TW201928122A - Method for applying a layer on a plating part of a substrate surface - Google Patents

Abstract

The invention relates to a method for applying a layer on a substrate surface, comprising applying the layer on a plating part of the substrate surface by plating to which end the plating part is brought into contact with an electrolyte. A first part of the part of the substrate surface situated outside the plating part is kept free from contact with the electrolyte, wherein a second part, which at least partly deviates from the first part, of the part of the substrate surface situated outside the plating part is masked during application of the layer by plating due to a masking layer having been printed thereon by means of inkjet printing, with the plating part adjoining the second part.

Description

Method for laying layer on substrate surface to be plated

The present invention relates to a method for laying a layer on a portion of a substrate surface to be plated, and particularly to a method in which metal ions dissolved in a plating solution will adhere to the portion of the substrate surface to be plated.

The accuracy of the plating method disclosed in the United States US2006 / 0226017 A1 patent, which can be achieved by laying a layer on a substrate, is mainly determined by the accuracy with which the strip is placed on and abuts against the substrate. International patent application WO 92/22685 A1 also discloses an example of brush plating.

The invention relates to a method for laying a layer on a surface of a substrate to be plated. The layer is laid on the surface of the substrate by a plating layer, and one end of the portion to be plated is carried to In contact with a plating solution, the term “part to be plated” can be understood to mean an area on the substrate that is intended to be covered by the layer and will be covered by the layer after using this method. It is a liquid in which metal ions have been dissolved. The expression of the meaning by plating can be understood to mean that in the process, the metal ions dissolved in the plating solution will adhere to the layer during the laying of the layer. The portion to be plated on the surface of the substrate. The layer can be made of tin, gold, silver, palladium, nickel, gallium, indium, zinc, lead, copper, or cobalt, for example. It is accomplished by electroplating. When the layer is laid by electroplating, a cathode voltage is applied to the substrate in order to deposit metal ions from the plating solution. The portion to be plated does not cover the whole The surface of the substrate, but covers only a part of it, A plurality of the plated portion may be formed by tightly connected to each other not on the substrate surface area, but may be formed as a continuous region.

The present invention specifically refers to providing a method, and on the one hand, the material of the layer and the material used or consumed before and after the application of the method can be used in an efficient state; on the other hand, the present invention The invention also specifically refers to providing a method by which it is possible to lay a layer on the portion to be plated with a high degree of accuracy. To this end, the present invention provides a method as described above, the substrate A first part whose surface is located outside the part to be plated is idle without contacting the plating solution, wherein a second part whose surface is located outside the part to be plated is at least partially separated from the first part And in the process of laying the layer, because a shielding layer has been printed on it by inkjet printing, the second portion is masked, and the portion to be plated is next to the second portion; By inkjet printing, it is possible to precisely define the portion to be plated on the surface of the substrate. In this way, it is also possible to lay the layer on the portion to be plated with high accuracy. The surface of the substrate located on the second portion other than the portion to be plated is to form a masking layer for the printing. By maintaining the first portion of the substrate outside the portion to be plated to be idle, the substrate is located outside the portion to be plated. It is not necessary that the entire surface be provided with a masking layer by inkjet printing. This may actually be an unattractive option from a commercial point of view. In addition, if the plating of the layer is performed by electroplating, the substrate surface is located at The first part of the part other than the part to be plated can be used to provide an electrical contact to apply a cathode voltage to the substrate, and the second part provided with the shielding layer can be used in a highly accurate Location to use, which can provide both technical and cost advantages. The first part can be used in locations without high accuracy requirements. To avoid misunderstanding, it should be noted that both the first part and the second part are Will not cover all surfaces except the portion to be plated, the first portion will only be formed on all surfaces of the substrate other than the portion to be plated Part, and the second part is also formed on another part of the surface of the substrate except the part to be plated. In this example, it is also possible for the first part and the second part to partially overlap. Generally, the present invention is adopted. The purpose of this method will be to reduce the size of the second part, because the masking is generated by a printed masking layer to avoid unnecessary metal ion deposition outside the area to be plated, which is better than other methods that can also achieve this purpose It is more expensive, such as to make the part of the surface of the substrate outside the part to be plated idle without contacting the plating solution, or to simply place it outside the scope of the individual part of the plating solution, Or use the following shielding body for shielding, but in any case, the choice of reducing the size of the second part will actually depend on the form of the substrate and the position and size of the part to be plated. Therefore, the second part In fact, the size must at least account for more than 5% of the size of the portion of the substrate surface outside the area to be plated. This ratio can also be quite high, such as 80% On.

In one embodiment, the portion to be plated is not immediately adjacent to the first portion to achieve relatively high accuracy.

In an embodiment, the first portion of the substrate surface and the second portion of the substrate surface partially overlap to prevent a layer of objects from being accidentally generated between the first portion and the second portion. In this example, the The overlapping area is recommended to cover at least 15% of the surface of the substrate outside the portion to be plated to reduce the material required for the printed masking layer.

In particular, if the size of the first part of the substrate surface is larger than the size of the second part of the substrate surface, the commercial advantages of the present invention can actually be exerted in the best way, and if the substrate is flat, or at least Made of flat material, the present invention can be used even more advantageously. In this example, the substrate does not have to be flat. The present invention is also particularly suitable for partially bent or even completely bent For a plate-shaped substrate, the present invention is suitable for a substrate in which the portion to be plated is only on one side of the substrate, and a substrate in which the portion to be plated is on both sides of the substrate.

And if the portion to be plated is at least substantially located on a protruding portion of the substrate, the advantages of the present invention may be used. According to the present invention, in this example, a layer is laid on the portion to be plated of the substrate. It can be used as a bonding layer for welding. The layer can be made of tin, for example, or a contact pad for joints. The layer can be made of an inert metal for this purpose. Like gold, silver or palladium.

In one embodiment, the protrusion has a cross section, the shielding layer is printed on a part of the periphery of the cross section, and the layer is laid on the other part of the periphery by plating.

Specifically, the cross-section may also be rectangular in this example, or have at least four sides next to each other between at least a plurality of longitudinal sides, where the rectangle defines the four longitudinal sides of the protrusion, where the The portion to be plated extends to at least a portion of a first longitudinal side, wherein a third longitudinal side is located on the opposite side of the first longitudinal side, and the shielding layer is disposed immediately adjacent to the first longitudinal side and the third longitudinal side. On a second longitudinal side, or on a fourth longitudinal side that is also immediately adjacent to the first longitudinal side and the third longitudinal side. Therefore, the entire surface of the protrusion is provided with a layer by plating. unnecessary.

If the portion to be plated only extends to a portion of the first longitudinal side, and the shielding layer is also provided on the first longitudinal side, and in particular, if it is the entire periphery of the portion to be plated and the first longitudinal side Are separated by a distance, and / or if the shielding layer is also provided on the third longitudinal side, and / or if the protruding portion has an end side at a free end thereof, and the shielding layer is printed on the end side In the above, the size of the layer can be reduced to the extent that it can function. Therefore, the material of the layer, such as an inert metal, is usually quite expensive, so that it can be used in an efficient manner.

The present invention is also suitable for embodiments in which the portion to be plated is a bent portion of the substrate surface, and / or the second portion is a bent portion of the substrate surface. Such an arrangement may be generated, for example, as described above. In the case where the protruding portion is bent, for example, at the position of the free end thereof, the step of bending the protruding portion may be performed before or after the shielding layer is printed on the second part.

In general, the present invention is also applicable to a substrate having a strip shape or a strip shape.

According to the method of the present invention, the substrate is suspended on a belt-shaped conveyor belt during the process of laying the layer by plating. For example, the substrate can be clamped by the clamp, and the clamp is clamped against the substrate. The conveyor belt is as well known in the related technical field, and / or the substrate can be conveyed during the laying of the layer.

An actual embodiment of the method of the present invention can also be achieved by the first part being at least partially covered by at least one shielding body during the laying of the layer, the at least one shielding body being laid. The layer was previously located at one end of the portion to be plated and abutted against the first portion, and after the layer was laid, it was removed from the first portion, and the first portion of the substrate surface was passed through the shield. It can be maintained in a very effective and efficient manner without contact with the plating solution.

If the at least one shielding body also abuts a part of the second part during the laying of the layer, and is also removed by the part of the second part after the laying of the layer, It is also possible to achieve considerable savings in ink usage. Therefore, there is also an example in which the second part printed on the surface overlaps with the second part masked by at least one shielding body on the surface. The degree of overlap depends on the The degree to which the at least one shielding body is placed against the substrate is determined.

In particular, if the substrate is belt-shaped, and the at least one shielding body includes at least two belt bodies, separated from each other by a distance, and respectively shielding opposite sides on the substrate from each other, the method is efficient. There is a strip-shaped area between the two strip bodies, and at least a part of the portion to be plated is located in the strip-shaped area, and in addition to the portion to be plated, at least a portion of the printed portion of the surface is also Located in this strip-shaped area.

If the at least one shielding body includes a closed belt body, in other words, a belt body without any openings, the portion to be plated will be completely located between the two belt bodies.

Alternatively, it is also possible for the at least one shielding body to include a belt body and the belt body having multiple openings, wherein the second portion of the substrate surface is partially extended during the laying of the layer To the opening, the accuracy with which the layer can be laid on the substrate will not be determined mainly by the accuracy with which the strip is placed on and abutting the substrate, as in the prior art US 2006/0226017 A1 What is disclosed in the patent case is determined by the accuracy with which the shielding layer is printed on the substrate.

During the process of laying the layer, the at least one shielding body moves with the substrate to be transported.

Moreover, the use of the shielding body makes it possible for the shielding body to be completely immersed in the plating solution, and it will benefit from the simplification of the process.

In an embodiment, the portion to be plated is immersed in the plating solution and the first portion is at least partially maintained on the liquid surface of the plating solution to lay the layer, and within a range where the first portion is immersed, The aforementioned shielding body can be used on the first part.

It is also possible that the second part is partially maintained on the liquid surface of the plating solution, which can prevent a layer from being accidentally formed on the substrate above the plating solution, or at least above the normal level of the plating solution. On the substrate, the actual highest level of the plating solution is likely to be higher than the normal level, for example because of fluctuations.

In a relatively simplified embodiment, a cathode voltage is applied to the substrate via the first portion, so as to lay the layer on a portion to be plated on the surface of the substrate. In this example, the layer is laid It is related to electroplating. The cathode voltage will reduce the metal ions in the plating solution, so that it is deposited on the portion to be plated.

If the substrate is partially or completely immersed in the plating solution, and the layer is laid by electroplating, the cathode voltage is suggested to be applied through a position above the plating solution.

The contact between the portion to be plated on the substrate surface and the plating solution can also be performed by supplying the plating solution to the portion to be plated in order to lay the layer instead of immersing the substrate in the plating solution. .

In one practical example of this example, the plating solution is supplied to the portion to be plated through a contact member, the contact member is in contact with the portion to be plated, and is located at the periphery thereof, and the contact member is rotatable. And partly extends into the plating solution. In this optional configuration, the plating solution is continuously absorbed by the contact, and is supplied to the portion to be plated outside the plating solution through the rotation of the front cover.

Alternatively, it is also feasible to maintain the contact member in a fixed state, such as a cloth type, a brush type, or a sponge type, in which the plating solution is supplied to the fixed contact member, in this example The substrate is transported along the contact in a dragged state, wherein the substrate is carried to contact the plating solution via the contact wood, in this example, for example, by a so-called brush plating technique.

In general, after the shielding layer is laid, it is recommended that the substrate surface be removed. For example, stripping the shielding layer by a peeling method known to those skilled in the art can also achieve this goal.

The method of the present invention may further include an actual step of printing the masking layer on the second portion of the substrate surface by inkjet printing before laying the layer on the portion to be plated. Here, At the beginning of the method, the masking layer is provided by printing the masking layer on it by inkjet printing. This is also possible, and this can also be given to a different team or optionally to another Different countries.

In particular, for laying the layer on a plurality of different bent portions, and / or on multiple different surfaces facing different angles and adjacent to each other, such as laying on a protruding portion of a substrate, in In one embodiment, the shielding layer is printed on the second portion of the substrate surface by using a nozzle, and the orientation of the nozzle is changed for the substrate during the printing process.

The present invention also relates to a substrate which has been obtained by the aforementioned method of the present invention.

The technology of the present invention will be described in more detail through the description of multiple feasible embodiments and the following drawings.

According to FIG. 1, the device 1 discloses a conveying system including a conveyor belt 2 wound around one of the two pulleys 3 and 4. In use, one of the two pulleys 3 and 4 is not shown in any detail in the figure. Driven by a driving means to rotate relative to a central axis, and directly downstream of the pulley 3, at the position of reference numeral 24, a plurality of substrates 5 are formed by elastic wire clamps 6 (see FIG. 2). The fully automatic form is suspended on the conveyor belt 2, and directly upstream of the pulley 4, at the position of reference numeral 44, the substrates 5 are also removed from the conveyor belt 2 in a fully automatic form.

Figure 1 reveals two substrates 5. When the substrates 5 are transported and suspended from the conveyor belt 2, they will pass through a bath 7 containing a plating solution 8, and at two opposite ends of the bath 7, the The bath 7 is provided with locks (without revealing any details), and the substrates are sequentially moved into the bath 7 and out of the bath 7 through the locks, which is caused by the conveying action of the conveying system, as described above. It is stated that devices such as the device 1 are known to those having ordinary knowledge in the technical field, and a more detailed description will be omitted here for the reason.

In this embodiment, the substrate 5 has a portion to be plated on one side, which is designed as a plurality of small square regions 9 arranged in three parallel rows. These small regions 9 are intended to be covered by plating. The metal layer is more specifically covered by electroplating; it is separated from the strip-shaped portion 10 at the top end of the substrate 5, and the surface of the substrate 5 is located outside the small area 9 to provide a shielding layer 11 It is printed on the substrate 5 by inkjet printing. All the small areas 9 are therefore surrounded by the shielding layer 11. The liquid level of the plating solution 8 is deliberately selected so that all the small areas 9 In any case, it will be immersed in the plating solution 8 and exposed to the plating / plating action of the plating solution 8. The unprinted portion 10 of the substrate 5 is completely above the plating solution 8 of the bath 7, or In addition, the unprinted portion 10 of the substrate 5 is not exposed to the plating / plating action of the bath 7 plating solution 8. The top edge of the shielding layer 11, as indicated by reference numeral 11 ', is located exactly Above the plating solution 8, the unprinted portion above the plating solution 8 10 is used to apply a cathode voltage to the substrate 5 through the previously-released clips 6, causing the metal ions in the plating solution 8 to be attracted by the substrate 5 located at the small area 9 and adhered to the small areas 9 .

Fig. 2 shows the vertical cross-section of the bath 7 of the device. The multiple substrates 15 are shown in perspective and front views in Figs. 3 and 4, respectively. Here, they are suspended from the thin wire-like elastic clips 6. The conveyor belt 2 is spaced at the same distance from each other in the direction of the long axis of the conveyor belt 2. The substrate 15 is related to the lead frame and has ten inwardly protruding portions, at the area 17 of its individual free ends, and at The region 18 in the longitudinal position between the two ends of the protruding portion 16 must be metalized, for example, using tin or gold to make it possible to weld the protruding portions 16. More specifically, on the one hand, each Between the areas 17, 18, on the other hand, an electric wire is formed, or a contact pad is formed for connection joints or soldering. The metallization previously exposed on the substrate 15 greatly invades one end of the plating solution 19 It is also performed by electroplating.

In areas other than the areas 17, 18 intended to be plated, the substrate 15 is actually completely printed with a masking layer 20, which is performed by inkjet printing in accordance with the pattern disclosed in FIG. 4, and further, the The top strip 21 of the substrate 15 is not printed. The strip 21 is engaged by the bottom ends of the clips 6, and the substrate 15 is clamped against the bottom of the conveyor belt 2 by the clips 6. On the other hand, via the clip 6 made of electrically conductive material, the cathode voltage required for laying the metal layer on the areas 17, 18 by electroplating can be applied to the substrate 15 accordingly.

As shown in FIG. 3 and FIG. 4, the region 17 does not extend across the full width at the ends of the protrusions 16, and the ends of the protrusions 16 are also provided with a mask formed by inkjet near the edges. Layer 20, due to the inkjet printing masking layer 20, these areas 17, 18 can be very clearly defined, and the consumption of metal materials coated on these areas 17, 18 can be reduced accordingly, with a mention The masking layer 20 disclosed in FIG. 2 is for illustration only, and does not represent a true scale.

The liquid level of the plating solution 19 for the substrate 15 is deliberately selected so that the areas 17, 18 will be immersed in the plating solution 19 anyway, and a small portion of the printed shielding layer 20 will still extend to the plating solution 19 Above the liquid surface to prevent the unprinted strip 21 from still being inadvertently plated, for example caused by fluctuations in the surface of the plating solution 19.

Although the largest portion of the surface of the substrate 15 is provided with a shielding layer 20 by inkjet printing according to FIGS. 2, 3 and 4 in this embodiment, for other substrates, or at least for those containing other intended coatings For the substrate of the area, only a particularly small portion of the individual substrate is provided with a shielding layer by inkjet printing, and a considerable portion is left unprinted on the surface of the substrate 15 even if this portion is not intended It is actually possible to perform plating. In this embodiment, for example, imagine that only the areas 17, 18 of the five protruding portions 16 at the bottom are intended to be coated. This is also possible. In this case, for example, In other words, only a portion of the substrate 15 below the boundary line 22 will be provided with a shielding layer by inkjet printing, and the liquid level of the plating solution 19 may also be at a position corresponding to the boundary line 23.

The present invention is also suitable for laying a layer by plating on a specific area having a curved shape. As shown in FIGS. 5a to 5d, it shows a bent portion 25, which is a protruding portion 26, which is similar to the substrate. 15 of the protruding portion 16, the protruding portion 26 has four longitudinal sides 27, 28, 29, 30, one of which is not shown in Figs. 5a to 5d, in terms of its cross section, the protruding portion 26 is The rectangle is defined by the four longitudinal sides 27-30, and the protrusion 26 further has one end side 31.

As a result, only the area 32 on the first longitudinal side 27 of the bent portion 25 at one end of the protrusion 26 needs to be plated, and the periphery of the area 32 is connected to the first longitudinal side 27 and the second The boundary lines 33, 34 between the fourth longitudinal sides 28, 30 and the boundary line 35 connected between the first longitudinal side 27 and the end side 31 are separated by a distance, respectively. Figure 5b shows that a shielding layer 36 is How to print on the entire surface of the bent portion 25 of the protruding portion 26 except the area 32 by inkjet printing, the shielding layer 36 will therefore completely cover the second to fourth longitudinal sides of the bent portion 25 28, 29, 30 and the end side 31, and a part of the first longitudinal side 27, that is, the area outside the area 32; using inkjet printing on various curved surfaces and on various mutually perpendicular surfaces Printing can be achieved by changing the orientation of the inkjet printing nozzles. In this way, the nozzles are preferably oriented vertically or at least as vertically as possible towards the surface to be printed, and / or rely on individual substrates Proper operation along the sprinkler vertical.

The ink used must be able to withstand the plating solution used, and it must also be non-conductive, so that the printed layer will not be damaged by the plating solution during plating, and metal ions will not precipitate. For example, the ink can be UV-curing ink, such as those based on acrylate or polyurethane, or methacrylate or natural resin. Hot-melt inks for substrates, or a combination of UV-curable inks and hot-melt inks.

Figure 5c shows how a metal layer 37 is laid on the area 32 in the manner described in Figures 1 to 4 above, and Figure 5d shows how the shielding layer 36 is selectively removed, like It is a way known to those with ordinary knowledge in the art, for example, by stripping, the metal layer 37 is still left on the longitudinal side 27 of the bent portion 25 at one end of the protruding portion 26, And there is a distance from the boundary lines 33,34,35.

FIG. 6 discloses a device 51 for laying a layer on one or both sides of a strip-shaped substrate 52. The device 51 includes a bath 53 containing a plating solution 54 to a liquid surface 55, and the device 51 further includes A runner unit 56 containing two roulettes 57 and 58 has their central axes overlapping each other (Fig. 7a). On the side facing each other, the two roulettes 57 and 58 are separated by a distance d (Fig. 7b). The two inner masking bands 59 and 60 respectively surround one of the wheel discs 57 and 58 and also one of the pulleys 61 directly above the wheel unit 56 and the individual outer masking bands 62 and 63. It also surrounds the two wheel discs 57,58 and is located outside the two inner masking bands, and also surrounds the pulleys 64-69. In this example, the widths of the masking bands 59,60,62,63 are the same , But can be different from each other in other embodiments, the masking bands 59,60,62,63 are aligned relative to the roulette 57,58, so that the masking bands 59,62 on one side The individual faces on one side of the inner side are separated by a distance d from the shielding bands 60, 63 (also) on the other side.

By means of the pulleys 70, 71, the strip-shaped substrate 52 will pass between the plurality of pairs of the inner shielding strips 59, 60 and the outer shielding strips 62, 63 and will also be clamped, so that the masking strips 59, 60, 62, 63 will shield the long side of the strip-shaped substrate 52, at least the area where the substrate 52 passes through the plating solution 54.

The substrate 52 has a width B (FIG. 7 b). In the example disclosed in FIG. 7 a, the substrate 52 is provided with a main side having a long central area 75 and another main side also having a long area 76. Side, both major sides are intended to be metallized by plating to lay a metal layer. The two major sides of the surface of the substrate 52 are outside these areas 75,76 and at a width b (Figure 7b). In the range, there is a shielding layer 77 laid on the substrate 52 by inkjet printing, and the width b is greater than the distance d, so that the printed portion 77 is in two of these areas 75, 76. On the opposite side, it overlaps with the part of the substrate 52 that is clamped to the shielding tapes 59, 62 and 60, 63. In this way, the substrate 52 is located on the surface outside the plating action areas 75, 76, in part by The shielding layer 77 is partially idled by the shielding tape 59, 62 and 60, 63, which can be regarded as a shielding body, and partly is idled by the shielding layer 77 and the shielding tape 59, 62, and 60, 63 at the same time. It is not in contact with the plating solution 54.

The example disclosed in FIG. 7b does not have a strip-shaped plating action area, but has a plurality of square plating action areas 81 arranged in a row on one side of the substrate 52, and is not shown in FIG. 7b but in the The other side of the substrate 52 is arranged in a square plated action area 82.

If a metal layer only needs to be laid on the inside of the substrate 52, in another configuration, it is also possible to use a single external masking tape instead of the two external masking tapes that were previously uncovered. Such a masking tape The long side position of will overlap with the long opposite side position where the outer masking strips 62, 63 are far from each other, so that the entire exterior of the substrate 52 between the wheel discs 57, 58 will also be protected by the masking strips. It is isolated from the plating solution 54.

According to another embodiment, it is also possible to use a masking tape provided with a plurality of openings, and perform the alignment in such a way that a plurality of areas intended for plating, such as area 81, fall into the recesses of the openings. In this way, the surface of the printed part will be significantly reduced, and the plating will still be accurately completed, and as long as the periphery of the recess is at a distance from the periphery of the area intended to be coated, the plating will not be in any way It is directly affected by the accuracy of the alignment between the recess and the area to be plated.

According to another different embodiment that is still based on the above, it is actually possible to use two successive devices such as device 51. The substrate 52 in this example will be successively (recommended to be rinsed) to pass through Two different plating baths for laying different metal layers. In the first bath, it is possible to protect a first part of the area with the above-mentioned masking zone through the recess of the masking zone. As for the recesses, the other part of the area to be coated, that is, the second part is left idle, so that a layer of a first metal is laid on it by the coating; in the second bath, especially The first part of the area that is intended to be plated is idled by using the groove on the masking tape in combination with the second device, while the masking tape is to protect the second part of the completed plating layer from contact with the plating solution. Then, another layer of the second metal can be laid on the first part of the area to be plated by plating.

The device 100 disclosed in FIG. 8 does not include a bath containing a plating solution. The device 100 has a roller 101, and a belt-shaped substrate 102 passes through the roller 101 through pulleys 103 and 104 and guide wheels 105 and 106. Half of the substrate 102 abuts against the outside of the reel 101. In use, since the reel 101 is rotated relative to an axis that overlaps with its central axis, the reel 101 will be with the substrate 102 In order to achieve this purpose, the reel 101 can be provided with power for self-running, or it can be pulled by the substrate 102 by using the friction between the reel 101 and the substrate 102.

In the area of the upper half of the reel 101, the entire width of the substrate 102 is protected by an external shielding tape 107, which is wound around the pulley 108, 109, 110 and the guide wheel 111 The substrate 102 on the outside of the reel 101 is also moved with the substrate 102 during use. If the substrate 102 has a through passage, the use of the external shielding tape 107 will be necessary.

As shown in FIG. 8, the substrate 102 is partially provided with a shielding layer by using inkjet printing on one side forming the inside thereof. The printed shielding layer completely surrounds the metal layer which is intended to be provided by plating. The inner surface area of the substrate 102 refers to the portion to be plated as a whole. The wall surface of the reel 101 includes a recess that does not disclose any details in FIG. 8. The recess makes the area of the portion to be plated idle, and the shielding layer is located at The area around the individual area is also left idle, so the reel can therefore be used as a shield, which can also be referred to as a point mask, or the reel 101 can also provide a continuous recess, in this example In fact, the reel 101 may actually be composed of two coaxial parts separated by a distance, so that one of the strip-shaped portions of the substrate is left idle, and the strip-shaped portions are printed in a range other than the portion to be plated. The shielding layer, such a reel can also be called a linear shielding.

The idle area maintained by the recess in the substrate 102 may be one or more areas including the portion to be plated or a part of the printed masking layer, and the other part of the printed masking layer is also Will extend outside the groove of the wall surface of the reel 101, so that the shielding will be performed at the overlap of the wall surface of the reel itself and the other part of the front cover of the printed masking layer, and the outside of the substrate 102 is not A printed shielding layer is provided, but is completely protected by the shielding tape 107. Therefore, even if the substrate 102 itself has a through channel, the plating solution cannot reach the outside of the substrate 102. As long as the substrate 102 is completely closed, the shielding The use of layer 107 is not necessary.

The plating solution is continuously supplied to the bottom side of the substrate 102 through the recesses, causing a layer of matter to be deposited in the area of the portion to be plated, because the shielding layer is printed on the inkjet printing These areas are around, so they are precisely defined.

According to another different design, the present invention can also be used with so-called brush-plating or tampon-plating. A part of a substrate surface can be selectively borrowed by these techniques. A metal layer is provided by plating. The accuracy of this technology is limited. During brush plating, a contact such as a brush or cloth is carried to a part of the substrate surface. Contact the restricted area, the surface of the substrate is outside the restricted area, and remains idle without contacting the contact, so it is not in contact with the plating solution; when the plating solution is supplied to the contact, the substrate is Pass the contact in a dragged state. In the area where the contact is in contact with the substrate, a metal layer will be formed by plating. Those with ordinary knowledge in the technical field should be familiar with brush plating technology. Therefore, a more detailed description will be omitted and not described here. An example of brush plating disclosed in the international patent application WO 92/22685 A1 can be used as a reference, and FIG. 1 is an example of brush plating.

According to the present invention, a masking layer is previously laid on the surface of the substrate by inkjet printing except for the portion to be plated, or the substrate surface is intended to be laid by a layer of a layer-like portion by plating. In the process, it is possible to lay a layer of metal on the portion to be plated on the surface of the substrate by plating with high accuracy.

The present invention is not limited to the above embodiments, but is defined by the following claims. The present invention can be applied to different types of substrates, such as lead frames, and can be stamped and / or etched flat band. You can also choose to cover film / foil, and / or semi-finished products of electronic components, such as terminals, semiconductors, solar cells, light-emitting diodes and batteries.

[this invention]

1‧‧‧ device

2‧‧‧ conveyor belt

3,4‧‧‧ pulley

5‧‧‧ substrate

6‧‧‧ clip

7‧‧‧bath

8‧‧‧plating solution

9‧‧‧ area

Section 10‧‧‧

11‧‧‧ Masking layer

11 ’‧‧‧Top edge

15‧‧‧ substrate

16‧‧‧ protrusion

17,18‧‧‧area

19‧‧‧plating solution

20‧‧‧ masking layer

21‧‧‧ strip

22, 23‧‧‧ boundary

24,44‧‧‧Location

25‧‧‧ Bend

26‧‧‧ protrusion

27, 28, 29, 30‧‧‧ longitudinal side

31‧‧‧ end

32‧‧‧area

33, 34, 35 ‧ ‧ ‧ boundary

36‧‧‧ Masking layer

37‧‧‧ metal layer

51‧‧‧ device

52‧‧‧ substrate

53‧‧‧bath

54‧‧‧plating solution

55‧‧‧Liquid level

56‧‧‧ runner unit

57,58‧‧‧ Roulette

59,60‧‧‧Inner shelter

61‧‧‧Pulley

62,63‧‧‧External masking tape

64,65,66,67,68,69,70,71‧‧‧ pulley

75, 76‧‧‧ area

77‧‧‧masking layer

81,82‧‧‧Plating area

100‧‧‧ device

101‧‧‧roller

102‧‧‧ substrate

103‧‧‧Pulley

105,106‧‧‧Guide wheels

107‧‧‧outer masking tape

108,109,110‧‧‧ pulley

111‧‧‧Guide Wheel

B, b‧‧‧Width

d‧‧‧distance

FIG. 1 is a perspective view of an embodiment of a device for implementing the method of the present invention.

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 3, which shows a cross-sectional view of the bathtub in the device of FIG. 1, which forms a part of the device.

FIG. 3 is a perspective view of a substrate processed in the bath of FIG. 2.

FIG. 4 is a front view of the substrate of FIG. 3.

Figures 5a to 5d are perspective views of the columnar end of a substrate at each successive stage when the method of the present invention is implemented.

FIG. 6 is an upright schematic view of a second embodiment of the apparatus for implementing the method of the present invention.

7a and 7b are perspective views of two different substrates of FIG. 6 at the same cross-sectional position.

FIG. 8 is an upright schematic view of a third embodiment of the apparatus for implementing the method of the present invention.

Claims (38)

A method for laying a layer on a surface of a substrate to be plated includes laying the layer on the portion to be plated by plating, and one end of the portion to be plated is carried to a plating solution Contact, wherein a first portion of the substrate surface located outside the portion to be plated is idle without contacting the plating solution, and a second portion of the substrate surface located outside the portion to be plated is at least Partially deviates from the first part, and during the laying of the layer, the second part is masked because a masking layer has been printed on it by inkjet printing. The plated portion is immediately adjacent to the second portion. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 1, wherein the portion to be plated is not immediately adjacent to the first portion. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the first portion of the substrate surface and the second portion of the substrate surface partially overlap. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the size of the first portion of the substrate surface is larger than the size of the second portion of the substrate surface. The method for laying a layer on a surface of a substrate to be plated as described in claim 1, wherein the substrate is a flat plate, or at least is made of a flat plate material. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 1, wherein the portion to be plated is at least substantially located on a protruding portion of the substrate. A method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 6, wherein the protrusion has a cross section, the shielding layer is printed on a part of the periphery of the cross section, and the layer It is laid on another part of the periphery by plating. A method for laying a layer on a portion to be plated on a surface of a substrate as described in claim 7, wherein the cross section is rectangular or has at least four sides next to each other between at least a plurality of longitudinal sides, wherein the rectangle defines Out of the four longitudinal sides of the protrusion, wherein the portion to be plated extends to at least a portion of a first longitudinal side, wherein a third longitudinal side is located on the opposite side of the first longitudinal side, and the shielding layer is provided On a second longitudinal side adjacent to the first longitudinal side and the third longitudinal side, or on a fourth longitudinal side also adjacent to the first longitudinal side and the third longitudinal side. A method for laying a layer on a portion to be plated on a substrate surface as described in claim 8, wherein the portion to be plated extends only to a portion of the first longitudinal side, and the shielding layer is also provided on the first longitudinal side on. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 9, wherein the portion to be plated is separated from the entire periphery of the first longitudinal side by a distance. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 8, wherein the shielding layer is also disposed on the third longitudinal side. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 6, wherein the protruding portion has one end side at a free end thereof, and the shielding layer is printed on the end side. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the portion to be plated is a bent portion of the surface of the substrate. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the second portion is a bent portion of the substrate surface. The method for laying a layer on a surface of a substrate to be plated as described in claim 1, wherein the substrate has a strip shape. The method for laying a layer on a surface of a substrate to be plated as described in claim 1, wherein the substrate is long. The method for laying a layer on a surface of a substrate to be plated as described in claim 1, wherein the substrate is suspended on a belt-shaped conveyor belt during the process of laying the layer by plating. The method for laying a layer on a surface of a substrate to be plated as described in claim 1, wherein the substrate is conveyed during the process of laying the layer. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the first portion is at least partially covered by at least one shielding body during the laying of the layer. A shielding body is located at one end of the portion to be plated and abuts the first portion before laying the layer, and is removed from the first portion after the layer is laid. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 19, wherein the at least one shielding body also abuts a part of the second portion during the laying of the layer, After laying the layer, the part of the second part is also removed. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 19, wherein the at least one shielding body includes at least two bands separated from each other by a distance and shielding each other on the substrate Far away from the opposite side. The method for laying a layer on a portion of a substrate surface to be plated according to claim 19, wherein the at least one shielding body comprises a closed belt body. The method for laying a layer on a portion to be plated on the surface of a substrate according to claim 19, wherein the at least one shielding body comprises a strip body having a plurality of openings, wherein the second portion of the substrate surface During the laying of the layer, it partially extends into the opening. The method for laying a layer on a surface of a substrate to be plated as described in claim 19, wherein the substrate is transported during the laying of the layer, and the at least one shielding body is transported during the transport. The middle is moved with the substrate. The method for laying a layer on a surface of a substrate to be plated as described in claim 19, wherein the substrate is completely immersed in the plating solution. A method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the portion to be plated is immersed in the plating solution and the first portion is at least partially maintained on the liquid surface of the plating solution to The layer was laid. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 26, wherein the first portion is completely maintained on a liquid surface of the plating solution. A method for laying a layer on a portion of a substrate surface to be plated as described in claim 26, wherein the second portion is partially maintained on a liquid surface of the plating solution. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 1, wherein a cathode voltage is applied to the substrate through the first portion to lay the layer. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 29, wherein the cathode voltage is applied via a position above the plating solution. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 1, wherein the plating solution is supplied to the portion to be plated to lay the layer. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 31, wherein the plating solution is supplied to the portion to be plated through a contact, the contact is in contact with the portion to be plated, And located on its periphery. A method for laying a layer on a portion of a substrate surface to be plated as described in claim 31, wherein the contact is rotated and partially extends into the plating solution. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 32, wherein the contact is kept stationary, and the plating solution is supplied to the stationary contact. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 1, wherein the shielding layer is removed from the substrate surface after the layer is laid. The method for laying a layer on a portion to be plated on the surface of a substrate as described in claim 1, wherein before the layer is laid on the portion to be plated, the masking layer is printed on the substrate by inkjet printing. On the second portion of the substrate surface. The method for laying a layer on a portion of a substrate surface to be plated as described in claim 36, wherein the shielding layer is printed on the second portion of the substrate surface using a nozzle, the nozzle facing the printing The process is changed for the substrate. A substrate on which a layer has been laid by plating using the method of any of the preceding claims.