TWM510000U - USB Type-C female connector structure - Google Patents
USB Type-C female connector structure Download PDFInfo
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- TWM510000U TWM510000U TW104207954U TW104207954U TWM510000U TW M510000 U TWM510000 U TW M510000U TW 104207954 U TW104207954 U TW 104207954U TW 104207954 U TW104207954 U TW 104207954U TW M510000 U TWM510000 U TW M510000U
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- transmission conductor
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Description
本新型為提供一種USB Type-C母座連接器之結構,尤指一種可有效降低電磁干擾及射頻干擾,並具有較佳之特徵阻抗的USB Type-C母座連接器之結構。The present invention provides a USB Type-C female connector structure, and more particularly relates to a USB Type-C female connector structure which can effectively reduce electromagnetic interference and radio frequency interference and has better characteristic impedance.
按,隨著多媒體與高速寬頻的使用普及,電子裝置間傳遞的資料量日益龐大,故如何在短暫的時間內傳輸大量電子資料,是現今資訊科技發展的趨勢。除了增加電子裝置間傳輸電子訊號的通路外,目前一般採取的對應措施是提高電子裝置間所傳遞的電子訊號頻率。而連接器是一種位於不同電子裝置間的電子訊號溝通橋樑,隨著傳輸量要求的提升,連接器亦漸漸面臨高頻訊號傳遞的挑戰。According to the popularity of multimedia and high-speed broadband, the amount of data transmitted between electronic devices is increasing. Therefore, how to transmit a large amount of electronic data in a short period of time is a trend in the development of information technology today. In addition to increasing the path for transmitting electronic signals between electronic devices, the current general response is to increase the frequency of electronic signals transmitted between electronic devices. The connector is a bridge of electronic signal communication between different electronic devices. As the transmission requirements increase, the connector gradually faces the challenge of high-frequency signal transmission.
為了使USB能夠應用於更高速率的訊號傳輸,全新的通用序列匯流排Type C便因應而生。USB國際制定標準協會(USB-IF)於日前宣布了這項名為USB Type C介面的標準規範,由於同步傳輸的資料量大幅增加,在使用過程中可能產生相對應的電磁輻射,以致干擾其它電子元件的正常運作,有鑑於此,業界普遍都會以接地方式來降低電磁干擾(EMI)的產生。In order to enable USB to be applied to higher-speed signal transmission, the new universal serial bus Type C was born. The USB International Standards Association (USB-IF) has announced this standard specification called USB Type C interface. Due to the large increase in the amount of data transmitted synchronously, corresponding electromagnetic radiation may be generated during use, which may interfere with other In view of the normal operation of electronic components, in the industry, the grounding method is generally used to reduce the generation of electromagnetic interference (EMI).
然上述USB Type C連接器於使用時,為確實存在下列問題與缺失尚待改進:However, when the above USB Type C connector is used, the following problems and defects are still needed to be improved:
一、僅以接地方式降低電磁干擾,成效明顯不足。First, only reduce the electromagnetic interference by grounding, the effect is obviously insufficient.
二、連接器外殼體的多處鏤空以及端子焊接處,常是干擾最難抑制的位置。Second, the connector outer shell of multiple hollow and terminal welding, often the most difficult to suppress the interference position.
三、高頻端子間以及端子彎折處造成的干擾問題。Third, the interference caused by the high frequency terminals and the bending of the terminals.
是以,要如何解決上述習用之問題與缺失,即為本新型之申請人與從事此行業之相關廠商所亟欲研究改善之方向所在者。Therefore, how to solve the above problems and deficiencies in the past, that is, the applicants of the new type and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
故,本新型之申請人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種利用絕佳的包覆性及多層的隔離效果,使連接器具有防止雜訊(EMI、RFI)散逸優勢,而可有效抑制電磁波輻射的USB Type-C母座連接器之結構的新型專利者。Therefore, in view of the above-mentioned shortcomings, the applicants of this new type have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, they have designed such excellent utilization packages. Coverage and multi-layer isolation, the connector has a new patent to protect the structure of the USB Type-C female connector that can effectively suppress the noise (EMI, RFI) dissipation and effectively suppress electromagnetic radiation.
本新型之主要目的在於:利用設於該上傳輸導體組延伸部及該下傳輸導體組延伸部間的隔板部,將上下兩排傳輸導體組予以隔離,配合接地導磁板狀體的作用調節特徵阻抗、減少插入或迴授訊號損失、或調整近端與遠端的串音,以解決USB Type-C對內、對外的雜訊干擾問題。The main purpose of the present invention is to isolate the upper and lower rows of transmission conductor groups by using the partition portion disposed between the upper transmission conductor group extension and the lower transmission conductor group extension portion, and cooperate with the grounded magnetic conductive plate-like body. Adjust the characteristic impedance, reduce the insertion or feedback signal loss, or adjust the crosstalk between the near end and the far end to solve the problem of internal and external noise interference of the USB Type-C.
為達上述目的,本新型之結構包括:一上傳輸導體組,該上傳輸導體組係包含複數高頻訊號上傳輸導體組、複數位於該些高頻訊號上傳輸導體組兩側之差動電源上傳輸導體組、及複數位於各該差動電源上傳輸導體組間之低頻訊號上傳輸導體組,且該些高頻訊號上傳輸導體組、該些差動電源上傳輸導體組及該些低頻訊號上傳輸導體組係分別界定有一上傳輸導體組接觸部、一由該上傳輸導體組接觸部一端延伸形成之上傳輸導體組延伸部、及一由該上傳輸導體組延伸部背離該上傳輸導體組接觸部一端彎折形成之上傳輸導體組焊接部,而該上傳輸導體組焊接部係為單排焊接之態樣,其中該上傳輸導體組延伸部係包含一向下彎折形成之上傾斜部。並具有一與該上傳輸導體組上下並排之下傳輸導體組,該下傳輸導體組係包含複數高頻訊號下傳輸導體組、複數位於該些高頻訊號下傳輸導體組兩側之差動電源下傳輸導體組、及複數位於各該差動電源下傳輸導體組間之低頻訊號下傳輸導體組,且該些高頻訊號下傳輸導體組、該些差動電源下傳輸導體組及該些低頻訊號下傳輸導體組係分別界定有一下傳輸導體組接觸部、一由該下傳輸導體組接觸部一端延伸形成之下傳輸導體組延伸部、及一由該下傳輸導體組延伸部背離該下傳輸導體組接觸部一端彎折形成之下傳輸導體組焊接部,而該下傳輸導體組焊接部係為單排焊接之態樣,其中該下傳輸導體組延伸部係包含一向下彎折形成之下傾斜部。另於該上傳輸導體組延伸部及該下傳輸導體組延伸部間設有至少一隔板部,該隔板部係包含一位於該上傾斜部及該下傾斜部間之斜板部,並具有至少一供設置該隔板部、該上傳輸 導體組、及該下傳輸導體組之絕緣膠體,以及至少一收容該上傳輸導體組、該下傳輸導體組及該絕緣膠體之屏蔽殼體,而該屏蔽殼體係包含一內屏蔽殼體、一包覆該內屏蔽殼體之外屏蔽殼體、及至少一設於該內屏蔽殼體一側之絕緣墊體,再於該內屏蔽殼體一側形成複數分別位於該上傳輸導體組延伸部及該下傳輸導體延伸部之上下兩側的接地導磁板狀體;本新型係以向下彎折的上傳輸導體焊接部及下傳輸導體焊接部交錯排列形成垂直單排焊接的態樣,且在上傳輸導體延伸部及下傳輸導體延伸部間利用隔板部予以隔離,再於內屏蔽殼體上設置複數供降低迴授損失及調整串音之接地導磁板狀體,最後利用外屏蔽殼體將內屏蔽殼體連同垂直段的上、下傳輸導體焊接部完全包覆,藉此確實降低EMI及RFI。In order to achieve the above object, the structure of the present invention comprises: an upper transmission conductor set comprising a plurality of high frequency signal transmission conductor groups, and a plurality of differential power sources on both sides of the transmission conductor group on the high frequency signals An upper transmission conductor set, and a plurality of transmission conductor groups on the low frequency signal between the transmission conductor groups of the differential power supply, and the transmission conductor groups on the high frequency signals, the transmission conductor groups on the differential power sources, and the low frequency The signal transmission conductor sets respectively define an upper transmission conductor group contact portion, an extension portion of the upper transmission conductor group contact portion extending to form an upper transmission conductor group extension portion, and a transmission portion away from the upper transmission conductor group extension portion One end of the conductor group contact portion is bent to form an upper transmission conductor group soldering portion, and the upper transmission conductor group soldering portion is a single row soldering portion, wherein the upper transmission conductor group extending portion includes a downwardly bent formation Inclined section. And having a transmission conductor group arranged side by side with the upper transmission conductor group, the lower transmission conductor group comprising a plurality of high frequency signal transmission conductor groups, and a plurality of differential power sources located on both sides of the transmission conductor group under the high frequency signals a lower transmission conductor set, and a plurality of low-frequency signal transmission conductor groups located between the transmission conductor groups of the differential power source, and the high-frequency signal transmission conductor group, the differential power transmission conductor group, and the low frequency The signal transmission conductor group defines a lower transmission conductor group contact portion, a transmission conductor group extension portion extending from one end of the lower transmission conductor group contact portion, and a lower transmission portion extending from the lower transmission conductor group extension portion. One end of the conductor set contact portion is bent to form a lower transmission conductor set soldering portion, and the lower transmission conductor set soldering portion is a single row soldering aspect, wherein the lower transmission conductor set extension portion includes a downward bent shape Inclined section. Further, at least one partition portion is disposed between the upper transmission conductor group extending portion and the lower transmission conductor group extending portion, and the partition portion includes a swash plate portion between the upper inclined portion and the lower inclined portion, and Having at least one for providing the partition portion, the upper transmission a conductor set, and an insulating colloid of the lower transfer conductor set, and at least one shield case housing the upper transfer conductor set, the lower transfer conductor set and the insulating colloid, and the shield case comprises an inner shield case, a shielding case covering the inner shielding shell and at least one insulating pad body disposed on one side of the inner shielding housing, and forming a plurality of extension portions respectively located on the upper transmission conductor group on the side of the inner shielding housing And a grounded magnetic conductive plate-like body on the upper and lower sides of the lower portion of the lower transmission conductor; the present invention is formed by staggering the upper transmission conductor welding portion and the lower transmission conductor welding portion which are bent downward to form a vertical single-row welding manner. And separating between the upper transmission conductor extension portion and the lower transmission conductor extension portion by the partition portion, and then providing a plurality of grounded magnetic conductive plate-like bodies for reducing the feedback loss and adjusting the crosstalk on the inner shield casing, and finally utilizing the outer The shielded housing completely encloses the inner shielded housing along with the upper and lower transfer conductor welds of the vertical section, thereby reliably reducing EMI and RFI.
藉由上述技術,可針對習用USB Type-C所存在之問題點加以改善,以達到上述優點之實用進步性。With the above technology, the problems existing in the conventional USB Type-C can be improved to achieve the practical progress of the above advantages.
1‧‧‧上傳輸導體組1‧‧‧Upper transmission conductor set
11‧‧‧高頻訊號上傳輸導體組11‧‧‧Transmission conductor set on high frequency signal
111‧‧‧上傳輸導體組接觸部111‧‧‧Upper transmission conductor set contact
112‧‧‧上傳輸導體組延伸部112‧‧‧Upper transmission conductor set extension
1121‧‧‧上傾斜部1121‧‧‧Upper slope
113‧‧‧上傳輸導體組焊接部113‧‧‧Upper transmission conductor set welding
12‧‧‧差動電源上傳輸導體組12‧‧‧Transmission conductor set on differential power supply
121‧‧‧上傳輸導體組接觸部121‧‧‧Upper transmission conductor set contact
122‧‧‧上傳輸導體組延伸部122‧‧‧Upper transmission conductor set extension
123‧‧‧上傳輸導體組焊接部123‧‧‧Upper transmission conductor set welding department
13‧‧‧低頻訊號上傳輸導體組13‧‧‧Transmission conductor set on low frequency signal
131‧‧‧上傳輸導體組接觸部131‧‧‧Upper transmission conductor set contact
132‧‧‧上傳輸導體組延伸部132‧‧‧Upper transmission conductor set extension
133‧‧‧上傳輸導體組焊接部133‧‧‧Upper transmission conductor set welding
2‧‧‧下傳輸導體組2‧‧‧lower transmission conductor set
21‧‧‧高頻訊號下傳輸導體組21‧‧‧Transmission conductor set under high frequency signal
211‧‧‧下傳輸導體組接觸部211‧‧‧Transfer conductor set contact
212‧‧‧下傳輸導體組延伸部212‧‧‧Transmission conductor group extension
2121‧‧‧下傾斜部2121‧‧‧ Lower slope
213‧‧‧下傳輸導體組焊接部213‧‧‧Transmission conductor set welding
22‧‧‧差動電源下傳輸導體組22‧‧‧Transmission conductor set under differential power supply
221‧‧‧下傳輸導體組接觸部221‧‧‧Transfer conductor set contact
222‧‧‧下傳輸導體組延伸部222‧‧‧Transmission conductor group extension
223‧‧‧下傳輸導體組焊接部223‧‧‧Transmission conductor set welding
23‧‧‧低頻訊號下傳輸導體組23‧‧‧Transmission conductor set under low frequency signal
231‧‧‧下傳輸導體組接觸部231‧‧‧Transfer conductor set contact
232‧‧‧下傳輸導體組延伸部232‧‧‧Transmission conductor group extension
233‧‧‧下傳輸導體組焊接部233‧‧‧Transmission conductor set welding
3‧‧‧隔板部3‧‧‧Parts
31‧‧‧卡扣彈片31‧‧‧Snap snaps
32‧‧‧斜板部32‧‧‧ sloping plate
33‧‧‧隔離部33‧‧‧Isolation Department
34‧‧‧卡扣孔34‧‧‧Snap holes
4‧‧‧絕緣膠體4‧‧‧Insulating colloid
41‧‧‧上絕緣膠體41‧‧‧Upper insulating colloid
411‧‧‧第一上絕緣層411‧‧‧First upper insulation layer
412‧‧‧第二上絕緣層412‧‧‧Second upper insulation
413‧‧‧第三上絕緣層413‧‧‧The third upper insulation layer
414‧‧‧第一絕緣塊414‧‧‧First insulation block
4141‧‧‧支撐膠體4141‧‧‧Support colloid
42‧‧‧下絕緣膠體42‧‧‧Insulating colloid
421‧‧‧第一下絕緣層421‧‧‧First lower insulation layer
422‧‧‧第二下絕緣層422‧‧‧Second lower insulation layer
423‧‧‧第三下絕緣層423‧‧‧ Third lower insulation layer
424‧‧‧第二絕緣塊424‧‧‧Second insulation block
5‧‧‧屏蔽殼體5‧‧‧Shield housing
51‧‧‧內屏蔽殼體51‧‧‧Inside shielded housing
511‧‧‧接地導磁板狀體511‧‧‧Grounding magnetic plate
5111‧‧‧間隔部5111‧‧‧Interval
512‧‧‧固定彈片512‧‧‧Fixed shrapnel
52、52a‧‧‧外屏蔽殼體52, 52a‧‧‧ outer shield shell
521‧‧‧容置部521‧‧‧ 容 部
522‧‧‧披覆部522‧‧‧Covering Department
523‧‧‧蓋體部523‧‧‧ Cover Department
524‧‧‧斜後蓋524‧‧‧ oblique back cover
525、525a‧‧‧焊接腳525, 525a‧‧‧ soldering feet
5251a‧‧‧鏤空部5251a‧‧‧Face Department
53‧‧‧絕緣墊體53‧‧‧Insulation mat
531‧‧‧平面部531‧‧‧Flat Department
532‧‧‧限位部532‧‧‧Limited
533‧‧‧支撐部533‧‧‧Support
6a‧‧‧電路基板6a‧‧‧ circuit board
第一圖 係為本新型較佳實施例之立體圖。The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 係為本新型傳輸導體組及隔板部之側面透視圖。The second figure is a side perspective view of the new transmission conductor set and the partition portion.
第三圖 係為本新型上傳輸導體組之俯視圖。The third figure is a top view of the new upper transmission conductor set.
第四圖 係為本新型下傳輸導體組之俯視圖。The fourth figure is a top view of the new lower transmission conductor set.
第五圖 係為本新型外屏蔽殼體之立體圖。The fifth figure is a perspective view of the new outer shield case.
第六圖 係為本新型內屏蔽殼體之立體圖。Figure 6 is a perspective view of the new inner shield housing.
第七圖 係為本新型絕緣墊體之立體圖。The seventh figure is a perspective view of the new insulating mat body.
第八圖 係為本新型絕緣膠體之立體圖。The eighth figure is a perspective view of the new insulating colloid.
第八A圖 係為本新型第八圖之另一角度立體圖。Figure 8A is another perspective view of the eighth figure of the new type.
第九圖 係為本新型隔板部之另一角度立體圖。The ninth diagram is another perspective view of the new partition portion.
第十圖 係為本新型另一實施例之立體圖。Figure 10 is a perspective view of another embodiment of the present invention.
為達成上述目的及功效,本新型所採用之技術手段及構造,茲繪圖就本新型較佳實施例詳加說明其特徵與功能如下,俾利完全了解。In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions thereof are as follows.
請參閱第一圖至第九圖所示,係為本新型較佳實施例之立體圖、傳輸導體組及隔板部之側面透視圖、上傳輸導體組之俯視圖、下傳輸導體組之俯視圖、外屏蔽殼體之立體圖、內屏蔽殼體之立體圖、絕緣墊體之立體圖、絕緣膠體之立體圖、第八圖之另一角度立體圖及隔板部之另一角度立體圖,由圖中可清楚看出本新型係包括:一上傳輸導體組1,該上傳輸導體組1係包含複數高頻訊號上傳輸導體組11、複數位於該些高頻訊號上傳輸導體組11兩側之差動電源上傳輸導體組12、及複數位於各該差動電源上傳輸導體組12間之低頻訊號上傳輸導體組13,且該些高頻訊號上傳輸導體組11、該些差動電源上傳輸導體組12及該些低頻訊號上傳輸導體組13係分別界定有一上傳輸導體組接觸部111、121、131、一由該上傳輸導體組接觸部111、121、131一端延伸形成之上之傳輸導體組延伸部112、122、132、及一由該上傳輸導體組延伸部112、122、132背離該上傳輸導體組接觸部111、121、131一端彎折形成之上傳輸導體組焊接部113、123、133,而該上傳輸導體組焊接部113、123、133係為單排焊接之態樣,又該上傳輸導體組延伸部112、122、132係包含一向下彎折形成之上傾斜部1121,且該上傾斜部1121與該上傳輸導體組延伸部112、122、132及該上傳輸導體組焊接部113、123、133間之夾角係為135度;一與該上傳輸導體組1上下並排之下傳輸導體組2,該下傳輸導體組2係包含複數高頻訊號下傳輸導體組21、複數位於該些高頻訊號下傳輸導體組21兩側之差動電源下傳輸導體組22、及複數位於各該差動電源下傳輸導體組22間之低頻訊號下傳輸導體組23,且該些高頻訊號下傳輸導體組21、該些差動電源下傳輸導體組22及該些低頻訊號下傳輸導體組23係分別界定有一下傳輸導體組接觸部211、221、231一由該下傳輸導體組接觸部211一端延伸形成之下傳輸導體組延伸部212、222、232,及一由該下傳輸導體組延伸部212、222、232背離該下傳輸導體組接觸部211、221、231一端彎折形成之下傳輸導體組焊接部213、223、233,而該下傳輸導體組焊接部213、223、233係為單排焊接之態樣,又該下傳輸導體組延伸部212、222、232係包含一向下彎折形成之下傾斜部2121,且該下傾斜部2121與該下傳輸導體組延伸部212、 222、232及該下傳輸導體組焊接部213、223、233間之夾角係為135度;至少一設於該上傳輸導體組延伸部112、122、132及該下傳輸導體組延伸部212、222、232間的隔板部3,該隔板部3係包含至少一卡扣彈片31、一位於該上傾斜部1121及該下傾斜部2121間之斜板部32、至少一形成於該隔板部3或該斜板部32上之隔離部33、及複數形成於該隔板部3上之卡扣孔34;至少一供設置該隔板部3、該上傳輸導體組1、及該下傳輸導體組2之絕緣膠體4,該絕緣膠體4係包含一設於該隔板部3一側之上絕緣膠體41及一設於該隔板部3背離該上絕緣膠體41一側之下絕緣膠體42,其中上絕緣膠體41係包含一第一上絕緣層411、一向上凸出形成於該第一上絕緣層411一側之第二上絕緣層412、至少一向上凸出形成於該第二上絕緣層412背離該第一上絕緣層411一側之第三上絕緣層413、至少一向下凸出形成於該第三上絕緣層413背離該第二上絕緣層412一側且供包覆該上傳輸導體組焊接部113、123、133之第一絕緣塊414、及一形成於該第一絕緣塊414一側供支撐該屏蔽殼體5之支撐膠體4141,而下絕緣膠體42係包含一第一下絕緣層421、一向下凸出形成於該第一下絕緣層421一側之第二下絕緣層422、至少一向下凸出形成於該第二下絕緣層422背離該第一下絕緣層421一側之第三下絕緣層423、及至少一向下凸出形成於該第三下絕緣層423背離該第二下絕緣層422一側且供包覆該下傳輸導體組焊接部213、223、233之第二絕緣塊424;至少一收容該上傳輸導體組1、該下傳輸導體組2及該絕緣膠體4之屏蔽殼體5,該屏蔽殼體5係包含一內屏蔽殼體51、一包覆該內屏蔽殼體51之外屏蔽殼體52、及至少一設於該內屏蔽殼體51一側之絕緣墊體53,其中該外屏蔽殼體52係包含一容置部521、一由該容置部521一側翻折形成而披覆於該容置部521上之披覆部522、一形成於該披覆部522一側且寬度大於該披覆部522之蓋體部523、一形成於該蓋體部523一側之斜後蓋524、及複數形成於該披覆部522或該蓋體部523至少一側處之焊接腳525,而該絕緣墊體53則包含一平面部531、二分別形成於該平面部531兩側之限位部532、及至少一位於該平面部531底側之支撐部5 33;及複數形成於該內屏蔽殼體51一側且分別位於該上傳輸導體組延伸部112、122、132及該下傳輸導體組延伸部212、222、232之上下兩側的接地導磁板狀體511,且各該接地導磁板狀體511間具有一間隔部5111,且該內屏蔽殼體51兩側具有至少一固定彈片512。Referring to the first to ninth drawings, a perspective view of the preferred embodiment of the present invention, a side perspective view of the transmission conductor set and the spacer portion, a top view of the upper transmission conductor set, a top view of the lower transmission conductor set, and an outer view A perspective view of the shield case, a perspective view of the inner shield case, a perspective view of the insulating pad body, a perspective view of the insulating colloid, another angle perspective view of the eighth figure, and another perspective view of the partition portion, which is clearly visible in the figure The novel system includes: an upper transmission conductor set 1 comprising a plurality of high-frequency signal transmission conductor groups 11 and a plurality of differential power supply transmission conductors on both sides of the transmission conductor group 11 on the high-frequency signals. The group 12 and the plurality of transmission conductor groups 13 on the low frequency signal between the transmission conductor groups 12 on the differential power supply, and the transmission conductor groups 11 on the high frequency signals, the transmission conductor groups 12 on the differential power sources, and the The low-frequency signal transmission conductor groups 13 respectively define an upper transmission conductor group contact portion 111, 121, 131, and a transmission conductor assembly extending from one end of the upper transmission conductor group contact portion 111, 121, 131. Portions 112, 122, 132, and one end of the upper transmission conductor group extending portions 112, 122, 132 facing away from the upper transmission conductor group contact portions 111, 121, 131 are bent to form upper transmission conductor group soldering portions 113, 123, 133, wherein the upper transmission conductor set welding portions 113, 123, 133 are in a single row welding manner, and the upper transmission conductor group extending portions 112, 122, 132 comprise a downwardly bent upper inclined portion 1121. The angle between the upper inclined portion 1121 and the upper transmission conductor group extending portions 112, 122, 132 and the upper transmission conductor group welding portions 113, 123, 133 is 135 degrees; one is arranged side by side with the upper transmission conductor group 1 The lower transmission conductor set 2 includes a plurality of high frequency signal transmission conductor groups 21, a plurality of differential power transmission conductor groups 22 located on both sides of the high frequency signal transmission conductor group 21, and a plurality of low-frequency signal transmission conductor groups 23 located between the transmission conductor groups 22 of the differential power source, and the high-frequency signal transmission conductor groups 21, the differential power transmission conductor groups 22, and the low-frequency signals The transmission conductor group 23 is respectively defined with a lower transmission guide The group contact portions 211, 221, 231 extend from one end of the lower transmission conductor group contact portion 211 to form a lower transmission conductor group extension portion 212, 222, 232, and are separated from the lower transmission conductor group extension portion 212, 222, 232. The lower transmission conductor group contact portions 211, 221, 231 are bent at one end to form the lower transmission conductor group soldering portions 213, 223, 233, and the lower transmission conductor group solder portions 213, 223, 233 are in a single row soldering manner. The lower transmission conductor group extending portion 212, 222, 232 further includes a downwardly bent lower inclined portion 2121, and the lower inclined portion 2121 and the lower transmission conductor group extending portion 212, The angle between the 222, 232 and the lower transmission conductor set soldering portions 213, 223, 233 is 135 degrees; at least one of the upper transmission conductor group extending portions 112, 122, 132 and the lower transmission conductor group extending portion 212, a partition portion 3 between 222 and 232, the partition portion 3 includes at least one snap elastic piece 31, and a swash plate portion 32 between the upper inclined portion 1121 and the lower inclined portion 2121, at least one of which is formed at the partition a partition portion 33 on the plate portion 3 or the swash plate portion 32, and a plurality of snap holes 34 formed in the partition portion 3; at least one of the partition portion 3, the upper transmission conductor group 1, and the The insulating colloid 4 of the lower transmission conductor set 2, the insulating colloid 4 comprising an insulating colloid 41 disposed on one side of the spacer portion 3 and one disposed under the side of the spacer portion 3 facing away from the upper insulating colloid 41 The insulating adhesive body 42 includes a first upper insulating layer 411 and a second upper insulating layer 412 protruding upwardly from the first upper insulating layer 411, at least one of which is formed upwardly. a third upper insulating layer 412 facing away from the first upper insulating layer 411 on the side of the first upper insulating layer 412, at least one protruding downwardly formed on the third The upper insulating layer 413 faces away from the second upper insulating layer 412 and covers the first insulating block 414 of the upper transfer conductor group soldering portions 113, 123, 133, and is formed on the side of the first insulating block 414. The lower insulating layer 42 includes a first lower insulating layer 421 and a second lower insulating layer 422 protruding downwardly from the first lower insulating layer 421, at least a third lower insulating layer 423 formed on the side of the second lower insulating layer 422 facing away from the first lower insulating layer 421, and at least one downwardly convexly formed on the third lower insulating layer 423 away from the second a second insulating block 424 on one side of the lower insulating layer 422 for covering the lower transmission conductor set soldering portions 213, 223, 233; at least one housing the upper transmitting conductor set 1, the lower transmitting conductor set 2, and the insulating colloid 4 The shield case 5 includes an inner shield case 51, a shield case 52 covering the inner shield case 51, and at least one side disposed on the inner shield case 51. Insulating pad body 53 , wherein the outer shield housing 52 includes a receiving portion 521 , and a side of the receiving portion 521 is folded over a cover portion 522 which is formed on the accommodating portion 521, a cover portion 523 formed on the side of the cover portion 522 and having a width larger than the cover portion 522, and a cover portion 523 formed on the cover portion 523 a side inclined back cover 524 and a plurality of soldering legs 525 formed on at least one side of the covering portion 522 or the lid portion 523, and the insulating mat body 53 includes a flat portion 531, two of which are respectively formed on the plane a limiting portion 532 on both sides of the portion 531 and at least one supporting portion 5 on the bottom side of the planar portion 531 33; and a plurality of grounded magnetic fluxes formed on one side of the inner shield case 51 and located on the upper and lower sides of the upper transfer conductor group extensions 112, 122, 132 and the lower transfer conductor set extensions 212, 222, 232, respectively The plate-shaped body 511 has a spacer portion 5111 between the grounded magnetic conductive plate-like members 511, and the inner shield case 51 has at least one fixing elastic piece 512 on both sides.
藉由上述之說明,已可了解本技術之結構,而依據這個結構之對應配合,更達到可有效降低電磁干擾及射頻干擾,並具有較佳之特徵阻抗等優勢,而詳細之解說將於下述說明。With the above description, the structure of the present technology can be understood, and according to the corresponding cooperation of the structure, the advantages of electromagnetic interference and radio frequency interference can be effectively reduced, and the characteristic impedance is better, and the detailed explanation will be as follows. Description.
本新型傳輸導體組之排列方式係符合USB國際制定標準協會USB Type-C之規範,而主要改良部分包括有:The arrangement of the new transmission conductor set conforms to the USB Type-C specification of the USB International Standards Association, and the main improvements include:
(一)各該差動電源上傳輸導體組12及該差動電源下傳輸導體組22係沿背離該低頻訊號上傳輸導體組13及該低頻訊號下傳輸導體組23之方向向外擴散,且上、下傳輸導體組延伸部112、122、132、212、222、232分別包含一向下彎折之上傾斜部1121及一向下彎折之下傾斜部2121,使二者分別以傾斜態樣的方式向下彎折出交錯排列且為單排焊接態樣之上、下傳輸導體焊接部113、123、133、213、223、233,且上、下傳輸導體組延伸部112、122、132、212、222、232的每個轉折處皆以135度的夾角進行彎折,故可在上、下傳輸導體組1、2的水平區段(接觸部及延伸部)與傾斜區段(上、下傾斜部1121、2121)間設置隔板部3及斜板部32,藉此在減少插入或迴授訊號損失的同時,配合絕緣墊體53的支撐效果,可讓本新型適用於多種板材厚度及零件高度。(1) each of the differential power supply transmission conductor group 12 and the differential power transmission conductor group 22 are outwardly diffused in a direction away from the low frequency signal transmission conductor group 13 and the low frequency signal transmission conductor group 23, and The upper and lower transmission conductor group extending portions 112, 122, 132, 212, 222, and 232 respectively include a downwardly bent upper inclined portion 1121 and a downwardly bent lower inclined portion 2121, so that the two are respectively inclined. The method is bent downwardly and staggered and is a single row of soldering patterns above and below the transmission conductor soldering portions 113, 123, 133, 213, 223, 233, and the upper and lower transmission conductor group extending portions 112, 122, 132, Each of the corners of 212, 222, and 232 is bent at an angle of 135 degrees, so that the horizontal sections (contact portions and extensions) and the inclined sections of the upper and lower transmission conductor sets 1, 2 can be transported. The partition portion 3 and the swash plate portion 32 are disposed between the lower inclined portions 1121 and 2121), thereby reducing the insertion or feedback signal loss and the supporting effect of the insulating mat 53 to make the present invention suitable for various sheet thicknesses. And the height of the part.
(二)上傳輸導體組接觸部111、121、131之寬度係大於該上傳輸導體組延伸部112、122、132之寬度,且該上傳輸導體組延伸部112、122、132之寬度係大於該上傳輸導體組焊接部113、123、133之寬度,同時該下傳輸導體組接觸部211、221、231之寬度係大於該下傳輸導體組延伸部212、222、232之寬度,且該下傳輸導體組延伸部212、222、232之寬度係大於該下傳輸導體組焊接部213、223、233之寬度。使各端子具有三種不同寬度,且由接觸部、延伸部到焊接部之寬度漸漸變窄,藉此調整出較佳之特徵阻抗。(2) The width of the upper transmission conductor group contact portions 111, 121, 131 is greater than the width of the upper transmission conductor group extension portions 112, 122, 132, and the width of the upper transmission conductor group extension portions 112, 122, 132 is greater than The width of the upper transmission conductor set soldering portions 113, 123, 133, while the width of the lower transmission conductor group contact portions 211, 221, 231 is greater than the width of the lower transmission conductor group extending portions 212, 222, 232, and the lower The width of the transmission conductor set extensions 212, 222, 232 is greater than the width of the lower transmission conductor set welds 213, 223, 233. Each of the terminals has three different widths, and the width from the contact portion, the extension portion to the welded portion is gradually narrowed, thereby adjusting the preferred characteristic impedance.
(三)屏蔽殼體5包含有一內屏蔽殼體51、一外屏蔽殼體52、及一設於該 內屏蔽殼體51一側之絕緣墊體53,其中該內屏蔽殼體51一側的接地導磁板狀體511位於該些高頻訊號上傳輸導體組11及高頻訊號下傳輸導體組21的一側,藉此增加高頻端子的接觸點,同時利用間隔部5111將各該高頻端子予以隔離,降低彼此的干擾,並配合上下傳輸導體組1、2外擴形的分佈態樣以隔離部34隔離高低頻訊號來降低串音干擾。另外,外屏蔽殼體52除了利用容置部521、披覆部522、蓋體部523及斜後蓋524完整包覆內屏蔽殼體51及上、下傳輸導體組1、2外,內屏蔽殼體51亦提供外屏蔽殼體52之焊接腳525定位之功效,而外屏蔽殼體52則封閉內屏蔽殼體51之破孔,藉此大幅提升殼體內外的隔離效果,而達到絕佳的EMI及RFI抑制功效。(3) The shield case 5 includes an inner shield case 51, an outer shield case 52, and a The insulating pad body 53 on the side of the inner shield case 51, wherein the grounded magnetic conductive plate body 511 on the side of the inner shield case 51 is located on the high frequency signal transmission conductor group 11 and the high frequency signal transmission conductor group 21 One side, thereby increasing the contact point of the high-frequency terminal, and simultaneously separating each of the high-frequency terminals by the spacer portion 5111 to reduce mutual interference, and matching the distribution pattern of the upper and lower transmission conductor groups 1, 2 The isolation unit 34 isolates the high and low frequency signals to reduce crosstalk interference. In addition, the outer shield housing 52 is completely shielded by the inner shielding shell 51 and the upper and lower transmission conductor groups 1 and 2 by the receiving portion 521, the covering portion 522, the cover portion 523 and the oblique rear cover 524. The housing 51 also provides the function of positioning the welding legs 525 of the outer shielding shell 52, and the outer shielding shell 52 closes the broken holes of the inner shielding shell 51, thereby greatly improving the isolation effect inside and outside the casing, thereby achieving excellent EMI and RFI suppression.
另請同時配合參閱第十圖所示,係為本新型另一實施例之立體圖,由圖中可清楚看出,本實施例與上述實施例為大同小異,僅於該外屏蔽殼體52a至少一側處具有複數供固定於一電路基板6a上之焊接腳525a,且該焊接腳525a上具有至少一供加強固持力之鏤空部5251a。將本新型焊接於電路基板6a時,更藉由鏤空部5251a增加爬錫、滲錫時,電路基板6a與焊接腳525a的接觸面積,而提升本新型之固定強度。Please also refer to the tenth figure, which is a perspective view of another embodiment of the present invention. It can be clearly seen from the figure that the embodiment is similar to the above embodiment, and only the outer shield case 52a is at least one. The side has a plurality of soldering legs 525a for fixing on a circuit substrate 6a, and the soldering leg 525a has at least one hollow portion 5251a for enhancing the holding force. When the present invention is soldered to the circuit board 6a, the contact area between the circuit board 6a and the soldering leg 525a is increased by the hollow portion 5251a, and the fixing strength of the present invention is improved.
惟,以上所述僅為本新型之較佳實施例而已,非因此即侷限本新型之專利範圍,故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本新型之專利範圍內,合予陳明。However, the above description is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the drawings are the same. It is included in the scope of this new patent and is given to Chen Ming.
綜上所述,本新型之USB Type-C母座連接器之結構於使用時,為確實能達到其功效及目的,故本新型誠為一實用性優異之新型,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本新型,以保障申請人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。In summary, the structure of the USB Type-C female connector of the present invention can achieve its efficacy and purpose when used, so the novel is a new type of practicality, and is suitable for the application of the new patent.爰Proposing an application in accordance with the law, I hope that the trial committee will grant this new type as soon as possible to protect the applicant's hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creator will try his best to cooperate and feel good.
1‧‧‧上傳輸導體組1‧‧‧Upper transmission conductor set
1121‧‧‧上傾斜部1121‧‧‧Upper slope
2‧‧‧下傳輸導體組2‧‧‧lower transmission conductor set
2121‧‧‧下傾斜部2121‧‧‧ Lower slope
3‧‧‧隔板部3‧‧‧Parts
32‧‧‧斜板部32‧‧‧ sloping plate
Claims (10)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI612731B (en) * | 2015-03-18 | 2018-01-21 | 日本航空電子工業股份有限公司 | Connector |
TWI648924B (en) * | 2018-04-13 | 2019-01-21 | 岱煒科技股份有限公司 | USB C female connector |
-
2015
- 2015-05-22 TW TW104207954U patent/TWM510000U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI612731B (en) * | 2015-03-18 | 2018-01-21 | 日本航空電子工業股份有限公司 | Connector |
TWI648924B (en) * | 2018-04-13 | 2019-01-21 | 岱煒科技股份有限公司 | USB C female connector |
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