TWI795983B - Electronic device - Google Patents
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本發明涉及一種電子裝置,尤其涉及一種具備電磁屏蔽結構的電子裝置。The invention relates to an electronic device, in particular to an electronic device with an electromagnetic shielding structure.
現有的無線通訊裝置(如:筆記型電腦、智慧型手機、物聯網裝置、平板電腦、或其他相關裝置)通常設有天線和USB接口,然而隨著無線通訊裝置的薄型化,USB接口和天線的距離變得越來越近。當一外部儲存裝置插設至USB接口以對外部儲存裝置進行資料存取時,會因資料存取的訊號影響到天線的無線傳輸效能。Existing wireless communication devices (such as: notebook computers, smart phones, Internet of Things devices, tablet computers, or other related devices) usually have antennas and USB ports. However, with the thinning of wireless communication devices, USB ports and antennas The distance becomes closer and closer. When an external storage device is plugged into the USB interface for data access to the external storage device, the wireless transmission performance of the antenna will be affected by the data access signal.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.
本發明實施例在於提供一種電子裝置,其能有效地改善現有電子裝置所可能產生的缺陷。An embodiment of the present invention is to provide an electronic device, which can effectively improve possible defects of existing electronic devices.
本發明實施例公開一種電子裝置,其包括:一殼體;一電路板,設置於所述殼體內;一第一金屬屏蔽罩,安裝於所述電路板,並且所述第一金屬屏蔽罩與所述電路板形成共地連接;至少一個電連接模組,安裝於所述電路板;其中,至少一個所述電連接模組設置於所述第一金屬屏蔽罩的一側,並且至少一個所述電連接模組包含:一連接器;及一第二金屬屏蔽罩,設置於所述連接器的外圍;以及一軟性導電件,連接所述第二金屬屏蔽罩及所述第一金屬屏蔽罩,並且所述軟性導電件覆蓋至少一個所述電連接模組。The embodiment of the present invention discloses an electronic device, which includes: a casing; a circuit board disposed in the casing; a first metal shield mounted on the circuit board, and the first metal shield is connected to the circuit board. The circuit board forms a common ground connection; at least one electrical connection module is installed on the circuit board; wherein, at least one of the electrical connection modules is arranged on one side of the first metal shield, and at least one of the The electrical connection module includes: a connector; and a second metal shield disposed on the periphery of the connector; and a flexible conductive member connected to the second metal shield and the first metal shield , and the flexible conductive member covers at least one of the electrical connection modules.
本發明實施例也公開一種電子裝置,其包括:一殼體;一電路板,設置於所述殼體內;一第一金屬屏蔽罩,安裝於所述電路板,並且所述第一金屬屏蔽罩與所述電路板形成共地連接;至少一個電連接模組,安裝於所述電路板;其中,至少一個所述電連接模組設置於所述第一金屬屏蔽罩的一側,並且至少一個所述電連接模組包含:一連接器;及一第二金屬屏蔽罩,設置於所述連接器的外圍;以及一導電彈性件,至少一個所述電連接模組的所述連接器通過所述導電彈性件以電性連接所述殼體。The embodiment of the present invention also discloses an electronic device, which includes: a casing; a circuit board disposed in the casing; a first metal shield mounted on the circuit board, and the first metal shield A common ground connection is formed with the circuit board; at least one electrical connection module is installed on the circuit board; wherein at least one electrical connection module is arranged on one side of the first metal shield, and at least one The electrical connection module includes: a connector; and a second metal shield disposed on the periphery of the connector; and a conductive elastic member, at least one of the connectors of the electrical connection module passes through the The conductive elastic member is electrically connected to the casing.
綜上所述,本發明實施例所公開的電子裝置,其通過所述電連接模組搭配於所述軟性導電件及/或所述導電彈性件而構成的一共地架構(或電磁屏蔽架構),此顯然有別於現有電子裝置的電磁屏蔽架構,在電子裝置的內部空間受限的情況下還是能大幅地提升所述連接器的電磁屏蔽性能(如:降低所述連接器於信號傳輸時對無線訊號產生干擾)。In summary, the electronic device disclosed in the embodiment of the present invention has a common ground structure (or electromagnetic shielding structure) formed by the electrical connection module being matched with the flexible conductive member and/or the conductive elastic member. , which is obviously different from the electromagnetic shielding structure of existing electronic devices, and can still greatly improve the electromagnetic shielding performance of the connector when the internal space of the electronic device is limited (for example: reduce the interfere with wireless signals).
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“電子裝置”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is an illustration of the implementation of the "electronic device" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.
[實施例一][Example 1]
請參閱圖1和圖2所示,其為本發明的實施例一。本實施例公開一種電子裝置100,其可以是具有電磁屏蔽需求的無線通訊裝置,但本發明在此不加以限制。Please refer to Fig. 1 and Fig. 2, which is the first embodiment of the present invention. This embodiment discloses an
其中,所述電子裝置100於本實施例中包含有一殼體1、安裝於所述殼體1的一顯示屏幕2、設置於所述顯示屏幕2一側的一屏蔽金屬板3、設置於所述殼體1內的一電路板4與一天線5、安裝於所述電路板4的一第一金屬屏蔽罩6與至少一個電連接模組7、位在至少一個電連接模組7一側的一軟性導電件8、及位於至少一個電連接模組7另一側的一導電彈性件9。Wherein, the
需先說明的是,所述電子裝置100於本實施例中雖是以包含有上述構件來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述電子裝置100可依據設計需求而選擇性地省略所述軟性導電件8或所述導電彈性件9,並且所述電子裝置100還可以在省略所述顯示屏幕2、所述屏蔽金屬板3、及所述天線5的至少其中之一的情況下被運用(如:販售)或搭配其他構件使用。以下先介紹本實施例中的所述電子裝置100的各個構件之結構,而後再適時地說明所述電子裝置100的各個構件之間的連接關係。It should be noted that although the
所述殼體1於本實施例中是以具有一開孔121的兩件式構造來說明,所述殼體1包含有一背蓋11及可拆卸地安裝於所述背蓋11的一邊框12,並且所述殼體1所具有的所述開孔121於本實施例中是由所述邊框12的內緣所定義形成,並且所述邊框12可以是由非金屬材質所構成,但本發明不受限於此,舉例來說,在本發明未繪示的其他實施例中,所述殼體1也可以省略所述邊框12,並且採用一U形背蓋11進行實現。In this embodiment, the
再者,所述背蓋11包含有一接地區111及相連於所述接地區111的一絕緣區112,並且所述接地區111的面積可以是所述絕緣區112的至少三倍。進一步地說,所述接地區111於本實施例中是完全由金屬材質所製成,但於本發明未繪示的其他實施例中,所述接地區111可以是包含有一絕緣片體及形成於所述絕緣片體的多個金屬雷雕的接地處,所述接地處用來將所述電路板4的接地面、所述第一金屬屏蔽罩6、所述電連接器模組7和所述殼體1進行完整的系統接地搭接。Furthermore, the
再者,所述顯示屏幕2設置於所述殼體1的所述開孔121內,並且所述屏蔽金屬板3覆蓋於所述顯示屏幕2的內表面的至少80%區域,據以通過所述屏蔽金屬板3的設置而能有效地屏蔽所述顯示屏幕2與位於所述殼體1內的其他構件之間的電磁干擾。Furthermore, the
所述電路板4設置於所述背蓋11(如:所述接地區111)上,並且所述電路板4的接地面(圖未示出)電性耦接於所述背蓋11(如:所述接地區111),以使得所述電路板4能與所述背蓋11的所述接地區111形成共地連接。此外,所述顯示屏幕2與至少一個所述電連接模組7電性耦接所述電路板4,據以實現彼此之間的信號傳輸。The
所述天線5設置於所述背蓋11的絕緣區112,而且所述天線5電性連接於所述接地區111和所述電路板4,據此所述天線5可以穿過所述絕緣區112以進行無線信號傳輸。其中,所述天線5於本實施例中包含有位於所述絕緣區112相反側的一主天線51與一副天線52,所述主天線51或所述副天線52可因應需求支援LTE、GPS及/或Wi-Fi之多頻段操作。其中,所述主天線51和所述副天線52也可以皆為LTE天線,其工作頻段為700MHz ~2600MHz,藉以強化所述電子裝置100的傳輸效能。The
所述第一金屬屏蔽罩6位於遠離所述背蓋11的所述電路板4一側(如:圖1中的所述電路板4的上側),並且所述第一金屬屏蔽罩6包覆在安裝於所述電路板4上的多個電子元件(圖未繪示)的外側。其中,所述第一金屬屏蔽罩6與所述電路板4(如:接地面)形成共地連接。The
至少一個所述電連接模組7與所述第一金屬屏蔽罩6是安裝在所述電路板4的相同板面(如:圖1中的所述電路板4的頂面)上,並且所述電連接模組7設置於所述第一金屬屏蔽罩6的一側(如:圖1中的所述第一金屬屏蔽罩6的右側)。其中,至少一個所述電連接模組7與所述屏蔽金屬板3的距離D3介於0.5毫米(mm)~2毫米之間,並且至少一個所述電連接模組7與所述天線5(如:所述主天線51)相隔有小於50毫米的一預設距離D5。需先說明的是,所述電子裝置100於本實施例中所包含的至少一個所述電連接模組7的數量是以一個為例,但本發明不受限於此。At least one of the
所述電連接模組7包含一連接器71及設置於所述連接器71外圍的一第二金屬屏蔽罩72,並且所述連接器71於本實施例中是以C類型的USB3.1連接器來說明,但本發明不受限於此。其中,所述連接器71包含有自所述殼體1裸露於外的一插接口711,用以供一外部裝置(圖未繪示,如:C類型的USB儲存裝置)沿一寬度方向W插接。進一步地說,對應於所述插接口711的所述連接器71部位(如:圖1中的所述連接器71右端部位)是突伸出於所述電路板4(也就是,相對應於所述電路板4呈懸空狀)。The
再者,所述連接器71包含有焊接於所述電路板4的多個接腳712,並且所述第二金屬屏蔽罩72形成有裸露多個所述接腳712的一檢視窗口721,用以提供在生產過程中對所述連接器71與所述電路板4之間的焊接狀況進行檢視。更詳細地說,所述連接器71除了其前側(如:所述插接口711)與底側之外的其他方向大都被所述第二金屬屏蔽罩72所包覆,並且所述第二金屬屏蔽罩72的頂緣較佳是與所述第一金屬屏蔽罩6的頂緣於一高度方向H上大致呈等高配置。Furthermore, the
需額外說明的是,所述高度方向H於本實施例中是垂直於所述寬度方向W(或所述電路板4),並且為便於說明,垂直於所述高度方向H與所述寬度方向W的一方向於本實施例中定義為一長度方向L,但本發明不以此為限。It should be noted that the height direction H is perpendicular to the width direction W (or the circuit board 4 ) in this embodiment, and for the convenience of description, the height direction H and the width direction One direction of W is defined as a length direction L in this embodiment, but the present invention is not limited thereto.
所述軟性導電件8於本實施例中是以呈平面狀的導電布(conductive fabric)來說明,但本發明不受限於此。其中,所述軟性導電件8連接所述第二金屬屏蔽罩72及所述第一金屬屏蔽罩6,並且所述軟性導電件8覆蓋所述電連接模組7(如:所述軟性導電件8覆蓋於所述第二金屬屏蔽罩72的所述頂緣)。The flexible
也就是說,所述第二金屬屏蔽罩72與所述第一金屬屏蔽罩6通過所述軟性導電件8而彼此電性耦接,據以使所述第二金屬屏蔽罩72、所述軟性導電件8、及所述第一金屬屏蔽罩6可以通過所述電路板4而共地連接於所述殼體1的所述接地區111。That is to say, the
進一步地說,所述電連接模組7位在所述軟性導電件8沿所述高度方向H的一覆蓋區域內。於本實施例中,所述軟性導電件8的長度L8大致為對應於所述工作頻率的1/8倍波長,所述軟性導電件8的寬度W8大致為對應於所述工作頻率的1/8倍波長,據以使所述軟性導電件8能夠針對所述天線5的所述工作頻率提供較佳的抗電磁干擾效果,但本發明不受限於此。Furthermore, the
所述導電彈性件9(如:導電泡棉)於本實施例中是以呈柱狀來說明且其可以包含有一彈性體91(如:泡棉)及包覆於所述彈性體91外表面的一導電層92(如:導電布),以使所述導電彈性件9受到壓迫時可產生彈性地變形,但本發明不受限於此。The conductive elastic member 9 (such as: conductive foam) is described as a column in this embodiment and it may include an elastic body 91 (such as: foam) and cover the outer surface of the elastic body 91 A conductive layer 92 (for example: conductive cloth) is provided so that the conductive
其中,所述導電彈性件9設置於所述殼體1上,並且所述導電彈性件9的頂緣與所述電路板4的所述頂面於所述高度方向H上大致呈等高配置,據以使得對應於所述插接口711的所述連接器71部位可以被設置在所述導電彈性件9上。再者,所述導電彈性件9的寬度W9大致為對應於所述工作頻率的1/8倍波長。Wherein, the conductive
更詳細地說,所述導電彈性件9是設置在所述背蓋11的所述接地區111上,以使得所述電連接模組7的所述連接器71可以通過所述導電彈性件9以電性連接所述殼體1(如:所述接地區111)。據此,所述第二金屬屏蔽罩72、所述軟性導電件8、及所述第一金屬屏蔽罩6、所述殼體1(如:所述接地區111)、及所述導電彈性件9於本實施例中彼此共地連接,以使配置於其內側的所述連接器71的電訊號能夠有效地屏蔽,降低所述連接器71對所述天線5的無線訊號產生干擾的影響,進而具備有較佳的無線傳輸品質。More specifically, the conductive
其中,所述軟性導電件8與所述導電彈性件9需設置於所述連接器71的插接口711的邊緣處,較佳與所述插接口711的邊緣切齊,以將訊號快速地進行下地,其抗雜訊干擾能力可被控制在3dB內。倘若所述軟性導電件8與所述導電彈性件9並未與所述插接口711的邊緣切齊(例如:距離邊緣大於0.1 毫米),所產生的雜訊將落在5dB~8dB之間。基於所述軟性導電件8與所述導電彈性件9於本實施例中是相對於所述電連接模組7大致呈L形配置,以使得所述連接器71可以在所述插接口711處通過所述軟性導電件8與所述導電彈性件9來構成完整的電磁屏蔽結構,進而降低位於所述插接口711處的干擾源,以提升所述電子裝置100的無線傳輸效能。Wherein, the flexible
依上所述,所述電子裝置100於本實施例中通過所述電連接模組7搭配於所述軟性導電件8及/或所述導電彈性件9而構成的一共地架構(或電磁屏蔽架構),此顯然有別於現有電子裝置的電磁屏蔽架構,並能大幅地提升所述連接器71的電磁屏蔽性能(如:降低因所述連接器71的訊號干擾到天線的無線傳輸訊號)。As mentioned above, in this embodiment, the
再者,所述電連接模組7於本實施例中通過採用所述軟性導電件8及/或所述導電彈性件9,因而無須共地連接於所述殼體1的所述邊框12,據以使所述電子裝置100可以適用於無金屬邊框設計,並且還能利於所述電子裝置100的薄型化,例如:所述電連接模組7與所述屏蔽金屬板3之間僅留有狹小的空間(如:所述距離介於0.5毫米~2毫米之間)。Furthermore, the
進一步地說,所述電子裝置100於本實施例中通過所述電連接模組7搭配所述軟性導電件8及/或所述導電彈性件9,以使所述天線5於所述工作頻率能夠抑制雜訊,所述雜訊為所述連接器71存取資料而產生的電訊號,抑制雜訊干擾可被控制在3dB之內,進而使所述天線5具備有較佳的通訊品質。舉例來說,本實施例所公開的所述電子裝置100是能夠符合相應規範中的測試要求,如:USB-IF規範中的射頻干擾(Radio Frequency Interference,RFI )測試要求。Furthermore, in this embodiment, the
[實施例二][Example 2]
請參閱圖3至圖5所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一的差異(如:所述導電彈性件9)大致說明如下:Please refer to FIG. 3 to FIG. 5 , which are the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment (such as: the conductive elastic member 9) are roughly described as follows :
於本實施例中,至少一個所述電連接模組7的兩側分別設有所述導電彈性件9與所述軟性導電件8,以將至少一個所述電連接模組7進行接地。其中,至少一個所述電連接模組7的數量於本實施例中為一個,所以所述導電彈性件9的寬度W9為對應於所述工作頻率的1/8倍波長。In this embodiment, the conductive
更詳細地說,面向所述背蓋11的所述電路板4的底面上形成有一第一接地墊41及鄰近所述第一接地墊41的一第二接地墊42,並且所述第一接地墊41與所述第二接地墊42是沿著所述寬度方向W配置。也就是說,所述第一接地墊41與所述第二接地墊42電性連接所述電路板4的所述接地面(圖未繪示)。In more detail, a
再者,所述導電彈性件9本實施例中具有垂直於所述長度方向且大致呈b字形的截面,並且所述導電彈性件9的寬度W9大致為對應於所述工作頻率的1/8倍波長。其中,所述導電層92具有包覆於所述彈性體91的一包覆段921、自所述包覆段921一端延伸的一第一延伸段922、及自所述包覆段921另一端延伸的一第二延伸段923。其中,所述第一延伸段922連接於所述電路板4的所述第一接地墊41,並且所述第一延伸段922堆疊於所述第二延伸段923,而所述第二延伸段923突伸出所述第一延伸段922並連接於所述電路板4的所述第二接地墊42。Furthermore, in this embodiment, the conductive
據此,基於所述軟性導電件8與所述導電彈性件9於本實施例中是相對於所述電連接模組7大致呈U形配置,以使得所述連接器71可以在所述插接口711處通過所述軟性導電件8與所述導電彈性件9來構成更為完整的電磁屏蔽結構,進而降低位於所述插接口711處的干擾源,以提升所述電子裝置100的無線傳輸效能。Accordingly, based on the fact that the flexible
[實施例三][Embodiment three]
請參閱圖6和圖12所示,其為本發明的實施例三。由於本實施例類似於上述實施例一和二,所以兩個實施例的相同處不再加以贅述,而本實施例相較於上述實施例一和二的差異(如:所述電連接模組7的數量及其相應構件)大致說明如下:Please refer to FIG. 6 and FIG. 12 , which is the third embodiment of the present invention. Since this embodiment is similar to the first and second embodiments above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first and second embodiments above (such as: the
於本實施例中,如圖6和圖7所示,所述電子裝置100所包含的所述電連接模組7的數量為兩個,並且兩個所述電連接模組7安裝於所述電路板4的同側。其中,兩個所述電連接模組7是沿著所述長度方向L配置,並且所述軟性導電件8連接所述第一金屬屏蔽罩6及兩個所述電連接模組7的所述第二金屬屏蔽罩72,而 所述軟性導電件8覆蓋兩個所述電連接模組7(如:所述軟性導電件8覆蓋於兩個所述第二金屬屏蔽罩72的所述頂緣)。In this embodiment, as shown in FIG. 6 and FIG. 7 , the number of the
換個角度來說,兩個所述電連接模組7位在所述軟性導電件8沿所述高度方向H的一覆蓋區域內。其中,所述軟性導電件8的長度L8大致為對應於所述工作頻率的1/4倍波長,所述軟性導電件8的寬度W8大致為對應於所述工作頻率的1/8倍波長。此外,依據本實施例與實施例一所公開的內容,所述軟性導電件8的長度L8可以是對應於所述工作頻率的1/8倍波長或1/4倍波長。To put it another way, the two
再者,所述電子裝置100所包含的所述導電彈性件9的數量為兩個,並且兩個所述導電彈性件9分別連接兩個所述電連接模組7,而每個所述導電彈性件9的寬度W9為對應於所述工作頻率的1/8倍波長,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述導電彈性件9的數量也可以是一個,其同時連接於兩個所述電連接模組7。此外,有關每個所述導電彈性件9及其所相連接的所述電連接模組7之間的關係則如同實施例一和實施例二所載,在此不再加以贅述。Furthermore, the
需額外說明的是,為便於呈現所述電子裝置100的架構能夠有效地降低所述連接器71於信號傳輸時對無線訊號產生干擾,本實施例於下述說明之中,進一步地通過圖8~圖12所呈現的實驗比較結果來輔助證實,但本發明不以此為限。It should be noted that, in order to facilitate the presentation of the structure of the
其中,圖8為所述電子裝置100的所述主天線51之雜訊強度在有加(如:圖8中的曲線C51a)和沒有加(如:圖8中的曲線C51b)本實施例的所述軟性導電件8與所述導電彈性件9之雜訊強度比較結果。再者,圖9為所述電子裝置100的所述副天線52之雜訊強度在有加(如:圖9中的曲線C52a)和沒有加(如:圖9中的曲線C52b)本實施例的所述軟性導電件8與所述導電彈性件9之雜訊強度比較結果。Wherein, FIG. 8 shows the noise intensity of the
進一步地說,由圖8和圖9可清楚地得知,當將所述連接器71的所述插接口711打開做讀或寫作動的變化比較,可看出有加所述軟性導電件8與所述導電彈性件9的特性,其所述主天線51明顯可改善1dB~8dB,並且在高頻(例如是1800MHz~2600MHz的工作頻段,特別是1843MHz~1990MHz的工作頻段)所改善幅度最為明顯(如:至少可以改善5dB以上),進而具備有阻隔所述連接器71因存取而產生雜訊,使無線通訊品質不受雜訊影響的特性。在所述主天線51或所述副天線52的來看,其抑制雜訊干擾能力都可在3dB以內,具有良好的屏蔽特性。Further, it can be clearly seen from Fig. 8 and Fig. 9 that when the
另,圖10為本實施例的所述電子裝置100在配置不同長度L8的所述軟性導電件8時的雜訊強度比較圖。其中,曲線C8a對應於所述長度L8為1/4波長,曲線C8b對應於所述長度L8為1/8波長,曲線C8c對應於所述長度L8為1/16波長,曲線C8d對應於所述長度L8為1/32波長。由圖10可清楚得知,所述軟性導電件8的尺寸變化趨勢是當所述長度L8越小時,其抑制雜訊的能力會越差。也就是說,所述軟性導電件8的長度L8較佳為對應所述工作頻率的1/8倍波長或1/4倍波長,使無線傳輸具有較佳的抗雜訊效果。In addition, FIG. 10 is a comparison diagram of noise intensity when the
此外,圖11和圖12為所述電子裝置100在不同結構配置下的雜訊強度比較圖。於圖11之中,曲線C9a對應於實施例二的結構配置,曲線C9b對應於實施例一的結構配置,曲線C9a’ 對應於實施例二的結構配置但未採用所述軟性導電件8,曲線C9b’ 對應於實施例一的結構配置但未採用所述軟性導電件8。再者,於圖12之中,曲線C8為對應於實施例一或二的結構配置但未採用所述導電彈性件9。In addition, FIG. 11 and FIG. 12 are comparison diagrams of noise intensity of the
進一步地說,由圖11可清楚地得知,當所述電子裝置100未採用所述軟性導電件8時,所述導電彈性件9使用實施例二的架構相較於實施例一的架構來說,會使所述電子裝置100產生較佳的抑制雜訊能力。再者,由圖12可清楚得知,當所述電子裝置100未採用所述導電彈性件9時,將會降低其抑制雜訊的能力。Furthermore, it can be clearly seen from FIG. 11 that when the
也就是說,由圖11和圖12可看出,所述電子裝置100較佳是同時採用所述軟性導電件8與所述導電彈性件9,據以使其能通過相互搭配而產生加乘的抑制雜訊效果。其中,所述軟性導電件8對於所述電子裝置100的電磁屏蔽性能影響最大,所以當未採用所述軟性導電件8時,其抑制雜訊能力最差。That is to say, it can be seen from Fig. 11 and Fig. 12 that the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的電子裝置,通過所述電連接模組搭配於所述軟性導電件及/或所述導電彈性件而構成的一共地架構(或電磁屏蔽架構),此顯然有別於現有電子裝置的電磁屏蔽架構,在電子裝置的內部空間受限的情況下還是能大幅地提升所述連接器的電磁屏蔽性能(如:降低所述連接器於信號傳輸時對無線訊號產生干擾)。In summary, the electronic device disclosed in the embodiment of the present invention has a common ground structure (or electromagnetic shielding structure) formed by the electrical connection module being matched with the flexible conductive element and/or the conductive elastic element, This is obviously different from the electromagnetic shielding structure of existing electronic devices, and it can still greatly improve the electromagnetic shielding performance of the connector when the internal space of the electronic device is limited (such as: reducing the impact of the connector on signal transmission) interfere with wireless signals).
再者,所述電連接模組於本實施例中通過採用所述軟性導電件及/或所述導電彈性件,因而無須共地連接於所述殼體的所述邊框,據以使所述電子裝置可以適用於無金屬邊框設計,並且還能利於所述電子裝置的薄型化,例如:所述電連接模組與所述屏蔽金屬板之間僅留有狹小的空間(如:所述距離介於0.5毫米~2毫米之間)。Furthermore, in this embodiment, the electrical connection module does not need to be connected to the frame of the housing by using the flexible conductive member and/or the conductive elastic member, so that the The electronic device can be suitable for the design of no metal frame, and can also facilitate the thinning of the electronic device, for example: only a small space is left between the electrical connection module and the shielding metal plate (such as: the distance between 0.5 mm and 2 mm).
進一步地說,所述電子裝置於本實施例中通過所述電連接模組搭配於所述軟性導電件及/或所述導電彈性件,以使所述天線於所述工作頻率能夠抑制因所述連接器存取而產生的雜訊(如:抑制雜訊干擾能力被控制在3dB之內),進而使所述天線具備有較佳的通訊品質。舉例來說,本實施例所公開的所述電子裝置是能夠符合相應規範中的測試要求,如:USB-IF規範中的射頻干擾(Radio Frequency Interference,RFI )測試要求。Furthermore, in this embodiment, the electronic device is matched with the flexible conductive member and/or the conductive elastic member through the electrical connection module, so that the antenna can suppress the The noise generated by accessing the connector (for example, the ability to suppress noise interference is controlled within 3dB), thereby enabling the antenna to have better communication quality. For example, the electronic device disclosed in this embodiment can meet the test requirements in the corresponding specifications, such as the radio frequency interference (Radio Frequency Interference, RFI) test requirements in the USB-IF specification.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.
100:電子裝置 1:殼體 11:背蓋 111:接地區 112:絕緣區 12:邊框 121:開孔 2:顯示屏幕 3:屏蔽金屬板 4:電路板 41:第一接地墊 42:第二接地墊 5:天線 51:主天線 52:副天線 6:第一金屬屏蔽罩 7:電連接模組 71:連接器 711:插接口 712:接腳 72:第二金屬屏蔽罩 721:檢視窗口 8:軟性導電件 9:導電彈性件 91:彈性體 92:導電層 921:包覆段 922:第一延伸段 923:第二延伸段 L:長度方向 W:寬度方向 H:高度方向 L8:長度 W8:寬度 W9:寬度 D3:距離 D5:預設距離 C51a、C51b、C52a、C52b、C8a、C8b、C8c、C8d、C9a、C9b、C9a’、C9b’、C8:曲線 100: Electronic device 1: shell 11:Back cover 111: grounding area 112: Insulation area 12: border 121: opening 2: display screen 3: shielding metal plate 4: Circuit board 41: First ground pad 42:Second ground pad 5: Antenna 51: Main antenna 52: Secondary antenna 6: The first metal shield 7: Electrical connection module 71: Connector 711: socket 712: Pin 72: The second metal shield 721: View window 8: Soft conductive parts 9: Conductive elastic parts 91:Elastomer 92: Conductive layer 921: Coating section 922: The first extension 923: Second extension L: length direction W: width direction H: height direction L8: length W8: width W9: width D3: Distance D5: preset distance C51a, C51b, C52a, C52b, C8a, C8b, C8c, C8d, C9a, C9b, C9a', C9b', C8: Curves
圖1為本發明實施例一的電子裝置的側視示意圖。FIG. 1 is a schematic side view of an electronic device according to
圖2為本發明實施例一的電子裝置的俯視示意圖。FIG. 2 is a schematic top view of an electronic device according to
圖3為本發明實施例二的電子裝置的側視示意圖。FIG. 3 is a schematic side view of an electronic device according to
圖4為本發明實施例二的電子裝置的俯視示意圖。FIG. 4 is a schematic top view of an electronic device according to
圖5為本發明實施例二的電子裝置的局部立體分解示意圖。FIG. 5 is a partially exploded perspective view of an electronic device according to
圖6為本發明實施例三的電子裝置的俯視示意圖(一)。FIG. 6 is a schematic top view (1) of an electronic device according to
圖7為本發明實施例三的電子裝置的俯視示意圖(二)。FIG. 7 is a schematic top view (2) of an electronic device according to
圖8為本發明實施例三的電子裝置對應於主天線的雜訊強度比較圖。FIG. 8 is a comparison diagram of noise intensity corresponding to the main antenna of the electronic device according to the third embodiment of the present invention.
圖9為本發明實施例三的電子裝置對應於副天線的雜訊強度比較圖。FIG. 9 is a comparison diagram of the noise intensity corresponding to the secondary antenna of the electronic device according to the third embodiment of the present invention.
圖10為本發明實施例三的電子裝置在配置不同長度的軟性導電件時的雜訊強度比較圖。FIG. 10 is a comparison diagram of the noise intensity of the electronic device according to the third embodiment of the present invention when flexible conductive elements with different lengths are arranged.
圖11和圖12為本發明的電子裝置在不同結構配置下的雜訊強度比較圖。FIG. 11 and FIG. 12 are comparison diagrams of the noise intensity of the electronic device of the present invention under different structural configurations.
100:電子裝置 100: Electronic device
1:殼體 1: Shell
11:背蓋 11:Back cover
12:邊框 12: border
121:開孔 121: opening
2:顯示屏幕 2: display screen
3:屏蔽金屬板 3: shielding metal plate
4:電路板 4: Circuit board
6:第一金屬屏蔽罩 6: The first metal shield
7:電連接模組 7: Electrical connection module
71:連接器 71: Connector
711:插接口 711: socket
712:接腳 712: Pin
72:第二金屬屏蔽罩 72: The second metal shield
721:檢視窗口 721: View window
8:軟性導電件 8: Soft conductive parts
9:導電彈性件 9: Conductive elastic parts
91:彈性體 91:Elastomer
92:導電層 92: Conductive layer
W:寬度方向 W: width direction
H:高度方向 H: height direction
D3:距離 D3: Distance
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW110141240A TWI795983B (en) | 2021-11-05 | 2021-11-05 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW110141240A TWI795983B (en) | 2021-11-05 | 2021-11-05 | Electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI795983B true TWI795983B (en) | 2023-03-11 |
TW202320407A TW202320407A (en) | 2023-05-16 |
Family
ID=86692171
Family Applications (1)
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TW110141240A TWI795983B (en) | 2021-11-05 | 2021-11-05 | Electronic device |
Country Status (1)
Country | Link |
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TW (1) | TWI795983B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM499682U (en) * | 2014-11-21 | 2015-04-21 | Advanced Connectek Inc | Electrical receptacle connector with shielding and grounding features |
US20180205185A1 (en) * | 2017-01-16 | 2018-07-19 | Advanced Connectek Inc. | Receptacle electrical connector |
US20200060020A1 (en) * | 2018-08-20 | 2020-02-20 | Samsung Electronics Co., Ltd. | Printed circuit board including bending portion, and electronic device including the same |
CN213717130U (en) * | 2020-11-13 | 2021-07-16 | 宜宾得康电子有限公司 | Electric connector and electronic equipment |
-
2021
- 2021-11-05 TW TW110141240A patent/TWI795983B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM499682U (en) * | 2014-11-21 | 2015-04-21 | Advanced Connectek Inc | Electrical receptacle connector with shielding and grounding features |
US20180205185A1 (en) * | 2017-01-16 | 2018-07-19 | Advanced Connectek Inc. | Receptacle electrical connector |
US20200060020A1 (en) * | 2018-08-20 | 2020-02-20 | Samsung Electronics Co., Ltd. | Printed circuit board including bending portion, and electronic device including the same |
CN213717130U (en) * | 2020-11-13 | 2021-07-16 | 宜宾得康电子有限公司 | Electric connector and electronic equipment |
Also Published As
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TW202320407A (en) | 2023-05-16 |
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