TWI763998B - Exposure method, exposure apparatus, and method of manufacturing article - Google Patents
Exposure method, exposure apparatus, and method of manufacturing articleInfo
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- TWI763998B TWI763998B TW108118547A TW108118547A TWI763998B TW I763998 B TWI763998 B TW I763998B TW 108118547 A TW108118547 A TW 108118547A TW 108118547 A TW108118547 A TW 108118547A TW I763998 B TWI763998 B TW I763998B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
- G03F7/0022—Devices or apparatus
- G03F7/0025—Devices or apparatus characterised by means for coating the developer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
本發明關於曝光方法、曝光裝置、以及製造物品的方法。The present invention relates to an exposure method, an exposure apparatus, and a method of manufacturing an article.
作為在半導體裝置、顯示器(FPD)等的製造步驟(光刻步驟)中使用的一種類型的裝置,已知一種曝光裝置,其在相對地掃描驅動原版和基板的同時曝光(掃描和曝光)基板,並將原版的圖案轉印到基板上。在這種曝光裝置中,由於原版與基板之間的保持狀態(例如,緊接在台保持原版(或基板)之後)不完全,當驅動台時作用在原版上的慣性力(inertia force)可能會造成原版相對於台的位置波動(滑動)。日本專利公開號第2015-231035號揭露一種技術,在基板的掃描曝光之前以等於掃描曝光時的最大加速度的最大加速度執行台的初步驅動,以便藉由改進原版(標線片)與台之間的保持狀態而將原版固定到台上。As one type of apparatus used in manufacturing steps (lithography steps) of semiconductor devices, displays (FPDs), etc., there is known an exposure apparatus that exposes (scans and exposes) a substrate while relatively scanning-driving an original plate and a substrate , and transfer the original pattern to the substrate. In such an exposure apparatus, since the holding state between the original plate and the substrate (for example, immediately after the stage holds the original plate (or the substrate)) is not complete, an inertial force acting on the original plate when the stage is driven may be This will cause the position of the master to fluctuate (slip) relative to the table. Japanese Patent Laid-Open No. 2015-231035 discloses a technique for performing preliminary driving of a stage with a maximum acceleration equal to the maximum acceleration at the time of scanning exposure before scanning exposure of a substrate, so as to improve the gap between the master (reticle) and the stage by improving the The original plate is fixed to the table in the holding state.
對於曝光裝置而言,原版藉由驅動台而被固定在台上的位置與原版要被佈置在台上的目標位置之間的誤差理想地為小的。For the exposure apparatus, the error between the position where the original plate is fixed on the stage by driving the stage and the target position where the original plate is to be arranged on the stage is ideally small.
本發明提供,例如,一種有利於將原版固定到台上的技術。The present invention provides, for example, a technique that facilitates securing a master to a table.
根據本發明的一個面向,提供一種曝光方法,其在掃描由台所保持的原版的同時經由原版曝光基板,曝光方法包括:執行掃描驅動台的第一步驟,使得最大加速度變成第一加速度;以及在執行第一步驟之後,執行在曝光基板的同時掃描驅動台的第二步驟,使得最大加速度變成第二加速度,其中,第一加速度低於第二加速度。According to an aspect of the present invention, there is provided an exposure method of exposing a substrate via a master plate while scanning a master plate held by a stage, the exposure method comprising: performing a first step of scanning the drive stage so that the maximum acceleration becomes the first acceleration; and After the first step is performed, the second step of scanning the drive stage while exposing the substrate is performed so that the maximum acceleration becomes the second acceleration, wherein the first acceleration is lower than the second acceleration.
從參照所附圖式之例示性實施例的以下說明,本發明的更多特徵將變得清楚明瞭。Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings.
以下將參照所附圖式描述本發明的例示性實施例。應注意的是,相同的標號在所有圖式中表示相同的構件,且將不再給出其重複描述。Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. It should be noted that the same reference numerals denote the same components in all the drawings, and a repeated description thereof will not be given.
<第一實施例>
將參照所附圖式詳細地描述根據本發明的第一實施例。圖1是顯示根據本實施例的曝光裝置100的佈置的視圖。圖1所示的曝光裝置100可為在投影光學系統2與基板W之間沒有液體介入的情況下曝光基板W(晶圓)的曝光裝置,或在投影光學系統2與基板W之間有液體介入的情況下曝光基板W的液體浸液式曝光裝置。以下將描述使用其上形成有電路圖案的原版M(標線片或遮罩)將半導體裝置的電路圖案轉印到基板上的曝光裝置。<First Embodiment>
A first embodiment according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a view showing the arrangement of an
圖1所示的曝光裝置100是所謂的掃描和重複方法的曝光裝置(掃描曝光裝置),其在相對地掃描驅動原版M和基板W的同時曝光基板W。曝光裝置100可包括照明光學系統1、投影光學系統2、可在保持原版M的同時移動的原版台3、可在保持基板W的同時移動的基板台4、以及控制單元C。控制單元C由,例如,包括CPU和記憶體(儲存單元)的電腦所形成,並控制曝光裝置100的各個單元。圖1所示的XYZ正交坐標系可被界定為使得由X和Y方向所界定的平面平行於基板W的表面,且Z方向垂直於基板W的表面。The
照明光學系統1將從光源5發射的光塑形成,例如,帶狀或弧形光,且以被塑形的光照明原版M的一部分。雖然發射具有248 nm波長的光的KrF準分子雷射器可被使用來作為光源5,但亦可使用汞燈、ArF準分子雷射器(波長為193 nm)、EUV光源等。投影光學系統2具有預定投影放大率,並將原版M之被照明光學系統1照明的一部分的圖案投影在基板上(在基板上形成圖像)。The illumination
原版台3包括原版卡盤3a,其藉由,例如,真空吸附、靜電吸附等來保持原版M;原版驅動單元3b,其在X和Y方向上將原版M連同原版卡盤3a一起驅動;以及基準板3c,其上形成有指示原版台3的參考位置的標記。基板台4包括基板卡盤4a,其藉由,例如,真空吸附、靜電吸附等來保持基板W;基板驅動單元4b,其在X和Y方向上將基板W連同基板卡盤4a一起驅動;以及基準板4c,其上形成有指示基板台4的參考位置的標記。原版台3和基板台4被佈置成使得原版M和基板W被定位在經由投影光學系統2之幾乎光學共軛位置(投影光學系統2的物平面和像平面)。The master table 3 includes a
原版台3和基板台4的位置分別由測量單元10和12測量。測量單元10包括,例如,雷射干涉儀,且可基於在向設置在原版台3中的條狀反射鏡11發射雷射光時由條狀反射鏡11所反射的雷射光來測量原版台3的位置。類似地,測量單元12包括,例如,雷射干涉儀,且可基於在向設置在基板台4中的條狀反射鏡13發射雷射光時由條狀反射鏡13所反射的雷射光來測量基板台4的位置。The positions of the
在基板W的掃描曝光期間,基於分別由測量單元10和12測量的原版台3和基板台4的位置資訊的片段,控制單元C以對應於投影光學系統2的投影放大率的速度比用彼此同步的方式相對地掃描驅動原版台3和基板台4。這可將原版M的圖案轉印到基板上(更確切地說,基板上的抗蝕劑上)。During the scanning exposure of the substrate W, based on the pieces of positional information of the
曝光裝置100還可包括原版位置檢測單元14 (原版對準檢測單元)、基板位置檢測單元15(基板對準檢測單元)、以及表面位置檢測單元16。原版位置檢測單元14包括對準觀察儀,其檢測藉由控制單元C控制原版台3的位置而佈置在原版位置檢測單元14上方的原版M的標記以及原版台3的標記,並獲得標記之間的相對位置。例如,如圖2所示,在X方向上間隔開的多個標記18被設置在原版台3(原版卡盤3a)上,且原版位置檢測單元14檢測原版M的每一個標記17和原版台3的每一個標記18。這可使原版位置檢測單元14獲得原版M相對於原版台3的位置偏差(X、Y和θ方向)。The
基板位置檢測單元15包括對準觀察儀,其檢測設置在基板W中的多個照射區域當中的樣本照射區域中的多個標記,並藉由對檢測結果執行統計處理而獲得基板W中的多個照射區域的陣列資訊(array information)。表面位置檢測單元16包括將光投影到基板W的表面上的投影機16a以及接收由基板W的表面所反射的光的光學接收器16b,並檢測基板W的表面的高度(在Z方向上的位置)。參照圖1,原版位置檢測單元14和基板位置檢測單元15中的每一個被形成為離軸檢測單元,其在沒有投影光學系統2介入的情況下檢測每一個標記。然而,本發明不限於此。例如,每一個單元可形成為,例如,TTL(鏡後測光(Through The Lens))檢測單元,其在投影光學系統2介入的情況下檢測每一個標記。The substrate
在曝光裝置100中,原版M藉由原版輸送單元(未顯示)而被佈置在原版台3上的目標位置處(待佈置原版M的位置),並使原版台3保持原版M,從而開始基板W的掃描曝光。然而,緊接在開始藉由原版台3保持原版M之後,原版台3與原版M之間的保持狀態為不完全的。因此,若在此狀態下驅動原版台3,則作用在原版M上的慣性力可能造成原版台3上的原版M的位置波動(滑動)。亦即,原版台3上的目標位置與原版M之間的相對位置可能由於原版台3的掃描驅動而變化。這種原版M的位置波動最容易在開始保持原版M之後的原版台3的首次掃描驅動時發生,如圖3所示,且還趨於變大。另一方面,若重複原版台3的掃描驅動,則原版M的保持狀態被改善以將原版M固定到原版台3,因此減少位置波動。In the
圖4是用於解釋藉由重複原版台3的掃描驅動而減少原版M的位置波動的原理的視圖。在圖4中,41顯示原版台3與原版M之間的邊界部分的放大視圖,且42和43各自顯示圖4中的41中的微型區域的放大視圖。此外,圖4的42顯示當掃描驅動原版台3時的最大加速度為低的情況,且圖4的43顯示當掃描驅動原版台3時的最大加速度為高的情況。FIG. 4 is a view for explaining the principle of reducing the fluctuation of the position of the original plate M by repeating the scanning drive of the original plate table 3 . In FIG. 4 , 41 shows an enlarged view of a boundary portion between the
在圖4的41到43中,左側的視圖(緊接在保持開始之後)各自顯示緊接在原版M被佈置在原版台3上的目標位置處且原版台3開始保持原版M之後的狀態。在此狀態下,由於原版M在原版M被變形和扭曲的同時被供應到原版台3並由原版台3保持,發生所謂的卡盤扭曲(真空扭曲或吸附扭曲),且可能微觀地存在原版M與原版台3未相互接觸的多個區域(間隙)。亦即,此狀態是原版台3對原版M的保持並不穩定的狀態。另一方面,若原版台3的掃描驅動僅被執行一次,則慣性力作用在原版M上以大幅地減少卡盤扭曲,如圖4的41到43中的中央視圖(在首次驅動之後)所示,由此使得能夠改進原版台3對原版M的保持狀態。此時,由於圖4的43所示的高加速度時的慣性力大於圖4的42所示的低加速度時的慣性力,位置波動趨於變大。若進一步執行原版台3的掃描驅動,則能夠將原版M固定到原版台3,由此進一步改進原版台3對原版M的保持狀態,如圖4的41到43中的右側的視圖(在多次驅動之後)所示。In 41 to 43 of FIG. 4 , the views on the left side (immediately after holding start) each show a state immediately after the master M is arranged at the target position on the master table 3 and the master table 3 starts holding the master M. In this state, since the master M is supplied to and held by the
藉由以此方式重複原版台3的掃描驅動,可改善藉由原版台3對原版M的保持,以將原版M固定到原版台3上。因此,一般來說,曝光裝置藉由在不曝光基板W的情況下掃描驅動原版台3來執行“初步掃描驅動”,用於將原版M固定到原版台3上。“初步掃描驅動”可被定義為以原版台3之與在基板W的掃描曝光時的移動衝程相同的移動衝程(移動範圍)來驅動原版台3而不使其停止。此外,“初步掃描驅動”可定義為在與基板W的掃描曝光時的條件相同的條件下(除了原版台3的加速度)執行原版台3的掃描驅動。By repeating the scan drive of the master table 3 in this way, the holding of the master M by the master table 3 can be improved to fix the master M on the master table 3 . Therefore, in general, the exposure apparatus performs "preliminary scan driving" by scanning and driving the
原版台3上的目標位置與藉由初步掃描驅動固定到原版台3上的原版M的位置之間的誤差(在下文中有時被稱為“位置偏差”)可藉由,例如,在基板W的掃描曝光期間控制原版M與基板W之間的相對位置而被校正。然而,位置偏差較佳地為小的。例如,當將原版M的標記佈置在原版位置檢測單元14上方時,控制單元C基於藉由假設原版M被佈置在原版台3上的目標位置處所獲得的設計資訊來驅動原版台3。然而,若加速度相對於原版台3對原版M的保持力變得等於或高於預定值,則位置偏差會突然地增加。因此,若位置偏差過大,則原版M的標記不會落在原版位置檢測單元14的檢測場內,且其可能變得難以定位原版M。在此情況下,需要花費時間搜索原版M的標記,這對於生產量而言可能是不利的。The error between the target position on the
為了解決這個問題,根據本實施例的曝光裝置100執行在掃描驅動原版台3的第一步驟,使得最大加速度變成第一加速度,以及在曝光基板W的同時執行掃描驅動原版台3的第二步驟,使得最大加速度變成第二加速度。此時,在第一步驟中應用的第一加速度被設定成低於在第二步驟中應用的第二加速度。這可減少原版台3上的原版M的目標位置與固定位置之間的誤差(位置偏差)。第二加速度是在預設來執行基板W的掃描曝光的配方中之原版台3的最大加速度,且可為,例如,設定為使得一個照射區域的掃描曝光所花費的時間等於或短於期望值的原版台3的最大加速度。In order to solve this problem, the
如圖3所示,原版台3上的原版M的位置波動由於在開始藉由原版台3保持原版M之後的原版台3的首次掃描驅動而趨於變大。因此,第一步驟較佳地包括在開始保持原版M之後的原版台3的首次掃描驅動。應注意的是,以下描述中所使用的“原版台3的掃描驅動”被定義為以與在基板W的掃描曝光時的移動衝程相同的移動衝程在一個方向上驅動原版台3。As shown in FIG. 3 , the positional fluctuation of the original plate M on the original plate table 3 tends to be large due to the first scan drive of the original plate table 3 after the original plate M is started to be held by the original plate table 3 . Therefore, the first step preferably includes the first scan drive of the master table 3 after the master M is started to be held. It should be noted that the "scanning drive of the
圖5是顯示根據本實施例的曝光裝置100中的原版台3的掃描驅動的範例的時間圖。在圖5中,橫坐標表示時間,且縱坐標表示原版台3的加速度。圖5所示的驅動步驟A到G中的每一個包括原版台3以與在基板W的掃描曝光時的移動衝程相同的移動衝程的往復驅動。更具體地,如圖6所示,一個驅動步驟包括在預定方向(例如,+Y方向)上之原版台3的掃描驅動20、以及在與預定方向相反的方向(例如,-Y方向)上之原版台3的掃描驅動21。在預定方向上之原版台3的掃描驅動20包括加速操作D1和減速操作D2,且在相反方向上之原版台3的掃描驅動21包括加速操作D3和減速操作D4。相對於每一個加速操作(每一個減速操作),考慮到原版M的位置波動的再現性,較佳地提供恆定的加速期間22(恆定的減速期間)。FIG. 5 is a timing chart showing an example of scanning driving of the
在圖5所示的範例中,在開始保持原版M之後,執行原版台3的掃描驅動的驅動步驟A和B被執行,使得最大加速度變成第一加速度a1
。在驅動步驟A和B之後,執行原版台的掃描驅動的驅動步驟C到G被執行,使得最大加速度變成第二加速度a2
。如上所述,第一加速度a1
被設定成低於第二加速度a2
的值。In the example shown in FIG. 5 , after the holding of the master M is started, the driving steps A and B of performing the scanning drive of the
在圖5所示的範例中,開始基板W的掃描曝光的時間由箭頭23a到23d所指示。例如,若基板的掃描曝光從驅動步驟E開始(如由箭頭23a所指示),則應用第一加速度a1
的驅動步驟A和B以及應用第二加速度a2
的驅動步驟C和D對應到初步掃描驅動。此外,若基板W的掃描曝光從驅動步驟C開始(如由箭頭23b所指示),則應用第一加速度a1
的驅動步驟A和B對應到初步掃描驅動。類似地,若基板W的掃描曝光從驅動步驟B開始(如由箭頭23c所指示),則應用第一加速度a1
的驅動步驟A對應到初步掃描驅動。基板W的掃描曝光可從在開始保持原版M之後之執行原版台3的首次掃描驅動的驅動步驟A開始,如由箭頭23d所指示。在此情況下,不執行初步掃描驅動,但在驅動步驟A中應用第一加速度a1
。因此,相較於應用第二加速度a2
的情況,原版台3上的原版M的位置波動(滑動)較小,且對將圖案轉印到基板上的精確度的影響較小。In the example shown in FIG. 5, the time to start the scanning exposure of the substrate W is indicated by arrows 23a to 23d. For example, if the scanning exposure of the substrate starts from the driving step E (as indicated by the arrow 23a), the driving steps A and B applying the first acceleration a1 and the driving steps C and D applying the second acceleration a2 correspond to preliminary Scan driver. Further, if the scanning exposure of the substrate W starts from the driving step C (as indicated by the
接下來,將描述設定第一加速度的方法。第一加速度可由控制單元C基於,例如,表示原版M的位置波動與在開始保持原版M之後的原版台3的首次掃描驅動時的最大加速度之間的關係的資訊進行設定。圖7是顯示原版M的位置波動與在原版台3的首次掃描驅動時的最大加速度之間的關係(實線)的圖。此關係可由實驗、模擬等獲得。例如,基於圖7所示的資訊,第一加速度較佳地在允許原版台3上的原版M的位置波動落在可允許範圍AR內的最大加速度的範圍內被決定。可允許範圍AR可基於原版台3或曝光裝置本身的佈置而被任意地設定,且可由使用者經由使用者介面輸入。可允許範圍AR可設定成,例如,原版位置檢測單元14的檢測場的尺寸(例如,半徑)。Next, a method of setting the first acceleration will be described. The first acceleration can be set by the control unit C based on, for example, information representing the relationship between the positional fluctuation of the master M and the maximum acceleration at the first scan drive of the
若第一加速度過低,則減少卡盤扭曲的效果是不夠的。若第一加速度過高,則原版M的位置波動可能變得較大。第一加速度較佳地考慮到原版M的位置波動的再現性而決定。圖8顯示在改變最大加速度的同時對在原版台3的首次掃描驅動中之原版M的位置波動進行實驗的結果。圖8顯示出,相對於不同的原版M1和M2中的每一個,原版M在可為第一加速度的候選選項的三個加速度A到C中的每一個加速度處的位置波動。每一個資料藉由將原版佈置在原版台3上並執行掃描驅動原版台3的每一個步驟來獲得。作為範例,加速度A被設定成第二加速度的80%(比第二加速度低-1G的值),加速度B被設定成第二加速度的60%(比第二加速度低-2G的值),且加速度C被設定成第二加速度的40%(比第二加速度低-3G的值)。If the first acceleration is too low, the effect of reducing the twist of the chuck is insufficient. If the first acceleration is too high, the positional fluctuation of the master M may become larger. The first acceleration is preferably determined in consideration of the reproducibility of the positional fluctuation of the master M. FIG. 8 shows the results of experiments conducted on the fluctuation of the position of the master M in the first scan drive of the
如圖8所示,應理解的是,在加速度A下,相對於原版M1和M2兩者,資料1到4的每一個中的原版M的位置波動均大幅地超過可允許值。在加速度B下,原版M1的位置波動幾乎與在加速度A下相同,且大幅地超過可允許值,且相較於在加速度A下,原版M2在加速度B下的位置波動減少,但仍超過可允許值。關於在加速度B下的原版M2,資料1到5中的位置波動大幅地變化,且再現性較差。另一方面,在加速度C下,相對於原版M1和M2兩者,資料1到5的每一個中的原版M的位置波動均等於或小於可允許值,且再現性符合要求。因此,基於圖8所示的實驗結果,加速度C較佳地被設定為第一加速度。若以第一加速度執行原版台的掃描驅動(第一步驟)的次數過多,則對生產量而言是不利的。另一方面,若次數過少,則不能夠將卡盤扭曲減少到可允許範圍內。基於實驗結果,第一步驟的次數較佳地被設定為,例如,四到十。As shown in FIG. 8 , it should be understood that, under acceleration A, the positional fluctuation of master M in each of
接下來將描述根據本實施例的曝光裝置100的控制程序。圖9是說明根據本實施例的曝光裝置100的控制程序的流程圖。圖9所示的控制程序的每一個步驟可由控制單元C執行。將參照圖9所示的控制程序描述以第一加速度執行原版台3的掃描驅動以及以第二加速度執行原版台的掃描驅動(作為初步掃描驅動)的範例。Next, the control procedure of the
在步驟S11中,控制單元C使原版輸送單元(未顯示)將原版M輸送到原版台3上的目標位置。在步驟S12中,控制單元C使基板輸送單元(未顯示)將基板W輸送到基板台4上。在步驟S13中,作為初步掃描驅動,控制單元C掃描驅動原版台3,使得最大加速度變成第一加速度(第一步驟)。在步驟S14中,作為初步掃描驅動,控制單元C掃描驅動原版台3,使得最大加速度變成第二加速度(第三步驟)。在此實施例中,在步驟S14中應用第二加速度。然而,本發明不限於此,且可能應用高於第一加速度並低於第二加速度的第三加速度。In step S11 , the control unit C causes a master conveying unit (not shown) to convey the master M to a target position on the master table 3 . In step S12 , the control unit C causes the substrate conveyance unit (not shown) to convey the substrate W onto the
在步驟S15中,控制單元C使原版位置檢測單元14測量原版M相對於原版台3上的目標位置的位置偏差(誤差)。更確切地說,當控制單元C能夠控制原版台3使得原版M的標記和原版台3的標記被佈置在原版位置檢測單元14上方並使原版位置檢測單元14檢測標記之間的相對位置時,能夠測量位置偏差。In step S15 , the control unit C causes the original plate
在步驟S16中,控制單元C確定原版M是否被固定到原版台3上,亦即,原版台3上的原版M的位置波動是否落在(彙集在)可允許範圍內。例如,控制單元C獲得當前在步驟S15中所測量的原版M的位置偏差與先前在步驟S15中所測量的原版M的位置偏差之間的差值。若差值落在可允許範圍內,則控制單元C確定原版M被固定到原版台3上。若確定原版M未被固定,則過程前進到步驟S17,以改變初步掃描驅動的條件,並接著再次執行步驟S14到S16。另一方面,若確定原版M被固定,則過程前進到步驟S18。在步驟S18中,控制單元C開始針對基板W中的多個照射區域中的每一個照射區域進行掃描曝光。在每一個照射區域的掃描曝光中,執行原版台3的掃描驅動,使得最大加速度變成第二加速度(第二步驟)。In step S16, the control unit C determines whether the master M is fixed to the master table 3, that is, whether the positional fluctuation of the master M on the master table 3 falls (consolidates) within an allowable range. For example, the control unit C obtains the difference between the positional deviation of the original M which is currently measured in step S15 and the positional deviation of the original M that was previously measured in step S15. If the difference falls within the allowable range, the control unit C determines that the master M is fixed to the master table 3 . If it is determined that the master M is not fixed, the process proceeds to step S17 to change the conditions of the preliminary scan driving, and then steps S14 to S16 are performed again. On the other hand, if it is determined that the master M is fixed, the process proceeds to step S18. In step S18 , the control unit C starts scanning exposure for each of the plurality of shot regions in the substrate W. In the scanning exposure of each shot area, scanning driving of the
現在將描述圖9所示的控制程序的詳細範例。例如,如圖5所示,在測量時間點24處測量原版M的位置偏差,執行原版台3的往復驅動(兩次掃描驅動操作),並接著在測量時間點25處測量原版M的位置偏差。獲得在測量時間點24和25處所測量到的位置偏差之間的差值,並確定此差值是否落在可允許範圍內。若差值落在可允許範圍外,則確定原版M未被固定到原版台3上,且初步掃描驅動的條件被改變,以再次執行原版台3的掃描驅動,從而在測量時間點26處測量原版M的位置偏差。若在測量時間點25和26處所測量到的位置偏差之間的差值落在可允許範圍內,則確定原版M被固定到原版台3上,且開始基板W的掃描曝光。初步掃描驅動的條件的範例為原版台3的掃描驅動的次數、以及原版台3的最大加速度。在圖5所示的範例中,作為初步掃描驅動的條件,原版台3的掃描驅動的次數從用於往復驅動的兩次變成用於單向驅動的一次。A detailed example of the control program shown in FIG. 9 will now be described. For example, as shown in FIG. 5 , the positional deviation of the original plate M is measured at the
如上所述,根據本實施例的曝光裝置100執行掃描驅動原版台3的第一步驟,使得最大加速度變成第一加速度;以及在曝光基板W的同時執行掃描驅動原版台3的第二步驟,使得最大加速度變成第二加速度。此時,使應用在第一步驟中的第一加速度低於應用在第二步驟中的第二加速度。這可減少原版台3上的原版M的目標位置與固定位置之間的誤差(位置偏差)。As described above, the
<第二實施例>
將描述根據本發明的第二實施例。在第二實施例中,如圖1所示,設置檢測單元6,其檢測原版台3(原版卡盤3a)對原版M的保持力,且第一步驟(以第一加速度掃描驅動原版台3)根據檢測單元6對原版M的保持力的檢測結果而結束。原版M的保持力為,例如,真空吸附壓力或靜電吸附壓力。應注意的是,根據本實施例的曝光裝置的佈置與第一實施例中相同,且將省略其描述。<Second Embodiment>
A second embodiment according to the present invention will be described. In the second embodiment, as shown in FIG. 1, a
將參照圖10和11描述根據本實施例的曝光裝置的控制程序。圖10顯示由檢測單元6所檢測的原版M的保持力的時序改變(temporal change)的時間圖以及原版台3的掃描驅動的範例。圖11是說明根據本實施例的曝光裝置的控制程序的流程圖。圖11所示的控制程序的每一個步驟可由控制單元C來執行。A control procedure of the exposure apparatus according to the present embodiment will be described with reference to FIGS. 10 and 11 . FIG. 10 shows a time chart of the temporal change of the holding force of the original plate M detected by the
在步驟S21中,控制單元C使原版輸送單元(未顯示)將原版M輸送到原版台3上的目標位置。在步驟S22中,控制單元C使基板輸送單元(未顯示)將基板W輸送到基板台4上。在步驟S23中,控制單元C確定由檢測單元6所檢測到的原版M的保持力是否超過第一閾值TH1
。若原版M的保持力未超過第一閾值TH1
,則重複執行步驟S23;否則,過程前進到步驟S24。在步驟S24中,控制單元C執行原版台3的掃描驅動(第一步驟),使得最大加速度變成第一加速度。In step S21 , the control unit C causes the master conveying unit (not shown) to convey the master M to a target position on the master table 3 . In step S22 , the control unit C causes the substrate conveyance unit (not shown) to convey the substrate W onto the
在幾乎未產生原版台3對原版M的保持力的不充分狀態下,即使相對低的第一加速度應用到原版台3的掃描驅動,原版台3上的原版M的位置波動(滑動)也可能變得較大。為了解決這個問題,在此實施例中,提供第一閾值TH1
,且當原版M的保持力超過第一閾值TH1
時開始以第一加速度掃描驅動原版台3(第一步驟)。緊接在原版M的保持開始之後,原版M的保持力以陡峭的梯度改變,但梯度在預定值處變得平緩。第一閾值TH1
可被任意地設定,但其較佳地被設定為梯度的這種改變點。例如,第一閾值TH1
可被設定成落在當原版M的保持力處於穩定狀態下時所獲得的值的40%到60%的範圍內的值。In a state in which insufficient holding force of the original plate M by the
在步驟S25中,控制單元C確定由檢測單元6所檢測到的原版M的保持力是否超過大於第一閾值TH1
的第二閾值TH2
。若原版M的保持力未超過第二閾值TH2
,則過程返回到步驟S24,以再次以第一加速度執行原版台3的掃描驅動。另一方面,若原版M的保持力超過第二閾值TH2
,則過程前進到步驟S26,以結束原版台3之以第一加速度的掃描驅動,並執行原版台3的掃描驅動,使得最大加速度變成第二加速度。第二閾值TH2
可被任意地設定,且可被設定成,例如,落在當原版M的保持力處於穩定狀態下時所獲得的值的80%到95%的範圍內的值。In step S25, the control unit C determines whether or not the holding force of the original M detected by the
在步驟S27中,控制單元C確定原版台3之以第二加速度的掃描驅動是否已被執行預定次數。若原版台3之以第二加速度的掃描驅動尚未被執行預定次數,則過程返回到步驟S26,以再次以第二加速度執行原版台3的掃描驅動。另一方面,若原版台3之以第二加速度的掃描驅動已被執行預定次數,則過程前進到步驟S28。在步驟S28中,控制單元C開始針對基板W中的多個照射區域中的每一個照射區域進行掃描曝光。在每一個照射區域的掃描曝光中,執行原版台3的掃描驅動,使得最大加速度變成第二加速度(第二步驟)。In step S27, the control unit C determines whether or not the scanning driving of the
如上所述,在此實施例中,原版台3的掃描驅動時的最大加速度根據原版台3對原版M的保持力而改變。這可根據原版M的保持力執行原版台3之以最大加速度的掃描驅動,且因此能夠防止原版台3上的原版M的位置波動過度地發生。在此實施例中,設定用於在原版台3的掃描驅動時改變最大加速度的兩個閾值。然而,可提供三個或更多閾值,且最大加速度可被逐步地改變。最大加速度可根據原版M的保持力而被連續地改變。As described above, in this embodiment, the maximum acceleration at the time of scanning driving of the master table 3 is changed according to the holding force of the master table 3 to the master M. This makes it possible to perform scan driving of the master table 3 at the maximum acceleration according to the holding force of the master M, and thus it is possible to prevent the positional fluctuation of the master M on the master table 3 from occurring excessively. In this embodiment, two threshold values for changing the maximum acceleration at the time of scanning driving of the
<第三實施例>
將描述根據本發明的第三實施例。在第三實施例中,對原版台3的掃描驅動的次數進行計數,且第一步驟(以第一加速度掃描驅動原版台3)根據所計數的次數而結束。應注意的是,根據本實施例的曝光裝置的佈置與第一實施例中相同,且將省略其描述。<Third Embodiment>
A third embodiment according to the present invention will be described. In the third embodiment, the number of times of scanning driving of the
將參照圖12和13描述根據本實施例的曝光裝置的控制程序。圖12是顯示原版台3的掃描驅動的範例的時間圖。圖13是說明根據本實施例的曝光裝置的控制程序的流程圖。圖13所示的控制程序的每一個步驟可由控制單元C執行。應注意的是,步驟S31和S32與在第二實施例中所描述的圖11所示的控制程序的步驟S21和S22相同。A control procedure of the exposure apparatus according to the present embodiment will be described with reference to FIGS. 12 and 13 . FIG. 12 is a timing chart showing an example of scan driving of the
在步驟S33中,控制單元C執行原版台3的掃描驅動(第一步驟),使得最大加速度變成第一加速度,同時對以第一加速度執行原版台3的掃描驅動的次數進行計數。在步驟S34中,控制單元C確定原版台3之以第一加速度的掃描驅動的執行次數是否已達到預定數目N。基於,例如,實驗結果、模擬等,預定數目N可被設定成使得由原版台3的掃描驅動所造成的原版M的位置波動落在可允許範圍內的數目。若尚未達到預定數目N,則過程返回到S34,以再次以第一加速度執行原版台3的掃描驅動;否則,原版台3之以第一加速度的掃描驅動結束,且過程前進到步驟S35。In step S33, the control unit C executes the scanning driving of the original stage 3 (first step) so that the maximum acceleration becomes the first acceleration while counting the number of times the scanning driving of the
在步驟S35中,控制單元C執行原版台3的掃描驅動,使得最大加速度變成第二加速度,同時在對以第二加速度執行原版台3的掃描驅動的次數進行計數。在步驟S36中,控制單元C確定原版台3之以第二加速度的的掃描驅動的執行次數是否已達到預定數目M。基於,例如,實驗結果、模擬等,預定數目M可被設定成使得由原版台3的掃描驅動所造成的原版M的位置波動落在可允許範圍內的數目。若尚未達到預定數目M,則過程返回到S35,以再次以第二加速度執行原版台3的掃描驅動;否則,原版台3之以第二加速度的掃描驅動結束,且過程前進到步驟S37。在步驟S37中,控制單元C開始針對基板W中的多個照射區域中的每一個照射區域進行掃描曝光。在每一個照射區域的掃描曝光中,執行原版台3的掃描驅動,使得最大加速度變成第二加速度(第二步驟)。In step S35, the control unit C executes the scanning driving of the
如上所述,在此實施例中,原版台3的掃描驅動時的最大加速度根據原版台3之以第一加速度的掃描驅動的執行次數而改變。同樣在此控制過程中,能夠防止原版台3上的原版M的位置波動過度地發生。As described above, in this embodiment, the maximum acceleration at the time of the scanning driving of the
在此實施例中,最大加速度根據原版台3的掃描驅動的執行次數而改變。然而,例如,最大加速度可根據在其間執行原版台3的掃描驅動的時間而改變。更確切地說,測量在其間以第一加速度執行原版台3的掃描驅動的時間。當時間達到第一閾值時,結束原版台3之以第一加速度的掃描驅動(第一步驟),並開始原版台3之以第二加速度的掃描驅動。接下來,測量在其間以第二加速度執行原版台3的掃描驅動的時間。當時間達到第二閾值時,結束原版台3之以第二加速度的掃描驅動,並開始基板的掃描曝光。In this embodiment, the maximum acceleration is changed according to the number of times the scan drive of the
<製造物品的方法的實施例> 根據本發明的實施例的製造物品的方法適用於製造,例如,像是半導體裝置等微型裝置、或具有微結構的元件的物品。根據本實施例的製造物品的方法包括使用上述曝光裝置在被施加到基板的光敏劑上形成潛像圖案的步驟(曝光基板的步驟);以及利用在以上步驟中所形成的潛像圖案顯影(處理)基板的步驟。此製造方法還包括其它的已知步驟(氧化、沉積、氣相沉積、摻雜、平面化、蝕刻、抗蝕劑分離、切片、接合、封裝等)。相較於傳統方法,根據本實施例的製造物品的方法在物品的性能、品質、生產率和生產成本中的至少一個方面中是有利的。<Example of a method of manufacturing an article> The method of manufacturing an article according to an embodiment of the present invention is suitable for manufacturing, for example, a microdevice such as a semiconductor device, or an article having a microstructured element. The method of manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitizer applied to a substrate using the above-described exposure device (a step of exposing the substrate); and developing (a step of exposing the substrate) using the latent image pattern formed in the above step. processing) the step of the substrate. This fabrication method also includes other known steps (oxidation, deposition, vapor deposition, doping, planarization, etching, resist separation, dicing, bonding, packaging, etc.). Compared with the conventional method, the method of manufacturing the article according to the present embodiment is advantageous in at least one of the performance, quality, productivity and production cost of the article.
<其他實施例> 本發明的實施例還可藉由系統或裝置的電腦來實現,此電腦讀出並執行被記錄在儲存介質(其亦可更完整地被稱為“非暫時性電腦可讀取儲存介質”)上的電腦可執行指令(例如,一個或更多個程式),以執行一個或多個上述實施例的功能、及/或包含用於執行一個或多個上述實施例的功能的一個或多個電路(例如,特定應用積體電路(ASIC)),且本發明的實施例可藉由系統或裝置的電腦以,例如,讀出並執行來自儲存介質的電腦可執行指令以執行一個或多個上述實施例的功能、及/或控制一個或多個電路以執行一個或多個上述實施例的功能來執行的方法而實現。電腦可包括一個或多個處理器(例如,中央處理單元(CPU)、微處理單元(MPU)),且可包含單獨的電腦或單獨的處理器的網路,以讀出並執行電腦可執行指令。電腦可執行指令,例如,可從網路或儲存介質提供給電腦。儲存介質可包含,例如,硬碟、隨機存取記憶體(RAM)、唯讀記憶體(ROM)、分散式運算系統的儲存器、光學碟片(例如,光碟(CD)、多樣化數位光碟(DVD)或藍光光碟(BD)TM )、快閃記憶體裝置、記憶卡等中的一個或多個。<Other Embodiments> Embodiments of the present invention can also be implemented by a computer of the system or device, the computer reads and executes the data recorded in the storage medium (which may also be more fully referred to as "non-transitory computer-readable"). computer-executable instructions (eg, one or more programs) on a storage medium") for performing, and/or including functions for performing one or more of the above-described embodiments one or more circuits (eg, application-specific integrated circuits (ASICs)), and embodiments of the invention may be implemented by a computer of a system or device to, for example, read and execute computer-executable instructions from a storage medium to Implemented in a method that performs the functions of one or more of the above-described embodiments, and/or controls one or more circuits to perform the functions of one or more of the above-described embodiments. A computer may include one or more processors (eg, a central processing unit (CPU), a micro processing unit (MPU)), and may include a single computer or a network of individual processors to read and execute computer executables instruction. Computer-executable instructions, for example, may be provided to the computer from a network or storage medium. Storage media may include, for example, hard disks, random access memory (RAM), read only memory (ROM), storage for distributed computing systems, optical discs (eg, compact discs (CDs), digital compact discs (DVD) or Blu-ray Disc (BD) ™ ), one or more of a flash memory device, a memory card, and the like.
雖然已參照例示性實施例描述本發明,但應當理解的是,本發明並不限於所揭露的例示性實施例。以下的申請專利範圍的範疇應被賦予最寬廣的解釋,以涵蓋所有這類型的修改以及等效的結構和功能。While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
1‧‧‧照明光學系統 2‧‧‧投影光學系統 3‧‧‧原版台 3a‧‧‧原版卡盤 3b‧‧‧原版驅動單元 3c‧‧‧基準板 4‧‧‧基板台 4a‧‧‧基板卡盤 4b‧‧‧基板驅動單元 4c‧‧‧基準板 5‧‧‧光源 6‧‧‧檢測單元 10‧‧‧測量單元 11‧‧‧條狀反射鏡 12‧‧‧測量單元 13‧‧‧條狀反射鏡 14‧‧‧原版位置檢測單元 15‧‧‧基板位置檢測單元 16‧‧‧表面位置檢測單元 16a‧‧‧投影機 16b‧‧‧光學接收器 17‧‧‧標記 18‧‧‧標記 20‧‧‧掃描驅動 21‧‧‧掃描驅動 22‧‧‧恆定的加速期間 23a‧‧‧箭頭 23b‧‧‧箭頭 23c‧‧‧箭頭 23d‧‧‧箭頭 24‧‧‧測量時間點 25‧‧‧測量時間點 26‧‧‧測量時間點 41‧‧‧邊界部分的放大視圖 42‧‧‧微型區域的放大視圖 43‧‧‧微型區域的放大視圖 100‧‧‧曝光裝置 a1‧‧‧第一加速度 a2‧‧‧第二加速度 AR‧‧‧可允許範圍 C‧‧‧控制單元 D1‧‧‧加速操作 D2‧‧‧減速操作 D3‧‧‧加速操作 D4‧‧‧減速操作 M‧‧‧原版 S11‧‧‧步驟 S12‧‧‧步驟 S13‧‧‧步驟 S14‧‧‧步驟 S15‧‧‧步驟 S16‧‧‧步驟 S17‧‧‧步驟 S18‧‧‧步驟 S21‧‧‧步驟 S22‧‧‧步驟 S23‧‧‧步驟 S24‧‧‧步驟 S25‧‧‧步驟 S26‧‧‧步驟 S27‧‧‧步驟 S28‧‧‧步驟 S31‧‧‧步驟 S32‧‧‧步驟 S33‧‧‧步驟 S34‧‧‧步驟 S35‧‧‧步驟 S36‧‧‧步驟 S37‧‧‧步驟 TH1‧‧‧第一閾值 TH2‧‧‧第二閾值 W‧‧‧基板1‧‧‧Illumination optical system 2‧‧‧Projection optical system 3‧‧‧Master stage 3a‧‧‧Master chuck 3b‧‧‧Master drive unit 3c‧‧‧Reference plate 4‧‧‧Substrate stage 4a‧‧‧ Substrate chuck 4b‧‧‧Substrate driving unit 4c‧‧‧Reference plate 5‧‧‧Light source 6‧‧‧Detecting unit 10‧‧‧Measurement unit 11‧‧‧Strip mirror 12‧‧‧Measurement unit 13‧‧ ‧Strip mirror 14‧‧‧Original plate position detection unit 15‧‧‧Substrate position detection unit 16‧‧‧Surface position detection unit 16a‧‧‧Projector 16b‧‧‧Optical receiver 17‧‧‧Marking 18‧‧ ‧Mark 20‧‧‧Scanning Drive 21‧‧‧Scanning Drive 22‧‧‧Constant Acceleration Period 23a‧‧‧Arrow 23b‧‧‧Arrow 23c‧‧‧Arrow 23d‧‧‧Arrow 24‧‧‧Measurement Time Point 25 ‧‧‧Measurement time point 26‧‧‧Measurement time point 41‧‧‧Enlarged view of boundary portion 42‧‧‧Enlarged view of micro area 43‧‧‧Enlarged view of micro area 100‧‧‧Exposure device a 1 ‧‧ ‧First acceleration a 2 ‧‧‧Second acceleration AR‧‧‧Allowable range C‧‧‧Control unit D1‧‧‧Acceleration operation D2‧‧‧Deceleration operation D3‧‧‧Acceleration operation D4‧‧‧Deceleration operation M ‧‧‧Original S11‧‧‧Step S12‧‧‧Step S13‧‧‧Step S14‧‧‧Step S15‧‧‧Step S16‧‧‧Step S17‧‧‧Step S18‧‧‧Step S21‧‧‧Step S22 ‧‧‧Step S23‧‧‧Step S24‧‧‧Step S25‧‧‧Step S26‧‧‧Step S27‧‧‧Step S28‧‧‧Step S31‧‧‧Step S32‧‧‧Step S33‧‧‧Step S34 ‧‧‧Step S35‧‧‧Step S36‧‧‧Step S37‧‧‧Step TH 1 ‧‧‧First Threshold TH 2 ‧‧‧Second Threshold W‧‧‧Substrate
圖1是顯示曝光裝置100的佈置的視圖;FIG. 1 is a view showing the arrangement of an
圖2是顯示當從上方觀察時之保持原版的原版台的視圖;FIG. 2 is a view showing the master table holding the master when viewed from above;
圖3是顯示掃描驅動的次數與原版的位置波動之間的關係的圖;3 is a graph showing the relationship between the number of scan drives and the positional fluctuation of the original plate;
圖4是用於解釋減少原版的位置波動的原理的視圖;FIG. 4 is a view for explaining the principle of reducing the positional fluctuation of the master;
圖5是顯示根據第一實施例的原版台的掃描驅動的範例的時間圖;FIG. 5 is a timing chart showing an example of scan driving of the original stage according to the first embodiment;
圖6是顯示在一個驅動步驟中的原版台的操作的時間圖;6 is a timing chart showing the operation of the master stage in one driving step;
圖7是顯示原版的位置波動與在原版台的首次掃描驅動時之最大加速度之間的關係的圖;FIG. 7 is a graph showing the relationship between the positional fluctuation of the original plate and the maximum acceleration at the time of the first scan drive of the original plate stage;
圖8是顯示對改變最大加速度時在原版台的首次掃描驅動時之原版的位置波動進行實驗的結果的視圖;FIG. 8 is a view showing the result of an experiment on the positional fluctuation of the master at the time of the first scan drive of the master stage when the maximum acceleration is changed;
圖9是說明根據第一實施例的曝光裝置的控制程序的流程圖;9 is a flowchart illustrating a control procedure of the exposure apparatus according to the first embodiment;
圖10顯示根據第二實施例的原版台的掃描驅動的範例的時間圖;FIG. 10 is a timing chart showing an example of scan driving of the master stage according to the second embodiment;
圖11是說明根據第二實施例的曝光裝置的控制程序的流程圖;11 is a flowchart illustrating a control procedure of the exposure apparatus according to the second embodiment;
圖12是顯示根據第三實施例的原版台的掃描驅動的範例的時間圖;以及FIG. 12 is a timing chart showing an example of scan driving of the original stage according to the third embodiment; and
圖13是說明根據第三實施例的曝光裝置的控制程序的流程圖。13 is a flowchart illustrating a control procedure of the exposure apparatus according to the third embodiment.
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JP2005123220A (en) * | 2003-10-14 | 2005-05-12 | Nikon Corp | Stage control method, exposure method, stage control unit, exposure device, and device manufacturing method |
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