CN109037269A - Flexible micro light-emitting diode display device - Google Patents
Flexible micro light-emitting diode display device Download PDFInfo
- Publication number
- CN109037269A CN109037269A CN201810822594.2A CN201810822594A CN109037269A CN 109037269 A CN109037269 A CN 109037269A CN 201810822594 A CN201810822594 A CN 201810822594A CN 109037269 A CN109037269 A CN 109037269A
- Authority
- CN
- China
- Prior art keywords
- groove
- micro
- display device
- flexible
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 241000219000 Populus Species 0.000 claims 1
- 230000003760 hair shine Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 230000012447 hatching Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011368 organic material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- -1 ice alkene Chemical class 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920006393 polyether sulfone Polymers 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A flexible micro light emitting diode display device comprises a flexible substrate, a plurality of pixel units, a plurality of active elements, a plurality of micro light emitting diode elements, an encapsulation layer and at least one groove. The pixel unit and the active element are arranged on the flexible substrate. The micro light-emitting diode elements are positioned on the flexible substrate and are respectively electrically connected with the corresponding active elements. The packaging layer covers the micro light-emitting diode element and is provided with a first surface far away from the flexible substrate. The groove has an extending direction and is arranged on the first surface of the packaging layer. The depth of the groove in the vertical projection direction is smaller than the thickness of the packaging layer in the vertical projection direction. The groove is arranged between two adjacent pixel units. The groove is not overlapped with the micro LED element and the active element in the vertical projection direction.
Description
Technical field
The invention relates to a kind of display devices, and fill in particular to a kind of micro- diode displaying of flexibility
It sets.
Background technique
As portable type display device is widely used, the exploitation for flexible (flexible) display device also more becomes
Actively, to be implemented under different curve still displayable purpose.However, how to promote the flexibility and video recording analysis of display device
Degree has become the project for wanting to solve at present in fact.
Summary of the invention
The present invention provides a kind of micro- LED illuminating device of flexibility, can reach promotion light emitting display device
Flexibility and image analytic degree.
The present invention provides a kind of micro- light emitting display device of flexibility comprising flexible base board, multiple pixel units, more
A active component, multiple micro- light-emitting diodes, encapsulated layer and an at least groove.Pixel unit is set to flexible base board
On.Active component is set on flexible base board.Micro- light-emitting diode is located on flexible base board.Micro- light-emitting diode point
It is not electrically connected with corresponding active component, and each pixel unit includes an at least active component and at least one micro- light-emitting diodes
Tube elements.Encapsulated layer covers micro- light-emitting diode, and encapsulated layer has first surface, and wherein first surface is far from flexible base
Plate.Groove has an extending direction.Groove is set to the first surface of encapsulated layer.Groove is small in the depth on upright projection direction
In encapsulated layer in the thickness on upright projection direction.Groove is set between two adjacent pixel units.In upright projection side
Upward groove and micro- light-emitting diode and active component be not be overlapped.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Figure 1A is regarded on part according to a kind of micro- light emitting display device of flexibility of the first embodiment of the present invention
Schematic diagram.
Figure 1B is the sectional view of the A-A ' hatching line along Figure 1A.
Fig. 1 C is the bending sketch map in the region R1 in Figure 1B.
Fig. 2A is regarded on part according to a kind of micro- light emitting display device of flexibility of the second embodiment of the present invention
Schematic diagram.
Fig. 2 B is the sectional view of the B-B ' hatching line along Fig. 2A.
Fig. 3 is shown according to a kind of part section of micro- light emitting display device of flexibility of the third embodiment of the present invention
It is intended to.
Fig. 4 is shown according to a kind of part section of micro- light emitting display device of flexibility of the fourth embodiment of the present invention
It is intended to.
Fig. 5 A is regarded on part according to a kind of micro- light emitting display device of flexibility of the fifth embodiment of the present invention
Schematic diagram.
Fig. 5 B is the sectional view of the C-C ' hatching line along Fig. 5 A.
Fig. 6 A is regarded on part according to a kind of micro- light emitting display device of flexibility of the sixth embodiment of the present invention
Schematic diagram.
Fig. 6 B is the sectional view of the D-D ' hatching line along Fig. 6 A.
Wherein, appended drawing reference:
100,200,300,400,500,600: flexible micro- light emitting display device
102: pixel unit
110: flexible base board
110a: flexible base board surface
120: active component
130: micro- light-emitting diode
140: encapsulated layer
140a: first surface
140b: second surface
140h: package thickness
141: groove
141y: extending direction
141a: first groove
141b: second groove
241c, 641c: third groove
150: signal wire
150a: the first signal wire
150b: second signal line
400: elastic layer
GE: grid
S: source electrode
D: drain electrode
CH: semiconductor layer
GI: gate insulating layer
X: connecting line
F: external force
PV1: flatness layer
D1: the shortest distance
LI: component thickness
L2: element width
L3, L4: trench length
T, t1, t2, t3: maximum groove width
H: trench depth
H1: the first depth
H2: the second depth
H3: third depth
RI: amplifier section
X, y, z: direction
θ: angle
Specific embodiment
Structural principle and working principle of the invention are described in detail with reference to the accompanying drawing:
Referring to the schema of the present embodiment more fully to illustrate the present invention.However, the present invention also can be with a variety of different shapes
Formula embodies, and should not necessarily be limited by embodiments described herein.
In the accompanying drawings, for the sake of clarity, it is exaggerated the thickness in layer, film, panel, region etc..Throughout the specification, phase
Same appended drawing reference indicates identical element.It should be appreciated that ought such as layer, film, region or substrate element be referred to as another
It when element "upper" or " being connected to " another element, can be connect directly on another element or with another element, or intermediate
Element can be there is also.On the contrary, when element is referred to as " directly on another element " or when " being directly connected to " another element, no
There are intermediary elements.As it is used herein, " connection " can refer to physics and/or electric connection.Furthermore it is electrically connected or couples
It can there are other elements between two element.
It will be appreciated that though term " first " and " second " etc. can be used for describing various component, assembly units, area herein
Domain, layer and/or part, but these component, assembly units, region and/or part should not be limited by these terms.These terms
It is only used for distinguishing a component, assembly unit, region, layer or part and another component, assembly unit, region, layer or part.Cause
This, " first element " discussed below, " component ", " region ", " floor " or " part " can be referred to as second element, component, area
Domain, layer or part are without departing from teaching herein.
Term used herein is used for the purpose of for the purpose of describing particular embodiments, rather than restrictive.Such as this paper institute
It uses, except non-content explicitly indicates that, otherwise singular " one ", "one" and "the" are intended to include plural form, including
"at least one"."or" expression " and/or ".As it is used herein, term " and/or " it include one or more related institute lists
Any and all combinations of purpose.It is also understood that when used in this manual, term " includes " and/or " comprising " are specified
The feature, region, entirety, step, operation, the presence of element and/or component, but be not excluded for one or more of the other feature,
Region entirety, step, operation, the presence or addition of component, assembly unit and/or a combination thereof.
In addition, the relative terms of such as "lower" or " bottom " and "upper" or " top " can be used to describe herein a member
The relationship of part and another element, as shown in the figure.It should be appreciated that relative terms are intended to include other than orientation shown in figure
The different direction of device.For example, being described as be in the member of the "lower" side of other elements if the device in an attached drawing is overturn
Part will be oriented at the "upper" side of other elements.Therefore, exemplary term "lower" may include the orientation of "lower" and "upper", depend on
In the specific orientation of attached drawing.Similarly, if the device in an attached drawing is overturn, be described as be in other elements " lower section " or
The element of " lower section " will be oriented in other elements " top ".Therefore, exemplary term " following " or " following " may include
Above and below orientation.
" about " used herein, " approximation ", " substantial " or " generally " includes described value and in ordinary skill
Average value in the acceptable deviation range for the particular value that personnel determine, it is contemplated that the measurement that is discussed and relevant to measurement
The specific quantity (that is, limitation of measuring system) of error.For example, " about " can indicate one or more standard deviations in described value
In difference, or in ± 30%, ± 20%, ± 10%, ± 5%.Furthermore " about " used herein, " approximation " or " substantial " can be according to
Optical property, etching property or other properties to select more acceptable deviation range or standard deviation, and can not have to a mark
Quasi- deviation is applicable in whole properties.
Unless otherwise defined, all terms (including technical and scientific term) used herein have leads with belonging to the present invention
The normally understood identical meaning of the those of ordinary skill in domain.It will be further appreciated that such as in usually used dictionary
Those of definition term should be interpreted as having and their meanings in the relevant technologies and context of the invention are consistent
Meaning, and will not be interpreted Utopian or excessively formal meaning, unless clearly definition so herein.
Figure 1A is regarded on part according to a kind of micro- light emitting display device of flexibility of the first embodiment of the present invention
Schematic diagram.Figure 1B is the sectional view of the A-A ' hatching line along Figure 1A.Fig. 1 C is the bending sketch map in the region R1 in Figure 1B.For clarity
It indicates, is omitted in Figure 1A and show the film layer and component of part.Also, active component 120 or its between signal wire 150
Connection line does not appear in Figure 1A, but Figure 1B still shows active component 120 and connecting line X above-mentioned in sectional view, with clear
Indicate the connection relationship between signal wire 150, active component 120 and micro- light emitting diode 130.In addition, table for clarity
Show the micro- light emitting display device 100 of flexibility under deflected, it is merely exemplary in Fig. 1 C to show under deflected
The relationship of encapsulated layer 140 and corresponding micro- light-emitting diode 130.
Please refer to Figure 1A and Figure 1B, flexible micro- light emitting display device 100 may include flexible base board 110, multiple
Pixel unit 102, multiple active components 120, multiple micro- light-emitting diodes 130, encapsulated layer 140 and signal wire 150.It is soft
The material of property substrate 110 may include polyimide (polyimide；PI), polycarbonate (polycarbonate；PC), polyether sulfone
(polyethersulfone；PES), polyacrylate (polyacrylate；PA), poly- field ice alkene (polynorbornene；
PNB), polyethylene terephthalate (polyethylene terephthalate；PET), polyether-ether-ketone
(polyetheretherketone；PEEK), polyethylene naphthalate (polyethylene naphthalate；PEN),
Or PolyEtherImide (polyetherimide；PEI), but not limited to this and can be various other organic materials or organic/nothing
Machine mixing material or other suitable flexible materials, but invention is not limited thereto.
Multiple pixel units 102 are set on flexible base board 110 with multiple active components 120.Multiple active components 120 can
To be on the substrate surface 110a for being configured at flexible base board 110 in a manner of array arrangement.In other words, multiple pixel units
102 modes that can be array arrangement are configured on flexible base board 110.Each pixel unit 102 includes an at least active component 120
With at least one micro- light-emitting diode 130, so the present invention is not limited thereto, and each active component 120 has corresponding grid
Pole GE, source S, drain D and semiconductor layer CH.It can have gate insulating layer GI between grid G E and semiconductor layer CH.It is flat
Layer PV1 can be covered on active component 120.In the present embodiment, active component 120 is, for example, thin film transistor (TFT) (thin
film transistor；TFT), the active component 120 in Figure 1B be can be for bottom grid transistor npn npn with thin film transistor (TFT)
For (bottom gate), i.e. grid G E is located at the lower section of semiconductor layer CH.In other embodiments, thin film transistor (TFT) can be
Top grid type (top gate, such as: grid G E is located at the top of semiconductor layer CH) or solid type transistor (such as: half
Conductor layer CH is located on different levels) or other appropriate patterns transistor, however, the present invention is not limited thereto.In other realities
It applies in example, active component 120 is also possible to the switch element (switching device) of other kenels.
Micro- light-emitting diode 130 is configured on the substrate surface 110a of flexible base board 110, and multiple micro- light-emitting diodes
Tube elements 130 are electrically connected with corresponding active component 120 respectively.In some embodiments, micro- light-emitting diode 130 with
Drain D in active component 120 is electrically connected, but invention is not limited thereto.Light-emitting diode 130 can slightly for this
With substantially the same or different luminescent color.For example, the micro- light-emitting diode 130 in part can issue red
Light, the micro- light-emitting diode 130 in part in addition can issue green light, and the micro- light-emitting diode in remaining part
130 can issue blue light, but invention is not limited thereto.In other embodiments, then remaining micro- light-emitting diode
130 also capable of emitting other coloured light, such as: white light, sodium yellow or other suitable coloured light.
In the present embodiment, the size of micro- light-emitting diode 130 is (that is, be projected on the substrate surface of flexible base board 110
Area on 110a) can be 100 microns × 100 microns hereinafter, and micro- light-emitting diode 130 on upright projection direction
Component thickness L1 may be greater than or be approximately equal to 4 microns of (micrometer；μm) and be Less than or equal to about 30 microns.
Since the more general light emitting diode of the size of micro- light-emitting diode is much smaller, it can be substantially
More micro- light emitting diodes are placed on identical unit area, and then promote the image analytic degree of display device.In addition, due to
Light emitting diode (including but not limited to micro- light-emitting diode) be by semiconductor technology by multiple conductive layers, multiple partly lead
Body layer, luminescent layer and stacked dielectric layer form.Therefore, if light emitting diode it is oversized (such as: be similar to have larger size
Generally a light emitting diode, for example greater than about 100 microns or more), then the display device constituted can more difficult flexure.Except this
Except, compared to the display device constituted with luminous organic material, due to luminous organic material can be because of aqueous vapor or oxygen caused by
The damage that can not be repaired, therefore, the display device that luminous organic material is constituted need to often have a variety of additional film layers (e.g., to use
In the barrier layer (barrier layer) for stopping aqueous vapor or oxygen).In addition, the display device constituted with luminous organic material,
When in display static content for a long time (that is, in the case where brightness and/or constant tone of display), due to organic light emission material
Expect existing material property, even if the content in display device has changed, but previously shows the block of static content still for a long time
Ghost situation (that is, the aging phenomenon being commonly called as, burn-in or ghost) can persistently occur.Accordingly, compared with luminous organic material institute structure
At display device the preferable product longevity is had more other than it can bend with the display device that micro- light emitting diode is constituted
Life and display quality.
Encapsulated layer 140 covers micro- light-emitting diode 130.The material of encapsulated layer 140 is, for example, photoresist, asphalt mixtures modified by epoxy resin
Rouge (epoxy resin), silicone resin, polymethyl methacrylate (polymethyl methacrylate；PMMA) or other are suitable
Suitable transparent material, and the light that micro- light-emitting diode 130 can be allow to be issued transmits away.In some embodiments
In, encapsulated layer 140 can have package thickness 140h, and package thickness 140h may be greater than about 30 microns and be Less than or equal to about
300 microns, but invention is not limited thereto.In some embodiments, the Young's modulus (Young ' s of encapsulated layer 140
Modulus) it is less than the Young's modulus of flexible base board 110, therefore the degree that is bent of encapsulated layer 140 can be promoted, but the present invention
It is not limited.
Encapsulated layer 140 has each other relative first surface 140a and second surface 140b, and wherein first surface 140a is remote
From flexible base board 110.Also, it such as can be by etch process in forming an at least ditch on the top surface 140a of encapsulated layer 140
Slot 141 (being in the present embodiment, by taking two grooves 141a, 141b as an example), but not limited to this.In other embodiments, formed
An at least groove 141 can use other suitable modes, such as: coining mode, laser remove mode or other suitable modes.
Groove 141 is set to the first surface 140a of encapsulated layer 140, and groove 141 is stretched along the edge extending direction 141y, and groove 141 is arranged
Between two adjacent pixel units 102.Groove 141 is in the upright projection (surface of flexible base board 110 on flexible base board 110
In the normal direction of 110a) it is not be overlapped with micro- light-emitting diode 130 and active component 120.Shown by Figure 1A and Figure 1B
The micro- light emitting display device of flexibility in, in the state of not bending, the normal of the substrate surface 110a of flexible base board 110
Direction is, for example, the direction z, and the extending direction 141y of groove 141 can be the corresponding direction y, however, the present invention is not limited thereto.By
By at least groove 141 on encapsulated layer 140, flexible micro- light emitting display device 100 can be made in a corresponding direction
On can be bent or be bent.
In the present embodiment, in the normal direction (that is, upright projection direction Z) of the base plan 110a of flexible base board 110
On, groove 141 has trench depth h, and groove 141 has an angle, θ (as shown in Figure 1B), and angle, θ is preferably 0 degree of < θ
60 degree of <, but not limited to this.In addition, groove 140 is less than encapsulated layer 140 in vertical in the trench depth h on the Z of upright projection direction
The ratio of package thickness 140h on projecting direction, trench depth h and package thickness 140h are preferably greater than 0 and less than 0.9
(that is, 0 < h/140h < 0.9), but not limited to this.For example, when package thickness 140h is about 300 microns, component thickness L1
At about 4 microns, trench depth h is about 296 microns.Therefore the depth bounds of trench depth h are, for example, greater than about 0 micron and small
In about 296 microns, however, the present invention is not limited thereto, only trench depth h are less than the package thickness 140h of encapsulated layer 140, to reduce envelope
Fill the possibility that layer 140 is removed or micro- light-emitting diode 130 is impaired.
In the present embodiment, the trench depth h of these grooves 141 can be essentially the same as each other, but the present invention is not limited to
This.In other embodiments, the trench depth h of these grooves 141 can be differing from each other.
In the present embodiment, on the direction (such as: the direction x in Fig. 1 C) perpendicular to extending direction 141y, groove 141
In having maximum groove width t on the surface 140a of encapsulated layer 140, (such as: Fig. 1 C in the direction perpendicular to extending direction 141y
In the direction x) on, active component 120 have element width L2.Micro- light-emitting diode 130 and the groove 141 for being most bordering on it
Between there is shortest distance d1, shortest distance d1 to be greater than element width L2 and maximum groove width t be preferably less than micro- light-emitting diodes
The element width L2 of tube elements 130, however, the present invention is not limited thereto.When maximum groove width t is less than micro- light-emitting diode 130
Element width L2 when, the stress dispersion effect of micro- light emitting display device 100 is preferable.
In the present embodiment, the maximum groove width t of these grooves 141 can be essentially the same as each other, but the present invention is not
It is limited to this.In other embodiments, the maximum groove width t of these grooves 141 can be differing from each other, and trench depth h is big
In maximum groove width t.
Signal wire 150 is set between adjacent pixel unit 102.In the present embodiment, signal wire 150 is, for example, data
Line, and signal wire 150 can be electrically connected to the source S of active component 120, however, the present invention is not limited thereto.Implement in others
In example, signal wire is, for example, scan line, and signal wire above-mentioned 150 can be electrically connected to the grid G E of active component 120.?
In other feasible embodiments, signal wire 150 also can have other different purposes.For example, signal wire 150 can be
The conducting wire of other electronic components on flexible micro- light emitting display device 100, for example, power line, reference voltage line (OVDD or
OVSS).In addition to this, it is configured between first groove 141a and second groove 141b by by signal wire 150, it can be more effective
Dispersive stress, be effectively reduced flexible micro- light emitting display device 100 the fracture of signal wire 150 or removing can
Energy.
It is in a direction substantially parallel in a virtual face (such as: the paper of Figure 1A) of the substrate surface 110a of flexible base board 110, hangs down
Directly it can have multiple grooves 141 between the adjacent pixel unit 102 in extending direction 141y (i.e. X-direction in Fig. 1 C).
In other words, there are at least two grooves between two micro- light-emitting diodes 130 of two adjacent pixel units 102
141 (that is, including at least first groove 141a and second groove 141b).In some embodiments, first groove 141a and second
Groove 141b is set between two adjacent pixel units 102, and signal wire 150 is located at first groove 141a and second groove
Between 141b.In other embodiments, the quantity of groove 141 can be more than two.
For example, as shown in Figure 1 C, on perpendicular to extending direction 141y (i.e. X-direction in Fig. 1 C), flexible micro- hair
External force F of the one end of optical diode display device 100 by the direction (such as: the direction z in Fig. 1 C) perpendicular to flexible base board 110
When, flexible base board 110 can be made in (such as: the counter clockwise direction in Fig. 1 C) accordingly being bent on flexible direction 110b or curved
Song, and the encapsulated layer 140 being located on flexible base board 110 is made also to can have corresponding flexure or bending.In general, exerting a force
When on component, the phenomenon that part increases is had in the stress of the discontinuous place (discontinuity) of the geometry of component,
This phenomenon is known as stress and concentrates (stress concentration).And it may be easier to make the knot of component in stress raiser
It is configured to destroy.Therefore, by at least groove 141 on encapsulated layer 140, multiple stress can be generated under flexure or bending
At concentration, therefore single a stress raiser (that is, being similar to structure only with a groove) can be concentrated on to avoid stress,
And the stress of each stress raiser can be reduced, and reduce stress and concentrate and lead to micro- light-emitting diode 130 or have
The possibility that source element 120 is damaged.
In the present embodiment, groove 141 is in the normal direction (such as: Z-direction) of the base plan 110a of flexible base board 110
On change width be the surface 140a by encapsulated layer 140 towards successively decreasing on the direction of flexible base board 110, with this, the ditch of groove 141
Groove width t is perpendicular to the maximum width on extending direction 141y.For example, the section shape of groove 141 is, for example, V word
Shape, U-shaped or other suitable section shapes, but invention is not limited thereto.
Fig. 2A is regarded on part according to a kind of micro- light emitting display device of flexibility of the second embodiment of the present invention
Schematic diagram.Fig. 2 B is the sectional view of the B-B ' hatching line along Fig. 2A.It should be noted that, the embodiment of Fig. 2A and Fig. 2 B is continued to use herein
The element numbers and partial content of the embodiment of Figure 1A to Fig. 1 C, wherein being indicated using identical or approximate label identical or close
As element, and the explanation of same technique content is omitted, the explanation about clipped can refer to previous embodiment, following
It is no longer repeated for embodiment.
Referring to Fig. 2A and Fig. 2 B, the micro- light emitting display device 200 and first of the flexibility of second embodiment is real
Apply the micro- light emitting display device 100 of flexibility of example the difference is that: the direction perpendicular to extending direction 141y (such as: figure
The direction x in 1C) on, flexible micro- light emitting display device 200 is between two adjacent micro- light-emitting diodes 130
Including first groove 141a, second groove 141b and third groove 241c, third groove 241c be located at first groove 141a with
Between second groove 141b, and signal wire 150 is Chong Die with third groove 241c.In the present embodiment, first groove 141a is in vertical
It is respectively provided with the first depth h1 on straight projecting direction Z, there is second groove 141b the second depth h2, third groove 241c to have the
Three depth h3, first groove 141a, second groove 141b and third groove 241c are between two adjacent pixel units 102
And third groove 241c is between first groove 141a and second groove 141b, and third depth h3 be greater than the first depth h1 and
Second depth h2.
In the present embodiment, the first depth h1 and the second depth h2 can be substantially equal, and can make stress distribution more
It is average, but invention is not limited thereto.In some embodiments, the first depth h1 and the second depth h2 can be unequal.Citing
For, the first depth h1 can be greater than the second depth h2, or, the second depth h2 can be greater than the first depth h1.Have most
Between the third groove 241c and corresponding micro- light-emitting diode 130 of big depth (that is, third depth h3), first groove
141a and second groove 141b be respectively provided with the depth small compared with third depth h3 (such as: the first depth h1 and the second depth h2).
Therefore, can make to may be located remotely from corresponding micro- light-emitting diode 130 or corresponding with the maximum stress raiser answered
Active component 120, and can reduce that stress is concentrated and lead to that flexible micro- light emitting display device 200 damages can
Energy.
In some embodiments, the maximum ditch groove width of the maximum groove width t1 of first groove 141a, second groove 141b
The maximum groove width t3 of degree t2 and third groove 241c can be essentially the same as each other, or, the maximum of first groove 141a
The maximum groove width t3 of the maximum groove width t2 and third groove 241c of groove width t1, second groove 141b can be two-by-two
It is different or different from each other, in invention is not limited thereto, only trench depth h1, h2, h3 of each groove 141a, 141b, 241c
Greater than corresponding maximum groove width t1, t2, t3.
In some embodiments, on the extending direction 141y of groove 141, in two adjacent micro- light-emitting diodes
Multiple grooves 141 between 130 can have different trench lengths.For example, as shown in Figure 2 A, in extending direction
On 141y, third groove 241c can be to be continuous (that is, running through flexible base board shown by Fig. 2A on extending direction 141y
110 ranges) groove, and first groove 141a and second groove 141b can be discontinuous groove.In other words, third groove
The trench length (do not indicate, but be greater than 110 range of flexible base board shown by Fig. 2A on extending direction 141y) of 241c is greater than
The trench length L4 of the trench length L3 and second groove 141b of first groove 141a.
Fig. 3 is shown according to a kind of part section of micro- light emitting display device of flexibility of the third embodiment of the present invention
It is intended to.It should be noted that, the embodiment of Fig. 3 continues to use the element numbers and partial content of the embodiment of Figure 1A to Fig. 1 C herein,
Identical or approximate element is wherein indicated using identical or approximate label, and the explanation of same technique content is omitted,
Explanation about clipped can refer to previous embodiment, and following embodiment will not be repeated herein.It indicates for clarity, Fig. 3 institute
The part section of the micro- light emitting display device 300 of flexibility shown can be corresponding to the region R1 in Figure 1B.
Referring to figure 3., the micro- light emitting display device 300 of the flexibility of 3rd embodiment and the difference of first embodiment exist
In, in the normal direction of the base plan 110a (being illustrated in Figure 1B) of flexible base board 110 (being illustrated in Figure 1B), multiple grooves
341 change width is to be incremented by by the surface 140a of encapsulated layer 140 towards on the direction of flexible base board 110.For example, groove
341 section shape is e.g. trapezoidal, but invention is not limited thereto.
Fig. 4 is shown according to a kind of part section of micro- light emitting display device of flexibility of the fourth embodiment of the present invention
It is intended to.It should be noted that, the embodiment of Fig. 4 continues to use the element numbers and partial content of the embodiment of Figure 1A to Fig. 1 C herein,
Identical or approximate element is wherein indicated using identical or approximate label, and the explanation of same technique content is omitted,
Explanation about clipped can refer to previous embodiment, and following embodiment will not be repeated herein.
Referring to figure 4., the micro- light emitting display device 400 of flexibility of fourth embodiment and the flexibility of first embodiment are micro-
Light emitting display device 100 the difference is that: flexible micro- light emitting display device 400 further includes elastic layer 400.Elasticity
Layer 400 is located on encapsulated layer 140 and is filled in multiple grooves 141, and the Young's modulus of elastic layer 400 is less than encapsulated layer 140
Young's modulus, elastic layer be, for example, solid rubber, blown rubber, soft rubber, photoresist or combinations thereof or other be suitable for
Transparent material.Stress can be further absorbed by the configuration of elastic layer 400, promotes the reliability of product.
Fig. 5 A is regarded on part according to a kind of micro- light emitting display device of flexibility of the fifth embodiment of the present invention
Schematic diagram.Fig. 5 B is the sectional view of the C-C ' hatching line along Fig. 5 A.It should be noted that, the embodiment of Fig. 5 A to Fig. 5 B is continued to use herein
The element numbers and partial content of the embodiment of Figure 1A to Fig. 1 C, wherein being indicated using identical or approximate label identical or close
As element, and the explanation of same technique content is omitted, the explanation about clipped can refer to previous embodiment, following
It is no longer repeated for embodiment.
A and Fig. 5 B referring to figure 5., the micro- light emitting display device 500 of flexibility and first embodiment of the 5th embodiment
The micro- light emitting display device 100 of flexibility the difference is that: flexible micro- light emitting display device 500 includes the first signal
Line 150a and second signal line 150b.First signal wire 150a is at least partly be overlapped with first groove 141a, and the first signal wire
150a is electrically connected with corresponding active component 120.Second signal line 150b is at least partly be overlapped with second groove 141b.At this
In embodiment, the first signal wire 150a is for example, electrically connected to a data line of active component 120, and second signal line 150b
It can be another data line for being electrically connected to another active component (not shown), however, the present invention is not limited thereto.In other implementations
In example, second signal line 150b can be scan line, and second signal line 150b can be electrically connected to the grid of active component 120
Pole GE.In other feasible embodiments, second signal line 150b can on flexible micro- light emitting display device 500 its
The conducting wire of his electronic component.
Fig. 6 A is regarded on part according to a kind of micro- light emitting display device of flexibility of the sixth embodiment of the present invention
Schematic diagram.Fig. 6 B is the sectional view of the D-D ' hatching line along Fig. 6 A.It should be noted that, the embodiment of Fig. 6 A to Fig. 6 B is continued to use herein
The element numbers and partial content of the embodiment of Fig. 5 A to Fig. 5 B, wherein being indicated using identical or approximate label identical or close
As element, and the explanation of same technique content is omitted, the explanation about clipped can refer to previous embodiment, following
It is no longer repeated for embodiment.
Fig. 6 A and Fig. 6 B is please referred to, the micro- light emitting display device 600 of the flexibility of sixth embodiment and flexibility are micro- luminous
Diode display 500 the difference is that: flexible micro- light emitting display device 600 further includes third groove 641c, and the
Three groove 641c are between first groove 141a and second groove 141b.In other feasible embodiments, by the first letter
Number line 150a is at least partly be overlapped with first groove 141a, and second signal line 150b is at least partly be overlapped with second groove 141b,
Can more effective dispersive stress, to be effectively reduced the first signal wire 150a of flexible micro- light emitting display device 600
And/or the possibility of second signal line 150b fracture or removing.
The micro- light emitting display device of flexibility disclosed by the invention, by two neighboring micro- light-emitting diode it
Between the configuration with an at least groove, have preferably flexible.In addition, it is less than the package thickness of encapsulated layer by trench depth, with
The possibility that encapsulated layer is removed or micro- light-emitting diode is impaired is reduced, it is reliable to promote flexible micro- light emitting display device
Degree.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (15)
1. a kind of micro- light emitting display device of flexibility characterized by comprising
Multiple pixel units are set on a flexible base board；
Multiple active components are set on the flexible base board；
Multiple micro- light-emitting diodes, be located at the flexible base board on, and this slightly light-emitting diode respectively with it is corresponding
Those active components be electrically connected, and respectively the pixel unit include at least one those active components and at least one this slightly shine
Diode element；
One encapsulated layer covers the light-emitting diode slightly, which has a first surface, and wherein the first surface is remote
From the flexible base board；And
An at least groove has an extending direction, which is set to the first surface of the encapsulated layer, this at least one
For groove in having a trench depth on a upright projection direction, which is less than the encapsulated layer on the upright projection direction
A thickness, which is arranged between two those adjacent pixel units, in this is at least on the upright projection direction
One groove and the light-emitting diode and those active components slightly be not be overlapped.
2. micro- light emitting display device as described in claim 1 flexible, which is characterized in that including an at least signal wire,
It is arranged between two those adjacent pixel units.
3. micro- light emitting display device as claimed in claim 2 flexible, which is characterized in that wherein this at least a groove is
Multiple grooves, and those grooves include a first groove and a second groove, the wherein first groove and the second groove,
Be arranged between two those adjacent pixel units, and an at least signal wire be located at the first groove and the second groove it
Between.
4. flexible micro- light emitting display device as claimed in claim 3, which is characterized in that wherein those grooves further include
One third groove, between the first groove and the second groove, and an at least signal wire is Chong Die with the third groove.
5. flexible micro- light emitting display device as claimed in claim 3, which is characterized in that a wherein at least signal wire
For a plurality of signal wire, and those signal wires further include one first signal wire and a second signal line, first signal wire and this
One groove is at least partly overlapped, and the second signal line is at least partly be overlapped with the second groove.
6. Flexible light-emitting diodes display device as claimed in claim 5, which is characterized in that wherein those grooves further include one
Third groove, between the first groove and the second groove.
7. the micro- light emitting display device of flexibility as described in claim 4,6, which is characterized in that wherein the first groove,
The second groove and the third groove are in being respectively provided with one first depth, one second depth and one the on the upright projection direction
Three depth, the first groove, the second groove and the third groove are between two those adjacent pixel units and the third
Groove is located between the first groove and the second groove, which is greater than first depth and second depth.
8. micro- light emitting display device as claimed in claim 7 flexible, which is characterized in that wherein first depth with should
Second deep equality.
9. micro- light emitting display device as described in claim 1 flexible, which is characterized in that wherein respectively the groove in vertical
There is a maximum groove width, respectively micro- light-emitting diode is in having unitary on the vertical extending direction on the extending direction
Part width, this has a shortest distance slightly between light-emitting diode and those grooves, which is greater than the element
Width, and the element width is greater than the maximum groove width.
10. flexible micro- light emitting display device as described in claim 1, which is characterized in that a wherein at least groove
In having a maximum groove width on the vertical extending direction, and the trench depth is greater than the maximum groove width.
11. micro- light emitting display device as described in claim 1 flexible, which is characterized in that wherein the encapsulated layer should
Thickness be greater than 30 microns and be less than or equal to 300 microns, and this light-emitting diode has on the upright projection direction slightly
One component thickness, the component thickness are greater than 4 microns and are less than or equal to 30 microns.
12. flexible micro- light emitting display device as described in claim 1, which is characterized in that wherein the flexibility is micro- shines
Diode display has a flexible direction, and the flexibility direction is perpendicular to the extending direction of an at least groove.
13. flexible micro- light emitting display device as described in claim 1, which is characterized in that a wherein at least groove
For multiple grooves, and at least two in those grooves are different in the length on the extending direction.
14. flexible micro- light emitting display device as described in claim 1, which is characterized in that the wherein poplar of the encapsulated layer
Family name's modulus is less than the Young's modulus of the flexible base board.
15. flexible micro- light emitting display device as claimed in claim 13, which is characterized in that further include:
Posterior limiting is set on the encapsulated layer and is filled in those grooves, and the Young's modulus of the elastic layer is less than the envelope
Fill the Young's modulus of layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107118243 | 2018-05-29 | ||
| TW107118243A TWI681555B (en) | 2018-05-29 | 2018-05-29 | Flexible micro led display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037269A true CN109037269A (en) | 2018-12-18 |
| CN109037269B CN109037269B (en) | 2021-01-15 |
Family
ID=64644856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810822594.2A Active CN109037269B (en) | 2018-05-29 | 2018-07-24 | Flexible micro light-emitting diode display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109037269B (en) |
| TW (1) | TWI681555B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103150965A (en) * | 2012-11-16 | 2013-06-12 | 友达光电股份有限公司 | Flexible display panel |
| CN204333042U (en) * | 2014-12-24 | 2015-05-13 | 上海天马有机发光显示技术有限公司 | A kind of organic light-emitting diode packaging structure and organic electroluminescence display panel |
| CN106784377A (en) * | 2016-12-28 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | A kind of preparation method of flexible display panels, display device and flexible display panels |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI363891B (en) * | 2006-11-14 | 2012-05-11 | Lg Display Co Ltd | Manufacturing method of the flexible display device |
| TWI426480B (en) * | 2010-07-05 | 2014-02-11 | Univ Nat Changhua Education | Display apparatus and manufacturing method thereof |
| US8514474B2 (en) * | 2011-08-30 | 2013-08-20 | Delta Electronics, Inc. | Three-dimensional display device |
| CN105453697B (en) * | 2013-08-14 | 2018-04-17 | 吉坤日矿日石能源株式会社 | The manufacture method of light-emitting component and light-emitting component |
| TW201701459A (en) * | 2015-06-24 | 2017-01-01 | 正昌新視界有限公司 | A flexible LED display |
| TWI581226B (en) * | 2015-12-25 | 2017-05-01 | 正昌新視界股份有限公司 | A flexible led display |
-
2018
- 2018-05-29 TW TW107118243A patent/TWI681555B/en active
- 2018-07-24 CN CN201810822594.2A patent/CN109037269B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103150965A (en) * | 2012-11-16 | 2013-06-12 | 友达光电股份有限公司 | Flexible display panel |
| CN204333042U (en) * | 2014-12-24 | 2015-05-13 | 上海天马有机发光显示技术有限公司 | A kind of organic light-emitting diode packaging structure and organic electroluminescence display panel |
| CN106784377A (en) * | 2016-12-28 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | A kind of preparation method of flexible display panels, display device and flexible display panels |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202005075A (en) | 2020-01-16 |
| TWI681555B (en) | 2020-01-01 |
| CN109037269B (en) | 2021-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101864563B1 (en) | Flexible display device with wire having reinforced portion and manufacturing method for the same | |
| KR102234317B1 (en) | Flexible display device including folding area | |
| TWI574094B (en) | Display panel | |
| US20170207249A1 (en) | Display device using semiconductor light emitting device | |
| KR20190013434A (en) | Tile display devices and dispay devices | |
| US20210273131A1 (en) | Method of aligning light emitting elements and method of manufacturing display device using the same | |
| KR20160130921A (en) | Touch panel and method for manufacturing the same | |
| TW202127653A (en) | Display apparatus | |
| CN104898322A (en) | Display device and driving method thereof | |
| US20220039697A1 (en) | Detection device | |
| TW202011629A (en) | MicroLED display panel | |
| KR20190099149A (en) | Display device using micro-led | |
| KR20230047339A (en) | Wiring film and display device including the same | |
| PH12019000058A1 (en) | Display device | |
| US11600221B2 (en) | Display apparatus | |
| WO2021212560A1 (en) | Detection device and detection method | |
| US11587880B2 (en) | Electronic device | |
| CN109037269A (en) | Flexible micro light-emitting diode display device | |
| JP7054802B2 (en) | How to mount display board and LED element | |
| TWM546017U (en) | A flexible LED display | |
| CN116456747A (en) | Heat dissipation layer and flexible display device comprising same | |
| US11869416B2 (en) | Display device using semiconductor light-emitting element | |
| TWI717871B (en) | Display apparatus | |
| TW201739043A (en) | A flexible LED display | |
| KR20190122156A (en) | Electronic Device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |