TW497805U - Improved structure for securing an inner layered substrate of printed circuit board - Google Patents
Improved structure for securing an inner layered substrate of printed circuit boardInfo
- Publication number
- TW497805U TW497805U TW90203604U TW90203604U TW497805U TW 497805 U TW497805 U TW 497805U TW 90203604 U TW90203604 U TW 90203604U TW 90203604 U TW90203604 U TW 90203604U TW 497805 U TW497805 U TW 497805U
- Authority
- TW
- Taiwan
- Prior art keywords
- securing
- circuit board
- printed circuit
- improved structure
- layered substrate
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90203604U TW497805U (en) | 2001-03-09 | 2001-03-09 | Improved structure for securing an inner layered substrate of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90203604U TW497805U (en) | 2001-03-09 | 2001-03-09 | Improved structure for securing an inner layered substrate of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW497805U true TW497805U (en) | 2002-08-01 |
Family
ID=21681939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90203604U TW497805U (en) | 2001-03-09 | 2001-03-09 | Improved structure for securing an inner layered substrate of printed circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW497805U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108966533A (en) * | 2017-05-17 | 2018-12-07 | 阳程科技股份有限公司 | Multilayer circuit board coincide method and its in advance fix device |
TWI645761B (en) * | 2017-05-16 | 2018-12-21 | 陽程科技股份有限公司 | Lay-up method and pre fixation device of multilayer circuit board |
-
2001
- 2001-03-09 TW TW90203604U patent/TW497805U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI645761B (en) * | 2017-05-16 | 2018-12-21 | 陽程科技股份有限公司 | Lay-up method and pre fixation device of multilayer circuit board |
CN108966533A (en) * | 2017-05-17 | 2018-12-07 | 阳程科技股份有限公司 | Multilayer circuit board coincide method and its in advance fix device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |