TW201925947A - Heat dissipation control method and immersion cooling system thereof - Google Patents
Heat dissipation control method and immersion cooling system thereof Download PDFInfo
- Publication number
- TW201925947A TW201925947A TW106141597A TW106141597A TW201925947A TW 201925947 A TW201925947 A TW 201925947A TW 106141597 A TW106141597 A TW 106141597A TW 106141597 A TW106141597 A TW 106141597A TW 201925947 A TW201925947 A TW 201925947A
- Authority
- TW
- Taiwan
- Prior art keywords
- immersion cooling
- coolant
- cooling
- fan
- operating power
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明關於一種散熱控制方法及其浸入式冷卻系統,尤指一種使用感測處理裝置偵測冷卻液之蒸氣溫度以優先調整泵浦裝置或風扇裝置之運作功率的散熱控制方法及其浸入式冷卻系統。The present invention relates to a heat dissipation control method and an immersion cooling system thereof, and more particularly to a heat dissipation control method for using a sensing processing device to detect a vapor temperature of a coolant to preferentially adjust an operating power of a pump device or a fan device, and immersion cooling thereof system.
一般而言,浸入式冷卻系統係利用將發熱元件(如刀鋒型伺服器、磁碟陣列等)浸沒在冷卻液槽所儲存的冷卻液中,透過冷卻液吸熱後所產生之蒸氣帶走發熱元件運作時之熱能,再使用風扇裝置將蒸氣冷卻回液體並經由泵浦裝置送回的液氣兩相轉換過程來產生散熱功效。然而,由於傳統浸入式冷卻系統並沒有針對散熱功耗進行最佳化處理,而僅是由工作人員根據實務經驗以手動方式調整風扇裝置與泵浦裝置之運作功率或是直接將風扇裝置與泵浦裝置之運作功率調至最高,因此往往會造成浸入式冷卻系統在散熱控制操作上費時費工且相當地耗電。In general, the immersion cooling system uses a heating element (such as a blade type servo, a disk array, etc.) to be immersed in the coolant stored in the coolant tank, and the vapor generated by the heat absorption of the coolant removes the heating element. In the operation of the thermal energy, the fan device is used to cool the vapor back to the liquid and the liquid-gas two-phase conversion process sent back by the pump device to generate heat dissipation effect. However, since the conventional immersion cooling system does not optimize the heat dissipation power consumption, only the staff manually adjusts the operating power of the fan unit and the pump unit according to the practical experience or directly connects the fan unit and the pump. The operating power of the pump is adjusted to the highest, so the immersion cooling system often causes time and labor and considerable power consumption in the heat control operation.
本發明之目的在於提供一種使用感測處理裝置偵測冷卻液之蒸氣溫度以優先調整泵浦裝置或風扇裝置之運作功率的散熱控制方法及其浸入式冷卻系統,以解決上述之問題。It is an object of the present invention to provide a heat dissipation control method for detecting the operating power of a pump device or a fan device using a sensing processing device to detect the vapor temperature of the coolant, and an immersion cooling system thereof to solve the above problems.
根據一實施例,本發明之散熱控制方法應用在對一發熱元件進行散熱之一浸入式冷卻設備。該浸入式冷卻設備包含一冷卻液槽、一泵浦裝置,以及一風扇裝置,該發熱元件浸入該冷卻液槽所儲存之冷卻液中,該風扇裝置用來將該冷卻液於吸收該發熱元件之熱能時所產生之蒸氣冷卻回液體,該泵浦裝置連通於該冷卻液槽以及該風扇裝置以用來將蒸氣送至該風扇裝置以及用來將冷卻回液體之冷卻液送回該冷卻液槽。該散熱控制方法包含該浸入式冷卻設備於開機的期間進行至少一冷卻相關參數的初始化、使用一感測處理裝置偵測該冷卻液槽內之一蒸氣溫度、該感測處理裝置於判斷出該蒸氣溫度大於一溫控範圍之一最大值時優先提昇該泵浦裝置之運作功率,以及該感測處理裝置於判斷出該蒸氣溫度小於一溫控範圍之一最小值時優先降低該風扇裝置之運作功率。According to an embodiment, the heat dissipation control method of the present invention is applied to an immersion cooling device that dissipates heat from a heat generating component. The immersion cooling device comprises a coolant tank, a pumping device, and a fan device, wherein the heating element is immersed in the coolant stored in the coolant tank, the fan device is configured to absorb the coolant into the heating element The steam generated by the thermal energy is cooled back to the liquid, the pumping device is in communication with the coolant tank and the fan unit for sending steam to the fan unit and for returning the coolant cooled back to the liquid to the coolant groove. The heat dissipation control method includes the initialization of at least one cooling-related parameter during the startup of the immersion cooling device, and detecting a vapor temperature in the coolant tank by using a sensing processing device, wherein the sensing processing device determines the Preferably, when the vapor temperature is greater than a maximum value of a temperature control range, the operating power of the pumping device is preferentially increased, and the sensing processing device preferentially lowers the fan device when determining that the vapor temperature is less than a minimum value of a temperature control range Operating power.
根據另一實施例,本發明之浸入式冷卻系統用來對一發熱元件進行散熱,該浸入式冷卻系統包含一浸入式冷卻設備以及一感測處理裝置。該浸入式冷卻設備包含一冷卻液槽、一風扇裝置,以及一泵浦裝置。該冷卻液槽用來儲存一冷卻液以及容置該發熱元件,以使該發熱元件浸入該冷卻液中。該風扇裝置用來將該冷卻液於吸收該發熱元件之熱能時所產生之蒸氣冷卻回液體。該泵浦裝置連通於該冷卻液槽以及該風扇裝置,用來將蒸氣送至該風扇裝置以及用來將冷卻回液體之冷卻液送回該冷卻液槽。該感測處理裝置電連接於該浸入式冷卻設備,用來偵測該冷卻液槽內之一蒸氣溫度、於判斷出該蒸氣溫度大於一溫控範圍之一最大值時優先提昇該泵浦裝置之運作功率,以及於判斷出該蒸氣溫度小於一溫控範圍之一最小值時優先降低該風扇裝置之運作功率。According to another embodiment, the immersion cooling system of the present invention is used to dissipate heat from a heat generating component comprising an immersion cooling device and a sensing processing device. The immersion cooling apparatus includes a coolant tank, a fan unit, and a pump unit. The coolant tank is used for storing a coolant and accommodating the heat generating component to immerse the heat generating component in the coolant. The fan unit is configured to cool the vapor generated by the coolant when absorbing heat energy of the heat generating component back to the liquid. The pumping device is in communication with the coolant tank and the fan unit for delivering steam to the fan unit and for returning coolant cooled back to the liquid tank. The sensing processing device is electrically connected to the immersion cooling device for detecting a vapor temperature in the coolant tank, and preferentially raising the pump device when it is determined that the vapor temperature is greater than a maximum value of a temperature control range The operating power, and the operating power of the fan device is preferentially reduced when it is determined that the vapor temperature is less than a minimum of a temperature control range.
相較於先前技術,透過在蒸氣溫度過熱的情況下優先提昇具有低耗電功率之泵浦裝置之運作功率,以及在蒸氣溫度過低的情況下優先降低具有高耗電功率之風扇裝置之運作功率的自動化監控方法,本發明係可有效地解決先前技術所提及的浸入式冷卻系統在散熱控制操作上費時費工且相當地耗電的問題,從而大大地改善浸入式冷卻系統在散熱控制操作上的簡便性並且達到節能省電之功效。Compared with the prior art, the operating power of the pumping device with low power consumption is preferentially increased in the case of overheating of the steam temperature, and the operation of the fan device with high power consumption is preferentially reduced in the case where the steam temperature is too low. The invention discloses an automatic monitoring method for power, and the invention can effectively solve the problem that the immersion cooling system mentioned in the prior art is time-consuming and labor-consuming and consumes electricity in the heat-dissipating control operation, thereby greatly improving the heat-dissipating control of the immersion cooling system. It is easy to operate and achieves energy saving.
關於本發明之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following embodiments and the accompanying drawings.
請參閱第1圖,其為根據本發明之一實施例所提出之一浸入式冷卻系統10之功能方塊示意圖,浸入式冷卻系統10係用來對一發熱元件12(如刀鋒型伺服器、磁碟陣列等)進行散熱,如第1圖所示,浸入式冷卻系統10包含一浸入式冷卻設備14以及一感測處理裝置16。浸入式冷卻設備14包含一冷卻液槽18、一風扇裝置20,以及一泵浦裝置22。冷卻液槽18係可為一般常見應用在浸入式冷卻設備中之冷卻液儲存槽室(其相關槽室設計係常見於先前技術中,故於此不再贅述)而用來儲存一冷卻液24以及容置發熱元件12,以使發熱元件12可浸入冷卻液24中,其中冷卻液24係可為常見用來進行浸入式冷卻的惰性介電液(如礦物油、聚矽氧油等)。風扇裝置20係用來將冷卻液24於吸收發熱元件12之熱能時所產生之蒸氣冷卻回液體。泵浦裝置22係連通於冷卻液槽18以及風扇裝置20,以用來將蒸氣送至風扇裝置20進行冷卻以及用來將冷卻回液體之冷卻液24送回冷卻液槽18。感測處理裝置16係電連接於浸入式冷卻設備14,以用來對浸入式冷卻設備14進行冷卻相關數值以及冷卻液槽之蒸氣溫度的監控,從而確保浸入式冷卻設備14可順利運作,至於針對感測處理裝置16之感測原理(如系統溫度感測、冷卻液流速感測、泵浦轉速感測、風扇轉速感測、系統壓力感測、液面高度感測,以及蒸氣溫度感測)的相關描述,其係常見於先前技術中,故於此不再贅述。此外,在此實施例中,浸入式冷卻設備14可另包含一過濾泵浦26,過濾泵浦26係連通於冷卻液槽18,以用來對冷卻液槽18所儲存之冷卻液24進行雜質(如附著在發熱元件12上之微小異物)濾出,從而防止因雜質沈積所造成的散熱不良問題以及因雜質具有導電性所造成的電性短路問題。Please refer to FIG. 1 , which is a functional block diagram of an immersion cooling system 10 according to an embodiment of the present invention. The immersion cooling system 10 is used for a heating element 12 (such as a blade type servo, magnetic The dish array or the like performs heat dissipation. As shown in FIG. 1, the immersion cooling system 10 includes an immersion cooling device 14 and a sensing processing device 16. The immersion cooling device 14 includes a coolant tank 18, a fan unit 20, and a pump unit 22. The coolant tank 18 can be a coolant storage tank chamber commonly used in immersion cooling equipment (the relevant tank chamber design is common in the prior art, so it will not be described here) and is used to store a coolant 24 And accommodating the heating element 12 so that the heating element 12 can be immersed in the cooling liquid 24, wherein the cooling liquid 24 can be an inert dielectric liquid (such as mineral oil, polyoxygenated oil, etc.) commonly used for immersion cooling. The fan unit 20 is for cooling the vapor generated by the cooling liquid 24 when absorbing the thermal energy of the heat generating element 12 back to the liquid. The pumping device 22 is in communication with the coolant tank 18 and the fan unit 20 for sending steam to the fan unit 20 for cooling and for returning the coolant 24 cooled back to the coolant tank 18. The sensing processing device 16 is electrically coupled to the immersion cooling device 14 for monitoring the immersion cooling device 14 with the associated values of the cooling and the vapor temperature of the coolant bath to ensure smooth operation of the immersion cooling device 14 as well. Sensing principles for sensing processing device 16 (eg, system temperature sensing, coolant flow sensing, pumping speed sensing, fan speed sensing, system pressure sensing, level sensing, and vapor temperature sensing) The related descriptions are common in the prior art, and thus will not be described again. In addition, in this embodiment, the immersion cooling device 14 may further include a filter pump 26 that communicates with the coolant tank 18 for impurities in the coolant 24 stored in the coolant tank 18. (such as tiny foreign matter adhering to the heating element 12) is filtered out to prevent heat dissipation problems caused by impurity deposition and electrical short-circuit problems due to conductivity of impurities.
於此針對浸入式冷卻系統10之散熱控制方法進行說明,請參閱第1圖以及第2圖,第2圖為根據本發明之一實施例所提出之散熱控制方法之流程圖,本發明之散熱控制方法包含下列步驟。For the heat dissipation control method of the immersion cooling system 10, please refer to FIG. 1 and FIG. 2, and FIG. 2 is a flow chart of a heat dissipation control method according to an embodiment of the present invention. The control method consists of the following steps.
步驟200: 浸入式冷卻設備14於開機期間初始化冷卻相關參數。Step 200: The immersion cooling device 14 initializes cooling related parameters during startup.
步驟202: 感測處理裝置16判斷冷卻相關參數是否異常;若是,執行步驟204;若否,執行步驟206。Step 202: The sensing processing device 16 determines whether the cooling related parameter is abnormal; if yes, step 204 is performed; if not, step 206 is performed.
步驟204: 關閉浸入式冷卻設備14。Step 204: Turn off the immersion cooling device 14.
步驟206: 感測處理裝置16判斷冷卻液槽18之蒸氣溫度是否大於溫控範圍之最大值;若是,執行步驟208;若否,執行步驟214。Step 206: The sensing processing device 16 determines whether the vapor temperature of the coolant tank 18 is greater than the maximum value of the temperature control range; if yes, step 208 is performed; if not, step 214 is performed.
步驟208: 感測處理裝置16判斷泵浦裝置22之運作功率是否已升至最高;若是,執行步驟210;若否,執行步驟212。Step 208: The sensing processing device 16 determines whether the operating power of the pumping device 22 has risen to the highest; if yes, step 210 is performed; if not, step 212 is performed.
步驟210: 感測處理裝置16提昇風扇裝置20之運作功率。Step 210: The sensing processing device 16 boosts the operating power of the fan device 20.
步驟212: 感測處理裝置16提昇泵浦裝置22之運作功率。Step 212: The sensing processing device 16 boosts the operating power of the pumping device 22.
步驟214: 感測處理裝置16判斷冷卻液槽18之蒸氣溫度是否小於溫控範圍之最小值;若是,執行步驟216;若否,執行步驟222。Step 214: The sensing processing device 16 determines whether the vapor temperature of the coolant tank 18 is less than the minimum value of the temperature control range; if yes, step 216 is performed; if not, step 222 is performed.
步驟216: 感測處理裝置16判斷風扇裝置20之運作功率是否已降至最低;若是,執行步驟218;若否,執行步驟220。Step 216: The sensing processing device 16 determines whether the operating power of the fan device 20 has been reduced to a minimum; if yes, step 218 is performed; if not, step 220 is performed.
步驟218: 感測處理裝置16降低泵浦裝置22之運作功率。Step 218: The sensing processing device 16 reduces the operating power of the pumping device 22.
步驟220: 感測處理裝置16降低風扇裝置20之運作功率。Step 220: The sensing processing device 16 reduces the operating power of the fan device 20.
步驟222: 感測處理裝置16於浸入式冷卻設備14開機時,開啟過濾泵浦26過濾冷卻液24。Step 222: The sensing processing device 16 turns on the filter pump 26 to filter the coolant 24 when the immersion cooling device 14 is turned on.
步驟224: 感測處理裝置16週期性開啟過濾泵浦26過濾冷卻液。Step 224: The sensing processing device 16 periodically turns on the filtered pump 26 to filter the coolant.
以下係針對上述步驟進行詳細之描述。首先,在步驟200中,浸入式冷卻設備14可進行開機操作以對發熱元件12進行散熱,在上述開機期間,浸入式冷卻設備14係可進行針對浸入式冷卻設備14之冷卻相關參數的初始化,以使得浸入式冷卻設備14可在合適的冷卻相關參數設定下對發熱元件12進行散熱,其中上述冷卻相關參數係可較佳地包含系統溫度、冷卻液流速、泵浦轉速、風扇轉速、系統壓力以及冷卻液面高度(但不受此限,其係可根據浸入式冷卻設備14之實際散熱控制需求而有所增減)。接下來,感測處理裝置16係可在浸入式冷卻設備14開機的期間,針對上述冷卻相關參數進行監控且據以判斷是否異常(步驟202),若是感測處理裝置16判斷出上述冷卻相關參數出現異常(例如系統溫度過高、冷卻液流速過慢、泵浦轉速過低、風扇轉速過低、系統壓力過高,以及冷卻液面高度過低等),則會逕行關閉浸入式冷卻設備14,等到浸入式冷卻設備14經檢修而使得上述冷卻相關參數皆回復到正常數值後再行開機,藉以達到保護浸入式冷卻設備14的功效。The following is a detailed description of the above steps. First, in step 200, the immersion cooling device 14 can perform a power-on operation to dissipate heat from the heat generating component 12, during which the immersion cooling device 14 can perform initialization of cooling related parameters for the immersion cooling device 14. In order for the immersion cooling device 14 to dissipate heat from the heating element 12 under suitable cooling related parameter settings, wherein the cooling related parameters may preferably include system temperature, coolant flow rate, pump speed, fan speed, system pressure And the level of the coolant level (but not limited to this, it may be increased or decreased according to the actual heat control requirements of the immersion cooling device 14). Next, the sensing processing device 16 can monitor the cooling related parameter during the startup of the immersion cooling device 14 and determine whether the abnormality is determined (step 202), if the sensing processing device 16 determines the cooling related parameter. If an abnormality occurs (such as excessive system temperature, too slow coolant flow rate, low pump speed, low fan speed, high system pressure, and low coolant level), the immersion cooling device will be shut down. After the immersion cooling device 14 is overhauled, the above cooling related parameters are all returned to the normal value and then turned on, thereby achieving the effect of protecting the immersion cooling device 14.
在完成冷卻相關參數之檢測後,感測處理裝置16係可針對冷卻液24於吸收發熱元件12之熱能時所產生之蒸氣進行溫度監控並據以調控風扇裝置20或泵浦裝置22之運作功率,以對浸入式冷卻設備14之散熱功耗進行最佳化處理。更詳細地說,在步驟206中,感測處理裝置16係可用來判斷冷卻液槽18之蒸氣溫度是否大於溫控範圍之最大值,此處所提及之溫控範圍係可較佳地由冷卻液之沸點溫度±遲滯溫度(浸入式冷卻系統10可允許超出的工作溫度)所形成之溫度範圍來定義(但不以此為限,其亦可根據實務經驗而有所擴增或縮小)。當感測處理裝置16判斷出冷卻液槽18之蒸氣溫度大於溫控範圍之最大值時,此即代表浸入式冷卻系統10處於過熱狀態,則感測處理裝置16可據以提高浸入式冷卻設備14之散熱能力。After the detection of the cooling-related parameters is completed, the sensing processing device 16 can monitor the temperature of the vapor generated by the cooling liquid 24 when absorbing the thermal energy of the heating element 12 and adjust the operating power of the fan device 20 or the pumping device 22 accordingly. The heat dissipation power consumption of the immersion cooling device 14 is optimized. In more detail, in step 206, the sensing processing device 16 can be used to determine whether the vapor temperature of the coolant tank 18 is greater than the maximum value of the temperature control range. The temperature control range mentioned herein can preferably be The temperature range formed by the boiling point temperature of the coolant ± the hysteresis temperature (the immersion cooling system 10 allows the operating temperature to be exceeded) is defined (but not limited thereto, it may also be expanded or reduced according to practical experience) . When the sensing processing device 16 determines that the vapor temperature of the coolant tank 18 is greater than the maximum value of the temperature control range, which means that the immersion cooling system 10 is in an overheated state, the sensing processing device 16 can improve the immersion cooling device. 14 heat dissipation capabilities.
在實際應用中,由於泵浦裝置22之耗電功率係低於風扇裝置20之耗電功率,因此在節能省電的考量下,感測處理裝置16係可優先提昇泵浦裝置22之運作功率,也就是說,感測處理裝置16係可先判斷泵浦裝置22之運作功率是否已升至最高(步驟208);若感測處理裝置16判斷出泵浦裝置22之運作功率尚未升至最高,則感測處理裝置16可繼續提昇泵浦裝置22之運作功率(步驟212,例如以脈寬調變(Pulse Width Modulation, PWM)方式提昇泵浦裝置22之轉速),直到冷卻液槽18之蒸氣溫度下降至溫控範圍內為止;反之,若感測處理裝置16判斷出泵浦裝置22之運作功率已升至最高,但冷卻液槽18之蒸氣溫度仍然大於溫控範圍之最大值時,則感測處理裝置16可提昇風扇裝置20之運作功率(步驟210,例如以脈寬調變方式提昇風扇裝置20之轉速),從而使得冷卻液槽18之蒸氣溫度可在同時提昇泵浦裝置22與風扇裝置20之運作功率的情況下快速地下降至溫控範圍內,以避免浸入式冷卻系統10過熱。In practical applications, since the power consumption of the pumping device 22 is lower than the power consumption of the fan device 20, the sensing processing device 16 can preferentially increase the operating power of the pumping device 22 under the consideration of energy saving and power saving. That is, the sensing processing device 16 can first determine whether the operating power of the pumping device 22 has risen to the highest (step 208); if the sensing processing device 16 determines that the operating power of the pumping device 22 has not risen to the highest The sensing processing device 16 can continue to increase the operating power of the pumping device 22 (step 212, for example, increasing the rotational speed of the pumping device 22 by Pulse Width Modulation (PWM)) until the coolant tank 18 The vapor temperature drops to within the temperature control range; conversely, if the sensing processing device 16 determines that the operating power of the pumping device 22 has risen to the highest, but the vapor temperature of the coolant tank 18 is still greater than the maximum value of the temperature control range, The sensing processing device 16 can increase the operating power of the fan device 20 (step 210, for example, increasing the rotational speed of the fan device 20 in a pulse width modulation manner), so that the vapor temperature of the coolant tank 18 can be the same. It means the case where the lift pump 22 into the operating power of the fan device 20 is controlled in the range down to the ground quickly, in order to avoid overheating of an immersion cooling system 10.
另一方面,在步驟214中,感測處理裝置16係可用來判斷冷卻液槽18之蒸氣溫度是否小於溫控範圍之最小值,當感測處理裝置16判斷出冷卻液槽18之蒸氣溫度小於溫控範圍之最小值時,此即代表浸入式冷卻系統10須適當地調降散熱能力。同上所述,在實際應用中,由於泵浦裝置22之耗電功率係低於風扇裝置20之耗電功率,因此在節能省電的考量下,感測處理裝置16係可優先降低風扇裝置20之運作功率,也就是說,感測處理裝置16係可先判斷風扇裝置20之運作功率是否已降至最低(步驟216);若感測處理裝置16判斷出風扇裝置20之運作功率尚未降至最低,則感測處理裝置16可繼續降低風扇裝置20之運作功率(步驟220,例如以脈寬調變方式降低風扇裝置20之轉速),直到冷卻液槽18之蒸氣溫度上升至溫控範圍內為止;反之,若感測處理裝置16判斷出風扇裝置20之運作功率已降至最低,但冷卻液槽18之蒸氣溫度仍然小於溫控範圍之最小值時,則感測處理裝置16可降低泵浦裝置22之運作功率(步驟218,例如以脈寬調變方式降低泵浦裝置22之轉速),從而使得冷卻液槽18之蒸氣溫度可在同時降低泵浦裝置22與風扇裝置20之運作功率的情況下上升至溫控範圍內。On the other hand, in step 214, the sensing processing device 16 can be used to determine whether the vapor temperature of the coolant tank 18 is less than the minimum value of the temperature control range. When the sensing processing device 16 determines that the vapor temperature of the coolant tank 18 is less than When the temperature control range is at a minimum, this means that the immersion cooling system 10 has to properly reduce the heat dissipation capability. As described above, in practical applications, since the power consumption of the pumping device 22 is lower than the power consumption of the fan device 20, the sensing device 16 can preferentially reduce the fan device 20 under the consideration of energy saving and power saving. The operating power, that is, the sensing processing device 16 can first determine whether the operating power of the fan device 20 has been minimized (step 216); if the sensing processing device 16 determines that the operating power of the fan device 20 has not decreased At a minimum, the sensing processing device 16 can continue to reduce the operating power of the fan device 20 (step 220, for example, reducing the rotational speed of the fan device 20 in a pulse width modulation manner) until the vapor temperature of the coolant tank 18 rises to within the temperature control range. On the other hand, if the sensing processing device 16 determines that the operating power of the fan device 20 has been reduced to a minimum, but the vapor temperature of the coolant tank 18 is still less than the minimum value of the temperature control range, the sensing processing device 16 can lower the pump. The operating power of the pump device 22 (step 218, for example, reducing the rotational speed of the pump device 22 in a pulse width modulation manner), so that the vapor temperature of the coolant tank 18 can simultaneously reduce the pumping load 22 rises to within the operating temperature range and a case where the power of the fan device 20.
如此一來,透過在蒸氣溫度過熱的情況下優先提昇具有低耗電功率之泵浦裝置之運作功率,以及在蒸氣溫度過低的情況下優先降低具有高耗電功率之風扇裝置之運作功率的自動化監控方法,本發明係可有效地解決先前技術所提及的浸入式冷卻系統在散熱控制操作上費時費工且相當地耗電的問題,從而大大地改善浸入式冷卻系統在散熱控制操作上的簡便性並且達到節能省電之功效。In this way, the operating power of the pump device with low power consumption is preferentially increased in the case of overheating of the steam temperature, and the operating power of the fan device having high power consumption is preferentially lowered in the case where the steam temperature is too low. The invention provides an automatic monitoring method, which can effectively solve the problem that the immersion cooling system mentioned in the prior art is time-consuming and labor-intensive and consumes electricity in the heat-dissipating control operation, thereby greatly improving the heat-dissipating control operation of the immersion cooling system. The simplicity and energy saving effect.
除此之外,在步驟222中,感測處理裝置16係可在浸入式冷卻設備14開機期間,開啟過濾泵浦26對冷卻液槽18所儲存之冷卻液24進行雜質濾出,藉以確實地解決浸入式冷卻設備14因雜質沈積所造成的散熱不良問題以及因雜質具有導電性而導致發熱元件12電性短路的問題。另外,由於浸入式冷卻設備14在運作一段時間後仍然會容易產生上述問題,因此,在步驟224中,感測處理裝置16會根據一特定時間(例如一週),週期性地開啟過濾泵浦26對冷卻液槽18所儲存之冷卻液24進行雜質濾出,也就是說,除了在浸入式冷卻設備14開機時立即開啟過濾泵浦26過濾冷卻液24之外,感測處理裝置16係會在判斷出浸入式冷卻設備14在開機後之運作時間已超過上述特定時間的倍數(例如一週、二週等)時,開啟過濾泵浦26再次過濾冷卻液24,以確保浸入式冷卻設備14可順利地對發熱元件12進行散熱。In addition, in step 222, the sensing processing device 16 can open the filter pump 26 to filter the coolant 24 stored in the coolant tank 18 during the startup of the immersion cooling device 14, thereby reliably The problem of poor heat dissipation due to deposition of impurities in the immersion cooling device 14 and the problem that the heat generating element 12 is electrically short-circuited due to the conductivity of the impurities are solved. In addition, since the immersion cooling device 14 is still prone to the above problems after a period of operation, in step 224, the sensing processing device 16 periodically turns on the filter pump 26 according to a specific time (for example, one week). The coolant 24 stored in the coolant tank 18 is filtered out of impurities, that is, the sensing device 16 is in addition to the filter pump 26 being filtered immediately after the immersion cooling device 14 is turned on. It is determined that when the operation time of the immersion cooling device 14 after the power-on has exceeded a multiple of the above specific time (for example, one week, two weeks, etc.), the filter pump 26 is turned on to filter the coolant 24 again to ensure that the immersion cooling device 14 can be smoothly performed. The heat generating element 12 is radiated.
值得一提的是,上述判斷冷卻相關參數是否異常、於開機時開啟過濾泵浦,以及週期性開啟過濾泵浦之步驟係可為可省略之步驟,舉例來說,另一實施例中,本發明係可僅採用針對冷卻液之蒸氣溫度進行監控並據以調控風扇裝置或泵浦裝置之運作功率而對浸入式冷卻設備之散熱功耗進行最佳化處理的設計,從而簡化本發明之散熱控制設計。至於針對其他衍生變化實施例(如僅採用判斷冷卻相關參數是否異常與監控蒸氣溫度之實施例等)的相關描述,其係可參照上述實施例類推,於此不再贅述。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。It is worth mentioning that, in the above, the step of determining whether the cooling related parameter is abnormal, the filtering pump is turned on at the time of turning on, and the step of periodically turning on the filtering pump may be an elliptable step. For example, in another embodiment, The invention can simplify the heat dissipation of the present invention by using only the monitoring of the vapor temperature of the coolant and the operation power of the fan device or the pump device to optimize the heat dissipation power consumption of the immersion cooling device. Control design. For the description of other derivational variants (such as the embodiment of determining whether the cooling-related parameters are abnormal and the monitoring of the vapor temperature, etc.), reference may be made to the analogy of the above embodiments, and details are not described herein again. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10‧‧‧浸入式冷卻系統10‧‧‧Immersion cooling system
12‧‧‧發熱元件12‧‧‧heating components
14‧‧‧浸入式冷卻設備14‧‧‧Immersion cooling equipment
16‧‧‧感測處理裝置16‧‧‧Sensing device
18‧‧‧冷卻液槽18‧‧‧ coolant tank
20‧‧‧風扇裝置20‧‧‧Fan device
22‧‧‧泵浦裝置22‧‧‧ pumping device
24‧‧‧冷卻液24‧‧‧ Coolant
26‧‧‧過濾泵浦26‧‧‧Filter pump
步驟200、202、204、206、208、210、212、214、216、218、220、222、224‧‧‧步驟Steps 200, 202, 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224 ‧
第1圖為根據本發明之一實施例所提出之浸入式冷卻系統之功能方塊示意圖。 第2圖為根據本發明之一實施例所提出之散熱控制方法之流程圖。1 is a functional block diagram of an immersion cooling system in accordance with an embodiment of the present invention. 2 is a flow chart of a heat dissipation control method according to an embodiment of the present invention.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106141597A TWI633407B (en) | 2017-11-29 | 2017-11-29 | Heat dissipation control method and immersion cooling system thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106141597A TWI633407B (en) | 2017-11-29 | 2017-11-29 | Heat dissipation control method and immersion cooling system thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI633407B TWI633407B (en) | 2018-08-21 |
TW201925947A true TW201925947A (en) | 2019-07-01 |
Family
ID=63959938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106141597A TWI633407B (en) | 2017-11-29 | 2017-11-29 | Heat dissipation control method and immersion cooling system thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI633407B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112105238A (en) * | 2020-09-24 | 2020-12-18 | 安擎(天津)计算机有限公司 | Liquid cooling system for server and control method thereof |
TWI795259B (en) * | 2022-04-01 | 2023-03-01 | 英業達股份有限公司 | Operation parameter setting method for immersion phase change machine |
TWI809725B (en) * | 2021-07-21 | 2023-07-21 | 台達電子工業股份有限公司 | Immersion cooling system |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI690686B (en) * | 2018-10-31 | 2020-04-11 | 英業達股份有限公司 | Cooling device |
KR102518900B1 (en) * | 2021-01-20 | 2023-04-10 | 현대모비스 주식회사 | Method for optimizing performance in fuel cell system |
US12041751B2 (en) | 2021-07-21 | 2024-07-16 | Delta Electronics, Inc. | Immersion cooling system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05141831A (en) * | 1991-11-15 | 1993-06-08 | Nec Corp | Structure of controlling liquid coolant circulation volume |
US6519955B2 (en) * | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
US6377458B1 (en) * | 2000-07-31 | 2002-04-23 | Hewlett-Packard Company | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
US9357675B2 (en) * | 2013-10-21 | 2016-05-31 | International Business Machines Corporation | Pump-enhanced, immersion-cooling of electronic component(s) |
TWM501689U (en) * | 2015-01-07 | 2015-05-21 | Teco Elec & Machinery Co Ltd | Quasi-closed cycle heat dissipation system |
-
2017
- 2017-11-29 TW TW106141597A patent/TWI633407B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112105238A (en) * | 2020-09-24 | 2020-12-18 | 安擎(天津)计算机有限公司 | Liquid cooling system for server and control method thereof |
TWI809725B (en) * | 2021-07-21 | 2023-07-21 | 台達電子工業股份有限公司 | Immersion cooling system |
TWI795259B (en) * | 2022-04-01 | 2023-03-01 | 英業達股份有限公司 | Operation parameter setting method for immersion phase change machine |
Also Published As
Publication number | Publication date |
---|---|
TWI633407B (en) | 2018-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI633407B (en) | Heat dissipation control method and immersion cooling system thereof | |
US10524387B2 (en) | Heat dissipation control method and immersion cooling system thereof | |
US9593871B2 (en) | Systems and methods for operating a thermoelectric module to increase efficiency | |
US9320171B2 (en) | Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux | |
CN107367095B (en) | Compressor power module temperature control method and control system | |
GB2513650A (en) | Method and system for cooling a device | |
CN109210732B (en) | Over-temperature protection method and device for air conditioning unit, air conditioning unit and electronic equipment | |
CN110747612B (en) | Clothes treating apparatus and temperature control method thereof | |
TWI710874B (en) | Heat dissipation module and heat dissipation method thereof | |
CN115492674A (en) | Control method and device for electric water pump and cooling fan | |
CN113834179B (en) | Control method and device of fixed-frequency air conditioner, storage medium and air conditioner | |
JP6644762B2 (en) | Systems and methods for operating thermoelectric modules to increase efficiency | |
WO2022052583A1 (en) | Heat dissipation control method, apparatus and device | |
JP2007225226A (en) | Control method of cooling device | |
JP4266941B2 (en) | Air flow stabilization method, air flow stabilization device, and electronic apparatus including the same | |
KR102234374B1 (en) | Dry vacuum pump apparatus, control method thereof and control program | |
TWI596310B (en) | A circulating cooling system capable of controlling the temperature of cooling medium precisely | |
JP2010048448A (en) | Cooling tower and heat source machine system | |
CN115315067B (en) | Circuit board cooling fan rotating speed control method, storage medium and circuit board | |
JP6665073B2 (en) | Water supply unit | |
JP2011192575A (en) | Induction heating cooker | |
CN115666088B (en) | Electronic equipment and liquid cooling heat dissipation flow control method thereof | |
JP7000916B2 (en) | Communication device and fan control method | |
KR101679975B1 (en) | Air supply method of fuel cell system | |
JP2017145726A (en) | Dry vacuum pump device, control method for the same and control program |