TW201945298A - Apparatus and methods for processing material - Google Patents

Apparatus and methods for processing material Download PDF

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Publication number
TW201945298A
TW201945298A TW108109712A TW108109712A TW201945298A TW 201945298 A TW201945298 A TW 201945298A TW 108109712 A TW108109712 A TW 108109712A TW 108109712 A TW108109712 A TW 108109712A TW 201945298 A TW201945298 A TW 201945298A
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Taiwan
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block
electrode assembly
axis
blocks
along
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TW108109712A
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Chinese (zh)
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卡洛斯愛德華多 佛格
節森亞瑟 豪里
威廉巴歇爾 馬丁立三世
約翰艾契 美福德
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美商康寧公司
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Publication of TW201945298A publication Critical patent/TW201945298A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00Arrangement of elements for electric heating in or on furnaces
    • F27D11/02Ohmic resistance heating
    • F27D11/04Ohmic resistance heating with direct passage of current through the material being heated
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/02Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating
    • C03B5/027Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating by passing an electric current between electrodes immersed in the glass bath, i.e. by direct resistance heating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Glass Melting And Manufacturing (AREA)

Abstract

An electrode assembly includes a plurality of blocks stacked along a first axis. The plurality of blocks span a first distance along the first axis and a second distance along a second axis. The first distance and the second distance define a first face of the electrode assembly, and the plurality of blocks span a third distance from the first face of the electrode assembly to a second face of the electrode assembly along a third axis. A first dimension of a first block of the plurality of blocks is greater than a second dimension of a second block of the plurality of blocks. An apparatus includes the electrode assembly and a vessel. Methods of processing material in the vessel are also provided.

Description

用於處理材料的裝置及方法Device and method for processing materials

本案一般關於用於處理材料的裝置及方法,更特定而言,關於包括複數個塊的一種電極組件,包括電極組件及容器的一種裝置,以及用於處理容器中的材料的一種方法,包括向電極組件提供電能的步驟。This case generally relates to an apparatus and method for processing materials, and more particularly, to an electrode assembly including a plurality of blocks, an apparatus including an electrode assembly and a container, and a method for processing The step of providing electrical energy by the electrode assembly.

已知提供一玻璃製造裝置,其經設計以由一定量的熔融材料製造玻璃製品。習知的玻璃製造裝置包括熔爐,熔爐包括經設計以將批料處理(例如,熔化、加熱)成一定量的熔融材料的電極。It is known to provide a glass manufacturing apparatus that is designed to manufacture glass articles from a certain amount of molten material. Conventional glass manufacturing equipment includes a furnace that includes an electrode designed to process (eg, melt, heat) a batch into a quantity of molten material.

以下呈現了本案的簡化概述,以提供對詳細說明中所述的一些實施例的基本理解。A simplified overview of the case is presented below to provide a basic understanding of some embodiments described in the detailed description.

在一些實施例中,電極組件包括沿著第一軸在第一方向上堆疊的複數個塊。複數個塊沿著第一軸跨越第一距離,且沿著垂直於第一方向的第二方向上的第二軸跨越第二距離。第一距離與第二距離定義出電極組件的第一面,且複數個塊從電極組件的第一面到電極組件的第二面,沿著在與第一方向及第二方向垂直的第三方向上的第三軸,跨越第三距離。複數個塊中的一第一塊的沿著該第三軸從該第一塊的一第一端到該第一塊的一第二端而定義出的一第一尺寸,係大於複數個塊中的一第二塊的沿著該第三軸從該第二塊的一第一端到該第二塊的一第二端而定義出的一第二尺寸。In some embodiments, the electrode assembly includes a plurality of blocks stacked in a first direction along a first axis. The plurality of blocks span a first distance along a first axis and span a second distance along a second axis in a second direction perpendicular to the first direction. The first distance and the second distance define a first face of the electrode assembly, and a plurality of blocks from the first face of the electrode assembly to the second face of the electrode assembly, along a third party that is perpendicular to the first direction and the second direction A third upward axis, spanning a third distance. A first dimension of a first block of the plurality of blocks defined along a third axis from a first end of the first block to a second end of the first block is larger than the plurality of blocks A second dimension of one of the second blocks is defined along a third axis from a first end of the second block to a second end of the second block.

在一些實施例中,該第一塊的該第一端定義出該第一面的一第一部分,且該第二塊的該第一端定義出該第一面的一第二部分。In some embodiments, the first end of the first block defines a first portion of the first face, and the first end of the second block defines a second portion of the first face.

在一些實施例中,第一面定義出電極組件的平坦表面。In some embodiments, the first face defines a flat surface of the electrode assembly.

在一些實施例中,第一塊包括從該第一塊的第一端延伸到該第一塊的第二端的第一表面,並且第一表面定義出該第一塊的非平面邊界。In some embodiments, the first block includes a first surface extending from a first end of the first block to a second end of the first block, and the first surface defines a non-planar boundary of the first block.

在一些實施例中,第二塊包括從第二塊的第一端延伸到第二塊的第二端的第二表面,並且第一塊的第一表面的第一部分面向第二塊的第二表面的一部分。In some embodiments, the second block includes a second surface extending from a first end of the second block to a second end of the second block, and a first portion of the first surface of the first block faces the second surface of the second block. a part of.

在一些實施例中,第一塊的第一表面的第一部分在第一界面處鄰接第二塊的第二表面的一部分。In some embodiments, a first portion of a first surface of a first block abuts a portion of a second surface of a second block at a first interface.

在一些實施例中,該複數個塊中的一第三塊沿著該第三軸從該第三塊的一第一端到該第三塊的一第二端而定義出的第三尺寸係大於第二尺寸,且該第三塊的第一端面向該第二塊的第二端。In some embodiments, a third dimension of the plurality of blocks is defined along a third axis from a first end of the third block to a second end of the third block. It is larger than the second size, and the first end of the third block faces the second end of the second block.

在一些實施例中,第一尺寸等於第三尺寸。In some embodiments, the first size is equal to the third size.

在一些實施例中,第三塊包括從第三塊的第一端延伸到第三塊的第二端的第三表面,第三表面定義出第三塊的非平面邊界,以及第一塊的第二部分第一塊的表面面向第三塊的第三表面的一部分。In some embodiments, the third block includes a third surface extending from a first end of the third block to a second end of the third block, the third surface defines a non-planar boundary of the third block, and the third block of the first block The surface of the two-part first block faces a portion of the third surface of the third block.

在一些實施例中,第三塊的第一端在第二界面處鄰接第二塊的第二端,並且第一塊的第一表面的第二部分,在第三界面處,鄰接第三塊的第三表面的一部分。In some embodiments, the first end of the third block is adjacent to the second end of the second block at the second interface, and the second portion of the first surface of the first block is adjacent to the third block at the third interface. Part of the third surface.

在一些實施例中,電極組件還包括沿著第一軸與第二軸而外接複數個塊的第一框架。In some embodiments, the electrode assembly further includes a first frame surrounding a plurality of blocks along the first axis and the second axis.

在一些實施例中,第一框架係沿著第三軸為可移動。In some embodiments, the first frame is movable along a third axis.

在一些實施例中,第一框架沿著第一軸與第二軸中的至少一者對該複數個塊施加第一夾緊力。In some embodiments, the first frame applies a first clamping force to the plurality of blocks along at least one of the first axis and the second axis.

在一些實施例中,第一框架包括第一緊固件,該第一緊固件經導向以對第一夾緊力進行增大和減小中至少一個操作。In some embodiments, the first frame includes a first fastener that is guided to perform at least one of an increase and a decrease in the first clamping force.

在一些實施例中,電極組件包括沿著第一軸與第二軸而外接該複數個塊的第二框架。第二框架係沿著第三軸為可移動,第二框架沿著第一軸與第二軸中的至少一者對複數個塊施加第二夾緊力,第二框架包括第二緊固件,該第二緊固件經導向以對第二夾緊力進行增大和減小中至少一個操作。第一框架與第二框架可沿著第三軸獨立地移動。In some embodiments, the electrode assembly includes a second frame surrounding the plurality of blocks along the first axis and the second axis. The second frame is movable along a third axis, the second frame applies a second clamping force to a plurality of blocks along at least one of the first axis and the second axis, and the second frame includes a second fastener, The second fastener is guided to perform at least one of an increase and a decrease in the second clamping force. The first frame and the second frame are independently movable along a third axis.

在一些實施例中,一裝置包括電極組件及容器,該容器包括定義出該容器的一包封區域的至少一壁。該至少一壁包括定義出開口的一孔,該開口收納至少一部分的電極組件。In some embodiments, a device includes an electrode assembly and a container, and the container includes at least one wall defining an envelope region of the container. The at least one wall includes a hole defining an opening that receives at least a portion of the electrode assembly.

在一些實施例中,容器包括用於玻璃製造系統的熔化容器。In some embodiments, the container includes a melting container for a glass manufacturing system.

在一些實施例中,電極組件的位置係相對於壁的開口為可調整。In some embodiments, the position of the electrode assembly is adjustable relative to the opening of the wall.

在一些實施例中,一處理容器中的材料的方法包括向電極組件供應電能並用電能加熱容器的包封區域內的材料的步驟。In some embodiments, a method of processing material in a container includes the steps of supplying electrical energy to an electrode assembly and heating the material within an enclosed area of the container with electrical energy.

在一些實施例中,該方法包括在加熱材料的同時調節電極組件相對於壁的開口的位置的步驟。In some embodiments, the method includes the step of adjusting the position of the electrode assembly relative to the opening of the wall while heating the material.

接著將參考圖示出示例性實施例的圖式,在下文中更全面地描述實施例。儘可能地,在所有附圖中使用相同的元件符號來表示相同或相似的部分。然而,本案可以以許多不同的形式實現,並且不應該被解釋為限於本案所述的實施例。Reference will now be made to the drawings to illustrate exemplary embodiments, which are described more fully hereinafter. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. However, this case can be implemented in many different forms and should not be construed as being limited to the embodiments described in this case.

應理解,本案公開的具體實施例是示例性的,因此是非限制性的。出於本案的目的,在一些實施例中,玻璃製造裝置可任選地包括玻璃成形裝置,其由一定量的熔融材料來形成玻璃製品(例如,玻璃帶及/或玻璃板)。例如,在一些實施例中,玻璃製造裝置可任選地包括玻璃成形裝置,例如狹縫拉引裝置、浮選浴裝置、下拉裝置、上拉裝置、壓滾裝置、或其他能形成玻璃製品的玻璃成形裝置。在一些實施例中,玻璃製品可包括關於各種製品(例如,眼用的製品、顯示器製品)所需的一或多種光學特性。例如,在一些實施例中,玻璃製造裝置可用於提供可用於各種顯示器應用的顯示器製品(例如,顯示器玻璃板),包括但不限於,液晶顯示器(LCD)、電泳顯示器(EPD)、有機發光二極管顯示器(OLED)、電漿顯示板(PDP)、及其他電子顯示器。It should be understood that the specific embodiments disclosed herein are exemplary and therefore non-limiting. For the purposes of this case, in some embodiments, the glass manufacturing apparatus may optionally include a glass forming apparatus that forms a glass article (eg, a glass ribbon and / or a glass plate) from a certain amount of molten material. For example, in some embodiments, the glass manufacturing device may optionally include a glass forming device, such as a slot pull device, a flotation bath device, a pull-down device, a pull-up device, a roll-press device, or other glass-forming devices Glass forming device. In some embodiments, the glass article may include one or more optical characteristics required for various articles (eg, ophthalmic articles, display articles). For example, in some embodiments, a glass manufacturing apparatus may be used to provide display articles (eg, display glass plates) that can be used in various display applications, including, but not limited to, liquid crystal displays (LCD), electrophoretic displays (EPD), organic light emitting diodes Display (OLED), Plasma Display Panel (PDP), and other electronic displays.

如圖1中概要地顯示,在一些實施例中,示例性玻璃製造裝置100可包括玻璃成形裝置101,玻璃成形裝置101包括成形容器140,成形容器140經設計以由一定量的熔融材料121來製造玻璃帶103。在一些實施例中,玻璃帶103可包括中央部分152,中央部分152設置在對面的沿著玻璃帶103的第一外邊緣153與第二外邊緣155而形成的相對厚的邊緣珠粒之間。另外,在一些實施例中,可以透過玻璃分離器149(例如,劃線器、刻劃輪、鑽石尖端、雷射等)將玻璃板104沿著分離路徑151與玻璃帶103分離。在一些實施例中,在玻璃板104與玻璃帶103分離之前或之後,可以移除沿著第一外邊緣153與第二外邊緣155形成的相對厚的邊緣珠粒,以使中央部分152為具有均勻的厚度的高品質玻璃板104。在一些實施例中,所得到的高品質玻璃板104可接著於各種應用中至少被處理或使用的。As schematically shown in FIG. 1, in some embodiments, an exemplary glass manufacturing apparatus 100 may include a glass forming apparatus 101 including a forming container 140 designed to be made from a certain amount of molten material 121 Manufacture glass ribbon 103. In some embodiments, the glass ribbon 103 may include a central portion 152 disposed between oppositely thick edge beads formed along the first outer edge 153 and the second outer edge 155 of the glass ribbon 103. . In addition, in some embodiments, the glass plate 104 may be separated from the glass ribbon 103 along the separation path 151 through a glass separator 149 (eg, a scriber, a scribing wheel, a diamond tip, a laser, etc.). In some embodiments, the relatively thick edge beads formed along the first outer edge 153 and the second outer edge 155 may be removed before or after the glass plate 104 is separated from the glass ribbon 103 so that the central portion 152 is A high-quality glass plate 104 having a uniform thickness. In some embodiments, the resulting high-quality glass sheet 104 can then be processed or used at least in various applications.

在一些實施例中,玻璃製造裝置100可包括熔化容器105,熔化容器105定向成從儲存箱109接收批料107。批料107可以由馬達113提供動力的批量輸送裝置111所引入。在一些實施例中,可操作可選控制器115以啟動馬達113以將所需量的批料107引入熔化容器105中,如箭頭117所示。熔化容器105可以加熱批料107以提供熔融材料121。在一些實施例中,玻璃熔體探針119可用於測量立管123內的熔融材料121的位準,並透過通訊線路125將經測量的資訊傳送到控制器115。In some embodiments, the glass manufacturing apparatus 100 may include a melting vessel 105 oriented to receive a batch 107 from a storage tank 109. The batch 107 may be introduced by a batch conveying device 111 powered by a motor 113. In some embodiments, the optional controller 115 may be operated to activate the motor 113 to introduce the required amount of batch material 107 into the melting vessel 105 as shown by arrow 117. The melting vessel 105 may heat the batch 107 to provide a molten material 121. In some embodiments, the glass melt probe 119 can be used to measure the level of the molten material 121 in the riser 123 and transmit the measured information to the controller 115 through the communication line 125.

另外,在一些實施例中,玻璃製造裝置100可包括第一調節站,第一調節站包括位於熔化容器105下游並透過第一連接導管129連接到熔化容器105的澄清容器127。在一些實施例中,熔融材料121可以透過第一連接導管129從熔化容器105經重力饋送至澄清容器127。例如,在一些實施例中,重力可以驅動熔融材料121通過第一連接導管129的內部通道,從熔化容器105到達澄清容器127。另外,在一些實施例中,可透過各種技術從澄清容器127內的熔融材料121中去除氣泡。In addition, in some embodiments, the glass manufacturing apparatus 100 may include a first conditioning station including a clarification vessel 127 downstream of the melting vessel 105 and connected to the melting vessel 105 through a first connection duct 129. In some embodiments, the molten material 121 may be gravity-fed from the melting container 105 to the clarification container 127 through the first connection conduit 129. For example, in some embodiments, gravity may drive the molten material 121 from the melting vessel 105 to the clarification vessel 127 through the internal passage of the first connection conduit 129. In addition, in some embodiments, air bubbles may be removed from the molten material 121 within the clarification container 127 through various techniques.

在一些實施例中,玻璃製造裝置100還可包括第二調節站,第二調節站包括可位於澄清容器127下游的混合室131。混合室131可用於提供熔融材料121的均勻組合物,從而減少或消除可能存在於離開澄清容器127的熔融材料121內的不均勻性。如圖所示,澄清容器127可以透過第二連接導管135連接到混合室131。在一些實施例中,熔融材料121可以透過第二連接導管135從澄清容器127經重力饋送至混合室131。例如,在一些實施例中,重力可以驅動熔融材料121通過第二連接管道135的內部通道,從澄清容器127到達混合室131。In some embodiments, the glass manufacturing apparatus 100 may further include a second conditioning station including a mixing chamber 131 that may be located downstream of the clarification container 127. The mixing chamber 131 may be used to provide a homogeneous composition of the molten material 121, thereby reducing or eliminating unevenness that may be present in the molten material 121 leaving the clarification container 127. As shown, the clarification container 127 may be connected to the mixing chamber 131 through the second connection pipe 135. In some embodiments, the molten material 121 may be gravity-fed from the clarification container 127 to the mixing chamber 131 through the second connection duct 135. For example, in some embodiments, gravity may drive the molten material 121 from the clarification container 127 to the mixing chamber 131 through the internal passage of the second connection pipe 135.

另外,在一些實施例中,玻璃製造裝置100可包括第三調節站,第三調節站包括可位於混合室131下游的輸送容器133。在一些實施例中,輸送容器133可以調節熔融材料121以供給至入口導管141中。例如,輸送容器133可以用作蓄積器及/或流量控制器,以調節並提供一致的熔融材料流121至入口導管141。如圖所示,混合室131可以透過第三連接導管137的方式連接到輸送容器133。在一些實施例中,熔融材料121可以透過第三連接導管137從混合室131經重力饋送至輸送容器133。例如,在一些實施例中,重力可以驅動熔融材料121通過第三連接導管137的內部通道,從混合室131到達輸送容器133。如進一步所示,在一些實施例中,輸送管139(例如,降液管)可定位成將熔融材料121輸送到成形容器140的入口導管141。In addition, in some embodiments, the glass manufacturing apparatus 100 may include a third conditioning station including a transport container 133 that may be located downstream of the mixing chamber 131. In some embodiments, the transfer container 133 may adjust the molten material 121 to be supplied into the inlet conduit 141. For example, the transfer container 133 may be used as an accumulator and / or flow controller to regulate and provide a consistent flow of molten material 121 to the inlet conduit 141. As shown in the figure, the mixing chamber 131 can be connected to the transport container 133 by way of the third connection duct 137. In some embodiments, the molten material 121 may be gravity-fed from the mixing chamber 131 to the transfer container 133 through the third connection duct 137. For example, in some embodiments, gravity can drive the molten material 121 from the mixing chamber 131 to the transport container 133 through the internal passage of the third connection duct 137. As further shown, in some embodiments, a delivery tube 139 (eg, a downcomer) may be positioned to convey the molten material 121 to the inlet conduit 141 of the forming container 140.

根據本發明的特徵,可以提供成形容器的各種實施例,包括具有用於熔融拉引玻璃帶的楔形件的成形容器、具有槽以槽拉引出玻璃帶的成形容器、或者具有壓輥以從成形容器中壓滾製出玻璃帶的成形容器。作為說明,可以提供以下圖示與揭示出的成形容器140,以從成形楔209的根部145熔融拉引出熔融材料121,以製出玻璃帶103。例如,在一些實施例中,熔融材料121可以從入口導管141輸送到成形容器140。接著,熔融材料121可至少部分依據成形容器140的結構而形成玻璃帶103。例如,如圖所示,熔融材料121可以沿著在玻璃製造裝置100的拉引方向157上延伸的拉引路徑,從成形容器140的底部邊緣(例如,根部145)拉出。在一些實施例中,邊緣導引器163a、163b可以將熔融材料121導引離開成形容器140,並且至少部分地定義出玻璃帶103的寬度「W」。在一些實施例中,玻璃帶103的寬度「W」可以在玻璃帶103的第一外邊緣153與玻璃帶103的第二外邊緣155之間延伸。According to the features of the present invention, various embodiments of a forming container may be provided, including a forming container having a wedge for melt-drawing a glass ribbon, a forming container having a groove for drawing a glass ribbon out of a groove, or a pressing roller for The formed container in which the glass ribbon was rolled under pressure in the container. By way of illustration, the following illustration and disclosed forming container 140 may be provided to melt pull the molten material 121 from the root 145 of the forming wedge 209 to produce a glass ribbon 103. For example, in some embodiments, the molten material 121 may be delivered from the inlet conduit 141 to the forming container 140. Next, the molten material 121 may form the glass ribbon 103 at least in part according to the structure of the forming container 140. For example, as shown, the molten material 121 may be pulled out from the bottom edge (for example, the root 145) of the forming container 140 along a drawing path extending in the drawing direction 157 of the glass manufacturing apparatus 100. In some embodiments, the edge guides 163a, 163b can guide the molten material 121 away from the forming container 140, and at least partially define the width "W" of the glass ribbon 103. In some embodiments, the width “W” of the glass ribbon 103 may extend between the first outer edge 153 of the glass ribbon 103 and the second outer edge 155 of the glass ribbon 103.

圖2顯示出沿著圖1的2-2線截取的玻璃製造裝置100的立體剖視圖。在一些實施例中,成形容器140可包括槽201,槽201定向成從入口導管141接收熔融材料121。出於說明的目的,為清楚起見,從圖2中移除熔融材料121的交叉影線。成形容器140可以進一步包括成形楔209,其包括一對向下傾斜的會聚的表面部分207a、207b,該些部分延伸於成形楔209的相對端210a、210b之間(參見圖1)。成形楔209的一對向下傾斜的會聚的表面部分207a、207b可以沿拉引方向157會聚,以沿著成形楔209的底邊緣交叉,以定義出成形容器140的根部145。玻璃製造裝置100的拉引平面213可沿著拉引方向157延伸穿過根部145。在一些實施例中,玻璃帶103可沿著拉引平面213在拉引方向157上拉伸。如圖所示,拉引平面213可以藉由根部145將成形楔209對分,但在一些實施例中,拉引平面213可以相對於根部145在其他方向上延伸。FIG. 2 shows a perspective cross-sectional view of the glass manufacturing apparatus 100 taken along line 2-2 of FIG. 1. In some embodiments, the shaped container 140 may include a slot 201 that is oriented to receive the molten material 121 from the inlet conduit 141. For illustrative purposes, the cross hatching of the molten material 121 is removed from FIG. 2 for clarity. The forming container 140 may further include a forming wedge 209 including a pair of downwardly converging converging surface portions 207a, 207b that extend between opposite ends 210a, 210b of the forming wedge 209 (see FIG. 1). The pair of downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 may converge in the pulling direction 157 to cross along the bottom edge of the forming wedge 209 to define the root 145 of the forming container 140. The drawing plane 213 of the glass manufacturing apparatus 100 may extend through the root portion 145 along the drawing direction 157. In some embodiments, the glass ribbon 103 may be stretched in the pulling direction 157 along the pulling plane 213. As shown, the drawing plane 213 may bisect the forming wedge 209 by the root 145, but in some embodiments, the drawing plane 213 may extend in other directions relative to the root 145.

另外,在一些實施例中,熔融材料121可以沿著方向159流入成形容器140的槽201中。熔融材料121接著可藉由同時流過相應的堰203a、203b並向下流過相應的堰203a、203b的外表面205a、205b而從槽201溢流出來。隨後,各熔融材料121的流可以沿著成形楔209的向下傾斜的會聚的表面部分207a、207b流動,以從成形容器140的根部145被拉出,在根部145該些流會聚並熔合成為玻璃帶103。隨後,玻璃帶103可以沿著拉引方向157從拉引平面213中的根部145熔融拉出。在一些實施例中,玻璃分離器149(參見圖1)隨後可接著沿著分離路徑151將玻璃板104與玻璃帶103分離。如圖所示,在一些實施例中,分離路徑151可以沿著在第一外邊緣153與第二外邊緣155之間的玻璃帶103的寬度「W」延伸。另外,在一些實施例中,分離路徑151可在垂直於玻璃帶103的拉引方向157上延伸。此外,在一些實施例中,拉引方向157可以定義出一方向,即玻璃帶103可以從成形容器140熔融拉引出的方向。In addition, in some embodiments, the molten material 121 may flow into the groove 201 of the forming container 140 in the direction 159. The molten material 121 can then overflow from the groove 201 by flowing simultaneously through the respective weirs 203a, 203b and down through the outer surfaces 205a, 205b of the respective weirs 203a, 203b. Subsequently, the flow of each molten material 121 may flow along the downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 to be pulled out from the root portion 145 of the forming container 140, where these flows converge and fuse to form Glass ribbon 103. Subsequently, the glass ribbon 103 can be melt-drawn from the root 145 in the drawing plane 213 along the drawing direction 157. In some embodiments, the glass separator 149 (see FIG. 1) may then subsequently separate the glass plate 104 from the glass ribbon 103 along the separation path 151. As shown, in some embodiments, the separation path 151 may extend along the width “W” of the glass ribbon 103 between the first outer edge 153 and the second outer edge 155. In addition, in some embodiments, the separation path 151 may extend in a pulling direction 157 perpendicular to the glass ribbon 103. In addition, in some embodiments, the pulling direction 157 can define a direction, that is, a direction in which the glass ribbon 103 can be drawn by melting from the forming container 140.

如圖2所示,玻璃帶103可以玻璃帶103的第一主表面215a與玻璃帶103的第二主表面215b面向相反的方向從根部145被拉下,並且定義出玻璃帶103的厚度「T」(例如,平均厚度)。在一些實施例中,玻璃帶103的厚度「T」可小於或等於約2mm,小於或等於約1mm,小於或等於約0.5mm,例如,儘管在其他實施例中可以提供其他厚度,但是可小於或等於約300μm,小於或等於約200μm,或者小於或等於約100μm。例如,在一些實施例中,玻璃帶103的厚度「T」可以為從約50μm至約750μm,從約100μm至約700μm,從約200μm至約600μm,從約300μm至約500μm,從約50μm至約500μm,從約50μm至約700μm,從約50μm至約600μm,從約50μm至約500μm,從約50μm至約400μm,從約50μm至約300μm,從約50μm至約200μm,從約50μm至約100μm,包括其間的所有範圍及子範圍的厚度。另外,玻璃帶103可包括各種組合物,包括但不限於鈉鈣玻璃、硼矽酸鹽玻璃、鋁硼矽酸鹽玻璃、含鹼玻璃、或無鹼玻璃。As shown in FIG. 2, the glass ribbon 103 can be pulled down from the root 145 with the first major surface 215 a of the glass ribbon 103 and the second major surface 215 b of the glass ribbon 103 facing in opposite directions, and defines the thickness “T "(For example, average thickness). In some embodiments, the thickness “T” of the glass ribbon 103 may be less than or equal to about 2 mm, less than or equal to about 1 mm, and less than or equal to about 0.5 mm. For example, although other thicknesses may be provided in other embodiments, the thickness may be less than Or equal to about 300 μm, less than or equal to about 200 μm, or less than or equal to about 100 μm. For example, in some embodiments, the thickness “T” of the glass ribbon 103 may be from about 50 μm to about 750 μm, from about 100 μm to about 700 μm, from about 200 μm to about 600 μm, from about 300 μm to about 500 μm, from about 50 μm to About 500 μm, from about 50 μm to about 700 μm, from about 50 μm to about 600 μm, from about 50 μm to about 500 μm, from about 50 μm to about 400 μm, from about 50 μm to about 300 μm, from about 50 μm to about 200 μm, from about 50 μm to about 100 μm, including the thickness of all ranges and subranges in between. In addition, the glass ribbon 103 may include various compositions including, but not limited to, soda lime glass, borosilicate glass, aluminoborosilicate glass, alkali-containing glass, or alkali-free glass.

圖3圖示出了玻璃製造裝置100的一部分的平面圖,該玻璃製造裝置100包括沿著圖3中的3-3線截取的熔化容器105。在圖1中,為清楚起見,移除了熔化容器105的頂部(例如,蓋子、頂部、頂板)。因此,除非另有說明,否則應理解,在一些實施例中,熔化容器105可包括固定或可移除的頂部,而不脫離本案的範圍。另外,除非另有說明,否則在一些實施例中,熔化容器105的頂部可以對例如熔化容器105外部的環境開放,並且熔融材料121的自由表面可以面向開放的頂部。在一些實施例中,熔化容器105可以包括一壁310,該壁包括內表面311、312,該些內表面至少部分地定義出熔化容器105的一包封區域315(例如,體積)。例如,在一些實施例中,側壁內表面311與底壁內表面312可至少部分地定義出熔化容器105的包封區域315。如圖所示,在一些實施例中,包封區域315可包含材料(例如,批料107、熔融材料121);但除非另有說明,否則應理解,在一些實施例中,熔化容器105可為空的(例如,不提供材料),此不脫離本案的範圍。FIG. 3 illustrates a plan view of a part of a glass manufacturing apparatus 100 including a melting container 105 taken along a line 3-3 in FIG. 3. In FIG. 1, the top (eg, lid, top, top plate) of the melting container 105 is removed for clarity. Therefore, unless otherwise noted, it should be understood that in some embodiments, the melting vessel 105 may include a fixed or removable top without departing from the scope of the present case. In addition, unless stated otherwise, in some embodiments, the top of the melting container 105 may be open to the environment outside the melting container 105, for example, and the free surface of the molten material 121 may face the open top. In some embodiments, the melting vessel 105 may include a wall 310 that includes inner surfaces 311, 312 that at least partially define an envelope region 315 (eg, volume) of the melting vessel 105. For example, in some embodiments, the side wall inner surface 311 and the bottom wall inner surface 312 may at least partially define the encapsulation area 315 of the melting container 105. As shown, in some embodiments, the encapsulation area 315 may contain material (eg, batch 107, molten material 121); but unless otherwise noted, it should be understood that in some embodiments, the melting vessel 105 may It is empty (for example, no material is provided) and this does not depart from the scope of the case.

在一些實施例中,熔化容器105的壁310可包括(例如,由其製造)金屬及/或非金屬材料,包括但不限於一或多種絕熱耐火材料(例如,陶瓷、碳化矽、氧化鋯、鋯石、氧化鉻)。另外,在一些實施例中,熔化容器105的內表面311、312可以包括一層(未圖示)耐腐蝕的材料(例如,鉑、鉑合金),以提供包含在包封區域315與壁310內的材料107、121之間的耐腐蝕障壁層。在一些實施例中,熔化容器105的壁310可包括選擇用於抵抗因暴露於高溫(例如,等於或低於2100℃的溫度)、腐蝕性化學品(例如,硼、磷、氧化鈉)、及外力中一或更多者的情況下的結構的劣化及變形(例如,翹曲、下垂、蠕變、疲勞、腐蝕、破裂、開裂、熱衝擊、機械衝擊等)的材料。在一些實施例中,壁310可以製造為實心的整體結構;然而,在一些實施例中,複數個單獨的結構(例如,磚)可經組合(例如,堆疊)以提供至少一部分的壁310。出於本案的目的,無論以何種方式構成壁310,在不脫離本案的範圍的情況下,一容器(例如,包封容器)可以包括定義出至少一部分的包封區域315的內表面311、312,內表面311、312經定向以將材料107、121包含在包封區域315內。In some embodiments, the wall 310 of the melting vessel 105 may include (e.g., be manufactured from) metallic and / or non-metallic materials, including but not limited to one or more thermally insulating refractory materials (e.g., ceramic, silicon carbide, zirconia, Zircon, chromium oxide). In addition, in some embodiments, the inner surfaces 311, 312 of the melting vessel 105 may include a layer (not shown) of a corrosion-resistant material (eg, platinum, platinum alloy) to provide inclusion in the encapsulation area 315 and the wall 310 Corrosion resistant barrier layer between the materials 107, 121. In some embodiments, the wall 310 of the melting vessel 105 may include components selected to resist exposure to high temperatures (eg, temperatures at or below 2100 ° C), corrosive chemicals (eg, boron, phosphorus, sodium oxide), And materials that suffer from structural degradation and deformation (eg, warping, sagging, creep, fatigue, corrosion, cracking, cracking, thermal shock, mechanical shock, etc.) in the event of one or more of external forces. In some embodiments, the wall 310 may be manufactured as a solid monolithic structure; however, in some embodiments, a plurality of individual structures (eg, bricks) may be combined (eg, stacked) to provide at least a portion of the wall 310. For the purpose of this case, no matter how the wall 310 is constructed, without departing from the scope of this case, a container (eg, an encapsulation container) may include an inner surface 311 that defines at least a portion of the encapsulation area 315, 312, the inner surfaces 311, 312 are oriented to contain the material 107, 121 within the encapsulation area 315.

如箭頭117所示,在一些實施例中,批料107可由批量輸送裝置111引入熔化容器105的包封區域315內。在一些實施例中,熔化容器105可以加熱批料107以在包封區域315內提供熔融材料121。另外,在一些實施例中,熔化容器105可用於升高或降低被包含在包封區域315內的熔融材料121的溫度。例如,在一些實施例中,玻璃製造裝置100可包括加熱裝置300(例如,加熱器),其可包括第一電極301與第二電極302,第一電極301與第二電極302可操作以加熱(例如,熔化)批料107以提供熔融材料121。在一些實施例中,第一電極301與第二電極302可以彼此相同。同樣,在一些實施例中,與第一電極301相關的及/或可操作的結構與部件,可及與第二電極302相關的及/或可操作的結構與部件相同。因此,除非另有說明,否則出於本案的目的,第一電極301的特徵以及與第一電極301相關的及/或可與其操作的結構與部件,可同樣地適用於第二電極302的特徵以及與第二電極302相關的及/或可與其操作的結構與部件。此外,儘管未圖示,但在一些實施例中,第二電極302的特徵以及與該第二電極302相關的及/或可與其操作的結構與部件可以不相同於對應於第一電極301的特徵以及與第一電極301相關的及/或可與其操作的對應的結構與部件。As indicated by arrow 117, in some embodiments, the batch material 107 may be introduced into the envelope region 315 of the melting vessel 105 by the batch conveying device 111. In some embodiments, the melting vessel 105 may heat the batch 107 to provide the molten material 121 within the encapsulation area 315. In addition, in some embodiments, the melting vessel 105 may be used to raise or lower the temperature of the molten material 121 contained within the encapsulation region 315. For example, in some embodiments, the glass manufacturing apparatus 100 may include a heating device 300 (eg, a heater), which may include a first electrode 301 and a second electrode 302, and the first electrode 301 and the second electrode 302 may be operable to heat The batch 107 is (eg, melted) to provide a molten material 121. In some embodiments, the first electrode 301 and the second electrode 302 may be the same as each other. Similarly, in some embodiments, structures and components related to and / or operable with the first electrode 301 are the same as structures and components related to and / or operable with the second electrode 302. Therefore, unless stated otherwise, for the purposes of this case, the features of the first electrode 301 and the structures and components associated with and / or operable with the first electrode 301 may be equally applicable to the features of the second electrode 302 And structures and components associated with and / or operable with the second electrode 302. In addition, although not shown, in some embodiments, the characteristics of the second electrode 302 and the structures and components associated with and / or operable with the second electrode 302 may be different from those corresponding to the first electrode 301 Features and corresponding structures and components associated with and / or operable with the first electrode 301.

在一些實施例中,可以提供一或多個附加的加熱裝置(未圖示),例如,以首先熔化批料107以提供熔融材料121。在一些實施例中,可接著採用包括第一電極301與第二電極302的加熱裝置300來進一步熔化批料107及/或進一步加熱熔融材料121。此外,在一些實施例中,可以提供一或多個附加的加熱裝置(未圖示),包括但不限於燃氣加熱器、電加熱器、及電阻加熱器,與加熱裝置300一起而向包含在熔化容器105的包封區域315內的材料107、121提供額外的熱量,此不脫離本案的範圍。In some embodiments, one or more additional heating devices (not shown) may be provided, for example, to first melt the batch 107 to provide a molten material 121. In some embodiments, the heating device 300 including the first electrode 301 and the second electrode 302 may then be used to further melt the batch 107 and / or further heat the molten material 121. In addition, in some embodiments, one or more additional heating devices (not shown) may be provided, including but not limited to gas heaters, electric heaters, and resistance heaters. The materials 107, 121 in the envelope region 315 of the melting vessel 105 provide additional heat without departing from the scope of this case.

在一些實施例中,加熱裝置300可包括電路,電路包括電連接到第一電極301的第一電引線307及電連接到第二電極302的第二電引線308。在一些實施例中,材料(例如,批料107、熔融材料121)可包括使材料表現為一電阻器的材料特性,其至少基於焦耳加熱的原理,將通過材料107、121的電流325轉換成熱能。因此,在一些實施例中,焦耳加熱可以至少部分地基於焦耳定律(P=I2 ×R),其中「P」是電加熱功率,「I」是電流325,且「R」是電流325通過的材料的電阻率。例如,在一些實施例中,電流325(由第一電引線307所提供)可以從第一電極301的正面303通過,經過包含在包封區域315內的材料107、121,流至第二電極302的正面304。同樣,在一些實施例中,電流325(由第二電引線308所提供)可以從第二電極302的正面304通過,經過包含在包封區域315內的材料107、121,流向第一電極301的正面303。因此,在一些實施例中,至少部分地基於電流325變成熱能的該轉換,加熱裝置300的一或多個特徵可操作以提高材料107、121的溫度,及/或在當操作玻璃製造裝置100時,維持包含在包封區域315內的材料107、121的溫度。In some embodiments, the heating device 300 may include a circuit including a first electrical lead 307 electrically connected to the first electrode 301 and a second electrical lead 308 electrically connected to the second electrode 302. In some embodiments, the material (eg, batch 107, molten material 121) may include material characteristics that make the material behave as a resistor, which at least based on the principle of Joule heating, converts the current 325 through the materials 107, 121 into Thermal energy. Therefore, in some embodiments, Joule heating may be based at least in part on Joule's law (P = I 2 × R), where “P” is electric heating power, “I” is current 325, and “R” is current 325 through Resistivity of the material. For example, in some embodiments, a current 325 (provided by the first electrical lead 307) may pass through the front surface 303 of the first electrode 301, pass through the materials 107, 121 contained in the encapsulation area 315, and flow to the second electrode 302's front 304. Similarly, in some embodiments, a current 325 (provided by the second electrical lead 308) may flow through the front surface 304 of the second electrode 302, and through the materials 107, 121 contained in the encapsulation area 315, and flow to the first electrode 301 The positive 303. Therefore, in some embodiments, based at least in part on this conversion of the current 325 into thermal energy, one or more features of the heating device 300 are operable to increase the temperature of the materials 107, 121, and / or when operating the glass manufacturing device 100 At this time, the temperature of the materials 107 and 121 contained in the encapsulation region 315 is maintained.

在一些實施例中,加熱裝置300可用來,例如,對於包含在熔化容器105的包封區域315內的材料107、121的溫度波動與溫度梯度進行控制和減低的至少一個操作。例如,在一些實施例中,加熱裝置300的一或多個特徵可以均勻地加熱批料107,以使包含在容器105內的熔融材料121具有均勻的受控制的溫度。在一些實施例中,熔融材料121的均勻受控的溫度,可相對於由含有溫度梯度及/或溫度波動的熔融材料121所形成的玻璃帶,提供品質更佳的玻璃帶103。例如,如箭頭317所示,在一些實施例中,熔融材料121可以在被加熱裝置300加熱的同時流過包封區域315(例如,穿過電流325)。在一些實施例中,可接著將熔融材料121從容器105提供到玻璃成形裝置101(例如,透過第一連接導管129)以進一步處理,例如,形成玻璃帶103(參見圖1)。In some embodiments, the heating device 300 may be used, for example, for at least one operation to control and reduce the temperature fluctuations and temperature gradients of the materials 107, 121 contained in the envelope region 315 of the melting container 105. For example, in some embodiments, one or more features of the heating device 300 may uniformly heat the batch 107 such that the molten material 121 contained within the container 105 has a uniform, controlled temperature. In some embodiments, the uniformly controlled temperature of the molten material 121 may provide a better quality glass ribbon 103 relative to a glass ribbon formed by the molten material 121 containing temperature gradients and / or temperature fluctuations. For example, as shown by arrow 317, in some embodiments, the molten material 121 may flow through the encapsulation area 315 (eg, through a current 325) while being heated by the heating device 300. In some embodiments, the molten material 121 may then be provided from the container 105 to the glass forming device 101 (eg, through the first connection conduit 129) for further processing, such as forming a glass ribbon 103 (see FIG. 1).

在一些實施例中,第一電極301與第二電極302中的至少一者可包括(例如,由其製造)金屬及/或非金屬材料,包括但不限於氧化錫、碳、氧化鋯、鉬、鉑及鉑合金中的一或多種。在一些實施例中,第一電極301的正面303與第二電極302的正面304可接觸包含在熔化容器105的包封區域315內的材料107、121。因此,在一些實施例中,第一電極301與第二電極302中的至少一者可包括選擇用於抵抗因暴露於高溫(例如,等於或低於2100℃的溫度)、腐蝕性化學品(例如硼、磷、氧化鈉)、及外力中一或更多者的情況下的結構的劣化及變形(例如,翹曲,下垂,蠕變,疲勞,腐蝕,破裂,開裂,熱衝擊,機械衝擊等)的材料。此外,在一些實施例中,第一電極301與第二電極302中的至少一者可以製造為實心(例如,單個、單片)結構;然而,在一些實施例中,如以下更全面地論述的,可以組合(例如,堆疊)複數個單獨的結構(例如,磚、塊)以提供第一電極301與第二電極302中的至少一者的至少一部分。在一些實施例中,利用複數個單獨的結構(例如,磚、塊)構成電極301、302,可以幫助簡化並減少電極301、302的製造成本。In some embodiments, at least one of the first electrode 301 and the second electrode 302 may include (eg, manufactured from) a metal and / or non-metal material, including but not limited to tin oxide, carbon, zirconia, molybdenum Or more of platinum, platinum, and platinum alloys. In some embodiments, the front surface 303 of the first electrode 301 and the front surface 304 of the second electrode 302 may contact the materials 107, 121 contained in the encapsulation region 315 of the melting container 105. Therefore, in some embodiments, at least one of the first electrode 301 and the second electrode 302 may include a component selected to resist exposure to high temperatures (eg, a temperature equal to or lower than 2100 ° C), corrosive chemicals ( (E.g., boron, phosphorus, sodium oxide), and structural degradation and deformation (e.g., warping, sagging, creep, fatigue, corrosion, cracking, cracking, thermal shock, mechanical shock) in the case of one or more of external forces Etc). Further, in some embodiments, at least one of the first electrode 301 and the second electrode 302 may be manufactured as a solid (eg, single, monolithic) structure; however, in some embodiments, as discussed more fully below Yes, a plurality of separate structures (eg, bricks, blocks) may be combined (eg, stacked) to provide at least a part of at least one of the first electrode 301 and the second electrode 302. In some embodiments, constructing the electrodes 301 and 302 by using a plurality of separate structures (eg, bricks and blocks) can help simplify and reduce the manufacturing cost of the electrodes 301 and 302.

在一些實施例中,至少基於由電流325提供給包含在熔化容器105的包封區域315內的材料107、121的熱能,第一電極301的背面305的溫度可以是小於第一電極301的正面303的溫度。同樣,在一些實施例中,至少基於由電流325提供給包含在熔化容器105的包封區域315內材料107、121的熱能,第二電極302的背面306的溫度可以是小於第二電極302的正面304的溫度。另外,在一些實施例中,第一電極301的背面305及/或第二電極302的背面306可以用液體(例如,水)、氣體(例如,空氣)、固體(例如,散熱片)中的一或多者來進行冷卻,例如,基於傳導傳熱、對流傳熱、及輻射傳熱中的一或多者,來調節電連接到第一電極301與第二電極302的一或多個電子部件(例如,電引線307、308與相關的電子部件)的溫度。In some embodiments, the temperature of the back surface 305 of the first electrode 301 may be less than the front surface of the first electrode 301 based on at least the thermal energy provided by the current 325 to the materials 107, 121 contained in the encapsulation region 315 of the melting container 105. 303 temperature. Similarly, in some embodiments, the temperature of the back surface 306 of the second electrode 302 may be lower than that of the second electrode 302 based at least on the thermal energy provided by the current 325 to the materials 107, 121 contained in the enclosing area 315 of the melting vessel 105. The temperature of the front side 304. In addition, in some embodiments, the back surface 305 of the first electrode 301 and / or the back surface 306 of the second electrode 302 may be made of liquid (for example, water), gas (for example, air), or solid (for example, heat sink). Cooling is performed by one or more, for example, adjusting one or more electrons electrically connected to the first electrode 301 and the second electrode 302 based on one or more of conductive heat transfer, convective heat transfer, and radiative heat transfer. Temperature of components (eg, electrical leads 307, 308 and related electronic components).

如圖4中進一步所示,其顯示出沿著圖3的4-4線截取的熔化容器105的剖視圖。在一些實施例中,第一電極301可定位在定義出熔化容器105的壁310中的第一開口403的第一孔401中,第二電極302可定位在定義出熔化容器105的壁310中的第二開口404的第二孔402中。在一些實施例中,可以第一開口403面向第二開口404的方式,將第一孔401定位成與第二孔402相對。例如,在一些實施例中,第一開口403與第二開口404可以沿著一共用軸對齊。另外,在一些實施例中,第一電極301的正面303可面向第二電極302的正面304(例如,沿著一共用軸對齊),正面303、304的一或多個表面接觸包含在熔化容器105的包封區域315內的材料107、121。因此,在一些實施例中,電流325可從位在第一孔401的第一開口403內的第一電極301的正面303通過,經過包含在包封區域315內的材料107、121,到達位在第二孔402的第二開口404內的第二電極302的正面304。同樣,在一些實施例中,電流325可從位在第二孔402的第二開口404內的第二電極302的正面304通過,經過包含在包封區域315中的材料107、121,到達位在第一孔401的第一開口403內的第一電極301的正面303。As further shown in FIG. 4, it shows a cross-sectional view of the melting container 105 taken along line 4-4 of FIG. 3. In some embodiments, the first electrode 301 may be positioned in the first hole 401 defining the first opening 403 in the wall 310 of the melting container 105 and the second electrode 302 may be positioned in the wall 310 defining the melting container 105 In the second hole 402 of the second opening 404. In some embodiments, the first hole 401 may be positioned opposite to the second hole 402 in such a manner that the first opening 403 faces the second opening 404. For example, in some embodiments, the first opening 403 and the second opening 404 may be aligned along a common axis. In addition, in some embodiments, the front surface 303 of the first electrode 301 may face the front surface 304 of the second electrode 302 (eg, aligned along a common axis), and one or more surfaces of the front surfaces 303, 304 are in contact with the melting container. The materials 107, 121 within the enclosing area 315 of 105. Therefore, in some embodiments, the current 325 may pass through the front surface 303 of the first electrode 301 located in the first opening 403 of the first hole 401 and pass through the materials 107 and 121 included in the encapsulation area 315 to reach the position. The front surface 304 of the second electrode 302 within the second opening 404 of the second hole 402. Similarly, in some embodiments, the current 325 may pass through the front surface 304 of the second electrode 302 located in the second opening 404 of the second hole 402 and pass through the materials 107 and 121 included in the encapsulation area 315 to reach the position. The front surface 303 of the first electrode 301 in the first opening 403 of the first hole 401.

在一些實施例中,例如,至少基於加熱裝置300的操作及與材料107、121的接觸,第一電極301的正面303與第二電極302的正面304中的至少一者會在一段持續時間內磨損(例如,劣化、磨小)。因此,如以下更充分地說明,在一些實施例中,第一電極301可以相對於第一開口403沿著在方向351上延伸的一調整路徑選擇性地平移,以沿著在方向351上的調整路徑平移正面303。在一些實施例中,在方向351上相對於第一開口403平移第一電極301,可以補償在操作玻璃製造裝置100時由磨損所引起的正面303的結構劣化。同樣,在一些實施例中,第二電極302可以相對於第二開口404沿著在方向352上延伸的一調整路徑選擇性地平移,以沿著在方向352上的調整路徑平移正面304。在一些實施例中,在方向352上相對於第二開口404平移第二電極302,可以補償在操作玻璃製造裝置100時由磨損所引起的正面304的結構劣化。In some embodiments, for example, at least one of the front surface 303 of the first electrode 301 and the front surface 304 of the second electrode 302 will be for a period of time, based at least on the operation of the heating device 300 and the contact with the materials 107, 121. Wear (eg, deterioration, wear). Therefore, as explained more fully below, in some embodiments, the first electrode 301 may be selectively translated relative to the first opening 403 along an adjustment path extending in the direction 351 to move along the direction 351 Adjust the path to pan front 303. In some embodiments, translating the first electrode 301 relative to the first opening 403 in the direction 351 can compensate for structural deterioration of the front surface 303 caused by abrasion when the glass manufacturing apparatus 100 is operated. Similarly, in some embodiments, the second electrode 302 can be selectively translated relative to the second opening 404 along an adjustment path extending in the direction 352 to translate the front surface 304 along the adjustment path in the direction 352. In some embodiments, translating the second electrode 302 relative to the second opening 404 in the direction 352 can compensate for structural deterioration of the front surface 304 caused by abrasion when operating the glass manufacturing apparatus 100.

在一些實施例中,壁310的內表面311、312以及第一電極301的正面303與第二電極302的正面304,可至少部分地限定熔化容器105的包封區域315。另外,在一些實施例中,電極301、302的正面303、304可與壁310的內表面311齊平。例如,在一些實施例中,電極301、302的正面303、304可被定位成與壁310的內表面311齊平,及/或當在操作玻璃製造裝置100時,在個別的方向351、352上平移時與壁310的內表面311齊平。此外或可選地,在一些實施例中,電極301、302的正面303、304可經定位為凹下或凸出,及/或當在操作玻璃製造裝置100時,在個別的方向351、352上平移,以相對於壁310的內表面311凹下或凸出。因此,在一些實施例中,基於至少部分地基於該電流325轉換成熱能,加熱裝置的一或多個特徵300可以操作以提高材料107、121的溫度,及/或維持包含在包封區域315內的材料107、121的溫度。In some embodiments, the inner surfaces 311 and 312 of the wall 310 and the front surface 303 of the first electrode 301 and the front surface 304 of the second electrode 302 may at least partially define the encapsulation region 315 of the melting container 105. In addition, in some embodiments, the front surfaces 303, 304 of the electrodes 301, 302 may be flush with the inner surface 311 of the wall 310. For example, in some embodiments, the front faces 303, 304 of the electrodes 301, 302 may be positioned flush with the inner surface 311 of the wall 310, and / or in individual directions 351, 352 when operating the glass manufacturing apparatus 100 It is flush with the inner surface 311 of the wall 310 during the upward translation. Additionally or alternatively, in some embodiments, the front faces 303, 304 of the electrodes 301, 302 may be positioned as concave or convex, and / or in individual directions 351, 352 when operating the glass manufacturing apparatus 100 It is translated upward to be concave or convex relative to the inner surface 311 of the wall 310. Thus, in some embodiments, one or more features 300 of the heating device may be operated to increase the temperature of the materials 107, 121, and / or remain contained within the encapsulation area 315, based at least in part on the conversion of the current 325 into thermal energy. The temperature of the materials 107, 121 inside.

此外,儘管已對於熔化容器105的特徵進行了說明,但除非另有說明,否則應理解,在一些實施例中,加熱裝置300的一或多個特徵可單獨或組合地配備一或多個容器(例如,包封容器,包含未明確揭示的容器),以例如加熱一或多個容器之包封區域內所含的材料(包含未明確揭示的材料),此不脫離本案的範圍。在一些實施例中,使用加熱裝置300的示例性容器可以多種方法處理熔融材料,包括但不限於,澄清、調節、涵容、攪拌、允許化學反應、打入氣泡、冷卻、加熱、成形、保持、流動。Further, although the features of the melting vessel 105 have been described, it should be understood that, in some embodiments, in some embodiments, one or more features of the heating device 300 may be equipped with one or more vessels individually or in combination. (Eg, encapsulating a container, including a container that is not explicitly disclosed), such as heating the material contained in the enclosing area of one or more containers (including the material that is not explicitly disclosed), without departing from the scope of the present case. In some embodiments, the exemplary container using the heating device 300 can process molten material in a variety of ways including, but not limited to, clarification, conditioning, containment, agitation, allowing chemical reactions, injecting bubbles, cooling, heating, forming, holding, flow.

例如,在一些實施例中,加熱裝置300的一或多個特徵可單獨或組合地配備玻璃製造裝置100(圖1)及玻璃成形裝置101的一或多個特徵,包括但不限於熔化容器105、儲存箱109、立管123、澄清容器127、第一連接導管129、混合室131、輸送容器133、第二連接導管135、第三連接導管137、輸送管139、及成形容器140,以例如加熱包含在該些特徵內的材料(例如,批料107、熔融材料121)。此外,儘管熔化容器105在圖3與圖4中顯示為基本上立方體的結構,除非另有說明,否則應理解,在一些實施例中,熔化容器105及併入加熱裝置300的其他容器可包括定義出一或多個輪廓與形狀的壁的結構,輪廓與形狀包括但不限於,球形、矩形框、圓柱形、圓錐形、或其他三維形狀,其經定向為包括含有材料的包封區域(例如,體積)。For example, in some embodiments, one or more features of the heating device 300 may be individually or combined with one or more features of the glass manufacturing device 100 (FIG. 1) and the glass forming device 101, including but not limited to the melting vessel 105 , Storage tank 109, riser 123, clarification container 127, first connection duct 129, mixing chamber 131, transport container 133, second connection duct 135, third connection duct 137, transport tube 139, and forming container 140, for example, The materials contained in these features are heated (eg, batch 107, molten material 121). In addition, although the melting vessel 105 is shown in FIG. 3 and FIG. 4 as a substantially cubic structure, unless otherwise noted, it should be understood that in some embodiments, the melting vessel 105 and other vessels incorporating the heating device 300 may include Defines the structure of one or more contours and shapes of walls, including but not limited to, spherical, rectangular frames, cylindrical, conical, or other three-dimensional shapes, which are oriented to include an encapsulating area containing material ( (For example, volume).

現在將參照圖5~17,描述示例性加熱裝置300的例示實施例。在一些實施例中,加熱裝置300可用於加熱包含在熔化容器105的包封區域315內的熔融材料121,除非另有說明,否則應理解,在一些實施例中,加熱裝置300的一或多個特徵可單獨或組合地應用以加熱包含在一或多個依據本案實施例的其他容器(例如,包封容器)的包封區域內的材料,此不脫離本案的範圍。另外,加熱裝置300可包括多種配置。因此,在一些實施例中,第一電極301及與第一電極301相關的特徵可相同於第二電極302及與第二電極302相關的特徵。如此,電極301、302的實施例及與電極301、302相關的結構將參照第一電極301來說明,以供理解一些實施例中,此種特徵與說明可同樣適用於第二電極302。An exemplary embodiment of an exemplary heating device 300 will now be described with reference to FIGS. 5-17. In some embodiments, the heating device 300 may be used to heat the molten material 121 contained in the enclosing area 315 of the melting container 105. Unless otherwise noted, it should be understood that in some embodiments, one or more of the heating devices 300 This feature may be applied individually or in combination to heat the material contained in the encapsulation area of one or more other containers (eg, encapsulated containers) according to embodiments of the present invention without departing from the scope of the present invention. In addition, the heating device 300 may include various configurations. Therefore, in some embodiments, the features related to the first electrode 301 and the first electrode 301 may be the same as the features related to the second electrode 302 and the second electrode 302. In this way, the embodiments of the electrodes 301 and 302 and the structures related to the electrodes 301 and 302 will be described with reference to the first electrode 301 for understanding that in some embodiments, such features and descriptions can be applied to the second electrode 302 as well.

圖5圖示出了依據本案的實施例的熔化容器105,包括沿著圖3的5-5線截取的加熱裝置300的第一電極301的背面305的一側視圖。另外,圖6~12圖示出了圖4的熔化容器105與加熱裝置300的局部剖視圖的各種示例性實施例,包括用加熱裝置300處理材料121的方法。在一些實施例中,第一電極301可以被定義為包括複數個塊500的電極組件301。參照圖5~12,揭示了十五個塊501~515,應能理解在一些實施例中,可提供定義出複數個塊500的更多或更少的塊,而不脫離本案的範圍。同樣,在一些實施例中,關於形狀、大小、及方向,每個塊可以是相同的,一或多個塊可以是一或多個相同塊的一部分(例如,半塊),且一或多個塊可以與一或多個其他塊不同。在一些實施例中,提供相同的塊及/或一或多個塊作為一個或更多個相同的塊的部分(例如,半塊),可以對在製造與該複數個塊500的成本的至少一者上提供相對優點,例如,可以透過提供複數個不同的塊或一個相對較大尺寸的單個塊來獲得。FIG. 5 illustrates a side view of the back surface 305 of the melting vessel 105 including the first electrode 301 of the heating device 300 taken along line 5-5 of FIG. 3 according to an embodiment of the present invention. In addition, FIGS. 6 to 12 illustrate various exemplary embodiments of partial cross-sectional views of the melting container 105 and the heating device 300 of FIG. 4, including a method of processing the material 121 with the heating device 300. In some embodiments, the first electrode 301 may be defined as an electrode assembly 301 including a plurality of blocks 500. Referring to FIGS. 5 to 12, fifteen blocks 501 to 515 are disclosed. It should be understood that in some embodiments, more or fewer blocks defining a plurality of blocks 500 may be provided without departing from the scope of the present application. Also, in some embodiments, with respect to shape, size, and orientation, each block may be the same, one or more blocks may be part of one or more of the same block (eg, half block), and one or more Each block may be different from one or more other blocks. In some embodiments, providing the same block and / or one or more blocks as part (eg, a half block) of one or more of the same block can reduce at least the cost of manufacturing the same number of blocks 500 One provides relative advantages, for example, can be obtained by providing a plurality of different blocks or a single block of relatively large size.

此外,出於本案的目的,在圖3~17中提供了標準的三維(右手)笛卡爾座標系,具有第一軸「X」沿著第一方向延伸,第二軸「Y」沿著垂直於第一方向的第二方向延伸,第三軸「Z」沿著垂直於第一方向與第二個方向的第三方向延伸。除非另有說明,否則座標系提供了基礎,依據本案的實施例,可從該基礎確定出本案的一或多個特徵的相對空間座標與相對方位中的至少一者。另外,在一些實施例中,可以提供不同的座標係以定義本案的一或多個特徵的相對空間座標與相對方位中的至少一者,而不脫離本案的範圍。例如,在一些實施例中,複數個塊500可以沿著在第一方向上延伸的第一軸「X」堆疊。在一些實施例中,經堆疊的塊500可沿著第一軸「X」跨越第一距離「D1」,沿著在垂直於第一方向的第二方向上延伸的第二軸「Y」跨越第二距離「D2」,以及沿著在垂直於第一方向與第二方向的第三方向上延伸的第三軸「Z」跨越第三距離「D3」。在一些實施例中,距離「D1」、「D2」、及「D3」中的一或多者,可以對應至沿著相應軸「X」、「Y」、「Z」上的複數個塊500中的一或多個塊501~515會跨越的整個距離。同樣,在一些實施例中,距離「D1」、「D2」、及「D3」中的一或多者,可以對應至小於沿著相應軸「X」、「Y」、「Z」上的複數個塊500中的一或多個塊501~515會跨越的整個距離(例如,部分距離)。In addition, for the purpose of this case, the standard three-dimensional (right-handed) Cartesian coordinate system is provided in Figures 3-17, with a first axis 「X」 extending along the first direction and a second axis 「Y」 along the vertical Extending in a second direction in the first direction, the third axis 「Z」 extends in a third direction perpendicular to the first direction and the second direction. Unless otherwise stated, the coordinates provide the basis from which at least one of the relative spatial coordinates and the relative orientation of one or more features of the case can be determined from the basis of the embodiment of the case. In addition, in some embodiments, different coordinate systems may be provided to define at least one of a relative spatial coordinate and a relative orientation of one or more features of the present invention without departing from the scope of the present invention. For example, in some embodiments, the plurality of blocks 500 may be stacked along a first axis 「X」 extending in a first direction. In some embodiments, the stacked block 500 may span a first distance 「D1」 along a first axis 「X」 and a second axis 「Y」 extending in a second direction perpendicular to the first direction. The second distance 「D2」, and a third distance 「D3」 extending along a third axis 「Z」 extending in a third direction perpendicular to the first direction and the second direction. In some embodiments, one or more of the distances 「D1」, 「D2」, and 「D3」 may correspond to a plurality of blocks 500 along respective axes 「X」, 「Y」, 「Z」. One or more of the blocks 501-515 will span the entire distance. Similarly, in some embodiments, one or more of the distances 「D1」, 「D2」, and 「D3」 may correspond to less than a complex number along respective axes 「X」, 「Y」, 「Z「. The entire distance (eg, a partial distance) that one or more of the blocks 500-515 in the block 500 can span.

如圖5~7所示,在一些實施例中,相對於第一軸「X」,塊501可以堆疊在半塊502及塊507上;塊503可以堆疊在半塊504及塊508上;塊505可以堆疊在半塊506及塊509上。類似地,半塊502及塊507可以堆疊在塊503上;半塊504及塊508可以堆疊在塊505上,從而提供包括複數個堆疊的塊500的電極組件301。在一些實施例中,第一距離「D1」與第二距離「D2」可以定義出電極組件301的正面303。例如,在一些實施例中,提供與一個或多個整塊501、503、505(或相應的部分塊)堆疊的一個或多個半塊502、504、506(或其他部分塊),能提供具有正面303的電極組件301與包含在容器105的包封區域315中的熔融材料121接觸。在一些實施例中,正面303可以定義出電極組件301的平坦表面。在一些實施例中,至少部分地基於複數個塊500的堆疊配置以及相對位置,及/或當操作玻璃製造裝置500時定義出電極組件301的部分的正面303的複數個塊500的端的磨損,而可在其他實施例中提供其他表面輪廓,包括但不限於非平面表面輪廓、成角度表面輪廓、交錯表面輪廓、及階梯表面輪廓。As shown in FIGS. 5-7, in some embodiments, with respect to the first axis 「X」, block 501 may be stacked on half block 502 and block 507; block 503 may be stacked on half block 504 and block 508; block 505 can be stacked on half block 506 and block 509. Similarly, half blocks 502 and 507 may be stacked on block 503; half blocks 504 and 508 may be stacked on block 505, thereby providing an electrode assembly 301 including a plurality of stacked blocks 500. In some embodiments, the first distance “D1” and the second distance “D2” may define the front surface 303 of the electrode assembly 301. For example, in some embodiments, providing one or more half-blocks 502, 504, 506 (or other partial blocks) stacked with one or more whole blocks 501, 503, 505 (or corresponding partial blocks) can provide The electrode assembly 301 having the front surface 303 is in contact with the molten material 121 contained in the envelope region 315 of the container 105. In some embodiments, the front surface 303 may define a flat surface of the electrode assembly 301. In some embodiments, based at least in part on the stacking configuration and relative position of the plurality of blocks 500, and / or when the glass manufacturing apparatus 500 is operated, the wear of the ends of the plurality of blocks 500 defining the front side 303 of a portion of the electrode assembly 301, Other surface contours may be provided in other embodiments, including but not limited to non-planar surface contours, angled surface contours, staggered surface contours, and stepped surface contours.

另外,在一些實施例中,堆疊的塊500的第一塊可以沿著第三軸「Z」相對於堆疊的塊500的第二塊偏移(例如,交錯)。例如,如圖5~7所示,在一些實施例中,塊501可以沿著第三軸「Z」相對於半塊502偏移,並且塊507可以沿著第三軸「Z」相對於塊501偏移;塊503可以沿著第三軸「Z」相對於半塊504偏移,並且塊508可以沿著第三軸「Z」相對於塊503偏移;塊505可以沿著第三軸「Z」相對於半塊506偏移,並且塊509可以沿著第三軸「Z」相對於塊505偏移。類似地,在一些實施例中,塊503可以沿著第三軸「Z」相對於半塊502偏移,並且塊507可以沿著第三軸「Z」相對於塊503偏移;塊505可以沿著第三軸「Z」相對於半塊504偏移,並且塊508可以沿著第三軸「Z」相對於塊505偏移。在一些實施例中,電極組件301的相反的背面305可包括至少基於堆疊的塊500的相對偏移的非平面輪廓。In addition, in some embodiments, the first block of the stacked block 500 may be offset (eg, staggered) relative to the second block of the stacked block 500 along a third axis 「Z」. For example, as shown in FIGS. 5-7, in some embodiments, the block 501 may be offset relative to the half block 502 along the third axis 「Z」, and the block 507 may be relative to the block along the third axis 「Z」 501 offset; block 503 may be offset relative to half block 504 along the third axis 「Z」, and block 508 may be offset relative to block 503 along the third axis 「Z」; block 505 may be offset along the third axis 「Z」 is offset with respect to half block 506, and block 509 may be offset with respect to block 505 along the third axis 「Z」. Similarly, in some embodiments, block 503 may be offset relative to half block 502 along a third axis 「Z」, and block 507 may be offset relative to block 503 along a third axis 「Z」; block 505 may be Offset with respect to the half block 504 along the third axis 「Z」, and block 508 may be offset with respect to the block 505 along the third axis 「Z」. In some embodiments, the opposite back surface 305 of the electrode assembly 301 may include a non-planar profile based at least on the relative offset of the stacked blocks 500.

在一些實施例中,加熱裝置300與電極組件301還可以包括一或多個框架561、562包圍沿著第一軸「X」與第二軸「Y」而堆疊的塊500。在一些實施例中,每個框架561、562可對沿著第一軸「X」與第二軸「Y」中的至少一者上的該堆疊的塊500施加夾緊力。例如,在一些實施例中,藉由沿著第一軸「X」與第二軸「Y」中的至少一者施加夾緊力,在一些實施例中,框架561、562能夠將複數個塊500以堆疊配置而保持在一起,以提供塊500的結構穩定的堆疊。同樣,在一些實施例中,透過沿著第一軸「X」與第二軸「Y」中的至少一者施加的夾緊力,在一些實施例中,框架561、562可以強制相鄰塊的一或多個面(例如,表面)形成抵靠關係,以在複數個塊500之間提供導電性。例如,在一些實施例中,電引線307(圖3~5)可電連接到電極組件301及/或電連接到一或多個框架561、562,其可以同樣地電連接至電極組件301的複數個塊500中的一或多個塊。在一些實施例中,由框架561、562所提供的夾緊力可以強制(例如,推、壓、保持)相鄰,將該複數個塊500的面抵靠在一起,以提供該複數個塊500的之間的導電界面。因此,在一些實施例中,電流325(由電引線307提供的)可從電極組件301的正面303通過,經過包含在包封區域315中的材料121,基於焦耳加熱原理從而加熱材料121。In some embodiments, the heating device 300 and the electrode assembly 301 may further include one or more frames 561, 562 surrounding the block 500 stacked along the first axis 「X」 and the second axis 「Y」. In some embodiments, each frame 561, 562 may apply a clamping force to the stacked block 500 along at least one of the first axis 「X」 and the second axis 「Y」. For example, in some embodiments, by applying a clamping force along at least one of the first axis 「X」 and the second axis 「Y」, in some embodiments, the frames 561, 562 are capable of holding a plurality of blocks The 500s are held together in a stacked configuration to provide a structurally stable stack of blocks 500. Similarly, in some embodiments, the frames 561, 562 may force adjacent blocks through a clamping force applied along at least one of the first axis 「X」 and the second axis 「Y」. One or more faces (eg, surfaces) form abutting relationship to provide conductivity between the plurality of blocks 500. For example, in some embodiments, the electrical lead 307 (FIGS. 3-5) may be electrically connected to the electrode assembly 301 and / or to one or more frames 561, 562, which may be electrically connected to the electrode assembly 301 as well. One or more of the plurality of blocks 500. In some embodiments, the clamping forces provided by the frames 561, 562 may force (eg, push, press, hold) adjacent, abut the faces of the plurality of blocks 500 together to provide the plurality of blocks. 500's conductive interface. Therefore, in some embodiments, a current 325 (provided by the electrical lead 307) may pass through the front surface 303 of the electrode assembly 301, pass through the material 121 contained in the encapsulation area 315, and heat the material 121 based on the Joule heating principle.

在一些實施例中,框架561、562係沿著在第三軸「Z」上延伸的路徑(例如,圖6與圖7中的路徑565)為可選擇性地移動。例如,在一些實施例中,框架561、562可以沿著加熱裝置300的一或多個導軌550a、555a、550b、555b為手動的與自動的選擇性地運動中的至少一者。在一些實施例中,框架561、562能夠基於滾動接合(例如,輪式)、齒輪式接合、槽式接合、滑動接合或其他機械式接合,或經導向以提供在框架561、562與導軌550a、555a、550b、555b之間的選擇性相對運動的連接,而沿著導軌550a、555a、550b、555b移動。此外,在一些實施例中,框架561可相對於框架562為獨立可移動,以使得每個框架561、562可沿著在第三軸「Z」上延伸的路徑(例如,圖6與圖7中的路徑565)獨立地且選擇性地可移動。如以下更充分說明,在一些實施例中,每個框架561、562可沿著在第三軸「Z」上延伸的路徑565,以相對於導軌550a、555a、550b、555b,及/或相對於該複數個塊500,可獨立地且選擇性地可移動。In some embodiments, the frames 561, 562 are selectively movable along a path (eg, path 565 in FIGS. 6 and 7) extending on the third axis 「Z「. For example, in some embodiments, the frames 561, 562 may be at least one of manual and automatic selective movement along one or more guide rails 550a, 555a, 550b, 555b of the heating device 300. In some embodiments, the frames 561, 562 can be based on rolling engagements (eg, wheeled), geared engagements, grooved engagements, sliding engagements, or other mechanical engagements, or guided to provide the frames 561, 562 with the rails 550a , 555a, 550b, 555b, and selectively move relative to each other, while moving along the guide rails 550a, 555a, 550b, 555b. In addition, in some embodiments, the frame 561 may be independently movable relative to the frame 562 such that each frame 561, 562 may follow a path extending on the third axis 「Z ((for example, FIGS. 6 and 7 Path 565) is independently and selectively movable. As explained more fully below, in some embodiments, each frame 561, 562 may follow a path 565 extending on the third axis 「Z」, relative to the guide rails 550a, 555a, 550b, 555b, and / or relative The plurality of blocks 500 can be independently and selectively movable.

因此,如圖6中概要地圖示,在一些實施例中,對沿著第一軸「X」與第二軸「Y」中的至少一者的該複數個塊500提供夾緊力的一或多個框架561、562,可以選擇性地相對於第一開口403被沿著在方向「Z」上延伸的調節路徑565平移,以沿著在方向「Z」上的調節路徑565,平移電極組件301的正面303。如圖7中概要地圖示,在一些實施例中,沿著路徑565相對於第一開口403平移夾緊電極組件301的複數個塊500的一或多個框架561、562,可沿著調整路徑565移動電極組件301的正面303,以補償在操作玻璃製造設備100時由磨損所引起的電極組件301的正面303的結構劣化。此外,如圖8所示,在一些實施例中,可對堆疊的塊500增加附加塊510、511、512(例如,堆疊)。例如,在一些實施例中,當操作該玻璃製造裝置100時,隨著電極組件301的正面303磨損(例如,劣化),如圖9所示,可增加一或多個附加塊510、511、512以取代並補充電極組件301的結構。Therefore, as schematically illustrated in FIG. 6, in some embodiments, one of the clamping forces 500 is provided to the plurality of blocks 500 along at least one of the first axis 「X」 and the second axis 「Y」. The plurality of frames 561, 562 may be selectively translated relative to the first opening 403 along the adjustment path 565 extending in the direction 「Z」 to translate the electrode along the adjustment path 565 in the direction 「Z」. The front side 303 of the component 301. As schematically illustrated in FIG. 7, in some embodiments, one or more frames 561, 562 of the plurality of blocks 500 of the clamp electrode assembly 301 are translated along the path 565 relative to the first opening 403, which can be adjusted along The path 565 moves the front surface 303 of the electrode assembly 301 to compensate for structural deterioration of the front surface 303 of the electrode assembly 301 caused by abrasion when the glass manufacturing apparatus 100 is operated. In addition, as shown in FIG. 8, in some embodiments, additional blocks 510, 511, 512 (eg, stacking) may be added to the stacked blocks 500. For example, in some embodiments, when the glass manufacturing apparatus 100 is operated, as the front surface 303 of the electrode assembly 301 is worn (eg, deteriorated), as shown in FIG. 9, one or more additional blocks 510, 511, 512 replaces and supplements the structure of the electrode assembly 301.

類似地,如圖10中概要地圖示,在一些實施例中,在對電極組件301的堆疊的塊500增加一或多個附加塊510、511、512之後,對沿著第一軸「X」與第二軸「Y」中的至少一者的堆疊的塊500提供夾緊力的一或多個框架561、562,可進一步相對於沿著在方向「Z」延伸的調節路徑565而被選擇性地平移,以沿著在方向「Z」延伸的調節路徑565而平移電極組件301的正面303,以補償在操作玻璃製造裝置100時由磨損引起的電極組件301的正面303的進一步結構劣化。同樣,如圖11所示,在一些實施例中,可對堆疊的塊500增加附加塊513、514、515(例如,堆疊)。例如,如圖12所示,當操作該玻璃製造裝置100時,隨著電極組件301的正面303在一段期間內的磨損(例如,劣化),可增加一或多個附加塊513、514、515以取代並補充電極組件301的結構。如將能理解的,在一些實施例中,當在操作該玻璃製造裝置100時,增加一或多個附加塊的流程可以執行一次或多次,以當電極組件301的正面303磨損並劣化時,能選擇性地且連續地替換及補充電極組件301的結構。Similarly, as schematically illustrated in Figure 10, in some embodiments, after adding one or more additional blocks 510, 511, 512 to the stacked block 500 of the electrode assembly 301, The stacked block 500 of at least one of 」and the second axis「 Y 」provides one or more frames 561, 562 that provide a clamping force, and may be further moved relative to the adjustment path 565 extending in the direction「 Z 」. Selectively translate to translate the front surface 303 of the electrode assembly 301 along the adjustment path 565 extending in the direction 「Z」 to compensate for further structural deterioration of the front surface 303 of the electrode assembly 301 caused by abrasion during operation of the glass manufacturing apparatus 100 . Also, as shown in FIG. 11, in some embodiments, additional blocks 513, 514, 515 (eg, stacking) may be added to the stacked blocks 500. For example, as shown in FIG. 12, when the glass manufacturing apparatus 100 is operated, as the front surface 303 of the electrode assembly 301 is worn (eg, deteriorated) over a period of time, one or more additional blocks 513, 514, 515 may be added. To replace and supplement the structure of the electrode assembly 301. As will be understood, in some embodiments, when the glass manufacturing apparatus 100 is operated, the process of adding one or more additional blocks may be performed one or more times so that when the front surface 303 of the electrode assembly 301 is worn and deteriorated The structure of the electrode assembly 301 can be replaced and supplemented selectively and continuously.

另外,如圖5所示,在一些實施例中,框架561、562可包括緊固件575,其可操作成選擇性地施加夾緊力。例如,圖15~17中提供了相對於框架561的示例性緊固件的各種實施例,應理解一或多個緊固件,包括沒有明顯揭示的緊固件,可以在進一步的實施例中選擇性地且獨立地對每個框架561、562提供夾緊力,而不脫離本案的範圍。In addition, as shown in FIG. 5, in some embodiments, the frames 561, 562 may include a fastener 575 that is operable to selectively apply a clamping force. For example, various embodiments of exemplary fasteners relative to the frame 561 are provided in FIGS. 15-17. It should be understood that one or more fasteners, including fasteners that are not explicitly disclosed, may be selectively used in further embodiments. And each frame 561, 562 is independently provided with a clamping force without departing from the scope of the present case.

如圖15所示,在一些實施例中,緊固件575可包括螺栓701及螺母702。在一些實施例中,螺栓701及螺母702可以機械地連接框架561的第一部分561a與第二部分561b。例如,在一些實施例中,螺栓701及螺母702可將框架561的第一部分561a的第一托架576連接至框架561的第二部分561b的第二托架577。因此,在一些實施例中,螺母702相對於螺栓701的操作(例如,鬆開或擰緊)可以分別增加或減小框架561的第一部分561a與第二部分561b之間的距離「d」。As shown in FIG. 15, in some embodiments, the fastener 575 may include a bolt 701 and a nut 702. In some embodiments, the bolt 701 and the nut 702 may mechanically connect the first portion 561a and the second portion 561b of the frame 561. For example, in some embodiments, the bolts 701 and nuts 702 may connect the first bracket 576 of the first portion 561a of the frame 561 to the second bracket 577 of the second portion 561b of the frame 561. Therefore, in some embodiments, the operation (eg, loosening or tightening) of the nut 702 relative to the bolt 701 may increase or decrease the distance 「d」 between the first portion 561a and the second portion 561b of the frame 561, respectively.

如圖16所示,在一些實施例中,緊固件575可包括鉤703及桿704。在一些實施例中,鉤703及桿704可以機械地連接框架561的第一部分561a與第二部分561b。例如,在一些實施例中,桿704及鉤703可將框架561的第一部分561a的第一托架576連接至框架561的第二部分561b的第二托架577。因此,在一些實施例中,槓桿704相對於鉤703的操作(例如,沿著路徑705的旋轉)可以分別減小或增加框架561的第一部分561與第二部分561b之間的距離「d」。As shown in FIG. 16, in some embodiments, the fastener 575 may include a hook 703 and a rod 704. In some embodiments, the hook 703 and the lever 704 may mechanically connect the first portion 561a and the second portion 561b of the frame 561. For example, in some embodiments, the lever 704 and the hook 703 may connect the first bracket 576 of the first portion 561a of the frame 561 to the second bracket 577 of the second portion 561b of the frame 561. Therefore, in some embodiments, the operation of the lever 704 relative to the hook 703 (eg, rotation along the path 705) may reduce or increase the distance 「d」 between the first portion 561 and the second portion 561b of the frame 561, respectively. .

如圖17所示,在一些實施例中,緊固件575可包括拉伸彈簧706。在一些實施例中,拉伸彈簧706可以機械地連接框架561的第一部分561a與第二部分561b。例如,在一些實施例中,張力彈簧706可將框架561的第一部分561a的第一托架576連接至框架561的第二部分561b的第二托架577。因此,在一些實施例中,拉伸彈簧706可以相對於第一托架576與第二托架577施加壓縮力,該壓縮力可以減小框架561的第一部分561a與第二部分561b之間的距離「d」。相反,在一些實施例中,拉伸彈簧706的相對於第一托架576與第二托架577的反向的力,可以增加框架561的第一部分561a與第二部分561b之間的距離「d」。在一些實施例中,減小距離「d」可以增加(例如,施加)堆疊的塊500上的夾緊力,而增加距離「d」可以減小(例如,移除)堆疊的塊500上的夾緊力。As shown in FIG. 17, in some embodiments, the fastener 575 may include a tension spring 706. In some embodiments, the tension spring 706 may mechanically connect the first portion 561a and the second portion 561b of the frame 561. For example, in some embodiments, the tension spring 706 may connect the first bracket 576 of the first portion 561a of the frame 561 to the second bracket 577 of the second portion 561b of the frame 561. Therefore, in some embodiments, the tension spring 706 may apply a compressive force with respect to the first bracket 576 and the second bracket 577, and the compression force may reduce the pressure between the first portion 561a and the second portion 561b of the frame 561. Distance 「d」. In contrast, in some embodiments, the opposite force of the tension spring 706 relative to the first bracket 576 and the second bracket 577 may increase the distance between the first portion 561a and the second portion 561b of the frame 561. d 」. In some embodiments, decreasing the distance 「d」 may increase (eg, apply) the clamping force on the stacked block 500, and increasing the distance 「d」 may decrease (eg, remove) the Clamping force.

例如,如圖8所示,在一些實施例中,框架561可施加夾緊力至堆疊的塊500以將複數個塊500保持在堆疊配置中。另外,在一些實施例中,框架562的夾緊力可被移除,且框架562可接著被向方向566平移以定位以接收附加塊510、511、512。在一些實施例中,藉由使用至少兩個獨立的可移動框架561、562,至少一個框架(例如,框架561)可施加夾緊力並保持該複數個塊500的堆疊配置,而可以移除另一個框架(例如,框架562)的至少一個的夾緊力以允許未被夾緊的框架562在相對於堆疊的塊500的方向566上平移。如圖1所示。9,一旦附加塊510、511、512已被添加到塊500的堆疊,框架562的夾緊力可隨後被施加到保持附加塊510、511、512在與現有的塊501的堆疊配置、503、505、507、508、509,由此定義出該複數個塊電極組件301的500的。此外,在一些實施例中,一旦施加了框架562的夾緊力,則可以移除框架561的夾緊力以允許未夾緊框架561在方向566上相對於堆疊的塊500平移。也就是說,在一些實施例中,框架561、562可用來選擇性地對電極組件301的堆疊的塊500彼此獨立地及/或彼此同時地施加及/或移除夾緊力。在一些實施例中,至少一個框架561、562可提供夾緊力來保持該些塊500的堆疊配置,並確保在該些塊500的各個面之間的電接觸,例如,定義出操作玻璃製造裝置100整個時間段。For example, as shown in FIG. 8, in some embodiments, the frame 561 may apply a clamping force to the stacked blocks 500 to maintain the plurality of blocks 500 in a stacked configuration. In addition, in some embodiments, the clamping force of the frame 562 may be removed, and the frame 562 may then be translated in the direction 566 to be positioned to receive the additional blocks 510, 511, 512. In some embodiments, by using at least two independent movable frames 561, 562, at least one frame (eg, frame 561) can apply a clamping force and maintain the stacked configuration of the plurality of blocks 500, which can be removed The clamping force of at least one of the other frames (eg, the frame 562) to allow the unclamped frame 562 to translate in a direction 566 relative to the stacked block 500. As shown in Figure 1. 9. Once the additional blocks 510, 511, 512 have been added to the stack of block 500, the clamping force of the frame 562 can then be applied to keep the additional blocks 510, 511, 512 in a stacked configuration with the existing block 501, 503, 505, 507, 508, 509, thereby defining 500 of the plurality of block electrode assemblies 301. Further, in some embodiments, once the clamping force of the frame 562 is applied, the clamping force of the frame 561 may be removed to allow the unclamped frame 561 to translate in the direction 566 relative to the stacked block 500. That is, in some embodiments, the frames 561, 562 may be used to selectively apply and / or remove clamping forces to the stacked blocks 500 of the electrode assembly 301 independently of each other and / or simultaneously with each other. In some embodiments, at least one frame 561, 562 may provide a clamping force to maintain the stacked configuration of the blocks 500 and ensure electrical contact between the various faces of the blocks 500, for example, to define operating glass manufacturing Device 100 for the entire time period.

在一些實施例中,一或多個夾緊框架(例如,圖6中的框架561、562)可施加夾緊力以保持該些塊500的堆疊配置,而電極組件301是固定的。同樣,在一些實施例中,夾緊框架(例如,圖6與圖7中的框架561、562)可相對於沿著在方向「Z」上延伸的調節路徑565上的第一開口403平移,以沿著在方向「Z」上的調節路徑565平移電極組件301的正面303,以補償在操作玻璃製造裝置100時由磨損所引起的電極組件301的正面303的結構劣化。類似地,在一些實施例中,一旦增加了附加塊510、511、512(如圖8與圖9中概要地圖示),該夾緊框架(例如,圖10中的框架561、562)可相對於沿著在方向「Z」上延伸的調節路徑565上的第一開口403平移,以沿著在方向「Z」上的調節路徑565平移電極組件301的正面303,以補償在操作玻璃製造裝置100時由磨損所引起的電極組件301的正面303的進一步結構劣化。In some embodiments, one or more clamping frames (eg, frames 561, 562 in FIG. 6) may apply a clamping force to maintain the stacked configuration of the blocks 500, while the electrode assembly 301 is fixed. Similarly, in some embodiments, the clamping frame (eg, the frames 561, 562 in FIGS. 6 and 7) can be translated relative to the first opening 403 along the adjustment path 565 extending in the direction 「Z」, The front surface 303 of the electrode assembly 301 is translated along the adjustment path 565 in the direction 「Z」 to compensate for the structural deterioration of the front surface 303 of the electrode assembly 301 caused by abrasion when the glass manufacturing apparatus 100 is operated. Similarly, in some embodiments, once additional blocks 510, 511, 512 are added (as schematically illustrated in Figures 8 and 9), the clamping frame (eg, frames 561, 562 in Figure 10) may be Translate with respect to the first opening 403 on the adjustment path 565 extending in the direction 」Z」 to translate the front surface 303 of the electrode assembly 301 along the adjustment path 565 in the direction 「Z」 to compensate for the manufacturing of the operating glass The structure of the front surface 303 of the electrode assembly 301 caused by abrasion during the device 100 is further deteriorated.

如圖11所示,在一些實施例中,例如,在沿著在方向「Z」上的調節路徑565平移電極組件301的正面303以補償在操作該玻璃製造裝置100時因磨損所引起的電極組件301的正面303的進一步結構劣化之後,可再次移除框架562的夾緊力,且框架562可接著在方向566上平移以定位以接收附加塊513、514、515,而框架561可施加夾緊力並將複數個塊500保持堆疊配置。如圖12所示,一旦附加塊513、514、515已被添加到塊500的堆疊上,可接著施加框架562的夾緊力以保持附加塊513、514、515與現有的塊507、508、509、510、511、512的堆疊配置,從而定義出電極組件301的複數個塊500。如前所述,在一些實施例中,一旦施加了框架562的夾緊力,就可以移除框架561的夾緊力以允許未夾緊的框架561相對於堆疊的塊500平移,同時框架562施加夾緊力將塊500保持在堆疊配置中。因此,在一些實施例中,夾緊的框架(例如,圖12中的框架561、562)可接著相對於沿著在方向「Z」上延伸的調節路徑565上的第一開口403平移,以沿著在方向「Z」上的調節路徑565平移電極組件301的正面303,以補償在操作玻璃製造裝置100時由磨損所引起的電極組件301的正面303的進一步結構劣化。除非另有說明,否則應當理解的是,在不脫離本案的範圍的情況下,在玻璃製造裝置100的操作之前、期間、或之後,夾緊及鬆開框架561、562,平移電極組件301以補償磨損,以及增加附加塊至堆疊的塊500的的程序可進行複數次(例如,重複)。As shown in FIG. 11, in some embodiments, for example, the front surface 303 of the electrode assembly 301 is translated along the adjustment path 565 in the direction 「Z」 to compensate for the electrode caused by abrasion when the glass manufacturing apparatus 100 is operated. After further structural deterioration of the front side 303 of the module 301, the clamping force of the frame 562 can be removed again, and the frame 562 can then be translated in direction 566 to position to receive the additional blocks 513, 514, 515, and the frame 561 can apply a clamp Tighten and keep the plurality of blocks 500 in a stacked configuration. As shown in FIG. 12, once the additional blocks 513, 514, and 515 have been added to the stack of the blocks 500, the clamping force of the frame 562 may then be applied to keep the additional blocks 513, 514, and 515 and the existing blocks 507, 508, The stacked configurations of 509, 510, 511, and 512 define a plurality of blocks 500 of the electrode assembly 301. As mentioned previously, in some embodiments, once the clamping force of the frame 562 is applied, the clamping force of the frame 561 may be removed to allow the unclamped frame 561 to translate relative to the stacked block 500 while the frame 562 A clamping force is applied to hold the block 500 in a stacked configuration. Therefore, in some embodiments, the clamped frame (eg, frames 561, 562 in FIG. 12) may then be translated relative to the first opening 403 along the adjustment path 565 extending in the direction 「Z」 to The front surface 303 of the electrode assembly 301 is translated along the adjustment path 565 in the direction 「Z」 to compensate for further structural deterioration of the front surface 303 of the electrode assembly 301 caused by abrasion when the glass manufacturing apparatus 100 is operated. Unless otherwise stated, it should be understood that, without departing from the scope of this case, before, during, or after the operation of the glass manufacturing apparatus 100, the frames 561, 562 are clamped and released, and the electrode assembly 301 is translated to The process of compensating for wear, and adding additional blocks to the stacked blocks 500 may be performed multiple times (eg, repeated).

圖13中圖示出了示例性塊525,可理解的是,在一些實施例中,一或多個複數個塊500可以是相同的示例性塊525。此外,在一些實施例中,在不脫離本案的範圍的情況下,複數個塊500中的一或多個可包括與示例性塊525的特徵相同或相似的一或多個特徵,以及與示例性塊525的特徵不同的一或多個特徵。同樣,在一些實施例中,複數個塊500中的一或多個可提供作為示例性塊525的部分(例如,四分之一、三分之一、一半、三分之二、四分之三等)的塊。例如,在一些實施例中,塊525可包括從塊525的第一端525a延伸至塊525的第二端525b的第一表面525d、525e。在一些實施例中,塊525可以包括與第一表面525d、525e相對的,且從塊525的第一端525a延伸至塊525的第二端525b的第二表面525c。在一些實施例中,塊525的第三表面525f及塊525的相對的第四表面525g,可在第一表面525d、525e、第二表面525c、第一端525a、及第二端525b內定義出塊525的個別的外邊界。在一些實施例中,第一表面525d、525e可以定義出塊525的非平面邊界。例如,在一些實施例中,表面的第一平面部分525d可以以非零角度與表面的第二平面部分525e相交,以定義出塊525的非平面邊界。在一些實施例中,第一平面部分525d與第二平面部分525e中的至少一者可以相對於X-Y平面以非垂直的角度延伸。儘管未明確示出,但應理解,在一些實施例中,在不脫離本案的範圍的情況下,可提供第一表面525d、525e的一或多個平面及/或非平面(例如,彎曲的、階梯狀的、波浪形的、成角度的)部分,以定義出塊525的非平面(例如,彎曲的、階梯狀的、波浪形的、成角度的)邊界。An exemplary block 525 is illustrated in FIG. 13, and it is understood that in some embodiments, one or more of the plurality of blocks 500 may be the same exemplary block 525. Further, in some embodiments, one or more of the plurality of blocks 500 may include one or more features that are the same as or similar to the features of the exemplary block 525, as well as examples, without departing from the scope of the present case. The characteristics of the sexual block 525 are different from one or more characteristics. Also, in some embodiments, one or more of the plurality of blocks 500 may be provided as part of an exemplary block 525 (eg, a quarter, a third, a half, a two-thirds, a quarter Third class). For example, in some embodiments, block 525 may include first surfaces 525d, 525e that extend from a first end 525a of block 525 to a second end 525b of block 525. In some embodiments, the block 525 may include a second surface 525c opposite the first surface 525d, 525e and extending from a first end 525a of the block 525 to a second end 525b of the block 525. In some embodiments, the third surface 525f of the block 525 and the opposite fourth surface 525g of the block 525 may be defined within the first surface 525d, 525e, the second surface 525c, the first end 525a, and the second end 525b. Individual outer boundaries of block 525 are produced. In some embodiments, the first surfaces 525d, 525e may define a non-planar boundary of the block 525. For example, in some embodiments, the first planar portion 525d of the surface may intersect the second planar portion 525e of the surface at a non-zero angle to define a non-planar boundary of the block 525. In some embodiments, at least one of the first planar portion 525d and the second planar portion 525e may extend at a non-vertical angle with respect to the X-Y plane. Although not explicitly shown, it should be understood that in some embodiments, one or more planar and / or non-planar (e.g., curved) surfaces of the first surface 525d, 525e may be provided without departing from the scope of the present application. , Stepped, wavy, angled) portion to define the non-planar (eg, curved, stepped, wavy, angled) boundary of block 525.

不受理論的束縛,可推知的是,塊525的第一表面525d、525e的非平面邊界可以在相鄰的抵靠塊之間提供,例如,相較於相當的平面邊界更好的電接觸。此外,在一些實施例中,還可以至少部分地基於塊的偏移(例如,交錯)堆疊以及定義出緊鄰塊之間的一或多個界面的非平面邊界來增加塊500的結構穩定性,因為電極組件301是提供於靜止位置,且/或 與例如具有相當的平面邊界的塊堆疊相比,因電極組件301是在玻璃製造設備100的操作期間被平移。Without being bound by theory, it can be inferred that the non-planar boundaries of the first surfaces 525d, 525e of the block 525 can be provided between adjacent abutting blocks, for example, better electrical contact than comparable planar boundaries . In addition, in some embodiments, the structural stability of the block 500 may also be increased based at least in part on the offset (eg, interlaced) stacking of the blocks and on non-planar boundaries defining one or more interfaces immediately between the blocks, Because the electrode assembly 301 is provided in a rest position, and / or compared to, for example, a stack of blocks with considerable planar boundaries, the electrode assembly 301 is translated during operation of the glass manufacturing apparatus 100.

例如,圖14圖示出了根據本案的實施例的沿著第一軸「X」堆疊並沿著第三軸「Z」偏移(例如,交錯)的複數個塊500的示例性實施例。提供一部分的電極組件301,包括塊501、半塊502、及塊507、510及513。在一些實施例中,塊501可以包括第一端501a、第二端501b、定義出塊501的非平面邊界的第一表面501d、501e、第二表面501c,及相對於示例性塊525所描述的第三表面501f(圖13)。同樣,在一些實施例中,半塊502可包括第一端502a、第二端502b、定義出塊502的一部分非平面邊界的第一表面502e、第二表面502c、及第三表面502f。類似地,在一些實施例中,塊507、510、513可包括第一端507a、510a、513a,第二端507b、510b、513b,定義出塊507、510、513的非平面邊界的第一表面507d、507e、510d、510e、513d、513e、第二表面507c、510c、513c、及相對於示例性塊525所描述的第三表面507f、510f、513f(圖13)。For example, FIG. 14 illustrates an exemplary embodiment of a plurality of blocks 500 stacked along a first axis 「X」 and offset (eg, staggered) along a third axis 「Z」 according to an embodiment of the present case. A part of the electrode assembly 301 is provided, including blocks 501, half blocks 502, and blocks 507, 510, and 513. In some embodiments, the block 501 may include a first end 501a, a second end 501b, a first surface 501d, 501e, a second surface 501c defining a non-planar boundary of the block 501, and described with respect to the exemplary block 525 Third surface 501f (Figure 13). Similarly, in some embodiments, the half-block 502 may include a first end 502a, a second end 502b, a first surface 502e, a second surface 502c, and a third surface 502f defining a portion of a non-planar boundary of the block 502. Similarly, in some embodiments, the blocks 507, 510, 513 may include a first end 507a, 510a, 513a, a second end 507b, 510b, 513b, defining a first non-planar boundary of the blocks 507, 510, 513 Surfaces 507d, 507e, 510d, 510e, 513d, 513e, second surfaces 507c, 510c, 513c, and third surfaces 507f, 510f, 513f described with respect to the exemplary block 525 (FIG. 13).

在一些實施例中,沿著第三軸「Z」從端501a到端501b定義出的塊501的第一尺寸「d1」,可大於沿著第三軸「Z」從端502a到端502b定義出的塊502的第二尺寸「d2」。另外,在一些實施例中,第一塊501的端501b可以定義出電極組件301的第一面303的第一部分,並且第二塊502的端502a可以定義出電極組件301的第一面303的第二部分。如所述的,在一些實施例中,至少一部分的第一面303可以定義出電極組件301的平坦表面。在一些實施例中,沿著第三軸「Z」從端507a到端507b定義出的塊507的第三尺寸「d3」,可大於塊502的第二尺寸「d2」。在一些實施例中,塊501的第一尺寸「d1」可以等於塊507的第三尺寸「d3」。In some embodiments, the first dimension 「d1」 of the block 501 defined from the end 501a to the end 501b along the third axis 「Z」 may be larger than the definition from the end 502a to the end 502b along the third axis 「Z」. The second dimension of the block 502 is d2. In addition, in some embodiments, the end 501b of the first block 501 may define the first part of the first surface 303 of the electrode assembly 301, and the end 502a of the second block 502 may define the first surface 303 of the electrode assembly 301. the second part. As mentioned, in some embodiments, at least a portion of the first face 303 may define a flat surface of the electrode assembly 301. In some embodiments, the third dimension 「d3」 of the block 507 defined from the end 507a to the end 507b along the third axis 「Z」 may be larger than the second size 「d2」 of the block 502. In some embodiments, the first size 「d1」 of block 501 may be equal to the third size 「d3」 of block 507.

在一些實施例中,定義塊501的非平面邊界的該表面的部分501e,可面向定義出至少半塊502的一部分非平面邊界的該表面的部分502e。例如,在一些實施例中,表面的定義塊的非平面邊界的部分501E501能夠抵靠在界面521定義出至少半框502的非平面邊界的一部分的表面的部分502E。同樣,在一些實施例中,定義出塊501的非平面邊界的表面的部分501d,可以面向定義出塊507的非平面邊界的表面的部分507d。例如,在一些實施例中,定義出塊501的非平面邊界的表面的部分501d,可以在界面571處抵靠定義出塊507的非平面邊界的表面的部分507d。類似地,在一些實施例中,定義出塊507的非平面邊界的表面的部分507e,可面向定義出塊510的非平面邊界的表面的部分510e。例如,在一些實施例中,定義出塊507的非平面邊界的表面的部分507e可以在一界面處抵靠定義出塊510的非平面邊界的表面的部分510e。應當理解,堆疊的塊500的交錯方式可以重複用任何數量的塊及/或部分的塊,而不脫離本案的範圍。In some embodiments, a portion 501e of the surface that defines a non-planar boundary of the block 501 may face a portion 502e of the surface that defines a non-planar boundary of at least a half of the block 502. For example, in some embodiments, the portion 501E501 of the surface that defines the non-planar boundary of the block can abut the portion 502E of the surface that defines at least a portion of the non-planar boundary of the half-frame 502 on the interface 521. Similarly, in some embodiments, the portion 501d of the surface defining the non-planar boundary of the block 501 may face the portion 507d of the surface defining the non-planar boundary of the block 507. For example, in some embodiments, the portion 501d of the surface defining the non-planar boundary of the block 501 may abut the portion 507d of the surface defining the non-planar boundary of the block 507 at the interface 571. Similarly, in some embodiments, the portion 507e of the surface defining the non-planar boundary of the block 507 may face the portion 510e of the surface defining the non-planar boundary of the block 510. For example, in some embodiments, a portion 507e of the surface defining the non-planar boundary of the block 507 may abut against a portion 510e of the surface defining the non-planar boundary of the block 510 at an interface. It should be understood that the interleaved manner of the stacked blocks 500 may reuse any number of blocks and / or partial blocks without departing from the scope of the present case.

此外,在一些實施例中,定義出塊513的非平面邊界的表面的部分513d,可面向定義出塊510的非平面邊界的表面的部分510d。例如,在一些實施例中,定義出塊513的非平面邊界的表面的部分513d可經定位(例如,增加到該堆疊的塊500)以在一界面處抵靠定義出塊510的非平面邊界的表面的部分510d。另外,在一些實施例中,塊501的端501b及半塊502的端502a可以與定義出電極301的正面303的平坦表面共平面。在一些實施例中,塊501的端501a可面向(例如,抵靠)塊510的端510b,半塊502的端502b可以在界面527處面向(例如,抵靠)塊507的端507a,並且塊513的端513a可面向(例如,定位成抵靠)塊507的端507b。因此,在一些實施例中,緊鄰堆疊的塊500的抵靠表面之間的界面(例如,界面521、527、571),可以提供在定義出電極組件301的複數個塊500之間的電連接。同樣,在一些實施例中,可以重複堆疊及/或增加塊的程序,以在不中斷製造程序的情況下用新電極材料連續地替換及補充耗盡的電極材料。Further, in some embodiments, the portion 513d of the surface defining the non-planar boundary of the block 513 may face the portion 510d of the surface defining the non-planar boundary of the block 510. For example, in some embodiments, a portion 513d of a surface defining a non-planar boundary of the block 513 may be positioned (eg, added to the stacked block 500) to abut an non-planar boundary defining the block 510 at an interface. Part of the surface 510d. In addition, in some embodiments, the end 501b of the block 501 and the end 502a of the half block 502 may be coplanar with the flat surface defining the front surface 303 of the electrode 301. In some embodiments, end 501a of block 501 may face (eg, abut) end 510b of block 510, end 502b of half-block 502 may face (eg, abut) end 507a of block 507 at interface 527, and An end 513a of the block 513 may face (eg, be positioned against) an end 507b of the block 507. Therefore, in some embodiments, the interface (eg, interfaces 521, 527, 571) between the abutting surfaces of the stacked blocks 500 immediately adjacent can provide an electrical connection between the plurality of blocks 500 defining the electrode assembly 301 . Also, in some embodiments, the process of stacking and / or adding blocks may be repeated to continuously replace and replenish depleted electrode material with new electrode material without interrupting the manufacturing process.

此處描述的實施例及功能操作可以在數位電子電路系統中實現,或者在電腦軟體、韌體或硬體中實現,包括本說明書中公開的結構及其結構等同物,或者其中的一或多個的組合。於此描述的實施例可以實現為一或多個電腦程式產品,即,在有形程式載體上編碼的一或多個電腦程式指令模組,用於由資料處理裝置執行或控制資料處理裝置的操作。有形程序載體可以是電腦可讀媒體。電腦可讀媒體可以是機器可讀儲存裝置,機器可讀儲存基板、記憶體裝置、或其中的一或多個的組合。The embodiments and functional operations described herein can be implemented in digital electronic circuit systems, or in computer software, firmware, or hardware, including the structures disclosed in this specification and their structural equivalents, or one or more of them Combination. The embodiments described herein may be implemented as one or more computer program products, that is, one or more computer program instruction modules encoded on a tangible program carrier, for performing or controlling operations of the data processing device by the data processing device. . The tangible program carrier may be a computer-readable medium. The computer-readable medium may be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of them.

用語「處理器」或「控制器」可以包含用於處理資料的所有裝置、裝置與機器,包括例如可編程處理器,電腦或複數個處理器或電腦。除了硬體之外,處理器還可以包括所論述的電腦程式創建執行環境的代碼,例如,構成處理器韌體的代碼、協定堆疊、資料庫管理系統、操作系統、或者其中一或多個的組合。The term "processor" or "controller" may include all devices, devices, and machines for processing data, including, for example, a programmable processor, a computer, or a plurality of processors or computers. In addition to hardware, the processor may also include code for the computer program in question to create an execution environment, such as code that forms the processor firmware, protocol stacks, a database management system, an operating system, or one or more of them. combination.

電腦程式(也稱為程式、軟體,軟體應用程式、指令碼、或代碼)可以用任何形式的編程語言編寫,包括編譯或解釋語言,或宣告或程序語言,並且可以以任何形式使用包括作為獨立程式或作為模組、組件、子程式或適用於計算環境的其他單元。電腦程式不一定對應於文件系統中的文件。程式可以儲存在文件的一部分中,該文件保存其他程式或資料(例如,儲存在標記語言文檔中的一或多個腳本),儲存在專用於所論述的程式的單個文件中,或儲存在複數個協調文件中(例如,儲存一或多個模組,子程式或代碼部分的文件。可以使用電腦程式以在一個電腦上或在位於一個站點上或分佈在複數個站點上並透過通訊網絡互相連接的複數個電腦上執行。Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any form of programming language, including compiled or interpreted languages, or declaration or programming languages, and can be used in any form, including as a stand-alone A program or as a module, component, subroutine, or other unit suitable for a computing environment. Computer programs do not necessarily correspond to files in the file system. Programs can be stored in a part of a document that holds other programs or information (for example, one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in the plural In a coordination document (for example, a document that stores one or more modules, subroutines, or code sections. A computer program can be used on a computer or on one site or distributed across multiple sites and communicated through The network is executed on a plurality of computers connected to each other.

於此所述的流程可以由執行一或多個電腦程式的一或多個可編程處理器執行,以透過對輸入資料進行操作並產生輸出來執行功能。流程及邏輯也可以由專用邏輯電路執行,並且裝置也可以實現為專用邏輯電路,例如FPGA(現場可編程門陣列)或ASIC(專用集成電路)等。The processes described herein can be executed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic can also be performed by dedicated logic circuits, and the device can also be implemented as dedicated logic circuits, such as FPGA (field programmable gate array) or ASIC (application-specific integrated circuit).

作為實例,適合於執行電腦程式的處理器包括通用及專用微處理器,以及任何類型的數位電腦的任何一或多個處理器。通常,處理器將從唯讀記憶體或隨機存取記憶體或兩者接收指令及資料。電腦的基本元件是用於執行指令的處理器及用於儲存指令及資料的一或多個資料記憶體裝置。通常,電腦還將包括或可操作地耦合以從一或多個大容量儲存裝置接收資料或將資料傳輸到一或多個大容量儲存裝置,或者用於儲存資料,例如磁碟、磁性光碟、或光碟。但是,電腦不需要此種裝置。此外,電腦可以嵌入另一個裝置中,例如攜帶電話、個人數位助理(PDA)等。As examples, processors suitable for running computer programs include general-purpose and special-purpose microprocessors, and any one or more processors of any type of digital computer. Generally, the processor will receive instructions and data from read-only memory or random access memory or both. The basic components of a computer are a processor for executing instructions and one or more data memory devices for storing instructions and data. Generally, a computer will also include or be operatively coupled to receive data from or transfer data to one or more mass storage devices, or to store data such as magnetic disks, magnetic optical disks, Or disc. However, computers do not require such devices. In addition, the computer can be embedded in another device, such as a mobile phone, personal digital assistant (PDA), and so on.

適用於儲存電腦程式指令及資料的電腦可讀媒體包括所有形式的資料記憶體,包括非揮發記憶體、媒體及記憶體裝置,包括例如半導體記憶體裝置,例如EPROM,EEPROM及快閃記憶體裝置;磁碟,例如內部硬碟或可移動磁碟;磁性光碟;及CDROM及DVD-ROM磁碟。處理器及記憶體可以由專用邏輯電路補充或併入專用邏輯電路中。Computer-readable media suitable for storing computer program instructions and data include all forms of data memory, including non-volatile memory, media, and memory devices, including, for example, semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices ; Magnetic disks, such as internal hard disks or removable disks; magnetic optical disks; and CDROM and DVD-ROM disks. The processor and the memory may be supplemented by or incorporated in a dedicated logic circuit.

為了提供與使用者的互動,此處描述的實施例可以在具有顯示裝置的電腦上實現,例如用於向使用者顯示資訊的CRT(陰極射線管)或LCD(液晶顯示器)監視器等,及鍵盤,及例如滑鼠、或軌跡球、或觸控螢幕的指示裝置,使用者可透過該觸控螢幕向電腦提供輸入。其他類型的裝置也可用於提供與使用者的互動;例如,可以以任何形式接收來自使用者的輸入,包括聲學、語音、或觸覺輸入。In order to provide interaction with the user, the embodiments described herein can be implemented on a computer having a display device, such as a CRT (Cathode Ray Tube) or LCD (Liquid Crystal Display) monitor for displaying information to the user, and A keyboard, and a pointing device such as a mouse, or trackball, or a touch screen, through which a user can provide input to a computer. Other types of devices can also be used to provide interaction with the user; for example, input from the user can be received in any form, including acoustic, speech, or haptic input.

於此所述的實施例可以在包括後端組件的計算系統中實現,後端組件例如作為資料伺服器,或者包括中間件部件,例如應用伺服器,或者包括前端部件,例如客戶端電腦。具有圖形使用者界面或網頁瀏覽器,使用者可透過該瀏覽器與本案所述的發明標的,實現或一或多個此種後端、中間件或前端部件的任何組合來進行互動。系統的部件可以透過任何形式或媒體的數位資料通訊互相連接,例如通訊網絡。通訊網絡的實例包括區域網路(「LAN」)及廣域網路(「WAN」),例如網際網路。The embodiments described herein can be implemented in a computing system that includes a back-end component, such as a data server, or a middleware component, such as an application server, or a front-end component, such as a client computer. With a graphical user interface or web browser, the user can interact with any combination of one or more such backends, middleware, or front-end components through the browser and the inventive subject matter described in this case. The components of the system can be connected to each other through digital data communication in any form or medium, such as a communication network. Examples of communication networks include a local area network (「LAN」) and a wide area network (「WAN」), such as the Internet.

計算系統可以包括客戶端及伺服器。客戶端及伺服器通常彼此遠離,並且通常透過通訊網絡進行互動。客戶端及伺服器的關係藉由在各個電腦上運行並且彼此具有客戶端-伺服器關係的電腦程式而產生。The computing system may include clients and servers. The client and server are usually remote from each other and usually interact through a communication network. The relationship between the client and the server is generated by a computer program running on each computer and having a client-server relationship with each other.

應當理解,所揭示的各種實施例可以涉及結合該特定實施例描述的特定特徵、元件、或步驟。還應理解,儘管關於一個特定實施例描述了特定特徵、元件、或步驟,但是可以與各種未圖示的組合或置換中的替換實施例互換或組合。It should be understood that the various disclosed embodiments may involve specific features, elements, or steps described in connection with this particular embodiment. It should also be understood that although a particular feature, element, or step has been described with respect to a particular embodiment, it can be interchanged or combined with alternative embodiments in various combinations or permutations not shown.

還應理解,除非明確地相反指出,否則如本案所用,用語「一」、「一個」、或「一個」表示「至少一個」,並且不應限於「僅一個」。同樣,「複數個」意欲表示「不止一個」。It should also be understood that, unless explicitly stated to the contrary, as used in this case, the terms 「a」, 案 a 」, or「 a 」represent「 at least one 」and should not be limited to 指出 only one」. Similarly, 「plural」 intends to indicate 「more than one」.

範圍在本案中可以表示為從「約」一個特定值,及/或到「約」另一個特定值。當表達此種範圍時,實施例包括從一個特定值及/或到另一個特定值。類似地,當透過使用先行詞「約」將值表示為近似值時,將理解該特定值形成另一個實施例。將進一步理解,每個範圍的端點相對於另一個端點都是重要的,並且獨立於另一個端點。The range in this case can be expressed as from about one specific value, and / or to about another specific value. When such a range is expressed, embodiments include going from one particular value and / or to another particular value. Similarly, when a value is expressed as an approximation by using the antecedent 「约, the specific value will be understood to form another embodiment. It will be further understood that the endpoint of each range is important relative to the other endpoint and is independent of the other endpoint.

此處使用的用語「實質的」、「基本上」及其變化型意欲所述的特徵等於或近似等於該值或該描述。The terms 「substantially」, 「substantially」, and variations thereof are used herein to mean that the characteristic described is equal to or approximately equal to the value or the description.

除非另有明確說明,否則決不意圖將本案的任何方法解釋為要求以特定順序執行其步驟。因此,在方法請求項實際上沒有記載其步驟所遵循的順序,或者在請求項或描述中沒有特別說明步驟將限於特定順序的情況下,並不意味著須推斷出任何特定的順序。Unless expressly stated otherwise, it is by no means intended to interpret any method in this case as requiring its steps to be performed in a particular order. Therefore, the fact that a method request does not record the order in which its steps are followed, or that the request or description does not specifically state that the steps will be limited to a particular order, does not imply that any particular order must be inferred.

儘管可以使用連接詞「包括」來公開特定實施例的各種特徵、元件、或步驟,但是應該理解,替代實施例,包括可以使用連接詞「由......組成」或「基本上由......組成」來暗示所述的實施例。因此,例如,對包括A+B+C的裝置的隱含的替代實施例,包括其中由A+B+C組成的實施例的裝置及其中裝置基本上由A+B+C組成的實施例。Although the connectives 「include」 may be used to disclose various features, elements, or steps of a particular embodiment, it should be understood that alternative embodiments, including the use of the connectives 」consist of」 or 「consist essentially of ... composed of 」to imply the described embodiment. Thus, for example, an implicit alternative embodiment to a device that includes A + B + C, a device that includes an embodiment in which A + B + C is included, and an embodiment in which the device consists essentially of A + B + C .

對於本領域技術人員顯而易見的是,在不脫離所附申請專利範圍的精神及範疇的情況下,可以對本案做出各種修改及變化。因此,本案意欲涵蓋本案實施例的修改及變化,包括落入所附申請專利範圍及其等同物的範圍內。It is obvious to those skilled in the art that various modifications and changes can be made to the present application without departing from the spirit and scope of the scope of the attached patent application. Therefore, this case intends to cover the modifications and changes of the embodiments of the present case, including falling within the scope of the attached patent application and its equivalents.

應當理解,儘管已經對於本發明的某些說明性及特定實施例詳細描述了各種實施例,但是本案不應被視為限於此,因為在不脫離以下申請專利範圍的情況下可以對所公開的特徵進行多種修改及組合。It should be understood that, although various embodiments have been described in detail for certain illustrative and specific embodiments of the invention, this case should not be considered as limited thereto, as the disclosed embodiments may be made without departing from the scope of the following patent applications Various modifications and combinations of features.

100‧‧‧玻璃製造設備100‧‧‧ glass manufacturing equipment

101‧‧‧玻璃成形裝置 101‧‧‧ glass forming device

103‧‧‧玻璃帶 103‧‧‧glass ribbon

104‧‧‧玻璃板 104‧‧‧glass plate

105‧‧‧熔化容器 105‧‧‧melting container

107‧‧‧批料 107‧‧‧ batch

109‧‧‧儲存箱 109‧‧‧Storage Box

111‧‧‧批量輸送裝置 111‧‧‧batch conveying device

113‧‧‧馬達 113‧‧‧ Motor

115‧‧‧控制器 115‧‧‧controller

117‧‧‧箭頭 117‧‧‧arrow

119‧‧‧玻璃熔體探針 119‧‧‧Glass Melt Probe

121‧‧‧熔融材料 121‧‧‧ Molten Materials

123‧‧‧立管 123‧‧‧ riser

125‧‧‧通訊線路 125‧‧‧communication line

127‧‧‧澄清容器 127‧‧‧clarified container

129‧‧‧第一連接導管 129‧‧‧The first connection catheter

131‧‧‧混合室 131‧‧‧ mixing room

133‧‧‧輸送容器 133‧‧‧conveying container

135‧‧‧第二連接導管 135‧‧‧Second connection catheter

137‧‧‧第三連接導管 137‧‧‧Third connection catheter

139‧‧‧輸送管 139‧‧‧conveying pipe

140‧‧‧成形容器 140‧‧‧formed container

141‧‧‧入口導管 141‧‧‧Inlet conduit

145‧‧‧根部 145‧‧‧root

149‧‧‧玻璃分離器 149‧‧‧ glass separator

151‧‧‧分離路徑 151‧‧‧Separation path

152‧‧‧中央部分 152‧‧‧Central Section

153‧‧‧第一外邊緣 153‧‧‧first outer edge

155‧‧‧第二外邊緣 155‧‧‧ second outer edge

157‧‧‧拉引方向 157‧‧‧pull direction

159‧‧‧方向 159‧‧‧direction

163a、163b‧‧‧邊緣導引器 163a, 163b‧‧‧Edge Guide

201‧‧‧槽 201‧‧‧slot

203a、203b‧‧‧堰 203a, 203b ‧‧‧ weir

205a、205b‧‧‧外表面 205a, 205b‧‧‧ Outer surface

207a、207b‧‧‧表面部分 207a, 207b‧‧‧ surface part

209‧‧‧成形楔 209‧‧‧shaped wedge

210a、210b‧‧‧端 210a, 210b‧‧‧

213‧‧‧拉引平面 213‧‧‧Pull plane

215a‧‧‧第一主表面 215a‧‧‧First major surface

215b‧‧‧第二主表面 215b‧‧‧Second major surface

300‧‧‧加熱裝置 300‧‧‧Heating device

301‧‧‧第一電極 301‧‧‧first electrode

302‧‧‧第二電極 302‧‧‧Second electrode

303‧‧‧正面 303‧‧‧front

304‧‧‧正面 304‧‧‧Front

305‧‧‧背面 305‧‧‧Back

306‧‧‧背面 306‧‧‧Back

307‧‧‧電引線 307‧‧‧electric leads

308‧‧‧電引線 308‧‧‧electric leads

310‧‧‧壁 310‧‧‧ wall

311‧‧‧內表面 311‧‧‧Inner surface

312‧‧‧內表面 312‧‧‧Inner surface

315‧‧‧包封區域 315‧‧‧ Encapsulation area

317‧‧‧箭頭 317‧‧‧arrow

325‧‧‧電流 325‧‧‧current

351‧‧‧方向 351‧‧‧direction

352‧‧‧方向 352‧‧‧direction

401‧‧‧第一孔 401‧‧‧first hole

402‧‧‧第二孔 402‧‧‧Second Hole

403‧‧‧第一開口 403‧‧‧first opening

404‧‧‧第二開口 404‧‧‧Second Opening

500‧‧‧塊 500‧‧‧ blocks

501‧‧‧塊 501‧‧‧block

501a‧‧‧第一端 501a‧‧‧ first end

501b‧‧‧第二端 501b‧‧‧ second end

501c‧‧‧第二表面 501c‧‧‧Second surface

501e、501d‧‧‧第一表面 501e, 501d‧‧‧First surface

501f‧‧‧第三表面 501f‧‧‧ Third surface

502‧‧‧塊 502‧‧‧block

502a‧‧‧第一端 502a‧‧‧ the first end

502b‧‧‧第二端 502b‧‧‧ second end

502c‧‧‧第二表面 502c‧‧‧Second surface

502e‧‧‧第一表面 502e‧‧‧first surface

502f‧‧‧第三表面 502f‧‧‧ Third surface

503‧‧‧塊 503‧‧‧ blocks

504‧‧‧塊 504‧‧‧block

505‧‧‧塊 505‧‧‧block

506‧‧‧塊 506‧‧‧block

507‧‧‧塊 507‧‧‧block

507a‧‧‧第一端 507a‧‧‧first end

507b‧‧‧第二端 507b‧‧‧second end

507c‧‧‧第二表面 507c‧‧‧Second surface

507d‧‧‧第一表面 507d‧‧‧first surface

507e‧‧‧第一表面 507e‧‧‧first surface

507f‧‧‧第三表面 507f‧‧‧ third surface

508‧‧‧塊 508‧‧‧block

509‧‧‧塊 509‧‧‧ blocks

510‧‧‧附加塊 510‧‧‧ additional block

510a‧‧‧第一端 510a‧‧‧ first end

510b‧‧‧第二端 510b‧‧‧ second end

510c‧‧‧第二表面 510c‧‧‧Second surface

510d‧‧‧第一表面 510d‧‧‧First surface

510e‧‧‧第一表面 510e‧‧‧First surface

510f‧‧‧第三表面 510f‧‧‧ Third surface

511‧‧‧附加塊 511‧‧‧additional block

512‧‧‧附加塊 512‧‧‧ additional block

513‧‧‧附加塊 513‧‧‧additional block

513a‧‧‧第一端 513a‧‧‧First end

513b‧‧‧第二端 513b‧‧‧ second end

513c‧‧‧第二表面 513c‧‧‧Second surface

513d‧‧‧第一表面 513d‧‧‧first surface

513e‧‧‧第一表面 513e‧‧‧first surface

513f‧‧‧第三表面 513f‧‧‧ Third surface

514‧‧‧附加塊 514‧‧‧additional block

515‧‧‧附加塊 515‧‧‧additional block

521‧‧‧界面 521‧‧‧ interface

525‧‧‧塊 525‧‧‧block

525a‧‧‧第一端 525a‧‧‧first end

525b‧‧‧第二端 525b‧‧‧ second end

525c‧‧‧第二表面 525c‧‧‧Second surface

525d、525e‧‧‧第一表面 525d, 525e‧‧‧First surface

525f‧‧‧第三表面 525f‧‧‧ third surface

525g‧‧‧第四表面 525g‧‧‧ fourth surface

527‧‧‧界面 527‧‧‧ interface

550a‧‧‧導軌 550a‧‧‧rail

550b‧‧‧導軌 550b‧‧‧rail

555a‧‧‧導軌 555a‧‧‧rail

555b‧‧‧導軌 555b‧‧‧rail

561‧‧‧框架 561‧‧‧Frame

561a‧‧‧第一部分 561a‧‧‧Part I

561b‧‧‧第二部分 561b‧‧‧Part Two

562‧‧‧框架 562‧‧‧Frame

565‧‧‧路徑 565‧‧‧path

571‧‧‧界面 571‧‧‧ interface

575‧‧‧緊固件 575‧‧‧Fastener

576‧‧‧第一托架 576‧‧‧First bracket

577‧‧‧第二托架 577‧‧‧Second bracket

701‧‧‧螺栓 701‧‧‧bolt

702‧‧‧螺母 702‧‧‧nut

703‧‧‧鉤 703‧‧‧hook

704‧‧‧桿 704‧‧‧ par

705‧‧‧路徑 705‧‧‧path

706‧‧‧拉伸彈簧 706‧‧‧tension spring

當參考附圖閱讀以下詳細說明時,可以更佳地理解該些及其他特徵、實施例、及優點,其中:These and other features, embodiments, and advantages can be better understood when reading the following detailed description with reference to the drawings, in which:

圖1概要地圖示出了根據本揭示案實施例的玻璃製造裝置的示例性實施例;FIG. 1 schematically illustrates an exemplary embodiment of a glass manufacturing apparatus according to an embodiment of the present disclosure;

圖2圖示出了沿著圖1的2-2線截取的玻璃製造裝置的立體剖視圖,其包括根據本揭示案實施例的玻璃成形裝置;2 illustrates a perspective cross-sectional view of a glass manufacturing apparatus taken along line 2-2 of FIG. 1, which includes a glass forming apparatus according to an embodiment of the present disclosure;

圖3圖示出了沿著圖1中3-3線截取的一部分的玻璃製造裝置的平面圖,其包括根據本揭示案實施例的容器及加熱裝置;3 illustrates a plan view of a part of a glass manufacturing apparatus taken along a line 3-3 in FIG. 1, which includes a container and a heating device according to an embodiment of the present disclosure;

圖4圖示出了沿著圖3的4-4線截取的根據本揭示案實施例的容器與加熱裝置的橫截面圖;4 illustrates a cross-sectional view of a container and a heating device according to an embodiment of the present disclosure, taken along line 4-4 of FIG. 3;

圖5圖示出了沿著圖3中5-5線截取的玻璃製造裝置的容器的側視圖,其包括根據本揭示案實施例的電極組件;5 illustrates a side view of a container of the glass manufacturing apparatus taken along line 5-5 in FIG. 3, which includes an electrode assembly according to an embodiment of the present disclosure;

圖6圖示出了圖4的容器與加熱裝置的局部剖視圖,其包括根據本揭示案實施例的包括複數個塊的電極組件;6 illustrates a partial cross-sectional view of the container and the heating device of FIG. 4, which includes an electrode assembly including a plurality of blocks according to an embodiment of the present disclosure;

圖7圖示出了包括圖6的根據本揭示案實施例的複數個塊的電極組件的局部剖視圖的示例性實施例;FIG. 7 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present disclosure of FIG. 6; FIG.

圖8圖示出了包括圖7的根據本揭示案實施例的複數個塊的電極組件的局部剖視圖的示例性實施例;FIG. 8 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present disclosure of FIG. 7; FIG.

圖9圖示出了包括圖8的根據本揭示案實施例的複數個塊的電極組件的局部剖視圖的示例性實施例;FIG. 9 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present disclosure of FIG. 8; FIG.

圖10圖示出了包括圖9的根據本案的實施例的複數個塊的電極組件的局部剖視圖的示例性實施例;FIG. 10 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present invention of FIG. 9; FIG.

圖11圖示出了包括圖10的根據本案的實施例的複數個塊的電極組件的局部剖視圖的示例性實施例;11 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present invention of FIG. 10;

圖12圖示出了包括圖11的根據本案的實施例的複數個塊的電極組件的部分橫截面視圖的示例性實施例;FIG. 12 illustrates an exemplary embodiment of a partial cross-sectional view of an electrode assembly including a plurality of blocks according to an embodiment of the present invention of FIG. 11; FIG.

圖13圖示出了圖6~12的根據本揭示案實施例的電極組件的複數個塊的示例性塊的立體圖;13 illustrates a perspective view of an exemplary block of a plurality of blocks of the electrode assembly according to the embodiment of the present disclosure of FIGS. 6 to 12;

圖14圖示出了圖13的根據本案實施例而堆疊的複數個示例性塊的示例性實施例;14 illustrates an exemplary embodiment of a plurality of exemplary blocks stacked according to the embodiment of the present case of FIG. 13;

圖15圖示出了圖5的在視線15處的根據本揭示案實施例的電極組件的框架與緊固件的示例性實施例;15 illustrates an exemplary embodiment of a frame and a fastener of an electrode assembly according to an embodiment of the present disclosure at line of sight 15 of FIG. 5;

圖16圖示出了圖5的在視線15處的根據本揭示案實施例的電極組件的框架與緊固件的替代示例性實施例。FIG. 16 illustrates an alternative exemplary embodiment of a frame and a fastener of an electrode assembly according to an embodiment of the present disclosure at line of sight 15 of FIG. 5.

圖17圖示出了圖5的在視線15處的根據本揭示案實施例的電極組件的框架與緊固件的替代示例性實施例。FIG. 17 illustrates an alternative exemplary embodiment of a frame and a fastener of an electrode assembly according to an embodiment of the present disclosure at line of sight 15 in FIG. 5.

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Claims (20)

一種電極組件,包含: 複數個塊,沿著在一第一方向上的一第一軸堆疊; 其中該複數個塊沿著該第一軸跨越一第一距離,沿著在垂直於該第一方向的一第二方向上的一第二軸跨越一第二距離,其中該第一距離與該第二距離定義出該電極組件的一第一面,且其中該複數個塊在垂直於該第一方向與該第二方向的一第三方向上,從該電極組件的該第一面到該電極組件的一第二面,沿著一第三軸跨越一第三距離;及 其中該複數個塊中的一第一塊的沿著該第三軸從該第一塊的一第一端到該第一塊的一第二端而定義出的一第一尺寸,係大於該複數個塊中的一第二塊的沿著該第三軸從該第二塊的一第一端到該第二塊的一第二端而定義出的一第二尺寸。An electrode assembly comprising: A plurality of blocks stacked along a first axis in a first direction; Wherein the plurality of blocks span a first distance along the first axis, and span a second distance along a second axis in a second direction perpendicular to the first direction, wherein the first distance and the The second distance defines a first side of the electrode assembly, and the plurality of blocks are oriented in a third direction perpendicular to the first direction and the second direction from the first side of the electrode assembly to the electrode A second side of the module spanning a third distance along a third axis; and A first dimension of a first block of the plurality of blocks defined along a third axis from a first end of the first block to a second end of the first block is larger than the first dimension. A second dimension of a second block of the plurality of blocks is defined along a third axis from a first end of the second block to a second end of the second block. 如請求項1所述的電極組件,其中該第一塊的該第一端定義出該第一面的一第一部分,且其中該第二塊的該第一端定義出該第一面的一第二部分。The electrode assembly according to claim 1, wherein the first end of the first block defines a first portion of the first face, and wherein the first end of the second block defines a first portion of the first face the second part. 如請求項1所述的電極組件,其中該第一面定義出該電極組件的一平坦表面。The electrode assembly according to claim 1, wherein the first surface defines a flat surface of the electrode assembly. 如請求項1所述的電極組件,其中該第一塊包括從該第一塊的該第一端延伸到該第一塊的該第二端的一第一表面,且其中該第一表面定義出該第一塊的一非平面邊界。The electrode assembly according to claim 1, wherein the first block includes a first surface extending from the first end of the first block to the second end of the first block, and wherein the first surface defines A non-planar boundary of the first block. 如請求項4所述的電極組件,其中該第二塊包括從該第二塊的該第一端延伸到該第二塊的該第二端的一第二表面,且其中該第一塊的該第一表面的一第一部分面向該第二塊的該第二個表面的一部分。The electrode assembly according to claim 4, wherein the second block includes a second surface extending from the first end of the second block to the second end of the second block, and wherein the first block A first portion of the first surface faces a portion of the second surface of the second block. 如請求項5所述的電極組件,其中該第一塊的該第一表面的該第一部分,在一第一界面處,鄰接該第二塊的該第二表面的該部分。The electrode assembly according to claim 5, wherein the first portion of the first surface of the first block is adjacent to the portion of the second surface of the second block at a first interface. 如請求項1所述的電極組件,其中該複數個塊中的一第三塊沿著該第三軸從該第三塊的一第一端到該第三塊的一第二端而定義出的一第三尺寸,係大於該第二尺寸,且其中該第三塊的該第一端面向該第二塊的該第二端。The electrode assembly according to claim 1, wherein a third of the plurality of blocks is defined along a third axis from a first end of the third block to a second end of the third block A third dimension of is larger than the second dimension, and wherein the first end of the third block faces the second end of the second block. 如請求項6所述的電極組件,其中該第一尺寸等於該第三尺寸。The electrode assembly according to claim 6, wherein the first size is equal to the third size. 如請求項7所述的電極組件,其中該第三塊包括從該第三塊的該第一端延伸到該第三塊的該第二端的一第三表面,其中該第三表面定義出該第三塊的一非平面邊界,且其中該第一塊的該第一表面的一第二部分面向該第三塊的該第三表面的一部分。The electrode assembly according to claim 7, wherein the third block includes a third surface extending from the first end of the third block to the second end of the third block, wherein the third surface defines the A non-planar boundary of the third block, and wherein a second portion of the first surface of the first block faces a portion of the third surface of the third block. 如請求項9所述的電極組件,其中該第三塊的該第一端在一第二界面處鄰接該第二塊的該第二端,且其中該第一塊的該第一表面的該第二部分,在一第三界面處,鄰接該第三塊的該第三表面的該部分。The electrode assembly according to claim 9, wherein the first end of the third block is adjacent to the second end of the second block at a second interface, and wherein the first surface of the first block is The second part, at a third interface, abuts the part of the third surface of the third block. 如請求項1所述的電極組件,還包括沿著該第一軸與該第二軸包圍該複數個塊的一第一框架。The electrode assembly according to claim 1, further comprising a first frame surrounding the plurality of blocks along the first axis and the second axis. 如請求項11所述的電極組件,其中該第一框架係沿著該第三軸為可移動的。The electrode assembly according to claim 11, wherein the first frame is movable along the third axis. 如請求項11所述的電極組件,其中該第一框架沿著該第一軸與該第二軸中的至少一者對該複數個塊施加一第一夾緊力。The electrode assembly according to claim 11, wherein the first frame applies a first clamping force to the plurality of blocks along at least one of the first axis and the second axis. 如請求項13所述的電極組件,其中該第一框架包含一第一緊固件,該第一緊固件經導向以至少增大或減小該第一夾緊力。The electrode assembly according to claim 13, wherein the first frame includes a first fastener that is guided to increase or decrease the first clamping force at least. 如請求項11所述的電極組件,還包括沿著該第一軸與該第二軸外接該複數個塊的一第二框架,其中該第二框架可沿著該第三軸移動,其中該第二框架沿著第一軸與該第二軸中的至少一者對該複數個塊施加一第二夾緊力,其中該第二框架包括一第二緊固件,該第二緊固件經導向為至少增大或減小,且其中該第一框架與該第二框架可獨立地沿著該第三軸移動。The electrode assembly according to claim 11, further comprising a second frame circumscribing the plurality of blocks along the first axis and the second axis, wherein the second frame is movable along the third axis, wherein the The second frame applies a second clamping force to the plurality of blocks along at least one of the first axis and the second axis, wherein the second frame includes a second fastener, the second fastener being guided Is at least increased or decreased, and wherein the first frame and the second frame are independently movable along the third axis. 一種包含如請求項1所述的電極組件的裝置,包括一容器,該容器包括定義出該容器的一包封區域的至少一壁,該至少一壁包括一孔,該孔定義出一開口,該開口包含該電極組件的至少一部分。A device comprising the electrode assembly according to claim 1, comprising a container, the container comprising at least one wall defining an envelope region of the container, the at least one wall including a hole defining an opening, The opening includes at least a portion of the electrode assembly. 如請求項16所述的裝置,其中該容器包括用於一玻璃製造系統的一熔化容器。The apparatus of claim 16 wherein the container comprises a melting container for a glass manufacturing system. 如請求項16所述的裝置,其中該電極組件的一位置係相對於該壁的該開口是可調整的。The device according to claim 16, wherein a position of the electrode assembly is adjustable relative to the opening of the wall. 一種處理如請求項16中的容器內的材料的方法,包括:向該電極組件供應電能並利用該電能加熱該容器的該包封區域內的該材料的步驟。A method of processing material in a container as in claim 16, comprising the steps of supplying electrical energy to the electrode assembly and using the electrical energy to heat the material in the envelope area of the container. 如請求項19所述的方法,包括:在加熱該材料的同時,調節該電極組件相對於該壁的該開口的一位置的步驟。The method according to claim 19, comprising the step of adjusting a position of the electrode assembly relative to the opening of the wall while heating the material.
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