TW201941971A - Manufacturing method for glass substrate - Google Patents
Manufacturing method for glass substrate Download PDFInfo
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- TW201941971A TW201941971A TW108111751A TW108111751A TW201941971A TW 201941971 A TW201941971 A TW 201941971A TW 108111751 A TW108111751 A TW 108111751A TW 108111751 A TW108111751 A TW 108111751A TW 201941971 A TW201941971 A TW 201941971A
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- Prior art keywords
- glass plate
- cutting
- mother glass
- strip
- glass substrate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
本發明是有關於一種製造例如用於觸控面板的玻璃基板的方法。The present invention relates to a method for manufacturing a glass substrate for a touch panel, for example.
眾所周知,於銀行的自動櫃員機(Automatic Teller Machine,ATM)、遊戲中心的遊戲機、鐵路或公共汽車等的售票機等顯示裝置中,使用有觸控面板。藉由將觸控面板搭載於顯示裝置,可根據顯示裝置所顯示的資訊通過視覺而直觀地進行機器的操作,故具有搭載有觸控面板的裝置的操作變得容易的優點。As is well known, touch panels are used in display devices such as automatic teller machines (ATMs) in banks, game machines in game centers, and ticket vending machines such as railways and buses. By mounting the touch panel on the display device, the operation of the machine can be performed visually and intuitively based on the information displayed by the display device, and therefore there is an advantage that the operation of the device equipped with the touch panel becomes easy.
另外,觸控面板可在顯示裝置內搭載輸入裝置,故無需另外設置輸入裝置,從而可使裝置整體小型化。因此,要求小型化的行動電話、智慧型手機、便攜式遊戲機、平板型個人電腦(personal computer,PC)或筆記型PC亦適合使用觸控面板。In addition, the touch panel can be equipped with an input device in a display device, so there is no need to provide an additional input device, thereby miniaturizing the entire device. Therefore, a miniaturized mobile phone, a smart phone, a portable game console, a tablet personal computer (PC) or a notebook PC is also suitable for using a touch panel.
作為觸控面板,使用於玻璃基板的表面形成有導電電路或電極等配線圖案的觸控面板。對於配線圖案的形成,根據圖案的線寬、厚度等條件而使用各種印刷法。例如凹版平版印刷(Gravure offset printing)是於形成數十um程度的微細配線圖案時有效的印刷法。As the touch panel, a touch panel in which a wiring pattern such as a conductive circuit or an electrode is formed on a surface of a glass substrate is used. For the formation of the wiring pattern, various printing methods are used in accordance with conditions such as the line width and thickness of the pattern. For example, gravure offset printing is a printing method that is effective when forming a fine wiring pattern of about several tens um.
於一般的凹版平版印刷中,使用形成有與規定的印刷圖案(配線圖案)對應的凹部的凹版、及表面由矽酮橡膠構成的橡皮布(blanket)。凹版平版印刷的步驟包括:刮除(doctoring)步驟,將油墨填充至凹版的凹部;分離(off)步驟,使填充至凹部的油墨轉移至橡皮布的表面;以及固著(set)步驟,將轉移至橡皮布的油墨轉印至玻璃板等。In general gravure lithography, a gravure in which a recessed portion corresponding to a predetermined printing pattern (wiring pattern) is formed, and a blanket having a surface made of silicone rubber are used. The steps of gravure lithography include a doctoring step to fill ink into the concave portion of the gravure; an off step to transfer the ink filled into the concave portion to the surface of the blanket; and a set step to set The ink transferred to the blanket is transferred to a glass plate or the like.
於凹版平版印刷的刮除步驟中,對凹版的整個表面塗佈油墨後,藉由刮刀刮除凹版的表面的多餘的油墨,藉此對凹部填充油墨。但是,於藉由刮刀掃描凹版時,刮刀的前端彈性變形而落入凹部內,而有可能刮除凹部內的一部分油墨。當產生此種油墨的過度刮除時,於隨後的分離步驟中,油墨自凹部朝向橡皮布的轉移會出現問題,這成為產生印刷不良的主要原因。In the scraping step of gravure lithography, after the entire surface of the gravure is coated with ink, the excess ink on the surface of the gravure is scraped off by a doctor blade, thereby filling the recessed portion with ink. However, when scanning a gravure with a doctor blade, the distal end of the doctor blade is elastically deformed and falls into the recessed portion, and some ink in the recessed portion may be scraped off. When excessive scratching of such an ink occurs, in the subsequent separation step, a problem arises in the transfer of the ink from the recessed portion to the blanket, which becomes a major cause of poor printing.
作為防止此種印刷不良的技術,於專利文獻1中揭示有如下凹版平版印刷方法:配置包含第一細線部與第二細線部的凹版上的凹部,所述第一細線部沿著印刷方向延伸,所述第二細線部沿著與印刷方向正交的方向延伸,當利用刮刀對凹部填充油墨(印刷糊劑)時,以刮刀相對於第二細線部而以規定角度傾斜的方式,使所述刮刀對凹版進行掃描。As a technique for preventing such poor printing, Patent Document 1 discloses a gravure lithographic printing method in which a recessed portion on a gravure including a first thin line portion and a second thin line portion is arranged, and the first thin line portion extends along a printing direction. The second thin line portion extends in a direction orthogonal to the printing direction. When the concave portion is filled with ink (printing paste) by a doctor blade, the blade is inclined at a predetermined angle with respect to the second thin line portion, so that The scraper scans the gravure.
於所述印刷方法中,於由長方形形狀的平板構成的凹版,以呈規定的傾斜的方式形成凹部的第二細線部,並沿著長邊方向(搬送方向)搬送所述凹版。進而,沿著與搬送方向正交的方向配置刮刀。藉由使刮刀沿著搬送方向掃描,並通過傾斜狀的第二細線部,可防止刮刀的前端部落入第二細線部。
[現有技術文獻]
[專利文獻]In the printing method, a second thin line portion of a recessed portion is formed on a gravure formed of a rectangular flat plate at a predetermined inclination, and the gravure is transported along a long side direction (conveyance direction). Furthermore, a scraper is arrange | positioned along the direction orthogonal to a conveyance direction. By scanning the scraper in the conveying direction and passing the inclined second thin line portion, the tip of the scraper can be prevented from entering the second thin line portion.
[Prior Art Literature]
[Patent Literature]
[專利文獻1]日本專利特開2014-128924號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-128924
[發明所欲解決之課題]
於所述方法中當執行分離步驟時,於橡皮布形成與第二細線部的傾斜相應的傾斜狀的油墨圖案。進而當執行固著步驟時,於玻璃板上形成相對於該玻璃板的長邊方向(搬送方向)而呈傾斜狀轉印第二細線部而得的印刷圖案。[Problems to be Solved by the Invention]
In the method, when the separation step is performed, an inclined ink pattern corresponding to the inclination of the second thin line portion is formed on the blanket. Furthermore, when the fixing step is performed, a printed pattern obtained by transferring the second thin line portion in an inclined manner with respect to the long side direction (conveying direction) of the glass plate is formed on the glass plate.
期望於使用所述的凹版平版印刷方法來對觸控面板進行量產時,例如於長條狀的帶狀母玻璃板形成多個印刷圖案,並按照印刷圖案從所述帶狀母玻璃板切出玻璃基板。When mass production of a touch panel is performed by using the gravure lithography method, for example, a plurality of printed patterns are formed on a long strip-shaped mother glass plate, and cut from the strip-shaped mother glass plate according to the printed pattern. Out the glass substrate.
但是,藉由所述的凹版平版印刷而形成的印刷圖案相對於帶狀母玻璃板的長邊方向而形成為傾斜狀,故需要根據該印刷圖案的傾斜形態來切出玻璃基板的步驟。However, the printing pattern formed by the gravure lithography described above is inclined with respect to the longitudinal direction of the strip-shaped mother glass plate, so a step of cutting the glass substrate according to the inclined form of the printing pattern is required.
本發明是鑒於所述情況而成者,其技術課題在於根據呈傾斜狀形成於帶狀母玻璃板的印刷圖案,而適宜切出玻璃基板。
[解決課題之手段]This invention is made | formed in view of the said situation, and its technical subject is to cut out a glass substrate suitably based on the printing pattern formed on the strip | belt-shaped mother glass plate in an inclined shape.
[Means for solving problems]
本發明為用以解決所述課題者,是包括切斷步驟的玻璃基板的製造方法,所述切斷步驟將隔開間隔而形成有多個印刷圖案的帶狀母玻璃板切斷,其中所述印刷圖案相對於所述帶狀母玻璃板的長邊方向而形成為傾斜狀,所述切斷步驟包括:準備步驟,準備所述帶狀母玻璃板;第一切斷步驟,沿著寬度方向將所述帶狀母玻璃板切斷,藉此形成包含一個或多個所述印刷圖案的單片狀母玻璃板;以及第二切斷步驟,沿著所述印刷圖案的傾斜方向將所述單片狀母玻璃板切斷,藉此形成所述玻璃基板。This invention is to solve the said subject, It is a manufacturing method of the glass substrate which includes the cutting | disconnection step which cut | disconnects the strip | belt-shaped mother-glass board which formed the multiple printed pattern at intervals, The printing pattern is inclined with respect to the longitudinal direction of the strip-shaped mother glass plate, and the cutting step includes a preparation step of preparing the strip-shaped mother glass plate, and a first cutting step along the width Cutting the strip-shaped mother glass plate in a direction, thereby forming a single-piece mother glass plate including one or more of the printed patterns; and a second cutting step of cutting all the substrates along the oblique direction of the printed patterns. The single-piece mother glass plate is cut to form the glass substrate.
根據所述構成,藉由第一切斷步驟將帶狀母玻璃板沿寬度方向切斷,而形成單片狀母玻璃板,藉此於其後的第二切斷步驟中,可容易地進行該單片狀母玻璃板的移動及定位。於第二切斷步驟中,沿著印刷圖案的傾斜方向將單片狀母玻璃板切斷,藉此可自單片狀母玻璃板效率良好地切出包含印刷圖案的玻璃基板。According to the configuration, the strip-shaped mother glass plate is cut in the width direction by the first cutting step to form a single-piece mother glass plate, thereby making it easy to perform the second cutting step thereafter. Movement and positioning of the single sheet mother glass plate. In the second cutting step, the single-piece mother glass plate is cut along the oblique direction of the printed pattern, whereby the glass substrate containing the printed pattern can be efficiently cut from the single-piece mother glass plate.
於所述第一切斷步驟中,理想的是藉由於對所述帶狀母玻璃板賦予彎曲應力的狀態下,於所述帶狀母玻璃板的一部分形成初始裂紋,使所述初始裂紋沿著所述寬度方向發展,由此切斷所述帶狀母玻璃板。如此,藉由應力割斷而切斷帶狀母玻璃板,可高速地切斷該帶狀母玻璃板。In the first cutting step, an initial crack is preferably formed in a part of the strip-shaped mother glass plate in a state where bending stress is applied to the strip-shaped mother glass plate, so that the initial cracks are The strip-shaped mother glass plate is cut in the width direction. As described above, by cutting the band-shaped mother glass plate by stress cutting, the band-shaped mother glass plate can be cut at a high speed.
理想的是所述第一切斷步驟包括部分切斷步驟,所述部分切斷步驟於將所述帶狀母玻璃板切斷而形成所述單片狀母玻璃板後,沿著所述印刷圖案的傾斜方向將所述單片狀母玻璃板的一部分切斷。Preferably, the first cutting step includes a partial cutting step, which is performed after cutting the strip-shaped mother glass plate to form the single-piece mother glass plate, followed by the printing. The oblique direction of the pattern cuts a part of the monolithic mother glass plate.
藉由所述部分切斷步驟,將單片狀母玻璃板的一部分沿著印刷圖案的傾斜方向切斷,藉此於其後的單片狀母玻璃板形成與印刷圖案同樣地傾斜的邊部分。將所述部分用作之後的第二切斷步驟中的切斷始端部,藉此可容易且效率良好地進行該第二切斷步驟。According to the partial cutting step, a part of the single-piece mother glass plate is cut along the oblique direction of the printed pattern, so that the subsequent single-piece mother glass plate forms a side portion inclined like the printed pattern. . The second cutting step can be easily and efficiently performed by using the portion as a cutting start end portion in the subsequent second cutting step.
於所述部分切斷步驟中,理想的是藉由於對所述單片狀母玻璃板賦予彎曲應力的狀態下,於所述單片狀母玻璃板的一部分形成初始裂紋,使所述初始裂紋沿著所述印刷圖案的傾斜方向發展,由此切斷所述單片狀母玻璃板的一部分。如此,藉由利用與帶狀母玻璃板的寬度方向的切斷同樣的應力割斷來進行部分割斷步驟,可效率良好地執行第一切斷步驟。In the partial cutting step, it is desirable that the initial crack is formed by forming an initial crack in a part of the single-piece mother glass plate in a state where bending stress is applied to the single-piece mother glass plate. Along the oblique direction of the printed pattern, a part of the monolithic mother glass plate is cut. As described above, the first cutting step can be performed efficiently by performing the partial cutting step using the same stress cutting as in the widthwise cutting of the strip-shaped mother glass plate.
於所述第二切斷步驟中,理想的是對所述單片狀母玻璃板照射雷射光,將所述單片狀母玻璃板割斷,藉此形成所述玻璃基板。由此,可高精度地切斷單片狀母玻璃板,從而可形成高品質的玻璃基板的端面。In the second cutting step, it is desirable to irradiate the single-piece mother glass plate with laser light and cut the single-piece mother glass plate to form the glass substrate. Thereby, the single-piece mother glass plate can be cut with high accuracy, and the end face of a high-quality glass substrate can be formed.
所述切斷步驟理想的是包括搬送步驟,所述搬送步驟使藉由所述第一切斷步驟而形成的所述單片狀母玻璃板移動至所述第二切斷步驟。藉此,可效率良好地進行第一切斷步驟及第二切斷步驟的一系列的步驟。
[發明的效果]The cutting step preferably includes a conveying step that moves the single-piece mother glass plate formed by the first cutting step to the second cutting step. Thereby, a series of steps of the first cutting step and the second cutting step can be performed efficiently.
[Effect of the invention]
根據本發明,可根據呈傾斜狀形成於帶狀母玻璃板的印刷圖案,而適宜切出玻璃基板。According to the present invention, a glass substrate can be suitably cut out based on a printing pattern formed on a strip-shaped mother glass plate in an inclined shape.
以下,參照圖式對用以實施本發明的方式進行說明。圖1至圖10表示本發明的玻璃基板的製造方法的第一實施方式。Hereinafter, the mode for implementing this invention is demonstrated with reference to drawings. 1 to 10 show a first embodiment of a method for manufacturing a glass substrate of the present invention.
圖1表示本實施方式的玻璃基板的製造裝置。製造裝置1包括印刷部2、切斷部3。FIG. 1 shows a manufacturing apparatus for a glass substrate according to this embodiment. The manufacturing apparatus 1 includes a printing section 2 and a cutting section 3.
印刷部2包括搬送裝置4及印刷裝置5。搬送裝置4由帶式輸送機構成,但不限於該構成,可由輥式輸送機及其他各種搬送裝置構成。搬送裝置4藉由卷對卷(roll-to-roll)方式來搬送帶狀母玻璃板MGS1。即,搬送裝置4自第一玻璃卷GR1引出帶狀母玻璃板MGS1,並朝下游側搬送。帶狀母玻璃板MGS1通過印刷裝置5後,被捲繞成第二玻璃卷GR2。The printing unit 2 includes a conveying device 4 and a printing device 5. The conveyance device 4 is constituted by a belt conveyor, but is not limited to this structure, and may be constituted by a roller conveyor and various other conveyance devices. The transfer device 4 transfers the strip-shaped mother glass sheet MGS1 by a roll-to-roll method. That is, the conveying device 4 takes out the strip-shaped mother glass sheet MGS1 from the first glass roll GR1 and conveys it to the downstream side. The strip-shaped mother glass plate MGS1 passes through the printing device 5 and is wound into a second glass roll GR2.
印刷裝置5配置於第一玻璃卷GR1與第二玻璃卷GR2之間。印刷裝置5例如包含凹版平版印刷方式的裝置,但並不限定於所述構成。The printing device 5 is arranged between the first glass roll GR1 and the second glass roll GR2. The printing apparatus 5 includes, for example, a gravure lithographic printing apparatus, but is not limited to the above-mentioned configuration.
印刷裝置5主要包括:凹版6、刮刀7、及橡皮布8。The printing device 5 mainly includes a gravure 6, a doctor blade 7, and a blanket 8.
凹版6例如構成為圓柱狀,且以可繞其軸心旋轉的方式構成。凹版6具有填充油墨9的凹部10。凹部10相對於凹版6的軸向而形成為傾斜狀。凹版6與橡皮布8接觸,使填充於凹部10的油墨9轉移至該橡皮布8。The intaglio plate 6 is formed in a cylindrical shape, for example, and is configured to be rotatable about its axis. The intaglio plate 6 has a concave portion 10 filled with an ink 9. The recessed portion 10 is formed obliquely with respect to the axial direction of the intaglio plate 6. The intaglio plate 6 is in contact with the blanket 8, and the ink 9 filled in the concave portion 10 is transferred to the blanket 8.
刮刀7以其前端部與凹版6的表面接觸的方式構成。刮刀7的前端部構成為可彈性變形。刮刀7將塗佈於凹版6的油墨9填充至凹部10,並且刮除多餘的油墨9。The doctor blade 7 is comprised so that the front-end part may contact the surface of the intaglio plate 6. The front end portion of the scraper blade 7 is configured to be elastically deformable. The doctor blade 7 fills the recessed portion 10 with the ink 9 applied to the gravure plate 6 and scrapes off the excess ink 9.
橡皮布8例如藉由於圓筒狀的本體部的表面纏繞矽酮橡膠等來構成。橡皮布8構成為可繞其軸心旋轉,且構成為可沿與軸心方向正交的水平方向及上下方向移動。橡皮布8將自凹版6轉移的油墨9轉印至帶狀母玻璃板MGS1,藉此於該帶狀母玻璃板MGS1的表面形成規定的印刷圖案11。The blanket 8 is configured by, for example, winding a surface of a cylindrical body portion with silicone rubber or the like. The blanket 8 is configured to be rotatable about its axis, and is configured to be movable in a horizontal direction and a vertical direction orthogonal to the axis direction. The blanket 8 transfers the ink 9 transferred from the intaglio plate 6 to the band-shaped mother glass plate MGS1, thereby forming a predetermined print pattern 11 on the surface of the band-shaped mother glass plate MGS1.
用於印刷圖案11的油墨9例如藉由將導電性粉末、樹脂、溶劑等混合而構成。作為導電性粉末例如較佳為使用Ag、Au、Pt、Cu、Al等金屬粉末。The ink 9 for printing the pattern 11 is configured by, for example, mixing a conductive powder, a resin, a solvent, and the like. As the conductive powder, for example, metal powders such as Ag, Au, Pt, Cu, and Al are preferably used.
切斷部3包括:第一切斷部12,將帶狀母玻璃板MGS1切斷而形成單片狀母玻璃板MGS2;第二切斷部13,將單片狀母玻璃板MGS2切斷而形成玻璃基板GS;以及搬送部14,設置於第一切斷部12與第二切斷部13之間。The cutting portion 3 includes a first cutting portion 12 that cuts the strip-shaped mother glass plate MGS1 to form a single-piece mother glass plate MGS2, and a second cutting portion 13 that cuts the single-piece mother glass plate MGS2 and A glass substrate GS is formed; and a conveying section 14 is provided between the first cutting section 12 and the second cutting section 13.
第一切斷部12將帶狀母玻璃板MGS1沿寬度方向WD(與長邊方向LD正交的方向)切斷,藉此形成單片狀母玻璃板MGS2。The first cutting section 12 cuts the strip-shaped mother glass plate MGS1 in the width direction WD (a direction orthogonal to the longitudinal direction LD), thereby forming a single-piece mother glass plate MGS2.
第一切斷部12包括搬送裝置15及彎曲應力割斷裝置16。搬送裝置15將自第二玻璃卷GR2取出的帶狀母玻璃板MGS1搬送至下游側的彎曲應力割斷裝置16。搬送裝置15由帶式輸送機構成,但不限於該構成,可由輥式輸送機及其他各種搬送裝置構成。The first cutting section 12 includes a conveying device 15 and a bending stress cutting device 16. The transfer device 15 transfers the strip-shaped mother glass sheet MGS1 taken out from the second glass roll GR2 to the downstream bending stress cutting device 16. The conveyance device 15 is constituted by a belt conveyor, but is not limited to this structure, and may be constituted by a roller conveyor and various other conveyance devices.
彎曲應力割斷裝置16包括:支撐構件17、一對按壓構件18、及裂紋形成構件19。The bending stress cutting device 16 includes a support member 17, a pair of pressing members 18, and a crack formation member 19.
支撐構件17可為具有圓筒面的棒狀構件,亦可為多棱柱狀構件。支撐構件17構成為可沿上下方向移動。支撐構件17以與帶狀母玻璃板MGS1的寬度方向WD平行的方式配置於該帶狀母玻璃板MGS1的下側。The support member 17 may be a rod-shaped member having a cylindrical surface, or may be a polygonal columnar member. The support member 17 is configured to be movable in the vertical direction. The support member 17 is arranged on the lower side of the strip-shaped mother glass plate MGS1 so as to be parallel to the width direction WD of the strip-shaped mother glass plate MGS1.
按壓構件18由金屬或樹脂等構成為圓柱狀。按壓構件18構成為可沿上下方向及水平方向移動。按壓構件18以與帶狀母玻璃板MGS1的寬度方向WD平行的方式配置於該帶狀母玻璃板MGS1的上方。按壓構件18配置於支撐構件17的上游側與下游側的兩個部位。The pressing member 18 is formed in a cylindrical shape from metal, resin, or the like. The pressing member 18 is configured to be movable in the vertical direction and the horizontal direction. The pressing member 18 is arranged above the band-shaped mother glass plate MGS1 so as to be parallel to the width direction WD of the band-shaped mother glass plate MGS1. The pressing member 18 is disposed at two locations on the upstream side and the downstream side of the support member 17.
裂紋形成構件19構成為可沿上下方向移動,且配置於支撐構件17的上方。裂紋形成構件19於其下端部具有金剛石割刀。The crack formation member 19 is configured to be movable in the vertical direction and is arranged above the support member 17. The crack formation member 19 has a diamond cutter at its lower end.
第二切斷部13藉由雷射熱割斷將由第一切斷部12所形成的單片狀母玻璃板MGS2切斷。第二切斷部13包括:壓盤20,支撐單片狀母玻璃板MGS2;緩衝材21,載置於所述壓盤20;裂紋形成構件22,於單片狀母玻璃板MGS2形成初始裂紋;雷射照射裝置23,用以切斷單片狀母玻璃板MGS2;以及冷卻裝置24。The second cutting section 13 cuts the single-piece mother glass plate MGS2 formed by the first cutting section 12 by laser thermal cutting. The second cutting section 13 includes a platen 20 that supports a single-piece mother glass plate MGS2, a buffer material 21 placed on the platen 20, and a crack-forming member 22 that forms an initial crack in the single-piece mother glass plate MGS2. A laser irradiation device 23 for cutting a single-piece mother glass plate MGS2; and a cooling device 24.
壓盤20為金屬製,且具有較單片狀母玻璃板MGS2的表面積更大的支撐面。緩衝材21為包含發泡樹脂的片材。緩衝材21具有小於壓盤20的支撐面且大於單片狀母玻璃板MGS2的面積。The platen 20 is made of metal and has a supporting surface having a larger surface area than that of the single-piece mother glass plate MGS2. The buffer material 21 is a sheet containing a foamed resin. The buffer material 21 has an area smaller than the support surface of the platen 20 and larger than the area of the single-piece mother glass plate MGS2.
裂紋形成構件22配置於壓盤20的上方,且構成為可沿水平方向及上下方向移動。裂紋形成構件22於其下端部具有金剛石割刀。The crack formation member 22 is arranged above the platen 20 and is configured to be movable in the horizontal direction and the vertical direction. The crack formation member 22 has a diamond cutter at the lower end portion.
雷射照射裝置23構成為可沿上下方向及水平方向移動。雷射照射裝置23例如構成為照射CO2 雷射等雷射光L,但不限於所述構成。冷卻裝置24構成為將混合水與空氣而成的冷媒(霧氣)R朝下方噴射。另外,冷卻裝置24構成為可沿上下方向及水平方向移動,且追隨雷射照射裝置23來移動。The laser irradiation device 23 is configured to be movable in the vertical direction and the horizontal direction. The laser irradiation device 23 is configured to irradiate laser light L such as a CO 2 laser, but is not limited to the above-mentioned configuration. The cooling device 24 is configured to inject a refrigerant (mist) R formed by mixing water and air downward. The cooling device 24 is configured to be movable in the vertical and horizontal directions, and is configured to follow the laser irradiation device 23 and move.
搬送部14將於第一切斷部12所形成的單片狀母玻璃板MGS2搬送至下游側的第二切斷部13。搬送部14由帶式輸送機構成,但不限於該構成,可由輥式輸送機及其他各種搬送裝置構成。The transfer unit 14 transfers the single-piece mother glass sheet MGS2 formed by the first cutting unit 12 to the downstream second cutting unit 13. The conveyance unit 14 is constituted by a belt conveyor, but is not limited to this structure, and may be constituted by a roller conveyor and various other conveyance devices.
作為藉由所述的製造裝置1製造的玻璃基板GS的材料,可使用矽酸鹽玻璃、二氧化矽玻璃,較佳為使用硼矽酸玻璃、鈉鈣玻璃、鋁矽酸鹽玻璃、化學強化玻璃,最佳為使用無鹼玻璃。此處,無鹼玻璃是指實質不含鹼成分(鹼金屬氧化物)的玻璃,具體而言,是指鹼成分的重量比為3000 ppm以下的玻璃。本發明中的鹼成分的重量比較佳為1000 ppm以下,更佳為500 ppm以下,最佳為300 ppm以下。As the material of the glass substrate GS manufactured by the manufacturing apparatus 1, silicate glass and silica glass can be used, and borosilicate glass, soda lime glass, aluminosilicate glass, and chemical strengthening are preferably used. Glass, preferably alkali-free glass. Here, the alkali-free glass refers to a glass that does not substantially contain an alkali component (alkali metal oxide), and specifically refers to a glass in which the weight ratio of the alkali component is 3000 ppm or less. The weight of the alkali component in the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, and most preferably 300 ppm or less.
以下,對使用所述構成的製造裝置1來製造玻璃基板GS的方法進行說明。玻璃基板GS的製造方法主要包括準備步驟、切斷步驟。Hereinafter, a method for manufacturing the glass substrate GS using the manufacturing apparatus 1 having the above-described configuration will be described. The manufacturing method of the glass substrate GS mainly includes a preparation step and a cutting step.
準備步驟包括:印刷步驟,於帶狀母玻璃板MGS1形成印刷圖案11;以及捲繞步驟,於印刷步驟後將帶狀母玻璃板MGS1捲繞成卷狀。The preparation step includes a printing step of forming a printing pattern 11 on the strip-shaped mother glass plate MGS1, and a winding step of winding the strip-shaped mother glass plate MGS1 into a roll shape after the printing step.
印刷步驟主要包括刮除步驟、分離步驟、及固著步驟。The printing step mainly includes a scraping step, a separating step, and a fixing step.
於刮除步驟中,印刷裝置5於使刮刀7接觸凹版6的狀態下,使所述凹版6旋轉,從而對凹部10填充油墨9。In the scraping step, the printing device 5 rotates the intaglio plate 6 while the blade 7 is in contact with the intaglio plate 6 to fill the concave portion 10 with the ink 9.
於分離步驟中,使凹版6與橡皮布8接觸,使填充於凹部10的油墨9轉移至該橡皮布8的外周面。藉此,於橡皮布8的外周面形成由油墨9構成的圖案。由所述油墨9構成的圖案構成為相對於橡皮布8的軸向而呈傾斜狀。In the separating step, the intaglio plate 6 is brought into contact with the blanket 8, and the ink 9 filled in the concave portion 10 is transferred to the outer peripheral surface of the blanket 8. Thereby, a pattern made of the ink 9 is formed on the outer peripheral surface of the blanket 8. The pattern composed of the ink 9 is configured to be inclined with respect to the axial direction of the blanket 8.
於固著步驟中,藉由搬送裝置4搬送自第一玻璃卷GR1引出的帶狀母玻璃板MGS1,並且使該帶狀母玻璃板MGS1的表面與橡皮布8接觸,從而將由油墨9構成的圖案轉印至帶狀母玻璃板MGS1的表面。藉此,於帶狀母玻璃板MGS1形成相對於其長邊方向LD而具有傾斜角度的多個印刷圖案11。In the fixing step, the belt-shaped mother glass plate MGS1 drawn from the first glass roll GR1 is conveyed by the conveying device 4, and the surface of the belt-shaped mother glass plate MGS1 is brought into contact with the blanket 8, so that the ink glass The pattern was transferred to the surface of the band-shaped mother glass plate MGS1. Thereby, a plurality of printed patterns 11 having an inclined angle with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1 are formed.
固著步驟中,可一邊搬送帶狀母玻璃板MGS1,一邊連續地將由油墨9構成的圖案轉印至該帶狀母玻璃板MGS1的表面,亦可停止一次帶狀母玻璃板MGS1的搬送,而間歇地將由油墨9構成的圖案轉印至該帶狀母玻璃板MGS1的表面。另外,於間歇地進行轉印的情況下,可使用用以吸附所述帶狀母玻璃基板的吸附壓盤。In the fixing step, the pattern of the ink 9 can be continuously transferred to the surface of the band-shaped mother glass plate MGS1 while the band-shaped mother glass plate MGS1 is being transported, or the band-shaped mother glass plate MGS1 can be stopped once. The pattern composed of the ink 9 is intermittently transferred to the surface of the band-shaped mother glass plate MGS1. In the case where the transfer is performed intermittently, an adsorption platen for adsorbing the belt-shaped mother glass substrate may be used.
於圖2中,以矩形形狀表示與印刷圖案11對應的區域。印刷圖案11具有第一邊11a、第二邊11b、第三邊11c、及第四邊11d。第一邊11a與第二邊11b構成的角度及第一邊11a與第四邊11d構成的角度均為90°,但並不限定於所述角度。第一邊11a與第三邊11c設為平行,第二邊11b與第四邊11d同樣構成為平行。第二邊11b與第三邊11c構成的角度及第三邊11c與第四邊11d構成的角度均為90°,但並不限定於所述角度。In FIG. 2, a region corresponding to the print pattern 11 is shown in a rectangular shape. The print pattern 11 includes a first side 11a, a second side 11b, a third side 11c, and a fourth side 11d. The angle formed by the first side 11a and the second side 11b and the angle formed by the first side 11a and the fourth side 11d are both 90 °, but it is not limited to the angle. The first side 11a is parallel to the third side 11c, and the second side 11b is configured to be parallel to the fourth side 11d. The angle formed by the second side 11b and the third side 11c and the angle formed by the third side 11c and the fourth side 11d are both 90 °, but it is not limited to the angle.
印刷圖案11的各邊11a~邊11d相對於帶狀母玻璃板MGS1的長邊方向LD而傾斜。例如,第一邊11a相對於帶狀母玻璃板MGS1的長邊方向LD而具有傾斜角度θ1。另外,印刷圖案11的第二邊11b相對於帶狀母玻璃板MGS1的長邊方向LD而具有傾斜角度θ2。Each side 11a to side 11d of the print pattern 11 is inclined with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1. For example, the first side 11a has an inclination angle θ1 with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1. The second side 11b of the print pattern 11 has an inclined angle θ2 with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1.
圖2所示的印刷圖案11為虛擬地例示者,並不限定於具有第一邊11a~第四邊11d所有的邊的印刷圖案。印刷圖案11只要為具有與第一邊11a至第四邊11d的至少一邊一致或平行地形成的線狀圖案者即可。印刷圖案11可於由第一邊11a至第四邊11d包圍的區域內具有多個線狀圖案。構成印刷圖案11的線狀部分不限於直線狀,可構成為曲線狀。印刷圖案11可於其一部分具有與帶狀母玻璃板MGS1的長邊方向LD平行的線狀部分。例如,於觸控面板用的玻璃基板GS,形成格子狀的細線圖案或矩形形狀的電極圖案作為印刷圖案11。The print pattern 11 shown in FIG. 2 is a virtual example, and is not limited to a print pattern having all sides of the first side 11a to the fourth side 11d. The print pattern 11 is only required to have a linear pattern formed in parallel with or parallel to at least one of the first to fourth sides 11a to 11d. The printed pattern 11 may have a plurality of linear patterns in an area surrounded by the first side 11a to the fourth side 11d. The linear portion constituting the print pattern 11 is not limited to a linear shape, and may be configured in a curved shape. The printed pattern 11 may have a linear portion parallel to the longitudinal direction LD of the strip-shaped mother glass plate MGS1 in a part of the printed pattern 11. For example, on the glass substrate GS for a touch panel, a grid-like thin line pattern or a rectangular electrode pattern is formed as the print pattern 11.
圖2中,用兩點鏈線表示自帶狀母玻璃板MGS1切出的玻璃基板GS。玻璃基板GS構成為長方形形狀。玻璃基板GS的面積設定地較印刷圖案11的面積大。玻璃基板GS具有與印刷圖案11的第一邊11a至第四邊11d對應的第一邊GSa、第二邊GSb、第三邊GSc、及第四邊GSd。虛擬地設定的玻璃基板GS的各邊GSa~邊GSd相對於帶狀母玻璃板MGS1的長邊方向LD而傾斜。例如,玻璃基板GS的第一邊GSa構成為與印刷圖案11的第一邊11a平行。因此,玻璃基板GS的第一邊GSa的傾斜角度與印刷圖案11的第一邊11a的傾斜角度θ1相等。同樣地,玻璃基板GS的第二邊GSb的傾斜角度與印刷圖案11的第二邊11b的傾斜角度θ2相等。In FIG. 2, the glass substrate GS cut out from the band-shaped mother glass plate MGS1 is indicated by a two-dot chain line. The glass substrate GS is configured in a rectangular shape. The area of the glass substrate GS is set larger than the area of the printed pattern 11. The glass substrate GS has a first side GSa, a second side GSb, a third side GSc, and a fourth side GSd corresponding to the first side 11a to the fourth side 11d of the print pattern 11. Each side GSa to side GSd of the glass substrate GS virtually set is inclined with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1. For example, the first side GSa of the glass substrate GS is configured to be parallel to the first side 11a of the printed pattern 11. Therefore, the inclination angle of the first side GSa of the glass substrate GS is equal to the inclination angle θ1 of the first side 11a of the print pattern 11. Similarly, the inclination angle of the second side GSb of the glass substrate GS is equal to the inclination angle θ2 of the second side 11b of the print pattern 11.
於捲繞步驟中,一邊藉由搬送裝置4搬送帶狀母玻璃板MGS1,一邊捲繞已完成印刷步驟的帶狀母玻璃板MGS1而形成第二玻璃卷GR2。In the winding step, while the belt-shaped mother glass plate MGS1 is being conveyed by the conveying device 4, the belt-shaped mother glass plate MGS1 that has completed the printing step is wound to form a second glass roll GR2.
切斷步驟包括:第一切斷步驟,將帶狀母玻璃板MGS1切斷而形成單片狀母玻璃板MGS2;第二切斷步驟,於第一切斷步驟後將單片狀母玻璃板MGS2切斷;以及搬送步驟,將藉由第一切斷步驟形成的單片狀母玻璃板MGS2自第一切斷部12搬送至第二切斷部13。The cutting step includes a first cutting step of cutting the strip-shaped mother glass plate MGS1 to form a single-piece mother glass plate MGS2, and a second cutting step of cutting the single-piece mother glass plate after the first cutting step. MGS2 is cut; and a conveying step, the single-piece mother glass sheet MGS2 formed in the first cutting step is conveyed from the first cutting section 12 to the second cutting section 13.
如圖3所示,於第一切斷步驟中,於帶狀母玻璃板MGS1設定與寬度方向WD平行的第一切斷預定線CL1。第一切斷預定線CL1設定於形成於帶狀母玻璃板MGS1的多個印刷圖案11中於長邊方向LD上相鄰的兩個印刷圖案11之間。第一切斷預定線CL1的一端部設為切斷始端部SP,第一切斷預定線CL1的另一端部設為切斷終端部EP。As shown in FIG. 3, in the first cutting step, a first cut-to-cut line CL1 is set on the strip-shaped mother glass plate MGS1 in parallel with the width direction WD. The first planned cutting line CL1 is set between two printed patterns 11 adjacent to each other in the longitudinal direction LD among the plurality of printed patterns 11 formed on the strip-shaped mother glass plate MGS1. One end portion of the first planned cut line CL1 is set as a cut start end portion SP, and the other end portion of the first cut planned line CL1 is set as a cut end portion EP.
於第一切斷步驟中,藉由第一切斷部12的支撐構件17自下側將帶狀母玻璃板MGS1上推,並藉由按壓構件18自上方按壓帶狀母玻璃板MGS1。藉此,拉伸彎曲應力作用於帶狀母玻璃板MGS1。接著,藉由裂紋形成構件19於帶狀母玻璃板MGS1的一部分,即第一切斷預定線CL1的切斷始端部SP形成初始裂紋。其後,藉由作用於帶狀母玻璃板MGS1的拉伸彎曲應力,使初始裂紋沿著第一切斷預定線CL1而發展至切斷終端部EP。藉此,帶狀母玻璃板MGS1的一部分被切斷,而形成單片狀母玻璃板MGS2。In the first cutting step, the belt-shaped mother glass plate MGS1 is pushed up from the lower side by the support member 17 of the first cutting portion 12, and the belt-shaped mother glass plate MGS1 is pressed from above by the pressing member 18. Thereby, the tensile bending stress acts on the strip-shaped mother glass plate MGS1. Next, an initial crack is formed by the crack formation member 19 in a part of the strip-shaped mother glass plate MGS1, that is, the cutting start end SP of the first planned cutting line CL1. Thereafter, an initial crack progresses along the first planned cutting line CL1 to the cutting end portion EP by a tensile bending stress acting on the strip-shaped mother glass plate MGS1. Thereby, a part of the strip-shaped mother glass plate MGS1 is cut, and a single-piece-shaped mother glass plate MGS2 is formed.
如圖4所示,單片狀母玻璃板MGS2構成為矩形形狀。單片狀母玻璃板MGS2具有第一邊Sa、第二邊Sb、第三邊Sc、及第四邊Sd。自單片狀母玻璃板MGS2切出的玻璃基板GS的各邊GSa~邊GSd相對於單片狀母玻璃板MGS2的各邊Sa~邊Sd以規定的角度傾斜。As shown in FIG. 4, the single-piece mother glass plate MGS2 is configured in a rectangular shape. The single-piece mother glass plate MGS2 has a first side Sa, a second side Sb, a third side Sc, and a fourth side Sd. Each side GSa to side GSd of the glass substrate GS cut out from the single-piece mother glass plate MGS2 is inclined at a predetermined angle with respect to each side Sa to side Sd of the single-piece mother glass plate MGS2.
於第一切斷步驟中,執行部分切斷步驟,即藉由彎曲應力割斷裝置16將單片狀母玻璃板MGS2的一部分切斷。In the first cutting step, a partial cutting step is performed, that is, a part of the single-piece mother glass plate MGS2 is cut by the bending stress cutting device 16.
如圖4所示,於部分切斷步驟中,沿著設定於單片狀母玻璃板MGS2的第二切斷預定線CL2將該單片狀母玻璃板MGS2的一部分切斷。第二切斷預定線CL2跨單片狀母玻璃板MGS2的第一邊Sa至第二邊Sb來設定。所述第二切斷預定線CL2以與第一邊Sa構成規定角度θ3的方式設定成傾斜狀。第二切斷預定線CL2的角度θ3與印刷圖案11的第二邊11b的傾斜角度θ2相等。換言之,第二切斷預定線CL2設定成與所切出的玻璃基板GS的第二邊GSb平行。第二切斷預定線CL2的切斷始端部SP設定於單片狀母玻璃板MGS2的第一邊Sa,第二切斷預定線CL2的切斷終端部EP設定於單片狀母玻璃板MGS2的第二邊Sb。As shown in FIG. 4, in the partial cutting step, a part of the single-piece mother glass plate MGS2 is cut along a second planned cutting line CL2 set to the single-piece mother glass plate MGS2. The second planned cutting line CL2 is set across the first side Sa to the second side Sb of the single-piece mother glass sheet MGS2. The second planned cutting line CL2 is set to be inclined so as to form a predetermined angle θ3 with the first side Sa. The angle θ3 of the second planned cutting line CL2 is equal to the inclination angle θ2 of the second side 11 b of the printed pattern 11. In other words, the second planned cutting line CL2 is set to be parallel to the second side GSb of the cut glass substrate GS. The cut start end SP of the second scheduled cut line CL2 is set to the first side Sa of the single-piece mother glass plate MGS2, and the cut end EP of the second cut scheduled line CL2 is set to the single-piece mother glass plate MGS2. The second side Sb.
於部分切斷步驟中,藉由支撐構件17與按壓構件18沿著第二切斷預定線CL2產生彎曲應力。接著,使裂紋形成構件19接觸第二切斷預定線CL2的切斷始端部SP,形成初始裂紋,藉此使所述初始裂紋發展至第二切斷預定線CL2的切斷終端部EP。藉此,單片狀母玻璃板MGS2的一部分被切斷成傾斜狀。於單片狀母玻璃板MGS2形成將第一邊Sa與第二邊Sb連接的第五邊Se(參照圖5)。In the partial cutting step, a bending stress is generated by the support member 17 and the pressing member 18 along the second planned cutting line CL2. Next, the crack formation member 19 is brought into contact with the cutting start end SP of the second planned cutting line CL2 to form an initial crack, thereby developing the initial crack to the cutting end EP of the second planned cutting line CL2. As a result, a part of the single-piece mother glass plate MGS2 is cut into an inclined shape. A fifth side Se connecting the first side Sa and the second side Sb is formed on the single-piece mother glass plate MGS2 (see FIG. 5).
所述第五邊Se於單片狀母玻璃板MGS2的第一邊Sa與第二邊Sb之間形成為斜邊。第五邊Se構成為與玻璃基板GS的第二邊GSb平行。第五邊Se以保留相對於玻璃基板GS的第二邊GSb的切斷餘量的方式形成於遠離該第二邊GSb的位置。The fifth side Se is formed as a hypotenuse between the first side Sa and the second side Sb of the single-piece mother glass plate MGS2. The fifth side Se is configured to be parallel to the second side GSb of the glass substrate GS. The fifth side Se is formed at a position away from the second side GSb so as to retain a cutting margin with respect to the second side GSb of the glass substrate GS.
於搬送步驟中,於部分切斷步驟完成後,藉由搬送部14將單片狀母玻璃板MGS2搬送至第二切斷部13。In the conveying step, after the partial cutting step is completed, the single-piece mother glass sheet MGS2 is conveyed to the second cutting section 13 by the conveying section 14.
如圖5所示,於第二切斷步驟中,首先於第二切斷部13的配置於壓盤20的緩衝材21上載置單片狀母玻璃板MGS2(載置步驟)。As shown in FIG. 5, in the second cutting step, first, a single-piece mother glass plate MGS2 is placed on the buffer material 21 of the second cutting section 13 disposed on the platen 20 (mounting step).
其後,沿著設定於單片狀母玻璃板MGS2的第三切斷預定線CL3及第四切斷預定線CL4進行與玻璃基板GS的第一邊GSa及第三邊GSc對應的切斷。與玻璃基板GS的第一邊GSa對應的第三切斷預定線CL3跨單片狀母玻璃板MGS2的第四邊Sd至第五邊Se來設定。該第三切斷預定線CL3的切斷始端部SP設定於第五邊Se,切斷終端部EP設定於第四邊Sd。Thereafter, cutting corresponding to the first side GSa and the third side GSc of the glass substrate GS is performed along the third planned cutting line CL3 and the fourth planned cutting line CL4 set in the single-piece mother glass plate MGS2. The third planned cutting line CL3 corresponding to the first side GSa of the glass substrate GS is set across the fourth to fifth sides Sd to Se of the single-piece mother glass plate MGS2. The cutting start end SP of the third planned cutting line CL3 is set on the fifth side Se, and the cutting end part EP is set on the fourth side Sd.
另一方面,與玻璃基板GS的第三邊GSc對應的第四切斷預定線CL4跨單片狀母玻璃板MGS2的第五邊Se至第三邊Sc來設定。該第四切斷預定線CL4的切斷始端部SP設定於第五邊Se,切斷終端部EP設定於第三邊Sc。On the other hand, a fourth planned cutting line CL4 corresponding to the third side GSc of the glass substrate GS is set across the fifth side Se to the third side Sc of the single-piece mother glass plate MGS2. A cutting start end SP of the fourth planned cutting line CL4 is set on the fifth side Se, and a cutting end EP is set on the third side Sc.
於第二切斷步驟中,藉由裂紋形成構件22於第三切斷預定線CL3及第四切斷預定線CL4的各切斷始端部SP形成初始裂紋。裂紋形成構件22自單片狀母玻璃板MGS2的切斷始端部SP的上方位置下降,與所述切斷始端部SP接觸來形成初始裂紋。In the second cutting step, the crack formation member 22 forms an initial crack at each cutting start end SP of the third planned cutting line CL3 and the fourth planned cutting line CL4. The crack-forming member 22 descends from a position above the cutting start end SP of the single-piece mother glass plate MGS2, and contacts the cutting start end SP to form an initial crack.
形成初始裂紋後,雷射照射裝置23於單片狀母玻璃板MGS2的上方,沿著第三切斷預定線CL3及第四切斷預定線CL4於水平方向自切斷始端部SP移動至切斷終端部EP。雷射照射裝置23一邊移動一邊朝向第三切斷預定線CL3及第四切斷預定線CL4照射雷射光L。After the initial crack is formed, the laser irradiation device 23 moves above the single-piece mother glass plate MGS2, along the third planned cutting line CL3 and the fourth planned cutting line CL4 in the horizontal direction from the cutting start portion SP to the cutting Break terminal EP. The laser irradiation device 23 irradiates the laser light L toward the third planned cutting line CL3 and the fourth planned cutting line CL4 while moving.
冷卻裝置24位於雷射照射裝置23的後方,並且追隨雷射照射裝置23而於水平方向移動。冷卻裝置24朝向經雷射光L照射的部位噴射冷媒R。藉由所述冷媒R將被雷射光L加熱的部位冷卻。The cooling device 24 is located behind the laser irradiation device 23 and moves in the horizontal direction following the laser irradiation device 23. The cooling device 24 sprays the refrigerant R toward a portion irradiated with the laser light L. The portion heated by the laser light L is cooled by the refrigerant R.
藉由利用雷射光L的局部加熱的玻璃的膨脹、與利用冷媒R的冷卻的玻璃的收縮,於第三切斷預定線CL3及第四切斷預定線CL4的部位產生熱應力(拉伸應力)。藉由所述熱應力,初始裂紋沿著第三切斷預定線CL3及第四切斷預定線CL4發展,且該裂紋到達切斷終端部EP,藉此將單片狀母玻璃板MGS2的一部分切斷。Thermal expansion (tensile stress) occurs at the positions of the third planned cutting line CL3 and the fourth planned cutting line CL4 due to the expansion of the locally heated glass using the laser light L and the contraction of the cooled glass using the refrigerant R. ). Due to the thermal stress, an initial crack develops along the third planned cutting line CL3 and the fourth planned cutting line CL4, and the crack reaches the cutting end portion EP, thereby a part of the single-piece mother glass plate MGS2 Cut off.
藉此,於所切斷的單片狀母玻璃板MGS2形成玻璃基板GS的第一邊GSa及第三邊GSc(參照圖6)。於所述切斷中,理想的是使兩台雷射照射裝置23及二台冷卻裝置24並行地掃描。藉此,可同時形成平行的第一邊GSa及第三邊GSc,且可提高作業性。另外,藉由於與第三切斷預定線CL3及第四切斷預定線CL4正交的第五邊Se設定切斷始端部SP,可利用裂紋形成構件22容易地形成初始裂紋。而且,可使所述初始裂紋沿著第三切斷預定線CL3及第四切斷預定線CL4高精度地發展。Thereby, the first side GSa and the third side GSc of the glass substrate GS are formed on the cut single-piece mother glass plate MGS2 (see FIG. 6). In the cutting, it is desirable to scan two laser irradiation devices 23 and two cooling devices 24 in parallel. Thereby, the first side GSa and the third side GSc which are parallel can be formed at the same time, and workability can be improved. In addition, by setting the cutting start end SP on the fifth side Se orthogonal to the third planned cutting line CL3 and the fourth planned cutting line CL4, the initial crack can be easily formed by the crack formation member 22. In addition, the initial crack can be developed along the third planned cutting line CL3 and the fourth planned cutting line CL4 with high accuracy.
藉由所述切斷,切除單片狀母玻璃板MGS2的第一邊Sa與第二邊Sb的全部,第三邊Sc、第四邊Sd及第五邊Se的一部分。換言之,於單片狀母玻璃板MGS2殘留有第三邊Sc、第四邊Sd及第五邊Se的一部分。By the cutting, all of the first side Sa and the second side Sb, a part of the third side Sc, the fourth side Sd, and the fifth side Se of the single-piece mother glass plate MGS2 are cut off. In other words, a part of the third side Sc, the fourth side Sd, and the fifth side Se remains in the single-piece mother glass plate MGS2.
接著,切斷與玻璃基板GS的第二邊GSb及第四邊GSd對應的單片狀母玻璃板MGS2。如圖6所示,跨先形成的玻璃基板GS的第一邊GSa與第三邊GSc來設定第五切斷預定線CL5及第六切斷預定線CL6。第五切斷預定線CL5與玻璃基板GS的第二邊GSb對應,第六切斷預定線CL6與玻璃基板GS的第四邊GSd對應。該情況下,於玻璃基板GS的第一邊GSa設定第五切斷預定線CL5及第六切斷預定線CL6的切斷始端部SP,於第三邊GSc設定切斷終端部EP。Next, the single-piece mother glass plate MGS2 corresponding to the second side GSb and the fourth side GSd of the glass substrate GS is cut. As shown in FIG. 6, a fifth planned cutting line CL5 and a sixth planned cutting line CL6 are set across the first side GSa and the third side GSc of the glass substrate GS formed earlier. The fifth planned cutting line CL5 corresponds to the second side GSb of the glass substrate GS, and the sixth planned cutting line CL6 corresponds to the fourth side GSd of the glass substrate GS. In this case, the fifth cutting planned line CL5 and the sixth planned cutting line CL6 are set with the cutting start end SP on the first side GSa of the glass substrate GS, and the cutting end part EP is set on the third side GSc.
與玻璃基板GS的第一邊GSa及第三邊GSc的切斷同樣地,於第五切斷預定線CL5及第六切斷預定線CL6的切斷始端部SP,藉由裂紋形成構件22形成初始裂紋。其後,藉由兩台雷射照射裝置23照射雷射光L及藉由兩台冷卻裝置24噴射冷媒R。藉此,藉由作用於單片狀母玻璃板MGS2的熱應力,初始裂紋發展至切斷終端部EP,而將單片狀母玻璃板MGS2切斷。藉此,形成玻璃基板GS的第二邊GSb及第四邊GSd。藉此,如圖7所示,形成具有與印刷圖案11的各邊11a~邊11d平行的各邊GSa~邊GSd的矩形的玻璃基板GS。Similarly to the cutting of the first side GSa and the third side GSc of the glass substrate GS, the cutting start end SP at the fifth planned cutting line CL5 and the sixth planned cutting line CL6 is formed by the crack formation member 22. Initial crack. Thereafter, the laser light L is irradiated by two laser irradiation devices 23 and the refrigerant R is ejected by two cooling devices 24. Accordingly, due to the thermal stress acting on the single-piece mother glass plate MGS2, the initial crack progresses to the cutting end portion EP, and the single-piece mother glass plate MGS2 is cut. Thereby, the second side GSb and the fourth side GSd of the glass substrate GS are formed. As a result, as shown in FIG. 7, a rectangular glass substrate GS having sides GSa to GSd parallel to the sides 11 a to 11 d of the print pattern 11 is formed.
圖8至圖10表示第一切斷步驟的另一例。如圖8所示,於帶狀母玻璃板MGS1,沿著寬度方向WD隔開間隔而形成有多個(圖例中兩個)印刷圖案(第一印刷圖案及第二印刷圖案)11A、印刷圖案11B。第一印刷圖案11A及第二印刷圖案11B相對於帶狀母玻璃板MGS1的長邊方向LD而以相同的角度(θ1、θ2)傾斜。8 to 10 show another example of the first cutting step. As shown in FIG. 8, a plurality of (two in the illustration) print patterns (first print pattern and second print pattern) 11A and print patterns are formed on the strip-shaped mother glass plate MGS1 at intervals along the width direction WD. 11B. The first printed pattern 11A and the second printed pattern 11B are inclined at the same angle (θ1, θ2) with respect to the longitudinal direction LD of the strip-shaped mother glass plate MGS1.
與所述例子同樣地,於遠離印刷圖案11A、印刷圖案11B的位置設定與帶狀母玻璃板MGS1的寬度方向WD平行的第一切斷預定線CL1。於第一切斷步驟中,藉由彎曲應力割斷裝置16於寬度方向WD沿著第一切斷預定線CL1將帶狀母玻璃板MGS1切斷,藉此形成包含兩個印刷圖案11A、印刷圖案11B的一片單片狀母玻璃板MGS2。本例中,對第一印刷圖案11A設定第一玻璃基板GSA,對第二印刷圖案11B設定第二玻璃基板GSB。As in the example described above, a first cut-off line CL1 is set at a position away from the printed pattern 11A and the printed pattern 11B in parallel with the width direction WD of the strip-shaped mother glass plate MGS1. In the first cutting step, the strip-shaped mother glass plate MGS1 is cut by the bending stress cutting device 16 in the width direction WD along the first planned cutting line CL1, thereby forming two printing patterns 11A and a printing pattern. A single piece of mother glass plate MGS2 of 11B. In this example, a first glass substrate GSA is set for the first print pattern 11A, and a second glass substrate GSB is set for the second print pattern 11B.
本例的部分切斷步驟包括:第一部分切斷步驟與第二部分切斷步驟。The partial cutting step in this example includes a first partial cutting step and a second partial cutting step.
如圖9所示,於第一部分切斷步驟中,於第一印刷圖案11A與第二印刷圖案11B之間設定第二切斷預定線CL2。第二切斷預定線CL2以與各印刷圖案11A、印刷圖案11B的傾斜角度相同的角度傾斜的方式跨單片狀母玻璃板MGS2的第二邊Sb至第四邊Sd來設定。As shown in FIG. 9, in the first partial cutting step, a second planned cutting line CL2 is set between the first printed pattern 11A and the second printed pattern 11B. The second cut line CL2 is set across the second side Sb to the fourth side Sd of the single-piece mother glass plate MGS2 so as to be inclined at the same angle as the inclination angle of each of the printed patterns 11A and 11B.
於第一部分切斷步驟中,藉由彎曲應力割斷裝置16使形成於第二切斷預定線CL2的切斷始端部SP的初始裂紋沿著該第二切斷預定線CL2發展,藉此切斷單片狀母玻璃板MGS2。藉由所述切斷,形成包含第一印刷圖案11A的第一單片狀母玻璃板MGS2A、及包含第二印刷圖案11B的第二單片狀母玻璃板MGS2B。如圖10所示,各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B的各邊Sa~邊Sd中,第三邊Sc成為與玻璃基板GS的第三邊GSc平行的斜邊。In the first partial cutting step, an initial crack formed on the cutting start end SP of the second planned cutting line CL2 is developed by the bending stress cutting device 16 along the second planned cutting line CL2, thereby cutting. Monolithic mother glass plate MGS2. By the cutting, a first single-piece mother glass plate MGS2A including the first print pattern 11A and a second single-piece mother glass plate MGS2B including the second print pattern 11B are formed. As shown in FIG. 10, among the sides Sa to Sd of each of the single-piece mother glass plate MGS2A and the single-piece mother glass plate MGS2B, the third side Sc becomes a hypotenuse parallel to the third side GSc of the glass substrate GS.
如圖10所示,於第二部分切斷步驟中,為了將各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B的一部分切斷,跨所述各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B的第一邊Sa至第二邊Sb設定第三切斷預定線CL3。第三切斷預定線CL3設定成與玻璃基板GS的第二邊GSb平行。於第二部分切斷步驟中,藉由彎曲應力割斷裝置16沿著所述第三切斷預定線CL3切斷各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B的一部分。藉此,於各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B,與所述例同樣地形成第五邊(未圖示)。As shown in FIG. 10, in the second partial cutting step, in order to cut a part of each of the single-piece mother glass plates MGS2A and MGS2B, the single-piece mother glass plates MGS2A, The first side Sa to the second side Sb of the single-piece mother glass plate MGS2B set a third planned cutting line CL3. The third planned cutting line CL3 is set to be parallel to the second side GSb of the glass substrate GS. In the second partial cutting step, a part of each of the single-piece mother glass sheet MGS2A and the single-piece mother glass sheet MGS2B is cut by the bending stress cutting device 16 along the third predetermined cutting line CL3. Thereby, the fifth side (not shown) is formed in each of the single-piece mother glass plate MGS2A and the single-piece mother glass plate MGS2B in the same manner as in the above-mentioned example.
其後,對各單片狀母玻璃板MGS2A、單片狀母玻璃板MGS2B實施與圖5及圖6的例子同樣的第二切斷步驟。藉此,形成包含第一印刷圖案11A的第一玻璃基板GSA、及包含第二印刷圖案11B的第二玻璃基板GSB。Thereafter, a second cutting step similar to the examples of FIGS. 5 and 6 is performed on each of the single-piece mother glass sheets MGS2A and MGS2B. Thereby, a first glass substrate GSA including the first print pattern 11A and a second glass substrate GSB including the second print pattern 11B are formed.
根據以上說明的本實施方式的玻璃基板GS的製造方法,藉由第一切斷步驟沿寬度方向WD將帶狀母玻璃板MGS1切斷,來形成單片狀母玻璃板MGS2。藉此,於其後的第二切斷步驟中,可容易地進行該單片狀母玻璃板MGS2的移動及定位。於第二切斷步驟中,沿著印刷圖案11的傾斜方向而將單片狀母玻璃板MGS2切斷,藉此可效率良好地切出包含印刷圖案11的玻璃基板GS。除此之外,於第二切斷步驟中,藉由雷射熱割斷將單片狀母玻璃板MGS2切斷,故可製造具有高品質的端面的玻璃基板GS。According to the manufacturing method of the glass substrate GS of the present embodiment described above, the band-shaped mother glass plate MGS1 is cut in the width direction WD in the first cutting step to form a single-piece mother glass plate MGS2. Thereby, in the subsequent second cutting step, the movement and positioning of the single-piece mother glass plate MGS2 can be easily performed. In the second cutting step, the single-piece mother glass plate MGS2 is cut along the oblique direction of the printed pattern 11, whereby the glass substrate GS including the printed pattern 11 can be efficiently cut out. In addition, in the second cutting step, the single-piece mother glass plate MGS2 is cut by laser thermal cutting, so that a glass substrate GS having a high-quality end surface can be manufactured.
圖11表示玻璃基板的製造方法的第二實施方式。於所述第一實施方式中,於準備步驟,藉由印刷步驟後的捲繞步驟將帶狀母玻璃板MGS1捲繞而構成第二玻璃卷GR2,於本實施方式的玻璃基板GS的製造方法中,不進行捲繞步驟而於印刷步驟後實施切斷步驟。製造裝置1於印刷部2的下游側具有第一切斷部12。第一切斷部12將藉由印刷部2形成有印刷圖案11的帶狀母玻璃板MGS1直接切斷。本實施方式的其他構成與第一實施方式的構成相同。於本實施方式中,對與第一實施方式共同的構成要素標注共同的符號。FIG. 11 shows a second embodiment of the method for manufacturing a glass substrate. In the first embodiment, in the preparation step, the strip-shaped mother glass plate MGS1 is wound by a winding step after the printing step to form a second glass roll GR2. In the manufacturing method of the glass substrate GS of this embodiment In the process, the winding step is not performed, and the cutting step is performed after the printing step. The manufacturing apparatus 1 includes a first cutting section 12 on the downstream side of the printing section 2. The first cutting section 12 directly cuts the band-shaped mother glass plate MGS1 on which the printed pattern 11 is formed by the printing section 2. The other configurations of this embodiment are the same as those of the first embodiment. In this embodiment, the same components as those in the first embodiment are denoted by common symbols.
本實施方式的玻璃基板GS的製造方法中,於準備步驟(印刷步驟),自第一玻璃卷GR1引出帶狀母玻璃板MGS1並藉由搬送裝置4進行搬送,同時藉由印刷裝置5於該帶狀母玻璃板MGS1形成多個印刷圖案11。其後,藉由位於印刷裝置5的下游側的第一切斷部12的彎曲應力割斷裝置16將所述帶狀母玻璃板MGS1沿寬度方向WD切斷,而形成單片狀母玻璃板MGS2(第一切斷步驟)。進而,藉由彎曲應力割斷裝置16去除單片狀母玻璃板MGS2的一部分(部分切斷步驟),藉由搬送部14將該單片狀母玻璃板MGS2搬送至第二切斷部13(搬送步驟)。最後,藉由第二切斷部13自單片狀母玻璃板MGS2切出玻璃基板GS(第二切斷步驟)。In the manufacturing method of the glass substrate GS of this embodiment, in the preparation step (printing step), the strip-shaped mother glass plate MGS1 is drawn from the first glass roll GR1 and conveyed by the conveying device 4, and at the same time, the The strip-shaped mother glass plate MGS1 forms a plurality of printed patterns 11. Thereafter, the band-shaped mother glass plate MGS1 is cut in the width direction WD by the bending stress cutting device 16 of the first cutting portion 12 located on the downstream side of the printing device 5 to form a single-piece mother glass plate MGS2. (First cutting step). Further, a part of the single-piece mother glass plate MGS2 is removed by the bending stress cutting device 16 (partial cutting step), and the single-piece mother glass plate MGS2 is transferred to the second cutting portion 13 by the transfer unit 14 (transfer step). Finally, the glass substrate GS is cut out from the single-piece mother glass plate MGS2 by the second cutting section 13 (second cutting step).
圖12表示玻璃基板的製造方法的第三實施方式。於所述第一實施方式中,自第一玻璃卷GR1引出帶狀母玻璃板MGS1,並對該帶狀母玻璃板MGS1執行準備步驟及切斷步驟,於本實施方式中,不使用玻璃卷來製造玻璃基板GS。FIG. 12 shows a third embodiment of the method for manufacturing a glass substrate. In the first embodiment, a strip-shaped mother glass sheet MGS1 is drawn from the first glass roll GR1, and a preparation step and a cutting step are performed on the strip-shaped mother glass sheet MGS1. In this embodiment, a glass roll is not used To manufacture a glass substrate GS.
製造裝置1於印刷部2的上游側具有成形部25。成形部25包括:成形體27,於上端部形成有溢流槽26且剖面為大致楔形;軋邊輥28,配置于成形體27的正下方,自表背兩側夾住自成形體27溢出的熔融玻璃;及退火爐29,配備於軋邊輥28的正下方。The manufacturing apparatus 1 has a forming section 25 on the upstream side of the printing section 2. The forming section 25 includes a forming body 27 with an overflow groove 26 formed at the upper end and a substantially wedge-shaped cross-section; a burring roller 28 is disposed directly below the forming body 27 and overflows from the forming body 27 between the front and back sides Molten glass; and an annealing furnace 29, which is provided directly below the edging roller 28.
成形部25使自溢流槽26的上方溢流的熔融玻璃分別沿著成形體27的兩側面流下,並在其下端部合流而成形為板狀。軋邊輥28限制該熔融玻璃的寬度方向的收縮而使其成為規定寬度的帶狀母玻璃板MGS1。退火爐29對帶狀母玻璃板MGS1實施消除應變的處理。The molding part 25 makes molten glass which overflows from the upper part of the overflow tank 26 flow down both the side surfaces of the molded body 27, and merges in the lower end part, and is shape | molded into a plate shape. The edging rolls 28 restrict the shrinkage in the width direction of the molten glass to be a strip-shaped mother glass sheet MGS1 having a predetermined width. The annealing furnace 29 performs a strain relief process on the strip-shaped mother glass plate MGS1.
於成形部25的下方配置變更帶狀母玻璃板MGS1的搬送方向的方向轉換部30。於方向轉換部30的側方配置橫向搬送部31,所述橫向搬送部31對方向經轉換的帶狀母玻璃板MGS1進行搬送。A direction conversion unit 30 that changes the conveyance direction of the strip-shaped mother glass plate MGS1 is disposed below the forming portion 25. A lateral conveyance unit 31 is disposed on the side of the direction conversion unit 30, and the lateral conveyance unit 31 conveys the belt-shaped mother glass sheet MGS1 whose direction has been changed.
於橫向搬送部31的上方配置有將帶狀母玻璃板MGS1的寬度方向端部的厚壁部分(耳部)去除的切斷裝置32。切斷裝置32藉由雷射熱割斷將帶狀母玻璃板MGS1切斷,但並不限定於該構成。切斷裝置32包括與帶狀母玻璃板MGS1的寬度方向兩端部對應的一對雷射照射裝置33及一對冷卻裝置34。A cutting device 32 is disposed above the horizontal transfer portion 31 to remove a thick portion (ear portion) of the widthwise end portion of the strip-shaped mother glass plate MGS1. The cutting device 32 cuts the strip-shaped mother glass plate MGS1 by laser thermal cutting, but is not limited to this configuration. The cutting device 32 includes a pair of laser irradiation devices 33 and a pair of cooling devices 34 corresponding to both ends of the strip-shaped mother glass plate MGS1 in the width direction.
雷射照射裝置33對帶狀母玻璃板MGS1的規定部位照射CO2 雷射等雷射光La,藉此對所述部位進行局部加熱。冷卻裝置34於帶狀母玻璃板MGS1的搬送方向上,配置於雷射照射裝置33的下游側。冷卻裝置34對帶狀母玻璃板MGS1中經雷射光La照射的部位噴射冷媒Ra,對該部位進行冷卻。切斷裝置32藉由照射雷射光La及噴射冷媒Ra而使帶狀母玻璃板MGS1產生熱應力,並藉由該熱應力使預先形成於帶狀母玻璃板MGS1的初始裂紋沿著帶狀母玻璃板MGS1的長邊方向LD發展。藉此,自帶狀母玻璃板MGS1切除耳部。The laser irradiation device 33 irradiates a predetermined portion of the strip-shaped mother glass plate MGS1 with laser light La such as a CO 2 laser, thereby locally heating the portion. The cooling device 34 is arranged on the downstream side of the laser irradiation device 33 in the conveyance direction of the strip-shaped mother glass plate MGS1. The cooling device 34 sprays a refrigerant Ra on a portion of the strip-shaped mother glass plate MGS1 irradiated with the laser light La, and cools the portion. The cutting device 32 radiates laser light La and sprays refrigerant Ra to generate thermal stress to the strip-shaped mother glass plate MGS1, and uses the thermal stress to cause an initial crack formed in advance on the strip-shaped mother glass plate MGS1 to follow the strip-shaped mother glass. The glass plate MGS1 develops in the longitudinal direction LD. Thereby, the ear portion was cut out from the band-shaped mother glass plate MGS1.
於橫向搬送部31的下游側配置印刷部2,並於印刷部2的下游側配置切斷部3。本實施方式的其他構成與第一實施方式的構成相同。再者,所述的切斷裝置32配置於成形部25與印刷部2之間,但不限於此,亦可配置於第一切斷部12與第二切斷部13之間。該情況下,切斷裝置32配置於搬送部14的上方位置。切斷裝置32中,藉由搬送部14搬送由第一切斷部12形成的單片狀母玻璃板MGS2,同時去除殘留於單片狀母玻璃板MGS2的耳部。A printing section 2 is arranged on the downstream side of the lateral conveying section 31, and a cutting section 3 is arranged on the downstream side of the printing section 2. The other configurations of this embodiment are the same as those of the first embodiment. The cutting device 32 is disposed between the forming section 25 and the printing section 2. However, the cutting device 32 is not limited to this, and may be disposed between the first cutting section 12 and the second cutting section 13. In this case, the cutting device 32 is disposed above the conveyance unit 14. In the cutting device 32, the single-piece mother glass plate MGS2 formed by the first cutting portion 12 is transferred by the transfer unit 14 and the ears remaining on the single-piece mother glass plate MGS2 are removed at the same time.
於本實施方式的玻璃基板GS的製造方法中,於準備步驟,藉由成形部25而連續地成形帶狀母玻璃板MGS1(成形步驟),並藉由方向轉換部30及橫向搬送部31搬送該帶狀母玻璃板MGS1(方向轉換步驟及橫向搬送步驟)。另外,於準備步驟中,一邊藉由橫向搬送部31搬送帶狀母玻璃板MGS1,一邊藉由切斷裝置32切除該帶狀母玻璃板MGS1的耳部(耳部去除步驟)。其後,藉由印刷部2於帶狀母玻璃板MGS1形成多個印刷圖案11(印刷步驟)。In the manufacturing method of the glass substrate GS of this embodiment, in the preparation step, the strip-shaped mother glass plate MGS1 is continuously formed by the forming section 25 (forming step), and is conveyed by the direction changing section 30 and the lateral conveying section 31. This strip-shaped mother glass plate MGS1 (direction changing step and lateral conveying step). In addition, in the preparation step, the ear portion of the band-shaped mother glass plate MGS1 is cut off by the cutting device 32 while the band-shaped mother glass plate MGS1 is transported by the lateral transfer portion 31 (ear removal step). Thereafter, a plurality of printing patterns 11 are formed on the strip-shaped mother glass plate MGS1 by the printing unit 2 (printing step).
繼而,藉由配置於印刷部2的下游側的第一切斷部12將帶狀母玻璃板MGS1切斷,藉此形成單片狀母玻璃板MGS2(第一切斷步驟)。藉由搬送部14將單片狀母玻璃板MGS2搬送至第二切斷部13(搬送步驟),藉由第二切斷部13將該單片狀母玻璃板MGS2切斷,藉此形成玻璃基板GS(第二切斷步驟)。再者,於第一切斷部12與第二切斷部13之間配置耳部去除用的切斷裝置32的情況下,藉由搬送部14進行搬送步驟的同時,對單片狀母玻璃板MGS2實施耳部去除步驟。該情況下的耳部去除步驟包含於切斷步驟,且成為於第一切斷步驟後切斷單片狀母玻璃板MGS2的一部分(耳部)的部分切斷步驟。
實施例Subsequently, the single-piece mother glass plate MGS2 is formed by cutting the band-shaped mother glass plate MGS1 by the first cutting portion 12 arranged on the downstream side of the printing portion 2 (first cutting step). The single-piece mother glass plate MGS2 is transferred to the second cutting portion 13 by the transfer portion 14 (transfer step), and the single-piece mother glass plate MGS2 is cut by the second cutting portion 13 to form glass. Substrate GS (second cutting step). When a cutting device 32 for removing ears is disposed between the first cutting section 12 and the second cutting section 13, the single-piece mother glass is simultaneously carried out by the carrying section 14 while carrying out the carrying step. The plate MGS2 performs an ear removal step. The ear removing step in this case is included in the cutting step and is a partial cutting step of cutting a part (ear) of the single-piece mother glass plate MGS2 after the first cutting step.
Examples
以下,對藉由本發明的製造方法來製造的玻璃基板的實施例進行說明,但本發明並不限於該實施例。Hereinafter, examples of the glass substrate manufactured by the manufacturing method of the present invention will be described, but the present invention is not limited to the examples.
本發明者們針對作為藉由本發明的製造方法製造實施例1及實施例2的玻璃基板的製品、作為藉由其他方法製造比較例1的玻璃基板的製品的品質,對各例的比較進行了研究。The present inventors compared each example with respect to the quality of a product manufactured by the manufacturing method of the present invention as the glass substrates of Examples 1 and 2 and a product manufactured by another method of the glass substrate of Comparative Example 1. the study.
實施例1的玻璃基板於第一切斷步驟中不進行部分切斷步驟而形成矩形形狀的單片狀母玻璃板後,執行第二切斷步驟來製作。實施例2的玻璃基板藉由於第一切斷步驟中進行部分切斷步驟後執行第二切斷步驟來製作。比較例1的玻璃基板藉由使用切斷刀的衝壓來製作。各例的玻璃基板均形成為具有四條邊的矩形形狀。After the glass substrate of Example 1 was formed into a rectangular single-piece mother glass plate without performing a partial cutting step in the first cutting step, the second cutting step was performed to produce the glass substrate. The glass substrate of Example 2 was produced by performing a second cutting step after performing a partial cutting step in the first cutting step. The glass substrate of Comparative Example 1 was produced by pressing using a cutting blade. Each of the glass substrates was formed in a rectangular shape having four sides.
對實施例1、實施例2及比較例1,通過目視來確認玻璃基板的各邊,藉此判定其優劣。將判定結果示於表1。
[表1]
[Table 1]
實施例1的玻璃基板由於各邊的狀態具有可作為製品來出貨的品質,故評估為「○」(優)。實施例2的玻璃基板由於各邊的狀態較實施例1更良好,故其評估設為「◎」(最優)另外,比較例1的玻璃基板由於自各邊破損而無法作為製品來切出,故將其評估設為「×」(不好)。Since the state of each side of the glass substrate of Example 1 has a quality which can be shipped as a product, it was evaluated as "○" (excellent). Since the state of each side of the glass substrate of Example 2 is better than that of Example 1, its evaluation is set to "◎" (optimal). In addition, the glass substrate of Comparative Example 1 cannot be cut out as a product because it is broken from each side. Therefore, the evaluation is set to "×" (bad).
再者,本發明並不限定於所述實施方式的構成,亦不限定於所述的作用效果。本發明可在不脫離本發明的主旨的範圍內進行各種變更。In addition, this invention is not limited to the structure of the said embodiment, nor is it limited to the said effect. The present invention can be variously modified without departing from the gist of the present invention.
於所述實施方式中,於第一切斷步驟,使用彎曲應力割斷裝置16,所述彎曲應力割斷裝置16藉由彎曲應力而使形成於帶狀玻璃板MGS1的初始裂紋發展,但本發明不限定於所述構成。例如,於第一切斷步驟(包含部分切斷步驟)中,沿著設定於帶狀母玻璃板MGS1的第一切斷預定線CL1(第二切斷預定線CL2)形成劃線,使應力作用於形成有劃線的部分,藉此可將該帶狀母玻璃板切斷(劃線割斷)。In the embodiment, in the first cutting step, a bending stress cutting device 16 is used. The bending stress cutting device 16 develops an initial crack formed in the band-shaped glass plate MGS1 by the bending stress, but the present invention does not It is limited to the said structure. For example, in the first cutting step (including the partial cutting step), a scribe line is formed along the first planned cutting line CL1 (the second planned cutting line CL2) set on the strip-shaped mother glass plate MGS1 to cause stress. The strip-shaped mother glass plate can be cut by cutting on the portion where the scribe line is formed (the scribe line is cut).
於所述實施方式中,於第一切斷步驟,將第一切斷線CL1設定成與帶狀母玻璃板MGS1的寬度方向WD平行,但本發明不限定於所述構成。亦可將所述第一切斷預定線CL1設定成根據印刷圖案11的傾斜形態而傾斜。In the above-mentioned embodiment, in the first cutting step, the first cutting line CL1 is set to be parallel to the width direction WD of the strip-shaped mother glass plate MGS1, but the present invention is not limited to the configuration. The first planned cutting line CL1 may be set to be inclined according to the inclined form of the printed pattern 11.
於所述實施方式中,例示了圓柱狀的凹版6,但不限於此,凹版6例如可構成為平板狀。In the above-mentioned embodiment, the cylindrical intaglio plate 6 is exemplified, but the invention is not limited thereto, and the intaglio plate 6 may be formed in a flat plate shape, for example.
於所述實施方式中,例示了於第一切斷步驟,藉由一台彎曲應力割斷裝置16來進行對帶狀母玻璃板MGS1的寬度方向WD的切斷、及對單片狀母玻璃板MGS2的部分切斷步驟,但本發明不限定於所述構成。即,製造裝置1可包括多台(例如二台)彎曲應力割斷裝置16。該情況下,藉由第一彎曲應力割斷裝置16沿著寬度方向WD將帶狀母玻璃板MGS1切斷,並藉由第二彎曲應力割斷裝置16對如上形成的單片狀母玻璃板MGS2進行部分切斷步驟。第二彎曲應力割斷裝置16可配置於第一彎曲應力割斷裝置16的下游側,例如可靠近搬送部14或第二切斷部13來配置。In the above embodiment, the first cutting step is exemplified by cutting the widthwise WD of the strip-shaped mother glass plate MGS1 by a bending stress cutting device 16 and the single-piece mother glass plate. Although the MGS2 is partially cut off, the present invention is not limited to the above configuration. That is, the manufacturing apparatus 1 may include a plurality of (for example, two) bending stress cutting devices 16. In this case, the band-shaped mother glass plate MGS1 is cut by the first bending stress cutting device 16 along the width direction WD, and the single-piece mother glass plate MGS2 formed as described above is cut by the second bending stress cutting device 16. Partial cutting step. The second bending stress cutting device 16 may be arranged on the downstream side of the first bending stress cutting device 16, and may be arranged, for example, near the conveying section 14 or the second cutting section 13.
1‧‧‧製造裝置1‧‧‧ manufacturing equipment
2‧‧‧印刷部 2‧‧‧Printing Department
3‧‧‧切斷部 3‧‧‧ cutting section
4‧‧‧搬送裝置 4‧‧‧ transport device
5‧‧‧印刷裝置 5‧‧‧Printing device
6‧‧‧凹版 6‧‧‧ Gravure
7‧‧‧刮刀 7‧‧‧ scraper
8‧‧‧橡皮布 8‧‧‧ blanket
9‧‧‧油墨 9‧‧‧ Ink
10‧‧‧凹部 10‧‧‧ recess
11、11A、11B‧‧‧印刷圖案 11, 11A, 11B‧‧‧Printed pattern
11a‧‧‧第一邊 11a‧‧‧first side
11b‧‧‧第二邊 11b‧‧‧Second side
11c‧‧‧第三邊 11c‧‧‧ Third side
11d‧‧‧第四邊 11d‧‧‧ Fourth side
12‧‧‧第一切斷部 12‧‧‧The first cutting section
13‧‧‧第二切斷部 13‧‧‧Second cutting section
14‧‧‧搬送部 14‧‧‧ Transport Department
15‧‧‧搬送裝置 15‧‧‧ transport device
16‧‧‧彎曲應力割斷裝置 16‧‧‧Bending stress cutting device
17‧‧‧支撐構件 17‧‧‧ support member
18‧‧‧按壓構件 18‧‧‧Pressing member
19、22‧‧‧裂紋形成構件 19, 22‧‧‧Crack-forming members
20‧‧‧壓盤 20‧‧‧Press plate
21‧‧‧緩衝材 21‧‧‧ buffer material
23、33‧‧‧雷射照射裝置 23, 33‧‧‧laser irradiation device
24、34‧‧‧冷卻裝置 24, 34‧‧‧ Cooling device
25‧‧‧成形部 25‧‧‧Forming Department
26‧‧‧溢流槽 26‧‧‧ overflow tank
27‧‧‧成形體 27‧‧‧ shaped body
28‧‧‧軋邊輥 28‧‧‧Roller
29‧‧‧退火爐 29‧‧‧annealing furnace
30‧‧‧方向轉換部 30‧‧‧Direction Conversion Department
31‧‧‧橫向搬送部 31‧‧‧Transportation Department
32‧‧‧切斷裝置 32‧‧‧ cutting device
CL1‧‧‧第一切斷預定線 CL1‧‧‧The first cut off line
CL2‧‧‧第二切斷預定線 CL2‧‧‧Second cut off line
CL3‧‧‧第三切斷預定線 CL3‧‧‧ Third cut-off line
CL4‧‧‧第四切斷預定線 CL4‧‧‧ Fourth cut-off line
CL5‧‧‧第五切斷預定線 CL5‧‧‧ Fifth cut off planned line
CL6‧‧‧第六切斷預定線 CL6‧‧‧ Sixth cut-off scheduled line
EP‧‧‧切斷終端部 EP‧‧‧ Cut-off terminal
GR1‧‧‧第一玻璃卷 GR1‧‧‧The first glass roll
GR2‧‧‧第二玻璃卷 GR2‧‧‧Second Glass Roll
GS‧‧‧玻璃基板 GS‧‧‧ glass substrate
GSA‧‧‧第一玻璃基板 GSA‧‧‧First glass substrate
GSB‧‧‧第二玻璃基板 GSB‧‧‧Second glass substrate
GSa‧‧‧第一邊 GSa‧‧‧First side
GSb‧‧‧第二邊 GSb‧‧‧Second side
GSc‧‧‧第三邊 GSc‧‧‧ Third Side
GSd‧‧‧第四邊 GSd‧‧‧ Fourth side
L、La‧‧‧雷射光 L, La‧‧‧ laser light
LD‧‧‧長邊方向 LD‧‧‧long side direction
MGS1‧‧‧帶狀母玻璃板 MGS1‧‧‧ ribbon mother glass
MGS2‧‧‧單片狀母玻璃板 MGS2‧‧‧Single sheet mother glass plate
MGS2A‧‧‧第一單片狀母玻璃板 MGS2A‧‧‧The first single sheet mother glass plate
MGS2B‧‧‧第二單片狀母玻璃板 MGS2B‧‧‧Second single sheet mother glass plate
R、Ra‧‧‧冷媒 R, Ra‧‧‧ Refrigerant
Sa‧‧‧第一邊 Sa‧‧‧first side
Sb‧‧‧第二邊 Sb‧‧‧Second side
Sc‧‧‧第三邊 Sc‧‧‧ Third side
Sd‧‧‧第四邊 Sd‧‧‧ Fourth side
Se‧‧‧第五邊 Se‧‧‧Fifth side
SP‧‧‧切斷始端部 SP‧‧‧ Cut off the beginning
WD‧‧‧寬度方向 WD‧‧‧Width direction
θ1、θ2、θ3‧‧‧傾斜角度 θ1, θ2, θ3‧‧‧ tilt angle
圖1是表示第一實施方式的玻璃基板的製造裝置的側面圖。FIG. 1 is a side view showing a glass substrate manufacturing apparatus according to a first embodiment.
圖2是表示準備步驟的平面圖。 FIG. 2 is a plan view showing a preparation step.
圖3是表示第一切斷步驟的平面圖。 FIG. 3 is a plan view showing a first cutting step.
圖4是表示第一切斷步驟的部分切斷步驟的平面圖。 FIG. 4 is a plan view showing a partial cutting step of the first cutting step.
圖5是表示第二切斷步驟的平面圖。 FIG. 5 is a plan view showing a second cutting step.
圖6是表示第二切斷步驟的平面圖。 FIG. 6 is a plan view showing a second cutting step.
圖7是表示第二切斷步驟完成時的玻璃基板的平面圖。 FIG. 7 is a plan view showing the glass substrate when the second cutting step is completed.
圖8是表示第一切斷步驟的另一例的平面圖。 FIG. 8 is a plan view showing another example of the first cutting step.
圖9是表示第一切斷步驟的部分切斷步驟的另一例的平面圖。 FIG. 9 is a plan view showing another example of a partial cutting step in the first cutting step.
圖10是表示第一切斷步驟的部分切斷步驟的另一例的平面圖。 FIG. 10 is a plan view showing another example of a partial cutting step in the first cutting step.
圖11是表示第二實施方式的玻璃基板的製造裝置的側面圖。 FIG. 11 is a side view showing a glass substrate manufacturing apparatus according to a second embodiment.
圖12是表示第三實施方式的玻璃基板的製造裝置的側面圖。 FIG. 12 is a side view showing a glass substrate manufacturing apparatus according to a third embodiment.
Claims (6)
Applications Claiming Priority (2)
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JP2018-072307 | 2018-04-04 | ||
JP2018072307A JP2019182685A (en) | 2018-04-04 | 2018-04-04 | Method for manufacturing glass substrate |
Publications (1)
Publication Number | Publication Date |
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TW201941971A true TW201941971A (en) | 2019-11-01 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW108111751A TW201941971A (en) | 2018-04-04 | 2019-04-02 | Manufacturing method for glass substrate |
Country Status (3)
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JP (1) | JP2019182685A (en) |
TW (1) | TW201941971A (en) |
WO (1) | WO2019193942A1 (en) |
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JP2022108103A (en) * | 2021-01-12 | 2022-07-25 | 日本電気硝子株式会社 | Method for manufacturing glass film |
JP2022115544A (en) * | 2021-01-28 | 2022-08-09 | 日本電気硝子株式会社 | Method for manufacturing glass film |
JP2022151004A (en) * | 2021-03-26 | 2022-10-07 | 日本電気硝子株式会社 | Glass film manufacturing method and manufacturing device therefor |
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JPS4832908A (en) * | 1971-09-03 | 1973-05-04 | ||
US8656738B2 (en) * | 2008-10-31 | 2014-02-25 | Corning Incorporated | Glass sheet separating device |
JP2012096936A (en) * | 2010-10-29 | 2012-05-24 | Asahi Glass Co Ltd | Apparatus and method for cutting edge of glass ribbon, and apparatus and method for manufacturing glass product |
JP2014128924A (en) * | 2012-12-28 | 2014-07-10 | Dic Corp | Gravure offset printing method |
JP6669988B2 (en) * | 2016-06-02 | 2020-03-18 | 日本電気硝子株式会社 | Manufacturing method of glass film |
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2018
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- 2019-03-14 WO PCT/JP2019/010517 patent/WO2019193942A1/en active Application Filing
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JP2019182685A (en) | 2019-10-24 |
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