二凹入部分20b(第二空間)的部分處設置有開口。應注意的是,雖然在此實施例中使用片狀的第一板22作為包括第一表面20的構件,但亦可使用除了片狀的板以外的構件。The first plate 22 is a member including a first surface 20 perpendicular to the optical axis direction of light emitted from the illumination optical system 1, and the upper surface of the original platen 2 is formed by the first surface 20. The first plate 22 is connected to the ends of the first protruding portion 21b and the second protruding portion 21c of the holding portion 21, and is arranged to include extension regions 22a, each extending region 22a from the second protruding portion 21c along the scanning direction Of the end extends. In addition, the first plate 22 is provided with an opening at a portion where the first concave portion 20a (first space) is formed and at a portion where the second concave portion 20b (second space) is formed. It should be noted that although the sheet-shaped first plate 22 is used as the member including the first surface 20 in this embodiment, members other than the sheet-shaped plate may also be used.

在此處,第一板22可被佈置為能夠減少在掃描曝光期間隨著原版台2的移動而從後面將描述的延伸區域22a與第二板7之間的間隙流入第一凹入部分20a及第二凹入部分20b的外部空氣。例如,第一板22可被佈置為在每一個延伸區域22a中包括與稍後將描述的第二板7(第二表面70)的距離最小的部分。此外,延伸區域22a可被設置為使得掃描方向上的長度等於或大於原版台2在掃描曝光時的移動行程(移動距離)的一半,且更佳地等於或大於移動行程的長度。亦即,第二凹入部分能夠被設置成不會在原版台2的移動期間落到第二板7的外部形狀之外。Here, the first plate 22 may be arranged to be able to reduce the flow into the first concave portion 20a from the gap between the extension area 22a and the second plate 7 which will be described later as the original platen 2 moves during scanning exposure And the outside air of the second concave portion 20b. For example, the first plate 22 may be arranged to include, in each extension area 22a, a portion having the smallest distance from the second plate 7 (second surface 70) which will be described later. In addition, the extension area 22a may be set so that the length in the scanning direction is equal to or greater than half of the movement stroke (movement distance) of the original stage 2 during scanning exposure, and more preferably equal to or greater than the length of the movement stroke. That is, the second concave portion can be set so as not to fall out of the outer shape of the second plate 7 during the movement of the original platen 2.

接下來,將描述第二板7及供應單元8a。Next, the second board 7 and the supply unit 8a will be described.

第二板7是包括垂直於從照明光學系統1發射的光的光軸方向的第二表面70的構件,且被佈置於原版台2上方以與原版台2間隔開,使得第二表面70面向原版台2(第一板)的第一表面20。例如,第二板7被設置於照明光學系統1或其他結構中,以不與原版台2一起移動。在此實施例中,第二板7被固定到照明光學系統1。The second plate 7 is a member including a second surface 70 perpendicular to the optical axis direction of the light emitted from the illumination optical system 1, and is arranged above the original platen 2 to be spaced apart from the original platen 2 so that the second surface 70 faces The first surface 20 of the original platen 2 (first board). For example, the second plate 7 is provided in the illumination optical system 1 or other structure so as not to move with the original platen 2. In this embodiment, the second board 7 is fixed to the illumination optical system 1.

此外,第二板7可被佈置為使得原版台2(第一板22)的第一表面20與第二板7的第二表面70之間的間隙為盡可能小的(亦即,形成微小間隙)。利用此佈置,能夠減輕第二凹入部分20b中的在供應到第二凹入部分20b的沖洗氣體通過第一表面20與第二表面70之間的間隙逸出時發生的氣壓的時間性的變化。舉例而言,第二板7可被佈置為使得第一表面20與第二表面70之間的間隙為盡可能小的,使得即使藉由在原版台2的移動期間的振動(在±Z方向上)亦無法使第一表面20與第二表面70相互接觸。作為範例,第二板7可被佈置為使得第一表面20與第二表面70之間的距離等於或小於第二凹入部分20b在掃描方向上的長度。應注意的是,雖然在此實施例中使用片狀的第二板7作為包括第二表面70的構件,但亦可使用除了片狀的板以外的構件,或此構件可由照明光學系統1的結構的一部分所形成。Furthermore, the second plate 7 may be arranged such that the gap between the first surface 20 of the original platen 2 (first plate 22) and the second surface 70 of the second plate 7 is as small as possible (i.e. gap). With this arrangement, it is possible to reduce the temporality of the gas pressure that occurs in the second concave portion 20b when the flushing gas supplied to the second concave portion 20b escapes through the gap between the first surface 20 and the second surface 70 Variety. For example, the second plate 7 may be arranged so that the gap between the first surface 20 and the second surface 70 is as small as possible, so that even by vibrating during the movement of the original platen 2 (in the ±Z direction Above), the first surface 20 and the second surface 70 cannot contact each other. As an example, the second plate 7 may be arranged so that the distance between the first surface 20 and the second surface 70 is equal to or less than the length of the second concave portion 20b in the scanning direction. It should be noted that although the sheet-like second plate 7 is used as the member including the second surface 70 in this embodiment, a member other than the sheet-like plate may also be used, or this member may be used by the illumination optical system 1 Part of the structure is formed.

每一個供應單元8a將沖洗氣體供應到第一板22與第二板7之間的空間,以及供應到原版台2的第一凹入部分20a及第二凹入部分20b。舉例而言,供應單元8a被構造成從設置於第二板7(第二表面70)中的出口71吹出沖洗氣體,從而在原版台2的移動期間將沖洗氣體供應到第一凹入部分20a及第二凹入部分20b。在此實施例中,提供用於沖洗氣體的多個(兩個)出口71,以在掃描方向上包夾照明光學系統1。Each supply unit 8a supplies the flushing gas to the space between the first plate 22 and the second plate 7, and to the first concave portion 20a and the second concave portion 20b of the original platen 2. For example, the supply unit 8a is configured to blow the flushing gas from the outlet 71 provided in the second plate 7 (second surface 70), thereby supplying the flushing gas to the first concave portion 20a during the movement of the original platen 2 And the second concave portion 20b. In this embodiment, multiple (two) outlets 71 for flushing gas are provided to sandwich the illumination optical system 1 in the scanning direction.

[向原版台供應沖洗氣體] 圖3A至3C是用於說明在掃描曝光時向原版台2(第一凹入部分20a及第二凹入部分20b)供應沖洗氣體的視圖。首先,如圖3A所示,驅動原版台2使得-X方向側上的第二凹入部分20b1 被佈置於+X方向側上的出口71b下方。此時,沖洗氣體從供應單元8a通過出口71b被供應到-X方向側上的第二凹入部分20b1 ,使得第二凹入部分20b1 被填充有沖洗氣體,且其中的氣壓變得高於原版台2外部的氣壓。在此狀態下,被供應到第二凹入部分20b1 的沖洗氣體通過第一表面20與第二表面70之間的間隙逐漸逸出,使得能夠防止外部空氣流動通過間隙。此外,當原版台2在此狀態下沿-X方向被移動時,外部空氣可能隨著原版台2的移動而通過第一表面20與第二表面70之間的間隙侵入,但外部空氣可在流入第一凹入部分20a之前流入凹入部分20b中且被稀釋。亦即,可減少(防止)外部空氣流入第一凹入部分20a中。[Supply of Rinse Gas to Original Plate Table] FIGS. 3A to 3C are views for explaining the supply of rinse gas to the original plate table 2 (first concave portion 20a and second concave portion 20b) at the time of scanning exposure. First, as shown in FIG. 3A, the original platen 2 is driven so that the second concave portion 20b 1 on the -X direction side is arranged below the outlet 71b on the +X direction side. At this time, the flushing gas is supplied from the supply unit 8a through the outlet 71b to the second concave portion 20b 1 on the -X direction side, so that the second concave portion 20b 1 is filled with the flushing gas, and the gas pressure therein becomes high Air pressure outside the original platen 2. In this state, the flushing gas supplied to the second concave portion 20b 1 gradually escapes through the gap between the first surface 20 and the second surface 70, making it possible to prevent outside air from flowing through the gap. In addition, when the original platen 2 is moved in the -X direction in this state, external air may invade through the gap between the first surface 20 and the second surface 70 as the original platen 2 moves, but the external air may Before flowing into the first concave portion 20a, it flows into the concave portion 20b and is diluted. That is, the outside air can be reduced (prevented) from flowing into the first concave portion 20a.

接著,如圖3B所示,驅動原版台2使得原版M被佈置在照明光學系統1下方,且在-X方向上移動原版台2的同時執行掃描曝光。當原版台2從圖3A所示的狀態移動到圖3B所示的狀態時,第二凹入部分20b1 被填充有從供應單元8a的出口71a供應的沖洗氣體。由於第二凹入部分20b1 被填充有沖洗氣體,其中的氣壓變得高於原版台2外部的氣壓。此時,第一凹入部分20a被佈置於出口71(71a及71b)下方,並藉由供應單元8a從出口71(71a及71b)被供應沖洗氣體。因此,第一凹入部分20a填充有沖洗氣體,且具有高於原版台2外部的氣壓之氣壓,使得能夠防止外部空氣通過第一表面20與第二表面70之間的間隙流入第一凹入部分20a中。Next, as shown in FIG. 3B, the original plate 2 is driven so that the original plate M is arranged below the illumination optical system 1, and the scanning exposure is performed while moving the original plate 2 in the -X direction. When the original platen 2 moves from the state shown in FIG. 3A to the state shown in FIG. 3B, the second concave portion 20b 1 is filled with the flushing gas supplied from the outlet 71a of the supply unit 8a. Since the second concave portion 20b 1 is filled with flushing gas, the air pressure therein becomes higher than the air pressure outside the original platen 2. At this time, the first concave portion 20a is arranged below the outlet 71 (71a and 71b), and the flushing gas is supplied from the outlet 71 (71a and 71b) by the supply unit 8a. Therefore, the first concave portion 20a is filled with flushing gas and has a gas pressure higher than that of the outside of the original platen 2, making it possible to prevent outside air from flowing into the first concave through the gap between the first surface 20 and the second surface 70 Part 20a.

當完成-X方向上的掃描曝光(原版台2的掃描)時,執行反向(+X方向)上的掃描曝光(原版台2的掃描)。據此,如圖3C所示,驅動原版台2使得+X方向側上的第二凹入部分20b2 被佈置於−X方向側上的出口71a下方。此時,類似於圖3A所示的狀態,沖洗氣體從供應單元8a通過出口71a被供應到+X方向側上的第二凹入部分20b2 ,使得其中的氣壓變得高於原版台2外部的氣壓。在此狀態下,類似於參照圖3A所描述的狀態,能夠防止外部空氣流動通過間隙,並還能夠減少(防止)外部空氣隨著原版台2的移動通過第一表面20與第二表面70之間的間隙而流入第一凹入部分20a。接著,驅動原版台2使得原版M被佈置在照明光學系統1下方,並且在+X方向上移動原版台2的同時執行掃描曝光。當原版台2在+X方向上從圖3C所示的狀態移動時,第二凹入部分20b2 填充有從供應單元8a的出口71b供應的沖洗氣體。由於第二凹入部分20b2 填充有沖洗氣體,其中的氣壓變得高於原版台2外部的氣壓。When the scanning exposure in the -X direction (scanning of the original stage 2) is completed, the scanning exposure in the reverse direction (+X direction) (scanning of the original stage 2) is performed. According to this, as shown in FIG. 3C, the original platen 2 is driven so that the second concave portion 20b 2 on the +X direction side is arranged below the outlet 71a on the −X direction side. At this time, similar to the state shown in FIG. 3A, flushing gas is supplied from the supply unit 8a through the outlet 71a to the second concave portion 20b 2 on the +X direction side, so that the air pressure therein becomes higher than the outside of the original platen 2 Air pressure. In this state, similar to the state described with reference to FIG. 3A, it is possible to prevent outside air from flowing through the gap, and it is also possible to reduce (prevent) outside air from passing between the first surface 20 and the second surface 70 as the original platen 2 moves The gap between them flows into the first concave portion 20a. Next, the original plate 2 is driven so that the original plate M is arranged below the illumination optical system 1, and the scanning exposure is performed while moving the original plate 2 in the +X direction. When the original platen 2 moves from the state shown in FIG. 3C in the +X direction, the second concave portion 20b 2 is filled with the flushing gas supplied from the outlet 71b of the supply unit 8a. Since the second concave portion 20b 2 is filled with flushing gas, the gas pressure therein becomes higher than the gas pressure outside the original platen 2.

以此方式,在此實施例的原版台2中,第二凹入部分20b(第二空間)被設置於佈置有原版M的第一凹入部分20a(第一空間)的掃描方向上,且第二凹入部分20b被使用為用於減少(防止)外部空氣流入第一凹入部分20a中的空間。據此,第二凹入部分20b可在掃描方向(±X方向)上被佈置於第一凹入部分20a的兩側上,但第二凹入部分20b亦可僅被佈置於一側上。應注意的是,當第二凹入部分20b僅被佈置於第一凹入部分20a的一側上時,其效果可能減半。然而,在原版台2周圍的外部空氣的流動相對於原版台2的移動速度構成極大的順風(tailwind)或逆風(headwind)的環境中,藉由在應當防止外部空氣的流入的一側上設置僅一個第二凹入部分20b能夠預期到充分的效果。In this way, in the original platen 2 of this embodiment, the second concave portion 20b (second space) is provided in the scanning direction of the first concave portion 20a (first space) where the original plate M is arranged, and The second concave portion 20b is used as a space for reducing (preventing) outside air from flowing into the first concave portion 20a. According to this, the second concave portion 20b may be arranged on both sides of the first concave portion 20a in the scanning direction (±X direction), but the second concave portion 20b may also be arranged on only one side. It should be noted that when the second concave portion 20b is arranged only on one side of the first concave portion 20a, its effect may be halved. However, in an environment where the flow of outside air around the original plate 2 constitutes a large tailwind or headwind with respect to the moving speed of the original plate 2, by installing on the side where the inflow of outside air should be prevented Only one second concave portion 20b can expect a sufficient effect.

此外,從藉由第二凹入部分20b防止外部空氣流入第一凹入部分20a中的觀點來看,第二凹入部分20b在垂直方向(Y方向)上的長度可等於或大於第一凹入部分20a在垂直方向上的長度。第二凹入部分20b可具有一體積,此體積允許第二凹入部分20b以在掃描原版台2期間從供應單元8a經由出口71所供應的沖洗氣體的流速填充有沖洗氣體。在此範圍內,可確定第二凹入部分20b在掃描方向上的長度、在垂直方向上的長度、以及深度。Further, from the viewpoint of preventing outside air from flowing into the first concave portion 20a by the second concave portion 20b, the length of the second concave portion 20b in the vertical direction (Y direction) may be equal to or greater than the first concave The length of the entrance portion 20a in the vertical direction. The second concave portion 20b may have a volume which allows the second concave portion 20b to be filled with the flushing gas at a flow rate of the flushing gas supplied from the supply unit 8a via the outlet 71 during scanning of the original platen 2. Within this range, the length of the second concave portion 20b in the scanning direction, the length in the vertical direction, and the depth can be determined.

在此實施例的曝光裝置100中,若僅在第二凹入部分20b的局部部分處增加氣壓,則外部空氣可能通過未增加氣壓的部分流入第一凹入部分20a中。因此,理想的是,從供應單元8a經由出口71供應沖洗氣體的範圍與第二凹入部分20b的範圍(長度)在垂直方向上大致相等(例如,一致),使得第二凹入部分20b中的氣壓整體上變得均勻地高。亦即,在垂直方向上,設置於第二板7中的出口71的範圍可等於或大於第二凹入部分20b的範圍,使得沖洗氣體被均勻地供應到第二凹入部分20b。此外,出口71可被設置於第二板7中,以相對於原版台2的往復運動的移動範圍的中心位置為對稱。In the exposure apparatus 100 of this embodiment, if the air pressure is increased only at a partial portion of the second concave portion 20b, outside air may flow into the first concave portion 20a through the portion where the air pressure is not increased. Therefore, it is desirable that the range in which the flushing gas is supplied from the supply unit 8a via the outlet 71 and the range (length) of the second concave portion 20b are approximately equal (eg, coincident) in the vertical direction, so that the second concave portion 20b The air pressure of the whole becomes uniformly high. That is, in the vertical direction, the range of the outlet 71 provided in the second plate 7 may be equal to or larger than the range of the second concave portion 20b, so that the flushing gas is uniformly supplied to the second concave portion 20b. In addition, the outlet 71 may be provided in the second plate 7 so as to be symmetrical with respect to the center position of the movement range of the reciprocating motion of the original platen 2.

在此處,將描述在原版台2中設置第二凹入部分20b的效果。當未在原版台2中設置第二凹入部分20b時,必須將沖洗氣體供應到第一凹入部分20a,以將第一凹入部分20a中的氣壓增加到能夠以沖洗氣體填充第一凹入部分20a並減少外部空氣流入第一凹入部分20a中的水平。在此情況下,由於第一凹入部分20a具有大於第二凹入部分20b的體積,需要大量的沖洗氣體來將第一凹入部分20a中的氣壓增加到此種水平。另一方面,當如同本實施例中在第一凹入部分20a的掃描方向上設置具有小於第一凹入部分20a的體積的第二凹入部分20b時,能夠以較用於增加第一凹入部分20a中的氣壓的沖洗氣體量更小的沖洗氣體量來增加第二凹入部分20b中的氣壓。由於具有高的氣壓的第二凹入部分20b具有暫時地向其引入已通過第一表面20與第二表面70之間的間隙的外部空氣以降低外部空氣的濃度的功能,能夠減少(防止)外部空氣流入第一凹入部分20a中。亦即,當如同本實施例中在原版台2中設置第二凹入部分20b時,能夠減少沖洗氣體的使用量,且能夠藉由減少(防止)外部空氣流入第一凹入部分20a中來防止原版M的模糊。Here, the effect of providing the second concave portion 20b in the original platen 2 will be described. When the second concave portion 20b is not provided in the original platen 2, the flushing gas must be supplied to the first concave portion 20a to increase the gas pressure in the first concave portion 20a to be able to fill the first concave with the flushing gas Into the portion 20a and reduce the level of outside air flowing into the first recessed portion 20a. In this case, since the first concave portion 20a has a larger volume than the second concave portion 20b, a large amount of flushing gas is required to increase the air pressure in the first concave portion 20a to such a level. On the other hand, when the second concave portion 20b having a smaller volume than the first concave portion 20a is provided in the scanning direction of the first concave portion 20a as in this embodiment, it is possible to increase the first concave The amount of the flushing gas of the gas pressure into the portion 20a is smaller to increase the gas pressure in the second concave portion 20b. Since the second concave portion 20b having a high air pressure has a function of temporarily introducing outside air that has passed through the gap between the first surface 20 and the second surface 70 to reduce the concentration of the outside air, it can be reduced (prevented) Outside air flows into the first concave portion 20a. That is, when the second concave portion 20b is provided in the original platen 2 as in this embodiment, the amount of flushing gas can be reduced, and the flow of external air into the first concave portion 20a can be reduced (prevented) Prevent blurring of the original M.

[原版台的周邊佈置的具體範例] 接下來,將描述原版台2的周邊佈置的具體範例。舉例而言,原版台2的移動速度的範圍從,例如,100 mm/s的低速到,例如,10,000 mm/s的高速,且原版台2的移動行程的範圍從數十毫米到數米。第一表面20與第二表面70之間的距離的範圍從數微米到數毫米。原版台2在垂直方向上的寬度的範圍從數十毫米到約1米。從供應單元8a經由出口71所供應的沖洗氣體的流速的範圍從數十L/min到數千L/min。[Specific example of the layout around the original plate] Next, a specific example of the peripheral arrangement of the original platen 2 will be described. For example, the moving speed of the original platen 2 ranges from, for example, a low speed of 100 mm/s to, for example, a high speed of 10,000 mm/s, and the moving stroke of the original platen 2 ranges from tens of millimeters to several meters. The distance between the first surface 20 and the second surface 70 ranges from a few microns to a few millimeters. The width of the original platen 2 in the vertical direction ranges from tens of millimeters to about 1 meter. The flow rate of the flushing gas supplied from the supply unit 8a via the outlet 71 ranges from tens of L/min to thousands of L/min.

在這樣的數值範圍下,第二凹入部分20b可具有一體積,此體積允許第二凹入部分20b以在掃描原版台2期間從供應單元8a經由出口71所供應的沖洗氣體的流速填充有沖洗氣體。舉例而言,理想的是,第二凹入部分20b的體積V呈V≤V1+V2的關係式。在此處,“V1”是在第二凹入部分20b在通過出口71的下方時從出口71所供應的氣體的體積,且“V2”是在第二凹入部分20b不是在通過出口71的下方時從出口71所供應的氣體的體積。在此範圍內,可確定第二凹入部分20b在掃描方向上的長度、在垂直方向上的長度、以及深度。應注意的是,第二凹入部分20b的深度可等於或大於原版M的厚度。此外,第二凹入部分20b的深度可大致等於第一凹入部分20a的深度,且更佳地大於第一凹入部分20a的深度。In such a numerical range, the second concave portion 20b may have a volume which allows the second concave portion 20b to be filled with the flow rate of the flushing gas supplied from the supply unit 8a via the outlet 71 during scanning of the original platen 2 Flush the gas. For example, ideally, the volume V of the second concave portion 20b has a relationship of V≦V1+V2. Here, "V1" is the volume of gas supplied from the outlet 71 when the second concave portion 20b passes below the outlet 71, and "V2" is where the second concave portion 20b is not passing through the outlet 71 The volume of the gas supplied from the outlet 71 when downward. Within this range, the length of the second concave portion 20b in the scanning direction, the length in the vertical direction, and the depth can be determined. It should be noted that the depth of the second concave portion 20b may be equal to or greater than the thickness of the original plate M. In addition, the depth of the second concave portion 20b may be substantially equal to the depth of the first concave portion 20a, and more preferably greater than the depth of the first concave portion 20a.

即使當第二凹入部分20b具有在原版台2移動時無法填充有沖洗氣體的體積時,也可以維持第二凹入部分20b的功能,例如,藉由暫時地將外部空氣引入到第二凹入部分來降低外部空氣的濃度。第二凹入部分20b的功能(例如,藉由暫時地將外部空氣引入到第二凹入部分來降低外部空氣的濃度)的較佳條件可為呈d×W×L≤V的關係式。在此處,“V”是第二凹入部分20b的體積,“d”是第一表面20與第二表面70之間的距離,“W”是第二凹入部分20b在垂直方向上的長度,且“L”是出口71位於第二凹入部分的內部時的掃描移動的距離。Even when the second concave portion 20b has a volume that cannot be filled with flushing gas when the original platen 2 moves, the function of the second concave portion 20b can be maintained, for example, by temporarily introducing outside air into the second concave To reduce the concentration of outside air. A preferable condition for the function of the second concave portion 20b (for example, to reduce the concentration of the external air by temporarily introducing external air into the second concave portion) may be a relationship of d×W×L≦V. Here, "V" is the volume of the second concave portion 20b, "d" is the distance between the first surface 20 and the second surface 70, and "W" is the vertical direction of the second concave portion 20b The length, and "L" is the distance that the scan moves when the outlet 71 is located inside the second concave portion.

雖然以上為較佳條件,但取決於第二板7的形狀、第二凹入部分20b的形狀、原版台2的形狀、以及周圍環境,可能存在更嚴格的關係式或更寬鬆的關係式。舉例而言,當第二凹入部分20b的深度相對於掃描方向上的長度或垂直方向上的長度來說極大時,或當第二凹入部分20b的內部空間相對於開口形狀較大時,無法有效地使用第二凹入部分20b的整個體積。因此,關係式可能更嚴格。此外,當周圍環境是排氣環境時或當局部強風吹向原版台2時,關係式可能改變。Although the above is a preferable condition, depending on the shape of the second plate 7, the shape of the second concave portion 20b, the shape of the original stage 2, and the surrounding environment, there may be a stricter relationship or a looser relationship. For example, when the depth of the second concave portion 20b is extremely large with respect to the length in the scanning direction or the length in the vertical direction, or when the internal space of the second concave portion 20b is large with respect to the opening shape, The entire volume of the second concave portion 20b cannot be effectively used. Therefore, the relationship may be stricter. In addition, when the surrounding environment is an exhaust environment or when a local strong wind blows toward the original platen 2, the relational expression may change.

同樣理想的是,從第二凹入部分20b逸出到第一表面20與第二表面70之間的間隙的沖洗氣體的流速高於原版台2的移動速度。從第二凹入部分20b逸出到第一表面20與第二表面70之間的具有距離d的間隙的沖洗氣體的流速v大致上被表示為v = F/{(d×W)×2+(d×D)×2},其中“D”是第二凹入部分20b在掃描方向上的長度,“W”是第二凹入部分20b在垂直方向上的長度,且“F”是每單位時間來自出口71的供應量。據此,當原版台2的移動速度被設定為VR時,理想的是滿足v ≥ VR的關係式。因此,可基於第二凹入部分20b的開口形狀、第一表面20與第二表面70之間的距離d、以及原版台2的移動速度來確定從供應單元8a供應到第二凹入部分20b的沖洗氣體的流速。即使當從第二凹入部分20b逸出的沖洗氣體的流速未高於原版台2的移動速度時,也能夠維持第二凹入部分20b的功能,例如,藉由暫時地將外部空氣引入到第二凹入部分來降低外部空氣的濃度。It is also desirable that the flow rate of the flushing gas that escapes from the second concave portion 20b to the gap between the first surface 20 and the second surface 70 is higher than the moving speed of the original platen 2. The flow velocity v of the flushing gas that escapes from the second concave portion 20b to the gap between the first surface 20 and the second surface 70 with a distance d is generally expressed as v = F/{(d×W)×2 +(d×D)×2}, where “D” is the length of the second concave portion 20b in the scanning direction, “W” is the length of the second concave portion 20b in the vertical direction, and “F” is The supply from export 71 per unit time. According to this, when the moving speed of the original stage 2 is set to VR, it is desirable to satisfy the relationship of v ≥ VR. Therefore, the supply from the supply unit 8a to the second concave portion 20b can be determined based on the opening shape of the second concave portion 20b, the distance d between the first surface 20 and the second surface 70, and the moving speed of the original platen 2 The flow rate of the flushing gas. Even when the flow velocity of the flushing gas escaping from the second concave portion 20b is not higher than the moving speed of the original platen 2, the function of the second concave portion 20b can be maintained, for example, by temporarily introducing outside air to The second concave portion reduces the concentration of outside air.

此外,第二凹入部分20b在垂直方向上的長度可等於或大於第一凹入部分20a在垂直方向上的長度。利用此佈置,第二凹入部分20b可減少(防止)從原版台2的掃描方向側流入的外部空氣流入至第一凹入部分20a。應注意的是,取決於第二凹入部分20b在垂直方向上的長度,防止外部空氣流入第一凹入部分20a中的效果可能改變。舉例而言,當第二凹入部分20b的垂直方向上的長度是第一凹入部分20a在垂直方向上的長度的50%時,防止外部空氣流入第一凹入部分20a中的效果也可能降低到50%。在此處,出口71在垂直方向上的開口形狀的長度可等於第二凹入部分20b在垂直方向上的長度。然而,只要能夠向整個第二凹入部分進行供應,則出口71在垂直方向上的開口形狀的長度可小於第二凹入部分20b在垂直方向上的長度。In addition, the length of the second concave portion 20b in the vertical direction may be equal to or greater than the length of the first concave portion 20a in the vertical direction. With this arrangement, the second concave portion 20b can reduce (prevent) the outside air flowing in from the scanning direction side of the original stage 2 from flowing into the first concave portion 20a. It should be noted that, depending on the length of the second concave portion 20b in the vertical direction, the effect of preventing outside air from flowing into the first concave portion 20a may change. For example, when the length of the second concave portion 20b in the vertical direction is 50% of the length of the first concave portion 20a in the vertical direction, the effect of preventing outside air from flowing into the first concave portion 20a is also possible Reduced to 50%. Here, the length of the opening shape of the outlet 71 in the vertical direction may be equal to the length of the second concave portion 20b in the vertical direction. However, as long as the entire second concave portion can be supplied, the length of the opening shape of the outlet 71 in the vertical direction may be smaller than the length of the second concave portion 20b in the vertical direction.

接下來,將描述在以上條件下被佈置之此實施例的曝光裝置100的效果。作為範例,當從供應單元8a所供應的沖洗氣體的流速被設定為500 L/min時,第一凹入部分20a中的濕度是0.15%RH,而原版台2外部的濕度是50%RH。另一方面,在未設置第二凹入部分20b的佈置中,即使當從供應單元8a所供應的沖洗氣體的流速被增加到550 L/min時,第一凹入部分20a中的濕度也是1.5%。此結果還顯示出當如同本實施例中在原版台2中設置第二凹入部分20b時,可防止(減少)外部空氣流入第一凹入部分20a中,且可減少沖洗氣體的使用量。Next, the effect of the exposure apparatus 100 of this embodiment arranged under the above conditions will be described. As an example, when the flow rate of the flushing gas supplied from the supply unit 8a is set to 500 L/min, the humidity in the first concave portion 20a is 0.15%RH, and the humidity outside the original platen 2 is 50%RH. On the other hand, in the arrangement where the second concave portion 20b is not provided, even when the flow rate of the flushing gas supplied from the supply unit 8a is increased to 550 L/min, the humidity in the first concave portion 20a is 1.5 %. This result also shows that when the second concave portion 20b is provided in the original platen 2 as in this embodiment, the outside air can be prevented (reduced) from flowing into the first concave portion 20a, and the amount of flushing gas used can be reduced.

在此處,在原版台2外部的空間中,可提供測量原版台2的位置的測量單元(例如,雷射干涉儀),以控制原版台2的位置。在此種測量單元中,當雷射光的光學路徑環境(例如,溫度、氣壓、濕度等)改變時,可能相應地發生測量誤差。亦即,當被供應到第一凹入部分20a及第二凹入部分20b之大量的沖洗氣體流出到原版台2外部的空間時,雷射光的光學路徑環境相應地改變,且可能發生測量誤差。在本實施例的曝光裝置100的佈置中,由於能夠減少沖洗氣體的使用量,故亦能夠減少此測量誤差。Here, in a space outside the original platen 2, a measurement unit (for example, a laser interferometer) that measures the position of the original platen 2 may be provided to control the position of the original platen 2. In such a measurement unit, when the optical path environment of laser light (for example, temperature, air pressure, humidity, etc.) changes, a measurement error may occur accordingly. That is, when a large amount of flushing gas supplied to the first concave portion 20a and the second concave portion 20b flows out to the space outside the original platen 2, the optical path environment of the laser light changes accordingly, and measurement errors may occur . In the arrangement of the exposure apparatus 100 of this embodiment, since the amount of flushing gas can be reduced, this measurement error can also be reduced.

<第二實施例> 將描述根據本發明的第二實施例。圖4A及4B是示出此實施例的曝光裝置200中的原版台2的周邊佈置的視圖。圖4A是示出曝光裝置200中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a的視圖。圖4B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。應注意的是,在以下描述中未特別提及的部分與第一實施例中的部分類似。<Second embodiment> The second embodiment according to the present invention will be described. 4A and 4B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 200 of this embodiment. 4A is a view showing the peripheral arrangement (X-Z section) of the original plate 2 in the exposure device 200, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a. FIG. 4B is a view of the original platen 2 of this embodiment when viewed from above (+Z direction side). It should be noted that parts not specifically mentioned in the following description are similar to those in the first embodiment.

此實施例的曝光裝置200的特徵在於,第二凹入部分20b(第二空間)的形狀不同於第一實施例中的第二凹入部分的形狀。在此實施例中,第二凹入部分20b被設置於原版台2(第一板22或第一表面20)中,以圍繞第一凹入部分20a(第一空間)外部。第二凹入部分20b可被形成為在掃描方向側及第一凹入部分20a的垂直方向側上具有相同的寬度的凹槽部分,或可被形成為在掃描方向側及第一凹入部分20a的垂直方向側上具有不同的寬度的凹槽部分。此外,第二凹入部分20b可被形成為一個連續的凹槽部分,或可被形成為彼此分離的多個凹槽部分。同樣在此實施例的第二凹入部分20b中,如第一實施例中所描述,第二凹入部分20b可被填充有沖洗氣體以增加氣壓,且可暫時地將外部空氣引入到第二凹入部分20b,以降低外部空氣的濃度。因此,可以減少(防止)外部空氣流入第一凹入部分20a中。The exposure apparatus 200 of this embodiment is characterized in that the shape of the second concave portion 20b (second space) is different from the shape of the second concave portion in the first embodiment. In this embodiment, the second concave portion 20b is provided in the original platen 2 (first plate 22 or first surface 20) to surround the outside of the first concave portion 20a (first space). The second concave portion 20b may be formed as a groove portion having the same width on the scanning direction side and the vertical direction side of the first concave portion 20a, or may be formed on the scanning direction side and the first concave portion The groove portions of different widths on the vertical direction side of 20a. In addition, the second concave portion 20b may be formed as one continuous groove portion, or may be formed as a plurality of groove portions separated from each other. Also in the second concave portion 20b of this embodiment, as described in the first embodiment, the second concave portion 20b may be filled with flushing gas to increase the air pressure, and external air may be temporarily introduced into the second The concave portion 20b is lowered to reduce the concentration of outside air. Therefore, it is possible to reduce (prevent) the outside air from flowing into the first concave portion 20a.

在本實施例的原版台2中,藉由設置第二凹入部分20b以圍繞第一凹入部分20a外部,能夠減少(防止)外部空氣從垂直方向(±Y方向)流入。舉例而言,當來自垂直方向的氣流相對於原版台2為較大的時,這是有效的。在此情況下,能夠從供應單元8a經由出口71將沖洗氣體供應到被佈置於第一凹入部分20a的垂直方向上的第二凹入部分20b的一部分,使得此部分被填充有沖洗氣體,以增加氣壓。亦即,對於第二凹入部分20b的形狀,理想的是,將掃描方向上的長度(寬度)及垂直方向上的長度(寬度)設計成使得第二凹入部分20b中的氣壓變高。此外,取決於供應單元8a的佈置空間及佈置位置,第二凹入部分20b的形狀可被設計成使得第二凹入部分20b中的氣壓變高。In the original platen 2 of the present embodiment, by providing the second concave portion 20b to surround the outside of the first concave portion 20a, it is possible to reduce (prevent) the inflow of external air from the vertical direction (±Y direction). For example, this is effective when the airflow from the vertical direction is relatively large relative to the original platen 2. In this case, it is possible to supply flushing gas from the supply unit 8a via the outlet 71 to a portion of the second concave portion 20b arranged in the vertical direction of the first concave portion 20a, so that this portion is filled with flushing gas, To increase air pressure. That is, with regard to the shape of the second concave portion 20b, it is desirable to design the length (width) in the scanning direction and the length (width) in the vertical direction so that the air pressure in the second concave portion 20b becomes higher. In addition, depending on the arrangement space and arrangement position of the supply unit 8a, the shape of the second concave portion 20b may be designed such that the air pressure in the second concave portion 20b becomes higher.

在本實施例的原版台2中,隨著在垂直方向上也設置第二凹入部分20b,沖洗氣體的使用量趨於大於第一實施例中的沖洗氣體的使用量,且第二凹入部分20b中的佈置空間趨於更大。此外,當第二凹入部分20b被形成為一個連續的凹槽部分時,第二凹入部分20b的體積變得大於第一實施例中的第二凹入部分的體積,使得用於填充第二凹入部分20b以增加氣壓的沖洗氣體的量可能變大。然而,第二凹入部分20b被佈置為使得由其所限定的空間(第二空間)小於由第一凹入部分20a所限定的空間(第一空間)。因此,相較於在原版台2中僅設置第一凹入部分20a並將沖洗氣體供應到第一凹入部分20a的佈置,能夠容易地以較小的沖洗氣體使用量來增加第二凹入部分20b中的氣壓,從而有效地減少(防止)外部空氣流入第一凹入部分20a中。即使當第二凹入部分20b由多個凹槽部分(小空間)所形成時,亦可獲得相同的效果。In the original platen 2 of this embodiment, as the second concave portion 20b is also provided in the vertical direction, the amount of flushing gas used tends to be larger than that of the first embodiment, and the second concave The layout space in the portion 20b tends to be larger. Further, when the second concave portion 20b is formed as a continuous groove portion, the volume of the second concave portion 20b becomes larger than the volume of the second concave portion in the first embodiment, so that The amount of flushing gas in the two concave portions 20b to increase the air pressure may become larger. However, the second concave portion 20b is arranged such that the space defined by it (second space) is smaller than the space defined by the first concave portion 20a (first space). Therefore, compared to the arrangement in which only the first concave portion 20a is provided in the original platen 2 and the flushing gas is supplied to the first concave portion 20a, the second concave can be easily increased with a smaller amount of flushing gas usage The air pressure in the portion 20b, thereby effectively reducing (preventing) outside air from flowing into the first concave portion 20a. Even when the second concave portion 20b is formed of a plurality of groove portions (small spaces), the same effect can be obtained.

<第三實施例> 將描述根據本發明的第三實施例。圖5A及5B是示出此實施例的曝光裝置300中的原版台2的周邊佈置的視圖。圖5A是示出曝光裝置300中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a的視圖。圖5B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。應注意的是,在以下描述中未特別提及的部分與第一實施例中的部分類似。<Third Embodiment> A third embodiment according to the present invention will be described. 5A and 5B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 300 of this embodiment. 5A is a view showing the peripheral arrangement (X-Z cross section) of the original plate 2 in the exposure device 300, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a. FIG. 5B is a view of the original platen 2 of this embodiment when viewed from above (+Z direction side). It should be noted that parts not specifically mentioned in the following description are similar to those in the first embodiment.

在此實施例的曝光裝置300中,相較於第一實施例,在原版台2(第一板22或第一表面20)中在第二凹入部分20b外部設置第二凹入部分20c(其亦可被稱作第三凹入部分20c)。第二凹入部分20c中的每一個在原版台2中被形成為限定具有較第一空間(第一凹入部分20a)小的體積的第三空間的凹槽部分,且被設置於第二凹入部分20b的掃描方向上。在此實施例中,在原版台2中設置多個(兩個或更多個)第二凹入部分20c,以在掃描方向(±X方向)上包夾第一凹入部分20a及第二凹入部分20b。在此處,理想的是,第二凹入部分20c具有與第二凹入部分20b相同的體積,或者具有允許第二凹入部分20c在掃描原版台2期間以從供應單元8a經由出口71所供應的沖洗氣體的流速填充有沖洗氣體的體積。第二凹入部分20c的形狀可與第二凹入部分20b的形狀相同。In the exposure apparatus 300 of this embodiment, as compared with the first embodiment, a second concave portion 20c is provided outside the second concave portion 20b in the original platen 2 (first plate 22 or first surface 20) ( It may also be referred to as the third concave portion 20c). Each of the second concave portions 20c is formed in the original platen 2 as a groove portion defining a third space having a smaller volume than the first space (first concave portion 20a), and is provided in the second In the scanning direction of the concave portion 20b. In this embodiment, a plurality (two or more) of second concave portions 20c are provided in the original platen 2 to sandwich the first concave portions 20a and the second in the scanning direction (±X direction) The concave portion 20b. Here, it is desirable that the second recessed portion 20c has the same volume as the second recessed portion 20b, or that it allows the second recessed portion 20c to be taken from the supply unit 8a via the outlet 71 during scanning of the original platen 2 The flow rate of the supplied flushing gas is filled with the volume of the flushing gas. The shape of the second concave portion 20c may be the same as the shape of the second concave portion 20b.

在此實施例的原版台2中,藉由進一步設置第二凹入部分20c,可更有效地減少(防止)外部空氣流入第一凹入部分20a中。特別是當原版台2在掃描方向上的移動行程較大且移動時間較長時,這是有效的。在此實施例的原版台2中,在原版台2移動的同時,從供應單元8a經由出口71以第二凹入部分20c、第二凹入部分20b及第一凹入部分20a的順序依序地供應沖洗氣體。這些部分中的每一個部分都按照以上順序填充有沖洗氣體,且其中的氣壓被增加。因此,可將外部空氣暫時地引入到第二凹入部分20c以降低外部空氣的濃度,且可將從第二凹入部分20c逸出的外部空氣暫時地引入到第二凹入部分20b以進一步降低外部空氣的濃度。亦即,能夠更有效地減少(防止)外部空氣流入第一凹入部分20a中。此外,相較於第一實施例,即使當如上所述地在原版台2中進一步設置第二凹入部分20c時,也不需要改變供應單元8a(出口71)的位置。亦即,在本實施例的曝光裝置300中,藉由僅改變原版台2的佈置,能夠進一步增強減少外部空氣流入第一凹入部分20a中的效果。In the original platen 2 of this embodiment, by further providing the second concave portion 20c, the inflow of outside air into the first concave portion 20a can be more effectively reduced (prevented). This is particularly effective when the movement path of the original platen 2 in the scanning direction is large and the movement time is long. In the original platen 2 of this embodiment, while the original platen 2 moves, the second concave portion 20c, the second concave portion 20b, and the first concave portion 20a are sequentially provided in order from the supply unit 8a via the outlet 71 Supply flushing gas. Each of these parts is filled with flushing gas in the above order, and the gas pressure therein is increased. Therefore, outside air may be temporarily introduced into the second concave portion 20c to reduce the concentration of the outside air, and outside air escaping from the second concave portion 20c may be temporarily introduced into the second concave portion 20b to further Reduce the concentration of outside air. That is, it is possible to more effectively reduce (prevent) outside air from flowing into the first concave portion 20a. Furthermore, compared to the first embodiment, even when the second concave portion 20c is further provided in the original platen 2 as described above, there is no need to change the position of the supply unit 8a (outlet 71). That is, in the exposure apparatus 300 of the present embodiment, by only changing the arrangement of the original stage 2, the effect of reducing the inflow of outside air into the first concave portion 20a can be further enhanced.

<第四實施例> 將描述根據本發明的第四實施例。圖6A及6B是示出此實施例的曝光裝置400中的原版台2的周邊佈置的視圖。圖6A是示出曝光裝置400中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a的視圖。圖6B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。應注意的是,在以下描述中未特別提及的部分與第一及第二實施例中的部分類似。<Fourth embodiment> A fourth embodiment according to the present invention will be described. 6A and 6B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 400 of this embodiment. 6A is a view showing the peripheral arrangement (X-Z cross section) of the original plate 2 in the exposure device 400, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a. 6B is a view of the original platen 2 of this embodiment when viewed from above (+Z direction side). It should be noted that parts not specifically mentioned in the following description are similar to those in the first and second embodiments.

在此實施例的曝光裝置400中,相較於第二實施例,在原版台2(第一板22或第一表面20)中設置第二凹入部分20c(其亦可被稱作第三凹入部分20c)以圍繞第二凹入部分20b的外部。第二凹入部分20c在原版台2中被形成為限定具有較第一空間(第一凹入部分20a)小的體積的第三空間的凹槽部分,且被設置成圍繞第二凹入部分20b的外部。在此處,第二凹入部分20c可與第二凹入部分20b具有相同的形狀(寬度及深度)。In the exposure apparatus 400 of this embodiment, compared to the second embodiment, a second concave portion 20c (which may also be referred to as a third) is provided in the original platen 2 (first plate 22 or first surface 20) The concave portion 20c) surrounds the outside of the second concave portion 20b. The second concave portion 20c is formed in the original platen 2 as a groove portion defining a third space having a smaller volume than the first space (first concave portion 20a), and is disposed to surround the second concave portion The exterior of 20b. Here, the second concave portion 20c may have the same shape (width and depth) as the second concave portion 20b.

在此實施例的原版台2中,如同在第三實施例中一般,藉由進一步設置第二凹入部分20c,可更有效地減少(防止)外部空氣流入第一凹入部分20a中。此外,相較於第二實施例,在此實施例的原版台2中,第二凹入部分20c還被設置成圍繞第二凹入部分20b的外部,使得能夠更有效地減少(防止)外部空氣從垂直方向(±Y方向)流入。在此處,在此實施例的原版台2中,為了盡可能地抑制由於設置第二凹入部分20c而引起的沖洗氣體的使用量的增加,第二凹入部分20c可被形成為彼此分離的多個凹槽部分。藉由以此方式將第二凹入部分20c形成為多個凹槽部分,能夠從供應單元8a局部地供應沖洗氣體,以局部地增加第二凹入部分20c中的氣壓。In the original platen 2 of this embodiment, as in the third embodiment, by further providing the second concave portion 20c, the inflow of outside air into the first concave portion 20a can be more effectively reduced (prevented). In addition, compared to the second embodiment, in the original platen 2 of this embodiment, the second concave portion 20c is also provided to surround the outside of the second concave portion 20b, making it possible to reduce (prevent) the outside more effectively Air flows in from the vertical direction (±Y direction). Here, in the original platen 2 of this embodiment, in order to suppress the increase in the usage amount of the flushing gas due to the provision of the second concave portion 20c as much as possible, the second concave portions 20c may be formed to be separated from each other Of multiple grooves. By forming the second concave portion 20c as a plurality of groove portions in this way, the flushing gas can be locally supplied from the supply unit 8a to locally increase the air pressure in the second concave portion 20c.

<第五實施例> 將描述根據本發明的第五實施例。圖7A及7B是示出此實施例的曝光裝置500中的原版台2的周邊佈置的視圖。圖7A是示出曝光裝置500中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a的視圖。圖7B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。應注意的是,在以下描述中未特別提及的部分與第一實施例中的部分類似。此外,原版台2的佈置不限於第一實施例中所描述的佈置,且可應用在第二到第四實施例中的任何一個實施例中所描述的佈置。<Fifth Embodiment> A fifth embodiment according to the present invention will be described. 7A and 7B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 500 of this embodiment. 7A is a view showing the peripheral arrangement (X-Z cross section) of the original plate 2 in the exposure apparatus 500, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a. 7B is a view of the original stage 2 of this embodiment when viewed from above (+Z direction side). It should be noted that parts not specifically mentioned in the following description are similar to those in the first embodiment. Further, the arrangement of the original stage 2 is not limited to the arrangement described in the first embodiment, and the arrangement described in any of the second to fourth embodiments can be applied.

此實施例的原版台2被設置有第二供應單元8b,每一個第二供應單元將沖洗氣體供應到第二凹入部分20b(第二空間)中的一個。第二供應單元8b中的每一個可被構造成始終將沖洗氣體供應到第二凹入部分20b,或可被構造成在特定時期內將沖洗氣體供應到第二凹入部分20b。特定時期可為原版台2沿著第一凹入部分20a及第二凹入部分20b的佈置方向(亦即,掃描方向(±X方向))移動的時期。利用此佈置,能夠將沖洗氣體供應到第二凹入部分20b,以使第二凹入部分20b中的氣壓高於原版台2外部的氣壓,從而減少(防止)外部空氣流入第一凹入部分20a中。The original platen 2 of this embodiment is provided with second supply units 8b, each of which supplies flushing gas to one of the second concave portions 20b (second space). Each of the second supply units 8b may be configured to always supply flushing gas to the second recessed portion 20b, or may be configured to supply flushing gas to the second recessed portion 20b for a specific period of time. The specific period may be a period in which the original platen 2 moves along the arrangement direction of the first concave portion 20a and the second concave portion 20b (that is, the scanning direction (±X direction)). With this arrangement, the flushing gas can be supplied to the second concave portion 20b so that the air pressure in the second concave portion 20b is higher than the air pressure outside the original platen 2, thereby reducing (preventing) outside air from flowing into the first concave portion 20a.

<第六實施例> 將描述根據本發明的第六實施例。圖8A及8B是示出此實施例的曝光裝置600中的原版台2的周邊佈置的視圖。圖8A是示出曝光裝置600中的原版台2的周邊佈置(X-Z截面)、以及照明光學系統1、原版台2、投影光學系統3、第二板7及供應單元8a的視圖。圖8B是當從上方(+Z方向側)觀察時之此實施例的原版台2的視圖。應注意的是,在以下描述中未特別提及的部分與第五實施例中的部分類似。此外,原版台2的佈置不限於第一實施例中所描述的佈置,且可應用在第二到第四實施例中的任何一個實施例中所描述的佈置。<Sixth Embodiment> The sixth embodiment according to the present invention will be described. 8A and 8B are views showing the peripheral arrangement of the original stage 2 in the exposure apparatus 600 of this embodiment. 8A is a view showing the peripheral arrangement (X-Z cross section) of the original plate 2 in the exposure device 600, and the illumination optical system 1, the original plate 2, the projection optical system 3, the second plate 7, and the supply unit 8a. 8B is a view of the original platen 2 of this embodiment when viewed from above (+Z direction side). It should be noted that parts not specifically mentioned in the following description are similar to those in the fifth embodiment. Further, the arrangement of the original stage 2 is not limited to the arrangement described in the first embodiment, and the arrangement described in any of the second to fourth embodiments can be applied.

在此實施例的原版台2中,設置有第二供應單元8b,每一個第二供應單元8b將沖洗氣體供應到第二凹入部分20b(第二空間)中的一個,且還設置有將沖洗氣體供應到第一凹入部分20a(第一空間)的第三供應單元8c。在此實施例中,由於藉由第三供應單元8c將沖洗氣體供應到第一凹入部分20a,故未設置藉由從第二板7中的出口71吹出沖洗氣體來將沖洗氣體供應到第一凹入部分20a的供應單元8a。因此,例如,當由於佈置空間等而無法在第二板7中設置供應單元8a(出口71)時,此實施例的佈置是有用的。In the original platen 2 of this embodiment, second supply units 8b are provided, each of which supplies flushing gas to one of the second concave portions 20b (second space), and is also provided with a The flushing gas is supplied to the third supply unit 8c of the first concave portion 20a (first space). In this embodiment, since the flushing gas is supplied to the first concave portion 20a by the third supply unit 8c, it is not provided to supply the flushing gas to the first by blowing the flushing gas from the outlet 71 in the second plate 7. A supply unit 8a of a concave portion 20a. Therefore, for example, when the supply unit 8a (outlet 71) cannot be provided in the second plate 7 due to the arrangement space or the like, the arrangement of this embodiment is useful.

以此方式,藉由在原版台2中設置向第一凹入部分20a供應沖洗氣體的第三供應單元8c,在原版台2的移動期間(例如,在掃描曝光期間)之供應到第一凹入部分20a的沖洗氣體的流速可保持為不變的。因此,可使第一凹入部分20a中的濕度分佈均勻,並可減少被使用來填充第一凹入部分20a的沖洗氣體的量。In this way, by providing the third supply unit 8c that supplies the flushing gas to the first concave portion 20a in the original platen 2, the supply to the first concave during the movement of the original platen 2 (for example, during the scanning exposure) The flow rate of the flushing gas into the portion 20a can be kept constant. Therefore, the humidity distribution in the first concave portion 20a can be made uniform, and the amount of flushing gas used to fill the first concave portion 20a can be reduced.

<第七實施例> 將描述根據本發明的第七實施例。在第一到第六實施例中,已描述包括第二表面70的構件(第二板7)被設置於原版台2的照明光學系統側上,且原版台2的上表面被使用來作為第一表面20以形成第一凹入部分20a及第二凹入部分20b的範例。另一方面,曝光裝置可具有一種佈置,其中,原版台2的下表面被使用來作為第一表面20以形成第一凹入部分20a及第二凹入部分20b,且包括面向第一表面20的第二表面的構件被設置於原版台2的投影光學系統側上。在此佈置的曝光裝置中,例如,如圖2A至8B所示,舉例而言,包括作為第二表面的表面90之構件(板9)被設置於原版台2的投影光學系統側上。接下來,原版台2具有上側與下側相對於圖2A至8B所示的佈置顛倒的佈置。亦即,原版台2可被佈置成使得設置有第一凹入部分20a及第二凹入部分20b的第一表面20面向設置於投影光學系統中的板9的表面90。即使在此佈置中,也能夠獲得與第一到第六實施例中相同的效果。<Seventh Embodiment> The seventh embodiment according to the present invention will be described. In the first to sixth embodiments, it has been described that the member (second plate 7) including the second surface 70 is provided on the illumination optical system side of the original stage 2, and the upper surface of the original stage 2 is used as the first An example of a surface 20 to form a first concave portion 20a and a second concave portion 20b. On the other hand, the exposure apparatus may have an arrangement in which the lower surface of the original platen 2 is used as the first surface 20 to form the first concave portion 20a and the second concave portion 20b, and includes a surface facing the first surface 20 The member of the second surface of is provided on the projection optical system side of the original stage 2. In the exposure apparatus arranged here, for example, as shown in FIGS. 2A to 8B, for example, a member (plate 9) including the surface 90 as the second surface is provided on the projection optical system side of the original stage 2. Next, the original platen 2 has an arrangement in which the upper side and the lower side are reversed with respect to the arrangement shown in FIGS. 2A to 8B. That is, the original platen 2 may be arranged so that the first surface 20 provided with the first concave portion 20a and the second concave portion 20b faces the surface 90 of the plate 9 provided in the projection optical system. Even in this arrangement, the same effects as in the first to sixth embodiments can be obtained.

<製造物品的方法的實施例> 根據本發明的實施例的一種製造物品的方法適合用於製造物品,例如,像是半導體裝置等的微型裝置、或具有微結構的元件。根據此實施例的製造物品的方法包括使用上述的曝光裝置在被施加到基板的光敏劑上形成潛像圖案的步驟(曝光基板的步驟)、以及利用在以上步驟中所形成的潛像圖案顯影(處理)基板的步驟。此製造方法還包括其他的已知步驟(氧化、沉積、氣相沉積、摻雜、平面化、蝕刻、抗蝕劑分離、切割、接合、封裝等)。相較於傳統方法,根據此實施例的製造物品的方法在物品的性能、質量、生產率及生產成本中的至少一個方面為有利的。<Example of method of manufacturing article> A method of manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article, for example, a micro device such as a semiconductor device or an element having a micro structure. The method of manufacturing an article according to this embodiment includes the steps of forming a latent image pattern on the photosensitizer applied to the substrate (step of exposing the substrate) using the above-described exposure device, and developing using the latent image pattern formed in the above steps (Processing) the step of the substrate. This manufacturing method also includes other known steps (oxidation, deposition, vapor deposition, doping, planarization, etching, resist separation, cutting, bonding, packaging, etc.). Compared with the conventional method, the method of manufacturing an article according to this embodiment is advantageous in at least one of performance, quality, productivity, and production cost of the article.

<其他實施例> 本發明的實施例還可藉由系統或裝置的電腦來實現,系統或裝置的電腦讀出並執行被記錄在儲存介質(其亦可更完整地被稱為“非暫時性電腦可讀取儲存介質”)上的電腦可執行指令(例如,一個或更多個程式),以執行一個或多個上述實施例的功能、及/或包括用於執行一個或多個上述實施例的功能的一個或多個電路(例如,特定應用積體電路(ASIC)),且本發明的實施例可藉由系統或裝置的電腦以,例如,讀出並執行來自儲存介質的電腦可執行指令以執行一個或多個上述實施例的功能、及/或控制一個或多個電路以執行一個或多個上述實施例的功能來執行的方法而實現。電腦可包括一個或多個處理器(例如,中央處理單元(CPU)、微處理單元(MPU)),且可包括單獨的電腦或單獨的處理器的網路,以讀出並執行電腦可執行指令。電腦可執行指令,例如,可從網路或儲存介質提供給電腦。儲存介質可包括,例如,硬碟、隨機存取記憶體(RAM)、唯讀記憶體(ROM)、分散式運算系統的儲存器、光學碟片(例如,光碟(CD)、多樣化數位光碟(DVD)或藍光光碟(BD)TM )、快閃記憶體裝置、記憶卡等中的一個或多個。<Other embodiments> Embodiments of the present invention can also be implemented by a computer of a system or device. The computer of the system or device reads and executes recorded on a storage medium (which can also be more completely called "non-transitory" Computer-readable storage medium") computer-executable instructions (eg, one or more programs) to perform the functions of one or more of the above-described embodiments, and/or include functions for performing one or more of the above-described implementations One or more circuits (eg, application specific integrated circuit (ASIC)), and embodiments of the present invention can be implemented by a computer of a system or device, for example, a computer that reads and executes from a storage medium can The method is executed by executing instructions to perform the functions of one or more of the above embodiments, and/or controlling one or more circuits to perform the functions of one or more of the above embodiments. The computer may include one or more processors (eg, central processing unit (CPU), micro-processing unit (MPU)), and may include a network of separate computers or separate processors to read and execute the computer executable instruction. Computer executable instructions, for example, can be provided to the computer from a network or storage medium. Storage media may include, for example, hard drives, random access memory (RAM), read-only memory (ROM), storage for distributed computing systems, optical discs (eg, compact discs (CD), diversified digital discs) One or more of (DVD) or Blu-ray Disc (BD) TM ), flash memory device, memory card, etc.

雖然已參照例示性實施例描述本發明,但應當理解的是,本發明並不限於所揭露的例示性實施例。以下的申請專利範圍的範疇應被賦予最寬廣的解釋,以涵蓋所有這類型的修改以及等效的結構及功能。Although the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following patent application scope should be given the broadest interpretation to cover all such types of modifications and equivalent structures and functions.

1:照明光學系統 2:原版台 3:投影光學系統 4:基板台 5:控制單元 6:光源 7:第二板 8a:供應單元 8b:第二供應單元 8c:第三供應單元 9:板 20:第一表面 20a:第一凹入部分 20b:第二凹入部分 20b1:第二凹入部分 20b2:第二凹入部分 20c:第二凹入部分 21:保持部分 21a:基部 21b:第一突出部分 21c:第二突出部分 22:第一板 22a:延伸區域 70:第二表面 71:出口 71a:出口 71b:出口 90:表面 100:曝光裝置 200:曝光裝置 300:曝光裝置 400:曝光裝置 500:曝光裝置 600:曝光裝置 M:原版 W:基板1: Illumination optical system 2: Original table 3: Projection optical system 4: Substrate table 5: Control unit 6: Light source 7: Second board 8a: Supply unit 8b: Second supply unit 8c: Third supply unit 9: Board 20 : First surface 20a: First concave portion 20b: Second concave portion 20b 1 : Second concave portion 20b 2 : Second concave portion 20c: Second concave portion 21: Holding portion 21a: Base 21b: First protruding portion 21c: second protruding portion 22: first plate 22a: extended area 70: second surface 71: outlet 71a: outlet 71b: outlet 90: surface 100: exposure device 200: exposure device 300: exposure device 400: Exposure device 500: Exposure device 600: Exposure device M: Original W: Substrate

圖1是示出曝光裝置的整體佈置的視圖;FIG. 1 is a view showing the overall arrangement of an exposure device;

圖2A及2B是示出根據第一實施例的原版台的周邊佈置的視圖;2A and 2B are views showing the peripheral arrangement of the original platen according to the first embodiment;

圖3A至3C是用於說明在掃描曝光時的沖洗氣體的供應的視圖;3A to 3C are views for explaining the supply of flushing gas during scanning exposure;

圖4A及4B是示出根據第二實施例的原版台的周邊佈置的視圖;4A and 4B are views showing the peripheral arrangement of the original platen table according to the second embodiment;

圖5A及5B是示出根據第三實施例的原版台的周邊佈置的視圖;5A and 5B are views showing the peripheral arrangement of the original plate according to the third embodiment;

圖6A及6B是示出根據第四實施例的原版台的周邊佈置的視圖;6A and 6B are views showing the peripheral arrangement of the original plate according to the fourth embodiment;

圖7A及7B是示出根據第五實施例的原版台的周邊佈置的視圖;以及7A and 7B are views showing the peripheral layout of the original platen according to the fifth embodiment; and

圖8A及8B是示出根據第六實施例的原版台的周邊佈置的視圖。8A and 8B are views showing the peripheral arrangement of the original plate according to the sixth embodiment.

1:照明光學系統 1: Illumination optical system

2:原版台 2: Original edition table

3:投影光學系統 3: projection optical system

7:第二板 7: Second board

8a:供應單元 8a: supply unit

9:板 9: Board

20:第一表面 20: first surface

20a:第一凹入部分 20a: first recessed part

20b:第二凹入部分 20b: Second recessed part

21:保持部分 21: Keep part

21a:基部 21a: base

21b:第一突出部分 21b: First highlight

21c:第二突出部分 21c: Second prominent part

22:第一板 22: First board

70:第二表面 70: Second surface

71:出口 71: Exit

90:表面 90: surface

100:曝光裝置 100: exposure device

M:原版 M: Original

Claims (16)

一種曝光裝置,其在掃描原版及基板的同時曝光該基板,該曝光裝置包括: 台,其包括第一表面,且能夠在保持該原版的同時移動,在該第一表面中形成有待被供應沖洗氣體的第一凹入部分及第二凹入部分;以及 構件,包括面向該第一表面的第二表面, 其中,該第一凹入部分被設置於該台的該第一表面中,以便限定該原版被佈置於其中的第一空間,並且 至少一個第二凹入部分在該台的該第一表面中被設置於該第一凹入部分外部,以便限定第二空間,該第二空間具有比該第一空間更小的體積。An exposure device that exposes the substrate while scanning the original plate and the substrate. The exposure device includes: The stage includes a first surface and can move while maintaining the original plate, and a first concave portion and a second concave portion to be supplied with flushing gas are formed in the first surface; and A member, including a second surface facing the first surface, Wherein, the first concave portion is provided in the first surface of the table, so as to define a first space in which the original plate is arranged, and At least one second recessed portion is provided outside the first recessed portion in the first surface of the stage so as to define a second space having a smaller volume than the first space. 如申請專利範圍第1項之曝光裝置,其中,該第二凹入部分相對於該第一凹入部分被設置於在掃描曝光期間之該台的掃描方向上。An exposure apparatus as claimed in item 1 of the patent scope, wherein the second concave portion is provided in the scanning direction of the stage during the scanning exposure with respect to the first concave portion. 如申請專利範圍第2項之曝光裝置,其中,該第二凹入部分在該掃描方向上的長度小於該第二凹入部分在垂直於該掃描方向的方向上的長度。An exposure apparatus as claimed in item 2 of the patent application, wherein the length of the second concave portion in the scanning direction is smaller than the length of the second concave portion in the direction perpendicular to the scanning direction. 如申請專利範圍第2項之曝光裝置,其中,在該垂直於該掃描方向的方向上,該第二凹入部分的長度不小於該第一凹入部分的長度。An exposure device as claimed in item 2 of the patent application, wherein in the direction perpendicular to the scanning direction, the length of the second concave portion is not less than the length of the first concave portion. 如申請專利範圍第2項之曝光裝置,其中,該第一表面與該第二表面之間的距離小於該第二凹入部分在該掃描方向上的長度。An exposure device as claimed in item 2 of the patent application, wherein the distance between the first surface and the second surface is smaller than the length of the second concave portion in the scanning direction. 如申請專利範圍第1項之曝光裝置,其中,該第二凹入部分被設置成在該第二表面中圍繞該第一凹入部分的外部。An exposure apparatus as claimed in item 1 of the patent scope, wherein the second concave portion is provided to surround the outside of the first concave portion in the second surface. 如申請專利範圍第1項之曝光裝置,其中,在該台的該第一表面上,該第二凹入部分外部的區域包括該第一表面與該第二表面之間的距離最小的部分。An exposure apparatus as claimed in item 1 of the patent scope, wherein, on the first surface of the stage, the area outside the second concave portion includes a portion where the distance between the first surface and the second surface is the smallest. 如申請專利範圍第1項之曝光裝置,其中,該第一凹入部分及該第二凹入部分中的每一個具有不小於該原版的厚度的深度。An exposure apparatus as claimed in claim 1 of the patent application, wherein each of the first concave portion and the second concave portion has a depth not less than the thickness of the original plate. 如申請專利範圍第1項之曝光裝置,其中,該第二凹入部分的深度不大於該第一凹入部分的深度。As in the exposure device of claim 1, the depth of the second concave portion is not greater than the depth of the first concave portion. 如申請專利範圍第1項之曝光裝置,其中,在該第一表面中,多個第二凹入部分被設置於該第一凹入部分外部,該多個第二凹入部分中的每一個第二凹入部分具有比該第一凹入部分更小的體積。An exposure apparatus as claimed in item 1 of the patent scope, wherein, in the first surface, a plurality of second concave portions are provided outside the first concave portion, each of the plurality of second concave portions The second concave portion has a smaller volume than the first concave portion. 如申請專利範圍第1項之曝光裝置,還包括供應單元,該供應單元構造成藉由從設置於該構件的該第一表面中的出口吹出沖洗氣體來在該台的移動期間向該第一凹入部分及該第二凹入部分供應該沖洗氣體。The exposure apparatus as claimed in item 1 of the patent scope further includes a supply unit configured to blow the flushing gas from the outlet provided in the first surface of the member to the first during the movement of the stage The recessed portion and the second recessed portion supply the flushing gas. 如申請專利範圍第1項之曝光裝置,還包括第二供應單元,該第二供應單元被設置於該台中,且構造成向該第二凹入部分供應沖洗氣體。The exposure device as claimed in item 1 of the patent scope further includes a second supply unit, which is provided in the stage and is configured to supply flush gas to the second recessed portion. 如申請專利範圍第12項之曝光裝置,還包括第三供應單元,該第三供應單元被設置於該台中,且構造成向該第一凹入部分供應沖洗氣體。An exposure apparatus as claimed in item 12 of the patent application further includes a third supply unit, which is provided in the stage and is configured to supply flush gas to the first concave portion. 如申請專利範圍第1項之曝光裝置,還包括照明光學系統,該照明光學系統構造成照射該原版, 其中,該構件相對於該台被設置於該照明光學系統的側上。For example, the exposure device according to item 1 of the patent application scope further includes an illumination optical system configured to illuminate the original, Wherein, the member is provided on the side of the illumination optical system with respect to the stage. 如申請專利範圍第1項之曝光裝置,還包括投影光學系統,該投影光學系統構造成將該原版的圖案投影到該基板上, 其中,該構件相對於該台被設置於該投影光學系統的側上。For example, the exposure device according to item 1 of the patent application scope further includes a projection optical system configured to project the original pattern onto the substrate, Wherein, the member is arranged on the side of the projection optical system with respect to the stage. 一種製造物品的方法,該方法包括: 使用如申請專利範圍第1至15項中的任一項之曝光裝置來曝光基板; 使被曝光的該基板顯影;以及 處理被顯影的該基板以製造該物品。A method of manufacturing an article, the method comprising: Expose the substrate using the exposure device as described in any one of patent application items 1 to 15; Develop the exposed substrate; and The developed substrate is processed to manufacture the article.
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US11841624B2 (en) 2020-06-30 2023-12-12 Canon Kabushiki Kaisha Exposure apparatus and method of manufacturing article

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JP7299755B2 (en) 2023-06-28

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