TW202005075A - Flexible micro LED display - Google Patents

Abstract

A flexible micro-LED display device including a flexible substrate, a plurality of pixel units, a plurality of active devices, a plurality of micro-LED devices, an encapsulation layer, and at least one trench is provided. The pixel units and the active devices are disposed on the flexible substrate. The micro-LED devices are disposed on the flexible substrate and electrically connected with corresponding active device respectively. The encapsulation layer is covered the micro-LED devices and has a first surface away from the flexible substrate. The trench has an extension direction and is disposed on the first surface of the encapsulation layer. The depth of the trench in the vertical projection direction is smaller than the thickness of the encapsulation layer in the vertical projection direction. The trench is located between two adjacent pixel units. In the vertical projection direction, the trench does not overlap with the micro-LED devices and the active devices.

Description

Flexible micro-luminescence diode display device

The present invention relates to a display device, and in particular to a flexible micro-luminous diode display device.

As portable display devices are widely used, the development of flexible display devices is becoming more and more active in order to achieve the purpose of being displayable under different curved surfaces. However, how to improve the flexibility and image resolution of the display device has become an urgent issue to be solved.

The invention provides a flexible micro light-emitting diode light-emitting device, which can improve the flexibility and image resolution of the light-emitting diode display device.

The invention provides a flexible micro light-emitting diode display device, which includes a flexible substrate, a plurality of pixel units, a plurality of active elements, a plurality of micro-light emitting diode elements, a packaging layer, and at least one trench. The pixel unit is disposed on the flexible substrate. The active device is disposed on the flexible substrate. The micro light emitting diode element is located on the flexible substrate. The micro light emitting diode elements are electrically connected to the corresponding active elements, and each pixel unit includes at least one active element and at least one micro light emitting diode element. The encapsulation layer covers the micro-luminescent diode element. The encapsulation layer has a first surface, wherein the first surface is away from the flexible substrate. The ditch has an extending direction. The trench is disposed on the first surface of the encapsulation layer. The depth of the trench in the vertical projection direction is smaller than the thickness of the packaging layer in the vertical projection direction. The ditch is disposed between two adjacent pixel units. In the vertical projection direction, the trench does not overlap with the micro light emitting diode element and the active element.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

The invention is explained more fully with reference to the drawings of this embodiment. However, the present invention can also be embodied in various forms, and should not be limited to the embodiments described herein.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “connected to” another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, the electrical connection or coupling may be that there are other elements between the two elements.

It should be understood that although the terms "first" and "second" etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or parts should not be affected by Limitations of these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Accordingly, the "first element", "component", "region", "layer", or "portion" discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, unless the content clearly indicates, the singular forms "a", "an", and "the" are intended to include the plural forms, including "at least one." "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "including" and/or "comprising" designate the described features, regions, wholes, steps, operations, presence of elements and/or components, but do not exclude one or more The presence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown. It should be understood that relative terms are intended to include different orientations of the device than those shown in the figures. For example, if the device in one drawing is turned over, the element described as being on the "lower" side of the other element will be oriented on the "upper" side of the other element. Thus, the exemplary term "lower" may include "lower" and "upper" orientations, depending on the particular orientation of the drawings. Similarly, if the device in one drawing is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "about", "approximately", "substantially", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, taking into account the The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately", or "substantially" can be based on optical properties, etching properties, or other properties to select a more acceptable range of deviation or standard deviation, and one standard deviation can be applied to all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

FIG. 1A is a partial schematic top view of a flexible micro-luminescent diode display device according to a first embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line A-A' in Fig. 1A. FIG. 1C is a schematic diagram of the bending of the R1 region in FIG. 1B. For clarity, parts of the film layers and components are omitted in FIG. 1A. Moreover, the active element 120 or the connection line between it and the signal line 150 will not appear in FIG. 1A, but FIG. 1B still shows the active element 120 and the aforementioned connection line X in a cross-sectional view to clearly indicate the signal line 150, The connection relationship between the active device 120 and the micro light emitting diode 130. In addition, in order to clearly show the flexible micro-luminescent diode display device 100 in the flexed state, only the encapsulation layer 140 in the flexed state and the corresponding micro-luminescent diode device are only exemplarily shown in FIG. 1C 130 relationship.

1A and 1B, the flexible micro-luminescent diode display device 100 may include a flexible substrate 110, a plurality of pixel units 102, a plurality of active elements 120, a plurality of micro-luminescent diode elements 130, The encapsulation layer 140 and the signal line 150. The material of the flexible substrate 110 may include polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyacrylate (PA), polyorthocyanene (polynorbornene; PNB), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyethylene naphthalate (PEN), or polyether Polyetherimide (PEI), but not limited to this, can be other various organic materials or organic/inorganic hybrid materials, or other suitable flexible materials, but the invention is not limited thereto.

The plurality of pixel units 102 and the plurality of active elements 120 are disposed on the flexible substrate 110. The plurality of active elements 120 may be arranged on the substrate surface 110a of the flexible substrate 110 in an array arrangement. In other words, the plurality of pixel units 102 may be arranged on the flexible substrate 110 in an array. Each pixel unit 102 includes at least one active element 120 and at least one micro-luminescent diode element 130, but the invention is not limited to this, each active element 120 has a corresponding gate GE, source S, drain D And semiconductor layer CH. A gate insulating layer GI may be provided between the gate electrode GE and the semiconductor layer CH. The flat layer PV1 may cover the active element 120. In this embodiment, the active device 120 is, for example, a thin film transistor (TFT). The active device 120 in FIG. 1B takes the thin film transistor as a bottom gate transistor, for example. The gate electrode GE is located below the semiconductor layer CH. In other embodiments, the thin film transistor may be a top gate (for example: the gate GE is located above the semiconductor layer CH), or a three-dimensional transistor (for example: the semiconductor layer CH is located on a different horizontal plane) , Or other suitable types of transistors, but the invention is not limited thereto. In other embodiments, the active device 120 may also be a switching device of other types.

The micro light emitting diode elements 130 are disposed on the substrate surface 110a of the flexible substrate 110, and the plurality of micro light emitting diode elements 130 are electrically connected to the corresponding active elements 120, respectively. In some embodiments, the micro-light emitting diode element 130 is electrically connected to the drain D in the active element 120, but the invention is not limited thereto. These micro light emitting diode elements 130 may have substantially the same or different light emitting colors. For example, part of the micro-emitting diode elements 130 can emit red light, another part of the micro-emitting diode elements 130 can emit green light, and the remaining part of the micro-emitting diode elements 130 can emit blue light, but this The invention is not limited to this. In other embodiments, the remaining micro-emitting diode elements 130 can also emit other colored lights, such as white light, yellow light, or other suitable colored lights.

In this embodiment, the size of the micro light emitting diode element 130 (that is, the area projected on the substrate surface 110a of the flexible substrate 110) may be 100 μm×100 μm or less, and the micro light emitting diode element 130 The element thickness L1 in the vertical projection direction may be greater than or approximately equal to 4 microns (micrometer; μm) and less than or approximately equal to 30 microns.

Since the size of the micro light emitting diode element is much smaller than that of a general light emitting diode, more micro light emitting diodes can be placed on substantially the same unit area, thereby improving the image resolution of the display device. In addition, the light-emitting diodes (including but not limited to micro-light-emitting diode devices) are formed by stacking a plurality of conductive layers, a plurality of semiconductor layers, a light-emitting layer, and an insulating layer through a semiconductor manufacturing process. Therefore, if the size of the light-emitting diode is too large (for example, similar to a general light-emitting diode with a larger size, for example, greater than about 100 microns or more), the resulting display device will be more difficult to flex. In addition, compared to display devices composed of organic light-emitting materials, since organic light-emitting materials can be irreparably damaged by moisture or oxygen, display devices composed of organic light-emitting materials often need to have a variety of additional Membrane layer (for example, a barrier layer for blocking moisture or oxygen). In addition, when a display device composed of organic light-emitting materials displays static content for a long period of time (that is, the display brightness and/or hue remains unchanged), since the organic light-emitting materials have material characteristics, even if the display device The content of has changed, but the blocks that have been displaying static content for a long time will continue to have afterimages (that is, commonly known as aging, screen burning or ghosting). Therefore, compared to a display device composed of organic light-emitting materials, a display device composed of micro-luminescent diodes has better product life and display quality in addition to being flexible.

The encapsulation layer 140 covers the micro-light emitting diode element 130. The material of the encapsulation layer 140 is, for example, photoresist, epoxy resin, silicone resin, polymethyl methacrylate (PMMA), or other suitable light-transmitting materials, which can make the micro-luminescent diode The light emitted by the body element 130 can be transmitted out. In some embodiments, the encapsulation layer 140 may have an encapsulation thickness 140h. The encapsulation thickness 140h may be greater than about 30 microns and less than or equal to 300 microns, but the invention is not limited thereto. In some embodiments, the Young's Modulus of the encapsulation layer 140 is smaller than the Young's Modulus of the flexible substrate 110, so the degree of bending of the encapsulation layer 140 can be improved, but the invention is not limited thereto .

The encapsulation layer 140 has a first surface 140 a and a second surface 140 b opposite to each other, wherein the first surface 140 a is away from the flexible substrate 110. Moreover, for example, at least one trench 141 can be formed on the top surface 140a of the encapsulation layer 140 by an etching process (in this embodiment, two trenches 141a and 141b are used as examples), but it is not limited thereto. In other embodiments, at least one trench 141 may be formed by other suitable methods, such as imprinting method, laser removal method, or other suitable methods. The trench 141 is disposed on the first surface 140a of the encapsulation layer 140, the trench 141 extends along the extending direction 141y, and the trench 141 is disposed between two adjacent pixel units 102. The vertical projection of the trench 141 on the flexible substrate 110 (in the normal direction of the surface 110a of the flexible substrate 110) does not overlap with the micro light emitting diode element 130 and the active element 120. In the flexible micro-emitting diode display device shown in FIGS. 1A and 1B, in the unflexed state, the normal direction of the substrate surface 110a of the flexible substrate 110 is, for example, the z direction, and the trench The extending direction 141y of 141 may be the corresponding y direction, but the present invention is not limited thereto. With at least one trench 141 on the encapsulation layer 140, the flexible micro-luminescent diode display device 100 can be flexed or bent in a corresponding direction.

In this embodiment, in the normal direction (ie, the vertical projection direction Z) of the substrate plane 110a of the flexible substrate 110, the trench 141 has a trench depth h, and the trench 141 has an angle θ (as shown in FIG. 1B ), the angle θ is preferably 0°<θ<60°, but it is not limited thereto. In addition, the trench depth h in the vertical projection direction Z of the trench 140 is less than the package thickness 140h of the package layer 140 in the vertical projection direction, and the ratio of the trench depth h to the package thickness 140h is preferably greater than 0 and less than 0.9 (ie, 0 < h/140h <0.9), but not limited to this. For example, when the package thickness 140h is about 300 microns and the device thickness L1 is about 4 microns, the trench depth h is about 296 microns. Therefore, the depth range of the trench depth h is, for example, greater than about 0 μm and less than about 296 μm, but the present invention is not limited thereto, but the trench depth h is less than the package thickness 140h of the package layer 140 to reduce the peeling of the package layer 140 or the micro light emitting diode The body element 130 may be damaged.

In this embodiment, the trench depth h of these trenches 141 may be substantially the same as each other, but the present invention is not limited thereto. In other embodiments, the trench depth h of these trenches 141 may be different from each other.

In this embodiment, in a direction perpendicular to the extension direction 141y (eg, the x direction in FIG. 1C), the trench 141 has the largest trench width t on the surface 140a of the encapsulation layer 140, and is perpendicular to the extension direction 141y In one direction (such as the x direction in FIG. 1C), the active device 120 has a device width L2. There is a shortest distance d1 between the micro-emitting diode element 130 and the trench 141 nearest to it, the shortest distance d1 is greater than the device width L2 and the maximum trench width t is preferably smaller than the device width L2 of the micro-emitting diode element 130, but this The invention is not limited to this. When the maximum trench width t is smaller than the device width L2 of the micro light emitting diode device 130, the stress dispersing effect of the micro light emitting diode display device 100 is better.

In this embodiment, the maximum trench width t of these trenches 141 may be substantially the same as each other, but the invention is not limited thereto. In other embodiments, the maximum trench width t of the trenches 141 may be different from each other, and the trench depth h is greater than the maximum trench width t.

The signal line 150 is disposed between adjacent pixel units 102. In this embodiment, the signal line 150 is, for example, a data line, and the signal line 150 may be electrically connected to the source S of the active device 120, but the present invention is not limited thereto. In other embodiments, the signal line is, for example, a scanning line, and the aforementioned signal line 150 may be electrically connected to the gate GE of the active device 120. In other feasible embodiments, the signal line 150 can also have other different uses. For example, the signal line 150 may be a wire of other electronic components on the flexible micro-luminescent diode display device 100, such as a power line and a reference voltage line (OVDD or OVSS). In addition, by arranging the signal line 150 between the first trench 141a and the second trench 141b, the stress can be more effectively dispersed to effectively reduce the signal line of the flexible microluminescent diode display device 100 150 The possibility of breaking or peeling.

In a virtual surface (such as the paper surface in FIG. 1A) substantially parallel to the substrate surface 110a of the flexible substrate 110, the adjacent pixel unit 102 perpendicular to the extending direction 141y (ie, the X direction in FIG. 1C) There may be multiple trenches 141 in between. In other words, there are at least two trenches 141 (ie, at least the first trench 141a and the second trench 141b) between the two micro light emitting diode elements 130 located between two adjacent pixel units 102. In some embodiments, the first trench 141a and the second trench 141b are disposed between two adjacent pixel units 102, and the signal line 150 is located between the first trench 141a and the second trench 141b. In other embodiments, the number of trenches 141 may exceed two.

For example, as shown in FIG. 1C, in a direction perpendicular to the extension direction 141y (ie, the X direction in FIG. 1C), one end of the flexible micro-luminescent diode display device 100 is subjected to a direction perpendicular to the flexible substrate 110 (For example: the z direction in FIG. 1C) When the external force F, the flexible substrate 110 can be flexed or bent in the flexible direction 110b (for example: counterclockwise in FIG. 1C), and the The encapsulation layer 140 on the flexible substrate 110 may also have corresponding deflection or bending. Generally speaking, when a force is applied to a component, the stress at the discontinuity of the component's geometry will increase locally. This phenomenon is called stress concentration. It may be easier to damage the structure of the component at the stress concentration. Therefore, with at least one trench 141 on the encapsulation layer 140, multiple stress concentrations can be generated under deflection or bending, thus avoiding stress concentration at a single stress concentration (ie, similar to a structure having only one trench ), and can reduce the stress at each stress concentration, and reduce the possibility of damage to the micro-light emitting diode element 130 or the active element 120 due to the stress concentration.

In this embodiment, the width of the trench 141 in the normal direction (for example, Z direction) of the substrate plane 110a of the flexible substrate 110 decreases from the surface 140a of the encapsulation layer 140 toward the flexible substrate 110 With this, the trench width t of the trench 141 is the maximum width in the direction perpendicular to the extending direction 141y. For example, the cross-sectional shape of the trench 141 is, for example, V-shaped, U-shaped, or other suitable cross-sectional shapes, but the invention is not limited thereto.

FIG. 2A is a schematic partial top view of a flexible micro-light emitting diode display device according to a second embodiment of the invention. Fig. 2B is a sectional view taken along the line B-B' of Fig. 2A. It must be noted here that the embodiments of FIGS. 2A and 2B continue to use the element numbers and partial contents of the embodiments of FIGS. 1A to 1C, wherein the same or similar reference numbers are used to indicate the same or similar elements, and the same is omitted For the description of the technical content, for the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

Please refer to FIGS. 2A and 2B at the same time. The difference between the flexible micro-luminescent diode display device 200 of the second embodiment and the flexible micro-luminescent diode display device 100 of the first embodiment is that it is perpendicular to the extending direction In one direction of 141y (such as the x direction in FIG. 1C), the flexible micro-luminescent diode display device 200 includes a first trench 141a and a second channel between two adjacent micro-luminescent diode elements 130 The trench 141b and the third trench 241c. The third trench 241c is located between the first trench 141a and the second trench 141b, and the signal line 150 overlaps the third trench 241c. In this embodiment, the first trench 141a has a first depth h1 in the vertical projection direction Z, the second trench 141b has a second depth h2, the third trench 241c has a third depth h3, the first trench 141a, the second The trench 141b and the third trench 241c are located between two adjacent pixel units 102 and the third trench 241c is located between the first trench 141a and the second trench 141b, and the third depth h3 is greater than the first depth h1 and the second depth h2.

In this embodiment, the first depth h1 and the second depth h2 may be substantially equal, and the stress distribution may be more even, but the invention is not limited to this. In some embodiments, the first depth h1 and the second depth h2 may not be equal. For example, the first depth h1 may be greater than the second depth h2, or the second depth h2 may be greater than the first depth h1. Between the third trench 241c having the maximum depth (ie, the third depth h3) and the corresponding micro light emitting diode element 130, the first trench 141a and the second trench 141b have a depth smaller than the third depth h3 ( For example: first depth h1 and second depth h2). Therefore, the stress concentration with the maximum stress can be kept away from the corresponding microluminescent diode element 130 or the corresponding active element 120, and the flexible microluminescent diode display device 200 due to stress concentration can be reduced The possibility of damage.

In some embodiments, the maximum trench width t1 of the first trench 141a, the maximum trench width t2 of the second trench 141b, and the maximum trench width t3 of the third trench 241c may be substantially the same as each other, or the maximum of the first trench 141a The ditch width t1, the maximum ditch width t2 of the second ditch 141b and the maximum ditch width t3 of the third ditch 241c may be different from each other or different from each other, but the invention is not limited to this, but each ditch 141a, 141b, 241c The depths h1, h2, h3 are greater than the corresponding maximum trench widths t1, t2, t3.

In some embodiments, in the extending direction 141y of the trench 141, a plurality of trenches 141 between two adjacent micro-emitting diode elements 130 may have different trench lengths. For example, as shown in FIG. 2A, in the extending direction 141y, the third trench 241c may be continuous (ie, extending in the extending direction 141y through the flexible substrate 110 depicted in FIG. 2A), and the first One trench 141a and the second trench 141b may be discontinuous trenches. In other words, the trench length of the third trench 241c (not shown, but greater than the range of the flexible substrate 110 shown in FIG. 2A in the extending direction 141y) is greater than the trench length L3 of the first trench 141a and the second trench 141b Ditch length L4.

3 is a schematic partial cross-sectional view of a flexible micro-luminescent diode display device according to a third embodiment of the present invention. It must be noted here that the embodiment of FIG. 3 follows the element numbers and partial contents of the embodiments of FIGS. 1A to 1C, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the same technical content is omitted. For the description, the description of the omitted parts may refer to the foregoing embodiments, and the following embodiments will not be repeated. For clarity, the partial cross-section of the flexible microluminescent diode display device 300 depicted in FIG. 3 may correspond to the region R1 in FIG. 1B.

Referring to FIG. 3, the difference between the flexible microluminescent diode display device 300 of the third embodiment and the first embodiment lies in the substrate plane 110a (shown in FIG. 1B) of the flexible substrate 110 (shown in FIG. 1B) In the normal direction of FIG. 1B ), the width changes of the plurality of trenches 341 increase from the surface 140 a of the encapsulation layer 140 toward the flexible substrate 110. For example, the cross-sectional shape of the trench 341 is, for example, a trapezoid, but the invention is not limited thereto.

FIG. 4 is a schematic partial cross-sectional view of a flexible micro light-emitting diode display device according to a fourth embodiment of the present invention. It must be noted here that the embodiment of FIG. 4 continues to use the element labels and partial contents of the embodiments of FIGS. 1A to 1C, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the same technical content is omitted. For the description, the description of the omitted parts may refer to the foregoing embodiments, and the following embodiments will not be repeated.

Please refer to FIG. 4, the difference between the flexible micro-light emitting diode display device 400 of the fourth embodiment and the flexible micro-light emitting diode display device 100 of the first embodiment is that the flexible micro-light emitting diode display The device 400 further includes an elastic layer 400. The elastic layer 400 is located on the encapsulation layer 140 and filled in the plurality of trenches 141, and the Young's modulus of the elastic layer 400 is smaller than that of the encapsulation layer 140. The elastic layer is, for example, solid rubber, foam rubber, soft rubber, Photoresist materials or combinations thereof or other suitable light transmissive materials. The configuration of the elastic layer 400 can further absorb stress and improve the reliability of the product.

FIG. 5A is a partial schematic top view of a flexible micro-light emitting diode display device according to a fifth embodiment of the present invention. Fig. 5B is a sectional view taken along line C-C' in Fig. 5A. It must be noted here that the embodiments of FIGS. 5A to 5B continue to use the element numbers and partial contents of the embodiments of FIGS. 1A to 1C, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the same is omitted. For the description of the technical content, for the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

5A and 5B, the difference between the flexible micro-luminescent diode display device 500 of the fifth embodiment and the flexible micro-luminescent diode display device 100 of the first embodiment is that the flexible micro-light emitting diode 100 The polar body display device 500 includes a first signal line 150a and a second signal line 150b. The first signal line 150a at least partially overlaps the first trench 141a, and the first signal line 150a is electrically connected to the corresponding active device 120. The second signal line 150b and the second trench 141b at least partially overlap. In this embodiment, the first signal line 150a is, for example, a data line electrically connected to the active element 120, and the second signal line 150b may be another data electrically connected to another active element (not shown) Line, but the invention is not limited to this. In other embodiments, the second signal line 150b may be a scanning line, and the second signal line 150b may be electrically connected to the gate GE of the active device 120. In other feasible embodiments, the second signal line 150b may be a wire of other electronic components on the flexible micro-light emitting diode display device 500.

FIG. 6A is a partial schematic top view of a flexible micro-luminescent diode display device according to a sixth embodiment of the invention. Fig. 6B is a sectional view taken along the line D-D' in Fig. 6A. It must be noted here that the embodiments of FIGS. 6A to 6B continue to use the element numbers and parts of the embodiments of FIGS. 5A to 5B, wherein the same or similar reference numbers are used to indicate the same or similar elements, and the same is omitted. For the description of the technical content, for the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

6A and 6B, the difference between the flexible micro-luminescent diode display device 600 of the sixth embodiment and the flexible micro-luminescent diode display device 500 is that the flexible micro-luminescent diode display device 600 The third trench 641c is further included, and the third trench 641c is located between the first trench 141a and the second trench 141b. In other feasible embodiments, by the first signal line 150a and the first trench 141a at least partially overlapping, and the second signal line 150b and the second trench 141b at least partially overlapping, the stress can be more effectively dispersed to effectively The possibility that the first signal line 150a and/or the second signal line 150b of the flexible micro-luminescent diode display device 600 is broken or peeled is reduced.

The flexible micro light-emitting diode display device disclosed by the present invention has better flexibility by having at least one trench between two adjacent micro-light emitting diode elements. In addition, the depth of the trench is smaller than the packaging thickness of the packaging layer, so as to reduce the possibility of peeling of the packaging layer or damage of the micro-light emitting diode device, and improve the reliability of the flexible micro-light emitting diode display device.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100, 200, 300, 400, 500, 600 ‧‧‧Flexible micro-luminescent diode display device 102 ‧‧‧ pixel unit 110 ‧‧‧ flexible substrate 110a‧‧‧ flexible substrate surface 120‧ ‧‧Active component 130‧‧‧Microluminescent diode component 140‧‧‧Package layer 140a‧‧‧‧First surface 140b‧‧‧Second surface 140h‧‧‧Package thickness 141‧‧‧Ditch 141y‧‧‧Extended Direction 141a‧‧‧The first channel 141b‧‧‧The second channel 241c, 641c‧‧‧The third channel 150‧‧‧ Signal line 150a‧‧‧The first signal line 150b‧‧‧The second signal line 400‧‧‧ Elastic layer GE‧‧‧Gate S‧‧‧Source D‧‧‧Drain CH‧‧‧Semiconductor layer GI‧‧‧Gate insulating layer X‧‧‧Connecting wire F‧‧‧External force PV1‧‧‧Flat Layer d1‧‧‧The shortest distance L1‧‧‧Element thickness L2‧‧‧Element width L3, L4‧‧‧Ditch length t, t1, t2, t3‧‧‧Max trench width h‧‧‧Ditch depth h1‧‧‧ First depth h2‧‧‧ Second depth h3‧‧‧ Third depth R1‧‧‧ Magnified part x, y, z‧‧‧ Direction θ‧‧‧ Angle

FIG. 1A is a partial schematic top view of a flexible micro-light emitting diode display device according to a first embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line A-A' in Fig. 1A. FIG. 1C is a schematic diagram of the bending of the R1 region in FIG. 1B. FIG. 2A is a schematic partial top view of a flexible micro-light emitting diode display device according to a second embodiment of the invention. Fig. 2B is a sectional view taken along the line B-B' of Fig. 2A. 3 is a schematic partial cross-sectional view of a flexible micro-luminescent diode display device according to a third embodiment of the present invention. FIG. 4 is a schematic partial cross-sectional view of a flexible micro light-emitting diode display device according to a fourth embodiment of the present invention. FIG. 5A is a partial schematic top view of a flexible micro-light emitting diode display device according to a fifth embodiment of the present invention. Fig. 5B is a sectional view taken along line C-C' in Fig. 5A. FIG. 6A is a partial schematic top view of a flexible micro-luminescent diode display device according to a sixth embodiment of the invention. Fig. 6B is a sectional view taken along the line D-D' in Fig. 6A.

100‧‧‧Flexible micro-luminous diode display device

110‧‧‧Flexible substrate

110a‧‧‧Flexible substrate surface

120‧‧‧Active components

130‧‧‧Microluminescent diode components

140‧‧‧encapsulation layer

140a‧‧‧First surface

140b‧‧‧Second surface

140h‧‧‧Package thickness

141‧‧‧Ditch

141a‧‧‧The first ditch

141b‧‧‧Second Ditch

150‧‧‧Signal line

GE‧‧‧Gate

S‧‧‧Source

D‧‧‧ Jiji

CH‧‧‧semiconductor layer

GI‧‧‧Gate insulation

X‧‧‧ connection cable

PV1‧‧‧flat layer

d1‧‧‧The shortest distance

L1‧‧‧component thickness

L2‧‧‧Element width

t‧‧‧Max trench width

h‧‧‧Ditch depth

R1‧‧‧Enlarged part

x, y, z‧‧‧ direction

θ‧‧‧angle

Claims (15)

A flexible micro-luminous diode display device, comprising: a plurality of pixel units, arranged on a flexible substrate; a plurality of active elements, arranged on the flexible substrate; a plurality of micro-luminous diodes The device is located on the flexible substrate, and the micro light-emitting diode elements are electrically connected to the corresponding active elements, and each pixel unit includes at least one of the active elements and at least one of the micro-light emitting diodes. A encapsulating layer covering the micro-light emitting diode elements, the encapsulating layer has a first surface, wherein the first surface is away from the flexible substrate; and at least one trench has an extending direction, the at least A trench is provided on the first surface of the packaging layer, the at least one trench has a trench depth in a vertical projection direction, the trench depth is less than a thickness of the packaging layer in the vertical projection direction, and the at least one trench is provided Between the two adjacent pixel units, the at least one trench does not overlap with the micro light emitting diode elements and the active elements in the vertical projection direction. The flexible microluminescent diode display device as described in item 1 of the patent application scope includes at least one signal line disposed between two adjacent pixel units. The flexible micro-emitting diode display device as described in item 2 of the patent application scope, wherein the at least one trench is a plurality of trenches, and the trenches include a first trench and a second trench, wherein the first The trench and the second trench are disposed between the two adjacent pixel units, and the at least one signal line is located between the first trench and the second trench. The flexible micro-emitting diode display device as described in item 3 of the patent application scope, wherein the trenches further include a third trench between the first trench and the second trench, and the at least one signal The line overlaps the third ditch. The flexible micro light-emitting diode display device as described in item 3 of the patent application scope, wherein the at least one signal line is a plurality of signal lines, and the signal lines further include a first signal line and a second signal Line, the first signal line and the first trench at least partially overlap, and the second signal line and the second trench at least partially overlap. The flexible light-emitting diode display device as described in item 5 of the patent application scope, wherein the trenches further include a third trench located between the first trench and the second trench. The flexible micro-emitting diode display device as described in item 4 or item 6 of the patent application scope, wherein the first trench, the second trench and the third trench each have a first in the vertical projection direction A depth, a second depth, and a third depth, the first trench, the second trench, and the third trench are between two adjacent pixel units, and the third trench is between the first trench and Between the second trenches, the third depth is greater than the first depth and the second depth. The flexible micro-emitting diode display device as described in item 7 of the patent application scope, wherein the first depth is equal to the second depth. The flexible micro-emitting diode display device as described in item 1 of the patent application range, wherein each of the trenches has a maximum trench width perpendicular to the extending direction, and each of the micro-emitting diode elements is perpendicular to the extending direction There is an element width on the top, and there is a shortest distance between the micro light-emitting diode elements and the trenches, the shortest distance is greater than the element width, and the element width is greater than the maximum trench width. The flexible micro-emitting diode display device as described in item 1 of the patent application range, wherein the at least one trench has a maximum trench width perpendicular to the extending direction, and the trench depth is greater than the maximum trench width. The flexible micro light-emitting diode display device as described in item 1 of the patent application range, wherein the thickness of the encapsulation layer is greater than 30 microns and less than or equal to 300 microns, and the micro-light emitting diode elements are in the vertical projection direction It has an element thickness that is greater than 4 microns and less than or equal to 30 microns. The flexible microluminescent diode display device as described in item 1 of the patent application range, wherein the flexible microluminescent diode display device has a flexible direction, and the flexible direction is perpendicular to the at least The extension direction of a ditch. The flexible micro-emitting diode display device as described in item 1 of the patent application range, wherein the at least one trench is a plurality of trenches, and at least two of the trenches have different lengths in the extending direction. The flexible microluminescent diode display device as described in item 1 of the patent application range, wherein the Young's modulus of the encapsulation layer is smaller than the Young's modulus of the flexible substrate. The flexible micro-emitting diode display device as described in item 13 of the patent application scope further includes: an elastic layer disposed on the encapsulation layer and filled in the trenches, and the Young's mode of the elastic layer The amount is smaller than the Young's modulus of the encapsulation layer.

Images