TW201936535A - Glass composition and sealing material - Google Patents
Glass composition and sealing material Download PDFInfo
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- TW201936535A TW201936535A TW108103685A TW108103685A TW201936535A TW 201936535 A TW201936535 A TW 201936535A TW 108103685 A TW108103685 A TW 108103685A TW 108103685 A TW108103685 A TW 108103685A TW 201936535 A TW201936535 A TW 201936535A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
Abstract
Description
本發明係關於一種不含有害之鉛或鹵素且能夠以400℃以下之低溫進行氣密密封之玻璃組合物、及使用其之密封材料。The present invention relates to a glass composition which does not contain harmful lead or halogen and which can be hermetically sealed at a low temperature of 400 ° C or lower, and a sealing material using the same.
密封材料用於半導體積體電路、水晶振動子、平面顯示裝置或LD(Laser Diode，雷射二極體)用玻璃端子等。The sealing material is used for a semiconductor integrated circuit, a crystal vibrator, a flat display device, or a glass terminal for an LD (Laser Diode).
由於對上述密封材料要求化學耐久性及耐熱性，故而使用玻璃系密封材料而非樹脂系之接著劑。雖然對玻璃系密封材料要求機械強度、流動性、耐候性等特性，但對於搭載對熱較弱之元件的電子零件之密封，要求儘可能降低密封溫度。具體而言，要求以400℃以下進行密封。因此，作為滿足上述特性之玻璃，廣泛使用大量含有降低熔點之效果極大之PbO的鉛硼酸系玻璃(例如，參照專利文獻1)。 [先前技術文獻] [專利文獻]Since the above sealing material is required to have chemical durability and heat resistance, a glass-based sealing material is used instead of a resin-based adhesive. Although the glass-based sealing material is required to have mechanical strength, fluidity, weather resistance, and the like, it is required to reduce the sealing temperature as much as possible for the sealing of the electronic component to which the component having weak heat is mounted. Specifically, it is required to perform sealing at 400 ° C or lower. Therefore, as a glass satisfying the above characteristics, a large amount of lead boric acid glass containing PbO having a large effect of lowering the melting point is widely used (for example, see Patent Document 1). [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開昭63-315536號公報 [專利文獻2]日本專利特開平6-24797號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 63-315536 (Patent Document 2) Japanese Patent Laid-Open No. Hei 6-24797
[發明所欲解決之問題][The problem that the invention wants to solve]
近年來，針對鉛硼酸系玻璃所包含之PbO，指出環境上之問題，期望自鉛硼酸系玻璃置換成不含PbO之玻璃。為此，作為鉛硼酸系玻璃之替代品，開發出各種低熔點玻璃。其中，專利文獻2所記載之Bi2 O3 -B2 O3 系玻璃作為鉛硼酸系玻璃之候選代替品受到期待，但密封溫度高至450℃以上，無法用於必須以更低溫進行密封之用途。In recent years, PbO contained in lead boric acid-based glass has been pointed out as an environmental problem, and it is desired to replace the lead boric acid-based glass with a glass containing no PbO. For this reason, various low-melting glass have been developed as a substitute for lead boric acid glass. Among them, Bi 2 O 3 -B 2 O 3 based glass described in Patent Document 2 is expected as a substitute for lead boric acid glass, but the sealing temperature is as high as 450 ° C or higher, and it cannot be used for sealing at a lower temperature. use.
鑒於以上情況，本發明之目的在於提供一種不含對環境有害之鉛且能夠以低溫進行密封之玻璃組合物、及使用其之密封材料。 [解決問題之技術手段]In view of the above circumstances, an object of the present invention is to provide a glass composition which does not contain lead which is harmful to the environment and which can be sealed at a low temperature, and a sealing material using the same. [Technical means to solve the problem]
本發明之玻璃組合物之特徵在於：以莫耳%計含有Ag2 O 10～60%、TeO2 10～60%、MoO3 10～60%。The glass composition of the present invention is characterized by containing 10 to 60% of Ag 2 O, 10 to 60% of TeO 2 and 10 to 60% of MoO 3 in terms of mol%.
本發明之玻璃組合物藉由含有10%以上之Ag2 O，從而達成低軟化點。再者，一般，若降低玻璃之熔點，則有未玻璃化、或產生分相而不易獲得均質之玻璃之傾向，但於本發明中，由於將TeO2 之含量規定為10%以上，將MoO3 之含量規定為10%以上，故而玻璃穩定化，能夠獲得均質之玻璃。The glass composition of the present invention achieves a low softening point by containing 10% or more of Ag 2 O. Further, in general, when the melting point of the glass is lowered, there is a tendency that the glass is not vitrified or a phase separation occurs, and a homogeneous glass is easily obtained. However, in the present invention, since the content of TeO 2 is 10% or more, MoO is used. Since the content of 3 is 10% or more, the glass is stabilized, and a homogeneous glass can be obtained.
本發明之玻璃組合物較佳為進而以莫耳%計含有CuO 0～20%、Bi2 O3 0～10%、TiO2 0～10%、AgI 0～10%。The glass composition of the present invention preferably further contains 0 to 20% of CuO, 0 to 10% of Bi 2 O 3 , 0 to 10% of TiO 2 and 0 to 10% of AgI in terms of mol%.
本發明之玻璃組合物較佳為進而以莫耳%計含有P2 O5 0～5%。The glass composition of the present invention preferably further contains P 2 O 5 to 5% by mol%.
本發明之密封材料之特徵在於含有包含上述玻璃組合物之玻璃粉末40～100體積%、及耐火性填料粉末0～60體積%。The sealing material of the present invention is characterized by containing 40 to 100% by volume of the glass powder containing the glass composition and 0 to 60% by volume of the refractory filler powder.
本發明之密封材料較佳為用於水晶振動子用途。The sealing material of the present invention is preferably used for crystal vibrator applications.
本發明之密封材料漿料之特徵在於含有上述密封材料與載劑。 [發明之效果]The sealing material slurry of the present invention is characterized by comprising the above sealing material and a carrier. [Effects of the Invention]
本發明可提供一種不含對環境有害之鉛且能夠以低溫進行密封之玻璃組合物、及使用其之密封材料。The present invention can provide a glass composition which does not contain lead which is harmful to the environment and which can be sealed at a low temperature, and a sealing material using the same.
本發明之玻璃組合物以莫耳%計含有Ag2 O 10～60%、TeO2 10～60%、MoO3 10～60%。將對玻璃組成作如上限定之理由示於以下。再者，在以下關於各成分之含量之說明中，只要無特別限定，則「%」意指「莫耳%」。The glass composition of the present invention contains 10 to 60% of Ag 2 O, 10 to 60% of TeO 2 and 10 to 60% of MoO 3 in terms of mol%. The reason why the glass composition is as defined above is shown below. In the following description of the content of each component, "%" means "% by mole" unless otherwise specified.
Ag2 O係降低玻璃之黏性(軟化點等)之成分。Ag2 O之含量為10～60%，較佳為13～50%，尤佳為15～45%。若Ag2 O之含量過少，則玻璃之黏性(軟化點等)變高，低溫密封容易變困難。另一方面，若Ag2 O之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。Ag 2 O is a component that reduces the viscosity (softening point, etc.) of the glass. The content of Ag 2 O is from 10 to 60%, preferably from 13 to 50%, particularly preferably from 15 to 45%. When the content of Ag 2 O is too small, the viscosity (softening point, etc.) of the glass becomes high, and the low-temperature sealing tends to be difficult. On the other hand, when the content of Ag 2 O is too large, the glass becomes thermally unstable, and the glass is easily devitrified during melting or baking.
TeO2 係形成玻璃網絡，並且提高耐候性之成分。TeO2 之含量為10～60%，較佳為15～57%，尤佳為25～55%。若TeO2 之含量過少，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透，並且耐候性容易降低。另一方面，若TeO2 之含量過多，則玻璃之黏性(軟化點等)變高，低溫密封容易變困難。TeO 2 forms a glass network and improves weatherability. The content of TeO 2 is from 10 to 60%, preferably from 15 to 57%, particularly preferably from 25 to 55%. When the content of TeO 2 is too small, the glass becomes thermally unstable, and the glass is easily devitrified at the time of melting or baking, and the weather resistance is liable to lower. On the other hand, when the content of TeO 2 is too large, the viscosity (softening point, etc.) of the glass becomes high, and the low-temperature sealing is likely to be difficult.
MoO3 係形成玻璃網絡，並且提高耐候性之成分。MoO3 之含量為10～60%，較佳為15～55%，尤佳為20～50%。MoO3 之含量過少或過多時，玻璃均會變得熱不穩定，於熔融時或焙燒時玻璃容易失透。MoO 3 forms a glass network and improves weather resistance. The content of MoO 3 is from 10 to 60%, preferably from 15 to 55%, particularly preferably from 20 to 50%. When the content of MoO 3 is too small or too large, the glass becomes thermally unstable, and the glass is easily devitrified during melting or baking.
本發明之玻璃組合物除上述成分以外，亦可於玻璃組成中含有下述成分。The glass composition of the present invention may contain the following components in the glass composition in addition to the above components.
CuO係使玻璃熱穩定化，並且提高耐候性之成分。CuO之含量較佳為0～20%、0.5～18%、1～15%。若CuO之含量過多，則玻璃之黏性(軟化點等)變高，低溫密封容易變困難。CuO is a component that heat-stabilizes glass and improves weather resistance. The content of CuO is preferably 0 to 20%, 0.5 to 18%, or 1 to 15%. When the content of CuO is too large, the viscosity (softening point, etc.) of the glass becomes high, and the low-temperature sealing tends to be difficult.
Bi2 O3 係降低玻璃之黏性(軟化點等)，並且提高耐候性之成分。Bi2 O3 之含量較佳為0～10%、0～6%、0.1～2%。若Bi2 O3 之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。Bi 2 O 3 is a component that lowers the viscosity (softening point, etc.) of the glass and improves weather resistance. The content of Bi 2 O 3 is preferably 0 to 10%, 0 to 6%, or 0.1 to 2%. When the content of Bi 2 O 3 is too large, the glass becomes thermally unstable, and the glass is easily devitrified during melting or baking.
TiO2 係使玻璃熱穩定化，並且提高耐候性之成分。TiO2 之含量較佳為0～10%、0～6%、0.1～2%。若TiO2 之含量過多，則玻璃之黏性(軟化點等)變高，低溫密封變困難。TiO 2 is a component that thermally stabilizes glass and improves weather resistance. The content of TiO 2 is preferably 0 to 10%, 0 to 6%, or 0.1 to 2%. When the content of TiO 2 is too large, the viscosity (softening point, etc.) of the glass becomes high, and low-temperature sealing becomes difficult.
AgI係降低玻璃之黏性(軟化點等)之成分。AgI之含量較佳為0～10%、0～5%、0.1～2%。若AgI之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。AgI is a component that reduces the viscosity (softening point, etc.) of the glass. The content of AgI is preferably 0 to 10%, 0 to 5%, or 0.1 to 2%. When the content of AgI is too large, the glass becomes thermally unstable, and the glass is easily devitrified during melting or baking.
P2 O5 係形成玻璃網絡，並且使玻璃熱穩定化之成分。P2 O5 之含量較佳為0～5%、0～2%，尤佳為0.1～1%。若P2 O5 之含量過多，則玻璃之黏性(軟化點等)變高，低溫密封變困難，並且耐候性容易降低。P 2 O 5 forms a glass network and a component that thermally stabilizes the glass. The content of P 2 O 5 is preferably 0 to 5%, 0 to 2%, particularly preferably 0.1 to 1%. When the content of P 2 O 5 is too large, the viscosity (softening point, etc.) of the glass becomes high, the low-temperature sealing becomes difficult, and the weather resistance is liable to lower.
Li2 O、Na2 O、K2 O有降低玻璃之黏性(軟化點等)之效果，該等之含量以總量計較佳為0～20%，尤佳為0～10%。若Li2 O、Na2 O、K2 O之總量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透，並且耐候性容易降低。再者，Li2 O、Na2 O、K2 O之含量分別較佳為0～10%，尤佳為0～5%。Li 2 O, Na 2 O, and K 2 O have an effect of lowering the viscosity (softening point, etc.) of the glass, and the content thereof is preferably 0 to 20%, particularly preferably 0 to 10%, based on the total amount. When the total amount of Li 2 O, Na 2 O, and K 2 O is too large, the glass becomes thermally unstable, and the glass is easily devitrified at the time of melting or baking, and the weather resistance is liable to lower. Further, the content of Li 2 O, Na 2 O, and K 2 O is preferably from 0 to 10%, particularly preferably from 0 to 5%.
MgO、CaO、SrO、BaO有使玻璃熱穩定化，並且提高耐候性之效果，該等之含量以總量計較佳為0～20%，尤佳為0～10%。若MgO、CaO、SrO、BaO之總量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。再者，MgO、CaO、SrO、BaO之含量分別較佳為0～10%，尤佳為0～5%。MgO, CaO, SrO, and BaO have an effect of thermally stabilizing the glass and improving weather resistance, and the content thereof is preferably from 0 to 20%, particularly preferably from 0 to 10%, based on the total amount. When the total amount of MgO, CaO, SrO, and BaO is too large, the glass becomes thermally unstable, and the glass is easily devitrified during melting or baking. Further, the content of MgO, CaO, SrO, and BaO is preferably from 0 to 10%, particularly preferably from 0 to 5%.
ZnO係降低玻璃之黏性(軟化點等)，並且提高耐候性之成分。ZnO之含量較佳為0～10%，尤佳為0～5%。若ZnO之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。ZnO is a component that lowers the viscosity (softening point, etc.) of glass and improves weather resistance. The content of ZnO is preferably from 0 to 10%, particularly preferably from 0 to 5%. When the content of ZnO is too large, the glass becomes thermally unstable, and the glass is easily devitrified at the time of melting or baking.
WO3 係使玻璃熱穩定化，並且提高耐候性之成分。WO3 之含量較佳為0～10%，尤佳為0～5%。若WO3 之含量過多，則玻璃反而會變得熱不穩定。WO 3 is a component which heat-stabilizes glass and improves weather resistance. The content of WO 3 is preferably from 0 to 10%, particularly preferably from 0 to 5%. If the content of WO 3 is too large, the glass may become thermally unstable.
Nb2 O5 係使玻璃熱穩定化，並且提高耐候性之成分。Nb2 O5 之含量較佳為0～10%，尤佳為0～5%。若Nb2 O5 之含量過多，則玻璃之黏性(軟化點等)變高，低溫密封容易變困難。Nb 2 O 5 is a component that thermally stabilizes glass and improves weather resistance. The content of Nb 2 O 5 is preferably from 0 to 10%, particularly preferably from 0 to 5%. When the content of Nb 2 O 5 is too large, the viscosity (softening point, etc.) of the glass becomes high, and the low-temperature sealing tends to be difficult.
V2 O5 係形成玻璃網絡，並且降低玻璃之黏性(軟化點等)之成分。V2 O5 之含量較佳為0～10%，尤佳為0～5%。若V2 O5 之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透，並且耐候性容易降低。V 2 O 5 forms a glass network and reduces the composition of the viscosity (softening point, etc.) of the glass. The content of V 2 O 5 is preferably from 0 to 10%, particularly preferably from 0 to 5%. When the content of V 2 O 5 is too large, the glass becomes thermally unstable, and the glass is easily devitrified at the time of melting or baking, and the weather resistance is liable to lower.
Ga2 O3 係使玻璃熱穩定化，並且提高耐候性之成分，但由於非常昂貴，故而其含量較佳為未達0.01%，尤佳為不含有。The Ga 2 O 3 system thermally stabilizes the glass and improves the weather resistance component. However, since it is very expensive, the content thereof is preferably less than 0.01%, and particularly preferably not contained.
SiO2 、Al2 O3 、GeO2 、Fe2 O3 、NiO、CeO2 、B2 O3 、Sb2 O3 係使玻璃熱穩定化，抑制失透之成分，分別可添加至多未達2%。若該等之含量過多，則玻璃變得熱不穩定，於熔融時或焙燒時玻璃容易失透。SiO 2 , Al 2 O 3 , GeO 2 , Fe 2 O 3 , NiO, CeO 2 , B 2 O 3 , and Sb 2 O 3 are used to thermally stabilize the glass and suppress devitrification components, and may be added up to 2 %. If the content is too large, the glass becomes thermally unstable, and the glass tends to devitrify during melting or baking.
本發明之玻璃組合物較佳為實質上不含PbO。此處，本發明中所謂之「實質上不含PbO」係指玻璃組成中之PbO之含量為1000 ppm以下之情形。The glass composition of the present invention is preferably substantially free of PbO. Here, the term "substantially free of PbO" as used in the present invention means a case where the content of PbO in the glass composition is 1000 ppm or less.
本發明之密封材料含有包含上述玻璃組合物之玻璃粉末。本發明之密封材料亦可為了提高機械強度、或調整熱膨脹係數而含有耐火性填料。其混合比例為玻璃粉末40～100體積%、耐火性填料0～60體積%，較佳為玻璃粉末50～99體積%、耐火性填料1～50體積%，尤佳為玻璃粉末60～95體積%、耐火性填料5～40體積%。若耐火性填料之含量過多，則相對地，玻璃粉末之比例變少，故而難以確保所需之流動性。The sealing material of the present invention contains a glass powder comprising the above glass composition. The sealing material of the present invention may also contain a refractory filler for the purpose of improving mechanical strength or adjusting the coefficient of thermal expansion. The mixing ratio is 40 to 100% by volume of the glass powder, 0 to 60% by volume of the refractory filler, preferably 50 to 99% by volume of the glass powder, 1 to 50% by volume of the refractory filler, and more preferably 60 to 95% by volume of the glass powder. %, refractory filler 5 to 40% by volume. When the content of the refractory filler is too large, the proportion of the glass powder is relatively small, so that it is difficult to ensure the required fluidity.
耐火性填料並無特別限定，可選擇各種材料，較佳為難以與上述玻璃粉末反應者。The refractory filler is not particularly limited, and various materials can be selected, and it is preferred that it is difficult to react with the above glass powder.
具體而言，作為耐火性填料，可單獨使用NbZr(PO4 )3 、Zr2 WO4 (PO4 )2 、Zr2 MoO4 (PO4 )2 、Hf2 WO4 (PO4 )2 、Hf2 MoO4 (PO4 )2 、磷酸鋯、鋯英石、氧化鋯、氧化錫、鈦酸鋁、石英、β-鋰輝石、富鋁紅柱石、氧化鈦、石英玻璃、β-鋰霞石、β-石英、矽鋅礦、堇青石、Sr0.5 Zr2 (PO4 )3 等NaZr2 (PO4 )3 型固溶體等，或將2種以上混合使用。再者，關於耐火性填料之粒徑，較佳為使用平均粒徑D50 為0.2～20 μm左右者。Specifically, as the refractory filler, NbZr(PO 4 ) 3 , Zr 2 WO 4 (PO 4 ) 2 , Zr 2 MoO 4 (PO 4 ) 2 , Hf 2 WO 4 (PO 4 ) 2 , Hf may be used alone. 2 MoO 4 (PO 4 ) 2 , zirconium phosphate, zircon, zirconia, tin oxide, aluminum titanate, quartz, β-spodumene, mullite, titanium oxide, quartz glass, β-eucryptite, NaZr 2 (PO 4 ) 3 type solid solution such as β-quartz, strontium zinc ore, cordierite, Sr 0.5 Zr 2 (PO 4 ) 3 or the like may be used in combination of two or more kinds. Further, as for the particle diameter of the refractory filler, it is preferred to use an average particle diameter D 50 of about 0.2 to 20 μm.
本發明之玻璃組合物及密封材料之軟化點較佳為400℃以下、390℃以下、380℃以下，尤佳為370℃以下。若軟化點過高，則玻璃之黏性變高，故而有密封溫度上升而於密封時使元件劣化之虞。再者，軟化點之下限並無特別限定，現實而言為180℃以上。此處，所謂「軟化點」，係將平均粒徑D50 為0.5～20 μm之玻璃組合物及密封材料作為測定試樣，利用大樣品量型示差熱分析裝置測得之值。作為測定條件，自室溫開始測定，並將升溫速度設為10℃/分鐘。再者，利用大樣品量型示差熱分析裝置所測得之軟化點係指圖1所示之測定曲線中之第四反曲點之溫度(Ts)。The softening point of the glass composition and the sealing material of the present invention is preferably 400 ° C or lower, 390 ° C or lower, or 380 ° C or lower, and particularly preferably 370 ° C or lower. When the softening point is too high, the viscosity of the glass becomes high, so that the sealing temperature rises and the element is deteriorated at the time of sealing. Further, the lower limit of the softening point is not particularly limited, and is actually 180 ° C or more. Here, the "softening point" is a value measured by a large sample amount type differential thermal analyzer using a glass composition having an average particle diameter D 50 of 0.5 to 20 μm and a sealing material as a measurement sample. The measurement conditions were measured from room temperature, and the temperature increase rate was set to 10 ° C / min. Furthermore, the softening point measured by the large sample size differential thermal analyzer refers to the temperature (Ts) of the fourth inflection point in the measurement curve shown in FIG.
本發明之玻璃組合物及密封材料之熱膨脹係數(30～150℃)較佳為40×10-7 /℃～250×10-7 /℃、50×10-7 /℃～230×10-7 /℃，尤佳為60×10-7 /℃～200×10-7 /℃。熱膨脹係數過低或過高時，均會因與被密封材料之膨脹差而導致於密封時或密封後密封部容易破損。The glass composition and the sealing material of the present invention preferably have a coefficient of thermal expansion (30 to 150 ° C) of 40 × 10 -7 / ° C to 250 × 10 -7 / ° C, 50 × 10 -7 / ° C to 230 × 10 -7 / ° C, particularly preferably 60 × 10 -7 / ° C ~ 200 × 10 -7 / ° C. When the coefficient of thermal expansion is too low or too high, the sealing portion is easily broken at the time of sealing or after sealing due to the difference in expansion from the material to be sealed.
具有上述特性之本發明之玻璃組合物及密封材料尤其適於被要求以低溫進行密封之水晶振動子用途。The glass composition and sealing material of the present invention having the above characteristics are particularly suitable for crystal vibrator applications which are required to be sealed at a low temperature.
其次，對使用本發明之玻璃組合物之玻璃粉末之製造方法、及將本發明之玻璃組合物用作密封材料之方法之一例進行說明。Next, an example of a method for producing a glass powder using the glass composition of the present invention and a method for using the glass composition of the present invention as a sealing material will be described.
首先，將以具有上述組成之方式調製之原料粉末以800～1000℃熔融1～2小時，直至獲得均質之玻璃。繼而，將熔融玻璃成形為膜狀等，其後進行粉碎、分級，藉此製作包含本發明之玻璃組合物之玻璃粉末。再者，玻璃粉末之平均粒徑D50 較佳為2～20 μm左右。根據需要在玻璃粉末中添加各種耐火性填料粉末。First, the raw material powder prepared in the above-described composition is melted at 800 to 1000 ° C for 1 to 2 hours until a homogeneous glass is obtained. Then, the molten glass is molded into a film shape or the like, and then pulverized and classified to prepare a glass powder containing the glass composition of the present invention. Further, the average particle diameter D 50 of the glass powder is preferably about 2 to 20 μm. Various refractory filler powders are added to the glass powder as needed.
繼而，於玻璃粉末(或者密封材料)中添加載劑並加以混練，藉此製備玻璃漿料(或者密封材料漿料)。載劑主要包含有機溶劑與樹脂，樹脂係以調整漿料之黏性為目的而添加。又，亦可根據需要添加界面活性劑、增黏劑等。Then, a carrier is added to a glass powder (or a sealing material) and kneaded, thereby preparing a glass paste (or a sealing material slurry). The carrier mainly contains an organic solvent and a resin, and the resin is added for the purpose of adjusting the viscosity of the slurry. Further, a surfactant, a tackifier, or the like may be added as needed.
有機溶劑較佳為沸點較低(例如，沸點為300℃以下)，且焙燒後之殘渣較少，此外，不會使玻璃變質，其含量較佳為10～40質量%。作為有機溶劑，較佳為使用碳酸丙二酯、甲苯、N,N'-二甲基甲醯胺(DMF)、1,3-二甲基-2-咪唑啶酮(DMI)、碳酸二甲酯、丁基卡必醇乙酸酯(BCA)、乙酸異戊酯、二甲基亞碸、丙酮、甲基乙基酮等。又，作為有機溶劑，進而較佳為使用高級醇。高級醇由於其自身具有黏性，故而即便不於載劑中添加樹脂，亦能夠漿料化。又，戊二醇與其衍生物、具體而言二乙基戊二醇(C9 H20 O2 )亦由於黏性優異，故而能夠用於溶劑。The organic solvent preferably has a low boiling point (for example, a boiling point of 300 ° C or less), and has less residue after calcination, and further, does not deteriorate the glass, and the content thereof is preferably from 10 to 40% by mass. As the organic solvent, propylene carbonate, toluene, N,N'-dimethylformamide (DMF), 1,3-dimethyl-2-imidazolidinone (DMI), and dimethyl carbonate are preferably used. Ester, butyl carbitol acetate (BCA), isoamyl acetate, dimethyl hydrazine, acetone, methyl ethyl ketone, and the like. Further, as the organic solvent, it is more preferred to use a higher alcohol. Since the higher alcohol has its own viscosity, it can be slurried even if no resin is added to the carrier. Further, since pentanediol and its derivative, specifically diethyl pentanediol (C 9 H 20 O 2 ), are also excellent in viscosity, they can be used as a solvent.
樹脂較佳為分解溫度較低，焙燒後之殘渣較少，此外，不易使玻璃變質，其含量較佳為0.1～20質量%。作為樹脂，較佳為使用硝化纖維素、聚乙二醇衍生物、聚乙二醇碳酸酯、丙烯酸酯(丙烯酸系樹脂)等。The resin preferably has a low decomposition temperature and a small residue after baking, and further, it is difficult to deteriorate the glass, and the content thereof is preferably from 0.1 to 20% by mass. As the resin, nitrocellulose, a polyethylene glycol derivative, polyethylene glycol carbonate, acrylate (acrylic resin) or the like is preferably used.
其次，使用分注器或網版印刷機等塗佈機將漿料塗佈於包含金屬、陶瓷、或玻璃之第一構件與包含金屬、陶瓷、或玻璃之第二構件之密封部位，加以乾燥，並以300～400℃進行熱處理。藉由該熱處理，玻璃粉末軟化流動而將第一與第二構件密封。Next, the slurry is applied to a sealing portion containing a first member of metal, ceramic, or glass and a second member containing metal, ceramic, or glass using a coater such as a dispenser or a screen printer, and dried. And heat treatment at 300 to 400 °C. By this heat treatment, the glass powder softens and flows to seal the first and second members.
本發明之玻璃組合物及密封材料除密封以外亦能夠用於被覆、填充等目的。又，亦能夠以漿料以外之形態、具體而言粉末、坯片、小片等狀態使用。 [實施例]The glass composition and the sealing material of the present invention can be used for coating, filling, and the like in addition to sealing. Further, it can also be used in a form other than a slurry, specifically, a powder, a green sheet, a small piece, or the like. [Examples]
基於實施例對本發明進行詳細說明。表1及2表示本發明之實施例(試樣No.1～10)及比較例(試樣No.11、12)。The invention will be described in detail based on the examples. Tables 1 and 2 show examples (samples Nos. 1 to 10) and comparative examples (samples Nos. 11 and 12) of the present invention.
[表1]
[表2]
首先，以成為表中所示之玻璃組成之方式調製各種氧化物、碳酸鹽等玻璃原料，準備玻璃批料，然後，將該玻璃批料放入至鉑坩堝，以800～1000℃熔融1～2小時。其次，將熔融玻璃之一部分作為TMA(推桿式熱膨脹係數測定)用樣品，流出至不鏽鋼製之模具，並將其他熔融玻璃利用水冷輥成形成膜狀。再者，關於不含耐火性填料之No.1、2、4、5、6、8、9、11、12，係藉由於成形後進行特定之緩冷處理(退火)而獲得TMA用樣品。最後，利用球磨機將膜狀之玻璃粉碎後，通過網眼為75 μm之篩，獲得平均粒徑D50 約為10 μm之玻璃粉末。First, a glass raw material such as various oxides and carbonates is prepared in such a manner as to be a glass composition shown in the table, and a glass batch is prepared. Then, the glass batch is placed in a platinum crucible and melted at 800 to 1000 ° C. 2 hours. Next, a part of the molten glass was used as a sample for TMA (Pushing Rod Type Thermal Expansion Coefficient), and it flowed out to a mold made of stainless steel, and the other molten glass was formed into a film shape by a water-cooling roll. Further, No. 1, 2, 4, 5, 6, 8, 9, 11, 12, which does not contain a refractory filler, was obtained by performing a specific slow cooling treatment (annealing) after molding to obtain a sample for TMA. Finally, the film-shaped glass was pulverized by a ball mill, and passed through a sieve having a mesh size of 75 μm to obtain a glass powder having an average particle diameter D 50 of about 10 μm.
其後，關於混合耐火性填料之No.3、7、10之試樣，係如表中所示，將獲得之玻璃粉末與耐火性填料粉末混合而獲得混合粉末。Thereafter, the samples of No. 3, 7, and 10 in which the refractory filler was mixed were mixed with the refractory filler powder to obtain a mixed powder as shown in the table.
耐火性填料粉末係使用NbZr(PO4 )3 (表中記為NZP)、Zr2 WO4 (PO4 )2 (表中記為ZWP)。又，耐火性填料粉末之平均粒徑D50 約為10 μm。As the refractory filler powder, NbZr(PO 4 ) 3 (hereinafter referred to as NZP) and Zr 2 WO 4 (PO 4 ) 2 (hereinafter referred to as ZWP) were used. Further, the refractory filler powder has an average particle diameter D 50 of about 10 μm.
對獲得之混合粉末以380℃焙燒30分鐘，獲得焙燒體。將獲得之焙燒體作為TMA用樣品。The obtained mixed powder was baked at 380 ° C for 30 minutes to obtain a calcined body. The obtained calcined body was used as a sample for TMA.
對於No.1～10之試樣，評價玻璃轉移點、熱膨脹係數、軟化點、流動性。For the samples No. 1 to 10, the glass transition point, thermal expansion coefficient, softening point, and fluidity were evaluated.
玻璃轉移點及熱膨脹係數(30～150℃)係藉由TMA裝置而測定TMA用樣品所得。The glass transition point and the coefficient of thermal expansion (30 to 150 ° C) were obtained by measuring the sample for TMA by a TMA apparatus.
軟化點係藉由大樣品量型示差熱分析裝置測定。測定氛圍設為大氣中、升溫速度設為10℃/分鐘，自室溫開始測定。The softening point was measured by a large sample size differential thermal analyzer. The measurement atmosphere was set to the atmosphere, and the temperature increase rate was set to 10 ° C / min, and the measurement was started from room temperature.
流動性係以如下方式評價。將粉末試樣5 g放入至直徑20 mm之模具，進行壓製成型後，在玻璃基板上以380℃焙燒30分鐘。將焙燒體之流動徑為19 mm以上者設為「○」，將未達19 mm者設為「×」進行評價。The fluidity was evaluated in the following manner. 5 g of the powder sample was placed in a mold having a diameter of 20 mm, and subjected to press molding, followed by baking at 380 ° C for 30 minutes on a glass substrate. When the flow diameter of the calcined body is 19 mm or more, it is set to "○", and when it is less than 19 mm, it is set to "x".
根據表可知，本發明之實施例之No.1～10之試樣的流動性優異。另一方面，比較例之No.11之試樣由於過量地含有Ag2 O，故而未玻璃化。No.12之試樣由於MoO3 之含量較少，故而未玻璃化。 [產業上之可利用性]According to the table, the samples of Nos. 1 to 10 of the examples of the present invention were excellent in fluidity. On the other hand, the sample No. 11 of the comparative example was not vitrified because it contained Ag 2 O excessively. The sample No. 12 was not vitrified because the content of MoO 3 was small. [Industrial availability]
本發明之玻璃組合物及密封材料適宜用於半導體積體電路、水晶振動子、平面顯示裝置或LD用玻璃端子之密封。The glass composition and the sealing material of the present invention are suitably used for sealing a semiconductor integrated circuit, a crystal vibrator, a flat display device, or a glass terminal for LD.
圖1係表示藉由大樣品量型示差熱分析裝置所獲得之測定曲線之模式圖。Fig. 1 is a schematic view showing a measurement curve obtained by a large sample size differential thermal analyzer.
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