TW201902320A - Lay-up method and pre fixation device of multilayer circuit board - Google Patents

Abstract

A lay-up method and pre fixation device of multilayer circuit board, the lay-up method includes; forming positioning holes in a multilayer board, encapsulating glue in the positioning holes, hardening the glue of the positioning holes, and complete the pre fixation of the multilayer board to making the hardened glue position between the inner layers of the multilayer board. The pre fixation device includes a fixture, the fixture corresponds to install the positioning holes of the multilayer board, and the fixture inside set with at least one tools, the tool complete the pre fixation of the multilayer board by using the lay-up method.

Description

Multilayer circuit board stacking method and pre-fixing device thereof

Multi-layer circuit board stacking method and pre-fixing device thereof, especially a high-layer board pre-fixed by a laminating method, which can solve the problem of sliding or short-circuiting when multi-layer circuit board is pressed, and a multi-layer circuit board superposing method It is pre-fixed.

At present, in the lamination process of a multi-layer circuit board, a high-rise board including a plurality of layers such as an inner layer board, a film, and a copper foil is pre-fixed by a stacking process, so that the high-rise board is provided with a multi-layer circuit board. The functional characteristics of the design, orientation, position, etc., and in subsequent thermal compression processes, these functional features must be maintained to complete the designed multilayer board. However, the pre-fixed pre-fixing methods used today, for example, document holder fixing, tape fixing, rivet fixing, heat riveting, high-frequency fixing or special fixture fixing, are still in the subsequent thermocompression bonding process. There are problems such as protruding rivet head, rupture and deformation of rivet, generation of metal dust, incomplete melting and curing resin, etc., resulting in insufficient press-fitting precision of multilayer circuit board, short-circuit of metal dust contamination, failure of pre-fixed position slip, and damage of pressed steel plate Such as missing, the multi-layer circuit board pressing process can not effectively improve the efficiency, reduce the cost, time and effort, and effectively overcome the above-mentioned defects and drawbacks, in order to effectively improve the compression performance of the multilayer circuit board, and make the multilayer circuit The quality of the board meets the increasingly complex functional requirements.

In view of the above, it is necessary to provide a multilayer circuit board stacking method and a pre-fixing device thereof which can avoid insufficient press-fitting precision, metal powder contamination short-circuit, pre-fixed position slip failure, and damage of the pressed steel sheet.

A multi-layer circuit board superposing method and a pre-fixing device thereof, the superimposing method comprising: presetting an alignment hole and a positioning hole in an inner layer plate and a film of a high-rise board, and superposing the alignment holes by the alignment holes And filling the positioning hole with the glue; and hardening the colloid in the positioning hole; to complete the pre-fixing of the high-rise plate, the hardened colloid is located between the inner layers of the high-rise plate. The pre-fixing device includes a clamp corresponding to the positioning hole of the high-rise board, and the fixture is provided with at least one implement, and the implement uses the stacking method to complete pre-fixing of the high-rise board for subsequent heat In the press-bonding process, the pre-fixed high-rise plate is hot pressed to form a multilayer circuit board by a pair of pressed steel sheets.

Compared with the prior art, the multi-layer circuit board stacking method of the present invention and the pre-fixing device thereof are pre-fixed to the high-rise board by the stacking method, and the high-rise board body can be maintained in the subsequent hot-pressing operation. The stacking precision can completely avoid the metal powder contamination, the pre-fixed position slip or the damage of the pressed steel plate, and effectively solve the problems existing in the pressing process of the multilayer circuit board, and improve the multilayer circuit. The board is manufactured smoothly and the product quality is good and practical.

The present invention will be specifically described below with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a flow chart of a method for laminating a multilayer circuit board of the present invention. The step of the multi-layer circuit board stacking method includes: Step 201: preset a positioning hole in a high-rise board, and after the high-layer board is assembled according to specifications, the positioning hole is set at a pre-fixed position; Step 203, the positioning is performed. The hole is filled with glue, and the liquid glue is injected in the pressed state at the positioning hole completed by the high-layer plate; Step 205, the colloid in the positioning hole is hardened, and the injection into the positioning hole is completed in a pressed state. The colloid is directly subjected to a hardening treatment; and in step 207, the pre-fixation of the high-rise board is completed to maintain the hardened colloid between the inner layers of the high-rise board.

The superimposing method is for pre-fixing a high-rise board 10 (shown in FIG. 2), which generally includes a multi-layer board having six or more layers, or the high-rise board 10 has four or more inner layers. Multilayer board for boards. Before the high-rise board 10 is pressed into a multi-layer circuit board, a pre-fixed process of superimposing is required, and the pre-fixed process of the superimposing comprises superimposing a plurality of inner layers in order, direction and position, and A predetermined type and number of films are placed between the inner sheets of the plurality of sheets and outside, and then fixed. The preset positioning hole of the step 201 of the superposition method, that is, the pre-fixed position of the high-rise board 10, is set by using the alignment target of the alignment target or the alignment hole on the edge of the high-layer board 10, or is used. The optical alignment method is used to set the pre-fixed position. After the pre-fixed position of the high-rise panel 10 is confirmed, the high-rise panel 10 can be formed into a positioning hole by a separate manufacturing method or a simultaneous manufacturing method, and the respective manufacturing manners are performed on the plurality of inner layer boards and the film according to the alignment. The holes are drilled separately for the positioning holes, and at the same time, after the high-rise boards 10 are stacked according to specifications, the positioning holes are formed at the pre-fixed positions according to the alignment reference.

Please refer to FIG. 2 again, which is a top plan view of a high-level board of the multilayer circuit board of the present invention. The high-rise board 10 is formed by stacking a plurality of inner layer boards and films (not shown). The high-layer board 10 is viewed from a top view and includes a board edge area 101 and at least one multi-layer board area 103. The edge region 101 is located at the periphery of the high rise panel 10 and surrounds the multilayer circuit board region 103, which is separated from the multilayer circuit board region 103 by a cutting line 105. After the high-rise board 10 is formed with the inner layer lines in two facing positions of the inner layer board, a pair of alignment targets 106 are displayed as the reference of the subsequent alignment in the board edge area 101, and the alignment target 106 is usually disposed on the board. The short side middle position of the side area 101. The center position and the reference direction of the inner layer board are found by the alignment target 106, and at least a pair of bit holes 107 are disposed in the high-rise board 10 (the alignment holes 107 are generally disposed at the center of the four sides of the board edge area 101 and One of the holes is offset from the dwelling. The alignment of the high-level plate 10 is confirmed by the alignment of the alignment holes 107, and the plurality of inner plates 12 and the plurality of films 14 in the high-rise plate 10 are also determined ( The entire position at the pre-fixed position as shown in FIG. 3 is set by at least one positioning hole 108 of the high-rise panel 10 from all positions at the pre-fixed position. Therefore, the step 201 further includes: pressing the high-rise panel by a clamp, and manufacturing the positioning hole 108 at the pre-fixed position by a first implement provided in the clamp.

Please refer to FIG. 3, which is a cross-sectional view showing a specific embodiment of a preset positioning hole of the pre-fixing device of the multilayer circuit board of the present invention. The pre-fixing device 30 of the multi-layer circuit board includes a clamp 32 and a first implement 34. The first implement 34 is used to manufacture the positioning hole 108. The clamp 32 is correspondingly disposed on the positioning hole 108 of the high-rise board 10. At a fixed position (as shown in FIG. 2), the positioning hole 108 is at a position where the positioning hole 108 of the high-rise panel 10 is disposed. The clamp 32 has a corresponding pair of pressing heads 321 disposed at a pre-fixed position of the positioning hole 108 of the high-rise board 10, and outside the high-rise board 10 at the pre-fixed position of the positioning hole 108. The high-rise panel 10 is pressed on the surface. The first implement 34 is disposed in the clamp 32, and the positioning hole 108 is manufactured at the pre-fixed position by the first implement 34 in the clamp 32. In this embodiment, the positioning hole 108 is formed at a pre-fixed position of the positioning hole 108. The first implement 34 is a drilling machine. The drilling tool includes a drill bit 341. The drill bit 341 is telescopically operated on the clamp. The plurality of inner plates 12 and the plurality of films 14 included in the high-rise plate 10 are formed in a hole 320 of the upper plate 10, and the positioning holes 108 are formed at the pre-fixed position of the positioning holes 108 of the high-layer plate 10. In addition, the step 201 further includes: manufacturing a hole of the positioning hole at the pre-fixed position of the plurality of inner layers before the stacking of the high-rise boards and the film. In other words, the high-rise panel 10 is prefabricated to form the positioning hole 108. In addition to the above-described first implement 34 in the clamp 32, the high-rise panel 10 can be pre-made by stacking the high-rise panel 10. The plurality of inner sheets 12 and the plurality of sheets 14 before the stacking of the high-rise panels 10 can also be disposed on the plurality of inner sheets 12 and the plurality of sheets 14 by the alignment method described above. 107 and the pre-fixed position of the positioning hole 108, and the hole of the positioning hole 108 is fabricated at the pre-fixed position, after the plurality of inner layer plates 12 and the plurality of the film 14 are overlapped by the alignment holes 107, The positioning holes 108 of the high-rise panel 10 are formed by a plurality of the inner layer plates 12 and a plurality of holes of the positioning holes 108 of the film 14 at the pre-fixed position.

Furthermore, in step 203, the step of filling the positioning hole further comprises: pressing at a position of the two ends of the positioning hole of the high-level plate through a clamp, and the second fixture is provided in the fixture, and the second implement An injection is made in the positioning hole at one end of the clamp. Please refer to FIG. 4 again, which is a cross-sectional view showing a specific embodiment of the positioning hole filling and hardening of the pre-fixing device of the multilayer circuit board of the present invention. The pre-fixing device 30 includes a clamp 36 and a second implement 38. The clamp 36 has a corresponding pair of pressing heads 361 opposite to the positioning holes 108 of the high-rise panel 10, and The high-rise plate 10 is pressed at the opening at both ends of the positioning hole 108. The second implement 38 is disposed in the pressing head 361 at one end of the clamp 36. The second implement 38 is inserted into the positioning hole 108 by the pressing head 361 at one end of the clamp 36. In this embodiment, the second implement 38 is an injection nozzle, and the second implement 38 includes an injection tube 381 and a light guide tube 383. The injection tube 381 is disposed inside the light guide tube 383, and the first The second implement 38 injection nozzle is disposed in one of the press heads 361 of the clamp 36, and the end of the second implement 38 injection nozzle protrudes from the outer end surface of the press head 361 to inject the second implement 38. The nozzle can be inserted into the positioning hole 108 for injection. The second implement 38 extends into the positioning hole 108 to be a liquid glue for injecting an ultraviolet glue 385, and the light guide tube 383 of the second implement 38 is an ultraviolet light guide tube, and the ultraviolet adhesive 385 can guide the light through the ultraviolet light. The ultraviolet light guided by the tube 383 directly hardens the liquid glue of the ultraviolet glue 385 to complete the step 205 to harden the colloid in the positioning hole. The colloid in the positioning hole 108 may further include an epoxy resin, an acryl resin, and the hardening treatment further includes microwave hardening and heat hardening. Therefore, the drilling tool of the first implement 34 and the injection nozzle implement of the second implement 38, after performing the steps 201, 203, and 205 of the multi-layer circuit board superposing method, the colloidal ultraviolet adhesive 385 can be hardened. The pressing head 361 is restrained in the positioning hole 108 by pressing at the opening of the positioning hole 108, and the second machine 38 injection nozzle extends into the positioning hole 108 to inject the hardened colloidal ultraviolet glue 385. It is held between the inner layers of the high-rise panel 10 and does not protrude from the outer surface of the high-rise panel 10. The high-rise panel 10 can be effectively pre-fixed, and the pre-fixing of the high-rise panel is completed in step 207.

Finally, please refer to FIG. 5, which is a cross-sectional view showing a specific embodiment of a high-rise board of a multilayer circuit board of the present invention which is thermocompression-bonded by a pair of press-bonded steel sheets. When the high-rise board 10 is pre-fixed by the multi-layer circuit board superposing method, the high-rise board 10 is disposed between the pair of press-fit steel sheets 50, and the press-fit steel sheets 50 are opposed to each other. A copper foil 16 is separately disposed on the opposite surfaces of the high-rise panel 10, and then the hot-pressing of the high-rise panel 10 is performed by the laminated steel sheet 50, so that the high-rise panel 10 can be hot-pressed to form a multilayer circuit board (Fig. Not shown). When the laminated steel plate 50 is subjected to the thermal pressing operation, the surface of the high-rise board 10 which is pre-fixed is free from any protrusion due to the multi-layer circuit board overlapping method used in the high-rise board 10, and the positioning hole 108 The hardened UV adhesive 385 has been hardened and stabilized, and does not contain any metal components, which can effectively solve the problems existing in the conventional pre-fixation method.

The method for assembling a multi-layer circuit board according to the present invention and the pre-fixing device thereof, the pre-fixed high-rise board 10 of the multi-layer circuit board superposition method, the colloid in the positioning hole 108 is quickly hardened, and is retained in the high-rise board 10 Between the layers, when the thermocompression operation is performed, it is possible to avoid the lack of the precision of the lamination of the multilayer circuit board, the short-circuit of the metal dust contamination, the failure of the pre-fixed position slip, and the loss of the damaged laminated steel plate, thereby improving the manufacture of the multilayer circuit board. Smooth and good practical features of product quality.

It should be noted that the above-described embodiments are merely preferred embodiments of the present invention, and those skilled in the art can make other changes within the spirit of the present invention. All changes made in accordance with the spirit of the invention are intended to be included within the scope of the invention.

10‧‧‧High-rise board

101‧‧‧edge area

103‧‧‧Multilayer board area

105‧‧‧ cutting line

106‧‧‧ Alignment target

107‧‧‧ alignment hole

108‧‧‧Positioning holes

12‧‧‧ Inner board

14‧‧‧ Film

16‧‧‧ copper foil

201, 203, 205, 207‧‧ steps

30‧‧‧Pre-fixed device

32, 36‧‧‧ fixture

320‧‧‧ Holes

321, 361‧‧ ‧ pressed head

34‧‧‧First implement

341‧‧‧ drill bit

38‧‧‧Second implement

381‧‧‧Injection tube

383‧‧‧Light pipe

385‧‧‧UV glue

50‧‧‧ Pressed steel plate

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing a method of laminating a multilayer circuit board of the present invention.

2 is a top plan view of a high-level panel of a multilayer circuit board of the present invention.

Figure 3 is a cross-sectional view showing a specific embodiment of a preset positioning hole of the pre-fixing device of the multilayer circuit board of the present invention.

Fig. 4 is a cross-sectional view showing a specific embodiment of the positioning hole filling and hardening of the pre-fixing device of the multilayer circuit board of the present invention.

Figure 5 is a cross-sectional view showing a specific embodiment of a high-rise board of a multilayer circuit board of the present invention which is thermocompression-bonded by a pair of press-bonded steel sheets.

no

no

Claims (10)

A multi-layer circuit board stacking method, the step of the stacking method comprising: presetting a positioning hole in a high-rise board, wherein the high-level board is assembled according to a specification, and the positioning hole is disposed at a pre-fixed position; The glue is applied, and the liquid glue is injected in the pressing hole at the positioning hole completed by the high-layer plate; the colloid in the positioning hole is hardened, and the colloid injected into the positioning hole is directly hardened under the pressing state. Processing; and pre-fixing the high-rise panel to maintain the hardened colloid between the inner layers of the high-rise panel. The method of assembling a multi-layer circuit board according to claim 1, wherein the step of presetting the positioning hole in the high-rise board further comprises: pressing the high-rise board by a jig, and having a An implement is fabricated at the pre-fixed position. The method of assembling a multi-layer circuit board according to claim 1, wherein the step of presetting the positioning hole in the high-rise board further comprises: the plurality of inner layers before the stacking of the high-rise boards and the plurality of films At the pre-fixed position, the hole of the positioning hole is made. The method for laminating a multi-layer circuit board according to claim 1, wherein the step of filling the positioning hole further comprises: pressing at a position of both ends of the positioning hole of the high-layer plate by a jig, and the jig There is a second implement therein, and the second implement is inserted into the positioning hole at one end of the clamp to be injected. The method of assembling a multi-layer circuit board according to claim 4, wherein the second implement protrudes into the positioning hole to inject a UV glue, and the second implement has an ultraviolet light guide tube, and the ultraviolet glue passes through The ultraviolet light of the ultraviolet light guide tube is hardened to complete the step of hardening the colloid in the positioning hole. A multi-layer circuit board pre-fixing device includes a jig, a first implement, and a second implement. The clamp is disposed at at least one positioning hole of a high-rise board, and the first implement and the second implement are disposed on In the fixture, the first implement and the second implement pre-fix the high-rise panel at the positioning hole. The pre-fixing device for a multi-layer circuit board according to claim 6, wherein the first machine tool and the second machine tool perform pre-fixing of the high-rise board by a stacking method, and the steps of the stacking method include: The positioning hole is preset in the high-rise board, and after the high-layer board is assembled according to the specification, the positioning hole is disposed at the pre-fixed position; the positioning hole is filled with glue, and the positioning hole of the high-level board is pressed to be in a pressed state. The liquid glue is injected; the colloid in the positioning hole is hardened, and the colloid injected in the positioning hole is directly hardened in a pressed state; and the pre-fixing of the high-layer plate is completed, so that the hardened colloid is maintained in the Between the inner layers of the high-rise boards. The multi-layer circuit board pre-fixing device of claim 6, wherein the jig includes a corresponding pair of pressing heads, the pressing heads are oppositely disposed, and are located at a pre-fixed position of the high-rise board, and The high-rise panel is pressed on the outer surface at the pre-fixed position. The multi-layer circuit board pre-fixing device according to claim 6, wherein the first machine tool is a drilling machine, and the drilling machine tool comprises a drill bit, and the drill bit is telescopically operated in a hole in the jig. . The multi-layer circuit board pre-fixing device of claim 6, wherein the second implement is an injection nozzle, the injection nozzle includes an injection tube and a light guide tube, and the injection tube is disposed on the light guide tube Internally, and the injection nozzle is disposed in one of the press heads of the clamp, and the end of the injection nozzle protrudes from an outer end surface of the press head.