TW201939300A - Memory card adaptor and memory device - Google Patents
Memory card adaptor and memory device Download PDFInfo
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- TW201939300A TW201939300A TW107109070A TW107109070A TW201939300A TW 201939300 A TW201939300 A TW 201939300A TW 107109070 A TW107109070 A TW 107109070A TW 107109070 A TW107109070 A TW 107109070A TW 201939300 A TW201939300 A TW 201939300A
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- memory card
- electrical
- slot
- electrical connection
- electrically connected
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6675—Structural association with built-in electrical component with built-in electronic circuit with built-in power supply
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/70—Structural association with built-in electrical component with built-in switch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
- H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
Abstract
Description
本發明涉及一種轉接組件及記憶卡裝置,特別是一種能插接於提供符合M.3介面規範的記憶卡插設的電連接槽中的轉接組件及記憶卡裝置。 The invention relates to an adapter component and a memory card device, and in particular to an adapter component and a memory card device that can be inserted into an electrical connection slot for providing a memory card in accordance with the M.3 interface specification.
M.3介面規範是目前三星公司(Samsung)極力推展的高速固態硬碟(Solid State Disk,SSD)的新介面規範,目前主要是應用於企業級的伺服器中。此M.3介面規範的相關連接埠與現有的M.2介面規範的相關連接埠基本上不相容。但,目前較為流通的高速固態硬碟為符合M.2介面規範的固態硬碟,因此,對於相關技術人員而言,如何使現有符合M.2介面規範的固態硬碟與M.3介面規範的相關連接埠相容,成為了重要的課題。 The M.3 interface specification is a new interface specification for high-speed solid state disks (SSDs) that is currently being promoted by Samsung. It is currently mainly used in enterprise servers. The related ports of this M.3 interface specification are basically incompatible with the related ports of the existing M.2 interface specification. However, the currently circulating high-speed solid-state hard disks are solid-state hard disks that comply with the M.2 interface specification. Therefore, for related technical personnel, how to make the existing solid-state hard disks that meet the M.2 interface specification and the M.3 interface specification The related port compatibility has become an important issue.
緣此,本發明人乃潛心研究並配合學理的運用,而提出一種設計合理且有效改善上述問題的本發明。 For this reason, the present inventor has devoted himself to studying and cooperating with the application of theories to propose a present invention with a reasonable design and effective improvement of the above problems.
本發明的主要目的在於提供一種轉接組件及記憶卡裝置,用以改善現有技術中,符合M.2介面規範的記憶卡無法直接與用以提供符合M.3介面規範的記憶卡插設的電連接槽插接的問題。 The main purpose of the present invention is to provide an adapter assembly and a memory card device, which are used to improve the existing technology in which a memory card that complies with the M.2 interface specification cannot be directly inserted into a memory card that is used to provide a M.3 interface specification. Problems with electrical connection slots.
為了實現上述目的,本發明提供一種轉接組件,其包含:一殼體、一電連接插槽、一電插接結構及一電路板。殼體的一端形成有一開口。電連接插槽設置殼體中,電連接插槽對應露出於開口,電連接插槽用以提供符合M.2(NGFF)介面規範的記憶卡電性插 接;符合M.2(NGFF)介面規範的記憶卡能通過開口,而與電連接插槽電性連接。電插接結構的部份外露於殼體,且外露於殼體的電插接結構對應位於殼體相反於形成有開口的一端;電插接結構能插設於提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽。電路板設置有一處理模組,電路板設置於殼體中,電連接插槽及電插接結構設置於電路板,處理模組電性連接電連接插槽及電插接結構。其中,當符合M.2(NGFF)介面規範的記憶卡插接於電連接插槽,且電插接結構插設於外部電插槽時,處理模組能將外部電插槽輸入的電壓轉換至符合M.2(NGFF)介面規範的記憶卡所需的電壓。 In order to achieve the above object, the present invention provides an adapter assembly including: a housing, an electrical connection slot, an electrical plug structure, and a circuit board. An opening is formed at one end of the casing. An electrical connection slot is provided in the housing, and the electrical connection slot is exposed correspondingly to the opening. The electrical connection slot is used to provide a M.2 (NGFF) interface memory card electrical plug. The memory card that complies with the M.2 (NGFF) interface specification can be electrically connected to the electrical connection slot through the opening. Parts of the electrical plug structure are exposed from the housing, and the electrical plug structure exposed from the housing is located at the end of the housing opposite to the opening; the electrical plug structure can be inserted to provide M.3 (NGSFF) compliance. An external electrical slot for a memory card with an interface specification. The circuit board is provided with a processing module. The circuit board is provided in the housing. The electrical connection slot and the electrical plug structure are disposed on the circuit board. The processing module is electrically connected to the electrical connection slot and the electrical plug structure. Among them, when a memory card complying with the M.2 (NGFF) interface specification is inserted into the electrical connection slot and the electrical plug structure is inserted into the external electrical slot, the processing module can convert the voltage input by the external electrical slot. Voltage required to a memory card that conforms to the M.2 (NGFF) interface specification.
為了實現上述目的,本發明還提供一種記憶卡裝置,其能插設於提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽,記憶卡裝置包含:一記憶卡、一殼體、一電連接插槽、一電連接結構及一電路板。記憶卡符合M.2(NGFF)介面規範。殼體的一端形成有一開口。電連接插槽設置殼體中,電連接插槽對應露出於開口,電連接插槽用以提供記憶卡插接。電插接結構的部份外露於殼體,且外露於殼體的電插接結構對應位於殼體相反於形成有開口的一端;電插接結構能插接於外部電插槽。電路板設置有一處理模組,電路板設置於殼體中,電連接插槽及電插接結構設置於電路板,處理模組電性連接電連接插槽及電插接結構。其中,當符合記憶卡插接於電連接插槽,且電插接結構插設於外部電插槽時,處理模組能將外部電插槽輸入的電壓轉換至記憶卡所需的電壓。 In order to achieve the above object, the present invention also provides a memory card device that can be inserted into an external electrical slot provided with a memory card that conforms to the M.3 (NGSFF) interface specification. The memory card device includes: a memory card, A casing, an electrical connection slot, an electrical connection structure and a circuit board. The memory card complies with M.2 (NGFF) interface specifications. An opening is formed at one end of the casing. The electrical connection slot is arranged in the housing, the electrical connection slot is exposed through the opening, and the electrical connection slot is used to provide a memory card insertion. A part of the electrical plug structure is exposed from the housing, and the electrical plug structure exposed from the housing is correspondingly located at an end of the housing opposite to the opening formed; the electrical plug structure can be plugged into an external electrical slot. The circuit board is provided with a processing module. The circuit board is provided in the housing. The electrical connection slot and the electrical plug structure are disposed on the circuit board. The processing module is electrically connected to the electrical connection slot and the electrical plug structure. Wherein, when the memory card is inserted into the electrical connection slot and the electrical plug structure is inserted in the external electrical slot, the processing module can convert the voltage input from the external electrical slot to the voltage required by the memory card.
本發明的有益效果可以在於:使用者可以利用轉接組件及記憶卡裝置,而使符合M.2(NGFF)介面規範的記憶卡,與用以提供符合M.3(NGSFF)介面規範的記憶卡插設的電連接槽插接電性連接,即,使用者利用轉接組件及記憶卡裝置,即可使提供符合M.3(NGSFF)介面規範的記憶卡插設的電連接槽,能電性連接符合 M.2(NGFF)介面規範的記憶卡,而可對M.2(NGFF)介面規範的記憶卡進行資料讀寫作業。 The beneficial effects of the present invention may be that the user can use the adapter assembly and the memory card device to make the memory card that complies with the M.2 (NGFF) interface specification, and to provide the memory that conforms to the M.3 (NGSFF) interface specification. The electrical connection slot for card insertion is used for electrical connection, that is, the user can use the adapter component and the memory card device to provide the electrical connection slot for the memory card insertion that conforms to the M.3 (NGSFF) interface specification. Electrical connection M.2 (NGFF) interface standard memory card, and M.2 (NGFF) interface standard memory card can read and write data.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, but the drawings are provided for reference and explanation only, and are not intended to limit the present invention.
S‧‧‧記憶卡裝置 S‧‧‧Memory card device
1‧‧‧轉接組件 1‧‧‧ adapter kit
10‧‧‧殼體 10‧‧‧shell
10a‧‧‧開口 10a‧‧‧ opening
101‧‧‧容置槽 101‧‧‧Receiving slot
102‧‧‧露出口 102‧‧‧Lu exports
11‧‧‧電路板 11‧‧‧Circuit Board
111‧‧‧供電電路 111‧‧‧Power supply circuit
112‧‧‧斷電控制電路 112‧‧‧ Power-off control circuit
12‧‧‧電連接插槽 12‧‧‧ Electrical connection slot
121‧‧‧第一腳位 121‧‧‧ first foot
122‧‧‧第二腳位 122‧‧‧ second foot
13‧‧‧電插接結構 13‧‧‧ Electric plug structure
131‧‧‧第一偵測腳位 131‧‧‧first detection pin
132‧‧‧第二偵測腳位 132‧‧‧Second detection pin
14‧‧‧處理模組 14‧‧‧Processing Module
141‧‧‧電壓轉換單元 141‧‧‧Voltage Conversion Unit
142‧‧‧熱插拔單元 142‧‧‧Hot Swap Unit
2‧‧‧記憶卡 2‧‧‧memory card
M1‧‧‧外部電路板 M1‧‧‧External circuit board
M2‧‧‧外部電插槽 M2‧‧‧ External electrical slot
M3‧‧‧熱插拔電路 M3‧‧‧Hot Swap Circuit
圖1為本發明的轉接組件的示意圖;亦為本發明的記憶卡裝置的分解示意圖。 FIG. 1 is a schematic diagram of an adapter assembly of the present invention; and it is an exploded schematic diagram of a memory card device of the present invention.
圖2為本發明的轉接組件與符合M.2介面規範的記憶卡相互插接的示意圖;亦為本發明的記憶卡裝置的組裝示意圖。 FIG. 2 is a schematic diagram of the plug-in module of the present invention and a memory card complying with the M.2 interface specification, and also a schematic diagram of the assembly of the memory card device of the present invention.
圖3為本發明的轉接組件與符合M.2介面規範的記憶卡相互插接的另一實施例的示意圖;亦為本發明的記憶卡裝置的另一實施例的組裝示意圖。 FIG. 3 is a schematic diagram of another embodiment of a plug-in module of the present invention and a memory card complying with the M.2 interface specification; and FIG.
圖4為本發明的轉接組件的又一實施例的示意圖;亦為本發明的記憶卡裝置的又一實施例的組裝示意圖。 FIG. 4 is a schematic diagram of another embodiment of the adapter assembly of the present invention; and it is an assembly schematic diagram of another embodiment of the memory card device of the present invention.
圖5為本發明的轉接組件的方塊示意圖;亦為本發明的記憶卡裝置的方塊示意圖。 FIG. 5 is a block diagram of the adapter assembly of the present invention; and it is a block diagram of the memory card device of the present invention.
圖6為本發明的轉接組件的另一實施例的方塊示意圖;亦為本發明的記憶卡裝置的另一實施例的方塊示意圖。 FIG. 6 is a schematic block diagram of another embodiment of the adapter assembly of the present invention; and FIG. 6 is a schematic block diagram of another embodiment of the memory card device of the present invention.
圖7為本發明的轉接組件插設於外部電路板的外部電插槽的局部電路連接示意圖。 FIG. 7 is a schematic diagram of a partial circuit connection of the adapter assembly of the present invention inserted in an external electrical slot of an external circuit board.
以下係藉由特定的具體實例說明本發明之轉接組件及記憶卡裝置的實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明之精神下進行各種修飾與變更。又本發明之圖式僅為簡單說明,並非依實際尺寸描繪,亦即未反 應出相關構成之實際尺寸,先予敘明。以下之實施方式係進一步詳細說明本發明之觀點,但並非以任何觀點限制本發明之範疇。 The following is a description of the implementation of the adapter component and the memory card device of the present invention with specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. The drawings of the present invention are only for simple description, and are not drawn according to actual dimensions, that is, they are not reflected. The actual dimensions of the relevant components shall be given and stated first. The following embodiments describe the viewpoints of the present invention in more detail, but do not limit the scope of the present invention in any way.
請一併參閱圖1及圖2,其為本發明的轉接組件的示意圖。如圖所示,轉接組件1包含有一殼體10、一電路板11、一電連接插槽12、一電插接結構13及一處理模組14。殼體10的一端形成有一開口10a。電路板11固定設置於殼體10中,電路板11上設置有電連接插槽12、電插接結構13及處理模組14。設置於電路板11上的電連接插槽12是對應露出於殼體10的開口10a,而相關記憶卡則能通過開口10a而插接於電連接插槽12中。殼體10形成有開口10a的一端還可以是對應內凹形成有一容置槽101。 Please refer to FIG. 1 and FIG. 2 together, which are schematic diagrams of the adapter assembly of the present invention. As shown in the figure, the adapter assembly 1 includes a housing 10, a circuit board 11, an electrical connection slot 12, an electrical plug structure 13 and a processing module 14. An opening 10 a is formed at one end of the casing 10. The circuit board 11 is fixedly disposed in the casing 10. The circuit board 11 is provided with an electrical connection slot 12, an electrical plug-in structure 13, and a processing module 14. The electrical connection slot 12 provided on the circuit board 11 corresponds to the opening 10a exposed from the casing 10, and the related memory card can be inserted into the electrical connection slot 12 through the opening 10a. An end of the casing 10 formed with the opening 10 a may also be formed with an accommodation groove 101 corresponding to the indentation.
電連接插槽12及電插接結構13可以設置於電路板11彼此相反的兩端,但不以此為限,在不同的實施例中,電連接插槽12及電插接結構13也可以是設置於電路板11彼此相連的兩側。電連接插槽12用以提供符合M.2(NGFF)介面規範的記憶卡2插設,電連接插槽12的型式可以是依據需求,為B Key型式、M Key型式或B+M Key型式等,於此不加以限制。另外,電連接插槽12還可以是具有限位(防呆)結構,以限制符合M.2介面規範的記憶卡2僅能以特定的方式,插設於電連接插槽12中。其中,M.2(NGFF)介面規範即為英特爾(Intel)公司所制訂的相關規格(例如包含電氣層及硬體層等相關規格)。 The electrical connection slot 12 and the electrical plug structure 13 may be disposed at opposite ends of the circuit board 11, but are not limited thereto. In different embodiments, the electrical connection slot 12 and the electrical plug structure 13 may also be provided. It is disposed on two sides of the circuit board 11 connected to each other. Electrical connection slot 12 is used to provide M.2 (NGFF) interface memory card 2 insertion. The type of electrical connection slot 12 can be B Key type, M Key type, or B + M Key type according to requirements. Etc. are not limited here. In addition, the electrical connection slot 12 may also have a limiting (foolproof) structure to restrict the memory card 2 that complies with the M.2 interface specification to be inserted into the electrical connection slot 12 only in a specific manner. Among them, the M.2 (NGFF) interface specification is a relevant specification (for example, including electrical layer and hardware layer specifications) formulated by Intel Corporation.
在實際實施中,形成容置槽101的側壁,將可導引符合M.2介面規範的記憶卡2正確地與電連接插槽12相互插接。如圖2所示,符合M.2介面規範的記憶卡2與電連接插槽12相互插接時,符合M.2介面規範的記憶卡2的部份可以是對應外露於轉接組件1外,但不以此為限。如圖3所示,在不同的實施例中,容置槽101的深度可以大致與符合M.2介面規範的記憶卡2長度相同,而符合M.2介面規範的記憶卡2與電連接插槽12相互插接時,符合M.2介面規範的記憶卡2的整體將對應被容置於容置槽101 中。另外,在圖3所示的實施態樣中,殼體10可以是具有使容置槽101與外連通的露出口102,該露出口102可以是與開口10a相互連通,而使用者將符合M.2介面規範的記憶卡2設置於容置槽101中時,將可以透過露出口102觀看符合M.2介面規範的記憶卡2所標示的相關資訊。當然,在不同的應用中,殼體10也可以是不具有露出口102,而僅具有容置槽101。在另一實施例中,殼體10的一端也可是僅具有開口10a,而電連接插槽12則大致鄰近於開口10a設置。 In actual implementation, the side wall of the receiving groove 101 is formed to correctly guide the memory card 2 complying with the M.2 interface specification to be correctly inserted into the electrical connection slot 12. As shown in FIG. 2, when the memory card 2 that complies with the M.2 interface specification and the electrical connection slot 12 are plugged into each other, a part of the memory card 2 that complies with the M.2 interface specification may be correspondingly exposed outside the adapter component 1. , But not limited to this. As shown in FIG. 3, in different embodiments, the depth of the accommodating slot 101 may be substantially the same as the length of the memory card 2 conforming to the M.2 interface specification, and the memory card 2 conforming to the M.2 interface specification and the electrical connection plug When the slots 12 are plugged into each other, the entire memory card 2 conforming to the M.2 interface specification will be correspondingly accommodated in the receiving slot 101 in. In addition, in the embodiment shown in FIG. 3, the casing 10 may have a dew outlet 102 that communicates the accommodation groove 101 with the outside, and the dew outlet 102 may communicate with the opening 10a, and the user will comply with M .2 When the memory card 2 with the interface specification is set in the accommodation slot 101, the relevant information marked by the memory card 2 that conforms to the M.2 interface specification can be viewed through the exposure opening 102. Of course, in different applications, the housing 10 may not have the exposure opening 102 but only the receiving groove 101. In another embodiment, one end of the housing 10 may have only the opening 10a, and the electrical connection slot 12 is disposed substantially adjacent to the opening 10a.
電插接結構13的至少一部份外露於殼體10,且外露於殼體10的電插接結構13對應位於殼體10相反於形成有開口10a的一端。在實際應用中,電插接結構13可以是與電路板11一體成型地設置,但不以此為限。電插接結構13的形式可以是依據需求為B Key型式、M Key型式等,於此不加以限制。電插接結構13能插設於用以提供符合M.3(NGSFF)介面規範的記憶卡插設的一外部電插槽(例如是固定設置於電腦主板中或是伺服器主板中)。其中,M.3介面規範即為三星電子(Samsung)公司所制訂的相關規格。 At least a part of the electrical plug structure 13 is exposed from the casing 10, and the electrical plug structure 13 exposed from the casing 10 is correspondingly located at an end of the casing 10 opposite to the opening 10 a. In practical applications, the electrical plug structure 13 may be provided integrally with the circuit board 11, but is not limited thereto. The form of the electrical plug structure 13 may be a B Key type, an M Key type, etc. according to the requirements, and is not limited herein. The electrical plug structure 13 can be inserted into an external electrical slot (for example, fixedly installed in a computer motherboard or a server motherboard) for providing a memory card insertion conforming to the M.3 (NGSFF) interface specification. Among them, the M.3 interface specification is a relevant specification made by Samsung Electronics.
處理模組14設置於電路板11,處理模組14電性連接電連接插槽12的各腳位及電插接結構13的各腳位,而處理模組14用以處理及傳遞來自外部電插槽所傳遞的訊號至插設於電連接插槽12的符合M.2介面規範的記憶卡。在具體實施中,處理模組14可以是微處理器。 The processing module 14 is disposed on the circuit board 11. The processing module 14 is electrically connected to the pins of the electrical connection slot 12 and the pins of the electrical plug structure 13, and the processing module 14 is used to process and transmit external power. The signal transmitted from the slot is to a memory card that meets the M.2 interface specification and is inserted in the electrical connection slot 12. In a specific implementation, the processing module 14 may be a microprocessor.
當符合M.2介面規範的記憶卡2插接於所述電連接插槽12,且電插接結構13插設於外部電插槽時,處理模組14能將外部電插槽輸入的電壓轉換至符合M.2介面規範的記憶卡所需的電壓。具體來說,外部電插接槽所輸入的電壓為12伏特,而處理模組14能將其轉換為3.3伏特,以供符合M.2介面規範的記憶卡使用。 When the memory card 2 complying with the M.2 interface specification is inserted into the electrical connection slot 12 and the electrical connection structure 13 is inserted into the external electrical slot, the processing module 14 can input the voltage input from the external electrical slot. Voltage required to switch to a M.2 interface-compliant memory card. Specifically, the input voltage of the external electrical socket is 12 volts, and the processing module 14 can convert it to 3.3 volts for use by a memory card that conforms to the M.2 interface specification.
特別說明的是,本發明的轉接組件1的殼體10所具有的開口10a及容置槽101的形式,可依據需求設計,不侷限於圖2及圖3 所示的型態。舉例來說,如圖4所示,在不同的應用中,殼體10的容置槽101可以是與外連通,且容置槽101的寬度可以是略大於符合M.2介面規範的記憶卡2的寬度,殼體10於開口10a的兩側還可以是對應設置有相關的卡扣結構(例如彈片、彈性凸點、凸點等)。當使用者欲將符合M.2介面規範的記憶卡2與殼體10中的電連接插槽12相互插接前,使用者可以是先將符合M.2介面規範的記憶卡2的部份壓入容置槽101中,此時,設置於容置槽101中的相關卡扣結構,將可使符合M.2介面規範的記憶卡2穩定地設置於容置槽101中,而後使用者可再將已位於容置槽101中的符合M.2介面規範的記憶卡2向電連接插槽12方向推抵,據以使符合M.2介面規範的記憶卡2與電連接插槽12相互電性插接。在另一容置槽101與外連通的實施例中,殼體10還可以是具有可活動地的一蓋體,其可被操作而選擇性地遮蔽容置槽101,據以限制已設置於容置槽101中的符合M.2介面規範的記憶卡2。 In particular, the form of the opening 10a and the receiving groove 101 of the housing 10 of the adapter assembly 1 of the present invention can be designed according to requirements, and is not limited to FIG. 2 and FIG. 3. The pattern shown. For example, as shown in FIG. 4, in different applications, the receiving slot 101 of the housing 10 may communicate with the outside, and the width of the receiving slot 101 may be slightly larger than the memory card that complies with the M.2 interface specification. The width of the housing 10 may be two sides of the housing 10 on the opening 10a, and corresponding buckle structures (such as elastic pieces, elastic bumps, bumps, etc.) may be provided correspondingly. Before the user wants to plug the memory card 2 that complies with the M.2 interface specification and the electrical connection slot 12 in the housing 10, the user may first part of the memory card 2 that complies with the M.2 interface specification. Press into the receiving slot 101. At this time, the relevant buckle structure provided in the receiving slot 101 will allow the memory card 2 that conforms to the M.2 interface specification to be stably set in the receiving slot 101, and then the user The memory card 2 that conforms to the M.2 interface specification, which is already located in the accommodation slot 101, can be pushed toward the electrical connection slot 12, so that the memory card 2 and the electrical connection slot 12 that conform to the M.2 interface specification can be pushed. Electrically plugged into each other. In another embodiment in which the receiving groove 101 communicates with the outside, the housing 10 may also have a cover that can be movably operable to selectively cover the receiving groove 101 to restrict the installation of the receiving groove 101. The memory card 2 in the receiving slot 101 conforms to the M.2 interface specification.
請一併參閱圖5及圖6,其為本發明的轉接組件1的方塊示意圖。如圖所示,處理模組14可以包含有一電壓轉換單元141、一熱插拔單元142,電路板11還設置有一供電電路111及一斷電控制電路112。電壓轉換單元141用以將電連接插槽12所輸入的電壓,轉換為符合M.2介面規範的記憶卡所需的電壓。熱插拔單元142電性連接電插接結構13,熱插拔單元142能確保轉接組件1與通電的外部電插槽相互插接時,轉接組件1能正常工作,且熱插拔單元142亦能確保轉接組件1在與外部電插槽電性連接的情況下被拔除時,插設於轉接組件1上符合M.2介面規範的記憶卡2不受影響。也就是說,熱插拔單元142能避免符合M.2介面規範的記憶卡2,在轉接組件1突然地被拔離通電的外部電插槽時,受到突波、過電壓或是過電流等影響,且熱插拔單元142能讓使用者在外部電插槽通電時,直接使電插接結構13插接於外部電插槽,而轉接組件1能直接工作。在實際應用中,熱插拔單元142 可以是包含有電子熔絲(eFuse)的電路保護器,但不以此為限;電壓轉換單元141則可以是降壓變換器(Buck Converter)。 Please refer to FIG. 5 and FIG. 6 together, which are schematic block diagrams of the adapter assembly 1 of the present invention. As shown in the figure, the processing module 14 may include a voltage conversion unit 141 and a hot-swap unit 142. The circuit board 11 is further provided with a power supply circuit 111 and a power-off control circuit 112. The voltage conversion unit 141 is used to convert the voltage input from the electrical connection slot 12 into a voltage required by a memory card that complies with the M.2 interface specification. The hot-swap unit 142 is electrically connected to the electrical plug structure 13. The hot-swap unit 142 can ensure that the transfer module 1 can work normally when the transfer module 1 and a powered external electrical slot are connected to each other, and the hot-swap unit 142 can also ensure that when the adapter assembly 1 is removed while being electrically connected to an external electrical slot, the memory card 2 inserted in the adapter assembly 1 and complying with the M.2 interface specification is not affected. In other words, the hot-swap unit 142 can prevent the memory card 2 that conforms to the M.2 interface specification from being subjected to surges, overvoltages, or overcurrents when the adapter assembly 1 is suddenly pulled out of a powered external electrical slot. And other effects, and the hot-swap unit 142 allows the user to directly connect the electrical plug-in structure 13 to the external electrical slot when the external electrical slot is powered on, and the adapter component 1 can work directly. In practical applications, the hot-swap unit 142 The circuit protector may include an electronic fuse (eFuse), but is not limited thereto. The voltage conversion unit 141 may be a buck converter.
供電電路111可以是電性連接電插接結構13(如圖2所示)的供電腳位。斷電控制電路112電性連接電插接結構13(如圖2所示)的斷電指示腳位(Power Disable Feature,PWDIS),而使用者可以透過斷電控制電路112以切斷插接於電連接插槽12上符合M.2介面規範的記憶卡2的電力,或者使插接於電連接插槽12上符合M.2介面規範的記憶卡2進入睡眠狀態。 The power supply circuit 111 may be a power supply pin that is electrically connected to the electrical plug structure 13 (as shown in FIG. 2). The power-off control circuit 112 is electrically connected to a power-disable feature (PWDIS) of the electrical plug structure 13 (as shown in FIG. 2), and the user can cut off the plug-in through the power-off control circuit 112. The power of the memory card 2 that complies with the M.2 interface specification on the electrical connection slot 12 or puts the memory card 2 that meets the M.2 interface specification on the electrical connection slot 12 into a sleep state.
在實際應用中,電壓轉換單元141、熱插拔單元142、供電電路111及斷電控制電路112的彼此間的電性連接方式,可以是依據需求設計。舉例來說,如圖5所示,電壓轉換單元141可以是電性連接供電電路111、斷電控制電路112及熱插拔單元142,而熱插拔單元142可以是電性連接及電連接插槽12,而插設於電連接插槽12中符合M.2介面規範的記憶卡2所需的電力則是來自於熱插拔單元142提供;如圖6所示,在另一實施例中,熱插拔單元142電性連接供電電路111及斷電控制電路112;電壓轉換單元141電性連接熱插拔單元142及電連接插槽12,而插設於電連接插槽12中符合M.2介面規範的記憶卡2所需的電力則是來自於電壓轉換單元141提供。透過如圖5及圖6所示的電性連接方式,當斷電控制電路112切斷插接於電連接插槽12上符合M.2介面規範的記憶卡2的電力,或者使插接於電連接插槽12上符合M.2介面規範的記憶卡2進入睡眠狀態時,熱插拔單元142及電壓轉換單元141的電力將同時被切斷,而可達到省電的效果。 In practical applications, the electrical connection modes of the voltage conversion unit 141, the hot-swap unit 142, the power supply circuit 111, and the power-off control circuit 112 can be designed according to requirements. For example, as shown in FIG. 5, the voltage conversion unit 141 may be electrically connected to the power supply circuit 111, the power-off control circuit 112, and the hot-pluggable unit 142, and the hot-pluggable unit 142 may be electrically connected and electrically connected. Slot 12, and the power required by the M.2 interface-compliant memory card 2 inserted in the electrical connection slot 12 is provided by the hot-swap unit 142; as shown in FIG. 6, in another embodiment The hot-swap unit 142 is electrically connected to the power supply circuit 111 and the power-off control circuit 112; the voltage conversion unit 141 is electrically connected to the hot-swap unit 142 and the electrical connection slot 12, and is inserted in the electrical connection slot 12 in accordance with M .2 The power required for the memory card 2 with interface specifications is provided by the voltage conversion unit 141. Through the electrical connection method as shown in FIG. 5 and FIG. 6, when the power-off control circuit 112 cuts off the power of the memory card 2 inserted in the electrical connection slot 12 and conforms to the M.2 interface specification, or makes it plugged in When the memory card 2 complying with the M.2 interface specification on the electrical connection slot 12 enters the sleep state, the power of the hot-swap unit 142 and the voltage conversion unit 141 will be cut off at the same time, thereby achieving the effect of saving power.
請復參圖1至圖3,其為本發明的記憶卡裝置S的示意圖。如圖所示,記憶卡裝置S包含有一記憶卡2及一轉接組件1。轉接組件1包含有一殼體10、一電路板11、一電連接插槽12、一電插接結構13及一處理模組14。記憶卡2為符合M.2介面規範的記憶卡。關於轉接組件1的詳細說明,與前述實施例相同,於此不再 贅述。 Please refer to FIGS. 1 to 3 again, which are schematic diagrams of the memory card device S of the present invention. As shown in the figure, the memory card device S includes a memory card 2 and a transfer module 1. The transfer module 1 includes a housing 10, a circuit board 11, an electrical connection slot 12, an electrical plug structure 13 and a processing module 14. Memory card 2 is a memory card that complies with M.2 interface specifications. The detailed description of the adapter assembly 1 is the same as the foregoing embodiment, and is not repeated here. To repeat.
特別說明的是,上述符合M.2介面規範的記憶卡在實際應用中,可以依據需求選擇所需的通訊介面(例如PCIe、SATA),上述符合M.2介面規範的記憶卡2及電連接插槽12不侷限特定的通訊介面。 In particular, in the practical application, the above-mentioned memory card that complies with the M.2 interface specification can be selected according to the needs of the required communication interface (such as PCIe, SATA). The above-mentioned memory card 2 that complies with the M.2 interface specification and electrical connection The slot 12 is not limited to a specific communication interface.
請參閱圖7,其顯示為本發明的轉接組件的另一實施例的電路連接示意圖。如圖所示,轉接組件1的電插接結構13包含有多個腳位(圖未示),其中兩個腳位分別定義為一第一偵測腳位131及一第二偵測腳位132。其中,轉接組件1在未設置有符合M.2介面規範的記憶卡2的狀態下,插接於一外部電路板M1的符合M.3介面規範的一外部電插槽M2時,第一偵測腳位131及第二偵測腳位132將呈現為斷路狀態。符合M.2介面規範的記憶卡2插設於電連接插槽12時,第一偵測腳位131與第二偵測腳位132對應與符合M.2介面規範的記憶卡2的一第一腳位121及一第二腳位122相互電性連接;其中,符合M.2介面規範的記憶卡2的第一腳位121及第二腳位122是彼此相互電性連接。 Please refer to FIG. 7, which is a schematic diagram showing a circuit connection of another embodiment of the adapter assembly of the present invention. As shown in the figure, the electrical plug structure 13 of the adapter assembly 1 includes a plurality of pins (not shown), wherein the two pins are respectively defined as a first detection pin 131 and a second detection pin Bit 132. Wherein, the adapter assembly 1 is inserted into an external electrical slot M2 of an external circuit board M1 that conforms to the M.3 interface specification in a state where the memory card 2 that conforms to the M.2 interface specification is not provided. The detection pin 131 and the second detection pin 132 will be in an open state. When the memory card 2 complying with the M.2 interface specification is inserted in the electrical connection slot 12, the first detecting pin 131 and the second detecting pin 132 correspond to the first one of the memory card 2 complying with the M.2 interface specification. A pin 121 and a second pin 122 are electrically connected to each other. Among them, the first pin 121 and the second pin 122 of the memory card 2 complying with the M.2 interface specification are electrically connected to each other.
當轉接組件1的電連接插槽12插設有符合M.2介面規範的記憶卡2,且轉接組件1插設於外部電路板M1的符合M.3介面規範的外部電插槽M2時,外部電路板M1的一熱插拔電路M3,將與第一偵測腳位131、第一腳位121、第二腳位122及第二偵測腳位132共同形成一偵測迴路。換言之,轉接組件1插接於外部電路板M1的外部電插槽M2時,第一偵測腳位131及第二偵測腳位132能透過符合M.2介面規範的記憶卡2彼此相互電性連接,即,第一偵測腳位131及第二偵測腳位132能對應呈現為相互導通的狀態。 When the electrical connection slot 12 of the adapter component 1 is inserted with a memory card 2 that conforms to the M.2 interface specification, and the adapter component 1 is inserted into the external electrical slot M2 that conforms to the M.3 interface specification of the external circuit board M1 At this time, a hot-swap circuit M3 of the external circuit board M1 will form a detection loop together with the first detection pin 131, the first pin 121, the second pin 122, and the second detection pin 132. In other words, when the adapter assembly 1 is inserted into the external electrical slot M2 of the external circuit board M1, the first detection pin 131 and the second detection pin 132 can communicate with each other through the memory card 2 that complies with the M.2 interface specification. The electrical connection, that is, the first detection pin 131 and the second detection pin 132 can be in a mutually conductive state correspondingly.
當轉接組件1插接於外部電路板M1的外部電插槽M2,且符合M.2介面規範的記憶卡2突然被拔離轉接組件1的電連接插槽12時,第一偵測腳位131與第二偵測腳位132將由導通狀態轉換 為斷路狀態。此時,外部電路板M1的相關處理器,將可據以得知符合M.2介面規範的記憶卡2已被拔離所述轉接組件1,而處理器將可對應執行相對應的動作。 The first detection is when the adapter component 1 is plugged into the external electrical slot M2 of the external circuit board M1, and the memory card 2 complying with the M.2 interface specification is suddenly removed from the electrical connection slot 12 of the adapter component 1. Pin 131 and second detection pin 132 will be switched from on-state It is open circuit. At this time, the relevant processor of the external circuit board M1 will know that the memory card 2 that complies with the M.2 interface specification has been removed from the adapter component 1, and the processor can perform the corresponding actions accordingly. .
相對地,當插接有符合M.2介面規範的記憶卡2的轉接組件1,突然被拔離外部電路板M1的外部電插槽M2時,所述偵測迴路將由導通狀態轉換為斷路狀態,此時,外部電路板M1的處理器將可據以得知轉接組件1已被拔離外部電路板M1,外部電路板M1的處理器則可據以執行相對應的動作。 In contrast, when the adapter component 1 of the memory card 2 that conforms to the M.2 interface specification is plugged in and suddenly disconnected from the external electrical slot M2 of the external circuit board M1, the detection circuit will be switched from a conductive state to an open circuit At this time, the processor of the external circuit board M1 can know that the adapter component 1 has been removed from the external circuit board M1, and the processor of the external circuit board M1 can perform corresponding actions accordingly.
如下表所示,其顯示為本發明的轉接組件1的電插接結構13的具體腳位定義。其中,表中所示第67位腳位(PRSNT1#)及第6位腳位(PRSNT2#),即為前述實施例所述第一偵測腳位131及第二偵測腳位132。 As shown in the following table, it shows the specific pin definitions of the electrical plug structure 13 of the adapter assembly 1 of the present invention. The 67th pin (PRSNT1 #) and the 6th pin (PRSNT2 #) shown in the table are the first detection pin 131 and the second detection pin 132 described in the foregoing embodiment.
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above are only the preferred and feasible embodiments of the present invention, and therefore do not limit the patent scope of the present invention. Therefore, any equivalent technical changes made using the description and drawings of the present invention are included in the protection scope of the present invention. .
Claims (10)
Priority Applications (2)
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TW107109070A TWI694335B (en) | 2018-03-16 | 2018-03-16 | Memory card adaptor and memory device |
CN201810251603.7A CN110277675B (en) | 2018-03-16 | 2018-03-26 | Switching assembly and memory card device |
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TW107109070A TWI694335B (en) | 2018-03-16 | 2018-03-16 | Memory card adaptor and memory device |
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TWI801972B (en) * | 2021-08-18 | 2023-05-11 | 神雲科技股份有限公司 | Generic interface card |
CN113886309A (en) * | 2021-10-13 | 2022-01-04 | 北京世宁达科技有限公司 | PCIE module with hot plug structure and chassis |
CN114421246B (en) * | 2022-02-22 | 2024-04-09 | 深圳市康睿优医疗器械有限公司 | Adapter structure for converting solid state disk of M.2 interface into compatible CFexpress B type memory card |
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TW579025U (en) * | 2002-05-23 | 2004-03-01 | Wistron Corp | PDA and memory card adapter of PDA |
TWI243995B (en) * | 2002-10-04 | 2005-11-21 | Onspec Electronic Inc | Multimode controller for intelligent and ""dumb"" flash cards |
US7367503B2 (en) * | 2002-11-13 | 2008-05-06 | Sandisk Corporation | Universal non-volatile memory card used with various different standard cards containing a memory controller |
TWI222009B (en) * | 2003-03-21 | 2004-10-11 | Carry Computer Eng Co Ltd | Universal micro memory card |
TWI221346B (en) * | 2003-09-19 | 2004-09-21 | Datafab Sys Inc | Electrical connector suitable for plural types of electronic cards and electronic device using the same |
TWI244607B (en) * | 2004-08-27 | 2005-12-01 | Incomm Technologies Co Ltd | Multi-interface auto-switching circuit and memory device having the same |
TW200830189A (en) * | 2007-01-08 | 2008-07-16 | Alcor Micro Corp | Expresscard device |
CN101355217A (en) * | 2007-07-25 | 2009-01-28 | 恩悠数位股份有限公司 | Multifunctional switching device |
KR20100012993U (en) * | 2009-06-23 | 2010-12-31 | (주)허브로 | iGender |
CN201590584U (en) * | 2010-02-05 | 2010-09-22 | 深圳市普联技术有限公司 | Switching device |
TWM450884U (en) * | 2012-10-11 | 2013-04-11 | Carry Technology Co Ltd | Memory card adapter device |
CN202997252U (en) * | 2012-12-25 | 2013-06-12 | 蒋一博 | Data interface converter |
WO2016122476A1 (en) * | 2015-01-28 | 2016-08-04 | Hewlett-Packard Development Company, L.P. | Interposer device |
TWI573337B (en) * | 2015-12-17 | 2017-03-01 | 宜鼎國際股份有限公司 | M.2 interface memory device and m.2 interface connection seat insertedly provided thereof |
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