TW201919463A - Power supply capable of enhancing heat dissipation effect and reducing noise during operation - Google Patents

Abstract

The present invention discloses a power supply, which comprises a bottom shell, an upper cover, a circuit board and a cooling fan. In which, the bottom shell and the upper cover are assembled with other and together define a receiving space. The circuit board is mounted on the bottom shell and located in the receiving space. The circuit board is configured with a plurality of electric components and a plurality of heat dissipation elements that are respectively disposed in correspondence to one of the electric components and capable of conducting heat, wherein each of the heat dissipation elements is provided with an assembly hole. The cooling fan comprises a support rack, a driving module disposed on the support rack, and a fan blade unit which is covered on the driving module and is driven by the driving module for rotation. The support rack is in a flat plate shape and is provided with a plurality of connecting ribs respectively connected with one of the assembly holes. The cooling fan is not provided with a barrier wall disposed around the fan blade unit.

Description

Power Supplier

The present invention relates to a power supply, and more particularly to a power supply for a cooling fan that does not have a retaining wall surrounding a blade group.

At present, the power supply used in the personal computer includes a fan for dissipating heat, and the fan is generally disposed as disclosed in US 20090290293, US Pat. No. 20,100, 284, 149, US Pat.

It is clear from the prior patent that the fan currently used has an outer frame through which the fan is mounted on a casing of the power supply. On the other hand, the outer frame further defines a blade group. The flow guiding channel is suspended therein, so that the cooling airflow generated by the fan is discharged from the guiding channel.

In this way, although the heat dissipation airflow generated by the fan can be collected, the dissipative airflow can only dissipate heat for a local place, and the heat dissipation airflow cannot effectively provide heat dissipation to each component inside the power supply. Reduced heat dissipation.

The main object of the present invention is to solve the problem that the fans used in the universal power supply have an outer frame and the heat dissipation effect is reduced.

To achieve the above object, the present invention provides a power supply including a bottom case, an upper cover, a circuit board, and a heat dissipation fan. The bottom case and the upper cover are assembled with each other and define an accommodating space. The circuit board is mounted on the bottom case and located in the accommodating space. The circuit board is provided with a plurality of electronic components and a plurality of corresponding electronic components respectively. One of the heat dissipating members disposed and capable of conducting heat, each of the heat dissipating members having an assembly hole. The heat dissipation fan includes a support frame, a drive module disposed on the support frame, and a fan blade group that is mounted on the drive module and is rotated by the drive module. The support frame has a flat shape. And having a plurality of connecting ribs respectively connected to one of the assembling holes, and the cooling fan does not have a retaining wall provided by the fan blade group.

In one embodiment, the assembly hole is replaced by a gap formed between the plurality of fins on the heat dissipating component.

In one embodiment, the lines connecting the positions of the assembly holes are a polygon.

In one embodiment, the heat dissipating components are of equal height such that the top edges of the heat dissipating components are on the same parallel line, and each of the assembly holes is located at the top edge of each of the heat dissipating components.

In one embodiment, the upper cover has a vent provided to the cooling fan on at least one side.

In addition to the foregoing, the present invention also provides another power supply that includes a bottom case, an upper cover, a circuit board, and a heat dissipation fan. The bottom case and the upper cover are assembled with each other and define an accommodating space. The circuit board is mounted on the bottom case and located in the accommodating space. The heat dissipation fan includes a support frame and a driving device disposed on the support frame. a module, and a blade group that is mounted on the driving module and rotated by the driving module, the support frame has a body for providing the driving module and the blade group, and a plurality of the body A support column connected to and fixed to the circuit board, the support frame does not have a retaining wall provided by the blade group.

In one embodiment, the upper cover has a vent provided to the cooling fan on at least one side.

In one embodiment, the support columns and the body are two detachable members.

In one embodiment, the lines connecting the support posts on the circuit board are a polygon.

In one embodiment, the support frame has a plurality of connecting ribs respectively disposed between two adjacent support columns.

Through the foregoing embodiments of the present invention, the heat dissipating fan disclosed in the present invention does not have a retaining wall surrounding the blade group. In other words, the heat dissipating fan of the present invention has no outer frame. In this way, the heat dissipation airflow generated by the heat dissipation fan is no longer limited by the outer frame, and the heat dissipation can be simultaneously performed on each electronic component or component in the accommodating space, thereby improving the heat dissipation effect compared with the conventional use. . On the other hand, the heat dissipating fan of the present invention has no outer frame and can specifically reduce the noise generated during operation.

The detailed description and technical contents of the present invention are as follows:

Referring to Figures 1 through 5, the present invention provides a power supply 10 that can be implemented in an ATX specification. The power supply 10 includes a bottom case 11, an upper cover 12, a circuit board 13, and a heat dissipation fan 14. The bottom case 11 and the upper cover 12 are mutually assembled. In an embodiment, the bottom case 11 and the upper cover 12 are respectively U-shaped structures, and the bottom case 11 and the upper cover 12 are assembled to define a common The accommodating space 15 defines at least one vent 121 on the upper cover 12. The bottom case 11 and the upper cover 12 of the present invention can be further implemented in a multi-component manner according to the design. Furthermore, the side of the bottom case 11 can be further equipped with a power input port 111 and at least one power output port 112, and the power input port 111 and the power output port 112 are disposed on different sides of the bottom case 11, the power The number of output ports 112 can be adjusted according to implementation requirements.

The circuit board 13 is mounted on the bottom case 11 and located in the accommodating space 15. The circuit board 13 is provided with a plurality of electronic components 131 and a plurality of heat dissipation corresponding to one of the electronic components 131. Element 132. The electronic components 131 are configured to form at least one power correction circuit, a power conversion circuit, and the like. Moreover, each of the heat dissipating elements 132 is in contact with one of the correspondingly disposed electronic components 131 to perform heat conduction. Each of the heat dissipating members 132 has an assembly hole 133. In one embodiment, the heat dissipating elements 132 are equal in height such that each of the top edges 134 of the heat dissipating elements 132 are located on the same parallel line 60, and each of the assembly holes 133 is located in each of the heat dissipating elements 132. The top edge 134. Furthermore, the assembly hole 133 of the present invention can be replaced by a gap 136 formed on the heat dissipating member 132 between the plurality of fins 135, as shown in FIG.

In addition, in the embodiment, the heat dissipation fan 14 includes a support frame 141, a driving module 142 disposed on the support frame 141, and a cover on the drive module 142 and driven by the drive module 142. Rotating blade set 143. The cooling fan 14 can be connected to a power supply circuit (not shown) on the circuit board 13 via a power connection line 144 to obtain power required for rotation. Moreover, the drive module 142 is implemented in a motor structure. Further, the support frame 141 of the present invention has a flat shape and has a plurality of connecting ribs 145 respectively connected to one of the assembly holes 133. The connection rib 145 can be dissipated according to each of the assembly holes 133. The position or aspect of element 132 is adjusted. Moreover, the cooling fan 14 of the present invention does not have a retaining wall provided by the blade group 143. In other words, the cooling fan 14 does not have a current limiting passage defined by the outer frame and suspending the blade group 143 therein. In this way, the heat dissipation fan 14 can generate a heat dissipation airflow more specifically in the accommodating space 15 during the energization operation, thereby improving heat dissipation performance.

Referring to FIG. 5, in order to increase the stability of the cooling fan 14 during the rotation process, in an embodiment, the assembly holes 133 are to be arranged such that the connection positions of the assembly holes 133 are a polygon 61. In this way, the heat dissipation fan 14 can be more stably supported, and the possibility of sloshing during the rotation of the heat dissipation fan 14 is reduced. However, the current embodiment of the present invention is exemplified by three assembly holes 133, but is not limited by this number.

Referring to FIG. 6 to FIG. 7 and FIG. 10, in addition to the power supply 10 described above, the present invention also proposes another embodiment. However, in order to distinguish the two embodiments, different reference numerals will be used later. In the embodiment, the power supply 20 includes a bottom case 21, an upper cover 22, a circuit board 23, and a heat dissipation fan 24. The bottom case 21 and the upper cover 22 are assembled to each other to define an accommodating space 25 , and the upper cover 22 can have a vent 221 provided on the heat dissipating fan 24 at least on one side. Moreover, the circuit board 23 is mounted on the bottom case 21 and located in the accommodating space 25. The circuit board 23 can be provided with a plurality of electronic components 231 and a plurality of heat dissipating components 232 according to implementation requirements, and the electronic components 231 are configured to be at least A power correction circuit, a power conversion circuit and the like are formed, and the heat dissipation elements 232 can be arranged according to implementation requirements.

Further, the cooling fan 24 includes a support frame 241, a driving module 242 disposed on the support frame 241, and a fan blade that is mounted on the driving module 242 and rotated by the driving module 242. Group 243. In this embodiment, the support frame 241 has a main body 244 for providing the driving module 242 and the fan blade group 243, and a plurality of support columns 245 respectively connected to the main body 244 and fixed on the circuit board 23. Specifically, the body 244 is in the form of a flat plate. The body 244 has at least one flat portion 246 for providing the driving module 242, and a blade group is connected to the flat portion 246 and located at a center of the body 244. 243 assembled protrusion 247. In one embodiment, the body 244 further includes a plurality of connecting portions 248 respectively extending from the edge of the flat portion 246, and each of the connecting portions 248 respectively corresponds to one of the supporting columns 245. The circuit board 23 has a plurality of through holes 233 respectively provided for the support columns 245. Moreover, the support posts 245 jointly support the body 244 such that the body 244 is disposed at a height 62 relative to the circuit board 23. The height of the support posts 245 is at least higher than the highest of the electronic components 231. Moreover, the support columns 245 and the body 244 are two detachable members. Furthermore, in the embodiment, the cooling fan 24 does not have a retaining wall provided by the blade group 243. That is, the cooling fan 24 does not have a frame defined by the outer frame and the fan blade group 243 is suspended therein. Current limiting channel.

Referring to FIG. 7 and FIG. 8 , in order to increase the stability of the cooling fan 24 during the rotation process, in an embodiment, the positions of the support columns 245 disposed on the circuit board 23 will be planned. The connection of the support post 245 to the position on the circuit board 23 is a polygon 63. However, this embodiment is exemplified by three support posts 245, but is not limited by this number. Furthermore, each of the support posts 245 is further implemented with a fixing member 30 for fixing each of the support posts 245 to the circuit board 23. The fixing member 30 can be a nut or a screw or the like. In addition, referring to FIG. 9 , in an embodiment, the support frame 241 can have a plurality of connecting ribs 249 respectively disposed between two adjacent support columns 245 , and the arrangement of the connecting ribs 249 can increase the The structural strength of the support columns 245, the aspects of the connecting ribs 249 can be adjusted according to the implementation requirements.

On the other hand, the upper cover 22 has at least one vent 221 provided for the heat dissipating fan 24. In one embodiment, the upper cover 22 is provided with a plurality of vents 221, and the vents 221 can follow one The design pattern is shaped. In addition, the vent 221 of the upper cover 22 can also adjust the opening area according to the implementation, so that the vent 221 can provide a decorative baffle 26 disposed therein, and the decorative baffle 26 can be provided. The plurality of vent holes 261 opened in accordance with a design pattern are as shown in FIG. In this embodiment, the power supply 20 will provide the user with a different decorative baffle 26 based on personal preference.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. Variations and modifications are still within the scope of the patents of the present invention.

10‧‧‧Power supply

11‧‧‧ bottom case

111‧‧‧Power input埠

112‧‧‧Electrical output埠

12‧‧‧Upper cover

121‧‧‧ vents

13‧‧‧Circuit board

131‧‧‧Electronic components

132‧‧‧Heat components

133‧‧‧Assembled holes

134‧‧‧Top edge

135‧‧‧Fins

136‧‧‧ gap

14‧‧‧ cooling fan

141‧‧‧Support frame

142‧‧‧Drive Module

143‧‧‧ fan group

144‧‧‧Power connection cable

145‧‧‧ Connecting ribs

15‧‧‧ accommodating space

20‧‧‧Power supply

21‧‧‧ bottom case

22‧‧‧Upper cover

221‧‧‧ vents

23‧‧‧ Circuit board

231‧‧‧Electronic components

232‧‧‧Heat components

233‧‧‧Perforation

24‧‧‧ cooling fan

241‧‧‧Support frame

242‧‧‧Drive Module

243‧‧‧Fan leaf group

244‧‧‧ Ontology

245‧‧‧Support column

246‧‧‧ Flat

247‧‧‧Protruding

248‧‧‧Connecting Department

249‧‧‧ Connecting ribs

25‧‧‧ accommodating space

26‧‧‧Decorative baffle

261‧‧‧ venting holes

30‧‧‧Fixed parts

60‧‧‧ parallel lines

61‧‧‧ polygon

62‧‧‧ Height

63‧‧‧ polygon

FIG. 1 is an exploded perspective view of a power supply according to an embodiment of the present invention. 2 is an exploded perspective view showing a partial structure of a power supply according to an embodiment of the present invention. Figure 3 is a cross-sectional view showing the structure of a power supply device in accordance with an embodiment of the present invention. Figure 4 is a cross-sectional view showing the structure of a power supply of another embodiment of the present invention. FIG. 5 is a top plan view showing a partial structure of a power supply according to an embodiment of the present invention. FIG. 6 is an exploded perspective view showing a partial structure of a power supply according to another embodiment of the present invention. Figure 7 is a cross-sectional view showing the structure of a power supply of another embodiment of the present invention. FIG. 8 is a top plan view showing a partial structure of a power supply according to another embodiment of the present invention. Figure 9 is an exploded perspective view showing the structure of a power supply of another embodiment of the present invention. Figure 10 is a schematic exploded view of the upper cover of another embodiment of the present invention.

Claims (10)

A power supply comprising: a bottom case and an upper cover, the bottom case and the upper cover are assembled with each other and jointly define an accommodating space; a circuit board is mounted on the bottom case and located in the accommodating space, the circuit The board is provided with a plurality of electronic components and a plurality of heat dissipating components respectively disposed corresponding to one of the electronic components and capable of heat conduction, each of the heat dissipating components having an assembly hole; and a heat dissipation fan including a support frame, a driving module disposed on the support frame, and a fan blade group mounted on the driving module and driven by the driving module, the supporting frame is in a flat shape and has a plurality of components and one of the assembly The connecting ribs of the holes are connected, and the cooling fan does not have a retaining wall provided by the fan blade group. The power supply of claim 1, wherein the assembly hole is replaced by a gap formed between the plurality of fins on the heat dissipating member. The power supply of claim 1, wherein the connection location of the assembly holes is a polygon. The power supply of any one of claims 1 to 3, wherein the heat dissipating components are equal in height such that the top edges of the heat dissipating components are on the same parallel line, and each of the assembly holes is located in each of the heat dissipating components The top edge. The power supply of claim 1, wherein the upper cover has a vent provided to the cooling fan on at least one side. A power supply comprising: a bottom case and an upper cover, the bottom case and the upper cover are mutually assembled and jointly define a receiving space; a circuit board mounted on the bottom case and located in the receiving space; and a The heat dissipation fan includes a support frame, a drive module disposed on the support frame, and a fan blade group mounted on the drive module and driven by the drive module, the support frame having a The drive module and the body of the fan blade group and a plurality of support columns respectively connected to the body and fixed on the circuit board, the support frame does not have a retaining wall provided by the fan blade group. The power supply of claim 6, wherein the upper cover has a vent provided to the heat dissipation fan on at least one side. The power supply of claim 6, wherein the support columns and the body are two detachable members. The power supply of claim 8, wherein the connection of the support posts on the circuit board is a polygon. The power supply of claim 8 or 9, wherein the support frame has a plurality of connecting ribs respectively disposed between two adjacent support posts.