TW201940974A - Photosensitive composition, composite, electronic component, and method for manufacturing electronic component in which the photosensitive composition is capable of shortening development time and reducing occurrence of residue between lines - Google Patents

Abstract

The present invention relates to a photosensitive composition, a composite, an electronic component, and a method for manufacturing an electronic component. The present invention provides a photosensitive composition capable of shortening development time and reducing occurrence of residue between lines. According to the present invention, a photosensitive composition is provided. The photosensitive composition comprises a precious metal powder, a photopolymerizable compound, a photopolymerization initiator, and a dispersant. The solubility parameter of the aforementioned dispersant is 9.9 (cal/cm 3) 1/2 or more.

Description

Photosensitive composition, composite, electronic part, and manufacturing method of electronic part

The present invention relates to a photosensitive composition and use thereof. Specifically, it is related with the manufacturing method of a photosensitive composition, a composite, an electronic component, and an electronic component.

Conventionally, a method is known in which a conductive layer and a resin insulating layer are formed on a substrate by photocuring a photosensitive composition containing a photopolymerizable compound and a photopolymerization initiator (see Patent Documents 1 and 2). For example, Patent Document 1 discloses a method of forming a conductive layer made of a base metal on a substrate by a photo development method. In the above method, first, a photosensitive composition is applied to a substrate, dried, and formed into a film-like body (a step of forming the film-like body). Next, the formed film-shaped body is covered with a photoresist having a predetermined opening pattern, and the film-shaped body is exposed through the photoresist (exposure step). Thereby, the exposed part of a film-shaped body is photocured. Next, the unexposed portion that has been blocked by light is etched and removed in an alkaline aqueous developing solution (development step). Then, the film-like body which becomes a desired development pattern is baked (baking step). According to the photo development method including the above steps, a fine conductive layer can be formed compared to various conventional printing methods.
[Prior Art Literature]

[Patent Literature]
[Patent Document 1] Japanese Patent No. 3975932
[Patent Document 2] Japanese Patent Application Publication No. 2015-161815

However, in recent years, miniaturization and high performance of various electronic devices are rapidly progressing, and further miniaturization and high density of electronic components mounted on electronic devices are required. Accompanying this, in the manufacture of electronic components, it is required to reduce the resistance of the conductive layer and reduce the thickness (narrowing) of the conductive layer. For example, it is required to form a conductive layer having a line width of a wiring constituting a conductive layer and a space (line and space: L / S) between adjacent wirings of 30 μm / 30 μm or less, and further 20 μm / 20 μm or less.

However, according to the study by the present inventors, when the viscosity of the photopolymerizable compound used is high, for example, when the photopolymerizable compound used is a polymer with a large molecular weight, it is difficult to form a thin line with a small L / S stably. Conductive layer. That is, when the viscosity of a photopolymerizable compound is high, the adhesiveness of a base material and an unexposed part will become high. However, if L / S is small, it becomes difficult to supply the developer to the space portion between the lines in the developing step. As a result, it is difficult to remove the unexposed portion, and the development time, that is, the time required to completely remove the unexposed portion (the time to the development point (B.P.)) may be longer. In addition, as shown in the schematic diagram of FIG. 2, residues that have not been completely removed by etching (hereinafter, referred to as “interline residues”) may remain in the space portion. Accordingly, there are problems in that a leakage current is generated due to a tunnel effect, or a short-circuit failure occurs due to communication between wirings. Therefore, the user's request is to shorten the development time and reduce the occurrence of residue between the lines, improve productivity, and yield.

The present invention has been made in view of the above-mentioned aspects, and an object thereof is to provide a photosensitive composition capable of shortening the development time and reducing the occurrence of residues between lines. Another related object is to provide a composite body including a conductive film formed from a dried body of the photosensitive composition. Another related object is to provide an electronic component including a conductive layer formed of a fired body of the photosensitive composition, and a method for producing the electronic component.

According to the present invention, there is provided a photosensitive composition including a noble metal powder, a photopolymerizable compound, a photopolymerization initiator, and a dispersant. The solubility parameter of the dispersant is 9.9 (cal / cm ³ ) ^1/2 or more.

The photosensitive composition contains a dispersant having a solubility parameter as high as 9.9 or more. Thereby, the unexposed portion is easily removed in the developing step, and the developing time can be shortened. In addition, the occurrence of residues between the wires can be reduced, and a conductive layer with fine wires having a small L / S can be formed with good reproducibility. As a result, productivity and yield can be improved.

It should be noted that in this specification, "Solubility Parameter (SP value)" means, for example, "examination of solubility parameters of additives", research on coatings, No. 152, pp41-46, 2010 October, [online], <URL: http://www.kansai.co.jp/rd/token/pdf/152/08.pdf >, and the value measured by the cloud point titration method. A specific measurement method is described in the item of the example. The unit of the SP value is (cal / cm ³ ) ^1/2 .

In a preferred embodiment disclosed herein, the photopolymerizable compound includes a photopolymerizable polymer having a weight average molecular weight of 5,000 or more. When the photopolymerizable compound contains a photopolymerizable polymer, it is more difficult to remove unexposed portions during the development step. Thereby, the effects of the technology disclosed herein can be better utilized.

In a preferred embodiment disclosed herein, the photopolymerizable compound includes one or more compounds having an acidic group. Thereby, the effect of improving the removability of the unexposed portion in the developing step can be exerted at a higher level.

In a preferred aspect disclosed herein, when the entirety of the noble metal powder is 100 parts by mass, the content ratio of the dispersant is 0.1 parts by mass or more and 2.7 parts by mass or less. Thereby, the removability of the unexposed portion and the etching resistance of the exposed portion can be balanced at a high level. That is, in the development step, the removability of the unexposed portion is improved, and high adhesion (tackiness) to the substrate can be achieved for the exposed portion.

In a preferred embodiment disclosed herein, the dispersant is composed only of a compound having a solubility parameter of 9.9 (cal / cm ³ ) ^1/2 or more. Thereby, the residue between the lines is less likely to remain, and the space portion of the thin line can be more stably secured.

In a preferred embodiment disclosed herein, the dispersant contains one or more compounds having an acidic group. Accordingly, in the developing step, the unexposed portion can be removed more quickly and cleanly by using an aqueous developer.

In a preferred embodiment disclosed herein, the noble metal powder includes silver-based particles. Thereby, a conductive layer having excellent balance between cost and low resistance can be realized.

In addition, according to the present invention, there is provided a composite including: a green sheet; and a conductive film disposed on the green sheet and formed of a dried body of the photosensitive composition.

According to the present invention, there is provided an electronic component including a conductive layer formed from a fired body of the photosensitive composition. According to the said photosensitive composition, the conductive layer of the thin wire with small L / S can be formed reproducibly. Therefore, by using the photosensitive composition, it is possible to suitably realize an electronic component having a small and / or high density conductive layer.

In addition, according to the present invention, there is provided a method for manufacturing an electronic component, which includes the steps of: applying the photosensitive composition to a substrate, performing exposure and development, and then firing to form a fired body of the photosensitive composition. Conductive layer. According to such a manufacturing method, an electronic component having a small and / or high-density conductive layer can be stably manufactured, and productivity and yield can be improved.

Hereinafter, suitable embodiments of the present invention will be described. It should be noted that features other than those specifically mentioned in this specification (such as the composition of the photosensitive composition) and necessary technical features required for the implementation of the present invention (such as a method for preparing a photosensitive composition, a conductive film, The method of forming the conductive layer, the method of manufacturing electronic parts, etc.) can be understood based on the technical content taught in this specification and based on the general technical common sense of those skilled in the art in this field. The present invention can be implemented based on the contents disclosed in this specification and technical common sense in the field.

In the following description, a film-like body (dried product) obtained by drying the photosensitive composition at a temperature below the boiling point of the dispersant, specifically, approximately 200 ° C or lower, for example, 100 ° C or lower It is called a "conductive film. A conductive film includes all of the unfired (before firing) film-like bodies. The conductive film may be an uncured material before photocuring or a cured product after photocuring. In addition, in the following description, A sintered body (fired product) obtained by firing the photosensitive composition at a temperature higher than the sintering temperature of the precious metal powder is referred to as a "conductive layer". The conductive layer includes a wiring (a linear body), a wiring pattern, and a solid pattern.
In addition, the expression "A ~ B" which shows a range in this specification means A or more and B or less.

≪Photosensitive composition≫
The photosensitive composition disclosed here can be used suitably for manufacture of the layer which consists of a noble metal, for example, a conductive layer, a heat radiation layer, etc. The photosensitive composition disclosed herein includes, as essential components, a precious metal powder, a photopolymerizable compound, a photopolymerization initiator, and a dispersant. Hereinafter, each component will be described in order.

＜ Precious metal powder ＞
The noble metal powder is a component that imparts conductivity to a conductive layer obtained by firing a photosensitive composition, for example. The precious metal powder is not particularly limited, and one or two or more kinds can be appropriately selected and used from conventionally known substances, for example, depending on the application and the like. Suitable examples of the precious metal powder include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru), osmium (Os), and the like. Simple elements of metals, and mixtures and alloys thereof. Examples of the alloy include silver alloys such as silver-palladium (Ag-Pd), silver-platinum (Ag-Pt), and silver-copper (Ag-Cu).

In a suitable embodiment, the precious metal powder includes silver-based particles. The cost of silver is low, and the electrical conductivity and thermal conductivity are high. Therefore, when the precious metal powder contains silver-based particles, for example, a conductive layer having excellent balance between cost and low resistance can be realized.
In addition, in this specification, "silver-type particle" means all the particles containing a silver component. Examples of the silver-based particles include a simple substance of silver, the above-mentioned silver alloy, core-shell particles with silver-based particles as a core, and silver-ceramic core-shell particles.

There is no particular limitation on the D ₅₀ particle size of the precious metal powder (the particle size distribution based on the volume basis of the laser diffraction and scattering methods, the particle size equivalent to 50% of the cumulative value from the smaller particle size side), from From the viewpoint of taking into consideration the exposure performance in the exposure step, it may be approximately 1 to 5 μm. When the D ₅₀ particle diameter is in the above range, the exposure performance of the exposed portion can be improved, and fine lines can be formed more stably. From the viewpoint of suppressing aggregation in the photosensitive composition and improving stability, the D ₅₀ particle diameter of the precious metal powder may be, for example, 1.5 μm or more and 2 μm or more. The D ₅₀ particle diameter of the noble metal powder may be, for example, 4.5 μm or less and 4 μm or less from the viewpoint of improving the formation of fine wires, or promoting the densification of the conductive layer and reducing the resistance.

Noble metal powder may have an organic surface treatment agent attached to its surface. The organic surface treatment agent can be used, for example, for at least one of the purpose of improving the dispersibility of the noble metal powder in the photosensitive composition, increasing the affinity of the noble metal powder with other contained components, and preventing the surface oxidation of the metal constituting the noble metal powder. Examples of the organic surface treatment agent include fatty acids such as carboxylic acids, and benzotriazole-based compounds.

There is no particular limitation, and the ratio of the precious metal powder to the entire photosensitive composition is approximately 50% by mass or more, typically 60 to 95% by mass, and may be, for example, 70 to 90% by mass. By satisfying the above range, it is possible to suitably form a conductive layer having excellent density and electrical conductivity. Moreover, the handleability of a photosensitive composition and the workability | operativity at the time of shaping | molding into a conductive film can be improved.

<Photopolymerizable compound>
The photopolymerizable compound is a photocurable component that is cured by causing a polymerization reaction, a cross-linking reaction, and the like to occur by the active species generated during the decomposition of a photopolymerization initiator described later. The polymerization reaction may be, for example, addition polymerization or ring-opening polymerization. The photopolymerizable compound is not particularly limited, and one or two or more kinds can be appropriately selected and used from conventionally known substances depending on, for example, the use, the type of the substrate, and the like. The photopolymerizable compound typically has one or more unsaturated bonds and / or a cyclic structure. One suitable example of the photopolymerizable compound includes a radically polymerizable compound having one or more (meth) acrylfluorenyl groups and vinyl ethylenically unsaturated bonds, and a cyclic group such as epoxy groups. Structure of a cationically polymerizable compound.

In this specification, a photopolymerizable compound includes a photopolymerizable monomer having a weight average molecular weight of less than 1500, a photopolymerizable oligomer having a weight average molecular weight of 1500 or more and less than 5,000, and a photopolymerization having a weight average molecular weight of 5,000 or more. Sexual polymer.
In addition, the "weight average molecular weight" in this specification means the weight average molecular weight measured by gel chromatography (colloidal permeation chromatography: GPC) and converted using a standard polystyrene calibration curve.

In a suitable embodiment, the photopolymerizable compound includes a photopolymerizable polymer having a weight average molecular weight of 5,000 or more. Compared with monomers and oligomers, photopolymerizable polymers can be cured with relatively little exposure. Therefore, curing can be performed stably to the depth of the exposed portion (the portion close to the substrate). Therefore, by including the photopolymerizable polymer, the adhesion between the substrate and the conductive layer is improved, and it is possible to suitably suppress occurrence of defects such as peeling and disconnection in the conductive layer. In addition, water resistance and durability of the conductive layer can be improved. Moreover, when a photopolymerizable compound contains a photopolymerizable polymer, the adhesiveness (tackiness) with respect to a base material improves, and the removability of an unexposed part in a developing process falls. Therefore, the application of the technology disclosed herein is effective. The weight average molecular weight of the photopolymerizable compound is approximately 10,000 or more, typically 15,000 or more, for example, 20,000 or more, approximately 100,000 or less, and for example, 50,000 or less. The photopolymerizable compound preferably contains, in addition to the photopolymerizable polymer, at least one of a photopolymerizable monomer and a photopolymerizable oligomer.

In a suitable embodiment, the photopolymerizable compound includes a monomer having a (meth) acrylfluorenyl group and a (meth) acrylic acid ester having the monomer as a structural unit. When the photopolymerizable compound contains a (meth) acrylate, the flexibility of the conductive layer and the followability to the substrate can be improved. As a result, the occurrence of problems such as peeling and disconnection can be more favorably suppressed. As a suitable example of a (meth) acrylic acid ester, the homopolymer of an alkyl (meth) acrylate is mentioned, The alkyl (meth) acrylate is a main monomer, and the main monomer is included with this. Copolymer of copolymerizable side monomer.
It should be noted that, in this specification, "(meth) acrylfluorenyl" means a term including "methacrylfluorenyl" and "acrylfluorenyl", and "(meth) acrylate" means that The term "methacrylate" and "acrylate".

In a suitable embodiment, the double bond equivalent of the (meth) acrylate (calculated as a weight average molecular weight / C = C number of double bonds.) Is approximately 200 or more, typically 300 or more, for example, 400 or more Further, it is 450 or more, approximately 1,000 or less, and for example, 500 or less. If the double bond equivalent is within the above range, in the developing step, the removal performance of the unexposed portion and the etching resistance of the exposed portion can be balanced at a high level. That is, the development time can be further shortened, and the occurrence of defects such as peeling and disconnection can be more favorably suppressed.

In a suitable embodiment, the (meth) acrylate includes a monomer having a (meth) acrylfluorenyl group and an ionic functional group (for example, an acidic group) as a structural unit. Thereby, the removal property of an uncured part is effectively improved, and the effect of the technology disclosed here can be exhibited at a higher level. Specific examples of the (meth) acrylate having an ionic functional group in addition to the (meth) acrylfluorenyl group include, for example, a carboxyl group-containing (meth) acrylate and a phosphate group-containing (meth) acrylate , Acid-modified epoxy (meth) acrylate, urethane-containing urethane-modified epoxy (meth) acrylate, etc. Among these, a (meth) acrylfluorenyl group and a carboxyl group-containing monomer are preferable, and (meth) acrylic acid ester which uses this monomer as a structural unit. Examples of such commercially available (meth) acrylates include CYCLOMER P (trademark) ACA Z200M, Z230AA, Z250, Z251, Z300, Z320, and Z254F manufactured by Daicel Ornex Co., Ltd.

In a suitable embodiment, the photopolymerizable compound includes a photopolymerizable compound (a urethane bond-containing compound) having a urethane bond (-NH-C (= O) -O-). For example, the photopolymerizable polymer may be a urethane bond-containing polymer having a urethane bond, or the photopolymerizable polymer may further include an amino group containing a urethane bond. A formate bond monomer and a urethane bond-containing oligomer having a urethane bond. When the photopolymerizable compound contains a urethane bond-containing compound, it is possible to more effectively improve the etching resistance of the exposed portion, and to realize a conductive layer having more flexibility and stretchability. Therefore, it is possible to improve the adhesion between the substrate and the conductive layer, and to suppress the occurrence of defects such as peeling and disconnection at a high level. As a suitable example of a urethane bond containing compound, a urethane modified (meth) acrylate, a urethane modified epoxy, etc. are mentioned.

In a suitable embodiment, the photopolymerizable compound includes a compound having an acidic group. For example, a compound having a resin acid value of approximately 30 mgKOH / g or more, typically 50 mgKOH / g or more, for example, 100 to 150 mgKOH / g is included. The resin acid value of the entire photopolymerizable compound is preferably in the above range. In other words, it is preferred that the entire photopolymerizable compound exhibit a predetermined acidity. If the resin acid value is a predetermined value or more, the unexposed portion can be removed more quickly and cleanly by using an aqueous developer in the developing step. In addition, if the resin acid value is equal to or less than a predetermined value, the solubility in an aqueous developing solution is suppressed in the developing step, and peeling and disconnection of the exposed portion can be more effectively suppressed.
In addition, the "acid value" in this specification means the content (mg) of potassium hydroxide (KOH) required to neutralize the free fatty acid contained in a unit sample (1g). The unit is mgKOH / g.

In a suitable embodiment, the SP value of the photopolymerizable compound is approximately within 20 (cal / cm ³ ) ^1/2 , typically 8 to 13 (cal / cm ³ ) ^1/2 , and may be, for example, 10 to 13 ( cal / cm ³ ) ^1/2 . It should be noted that, when a plurality of compounds are used as the photopolymerizable compound, a value (weighted average value) calculated by integrating the SP value of each compound and the composition ratio of each compound is used as the photopolymerizable compound. SP value. Thereby, the stability of the entire photosensitive composition can be improved, and the effects of the technology disclosed herein can be exhibited at a higher level.
In another suitable solution, the glass transition temperature (Tg value based on Differential Scanning Calorimetry (DSC) of the photopolymerizable compound) is approximately 40 ° C or higher, typically 50 ° C or higher, for example The temperature is 60 ° C. or higher and further 100 ° C. or higher. In one example, it is 120 ° C. or higher and 130 ° C. or higher, and is generally 200 ° C. or lower, for example, 150 ° C. or lower. This can further improve the flexibility and adhesion of the conductive film, and further improve the adhesion between the substrate and the conductive layer. In addition, when the Tg value is in the above range, the adhesiveness (tackiness) to the substrate is improved, and the removability of the unexposed portion in the development step is reduced. Therefore, the application of the technology disclosed herein is effective.

There is no particular limitation. When the photopolymerizable compound contains a photopolymerizable polymer, the ratio of the photopolymerizable polymer to the entire photopolymerizable compound is, on a mass basis, approximately 10% by mass or more, and typically 20%. The mass% or more can be, for example, 30 mass% or more, approximately 90 mass% or less, typically 80 mass% or less, and for example, 50 mass% or less. When the above range is satisfied, the effects of the technology disclosed herein can be exerted at a high level. Moreover, although it does not specifically limit, when a photopolymerizable compound contains at least one of a photopolymerizable monomer and a photopolymerizable oligomer, at least one of a photopolymerizable monomer and a photopolymerizable oligomer is photopolymerized. The ratio of the entire sex compound is approximately 10% by mass or more, typically 20% by mass or more, for example, 50% by mass or more, approximately 90% by mass or less, and typically 80% by mass or less. For example, it may be 70% by mass or less.

There is no particular limitation, and the ratio of the photopolymerizable compound to the entire photosensitive composition is approximately 0.1 to 50% by mass, typically 0.5 to 30% by mass, for example, 1 to 20% by mass, and further 5 to 15%. quality%. In addition, the content ratio of the photopolymerizable compound is not particularly limited, and is approximately 0.1 to 50 parts by mass, typically 0.5 to 30 parts by mass, and for example, 1 to 20 parts by mass, based on 100 parts by mass of the noble metal powder. By satisfying the above range, the photocurability of the photosensitive composition can be appropriately exhibited, and the conductive layer can be formed stably at a high level.

<Photopolymerization initiator>
The photopolymerization initiator is a component that is decomposed by irradiation with active energy rays such as visible light rays, ultraviolet rays, and electron beams to generate active species such as radicals and cations, and initiates a reaction of the photopolymerizable compound. As the photopolymerization initiator, one or two or more kinds can be appropriately selected and used from conventionally known substances according to the type of the photosensitive resin and the like. As a suitable example, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinylpropane-1-one and 2-benzyl-2-dimethylamino group can be mentioned. -1- (4-morpholinylphenyl) -butane-1-one, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2,4,6-trimethylbenzene Fluorenyldiphenylphosphine oxide, 2,4-diethylthioxanthone, benzophenone and the like.

There is no particular limitation, and the ratio of the photopolymerization initiator to the entire photosensitive composition is approximately 0.01 to 5% by mass, typically 0.1 to 3% by mass, and may be, for example, 0.2 to 2% by mass. Thereby, the photocurability of a photosensitive composition can be exhibited suitably, and a conductive layer can be formed more stably.

＜ Dispersant ＞
The dispersant is an essential component for improving the removability of the unexposed portion in the developing step. In the technology disclosed herein, the SP value of the dispersant by the cloud point titration method is 9.9 (cal / cm ³ ) ^1/2 or more. When a plurality of compounds are used as the dispersant, a value (weighted average value) calculated by integrating the SP value of each compound and the composition ratio of each compound is used as the SP value of the dispersant. The SP value is a scale indicating the degree of hydrophilicity and hydrophobicity. When the SP value is equal to or greater than a predetermined value, the "compatibility" between the aqueous developer and the photosensitive composition becomes good. More specifically, the interaction between the resin component (for example, a photopolymerizable compound and an organic binder described later) and the precious metal powder can be reduced, and the resin component and the precious metal powder can be easily dissolved in an aqueous developer. Thereby, the removability of an unexposed part can be improved suitably.

Examples of commercially available dispersants having an SP value of 9.9 (cal / cm ³ ) ^1/2 or more include, for example, Malialim (trademark) SC1015F manufactured by Daicel Ornex Co., Ltd., and Hypermer (produced by Croda Japan Ltd.). Trademarks) KD-4, KD-8, KD-9, etc. From the viewpoint of low cost and the like, and exhibiting the above-mentioned effect with a smaller amount of use, the SP value of the dispersant is 10.0 (cal / cm ³ ) ^1/2 or more, and may be, for example, 10.4 (cal / cm ³ ) ^1/2 the above. In addition, the upper limit of the SP value of the dispersant is not particularly limited, and it is approximately 30 (cal / cm ³ ) ^1/2 or less from the standpoint of ease of acquisition, for example, 20 (cal / cm ³ ) ^1/2 or less, as an example It may be as 15 (cal / cm ^{3) 1/2} or less.

As long as the dispersant satisfies the range of the above-mentioned SP value, one or two kinds can be appropriately selected from compounds known to be used as a dispersant in the middle of such use. Used above. In a suitable embodiment, the dispersant contains one or more compounds having an acidic group. The acidic group is a substituent having a dissociative proton and exhibiting acidity in water. Among them, a compound containing a functional group exhibiting relatively high acidity, such as a phenolic hydroxyl group, a carboxyl group, a sulfo group, a phosphino group, a boric acid group, and the like, is preferable. The acidic group has strong coordination to the precious metal fine particles constituting the precious metal powder. Therefore, by using a compound having an acidic group, the interaction between the acidic group of the photopolymerizable polymer and the noble metal particles is weakened, and the photopolymerizable polymer is easily dissolved in the developing solution. As a result, the removability of the unexposed portion can be more improved.

The compound having an acidic group preferably has an acid value. That is, it is an acidic compound whose acid value is above the detection lower limit (it also depends on the measurement accuracy, but is approximately 0.5 mgKOH / g or more). The acid value of the compound having an acidic group is approximately 10 to 200 mgKOH / g or more, and may be, for example, 20 to 100 mgKOH / g. Thereby, the effects of the technology disclosed herein can be exerted at a higher level. The compound having an acidic group may further have a basic group. That is, it may be an amphoteric compound. In the above case, the compound having an acidic group may not have an acid value.

The structure of one or two or more compounds constituting the dispersant is not particularly limited, and typically has a linear straight chain type or a linear main skeleton (the carbon number becomes the largest carbon chain. The same applies hereinafter). A branched structure with multiple side chains (carbon chains branched from the main chain. The same below. For example, graft chains.) Alternatively, it may be a comb structure in which a plurality of side chains are arranged along the main skeleton. At least one of the main skeleton and the plurality of side chains may have an ionic functional group. The ionic functional group may be present in the main skeleton, or may be present at the end of the side chain or halfway. However, the main skeleton and / or a plurality of side chains may be hydrophobic without having an ionic functional group. The main skeleton may include polyfunctionality having a plurality of ionic functional groups. The main skeleton may be, for example, a polycarboxylic acid having a plurality of the acidic groups, a polyamine having a plurality of basic groups, and the like. The side chain may be an alkylene chain, a polyoxyalkylene chain, such as an ethylene oxide (EO) chain, a propylene oxide (PO) chain. The side chain may be a saturated or unsaturated, linear or branched hydrocarbon chain.

Each of the one or two or more compounds constituting the dispersant has a weight average molecular weight of approximately 100 or more, typically 500 or more, for example, 1,000 or more, approximately 100,000 or less, and typically 50,000 or less. For example, it may be Below 30,000. By setting it as the said range, the coordination property with respect to the micrometer-sized precious metal fine particle can be improved. In addition, the tackiness of the photosensitive composition can be suppressed, and the removability of the unexposed portion can be more improved. Therefore, the effects of the technology disclosed herein can be exerted at a higher level.

In the dispersant, the ratio of compounds having a solubility parameter lower than 9.9 (cal / cm ³ ) ^1/2 can be suppressed to be low. For example, the content ratio of a compound having a solubility parameter of less than 9.9 (cal / cm ³ ) ^1/2 may be lower than approximately 50% by mass, preferably 40% by mass or less, and more preferably 10% by mass or less of the entire compound constituting the dispersant. Particularly, It is preferably free of compounds having a solubility parameter lower than 9.9 (cal / cm ³ ) ^1/2 . In other words, it is particularly preferable that the dispersant is composed of only a compound having a solubility parameter of 9.9 (cal / cm ³ ) ^1/2 or more. Thereby, the residue between the lines is less likely to remain in the space portion, and a fine line can be formed more stably. That is, it is possible to improve the fine-line forming property more favorably. Therefore, the effects of the technology disclosed herein can be exerted at a higher level.

In a suitable embodiment, the absolute value of the difference between the SP values of water and the dispersant, that is, the SP value of water-the SP value of the dispersant, is approximately within 13.6 (cal / cm ³ ) ^1/2 , and is typically Within 13.5 (cal / cm ³ ) ^1/2 , for example, it may be within 13.1 (cal / cm ³ ) ^1/2 . Thereby, the affinity with an aqueous developer can be further improved, and the removal property of an unexposed part can be improved more.
In another suitable embodiment, the absolute value of the difference between the SP value of the photopolymerizable compound and the dispersant, that is, the SP value of the photopolymerizable compound-the SP value of the dispersant is approximately 13 (cal / cm ³ ) ¹ Within ^{/ 2} , typically within 10 (cal / cm ³ ) ^1/2 , for example within 8 (cal / cm ³ ) ^1/2 , and in one example, within 5 (cal / cm ³ ) ^1/2 . Thereby, the stability of the entire photosensitive composition can be improved, and the effects of the technology disclosed herein can be exhibited at a higher level.

There is no particular limitation, and the ratio of the dispersant to the entire photosensitive composition is approximately 0.01 to 5% by mass, typically 0.1 to 3% by mass, and may be, for example, 0.2 to 2% by mass. Thereby, it is easier to remove the unexposed part in the developing step, and it is possible to better suppress the occurrence of residue between the lines. In addition, it is possible to form a conductive layer excellent in denseness and electrical conductivity. In addition, it is not particularly limited, and the content ratio of the dispersant is approximately 0.01 to 10 parts by mass, typically 0.05 to 5 parts by mass, and preferably 0.1 to 2.7 parts by mass with respect to 100 parts by mass of the precious metal powder. Thereby, the removability of the unexposed portion and the etching resistance of the exposed portion can be balanced at a high level. That is, it is possible to improve the removability of the unexposed portion in the developing step, and to achieve high adhesion (tackiness) to the substrate to the exposed portion.

＜ Organic binders ＞
The photosensitive composition may contain an organic binder in addition to the above-mentioned essential components. An organic binder is a component which improves the adhesiveness of a base material and the conductive film (uncured material) before photocuring. As the organic binder, one or two or more kinds can be appropriately selected and used from conventionally known substances depending on, for example, the type of the substrate, the type of the photopolymerizable compound, and the like. The organic binder is preferably one that can be easily removed with an aqueous developer in the developing step. For example, when an alkaline aqueous developing solution is used in the developing step, an alkali-soluble resin such as the compound having an acidic group as described above is preferred. Thereby, it is easier to remove unexposed portions in the developing step.

A suitable example of the organic binder includes cellulose-based polymer compounds such as methyl cellulose, ethyl cellulose, carboxymethyl cellulose, and hydroxymethyl cellulose, acrylic resins, phenol resins, and alkyds. Resin, polyvinyl alcohol, polyvinyl butyral, etc. Among these, a cellulose-based polymer compound is preferable from the viewpoint of easy removal in the developing step.

When an organic binder is contained in the photosensitive composition, it is not particularly limited. The ratio of the organic binder to the entire photosensitive composition is approximately 0.1 to 20% by mass, typically 0.5 to 10% by mass. For example, it may be It is 1 to 5 mass%.

＜ Organic Dispersion Medium ＞
In addition to the above-mentioned essential components, the photosensitive composition may further contain an organic dispersion medium for dispersing these components. The organic dispersion medium is a component that imparts moderate viscosity and fluidity to the photosensitive composition, improves the operability of the photosensitive composition, or improves the workability when molded into a conductive film. As the organic dispersion medium, one or two or more kinds can be appropriately selected and used from conventionally known substances according to, for example, the type of the photopolymerizable compound.

A suitable example of the organic dispersion medium includes alcohol solvents such as terpineol, dihydroterpineol (menthol), TEXANOL, 3-methyl-3-methoxybutanol, and benzyl alcohol; Glycol solvents such as ethylene glycol, propylene glycol, and diethylene glycol; dipropylene glycol methyl ether, methyl cellosolve (ethylene glycol monomethyl ether), cellosolve (ethylene glycol monoethyl ether), Ether solvents such as butylcarbitol (diethylene glycol monobutyl ether); diethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, butanediol acetate, butyl Ester solvents such as diethylene glycol acetate, butyl cellosolve acetate, butylcarbitol acetate (diethylene glycol monobutyl ether acetate), isobornyl acetate; toluene, xylene, Hydrocarbon solvents such as naphtha and petroleum hydrocarbons; mineral spirits; organic solvents.

Among them, an organic solvent having a boiling point of 150 ° C. or higher is preferred, and an organic solvent having a boiling point of 170 ° C. or higher is preferred from the viewpoint of improving the storage stability of the photosensitive composition and the operability during the formation of the conductive film. In addition, as another suitable example, an organic solvent having a boiling point of 250 ° C. or lower is preferred, and an organic solvent having a boiling point of 220 ° C. or lower is preferred from the viewpoint of suppressing the drying temperature after the conductive film is printed to a low level. This can increase productivity and reduce production costs.

Examples of suitable commercially available organic solvents include Dawanor DPM (trademark) (boiling point: 190 ° C, manufactured by Dow Chemical Company), Dawanor DPMA (trademark) (boiling point: 209 ° C, manufactured by Dow Chemical Company), and menthol ( Boiling point: 207 ° C), menthol P (boiling point: 216 ° C), Isopar H (boiling point: 176 ° C, manufactured by Kanto Fuel Co., Ltd.), SW-1800 (boiling point: 198 ° C, manufactured by Maruzan Petroleum Co., Ltd.), and the like.

When an organic dispersion medium is contained in the photosensitive composition, it is not particularly limited, and the ratio of the organic dispersion medium to the entire photosensitive composition is approximately 1 to 50% by mass, typically 3 to 30% by mass, For example, it may be 5-20 mass%.

＜ Other Additives ＞
As long as the photosensitive composition does not significantly impair the effects of the technology disclosed herein, it may further contain various additional components in addition to the above-mentioned components as necessary. As an additive component, 1 type, or 2 or more types can be suitably selected and used from a conventionally well-known thing. Examples of the additive component include an inorganic filler, a photosensitizer, a polymerization inhibitor, a radical scavenger, an antioxidant, an ultraviolet absorber, a plasticizer, a surfactant, a leveling agent, a thickener, and a consumer Foaming agent, anti-gelling agent, stabilizer, preservative, pigment, etc. It is not particularly limited, and the proportion of the additive component in the entire photosensitive composition is approximately 5% by mass or less, typically 3% by mass or less, for example, 2% by mass or less, and preferably 1% by mass or less.

As described above, the photosensitive composition disclosed herein includes a dispersant having a solubility parameter as high as 9.9 (cal / cm ³ ) ^1/2 or more. Thereby, the unexposed portion can be quickly and appropriately removed in the developing step. As a result, the development time can be shortened, and the occurrence of residue between the wires can be reduced. In other words, a space can be stably secured between adjacent wirings. Therefore, even a thin conductive layer with a small L / S can be formed with good reproducibility, and productivity and yield can be improved.

＜ Application of photosensitive composition ＞
According to the photosensitive composition disclosed herein, a thin-wire conductive layer can be formed stably. Therefore, the photosensitive composition disclosed here can be used suitably for formation of the conductive layer in various electronic components, such as an inductor component, a capacitor component, and a multilayer circuit board.

Electronic components can be mounted in various forms such as surface mount type and through hole mount type. The electronic component may be a laminated type, a rolled type, or a thin film type. Typical examples of inductor parts include high-frequency filters, common-mode filters, inductors (coils) for high-frequency circuits, inductors (coils) for general circuits, high-frequency filters, choke coils, and transformers. Wait.

An example of the electronic component is a ceramic electronic component. It should be noted that in this specification, "ceramic electronic parts" means all electronic parts made of ceramic materials, including: ceramic substrates (glass ceramic substrates) having an amorphous state or crystalline (that is, non-glass) ) All electronic parts of ceramic substrate. Typical examples of ceramic electronic components include high-frequency filters with ceramic substrates, ceramic inductors (coils), ceramic capacitors, and low-temperature baked ceramic substrates (LTCC substrates). ), High temperature firing laminated ceramic substrate (High Temperature Co-fired Ceramics Substrate: HTCC substrate), etc.

The ceramic material is not particularly limited, and examples thereof include zirconium oxide (zirconia), magnesium oxide (magnesium oxide), aluminum oxide (alumina), and silicon oxide (silicon dioxide). Oxide materials such as titanium oxide (titanium dioxide), cerium oxide (cerium oxide), yttrium oxide (yttrium oxide), barium titanate; cordierite, mullite, forsterite, talc, plug Tungsten, zircon, ferrite and other composite oxide-based materials; silicon nitride (silicon nitride), aluminum nitride (aluminum nitride) and other nitride-based materials; silicon carbide (silicon carbide) and other carbide-based materials; Hydroxide-based materials such as hydroxyapatite; etc.

FIG. 1 is a cross-sectional view schematically showing the structure of a multilayer chip inductor 1. It should be noted that the dimensional relationship (length, width, thickness, etc.) in FIG. 1 does not necessarily reflect the actual dimensional relationship. The symbols X and Y in the drawings indicate the left-right direction and the up-down direction, respectively. Among them, it is merely a direction for convenience of explanation.

The multilayer chip inductor 1 includes a main body portion 10 and external electrodes 20 provided on both side portions of the main body portion 10 in the left-right direction X. The multilayer chip inductor 1 has dimensions such as a 1608 shape (1.6 mm × 0.8 mm) and a 2520 shape (2.5 mm × 2.0 mm).

The main body portion 10 has a structure in which a ceramic layer (dielectric layer) 12 and an internal electrode layer 14 are integrated. The ceramic layer 12 is made of a ceramic material. In the vertical direction Y, an internal electrode layer 14 is disposed between the ceramic layers 12. The internal electrode layer 14 is formed using the photosensitive composition. The internal electrode layers 14 adjacent to each other in the vertical direction Y with the ceramic layer 12 interposed therebetween are conducted through the through holes 16 provided in the ceramic layer 12. Thereby, the internal electrode layer 14 is configured in a three-dimensional spiral shape (spiral shape). Both ends of the internal electrode layer 14 are connected to the external electrode 20, respectively.

Such a multilayer chip inductor 1 can be manufactured by the following steps, for example.
That is, first, a paste containing a ceramic material as a raw material, a binder resin, and an organic solvent is prepared and supplied to a carrier sheet to form a ceramic green sheet. Next, the ceramic green sheet is rolled and cut into a desired size to obtain a plurality of green sheets for forming a ceramic layer. Next, via holes are suitably formed at predetermined positions of the plurality of green sheets for forming ceramic layers using a punch or the like.

Next, using the photosensitive composition, a conductive film having a predetermined coil pattern is formed at predetermined positions on a plurality of green sheets for forming ceramic layers. As an example, an unfired conductive film can be formed by a manufacturing method including the following steps: (Step S1: a step of forming a film-like body) A photosensitive composition is provided on a green sheet for forming a ceramic layer and dried to form the film. A step of a conductive film formed from a dried body of a photosensitive composition; (Step S2: exposure step) covering the conductive film with a photoresist having a predetermined opening pattern, exposing the photoresist through the photoresist, and partially curing the conductive film with light. Step; (Step S3: Development step) a step of etching the photo-cured conductive film and removing unexposed portions.

In addition, when forming a conductive film using the said photosensitive composition, a conventionally well-known method can be used suitably. For example, in (step S1), the application of the photosensitive composition can be performed using various printing methods such as screen printing, a bar coater, and the like. The photosensitive composition can be dried at a temperature below the boiling point of the photopolymerizable compound and the photopolymerization initiator, typically at 50 to 100 ° C. (Step S2) For the exposure, for example, an exposure machine that emits light in a wavelength range of 10 to 500 nm, such as an ultraviolet irradiation lamp such as a high-pressure mercury lamp, a metal halide lamp, or a xenon lamp, can be used. In (Step S3), an alkaline aqueous developer can be typically used for the etching. For example, an aqueous solution containing sodium hydroxide, sodium carbonate, or the like can be used. The concentration of the alkaline aqueous solution can be adjusted to, for example, 0.01 to 0.5% by mass.

Next, (step S4: firing step) a plurality of green sheets for forming a ceramic layer on which a conductive film in an unfired state is formed are laminated and pressure-bonded. Thereby, a laminated body of an unfired ceramic green sheet was produced. Next, the laminated body of the ceramic green sheet is fired at, for example, 600 to 1000 ° C. Thereby, the ceramic green sheet is sintered into one body to form a main body portion 10 including a ceramic layer 12 and an internal electrode layer 14 formed of a fired body of a photosensitive composition. Then, an appropriate external electrode-forming paste is applied to both end portions of the main body portion 10 and then fired, whereby the external electrode 20 is formed.
As described above, the multilayer chip inductor 1 can be manufactured.

Hereinafter, several embodiments of the present invention will be described, but it is not intended to limit the present invention to those shown in the above embodiments.

(Preparation of dispersant)
First, eight kinds of commercially available dispersants (dispersants a to h) shown below were prepared.
(Dispersant a): Malialim (trademark) SC1015F manufactured by Daicel Ornex Co., Ltd., a comb-type high-molecular ionic dispersant with polycarboxylic acid as the main skeleton and a polyoxyalkylene chain on the side chain, Weight-average molecular weight 20,000 to 30,000 (dispersant b): Hypermer (trademark) KD-2 manufactured by Croda Japan Ltd., a comb-type high polyamine-based skeleton and a polyoxyalkylene chain on the side chain Molecular ionic dispersant, weight average molecular weight 2000
(Dispersant c): Hypermer (trademark) KD-9 manufactured by Croda Japan Ltd., a comb-type high molecular ionic dispersant having a polycarboxylic acid as the main skeleton and a hydrocarbon chain on the side chain, and a weight average molecular weight 760, acid value 74mgKOH / g
(Dispersant d): Hypermer (trademark) KD-21 manufactured by Croda Japan Ltd., and zwitterionic dispersant (dispersant e) containing amidamine bond and carboxyl group: Hypermer (trademark) KD-3 manufactured by Croda Japan Ltd. Comb-type polymer ionic dispersant (dispersant f) with polyamine as the backbone and a hydrocarbon chain on the side chain: Hypermer (trademark) LP5 manufactured by Croda Japan Ltd., with polyamine as the backbone Comb-type polymer ionic dispersant (dispersant g) with a hydrocarbon chain on the side chain: Hypermer (trademark) KD-15 manufactured by Croda Japan Ltd., with oleic acid as the main chain and on the main chain Linear ionic dispersant (dispersant h) with a dicarboxylic acid on one side of the terminal: Crodafos (trademark) O3A, a phosphoric acid-based dispersant manufactured by Croda Japan Ltd.

(Measurement of SP value of dispersant)
For each dispersant, the SP value was calculated by the cloud point titration method. Specifically, in a 25 ° C environment, first weigh 0.3 g of a dispersant in a beaker, and add 11.3 ml of acetone (good solvent) with an SP value of 9.8 (cal / cm ³ ) ^1/2 to disperse The agent is fully dissolved. N-hexane having a SP value (δml) of 7.2 (cal / cm ³ ) ^1/2 as a poor solvent having a low SP value was added dropwise little by little, and the drop amount Vml (ml of the point where white turbidity was generated was recorded. ). Similarly, pure water having a SP value (δmh) of 23.4 (cal / cm ³ ) ^1/2 as a poor solvent having a high SP value was added dropwise little by little, and the drop amount Vmh ( ml). The results are shown in Table 1 below.

[Table 1]

Then, the SP values δml and δmh of the poor solvent and the dropping amounts Vml and Vmh described in Table 1 were substituted into the following formula (1) to calculate the SP value (δ). The results are shown in Tables 1 and 2. As shown in Table 1, a ~ d dispersant individual SP value of 9.9 (cal / cm ^{3) 1/2} or more, a dispersing agent, e ~ h individual SP value is lower than 9.9 (cal / cm ^{3) 1 / 2} .

(Where V _ml is the volume of the poor solvent with a low SP value, V _mh is the volume of the poor solvent with a high SP value, δ _ml is the SP value of the poor solvent with a low SP value, and δ _mh is the SP value.)

(Preparation of photosensitive composition)
First, a silver powder (D ₅₀ particle diameter: 2 μm) was prepared as a noble metal powder. In addition, an acrylic polymer (CYCLOMER P (trademark) ACA Z320 manufactured by Daicel Ornex Co., Ltd., a weight average molecular weight: 23000, a double bond equivalent weight: 450, a resin acid value: 130 mgKOH / g, and a Tg value: 140 ° C were prepared. ), And a urethane acrylate monomer as a photopolymerizable compound.
Then, the prepared silver powder, an acrylic polymer, a urethane acrylate monomer, a cellulose polymer compound as an organic binder, a photosensitizer, and a photopolymerization initiator (BASF Japan Ltd. Manufactured by IRGACURE (trademark) 369), and other additives (here, an anti-gelling agent, a polymerization inhibitor, and an ultraviolet absorber are used) so that the content ratios shown in Table 2 are dissolved in an organic dispersion medium It is further suitable to add a dispersant a to h to prepare a photosensitive composition (Examples 1 to 9 and Comparative Examples 1 to 7). In addition, the mass ratio shown in Table 2 is a content ratio (mass part) when silver powder is 100 mass parts.

(Creation of wiring patterns)
First, the prepared photosensitive composition was coated on a commercially available ceramic green sheet with a size of 4 cm × 4 cm by screen printing. Next, it was made to dry at 60 degreeC for 15 minutes, and it formed into the electroconductive film (solid film) on the green sheet (the formation process of a film-like body). Next, a photoresist is covered from above the conductive film. At this time, as the photoresist, a photoresist having a pattern with a line width of 20 μm and an interval (space) between adjacent lines of 20 μm (L / S = 20 μm / 20 μm) was used. In a state where the photoresist is covered on the conductive film, light is irradiated with an exposure machine under conditions of an illuminance of 9 mJ / cm ² and an exposure amount of 1800 mJ / cm ² to cure the exposed portion (exposure step). After the exposure, a 0.1% by mass alkaline Na ₂ CO ₃ aqueous solution (developing solution) was blown onto the surface of the ceramic green sheet until the development point (BP) was reached (development step). In addition, as BP, it is set as the time until the unexposed part was developed in 0.1 mass% alkaline developing solution, and the unexposed part disappeared visually. After removing the unexposed part in this manner, it was washed with pure water and dried at room temperature. In this way, a conductive film (dry film) of a wiring pattern is formed on the ceramic green sheet.

(Evaluation of wiring pattern)
The prepared wiring pattern was evaluated for developability, presence or absence of residue, and tackiness.

・ Evaluation of developability:
In the development step described above, the time (development time) until the development point (BP) is reached is measured. The result is shown in the "development time (second)" column of Table 2. In addition, the development time of Comparative Example 1 (the test example without the dispersant added) was used as a reference, and the difference between the development time and Comparative Example 1 was calculated for each test example. The results are shown in the "Difference (second) from Comparative Example 1" column in Table 2. In addition, based on the difference from the development time with Comparative Example 1, developability was evaluated by the following index.
"◎": The development time was 5 seconds or more shorter than that of Comparative Example 1 (the developability was good).
"×": The development time is equal to or slower than Comparative Example 1 (poor developability).

・ Evaluation of presence or absence of residue:
A total of 10 fields of view of the space portion of the wiring pattern were observed with an optical microscope, and the presence or absence of residue was confirmed from the obtained observation image. The results are shown in the "presence of residue" column in Table 2. The expressions in this column are as follows.
"◎": Among the 10 fields of vision, the residue is less than 1 field of view.
"○": Among the 10 fields of vision, there are 2 to 4 fields of vision with residues.
"×": Among the 10 fields of vision, those with residues are 5 or more fields.

・ Evaluation of stickiness:
A polyethylene terephthalate (PET) film was placed on the conductive film formed as described above, and was pressed from above for 24 hours under a load of 2 kg. Then, the adhesiveness of the conductive film when the PET film was peeled after 24 hours was evaluated. The results are shown in the "stickiness" column in Table 2. The expressions in this column are as follows.
"◎": The conductive film was not adhered to the PET film (no peeling).
"×": The conductive film is attached to the PET film (with peeling).

[Table 2]

Comparative Example 1 is a test example without adding a dispersant. As shown in Table 2, in Comparative Example 1, the development time was relatively long, and a large amount of residue was confirmed in the space portion. In addition, Comparative Examples 3 to 7 using a dispersant having an SP value of 9.46 or less were similar to Comparative Example 1 in that the development time was long and a large amount of residue was also confirmed in the space portion. Further, in Comparative Example 2 using a dispersant having an SP value of 9.80, the development time was shorter than that in Comparative Example 1, but a large amount of residue was still observed in the space portion.

Compared to Comparative Examples 1 to 7, using Examples 1 to 9 with a dispersant having an SP value of 9.9 (cal / cm ³ ) ^1/2 or more, compared with Comparative Example 1, the development time was shorter and the occurrence of residues was also smaller. Suppressed to be lower. In other words, by using a dispersant having an SP value of 9.9 or more, for example, the effects of the technology disclosed herein are exhibited without depending on the structure of the dispersant, without exception. Among them, in Examples 1 to 8 containing no compound having an SP value lower than 9.9, the occurrence of residues was more favorably suppressed. In addition, according to the comparison of Examples 1 to 5 in which the amount of the dispersant is different, by setting the content ratio of the dispersant to 100 parts by mass of the silver powder to be 0.1 to 2.7 parts by mass, the removal of the unexposed portion in the developing step can be improved And the adhesion (tackiness) of the exposed portion to the substrate is improved. These results show the significance of the technology disclosed herein.

The present invention has been described in detail above, but these are merely examples, and the present invention can be modified in various ways without departing from the spirit thereof.

1‧‧‧Laminated Chip Inductors

10‧‧‧Main body

12‧‧‧ceramic layer

14‧‧‧Internal electrode layer

16‧‧‧through hole

20‧‧‧External electrode

FIG. 1 is a cross-sectional view schematically showing a structure of a multilayer chip inductor according to an embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining residues between lines.

Claims (10)

A photosensitive composition comprising a precious metal powder, a photopolymerizable compound, a photopolymerization initiator, and a dispersant, and the dispersant has a solubility parameter of 9.9 (cal / cm ³ ) ^1/2 or more. The photosensitive composition according to claim 1, wherein the photopolymerizable compound includes a photopolymerizable polymer having a weight average molecular weight of 5,000 or more. The photosensitive composition according to claim 1 or claim 2, wherein the photopolymerizable compound includes one or more compounds having an acidic group. The photosensitive composition according to claim 1 or claim 2, wherein when the whole of the precious metal powder is 100 parts by mass, the content ratio of the dispersant is 0.1 parts by mass or more and 2.7 parts by mass The following. The photosensitive composition according to claim 1 or claim 2, wherein the dispersant is composed of only a compound having a solubility parameter of 9.9 (cal / cm ³ ) ^1/2 or more. The photosensitive composition according to claim 1 or claim 2, wherein the dispersant contains one or more compounds having an acidic group. The photosensitive composition according to claim 1 or claim 2, wherein the precious metal powder includes silver-based particles. A complex with: Raw film; and The conductive film is disposed on the green sheet and is formed of a dried body of the photosensitive composition according to any one of claims 1 to 7 of the scope of patent application. An electronic component comprising a conductive layer formed of a fired body of the photosensitive composition according to any one of claims 1 to 7 of the scope of patent application. An electronic component manufacturing method includes the steps of: applying a photosensitive composition as described in any one of claims 1 to 7 on a substrate, exposing and developing, and then firing to form A conductive layer formed from a fired body of the photosensitive composition.