TW201929098A - Fabrication method of circuit components for matrix-batch die package for fabricating circuit components in matrix batches with high efficiency and at low cost - Google Patents

Abstract

Provided is method for batch fabrication of circuit component through simultaneously packaging multiple units of component die in a matrix form of multiple-unit. The component die includes at least two electrodes, wherein at least one electrode is disposed on the top surface of the component die, and the remaining electrode or electrodes are disposed on the bottom surface of opposite component die correspondingly. In the method, each electrode of the component die packaged and protected in each circuit component is electrically connected to a corresponding terminal electrode of the circuit component package. The method comprises the steps of: forming a preparative structure of at least two terminal electrodes for each circuit component in the matrix on a copper matrix substrate; then, for each circuit component, picking and placing a component die, so that the electrode on the bottom surface of the die faces the surface of a preparative structure of a corresponding terminal electrode in the preparative structure of at least two terminal electrodes of the copper matrix substrate; then, for each circuit component, picking and placing a horizontal conductor plate having a bottom connection surface on the horizontal side oppositely disposed to the electrode on the top surface of the component die; then, for each circuit component, picking and placing a vertical conductor block including an upper end placed into a vertical connection hole at the other horizontal side of the horizontal conductor plate, and a vertical connection surface oppositely connected with the upper end of the vertical conductor block, wherein a bottom connection surface of a lower end of the vertical conductor block is oppositely placed on the surface of the preparative structure of the corresponding terminal electrode in the preparative structure of at least two terminal electrodes of the copper matrix substrate; and finally, performing a thermal reflow to simultaneously melt: the soldering material pre-applied between the electrode on the bottom surface of the die and the surface of the preparative structure of the terminal electrode of the corresponding copper matrix substrate; the soldering material pre-applied between the bottom connection surface of the horizontal conductor plate and the electrode on the top surface of the corresponding die; the soldering material pre-applied between the top end of the vertical conductor block and the vertical connection surface in the vertical connection hole of the corresponding horizontal conductor plate; and the soldering material pre-applied between the bottom connection surface of the lower end of the vertical conductor block and the surface of the preparative structure of the corresponding terminal electrode of the copper matrix substrate. Then solder the same.

Description

Circuit component manufacturing method for array batch package component die

The present invention relates to a package and a package method for a semiconductor circuit component, and more particularly to a package and a package method for a surface mount circuit component requiring high power and good heat dissipation. More particularly, the present invention relates to a method of fabricating circuit elements in a multi-unit array form while packaging a plurality of units of circuit element dies in a batch manner, efficiently and with high yield.

At present, the surface mount structure of Discrete Circuit Component such as diode, light-emitting diode, transistor and thyristor is generally common in cylindrical glass/plastic package, wire Lead-frames are available in leaded packages, square-lead-free lead-packages, and flip-chip packages. Among them, the flip chip package has the advantages of lightness, thinness and shortness, but it is inconvenient to use, and the parts are relatively easy to aging, so it is rarely used in applications such as high power and durability. In contrast, the foregoing except the flip chip package is the mainstream of the current power type package. However, with the higher electrical requirements, increased power, heat transfer and high temperature, the above-mentioned common packaging process technology has also approached the technical bottleneck.

High-power circuit components, particularly power diodes, transistors, and thyristors, are discrete components that are indispensable for power electronics applications. Its performance, reliability, and service life are key to the promotion of important uses such as renewable energy and electric vehicles. Sexual influence. However, in addition to the performance life, its manufacturing cost is also an equally important factor for its widespread application.

A conventional method for packaging a circuit component package having good heat dissipation and high electric power, for example, the Republic of China Patent No. I583282, and the invention application No. 105110137, based on two large conductive copper plates, in the form of an array of multiple units, A plurality of units of circuit component dies are packaged in order to utilize batch mode to seek efficient mass production of circuit components to reduce unit cost. However, the two conventional techniques utilize two large copper sheets to control the thickness tolerance of the substrate array copper plate, the circuit element grain body, the parallel array of parallel conductive sheets, and the solder material to a certain extent. Once the actual difference of these process parameters is not well controlled, the serious consequences of welding quality and poor alignment accuracy will occur in the whole batch of products. In other words, the production yield is reduced, and the direct result is the increase in the unit cost of the qualified product.

In order to overcome the foregoing problems of the prior art, the present invention provides a method for simultaneously packaging a plurality of units of element dies in an array form of a plurality of units to batch-produce circuit elements, wherein the element die includes at least two electrodes, at least One electrode is located on the top surface of the element die, and the remaining electrodes are located on the bottom surface of the opposite corresponding grain body. In the method, each of the circuit elements of each of the circuit elements protected by the package is electrically connected to one of the corresponding terminal electrodes of the circuit element body. The method of the method includes preliminarily constructing at least two terminal electrodes of each circuit component in the array prior to forming on a substrate array copper plate. Thereafter, the component die is taken for each circuit component such that one of the preliminary structures of the at least two terminal electrodes of the bottom surface of the die body facing the base array copper plate corresponds to the surface of the preliminary configuration of the terminal electrode. Then, a horizontal conductive sheet is taken for each circuit component, and one of the horizontal sides thereof is bottomed to face the electrode placed on the top surface of the element die. Then, a vertical conductive block is disposed for each circuit component, and the upper end of the horizontal conductive sheet is placed in one of the horizontally opposite sides of the horizontal conductive strip, and has a vertical joint to hang The upper end of the straight conductive block is butted, and one of the bottom joints of the lower end of the vertical conductive block is opposite to the surface of the preliminary structure of the terminal electrode of one of the preliminary structures of the at least two electrodes of the base array copper plate. After that, reflow is performed to pre-apply the solder between the bottom surface electrode of the grain body and the terminal electrode of the base array copper plate corresponding thereto, and the bottom surface of the horizontal conductive sheet and the corresponding top surface electrode of the grain body The pre-applied solder material, the pre-applied solder between the upper end of the vertical conductive block and the vertical joint of the horizontal conductive sheet corresponding to the horizontal conductive strip, and the bottom surface of the vertical conductive block and the corresponding end surface of the terminal electrode Pre-applied solder materials, all of which are simultaneously melted and then fixed.

1000‧‧‧Base array copper plate

1011, 1012‧‧‧ upper surface electrode

1020‧‧ units

200‧‧‧Circuit component grain

210‧‧‧ Circuit element top surface electrode

220‧‧‧ Circuit element bottom surface electrode

3001, 3001A‧‧‧ horizontal conductive sheet

3002‧‧‧Horizontal conductive sheet vertical joint

3003‧‧‧Vertical hole

3005, 3005A‧‧‧ vertical conductive block

3100, 3100A‧‧‧ unit structure

5100‧‧‧Water and gas barrier packaging materials

218, 1028, 3008, 1018‧‧‧ tin

6009‧‧‧ lower surface electrode

2000‧‧‧Circuit component structure

1 shows a partial region of a substrate array copper plate having a three-terminal electrode-circuit element fabricated in accordance with an embodiment of the present invention.

2 is a perspective view showing the basic configuration of a component die of a circuit component applicable to the substrate array copper of FIG. 1.

3A is a schematic view showing the mounting operation performed on the substrate array copper plate in sequence when the circuit component is fabricated in the present invention.

3B is a perspective view showing the unit structure completed in each circuit component unit after the completion of the fetching process and the reflow process in FIG. 3A.

4 is a perspective view showing a unit structure in which a vertical conductive block is first taken in accordance with the present invention, and then a horizontal conductive sheet is taken, which is completed by each circuit component unit after the reflow process.

Fig. 5A is a cross-sectional view of the unit structure of Fig. 3B cut along the aa' plane after being hermetically sealed.

FIG. 5B is a view showing the unit structure of FIG. 3B after being water-sealed and sealed along the bb' plane. Sectional view.

Figure 6 is a perspective view of the back side of the entire array before the individual circuit component units are separately cut and separated after the moisture seal.

Figure 7 shows the structural configuration of the circuit element fabricated in accordance with the method of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a substrate array copper plate 1000 which is applied to a circuit element having a three-terminal electrode according to an embodiment of the present invention, a partial area thereof, an enlarged perspective view. In accordance with the present invention, a typical batch production would use a matrix of tens of times and tens of circuit component units. Only four of the units are shown in Figure 1, as indicated by the dashed line indicated by the numeral 1020 in the figure. In this example, the upper surface terminal electrodes 1011, 1012 are pre-designated or preliminarily formed on the upper surface of the base array copper plate 1000.

In the example of FIG. 1, the preliminary configuration of the terminal electrodes may protrude from the upper surface of the substrate array copper plate 1000, and may be subjected to a subtractive process such as etching, an electroplating/chemical addition process, or a common mechanical process such as turning, milling, or the like. Drilling, grinding, sawing, stamping, etc. are formed on a base copper plate, which can be used to make a plurality of terminal electrode preliminary structures 1011 and 1012 of a plurality of circuit component units 1020. In another embodiment, the terminal electrode preliminary structures 1010 may not protrude from the upper surface of the substrate array copper plate 1000.

2 is a perspective view showing the basic configuration of a component die of a circuit component applicable to the substrate array copper of FIG. 1. A typical power diode, a transistor or a thyristor element die, in general, is a rectangular body structure. In accordance with the present invention, a batch of such component die 200 will be placed on respective corresponding circuit component units 1020 on the surface of substrate array copper plate 1000 of FIG. In the examples of FIGS. 1 and 2, the element die 200 is properly placed on the surface of the base array copper plate 1000 when the automatic pick-and-place equipment is used. In position 1020, the two bottom electrode 220 will respectively align with the terminal electrode preliminary structure 1011 on the surface of the base array copper plate 1000.

3A is a schematic view showing the process of sequentially performing the circuit component on the substrate array copper plate, in which the component die 200 is first taken, and the die is placed in its designated component unit 1020. Positioning. As before, the bottom electrode 220 of the die 200 conforms to the terminal electrode preliminary configuration 1011 of the base array copper plate 1000, respectively.

Then, a horizontal conductive sheet 3001 is disposed on the horizontal side, that is, the left side in FIG. 3, and a bottom surface thereof faces the electrode 210 placed on the top surface of the element die 200.

Then, a vertical conductive block 3005 is disposed, and the upper end is placed on the horizontal other side of the horizontal conductive sheet 3001, that is, in one of the right vertical holes 3003 in the figure. The vertical via 3003 has a vertical junction 3002 to interface with the upper end of the vertical conductive block 3005. One of the bottom surfaces of the lower end of the vertical conductive block 3005 is opposite to the surface of the corresponding end electrode preliminary structure 1012 on the base array copper plate 1000.

It is noted that the vertical through hole 3003 can be a hole having a complete circumference. It can also be an open hole that does not have a complete circumference, as shown in the figure.

After the element die 200, the horizontal conductive sheet 3001, and the vertical conductive block 3005 are sequentially taken out, thermal reflow can be performed. The reflow process can pre-apply the solder material between the bottom electrode 220 of the die body 200 and the surface of the terminal electrode of the base array copper plate 1000 corresponding to the preliminary structure 1011; the bottom conductive surface of the horizontal conductive plate 3001 and the corresponding crystal a solder material pre-applied between the top electrodes 210 of the granules 200; a solder material pre-applied between the upper ends of the vertical conductive blocks 3005 and the vertical conductive pads 3001 of the corresponding horizontal conductive sheets 3001; and vertical conductive The solder material pre-applied between the bottom end of the block 3005 and the surface of the terminal electrode preliminary structure 1012 of the corresponding base array copper plate 1000 is all melted and then welded.

The foregoing pre-applied solder can be a solder paste containing tin particles in general, or a solder piece containing tin. Such solder may be applied between the element die 200, the horizontal conductive sheet 3001, and the vertical conductive block 3005. If a solder paste is used, it can be carried out using, for example, an automatic solder paste device. If a solder tab is used, it can be carried out using a device for removing the die.

The perspective view of FIG. 3B shows the unit structure 3100 completed for each circuit component unit after the soldering process of FIG. 3A is completed and the solder reflow process is performed, after all solders are soldered to form a permanent electrical junction.

In FIG. 3B, the solder material pre-applied between the bottom electrode 220 of the die body 200 and the surface of the terminal electrode preliminary structure 1011 of the corresponding base array copper plate 1000 is soldered to the solder layer 1018; the horizontal conductive sheet The solder material pre-applied between the bottom surface of the 3001 and the corresponding top surface electrode 210 of the grain body 200 is soldered to the solder layer 218; the upper end of the vertical conductive block 3005 is perpendicular to the corresponding horizontal conductive sheet 3001. The solder material pre-applied between the vertical joints 3002 in the direct hole 3003 is soldered to the solder layer 3008 at this time; and the bottom end of the vertical conductive block 3005 and the corresponding terminal electrode of the base array copper plate 1000 are initially constructed 1012. The solder material previously applied between the surfaces is then soldered to the solder layer 1028.

According to the present invention, in another embodiment, the order of the horizontal conductive sheets and the vertical conductive blocks can also be reversed. At this time, one side of the horizontal conductive sheet does not need to have a vertical connection hole (3003, FIG. 3A). In other words, in the embodiment of FIGS. 3A and 3B, the horizontal conductive sheet 3001 is first taken, and then the vertical conductive block 3005 is taken, and the other method is to first take the vertical conductive block and then take the horizontal conductive sheet.

4 is a perspective view showing the method of first taking the vertical conductive block 3005A, and then taking the horizontal conductive sheet 3001A, and the taking process is completed and the circuit component unit is finished after the reflow process. The unit structure is 3100A. According to the present invention, the procedure for producing the unit structure 3100A of Fig. 4 is as follows.

The component die 200 is first placed and positioned to position it in its designated component unit. The bottom electrode 220 of the die body 200 coincides with the terminal electrode preliminary structure 1011 of the base array copper plate 1000, respectively.

Then, a vertical conductive block 3005A is disposed, and one of the lower ends thereof is bottomed to face the surface of the corresponding terminal electrode preliminary structure 1012 of the base array copper plate 1000; Thereafter, a horizontal conductive sheet 3001A is taken, one of the horizontal sides of which is connected to the electrode 210 placed on the top surface of the element die 200, and the other bottom of the horizontal side is placed vertically. The conductive block 3005A has a top surface of one of its upper ends.

After the element die 200, the vertical conductive block 3005A, and the horizontal conductive sheet 3001A are successively removed, thermal reflow can be performed. The reflow process can pre-apply the solder material between the bottom electrode 220 of the die body 200 and the surface of the terminal electrode of the base array copper plate 1000 corresponding to the preliminary structure 1011; the bottom conductive surface of the horizontal conductive plate 3001A and the corresponding crystal a solder material pre-applied between the top electrodes 210 of the granular body 200; a solder material pre-applied between the upper end of the vertical conductive block 3005A and the bottom conductive surface of the horizontal conductive sheet 3001A corresponding thereto; and a bottom end of the vertical conductive block 3005A The pre-applied solder material between the surface of the terminal electrode 1012 of the base array copper plate 1000 corresponding thereto is all melted and then welded.

In FIG. 4, the solder material pre-applied between the bottom surface electrode 220 of the die body 200 and the surface of the terminal electrode preliminary structure 1011 of the corresponding base array copper plate 1000 is soldered to the solder layer 1018; the horizontal conductive sheet 3001A solder material pre-applied between the bottom joint surface and the corresponding top surface electrode 210 of the grain body 200, which has been welded to the solder layer 218 at this time; the vertical conductive block 3005A The solder material pre-applied between the end of the horizontal conductive sheet 3001A and the bottom surface thereof is soldered to the solder layer 3008; and the lower end of the vertical conductive block 3005A is connected to the corresponding base array copper plate 1000. The terminal electrode preliminarily constructs the solder material pre-applied between the surfaces of 1012, at which point it is soldered to the solder layer 1028.

According to the method for fabricating the circuit component of the array batch package element die of the present invention, the unit structure 3100 of the circuit component of FIG. 3B and the manufacturing method thereof can be applied to the case where the thickness tolerance variation of the whole batch of the die body is large. In contrast, the unit structure 3100A of the circuit component of FIG. 4 and the method of fabricating the same can be applied to the case where the variation of the thickness tolerance of the whole batch of the element body is small. Compared with the two, although the horizontal conductive sheet and the vertical conductive fast block structure are slightly different, and the order of the arrangement is reversed, basically, the unit structure of the circuit component in the circuit component package of the present invention utilizes the vertical conductive block. The upper end is soldered to one end of the horizontal conductive sheet to electrically connect the top surface electrode 210 of the element die 200 to the corresponding end electrode preliminary structure 1012 on the base array copper plate 1000. The large-area soldering surface of the two is the key to the high power and good heat dissipation of the circuit components produced by the method of the present invention.

In addition, the four soldering faces in the unit structure of the circuit component described in the present invention in FIGS. 3A and 4 allow the overall system balance characteristics of the molten solder during warm reflow, and the result is the batch process yield. Significantly improved. This improvement directly represents a reduction in the cost of the circuit component product.

According to the present invention, after the formation of the strong high-performance unit structure in Fig. 3B or 4, the water gas seal protection can be performed. In a typical practice, the mold is filled with a gel or gum resin and cooled and solidified. The cured resin body 5100 protects the entire unit structure. Fig. 5A is a cross-sectional view of the unit structure of Fig. 3B cut along the aa' plane after being hermetically sealed. Fig. 5B is a cross-sectional view of the unit structure of Fig. 3B cut along the bb' plane after moisture sealing.

Thereafter, the bottom surface of the base array copper plate 1000 can be subtracted to separate all of the terminal electrodes of all the individual circuit elements of the entire array. A typical typical subtractive treatment can be, for example, a chemical etching process. The perspective view of Fig. 6 is a water-tight seal, and after separating all of the terminal electrodes, the individual circuit element units are separately cut and separated, and the back side of the entire array is constructed. Note that this example in Figure 6 is a circuit component having a two-terminal electrode 6009, such as a power diode.

Next, the overall array of Figure 6 can be cut along the AA' and BB' cut faces in the figure to physically separate all of the individual circuit components in the array. Figure 7 shows the structural configuration of the circuit component 2000 produced in accordance with the method of the present invention.

As is well known in the art, all of the terminal electrodes of the circuit component unit after separation in FIG. 7 are electrically separated, and each individual terminal electrode can be subjected to nickel-gold or nickel-tin plating treatment. .

As is well known in the art, the circuit components fabricated by the method of the present invention can be discrete circuit components having two, three or more terminal electrodes. This circuit component can be a diode. It can also be a transistor. It can also be an optically coupled switch. It may even be an integrated circuit component having at least four terminal electrodes.

The invention has been described above by way of a preferred example, and the above description is not intended to limit the invention. It will be appreciated that those skilled in the art will be able to make a few changes and changes without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (8)

The method further comprises: encapsulating a plurality of unit element dies in an array form of a plurality of units to form a circuit component in batches, wherein the element die body comprises at least two electrodes, wherein at least one electrode is located on a top surface of the element die body, and the remaining electrodes are The method is located on the bottom surface of the opposite corresponding crystal body. The method electrically connects each electrode of the circuit element protected by each circuit component to one end electrode of the circuit component body, and comprises the following steps: Forming at least two terminal electrodes of each circuit component in the array on the base array copper plate; arranging the component die for each circuit component such that the bottom surface electrode of the die body faces at least two terminal electrodes of the base array copper plate a surface corresponding to the preliminary configuration of the terminal electrode; a vertical conductive block is disposed for each circuit component, and one of the lower ends of the bottom electrode is opposite to the one of the preliminary structures of the at least two terminal electrodes disposed on the substrate array copper plate. a surface; a horizontal conductive sheet is taken for each circuit component, and one of the horizontal sides thereof is bottomed to face the electrode placed on the top surface of the element die, and the level is another The other bottom junction is opposite to one of the upper ends of the vertical conductive block; and the thermal reflow is performed, and the bottom surface electrode of the grain body and the corresponding terminal electrode of the base array copper plate are between the preliminary structural surfaces. Pre-applied solder material, pre-applied solder between the bottom joint surface of the horizontal conductive sheet and the corresponding top surface electrode of the grain body, pre-applied solder between the upper end of the vertical conductive block and the horizontal conductive sheet corresponding thereto The pre-applied solder material between the bottom end of the vertical conductive block and the corresponding initial surface of the terminal electrode of the vertical conductive block is all melted and then fixed. The method of claim 1 , wherein the reflow process further comprises: forming a water-tight insulating package structure, which covers the component die, the horizontal conductive sheet, and the vertical conductive block which are fixed on the substrate array copper plate; The bottom surface of the base array copper plate is subtracted to separate all of the end electrodes of all of the individual circuit components in the array; the package structure is hermetically sealed from the cut water to physically separate all of the individual circuit elements in the array. The method of claim 2, further comprising: after the subtraction process, all the terminal electrodes of all the individual circuit components in the array are separated, and then each of the individual terminal electrodes is subjected to nickel-gold or nickel-tin plating treatment. The method of claim 1, wherein the circuit component is a discrete circuit component having two, three or more terminal electrodes. The method of claim 4, wherein the circuit component is a diode. The method of claim 4, wherein the circuit component is a transistor. The method of claim 4, wherein the circuit component is an optically coupled switch. The method of claim 1, wherein the circuit component is an integrated circuit component having at least four terminal electrodes.