TW201927884A - Substrate composition and substrate prepared therefrom - Google Patents

Abstract

A substrate composition and a substrate prepared from the substrate composition are provided. The substrate composition includes 25-80 parts by weight of a polymer, 20-75 parts by weight of an inorganic filler, and 0.015-0.7 parts by weight of a compound. The total weight of the polymer and the inorganic filler are 100 parts by weight. The polymer is selected from a group consisting of polytetrafluoroethylene (PTFE) and perfluoroalkoxy alkane (PFA). The compound has at least three terminal vinyl groups.

Description

Substrate composition and substrate prepared therefrom

The present disclosure relates to a substrate composition and a substrate prepared from the substrate composition.

In the new century, electronic products tend to be light, thin, short, and small, and are transmitted at high frequencies, so that the wiring of printed circuit boards must be high-density to increase the transmission speed while maintaining signal integrity. The electronic products use multi-layered semiconductor components and precision packaging technology to achieve high density of multilayer boards by advanced bonding and mounting technology.

In the field of electronic components, there is an urgent need for high-frequency communication equipment. Therefore, related electronic component materials such as semiconductor sealing materials having a low dielectric constant and materials having a low dielectric loss factor have recently been required to The ability to transfer data quickly and without the loss or interference of data during the transfer process.

Polytetrafluoroethylene (PTFE) has been commonly used as a high-frequency substrate material due to its low dielectric constant and dielectric loss factor. However, polytetrafluoroethylene (PTFE) is inherently insufficient in rigidity, and in addition to being less susceptible to subsequent processing, the resulting substrate is also less mechanically strong.

Based on the above, there is a need in the industry for a substrate material having a low dielectric constant, a low loss factor, good heat resistance, and high mechanical strength to solve the problems encountered in the prior art.

According to an embodiment of the present disclosure, the present disclosure provides a substrate composition, which may comprise 25-80 parts by weight of a polymer, wherein the polymer may be selected from polytetrafluoroethylene (PTFE) and perfluoroalkoxy. a group consisting of perfluoroalkoxy alkane (PFA); 20-75 parts by weight of an inorganic filler, wherein the total of the polymer and the inorganic filler may be 100 parts by weight; and, 0.015-0.7 parts by weight of the compound Wherein the compound may have at least three terminal vinyl groups.

According to an embodiment of the disclosure, the present disclosure also provides a substrate. The substrate comprises a film layer, wherein the film layer is a cured product formed by the above substrate composition.

100‧‧‧Substrate

110‧‧‧ film layer

120‧‧‧First metal foil

130‧‧‧Second metal foil

1 is a schematic view of a substrate according to an embodiment of the present invention.

Figure 2 is a schematic view of a substrate according to another embodiment of the present invention.

The disclosed embodiments provide a substrate composition and a substrate prepared from the substrate composition. The substrate composition of the present disclosure includes a specific polymer, an inorganic filler, and a compound having at least three terminal alkenyl groups, and The composition constitutes the substrate composition in a specific ratio. By adding the compound having at least three terminal alkenyl groups, the processability of the substrate composition can be improved without increasing the dielectric properties (for example, dielectric constant and loss factor), and the substrate can be increased by the substrate. The mechanical strength of the substrate prepared from the composition.

According to an embodiment of the present disclosure, the present disclosure provides a substrate composition which may comprise 25-80 parts by weight (for example, 30-75 parts by weight, or 35-70 parts by weight) of a polymer; 20-75 parts by weight ( For example, 25 to 70 parts by weight, or 30 to 65 parts by weight, of the inorganic filler, wherein the total of the polymer and the inorganic filler may be 100 parts by weight; and, 0.015 to 0.7 parts by weight of the compound, wherein the compound It may have at least three terminal vinyl groups.

According to an embodiment of the present disclosure, the polymer may be selected from the group consisting of polytetrafluoroethylene (PTFE) and perfluoroalkoxy alkane (PFA). Further, the number average molecular weight of the polymer may range from about several hundred thousand to several millions.

According to an embodiment of the present disclosure, the inorganic filler may be, for example, ceria, alumina, magnesia, calcium carbonate, barium carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, graphite, magnesium carbonate, barium sulfate, or the like. The combination. The inorganic filler may have an average particle diameter of about 500 nm to 3000 nm.

According to an embodiment of the present disclosure, the addition amount of the compound having at least three terminal alkenyl groups has a great influence on the properties of the substrate composition (and the substrate prepared from the substrate composition) of the present disclosure. According to the disclosure In the embodiment, the amount of the compound having at least three terminal alkenyl groups is controlled in the range of 0.015 to 0.7 parts by weight (for example, 0.018 to 0.65 parts by weight, 0.018 to 0.6 parts by weight, or 0.015 to 0.6 parts by weight). If the amount of the compound having at least three terminal alkenyl groups is too low or too high, the processability of the substrate composition and the mechanical strength of the obtained substrate cannot be improved. Further, if the compound having at least three terminal alkenyl groups is added in an amount exceeding 0.7 part by weight, the dielectric constant and the loss factor of the obtained substrate composition are likely to increase.

According to an embodiment of the present disclosure, the compound having at least three terminal alkenyl groups may comprise triallyl isocyanurate (TAIC), trimethallyl isocyanurate (TMAIC). ), triallyl cyanurate (TAC), tetravinyltetramethylcyclotetrasiloxane, octavinyl octasilesquioxane, or the like combination. Furthermore, according to an embodiment of the present disclosure, the compound having at least three terminal alkenyl groups may be selected from triallyl isocyanurate (TAIC), trimethallyl isocyanurate (trimethallyl). Isocyanurate, TMAIC), triallyl cyanurate (TAC), tetravinyltetramethylcyclotetrasiloxane and octavinyl octasilsesquioxane The group of people.

According to an embodiment of the present disclosure, the substrate composition of the present disclosure may further comprise 0.01-10 parts by weight of an additive, wherein the additive may be an initiator, flat Agent, colorant, antifoaming agent, flame retardant, or a combination thereof.

According to an embodiment of the present disclosure, the substrate composition of the present disclosure may further comprise a solvent to uniformly disperse the above polymer, inorganic filler, compound and/or additive in the solvent. The solvent may, for example, be methyl ethyl ketone, methyl propylene glycol (PGMEA), ethyl-2-ethoxyethanol acetate, ethyl 3-ethoxypropionate, isoamyl acetate, benzene, toluene, xylene, Cyclohexane, or a combination of the above.

According to an embodiment of the present disclosure, the initiator may be a peroxide initiator such as benzoyl peroxide, 1,1-bis(t-butylperoxy)cyclohexane ( 1,1-bis(tert-butylperoxy)cyclohexane), 2,5-bis(t-butylperoxy)-2,5-dimethylcyclohexane (2,5-bis(tert-butylperoxy)- 2,5-dimethylcyclohexane), 2,5-bis(t-butylperoxy)-2,5-dimethyl-3-cyclohexyne (2,5-bis(tert-butylperoxy)-2,5 -dimethyl-3-cyclohexyne), bis(1-(tert-butylpeorxy)-1-methy-ethyl)benzene, Tert-butyl hydroperoxide, tert-butyl peroxide, tert-butyl peroxybenzoate, anisyl hydrogen peroxide ( Cumene hydroperoxide), cyclohexanone peroxide, dicumyl peroxide, lauroyl peroxide, or a combination thereof.

According to an embodiment of the disclosure, the present disclosure also provides a substrate. The The substrate comprises a film layer, wherein the film layer is a cured product formed by the substrate composition. According to an embodiment of the present disclosure, the substrate preparation method may include the steps of: drying the above substrate composition at 80 to 120 ° C (removing the solvent), and forming a sheet by a roll press process. Next, the sheet was baked at 150 to 300 ° C to obtain the film layer. According to an embodiment of the present disclosure, the substrate 100 of the present disclosure may further include a first metal foil 120 disposed on the film layer 110. Please refer to FIG. According to an embodiment of the present disclosure, the first metal foil may be a copper foil or an aluminum foil.

According to the embodiment of the present disclosure, in addition to the first metal foil 120 and the film layer 110, the substrate 100 may further include a second metal foil 130. The film layer 110 is placed between the first metal foil 120 and the second metal foil 130. Please refer to FIG. 2 . According to an embodiment of the present disclosure, the second metal foil may be a copper foil or an aluminum foil.

According to the disclosed embodiment, the substrate has a low dielectric constant, a low loss factor, and high mechanical strength, and can be used as a printed circuit board, an integrated circuit carrier, or a high frequency substrate.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

Substrate composition

Example 1:

First, 4 g of trimethallyl isocyanurate (TMAIC) (purchased from Hunan Farida Technology Co., Ltd.) and 1.2 g of dicumyl peroxide were dissolved. In 36 grams of methyl ethyl ketone, one is obtained A solution containing trimethylallyl isocyanurate (TMAIC solution). Next, 27.5 g of cerium oxide (average particle size 25 nm, available from US Silica), 37.5 g of PTFE dispersion (purchased from DuPont, in which the PTFE content was 60% (22.5 g)) And 0.1 g of the above-mentioned solution containing trimethylallyl isocyanurate (wherein the content of trimethylallyl isocyanurate was 0.0097 g) was mixed. After drying to remove a part of the solvent, the substrate composition (1) was obtained.

Example 2:

The substrate composition (1) was prepared in the same manner as in Example 1, except that the solution containing trimethylallyl isocyanurate was increased from 0.1 g to 0.25 g to obtain a substrate composition (2).

Example 3:

The substrate composition (1) was prepared in the same manner as in Example 1, except that the solution containing the trimethylallyl isocyanurate was increased from 0.1 g to 0.5 g to obtain a substrate composition (3).

Example 4:

The substrate composition (1) was prepared in the same manner as in Example 1, except that the solution containing the trimethylallyl isocyanurate was increased from 0.1 g to 1 g to obtain a substrate composition (4).

Example 5:

This was carried out in the manner of preparation of the substrate composition (1) described in Example 1, except that the solution containing trimethylallyl isocyanurate was increased from 0.1 g to 3 g to obtain a substrate composition (5).

Comparative Example 1:

The substrate composition (1) was prepared in the same manner as in Example 1, except that the trimethylallyl isocyanurate solution was not added, and the substrate composition (6) was obtained.

Comparative Example 2:

The substrate composition (1) was prepared in the same manner as in Example 1, except that the solution containing trimethylallyl isocyanurate was increased from 0.1 g to 5 g to obtain a substrate composition (7).

Example 6

First, 4 g of tetravinyltetramethylcyclotetrasiloxane (available from Gonglong Chemical Co., Ltd. imported Gelest Inc.) and 1.2 g of dicumyl peroxide were dissolved in 36 g of methyl ethyl ketone ( In methyl ethyl ketone), a solution containing tetravinyltetramethylcyclotetraoxane was obtained. Next, 27.5 g of cerium oxide (average particle size 25 μm, purchased from US Silica), 37.5 g of PTFE dispersion (purchased from DuPont, in which the PTFE content was 60% (22.5 g)) And 1 g of the above tetravinyltetramethylcyclotetraoxane solution (in which the tetravinyltetramethylcyclotetraoxane content was 0.097 g) was mixed. After a part of the solvent was removed by drying, a substrate composition (8) was obtained.

Example 7

First, 4 grams of octavinyl octasilesquioxane (available from Gelest Inc.) and 1.2 grams of dicumyl peroxide were dissolved in 36 grams of methyl ethyl ketone. In the case, a solution containing octavinyl octaquid silsesquioxane is obtained. Next, will 27.5 g of cerium oxide (average particle size 25 μm, available from US Silica), 37.5 g of PTFE dispersion (purchased from DuPont with a PTFE content of 60% (22.5 g)), and One gram of the above octavinyl octaquid silsesquioxane solution in which the octavinyl octaquid silsesquioxane content was 0.097 g was mixed. After a part of the solvent was removed by drying, a substrate composition (9) was obtained.

Substrate preparation and quality measurement

Example 8

The substrate compositions described in Examples 1-5 and Comparative Examples 1-2 were each baked at 120 ° C to remove the solvent. Next, the baked product is rolled using a roller to form a sheet. Next, the sheet was baked and cured at 150 to 300 ° C to form a film layer (1) to (7) (having a thickness of about 300 μm). Finally, the obtained film layers (1) to (7) were respectively pressed together with a copper foil (purchased from Fukuda and having a thickness of 18 μm) to obtain substrates (1) to (7).

Next, after the copper foil is removed by etching, the dielectric constant (Dk), dielectric loss factor (Df), and elastic modulus (elastic modulus) of the film layers (1)-(7) are measured. ), viscosity modulus, and complex modulus. The results are shown in Table 1. Among them, the dielectric constant (Dk) and the dielectric loss factor (Df) are measured at a frequency of 10 GHz using a microwave dielectrometer (available from AET); and the elastic modulus ( Elastic modulus), viscosity modulus, and complex modulus are measured at 50 ° C using a viscosity analyzer This is carried out in accordance with ASTM D 5992-96.

Example 9

The substrate composition described in Example 6 was baked at 120 ° C to remove the solvent. Next, the baked product is rolled using a roller to form a sheet. Next, the sheet was baked and cured at 150 to 300 ° C to form a film layer (8) (having a thickness of about 300 μm). The obtained film layer (8) and a copper foil (purchased from Fukuda, thickness: 18 μm) were pressed together to obtain a substrate (8). Next, after the copper foil is removed by etching, the dielectric constant (Dk), the dielectric loss factor (Df), the elastic modulus, and the viscosity of the film layer (8) are measured. Modulus modulus, and complex modulus, knot As shown in Table 2.

As can be seen from Table 1-2, since the substrate composition described in Examples 1-6 is added with about 0.0194 parts by weight to 0.582 parts by weight of at least three terminal alkenyl compounds (for example, trimethylallyl isocyanuramide) An acid ester (TMAIC), or tetravinyltetramethylcyclotetraoxane) (relative to 100 parts by weight of an inorganic filler and a polymer), thus forming a film layer formed by the substrate composition of the present invention In addition to the low dielectric constant and low dielectric loss factor, the elastic modulus, viscous modulus, and composite modulus are comparable to those of Comparative Example 1 (without addition of at least three terminal alkenyl compounds). It has also been greatly improved. Further, when an excessive amount of trimethylallyl isocyanurate was added (i.e., Comparative Example 2), the Young's modulus of the obtained film layer was lower than that of Comparative Example 1 (no added trimethylallyl isocyanurate) The ester layer is low in the film layer.

The present disclosure has been disclosed in the above several embodiments, but it is not intended to limit the disclosure, and any one skilled in the art can make any changes and refinements without departing from the spirit and scope of the disclosure. Therefore, the scope of protection of this disclosure is subject to the definition of the scope of the patent application.

Claims (13)

A substrate composition comprising: 25-80 parts by weight of a polymer, wherein the polymer is selected from the group consisting of polytetrafluoroethylene (PTFE) and perfluoroalkoxy alkane (PFA); 20 to 75 parts by weight of the inorganic filler, wherein the total of the polymer and the inorganic filler is 100 parts by weight; and 0.015 to 0.7 parts by weight of the compound, wherein the compound has at least three terminal alkenyl groups (terminal vinyl Group). The substrate composition according to claim 1, wherein the inorganic filler is cerium oxide, aluminum oxide, magnesium oxide, calcium carbonate, cerium carbide, sodium carbonate, titanium oxide, zinc oxide, zirconium oxide, graphite, carbonic acid. Magnesium, barium sulfate, or a combination of the above. The substrate composition according to claim 1, wherein the compound is triallyl isocyanurate (TAIC). The substrate composition according to claim 1, wherein the compound is trimethallyl isocyanurate (TMAIC). The substrate composition according to claim 1, wherein the compound is triallyl cyanurate (TAC). The substrate composition according to claim 1, wherein the compound is tetravinyltetramethylcyclotetrasiloxane. The substrate composition according to claim 1, wherein the compound is Octavinyl octasilsesquioxane (octavinyl octasilsesquioxane). The substrate composition according to claim 1, further comprising 0.01 to 10 parts by weight of an additive. The substrate composition according to claim 8, wherein the additive is an initiator, a flat agent, a colorant, an antifoaming agent, a flame retardant, or a combination thereof. A substrate comprising: a film layer, wherein the film layer is a cured product formed by the substrate composition described in claim 1 of the patent application. The substrate of claim 10, further comprising: a first metal foil disposed on the film layer. The substrate of claim 11, further comprising: a second metal foil, wherein the film layer is disposed between the first metal foil and the second metal foil. The substrate of claim 10, wherein the substrate is a printed circuit board, an integrated circuit carrier, or a high frequency substrate.