TW201937638A - Substrate processing apparatus and substrate processing method using the same - Google Patents

Abstract

Disclosed is a substrate processing apparatus that comprises an equipment front end module, a process chamber that processes a substrate, a transfer chamber having a transfer robot that transfers the substrate into or out of the process chamber, and a buffer unit located between the transfer chamber and the equipment front end module and having an edge clamp support member that supports an edge clamp that is located at an edge of the substrate and moved into the process chamber together with the substrate.

Description

Substrate processing equipment and substrate processing method using the substrate processing equipment

Embodiments of the inventive concepts described herein relate to a substrate processing apparatus and a substrate processing method using the substrate processing apparatus.

In general, various processes such as etching, ashing, deposition, cleaning, etc. for processing a substrate using a plasma are required to manufacture semiconductor elements, display panels, and the like.

The substrate can be bent or twisted in a general process. The phenomenon in which the substrate is bent or twisted is called substrate wrapping. The warpage of the substrate may occur when the substrate shrinks unevenly after the substrate is expanded in response to high-temperature heating in the process or the substrate is thin.

If the warped substrate is processed in a bent or twisted state, a gap may exist between the substrate and the base, and a local plasma may be generated in the gap. As illustrated in FIGS. 1 and 2, for the etching rate, Etching uniformity and the like have adverse effects.

Embodiments of the inventive concept provide a substrate processing apparatus and method for preventing a substrate from being processed in a warped state.

According to one aspect of an embodiment, a substrate processing apparatus includes a front-end module; a process chamber that processes a substrate; a transfer chamber that has a transfer robot that transfers the substrate to the process chamber or Conveying out of the process chamber; and a buffer unit positioned between the conveying chamber and the equipment front-end module and having an edge holder support member that supports the edge holder, the An edge holder is positioned at an edge of the substrate and is moved into the process chamber together with the substrate.

The edge holder supported by the edge holder supporting member may be positioned at a higher position than a position where the substrate is received in the buffer unit.

The edge holder received in the buffer unit can be selectively moved up or down from a preset reference position.

According to another aspect of an embodiment, an apparatus for processing a substrate includes a front-end module and a processing module, and the processing module processes the substrate. The equipment front-end module includes a loading port, and a container having the substrate inside is placed on the loading port; and a transfer frame having an index robot (index robot), the indexing robot transfers the substrate between the loading port and the processing module. The processing module includes a clamping buffer, which is disposed adjacent to the front-end module of the equipment; a processing chamber, which processes the substrate; and a transfer chamber, which has a transfer robot, and the transfer robot is in the process chamber and the The substrate is transferred between the clamping buffers. The clamp buffer includes a substrate support member that supports the substrate; and an edge holder support member that has a support end that supports an edge holder that is positioned on a top side of the substrate. It is transferred to the process chamber at the edge and with the substrate.

The supporting end may be positioned at a second position higher than the first position, at which the substrate is supported on the substrate supporting member.

The support end is movable between the second position and a third position higher than the second position.

The clamping buffer may further include a detection sensor that detects whether the substrate on the substrate supporting member is present.

The clamping buffer may further include an actuator that moves a supporting end of the clamping buffer between a second position and a third position, the second position being higher than supporting the substrate on the substrate supporting member The third position is higher than the second position.

The device may further have a controller, and the controller may control the actuator to position the support end on the basis of the information detected by the detection sensor on the substrate supporting member that is substantially absent. At the third position, and based on information detected by the detection sensor about the substantially existing on the substrate support member, controlling the actuator to position the support end at the second position .

The process chamber may include a base and a guide ring, the substrate is placed on the base, and the guide ring surrounds the base and has a protrusion, the protrusion further protrudes upward beyond the top side of the base and Has an inclined side surface facing the substrate. The edge holder may have an inclined portion corresponding to a slope of the protruding portion.

The process chamber may further include a detection sensor that detects the edge holder, and the edge holder further protrudes beyond a boundary preset value of the guide ring or more.

The device may further include a controller.

When the detection sensor detects that the edge holder further protrudes beyond the boundary of the guide ring by the preset value or more, the controller may stop operating the device or may activate an alarm.

The plurality of clamping buffers may be configured to form a clamping buffer unit.

The processing module may further include a passing buffer disposed between the equipment front-end module and the transfer chamber parallel to the holding buffer.

The plurality of pass buffers may be configured to form a pass buffer unit.

The holding buffer and the passing buffer may be stacked vertically to form a buffer unit.

According to another aspect of an embodiment, an apparatus for processing a substrate includes a front-end module and a processing module, and the processing module processes the substrate. The equipment front-end module includes a loading port, and a container having the substrate inside is placed on the loading port; and a transfer frame having an indexing robot that transfers the substrate between the loading port and the processing module. The processing module may include a clamping buffer unit, which is disposed adjacent to the front-end module of the equipment; a processing chamber, which processes the substrate; and a transfer chamber, which has a transfer robot, and the transfer robot has a Two hands transfer the substrate between the process chamber and the clamping buffer unit. The grip buffer unit may include two grip buffers arranged side by side. Each of the clamping buffers may include a substrate support member that supports the substrate; and an edge holder support member that includes a support end that supports the edge holder, the edge holder being positioned at An edge on the top side of the substrate is transferred to the process chamber together with the substrate.

The holding buffer may further include an actuator that moves the supporting end of the holding buffer between a second position and a third position, and the second position in the flag is higher than supporting the substrate at the The first position on the substrate supporting member, and the third position is higher than the second position.

The clamping buffer may further include a detection sensor that detects whether the substrate is present on the substrate supporting member, and the device may further include a controller. The controller may control the actuator to position the edge holder at the third position based on information detected by the detection sensor about the substrate not being present on the substrate supporting member, and The actuator may be controlled to position the edge holder at the second position based on information detected by the detection sensor about the substrate being present on the substrate supporting member.

The processing module may further include a passing buffer unit which is vertically stacked on the holding buffer unit between the equipment front-end module and the transfer chamber and includes a plurality of passing buffers.

According to another aspect of an embodiment, a method for processing a substrate by using the substrate processing apparatus includes positioning the edge holder on the supporting end of the holding buffer; transferring the substrate to be processed Into the holding buffer; and transferring the edge holder and the substrate from the holding buffer to the process chamber.

The clamping buffer may further include a detection sensor that detects whether the substrate is present on the substrate supporting member, and the method may further include detecting whether the substrate has the clamping buffer. On the substrate supporting member; based on the information detected by the detection sensor, controlling the actuator to position the edge holder at a specific position; by both hands of the transfer robot, Entry in a holding buffer; and picking up the substrate in the holding buffer by the transfer robot and transferring the substrate to the process chamber.

According to another aspect of an embodiment, a method for processing a substrate by using the substrate processing apparatus includes positioning the edge holder on the support end of the holding buffer, based on the information transmitted to the Loading the port and the information of the substrate to be processed, the controller controls the indexing robot to selectively transfer the substrate to the passing buffer or the holding buffer; detecting whether the substrate exists in the folder The substrate supporting member holding the buffer; based on the information detected by the detection sensor, the actuator is controlled by the controller; the selection is made to the selection by both hands of the transfer robot at the same time Through the buffer or the selected holding buffer; and the transfer robot picks up the substrate in the selected through buffer or the selected holding buffer and transfers the substrate to the process chamber Room.

According to an embodiment of the inventive concept, it is possible to reduce a loss caused by a warped substrate and efficiently process the substrate. In addition, it is possible to prevent damage to the substrate processing equipment.

1‧‧‧ substrate processing equipment

4‧‧‧ carrier

6‧‧‧ support

10‧‧‧ loading port

11‧‧‧ first direction

12‧‧‧ second direction

20‧‧‧ Equipped with front-end module

21‧‧‧Transmission Framework

25‧‧‧ Index Robot

27‧‧‧ transport track

30‧‧‧Processing Module

40‧‧‧Buffer unit

41‧‧‧Grip buffer

41a, 41b ‧‧‧ the first buffer area

42‧‧‧ through the buffer

42a, 42b‧‧‧‧Second buffer area

50‧‧‧ transfer chamber

53‧‧‧ Teleport Robot

53a, 53b‧‧‧hand

54‧‧‧Actuator

60‧‧‧Processing Chamber

70‧‧‧controller

110‧‧‧shell

110a‧‧‧First case

110a, 110b‧‧‧Second shell

112a, 114a, 112b, 114b‧‧‧channel

116a, 116b, 117a, 117b

130‧‧‧ substrate support member

140‧‧‧ Pusher

150、150’‧‧‧Edge holder support member

151‧‧‧ support end

152‧‧‧cylinder

160‧‧‧Edge holder

161‧‧‧ inclined surface

161’‧‧‧ receiving groove

162‧‧‧Assembly groove

162a‧‧‧inclined surface

171, 172‧‧‧first detection sensor

173‧‧‧Second detection sensor

171a, 172a, 173a ‧‧‧ laser beam

181‧‧‧Gas supply line

231‧‧‧lift pin

232‧‧‧Plate

2100‧‧‧ Chamber

2110‧‧‧Subject

2121‧‧‧ diffusion space

2200‧‧‧ base

2220‧‧‧Heating components

2210‧‧‧ Bias Power

2230‧‧‧Guide ring

2231‧‧‧ protrusion

2232‧‧‧ inclined surface

2233‧‧‧Assembly section

2300‧‧‧ Bezel

2310‧‧‧Distribution holes

2400‧‧‧ Plasma Excitation Module

2410‧‧‧Oscillator

2420‧‧‧Wave

2430‧‧‧Dielectric

2440‧‧‧Process Gas Supply Unit

2500‧‧‧Third detection sensor

2501‧‧‧ laser beam

A‧‧‧ details

W‧‧‧ substrate

d‧‧‧width

h1‧‧‧ first height

h2‧‧‧ second height

h3‧‧‧ third height

h4‧‧‧ height

S110 ~ S180‧‧‧step

The above and other objects and features will become apparent from the following description with reference to the following drawings, in which, unless otherwise specified, the same element symbols throughout the drawings represent the same parts, and among which: FIG. 1 and FIG. 2 are used for A view explaining a problem in the related art; FIG. 3 is a plan view of a substrate processing apparatus according to an embodiment of the inventive concept; FIG. 4 is a plan view of a transfer robot according to an embodiment of the inventive concept; A schematic plan view of a buffer unit according to an embodiment of the concept; FIG. 6 is a schematic side view illustrating the inside of a housing of a buffer unit according to an embodiment of the inventive concept; FIG. 7 is a view illustrating one of the concepts according to the inventive concept A side view of the operating state of the gripping buffer of the embodiment; FIG. 8 illustrates a case where the substrate is transferred from the equipped front-end module to the gripping buffer Fig. 9 illustrates a state in which the pusher corrects the position of the substrate and the transfer robot enters the holding buffer; Fig. 10 illustrates a state in which the substrate is picked up by the transfer robot and the edge holder is positioned on the substrate; Fig. 11 illustrates The substrate is transferred out of the buffer unit of FIG. 6; FIG. 12 is a schematic side view of the process chamber in which the substrate is positioned on the base; FIG. 13 is an enlargement of detail A in FIG. 12; FIG. 12 is an enlarged view of detail A in FIG. 12; FIG. 15 illustrates a state in which a substrate and an edge holder are mounted on a base; and FIG. 16 is a diagram of a vertical buffer holding buffer unit and a buffer unit passing through the buffer unit. Schematic side view of a buffer unit, wherein the clamping buffer unit includes a horizontally arranged clamping buffer and is contained by the buffer unit A horizontally disposed passing buffer; FIG. 17 is a view for explaining a problem in the case of a two-handed transfer robot; FIG. 18 is a flowchart illustrating a substrate processing method according to an embodiment of the inventive concept; FIG. 19 Illustrates a state in which a substrate is conveyed to one of the horizontally arranged holding buffers according to an embodiment of the inventive concept; FIG. 20 illustrates an upward movement of a supporting end of the holding buffer in which a substrate is not detected, and It is detected that the supporting end of the holding buffer with the substrate is maintained at the same position; FIG. 21 illustrates a state where the transfer robot enters the holding buffer unit of FIG. 19; and FIG. 22 illustrates where the edge holder is positioned at FIG. 23 illustrates a state on a substrate picked up by a transfer robot in a holding buffer unit of FIG. 20; FIG. 23 illustrates an edge holder supporting member according to another embodiment of the inventive concept; and FIG. 24 illustrates a substrate supporting member according to another embodiment of the inventive concept.

Hereinafter, embodiments of the inventive concept will be described in more detail with reference to accompanying drawings. However, the inventive concepts may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. The truth is that these embodiments are configured so that this disclosure will be thorough and complete, and convey the scope of inventive concepts to those skilled in the art. In the drawings, the dimensions of elements are exaggerated for clarity of illustration.

FIG. 3 is a schematic plan view of a substrate processing apparatus 1 according to an embodiment of the inventive concept.

Referring to FIG. 3, the substrate processing apparatus 1 may have an equipment front end module (EFEM) 20 and a processing module 30. The front-end module 20 and the processing module 30 can be arranged along one direction. Hereinafter, a direction in which the front-end module 20 and the processing module 30 are configured may be referred to as a first direction 11, and a direction perpendicular to the first direction 11 as viewed from above may be referred to as a second direction 12.

The equipment front-end module 20 may have a loading port 10 and a transmission frame 21. The loading port 10 may be disposed in front of the equipment front-end module 20 along the first direction 11. The loading port 10 may have a plurality of supports 6. The support 6 may be along the second direction 12 Arranged in rows, and on its top side may have carriers 4 (eg, boxes, FOUPs, or the like) that have substrates W to be processed and processed substrates W received therein. The carrier 4 may have a substrate W to be processed and a processed substrate W received therein. The transmission frame 21 may be disposed between the loading port 10 and the processing module 30. The inside of the transfer frame 21 may include an indexing robot 25 that transfers the substrate W between the loading port 10 and the processing module 30. The indexing robot 25 can move along the transport rail 27 arranged in the second direction 12 to transfer the substrate W between the carrier 4 and the processing module 30.

The processing module 30 may include a buffer unit 40, a transfer chamber 50, a plurality of process chambers 60, and a controller 70.

The buffer unit 40 may be disposed adjacent to the transfer frame 21. For example, the buffer unit 40 may be disposed between the transfer chamber 50 and the equipment front-end module 20. The buffer unit 40 may provide a space where the substrate W to be processed is in a standby state before being transferred to the process chamber 60 or a space where the processed substrate W is in a standby state before being transferred to the equipment front-end module 20.

The transfer chamber 50 may be disposed adjacent to the buffer unit 40. When viewed from above, the transfer chamber 50 may have a polygonal body. The buffer unit 40 and the plurality of process chambers 60 may be arranged around the main body. The main body may have a passage (not illustrated) in a side wall thereof through which the substrate W enters or exits the transfer chamber 50, and the passage may connect the transfer chamber 50 and the buffer unit 40. Or the process chamber 60 is connected. Doors (not illustrated) may be disposed at the respective passages to open / close the passages and hermetically seal the inside of the transfer chamber 50. A transfer robot 53 that transfers the substrate W between the buffer unit 40 and the process chamber 60 may be disposed in a space inside the transfer chamber 50. The transfer robot 53 may transfer the unprocessed substrate W in the standby state in the buffer unit 40 to the process chamber 60, or may transfer the processed substrate W to the buffer unit 40. In addition, the transfer robot 53 may transfer the substrates W between the processing chambers 60 to sequentially or simultaneously supply the substrates W to the plurality of processing chambers 60.

The process chamber 60 may be disposed around the transfer chamber 50. A plurality of process chambers 60 may be provided. In each process chamber 60, a process may be performed on the substrate W. The process chamber 60 can process the substrate W transferred by the transfer robot 53 and can supply the processed substrate W to the transfer robot 53. The processes performed in the respective process chambers 60 may be different from each other. The process performed in the process chamber 60 may be one of processes of manufacturing a semiconductor element or a display panel by using the substrate W.

The controller 70 may control elements of the substrate processing apparatus 1, including a buffer unit 40.

The substrate W processed by the substrate processing apparatus 1 may have a wide range of meanings, including a substrate for manufacturing a semiconductor element or a flat panel display (FPD) and other substrates for manufacturing an object having a circuit pattern formed on a thin film. . Examples of the substrate W may include a silicon wafer, a glass substrate Boards, organic substrates, and the like.

FIG. 4 is a plan view of a transfer robot according to an embodiment of the inventive concept.

Referring to FIG. 4, the transfer robot 53 may have two hands 53 a and 53 b. The two hands 53a and 53b can share one actuator 54 and can be driven simultaneously. However, the scope of the inventive concept is not limited to a two-handed transfer robot having two hands, which are simultaneously driven by an actuator.

FIG. 5 is a schematic plan view of a buffer unit 40 according to an embodiment of the inventive concept.

Referring to FIG. 5, the buffer unit 40 may include first and second cases 110 a and 110 b and a substrate supporting member 130.

The first case 110 a and the second case 110 b may be a frame that protects the buffer unit 40. The first case 110a and the second case 110b may have an inner space that receives the substrate W. The first case 110a and the second case 110b may have a passage through which the substrate W is conveyed between the transfer frame 21 and an inner space of the first case 110a and the second case 110b arranged close to and parallel to the transfer frame 21. The passage 112a and the passage 114b through which the substrate 112a and the substrate W pass between the inner space of the first case 110a and the second case 110b and the transfer chamber 50. Doors 116a, 116b, 117a, and 117b can be installed On the sidewalls, channels 112a, 112b, 114a, and 114b are formed in the sidewalls. The doors 116a, 116b, 117a, and 117b may open / close the passages 112a, 112b, 114a, and 114b and hermetically seal the inner spaces of the first and second cases 110a and 110b. The gas supply line 181 may be installed on the sides of the first and second cases 110a and 110b to supply the flushing gas into the inner space of the first and second cases 110a and 110b. The first casing 110a and the second casing 110b may be arranged side by side in the first direction 11. Each of the first case 110a and the second case 110b may optionally include a clamping buffer 41 or a passing buffer 42.

FIG. 6 is a schematic side view illustrating the inside of the first case 110a or the second case 110b. Hereinafter, the first case 110 a or the second case 110 b may be referred to as a case 110.

Referring to FIG. 6, the housing 110 may include a clamping buffer 41 and a passing buffer 42 stacked vertically.

The clamping buffer 41 may form a first buffer region 41a. The first buffer region 41 a may include a substrate support member 130, a pusher 140, and an edge holder support member 150.

The buffer 42 may form a second buffer region 42 a. The second buffer region 42 a may include a substrate supporting member 130 and a pusher 140.

The substrate supporting member 130 may support the substrate W transferred to the first buffer region 41 a and the second buffer region 42 a. The substrate supporting member 130 may support a bottom side of the substrate W. The substrate supporting member 130 may be positioned on the lower side of the first buffer region 41a and the second buffer region 42a. The substrate support member 130 may have a shape that does not interfere with the index robot 25 or the transfer robot 53 when the index robot 25 or the transfer robot 53 transfers the substrate W into the first buffer area 41a and the second buffer area 42a and transfers out of these buffer areas To enter. For example, the substrate supporting member 130 may have a rod shape to support the bottom side of the substrate W.

The pusher 140 may be positioned outside the substrate W supported by the substrate supporting member 130. The pusher 140 may align the transferred substrate W. The pusher 140 may be configured such that a portion of the pusher 140 facing a side surface of the substrate W can be moved toward the substrate W. The pushers 140 may be configured to face each other with respect to the substrate W. For example, two pushers 140 may be configured to face each other with respect to the substrate W, or four pushers 140 may be configured to be symmetrical with respect to the substrate W.

FIG. 7 is a side view illustrating an operating state of a clamp buffer according to an embodiment of the inventive concept.

Referring to FIG. 7, the clamping buffer 41 may include a substrate supporting member 130 and an edge holder supporting member 150.

The edge holder support member 150 may support the edge holder 160. The edge holder supporting member 150 may be positioned outside the edge of the substrate W supported by the substrate supporting member 130.

The edge holder support member 150 may include a support end 151 positioned at a second position h2 higher than the first position h1 and a top side of the substrate support member 130 positioned at the first position. The support tip 151 may support the edge holder 160.

The support tip 151 may be connected to an actuator (not illustrated), and the actuator may move the support tip 151 between the second position h2 and a third position h3 higher than the second position h2.

FIG. 8 illustrates a state in which the substrate is transferred from the equipped front-end module to the holding buffer.

Referring to FIG. 8, before the substrate W is transferred from the equipped front-end module 20 into the buffer unit 40, the edge holder 160 may be positioned on the edge holder supporting member 150. The edge holder 160 may have a circular or rectangular shape to correspond to the periphery of the substrate W and may be made of a ceramic material.

The mounting groove 162 may be formed on the edge holder 160. The mounting groove 162 may be formed to correspond to the shape of the edge holder supporting end 151. The mounting groove 162 prevents the edge holder 160 from being separated from the support tip 151.

In a state in which the edge holder 160 is prepared, the index robot 25 may transfer the substrate W to be processed into the holding buffer 41. The controller 70 can control the indexing robot 25 to transfer the substrate W at a height h4 to the clamping buffer 41, which is a preset distance higher than the height at which the substrate W will be supported by the substrate support member 130. After that, when the substrate W and the substrate W are vertically aligned at a position supported by the substrate support member 130, the index robot 25 may be moved downward to place the substrate W on the substrate support member 130.

FIG. 9 illustrates a state in which the pusher corrects the position of the substrate and the transfer robot enters the holding buffer.

Referring to FIG. 9, after the substrate W is transferred from the equipped front-end module 20 to the holding buffer 41, the position of the substrate W can be corrected by the pusher 140. The indexing robot 25 (see FIG. 8) may be provided to position the substrate W at a preset position. However, in positioning the substrate W on the substrate supporting member 130, there may be a difference between the position of the substrate W and the preset position. The controller 70 may move the pusher 140 toward the substrate W by a predetermined distance to push the substrate W to the correct position. Thereafter, the pusher 140 may leave the substrate W to avoid disturbing other components. When the substrate W is completely aligned, the transfer robot 53 can enter the clamping buffer 41 so as to be positioned below the substrate W.

Figure 10 illustrates where the substrate is picked up by the transfer robot and clamped at the edges The device is positioned on the substrate.

Referring to FIG. 10, the transfer robot 53 may move upward to a preset height higher than the second position h2 (see FIG. 7) to pick up the substrate W (the preset height is lower than the third position h3). The edge holder 160 may be positioned on the substrate W during the upward movement of the transfer robot 53 to pick up the substrate W. When the substrate W is completely picked up, the transfer robot 53 can be moved backward from the clamping buffer 41 to the transfer chamber 50.

FIG. 11 illustrates a state in which a substrate is transferred out of the buffer unit of FIG. 6.

Referring to FIG. 11, the buffer unit 40 may include first detection sensors 171 and 172 and a second detection sensor 173, and the edge holder support member 150 may include a support end 151 and a cylinder 152. The cylinder support Support end 151.

The first detection sensors 171 and 172 can detect whether the substrate W is present on the substrate supporting member 130 and can transmit the detected information to the controller 70. The first detection sensors 171, 172 may be selected as laser sensors that emit laser beams 171a, 172a.

The cylinder 152 constituting the edge holder support member 150 may be selected as a hydraulic, pneumatic, or screw cylinder and may be variable in length. End of support The end 151 may be coupled to an end portion of the cylinder 152 and may be variable in height when the cylinder 152 is driven.

Because the supporting end 151 supports the edge holder 160, when the supporting end 151 is raised or lowered, the edge holder 160 moves upward or downward. The reference position of the support end 151 may be set to a second position h2 (see FIG. 7) at which the edge holder 160 is transferred out of the buffer unit together with the substrate W when it comes into contact with the top side of the substrate W 40, and the support end 151 can be moved upward to a third position h3 (see FIG. 7) higher than the second position h2 by a predetermined height so as not to contact the index robot 25 and the transfer robot 53.

The controller 70 may receive information from the first detection sensors 171, 172 about the absence of the substrate W on the substrate supporting member 130, and may drive the cylinder 152 based on the received information about the absence of the substrate W. The cylinder 152 can move the support tip 151 upward from the second position h2 to the third position h3.

The second detection sensor 173 can detect the height of the edge holder 160. According to an embodiment, the second detection sensor 173 may be a laser sensor, which is disposed on a side wall of the housing 110 to correspond to a reference position of the edge holder 160 and parallel to the reference position of the edge holder 160. A laser beam 173a is emitted in the direction of the ground to detect whether the edge holder 160 is at the second position h2.

FIG. 12 is a schematic view of a process chamber in which a substrate is positioned on a base Side view.

Referring to FIG. 12, the process chamber 60 may include a chamber 2100, a base 2200, a baffle 2300, and a plasma excitation module 2400.

The chamber 2100 may have a space in which a process is performed.

The base 2200 may be positioned inside the chamber 2100. The substrate W may be placed on the top side of the base 2200. The base 2200 may be made of aluminum. The base 2200 may have a coolant passage (not illustrated) formed therein through which a cooling fluid is circulated. The cooling fluid may cool the base 2200 as it circulates through the coolant channel. The bias power can apply electric power to the base 2200 to adjust the degree to which the substrate W is processed by the plasma. The electrical power applied by the bias power source may be radio frequency (RF) power. The base 2200 can form a sheath by using electric power supplied by a bias power source and can generate a high-density plasma in an area to enhance process capability.

The base 2200 may have a heating member 2220 on the inside. According to an embodiment, the heating member 2220 may be a heating wire. The heating member 2220 may heat the substrate W to a preset temperature.

The baffle 2300 may be electrically connected to an upper wall of the main body 2110. The baffle 2300 may have a disc shape and may be arranged parallel to the top side of the base 2200. The baffle 2300 may be made of anodized aluminum. The baffle 2300 may have a formation Inside the distribution hole 2310. The distribution holes 2310 may be formed on a concentric circumference at predetermined intervals to uniformly supply radicals. The plasma diffused throughout the diffusion space 2121 may be introduced into the distribution hole 2310. At this time, charged particles such as electrons or ions may be confined in the baffle 2300, and neutral particles having no charge such as oxygen radicals may be supplied to the substrate W through the distribution hole 2310. In addition, the baffle 2300 may be grounded to form a channel through which electrons or ions move.

The plasma excitation module 2400 may generate a plasma and may supply the plasma to the chamber 2100. The plasma excitation module 2400 may be disposed at the top of the chamber 2100. The plasma excitation module 2400 may include an oscillator 2410, a waveguide 2420, a dielectric tube 2430, and a process gas supply unit 2440. The oscillator 2410 may generate electromagnetic waves. The waveguide 2420 can be connected to the oscillator 2410 and the dielectric tube 2430, and can be used to guide the electromagnetic wave generated by the oscillator 2410 into the dielectric tube 2430. The process gas supply unit 2440 may supply a process gas into the dielectric tube 2430. The process gas can be selected depending on the progress of the process. The process gas supplied into the dielectric tube 2430 can be excited into a plasma by electromagnetic waves. Plasma can be introduced into the diffusion space 2121 via a dielectric tube 2430. Although the plasma excitation module 2400 described above has been described as using electromagnetic waves, the plasma excitation module 2400 may be an inductively coupled plasma excitation module or a capacitively coupled plasma excitation module.

The base 2200 may include a lift pin (not illustrated), and the substrate W may be placed in the process chamber in a state in which the lift pin of the base 2200 is moved upward. Room 60.

According to an embodiment of the inventive concept, the substrate W may be placed in the process chamber 60, and an edge of the substrate W may be covered with an edge holder 160. Therefore, it is possible to prevent the phenomenon caused by the exposure of the edges of the substrate W to the plasma during the process and reduce the degree of exposure of the edges of the substrate W to the plasma during the process. For example, when the substrate W is positioned on the base 2200, there may be a gap between the bottom of the periphery outside the substrate W and the base 2200 due to the problem that the bottom of the periphery outside the substrate W does not form a completely flat surface. When the substrate W is being processed, an arc may be generated in the gap to damage the substrate W. In addition, it may be necessary to prevent the periphery of the substrate W from being subjected to plasma treatment. In addition, since no component for fixing the substrate W is needed inside the processing chamber 60, it is possible to simplify the maintenance of the processing chamber 60.

The guide ring 2230 may be provided to surround the base 2200. The guide ring 2230 may be made of a ceramic material.

FIG. 13 is an enlargement of detail A in FIG. 12.

Referring to FIG. 13, the guide ring 2230 may include a protruding portion 2231 that further protrudes beyond a predetermined height of a top side of the base 2200 on which the substrate W is placed. The protruding portion 2231 may be formed to be spaced apart from the edge of the substrate W by a predetermined distance in a state where the substrate W is placed at a reference position of the base 2200. The protrusion 2231 may have an inclined surface 2232 formed on a side thereof, The inclined surface faces the substrate W. A fitting portion 2233 may be formed inside the inclined surface 2232 on which the edge holder 160 is fitted.

The edge holder 160 may have a mounting groove 162 corresponding to the protrusion 2231 of the guide ring 2230. The mounting groove 162 may have an inclined surface 162 a corresponding to the inclined surface 2232 of the protrusion 2231. The inclined surface 2232 and the inclined surface 162a may be inclined downward from the outside to the inside with respect to the guide ring 2230.

When the teaching position is changed due to abnormal operation of the transfer robot 53, the inclined surface 2232 of the guide ring 2230 and the inclined surface 162a of the edge holder 160 may slide relative to each other to move to the correct position.

FIG. 14 is an enlargement of detail A in FIG. 12 according to another embodiment. The edge holder 160 may have a receiving groove 161 'having a shape corresponding to an outer side surface of the substrate W. The receiving groove 161 ′ can be more firmly coupled to the substrate W than the inclined surface 161 in the embodiment illustrated in FIG. 11, and when the inclined surface 2232 of the guide ring 2230 and the inclined surface 162 a of the edge holder 160 The edge holder 160 can be prevented from being separated from the substrate W when sliding relative to each other due to a change in the teaching position caused by the abnormal operation of the transfer robot 53.

The edge holder 160 may have a mounting groove 162 formed thereon. The mounting groove 162 may be formed to correspond to the edge holder supporting member 150 The shape of the top end. When the edge holder 160 is positioned on the edge holder supporting member 150, the upper end of the edge holder supporting member 150 may be positioned in the mounting groove 162 to prevent the edge holder 160 and the edge holder supporting member 150 separated.

FIG. 15 illustrates a state in which a substrate and an edge holder are mounted on a base.

Referring to FIG. 15, the process chamber 60 may include a third detection sensor 2500. The third detection sensor 2500 can detect the position of the edge holder 160 placed in the process chamber 60 together with the substrate W. According to an embodiment, the third detection sensor 2500 may be a laser sensor, which applies the laser beam 2501 vertically to a distance of a predetermined distance from the periphery of the guide ring 2230. Position, the guide ring surrounds the base 2200. When the third detection sensor 2500 detects that the edge holder 160 further protrudes beyond the boundary of the guide ring 2230 by a preset distance or more, the controller 70 may stop operating the device and may activate an alarm (not illustrated) to notify Workers this fact. According to another embodiment, the controller 70 may determine whether the position detected by the third detection sensor 2500 exceeds an allowable error range. Damage to the expensive edge holder 160 made of ceramic material can be prevented by detecting and controlling using the third detection sensor 2500.

FIG. 16 is a schematic side view of a buffer unit having clamping buffer units stacked vertically and a buffer unit passing through the buffer unit, where the clamping buffer unit includes horizontally arranged clamping buffers and Horizontally arranged pass buffers.

Referring to FIG. 16, the holding buffer unit may include a pair of holding buffers 41 arranged in a horizontal direction, and the passing buffer unit may include a pair of passing buffers 42 arranged in a horizontal direction. The holding buffer unit and the passing buffer unit may be vertically stacked to form the buffer unit 40.

FIG. 17 is a view for explaining a problem in the case of a two-handed transfer robot.

Referring to FIG. 17, when the transfer robot 53 is operated with two hands 53a and 53b, two substrates can be transferred to the holding buffer unit at a time by using a box for carrying a set of 25 substrates, and only one substrate Can be left in the final transfer step. The last remaining substrate can be transferred to only one of the first buffer regions 41a and 41b in the clamping buffer unit. When two hands 53a and 53b enter the holding buffer unit to pick up the substrate W, one hand 53a can place the substrate W and the edge holder 160 on the hand, but the other hand 53b can only hold the edge The device 160 is placed on the hand, as illustrated in FIG. 17. Since the edge holder 160 has a width d of 3 mm or less, the edge holder 160 that is not combined with the substrate W can be placed on the hand 53b in an unstable state (in the drawing, the width d is slightly exaggerated To identify the edge holder 160). The edge holder 160 positioned on the hand 53b in the unstable state is more likely to fall from the hand 53b.

The edge holder 160 made of a ceramic material may have a high risk of damage and may be expensive. Therefore, damage to the edge holder 160 may cause high losses. The inventive concept can prevent the situation described above by the control of the edge holder supporting member 150.

FIG. 18 is a flowchart illustrating a substrate processing method using a substrate processing apparatus according to an embodiment of the inventive concept. FIG. 19 illustrates a state in which a substrate is transferred to one of the clamping buffers arranged horizontally according to an embodiment of the inventive concept. FIG. 20 illustrates a state in which the supporting end of the clamping buffer without detecting the substrate moves upward and the supporting end of the clamping buffer having detected the substrate is maintained at the same position. FIG. 21 illustrates a state in which the transfer robot enters the holding buffer unit of FIG. 19. FIG. 22 illustrates a state in which an edge holder is positioned on a substrate picked up by a transfer robot in the holding buffer unit of FIG. 20.

Referring to FIGS. 18 to 22, a substrate processing method using a substrate processing apparatus may provide a processing method for preventing damage to the edge holder 160.

The edge holder 160 can be positioned on the supporting end 151 in the holding buffer 41 (step S110).

The indexing robot 25 may transfer the substrate W to be processed into the first buffer areas 41 a and 41 b of the holding buffer 41 (step S120). According to an embodiment, the substrate W may be transferred into the first buffer area 41b, and the substrate W It may not be transferred to the first buffer area 41a.

When the substrate W is completely transferred, the first detection sensors 171 and 172 can detect whether the substrate W is positioned on the substrate support member 130 and exists in the clamping buffer 41 (step S140) (see FIG. 19) .

When the first detection sensors 171 and 172 detect the absence of the substrate W, the controller 70 may control the actuator to move the supporting end 151 upward based on the information about the absence of the substrate W (step S145) (see FIG. 20) ). Conversely, when the first detection sensors 171 and 172 detect the presence of the substrate W, the lifting control of the supporting end 151 may not be performed.

When the substrate W is aligned by the pusher 40 and the supporting end 151 in the clamping buffer without the substrate W is completely moved upward, the two hands 53a and 53b of the transfer robot 53 can simultaneously enter the clamping buffer unit ( Step S150) (see FIG. 21).

The two hands 53a and 53b can be moved to a preset position in the holding buffer unit and can then pick up the substrate W when moving upward to a position higher than the support end 151 (step S160) (see FIG. 22).

The transfer robot 53 that has completely picked up the substrate W may transfer the substrate W out of the grip buffer unit when it is moved backward from the grip buffer unit to the transfer chamber 50 (step S170).

The substrate W transferred into the transfer chamber 50 may be placed in the process chamber 60.

Because the edge holder 160 is conveyed out of the holding buffer unit together with the substrate W, the edge holder supporting member 150 in the first buffer area 41b may not have an edge holder fitted thereon. The controller 70 may store information about that the edge holder support member 150 in the first buffer area 41b does not have an edge holder fitted thereon when transferring the substrate W into the transfer chamber 50, and may instruct a supply edge The holder 160 to the first buffer area 41b.

The substrate processing method described above can prevent damage to the edge holder in a two-handed transfer robot to which an edge holder is applied and a substrate processing apparatus having a dual chamber.

FIG. 23 illustrates an edge holder supporting member according to another embodiment of the inventive concept.

Referring to FIG. 23, an edge holder support member 150 'according to another embodiment may be a support member protruding horizontally from a side wall of the housing 110. The support 150 'can be configured to move up or down. In the embodiment of FIG. 23, a detection sensor may be provided, as in the embodiment of FIG. 11.

FIG. 24 illustrates a substrate supporting member according to another embodiment of the inventive concept.

Referring to FIG. 24, the substrate supporting member 230 according to another embodiment may include a plate 232 for supporting the substrate W and a substrate for raising and lowering the substrate W to a preset height when the substrate W is exchanged with the index robot 25 or the transfer robot 53 Lifting pin 231. According to an embodiment, the upper end of the lifting pin 231 can be moved upward to the first position h1.

The process chamber 60 may be a process chamber other than a plasma processing chamber.

According to an embodiment, the movement reference position of the support end 151 may be set to the third position h3, and when the entry of the substrate W to the buffer unit 40 is detected, the support end 151 may be moved down to the second position h2 to The transfer robot 53 is enabled to pick up the substrate W together with the edge holder 160.

The controller 70 may receive information about the substrate W transferred to the loading port 10 and to be processed, and may control the indexing robot 25 to selectively transfer the substrate W to the holding buffer 41 and the passing buffer 42. The edge holder 160 may be configured for a substrate having excessive warpage. Substrates with less warpage can be classified into the first group, and substrates with excessive warpage can be classified into the second group. When the first group of substrates is configured to the substrate processing equipment, the controller 70 may provide the substrate to the passing buffer 42, and when the second group of substrates is configured to the substrate processing equipment, the controller 70 may provide The substrate is supplied to a clamp buffer 41.

When the substrate W is transferred into the pass buffer 42, the controller 70 may control the transfer robot 53 to enter the second buffer areas 42 a and 42 b in the pass buffer 42. The transfer robot 53 can pick up the substrate W passing through the buffer 42 and can transfer the substrate W into the process chamber 60.

The substrate processing method described above can improve productivity by using the clamp buffer 41 and by the buffer 42.

The foregoing description illustrates the inventive concept. Furthermore, what has been described above describes exemplary embodiments of the inventive concepts, and the inventive concepts can be used in various other combinations, changes, and environments. That is, the inventive concept can be made without departing from the scope of the inventive concept disclosed in the description, the equivalent scope of the written disclosure, and / or the technical or knowledge scope of those with ordinary knowledge in the technical field to which it belongs. Make changes or modifications. The written embodiments describe the best state of the technical spirit for implementing the inventive concept, and can make various changes required in the specific application and purpose of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the state of the disclosed embodiment. In addition, it should be understood that the scope of the attached patent application includes other embodiments.

Although the inventive concept has been described with reference to the embodiments, it will be apparent to those having ordinary knowledge in the technical field that the inventive concept can be used without departing from the inventive concept. Make various changes and modifications within the spirit and scope of the situation. Therefore, it should be understood that the above embodiments are not limiting, but are illustrative.

Claims (20)

A device for processing a substrate, comprising: a front-end module; and a processing module configured to process the substrate, wherein the front-end module of the device includes: a loading port, and a container system with the substrate on the inside On the loading port; and a transfer frame having an indexing robot configured to transfer the substrate between the loading port and the processing module; wherein the processing module includes a clamping buffer, which Adjacent to the aforementioned equipment front-end module; a processing chamber that is configured to process the substrate; and a transfer chamber that has a transfer robot that is configured to fit between the process chamber and the clamping buffer The aforementioned substrate is transferred between them; and wherein the aforementioned clamping buffer includes: a substrate supporting member configured to support the aforementioned substrate; and an edge holder supporting member having a supporting end configured to support the edge Holder, the aforementioned edge holder It is transferred to the aforementioned process chamber in a state of being positioned at an edge on the top side of the aforementioned substrate. The apparatus for processing a substrate according to claim 1, wherein the support end is positioned at a second position higher than the first position, and the substrate is supported on the substrate support member at the first position. The apparatus for processing a substrate according to claim 2, wherein the supporting end is configured to move between the second position and a third position higher than the second position. The apparatus for processing a substrate as recited in claim 1, wherein the aforementioned holding buffer further comprises: an actuator configured to move the foregoing of the holding buffer between the second position and the third position. At the support end, the second position is higher than the first position where the substrate is supported on the substrate support member, and the third position is higher than the second position. The device for processing a substrate as described in claim 4, wherein the clamping buffer further includes: a detection sensor configured to detect whether the substrate is present on the substrate supporting member. The apparatus for processing a substrate as described in claim 5, further comprising: a controller; wherein the aforementioned controller is configured to: Based on the information that the substrate does not exist on the substrate support member, the actuator is controlled to position the support end at the third position, wherein the detection sensor detects the information that the substrate does not exist ; And controlling the actuator to position the support end at the second position based on information about the existence of the substrate on the substrate support member, wherein the detection sensor detects the information about the existence of the substrate . The apparatus for processing a substrate as described in claim 3, wherein the aforementioned process chamber includes: a pedestal, the substrate is placed on the pedestal; and a guide ring is arranged to surround the pedestal and The protruding portion further protrudes upward beyond the top side of the base and has an inclined side surface, the inclined side surface faces the substrate, wherein the edge holder has an inclined portion, and the inclined portion corresponds to the protruding portion Slope side surface. The apparatus for processing a substrate as described in claim 3, wherein the process chamber includes: a base, the substrate is placed on the base; and a guide ring is configured to surround the base and guide the base. Position of the aforementioned substrate; and The detection sensor is configured to detect the edge holder, and the edge holder further protrudes beyond a boundary preset value of the guide ring or more. The device for processing a substrate according to claim 8, further comprising: a controller; wherein the controller is configured to detect that the edge holder further protrudes beyond the guide ring when the detection sensor detects the edge holder. When the aforementioned boundary is the aforementioned preset value or more, the aforementioned equipment is stopped or the alarm is activated. The apparatus for processing a substrate as described in claim 1, wherein a plurality of clamping buffers are configured to form a clamping buffer unit. The apparatus for processing a substrate as described in claim 1, wherein the processing module further includes: a buffer, which is disposed parallel to the clamping buffer between the equipment front-end module and the transfer chamber. The apparatus for processing a substrate as described in claim 11, wherein a plurality of buffer units are configured to form a buffer unit. The apparatus for processing a substrate as recited in claim 11, wherein the aforementioned holding buffer and the aforementioned through buffer are vertically stacked to form a buffer unit. An apparatus for processing a substrate, comprising: equipping a front-end module; and A processing module configured to process the aforementioned substrate, wherein the aforementioned equipment front-end module includes: a loading port, a container having the aforementioned substrate inside is placed on the aforementioned loading port; and a transfer frame having an indexing robot, the indexing The robot is configured to transfer the substrate between the loading port and the processing module; wherein the processing module includes: a clamping buffer unit, which is arranged adjacent to the front-end module of the equipment; a processing chamber, which is Configured to process the substrate; and a transfer chamber having a transfer robot having two hands that are configured to extend and retract simultaneously and transfer the substrate between the process chamber and the clamping buffer unit ; Wherein the aforementioned clamping buffer unit includes two clamping buffers arranged side by side; and wherein each of the aforementioned clamping buffers includes: a substrate supporting member which is configured to support the aforementioned substrate; and an edge holder A support member including a support end, the support end being configured to support an edge holder, and the edge holder The device is transferred to the processing chamber in a state of being positioned at an edge on the top side of the substrate. The apparatus for processing a substrate as recited in claim 14, wherein the aforementioned holding buffer further comprises: an actuator configured to move the foregoing of the holding buffer between the second position and the third position. At the support end, the second position is higher than the first position on the substrate supporting member supporting the substrate, and the third position is higher than the second position. The device for processing a substrate as described in claim 15, wherein the clamping buffer further includes a detection sensor, and the detection sensor is configured to detect whether the substrate is present on the substrate supporting member; Wherein the aforementioned device further includes a controller; and wherein the aforementioned controller is configured to control the actuator to position the edge holder at the third based on information about the substrate not being present on the substrate supporting member. At the position where the aforementioned detection sensor detects the aforementioned information regarding the absence of the aforementioned substrate; and based on the information regarding the existence of the aforementioned substrate on the aforementioned substrate supporting member, controlling the aforementioned actuator to position the aforementioned edge holder at At the aforementioned second position, the aforementioned detecting sensor detects the aforementioned information about the existence of the substrate. The apparatus for processing a substrate according to claim 16, wherein the processing module further includes: a buffer unit, which is vertically stacked on the clamping buffer between the equipment front-end module and the transfer chamber. The unit includes a plurality of pass buffers. A method for processing a substrate by using the apparatus for processing a substrate as described in claim 1 or 14, comprising the steps of positioning the edge holder on the supporting end of the holding buffer. ; Transferring the substrate to be processed into the clamping buffer; and transferring the edge holder and the substrate from the clamping buffer to the processing chamber. The method for processing a substrate as described in claim 18, wherein the clamping buffer further includes a detection sensor, the detection sensor is configured to detect whether the substrate is present on the substrate supporting member And wherein the method further includes: detecting whether the substrate is present on the substrate supporting member of the clamping buffer; and controlling the actuator to move the edge based on information detected by the detection sensor. The gripper is positioned at a specific position; The two hands of the transfer robot are brought into the holding buffer at the same time; and the substrate in the holding buffer is picked up by the transfer robot and transferred to the processing chamber. A method for processing a substrate by using an apparatus for processing a substrate as claimed in claim 17, said method comprising: positioning said edge holder on said supporting end of said holding buffer; based on Information of the substrate to be loaded to the loading port and to be processed, the controller controls the indexing robot to selectively transfer the substrate to the passing buffer or the clamping buffer; detecting whether the substrate exists On the substrate supporting member of the holding buffer; based on the information detected by the detection sensor, controlling the actuator by the controller; allowing the two hands of the transfer robot to enter the simultaneously Holding the buffer; and picking up the substrate in the selected pass buffer or the selected holding buffer by the transfer robot and transferring the substrate to the process chamber.