TW201912311A - A cleaning device of a chuck-table and a grinding device having the cleaning device - Google Patents

Abstract

To provide a cleaning device of a chuck table and a grinding device having the cleaning device capable of suppressing uneven wear of the chuck surface while cleaning the chuck surface of the chuck table and deterioration of the shape of the wafer after grinding processing. A device for cleaning a chuck surface of a chuck table configured to be able to suck a work while rotating. The device includes a cleaning unit 61 having a plurality of cleaning members 43, and a pressing unit 45 for pressing the cleaning unit 61 against the chuck surface. In the cleaning device of the chuck table, each of the cleaning members 43 is cantilever-fixed to the pressing unit 45 via a spherical bearing 48. Between the cleaning member 43 and the pressing unit 45, a spring 44 for urging the cleaning member 43 to the side opposite to the pressing unit 45 is disposed.

Description

Cleaning device for suction cup carrier and grinding device having the same

The present invention relates to a device for cleaning a suction cup surface of a suction cup stage provided in a grinding device for cleaning a silicon wafer, and a grinding device having the cleaning device.

In the manufacturing process of the ruthenium wafer, a single crystal ruthenium ingot grown by, for example, Czochralski (CZ) method is sliced, and the obtained ruthenium wafer is subjected to grinding treatment to have a desired effect. Thickness or flatness.

Fig. 1 shows an example of the configuration of a grinding device used in the above grinding process. The grinding device 1 shown in the figure includes a suction cup portion 10, a grinding portion 20, and a base 5 that supports the suction portion 10 and the grinding portion 20. The chuck unit 10 vacuum-adsorbs and holds the tantalum wafer 2 on the chuck surface 12, and includes a chuck stage 11 having a circular chuck surface 12 and a chuck carriage driving motor 13 that rotates the chuck stage 11. The drive shaft of the suction stage drive motor 13 is coupled to the rotary shaft of the center of the chuck stage 11, and the suction stage drive motor 13 rotates the chuck stage 11 with the shaft 12c passing through the center of the chuck surface 12 as a rotary shaft. drive.

On the other hand, the grinding unit 20 grinds the surface of the crucible wafer 2 opposite to the adsorption surface, and includes a grinding vermicia 21 that forms a grinding surface in the circumferential direction, and a grinding motor for grinding the vermiculite 21. 22. The pushing mechanism 23 that moves the grinding vermiculite 21 in a direction toward or away from the suction cup stage 11 side. The grinding drive motor 22 is used to rotate the grinding rock 21 for grinding by the shaft 21c which is the center of the grinding surface of the vermiculite 21 for grinding.

FIG. 2 shows an example of the suction cup stage 11. The chuck stage 11 shown in this figure is composed of a dense portion 14 and a porous portion 15. The dense portion 14 is a ceramic body of, for example, alumina (Al ₂ O ₃ ), which is configured to be dense and seamless. Further, the mounting surface 14a of the porous portion 15 has a groove 14b formed in each portion of the mounting surface 14a. A hole 14c for sucking a vacuum and discharging water and gas is formed at the center of the dense portion 14, and the hole 14c communicates with the groove 14b of the mounting surface 14a.

On the other hand, the porous portion 15 is a sintered body of ceramic particles of, for example, alumina (Al ₂ O ₃ ), and is configured to have a sponge-like air permeability. The surface of the porous portion 15 corresponds to the suction cup surface 12. The back surface of the porous portion 15 is attached to the mounting surface 14a of the dense portion 14 to constitute the chuck table 11.

The suction port of the vacuum pump (not shown) communicates with the hole 14c of the chuck stage 11. When the vacuum pump operates, air is sucked from the suction cup surface 12 of the chuck table 11 through the porous portion 15, the groove 14b, and the hole 14c, and the chuck surface 12 becomes a negative pressure, and the silicon wafer 2 is vacuum-adsorbed to the chuck surface 12.

In the above-described grinding process, each time the surface of the crucible 2 is ground, fine foreign matter such as grinding or abrasion powder of vermiculite is generated. After the grinding process, the water and the gas are blown out, and the ground silicon wafer is released, but the foreign matter generated at this time remains on the chuck surface 12 of the chuck table 11.

However, when the foreign matter such as grinding or abrasion powder remains on the suction pad surface 12 of the chuck table 11, the next wafer 2 is directly adsorbed and subjected to the grinding process, and the foreign matter is present on the silicon wafer 2 at the position where the foreign matter exists. The depression cannot be flattened and the desired flatness cannot be obtained.

Therefore, in the past, when a single wafer 2 was subjected to a grinding process, water was supplied to the chuck surface 12 for cleaning, and at the same time, the cleaning member of the cleaning device 3 was brought into contact with the chuck surface 12, The suction pad stage 11 is rotated, whereby the foreign matter on the suction cup surface 12 is removed and washed.

For example, Patent Document 1 describes a cleaning device 3 for cleaning the suction cup surface 12 of the suction cup stage 11 by a rectangular cleaning member 31. The cleaning device 3 is schematically shown in FIG. 3(a) and 3(b) are a plan view of the cleaning device 3 and a cross-sectional view taken along the line A of Fig. 3(a), respectively.

The cleaning of the chuck stage 11 by the cleaning device 3 shown in Fig. 3 is performed in the following manner. That is, the cleaning member 31 having the length corresponding to the radius of the suction cup surface 12 and held by the spring 32 is pressed to contact the suction cup surface 12 of the suction cup stage 11, so that the suction cup stage 11 is wound around the rotary shaft 12c. The circumferential direction H is rotated. Thereby, the foreign matter on the suction cup surface 12 of the suction cup stage 11 can be swept away.

However, the rectangular cleaning member 31 of the cleaning device 3 shown in FIG. 3 receives the frictional force from the suction cup surface 12 of the suction cup stage 11 and is inclined toward the downstream side in the rotation direction of the suction cup stage 11, and passes through the suction cup surface 12. The center line of the center is deviated to contact the chuck face 12 in a line contact manner. When the suction cup stage 11 is rotated in a state where the cleaning member 31 having the length corresponding to the radius is inclined, the cleaning member 31 is not in contact with the center portion 12C of the suction cup surface 12 of the suction cup stage 11. The cleaning ability of the center portion 12C is made very low, and the wear becomes extremely small.

Further, the rectangular cleaning member 31 is a member having a length corresponding to the radius of the suction cup surface 12 as described above. Therefore, the frictional force of each portion in the longitudinal direction of the cleaning member 31 from the suction cup stage 11 is different, and the portion of the cleaning member 31 that is closer to the central portion 12C of the suction cup surface 12 has a smaller frictional force, and is closer to the suction cup. The portion of the outer peripheral portion 12A of the face 12 has a larger frictional force. Since the cleaning member 31 is an integral member, the torsion is generated due to the difference in frictional force between the respective portions in the longitudinal direction, or a part of the cleaning member 31 is floated and does not come into contact with the suction cup surface 12. Therefore, the portions of the longitudinal direction of the cleaning member 31 become uneven with respect to the pressure of the suction cup surface 12, and the washing ability of each portion of the suction cup surface 12 is not uniform. As a result, the wear of the center portion 12C of the suction cup surface 12 of the suction cup stage 11 becomes small, and the abrasion of the outer surface portion 12B and the outer peripheral portion 12A becomes large, and partial wear of the suction cup surface occurs.

Therefore, Patent Document 2 describes a cleaning device that constitutes the cleaning member 31 by a plurality of cleaning members divided in the longitudinal direction. FIG. 4 shows a side surface of a cleaning portion of the cleaning device described in Patent Document 2. In the cleaning portion 41 of the cleaning device of the patent document 2, the holding member 42 that holds the divided cleaning member 43 is held by the four coil springs 44 to be elastically supported on the lower surface of the rectangular flat pressing portion 45. The spring fixing stay 44a is inserted into the inside of each coil spring 44 to fix it to the holding member 42 and the pressing portion 45. In this way, each of the cleaning members 43 has a structure that receives the frictional force in the rotation direction of the suction cup stage 11 when the suction cup surface 12 of the suction cup stage 11 is washed. Furthermore, in FIG. 4, only two of the four coil springs 44 are shown.

However, in the cleaning device described in Patent Document 2, when the cleaning member 43 is brought into contact with the suction cup surface 12 of the suction cup stage 11 and the suction cup stage 11 is rotated, the divided cleaning member 43 is pressed against the pressing portion 45. Relatively offset, it is inclined toward the upstream side in the rotation direction of the chuck table 11. Therefore, the difference in the restoring force of the four coil springs 44 causes the cleaning member 43 to contact the chuck surface 12 with an equal pressure, causing the partial wear of the chuck surface 12 and the problem of the shape of the wafer after the grinding process being deteriorated.

The pressure at which the cleaning member 43 is pressed against the suction cup surface 12 of the suction cup stage 11 is increased, whereby the floating of the cleaning member 43 can be suppressed. However, as described above, the porous portion 15 constituting the suction cup surface 12 is soft, and is a sintered body of ceramic particles such as Al ₂ O ₃ . Therefore, when the cleaning member 43 is pressed against the suction cup surface 12, the suction cup surface 12 is excessively worn.

In the cleaning device, the cleaning device is provided with two cleaning units on the upstream side in the rotation direction of the suction cup stage 11 among the four coil springs 44 in the cleaning device described in Patent Document 2. Change to 2 cantilever leaf springs. FIG. 5 shows a side surface of a cleaning portion of the cleaning device described in Patent Document 3. In the cleaning unit 51 of the cleaning device of Patent Document 3, the coil spring 44 on the upstream side in the rotation direction of the chuck table 11 is replaced with a cantilever plate spring 47 whose one end is fixed to the fixing portion 46, and the other two coil springs 44 are provided. The holding member 42 and the pressing portion 45 are fixed by a spring fixing bolt 44b. In this manner, when the pressing member 43 is relatively offset with respect to the pressing member 45, the inclination of the upstream side of the suction stage 11 in the rotation direction can be suppressed. Furthermore, in FIG. 5, only one of the two sets of leaf springs 47 and the coil springs 44 is shown.

CITATION LIST Patent Literature Patent Literature 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei.

[Questions to be solved by the invention]

However, in the cleaning device described in Patent Document 3, it is difficult to adjust the arrangement of the leaf springs 47 so that the cleaning member 43 and the suction cup surface 12 are in equal contact with each other. As a result, a difference in restoring force between the two coil springs 44 and the two leaf springs 47 occurs, and the cleaning member 43 cannot be brought into contact with the suction cup surface 12 with uniform pressure, and the suction cup surface 12 is still worn and the grinding process is performed. The problem of the shape of the wafer is deteriorated. Further, when the cleaning member 43 is brought into contact with the suction cup surface 12 of the suction cup stage 11 and the suction cup stage 11 is rotated, the leaf spring 47 is remarkably deformed like a twist, and the plate spring 47 is broken.

Therefore, an object of the present invention is to provide a cleaning device for a suction cup carrier and a grinding device including the cleaning device, which can suppress the uneven wear of the suction cup surface when the suction cup surface of the suction cup carrier is washed, and suppress the grinding process. The shape of the wafer deteriorates. [Means for solving problems]

The inventor of the present invention is working on a method for solving the above problems. As a result of the study, it has been found that the two cantilever leaf springs 47 in the cleaning device described in Patent Document 3 are changed to one spherical bearing, and it is extremely effective to fix the respective spherical bearings of the plurality of cleaning members to the pressing portion by cantilever. The present invention is completed.

That is, the gist of the present invention is as follows. (1) A cleaning device for a suction cup carrier, which is a device for cleaning a suction cup surface of a suction cup carrier configured to be capable of adsorbing a workpiece and rotating, the cleaning device of the suction tray carrier comprising: a plurality of cleaning members a cleaning unit; and a pressing portion for pressing the cleaning portion to the suction cup surface; each of the plurality of cleaning members is cantilever-fixed to the pressing portion via a spherical bearing, and the cleaning member and the pushing unit A spring that biases the cleaning member toward the side opposite to the pressing portion is disposed between the pressing portions.

(2) The cleaning device of the chuck table according to the above (1), wherein the end portions of the adjacent cleaning members are repeated in the width direction of the cleaning portion.

(3) The cleaning device of the chuck table according to the above (1) or (2), wherein the adjacent cleaning members are disposed opposite to each other in the width direction of the cleaning portion.

(4) The cleaning device of the suction cup carrier according to any one of the above (1) to (3), further comprising a restriction portion that limits a movable range of the cleaning member.

(5) The cleaning device of the suction cup carrier according to any one of the above aspects, further comprising a rocking portion that swings the cleaning portion in a longitudinal direction of the cleaning portion.

(6) A grinding device for a workpiece, comprising the cleaning device of the suction cup carrier according to the above (1) to (5). [Effect of the invention]

According to the present invention, it is possible to suppress the uneven wear of the chuck surface during the cleaning of the chuck surface of the chuck table, and it is possible to suppress the deterioration of the shape of the wafer after the grinding process.

(Cleaning device) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. A cleaning device for a suction cup carrier according to the present invention is a device for cleaning a suction cup surface of a suction cup carrier that is configured to be capable of sucking a workpiece and rotating, and includes: a cleaning portion having a plurality of cleaning members; and the cleaning portion Push to the pressing portion of the suction cup. Here, the main point is that each of the plurality of cleaning members is cantilevered to the pressing portion via the spherical bearing, and the cleaning member is biased to the opposite side of the pressing portion between the cleaning member and the pressing portion. spring.

6 to 9 show a cleaning portion of a cleaning device in accordance with a preferred embodiment of the present invention. Here, FIG. 6 shows a plan view of the cleaning portion (that is, a view from the side of the suction cup surface 12 of the suction cup stage 11), FIG. 7 shows a vector view B of FIG. 6, and FIG. 8 shows a vector view C of FIG. FIG. 9 and FIG. 9 show a vector view D of FIG. 6. In FIGS. 6 to 9, the same components as those shown in FIGS. 4 and 5 are denoted by the same reference numerals.

As described above, in the cleaning unit 51 of the cleaning device described in Patent Document 3, two cantilever leaf springs 47 are used instead of the cleaning unit of the cleaning device described in Patent Document 2 shown in FIG. Two coil springs 44 in 41. Therefore, it is possible to prevent the offset or partial contact of the cleaning member 43 occurring in the cleaning device described in Patent Document 2.

However, it is difficult to adjust the configuration of the leaf spring 47 so that the cleaning member 43 uniformly contacts the suction cup surface 12. In addition, since the leaf spring 47 can only be deformed in the thickness direction thereof, the cleaning member 43 cannot be applied to the cleaning member 43 in response to the force in which the cleaning member 43 is inclined in the radial direction of the chuck table 11.

As a result, the difference in restoring force between the two coil springs 44 and the two leaf springs 47 causes the cleaning member 43 to contact the chuck surface 12 with equal pressure, and the disc surface 12 is subjected to partial wear. Further, deformation, torsion, and breakage of the leaf spring 47 during the repeated washing process are also problems.

In order to solve the problems associated with the conventional cleaning device, in the cleaning portion 61 of the cleaning device according to the present invention, the cleaning member 43 is cantilevered to the pressing portion 45 at one point by the spherical bearing 48. FIG. 10 is a view for explaining the above-described spherical bearing 48. That is, as shown in Fig. 10 (a), the pin 49 that connects the fixing portion 46 and the support member 46 has a convex spherical surface 49a and a shaft portion 49b provided at one end portion thereof. Further, as shown in FIG. 10(b), a concave spherical surface 46a that receives the convex spherical surface 49a of the pin 49 is formed inside the fixing portion 46 provided on the pressing portion 45. Further, as shown in FIG. 10(c), the convex spherical surface 49a of the pin 49 and the concave spherical surface 46a inside the fixing portion 46 are fitted to each other to constitute the spherical bearing 48.

With the above spherical bearing 48, the pin 49 can be rotated in any plane including the central axis of the pin 49. Further, the other end portion of the pin 49 is fixed to the side surface of the holding member 42, the fixing portion 46 and the holding member 42 are connected by the pin 49, and the cleaning member 43 is cantilevered and fixed to the pressing portion 45 via the ball bearing 48.

Further, between the respective cleaning members 43 (support members 42) and the pressing portion 45, two coil springs 44 that urge the cleaning member 43 to the side opposite to the pressing portion 45 are disposed.

The cleaning device of the present invention has the above-described configuration, and similarly to the cleaning portion 51 of the cleaning device described in Patent Document 3, the relative displacement of the cleaning member 43 with respect to the pressing portion 45 can be prevented.

In addition, since the degree of freedom of movement of the cleaning member 43 is higher than the cleaning unit 51 of the cleaning device described in Patent Document 3, the cleaning member 43 can be inclined in the radial direction of the chucking table 11 in accordance with the force. The cleaning member 43 is brought into uniform contact with the suction cup surface 12 of the suction cup stage 11.

Further, the cleaning member 43 can be brought into contact with the suction cup surface 12 of the suction cup stage 11 with a constant pressure by the restoring force of the coil spring 44. As a result, the partial wear of the chuck surface 12 can be suppressed, and the deterioration of the shape of the wafer after the grinding process can be suppressed.

As described above, the cleaning device according to the present invention is characterized in that each of the plurality of cleaning members 43 in the cleaning portion 61 is cantilever-fixed to the pressing portion 45 through the spherical bearing 48, and the cleaning member 43 is pressed. A spring 44 that urges the cleaning member 43 to the side opposite to the pressing portion 45 is disposed between the portions 45. Therefore, a known configuration can be appropriately used for other configurations.

For example, the cleaning member 43 may be made of, for example, alumina ceramic, and brought into contact with the suction cup surface 12 of the suction cup stage 11, and then the suction cup stage 11 is rotated, whereby the suction cup surface 12 can be washed and the suction surface 12 can be removed. Foreign body.

Further, as shown in FIG. 6, the end portion of the adjacent cleaning member 43 is preferably repeated in the width direction of the cleaning portion 61. Thereby, no gap is formed between the cleaning members 43 adjacent to each other in the radial direction of the suction cup surface 12. As a result, the line contact portions of the respective cleaning members 43 are repeatedly contacted in the radial direction of the suction cup surface 12, and the entire suction cup surface 12 of the suction cup stage 11 can be uniformly washed.

Further, the cleaning portion 61 according to the present invention preferably further includes a restriction portion 50 that limits the movable range of the cleaning member 43. Thereby, it is possible to suppress the twist of the cleaning member 43 when the chuck table 11 is rotated during the cleaning operation.

In the cleaning unit 61 shown in FIGS. 6 to 9, the two pressing portions 45 are provided with two restriction portions 50 each having an L-shaped plate-shaped member, and the cleaning member 43 is restricted to the suction cup. The surface 11 is moved and the cleaning member 43 is rotated about the central axis of the pin 49. The tip end portion of the restricting portion 50 is fitted to the recess portion 42a provided in each of the holding members 42. The restricting portion 50 may be composed of, for example, stainless steel.

Moreover, as shown in FIG. 6, it is preferable that the adjacent cleaning member 43 is reversed in the width direction of the cleaning part 61. Thereby, the washing portion 61 can be made smaller. In the cleaning unit 51 of the cleaning device described in Patent Document 3 shown in FIG. 5, the leaf spring 47 must be disposed on the chuck table 11 with respect to the chuck table 11 in the present invention. The direction of rotation is not compressed, and such structural concerns are not required in the present invention.

Further, the cleaning device according to the present invention further preferably includes a rocking portion that causes the cleaning portion 61 to swing in the longitudinal direction of the cleaning portion 61 (that is, in the radial direction of the chuck table 11). Thereby, the foreign matter on the suction cup surface 12 can be removed more effectively by the cleaning member 43.

In the cleaning unit 61 shown in FIGS. 6 to 9, two coil springs 44 are disposed in each of the cleaning members 43, but one or three or more may be disposed. In addition, the shape of the cleaning member 43 is not particularly limited, and as described in Patent Documents 1 and 2, taper processing or curvature processing (R processing) may be applied everywhere.

(Milling Device) Next, a grinding device for a workpiece according to the present invention will be described. A grinding device for a workpiece according to the present invention is characterized by comprising the above-described cleaning device for a suction cup carrier according to the present invention, and other configurations are not limited. For example, the cleaning unit 61 of the cleaning device according to the present invention may be applied to the cleaning device 3 in the grinding device 1 illustrated in Fig. 1 .

Further, the workpiece to be ground as the grinding device of the present invention may be a semiconductor wafer, and is particularly suitable for grinding a tantalum wafer.

According to the cleaning apparatus of the present invention, when the suction cup surface of the suction cup stage is cleaned, the uneven wear of the suction cup surface can be suppressed. Therefore, the workpiece grinding device of the present invention can suppress the shape of the wafer after the grinding process. deterioration. [Examples]

The embodiments of the present invention are described below, but the present invention is not limited to the embodiments.

(Comparative Example) A polishing apparatus for applying the cleaning unit 51 of the cleaning apparatus described in Patent Document 2 shown in Fig. 5 to the cleaning unit of the cleaning apparatus 3 of the apparatus shown in Fig. 1 is used. The surface is subjected to grinding treatment. Specifically, first, a single crystal enamel ingot having a diameter of 300 mm which was bred according to the CZ method was sliced. Next, the obtained germanium wafer is placed and adsorbed on the chuck surface 12 which has been flattened and cleaned before, and the surface of the germanium wafer is subjected to a grinding process. Thereafter, the suction cup surface 12 of the suction cup stage 11 is washed by the washing device. The grinding process on the surface of the tantalum wafer and the washing process of the chuck stage 12 were continuously performed 100 times.

(Invention Example) As in the comparative example, the ruthenium wafer was subjected to a grinding process. However, it is carried out by applying the cleaning unit 61 of the cleaning device of the present invention shown in FIGS. 6 to 9 to the grinding device of the cleaning unit of the cleaning device 3 of the device shown in FIG. 1 . Other conditions are exactly the same as the comparative example.

<Evaluation of Flatness of Wafer Wafer> An overview and a mirror image of the flatness measurement results of the tantalum wafer after the 100th grinding in the comparative example and the invention example are shown in FIGS. 11 and 12 . Here, FIG. 11 is a comparative example, and FIG. 12 is an invention example. In addition, in FIGS. 11 and 12, (a) is an overview of the flatness measurement result, and (b) is a magic mirror image. The flatness measurement results shown in FIGS. 11(a) and 12(a) are such that the light emitted from the semiconductor laser to the surface of the germanium wafer is concentrated by the light projection mirror, and is irradiated to the measurement target and reflected or scattered. The light is collected by the light receiving mirror and then analyzed by the amount of displacement. On the other hand, the mirror image shown in FIG. 11(b) and FIG. 12(b) is such that the parallel light is irradiated onto the wafer, and the image of the surface is captured by the CCD camera, and the light is converged by the unevenness of the surface and Diffusion, and the one obtained by the measuring device which can emphasize the fine unevenness.

11(a) and (b), it is understood that an annular convex portion is formed on the surface of the tantalum wafer after the 100th grinding. This is because when the suction cup surface 12 is cleaned by the cleaning device, the cleaning member 43 cannot be uniformly contacted with the surface of the suction cup surface 12, and the contact pressure fluctuates to cause partial wear on the suction cup surface 12, and the washed suction surface 12 is The surface shape was transferred to the surface of the tantalum wafer after the 100th grinding.

On the other hand, as shown in FIGS. 12( a ) and ( b ), the annular convex portion as in the comparative example was not formed on the surface of the tantalum wafer after the 100th grinding. From this, it can be inferred that when the suction cup surface 12 is cleaned by the cleaning device, the cleaning member 43 can be uniformly contacted with the surface of the suction cup surface 12, and the surface of the suction cup surface 12 is not unevenly worn. As can be seen, the cleaning apparatus of the present invention can or can have a high-density tantalum wafer.

[Industrial Applicability] According to the present invention, when the suction cup surface of the suction cup stage is washed, the partial wear of the suction cup surface can be suppressed, and the deterioration of the shape of the wafer after the grinding process can be suppressed, so that it is suitable for the semiconductor crystal. Round manufacturing.

1‧‧‧ grinding device

2‧‧‧矽 wafer

3‧‧‧cleaning device

5‧‧‧Base

10‧‧‧Sucker Department

11‧‧‧Sucker stage

12‧‧‧Sucker face

12A‧‧‧The outer part

12B‧‧‧ inside

12C‧‧‧ Central Department

12c‧‧‧ suction cup center axis

13‧‧‧Drive motor for suction cup carrier

14‧‧‧Digital Department

14a‧‧‧Installation surface

14b‧‧‧ditch

14c‧‧‧ hole

15‧‧‧Porous Department

20‧‧‧Fishing Department

21‧‧‧Surface for grinding

21a‧‧‧ grinding face

21c‧‧‧Metal Center Shaft

22‧‧‧ grinding drive motor for vermiculite

23‧‧‧ Pushing agency

31, 41, 51, 61‧‧‧ Cleaning Department

32‧‧‧ Spring

42‧‧‧Retaining components

42a‧‧‧ recess

43‧‧‧Washing components

44‧‧‧ coil spring

44a‧‧·Spring fixing pillar

44b‧‧•Spring fixing bolts

45‧‧‧Pushing Department

46‧‧‧ Fixed Department

46a‧‧‧ concave spherical surface

47‧‧‧ plate spring

48‧‧‧Spherical bearings

49‧‧ ‧ sales

49a‧‧‧ convex spherical surface

49b‧‧‧Axis

50‧‧‧Restrictions

61‧‧‧Clean Department

H‧‧‧Weighing direction of the suction cup

Fig. 1 is a view showing an example of a configuration of a grinding device. Fig. 2 is a view for explaining the configuration of a suction cup carrier, wherein (a) is a side view and (b) is a top view. 3 is a view showing a cleaning device described in Patent Document 1, wherein (a) and (b) are a plan view of the cleaning device and a cross-sectional view taken along the line A of (a). 4 is a side view of the cleaning member shown in Patent Document 2. Fig. 5 is a side view of the cleaning member shown in Patent Document 3. Figure 6 is a plan view showing a cleaning portion in the cleaning device according to the present invention. Figure 7 is a view B of Figure 6. Figure 8 is a plan view C of Figure 6. Figure 9 is a plan view D of Figure 6. Fig. 10 is a view for explaining a spherical bearing, wherein (a) is a pin, (b) is a fixed portion, and (c) is a spherical bearing. 11 is a view showing an overview of (a) flatness measurement results of the tantalum wafer after the 100th grinding in the comparative example, and (b) a mirror diagram. FIG. 12 is a view showing an overview of (a) flatness measurement results of the tantalum wafer after the 100th grinding in the invention example, and (b) a mirror diagram.

Claims (8)

A cleaning device for a suction cup carrier, which is a device for cleaning a suction cup surface of a suction cup carrier configured to be capable of adsorbing a workpiece and rotating, the cleaning device of the suction tray carrier comprising: a cleaning portion having a plurality of cleaning members And a pressing portion for pressing the cleaning portion to the suction cup surface; each of the plurality of cleaning members is fixed to the pressing portion by a spherical bearing via a spherical bearing, and the cleaning member and the pressing portion are A spring that biases the cleaning member toward the side opposite to the pressing portion is disposed. In the cleaning device of the suction cup carrier according to the first aspect of the invention, the end portion of the adjacent cleaning member is repeated in the width direction of the cleaning portion. The cleaning device of the suction cup stage according to the first aspect of the invention of the first aspect of the invention further includes a restriction portion for restricting a movable range of the cleaning member. The cleaning device of the suction cup carrier according to the second aspect of the invention is further characterized in that the restriction device for restricting the movable range of the cleaning member is further included. The cleaning device of the suction cup carrier according to any one of the first to fourth aspects of the invention, wherein the adjacent cleaning members are disposed opposite to each other in the width direction of the cleaning portion. The cleaning device of the suction cup carrier according to any one of the first to fourth aspects of the present invention, further comprising a rocking portion that swings the cleaning portion in a longitudinal direction of the cleaning portion. The cleaning device of the suction cup carrier according to the fifth aspect of the invention, further comprising a rocking portion that swings the cleaning portion in a longitudinal direction of the cleaning portion. A grinding device for a workpiece, comprising the cleaning device of the suction cup carrier according to the first to fifth aspects of the patent application.