TW201906043A - Image assist method for placing chip and chip apparatus using the method - Google Patents

Abstract

An image assist method for placing chip is provided in the present invention. The method comprises a fetching step, a reference image capturing step, an alignment-image capture step, a calculating processing step, a calibration adjusting step and a placing step. In the reference image capturing step, a reference image which covers an image reference member and a chip sucked by a chip placement member is captured from the direction to the image reference member, and the image reference member to the chip relative position relation information is obtained. In the alignment-image capture step, an image reference member to substrate position relation image which covers the image reference member and the substrate is captured from the back direction of the image reference member. In the calculating processing step, a location calibration relationship information between the chip position and the position-to-be-placed is calculated. In the calibration adjusting step, correcting the relative position between the chip placement member and the position-to-be-placed so that the position of the chip sucked by the chip placement member is aligned with the position-to-be-placed.

Description

Image-assisted crystallizing method and crystal setting device

The invention relates to a crystal crystallization method and a crystal arranging device, in particular to an image-assisted crystallization method and a crystal arranging device.

In the process of semiconductor wafer level packaging, the wafer must be cut into a plurality of crystal grains, and then the good products are picked out and reconfigured onto the substrate for subsequent processing. In the process of reconfiguration, due to the precision process, the accuracy of the placement and arrangement of the crystal grains is extremely strict, and the accuracy below micron or less is usually required. In order to ensure the high precision of the crystal, the conventional crystallizing device usually records the condition of the robot after placing the calibration wafer through an image capturing mechanism before the crystal is set, to record the position error of the wafer in each substrate to be crystallized. After repeating several times, the error average value is obtained, and the relative position of the wafer and the substrate at the time of actual crystallizing is compensated by the average error of each position.

However, the above method must be repeated over time to establish an average error of its respective positions for compensation in actual crystallizing, and cannot be corrected in time when new error causes (such as structural changes in temperature due to temperature changes) occur. Errors, but each position error table must be re-established, so if you use this method to crystallize, you can't achieve more stringent accuracy and accuracy more efficiently and instantly.

Therefore, in order to solve the above problems, an object of the present invention is to provide an image-assisted crystallizing method and a crystallizing apparatus.

The technical means for solving the problems of the prior art provides an image-assisted crystallizing method for moving a crystallizing member of a crystallizing device to a to-be-crystallized portion of a substrate to be crystallized, The crystal morphing device comprises a crystal morphing mechanism, a reference image capturing mechanism and a pair of image capturing mechanisms, the crystallization mechanism comprising the morphing member and an image reference member disposed on the periphery of the morphing member, the crystallization The method includes: a crystal removing step of drawing a wafer by using the crystallizing member; and a reference image capturing step, wherein the reference image capturing mechanism captures the image reference member from the opposite direction of the image reference member and a reference image of the wafer taken by the crystallizing member to obtain a relative positional relationship between the image reference member and the wafer at a relative position between the wafer and the image reference member; a pair of bit image capturing steps, using the alignment The image capturing mechanism captures a positional relationship between the image reference member and the substrate including the image reference member and a substrate to be crystallized from a back direction of the image reference member a calculation processing step, based on the image reference member-to-substrate positional relationship image and the image reference member-to-wafer relative position relationship information, and estimating the position of the wafer sucked by the crystallizing member and the substrate on the substrate to be crystallized a position correction relationship information between the portions to be crystallized; a correction adjustment step of correcting and adjusting the relative position between the crystallizing member and the portion to be crystallized according to the position correction relationship information, so that the crystallizing member absorbs The position of the wafer is aligned with the portion to be crystallized; and a seeding step is performed to cause the crystallizing member to perform crystallization.

In an embodiment of the present invention, an image-assisted crystallizing method is provided, wherein the calculating processing step is based on a visual feature of the image-receiving substrate in the substrate position-relationship image and the image reference member pair. The position correction relationship information is derived from the relative positional relationship information of the wafer.

Another technical means for solving the problems of the prior art is to provide a crystallizing apparatus, comprising: a crystal seeding mechanism comprising a crystallizing member and an image reference member disposed on a periphery of the crystallizing member, The crystallizing member is configured to pick up a wafer and perform crystallizing; and a reference image capturing mechanism configured to capture the image reference member and the crystallizing member from the opposite direction of the image reference member and the crystallizing member Extracting a reference image of the wafer to obtain a relative positional relationship between the image reference member and the wafer at a relative position between the wafer and the image reference member; a pair of bit image capturing mechanisms configured to be from the image reference The back direction of the component captures an image reference member-to-substrate positional relationship image of the image reference member and a substrate to be crystallized; a control system comprising: a mobile unit, the power connection mechanism; and a calculation process a unit, the signal is connected to the reference image capturing mechanism and the alignment image capturing mechanism, and the computing processing unit is configured to be based on the image reference A position-correcting relationship between the position information of the substrate and the positional relationship of the image reference member to the wafer, and calculating a positional correction relationship between the position of the wafer sucked by the crystallizing member and a portion to be crystallized on the substrate to be crystallized And a correction adjustment unit, the signal is connected to the calculation processing unit and the mobile unit, and the correction adjustment unit is configured to correct and adjust the relative position between the crystallized member and the to-be-crystallized portion according to the position correction relationship information. The position of the wafer sucked by the crystallizing member is aligned with the portion to be crystallized.

In an embodiment of the invention, a crystal setting device is provided, the image reference member being a photomask or a light transmissive member having an image signature.

In an embodiment of the present invention, a crystal setting device is provided, and the correction adjustment unit controls the mobile unit to finely adjust the crystallizing member according to the position correction relationship information, so that the position of the wafer sucked by the crystallizing member is The site to be crystallized.

In an embodiment of the invention, a crystallizing apparatus is further provided, further comprising a moving stage carrying the substrate to be crystallized, the moving stage signal is connected to the correction adjusting unit, and the correction adjusting unit corrects the relationship information according to the position The moving stage is finely adjusted so that the position of the wafer sucked by the crystallizing member is aligned with the portion to be crystallized.

In an embodiment of the present invention, a crystallizing apparatus is further provided, further comprising: a mark imprinted on the substrate to be crystallized, wherein the computing processing unit is based on the substrate to be crystallized in the image positional relationship image of the image reference member The image of the mark and the relative positional relationship information of the image reference member to the wafer are used to derive the position correction relationship information.

Through the technical means adopted by the present invention, the crystallizing member can be accurately moved to each of the to-be-crystallized portions of the substrate to be crystallized, thereby greatly increasing the crystallization (the substrate B to be marked) or the alignment (the substrate to be crystallized) B is unmarked) accuracy and accuracy.

The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 4 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.

Referring to Fig. 1, and referring to Figs. 2 to 4, the description of this embodiment is as follows. The image-assisted crystallizing method of one embodiment of the present invention is used to move a crystallizing member 11 of a crystallizing device 100 to a to-be-crystallized portion of a substrate B to be crystallized. The crystal device 100 includes a crystallizing mechanism 1, a reference image capturing mechanism 2, a pair of image capturing mechanisms 3, and a control system 4. The image-assisted crystallizing method of the embodiment includes a crystal removing step S101, a reference image capturing step S102, a pair of bit image capturing step S103, a calculating processing step S104, a correction adjusting step S105, and a crystal setting step. S106.

The crystal platen mechanism 1 includes a crystal plate member 11 and an image reference member 12 disposed on the periphery of the crystal plate member 11. The crystal plate member 11 is configured to suck a wafer D and perform crystallizing. In the present embodiment, the crystallizing member 11 is a suction type robot arm, but the invention is not limited thereto. The image reference member 12 is an object of a light transmissive material having an image feature symbol, such as a photomask.

The control system 4 includes a mobile unit 41, a calculation processing unit 42, and a correction adjustment unit 43. The moving unit 41 is operatively coupled to the seeding mechanism 1. The calculation processing unit 42 is connected to the reference image capturing mechanism 2 and the registration image capturing mechanism 3. The correction adjustment unit 43 signals the connection calculation processing unit 42 and the movement unit 41.

Next, how the crystallizing apparatus 100 of the embodiment of the present invention performs the crystallizing method will be described.

In the crystallization step S101, a wafer D is taken up by the crystallizing member 11.

Next, in the reference image capturing step S102, as shown in FIG. 2, the reference image capturing means 2 captures the image reference member 12 and the crystallizing member 11 from the opposite direction of the image reference member 12 and the crystallizing member 11. A reference image M1 of the wafer D is taken up, and an image reference member-to-wafer relative position relationship information of the relative position between the wafer D and the image reference member 12 is obtained. Here, the opposing direction refers to a direction facing the image reference member 12 and the crystallizing member 11 . In the present embodiment, the surface of the image reference member 12 has a cross-shaped mark pattern; the surface of the wafer D has a specific visual appearance (indicated by a circle in the present embodiment), but the present invention is not limited thereto, and the image reference member The pattern and arrangement of the surface of 12 may also be in other marking forms, and the surface of wafer D may be other types of visual appearance.

As shown in FIG. 3, the seeding mechanism 1 is then moved by the moving unit 41 to the area corresponding to the substrate B to be crystallized. In the aligning image capturing step S103, the aligning image capturing mechanism 3 is configured to capture an image reference member-to-substrate position covering the image reference member 12 and the substrate to be crystal B from the back direction of the image reference member 12 Relational image M2 (Fig. 4). The aligning image capturing mechanism 3 may further include at least one mirror and an image capturing member, and the image capturing member disposed at the other position is captured from the back direction of the image reference member 12 by using the mirror to change the optical path. The image reference member and the substrate to be crystal substrate B are covered by the image reference member and the substrate positional relationship image.

Next, in the calculation processing step S104, the calculation processing unit 42 estimates the position of the wafer D sucked by the crystal platen member 11 based on the image reference member-to-substrate position relation image M2 and the image reference member-to-wafer relative position relationship information (in FIG. 4). A position correction relationship information between a portion to be crystallized on the substrate B to be crystallized is indicated by a broken line. In the present embodiment, in the calculation processing step S104, the crystallizing apparatus 100 further includes a mark (indicated by a thick cross in FIG. 4), which is imprinted on the surface of the substrate B to be crystallized, and the calculation processing unit 42 is based on the image reference. The position-correction relationship information is derived from the image of the mark on the surface of the substrate to be crystal substrate B in the substrate positional relationship image M2 and the relative positional relationship information of the image reference member to the wafer. For example, the marks of these thick crosses are pre-arranged around each of the portions to be crystallized to indicate the respective portions to be crystallized. However, the present invention is not limited thereto, and the mark may represent the portion to be crystallized in various manners, and the aforementioned portion to be crystallized is not limited to the reference member to substrate positional relationship image M2. In another example, the surface of the substrate B to be crystallized is not marked, so that a visual feature of the substrate substrate B in the substrate positional relationship image M2 and a relative positional relationship between the image reference member and the wafer are calculated according to the image reference member. The position correction relationship information is output.

In the correction adjustment step S105, the correction adjustment unit 43 corrects the relative position between the crystallizing member 11 and the portion to be crystallized according to the position correction relationship information, so that the position of the wafer D sucked by the crystal member 11 is aligned. Crystallization site. For example, by correcting the relative position between the crystallizing member 11 and the portion to be crystallized, the outer edge of the sucked wafer D can be aligned with the outer edge of the thick cross (the portion to be crystallized). In the present embodiment, the correction adjustment unit 43 controls the movement unit 41 to finely adjust the position of the crystallizing member 11 according to the position correction relationship information, so that the position of the wafer D sucked by the crystallizing member 11 is aligned with the portion to be crystallized. As shown in FIG. 3, the crystal device 100 may further include a moving stage 5 carrying the substrate B to be crystallized, and a signal connection correction adjusting unit 43. The correction adjusting unit 43 finely adjusts the moving stage 5 according to the position correction relationship information so that the position of the wafer D sucked by the crystal pulling member 11 is aligned with the portion to be crystallized of the substrate B to be crystallized.

Finally, in the seeding step S106, the crystallizing member 11 is subjected to seeding.

In summary, the crystallizing method and the crystal arranging device of the present invention can greatly improve the precision and accuracy of the crystallization (the substrate B to be marked) or the alignment (the substrate B to be unmarked) without the marking of the prior art. .

The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications should still be It is within the scope of the invention to the invention of the invention.

100‧‧ ‧ crystallizing equipment

1‧‧ ‧ crystallizing mechanism

11‧‧‧ Crystallized components

12‧‧‧Image reference components

2‧‧‧ benchmark image capture mechanism

3‧‧‧ Alignment image capture mechanism

4‧‧‧Control system

41‧‧‧Mobile unit

42‧‧‧Calculation Processing Unit

43‧‧‧Correction adjustment unit

5‧‧‧Mobile stage

B‧‧‧The substrate to be crystallized

D‧‧‧ wafer

M1‧‧‧ benchmark image

M2‧‧‧ image reference member to substrate positional relationship image

S101‧‧‧ Crystallization step

S102‧‧‧ benchmark image capture step

S103‧‧‧ alignment image capture step

S104‧‧‧ Calculation processing steps

S105‧‧‧correction adjustment steps

S106‧‧‧ Crystallization step

1 is a flow chart showing an image assisted crystallizing method in accordance with an embodiment of the present invention. Figure 2 is a schematic diagram showing a reference image in accordance with an embodiment of the present invention. Figure 3 is a schematic diagram showing a crystallizing apparatus in accordance with an embodiment of the present invention. Fig. 4 is a view showing an image reference member versus substrate positional relationship image according to an embodiment of the present invention.

Claims (7)

An image-assisted crystallizing method for moving a crystallizing member of a crystallizing device to a to-be-crystallized portion of a substrate to be crystallized, the seeding device comprising a crystallizing mechanism, a reference image capturing mechanism, and a pair of image capturing mechanism, the crystallizing mechanism comprising the crystallizing member and an image reference member disposed on a periphery of the crystallizing member, the crystallizing method comprising: a crystal pulling step of drawing a wafer by using the crystal pulling member And a reference image capturing step, wherein the reference image capturing mechanism captures a reference image of the wafer that is captured by the image reference member and the crystallizing member from a direction opposite to the image reference member to obtain the wafer a relative positional relationship between the image reference member and the wafer relative to the image reference member; a pair of bit image capturing steps, using the alignment image capturing mechanism to capture from the back direction of the image reference member Having the image reference member and an image reference member of the substrate to be crystallized to the substrate positional relationship image; a calculation processing step, the substrate is based on the image reference member Position-relationship image and information about relative positional relationship of the image reference member to the wafer, and calculating a position correction relationship between the position of the wafer sucked by the crystallizing member and a portion to be crystallized on the substrate to be crystallized; Correcting the adjustment step, correcting and adjusting the relative position between the crystallizing member and the portion to be crystallized according to the position correction relationship information, so that the position of the wafer sucked by the crystallizing member is aligned with the portion to be crystallized; A seeding step causes the crystallizing member to perform crystallization. The image-assisted crystallizing method of claim 1, wherein the calculating processing step is based on a visual feature of the image-receiving substrate in the substrate position-dependent image and the relative position of the image reference member to the wafer. The relationship information is used to derive the position correction relationship information. A crystal morphing apparatus comprising: a crystal morphing mechanism comprising a crystallizing member and an image reference member disposed on a periphery of the morphing member, the crystal structuring member for sucking a wafer and performing crystallization; and a reference image capture The mechanism is configured to extract a reference image of the wafer from the image reference member and the crystallizing member from the opposite direction of the image reference member and the crystal member to obtain the wafer and the image reference member Information relating to relative position of the image reference member relative to the wafer; a pair of image capturing means configured to capture the image reference member and a crystal to be crystallized from the back direction of the image reference member An image reference member-to-substrate positional relationship image of the substrate; a control system comprising: a mobile unit electrically connected to the crystallizing mechanism; a computing processing unit, the signal connecting the reference image capturing mechanism and the alignment image capturing mechanism The calculation processing unit is configured to be based on the image reference member to the substrate positional relationship image and the image reference member to the wafer phase Positional relationship information, and calculating a position correction relationship information between the position of the wafer sucked by the crystallizing member and a portion to be crystallized on the substrate to be crystallized; and a correction adjusting unit, the signal is connected to the calculation processing unit And the moving unit, the correction adjusting unit is configured to correct and adjust the relative position between the crystallizing member and the to-be-crystallized portion according to the position correction relationship information, so that the position of the wafer sucked by the crystallizing member is The site to be crystallized. The crystallizing device of claim 3, wherein the image reference member is a reticle or a light transmissive member having an image feature symbol. The crystallizing device of claim 3, wherein the correction adjusting unit controls the moving unit to finely adjust the crystallizing member according to the position correction relationship information, so that the position of the wafer sucked by the crystallizing member is aligned with the Crystallization site. The crystallizing device of claim 3, further comprising a moving stage carrying the substrate to be crystallized, wherein the moving stage signal is connected to the correction adjusting unit, and the correction adjusting unit finely adjusts the relationship according to the position correction relationship information The stage is moved such that the position of the wafer sucked by the crystallizing member is aligned with the portion to be crystallized. The crystallizing device of claim 3, further comprising a mark imprinted on the substrate to be crystallized, wherein the calculation processing unit is based on the mark of the substrate to be crystallized in the substrate positional relationship image according to the image reference member The position correction relationship information is derived from the image and the relative positional relationship information of the image reference member to the wafer.