TW201903099A - Sheet adhesive, gas barrier laminate, and sealing body - Google Patents

Sheet adhesive, gas barrier laminate, and sealing body Download PDF

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Publication number
TW201903099A
TW201903099A TW107118445A TW107118445A TW201903099A TW 201903099 A TW201903099 A TW 201903099A TW 107118445 A TW107118445 A TW 107118445A TW 107118445 A TW107118445 A TW 107118445A TW 201903099 A TW201903099 A TW 201903099A
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sheet
adhesive
gas barrier
modified polyolefin
layer
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TW107118445A
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Chinese (zh)
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TWI776903B (en
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長谷川樹
西嶋健太
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日商琳得科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

The sheet-shaped adhesive according to the present invention is formed from an adhesive composition containing (A) a modified polyolefin resin and (B) a thermosetting component, and satisfies the following conditions (I) and (II). Condition (I): when the sheet-shaped adhesive is allowed to stand for 20 minutes in a 120 DEG C environment, the amount of outgas generation per 1 cm3 is not more than 20 mg/cm3. Condition (II): when a laminate of the sheet-shaped adhesive applied on a 50 [mu]m-thick polyethylene terephthalate film is pressed onto a glass plate using a roller and conditions of a temperature of 60 DEG C, a pressure of 0.2 MPa, and a speed of 0.2 m/min, in order to bond the sheet-shaped adhesive side face of the laminate to the glass plate, and the sheet-shaped adhesive is then cured for 2 hours at 100 DEG C followed by holding for 24 hours in a 23 DEG C/50% relative humidity environment, the adhesive strength of the laminate for the glass plate, as measured in accordance with JIS Z 0237 : 2000 using conditions of a peel rate of 300 mm/min and a peel angle of 180 DEG, is at least 10 N/25 mm.

Description

片狀接著劑、氣體阻障性層合體,及密封體Sheet adhesive, gas barrier laminated body, and sealing body

本發明為有關片狀接著劑、具有作為接著劑層的該片狀接著劑之氣體阻障性層合體,及電子裝置等的被密封物被前述氣體阻障性層合體密封而成的密封體。The present invention relates to a sheet-shaped adhesive, a gas-barrier laminate having the sheet-shaped adhesive as an adhesive layer, and a sealed body in which a sealed object such as an electronic device is sealed with the gas-barrier laminate. .

近年來,有機EL元件以可經低電壓直流驅動而產生高亮度的發光之發光元件而受到極大注目。   但是,有機EL元件,於經過一段時間後,多會容易發生發光亮度、發光效率,及發光均勻性等發光特性降低之問題。   造成該發光特性降低問題之原因,推測應為氧或水份等滲入有機EL元件之內部,而使電極或有機層劣化之原因,因此,多使用密封材料將有機EL元件密封,以防止氧或水份之滲入等。   具體而言,為於基板上所形成的有機EL元件,使用密封材料被覆於該有機EL元件及該有機EL元件之周邊部的基板表面,再將該密封材料硬化,將有機EL元件密封。   又,使用密封材料密封有機EL元件時,密封材料發生釋氣(Out Gas)時將會造成有機EL元件劣化,因而又再度進行開發低釋氣性的密封材料。In recent years, organic EL elements have attracted much attention as light-emitting elements that can generate high-brightness light emission by low-voltage DC driving. However, after a certain period of time, the organic EL element is prone to problems such as reduction in light emission brightness, light emission efficiency, and light emission uniformity. The cause of the problem of lowering the light-emitting characteristics is presumably due to the penetration of oxygen or moisture into the organic EL element, which deteriorates the electrode or the organic layer. Therefore, a sealing material is often used to seal the organic EL element to prevent oxygen or Infiltration of water, etc. Specifically, in order to form an organic EL element on a substrate, a sealing material is used to cover the surface of the organic EL element and the substrate on the periphery of the organic EL element, and the sealing material is hardened to seal the organic EL element. In addition, when an organic EL element is sealed with a sealing material, the organic EL element will be deteriorated when out gas is generated in the sealing material, so development of a sealing material with low outgassing properties is being carried out again.

例如,專利文獻1中,則有記載有使用含有特定的陽離子硬化性化合物、光陽離子聚合起始劑,及唑系化合物的有機EL元件密封用組成物。   專利文獻1中,記載者使用以唑系化合物作為硬化遅延劑的密封用組成物,而可形成具有低釋氣性及防濕性的硬化物等內容。 [先前技術文獻] [專利文獻]For example, Patent Document 1 describes a composition for sealing an organic EL device using a specific cation-curable compound, a photocationic polymerization initiator, and an azole-based compound. Patent Document 1 describes that the use of an azole-based compound as a hardening and rolling agent for a sealing composition can form a hardened material having low outgassing property and moisture resistance. [Prior Art Literature] [Patent Literature]

[專利文獻1]WO2015/111525號[Patent Document 1] WO2015 / 111525

[發明所欲解決之問題][Problems to be solved by the invention]

但,依本發明者們的研究得知,密封材料中的釋氣量,不僅受到硬化遅延劑,也會受到組成物中所含有的各成分之種類或含量等而變化。   因此,更尋求一種具有低釋氣性,且對被密封物之劣化具有高度抑制效果的密封材料。又,例如即使達成密封材料的低釋氣性時,仍會有更能抑制造成有機EL元件的發光特性等的被密封物之電子裝置的特性降低的需求。However, according to the studies of the present inventors, it is known that the amount of outgassing in the sealing material is changed not only by the hardening and rolling agent, but also by the type or content of each component contained in the composition. Therefore, a sealing material having low outgassing property and highly inhibiting the deterioration of the sealed object is further sought. Further, for example, even when a low outgassing property of the sealing material is achieved, there is still a need to further suppress the degradation of the characteristics of the electronic device of the sealed object, such as the light-emitting characteristics of the organic EL element.

又,一般而言,於氣體阻障性膜所具有的氣體阻障層上,直接層合含有樹脂的樹脂層之構成時,因氣體阻障層與樹脂的親和性較低,故於氣體阻障層與樹脂層的層間密著性會有發生問題之情形。特別是使用含有高分子化合物的已施加改質處理的氣體阻障層時,於該氣體阻障層與樹脂層的層間密著性多有發生劣化的情形。   因此,密封材料也需要與氣體阻障層具有優良的層間密著性。In addition, in general, when a resin-containing resin layer is directly laminated on a gas-barrier layer of a gas-barrier film, the affinity of the gas-barrier layer and the resin is low, so the gas-barrier layer has low affinity. There may be a problem in the adhesion between the barrier layer and the resin layer. In particular, when a modified gas barrier layer containing a polymer compound is used, the interlayer adhesion between the gas barrier layer and the resin layer may be deteriorated. Therefore, the sealing material also needs to have excellent interlayer adhesion with the gas barrier layer.

本發明為鑑於上述情事所提出者,而以提出一種對於被密封物有高度抑制劣化之效果的密封材料、與氣體阻障層具有優良層間密著性的片狀接著劑、具有作為接著劑層的該片狀接著劑之氣體阻障性層合體,及電子裝置等的被密封物受該氣體阻障性層合體密封而形成的密封體為目的。 [解決問題之方法]The present invention has been made in view of the above circumstances, and proposes a sealing material having a high effect of suppressing deterioration of a sealed object, a sheet-shaped adhesive having excellent interlayer adhesion with a gas barrier layer, and a layer as an adhesive. The gas-barrier laminated body of the sheet-shaped adhesive, and a sealed body formed by sealing the to-be-sealed object such as an electronic device with the gas-barrier laminated body. [Solution to the problem]

本發明者們,發現含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)的接著劑組成物所形成的片狀接著劑,即可解決上述之問題,因而完成本發明。The present inventors have found that a sheet-shaped adhesive formed from an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B) can solve the above-mentioned problems, and thus completed the present invention.

即,本發明為有關下述[1]~[18]之發明。   [1]一種片狀接著劑,其係由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成的片狀接著劑,且滿足下述要件(I)及(II);   ・要件(I):將前述片狀接著劑在120℃環境下靜置20分鐘後之每1cm3 之釋氣產生量為20mg/cm3 以下;   ・要件(II):在溫度60℃、壓力0.2MPa,及速度0.2m/min之條件下,以軋輥,將在厚度50μm之聚對酞酸乙二酯膜上已貼附前述片狀黏著劑之層合體押向玻璃板而貼合前述層合體之前述片狀黏著劑側之面與前述玻璃板,並在100℃、2小時之條件下使前述片狀接著劑硬化後,在23℃相對濕度50%之環境下保管24小時後,在剝離速度300mm/min及剝離角度180°之條件下根據JIS Z0237:2000所測量之來自前述玻璃板之前述層合體的黏著力為10N/25mm以上。   [2]如[1]記載之片狀接著劑,其中熱硬化性成分(B)包含多官能環氧化合物。   [3]如[2]記載之片狀接著劑,其中前述多官能環氧化合物之環氧當量為100~300g/eq。   [4]如[1]~[3]中任一項記載之片狀接著劑,其中改質聚烯烴系樹脂(A)為酸改質聚烯烴系樹脂。   [5]如[1]~[4]中任一項記載之片狀接著劑,其中相對於前述接著劑組成物之有效成分之總量,改質聚烯烴系樹脂(A)之含量為15~95質量%。   [6]如[1]~[5]中任一項記載之片狀接著劑,其中相對於前述改質聚烯烴系樹脂(A)100質量份,前述熱硬化性成分(B)之含量為5~150質量份。   [7]如[1]~[6]中任一項記載之片狀接著劑,其中更含有矽烷耦合劑(C)。   [8]如[7]記載之片狀接著劑,其中相對於改質聚烯烴系樹脂(A)100質量份,矽烷耦合劑(C)之含量為0.01~10質量份。   [9]一種氣體阻障性層合體,其係包含:具有基材層之氣體阻障性膜與接著劑層,該接著劑層係由片狀接著劑所構成,該片狀接著劑係由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成者,   並且滿足下述要件(I)及(IIa);   ・要件(I):將前述片狀接著劑在120℃環境下靜置20分鐘後之每1cm3 之釋氣產生量為20mg/cm3 以下   ・要件(IIa):在溫度60℃、壓力0.2MPa,及速度0.2m/min之條件下,以軋輥,將前述氣體阻障性層合體押向玻璃板而貼合前述氣體阻障性層合體之前述片狀接著劑與前述玻璃板,並在100℃、2小時之條件下使前述片狀接著劑硬化後,在23℃相對濕度50%之環境下保管24小時後,在剝離速度300mm/min及剝離角度180°之條件下根據JIS Z0237:2000所測量之來自前述玻璃板之前述層合體的黏著力為10N/25mm以上。   [10]如[9]記載之氣體阻障性層合體,其中熱硬化性成分(B)包含多官能環氧化合物。   [11]如[10]記載之氣體阻障性層合體,其中前述多官能環氧化合物之環氧當量為100~300g/eq。   [12]如[9]~[11]中任一項記載之氣體阻障性層合體,其中改質聚烯烴系樹脂(A)為酸改質聚烯烴系樹脂。   [13]如[9]~[12]中任一項記載之氣體阻障性層合體,其中相對於前述接著劑組成物之有效成分之總量,改質聚烯烴系樹脂(A)之含量為15~95質量%。   [14]如[9]~[13]中任一項記載之氣體阻障性層合體,其中相對於前述改質聚烯烴系樹脂(A)100質量份,前述熱硬化性成分(B)之含量為5~150質量份。   [15]如[9]~[14]中任一項記載之氣體阻障性層合體,其中更含有矽烷耦合劑(C)。   [16]如[15]記載之氣體阻障性層合體,其中相對於改質聚烯烴系樹脂(A)100質量份,矽烷耦合劑(C)之含量為0.01~10質量份。   [17]如[9]~[16]中任一項記載之氣體阻障性層合體,其中前述氣體阻障性膜具有基材層及氣體阻障層,   前述氣體阻障層為含有高分子化合物的已施加改質處理之高分子層。   [18]如[17]記載之氣體阻障性層合體,其中前述氣體阻障層與前述接著劑層係經直接層合者。   [19]一種密封體,其特徵為被密封物係將如[1]~[8]中任一項記載之片狀接著劑,或,如[9]~[18]中任一項記載之氣體阻障性層合體所具有之接著劑層作為密封材料並受到密封而成。   [20]如[19]記載之密封體,其中前述被密封物為有機EL元件、有機EL顯示器元件、液晶顯示器元件,或太陽能電池元件。 [發明之效果]That is, the present invention relates to the following [1] to [18]. [1] A sheet-shaped adhesive, which is a sheet-shaped adhesive formed from an adhesive composition containing a modified polyolefin-based resin (A) and a thermosetting component (B), and satisfies the following requirements (I ) And (II); ・ Requirement (I): The outgassing amount per 1 cm 3 after the sheet adhesive is left to stand at 120 ° C for 20 minutes is 20 mg / cm 3 or less; ・ Requirement (II): At a temperature of 60 ° C, a pressure of 0.2 MPa, and a speed of 0.2 m / min, using a roll, the laminate having the aforementioned sheet-shaped adhesive on a polyethylene terephthalate film having a thickness of 50 μm was pressed against the glass. The sheet is bonded to the sheet-shaped adhesive side surface of the laminated body and the glass plate, and the sheet-shaped adhesive is hardened at 100 ° C for 2 hours, and then at 23 ° C and a relative humidity of 50%. After storage for 24 hours, the adhesive force of the laminate from the glass plate measured according to JIS Z0237: 2000 under conditions of a peeling speed of 300 mm / min and a peeling angle of 180 ° was 10 N / 25 mm or more. [2] The sheet-shaped adhesive according to [1], wherein the thermosetting component (B) contains a polyfunctional epoxy compound. [3] The sheet-shaped adhesive according to [2], wherein the epoxy equivalent of the polyfunctional epoxy compound is 100 to 300 g / eq. [4] The sheet-shaped adhesive according to any one of [1] to [3], wherein the modified polyolefin resin (A) is an acid-modified polyolefin resin. [5] The sheet-shaped adhesive according to any one of [1] to [4], wherein the content of the modified polyolefin-based resin (A) is 15 based on the total amount of the active ingredients of the adhesive composition. ~ 95 mass%. [6] The sheet-like adhesive according to any one of [1] to [5], wherein the content of the thermosetting component (B) is 100 parts by mass of the modified polyolefin-based resin (A). 5 to 150 parts by mass. [7] The sheet-shaped adhesive according to any one of [1] to [6], further comprising a silane coupling agent (C). [8] The sheet-shaped adhesive according to [7], wherein the content of the silane coupling agent (C) is 0.01 to 10 parts by mass based on 100 parts by mass of the modified polyolefin-based resin (A). [9] A gas barrier laminate, comprising: a gas barrier film having a substrate layer and an adhesive layer, the adhesive layer is composed of a sheet adhesive, and the sheet adhesive is composed of Formed by an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B), and satisfying the following requirements (I) and (IIa); After the adhesive is left at 120 ° C for 20 minutes, the outgassing amount per 1cm 3 is less than 20mg / cm 3 · Requirement (IIa): Conditions of temperature 60 ° C, pressure 0.2MPa, and speed 0.2m / min Next, a roll is used to press the gas-barrier laminate to a glass plate, and the sheet-shaped adhesive of the gas-barrier laminate and the glass plate are bonded, and the foregoing is made at 100 ° C for 2 hours. After the sheet-shaped adhesive is cured, it is stored in an environment with a relative humidity of 50% at 23 ° C. for 24 hours, and the peeling speed is 300 mm / min and the peeling angle is 180 ° according to JIS Z0237: 2000. The adhesive force of the laminate is 10N / 25mm or more. [10] The gas barrier laminate according to [9], wherein the thermosetting component (B) contains a polyfunctional epoxy compound. [11] The gas barrier laminate according to [10], wherein the epoxy equivalent of the multifunctional epoxy compound is 100 to 300 g / eq. [12] The gas barrier laminate according to any one of [9] to [11], wherein the modified polyolefin resin (A) is an acid modified polyolefin resin. [13] The gas-barrier laminate according to any one of [9] to [12], wherein the content of the modified polyolefin-based resin (A) is modified relative to the total amount of active ingredients of the adhesive composition It is 15 to 95% by mass. [14] The gas barrier laminate according to any one of [9] to [13], wherein the thermosetting component (B) is 100 parts by mass of the modified polyolefin resin (A). The content is 5 to 150 parts by mass. [15] The gas barrier laminate according to any one of [9] to [14], further comprising a silane coupling agent (C). [16] The gas barrier laminate according to [15], wherein the content of the silane coupling agent (C) is 0.01 to 10 parts by mass based on 100 parts by mass of the modified polyolefin resin (A). [17] The gas barrier laminate according to any one of [9] to [16], wherein the gas barrier film has a base material layer and a gas barrier layer, and the gas barrier layer contains a polymer A modified polymer layer of a compound. [18] The gas barrier laminate according to [17], wherein the gas barrier layer and the adhesive layer are directly laminated. [19] A sealed body characterized in that the material to be sealed is a sheet-shaped adhesive as described in any one of [1] to [8], or as described in any one of [9] to [18] The adhesive layer of the gas barrier laminate is sealed as a sealing material. [20] The sealed body according to [19], wherein the object to be sealed is an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element. [Effect of the invention]

本發明之片狀接著劑,可形成對於被密封物具有高度的抑制劣化效果的密封材料,且與氣體阻障層亦具有優良的層間密著性。 [實施發明之形態]The sheet-shaped adhesive of the present invention can form a sealing material having a high effect of suppressing deterioration of an object to be sealed, and also has excellent interlayer adhesion with a gas barrier layer. [Form of Implementing Invention]

本說明書中,較佳的數值範圍(例如,含量等之範圍),階段性記載的下限值及上限值,可各自獨立組合使用。例如,「較佳為10~90,更佳為30~60」之記載,亦可將「較佳下限值(10)」與「更佳上限值(60)」組合,而形成「10~60」之組合。In the present specification, a preferred numerical range (for example, a range of content, etc.), a lower limit value and an upper limit value described in stages may be used independently in combination. For example, the description of "preferably 10 to 90, more preferably 30 to 60" may also be combined with "better lower limit (10)" and "better upper limit (60)" to form "10 ~ 60 "combination.

[片狀接著劑]   本發明之第一實施形態的片狀接著劑,為由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成的片狀接著劑,且滿足下述要件(I)及(II);   ・要件(I):將前述片狀接著劑在120℃環境下靜置20分鐘後之每1cm3 之釋氣產生量為20mg/cm3 以下。   ・要件(II):在溫度60℃、壓力0.2MPa,及速度0.2m/min之條件下,以軋輥,將厚度50μm之聚對酞酸乙二酯膜上已貼附前述片狀接著劑之層合體押向玻璃板而貼合前述層合體之前述片狀接著劑側之面與前述玻璃板,於100℃、2小時之條件下,使前述片狀接著劑硬化後,於23℃相對濕度50%之環境下保管24小時後,在剝離速度300mm/min及剝離角度180°之條件下根據JIS Z0237:2000所測量之來自前述玻璃板之前述層合體的黏著力為10N/25mm以上。[Flake Adhesive] The sheet adhesive according to the first embodiment of the present invention is a sheet adhesive formed from an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B). Agent and satisfies the following requirements (I) and (II); ・ Requirement (I): The amount of outgassing per 1 cm 3 after the sheet adhesive is left to stand at 120 ° C for 20 minutes is 20 mg / cm 3 or less.・ Requirement (II): Under the conditions of a temperature of 60 ° C, a pressure of 0.2 MPa, and a speed of 0.2 m / min, a 50 μm-thick polyethylene terephthalate film is affixed with a roll by a roller. The laminated body was pressed against a glass plate to adhere the sheet-shaped adhesive side surface of the laminated body to the glass plate, and the sheet-shaped adhesive was cured at 100 ° C for 2 hours, and then the relative humidity was 23 ° C. After 24 hours of storage in a 50% environment, the adhesive force of the aforementioned laminated body from the aforementioned glass plate as measured in accordance with JIS Z0237: 2000 under conditions of a peeling speed of 300 mm / min and a peeling angle of 180 ° was 10 N / 25 mm or more.

因要件(I)所規定的釋氣產生量為20mg/cm3 以下,故本發明之片狀接著劑可稱為具有優良低釋氣性的密封材料。   又,因要件(II)所規定的黏著力為10N/25mm以上,故本發明之片狀接著劑可稱於硬化後不容易由被密封面剝離的密封材料。   即,本發明之片狀接著劑,可於滿足上述要件(I)及(II)之方式進行調整,故可製得具有優良的低釋氣性同時,硬化後也不容易由被密封面剝離的對被密封物具有高度的抑制劣化之效果的密封材料。Since the amount of outgassing required by the requirement (I) is 20 mg / cm 3 or less, the sheet-shaped adhesive of the present invention can be called a sealing material having excellent low outgassing properties. Moreover, since the adhesive force prescribed | regulated by the requirement (II) is 10 N / 25mm or more, the sheet-shaped adhesive agent of this invention can be said to be a sealing material which does not peel easily from a to-be-sealed surface after hardening. That is, the sheet-shaped adhesive of the present invention can be adjusted in a manner that satisfies the requirements (I) and (II) described above, so it can have excellent low outgassing properties, and it is not easy to peel off from the sealed surface after curing. A sealing material having a high effect of suppressing deterioration of a sealed object.

本發明之片狀接著劑中,要件(I)所規定的釋氣產生量,就形成具有更優良的低釋氣性,且對被密封物具有更高的抑制劣化之效果的觀點,較佳為18mg/cm3 以下,更佳為15mg/cm3 以下,特佳為10mg/cm3 以下,最佳為8mg/cm3 以下,更較佳為7mg/cm3 以下,特較佳為4mg/cm3 以下,最最佳為1mg/cm3 以下,又,通常為0.1mg/cm3 以上。   又,本說明書中,要件(I)所規定的前述片狀物之釋氣量,係指依實施例之記載方法所測定之值之意。In the sheet-shaped adhesive of the present invention, it is preferable that the outgassing amount prescribed by the requirement (I) has a better low outgassing property and has a higher effect of suppressing deterioration of the sealed object. of 18mg / cm 3 or less, more preferably 15mg / cm 3 or less, and particularly preferably 10mg / cm 3 or less, most preferably 8mg / cm 3 or less, more preferably 7mg / cm 3 or less, particularly preferably 4mg / cm 3 or less, most preferably 1 mg / cm 3 or less, and usually 0.1 mg / cm 3 or more. In addition, in this specification, the outgassing amount of the sheet-like article specified in the requirement (I) means the value measured by the method described in the examples.

又,本發明之片狀接著劑中,要件(II)所規定之黏著力,就可確實地抑制由硬化後的被密封面被剝離的觀點,較佳為12N/25mm以上,更佳為14N/25mm以上,特佳為16N/25mm以上,最佳為18N/25mm以上,更較佳為20N/25mm以上,特較佳為22N/25mm以上,又,通常30N/25mm以下。In the sheet-shaped adhesive of the present invention, from the viewpoint that the adhesive force specified by the requirement (II) can reliably suppress peeling from the sealed surface after curing, it is preferably 12N / 25mm or more, and more preferably 14N. Above / 25mm, particularly preferably above 16N / 25mm, most preferably above 18N / 25mm, more preferably above 20N / 25mm, particularly preferably above 22N / 25mm, and usually below 30N / 25mm.

又,本發明之片狀接著劑中,要件(II)所使用的聚對酞酸乙二酯膜為,實質上由聚對酞酸乙二酯所形成的薄膜,其為以聚對酞酸乙二酯為主成分。聚對酞酸乙二酯膜中,可添加常用的添加物。聚對酞酸乙二酯膜通常可被拉伸,拉伸方法一般為使用二軸拉伸法。In the sheet-shaped adhesive of the present invention, the polyethylene terephthalate film used in the requirement (II) is a film formed substantially of polyethylene terephthalate, which is made of polyterephthalic acid. Ethylene glycol is the main component. Polyethylene terephthalate film can be added with common additives. Polyethylene terephthalate film can usually be stretched, and the stretching method is generally a biaxial stretching method.

又,就提高聚對酞酸乙二酯膜上層合片狀接著劑時的密著性之觀點,可以對樹脂薄膜之表面,施予氧化法或凹凸化法等的易接著處理。   氧化法,例如,電暈放電處理、電漿放電處理、鉻酸處理(濕式)、熱風處理、臭氧,及紫外線照射處理等,凹凸化法,例如,噴沙法、溶劑處理法等。From the viewpoint of improving the adhesion when a sheet-shaped adhesive is laminated on a polyethylene terephthalate film, the surface of the resin film can be easily adhered by an oxidation method or an uneven method. The hafnium oxidation method includes, for example, a corona discharge treatment, a plasma discharge treatment, a chromic acid treatment (wet), a hot air treatment, ozone, and an ultraviolet irradiation treatment, and a bumping method such as a sandblasting method, a solvent treatment method, and the like.

又,本發明之片狀接著劑的厚度,可配合用途作適當之設定,較佳為2~50μm,更佳為5~25μm,特佳為10~20μm。   又,本發明之片狀接著劑之形狀,亦可配合用途作適當之設定,例如,可為正方形及長方形等四方形、多角形、圓形,及橢圓形等。The thickness of the sheet-shaped adhesive of the present invention can be appropriately set according to the application, and is preferably 2 to 50 μm, more preferably 5 to 25 μm, and particularly preferably 10 to 20 μm. In addition, the shape of the sheet-shaped adhesive of the present invention can also be appropriately set according to the application. For example, the shape can be a square, a rectangle, a polygon, a circle, and an ellipse.

本發明之片狀接著劑,為由含有改質聚烯烴系樹脂(A)與熱硬化性成分(B)的接著劑組成物所形成者。又,該接著劑組成物含有改質聚烯烴系樹脂(A)與熱硬化性成分(B)之組合時,片狀接著劑可以滿足上述要件(I)及(II)之方式製得該接著劑組成物。   以下,將列舉使用本發明的接著劑組成物,製作可形成滿足上述要件(I)及(II)的片狀接著劑之接著劑組成物的具體方法,詳細說明本發明。The sheet-shaped adhesive of the present invention is formed from an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B). When the adhesive composition contains a combination of a modified polyolefin resin (A) and a thermosetting component (B), the sheet-shaped adhesive can be obtained in a manner that satisfies the requirements (I) and (II) described above.剂 组合 物。 Composition. Hereinafter, the present invention will be described in detail using a specific method for producing an adhesive composition capable of forming a sheet-shaped adhesive satisfying the requirements (I) and (II) using the adhesive composition of the present invention.

<接著劑組成物>   本發明所使用的接著劑組成物,為含有改質聚烯烴系樹脂(A)與熱硬化性成分(B)。   又,以下說明中,「改質聚烯烴系樹脂(A)」及「熱硬化性成分(B)」亦將分別稱為「成分(A)」及「成分(B)」。<Adhesive Composition> 的 The adhesive composition used in the present invention contains a modified polyolefin resin (A) and a thermosetting component (B). In the following description, the "modified polyolefin resin (A)" and the "thermosetting component (B)" will also be referred to as "component (A)" and "component (B)", respectively.

本發明所使用的接著劑組成物,於本發明之片狀接著劑滿足上述要件(I)及(II),且無損本發明之效果的範圍,可含有成分(A)及(B)以外的其他成分。   該其他成分,例如,由矽烷耦合劑(C)、咪唑系硬化觸媒(D),及增黏劑(E)所選出之1種以上者。   又,以下之說明中,「矽烷耦合劑(C)」,「咪唑系硬化觸媒(D)」,及「增黏劑(E)」,亦分別稱為「成分(C)」,「成分(D)」,及「成分(E)」。The adhesive composition used in the present invention may contain ingredients other than the components (A) and (B) in a range in which the sheet-shaped adhesive of the present invention satisfies the above requirements (I) and (II) without impairing the effects of the present invention. Other ingredients.其他 The other components are, for example, one or more selected from a silane coupling agent (C), an imidazole-based hardening catalyst (D), and a thickener (E). In the following description, "silane coupling agent (C)", "imidazole-based hardening catalyst (D)", and "tackifier (E)" are also referred to as "ingredient (C)" and "ingredient" (D) ", and" ingredient (E) ".

本發明所使用的接著劑組成物中,相對於該接著劑組成物之有效成分之總量(100質量%),成分(A)及(B)之總計含量,較佳為70質量%以上,更佳為80質量%以上,特佳為90質量%以上,最佳為95質量%以上,更較佳為99質量%以上,又,通常為100質量%以下。In the adhesive composition used in the present invention, the total content of the components (A) and (B) is preferably 70% by mass or more with respect to the total amount (100% by mass) of the active ingredients of the adhesive composition. It is more preferably 80% by mass or more, particularly preferably 90% by mass or more, most preferably 95% by mass or more, more preferably 99% by mass or more, and usually 100% by mass or less.

本發明所使用的接著劑組成物中,相對於該接著劑組成物之有效成分之總量(100質量%),成分(A)、(B)、(C)、(D),及(E)之總計含量,較佳為80~100質量%,更佳為85~100質量%,特佳為90~100質量%,最佳為95~100質量%。   又,本發明中,接著劑組成物之有效成分,係指去除接著劑組成物中所含的無關物性的稀釋溶劑後之成分之意。In the adhesive composition used in the present invention, the components (A), (B), (C), (D), and (E) are relative to the total amount (100% by mass) of the active ingredients of the adhesive composition. The total content is preferably 80 to 100% by mass, more preferably 85 to 100% by mass, particularly preferably 90 to 100% by mass, and most preferably 95 to 100% by mass. In addition, in the present invention, the effective component of the adhesive composition refers to a component obtained by removing an irrelevant physical solvent and a diluting solvent contained in the adhesive composition.

(成分(A):改質聚烯烴系樹脂)   本發明所使用的接著劑組成物,為含有改質聚烯烴系樹脂(A)。   本發明所使用的接著劑組成物,因含有改質聚烯烴系樹脂(A),故可形成滿足上述要件(I)及(II)之片狀接著劑。又,亦可使膜厚較薄的片狀物(接著劑層)的形成性更為良好。   又,改質聚烯烴系樹脂(A),可單獨使用亦可、將2種以上合併使用亦可。(Component (A): Modified polyolefin resin) 的 The adhesive composition used in the present invention contains a modified polyolefin resin (A).接着 Since the adhesive composition used in the present invention contains a modified polyolefin resin (A), it can form a sheet-shaped adhesive that satisfies the requirements (I) and (II) described above. Moreover, the sheet-form (adhesive layer) with a thin film thickness can also be made more favorable. In addition, the modified polyolefin resin (A) may be used alone or in combination of two or more kinds.

本發明中,改質聚烯烴系樹脂係指,於作為前驅物的聚烯烴樹脂中,經使用具有官能基的改質劑施予改質處理而得的具有官能基之聚烯烴樹脂。   又,聚烯烴樹脂係指,具有由烯烴系單體所產生的重複單位之聚合物之意。   又,本發明中,該聚烯烴樹脂,可為僅由烯烴系單體所產生的重複單位所構成之聚合物亦可、具有由烯烴系單體所產生的重複單位同時,亦具有由烯烴系單體以外的單體所產生的重複單位的共聚物亦可。In the present invention, the modified polyolefin-based resin means a polyolefin resin having a functional group, which is obtained by subjecting the polyolefin resin as a precursor to a modification treatment using a modifier having a functional group. The term “polyolefin resin” refers to a polymer having a repeating unit derived from an olefin-based monomer. In the present invention, the polyolefin resin may be a polymer composed of only repeating units generated from an olefin-based monomer, or may have a repeating unit generated from an olefin-based monomer. A copolymer of a repeating unit generated from a monomer other than the monomer may be used.

上述之烯烴系單體,以碳數2~8之α-烯烴為佳,以乙烯、丙烯、1-丁烯、異丁烯,或1-己烯為較佳,以乙烯或丙烯為更佳。   烯烴系單體以外的單體,例如,乙酸乙烯酯、(甲基)丙烯酸酯、苯乙烯等。The aforementioned olefin-based monomer is preferably an α-olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene, or 1-hexene, and more preferably ethylene or propylene. Examples of the monomer other than the olefin-based monomer include vinyl acetate, (meth) acrylate, and styrene.

聚烯烴樹脂,例如,超低密度聚乙烯(VLDPE)、低密度聚乙烯(LDPE)、中密度聚乙烯(MDPE)、高密度聚乙烯(HDPE)、直鏈狀低密度聚乙烯、聚丙烯(PP)、乙烯-丙烯共聚物、烯烴系彈性體(TPO)、乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯共聚物等。   又,本說明書中,例如,「(甲基)丙烯酸」係指,「丙烯酸」與「甲基丙烯酸」二者之意,其他類似用語亦具有相同之意義。Polyolefin resins, for example, very low density polyethylene (VLDPE), low density polyethylene (LDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), linear low density polyethylene, polypropylene ( PP), ethylene-propylene copolymer, olefin-based elastomer (TPO), ethylene-vinyl acetate copolymer (EVA), ethylene- (meth) acrylic copolymer, ethylene- (meth) acrylate copolymer, and the like. In addition, in this specification, for example, "(meth) acrylic acid" means both "acrylic acid" and "methacrylic acid", and other similar terms have the same meaning.

聚烯烴樹脂於改質處理所使用的改質劑,只要可使聚烯烴樹脂中,導入分子內具有後述可進行交聯反應的官能基的化合物或該具有官能基之化合物者即可。   該官能基,例如,羧基、羧酸酐所產生之基(以下,亦稱為「羧酸酐基」)、羧酸酯基、羥基、環氧基、醯胺基、銨基、腈基、胺基、醯亞胺基、異氰酸酯基、乙醯基、硫醇基、醚基、硫醚基、碸基、膦基(phosphonic group)、硝基、胺基甲酸酯基、烷氧矽烷基,及鹵素原子等。   該些之中,又以羧基、羧酸酐基、羧酸酯基、羥基、銨基、胺基、醯亞胺基,或異氰酸酯基為佳,以羧基、羧酸酐基、羥基,或烷氧矽烷基為較佳,以羧基、羧酸酐基,或羥基為更佳,以羧酸酐基為更較佳。   所使用的改質劑,可為分子內具有1種的上述官能基之化合物亦可、具有2種以上的上述官能基之化合物亦可。   經使用上述改質劑對聚烯烴樹脂進行改質處理結果,可將可進行交聯反應之基(以下,亦稱為「交聯性官能基」)導入聚烯烴樹脂中。   因此,「改質聚烯烴系樹脂(A)」,為具有交聯性官能基之聚烯烴樹脂。As the modifier used for the modification treatment of the polyolefin resin, any compound having a functional group capable of performing a cross-linking reaction described later or a compound having the functional group may be introduced into the polyolefin resin. The functional group is, for example, a carboxyl group, a group derived from a carboxylic acid anhydride (hereinafter, also referred to as a "carboxylic acid anhydride group"), a carboxylic acid ester group, a hydroxyl group, an epoxy group, a sulfonylamino group, an ammonium group, a nitrile group, or an amine group. , Fluorenimine, isocyanate, ethenyl, thiol, ether, thioether, fluorenyl, phosphoric group, nitro, carbamate, alkoxysilyl, and Halogen atom, etc. Among these, a carboxyl group, a carboxylic acid anhydride group, a carboxylic acid ester group, a hydroxyl group, an ammonium group, an amine group, an imino group, or an isocyanate group are more preferable, and a carboxyl group, a carboxylic acid anhydride group, a hydroxyl group, or an alkoxysilane The group is more preferable, and a carboxyl group, a carboxylic acid anhydride group, or a hydroxyl group is more preferable, and a carboxylic acid anhydride group is more preferable.质 The modifier used may be a compound having one kind of the above-mentioned functional group in the molecule, or a compound having two or more kinds of the above-mentioned functional group.结果 As a result of the modification treatment of the polyolefin resin using the above-mentioned modifier, a group capable of performing a crosslinking reaction (hereinafter, also referred to as "crosslinkable functional group") can be introduced into the polyolefin resin. Therefore, the "modified polyolefin resin (A)" is a polyolefin resin having a crosslinkable functional group.

改質聚烯烴系樹脂(A),就可容易形成滿足上述要件(I)及(II)之片狀接著劑的同時,也容易形成低水蒸氣透過率、高氣體阻障性的片狀接著劑之觀點,以使用酸改質聚烯烴系樹脂、羥基改質聚烯烴系樹脂,或矽烷改質聚烯烴系樹脂為佳,又以酸改質聚烯烴系樹脂或羥基改質聚烯烴系樹脂為較佳,以酸改質聚烯烴系樹脂為更佳。The modified polyolefin resin (A) can easily form a sheet-shaped adhesive that satisfies the above requirements (I) and (II), and also easily form a sheet-shaped adhesive with low water vapor transmission rate and high gas barrier properties. From the viewpoint of the agent, it is preferable to use an acid-modified polyolefin resin, a hydroxy-modified polyolefin resin, or a silane-modified polyolefin resin, and an acid-modified polyolefin resin or a hydroxy-modified polyolefin resin. More preferably, an acid-modified polyolefin resin is more preferred.

本發明中,酸改質聚烯烴系樹脂,係指經使用酸作為改質劑施予接枝改質後的聚烯烴樹脂之意。例如,使聚烯烴樹脂與不飽和羧酸及/或其酸酐進行反應,而導入羧基及/或羧酸酐基(接枝改質)而得者。換言之,例如具有作為交聯性官能基的羧基及/或羧酸酐基之聚烯烴樹脂。In the present invention, the term "acid-modified polyolefin resin" refers to a polyolefin resin that has been graft-modified using an acid as a modifier. For example, it is obtained by reacting a polyolefin resin with an unsaturated carboxylic acid and / or its anhydride, and introducing a carboxyl group and / or a carboxylic anhydride group (graft modification). In other words, for example, a polyolefin resin having a carboxyl group and / or a carboxylic acid anhydride group as a crosslinkable functional group.

可與聚烯烴樹脂進行反應之不飽和羧酸及/或其酸酐,例如,馬來酸、富馬酸、依康酸、檬康酸、戊烯二酸、四氫酞酸、烏頭酸、馬來酸酐、依康酸酐、戊烯二酸酐、檬康酸酐、烏頭酸酐、降莰烯二羧酸酐、四氫酞酸酐等。   該些的不飽和羧酸及/或其酸酐,可單獨使用或2種以上合併使用。   該些之中,就滿足可形成上述要件(I)及(II)之片狀接著劑之觀點,以馬來酸酐為佳。Unsaturated carboxylic acids and / or anhydrides thereof that can react with polyolefin resins, such as maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaric acid, tetrahydrophthalic acid, aconitic acid, horse Maleic anhydride, itaconic anhydride, glutaric anhydride, citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride and the like. These unsaturated carboxylic acids and / or their anhydrides can be used alone or in combination of two or more. Among these, maleic anhydride is preferable from the viewpoint that the sheet-like adhesives that can form the above-mentioned requirements (I) and (II) are satisfied.

與聚烯烴樹脂進行反應的不飽和羧酸及/或其酸酐之摻合量,就容易形成滿足上述要件(I)及(II)之片狀接著劑的同時,也容易形成低水蒸氣透過率、高氣體阻障性之片狀接著劑之觀點,相對於改質前之聚烯烴樹脂100質量份,較佳為0.1~5質量份,更佳為0.2~3質量份、更較佳為0.2~1.0質量份。The blending amount of the unsaturated carboxylic acid and / or its anhydride reacted with the polyolefin resin can easily form a sheet-shaped adhesive that satisfies the above requirements (I) and (II), and also easily form a low water vapor transmission rate. From the viewpoint of sheet adhesive with high gas barrier properties, it is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and still more preferably 0.2 to 100 parts by mass of the polyolefin resin before modification. ~ 1.0 part by mass.

本發明中,酸改質聚烯烴系樹脂,亦可使用市售品。   市售品之酸改質聚烯烴系樹脂,例如,ADMER(註冊商標)(三井化學股份有限公司製)、UNISTOLE(註冊商標)(三井化學股份有限公司製)、Bondy Ram(Polyram公司製)、orevac(註冊商標)(ARKEMA公司製)、MODIC(註冊商標)(三菱化學股份有限公司製)等。In the present invention, a commercially available product may be used as the acid-modified polyolefin resin. Commercially available acid-modified polyolefin resins include, for example, ADMER (registered trademark) (manufactured by Mitsui Chemicals Co., Ltd.), UNISTOLE (registered trademark) (manufactured by Mitsui Chemicals Co., Ltd.), Bondy Ram (manufactured by Polyram Corporation), orevac (registered trademark) (made by ARKEMA), MODIC (registered trademark) (made by Mitsubishi Chemical Corporation), and the like.

又,本發明中,矽烷改質聚烯烴系樹脂,係指不飽和矽烷化合物經使用改質劑進行接枝改質而得之聚烯烴樹脂。即,矽烷改質聚烯烴系樹脂為,於主鏈的聚烯烴樹脂上,具有與作為側鏈的不飽和矽烷化合物形成接枝共聚之構造者。換言之,矽烷改質聚烯烴系樹脂,為具有作為交聯性官能基的含矽烷之基之聚烯烴樹脂。In the present invention, the silane-modified polyolefin resin refers to a polyolefin resin obtained by graft-modifying an unsaturated silane compound with a modifier. That is, the silane-modified polyolefin resin is a polyolefin resin having a main chain having a structure that forms a graft copolymerization with an unsaturated silane compound as a side chain. In other words, the silane-modified polyolefin resin is a polyolefin resin having a silane-containing group as a crosslinkable functional group.

與聚烯烴樹脂進行反應的不飽和矽烷化合物,以乙烯矽烷化合物為佳,例如,乙烯三甲氧基矽烷、乙烯三乙氧基矽烷、乙烯三丙氧基矽烷、乙烯三異丙氧基矽烷、乙烯三丁氧基矽烷、乙烯三戊氧基矽烷、乙烯三苯氧基矽烷、乙烯三苄氧基矽烷、乙烯伸三甲基二氧基矽烷、乙烯伸三乙基二氧基矽烷、乙烯丙醯氧基矽烷、乙烯三乙醯氧基矽烷、乙烯三羧基矽烷等。   該些的不飽和矽烷化合物,可單獨使用或2種以上合併使用。   又,以不飽和矽烷化合物為主鏈的聚烯烴樹脂,進行接枝聚合時之條件,可使用一般公知的接枝聚合方法即可。Unsaturated silane compounds that react with polyolefin resins are preferably ethylene silane compounds, for example, ethylene trimethoxysilane, ethylene triethoxysilane, ethylene tripropoxysilane, ethylene triisopropoxysilane, ethylene Tributoxysilane, ethylenetripentyloxysilane, ethylenetriphenoxysilane, ethylenetribenzyloxysilane, ethylenetrimethyldioxysilane, ethylenetriethyldioxysilane, ethylenepropyloxy Silane, ethylene triethoxysilane, ethylene tricarboxysilane, etc. These unsaturated silane compounds can be used alone or in combination of two or more. In addition, for a polyolefin resin having an unsaturated silane compound as a main chain, the conditions for performing graft polymerization may be a generally known graft polymerization method.

與聚烯烴樹脂進行反應的不飽和矽烷化合物之摻合量,就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,相對於改質前之聚烯烴樹脂100質量份,較佳為0.1~10質量份,更佳為0.3~7質量份,特佳為0.5~5質量份。From the viewpoint that the amount of the unsaturated silane compound to be reacted with the polyolefin resin forms a sheet-shaped adhesive that satisfies the requirements (I) and (II) described above, compared with 100 parts by mass of the polyolefin resin before the modification, It is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, and particularly preferably 0.5 to 5 parts by mass.

具體的矽烷改質聚烯烴系樹脂,例如,矽烷改質聚乙烯樹脂,及、矽烷改質乙烯-乙酸乙烯酯共聚物等,又以矽烷改質低密度聚乙烯、矽烷改質超低密度聚乙烯、矽烷改質直鏈狀低密度聚乙烯等的矽烷改質聚乙烯樹脂為佳。Specific silane-modified polyolefin resins, for example, silane-modified polyethylene resins, silane-modified ethylene-vinyl acetate copolymers, etc., and silane-modified low-density polyethylene, silane-modified ultra-low-density polymer Silane-modified polyethylene resins such as ethylene and silane-modified linear low-density polyethylene are preferred.

本發明中,矽烷改質聚烯烴系樹脂,亦可使用市售品。   市售品之矽烷改質聚烯烴系樹脂,例如,LINKLON(註冊商標)(三菱化學股份有限公司製)等,又以低密度聚乙烯系之LINKLON、直鏈狀低密度聚乙烯系之LINKLON、超低密度聚乙烯系之LINKLON,及乙烯-乙酸乙烯酯共聚物系之LINKLON為佳。In the present invention, commercially available products may be used as the silane-modified polyolefin resin. Commercially available silane-modified polyolefin resins, for example, LINKLON (registered trademark) (manufactured by Mitsubishi Chemical Co., Ltd.), and other low-density polyethylene-based LINKLON, linear low-density polyethylene-based LINKLON, Ultra low density polyethylene based LINKLON and ethylene-vinyl acetate copolymer based LINKLON are preferred.

又,本發明中,羥基改質聚烯烴系樹脂係指,於聚烯烴樹脂中導入交聯性官能基之羥基的聚烯烴樹脂之意。換言之,羥基改質聚烯烴系樹脂為,具有羥基作為交聯性官能基的聚烯烴樹脂。In the present invention, the hydroxy-modified polyolefin resin means a polyolefin resin in which a hydroxyl group of a crosslinkable functional group is introduced into the polyolefin resin. In other words, the hydroxy-modified polyolefin resin is a polyolefin resin having a hydroxyl group as a crosslinkable functional group.

於聚烯烴樹脂中導入羥基之方法,並未有特別之限定。例如,使聚烯烴樹脂與具有氫過氧基之過氧化物(例如,過氧化氫等)進行反應,使聚烯烴樹脂所具有的雙鍵部位環氧化後,再進行水解之方法等。The method for introducing a hydroxyl group into a polyolefin resin is not particularly limited. For example, a method in which a polyolefin resin is reacted with a peroxide having a hydroperoxy group (for example, hydrogen peroxide, etc.) to epoxidize a double bond site included in the polyolefin resin, and then hydrolyzed.

與聚烯烴樹脂進行反應的前述過氧化物之摻合量,並未有特別之限定,就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,相對於改質前之聚烯烴樹脂100質量份,較佳為0.1~10質量份,更佳為0.3~7質量份,特佳為0.5~5質量份。There is no particular limitation on the amount of the peroxide to be reacted with the polyolefin resin. From the viewpoint of forming a sheet-like adhesive that satisfies the above requirements (I) and (II), it is relative to the polymerization before the modification. The olefin resin is 100 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, and particularly preferably 0.5 to 5 parts by mass.

本發明中,羥基改質聚烯烴系樹脂,亦可使用市售品。   市售品的羥基改質聚烯烴系樹脂,例如,POLYTAIL (註冊商標)(三菱化學股份有限公司製)等。In the present invention, a commercially available hydroxy-modified polyolefin resin may be used. A commercially available hydroxy-modified polyolefin-based resin is, for example, POLYTAIL (registered trademark) (manufactured by Mitsubishi Chemical Corporation).

改質聚烯烴系樹脂(A)之重量平均分子量(Mw),就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,較佳為10,000~2,000,000,更佳為20,000~1,500,000,特佳為25,000~250,000,最佳為30,000~150,000。前述改質聚烯烴系樹脂之重量平均分子量於該範圍時,即使前述改質聚烯烴樹脂的前述接著劑組成物中之含量較多時,也容易使前述接著劑組成物維持片狀形狀。The weight average molecular weight (Mw) of the modified polyolefin-based resin (A) is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000 from the viewpoint of forming a sheet-shaped adhesive that satisfies the requirements (I) and (II) described above. Particularly preferred is 25,000-250,000, and the best is 30,000-150,000. When the weight average molecular weight of the modified polyolefin-based resin is within this range, it is easy to maintain the sheet-like shape of the adhesive composition even when the content of the adhesive composition of the modified polyolefin resin is large.

又,本說明書中,改質聚烯烴系樹脂(A)之重量平均分子量(Mw),為使用四氫呋喃作為溶劑,依凝膠滲透色層分析(GPC)法所測定的標準聚苯乙烯換算之值,具體而言,為基於實施例記載之方法所測定之值。In this specification, the weight average molecular weight (Mw) of the modified polyolefin-based resin (A) is a value converted into a standard polystyrene measured by a gel permeation chromatography (GPC) method using tetrahydrofuran as a solvent. Specifically, it is a value measured based on the method described in the examples.

前述改質聚烯烴系樹脂(A),就該改質聚烯烴系樹脂(A)的前述接著劑組成物中之含量較多時,也容易使前述接著劑組成物維持片狀形狀之觀點,以常溫(25℃)下為固體者為佳。In view of the fact that the modified polyolefin-based resin (A) has a large content in the adhesive composition of the modified polyolefin-based resin (A), it is also easy to maintain the sheet-like shape of the adhesive composition, It is better to be solid at room temperature (25 ° C).

本發明所使用的接著劑組成物中,就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,成分(A)之含量,相對於該接著劑組成物之有效成分之總量(100質量%),較佳為15~95質量%,更佳為23~95質量%,特佳為30~90質量%。In the adhesive composition used in the present invention, from the viewpoint of forming a sheet-shaped adhesive that satisfies the above-mentioned requirements (I) and (II), the content of the component (A) is relative to the total of the active ingredients of the adhesive composition The amount (100% by mass) is preferably 15 to 95% by mass, more preferably 23 to 95% by mass, and particularly preferably 30 to 90% by mass.

<成分(B):熱硬化性成分>   本發明所使用的接著劑組成物,為含有熱硬化性成分(B)。   本發明所使用的接著劑組成物,因含有熱硬化性成分(B),故可形成滿足上述要件(I)及(II)之片狀接著劑。   又,熱硬化性成分(B),可單獨使用亦可、將2種以上合併使用亦可。   又,熱硬化性成分(B)之含量,相對於改質聚烯烴系樹脂(A)100質量份,較佳為5~110質量份,更佳為10~50質量份,特佳為20~30質量份。<Component (B): Thermosetting component> 的 The adhesive composition used in the present invention contains a thermosetting component (B).的 The adhesive composition used in the present invention can form a sheet-shaped adhesive that satisfies the above-mentioned requirements (I) and (II) because it contains a thermosetting component (B). The thermosetting component (B) may be used alone or in combination of two or more kinds. The content of the thermosetting component (B) is preferably 5 to 110 parts by mass, more preferably 10 to 50 parts by mass, and particularly preferably 20 to 100 parts by mass of the modified polyolefin-based resin (A). 30 parts by mass.

熱硬化性成分(B),只要為受到加熱時,可經由熱硬化性成分(B)所具有的官能基產生相互間之反應及/或經由與改質聚烯烴系樹脂(A)所具有的交聯性官能基進行反應(交聯反應),而具有可形成具有立體網目構造的強固被膜之性質的化合物即可,例如,環氧系化合物、三聚氰胺系化合物、尿素系化合物,及馬來醯亞胺系化合物等,較佳為環氧系化合物。   該些的化合物,可單獨使用1種,或將2種以上組合使用皆可。As long as the thermosetting component (B) is heated, it can react with each other via the functional groups of the thermosetting component (B) and / or via the functional group possessed by the modified polyolefin resin (A). The crosslinkable functional group is allowed to react (crosslinking reaction), and a compound having a property of forming a strong film having a three-dimensional mesh structure may be sufficient, for example, epoxy-based compound, melamine-based compound, urea-based compound, and maleam The imine-based compound and the like are preferably epoxy-based compounds. These compounds may be used singly or in combination of two or more kinds.

其中,熱硬化性成分(B),就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,本發明所使用的接著劑組成物,以含有多官能環氧化合物者為佳。   又,多官能環氧化合物,可單獨使用亦可、將2種以上合併使用亦可。   熱硬化性成分(B)中,多官能環氧化合物之含量,就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,相對於熱硬化性成分(B)之總量(100質量%),較佳為50質量%以上,更佳為60~100質量%,特佳為70~100質量%,最佳為80~100質量%,更較佳為90~100質量%,特較佳為100質量%。Among them, the thermosetting component (B) is preferable from the viewpoint of forming a sheet-shaped adhesive that satisfies the above requirements (I) and (II). The adhesive composition used in the present invention is preferably one containing a polyfunctional epoxy compound. . The polyfunctional epoxy compound may be used alone or in combination of two or more kinds. The content of the polyfunctional epoxy compound in the thermosetting component (B) is from the viewpoint of forming a sheet-shaped adhesive that satisfies the requirements (I) and (II) above, relative to the total amount of the thermosetting component (B) ( 100% by mass), preferably 50% by mass or more, more preferably 60 to 100% by mass, particularly preferably 70 to 100% by mass, most preferably 80 to 100% by mass, and more preferably 90 to 100% by mass, It is particularly preferably 100% by mass.

本發明中,多官能環氧化合物係指,分子內至少具有2個以上環氧基的化合物之意。   多官能環氧化合物,就形成滿足上述要件(I)及(II)之片狀接著劑之觀點,以至少具有2個環氧基的2官能環氧化合物為佳。In the present invention, the polyfunctional epoxy compound means a compound having at least two epoxy groups in the molecule. (2) A polyfunctional epoxy compound is preferably a bifunctional epoxy compound having at least two epoxy groups from the viewpoint of forming a sheet-shaped adhesive that satisfies the requirements (I) and (II).

2官能環氧化合物,例如,雙酚A二縮水甘油醚、雙酚F二縮水甘油醚、雙酚S二縮水甘油醚、溴化雙酚A二縮水甘油醚、溴化雙酚F二縮水甘油醚、溴化雙酚S二縮水甘油醚、酚醛清漆型環氧樹脂(例如酚・酚醛清漆型環氧樹脂、甲酚・酚醛清漆型環氧樹脂、溴化酚・酚醛清漆型環氧樹脂)等的芳香族環氧化合物;氫化雙酚A二縮水甘油醚、氫化雙酚F二縮水甘油醚、氫化雙酚S二縮水甘油醚等的脂環式環氧化合物;季戊四醇聚縮水甘油醚、1,6-己二醇二縮水甘油醚、六氫酞酸二縮水甘油酯、新戊二醇二縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、2,2-雙(3-縮水甘油-4-縮水甘油氧苯基)丙烷、二羥甲基三環癸烷二縮水甘油醚等的脂肪族環氧化合物等。Bifunctional epoxy compounds, for example, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether Ether, brominated bisphenol S diglycidyl ether, novolac-type epoxy resin (e.g., phenol, novolac-type epoxy resin, cresol, novolac-type epoxy resin, brominated phenol-novolac-type epoxy resin) And other aromatic epoxy compounds; alicyclic epoxy compounds such as hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether; pentaerythritol polyglycidyl ether, 1 , 6-hexanediol diglycidyl ether, hexahydrophthalic acid diglycidyl ester, neopentyl glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, 2,2-bis (3-glycidyl- Aliphatic epoxy compounds such as 4-glycidyloxyphenyl) propane, dimethylol tricyclodecane diglycidyl ether, and the like.

其中,就提高上述要件(II)規定之黏著力之觀點,以使片狀接著劑的交聯密度更向上提升者為佳。   就該觀點而言,接著劑組成物中所含有的由多官能環氧化合物所產生的環氧基數越多時,就促進交聯反應之目的為更佳者。   因此,就增加接著劑組成物中所含有的由多官能環氧化合物所產生的環氧基之數目的觀點,以選擇環氧當量較小的多官能環氧化合物為佳。又,基於相同之觀點,以選擇重量平均分子量(Mw)較小的多官能環氧化合物為佳。Among them, from the viewpoint of increasing the adhesion force prescribed by the above-mentioned requirement (II), it is preferable to increase the cross-linking density of the sheet-shaped adhesive further upward. From this viewpoint, the more the number of epoxy groups generated by the polyfunctional epoxy compound contained in the adhesive composition, the better the purpose of promoting the crosslinking reaction. Therefore, from the viewpoint of increasing the number of epoxy groups generated from the polyfunctional epoxy compound contained in the adhesive composition, it is preferable to select a polyfunctional epoxy compound having a small epoxy equivalent. From the same viewpoint, it is preferable to select a polyfunctional epoxy compound having a small weight average molecular weight (Mw).

又,就降低上述要件(I)規定之釋氣產生量之觀點,多官能環氧化合物之重量平均分子量(Mw)以較大者為佳。又,接著劑組成物中,多官能環氧化合物的含量以較小者為佳。   即,以往同時考量提高上述要件(II)規定之黏著力之觀點時,將不容易調整可形成同時滿足上述要件(I)及(II)之片狀接著劑所使用的接著劑組成物。但將多官能環氧化合物之重量平均分子量(Mw)、環氧當量,及相對於接著劑組成物中的改質聚烯烴系樹脂(A)之多官能環氧化合物之含量,依以下方式調整時,即可製得可形成同時滿足上述要件(I)及(II)之片狀接著劑所使用的接著劑組成物。From the viewpoint of reducing the amount of outgassing specified in the above requirement (I), the larger the weight average molecular weight (Mw) of the polyfunctional epoxy compound is preferred. The content of the polyfunctional epoxy compound in the adhesive composition is preferably smaller. That is, in the past, when the viewpoint of improving the adhesive force specified in the above-mentioned requirement (II) was considered at the same time, it would not be easy to adjust the adhesive composition that can be used to form a sheet-shaped adhesive agent that satisfies the requirements (I) and (II). However, the weight-average molecular weight (Mw) of the polyfunctional epoxy compound, the epoxy equivalent, and the content of the polyfunctional epoxy compound with respect to the modified polyolefin-based resin (A) in the adhesive composition are adjusted in the following manner. In this case, an adhesive composition that can be used to form a sheet adhesive that satisfies the above requirements (I) and (II) can be obtained.

因此,就達成較上述要件(I)規定之釋氣產生量為更低,同時可使上述要件(II)規定之黏著力更向上提升觀點,多官能環氧化合物之重量平均分子量(Mw),較佳為1,000~4,000,更佳為1,200~3,600,特佳為1,400~3,200。Therefore, it is achieved that the outgassing amount is lower than that specified in the above requirement (I), and at the same time, the adhesive force specified in the above requirement (II) can be raised upward, the weight average molecular weight (Mw) of the polyfunctional epoxy compound, It is preferably 1,000 to 4,000, more preferably 1,200 to 3,600, and particularly preferably 1,400 to 3,200.

又,就使上述要件(II)規定之黏著力更向上提升之觀點,多官能環氧化合物的環氧當量,較佳為300g/eq以下,更佳為270g/eq以下,特佳為240g/eq以下,最佳為210g/eq以下。又,通常為100g/eq以上。   本說明書中,「環氧當量」係指,含有1克當量的環氧基之環氧化合物的克數(g/eq)之意,其係依JIS K 7236:2009為基準所測定之值。From the viewpoint of further increasing the adhesive force specified in the above requirement (II), the epoxy equivalent of the polyfunctional epoxy compound is preferably 300 g / eq or less, more preferably 270 g / eq or less, and particularly preferably 240 g / eq. eq or less, preferably 210 g / eq or less. It is usually 100 g / eq or more. In this specification, "epoxy equivalent" means the number of grams (g / eq) of an epoxy compound containing 1 gram equivalent of an epoxy group, and it is a value measured based on JIS K 7236: 2009.

又,就使上述要件(I)規定之釋氣產生量更低之觀點,多官能環氧化合物之含量,相對於改質聚烯烴系樹脂(A)100質量份,較佳為5~150質量份,更佳為10~80質量份,特佳為15~50質量份。From the viewpoint of reducing the outgassing amount specified in the above requirement (I), the content of the polyfunctional epoxy compound is preferably 5 to 150 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A). Parts, more preferably 10 to 80 parts by mass, and particularly preferably 15 to 50 parts by mass.

<成分(C):矽烷耦合劑>   本發明所使用的接著劑組成物,就無論於常溫及高溫環境下,皆為可形成具有優良接著強度的密封體之接著劑組成物的觀點,更以含有矽烷耦合劑(C)為佳。<Component (C): Silane coupling agent> 的 The adhesive composition used in the present invention is an adhesive composition capable of forming a sealing body having excellent adhesive strength regardless of normal temperature and high temperature environments. Containing a silane coupling agent (C) is preferred.

矽烷耦合劑(C),基於上述之觀點,以分子內至少具有1個烷氧矽烷基的有機矽化合物為佳。   具體的矽烷耦合劑(C),例如,乙烯三甲氧基矽烷、乙烯三乙氧基矽烷、甲基丙烯醯氧丙基三甲氧基矽烷等的含有聚合性不飽和基之矽化合物;3-環氧丙氧丙基三甲氧基矽烷、環氧丙氧辛基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷等的具有環氧構造的矽化合物;3-胺丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺丙基甲基二甲氧基矽烷等的含有胺基的矽化合物;3-氯丙基三甲氧基矽烷;3-異氰酸丙基三乙氧基矽烷;等。   該些矽烷耦合劑(C),可單獨使用亦可、將2種以上合併使用亦可。The silane coupling agent (C) is preferably an organosilicon compound having at least one alkoxysilyl group in the molecule from the above viewpoint. Specific silane coupling agent (C), for example, a silicon compound containing a polymerizable unsaturated group such as ethylenetrimethoxysilane, ethylenetriethoxysilane, methacryloxypropyltrimethoxysilane, etc .; Silicon compounds with epoxy structure, such as oxypropyloxypropyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3 -Aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldimethyl Amine-containing silicon compounds such as oxysilane; 3-chloropropyltrimethoxysilane; 3-isocyanatopropyltriethoxysilane; etc. These silane coupling agents (C) may be used alone or in combination of two or more kinds.

本發明所使用的接著劑組成物中,成分(C)之含量,就無論於常溫及高溫環境下的任一環境,皆可形成具有優良接著強度之密封體的接著劑組成物之觀點,相對於成分(A)100質量份,較佳為0.01~10質量份,更佳為0.02~5質量份,特佳為0.05~2質量份。In the adhesive composition used in the present invention, the content of the component (C) is an adhesive composition that can form a sealed body having excellent adhesive strength regardless of the environment at normal temperature and high temperature. 100 parts by mass of the component (A) is preferably 0.01 to 10 parts by mass, more preferably 0.02 to 5 parts by mass, and particularly preferably 0.05 to 2 parts by mass.

<成分(D):咪唑系硬化觸媒>   本發明所使用的接著劑組成物,就於高溫環境下也可顯示優良接著性之接著劑組成物的觀點,以再含有咪唑系硬化觸媒(D)為佳。<Ingredient (D): imidazole-based hardening catalyst> 的 The adhesive composition used in the present invention contains an imidazole-based hardening catalyst from the viewpoint that the adhesive composition can exhibit excellent adhesion even in a high temperature environment ( D) is better.

咪唑系硬化觸媒(D),例如,2-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑、2-苯基-4-甲基-5-羥甲基咪唑、2-苯基-4,5-二羥甲基咪唑等。   該些咪唑系硬化觸媒(D),可單獨使用亦可、將2種以上合併使用亦可。   該些之中,成分(D)又以2-乙基-4-甲基咪唑為佳。Imidazole-based hardening catalyst (D), for example, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dimethylolimidazole, and the like. These imidazole-based hardening catalysts (D) may be used alone or in combination of two or more kinds. Among these, the component (D) is preferably 2-ethyl-4-methylimidazole.

本發明所使用的接著劑組成物中,成分(D)之含量,就於高溫環境下也可顯示優良接著性之接著劑組成物的觀點,相對於成分(A)成分100質量份,較佳為0.1~10質量份,更佳為0.2~5質量份,特佳為0.3~2.5質量份。The content of the component (D) in the adhesive composition used in the present invention is preferably from 100 parts by mass of the component (A) from the viewpoint that the adhesive composition can exhibit excellent adhesion even in a high-temperature environment. It is 0.1 to 10 parts by mass, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.3 to 2.5 parts by mass.

<成分(E):增黏劑>   本發明所使用的接著劑組成物,就所形成的密封材料之形狀維持性為更良好的觀點,亦可再含有增黏劑(E)。<Component (E): Tackifier> The adhesive composition used in the present invention may further contain a tackifier (E) from the viewpoint that the shape-maintaining property of the formed sealing material is better.

增黏劑(E),例如,聚合松脂、聚合松脂酯、松脂衍生物等的松脂系樹脂;聚萜烯樹脂、芳香族改質萜烯樹脂及其氫化物、萜烯酚樹脂等的萜烯系樹脂;苯并呋喃・茚樹脂;脂肪族石油系樹脂、芳香族系石油樹脂及其氫化物、脂肪族/芳香族共聚物石油樹脂等的石油樹脂;苯乙烯或有取代之苯乙烯聚合物;α-甲基苯乙烯單一聚合系樹脂、α-甲基苯乙烯與苯乙烯之共聚物、苯乙烯系單體與脂肪族系單體之共聚物、苯乙烯系單體與α-甲基苯乙烯與脂肪族系單體之共聚物、苯乙烯系單體所形成的均聚物、苯乙烯系單體與芳香族系單體之共聚物等的苯乙烯系樹脂;等。   該些的增黏劑(E),可單獨使用亦可、將2種以上合併使用亦可。   該些之中,成分(E)又以苯乙烯系樹脂為佳,以苯乙烯系單體與脂肪族系單體之共聚物為較佳。Tackifier (E), for example, turpentine resins such as polymerized turpentine, polymerized turpentine esters, and turpentine derivatives; polyterpene resins, aromatic modified terpene resins and their hydrides, and terpenes such as terpene phenol resins Resins; benzofuran and indene resins; petroleum resins such as aliphatic petroleum resins, aromatic petroleum resins and their hydrides, aliphatic / aromatic copolymer petroleum resins; styrene or substituted styrene polymers ; Α-methylstyrene single polymer resin, copolymer of α-methylstyrene and styrene, copolymer of styrene monomer and aliphatic monomer, styrene monomer and α-methyl A styrene resin such as a copolymer of styrene and an aliphatic monomer, a homopolymer formed of a styrene monomer, a copolymer of a styrene monomer and an aromatic monomer, and the like; and the like. These thickeners (E) may be used alone or in combination of two or more kinds. Among these, the component (E) is preferably a styrene resin, and a copolymer of a styrene monomer and an aliphatic monomer is more preferable.

增黏劑(E)之軟化點,就使所形成的密封材料之形狀維持性更向上提升,同時於高溫環境下也可顯示優良接著性之接著劑組成物的觀點,較佳為80℃以上,更佳為85~170℃,特佳為90~150℃。   又,本說明書中,軟化點為,根據JIS K 5902為基準所測定之值之意。   使用2種以上的複數之增黏劑時,該些複數之增黏劑的軟化點之加權平均,以屬於上述範圍者為佳。The softening point of the tackifier (E) improves the shape retention of the formed sealing material, and at the same time, it is an adhesive composition that can exhibit excellent adhesiveness under a high temperature environment, and is preferably 80 ° C or higher. , More preferably 85 to 170 ° C, and particularly preferably 90 to 150 ° C. In this specification, the softening point means a value measured in accordance with JIS K 5902.时 When two or more types of tackifiers are used, the weighted average of the softening points of the plurality of tackifiers is preferably within the above range.

本發明之接著劑組成物中,成分(E)之含量,就使所形成的密封材料為形狀維持性更為良好的接著劑組成物的觀點,相對於成分(A)100質量份,較佳為1~200質量份,更佳為10~150質量份,特佳為15~100質量份,最佳為20~80質量份。The content of the component (E) in the adhesive composition of the present invention is preferably from 100 mass parts of the component (A) from the viewpoint that the sealing material to be formed is an adhesive composition having better shape retention. It is 1 to 200 parts by mass, more preferably 10 to 150 parts by mass, particularly preferably 15 to 100 parts by mass, and most preferably 20 to 80 parts by mass.

<其他添加劑>   本發明所使用的接著劑組成物,於無損本發明之效果的範圍,可含有上述成分(A)~(E)以外的其他添加劑。   其他添加劑,可配合用途作適當之選擇,例如,紫外線吸收劑、抗靜電劑、光安定劑、抗氧化劑、樹脂安定劑、填充劑、顏料、增量劑、軟化劑等的添加劑。   該些的添加劑,可單獨使用亦可、將2種以上合併使用亦可。<Other additives> 的 The adhesive composition used in the present invention may contain other additives other than the above-mentioned components (A) to (E), as long as the effect of the present invention is not impaired. Other additives can be appropriately selected according to the application, for example, additives such as ultraviolet absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, softeners and the like. These additives may be used alone or in combination of two or more.

又,本發明所使用的接著劑組成物,就具有良好成形性之觀點,亦可再含有稀釋溶劑。   稀釋溶劑,可由有機溶劑中適當地選擇,具體例如,苯、甲苯等之芳香族烴系溶劑;乙酸乙酯、乙酸丁酯等的酯系溶劑;丙酮、甲基乙基酮、甲基異丁酮等的酮系溶劑;n-戊烷、n-己烷、n-庚烷等的脂肪族烴系溶劑;環戊烷、環己烷、甲基環己烷等的脂環式烴系溶劑;等。   該些的溶劑,可單獨使用亦可、將2種以上合併使用亦可。   又,溶劑之含量,可於考慮塗佈性等後,作適當之設定。The adhesive composition used in the present invention may further contain a diluent solvent from the viewpoint of good moldability. The diluting solvent can be appropriately selected from organic solvents, and specific examples include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; acetone, methyl ethyl ketone, and methyl isobutyl Ketone solvents such as ketones; aliphatic hydrocarbon solvents such as n-pentane, n-hexane, and n-heptane; alicyclic hydrocarbon solvents such as cyclopentane, cyclohexane, and methylcyclohexane ;Wait. These solvents may be used alone or in combination of two or more. In addition, the content of the solvent can be appropriately set in consideration of coating properties and the like.

<片狀接著劑之製造方法>   本發明之片狀接著劑,為由上述接著劑組成物所形成。   本發明之片狀接著劑之製造方法,並未有特別之限定,例如,可於後述剝離薄膜之剝離處理面上,塗佈上述接著劑組成物而形成塗膜,使該該塗膜乾燥後形成片狀接著劑之方法等。<The manufacturing method of a sheet-shaped adhesive> The sheet-shaped adhesive of this invention is formed from the said adhesive composition. The method for producing the sheet-shaped adhesive of the present invention is not particularly limited. For example, the adhesive composition can be applied on the release-treated surface of a release film described later to form a coating film, and the coating film can be dried. A method for forming a sheet-like adhesive.

接著劑組成物之塗佈方法,例如,旋轉塗佈法、噴灑塗佈法、條狀塗佈法、刮片塗佈法、滾筒塗佈法、面板塗佈法、模具(die)塗佈法、凹版塗佈法等。   又,就使塗佈性更良好之觀點,以於接著劑組成物中加入上述稀釋溶劑,形成溶液形態者為佳。   使用塗膜乾燥時的乾燥條件,例如,通常為於80~150℃,施予30秒鐘~5分鐘的乾燥處理為佳。The coating method of the adhesive composition is, for example, a spin coating method, a spray coating method, a strip coating method, a blade coating method, a roll coating method, a panel coating method, or a die coating method. , Gravure coating method, etc. Furthermore, from the viewpoint of better coating properties, it is preferable to add the above-mentioned diluent solvent to the adhesive composition to form a solution form. The drying conditions used when the coating film is dried are, for example, usually 80 to 150 ° C., and a drying treatment is preferably performed for 30 seconds to 5 minutes.

又,於剝離薄膜上所形成的片狀接著劑上,可再層合另1片剝離薄膜。如此,可使片狀接著劑的兩面被保護至使用之時。2片的剝離薄膜,可為相同亦可、互相相異者亦可,又以具有互相相異的黏著力者為佳。Further, another sheet of release film may be laminated on the sheet-shaped adhesive formed on the release film. In this way, both sides of the sheet-shaped adhesive can be protected until use. The two peeling films may be the same or different from each other, and it is preferable that they have mutually different adhesion.

<片狀接著劑之用途>   本發明之片狀接著劑,例如,可做為密封電子裝置等的被密封物的密封片之接著劑層使用。   隨後,將對本發明之第二實施形態的氣體阻障性層合體進行說明。<Application of Sheet Adhesive> The sheet adhesive of the present invention can be used, for example, as an adhesive layer of a sealing sheet for sealing an object to be sealed such as an electronic device. Next, a gas barrier laminate according to a second embodiment of the present invention will be described.

[氣體阻障性層合體]   本發明之氣體阻障性層合體,為具有具基材層的氣體阻障性膜,與由片狀接著劑所構成的接著劑層。片狀接著劑,為由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成,且滿足上述要件(I)。   又,本發明之氣體阻障性層合體,另滿足以下之要件(IIa)。   ・要件(IIa):在溫度60℃、壓力0.2MPa,及速度0.2m/min之條件下,以軋輥,將前述氣體阻障性層合體押向玻璃板,而貼合於前述氣體阻障性層合體之前述片狀接著劑與前述玻璃板,並在100℃、2小時之條件下使前述片狀接著劑硬化後,在23℃相對濕度50%之環境下保管後,根據相對濕度JIS Z0237:2000為基準所測量之前述氣體阻障性層合體與前述玻璃板之黏著力為10N/25mm以上。[Gas Barrier Laminate] The gas barrier laminate of the present invention is a gas barrier film having a substrate layer and an adhesive layer composed of a sheet-shaped adhesive. The sheet-shaped adhesive is formed from an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B), and satisfies the above-mentioned requirement (I). In addition, the gas barrier laminate of the present invention satisfies the following requirement (IIa).・ Requirement (IIa): At a temperature of 60 ° C, a pressure of 0.2 MPa, and a speed of 0.2 m / min, the gas barrier laminate is pressed against a glass plate with a roller, and the gas barrier is bonded to the glass barrier. Laminate the sheet-shaped adhesive and the glass plate, and harden the sheet-shaped adhesive at 100 ° C for 2 hours, and then store the sheet-shaped adhesive at 23 ° C and 50% relative humidity according to the relative humidity JIS Z0237 : The adhesion between the gas barrier laminate and the glass plate measured at 2000 is 10N / 25mm or more.

本發明之氣體阻障性層合體中,就形成可構成接著劑層的片狀接著劑之接著劑組成物的構成,為與上述構成為相同之內容。又,上述要件(IIa)規定之黏著力,就滿足上述要件(II)規定之黏著力時,可使用滿足與上述之調整方法為相同之方法。上述要件(I)規定之釋氣產生量,亦可經由上述調整方法而得到滿足。In the gas barrier laminate of the present invention, the constitution of the adhesive composition forming a sheet-like adhesive capable of constituting the adhesive layer is the same as that described above. In addition, when the adhesive force specified in the above-mentioned requirement (IIa) satisfies the adhesive force specified in the above-mentioned requirement (II), the same method as the above-mentioned adjustment method can be used. The outgassing amount specified in the above requirement (I) can also be satisfied through the above-mentioned adjustment method.

本發明之氣體阻障性層合體所具有的氣體阻障性膜,為至少具有基材層的具有氣體阻隔機能之薄膜。該氣體阻障性膜之一態樣,例如,具有基材層及氣體阻障層者。例如,具有以下的層構成內容的態樣。   ・(i)使基材層/氣體阻障層/接著劑層/剝離薄膜依此順序層合而得的氣體阻障性層合體。The gas barrier film included in the gas barrier laminate of the present invention is a film having a gas barrier function having at least a base material layer. One aspect of the gas barrier film includes, for example, a substrate layer and a gas barrier layer. For example, it has the aspect of the following layer constitution content. (I) A gas barrier laminate obtained by laminating a base material layer, a gas barrier layer, an adhesive layer, and a release film in this order.

又,上述(i)之態樣中,就提高基材層與氣體阻障層之密著性的觀點,可如下述(ii)之態樣般,可於基材層與氣體阻障層之間具有底漆層。   ・(ii)使基材層/底漆層/氣體阻障層/接著劑層/剝離薄膜依此順序層合而得的氣體阻障性層合體。In addition, in the aspect (i), from the viewpoint of improving the adhesion between the base material layer and the gas barrier layer, it can be applied to the base material layer and the gas barrier layer as in the following aspect (ii). There is a primer layer in between. (Ii) A gas barrier laminate obtained by laminating a base material layer, a primer layer, a gas barrier layer, an adhesive layer, and a release film in this order.

又,上述(i)及(ii)之態樣,為表示氣體阻障性層合體於使用前的狀態,於使用之際,通常為使用將剝離薄膜剝離去除者。In addition, the aspects (i) and (ii) above indicate the state of the gas barrier laminate before use, and when used, the peeled film is usually removed and removed.

其中,本發明之氣體阻障性層合體所具有的氣體阻障性膜,其基材層本體具有氣體阻隔機能,故基材層可作為兼具有氣體阻障層機能的單層之樹脂薄膜等。Among them, the gas barrier film of the gas barrier laminate of the present invention has a gas barrier function in the substrate layer body, so the substrate layer can be used as a single-layer resin film that also has the function of the gas barrier layer. Wait.

其中,本發明之氣體阻障性層合體中,以氣體阻障層與接著劑層直接層合之構成者為佳。特別是氣體阻障層為施予後述改質處理的高分子層時,一般而言,因接著劑層與氣體阻障層之層間密著性不佳,故將本發明之片狀接著劑作為接著劑層使用時,可使接著劑層與氣體阻障層具有優良的層間密著性。Among them, in the gas-barrier laminate of the present invention, it is preferable that the gas-barrier layer and the adhesive layer are directly laminated. In particular, when the gas barrier layer is a polymer layer to be modified as described later, generally, the adhesiveness between the adhesive layer and the gas barrier layer is not good, so the sheet-shaped adhesive of the present invention is used as When the adhesive layer is used, the adhesive layer and the gas barrier layer can have excellent interlayer adhesion.

氣體阻障性層合體所具有的氣體阻障性膜,於溫度40℃、90%RH(相對濕度)之環境下的水蒸氣透過率,較佳為0.1g/m2 /day以下,更佳為0.05g/m2 /day以下,特佳為0.005g/m2 /day以下。   若氣體阻障性膜的水蒸氣透過率為0.1g/m2 /day以下時,使用氣體阻障性層合體時,可抑制氧氣或水份等滲入透明基板上所形成的有機EL元件等的元件內部,而可有效地抑制電極或有機層之劣化。   又,具有氣體阻障性膜與接著劑層的氣體阻障性層合體,於溫度40℃、90%RH(相對濕度)之環境下的水蒸氣透過率,以與上述為相同數值者為佳。   又,本說明書中,氣體阻障層的水蒸氣透過率,為使用氣體透過率測定裝置(mocon公司製,製品名「PERMATRAN」)所測定之值之意,使用其他廣用的水蒸氣透過率測定裝置的測定值亦顯示出相同數值。   以下,本發明之第二實施形態的氣體阻障性層合體之一態樣,例如由基材層與氣體阻障層所構成的氣體阻障性膜,本發明之氣體阻障性層合體中,接著劑層以外的詳細構成內容係如以下所示。The gas-barrier film of the gas-barrier laminate has a water vapor transmission rate of 40 ° C and 90% RH (relative humidity), preferably 0.1 g / m 2 / day or less, more preferably It is 0.05 g / m 2 / day or less, and particularly preferably 0.005 g / m 2 / day or less. When the gas barrier film has a water vapor transmission rate of 0.1 g / m 2 / day or less, when a gas barrier laminate is used, it is possible to suppress the penetration of oxygen, moisture, and the like into an organic EL element formed on a transparent substrate. Inside the device, it can effectively suppress the deterioration of the electrode or the organic layer. In addition, the gas-barrier laminate having a gas-barrier film and an adhesive layer has a water vapor transmission rate of 40 ° C and 90% RH (relative humidity), and preferably has the same value as above. . In this specification, the water vapor transmission rate of the gas barrier layer is a value measured using a gas transmission rate measuring device (manufactured by Mocon Corporation, product name "PERMATRAN"), and other widely used water vapor transmission rates are used. The measured value of the measuring device also shows the same value. Hereinafter, one aspect of the gas barrier laminate according to the second embodiment of the present invention is, for example, a gas barrier film composed of a base material layer and a gas barrier layer. In the gas barrier laminate of the present invention, The details of the structure other than the adhesive layer are as follows.

<基材層>   氣體阻障性膜所具有的基材層,以含有樹脂成分之樹脂薄膜為佳。   該樹脂成分,可列舉如,聚醯亞胺、聚醯胺、聚醯胺醯亞胺、聚苯醚、聚醚酮、聚醚醚酮、聚烯烴、聚酯、聚碳酸酯、聚碸、聚醚碸、聚苯硫醚、聚芳酯、丙烯酸系樹脂、環烯烴系聚合物、芳香族系聚合物,及聚胺基甲酸酯系聚合物等。   該些的樹脂,可單獨使用亦可、將2種以上合併使用亦可。   又,使用含有樹脂成分的樹脂薄膜時,對於樹脂薄膜之表面,以使用氧化法或凹凸化法等施予易接著處理者為佳。氧化法或凹凸化法等的具體例,係如上所述。   氣體阻障性膜所具有的基材層的厚度,並未有特別之限制,就容易處理之觀點,較佳為0.5~500μm,更佳為1~200μm、更較佳為5~100μm。<Base material layer> The base material layer included in the gas barrier film is preferably a resin film containing a resin component. Examples of the resin component include polyimide, polyimide, polyimide, polyphenylene ether, polyetherketone, polyetheretherketone, polyolefin, polyester, polycarbonate, polyfluorene, Polyether fluorene, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic polymer, polyurethane polymer, etc. These resins may be used alone or in combination of two or more. When a resin film containing a resin component is used, it is preferable that the surface of the resin film be subjected to an easy-adhesion treatment using an oxidation method or an uneven method. Specific examples of the oxidation method and the unevenness method are as described above. The thickness of the base material layer of the gadolinium gas barrier film is not particularly limited, and from the viewpoint of easy handling, it is preferably 0.5 to 500 μm, more preferably 1 to 200 μm, and still more preferably 5 to 100 μm.

<氣體阻障層>   氣體阻障性膜所具有的氣體阻障層,就可使氣體阻障性膜的厚度薄化、具有優良氣體阻障性之觀點,以無機膜,及含有高分子化合物且已施予改質處理之高分子層為佳,以該高分子層為較佳。該高分子層為氣體阻障層時,可使氣體阻障層充滿柔軟性,而可使氣體阻障性膜具有優良的屈曲耐久性。<Gas barrier layer> The gas barrier layer of a gas barrier film can reduce the thickness of the gas barrier film and have excellent gas barrier properties. From the viewpoint of an inorganic film and a polymer compound A polymer layer that has been subjected to modification treatment is preferable, and the polymer layer is more preferable. When the polymer layer is a gas barrier layer, the gas barrier layer can be filled with flexibility, and the gas barrier film can have excellent buckling durability.

高分子層所含高分子化合物,例如,聚有機矽氧烷、聚矽氮烷系化合物等的含有矽之高分子化合物、聚醯亞胺、聚醯胺、聚醯胺醯亞胺、聚苯醚、聚醚酮、聚醚醚酮、聚烯烴、聚酯、聚碳酸酯、聚碸、聚醚碸、聚苯硫醚、聚芳酯、丙烯酸系樹脂、環烯烴系聚合物、芳香族系聚合物等。   該些的高分子化合物,可單獨使用亦可、將2種以上合併使用亦可。   該些之中,就可形成具有優良氣體阻障性的氣體阻障層之觀點,高分子層所含的高分子化合物,以含有矽之高分子化合物為佳,以聚矽氮烷系化合物為較佳。   聚矽氮烷系化合物的數平均分子量,較佳為100~50,000。Polymer compounds contained in the polymer layer, for example, silicon-containing polymer compounds such as polyorganosiloxane and polysilazane-based compounds, polyimide, polyimide, polyimide, imide, and polybenzene Ether, polyetherketone, polyetheretherketone, polyolefin, polyester, polycarbonate, polyfluorene, polyetherfluorene, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic system Polymer, etc. These polymer compounds may be used alone or in combination of two or more kinds. Among these, from the viewpoint of forming a gas barrier layer having excellent gas barrier properties, the polymer compound contained in the polymer layer is preferably a polymer compound containing silicon, and a polysilazane-based compound is used as Better. The number average molecular weight of the polysilazane-based compound is preferably 100 to 50,000.

聚矽氮烷系化合物,為分子內具有含-Si-N-鍵結(矽氮烷鍵結)之重複單位的聚合物,具體而言,以具有下述通式(1)所表示之重複單位的聚合物為佳。 The polysilazane-based compound is a polymer having a repeating unit containing -Si-N-bond (silazane bond) in the molecule, and specifically, it has a repeating formula represented by the following general formula (1) Units of polymer are preferred.

上述通式(1)中、n表示重複單位之數目,為表示1以上之整數。   Rx、Ry、Rz,各自獨立表示氫原子、無取代或具有取代基之烷基、無取代或具有取代基之環烷基、無取代或具有取代基之烯基、無取代或具有取代基之芳基或烷基矽烷基。   該些之中,Rx、Ry、Rz,又以氫原子、碳數1~6之烷基,或苯基為佳,以氫原子為較佳。   又,氣體阻障層所含的高分子化合物,可為前述通式(1)中的Rx、Ry、Rz全部為氫原子之無機聚矽氮烷亦可、Rx、Ry、Rz中之至少1個為氫原子以外之基的有機聚矽氮烷亦可。In the general formula (1), n represents the number of repeating units, and is an integer representing 1 or more. Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted group Aryl or alkylsilyl. Among these, Rx, Ry, and Rz are preferably a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and more preferably a hydrogen atom. The polymer compound contained in the gas barrier layer may be an inorganic polysilazane in which all of Rx, Ry, and Rz in the general formula (1) are hydrogen atoms, and at least one of Rx, Ry, and Rz may be used. Organic polysilazanes other than a hydrogen atom may also be used.

聚矽氮烷系化合物,可單獨使用亦可、將2種以上合併使用亦可。   又,聚矽氮烷系化合物,可使用聚矽氮烷改質物,或,亦可使用市售品。The polysilazane-based compound may be used alone or in combination of two or more kinds. As the polysilazane-based compound, a polysilazane modified product may be used, or a commercially available product may be used.

前述高分子層中,除上述高分子化合物以外,於無損本發明之效果的範圍,可再含有其他成分。   其他成分,例如,硬化劑、其他高分子、抗老化劑、光安定劑、難燃劑等。   前述高分子層中的高分子化合物之含量,就作為具有更優良氣體阻障性的氣體阻障層之觀點,相對於高分子層中成分之總量(100質量%),較佳為50~100質量%,更佳為70~100質量%,特佳為80~100質量%。The polymer layer may further contain other components in addition to the polymer compound as long as the effect of the present invention is not impaired. Other ingredients, such as hardeners, other polymers, anti-aging agents, light stabilizers, flame retardants, etc. The content of the polymer compound in the polymer layer is preferably 50 to 50% of the total amount of the components in the polymer layer (100% by mass) from the viewpoint of being a gas barrier layer having more excellent gas barrier properties. 100% by mass, more preferably 70 to 100% by mass, and particularly preferably 80 to 100% by mass.

又,氣體阻障性膜所具有的高分子層的厚度,較佳為50~300nm,更佳為50~200nm。   本發明中,即使高分子層的厚度為奈米級時,亦可製得具有充份氣體阻障性的氣體阻障性層合體。The thickness of the polymer layer included in the gas barrier film is preferably 50 to 300 nm, and more preferably 50 to 200 nm. In the present invention, even when the thickness of the polymer layer is in the order of nanometers, a gas barrier laminate having sufficient gas barrier properties can be obtained.

形成高分子層之方法,例如,將含有高分子化合物中之至少1種,與所期待的其他成分,及溶劑等的高分子層形成用溶液,使用旋轉塗佈器、刮片式塗佈機、凹版塗佈機(Coater)等的公知裝置進行塗佈而形成塗膜,再使該塗膜乾燥而形成高分子層之方法等。The method for forming a polymer layer is, for example, using a spin coater or a doctor blade coater to form a polymer layer forming solution containing at least one of a polymer compound, other components expected, and a solvent. A method of applying a known device such as a gravure coater (Coater) to form a coating film, and drying the coating film to form a polymer layer.

高分子層之改質處理,例如,離子注入處理、電漿處理、紫外線照射處理,及熱處理等。該些的處理,可單獨使用1種類進行處理,或將2種類以上組合進行處理皆可。   離子注入處理,如後所述般,例如,將離子注入高分子層,使高分子層改質之方法。   電漿處理,為使高分子層曝露於電漿中,以對高分子層進行改質之方法。例如,可依特開2012-106421號公報記載之方法,進行電漿處理。   紫外線照射處理,為將紫外線照射高分子層,以對高分子層進行改質之方法。例如,可依特開2013-226757號公報記載之方法,進行紫外線改質處理。   該些之中,就不會使高分子層表面粗糙、可有效率地改質至其內部為止、形成更優良的氣體阻障性的氣體阻障層之觀點,高分子層的改質處理,以離子注入處理為佳。Polymer layer modification treatments, such as ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, and heat treatment. These processes can be performed by using one type alone or by combining two or more types. As the ion implantation treatment, as described later, for example, a method of implanting ions into a polymer layer to modify the polymer layer. Plasma treatment is a method to modify the polymer layer in order to expose the polymer layer to the plasma. For example, plasma processing can be performed according to the method described in JP 2012-106421. Ultraviolet irradiation treatment is a method of irradiating ultraviolet rays to a polymer layer to modify the polymer layer. For example, the method described in Japanese Unexamined Patent Application Publication No. 2013-226757 can be used to perform ultraviolet modification treatment. Among these, from the viewpoint that the surface of the polymer layer is not rough and can be efficiently modified to the inside thereof, a gas barrier layer having better gas barrier properties is formed, and the polymer layer is modified. An ion implantation process is preferred.

離子注入處理之際,可被注入高分子層的離子,例如,氬氣、氦、氖、氪、氙氣等的稀有氣體之離子;氟化碳、氫、氮、氧、二氧化碳、氯、氟、硫等的離子;甲烷、乙烷等的鏈烷系氣體類之離子;乙烯、丙烯等的烯系氣體類之離子;戊二烯、丁二烯等的二烯烴系氣體類之離子;乙炔等的炔系氣體類之離子;苯、甲苯等的芳香族烴系氣體類之離子;環丙烷等的環鏈烷系氣體類之離子;環戊烯等的環烯系氣體類之離子;金屬離子;有機矽化合物之離子;等。   該些離子,可單獨使用亦可、將2種以上合併使用亦可。   該些之中,就可更簡便地注入離子,特別是可製得具有優良氣體阻障性的氣體阻障層之觀點,以使用氬氣、氦、氖、氪、氙氣等的稀有氣體之離子為佳,以氬氣離子為較佳。During ion implantation, ions that can be implanted into the polymer layer, for example, ions of rare gases such as argon, helium, neon, krypton, xenon, etc .; carbon fluoride, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, Ions such as sulfur; Ions of paraffinic gases such as methane and ethane; Ions of olefin gases such as ethylene and propylene; Ions of diene gases such as pentadiene and butadiene; acetylene and others Ion of acetylene gas; ion of aromatic hydrocarbon gas such as benzene and toluene; ion of cycloalkane gas such as cyclopropane; ion of cycloolefin gas such as cyclopentene; metal ion ; Ions of organosilicon compounds; etc.离子 These ions may be used alone or in combination of two or more kinds. Among these, ions can be implanted more easily, and in particular, a gas barrier layer having excellent gas barrier properties can be prepared, and ions of rare gases such as argon, helium, neon, krypton, and xenon can be used. Preferably, argon ions are more preferred.

注入離子之方法,並未有特別之限定。例如,照射經電場加速之離子(離子束)之方法、注入電漿中之離子(生成電漿的氣體中之離子)之方法等,就可簡便地製得氣體阻障層之觀點,以使用注入電漿中之離子的方法為佳。   注入電漿中之離子的方法,例如,於含有生成電漿的氣體之氛圍下,使電漿發生,對注入離子之層施加負的高電壓脈衝,而將該電漿中之離子(陽離子),注入注入離子之層的表面部。The method of implanting ions is not particularly limited. For example, a method of irradiating ions (ion beams) accelerated by an electric field, a method of implanting ions in a plasma (ions in a plasma-generating gas), and the like can be used to easily produce a gas barrier layer for use. The method of implanting ions in the plasma is preferred. A method for implanting ions in a plasma. For example, in a plasma-containing atmosphere, a plasma is generated, a negative high-voltage pulse is applied to the ion-implanted layer, and the ions (cations) in the plasma are generated. , Implant the surface portion of the implanted ion layer.

<底漆層>   本發明之氣體阻障性層合體中,就使基材層與氣體阻障層的密著性更為提升之觀點,可於基材層與氣體阻障層之間設置底漆層。   前述底漆層,例如,使含有紫外線硬化性化合物的組成物硬化而得之層等。含有該紫外線硬化性化合物之組成物,亦可含有二氧化矽粒子等的無機填充材。   前述底漆層的厚度,較佳為0.1~10μm,更佳為0.5~5μm。<Primer layer> 中 In the gas barrier laminate of the present invention, from the viewpoint of improving the adhesion between the base material layer and the gas barrier layer, a base can be provided between the base material layer and the gas barrier layer. Paint layer. (2) The primer layer is, for example, a layer obtained by curing a composition containing an ultraviolet curable compound. The composition containing the ultraviolet curable compound may contain an inorganic filler such as silica particles. The thickness of the primer layer is preferably 0.1 to 10 μm, and more preferably 0.5 to 5 μm.

<剝離薄膜>   剝離薄膜,可使用以往公知之物。例如,於剝離薄膜用基材上,具有經由剝離劑而可實施剝離處理的剝離層者。   剝離薄膜用基材,例如,玻璃紙、塗覆紙、上質紙等的紙基材;該些的紙基材上層合聚乙烯等的熱可塑性樹脂的層合紙;由聚對酞酸乙二酯樹脂、聚對酞酸丁二酯樹脂、聚乙烯萘酯樹脂、聚丙烯樹脂、聚乙烯樹脂等所形成的塑膠薄膜;等。   剝離劑,例如,聚矽氧系樹脂、烯烴系樹脂、異戊二烯系樹脂、丁二烯系樹脂等的橡膠系彈性體、長鏈烷系樹脂、醇酸系樹脂、氟系樹脂等。<Release film> As a release film, a conventionally known thing can be used. For example, there is a release layer on a base material for a release film, which can be subjected to a release treatment via a release agent. Substrates for release films, for example, paper substrates such as cellophane, coated paper, and high-quality paper; laminated papers made of thermoplastic resins such as polyethylene laminated on these paper substrates; and polyethylene terephthalate Plastic film formed from resin, polybutylene terephthalate resin, polyethylene naphthalate resin, polypropylene resin, polyethylene resin, etc .; etc. Releasing agents include, for example, rubber-based elastomers such as silicone resins, olefin-based resins, isoprene-based resins, and butadiene-based resins, long-chain alkane-based resins, alkyd-based resins, and fluorine-based resins.

<氣體阻障性層合體之製造方法>   氣體阻障性層合體之製造方法,並未有特別之限定。例如,於先前說明的片狀接著劑之製造方法中,將1片剝離薄膜替換為氣體阻障性膜,而可製得氣體阻障性層合體。   又,於製造片狀接著劑後,將片狀接著劑所具有的2片剝離薄膜中的1片剝離,使片狀接著劑的露出面貼著於氣體阻障性膜的氣體阻障層之方式,亦可製得氣體阻障性層合體。此時,片狀接著劑,若為具有具不同黏著力的2片剝離薄膜時,就處理性之觀點,以將黏著力較小側的剝離薄膜剝離為佳。<The manufacturing method of a gas barrier laminated body> The manufacturing method of a gas barrier laminated body is not specifically limited. For example, in the method for producing a sheet-shaped adhesive described previously, a gas barrier film can be replaced with one release film to form a gas barrier laminate. After the sheet-shaped adhesive is manufactured, one of the two release films included in the sheet-shaped adhesive is peeled off, and the exposed surface of the sheet-shaped adhesive is adhered to the gas barrier layer of the gas barrier film. Method, a gas barrier laminate can also be prepared. In this case, if the sheet-shaped adhesive is two peeling films having different adhesive strengths, it is preferable to peel the peeling film on the side with a smaller adhesive strength from the viewpoint of handleability.

[密封體]   本發明之密封體,為使被密封物受到本發明之第一實施形態的片狀接著劑或本發明之第二實施形態的氣體阻障性層合體密封而形成者。   本發明之密封體,例如,為具備有透明基板等的基板,與該基板上所形成的元件(被密封物),與密封該元件的密封材料者,且前述密封材料,為本發明之第二實施形態的構成氣體阻障性層合體之接著劑層者,或本發明之第一實施形態的片狀接著劑者。[Sealing Body] The sealing body of the present invention is formed by sealing the object to be sealed with the sheet-shaped adhesive of the first embodiment of the present invention or the gas barrier laminate of the second embodiment of the present invention. The sealing body of the present invention includes, for example, a substrate including a transparent substrate, a component (an object to be sealed) formed on the substrate, and a sealing material for sealing the component, and the sealing material is the first aspect of the present invention. A person constituting the adhesive layer of the gas barrier laminate according to the second embodiment, or a sheet adhesive according to the first embodiment of the present invention.

透明基板,並未有特別限定之物,而可使用各種基板材料。特別是以使用對可見光具有高透過率的基板材料為佳。又,以使用具有可阻斷由元件外部滲入之水份或氣體的具有高遮斷性能,且具有優良的耐溶劑性或耐候性的材料為佳。   具體而言,例如,石英或玻璃等之透明無機材料;聚對酞酸乙二酯、聚乙烯萘酯、聚碳酸酯、聚苯乙烯、聚乙烯、聚丙烯、聚苯硫醚、聚氟化亞乙烯、乙醯纖維素、溴化苯氧酯、芳香族聚醯胺類、聚醯亞胺類、聚苯乙烯類、聚芳酯類、聚碸類、聚烯烴類等之透明塑膠、前述氣體阻障性膜;等。   透明基板的厚度並未有特別之限制,可於考量光的透過率,或遮斷元件內外之性能中,作適當之選擇。The transparent substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having high transmittance to visible light. In addition, it is preferable to use a material having a high blocking performance that can block moisture or gas infiltrated from the outside of the device and has excellent solvent resistance or weather resistance. Specifically, for example, transparent inorganic materials such as quartz or glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polyphenylene sulfide, polyfluorinated Transparent plastics such as vinylene, ethyl cellulose, phenoxy bromide, aromatic polyamines, polyimides, polystyrenes, polyarylates, polyfluorenes, polyolefins, etc. Gas barrier film; etc. The thickness of the transparent substrate is not particularly limited, and it can be appropriately selected in consideration of the light transmittance or the performance of blocking the inside and outside of the element.

被密封物,例如,有機EL元件、有機EL顯示器元件、液晶顯示器元件、太陽能電池元件等的電子裝置等。   即,本發明之密封體,以有機EL元件、有機EL顯示器元件、液晶顯示器元件,或太陽能電池元件等的電子裝置,被例如本發明之第二實施形態的氣體阻障性層合體密封而得者為佳。The object to be sealed is, for example, an electronic device such as an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element. That is, the sealing body of the present invention is obtained by sealing an electronic device such as an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element with the gas barrier laminate of the second embodiment of the present invention. Those are better.

本發明之密封體之製造方法,並未有特別之限定。例如,可將本發明之第二實施形態的氣體阻障性層合體之接著劑層,被覆於被密封物的表面及被密封物的周邊部之基板表面後,經由加熱,而使氣體阻障性層合體的接著劑層與被密封物的表面及被密封物之周邊部的基板表面接著。   又,例如,將本發明之第一實施形態的片狀接著劑,被覆被密封物的表面及被密封物的周邊部之基板表面後,經由加熱,而使片狀接著劑與被密封物之表面及被密封物的周邊部之基板表面接著。此時,亦可將片狀接著劑上的層合上述氣體阻障層之密封片(例如,具有剝離薄膜/氣體阻障層/片狀接著劑/剝離薄膜之層構成的密封片)的片狀接著劑側之剝離薄膜去除後,再進行密封。   其次,經由使該接著劑層硬化,而可製得本發明之密封體。The manufacturing method of the sealing body of this invention is not specifically limited. For example, the adhesive layer of the gas barrier laminate according to the second embodiment of the present invention can be coated on the surface of the sealed object and the substrate surface of the peripheral portion of the sealed object and then heated to block the gas. The adhesive layer of the laminated body is adhered to the surface of the object to be sealed and the substrate surface at the peripheral portion of the object to be sealed. In addition, for example, the sheet-shaped adhesive of the first embodiment of the present invention covers the surface of the object to be sealed and the substrate surface of the peripheral portion of the object to be sealed, and then heats the sheet-shaped adhesive to the object to be sealed. The surface and the substrate surface of the periphery of the object to be sealed are adhered. At this time, a sheet of a sealing sheet (for example, a sealing sheet having a release film / gas barrier layer / sheet-shaped adhesive / release film layer) laminated on the sheet-shaped adhesive may be used as the sheet. After the release film on the adhesive side is removed, sealing is performed. Secondly, the adhesive layer of the present invention can be obtained by hardening the adhesive layer.

使氣體阻障性層合體之接著劑層或片狀接著劑與被密封物接著之際的接著條件,並未有特別之限定。接著溫度,例如,23~100℃,較佳為40~80℃。該接著處理,可於加壓中進行。使接著劑層或片狀接著劑硬化時的硬化條件,並未有特別之限定,可於考量改質聚烯烴系樹脂(A)所具有的交聯性官能基與熱硬化性成分(B)進行交聯反應之程度作適當之設定。例如,改質聚烯烴系樹脂(A)為酸改質聚烯烴系樹脂時,加熱溫度通常為80~200℃(較佳為90~150℃),加熱時間通常為30分鐘~12小時(較佳為1~6小時)。There are no particular restrictions on the bonding conditions for bonding the adhesive layer or sheet-shaped adhesive of the gas barrier laminate to the object to be sealed. The next temperature is, for example, 23 to 100 ° C, and preferably 40 to 80 ° C. This subsequent treatment can be performed under pressure. The curing conditions for curing the adhesive layer or the sheet-shaped adhesive are not particularly limited, and the crosslinkable functional group and the thermosetting component (B) of the modified polyolefin resin (A) can be considered in consideration of the modification. The degree to which the crosslinking reaction proceeds is appropriately set. For example, when the modified polyolefin resin (A) is an acid-modified polyolefin resin, the heating temperature is usually 80 to 200 ° C (preferably 90 to 150 ° C), and the heating time is usually 30 minutes to 12 hours (compared with It is preferably 1 to 6 hours).

[實施例][Example]

以下,將列舉實施例對本發明做更詳細的說明。但本發明並不受以下實施例的任何限定。   又,改質聚烯烴系樹脂(A)及熱硬化性成分(B)的多官能環氧化合物之重量平均分子量(Mw),為依以下方法所測定之值。 <改質聚烯烴系樹脂(A)之重量平均分子量(Mw)>   改質聚烯烴系樹脂(A)之重量平均分子量(Mw),為使用凝膠滲透色層分析儀(GPC)裝置(東曹股份有限公司製,製品名「HLC-8320」),依下述條件下進行測定,並換算為標準聚苯乙烯之重量平均分子量所得之值。 (測定條件)   ・測定試料:樣品濃度1質量%之四氫呋喃溶液   ・管柱:「TSK gel Super HM-H」2管、「TSK gel Super H2000」1管(皆為東曹股份有限公司製),依序連結而得者   ・管柱溫度:40℃   ・展開溶劑:四氫呋喃   ・流速:0.60mL/min <多官能環氧化合物之重量平均分子量(Mw)>   多官能環氧化合物之重量平均分子量(Mw),為使用上述凝膠滲透色層分析儀(GPC)裝置,於上述條件下測定,於觀察到的多數波峰中,對應於面積最大的波峰之波峰頂部的保持時間之換算為標準聚苯乙烯之重量平均分子量之值。Hereinafter, the present invention will be described in more detail with examples. However, the present invention is not limited in any way by the following examples. In addition, the weight average molecular weight (Mw) of the polyfunctional epoxy compound of the modified polyolefin resin (A) and the thermosetting component (B) is a value measured by the following method. <Weight average molecular weight (Mw) of modified polyolefin resin (A)> Weight average molecular weight (Mw) of modified polyolefin resin (A) is a gel permeation chromatography (GPC) device (East (Product name: "HLC-8320", manufactured by Cao Co., Ltd.), measured under the following conditions, and converted to a value obtained by weight average molecular weight of standard polystyrene. (Measuring conditions) Measurement sample: Tetrahydrofuran solution with a sample concentration of 1% by mass. Column: 2 tubes "TSK gel Super HM-H", 1 tube "TSK gel Super H2000" (all manufactured by Tosoh Corporation), Those obtained by sequential connection. • Column temperature: 40 ° C. • Development solvent: Tetrahydrofuran. • Flow rate: 0.60mL / min. <Weight average molecular weight (Mw) of polyfunctional epoxy compound> 之 Weight average molecular weight (Mw) of polyfunctional epoxy compound. ), Measured using the above-mentioned gel permeation chromatography (GPC) device under the above conditions, and among the observed peaks, the retention time of the peak corresponding to the peak with the largest area is converted into standard polystyrene Weight average molecular weight.

實施例1~4、比較例1~2 (1)接著劑組成物之製造   依表1記載之添加量(有效成分比)添加下述所示各成分,使用甲基乙基酮稀釋,分別製得有效成分濃度18質量%之接著劑組成物。   所使用的各成分之詳細內容,係如以下所示。   ・改質聚烯烴系樹脂(A):三井化學股份有限公司製,製品名「UNISTOLEH-200」,酸改質α-烯烴聚合物、25℃下為固體、重量平均分子量(Mw)=47,000。   ・熱硬化性成分(B):   多官能環氧化合物(1):三菱化學股份有限公司製,製品名「YX8034」,氫化雙酚A二縮水甘油醚、環氧當量=270g/eq、重量平均分子量(Mw)=3,200。   多官能環氧化合物(2):三菱化學股份有限公司製,製品名「YX8000」,氫化雙酚A二縮水甘油醚、環氧當量=205g/eq、重量平均分子量(Mw)=1,400。   多官能環氧化合物(3):三菱化學股份有限公司製,製品名「YX8040」,氫化雙酚A二縮水甘油醚、環氧當量=1100g/eq、重量平均分子量(Mw)=4,200。   多官能環氧化合物(4):共榮社化學股份有限公司製,製品名「EPOLIGHT 4000」,氫化雙酚A二縮水甘油醚、環氧當量=215~245g/eq、重量平均分子量(Mw)=800。   ・矽烷耦合劑(C):信越化學工業股份有限公司製,製品名「KBM-4803」,環氧丙氧基辛基三甲氧基矽烷。   ・咪唑系硬化觸媒(D):四國化成工業股份有限公司製,製品名「QAZO 2E4MZ」,2-乙基-4-甲基咪唑。   ・增黏劑(E):三井化學股份有限公司製,製品名「FTR6100」,苯乙烯系單體與脂肪族系單體之共聚物、軟化點=95℃。Examples 1 to 4 and Comparative Examples 1 to 2 (1) Manufacture of the adhesive composition According to the addition amount (effective ingredient ratio) described in Table 1, each component shown below was added, diluted with methyl ethyl ketone, and separately prepared. An adhesive composition having an active ingredient concentration of 18% by mass was obtained. The details of each component used are shown below. • Modified polyolefin resin (A): manufactured by Mitsui Chemicals Co., Ltd., product name "UNISTOLEH-200", acid modified α-olefin polymer, solid at 25 ° C, weight average molecular weight (Mw) = 47,000.・ Thermosetting component (B): Polyfunctional epoxy compound (1): Mitsubishi Chemical Corporation, product name "YX8034", hydrogenated bisphenol A diglycidyl ether, epoxy equivalent weight = 270 g / eq, weight average Molecular weight (Mw) = 3,200. Polyfunctional epoxy compound (2): manufactured by Mitsubishi Chemical Corporation, product name "YX8000", hydrogenated bisphenol A diglycidyl ether, epoxy equivalent = 205 g / eq, weight average molecular weight (Mw) = 1,400. Polyfunctional epoxy compound (3): manufactured by Mitsubishi Chemical Corporation, product name "YX8040", hydrogenated bisphenol A diglycidyl ether, epoxy equivalent weight = 1100 g / eq, weight average molecular weight (Mw) = 4,200. Polyfunctional epoxy compound (4): manufactured by Kyoeisha Chemical Co., Ltd., product name "EPOLIGHT 4000", hydrogenated bisphenol A diglycidyl ether, epoxy equivalent weight = 215 to 245 g / eq, weight average molecular weight (Mw) = 800.矽 Silane coupling agent (C): manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-4803", glycidyl octyl trimethoxysilane. · Imidazole-based hardening catalyst (D): manufactured by Shikoku Chemical Industry Co., Ltd., product name "QAZO 2E4MZ", 2-ethyl-4-methylimidazole. Tackifier (E): Made by Mitsui Chemicals Co., Ltd., product name "FTR6100", copolymer of styrene monomer and aliphatic monomer, softening point = 95 ° C.

(2)片狀接著劑之製造   於剝離薄膜(琳德股份有限公司製,製品名「SP-PET382150」)的剝離處理面上,塗佈所製得之接著劑組成物而形成塗膜,該塗膜於100℃下進行2分鐘乾燥,製得厚度10μm的片狀接著劑。此外,於該片狀接著劑的露出面與上述相同般貼合剝離薄膜的剝離處理面,而製得被剝離薄膜挾持的片狀接著劑。(2) Production of a sheet-like adhesive on a release-treated surface of a release film (manufactured by Linde Corporation, product name "SP-PET382150"), applying the prepared adhesive composition to form a coating film, The coating film was dried at 100 ° C. for 2 minutes to obtain a sheet-shaped adhesive having a thickness of 10 μm. In addition, the release-treated surface of the release film was bonded to the exposed surface of the sheet-shaped adhesive in the same manner as described above, and a sheet-shaped adhesive held by the release film was obtained.

(3)黏著力測定用試驗片之製造   將上述(2)中所得之被剝離薄膜挾持的片狀接著劑的一側的剝離薄膜去除,將兩面施予易接著處理的厚度50μm之聚對酞酸乙二酯膜(東洋紡股份有限公司製,製品名「PET50A4300」)作為基材薄膜,使用熱輥式的加熱層合器,於溫度60℃、壓力0.2MPa,及速度0.2m/min之條件,將該基材薄膜與片狀接著劑之露出面貼合,而製得黏著力測定用試驗片。(3) Manufacture of test piece for measuring adhesive force The peeling film on one side of the sheet-shaped adhesive held by the peeling film obtained in the above (2) was removed, and 50 μm-thick polyparaphthalein was easily applied on both sides. Ethylene glycol film (manufactured by Toyobo Co., Ltd., product name "PET50A4300") as a base film, using a hot-roller heating laminator, at a temperature of 60 ° C, a pressure of 0.2MPa, and a speed of 0.2m / min Then, the base film and the exposed surface of the sheet-shaped adhesive were bonded to each other to prepare a test piece for measuring adhesion.

使用實施例及比較例所製得的上述片狀接著劑及黏著力測定用試驗片,進行以下的測定及評估。該些結果係如表1所示。The following measurement and evaluation were performed using the above-mentioned sheet-like adhesives prepared in the examples and comparative examples and the test pieces for measuring the adhesive force. These results are shown in Table 1.

[片狀接著劑的釋氣產生量之測定]   將實施例及比較例所製得之經剝離薄膜挾持的片狀接著劑的一側之剝離薄膜去除,並以該片狀接著劑的露出面與玻璃板為對向之方式,將該片狀接著劑置於玻璃板上,使用加熱層合器,於60℃下進行接著。隨後,將該片狀接著劑的另一側之剝離薄膜去除,製得釋氣產生量測定用樣品。   使用下述裝置測定該釋氣產生量測定用樣品,於120℃之環境下靜置20分鐘時的釋氣產生量。   ・裝置:氣體色層分析質量分析計(島津製作所股份有限公司製,製品名「GCMS-QP2010」)。   ・管柱:5MS系管柱(島津製作所股份有限製,製品名「SH-Rtx(註冊商標)-5MS」,5%二苯基/95%二甲基聚矽氧烷)。   ・檢量線:甲苯。[Measurement of outgassing amount of sheet adhesive] 状 Remove the release film on one side of the sheet adhesive held by the release film held in the examples and comparative examples, and use the exposed surface of the sheet adhesive This sheet-shaped adhesive was placed on the glass plate so as to face the glass plate, and was bonded at 60 ° C. using a heating laminator. Subsequently, the release film on the other side of the sheet-shaped adhesive was removed to prepare a sample for measuring outgassing amount. (2) The sample for measuring the outgassing amount was measured using the following device, and the amount of outgassing when the sample was left standing at 120 ° C for 20 minutes. Equipment: Gas chromatography analysis mass analyzer (manufactured by Shimadzu Corporation, product name "GCMS-QP2010").管 ・ Column: 5MS series column (Shimadzu Corporation has limited shares, product name "SH-Rtx (registered trademark)-5MS", 5% diphenyl / 95% dimethylpolysiloxane).检 ・ Calibration line: Toluene.

[黏著力測定]   將依實施例及比較例所製得的黏著力測定用試驗片,切出寬25mm的短冊形狀後,去除剝離薄膜。隨後,於溫度60℃、壓力0.2MPa,及速度0.2m/min之條件下,使用層合器裝置,以軋輥,將黏著力測定用試驗片押向玻璃板,使黏著力測定用試驗片的片狀接著劑之露出面貼合於玻璃板,而製得玻璃板與測定用試驗片的層合體。其後,將該層合體於100℃下加熱2小時,使片狀接著劑硬化,製得黏著力測定用樣品。   將所製得之層合體,於23℃50%RH(相對濕度)之環境下保管24小時後,對該黏著力測定用樣品,去除上述貼附條件等之後,其他根據JIS Z0237:2000記載之測量方法,測量黏著力。具體而言,為將黏著力測定用試驗片,使用180°拉伸剝離法,以剝離速度300mm/分鐘之速度由玻璃板剝離,以測量其黏著力。[Adhesion measurement] (1) A test piece for adhesion measurement prepared in accordance with the examples and comparative examples was cut out into a booklet shape having a width of 25 mm, and then the release film was removed. Subsequently, at a temperature of 60 ° C., a pressure of 0.2 MPa, and a speed of 0.2 m / min, using a laminator device, the test piece for measuring the adhesive force was pressed against the glass plate with a roller, and the test piece for measuring the adhesive force was pressed. The exposed surface of the sheet-shaped adhesive was bonded to a glass plate to obtain a laminate of the glass plate and a test piece for measurement. Then, this laminated body was heated at 100 degreeC for 2 hours, the sheet-like adhesive was hardened, and the sample for adhesive force measurement was prepared. After the prepared laminate was stored in an environment of 23 ° C and 50% RH (relative humidity) for 24 hours, the adhesion measurement sample was removed from the above-mentioned attaching conditions, and the others were described in accordance with JIS Z0237: 2000 Measurement method to measure adhesion. Specifically, in order to measure the adhesive force, a test piece for measuring adhesive force was peeled from a glass plate at a peeling speed of 300 mm / minute using a 180 ° tensile peeling method.

[密封性評估] (i)有機EL元件之製造   使用陽極為形成膜的氧化銦錫(ITO)膜(厚度:100nm、薄片電阻:50Ω/□)之玻璃基板,依以下方法製得有機EL元件。   於前述玻璃基板的ITO膜上,以0.1~0.2nm/分鐘之速度蒸鍍N,N’-雙(萘-1-基)-N,N’-雙(苯基)-聯苯胺(Luminescence Technology公司製),而形成厚度50nm的電洞輸送層。   隨後,於所形成的電洞輸送層上,以0.1~0.2nm/分鐘之速度蒸鍍參(8-羥基-喹啉酸酯)鋁(Luminescence Technology公司製),而形成厚度50nm的發光層。   隨後,於所形成的發光層上,以0.1nm/分鐘之速度蒸鍍氟化鋰(LiF)(高純度化學研究所公司製),而形成厚度4nm的電子注入層。   最後,於所形成的電子注入層上,以0.1nm/分鐘之速度蒸鍍鋁(Al)(高純度化學研究所公司製),而形成厚度100nm的陰極,而製得有機EL元件。   又,蒸鍍時之真空度,全部為1×10-4 Pa以下。[Evaluation of Sealability] (i) Manufacture of organic EL element An organic EL element was prepared by using a glass substrate with an indium tin oxide (ITO) film (thickness: 100 nm, sheet resistance: 50 Ω / □) as the anode to form a film. . N, N'-bis (naphthalene-1-yl) -N, N'-bis (phenyl) -benzidine was deposited on the ITO film of the glass substrate at a rate of 0.1 to 0.2 nm / minute (Luminescence Technology (Manufactured by the company) to form a hole transport layer having a thickness of 50 nm. Subsequently, on the formed hole-transporting layer, ginseng (8-hydroxy-quinolinate) aluminum (manufactured by Luminescence Technology) was vapor-deposited at a rate of 0.1 to 0.2 nm / minute to form a light-emitting layer having a thickness of 50 nm. Subsequently, lithium fluoride (LiF) (manufactured by High Purity Chemical Research Institute) was vapor-deposited on the formed light emitting layer at a rate of 0.1 nm / minute to form an electron injection layer having a thickness of 4 nm. Finally, on the formed electron injection layer, aluminum (Al) (manufactured by High Purity Chemical Research Institute) was vapor-deposited at a rate of 0.1 nm / minute to form a cathode having a thickness of 100 nm, thereby obtaining an organic EL device. The degree of vacuum at the time of vapor deposition was all 1 × 10 -4 Pa or less.

(ii)電子裝置之製造   將實施例及比較例所製得的被剝離薄膜挾持的片狀接著劑的一側之剝離薄膜去除,將片狀接著劑的露出面與金屬箔薄膜重疊,使用加熱層合器,於40℃下接著。   隨後,將片狀接著劑的另一側的剝離薄膜去除,將片狀接著劑的露出面,以包覆玻璃基板上所形成的有機EL元件,也包含玻璃基板表面之方式層合,使用加熱層合器,於40℃下接著。其次,於100℃下進行2小時加熱,使片狀接著劑硬化,而製得密封有機EL元件的密封體之底部排放型電子裝置。(ii) Manufacturing of electronic devices Remove the release film on one side of the sheet-shaped adhesive held by the release film prepared in the examples and comparative examples, overlap the exposed surface of the sheet-shaped adhesive with the metal foil film, and apply heat Laminator, followed at 40 ° C. Subsequently, the release film on the other side of the sheet-shaped adhesive is removed, and the exposed surface of the sheet-shaped adhesive is laminated so as to cover the organic EL element formed on the glass substrate and also include the surface of the glass substrate, and is heated using Laminator, followed at 40 ° C. Next, the sheet-shaped adhesive was hardened by heating at 100 ° C for 2 hours to obtain a bottom-emission type electronic device that sealed the sealing body of the organic EL element.

(iii)密封性評估   將所製得之電子裝置,於85℃、85%RH(相對濕度)之環境下,靜置240小時後,起動電子裝置,測定有機EL元件的黑點(Dark Sport)(無發光處)之面積S1 。   於靜置上述環境下之前,預先測定有機EL元件的黑點之面積S0 ,並依下述式算出黑點之擴大率(Sm)。   ・Sm(%)=S1 /S0 ×100   又,依以下之基準,評估密封片的密封性。   A:黑點之擴大率(Sm)未達150%。   B:黑點之擴大率(Sm)為150%以上。   又,黑點之擴大率(Sm),其數值越大時,表示電極或有機層的劣化正在進行中之意。(iii) Evaluation of tightness The obtained electronic device was left to stand in an environment of 85 ° C. and 85% RH (relative humidity) for 240 hours, and then the electronic device was started to measure the dark point (Dark Sport) of the organic EL element. (No light emitting area) area S 1 . Before leaving in the above environment, the area S 0 of the black dots of the organic EL element was measured in advance, and the enlargement ratio (Sm) of the black dots was calculated according to the following formula.・ Sm (%) = S 1 / S 0 × 100 The sealability of the sealing sheet was evaluated based on the following criteria. A: The enlargement rate (Sm) of the black dot is less than 150%. B: The enlargement ratio (Sm) of the black dot is 150% or more. In addition, the larger the value of the black dot expansion ratio (Sm), the higher the value, indicating that the deterioration of the electrode or the organic layer is in progress.

由表1得知以下結論。   由實施例3、4與比較例2之釋氣量得知,即使片狀接著劑中的多官能環氧化合物之含量為相同,但其重量平均分子量(Mw)越小時,其釋氣量越大。   又,由實施例1、2與實施例3、4之釋氣量得知,即使片狀接著劑中的多官能環氧化合物為相同,但其含量越少時,其釋氣量亦越小。   此外,由實施例1,2與比較例1之硬化後黏著力得知,多官能環氧化合物的環氧當量越小、多官能環氧化合物之重量平均分子量(Mw)越小時,其硬化後的黏著力越大,特別是多官能環氧化合物的環氧當量越小時,硬化後黏著力越容易變大。The following conclusions are obtained from Table 1. It is known from the outgassing amounts of Examples 3, 4 and Comparative Example 2 that even if the content of the polyfunctional epoxy compound in the sheet-shaped adhesive is the same, the smaller the weight average molecular weight (Mw), the greater the outgassing amount. In addition, it is known from the outgassing amounts of Examples 1 and 2 and Examples 3 and 4 that even if the polyfunctional epoxy compound in the sheet-shaped adhesive is the same, the smaller the content, the smaller the outgassing amount. In addition, from the adhesive strength after curing in Examples 1, 2 and Comparative Example 1, it is known that the smaller the epoxy equivalent of the polyfunctional epoxy compound and the smaller the weight average molecular weight (Mw) of the polyfunctional epoxy compound, the harder the polyfunctional epoxy compound is after curing. The greater the adhesive strength of the epoxy resin, especially the smaller the epoxy equivalent of the multifunctional epoxy compound, the more easily the adhesive strength becomes larger after curing.

Claims (20)

一種片狀接著劑,其係由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成者,且滿足下述要件(I)及(II);   要件(I):將前述片狀接著劑在120℃環境下靜置20分鐘後之每1cm3 之釋氣產生量為20mg/cm3 以下;   要件(II):在溫度60℃、壓力0.2MPa、及速度0.2m/min之條件下,以軋輥,將在厚度50μm之聚對酞酸乙二酯膜上已貼附前述片狀黏著劑之層合體押向玻璃板而貼合前述層合體之前述片狀黏著劑側之面與前述玻璃板,並在100℃2小時之條件下使前述片狀接著劑硬化後,在23℃相對濕度50%之環境下保管24小時後,在剝離速度300mm/min及剝離角度180°之條件下根據JIS Z0237:2000所測量之來自前述玻璃板之前述層合體之黏著力為10N/25mm以上。A sheet-shaped adhesive formed from an adhesive composition containing a modified polyolefin resin (A) and a thermosetting component (B), and satisfying the following requirements (I) and (II); (I): The amount of outgassing per 1 cm 3 after the sheet adhesive is left to stand at 120 ° C for 20 minutes is 20 mg / cm 3 or less; requirement (II): at a temperature of 60 ° C, a pressure of 0.2 MPa, Under the condition of a speed of 0.2 m / min and a roll, a laminate having a thickness of 50 μm on a polyethylene terephthalate film to which the aforementioned sheet-shaped adhesive has been pasted is pressed onto a glass plate to adhere the aforementioned laminate. After the sheet-shaped adhesive side surface and the glass plate were cured at 100 ° C for 2 hours, the sheet-shaped adhesive was cured for 24 hours at 23 ° C and 50% relative humidity, and then the peeling speed was 300 mm / The adhesive force of the aforementioned laminated body from the aforementioned glass plate as measured in accordance with JIS Z0237: 2000 under the conditions of min and a peeling angle of 180 ° is 10 N / 25 mm or more. 如請求項1之片狀接著劑,其中熱硬化性成分(B)包含多官能環氧化合物。The sheet-shaped adhesive according to claim 1, wherein the thermosetting component (B) contains a polyfunctional epoxy compound. 如請求項2之片狀接著劑,其中前述多官能環氧化合物之環氧當量為100~300g/eq。The sheet-like adhesive according to claim 2, wherein the epoxy equivalent of the aforementioned multifunctional epoxy compound is 100 to 300 g / eq. 如請求項1~3中任一項之片狀接著劑,其中改質聚烯烴系樹脂(A)為酸改質聚烯烴系樹脂。The sheet-shaped adhesive according to any one of claims 1 to 3, wherein the modified polyolefin resin (A) is an acid-modified polyolefin resin. 如請求項1~3中任一項之片狀接著劑,其中相對於前述接著劑組成物之有效成分之總量,改質聚烯烴系樹脂(A)之含量為15~95質量%。The sheet-shaped adhesive according to any one of claims 1 to 3, wherein the content of the modified polyolefin-based resin (A) is 15 to 95% by mass based on the total amount of the active ingredients of the adhesive composition. 如請求項1~3中任一項之片狀接著劑,其中相對於前述改質聚烯烴系樹脂(A)100質量份,前述熱硬化性成分(B)之含量為5~150質量份。The sheet-shaped adhesive according to any one of claims 1 to 3, wherein the content of the thermosetting component (B) is 5 to 150 parts by mass based on 100 parts by mass of the modified polyolefin-based resin (A). 如請求項1~3中任一項之片狀接著劑,其中更含有矽烷耦合劑(C)。The sheet-shaped adhesive according to any one of claims 1 to 3, further comprising a silane coupling agent (C). 如請求項7之片狀接著劑,其中相對於改質聚烯烴系樹脂(A)100質量份,矽烷耦合劑(C)之含量為0.01~10質量份。The sheet-shaped adhesive according to claim 7, wherein the content of the silane coupling agent (C) is 0.01 to 10 parts by mass based on 100 parts by mass of the modified polyolefin resin (A). 一種氣體阻障性層合體,其係包含:具有基材層之氣體阻障性膜與接著劑層,   該接著劑層係由片狀接著劑所構成,該片狀接著劑係由含有改質聚烯烴系樹脂(A)及熱硬化性成分(B)之接著劑組成物所形成者,   並且滿足下述要件(I)及(IIa);   要件(I):將前述片狀接著劑在120℃環境下靜置20分鐘後之每1cm3 之釋氣產生量為20mg/cm3 以下   要件(IIa):在溫度60℃、壓力0.2MPa、及速度0.2 m/min之條件下,以軋輥,將前述氣體阻障性層合體押向玻璃板而貼合前述氣體阻障性層合體之前述片狀接著劑與前述玻璃板,並在100℃2小時之條件下使前述片狀接著劑硬化後,在23℃相對濕度50%之環境下保管24小時後,在剝離速度300mm/min及剝離角度180°之條件下根據JIS Z0237:2000所測量之來自前述玻璃板之前述層合體之黏著力為10N/25mm以上。A gas barrier laminate comprising a gas barrier film having a substrate layer and an adhesive layer, the adhesive layer is composed of a sheet adhesive, and the sheet adhesive is modified A polyolefin resin (A) and a thermosetting component (B) adhesive composition formed, and satisfy the following requirements (I) and (IIa); requirement (I): the aforementioned sheet-shaped adhesive is 120 After standing for 20 minutes at ℃, the outgassing amount per 1cm 3 is below 20mg / cm 3 (IIa): under the conditions of a temperature of 60 ° C, a pressure of 0.2MPa, and a speed of 0.2 m / min, using a roller, The gas barrier laminate is pressed onto a glass plate, the sheet adhesive and the glass plate of the gas barrier laminate are bonded, and the sheet adhesive is cured at 100 ° C for 2 hours. After 24 hours of storage in an environment with a relative humidity of 50% at 23 ° C, the adhesion force of the aforementioned laminated body from the aforementioned glass plate measured according to JIS Z0237: 2000 under the conditions of a peeling speed of 300 mm / min and a peeling angle of 180 ° is 10N / 25mm or more. 如請求項9之氣體阻障性層合體,其中熱硬化性成分(B)包含多官能環氧化合物。The gas barrier laminate according to claim 9, wherein the thermosetting component (B) contains a polyfunctional epoxy compound. 如請求項10之氣體阻障性層合體,其中前述多官能環氧化合物之環氧當量為100~300g/eq。The gas barrier laminate according to claim 10, wherein the epoxy equivalent of the aforementioned multifunctional epoxy compound is 100 to 300 g / eq. 如請求項9~11中任一項之氣體阻障性層合體,其中改質聚烯烴系樹脂(A)為酸改質聚烯烴系樹脂。The gas barrier laminate according to any one of claims 9 to 11, wherein the modified polyolefin resin (A) is an acid modified polyolefin resin. 如請求項9~11中任一項之氣體阻障性層合體,其中相對於前述接著劑組成物之有效成分之總量,改質聚烯烴系樹脂(A)之含量為15~95質量%。The gas barrier laminate according to any one of claims 9 to 11, wherein the content of the modified polyolefin-based resin (A) is 15 to 95% by mass based on the total amount of the active ingredients of the adhesive composition. . 如請求項9~11中任一項之氣體阻障性層合體,其中相對於前述改質聚烯烴系樹脂(A)100質量份,前述熱硬化性成分(B)之含量為5~150質量份。The gas barrier laminate according to any one of claims 9 to 11, wherein the content of the thermosetting component (B) is 5 to 150 masses based on 100 parts by mass of the modified polyolefin resin (A). Serving. 如請求項9~11中任一項之氣體阻障性層合體,其中更含有矽烷耦合劑(C)。The gas barrier laminate according to any one of claims 9 to 11, further comprising a silane coupling agent (C). 如請求項15之氣體阻障性層合體,其中相對於改質聚烯烴系樹脂(A)100質量份,矽烷耦合劑(C)之含量為0.01~10質量份。The gas barrier laminate according to claim 15, wherein the content of the silane coupling agent (C) is 0.01 to 10 parts by mass based on 100 parts by mass of the modified polyolefin resin (A). 如請求項9~11中任一項之氣體阻障性層合體,其中前述氣體阻障性膜具有前述基材層及氣體阻障層,   前述氣體阻障層為含有高分子化合物的已施加改質處理之高分子層。For example, the gas barrier laminate according to any one of claims 9 to 11, wherein the gas barrier film has the substrate layer and the gas barrier layer, and the gas barrier layer is a modified compound containing a polymer compound. Quality polymer layer. 如請求項17之氣體阻障性層合體,其中前述氣體阻障層與前述接著劑層係經直接層合者。The gas barrier laminate according to claim 17, wherein the gas barrier layer and the adhesive layer are directly laminated. 一種密封體,其特徵為被密封物係將如請求項1~3中任一項之片狀接著劑,或,如請求項9~11中任一項之氣體阻障性層合體所具有之接著劑層作為密封材料並受到密封而成。A sealed body characterized in that the material to be sealed will have a sheet-like adhesive as in any of claims 1 to 3, or a gas barrier laminate as in any of claims 9 to 11 The adhesive layer serves as a sealing material and is sealed. 如請求項19之密封體,其中前述被密封物為有機EL元件、有機EL顯示器元件、液晶顯示器元件,或太陽能電池元件。The sealing body according to claim 19, wherein the sealed object is an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element.
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