TW201933746A - Power supply device and laser device capable of increasing the operating frequency of an intermittent load - Google Patents
Power supply device and laser device capable of increasing the operating frequency of an intermittent load Download PDFInfo
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- TW201933746A TW201933746A TW107145417A TW107145417A TW201933746A TW 201933746 A TW201933746 A TW 201933746A TW 107145417 A TW107145417 A TW 107145417A TW 107145417 A TW107145417 A TW 107145417A TW 201933746 A TW201933746 A TW 201933746A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
- H01S3/09702—Details of the driver electronics and electric discharge circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
- H01S3/0975—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser using inductive or capacitive excitation
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/01—Details
- H03K3/011—Modifications of generator to compensate for variations in physical values, e.g. voltage, temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/53—Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback
- H03K3/57—Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback the switching device being a semiconductor device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
- Dc-Dc Converters (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
本發明係有關一種電源裝置。The invention relates to a power supply device.
作為產業用加工工具,廣泛普及有雷射加工裝置。圖1係雷射加工裝置1r的方塊圖。雷射加工裝置1r具備CO2
雷射等雷射光源2及向雷射光源2供給交流電力,並使其激勵之雷射驅動裝置4r。雷射驅動裝置4r具備直流電源6及高頻電源8。直流電源6為恆壓電源,藉由使用了PID(比例積分微分:Proportional-Integral-Differential)控制或PI(比例積分)控制等之回饋控制而使作為其輸出之直流電壓VDC
穩定在目標值。高頻電源8接受直流電壓VDC
,並將其轉換為交變電壓,供給到作為負載的雷射光源2。
在鑽孔用雷射加工裝置1r中,雷射光源2不連續運轉。亦即,交替地重複比較短的幾微秒~10微秒左右的發光期間和與其相同程度或比其短或比其長的停止期間。為了使雷射光源2的輸出能穩定化,直流電壓VDC
必須在規定的容許範圍(標準電壓範圍)內。
(先前技術文獻)
(專利文獻)
專利文獻1:日本特開2002-254186號公報
專利文獻2:日本特開平8-168891號公報Laser processing devices are widely used as industrial processing tools. FIG. 1 is a block diagram of a laser processing apparatus 1r. The laser processing device 1r includes a laser light source 2 such as a CO 2 laser, and a laser driving device 4r that supplies AC power to the laser light source 2 and excites it. The laser driving device 4r includes a DC power supply 6 and a high-frequency power supply 8. The DC power supply 6 is a constant voltage power supply, and stabilizes the DC voltage V DC as a target value by using feedback control such as PID (Proportional-Integral-Differential) control or PI (Proportional-Integral) control. . The high-frequency power source 8 receives the DC voltage V DC , converts it into an alternating voltage, and supplies it to the laser light source 2 as a load.
In the laser processing device 1r for drilling, the laser light source 2 is not continuously operated. That is, a relatively short light emission period of about several microseconds to about 10 microseconds and a stop period of the same degree or shorter than or longer than that are alternately repeated. In order to stabilize the output of the laser light source 2, the DC voltage V DC must be within a predetermined allowable range (standard voltage range).
(Prior technical literature)
(Patent Literature)
Patent Document 1: Japanese Patent Application Laid-Open No. 2002-254186 Patent Document 2: Japanese Patent Application Laid-Open No. 8-168891
(本發明所欲解決之課題)
圖2係圖1的雷射加工裝置1r的動作波形圖。為了易於理解,適當擴大、縮小本說明書中參閱的波形圖或時序圖的縱軸及橫軸,並且為了易於理解,所示之各波形亦被簡化或者誇張或強調。
根據雷射光源2的點亮、熄滅,高頻電源8重複動作期間與停止期間。高頻電源8從停止期間轉移到動作期間時,在直流電源6中產生回饋的響應延遲,直流電壓VDC
下降,有可能脫離容許範圍。高頻電源8從動作期間轉移到停止期間時,因回饋延遲而直流電壓VDC
上升,有可能脫離容許範圍。
本發明係在該種狀況下完成的,其一種態樣的例示性目的之一在於提供一種能夠提高進行間歇動作之負載的動作頻率之電源裝置。
(用以解決課題之手段)
本發明的一種態樣係有關一種電源裝置。電源裝置具備:電容器組,連接有進行間歇動作之負載;及充電電源,包含切換轉換器,且對電容器組進行充電。充電電源進行以負載的動作開始為觸發而導通1次切換轉換器的低側電晶體之主充電。
依該態樣,不等待高頻電源的動作結束,能夠與高頻電源的動作並行而對電容器組進行充電,因此能夠提高負載的重複頻率。
低側電晶體的導通時間可以按高頻電源的每一動作循環來更新。藉此,能夠抑制電容器組的電壓的漂移。
低側電晶體的導通時間可以為固定導通時間與校正導通時間之和。某一動作循環中的校正導通時間可以根據其之前的動作循環中的電容器組的電壓與目標電壓的誤差來調節。
充電電源進行主充電之結果,電容器組的電壓脫離標準電壓範圍時,可以進行子充放電。在主充電中進行粗略充電,在子充放電中,進行伴隨導通時間的回饋控制之精密充電,由此能夠使脫離標準電壓範圍之電容器組的電壓恢複到標準電壓範圍內。
主充電中的低側電晶體的導通時間可以藉由PI(比例/積分)控制或PID(比例/積分/微分)控制來調節。在發生了子充放電之動作循環的下一動作循環中,可以使用之前的動作循環的子充放電的導通時間,作為主充電中的低側電晶體的校正導通時間。藉此,能夠優化主充電中的充電量。
本發明的另一態樣係有關一種雷射裝置。雷射裝置具備:雷射光源;高頻電源,向雷射光源間歇性地供給交變電壓;及上述電源裝置,將高頻電源作為負載。
另外,將以上構成要素的任意組合或本發明的構成要素或表現在方法、裝置、系統等之間相互取代者亦作為本發明的態樣而有效。
(發明之效果)
依本發明的一種態樣,能夠提高負載的動作頻率。(Problems to be Solved by the Invention)
Fig. 2 is an operation waveform diagram of the laser processing apparatus 1r of Fig. 1. For ease of understanding, the vertical and horizontal axes of the waveform or timing diagrams referred to in this specification are appropriately enlarged and reduced, and for ease of understanding, the waveforms shown are also simplified or exaggerated or emphasized.
When the laser light source 2 is turned on and off, the high-frequency power source 8 repeats the operation period and the stop period. When the high-frequency power supply 8 is shifted from the stop period to the operation period, a response delay in feedback is generated in the DC power supply 6, and the DC voltage V DC may drop, which may leave the allowable range. When the high-frequency power source 8 is shifted from the operation period to the stop period, the DC voltage V DC may increase due to the feedback delay, and the frequency may deviate from the allowable range.
The present invention has been completed under such circumstances, and one of the exemplary objects of one aspect thereof is to provide a power supply device capable of increasing the operating frequency of a load that performs intermittent operations.
(Means to solve problems)
One aspect of the present invention relates to a power supply device. The power supply device includes a capacitor bank connected to a load for intermittent operation, and a charging power source including a switching converter and charging the capacitor bank. The charging power source performs main charging of the low-side transistor, which is switched on once when the load operation is triggered.
According to this aspect, the capacitor bank can be charged in parallel with the operation of the high-frequency power supply without waiting for the operation of the high-frequency power supply to be completed, so that the repetition frequency of the load can be increased.
The on-time of the low-side transistor can be updated for each operating cycle of the high-frequency power supply. This makes it possible to suppress the voltage drift of the capacitor bank.
The on-time of the low-side transistor can be the sum of the fixed on-time and the corrected on-time. The correction on-time in a certain operation cycle can be adjusted according to the error between the voltage of the capacitor bank and the target voltage in the previous operation cycle.
As a result of the main charging of the charging power source, when the voltage of the capacitor bank deviates from the standard voltage range, sub-charging and discharging can be performed. Rough charging is performed in the main charging, and precision charging with feedback control accompanying the on time is performed in the sub-charging and discharging, so that the voltage of the capacitor bank out of the standard voltage range can be restored to the standard voltage range.
The on-time of the low-side transistor in the main charge can be adjusted by PI (proportional / integral) control or PID (proportional / integral / derivative) control. In the next operation cycle where the operation cycle of the sub-charge occurs, the on-time of the sub-charge of the previous operation cycle can be used as the corrected on-time of the low-side transistor in the main charge. This makes it possible to optimize the amount of charge in main charging.
Another aspect of the present invention relates to a laser device. The laser device includes a laser light source, a high-frequency power source that intermittently supplies an alternating voltage to the laser light source, and the above-mentioned power source device using the high-frequency power source as a load.
In addition, any combination of the above constituent elements, or constituent elements of the present invention, or expressions of methods, devices, systems, etc., is also effective as aspects of the present invention.
(Effect of the invention)
According to one aspect of the present invention, the operating frequency of the load can be increased.
以下,基於較佳實施形態一邊參閱附圖一邊對本發明進行說明。對各附圖中所示之相同或同等的構成要素、構件、處理標註相同的符號,並適當省略重複之說明。並且,實施形態並不限定發明,而是例示,並且實施形態中記述之所有特徵或其組合並不一定係發明的本質性內容。
圖3系具備實施形態之電源裝置200之雷射裝置100的方塊圖。雷射裝置100具備雷射光源102、高頻電源104、高位控制器106、電源裝置200。雷射光源102例如為CO2
雷射。高位控制器106生成指示雷射光源102的激勵(發光)、停止之激勵訊號SEXC
。
高頻電源104的輸入與電源裝置200連接,且其輸出與雷射光源102連接。來自電源裝置200的直流電壓VDC
供給到高頻電源104。高頻電源104根據激勵訊號SEXC
,向雷射光源102間歇性地供給交流的驅動電壓VDRV
。亦即激勵訊號SEXC
指示激勵之期間(例如高電平),高頻電源104成為激活狀態,向雷射光源102供給交流的驅動電壓VDRV
。激勵訊號SEXC
指示停止之期間(例如低電平),高頻電源104成為非激活狀態,停止向雷射光源102的供電。將高頻電源104進行開關之期間稱為動作期間,將開關停止之期間稱為停止期間。高頻電源104的構成並無特別限定,只要利用公知技術即可。
電源裝置200具備電容器組202及充電電源210。電容器組202連接有作為進行間歇動作之負載之高頻電源104。電容器組202能夠掌握為直流電源,如以其單體向高頻電源104供給電力之蓄電元件等。
充電電源210包含切換轉換器212及轉換控制器220。充電電源210對電容器組202進行充電,以使在電容器組202中產生之直流電壓VDC
包括在標準電壓範圍VTGT
內。電容器組202的電容C被設計得足夠大以使在基於高頻電源104之放電的過程中,直流電壓VDC
亦不會低於容許範圍。
充電電源210以作為負載的高頻電源104的動作開始為觸發進行主充電。例如亦可以向轉換控制器220輸入激勵訊號SEXC
或者基於該激勵訊號SEXC
之訊號,以激勵訊號SEXC
過渡為高電平的情況亦即高頻電源104的動作開始為觸發,開始進行主充電。
切換轉換器212具有升壓轉換器的拓撲。具體而言,切換轉換器212包括電抗器L1
、低側電晶體M1
、高側電晶體M2
。電晶體M1
、M2
能夠由場效電晶體(FET:Field Effect Transistor)或絕緣柵雙極電晶體(IGBT:Insulated Gate Bipolar Transistor)、雙極電晶體構成。可以使用二極體來代替高側電晶體M2
。轉換控制器220控制低側電晶體M1
及高側電晶體M2
。
主充電中,轉換控制器220將切換轉換器212的低側電晶體M1
導通1次。
以上為實施形態之雷射裝置100的基本構成。接著對雷射裝置100的基本動作進行說明。
圖4係實施形態之雷射裝置100的動作波形圖。高頻電源104根據激勵訊號SEXC
以數kHz左右的重複頻率、佔空比5%左右進行間歇動作。圖4中示出1個循環(一發雷射)的動作。
在時刻t0
,激勵訊號SEXC
成為高電平(激活),成為激勵期間TEXC
(t0
~t1
)。在激勵期間TEXC
期間,高頻電源104進行開關動作。在激勵期間TEXC
期間,電容器組202的電荷被放電,直流電壓VDC
下降與下降量ΔV相當的量。但是,由於電容器組202的電容C足夠大,因此下降後的直流電壓VDC
不會低於標準電壓範圍VTGT
的下限。
轉換控制器220以激勵訊號SEXC
向高電平的過渡為觸發而導通低側電晶體M1
,在經過導通時間TON
後的時刻t2
,斷開低側電晶體M1
。
在導通低側電晶體M1
之期間,在電抗器L1
中流動之電流(電抗器電流)IL
增大。此時的電抗器電流IL
在低側電晶體M1
中流動,因此向電容器組202的充電電流ICHG
為零。
轉換控制器220在時刻t2
斷開低側電晶體M1
。若斷開低側電晶體M1
,則電抗器電流IL
隨時間減少。此時的電抗器電流IL
作為充電電流ICHG
,經由高側電晶體M2
的內接二極體(或者外置之二極體)供給到電容器組202。其結果,電容器組202的直流電壓VDC
上升,恢複到原始電壓電平。
對導通時間TON
進行說明。為簡單起見,下降量ΔV取決於雷射光源102的輸出,視為實質上恆定。在雷射光源102的激勵期間,從電容器組202向高頻電源104供給之電荷量Q成為Q=C×ΔV。因此,以充電電流ICHG
的時間積分值與電荷量Q一致之方式規定導通時間TON
即可。
轉換控制器220斷開低側電晶體M1
之後,如一點虛線所示亦可以導通高側電晶體M2
(同步整流模式)。在該情況下,充電電流ICHG
經由高側電晶體M2
的通道而流過。以上為雷射裝置100的動作。
藉由與比較技術的對比來明確電源裝置200的優點。圖5係比較技術之電源裝置的動作波形圖。比較技術中,激勵訊號SEXC
成為低電平,在高頻電源104停止之後,導通低側電晶體M1
。因此,1個循環的週期(重複週期)TCYC
由不等式(1)表示。
另一方面,依實施形態之電源裝置200,不等待高頻電源104的動作結束,能夠與高頻電源104的動作並行而對電容器組202進行充電。具體而言,1個循環的週期TCYC
由不等式(2)表示。
從不等式(1)與(2)的比較可知,依實施形態之電源裝置200,能夠縮短作為負載的高頻電源104的1個循環的週期,進而能夠提高負載的重複頻率。
本發明被掌握為圖3的方塊圖或電路圖,或者涉及從上述說明導出之各種裝置、電路,並不限定於特定構成。以下,並不是為了縮小本發明的範圍,而是助於理解發明的本質或電路動作,並且為了明確該些,對更具體的構成例或實施例進行說明。
(可變導通時間控制)
若雷射光源102的輸出能從設計值偏離,則電容器組202的電壓的下降量ΔV從設計值偏離。此時,若以預先規定之導通時間TON
進行主充電,則由充電產生之直流電壓VDC
的恢複量與由放電產生之下降量ΔV不平衡,從而直流電壓VDC
漂移。
或者若轉換控制器220的輸入電壓發生變動,則由充電產生之直流電壓VDC
的恢複量從設計值偏離,因此與由放電產生之下降量ΔV之間產生不平衡,從而直流電壓VDC
漂移。
為了抑制直流電壓VDC
的漂移,可以將低側電晶體M1
的導通時間TON
設為可變,按負載(高頻電源104)的每一動作循環來進行更新。圖6係與可變導通時間控制對應之轉換控制器220A的方塊圖。轉換控制器220A的主要部分可以藉由軟體程式和執行該軟體程式之處理器的組合來安裝,亦可以藉由硬體來安裝。轉換控制器220A的控制對象221包含脈寬調變器230或不圖示的驅動器、切換轉換器212、電容器組202。
轉換控制器220A中,低側電晶體M1
的導通時間TON
為固定導通時間TON_FIX
與校正導通時間ΔTON
之和。
固定導通時間TON_FIX
能夠依據每一發的直流電壓VDC
的下降量ΔV的設計值來進行規定。校正導通時間ΔTON
能夠取零、正或負。
某一動作循環中的校正導通時間ΔTON
根據其之前的動作循環中的電容器組202的充電結束時的直流電壓VDC
與目標電壓VREF
的誤差來調節。亦即,檢測直流電壓VDC
與目標電壓VREF
的誤差,並調節下一動作循環的校正導通時間ΔTON
,以使該些的誤差電壓VERR
接近零。
在某一動作循環i(i=1,2……)中,充電後的電壓VDC
藉由A/D轉換器222轉換為數位值VDC
[i]。減法器224從目標電壓值VREF
減去直流電壓值VDC
[i],生成誤差值VERR
[i]。PID(比例/積分/微分)控制器226依據誤差值VERR
[i],生成下一動作循環的校正導通時間ΔTON
[i+1]。藉由加法器228,將固定導通時間TON_FIX
和校正導通時間ΔTON
[i+1]加在一起,確定導通時間TON
[i+1]。脈寬調變器230在導通時間TON
[i+1]期間,生成成為高電平之脈衝訊號,並驅動切換轉換器212。可以採用PI控制器來代替PID控制器226。
以上係可變導通時間控制的說明。圖7(a)係表示固定了導通時間時的直流電壓VDC
的波形的一例之圖,圖7(b)係表示進行了可變導通時間控制時的直流電壓VDC
的波形的一例之圖。
如圖7(a)所示,若固定導通時間TON
,則因負載變動或輸入電壓變動等而在電容器組202的充電電荷量與放電電荷量之間產生不平衡,從而直流電壓VDC
在每一循環中漂移,最終導致脫離標準電壓範圍VTGT
。
相對於此,如圖7(b)所示,若導入可變導通時間控制,則抑制直流電壓VDC
的漂移,能夠保持在標準電壓範圍VTGT
內。除此以外,藉由PID控制來校正導通時間以使在每一循環中充電後的直流電壓VDC
接近目標電壓VREF
,因此能夠抑制雷射光源102的輸出能的變動。
(子充放電)
在1次主充電之後,亦能夠引起電容器組202的直流電壓VDC
脫離標準電壓範圍VTGT
的情況。這在如下狀況下發生,亦即,即使導入了可變導通時間控制的情況下,電容器組202的直流電壓VDC
的下降量ΔV亦急劇發生變動,或輸入電壓VIN
亦急劇發生變動。在直流電壓VDC
脫離標準電壓範圍VTGT
之期間,藉由高位控制器106而禁止雷射的發射,因此生產性下降。
因此,充電電源210進行1次主充電之結果,電容器組202的電壓VDC
脫離標準電壓範圍VTGT
時,進行子充放電。子充放電中,以高於主充電的精度,調節向電容器組202供給或者從該電容器組202提取之電流量。亦可以將子充放電稱為精密充放電。
圖8係與子充放電對應之轉換控制器220B的方塊圖。轉換控制器220B除了圖6的轉換控制器220A以外,還包括子充放電控制器240。主充電中,PID控制器226有效。
結束主充電之後,若直流電壓VDC
脫離標準電壓範圍VTGT
,則子充放電控制器240有效。子充放電控制器240能夠採用P控制、PI控制、PID控制中的任一種。子充放電控制器240回饋控制導通時間TON_FINE
以使直流電壓VDC
接近基準電壓VREF
,亦即誤差電壓VERR
接近零,且控制切換轉換器212。另外,正的導通時間TON_FINE
能夠與追加的充電建立對應關係,負的導通時間TON_FINE
能夠與追加的放電建立對應關係。當TON_FINE
為負時,切換轉換器212以高側電晶體M2
先行導通之降壓模式進行動作。
圖9(a)、圖9(b)係說明子充放電之時序圖。在時刻t0
激勵訊號SEXC
成為高電平,實施主充電,電容器組202的電壓VDC
上升。如圖9(a)所示,進行主充電之結果,若電壓VDC
低於標準電壓範圍VTGT
,則進行子充電。具體而言,轉換控制器220B回饋控制導通時間TON_FINE
以使誤差電壓VERR
接近零,並且對切換轉換器212的低側電晶體M1
進行至少1次開關。
如圖9(b)所示,進行主充電之結果,若電壓VDC
高於標準電壓範圍VTGT
,則進行子放電。具體而言,轉換控制器220B回饋控制導通時間TON_FINE
以使誤差電壓VERR
接近零,並且對切換轉換器212的高側電晶體M2
進行至少1次開關。
導入子充放電,回饋控制切換轉換器212,由此能夠使脫離標準電壓範圍之電壓VDC
恢複到標準電壓範圍VTGT
。
(從子充放電向主充電的切換)
另外,發生了子充放電之動作循環的下一動作循環中,可以使用之前的子充放電的導通時間TON_FINE
,作為主充電中的低側電晶體M1
的校正導通時間ΔT[i+1]。這可以藉由用TON_FINE
替換PID控制器226的積分項的值來實現。圖10係說明子充放電的導通時間TON_FINE
向主充電的反映之圖。
圖11(a)係不進行圖10的控制時的動作波形圖,圖11(b)係進行了圖10的控制時的動作波形圖。當不進行圖10的控制時,如圖11(a)所示,在每一循環中發生子放電。亦即重複週期變長與子放電的時間相當的量。相對於此進行了圖10的控制時,如圖11(b)所示,能夠防止在複數個循環中連續發生子放電,因此能夠提高雷射的重複頻率。
(用途)
接著對雷射裝置100的用途進行說明。圖12係表示具備雷射裝置100之雷射加工裝置300之圖。雷射加工裝置300向對象物302照射雷射脈衝304,從而對對象物302進行加工。對象物302的種類並無特別限定,並且加工的種類雖例示有鑽孔(drill)、切斷等,但亦並不限於此。
雷射加工裝置300具備雷射裝置100、光學系統310、控制裝置320、載台330。對象物302載置於載台330上,並根據需要進行固定。載台330根據來自控制裝置320的位置控制訊號S2
,將對象物302進行定位,相對掃描對象物302和雷射脈衝304的照射位置。載台330可以為1軸、2軸(XY)或者3軸(XYZ)。
雷射裝置100根據來自控制裝置320的觸發訊號(激勵訊號)S1
來進行振盪,產生雷射脈衝306。光學系統310向對象物302照射雷射脈衝306。光學系統310的構成並無特別限定,能夠包含用於將光束引導到對象物302之鏡組群、用於光束整形之透鏡或光圈等。
控制裝置320統括控制雷射加工裝置300。具體而言控制裝置320對雷射裝置100間歇性地輸出觸發訊號S1
。並且控制裝置320根據記述加工處理之資料(製法)來生成用於控制載台330之位置控制訊號S2
。
以上,基於幾種實施形態對本發明進行了說明。所屬技術領域中具有通常知識者理解該些實施形態為例示,在該些各構成要素或各處理製程的組合中能夠進行各種變形例,並且該種變形例亦屬於本發明的範圍。以下,對該種變形例進行說明。
實施形態中,藉由共同的轉換器來進行了主充電和子充放電,但並不限於此,亦可以準備主充電用切換轉換器及子充放電用切換轉換器這2個系統。
實施形態之電源裝置200的用途並不限定於電源裝置200,能夠用作向進行間歇動作之負載供給直流電壓之用途。
依據實施形態,並使用具體詞句來對本發明進行了說明,但實施形態僅示出本發明的原理、應用的一側面,實施形態中,在不脫離申請專利範圍中所規定之本發明的思想之範圍內,允許較多的變形例或配置的變更。Hereinafter, the present invention will be described based on a preferred embodiment with reference to the drawings. The same or equivalent constituent elements, components, and processes shown in the drawings are denoted by the same reference numerals, and repeated descriptions are appropriately omitted. In addition, the embodiments are not limited to the invention, but are exemplified, and all the features or combinations described in the embodiments are not necessarily essential to the invention.
FIG. 3 is a block diagram of a laser device 100 including a power supply device 200 according to an embodiment. The laser device 100 includes a laser light source 102, a high-frequency power source 104, a high-level controller 106, and a power source device 200. The laser light source 102 is, for example, a CO 2 laser. The high-level controller 106 generates an excitation signal S EXC indicating the excitation (light emission) and stop of the laser light source 102.
An input of the high-frequency power source 104 is connected to the power source device 200, and an output thereof is connected to the laser light source 102. The DC voltage V DC from the power source device 200 is supplied to the high-frequency power source 104. The high-frequency power source 104 intermittently supplies an AC drive voltage V DRV to the laser light source 102 based on the excitation signal S EXC . That is, the excitation signal S EXC indicates the period of excitation (for example, high level), the high-frequency power source 104 becomes active, and the laser light source 102 is supplied with the AC driving voltage V DRV . During the period when the excitation signal S EXC is stopped (for example, low level), the high-frequency power source 104 becomes inactive, and the power supply to the laser light source 102 is stopped. A period during which the high-frequency power source 104 is switched is referred to as an operation period, and a period during which the switch is stopped is referred to as a stop period. The configuration of the high-frequency power supply 104 is not particularly limited as long as a known technique is used.
The power supply device 200 includes a capacitor group 202 and a charging power source 210. The capacitor bank 202 is connected to a high-frequency power source 104 as a load that performs intermittent operations. The capacitor pack 202 can be regarded as a direct current power source, such as a power storage element that supplies power to the high-frequency power source 104 with a single unit.
The charging power source 210 includes a switching converter 212 and a conversion controller 220. The charging power source 210 charges the capacitor group 202 so that the DC voltage V DC generated in the capacitor group 202 is included in the standard voltage range V TGT . The capacitance C of the capacitor group 202 is designed to be sufficiently large so that the DC voltage V DC does not fall below the allowable range during the discharge based on the high-frequency power source 104.
The charging power source 210 performs main charging by triggering the operation of the high-frequency power source 104 as a load. For example, an excitation signal S EXC or a signal based on the excitation signal S EXC can also be input to the conversion controller 220, and when the excitation signal S EXC transitions to a high level, that is, the action of the high-frequency power source 104 starts as a trigger, and the main Charging.
The switching converter 212 has a topology of a boost converter. Specifically, the switching converter 212 includes a reactor L 1 , a low-side transistor M 1 , and a high-side transistor M 2 . The transistors M 1 and M 2 can be composed of a field effect transistor (FET: Field Effect Transistor), an insulated gate bipolar transistor (IGBT), or a bipolar transistor. Instead of the high-side transistor M 2, a diode can be used. The conversion controller 220 controls the low-side transistor M 1 and the high-side transistor M 2 .
During the main charging, the conversion controller 220 turns on the low-side transistor M 1 of the switching converter 212 once.
The above is the basic configuration of the laser device 100 according to the embodiment. Next, a basic operation of the laser device 100 will be described.
FIG. 4 is an operation waveform diagram of the laser device 100 according to the embodiment. The high-frequency power source 104 performs intermittent operation at a repetition frequency of several kHz and a duty ratio of about 5% according to the excitation signal S EXC . FIG. 4 shows the operation in one cycle (one laser).
At time t 0 , the excitation signal S EXC becomes high level (activated), and becomes the excitation period T EXC (t 0 to t 1 ). During the excitation period T EXC , the high-frequency power source 104 performs a switching operation. During the excitation period T EXC , the charge of the capacitor group 202 is discharged, and the DC voltage V DC drops by an amount corresponding to the amount of drop ΔV. However, since the capacitance C of the capacitor group 202 is sufficiently large, the reduced DC voltage V DC will not be lower than the lower limit of the standard voltage range V TGT .
Conversion controller 220 to the excitation signal S EXC to HIGH transition triggered by conduction to the low-side transistor M 1, the elapsed time after the on-time T ON t 2, disconnect the low side transistor M 1.
While the low-side transistor M 1 is turned on, the current (reactor current) I L flowing in the reactor L 1 increases. At this time, the reactor current I L on the low side transistor M 1 flows, and therefore to the capacitor charging current I CHG 202 is zero.
The switching controller 220 turns off the low-side transistor M 1 at time t 2 . If the low-side transistor M 1 is turned off, the reactor current I L decreases with time. The reactor current I L at this time is used as the charging current I CHG and is supplied to the capacitor group 202 via the internal diode (or external diode) of the high-side transistor M 2 . As a result, the DC voltage V DC of the capacitor bank 202 rises and returns to the original voltage level.
The on-time T ON will be described. For simplicity, the amount of decrease ΔV depends on the output of the laser light source 102 and is considered to be substantially constant. During the excitation period of the laser light source 102, the amount of charge Q supplied from the capacitor group 202 to the high-frequency power source 104 becomes Q = C × ΔV. Therefore, the ON time T ON may be specified so that the time integral value of the charging current I CHG coincides with the charge amount Q.
After the switching controller 220 turns off the low-side transistor M 1 , the high-side transistor M 2 can also be turned on as shown by a dotted line (synchronous rectification mode). In this case, the charging current I CHG flows through the channel of the high-side transistor M 2 . The above is the operation of the laser device 100.
The advantages of the power supply device 200 are clarified by comparison with the comparative technology. FIG. 5 is an operation waveform diagram of a power supply device of a comparative technology. In the comparison technique, the excitation signal S EXC becomes a low level, and after the high-frequency power source 104 stops, the low-side transistor M 1 is turned on. Therefore, the period (repetition period) T CYC of 1 cycle is represented by inequality (1).
On the other hand, according to the power supply device 200 of the embodiment, the capacitor bank 202 can be charged in parallel with the operation of the high-frequency power source 104 without waiting for the operation of the high-frequency power source 104 to end. Specifically, the period T CYC of one cycle is represented by inequality (2).
As can be seen from the comparison of the inequality (1) and (2), according to the power supply device 200 of the embodiment, the cycle of one cycle of the high-frequency power source 104 as a load can be shortened, and the repetition frequency of the load can be increased.
The present invention is understood to be a block diagram or a circuit diagram of FIG. 3, or various devices and circuits derived from the above description, and is not limited to a specific configuration. In the following, not to narrow the scope of the present invention, but to help understand the nature of the invention or circuit operation, and to clarify these, a more specific configuration example or embodiment will be described.
(Variable on-time control)
If the output of the laser light source 102 can deviate from the design value, the amount of decrease ΔV of the voltage of the capacitor group 202 deviates from the design value. At this time, if the main charging is performed with a predetermined ON time T ON , the recovery amount of the DC voltage V DC generated by the charging and the decrease amount ΔV generated by the discharge are unbalanced, so that the DC voltage V DC drifts.
Or, if the input voltage of the conversion controller 220 changes, the recovery amount of the DC voltage V DC generated by the charging deviates from the design value, so an imbalance is generated between the DC voltage V DC generated by the discharge and the DC voltage V DC drifts. .
In order to suppress the drift of the DC voltage V DC , the on-time T ON of the low-side transistor M 1 can be set to be variable and updated for each operation cycle of the load (high-frequency power source 104). FIG. 6 is a block diagram of the conversion controller 220A corresponding to the variable on-time control. The main part of the conversion controller 220A may be installed by a combination of a software program and a processor executing the software program, or may be installed by hardware. The control object 221 of the conversion controller 220A includes a pulse width modulator 230 or a driver (not shown), a switching converter 212, and a capacitor group 202.
In the conversion controller 220A, the on-time T ON of the low-side transistor M 1 is the sum of the fixed on-time T ON_FIX and the corrected on-time ΔT ON .
The fixed on-time T ON_FIX can be specified according to the design value of the drop amount ΔV of the DC voltage V DC for each transmission . The correction on-time ΔT ON can take zero, positive or negative.
The correction on-time ΔT ON in a certain operation cycle is adjusted based on the error between the DC voltage V DC and the target voltage V REF at the end of the charging of the capacitor group 202 in the previous operation cycle. That is, the error between the DC voltage V DC and the target voltage V REF is detected, and the correction on-time ΔT ON of the next operation cycle is adjusted so that the error voltages V ERR are close to zero.
In a certain operation cycle i (i = 1, 2 ...), the charged voltage V DC is converted into a digital value V DC [i] by the A / D converter 222. The subtractor 224 subtracts the DC voltage value V DC [i] from the target voltage value V REF to generate an error value V ERR [i]. The PID (proportional / integral / derivative) controller 226 generates a corrected on-time ΔT ON [i + 1] of the next action cycle according to the error value V ERR [i]. The adder 228 adds the fixed on-time T ON_FIX and the corrected on-time ΔT ON [i + 1] to determine the on-time T ON [i + 1]. The pulse width modulator 230 generates a high-level pulse signal during the on time T ON [i + 1], and drives the switching converter 212. Instead of the PID controller 226, a PI controller may be used.
The above is the description of the variable on-time control. FIG. 7 (a) is a diagram showing an example of the waveform of the DC voltage V DC when the on-time is fixed, and FIG. 7 (b) is a diagram showing an example of the waveform of the DC voltage V DC when the variable on-time control is performed .
As shown in FIG. 7 (a), if the on-time T ON is fixed, an imbalance occurs between the charged charge amount and the discharged charge amount of the capacitor group 202 due to load fluctuations or input voltage fluctuations, so that the DC voltage V DC is between The drift in each cycle eventually leads to a deviation from the standard voltage range V TGT .
On the other hand, as shown in FIG. 7 (b), when the variable on-time control is introduced, the DC voltage V DC is suppressed from drifting and can be maintained within the standard voltage range V TGT . In addition, the ON time is corrected by PID control so that the DC voltage V DC after charging in each cycle approaches the target voltage V REF , so that it is possible to suppress the variation in the output energy of the laser light source 102.
(Sub charge and discharge)
After the primary charging, the DC voltage V DC of the capacitor group 202 can also cause the standard voltage range V TGT to deviate. This occurs under the following conditions. Even when the variable on-time control is introduced, the amount of drop ΔV in the DC voltage V DC of the capacitor bank 202 changes rapidly, or the input voltage V IN also changes rapidly. During the period when the DC voltage V DC deviates from the standard voltage range V TGT , the laser emission is prohibited by the high-level controller 106, and thus the productivity is lowered.
Therefore, as a result of the primary charging of the charging power source 210 once, when the voltage V DC of the capacitor bank 202 deviates from the standard voltage range V TGT , sub-charging and discharging are performed. During the sub-charging and discharging, the amount of current supplied to or extracted from the capacitor group 202 is adjusted with a higher accuracy than the main charging. The sub charge and discharge can also be referred to as precision charge and discharge.
FIG. 8 is a block diagram of the conversion controller 220B corresponding to the sub charge and discharge. The conversion controller 220B includes a sub-charge / discharge controller 240 in addition to the conversion controller 220A of FIG. 6. During the main charging, the PID controller 226 is enabled.
After the main charging is completed, if the DC voltage V DC deviates from the standard voltage range V TGT , the sub-charge controller 240 is effective. The sub-charge / discharge controller 240 can adopt any one of P control, PI control, and PID control. The sub-charging and discharging controller 240 feedback controls the on-time T ON_FINE so that the DC voltage V DC approaches the reference voltage V REF , that is, the error voltage V ERR approaches zero, and controls the switching converter 212. In addition, a positive on-time T ON_FINE can be associated with an additional charge, and a negative on-time T ON_FINE can be associated with an additional discharge. When T ON_FINE is negative, the switching converter 212 operates in a step-down mode in which the high-side transistor M 2 is turned on first.
Fig. 9 (a) and Fig. 9 (b) are timing diagrams illustrating the charge and discharge of the sub. At time t 0, the excitation signal S EXC goes to a high level, main charging is performed, and the voltage V DC of the capacitor bank 202 rises. As shown in FIG. 9 (a), as a result of the main charging, if the voltage V DC is lower than the standard voltage range V TGT , the sub charging is performed. Specifically, the conversion controller 220B feedback-controls the on-time T ON_FINE so that the error voltage V ERR approaches zero, and switches the low-side transistor M 1 of the switching converter 212 at least once.
As shown in FIG. 9 (b), as a result of the main charging, if the voltage V DC is higher than the standard voltage range V TGT , the sub-discharge is performed. Specifically, the conversion controller 220B feedback-controls the on-time T ON_FINE so that the error voltage V ERR approaches zero, and switches the high-side transistor M 2 of the switching converter 212 at least once.
By introducing the sub-charging and discharging and feedback control switching converter 212, the voltage V DC outside the standard voltage range can be restored to the standard voltage range V TGT .
(Switching from sub-charge to main charge)
In addition, in the next operation cycle where the operation cycle of the sub-charge occurs , the on-time T ON_FINE of the previous sub-charge can be used as the corrected on-time ΔT [i + 1 of the low-side transistor M 1 in the main charge ]. This can be achieved by replacing the value of the integral term of the PID controller 226 with T ON_FINE . FIG. 10 is a diagram illustrating the reflection of the on-time T ON_FINE of the sub charge and discharge to the main charge.
FIG. 11 (a) is an operation waveform diagram when the control of FIG. 10 is not performed, and FIG. 11 (b) is an operation waveform diagram when the control of FIG. 10 is performed. When the control of FIG. 10 is not performed, as shown in FIG. 11 (a), a sub-discharge occurs in each cycle. That is, the repetition period becomes longer by an amount corresponding to the sub-discharge time. On the other hand, when the control of FIG. 10 is performed, as shown in FIG. 11 (b), the sub-discharges can be prevented from continuously occurring in a plurality of cycles, and therefore the repetition frequency of the laser can be increased.
(use)
Next, an application of the laser device 100 will be described. FIG. 12 is a diagram showing a laser processing apparatus 300 including a laser apparatus 100. The laser processing apparatus 300 irradiates a laser pulse 304 to the object 302 to process the object 302. The type of the object 302 is not particularly limited, and the types of processing include drilling, cutting, and the like, but are not limited thereto.
The laser processing device 300 includes a laser device 100, an optical system 310, a control device 320, and a stage 330. The object 302 is placed on the stage 330 and fixed as necessary. The stage 330 positions the object 302 based on the position control signal S 2 from the control device 320, and scans the irradiation position of the object 302 and the laser pulse 304 relative to the object. The stage 330 may be 1-axis, 2-axis (XY), or 3-axis (XYZ).
The laser device 100 oscillates according to a trigger signal (excitation signal) S 1 from the control device 320 to generate a laser pulse 306. The optical system 310 irradiates a laser pulse 306 to the object 302. The configuration of the optical system 310 is not particularly limited, and can include a lens group for guiding a light beam to the object 302, a lens or an aperture for beam shaping, and the like.
The control device 320 collectively controls the laser processing device 300. Specifically, the control device 320 intermittently outputs a trigger signal S 1 to the laser device 100. The control device 320 generates a position control signal S 2 for controlling the stage 330 based on the data (manufacturing method) describing the processing.
The present invention has been described based on several embodiments. Those skilled in the art will understand that these embodiments are examples, and various modifications can be made in the combination of these constituent elements or processing processes, and such modifications also fall within the scope of the present invention. This modification will be described below.
In the embodiment, the main charging and the sub charging and discharging are performed by a common converter. However, the present invention is not limited to this, and two systems of a main charging switching converter and a sub charging and discharging switching converter may be prepared.
The application of the power supply device 200 according to the embodiment is not limited to the power supply device 200, and it can be used for supplying a DC voltage to a load that performs intermittent operation.
According to the embodiment, the present invention has been described using specific words and expressions, but the embodiment only shows one side of the principle and application of the present invention. In the embodiment, the idea of the present invention provided in the scope of the patent application is not departed from. Within the range, many modifications or configuration changes are allowed.
100‧‧‧雷射裝置100‧‧‧laser device
102‧‧‧雷射光源 102‧‧‧laser light source
104‧‧‧高頻電源 104‧‧‧High Frequency Power
106‧‧‧高位控制器 106‧‧‧High controller
200‧‧‧電源裝置 200‧‧‧ Power supply unit
202‧‧‧電容器組 202‧‧‧Capacitor bank
210‧‧‧充電電源 210‧‧‧ Charging Power
212‧‧‧切換轉換器 212‧‧‧Switch converter
220‧‧‧轉換控制器 220‧‧‧ Conversion Controller
226‧‧‧PID控制器 226‧‧‧PID Controller
240‧‧‧子充放電控制器 240‧‧‧ sub charge and discharge controller
L1‧‧‧電抗器L 1 ‧‧‧Reactor
M1‧‧‧低側電晶體M 1 ‧‧‧Low-side transistor
M2‧‧‧高側電晶體M 2 ‧‧‧High-Side Transistor
300‧‧‧雷射加工裝置 300‧‧‧laser processing equipment
310‧‧‧光學系統 310‧‧‧ Optical System
320‧‧‧控制裝置 320‧‧‧control device
330‧‧‧載台 330‧‧‧ carrier
圖1係雷射加工裝置的方塊圖。FIG. 1 is a block diagram of a laser processing apparatus.
圖2係圖1的雷射加工裝置的動作波形圖。 FIG. 2 is an operation waveform diagram of the laser processing apparatus of FIG. 1.
圖3係具備實施形態之電源裝置之雷射裝置的方塊圖。 Fig. 3 is a block diagram of a laser device including a power supply device according to an embodiment.
圖4係實施形態之雷射裝置的動作波形圖。 FIG. 4 is an operation waveform diagram of the laser device according to the embodiment.
圖5係比較技術之電源裝置的動作波形圖。 FIG. 5 is an operation waveform diagram of a power supply device of a comparative technology.
圖6係與可變導通時間控制對應之轉換控制器的方塊圖。 FIG. 6 is a block diagram of a conversion controller corresponding to a variable on-time control.
圖7(a)係表示固定了導通時間時的直流電壓VDC 的波形的一例之圖,圖7(b)係表示進行了可變導通時間控制時的直流電壓VDC 的波形的一例之圖。FIG. 7 (a) is a diagram showing an example of the waveform of the DC voltage V DC when the on-time is fixed, and FIG. 7 (b) is a diagram showing an example of the waveform of the DC voltage V DC when the variable on-time control is performed .
圖8係與子充放電對應之轉換控制器的方塊圖。 FIG. 8 is a block diagram of a conversion controller corresponding to a sub charge and discharge.
圖9(a)、圖9(b)係說明子充放電之時序圖。 Fig. 9 (a) and Fig. 9 (b) are timing diagrams illustrating the charge and discharge of the sub.
圖10係說明子充放電的導通時間向主充電的反映之圖。 FIG. 10 is a diagram illustrating the reflection of the on-time of the sub-charge to the main charge.
圖11(a)係不進行圖10的控制時的動作波形圖,圖11(b)係進行了圖10的控制時的動作波形圖。 FIG. 11 (a) is an operation waveform diagram when the control of FIG. 10 is not performed, and FIG. 11 (b) is an operation waveform diagram when the control of FIG.
圖12係表示具備雷射裝置之雷射加工裝置之圖。 FIG. 12 is a diagram showing a laser processing apparatus including a laser device.
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JP2018005849A JP7132718B2 (en) | 2018-01-17 | 2018-01-17 | power supply, laser equipment |
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JP3315556B2 (en) | 1994-04-27 | 2002-08-19 | 三菱電機株式会社 | Laser processing equipment |
JPH10248252A (en) * | 1997-03-07 | 1998-09-14 | Meidensha Corp | Charge device for capacitor |
JP2000068573A (en) | 1998-08-18 | 2000-03-03 | Nec Corp | Laser power unit |
KR100317390B1 (en) * | 1999-11-23 | 2001-12-24 | 권영한 | Power controlling apparatus and a pulsed laser power supplying apparatus using the same |
KR100393260B1 (en) * | 2000-10-06 | 2003-07-31 | 김규 | a pulse power supply using zero crossing control method |
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JP2012122879A (en) * | 2010-12-09 | 2012-06-28 | Advantest Corp | Power supply device, controlling method thereof, and test device using the same |
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JP5790563B2 (en) * | 2012-03-26 | 2015-10-07 | 株式会社村田製作所 | Switching power supply |
KR20130129584A (en) * | 2012-05-21 | 2013-11-29 | 박찬웅 | Method and circuit for output voltage error detect and for output voltage control by winding voltage in switching power supply |
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JP6637717B2 (en) * | 2015-10-16 | 2020-01-29 | ローム株式会社 | DC / DC converter and its control circuit, system power supply |
JP6661439B2 (en) * | 2016-03-29 | 2020-03-11 | 住友重機械工業株式会社 | Laser drive |
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TWI777322B (en) * | 2019-12-23 | 2022-09-11 | 日商住友重機械工業股份有限公司 | Power supply device and laser device |
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CN110048695B (en) | 2024-01-12 |
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KR102605210B1 (en) | 2023-11-23 |
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