TW201944664A - USB A female connector can breakthrough problems of interference caused by resonance generated from radio frequency - Google Patents
USB A female connector can breakthrough problems of interference caused by resonance generated from radio frequency Download PDFInfo
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- TW201944664A TW201944664A TW107112706A TW107112706A TW201944664A TW 201944664 A TW201944664 A TW 201944664A TW 107112706 A TW107112706 A TW 107112706A TW 107112706 A TW107112706 A TW 107112706A TW 201944664 A TW201944664 A TW 201944664A
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Abstract
Description
本發明為提供一種母座連接器，尤指一種可有效消除雜訊干擾，以避免電磁波輻射對射頻產生共振造成干擾的USB A母座連接器。 The invention provides a female connector, in particular a USB A female connector that can effectively eliminate noise interference and avoid electromagnetic wave radiation from causing interference with radio frequency resonance.
按，目前業界通用的USB包括Type A型的，其包括遮罩殼體、收容於遮罩殼內與對接連接器配合的舌板，與包覆舌板的絕緣膠體，透過該等結構即可組裝成一USB連接器，然而，一般目前之Type A USB連接器通常在雜訊干擾上非常嚴重，簡單來說，當高頻端子作動時必然會產生一些雜訊，如果端子與端子之間在雜訊這一區塊做的不完善時，就會彼此產生干擾，亦俗稱之高頻雜訊干擾，進而使高頻無法達到優化目的，也會造成電磁波輻射對射頻產生共振所造成的干擾，藉此，要如何解決上述干擾所產生之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 According to the current industry-wide USB includes Type A, which includes a shield shell, a tongue plate accommodated in the shield shell and mating connector, and an insulating gel covering the tongue plate, which can be passed through these structures. Assembled into a USB connector, however, the current Type A USB connector is usually very serious in noise interference. In short, when the high-frequency terminal is activated, some noise will inevitably be generated. If there is noise between the terminal and the terminal, When the information block is not perfect, it will cause interference with each other, also known as high-frequency noise interference, which makes it impossible to optimize the high-frequency, and it will also cause the interference caused by the electromagnetic wave radiation to resonate with the radio frequency. Therefore, how to solve the problems and shortcomings caused by the interference mentioned above is the direction in which the inventors of the present invention and related manufacturers engaged in this industry are eager to study and improve.
故，本發明之發明人有鑑於上述缺失，乃蒐集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種可有效消除雜訊干擾，以避免電磁波輻射對射頻產生共振造成干擾的USB A母座連接器的發明專利者。 Therefore, the inventor of the present invention, in view of the above-mentioned shortcomings, collected relevant information, evaluated and considered from various parties, and based on years of experience accumulated in this industry, through continuous trial and error, he began to design this kind of effective noise elimination. The inventor of the USB A female connector that interferes with the electromagnetic wave radiation to cause interference with the radio frequency resonance.
本發明之主要目的在於：透過第一左接地傳輸導體部及第一右接地傳輸導體部將第一高頻傳輸導體對包圍起來，以及透過第二左接地傳輸導體部及第二右接地傳輸導體部將第二高頻傳輸導體對包圍起來，如此即可有效的消除第一高頻傳輸導體對及第二高頻傳輸導體對所產生之雜訊，以避免電磁波對射頻產生共振所造成的干擾，更達到高頻優化之目的。 The main object of the present invention is to surround a first high-frequency transmission conductor pair by a first left-grounded transmission conductor portion and a first right-grounded transmission conductor portion, and to pass through a second left-grounded transmission conductor portion and a second right-grounded transmission conductor The second high-frequency transmission conductor pair is surrounded by the ministry, so that the noise generated by the first high-frequency transmission conductor pair and the second high-frequency transmission conductor pair can be effectively eliminated, so as to avoid the interference caused by the resonance of electromagnetic waves on the radio frequency , To achieve the purpose of high-frequency optimization.
本發明能夠達成上述目的之主要結構包括一第一接地傳輸導體、第一左接 地傳輸導體部、第一右接地傳輸導體部、第一高頻傳輸導體對、電源傳輸導體、第二接地傳輸導體、第二左接地傳輸導體部、第二右接地傳輸導體部、第二高頻傳輸導體對、第三接地傳輸導體及低頻訊號傳輸導體對，其中，第一接地傳輸導體包含第一左接地傳輸導體部及第一右接地傳輸導體部，且第一左接地傳輸導體部及第一右接地傳輸導體部分別相互並行排列且於前端處相連，而第一高頻傳輸導體對係設在第一左接地傳輸導體部及第一右接地傳輸導體部之間，另外電源傳輸導體乃設於第一高頻傳輸導體對及第一右接地傳輸導體部之間，此外，第二接地傳輸導體包含第二左接地傳輸導體部及第二右接地傳輸導體部，且第二左接地傳輸導體部及第二右接地傳輸導體部分別相互並行排列且於前端處相連，而第二高頻傳輸導體對則設於第二左接地傳輸導體部及第二右接地傳輸導體部之間，第三接地傳輸導體乃設於第二高頻傳輸導體對及第二左接地傳輸導體部之間，最後的低頻訊號傳輸導體對則設於第一右接地傳輸導體部及第二左接地傳輸導體部之間。如此，當第一高頻傳輸導體對及第二高頻傳輸導體對受對手連接器差動導通作動時，會產生高頻雜訊，而該些高頻雜訊會受第一接地傳輸導體的第一左接地傳輸導體部與第一右接地傳輸導體部、以及第二接地傳輸導體的第二左接地傳輸導體部與第二右接地傳輸導體部之包圍影響，使得第一高頻傳輸導體對與第二高頻傳輸導體對所產生的高頻雜訊干擾會被阻隔並消除掉，達到高頻優化之目的。 The main structure of the present invention that can achieve the above object includes a first grounded transmission conductor, a first left grounded transmission conductor portion, a first right grounded transmission conductor portion, a first high-frequency transmission conductor pair, a power transmission conductor, and a second ground transmission conductor. A second left ground transmission conductor portion, a second right ground transmission conductor portion, a second high frequency transmission conductor pair, a third ground transmission conductor, and a low frequency signal transmission conductor pair, wherein the first ground transmission conductor includes the first left ground transmission The conductor portion and the first right grounded transmission conductor portion, and the first left grounded transmission conductor portion and the first right grounded transmission conductor portion are respectively arranged in parallel with each other and connected at the front end, and the first high-frequency transmission conductor pair is provided at the first Between the left ground transmission conductor portion and the first right ground transmission conductor portion, and the power transmission conductor is provided between the first high-frequency transmission conductor pair and the first right ground transmission conductor portion. In addition, the second ground transmission conductor includes a first The two left grounded transmission conductor portions and the second right grounded transmission conductor portion, and the second left grounded transmission conductor portion and the second right grounded transmission conductor portion are parallel to each other, respectively. The second high-frequency transmission conductor pair is arranged between the second left-grounded transmission conductor and the second right-grounded transmission conductor, and the third high-frequency transmission conductor is provided at the second high-frequency transmission conductor. Between the conductor pair and the second left-grounded transmission conductor portion, the last low-frequency signal transmission conductor pair is disposed between the first right-grounded transmission conductor portion and the second left-grounded transmission conductor portion. In this way, when the first high-frequency transmission conductor pair and the second high-frequency transmission conductor pair are actuated by differential conduction of the opponent connector, high-frequency noise is generated, and these high-frequency noises are affected by the first ground transmission conductor. The surrounding effects of the first left ground transmission conductor portion and the first right ground transmission conductor portion, and the second left ground transmission conductor portion and the second right ground transmission conductor portion of the second ground transmission conductor make the first high frequency transmission conductor pair The high-frequency noise interference generated by the pair with the second high-frequency transmission conductor will be blocked and eliminated to achieve the purpose of high-frequency optimization.
藉由上述技術，可針對習用Type A USB連接器所存在之高頻無法達到優化目的，也會造成電磁波輻射對射頻產生共振所造成的干擾之問題點加以突破，達到本發明如上述優點之實用進步性。 With the above-mentioned technology, the problem that the high frequency existing in the conventional Type A USB connector cannot be optimized can be solved, and the problem of interference caused by electromagnetic wave radiation to the resonance of the radio frequency can be broken through, and the practicality of the advantages of the present invention as described above is achieved Progressive.
1‧‧‧第一接地傳輸導體 1‧‧‧ the first ground transmission conductor
11‧‧‧第一左接地傳輸導體部 11‧‧‧The first left grounded transmission conductor
111‧‧‧第一左接地傳輸導體引腳部 111‧‧‧First left ground transmission conductor pin
12‧‧‧第一右接地傳輸導體部 12‧‧‧First right ground transmission conductor
121‧‧‧第一右接地傳輸導體接觸部 121‧‧‧ the first right ground transmission conductor contact portion
122‧‧‧第一右接地傳輸導體引腳部 122‧‧‧First right ground transmission conductor pin
2‧‧‧第一高頻傳輸導體對 2‧‧‧ the first high frequency transmission conductor pair
21‧‧‧第一高頻傳輸導體接觸部對 21‧‧‧The first high frequency transmission conductor contact part pair
22‧‧‧第一高頻傳輸導體引腳部對 22‧‧‧ the first high-frequency transmission conductor pin pair
3‧‧‧電源傳輸導體 3‧‧‧ Power Transmission Conductor
31‧‧‧電源傳輸導體接觸部 31‧‧‧Power transmission conductor contact
32‧‧‧電源傳輸導體引腳部 32‧‧‧ Power Transmission Conductor Pin
4‧‧‧第二接地傳輸導體 4‧‧‧Second ground transmission conductor
41‧‧‧第二左接地傳輸導體部 41‧‧‧Second left ground transmission conductor
411‧‧‧第二左接地傳輸導體接觸部 411‧‧‧Second left ground transmission conductor contact
412‧‧‧第二左接地傳輸導體引腳部 412‧‧‧Second left ground transmission conductor pin
42‧‧‧第二右接地傳輸導體部 42‧‧‧Second right ground transmission conductor
421‧‧‧第二右接地傳輸導體引腳部 421‧‧‧Second right ground transmission conductor pin
5‧‧‧第二高頻傳輸導體對 5‧‧‧Second high frequency transmission conductor pair
51‧‧‧第二高頻傳輸導體接觸部對 51‧‧‧The second high frequency transmission conductor contact part pair
52‧‧‧第二高頻傳輸導體引腳部對 52‧‧‧Second pair of high frequency transmission conductor pins
6‧‧‧第三接地傳輸導體 6‧‧‧ third ground transmission conductor
61‧‧‧第三接地傳輸導體接觸部 61‧‧‧Third ground transmission conductor contact
62‧‧‧第三接地傳輸導體引腳部 62‧‧‧Third ground transmission conductor pin
7‧‧‧低頻訊號傳輸導體對 7‧‧‧ Low-frequency signal transmission conductor pair
71‧‧‧低頻訊號傳輸導體接觸部對 71‧‧‧ contact pair of low-frequency signal transmission conductor
72‧‧‧低頻訊號傳輸導體引腳部對 72‧‧‧ Low-frequency signal transmission conductor pin pair
8‧‧‧絕緣膠體 8‧‧‧ Insulation Gel
9‧‧‧屏蔽殼體 9‧‧‧shielded housing
a‧‧‧PCB板 a‧‧‧PCB board
b‧‧‧對手連接器 b‧‧‧ Opponent Connector
C‧‧‧高頻雜訊 C‧‧‧High-frequency noise
第一圖 係為本發明較佳實施例之立體圖。 The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 係為本發明較佳實施例之分解圖。 The second figure is an exploded view of a preferred embodiment of the present invention.
第三圖 係為本發明較佳實施例之側面透視圖。 The third figure is a side perspective view of a preferred embodiment of the present invention.
第四圖 係為本發明較佳實施例之傳輸導體平面圖一。 The fourth figure is a first plan view of a transmission conductor according to a preferred embodiment of the present invention.
第四A圖 係為本發明較佳實施例之傳輸導體平面圖二。 The fourth diagram A is a second plan view of a transmission conductor according to a preferred embodiment of the present invention.
第五圖 係為本發明較佳實施例之傳輸導體側視圖。 The fifth figure is a side view of a transmission conductor according to a preferred embodiment of the present invention.
第六圖 係為本發明較佳實施例之傳輸導體前視圖。 The sixth figure is a front view of a transmission conductor according to a preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之結合PCB板示意圖。 The seventh diagram is a schematic diagram of a combined PCB board according to a preferred embodiment of the present invention.
第八圖 係為本發明較佳實施例之插置示意圖。 The eighth figure is a schematic diagram of the insertion of the preferred embodiment of the present invention.
第九圖 係為本發明較佳實施例之電磁波發散示意圖。 The ninth figure is a schematic diagram of electromagnetic wave divergence according to a preferred embodiment of the present invention.
為達成上述目的及功效，本發明所採用之技術手段及構造，茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下，俾利完全了解。 In order to achieve the above-mentioned object and effect, the technical means and structure adopted by the present invention are described in detail below with reference to the preferred embodiments of the present invention.
請參閱第一圖至第六圖所示，係為本發明較佳實施例之立體圖至傳輸導體前視圖，由圖中可清楚看出本發明係包括：一第一接地傳輸導體1，乃界定有二相互並行排列且相連之第一左接地傳輸導體部11及第一右接地傳輸導體部12，所述的第一右接地傳輸導體部12上界定有一位於下述第一高頻傳輸導體接觸部對21一側處之第一右接地傳輸導體接觸部121，且第一左接地傳輸導體部11一端界定有一第一左接地傳輸導體引腳部111，而第一右接地傳輸導體部12上界定有一位於下述第一高頻傳輸導體引腳部對22一側處之第一右接地傳輸導體引腳部122；一設於第一左接地傳輸導體部11及第一右接地傳輸導體部12之間的第一高頻傳輸導體對2，第一高頻傳輸導體對2上界定有一第一高頻傳輸導體接觸部對21，且第一高頻傳輸導體對2上還界定有一位於第一左接地傳輸導體引腳部111一側處之第一高頻傳輸導體引腳部對22；一設於第一高頻傳輸導體對2及第一右接地傳輸導體部12之間的電源傳輸導體3，電源傳輸導體3一端處界定有一位於第一高頻傳輸導體接觸部對21後方之電源傳輸導體接觸部31，且電源傳輸導體3上還界定有一位於第一右接地傳輸導體引腳部122與第一高頻傳輸導體引腳部對22之間的電源傳輸導體引腳部32；一設於第一接地傳輸導體1一側之第二接地傳輸導體4，乃界定有二相互並行排列且相連之第二左接地傳輸導體部41及第二右接地傳輸導體部42，所述第二左接地傳輸導體部41上界定有一位於第一右接地傳輸導體接觸部121一側處之第二左接地傳輸導體接觸部411，且第二右接地傳輸導體部42一端處界定有一第二右接地傳輸導體引腳部421，而第二左接地傳輸導體部41上界定有一位於下述第二高頻傳輸導體引腳部對52一側處之第二左接 地傳輸導體引腳部412；一設於第二左接地傳輸導體部41及第二右接地傳輸導體部42之間的第二高頻傳輸導體對5，第二高頻傳輸導體對5上界定有一位於第二左接地傳輸導體接觸部411一側處之第二高頻傳輸導體接觸部對51，且第二高頻傳輸導體對5上還界定有一位於第二右接地傳輸導體引腳部421一側處之第二高頻傳輸導體引腳部對52；一設於第二高頻傳輸導體對5及該第二左接地傳輸導體部之間的第三接地傳輸導體6，第三接地傳輸導體6一端處界定有一位於第二高頻傳輸導體接觸部對51後方之第三接地傳輸導體接觸部61，且第三接地傳輸導體6上還界定有一位於第二左接地傳輸導體引腳部412與第二高頻傳輸導體引腳部對52之間的第三接地傳輸導體引腳部62；一設於第一右接地傳輸導體部12及第二左接地傳輸導體部41之間的低頻訊號傳輸導體對7，低頻訊號傳輸導體對7上界定有一位於電源傳輸導體接觸部31及第三接地傳輸導體接觸部61之間的低頻訊號傳輸導體接觸部對71，且低頻訊號傳輸導體對7上界定有一位於第一右接地傳輸導體引腳部122與第二左接地傳輸導體引腳部412之間的低頻訊號傳輸導體引腳部對72；一絕緣膠體8，乃供第一接地傳輸導體1、第一高頻傳輸導體對2、電源傳輸導體3、第二接地傳輸導體4、第二高頻傳輸導體對5、第三接地傳輸導體6及低頻訊號傳輸導體對7設置；一屏蔽殼體9，乃供包覆絕緣膠體8。 Please refer to the first to sixth figures, which are perspective views of the preferred embodiment of the present invention to the front view of the transmission conductor. It can be clearly seen from the figure that the present invention includes: a first grounded transmission conductor 1, which is defined There are two first left ground transmission conductor portions 11 and first right ground transmission conductor portions 12 arranged in parallel and connected to each other. The first right ground transmission conductor portion 12 defines a first high frequency transmission conductor contact located below. The first right grounded transmission conductor contact portion 121 at the side of the pair 21, and one end of the first left grounded transmission conductor portion 11 defines a first left grounded transmission conductor pin portion 111, and the first right grounded transmission conductor portion 12 is A first right grounded transmission conductor pin portion 122 is defined at a side of the first high frequency transmission conductor pin portion pair 22 described below; a first left grounded transmission conductor portion 11 and a first right grounded transmission conductor portion are defined; A first high-frequency transmission conductor pair 2 between 12, a first high-frequency transmission conductor pair 2 is defined on the first high-frequency transmission conductor pair 2, and a first high-frequency transmission conductor pair 2 is further defined on a first One left ground transmission conductor pin part 1 The first high-frequency transmission conductor pin pair 22 at the side of 11; a power transmission conductor 3 provided between the first high-frequency transmission conductor pair 2 and the first right ground transmission conductor portion 12, and one end of the power transmission conductor 3 A power transmission conductor contact portion 31 located behind the first high frequency transmission conductor contact portion pair 21 is defined, and a power transmission conductor 3 is further defined with a first right ground transmission conductor pin portion 122 and a first high frequency transmission conductor. A power transmission conductor pin portion 32 between the pair of pin portions 22; a second ground transmission conductor 4 provided on one side of the first ground transmission conductor 1 defines a second left ground transmission arranged in parallel and connected to each other The conductor portion 41 and the second right ground transmission conductor portion 42 define a second left ground transmission conductor contact portion 411 on the side of the first right ground transmission conductor contact portion 121 on the second left ground transmission conductor portion 41, In addition, a second right grounded transmission conductor pin portion 421 is defined at one end of the second right grounded transmission conductor portion 42, and a second high frequency transmission conductor pin portion pair 52 is defined on the second left grounded transmission conductor portion 41. On one side Two left ground transmission conductor pin portions 412; a second high frequency transmission conductor pair 5 and a second high frequency transmission conductor pair 5 provided between the second left ground transmission conductor portion 41 and the second right ground transmission conductor portion 42 A second high-frequency transmission conductor contact portion pair 51 is defined at one side of the second left-grounded transmission conductor contact portion 411, and a second right-ground transmission conductor pin is defined on the second high-frequency transmission conductor pair 5. The second high-frequency transmission conductor pin portion pair 52 at one side of the portion 421; a third ground transmission conductor 6 provided between the second high-frequency transmission conductor pair 5 and the second left-ground transmission conductor portion; A third ground transmission conductor contact portion 61 located behind the second high-frequency transmission conductor contact portion pair 51 is defined at one end of the ground transmission conductor 6, and a third left ground transmission conductor pin is defined on the third ground transmission conductor 6 A third grounded transmission conductor pin portion 62 between the portion 412 and the second high-frequency transmission conductor pin portion pair 52; Low-frequency signal transmission conductor pair 7, low-frequency signal A low-frequency signal transmission conductor contact 71 is defined on the transmission conductor pair 7 between the power transmission conductor contact 31 and the third ground transmission conductor contact 61, and a low-frequency signal transmission conductor pair 7 is defined on the first right ground. Low-frequency signal transmission conductor pin pair 72 between the transmission conductor pin portion 122 and the second left ground transmission conductor pin portion 412; an insulating gel 8 is provided for the first ground transmission conductor 1, and the first high-frequency transmission conductor Pair 2, the power transmission conductor 3, the second ground transmission conductor 4, the second high-frequency transmission conductor pair 5, the third ground transmission conductor 6, and the low-frequency signal transmission conductor pair 7 are provided; a shield case 9 is used for covering insulation Colloid 8.
其中，所述第一高頻傳輸導體接觸部對21至第二高頻傳輸導體接觸部對51的距離乃大於電源傳輸導體接觸部31至第三接地傳輸導體接觸部61之距離，換言之可同參第四圖所示，第一高頻傳輸導體接觸部對21至第二高頻傳輸導體接觸部對51之距離即為第四圖上之A-A距離，而所述電源傳輸導體接觸部31至第三接地傳輸導體接觸部61之距離則為第四圖上之B-B距離。 The distance between the first high-frequency transmission conductor contact portion pair 21 to the second high-frequency transmission conductor contact portion pair 51 is greater than the distance between the power transmission conductor contact portion 31 and the third ground transmission conductor contact portion 61, in other words, the same Referring to the fourth figure, the distance between the first high-frequency transmission conductor contact portion pair 21 to the second high-frequency transmission conductor contact portion pair 51 is the AA distance in the fourth figure, and the power transmission conductor contact portions 31 to The distance of the third ground transmission conductor contact portion 61 is the BB distance in the fourth figure.
其中，所述第一高頻傳輸導體接觸部對21、第一右接地傳輸導體接觸部121、第二左接地傳輸導體接觸部411及第二高頻傳輸導體接觸部對51之位置乃與電源傳輸導體接觸部31、第三接地傳輸導體接觸部61及低頻訊號傳輸導體接觸部對71之位置位在不同水平面上，換言之，由第五圖及第六 圖可看出，所謂不同水平面上亦指第一高頻傳輸導體接觸部對21、第一右接地傳輸導體接觸部121、第二左接地傳輸導體接觸部411及第二高頻傳輸導體接觸部對51之A點位置，乃高於電源傳輸導體接觸部31、第三接地傳輸導體接觸部61及低頻訊號傳輸導體接觸部對71之B點位置，而A點位置與B點位置即分別為其最低頂點處，如此即便於對手連接器進行插置導通。 Wherein, the positions of the first pair of high-frequency transmission conductor contact portions 21, the first right-grounded transmission conductor contact portion 121, the second left-grounded transmission conductor contact portion 411, and the second high-frequency transmission conductor contact portion pair 51 are connected to a power source. The positions of the transmission conductor contact portion 31, the third ground transmission conductor contact portion 61, and the low-frequency signal transmission conductor contact portion pair 71 are located on different horizontal planes. In other words, as can be seen from the fifth and sixth figures, the so-called different horizontal planes also It refers to the position of point A of the first high-frequency transmission conductor contact portion pair 21, the first right ground transmission conductor contact portion 121, the second left ground transmission conductor contact portion 411, and the second high-frequency transmission conductor contact portion pair 51, which are higher than The position of point B of the power transmission conductor contact portion 31, the third ground transmission conductor contact portion 61, and the low-frequency signal transmission conductor contact portion pair 71, and the positions of the point A and the point B are their lowest vertices respectively, so that even if they are connected by an opponent The device conducts insertion.
其中，所述第一左接地傳輸導體引腳部111、電源傳輸導體引腳部32、低頻訊號傳輸導體引腳部對72、第三接地傳輸導體引腳部62及第二右接地傳輸導體引腳部421之寬度乃大於第一右接地傳輸導體引腳部122及第二左接地傳輸導體引腳部412之寬度，而第一右接地傳輸導體引腳部122及第二左接地傳輸導體引腳部412之寬度又大於第一高頻傳輸導體引腳部對22及第二高頻傳輸導體引腳部對52之寬度，進一步深論，所謂的寬度，指的是體積寬度，由第四圖可清楚看出。 The first left ground transmission conductor pin portion 111, the power transmission conductor pin portion 32, the low-frequency signal transmission conductor pin portion 72, the third ground transmission conductor pin portion 62, and the second right ground transmission conductor pin. The width of the leg portion 421 is larger than the width of the first right ground transmission conductor pin portion 122 and the second left ground transmission conductor pin portion 412, and the first right ground transmission conductor pin portion 122 and the second left ground transmission conductor pin portion The width of the leg portion 412 is greater than the width of the first high-frequency transmission conductor pin portion pair 22 and the second high-frequency transmission conductor pin portion pair 52. Further, the so-called width refers to the volume width. The figure can be clearly seen.
請同時配合參閱第一圖至第九圖所示，係為本發明較佳實施例之立體圖至電磁波發散示意圖，由圖中可清楚看出，所述第一左接地傳輸導體引腳部111、第一高頻傳輸導體引腳部對22、第一右接地傳輸導體引腳部122、電源傳輸導體引腳部32、第二右接地傳輸導體引腳部421、第二高頻傳輸導體引腳部對52、第二左接地傳輸導體引腳部412、第三接地傳輸導體引腳部62及低頻訊號傳輸導體引腳部對72可焊接於一PCB板a上面，形成資訊連通，且皆位在同一平面上，使得在加工製作上更為方便快速，此外，當本發明與一對手連接器b對接插置時，對手連接器b上的各端子部件得以與第一高頻傳輸導體接觸部對21、第一右接地傳輸導體接觸部121、第二左接地傳輸導體接觸部411、第二高頻傳輸導體接觸部對51、電源傳輸導體接觸部31、第三接地傳輸導體接觸部61及低頻訊號傳輸導體接觸部對71進行差動電性連結，使其可進行電源或資訊傳輸，並且在電源或資訊傳輸的期間，因第一高頻傳輸導體對2會產生高頻雜訊C，此時高頻雜訊C會從四周散發出來，如此，高頻雜訊C即會因第一接地傳輸導體1的第一左接地傳輸導體部11及第一右接地傳輸導體部12將第一高頻傳輸導體對2包圍起來，而使得高頻雜訊C無法對旁邊的第二高頻傳輸導體對5產生高頻雜訊C干擾，相對的，第二高頻傳輸導體對5所產生的高頻雜訊C得以被第二接地傳輸導體4的第二左接地傳輸導體部41及第二右接地傳輸導體部42所包圍起來，使得高頻雜訊C 無法對旁邊的第一高頻傳輸導體對2產生高頻雜訊C干擾。 Please also refer to the first to ninth figures together, which are the perspective view of the preferred embodiment of the present invention to the electromagnetic wave divergence diagram. It can be clearly seen from the figure that the first left ground transmission conductor pin portion 111, First high frequency transmission conductor pin pair 22, first right ground transmission conductor pin portion 122, power transmission conductor pin portion 32, second right ground transmission conductor pin portion 421, and second high frequency transmission conductor pin The part pair 52, the second left ground transmission conductor pin portion 412, the third ground transmission conductor pin portion 62, and the low-frequency signal transmission conductor pin portion pair 72 can be soldered on a PCB board a to form information communication, and are all positioned On the same plane, it is more convenient and fast in processing. In addition, when the present invention is mated with a mating connector b, each terminal component on the mating connector b can contact the first high-frequency transmission conductor contact portion. Pair 21, first right grounded transmission conductor contact portion 121, second left grounded transmission conductor contact portion 411, second high frequency transmission conductor contact portion pair 51, power transmission conductor contact portion 31, third grounded transmission conductor contact portion 61 and Low frequency signal transmission The conductor contact part makes a differential electrical connection to 71, so that it can perform power or information transmission, and during the power or information transmission, the first high-frequency transmission conductor pair 2 will generate high-frequency noise C, which is high at this time. The frequency noise C will be emitted from all around. In this way, the high frequency noise C will transmit the first high frequency due to the first left ground transmission conductor portion 11 and the first right ground transmission conductor portion 12 of the first ground transmission conductor 1. The conductor pair 2 is surrounded, so that the high-frequency noise C cannot interfere with the high-frequency noise C of the adjacent second high-frequency transmission conductor pair 5. In contrast, the high-frequency noise generated by the second high-frequency transmission conductor pair 5 The signal C can be surrounded by the second left ground transmission conductor portion 41 and the second right ground transmission conductor portion 42 of the second ground transmission conductor 4, so that the high-frequency noise C cannot be caused to the first high-frequency transmission conductor pair 2 next to it. Generate high-frequency noise C interference.
更進一步言之，第一右接地傳輸導體接觸部121主要位置位在第一高頻傳輸導體接觸部對21的正前方處(同參第四圖)，因此透過第一左接地傳輸導體部11、第一右接地傳輸導體部12及第一右接地傳輸導體接觸部121的三方包圍，而使第一高頻傳輸導體對2的高頻雜訊C無法干擾到第二高頻傳輸導體對5，同樣的，第二左接地傳輸導體接觸部411主要位置位在第二高頻傳輸導體接觸部對51的正前方處(同參第四圖)，因此透過第二左接地傳輸導體部41、第二右接地傳輸導體部42及第二左接地傳輸導體接觸部411的三方包圍，而使第二高頻傳輸導體對5的高頻雜訊C無法干擾到第一高頻傳輸導體對2。意謂，透過第一接地傳輸導體1及第二接地傳輸導體4參考極性關係，使其可有效的將高頻雜訊C消除掉。 Furthermore, the main position of the first right-grounded transmission conductor contact portion 121 is located directly in front of the first high-frequency transmission-conductor contact portion pair 21 (see also the fourth figure), so the first left-grounded transmission conductor portion 11 passes through The first right grounded transmission conductor portion 12 and the first right grounded transmission conductor contact portion 121 are surrounded by three sides, so that the high frequency noise C of the first high frequency transmission conductor pair 2 cannot interfere with the second high frequency transmission conductor pair 5 Similarly, the main position of the second left-grounded transmission conductor contact portion 411 is located directly in front of the second high-frequency transmission-conductor contact portion pair 51 (see also the fourth figure). Therefore, the second left-grounded transmission conductor portion 41, The second right ground transmission conductor portion 42 and the second left ground transmission conductor contact portion 411 are surrounded by three sides, so that the high frequency noise C of the second high frequency transmission conductor pair 5 cannot interfere with the first high frequency transmission conductor pair 2. This means that the reference polarity relationship between the first ground transmission conductor 1 and the second ground transmission conductor 4 can effectively eliminate high frequency noise C.
是以，本發明之USB A母座連接器為可改善習用之技術關鍵在於：透過第一左接地傳輸導體部11及第一右接地傳輸導體部12將第一高頻傳輸導體對2包圍起來，以及透過第二左接地傳輸導體部41及第二右接地傳輸導體部42將第二高頻傳輸導體對5包圍起來，如此即可有效的消除第一高頻傳輸導體對2及第二高頻傳輸導體對5所產生之雜訊，以避免電磁波對射頻產生共振所造成的干擾，更達到高頻優化之目的。 Therefore, the key of the USB A female connector of the present invention to improve the conventional technology lies in that the first high-frequency transmission conductor pair 2 is surrounded by the first left-grounded transmission conductor portion 11 and the first right-grounded transmission conductor portion 12. , And the second high-frequency transmission conductor pair 5 is surrounded by the second left-grounded transmission conductor portion 41 and the second right-grounded transmission conductor portion 42, so that the first high-frequency transmission conductor pair 2 and the second height can be effectively eliminated. The noise generated by the high frequency transmission conductor pair 5 can avoid the interference caused by the electromagnetic wave resonance to the radio frequency, and achieve the purpose of high frequency optimization.
惟，以上所述僅為本發明之較佳實施例而已，非因此即侷限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 However, the above description is only the preferred embodiment of the present invention, and it does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be the same. It is included in the patent scope of the present invention and is incorporated by Chen Ming.
綜上所述，本發明之USB A母座連接器於使用時，為確實能達到其功效及目的，故本發明誠為一實用性優異之發明，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本發明，以保障發明人之辛苦發明，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感公便。 In summary, when the USB A female connector of the present invention is used, in order to truly achieve its efficacy and purpose, the present invention is an invention with excellent practicality. In order to meet the application requirements of the invention patent, it is proposed according to law. I hope that the review committee will grant the present invention as soon as possible to protect the inventor's hard invention. If there is any suspicion in the review committee of the Bureau, please write to us and the inventor will cooperate with every effort and feel comfortable.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107112706A TWI657627B (en) | 2018-04-13 | 2018-04-13 | USB A female connector |
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| TW107112706A TWI657627B (en) | 2018-04-13 | 2018-04-13 | USB A female connector |
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| TWI657627B TWI657627B (en) | 2019-04-21 |
| TW201944664A true TW201944664A (en) | 2019-11-16 |
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| EP3734464A1 (en) * | 2019-04-29 | 2020-11-04 | Nxp B.V. | Integrated filter for de-sense reduction |
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| TWI751634B (en) * | 2020-07-31 | 2022-01-01 | 宏致電子股份有限公司 | Electrical connector |
| TWI835583B (en) * | 2023-03-10 | 2024-03-11 | 富佳得實業股份有限公司 | electrical connector |
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| TWM360480U (en) * | 2009-02-23 | 2009-07-01 | Ud Electronic Corp | USB connector |
| US20180011255A1 (en) * | 2014-12-05 | 2018-01-11 | Joseph Lai | User-Friendly USB Connectors with Fiber-Optical Connections |
| TWM504377U (en) * | 2015-02-10 | 2015-07-01 | T Conn Prec Corp | Improved grounding structure of electrical connector |
| CN206148727U (en) * | 2016-10-18 | 2017-05-03 | 太康精密股份有限公司 | Electric connector |
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| EP3734464A1 (en) * | 2019-04-29 | 2020-11-04 | Nxp B.V. | Integrated filter for de-sense reduction |
| US11457524B2 (en) | 2019-04-29 | 2022-09-27 | Nxp B.V. | Integrated filter for de-sense reduction |
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