TW202004120A - Measurement system and measurement method - Google Patents
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本發明是有關於一種光學元件的測量系統及測量方法。The invention relates to a measurement system and a measurement method of an optical element.
隨著科技產業日益發達,光學裝置的型態、使用功能以及使用方式越來越多元,光學元件的使用及搭配也來越廣泛。此外,由於光學裝置的微型化趨勢,所使用及搭配的光學元件也需微型化。因此,需要透過精密的儀器測量光學元件以維持較佳的光學品質。With the development of the technology industry, the types, functions and methods of optical devices are becoming more and more diverse, and the use and matching of optical components are becoming more and more extensive. In addition, due to the trend of miniaturization of optical devices, the optical components used and matched also need to be miniaturized. Therefore, it is necessary to measure optical components through precise instruments to maintain better optical quality.
然而,在現今的測量技術中,主要是以破壞性的測量方式測量光學元件,例如是將光學元件加工切成直角形狀以進行光學測量,因此將導致光學元件的浪費。而在現今的測量技術中,常以多個光源作為測量光。因此將導致測量儀器過於複雜且成本居高不下。除此之外,亦有光學校正困難的問題。因此,如何設計出較簡易且不消耗光學元件的測量儀器及其使用方法,是本領域通常知識者共同致力於發展的。However, in today's measurement technology, the optical element is mainly measured by a destructive measurement method, for example, the optical element is processed and cut into a right-angle shape for optical measurement, so that the optical element will be wasted. In today's measurement technology, multiple light sources are often used as measurement light. As a result, the measuring instruments are too complicated and the cost is high. In addition to this, there is also the problem of difficulty in optical correction. Therefore, how to design a measuring instrument that is relatively simple and does not consume optical elements and how to use it are commonly devised by those skilled in the art.
本發明提供一種測量系統及測量方法,可進行快速的光學測量且可使架構簡化並降低其花費成本,並可解決傳統測量方式需要破壞待測物以進行測量的問題。The invention provides a measurement system and a measurement method, which can perform rapid optical measurement and can simplify the structure and reduce its cost, and can solve the problem that the traditional measurement method needs to destroy the object to be measured for measurement.
本發明的一實施例提供一種測量系統,適於測量一待測物。測量系統包括光源、兩分光元件、導光裝置以及兩感測元件。兩分光元件的其中一者設於光源的光路下游。導光裝置設於兩分光元件的其中一者的第一光路下游。兩分光元件的其中另一者設於導光裝置的第一光路下游。兩感測元件的其中一者設於兩分光元件的其中一者的第二光路下游。兩感測元件的其中另一者設於兩分光元件的其中另一者的第一光路下游。因此,測量系統可藉由使用單一光源對待測物的兩面進行快速的光學測量以確認其光學性質。An embodiment of the present invention provides a measurement system suitable for measuring an object to be measured. The measurement system includes a light source, two beam splitting elements, a light guide device, and two sensing elements. One of the two dichroic elements is located downstream of the light path of the light source. The light guide device is provided downstream of the first optical path of one of the two beam splitting elements. The other of the two beam splitting elements is located downstream of the first optical path of the light guide device. One of the two sensing elements is located downstream of the second optical path of one of the two beam splitting elements. The other of the two sensing elements is disposed downstream of the first optical path of the other of the two beam splitting elements. Therefore, the measurement system can confirm the optical properties by using a single light source to perform rapid optical measurements on both sides of the object to be measured.
本發明的另一實施例提供一種測量方法,適於一待測物。測量方法包括下列步驟:首先,提供測量系統的第一光束及第二光束至待測物的相對第一面及第二面。接著,偵測待測物所反射的第一光束及第二光束以得出第一面及第二面的兩第一聚焦座標。最後,依據兩第一聚焦座標計算出待測物的形狀厚度。Another embodiment of the present invention provides a measurement method suitable for an object to be measured. The measurement method includes the following steps: First, provide the first beam and the second beam of the measurement system to the opposite first and second surfaces of the object to be measured. Then, the first light beam and the second light beam reflected by the object to be detected are detected to obtain two first focus coordinates of the first surface and the second surface. Finally, the shape thickness of the object to be measured is calculated based on the two first focus coordinates.
基於上述,在本發明的測量系統及測量方法中,測量系統可藉由分光元件將單一光源所發出的光束分成第一光束及第二光束,並分別於待測物的第一面及第二面的聚焦而得出第一面及第二面的聚焦位置,進而由聚焦位置資訊計算得出待測物的光學資訊。如此一來,在本實施例中,測量系統僅使用單一光源即可對待測物的相對兩面進行快速的光學測量以確認其光學性質,且可使測量系統的架構簡化並降低其花費成本。除此之外,可解決傳統測量方式需要破壞待測物以進行測量的問題。Based on the above, in the measurement system and measurement method of the present invention, the measurement system can divide the light beam emitted by the single light source into the first light beam and the second light beam by the spectroscopic element, and respectively on the first surface and the second surface of the object to be measured Focus the surface to get the focus position of the first surface and the second surface, and then calculate the optical information of the test object from the focus position information. In this way, in this embodiment, the measurement system uses only a single light source to perform rapid optical measurement on the opposite sides of the object to confirm its optical properties, and can simplify the structure of the measurement system and reduce its cost. In addition, it can solve the problem that the traditional measurement method needs to destroy the object to be measured.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.
圖1為本發明一實施例的測量系統的示意圖。請參考圖1,在本實施例中,測量系統100適於測量待測物10,待測物10例如為雙凹透鏡、雙凸透鏡、凹凸透鏡、凸凹透鏡、平凸透鏡或平凹透鏡等非平面鏡片、稜鏡或積分柱等表面具有曲率的光學元件,本發明並不限於此。在本實施例中,待測物10例如為雙凸透鏡。FIG. 1 is a schematic diagram of a measurement system according to an embodiment of the invention. Please refer to FIG. 1. In this embodiment, the
測量系統100包括光源110、分光元件120、130、感測元件140、150以及導光裝置180_1、180_2。The
光源110為可發出光束L的電子裝置,例如是雷射裝置(Laser device),然而本發明並不限定其種類。The
分光元件120、130為可針對光束L進行部分反射及部分透射的光學元件,例如是分光鏡(beam splitter)。在本實施例中,分光元件120、130例如是採用透射率介於40%至60%的分光鏡。在較佳的實施例中,分光鏡的透射率約為50%,但本發明並不限於此。The
感測元件140、150為可偵測光強度的電子裝置,例如是光感測器(photo detector)。The
導光裝置180_1、180_2可以是任意能引導光束L沿指定方向傳遞的裝置或光學元件。在本實施例中,導光裝置180_1、180_2例如是兩反射鏡,但本發明亦不限於此。The light guide devices 180_1, 180_2 may be any device or optical element that can guide the light beam L to be transmitted in a specified direction. In this embodiment, the light guide devices 180_1 and 180_2 are, for example, two mirrors, but the invention is not limited thereto.
除此之外,更具體而言,本實施例的測量系統100還包括了用於聚焦光束的物鏡170_1、170_2、170_3、170_4,但本發明不限於此,對於其數量、型態及種類亦不加以限制。In addition, more specifically, the
在本實施例中,光源110提供一光束L。分光元件120設於光源110的光路下游。導光裝置180_1、180_2,設於分光元件120的第一光路下游。分光元件130,設於導光裝置180_1、180_2的第一光路下游。感測元件140設於分光元件120的第二光路下游。感測元件150設於分光元件130的第一光路下游,如圖1所繪示。In this embodiment, the
詳細而言,在本實施例中,光源110所提供的光束L傳遞至分光元件120時,由分光元件120分成第一光束L1及第二光束L2。物鏡170_1位於分光元件120與待測物10之間,用以將分光元件120所傳遞的第二光束L2聚焦於待測物10上。物鏡170_2位於分光元件120與感測元件140之間,用以將被待測物10反射的第二光束L2聚焦於感測元件140上。物鏡170_3位於分光元件130與待測物10之間,用以將分光元件130所傳遞的第一光束L1聚焦於待測物10上。物鏡170_4位於分光元件130與感測元件150之間,用以將被待測物10反射的第一光束L1聚焦於感測元件150上。導光裝置180_1、180_2則位於分光元件120與130之間,用以將分光元件120所傳遞的第一光束L1反射至分光元件130。In detail, in this embodiment, when the light beam L provided by the
在測量開始之前,可以標準治具或影像判別校正方式校正待測物10與測量系統100的光軸,但本發明並不限於此。Before the measurement starts, the optical axis of the object to be measured 10 and the
圖2為本發明一實施例測量待測物的示意圖。請同時參考圖1及圖2,在本實施例的測量過程中,可進行下列測量步驟,以測得待測物10的一形狀厚度。形狀厚度即是指單一物件外型的實際厚度。具體而言,光源110提供一光束L至分光元件120,且光束L在分光元件120中透射及反射以分別形成第一光束L1以及第二光束L2。第一光束L1由分光元件120的透射傳遞經導光裝置180_1、180_2反射至分光元件130,接著經分光元件130反射至物鏡170_3,並藉由物鏡170_3聚焦在待測物10的第一面S1上(即焦點C1)。另一方面,第二光束L2經分光元件120反射至物鏡170_1,並藉由物鏡170_1聚焦在待測物10的第二面S2上(即焦點C2)。FIG. 2 is a schematic diagram of measuring a test object according to an embodiment of the invention. Please refer to FIGS. 1 and 2 at the same time. During the measurement process of this embodiment, the following measurement steps may be performed to measure a shape thickness of the
在第一光束L1及第二光束L2分別聚焦至待測物10的第一面S1及第二面S2之後,第一光束L1經待測物10的第一面S1反射回物鏡170_3,並透射分光元件130至物鏡170_4,最後經由物鏡170_4聚焦至感測元件150。第二光束L2則經待測物10的第二面S2反射回物鏡170_1,並透射分光元件120至物鏡170_2,最後經由物鏡170_2聚焦至感測元件140,如圖1所繪示。After the first light beam L1 and the second light beam L2 are focused on the first surface S1 and the second surface S2 of the
因此,在上述的測量步驟中,可藉由第一光束L1及第二光束L2分別於待測物10的第一面S1及第二面S2的聚焦而得出第一面S1及第二面S2的聚焦位置,進而由聚焦位置資訊計算得出待測物10的形狀厚度。如此一來,在本實施例中,測量系統100僅使用單一光源110即可對待測物10的相對兩面進行快速的光學測量以確認其形狀厚度,且可使測量系統100的架構簡化並降低其花費成本。除此之外,由於不需要破壞待測物10即可進行測量,因此可測量直徑小於10毫米的待測物10。Therefore, in the above measurement step, the first surface S1 and the second surface can be obtained by focusing the first light beam L1 and the second light beam L2 on the first surface S1 and the second surface S2 of the
在本實施例中,測量系統100還可包括一移動平台160,配置於分光元件120與130之間。移動平台160例如為可一維、二維或三維移動的平台裝置以及用以固定待測物10的結構,例如是光學元件固定架搭配可移動的光學平台(stage),但本發明並不限於此。待測物10藉由移動平台160記錄其移動的位置為座標資訊。具體而言,在上述的測量過程中,移動待測物10以使第一光束L1在第一面S1上聚焦及移動待測物10以使第二光束L2在第二面S2上聚焦,以紀錄第一面S1的位置及第二面S2的位置為兩第一聚焦座標,進而透過計算得出待測物的形狀厚度。然而,在其他實施例中,用以移動待測物10的裝置亦可由額外的治具所提供,本發明並不限於此。In this embodiment, the
此外,在上述的測量步驟之後,可針對已知形狀厚度的一參考物進行上述的測量步驟,進而得出第一光束L1及第二光束L2在參考物相對兩面上聚焦的兩第一聚焦座標,並藉由待測物10與參考物的兩第一聚焦座標差異值計算得出待測物10的形狀厚度,但本發明並不限於此。In addition, after the above measurement step, the above measurement step can be performed on a reference object with a known shape and thickness, thereby obtaining two first focus coordinates where the first light beam L1 and the second light beam L2 are focused on opposite sides of the reference object , And the shape thickness of the object to be measured 10 is calculated by the difference between the two first focus coordinates of the object to be measured 10 and the reference object, but the invention is not limited thereto.
圖3為本發明另一實施例測量待測物的示意圖。請同時參考圖1及圖3,在本實施例的測量過程中,可在得出待測物10的形狀厚度之後進行後續的測量步驟,以進一步測得待測物10的材質厚度。材質厚度是指光束在待測物10中行進,受待測物10的折射率影響而量測到的厚度,材質厚度會與形狀厚度有所差異。具體而言,使用光源110所提供的第一光束L1以在待測物10的第一面S1上形成聚焦點(即焦點C1),並且移動待測物10朝物鏡170_3以使第一光束L1的聚焦處由待測物10的第一面S1轉移至待測物10的第二面S2(即焦點C2)。因此,感測元件150可偵測待測物10所反射的第一光束L1以得出第一面S1及第二面S2的兩第二聚焦座標。FIG. 3 is a schematic diagram of measuring a test object according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 3 at the same time. In the measurement process of this embodiment, subsequent measurement steps may be performed after the shape and thickness of the
如此一來,可在上述的測量步驟中,藉由第一光束L1分別於待測物10的第一面S1及第二面S2的聚焦而得出第一面S1及第二面S2的聚焦位置,進而由聚焦位置資訊計算得出待測物10的材質厚度。在此步驟中,亦可藉由與參考物的材質厚度比較而計算出待測物10的材質厚度,其厚度差異的比較方式類似於前述測量步驟的比較方式,故在此不加以贅述。In this way, the focus of the first surface S1 and the second surface S2 can be obtained by focusing the first light beam L1 on the first surface S1 and the second surface S2 of the
圖4為本發明另一實施例測量待測物的示意圖。請同時參考圖1及圖4,在本實施例的測量過程中,可在得出待測物10的材質厚度之後進行後續的測量步驟,以進一步測得待測物10其中一面的一曲率半徑。具體而言,使用光源110所提供的第一光束L1並移動待測物10以使一聚焦元件的球心重合於待測物10第一面S1的球心R。當聚焦元件與待測物10的球心重合時,第一光束L1將在待測物10的第一面S1上產生全反射。在本實施例中,聚焦元件即為物鏡170_3,但在其他實施例中,亦可額外配置已知曲率半徑的聚焦元件進行測量,本發明並不限於此。FIG. 4 is a schematic diagram of measuring a test object according to another embodiment of the present invention. Please refer to FIGS. 1 and 4 at the same time. In the measurement process of this embodiment, subsequent measurement steps may be performed after the material thickness of the
如此一來,可在上述的測量步驟中,藉由待測物10所反射的第一光束L1以得出第一面S1的位置,進而由反射位置資訊計算得出待測物10的曲率半徑。待測物10的曲率半徑與聚焦元件的曲率半徑差異的比較方式類似於前述測量步驟的比較方式,故在此不加以贅述。In this way, in the above measurement step, the position of the first surface S1 can be obtained by the first beam L1 reflected by the object to be measured 10, and then the radius of curvature of the object to be measured 10 can be calculated from the reflected position information . The comparison method of the difference between the curvature radius of the object to be measured 10 and the curvature radius of the focusing element is similar to the comparison method of the foregoing measurement steps, so it will not be repeated here.
除此之外,本實施例還可進一步依據上述三種測量步驟所得出的形狀厚度、材質厚度以及曲率半徑透過公式計算求得待測物10的折射率。具體而言,折射率可依下列公式(1)定義得出:-----------------------------(1) 其中: n0 :空氣的折射率; n:待測物的折射率; l1 :待測物的形狀厚度; l2 :待測物的材質厚度; r:待測物的第一面的曲率半徑。In addition, in this embodiment, the refractive index of the object to be measured 10 can be further calculated according to the shape thickness, material thickness and curvature radius obtained by the above three measurement steps through formula calculation. Specifically, the refractive index can be defined according to the following formula (1): -----------------------------(1) where: n 0 : refractive index of air; n: refractive index of the object to be measured ; L 1 : shape and thickness of the object to be measured; l 2 : material thickness of the object to be measured; r: radius of curvature of the first surface of the object to be measured
如此一來,在本實施例上述的三種不同測量步驟中,測量系統100僅使用單一光源110即可測量待測物10進行快速的光學測量以確認其光學性質,進而得出待測物10的形狀厚度、材質厚度、曲率半徑以及其折射率,並且可使測量系統100的架構簡化並降低其花費成本。In this way, in the above-mentioned three different measurement steps in this embodiment, the
除了上述測量步驟之外,本實施例的光源110還可進一步更換以提供不同波長的另一光束進行光學測量。具體而言,即分別提供第一光束L1及另一光束(未繪示)以在待測物10的第一面S1上形成聚焦點(即焦點C1),並且在不同波長光束下移動待測物10朝物鏡170_3以使聚焦處由待測物10的第一面S1轉移至待測物10的第二面S2(即焦點C2),進而求得待測物10在不同波長光束下的兩材質厚度。因此,可據此量測方法計算出待測物10的阿貝數值。In addition to the above measurement steps, the
除了上述測量步驟之外,本實施例的測量系統還可進一步掛載溫控模組,配置於待測物10,以改變待測物10的溫度。舉例而言,溫控模組例如是可加熱的電子裝置、熱管或其他各種形式的加熱裝置,本發明並不限於此。如此一來,可在待測物10於不同溫度的情況下進行上述的光學測量,進而可求得出待測物10在不同溫度下的折射率變化值。In addition to the above measurement steps, the measurement system of this embodiment may further mount a temperature control module, which is disposed on the
圖5為本發明一實施例的測量方法的步驟流程圖。請參考圖1及圖5,本實施例的測量方法至少可應用於圖1的測量裝置100,故以下將以圖1的實施例的測量裝置100舉例,但本發明並不限於此。在本實施例中,首先進行步驟S500,提供測量系統100的第一光束L1及第二光束L2至待測物10的相對第一面S1及第二面S2。接著,進行步驟S510,偵測待測物10所反射的第一光束L1及第二光束L2以得出第一面S1及第二面S2的兩第一聚焦座標。接著,進行步驟S520,依據兩第一聚焦座標計算出待測物10的形狀厚度。如此一來,可藉由上述測量步驟求得待測物10的形狀厚度。FIG. 5 is a flowchart of steps of a measurement method according to an embodiment of the invention. Please refer to FIGS. 1 and 5. The measurement method of this embodiment can be applied to at least the
在完成上述步驟S520後,使用者可視需求選擇性地繼續進行步驟S530,提供第一光束L1並移動待測物10以使第一光束L1的聚焦處由待測物10的第一面S1轉移至待測物10的第二面S2。接著,進行步驟S540,偵測待測物10所反射的第一光束L1以得出第一面S1及第二面S2的兩第二聚焦座標。接著,進行步驟S550,依據兩第二聚焦座標計算出待測物10的材質厚度。如此一來,可藉由上述測量步驟求得待測物10的材質厚度。After completing the above step S520, the user can selectively continue to step S530 according to needs, provide the first light beam L1 and move the
在完成上述步驟S550後,使用者可視需求選擇性地繼續進行步驟S560,提供第一光束L1並移動待測物10以使聚焦元件(即物鏡170_1或物鏡170_3)的球心重合於第一面S1的球心。接著,進行步驟S570,偵測待測物10所反射的第一光束L1以得出第一面S1的曲率半徑。如此一來,可藉由上述測量步驟求得待測物10其中一面的曲率半徑。After completing the above step S550, the user can selectively continue to step S560 according to needs, providing the first light beam L1 and moving the object to be measured 10 so that the spherical center of the focusing element (ie, objective lens 170_1 or objective lens 170_3) coincides with the first surface The heart of S1. Next, step S570 is performed to detect the first light beam L1 reflected by the
在完成上述步驟S570後,使用者可視需求選擇性地繼續進行步驟S580,依據待測物10的形狀厚度及材質厚度以及第一面S1的曲率半徑得出待測物10的折射率值。換句話說,即是以步驟S520、步驟S550以及步驟S570所求得的待測物10光學資訊進行上述公式(1)的運算而得出待測物10的折射率值。After completing the above step S570, the user can selectively continue to step S580 according to needs, and obtain the refractive index value of the
綜上所述,在本發明的測量系統及測量方法中,測量系統可藉由分光元件將單一光源所發出的光束分成第一光束及第二光束分別於待測物的第一面及第二面的聚焦而得出第一面及第二面的聚焦位置,進而由聚焦位置資訊計算得出待測物的光學資訊。如此一來,在本實施例中,測量系統僅使用單一光源即可對待測物的相對兩面進行快速的光學測量以確認其光學性質,且可使測量系統的架構簡化並降低其花費成本。除此之外,可解決傳統測量方式需要破壞待測物以進行測量的問題。In summary, in the measurement system and the measurement method of the present invention, the measurement system can divide the light beam emitted by a single light source into the first light beam and the second light beam by the beam splitter on the first surface and the second surface of the object to be measured, respectively Focus the surface to get the focus position of the first surface and the second surface, and then calculate the optical information of the test object from the focus position information. In this way, in this embodiment, the measurement system uses only a single light source to perform rapid optical measurement on the opposite sides of the object to confirm its optical properties, and can simplify the structure of the measurement system and reduce its cost. In addition, it can solve the problem that the traditional measurement method needs to destroy the object to be measured.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
10‧‧‧待測物100‧‧‧測量系統110‧‧‧光源120、130‧‧‧分光元件140、150‧‧‧感測元件160‧‧‧移動平台170_1、170_2、170_3、170_4‧‧‧物鏡180_1、180_2‧‧‧導光裝置C1、C2‧‧‧焦點L‧‧‧光束L1‧‧‧第一光束L2‧‧‧第二光束R‧‧‧球心S1‧‧‧第一面S2‧‧‧第二面S500、S510、S520、S530、S540、S550、S560、S570、S580‧‧‧步驟10‧‧‧Object to be measured 100‧‧‧
圖1為本發明一實施例的測量系統的示意圖。 圖2為本發明一實施例測量待測物的示意圖。 圖3為本發明另一實施例測量待測物的示意圖。 圖4為本發明另一實施例測量待測物的示意圖。 圖5為本發明一實施例的測量方法的步驟流程圖。FIG. 1 is a schematic diagram of a measurement system according to an embodiment of the invention. FIG. 2 is a schematic diagram of measuring a test object according to an embodiment of the invention. FIG. 3 is a schematic diagram of measuring a test object according to another embodiment of the present invention. FIG. 4 is a schematic diagram of measuring a test object according to another embodiment of the present invention. FIG. 5 is a flowchart of steps of a measurement method according to an embodiment of the invention.
10‧‧‧待測物 10‧‧‧ test object
100‧‧‧測量系統 100‧‧‧Measurement system
110‧‧‧光源 110‧‧‧Light source
120、130‧‧‧分光元件 120、130‧‧‧Split element
140、150‧‧‧感測元件 140, 150‧‧‧ sensing element
160‧‧‧移動平台 160‧‧‧Mobile platform
170_1、170_2、170_3、170_4‧‧‧物鏡 170_1, 170_2, 170_3, 170_4‧‧‧‧Objective
180_1、180_2‧‧‧導光裝置 180_1, 180_2‧‧‧Light guide device
L‧‧‧光束 L‧‧‧beam
L1‧‧‧第一光束 L1‧‧‧First beam
L2‧‧‧第二光束 L2‧‧‧Second beam
S1‧‧‧第一面 S1‧‧‧The first side
S2‧‧‧第二面 S2‧‧‧Second side
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