TW201900799A - Active energy ray-curable adhesive sheet for optical members - Google Patents

Active energy ray-curable adhesive sheet for optical members Download PDF

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TW201900799A
TW201900799A TW107115866A TW107115866A TW201900799A TW 201900799 A TW201900799 A TW 201900799A TW 107115866 A TW107115866 A TW 107115866A TW 107115866 A TW107115866 A TW 107115866A TW 201900799 A TW201900799 A TW 201900799A
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adhesive sheet
active energy
acrylic resin
meth
energy ray
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TW107115866A
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Chinese (zh)
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TWI765036B (en
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浅野鉄也
中島貴弘
野原一樹
峯元誠也
石井嘉穗儿
稲永誠
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日商日本合成化學工業股份有限公司
日商三菱化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a novel adhesive sheet capable of not only realizing both a low dielectric constant and an excellent absorbing property for a stepped portion in a print, but also exceptional handling characteristics as adhesive sheet. An active-energy-ray-curing adhesive sheet containing an acrylic resin (A), wherein the acrylic resin (A) has an active-energy-ray-crosslinking structural unit, and is a (co)polymer of a monomer component including a (meth)acrylic acid ester monomer (a) having a C10 to 24 linear alkyl group, the active-energy-ray-curing adhesive sheet for an optical member having at least all of the following characteristics (1) to (3). (1) A tensile elasticity of 0.03 MPa or higher at a temperature of 23 DEG C (2) A displacement length of 1 mm in a holding power test in which the adhesive sheet is adhered to a stainless steel plate with an adhesion area of 25 mm * 20 mm and a load of 500 gf (4.9 N) is applied for 30 minutes (3) A relative dielectric constant of 3.7 or less at a frequency of 100 kHz.

Description

光學構件用活性能量線硬化型黏著片材Active energy ray hardening type adhesive sheet for optical member

本發明係關於一種介電常數較低,階差吸收性及操作性(例如切割性、二次加工性、保管性)優異之黏著片材。其中,較佳為關於一種例如可於形成個人電腦、行動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等之類之圖像顯示裝置時較佳地使用之光學構件用活性能量線硬化型黏著片材。The present invention relates to an adhesive sheet having a relatively low dielectric constant and excellent level absorptivity and operability (for example, cutting properties, secondary processability, and storage properties). Among them, it is preferable to form an image display device such as a personal computer, a mobile terminal (PDA), a game machine, a television (TV), a car navigation system, a touch panel, a handwriting tablet, or the like. The optical member used is an active energy ray-curable adhesive sheet.

近年來,以行動電話或移動終端等為中心,正在普及搭載有觸控感測器功能之圖像顯示裝置、尤其是搭載有靜電電容方式之觸控感測器功能之圖像顯示裝置。In recent years, an image display device equipped with a touch sensor function, particularly an image display device equipped with a touch sensor function of an electrostatic capacitance method, has been popularized mainly in a mobile phone or a mobile terminal.

此種靜電電容方式之觸控感測器係檢測手指等導電體自表面保護面板側接近,於經由絕緣膜對向之2個電極之間形成之電容器之靜電電容發生變化而進行位置檢測之方式的觸控感測器。This type of electrostatic capacitance type touch sensor detects the proximity of a conductive object such as a finger from the side of the surface protection panel, and changes the electrostatic capacitance of the capacitor formed between the two electrodes facing through the insulating film to detect the position. Touch sensor.

但是,隨著最近之構件之薄壁化,產生若電極與保護面板表面之間隔變窄,與觸控對應之靜電電容變化變大,則檢測信號容易產生雜訊之問題。因此,為了對電極與表面保護面板之間之填充中所使用之黏著片材,吸收觸控檢測感度之變化而抑制檢測信號之雜訊產生,要求黏著片材之低介電常數化。However, with the recent thinning of components, if the distance between the electrode and the surface of the protective panel is narrowed, and the change in the electrostatic capacitance corresponding to the touch becomes large, the detection signal is prone to noise. Therefore, in order to absorb the change in touch detection sensitivity and suppress the generation of noise of the detection signal for the adhesive sheet used in the filling between the electrode and the surface protection panel, a low dielectric constant of the adhesive sheet is required.

又,隨著電極之輕量化或低成本化,電極基板正在自玻璃置換為樹脂膜。於僅於單面將導電性薄膜進行圖案形成之電極之情形時,必須經由黏著片材等,將2個膜電極彼此、或玻璃電極與膜電極積層,對此時使用之黏著片材亦要求低介電常數化。In addition, with the weight reduction or cost reduction of electrodes, electrode substrates are being replaced by glass with resin films. In the case of an electrode in which a conductive thin film is patterned only on one side, two film electrodes, or a glass electrode and a film electrode must be laminated through an adhesive sheet or the like. The adhesive sheet used at this time is also required. Reduced dielectric constant.

作為低介電常數之黏著片材,例如於專利文獻1中揭示有一種雙面黏著片材,其特徵在於包含:丙烯酸系化合物(A),其係頻率100 kHz下之相對介電常數為3.0以下;及丙烯酸酯共聚物(B),其係使側鏈具有直鏈或支鏈之碳數1~9之烷基之(甲基)丙烯酸酯單體及/或乙烯醚單體進行共聚合而獲得。As a low-dielectric-constant adhesive sheet, for example, Patent Document 1 discloses a double-sided adhesive sheet, which is characterized by containing an acrylic compound (A) whose relative dielectric constant at a frequency of 100 kHz is 3.0. The following; and an acrylate copolymer (B), in which a (meth) acrylic acid ester monomer and / or a vinyl ether monomer having a linear or branched alkyl group having 1 to 9 carbon atoms in a side chain is copolymerized And get.

根據此種雙面黏著片材,藉由使用頻率100 kHz下之相對介電常數為3.0以下之低介電常數之丙烯酸系化合物(A),不僅可降低片材整體之相對介電常數,亦可使黏著片材整體為交聯體結構,故而亦可提高處理性(操作容易性),例如即便進行加熱亦可維持片材形狀。進而,藉由含有使側鏈具有直鏈或支鏈之碳數1~9之烷基之(甲基)丙烯酸酯單體及/或乙烯醚單體進行共聚合所獲得之丙烯酸酯共聚物(B),可獲得較佳之黏著特性,例如,貼合之構件不會因溫度或濕度等環境變化等而產生發泡或剝離,而且,可具有適度之彈性或凹陷恢復性。According to such a double-sided adhesive sheet, by using a low-dielectric constant acrylic compound (A) having a relative dielectric constant of 3.0 or less at a frequency of 100 kHz, not only the relative dielectric constant of the entire sheet can be reduced, but also Since the whole adhesive sheet can have a crosslinked structure, handling properties (easy handling) can also be improved, and for example, the shape of the sheet can be maintained even when heated. Further, an acrylate copolymer obtained by copolymerizing (meth) acrylate monomers and / or vinyl ether monomers having an alkyl group having 1 to 9 carbon atoms having a linear or branched side chain. B), can obtain better adhesion characteristics, for example, the bonded members will not be foamed or peeled off due to environmental changes such as temperature and humidity, and can have moderate elasticity or depression recovery.

又,於專利文獻2中,對如下黏著劑進行揭示,其特徵在於包含(甲基)丙烯酸系聚合物,該(甲基)丙烯酸系聚合物係藉由使包含酯末端具有碳數8~24之支鏈烷基之(甲基)丙烯酸烷基酯(a1)、及酯末端具有碳數8~24之直鏈烷基之(甲基)丙烯酸烷基酯(a2)之單體成分進行聚合而獲得。In addition, Patent Document 2 discloses an adhesive that is characterized by including a (meth) acrylic polymer having a carbon number of 8 to 24 by including an ester terminal. Polymerization of the monomer components of the (meth) acrylic acid alkyl ester (a1) of a branched alkyl group and the (meth) acrylic acid alkyl ester (a2) having a linear alkyl group having 8 to 24 carbon atoms at the end of the ester And get.

根據此種黏著劑,藉由上述長鏈之支鏈烷基與長鏈之直鏈烷基之作用,可實現低介電常數之黏著劑層,且可滿足接著性能。According to such an adhesive, by the action of the long-chain branched alkyl group and the long-chain linear alkyl group, an adhesive layer with a low dielectric constant can be realized, and the adhesion performance can be satisfied.

如此,迄今為止,嘗試維持黏著片材原本之功能,並且謀求黏著片材之低介電常數化。Thus, attempts have been made so far to maintain the original function of the adhesive sheet and to reduce the dielectric constant of the adhesive sheet.

另外,觸控面板方式之圖像顯示裝置通常組合表面保護面板、觸控面板及圖像顯示面板(亦統稱為「圖像顯示裝置用構成構件」)而構成。In addition, an image display device of a touch panel method is generally configured by combining a surface protection panel, a touch panel, and an image display panel (also collectively referred to as a “composition member for an image display device”).

近年來,智慧型手機或平板終端等觸控面板方式之圖像顯示裝置之表面保護面板係與強化玻璃一起使用丙烯酸系樹脂板或聚碳酸酯板等塑膠材料,該表面保護面板之視認開口面部以外之周緣部係進行黑色印刷。In recent years, the surface protection panel of an image display device of a touch panel method such as a smart phone or a tablet terminal is made of a plastic material such as an acrylic resin plate or a polycarbonate plate together with tempered glass. The other peripheral parts are printed in black.

又,於觸控面板中,與玻璃感測器一起使用塑膠膜感測器,或者使用觸控面板功能與表面保護面板一體化之構件(例如覆蓋層觸控(TOL)等),或者使用觸控面板功能一體化為圖像顯示面板之構件(例如內嵌式或表嵌式等)。In addition, in the touch panel, a plastic film sensor is used together with a glass sensor, or a component that integrates a touch panel function with a surface protection panel (such as TOL), or uses a touch panel. The function of the control panel is integrated as a component of the image display panel (such as an inline type or a table type).

於以行動電話或行動終端為中心之圖像顯示裝置之領域中,除薄壁化、高精密化以外,亦進行設計之多樣化,先前一般於表面保護面板之周緣部框狀地印刷黑色之隱蔽部,但隨著設計之多樣化,開始藉由黑色以外之顏色形成該框狀之隱蔽部。於藉由黑色以外之顏色形成隱蔽部之情形時,隱蔽性較低,故而與黑色相比,有隱蔽部、即印刷部之高度變高之傾向。因此,對用以貼合具備此種印刷部之構成構件之黏著片材要求追隨於大幅之印刷階差而填充至各處。In the field of image display devices centered on mobile phones or mobile terminals, in addition to thinning and high-precision, design diversification has also been performed. Previously, black prints were generally framed on the peripheral edge of the surface protection panel. The concealed part, but with the diversification of design, the frame-shaped concealed part started to be formed by a color other than black. In the case where the concealed portion is formed by a color other than black, the concealability is low. Therefore, the height of the concealed portion, that is, the printed portion tends to be higher than that of black. Therefore, it is required that the adhesive sheet for laminating the constituent members provided with such a printing section follow a large printing step and be filled everywhere.

因此,自先前以來,提出各種用以覆蓋印刷階差之方法。例如,於專利文獻3中,對一種紫外線交聯性黏著片材進行揭示,其係包含具有紫外線交聯性部位之包含(甲基)丙烯酸酯之單體之(甲基)丙烯酸系共聚物而成者,並且紫外線交聯前之黏著片材之儲存彈性模數於30℃、1 Hz下為5.0×104 Pa以上且1.0×106 Pa以下,且於80℃、1 Hz下為5.0×104 Pa以下,進而,紫外線交聯後之黏著片材之儲存彈性模數於130℃、1 Hz下為1.0×103 Pa以上。Therefore, various methods for covering the printing step have been proposed since before. For example, Patent Document 3 discloses a UV-crosslinkable adhesive sheet, which is a (meth) acrylic copolymer containing a (meth) acrylate-containing monomer having a UV-crosslinkable site, And the storage elastic modulus of the adhesive sheet before ultraviolet crosslinking is 5.0 × 10 4 Pa or more and 1.0 × 10 6 Pa or less at 30 ° C. and 1 Hz, and 5.0 × at 80 ° C. or 1 Hz Below 10 4 Pa, the storage elastic modulus of the adhesive sheet after ultraviolet crosslinking is 1.0 × 10 3 Pa or higher at 130 ° C. and 1 Hz.

根據此種黏著片材,藉由紫外線交聯前之階段中之加熱及/或加壓,即便其厚度與階差或隆起之高度為同等程度(例如20~30 μm),亦可充分地追隨於其階差或隆起,其結果為不會於階差或隆起附近產生空隙等,階差或隆起附近之黏著片材之內部殘留應力亦不會無用地變高。 又,藉由於將黏著片材貼合於被黏著體後進行紫外線交聯,可實現可靠性較高之接著。藉此,可將包含被黏著體之積層體之厚度抑制為較薄,並且可實現不存在空隙或液晶之色不均等缺陷之貼合。 先前技術文獻 專利文獻According to such an adhesive sheet, by the heating and / or pressing in the stage before the ultraviolet crosslinking, even if the thickness is equal to the height of the step or the bulge (for example, 20 to 30 μm), it can sufficiently follow As a result of the step or bulge, as a result, voids and the like are not generated near the step or bulge, and the internal residual stress of the adhesive sheet near the step or bulge does not become uselessly high. In addition, by bonding the adhesive sheet to the adherend and then performing ultraviolet crosslinking, it is possible to achieve highly reliable adhesion. Thereby, the thickness of the laminated body including the adherend can be suppressed to be thin, and bonding without defects such as voids or uneven color of the liquid crystal can be achieved. Prior Art Literature Patent Literature

專利文獻1:日本專利特開2015-040240號公報 專利文獻2:日本專利特開2013-194170號公報 專利文獻3:日本專利特開2011-184582號公報Patent Literature 1: Japanese Patent Laid-Open No. 2015-040240 Patent Literature 2: Japanese Patent Laid-Open No. 2013-194170 Patent Literature 3: Japanese Patent Laid-Open No. 2011-184582

[發明所欲解決之問題][Problems to be solved by the invention]

上述專利文獻1或上述專利文獻2中揭示之黏著片材維持黏著片材原本之功能,並且謀求黏著片材之低介電常數化,但未考慮印刷階差吸收性。The adhesive sheet disclosed in the above-mentioned Patent Document 1 or Patent Document 2 maintains the original function of the adhesive sheet, and seeks to lower the dielectric constant of the adhesive sheet, but does not consider the printing step absorbency.

又,認為於考慮印刷階差吸收性之情形時,如上述專利文獻3中揭示之黏著片材般,藉由對黏著片材賦予柔軟性,儘管為薄物(例如30~50 μm),但賦予優異之印刷階差吸收性,但若考慮印刷階差吸收性,則有操作性(例如切割性、二次加工性、保管性)變差之虞。 除此以外,上述專利文獻3之黏著片材未考慮介電常數之降低化。In addition, it is considered that when considering the absorption of the printing step, like the adhesive sheet disclosed in the aforementioned Patent Document 3, the adhesive sheet is imparted with flexibility, although it is thin (for example, 30 to 50 μm), but imparted with flexibility. Excellent printing step absorptivity. However, if the printing step absorptivity is taken into consideration, the workability (for example, cutability, secondary processability, and storage stability) may deteriorate. In addition, the adhesive sheet of the above-mentioned Patent Document 3 does not consider reduction of the dielectric constant.

因此,本發明之目的在於提供一種不僅可同時實現低介電常數化及優異之印刷階差吸收性,而且作為黏著片材之操作性(例如切割性、二次加工性、保管性)亦優異之新穎之黏著片材。 [解決問題之技術手段]Therefore, an object of the present invention is to provide not only a low dielectric constant and excellent printing step absorptivity, but also excellent handling properties (such as cutability, secondary processability, and storage stability) as an adhesive sheet. The novel adhesive sheet. [Technical means to solve the problem]

本發明之主要之特徵在於:其係含有丙烯酸系樹脂(A)之活性能量線硬化型黏著片材,且上述丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物,並將以下作為主旨。The main feature of the present invention is that it is an active energy ray-curable adhesive sheet containing an acrylic resin (A), and the acrylic resin (A) contains an active energy ray crosslinkable structure portion and has a carbon number The (co) polymer of a monomer component of a linear alkyl (meth) acrylate monomer (a) of 10 to 24 is as follows.

本發明提出一種光學構件用活性能量線硬化型黏著片材,其係含有丙烯酸系樹脂(A)者,且上述丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物,該光學構件用活性能量線硬化型黏著片材至少具有如下(1)~(3)之所有特性。 (1)溫度23℃下之拉伸彈性模數為0.03 MPa以上 (2)基於以25 mm×20 mm之貼合面積貼附於不鏽鋼板,於鉛直方向上施加500 gf(4.9 N)之負載30分鐘之保持力試驗之偏移長度為1 mm以上 (3)頻率100 kHz下之相對介電常數為3.7以下The present invention provides an active energy ray-curable adhesive sheet for an optical member, which contains an acrylic resin (A), and the acrylic resin (A) contains an active energy ray crosslinkable structure portion and has a carbon number. The (co) polymer of a monomer component of a linear alkyl (meth) acrylate monomer (a) of 10 to 24, the optical member has at least the following (1) to an active energy ray-curable adhesive sheet (3) All characteristics. (1) The tensile modulus of elasticity at a temperature of 23 ° C is 0.03 MPa or more. (2) Based on a 25 mm × 20 mm bonding area attached to a stainless steel plate. A load of 500 gf (4.9 N) is applied in the vertical direction. 30 minutes of holding force test with an offset length of 1 mm or more (3) The relative dielectric constant at 100 kHz is 3.7 or less

又,本發明提出一種光學構件用活性能量線硬化型黏著片材,其係含有丙烯酸系樹脂(A)者,且上述丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物,該光學構件用活性能量線硬化型黏著片材自至少一片材表面於厚度方向上具有頻率1 Hz、溫度20℃下之儲存彈性模數G'不同之包含上述丙烯酸系樹脂(A)之區域,且頻率100 kHz下之相對介電常數為3.7以下。 [發明之效果]The present invention also proposes an active energy ray-curable adhesive sheet for an optical member, which contains an acrylic resin (A), and the acrylic resin (A) contains an active energy ray crosslinkable structure and has A (co) polymer of a monomer component of a linear alkyl (meth) acrylate monomer (a) having 10 to 24 carbon atoms, the optical member is made of at least one sheet using an active energy ray-curable adhesive sheet The surface has a region including the above-mentioned acrylic resin (A) having a different storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 20 ° C. in the thickness direction, and the relative dielectric constant at a frequency of 100 kHz is 3.7 or less. [Effect of the invention]

本發明之光學構件用活性能量線硬化型黏著片材可同時實現較低之介電常數特性及優異之印刷階差吸收性。 又,而且作為黏著片材之操作性(例如切割性、二次加工性、保管性)亦優異,故而例如可於形成個人電腦、行動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等之類之圖像顯示裝置時較佳地使用。The active energy ray-curable adhesive sheet for an optical member of the present invention can achieve both low dielectric constant characteristics and excellent printing step absorbency. In addition, it is also excellent in operability (such as cutability, secondary processability, and storage) as an adhesive sheet, and thus can be used to form, for example, a personal computer, a mobile terminal (PDA), a game machine, a television (TV), and a car navigation system. Image display devices such as systems, touch panels, handwriting pads, etc. are preferably used.

以下,對本發明之實施形態詳細地進行說明,但以下之說明係本發明之實施態樣之一例(代表例),本發明不受該等內容任何限定。Hereinafter, the embodiment of the present invention will be described in detail, but the following description is an example (representative example) of the embodiment of the present invention, and the present invention is not limited by these contents.

再者,「(甲基)丙烯酸」係分別包括丙烯酸及甲基丙烯酸之含義,「(甲基)丙烯醯基」係分別包括丙烯醯基及甲基丙烯醯基之含義,「(甲基)丙烯酸酯」係分別包括丙烯酸酯及甲基丙烯酸酯之含義,「(共)聚合物」係包括聚合物及共聚物之含義。 又,「片材」係概念上包含片材、膜、膠帶。In addition, "(meth) acrylic acid" includes the meanings of acrylic acid and methacrylic acid, and "(meth) acrylfluorenyl" includes the meanings of acrylic and methacrylfluorene, respectively, and "(meth) "Acrylate" includes the meaning of acrylate and methacrylate respectively, and "(co) polymer" includes the meaning of polymer and copolymer. The "sheet" includes a sheet, a film, and an adhesive tape conceptually.

≪光學構件用活性能量線硬化型黏著片材≫ 本發明之光學構件用活性能量線硬化型黏著片材(以下,亦稱為「本黏著片材」)包含丙烯酸系樹脂(A),該丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物。活性 Active energy ray-curable adhesive sheet for optical member≫ The active energy ray-curable adhesive sheet for optical member of the present invention (hereinafter, also referred to as "the present adhesive sheet") contains an acrylic resin (A), and the acrylic Resin (A) is a (co) polymer containing a monomer component of a (meth) acrylic acid ester monomer (a) having a linear alkyl group of 10 to 24 having an active energy ray crosslinkable structural site .

又,本黏著片材至少具有如下(1)~(3)之所有特性。Moreover, this adhesive sheet has at least all the characteristics of the following (1)-(3).

(1)溫度23℃下之拉伸彈性模數為0.03 MPa以上 (2)基於以寬度25 mm×長度20 mm之貼合面積貼附於不鏽鋼板,於鉛直方向上施加500 gf(4.9 N)之負載30分鐘之保持力試驗之偏移長度為1 mm以上 (3)頻率100 kHz下之相對介電常數為3.7以下(1) The tensile modulus of elasticity at a temperature of 23 ° C is 0.03 MPa or more. (2) Based on a bonding area of 25 mm × 20 mm in length to a stainless steel plate. 500 gf (4.9 N) is applied in the vertical direction. The deflection length of the holding force test under load for 30 minutes is 1 mm or more. (3) The relative dielectric constant at a frequency of 100 kHz is 3.7 or less.

本黏著片材藉由具有上述特性,可同時實現較低之介電常數特性及優異之印刷階差吸收性,並且確保作為黏著片材之操作性(例如切割性、二次加工性、保管性)。By having the above-mentioned characteristics, the adhesive sheet can achieve both low dielectric constant characteristics and excellent printing step absorptivity, and can ensure the operability (e.g., cuttability, secondary processability, storage stability) of the adhesive sheet. ).

本黏著片材係使用包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物作為丙烯酸系樹脂(A),藉此,可獲得降低介電常數,並且以成為特定之範圍之方式調整拉伸彈性模數或保持力之黏著片材。This adhesive sheet is a (co) polymer containing a monomer component of a (meth) acrylate monomer (a) having a linear alkyl group having 10 to 24 carbon atoms and having an active energy ray crosslinkable structure site. As the acrylic resin (A), an adhesive sheet having a reduced dielectric constant and a tensile elastic modulus or a holding force adjusted in a specific range can be obtained.

(拉伸彈性模數) 本黏著片材於溫度23℃下之拉伸彈性模數為0.03 MPa以上。藉由將拉伸彈性模數設為此種範圍內,可確保優異之操作性。就此種觀點而言,本黏著片材之拉伸彈性模數較佳為0.03 MPa以上且1.0 MPa以下,更佳為0.03 MPa以上且0.5 MPa以下。(Tensile elastic modulus) The tensile elastic modulus of the adhesive sheet at a temperature of 23 ° C is 0.03 MPa or more. By setting the tensile elastic modulus in such a range, excellent operability can be ensured. From such a viewpoint, the tensile elastic modulus of the present adhesive sheet is preferably 0.03 MPa or more and 1.0 MPa or less, and more preferably 0.03 MPa or more and 0.5 MPa or less.

(保持力) 本黏著片材之基於上述保持力試驗之偏移長度為1 mm以上。藉由偏移長度為1 mm以上,可具有印刷階差吸收性。就此種觀點而言,本黏著片材之上述偏移長度較佳為1.0 mm以上且20 mm以下。再者,由保持力試驗求出之偏移長度係藉由下述實施例所記載之方法所求出之值。(Retention force) The offset length of this adhesive sheet based on the above-mentioned retention force test is 1 mm or more. With an offset length of 1 mm or more, it is possible to have printing step absorptivity. From such a viewpoint, the above-mentioned offset length of the present adhesive sheet is preferably 1.0 mm or more and 20 mm or less. The offset length obtained by the holding force test is a value obtained by a method described in the following examples.

本黏著片材藉由使用特定之丙烯酸系樹脂(A),具有偏移長度為1 mm以上之柔軟之性質,同時具有拉伸彈性模數為0.03 MPa以上之強硬之性質。 如此,本黏著片材藉由使用特定之丙烯酸系樹脂(A),可實現低介電常數化,並且雖較為柔軟但切割性等操作性優異,具有印刷階差吸收性及操作性之相反之性質。 更具體而言,藉由具有上述特性(1)~(3),並且採用如下所述之積層構成之黏著片材設計,可具有更高之印刷階差吸收性及操作性。This adhesive sheet uses a specific acrylic resin (A) to have a soft property with an offset length of 1 mm or more and a tough property with a tensile elastic modulus of 0.03 MPa or more. In this way, by using the specific acrylic resin (A), the present adhesive sheet can achieve a low dielectric constant, and although it is relatively soft, it has excellent operability such as cutting properties, and has the opposite of printing step absorption and operability. nature. More specifically, by having the above-mentioned characteristics (1) to (3) and adopting an adhesive sheet design composed of a laminated layer as described below, it is possible to have higher printing step absorptivity and operability.

例如,藉由使用特定之丙烯酸系樹脂(A),並且自至少一片材表面於厚度方向上形成頻率1 Hz、溫度20℃下之儲存彈性模數G'不同之區域,可以更高之水準表現印刷階差吸收性及操作性。For example, by using a specific acrylic resin (A) and forming a region having a different storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 20 ° C. from the surface of at least one sheet in the thickness direction, a higher level can be achieved. Expresses printing step absorptivity and operability.

再者,拉伸彈性模數係指藉由下述實施例所記載之方法所求出之值,儲存彈性模數G'意指藉由剪切模式進行動態黏彈性測定時之儲存彈性模數,係指藉由下述實施例所記載之方法所求出之值。In addition, the tensile elastic modulus refers to the value obtained by the method described in the following examples, and the storage elastic modulus G 'means the storage elastic modulus when the dynamic viscoelasticity is measured by the shear mode. , Refers to the value obtained by the method described in the following examples.

上述儲存彈性模數G'不同之區域係指例如包含積層2層以上儲存彈性模數G'不同之層之情形;或雖不存在明確地表現出層間之界面,但存在儲存彈性模數G'不同之部分之情形。The above-mentioned regions having different storage elastic modulus G 'refer to, for example, a case where two or more layers with different storage elastic modulus G' are included; or although there is no clear interface between layers, there is a storage elastic modulus G ' Different parts of the situation.

作為上述儲存彈性模數G'不同之包含上述丙烯酸系樹脂(A)之區域,例如可列舉具有包含上述丙烯酸系樹脂(A)之至少n個層,第1層及第i層於頻率1 Hz、溫度20℃下之儲存彈性模數G'相互不同之形態(以下,亦稱為「積層構成」)。 其中,n及i分別獨立為2以上之整數。Examples of the region including the acrylic resin (A) having different storage elastic modulus G ′ include, for example, at least n layers including the acrylic resin (A), and the first layer and the i-th layer have a frequency of 1 Hz. The forms in which the storage elastic modulus G 'at a temperature of 20 ° C are different from each other (hereinafter, also referred to as "laminated structure"). Among them, n and i are each independently an integer of 2 or more.

於上述積層構成中,上述第i層較佳為頻率1 Hz、溫度20℃下之儲存彈性模數G'為40 kPa以上且1 MPa以下。藉由上述第i層處於此種儲存彈性模數G'之範圍內,可使黏著片材本身具有塑性,防止黏著樹脂附著於沖孔模具或狹縫刀片,黏著材料繞入至剪裁端部而剝離膜無法剝離,或者端部之糊溢出等不良情況。In the laminated structure, the i-th layer preferably has a storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 20 ° C. of 40 kPa or more and 1 MPa or less. By the i-th layer being in the range of the storage elastic modulus G ', the adhesive sheet itself can be made plastic, preventing the adhesive resin from attaching to the punching die or the slit blade, and the adhesive material is wound to the cutting end. The peeling film cannot be peeled off or the end paste overflows.

又,於上述形態中,第1層較佳為頻率1 Hz、溫度20℃下之儲存彈性模數G'為30 kPa以上且70 kPa以下。藉由上述第1層處於此種儲存彈性模數G'之範圍內,可具有對印刷階差之追隨性、或降低貼合後之凹凸附近之光學應變等優點。In the above aspect, the first layer preferably has a storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 20 ° C. of 30 kPa or more and 70 kPa or less. Since the first layer is in the range of the storage elastic modulus G ′, it has the advantages of following the printing step, or reducing the optical strain near the unevenness after bonding.

上述儲存彈性模數G'係除變更構成本黏著片材之各成分之種類、分子量、組成比以外,亦可調節活性能量線之照射量,或者調節活性能量線交聯性結構部位之量,或者調節交聯劑之量,而調節交聯之程度,藉此設為上述範圍內。The above-mentioned storage elastic modulus G ′ is in addition to changing the type, molecular weight, and composition ratio of each component constituting the adhesive sheet, and can also adjust the amount of active energy ray exposure or the amount of cross-linkable structural sites of the active energy ray. Alternatively, the amount of the cross-linking agent is adjusted, and the degree of cross-linking is adjusted, thereby setting it within the above range.

該等之中,較佳為含有下述丙烯酸系樹脂(A)。Among these, it is preferable to contain the following acrylic resin (A).

(積層構成) 上述積層構成之本黏著片材具有積層n層以上之層之構成,具體而言,可列舉具有第1層/第2層、第1層/第2層/第3層、第1層/第2層/・・・/第i層之積層構成。再者,並非必須所有層為黏著劑層,較佳為至少第1(表層)及/或第n層(背層)為黏著劑層。(Laminated Structure) The present adhesive sheet having the laminated structure has a structure in which n or more layers are laminated. Specifically, the laminated sheet may include a first layer / second layer, a first layer / second layer / third layer, and a second layer. Layer 1/2 / ... / i layer. Moreover, it is not necessary that all layers are adhesive layers, and it is preferred that at least the first (surface layer) and / or the nth layer (back layer) be an adhesive layer.

因此,例如,除n為2之2層構成且第1層及第2(i=2)層包含上述丙烯酸系樹脂(A)之形態(n=2,i=2)、或n為3之3層構成且第1層及第2層(i=2)包含上述丙烯酸系樹脂(A)之形態(n=3,i=2)以外,亦可為n為3之3層構成且第1層及第3層(i=3)包含上述丙烯酸系樹脂(A)之形態(n=3,i=3)。Therefore, for example, a structure in which the first layer and the second (i = 2) layer include the above-mentioned acrylic resin (A) (n = 2, i = 2), or n is 3, except that n is 2. A three-layer structure and the first layer and the second layer (i = 2) include the form (n = 3, i = 2) of the acrylic resin (A) described above, and may also be a three-layer structure with n of 3 and the first The layer and the third layer (i = 3) include the form (n = 3, i = 3) of the acrylic resin (A).

於上述構成中,就容易製造之方面而言,較佳為n為2之2層構成且第1層及第2層(i=2)包含上述丙烯酸系樹脂(A)之形態(n=2,i=2);及n為3之3層構成且第1層及第2層(i=2)包含上述丙烯酸系樹脂(A)之形態(n=3,i=2)。In the above configuration, in terms of ease of production, a two-layer configuration in which n is 2 and the first layer and the second layer (i = 2) preferably include the above-mentioned acrylic resin (A) (n = 2). (I = 2); and n is a three-layer structure of 3, and the first and second layers (i = 2) include the above-mentioned acrylic resin (A) (n = 3, i = 2).

就可藉由具有適度之硬度之中間層使黏著片材本身具有塑性,又,藉由柔軟之表層及背層確保階差追隨性之方面而言,上述積層構成之本黏著片材最佳為相對於表層及背層,中間層包含上述丙烯酸系樹脂(A)之形態,且表層及背層與中間層之儲存彈性模數G'不同。In terms of making the adhesive sheet itself plastic by an intermediate layer having a moderate hardness, and ensuring step followability by a soft surface layer and a back layer, the present adhesive sheet composed of the above-mentioned laminated layers is most preferably The intermediate layer includes the form of the above-mentioned acrylic resin (A) with respect to the surface layer and the back layer, and the storage elastic modulus G 'of the surface layer and the back layer is different from that of the intermediate layer.

根據以上,較佳為n及i分別獨立為2以上之整數,於n為2之情形時,n與i相同,於n為3以上之情形時,滿足n>i之關係。Based on the above, it is preferable that n and i are each independently an integer of 2 or more. When n is 2, n is the same as i, and when n is 3 or more, the relationship of n> i is satisfied.

根據以上,本黏著片材最佳為n為2之2層構成且第1層及第2層(i=2)包含上述丙烯酸系樹脂(A)(n=2,i=2),第1層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為30 kPa以上且70 kPa以下,第2層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為40 kPa以上且1 MPa以下;並且最佳為n為3之3層構成且第1層及第2層(i=2)包含上述丙烯酸系樹脂(A)(n=3,i=2),第1層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為30 kPa以上且70 kPa以下,第2層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為40 kPa以上且1 MPa以下。此時,第3層於頻率1 Hz、溫度20℃下之儲存彈性模數G'可與第1層相同,亦可不同,更佳為相同。Based on the above, the present adhesive sheet preferably has a two-layer structure with n being 2 and the first layer and the second layer (i = 2) include the acrylic resin (A) (n = 2, i = 2), and the first The storage elastic modulus G 'of the layer at a frequency of 1 Hz and a temperature of 20 ° C is more than 30 kPa and less than 70 kPa. The storage elastic modulus of the second layer at a frequency of 1 Hz and a temperature of 20 ° C is 40 kPa and more. 1 MPa or less; and preferably a three-layer structure with n of 3 and the first and second layers (i = 2) include the acrylic resin (A) (n = 3, i = 2), and the first layer is The storage elastic modulus G 'at a frequency of 1 Hz and a temperature of 20 ° C is 30 kPa to 70 kPa, and the storage elastic modulus G' of the second layer at a frequency of 1 Hz and a temperature of 20 ° C is 40 kPa and 1 MPa. the following. At this time, the storage elastic modulus G 'of the third layer at a frequency of 1 Hz and a temperature of 20 ° C may be the same as or different from the first layer, and more preferably the same.

(本黏著片材之厚度) 本黏著片材之厚度較佳為處於20 μm~500 μm之範圍(於具有基材片材之情形時,其厚度除外)。例如,若為厚度20 μm以上,則不會妨礙與被黏著體之密接力或衝擊吸收性,若為500 μm以下,則可應對薄壁化之要求。 因此,本黏著片材之厚度較佳為20 μm~500 μm,其中,進而較佳為30 μm以上或300 μm以下,其中,進而較佳為50 μm以上或200 μm以下。(Thickness of the Adhesive Sheet) The thickness of the present adhesive sheet is preferably in the range of 20 μm to 500 μm (except for the case where a substrate sheet is provided). For example, if the thickness is 20 μm or more, the adhesion to the adherend or the shock absorption is not hindered, and if it is 500 μm or less, it can meet the requirements for thinning. Therefore, the thickness of the present adhesive sheet is preferably 20 μm to 500 μm, and more preferably 30 μm or more or 300 μm or less, and more preferably 50 μm or more or 200 μm or less.

於上述積層構成之本黏著片材中,較佳為第i層之厚度(S2)相對於第1層與第n層之總厚度、即表層及背層之總厚度(S1)之比率((S1)/(S2))為0.05≦(S1)/(S2)≦2。藉由設為此種厚度比,積層體中之表層及背層之厚度之幫助不會變得過大,不會過於柔軟而剪裁或處理性等作業性較差,故而較佳。 又,對凹凸或彎曲之面之追隨性不會變差,可維持對被黏著體之接著力或潤濕性,故而較佳。 就此種觀點而言,第i層之厚度(S2)相對於表層及背層之總厚度(S1)之比率更佳為0.1≦(S1)/(S2)≦2,進而較佳為0.1≦(S1)/(S2)≦1。In the present adhesive sheet composed of the above-mentioned laminated layers, the ratio of the thickness of the i-th layer (S2) to the total thickness of the first and n-th layers, that is, the total thickness of the surface layer and the back layer (S1) (( S1) / (S2)) is 0.05 ≦ (S1) / (S2) ≦ 2. By setting such a thickness ratio, the help of the thickness of the surface layer and the back layer in the laminated body will not become too large, it will not be too soft, and the workability such as cutting or handling is poor, so it is better. In addition, the followability to the uneven or curved surface is not deteriorated, and the adhesion or wettability to the adherend can be maintained, which is preferable. From this perspective, the ratio of the thickness (S2) of the i-th layer to the total thickness (S1) of the surface layer and the back layer is more preferably 0.1 ≦ (S1) / (S2) ≦ 2, and more preferably 0.1 ≦ ( S1) / (S2) ≦ 1.

(相對介電常數) 本黏著片材較佳為頻率100 kHz下之相對介電常數為3.7以下。藉由相對介電常數為3.7以下,本黏著片材可發揮作為絕緣層之功能,而降低觸控信號之類之高頻電氣信號之損耗。就此種方面而言,本黏著片材之相對介電常數更佳為3.5以下,更佳為3.2以下。再者,相對介電常數係藉由下述實施例所記載之方法所求出之值。(Relative Dielectric Constant) The present adhesive sheet preferably has a relative dielectric constant of 3.7 or less at a frequency of 100 kHz. With a relative dielectric constant of 3.7 or less, the adhesive sheet can function as an insulating layer, and reduce the loss of high-frequency electrical signals such as touch signals. In this respect, the relative dielectric constant of the present adhesive sheet is more preferably 3.5 or less, and even more preferably 3.2 or less. The relative dielectric constant is a value obtained by a method described in the following examples.

<丙烯酸系樹脂(A)> 本黏著片材含有丙烯酸系樹脂(A)。<Acrylic resin (A)> This adhesive sheet contains an acrylic resin (A).

上述丙烯酸系樹脂(A)較佳為包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物。 再者,該活性能量線交聯性結構部位係藉由活性能量線之照射,可與丙烯酸系樹脂(A)之一部分或丙烯酸系樹脂(A)以外之硬化成分進行反應而形成交聯結構之結構部位。The acrylic resin (A) is preferably a monomer component (a) containing a monomer component of a (meth) acrylate monomer (a) having a linear alkyl group having 10 to 24 carbon atoms having a site having an active energy ray crosslinkable structure. Co) polymer. In addition, the active energy ray crosslinkable structure portion is irradiated with the active energy ray and can react with a part of the acrylic resin (A) or a hardening component other than the acrylic resin (A) to form a crosslinked structure. Structural parts.

作為上述活性能量線交聯性結構部位,可列舉:例如具有(甲基)丙烯醯基、乙烯基等具有不飽和雙鍵之官能基等具有碳-碳雙鍵之自由基聚合性官能基之結構;或例如如二苯甲酮結構等般可藉由紫外線照射而激發,且於該激發態下奪取氫自由基者。再者,於進行活性能量線照射時,除遠紫外線、紫外線、近紫外線、紅外線等光線、X射線、γ射線等電磁波以外,亦可利用電子束、質子射線、中子射線等,就硬化速度、照射裝置之獲取容易性、價格等而言,有利的是利用紫外線照射之硬化。Examples of the active energy ray crosslinkable structural site include, for example, a radical polymerizable functional group having a carbon-carbon double bond, such as a functional group having an unsaturated double bond, such as a (meth) acrylfluorenyl group and a vinyl group. Structure; or, for example, a benzophenone structure and the like can be excited by ultraviolet radiation, and in this excited state deprived of hydrogen radicals. In addition, during active energy ray irradiation, in addition to far-ultraviolet rays, ultraviolet rays, near-ultraviolet rays, infrared rays and other electromagnetic waves, X-rays, gamma rays and other electromagnetic waves, electron beams, proton rays, neutron rays, etc. can also be used to harden the speed. In terms of availability, price, etc. of the irradiation device, it is advantageous to use ultraviolet rays for hardening.

為了導入含有具有不飽和雙鍵之官能基等具有碳-碳雙鍵之自由基聚合性官能基之結構,例如只要使具有與(甲基)丙烯酸2-異氰酸基乙酯等丙烯酸系樹脂中之官能基進行反應之官能基及不飽和雙鍵之單體與丙烯酸系樹脂中之官能基進行反應即可。又,為了導入可藉由紫外線照射而激發且於該激發態下奪取氫自由基者,只要以含有活性能量線交聯性結構部位之(甲基)丙烯酸酯單體(α)作為共聚合成分進行共聚即可。In order to introduce a structure containing a radically polymerizable functional group having a carbon-carbon double bond, such as a functional group having an unsaturated double bond, for example, it is necessary to make it have an acrylic resin such as 2-isocyanatoethyl (meth) acrylate The functional group in which the functional group in the reaction is reacted and the monomer having an unsaturated double bond may react with the functional group in the acrylic resin. In addition, in order to introduce a person that can be excited by ultraviolet radiation and deprive of hydrogen radicals in this excited state, a (meth) acrylate monomer (α) containing an active energy ray crosslinkable structural site is used as a copolymerization component. Copolymerization is sufficient.

作為含有活性能量線交聯性結構部位之(甲基)丙烯酸酯單體(α),就藉由紫外線、電子束等活性能量線可實現有效率之交聯結構形成之方面而言,較佳為含有具有二苯甲酮結構之(甲基)丙烯酸酯單體,具體而言,可列舉4-(甲基)丙烯醯氧基二苯甲酮等。As the (meth) acrylic acid ester monomer (α) containing a cross-linkable structure site of active energy ray, it is preferable that an efficient cross-linking structure can be formed by active energy rays such as ultraviolet rays and electron beams. It contains a (meth) acrylic acid ester monomer which has a benzophenone structure, Specifically, 4- (meth) acryl methoxy benzophenone etc. are mentioned.

作為含有活性能量線交聯性結構部位之(甲基)丙烯酸酯單體(α)之含量,相對於共聚合成分整體,較佳為0.01~5質量%,其中,作為具有二苯甲酮結構之(甲基)丙烯酸酯單體之含量,相對於共聚合成分整體,較佳為0.01~5質量%,尤佳為0.1~2質量%,進而較佳為0.2~1質量%。若此種含量過少,則有藉由活性能量線形成交聯結構時之保持力降低之傾向,若過多,則有系統整體之凝聚力過度提高,黏著力降低之傾向。The content of the (meth) acrylic acid ester monomer (α) containing a cross-linkable structural site of the active energy ray is preferably 0.01 to 5% by mass with respect to the entire copolymerization component. Among them, it has a benzophenone structure. The content of the (meth) acrylic acid ester monomer is preferably 0.01 to 5% by mass, more preferably 0.1 to 2% by mass, and still more preferably 0.2 to 1% by mass based on the entire copolymerization component. When the content is too small, the holding force when the crosslinked structure is formed by the active energy ray tends to decrease. When the content is too large, the cohesive force of the entire system tends to be excessively increased and the adhesive force tends to be reduced.

藉由丙烯酸系樹脂(A)具有活性能量線交聯性結構部位,可有效率地使丙烯酸系樹脂(A)硬化(交聯),除此以外,即便不含有酸成分,亦可提高凝聚力,可具有優異之耐發泡可靠性(其中,為優異之耐紫外線(UV)發泡可靠性)。就此種方面而言,作為上述活性能量線交聯性結構部位,最佳為二苯甲酮結構。Since the acrylic resin (A) has an active energy ray crosslinkable structural site, the acrylic resin (A) can be effectively hardened (crosslinked). In addition, the acrylic resin (A) can improve cohesion even if it does not contain an acid component. Can have excellent foaming reliability (Among them, excellent ultraviolet (UV) foaming reliability). In this respect, the active energy ray crosslinkable structural site is preferably a benzophenone structure.

作為上述具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a),例如可列舉:(甲基)丙烯酸癸酯(烷基之碳數10)、(甲基)丙烯酸月桂酯(碳數12)、(甲基)丙烯酸十三烷基酯(碳數13)、(甲基)丙烯酸十六烷基酯(碳數16)、(甲基)丙烯酸硬脂酯(碳數18)、(甲基)丙烯酸山萮酯(碳數22)等。 該等可單獨地使用,亦可併用2種以上。 再者,作為具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體之含有羥基之單體係視為下述(b)。Examples of the (meth) acrylate monomer (a) having a linear alkyl group having 10 to 24 carbon atoms include, for example, decyl (meth) acrylate (carbon number 10 of alkyl group), (meth) Lauryl acrylate (carbon number 12), tridecyl (meth) acrylate (carbon number 13), cetyl (meth) acrylate (carbon number 16), stearyl (meth) acrylate ( Carbon number 18), behenyl (meth) acrylate (carbon number 22), and the like. These can be used alone or in combination of two or more. It should be noted that a hydroxyl group-containing single system as a (meth) acrylate monomer having a linear alkyl group having 10 to 24 carbon atoms is regarded as the following (b).

又,於具有碳數10~24之烷基之直鏈之(甲基)丙烯酸烷基酯單體(a)中,就低介電常數化、或可降低丙烯酸系樹脂之玻璃轉移溫度之方面而言,較佳為使用甲基丙烯酸烷基酯,尤佳為具有碳數12~20之烷基者,最佳為甲基丙烯酸硬脂酯、甲基丙烯酸月桂酯、甲基丙烯酸十三烷基酯。In addition, in the straight-chain (meth) acrylic acid alkyl ester monomer (a) having an alkyl group having 10 to 24 carbon atoms, the dielectric constant can be lowered or the glass transition temperature of the acrylic resin can be reduced. In terms of use, an alkyl methacrylate is preferred, and an alkyl group having 12 to 20 carbon atoms is particularly preferred, and stearyl methacrylate, lauryl methacrylate, and tridecane methacrylate are most preferred. Based ester.

具有碳數10~24之直鏈烷基之(甲基)丙烯酸烷基酯單體(a)之含量相對於(共)聚合成分整體,為50~94質量%,較佳為60~83質量%,尤佳為70~80質量%。藉由設為上述範圍內,無介電常數變高,或者樹脂之熱穩定性降低之虞。The content of the alkyl (meth) acrylate monomer (a) having a linear alkyl group having 10 to 24 carbon atoms is 50 to 94% by mass, and preferably 60 to 83% by mass relative to the entire (co) polymerization component. %, Particularly preferably 70 to 80% by mass. By setting it as the said range, there exists no possibility that a dielectric constant becomes high, or the thermal stability of resin may fall.

(含羥基之(甲基)丙烯酸酯單體) 就耐濕熱白化性提昇之方面而言,上述丙烯酸系樹脂(A)較佳為進而包含含羥基之(甲基)丙烯酸酯單體(b)作為上述(a)以外之單體成分之單體成分之共聚物。(Hydroxy-containing (meth) acrylate monomer) The acrylic resin (A) preferably further contains a hydroxyl-containing (meth) acrylate monomer (b) in terms of improvement in moisture and heat whitening resistance. A copolymer of a monomer component which is a monomer component other than the above (a).

作為含羥基之(甲基)丙烯酸酯單體(b),例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸5-羥基戊酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯等丙烯酸羥基烷基酯;己內酯改性(甲基)丙烯酸2-羥基乙酯等己內酯改性單體;二乙二醇(甲基)丙烯酸酯、聚乙二醇(甲基)丙烯酸酯等氧伸烷基改性單體;除此以外,亦可列舉:2-丙烯醯氧基乙基-2-羥基乙基鄰苯二甲酸、N-羥甲基(甲基)丙烯醯胺、羥基乙基丙烯醯胺等含一級羥基單體;(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-氯-2-羥基丙酯等含二級羥基單體;(甲基)丙烯酸2,2-二甲基-2-羥基乙酯等含三級羥基單體。 該等可單獨地使用,亦可併用2種以上。Examples of the hydroxyl-containing (meth) acrylate monomer (b) include 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 5-hydroxy (meth) acrylate. Hydroxyalkyl acrylates such as amyl ester, 6-hydroxyhexyl (meth) acrylate, and 8-hydroxyoctyl (meth) acrylate; caprolactones such as caprolactone-modified 2-hydroxyethyl (meth) acrylate Modified monomers; oxyalkylene modified monomers such as diethylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate; in addition to this, 2-propenyloxy Primary hydroxyl-containing monomers such as ethyl-2-hydroxyethyl phthalate, N-hydroxymethyl (meth) acrylamide, hydroxyethylacrylamide; 2-hydroxypropyl (meth) acrylate, Secondary hydroxyl-containing monomers such as 2-hydroxybutyl (meth) acrylate and 3-chloro-2-hydroxypropyl (meth) acrylate; 2,2-dimethyl-2-hydroxyethyl (meth) acrylate Tertiary hydroxyl-containing monomers. These can be used alone or in combination of two or more.

於上述中,就與交聯劑之反應性優異之方面、耐濕熱白化性提昇之方面而言,較佳為含一級羥基單體,進而,就二(甲基)丙烯酸酯等雜質較少,容易製造之方面而言,較佳為丙烯酸2-羥基乙酯、丙烯酸4-羥基丁酯,尤佳為丙烯酸4-羥基丁酯。Among the above, in terms of excellent reactivity with a cross-linking agent and improvement in moist heat and whitening resistance, a primary hydroxyl-containing monomer is preferred, and further, impurities such as di (meth) acrylate are small. In terms of ease of production, 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate are preferred, and 4-hydroxybutyl acrylate is particularly preferred.

作為上述含羥基之(甲基)丙烯酸酯單體(b)於共聚合成分中之含有比率,相對於共聚合成分整體,較佳為5~15質量%,尤佳為8~14質量%,進而較佳為10~13質量%。藉由設為上述範圍內,無耐濕熱白化性降低,或者介電常數變高之虞。The content ratio of the hydroxyl group-containing (meth) acrylate monomer (b) in the copolymerization component is preferably 5 to 15% by mass, and particularly preferably 8 to 14% by mass, with respect to the entire copolymerization component. It is more preferably 10 to 13% by mass. By setting it as the said range, there is no possibility that a moist-heat whitening resistance may fall or a dielectric constant may become high.

又,作為上述單體成分(a)及(b)於共聚合成分中之含有比率,較佳為(a)為50~94質量%,(b)為5~15質量%。Moreover, as content ratio of the said monomer component (a) and (b) in a copolymerization component, (a) is 50-94 mass%, and (b) is 5-15 mass%.

丙烯酸系樹脂(A)中含有之游離酸較佳為1.0%以下,尤佳為0.5%以下,進而較佳為0.1%以下。 藉由設為上述範圍內,無熱穩定性降低,或者進行製造黏著片材時之金屬系被黏著體之腐蝕之虞。 如此,為了減少丙烯酸系樹脂(A)中之游離酸之含量,只要減少含羥基之(甲基)丙烯酸酯單體(b)中含有之游離酸即可,其含量較佳為1.0%以下,尤佳為0.5%以下,進而較佳為0.1%以下。The free acid contained in the acrylic resin (A) is preferably 1.0% or less, particularly preferably 0.5% or less, and further preferably 0.1% or less. By setting it as the said range, there is no possibility that thermal stability may fall or the metal system to be adhered may be corroded at the time of manufacture of an adhesive sheet. Thus, in order to reduce the free acid content in the acrylic resin (A), it is sufficient to reduce the free acid contained in the hydroxyl group-containing (meth) acrylate monomer (b), and its content is preferably 1.0% or less. It is particularly preferably 0.5% or less, and more preferably 0.1% or less.

就將介電常數保持為較低,並且高效率地提高凝聚力之方面而言,上述丙烯酸系樹脂(A)較佳為進而包含具有含支鏈之烷基之(甲基)丙烯酸烷基酯單體(c)作為上述(b)以外之單體成分之單體成分的共聚物。 再者,於具有含支鏈之烷基之(甲基)丙烯酸烷基酯單體具有羥基之情形時,視為含有羥基之(甲基)丙烯酸酯單體(b)。The acrylic resin (A) preferably contains a (meth) acrylic acid alkyl monoester having a branched chain-containing alkyl group in terms of keeping the dielectric constant low and efficiently improving cohesion. The copolymer (c) is a monomer component that is a monomer component other than the above (b). When the (meth) acrylic acid alkyl ester monomer having a branched alkyl group has a hydroxyl group, the (meth) acrylic acid ester monomer (b) containing a hydroxyl group is considered.

作為具有含支鏈之烷基之(甲基)丙烯酸烷基酯單體(c),例如可列舉:烷基中具有三級碳之含支鏈單體;或具有第三丁基之含支鏈單體等。Examples of the (meth) acrylic acid alkyl ester monomer (c) having a branched alkyl group include, for example, a branched chain monomer having a tertiary carbon in the alkyl group; or a branched group containing a third butyl group. Chain monomer and so on.

烷基中具有三級碳之含支鏈單體係可高效率地進行光交聯時之奪氫且提高凝聚力者,(甲基)丙烯酸第三丁酯等具有第三丁基之含支鏈單體係藉由提高玻璃轉移溫度而可提昇凝聚力者。 其中,作為具有含支鏈之烷基之(甲基)丙烯酸烷基酯單體,較佳為使用(甲基)丙烯酸異丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸第三丁酯,尤佳為(甲基)丙烯酸2-乙基己酯或(甲基)丙烯酸第三丁酯。A branched single-chain system with tertiary carbon in the alkyl group can efficiently perform hydrogen abstraction and improve cohesion during photocrosslinking. The third-butyl (meth) acrylate-containing branched chain has a third butyl group. Single system can increase cohesion by increasing glass transition temperature. Among them, as the (meth) acrylic acid alkyl ester monomer having a branched alkyl group, it is preferable to use isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (methyl The third butyl acrylate is particularly preferably 2-ethylhexyl (meth) acrylate or the third butyl (meth) acrylate.

上述共聚合成分中之(a)及(c)於共聚合成分中之含有比率(重量比)較佳為100/0~70/30,尤佳為100/0~80/20,進而較佳為90/10~85/15。藉由設為上述範圍內,無熱穩定性降低,或者黏著物性降低之虞。The content ratio (weight ratio) of (a) and (c) in the copolymerization component in the copolymerization component is preferably 100/0 to 70/30, particularly preferably 100/0 to 80/20, and more preferably It is 90/10 to 85/15. By setting it as the said range, there is no possibility that thermal stability may fall or adhesive property may fall.

上述丙烯酸系樹脂(A)亦可為視需要,作為共聚合成分,進而包含其他可進行共聚合之乙烯性不飽和單體作為單體成分之共聚物。The acrylic resin (A) may be a copolymer containing, as a copolymerization component, another copolymerizable ethylenically unsaturated monomer as a monomer component, if necessary.

作為其他可進行共聚合之乙烯性不飽和單體,例如可列舉:(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、苯基二乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、苯氧基聚乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇-聚丙二醇-(甲基)丙烯酸酯、(甲基)丙烯酸鄰苯基苯氧基乙酯、壬基苯酚環氧乙烷加成物(甲基)丙烯酸酯等含芳香環單體;(甲基)丙烯酸環己酯、(甲基)丙烯酸環己氧基烷基酯、(甲基)丙烯酸第三丁基環己氧基乙酯、(甲基)丙烯酸異基酯、(甲基)丙烯酸二環戊酯等含脂環單體;(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸3-甲氧基丁酯、(甲基)丙烯酸2-丁氧基乙酯、2-丁氧基二乙二醇(甲基)丙烯酸酯、甲氧基二乙二醇(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯、乙氧基二乙二醇(甲基)丙烯酸酯、甲氧基二丙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、辛氧基聚乙二醇-聚丙二醇-單(甲基)丙烯酸酯、十二烷氧基聚乙二醇單(甲基)丙烯酸酯、硬脂氧基聚乙二醇單(甲基)丙烯酸酯等含醚鏈單體;(甲基)丙烯酸、丙烯酸β-羧基乙酯等丙烯酸二聚物、丁烯酸、順丁烯二酸、順丁烯二酸酐、反丁烯二酸、檸康酸、戊烯二酸、伊康酸、N-乙醇酸、桂皮酸等含羧基單體;(甲基)丙烯醯胺、N-(正丁氧基烷基)(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二甲基胺基烷基(甲基)丙烯醯胺等含醯胺基單體;(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸二乙基胺基乙酯或其四級化物等含胺基單體;除此以外,亦可列舉:丙烯腈、甲基丙烯腈、苯乙烯、α-甲基苯乙烯、乙酸乙烯酯、丙酸乙烯酯、硬脂酸乙烯酯、氯乙烯、偏二氯乙烯、烷基乙烯醚、乙烯基甲苯、乙烯基吡啶、乙烯基吡咯啶酮、伊康酸二烷基酯、反丁烯二酸二烷基酯、烯丙醇、氯化烯丙基、甲基乙烯基酮、N-丙烯醯胺甲基三甲基氯化銨、烯丙基三甲基氯化銨、二甲基烯丙基乙烯基酮等。 該等可單獨地使用,亦可併用2種以上。 再者,就耐金屬腐蝕性之觀點而言,上述丙烯酸系樹脂(A)較佳為不包含羧基等酸成分。Examples of other ethylenically unsaturated monomers that can be copolymerized include phenyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, and phenyl diethylene glycol. Alcohol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol-polypropylene glycol- Aromatic ring-containing monomers such as (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, and nonylphenol ethylene oxide adduct (meth) acrylate; (meth) acrylic ring Hexyl ester, cyclohexyloxyalkyl (meth) acrylate, tert-butylcyclohexyloxyethyl (meth) acrylate, isopropyl (meth) acrylate, dicyclopentyl (meth) acrylate And other alicyclic monomers; 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, (meth) 2-butoxyethyl acrylate, 2-butoxydiethylene glycol (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (methyl) Acrylate, ethoxy diethylene glycol (meth) acrylate, Methoxydipropylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, octyloxyethylene glycol-polypropylene glycol-mono (meth) acrylate, dodecyloxy Ether-containing monomers such as polyethylene glycol mono (meth) acrylate and stearyloxy polyethylene glycol mono (meth) acrylate; acrylic acid dimerization such as (meth) acrylic acid and β-carboxyethyl acrylate Compounds, butenoic acid, maleic acid, maleic anhydride, fumaric acid, citraconic acid, glutaric acid, itaconic acid, N-glycolic acid, cinnamic acid, etc .; (Meth) acrylamide, N- (n-butoxyalkyl) (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N, N-diethyl (methyl Methyl) acrylamide, N, N-dimethylaminoalkyl (meth) acrylamine and other amine-containing monomers; dimethylaminoethyl (meth) acrylate, (meth) acrylic acid Diethylaminoethyl or its quaternary compound, and other amine-containing monomers; in addition, acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, and propylene Acid vinyl ester, vinyl stearate, vinyl chloride, vinylidene chloride, alkane Vinyl vinyl ether, vinyl toluene, vinyl pyridine, vinyl pyrrolidone, dialkyl ikonate, dialkyl fumarate, allyl alcohol, allyl chloride, methyl vinyl Ketones, N-acrylamidomethyltrimethylammonium chloride, allyltrimethylammonium chloride, dimethylallyl vinyl ketone, and the like. These can be used alone or in combination of two or more. From the viewpoint of resistance to metal corrosion, the acrylic resin (A) preferably does not contain an acid component such as a carboxyl group.

上述丙烯酸系樹脂(A)可藉由適當選擇上述聚合成分進行聚合而製造。作為丙烯酸系樹脂(A)之聚合方法,例如可使用溶液聚合、懸浮聚合、塊狀聚合、乳化聚合等先前公知之聚合方法,於本發明中,就可安全且穩定地以任意之單體組成製造丙烯酸系樹脂(A)之方面而言,較佳為藉由溶液聚合而製造。The said acrylic resin (A) can be manufactured by superposing | polymerizing suitably selecting the said polymerization component. As the polymerization method of the acrylic resin (A), for example, conventionally known polymerization methods such as solution polymerization, suspension polymerization, block polymerization, and emulsion polymerization can be used. In the present invention, it can be safely and stably composed of an arbitrary monomer. In terms of producing the acrylic resin (A), it is preferably produced by solution polymerization.

以下,示出本發明中所使用之丙烯酸系樹脂(A)之較佳之製造方法之一例。 首先,於有機溶劑中混合或滴下共聚合成分、聚合起始劑,進行溶液聚合而獲得丙烯酸系樹脂(A)溶液。An example of a preferred method for producing the acrylic resin (A) used in the present invention is shown below. First, a copolymerization component and a polymerization initiator are mixed or dropped in an organic solvent, and solution polymerization is performed to obtain an acrylic resin (A) solution.

(有機溶劑) 作為上述聚合反應中所使用之有機溶劑,例如可列舉:甲苯、二甲苯等芳香族烴類;己烷等脂肪族烴類;乙酸乙酯、乙酸丁酯等酯類;N-丙醇、異丙醇等脂肪族醇類;丙酮、甲基乙基酮、甲基異丁基酮、環己酮等酮類等。於該等溶劑中,就可自藉由溶液聚合所獲得之丙烯酸系樹脂溶液將溶劑蒸餾去除,高效率地製造無溶劑型丙烯酸系樹脂之方面而言,較佳為使用沸點為70℃以下之溶劑。(Organic solvent) Examples of the organic solvent used in the polymerization reaction include aromatic hydrocarbons such as toluene and xylene; aliphatic hydrocarbons such as hexane; esters such as ethyl acetate and butyl acetate; N- Aliphatic alcohols such as propanol and isopropanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc. Among these solvents, it is preferable to use a solvent having a boiling point of 70 ° C. or less from the point that the solvent can be distilled off from the acrylic resin solution obtained by the solution polymerization to efficiently produce a solvent-free acrylic resin. Solvent.

作為沸點為70℃以下之有機溶劑,例如可列舉:正己烷(67℃)之類之烴系溶劑、甲醇(65℃)之類之醇系溶劑、乙酸甲酯(54℃)之類之酯系溶劑、丙酮(56℃)之類之酮系溶劑、二乙醚(35℃)、二氯甲烷(40℃)、四氫呋喃(66℃)等,其中,就通用性或安全性之方面而言,較佳為使用丙酮、乙酸甲酯,尤佳為使用丙酮。 再者,繼上述各有機溶劑名稱之後記載之()內之數值為沸點。Examples of the organic solvent having a boiling point of 70 ° C or lower include hydrocarbon solvents such as n-hexane (67 ° C), alcohol solvents such as methanol (65 ° C), and esters such as methyl acetate (54 ° C). Solvents, ketone solvents such as acetone (56 ° C), diethyl ether (35 ° C), dichloromethane (40 ° C), tetrahydrofuran (66 ° C), etc. Among them, in terms of versatility or safety, Preferably, acetone and methyl acetate are used, and acetone is particularly preferably used. In addition, the numerical value in () after the name of each organic solvent mentioned above is a boiling point.

(聚合起始劑) 作為上述聚合反應中所使用之聚合起始劑,可使用作為通常之自由基聚合起始劑之偶氮系聚合起始劑或過氧化物系聚合起始劑等,作為偶氮系聚合起始劑,例如可列舉:2,2'-偶氮雙(2-甲基丁腈)、2,2'-偶氮二異丁腈、(1-苯基乙基)偶氮二苯基甲烷、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2-環丙基丙腈)、2,2'-偶氮雙(4-甲氧基-2,4-二甲基戊腈)等,作為過氧化物系聚合起始劑,例如可列舉:過氧化苯甲醯、過氧化二第三丁基、氫過氧化異丙苯、過氧化月桂醯、過氧化特戊酸第三丁酯、過氧化特戊酸第三己酯、過氧化新癸酸第三己酯、過氧化碳酸二異丙酯、過氧化二異丁醯等。 該等可單獨地使用,或者併用2種以上。(Polymerization initiator) As the polymerization initiator used in the above-mentioned polymerization reaction, an azo-based polymerization initiator or a peroxide-based polymerization initiator, which is a general radical polymerization initiator, can be used as the polymerization initiator. Examples of the azo-based polymerization initiator include 2,2'-azobis (2-methylbutyronitrile), 2,2'-azobisisobutyronitrile, and (1-phenylethyl) coupler. Azodiphenylmethane, 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (2-cyclopropylpropionitrile), 2,2'-azo Examples of the peroxide-based polymerization initiator include nitrogen bis (4-methoxy-2,4-dimethylvaleronitrile), and the like include benzamidine peroxide, ditributyl peroxide, and hydrogen. Cumene peroxide, lauryl peroxide, third butyl pervalerate, third hexyl pervalerate, third hexyl peroxypivalate, diisopropyl percarbonate, peroxy Diisobutyrium oxide and the like. These can be used individually or in combination of 2 or more types.

於上述丙烯酸系樹脂(A)之製造中,較佳為使用沸點為70℃以下者作為溶液聚合之反應溶劑,於相對較低之溫度下進行聚合。 此時,若使用10小時半衰期溫度較高之聚合起始劑,則容易殘存聚合起始劑,若殘存聚合起始劑,則有於下述自丙烯酸系樹脂(A)溶液將溶劑蒸餾去除之步驟中產生丙烯酸系樹脂之凝膠化之傾向。In the production of the above-mentioned acrylic resin (A), it is preferred to use a reaction solvent for solution polymerization with a boiling point of 70 ° C. or lower, and carry out the polymerization at a relatively low temperature. At this time, if a polymerization initiator having a high half-life temperature of 10 hours is used, it is easy to remain the polymerization initiator. If the polymerization initiator is remained, the solvent is distilled off from the acrylic resin (A) solution described below. The acrylic resin tends to gel during the step.

因此,就穩定地進行自藉由溶液聚合所獲得之丙烯酸系樹脂(A)溶液將溶劑蒸餾去除之步驟之方面而言,於上述聚合起始劑中,較佳為使用10小時半衰期溫度未達60℃之聚合起始劑,其中,較佳為2,2'-偶氮雙(2,4-二甲基戊腈)(52℃)、2,2'-偶氮雙(2-環丙基丙腈)(49.6℃)、2,2'-偶氮雙(4-甲氧基2,4-二甲基戊腈)(30℃)、過氧化特戊酸第三丁酯(54.6℃)、過氧化特戊酸第三己酯(53.2℃)、過氧化新癸酸第三己酯(44.5℃)、過氧化碳酸二異丙酯(40.5℃)、過氧化二異丁醯(32.7℃),尤佳為2,2'-偶氮雙(2,4-二甲基戊腈)(52℃)、過氧化特戊酸第三己酯(53.2℃)。 再者,繼上述各化合物名稱之後記載之()內之數值係各化合物之10小時半衰期溫度。Therefore, from the viewpoint of stably performing the step of distilling off the solvent from the acrylic resin (A) solution obtained by the solution polymerization, it is preferred that the above-mentioned polymerization initiator is used for a half-life temperature of less than 10 hours. Polymerization initiators at 60 ° C, of which 2,2'-azobis (2,4-dimethylvaleronitrile) (52 ° C), 2,2'-azobis (2-cyclopropane) are preferred Propionitrile) (49.6 ° C), 2,2'-azobis (4-methoxy2,4-dimethylvaleronitrile) (30 ° C), tert-butyl pervalerate (54.6 ° C) ), Tert-hexyl pivalate (53.2 ° C), tert-hexyl peroxyneodecanoate (44.5 ° C), diisopropyl peroxycarbonate (40.5 ° C), diisobutylphosphonium peroxide (32.7 ℃), particularly preferably 2,2'-azobis (2,4-dimethylvaleronitrile) (52 ° C), and trihexyl pivalate (53.2 ° C). In addition, the numerical value in () after the name of each compound is the 10-hour half-life temperature of each compound.

作為上述聚合起始劑之使用量,相對於聚合成分100質量份,通常為0.001~10質量份,較佳為0.1~8質量份,尤佳為0.5~6質量份,進而較佳為1~4質量份,尤佳為1.5~3質量份,最佳為2~2.5質量份。藉由設為上述範圍內,無丙烯酸系樹脂之聚合率降低,或者殘存單體增加,或者丙烯酸系樹脂之重量平均分子量變高之虞。The amount of the polymerization initiator used is usually 0.001 to 10 parts by mass, preferably 0.1 to 8 parts by mass, more preferably 0.5 to 6 parts by mass, and even more preferably 1 to 100 parts by mass of the polymerization component. 4 parts by mass, particularly preferably 1.5 to 3 parts by mass, and most preferably 2 to 2.5 parts by mass. By setting it as the said range, there exists no possibility that the polymerization rate of an acrylic resin may fall, or residual monomer may increase, or the weight average molecular weight of an acrylic resin may become high.

(聚合條件等) 關於溶液聚合之聚合條件,只要按照先前公知之聚合條件進行聚合即可,例如可於溶劑中混合或滴下含有(甲基)丙烯酸系單體之聚合成分、聚合起始劑,於特定之聚合條件下進行聚合。(Polymerization conditions, etc.) Regarding the polymerization conditions for solution polymerization, the polymerization may be performed according to conventionally known polymerization conditions. For example, a polymerization component containing a (meth) acrylic monomer and a polymerization initiator may be mixed or dropped in a solvent. Polymerization is carried out under specific polymerization conditions.

上述聚合反應中之聚合溫度通常為40~120℃,就可穩定地進行反應之方面而言,較佳為50~90℃,進而較佳為55~75℃,尤佳為60~70℃。藉由設為上述範圍內,無丙烯酸系樹脂(A)容易凝膠化,或者聚合起始劑之活性降低,而聚合率降低,殘存單體增加之虞。The polymerization temperature in the above-mentioned polymerization reaction is usually 40 to 120 ° C. In terms of allowing the reaction to proceed stably, it is preferably 50 to 90 ° C, more preferably 55 to 75 ° C, and particularly preferably 60 to 70 ° C. By setting it as the said range, there is no possibility that an acryl-type resin (A) will gel easily, or the activity of a polymerization initiator will fall, and a polymerization rate will fall, and a residual monomer may increase.

又,聚合反應中之聚合時間(於進行下述縱縮加熱之情形時,為縱縮加熱開始之前之時間)並無特別限制,為自最後之聚合起始劑之添加起0.5小時以上,較佳為1小時以上,進而較佳為2小時以上,尤佳為5小時以上。 再者,就容易除熱之方面而言,聚合反應較佳為一面使溶劑回流一面進行。The polymerization time in the polymerization reaction (the time before the start of the shrinking heating when the following shrinking heating is performed) is not particularly limited, and it is 0.5 hours or more from the last addition of the polymerization initiator. It is preferably at least 1 hour, more preferably at least 2 hours, and even more preferably at least 5 hours. In addition, in terms of easy removal of heat, the polymerization reaction is preferably performed while refluxing the solvent.

於丙烯酸系樹脂(A)之製造中,為了降低殘存聚合起始劑之量,較佳為進行縱縮加熱以將聚合起始劑加熱分解。In the production of the acrylic resin (A), in order to reduce the amount of the residual polymerization initiator, it is preferable to perform longitudinal heating to thermally decompose the polymerization initiator.

上述縱縮加熱溫度較佳為於高於上述聚合起始劑之10小時半衰期溫度之溫度下進行,具體而言,通常為40~150℃,就抑制凝膠化之方面而言,較佳為55~130℃,尤佳為75~95℃。藉由設為上述範圍內,無丙烯酸系樹脂(A)發生黃變,或者殘存聚合單體或聚合起始劑,丙烯酸系樹脂(A)之經時穩定性或熱穩定性降低之虞。The longitudinal heating temperature is preferably performed at a temperature higher than the 10-hour half-life temperature of the polymerization initiator. Specifically, it is usually 40 to 150 ° C. In terms of suppressing gelation, it is preferably 55 to 130 ° C, particularly preferably 75 to 95 ° C. By setting it as the said range, there is no possibility that an acryl-type resin (A) will yellow, or a polymerization monomer or a polymerization initiator will remain, and the acryl-type resin (A) may fall over time and thermal stability.

如此,可獲得丙烯酸系樹脂(A)溶液。 繼而,自所獲得之丙烯酸系樹脂(A)溶液將溶劑蒸餾去除。 自丙烯酸系樹脂(A)溶液將溶劑蒸餾去除之步驟可藉由公知一般之方法進行,作為將溶劑蒸餾去除之方法,有藉由進行加熱而將溶劑蒸餾去除之方法;或藉由進行減壓而將溶劑蒸餾去除之方法等,就有效率地進行溶劑之蒸餾去除之方面而言,較佳為藉由於減壓下進行加熱而進行蒸餾去除之方法。In this way, an acrylic resin (A) solution can be obtained. Then, the solvent was distilled off from the obtained acrylic resin (A) solution. The step of distilling off the solvent from the acrylic resin (A) solution can be performed by a known general method. As a method of distilling off the solvent, there is a method of distilling off the solvent by heating; or by reducing the pressure The method of distilling off the solvent, etc., is preferably a method of distilling off by heating under reduced pressure in terms of efficiently distilling off the solvent.

作為進行加熱而將溶劑蒸餾去除之情形時之溫度,較佳為於60~150℃下進行,就使殘存溶劑量極少之方面而言,尤佳為於60~80℃下保持使丙烯酸系樹脂(A)進行聚合後之反應溶液而使溶劑餾出,繼而,於80~150℃下使溶劑餾出。再者,就抑制丙烯酸系樹脂(A)之凝膠化之方面而言,較佳為溶劑蒸餾去除時之溫度不以150℃以上進行。The temperature in the case where the solvent is distilled off by heating is preferably performed at 60 to 150 ° C. In terms of minimizing the amount of residual solvent, it is particularly preferable to keep the acrylic resin at 60 to 80 ° C. (A) The reaction solution after polymerization is carried out to distill off the solvent, and the solvent is then distilled off at 80 to 150 ° C. Furthermore, from the viewpoint of suppressing gelation of the acrylic resin (A), it is preferred that the temperature during solvent removal is not performed at 150 ° C or higher.

作為進行減壓而將溶劑蒸餾去除之情形時之壓力,較佳為於20~101.3 kPa下進行,就使殘存溶劑量極少之方面而言,尤佳為於50~101.3 kPa之範圍內保持而使反應溶液中之溶劑餾出後,於0~50 kPa下使殘存溶劑餾出。 如此,可製造丙烯酸系樹脂(A)。The pressure in the case where the solvent is distilled off under reduced pressure is preferably performed at 20 to 101.3 kPa. In terms of keeping the amount of the residual solvent extremely small, it is particularly preferable to maintain the pressure within a range of 50 to 101.3 kPa. After the solvent in the reaction solution was distilled off, the residual solvent was distilled off at 0 to 50 kPa. In this way, an acrylic resin (A) can be produced.

上述丙烯酸系樹脂(A)之重量平均分子量較佳為10萬以上,進而較佳為15萬~150萬,尤佳為20萬~100萬,尤佳為25萬~80萬,其中,尤佳為30萬~60萬。 藉由設為上述範圍內,無黏度變得過高,塗敷性或處理性降低,或者凝聚力降低,耐久性降低之虞。 再者,上述丙烯酸系樹脂(A)之重量平均分子量係製造完成時之重量平均分子量,且為於製造後未進行加熱等之丙烯酸系樹脂(A)之重量平均分子量。The weight average molecular weight of the above-mentioned acrylic resin (A) is preferably 100,000 or more, more preferably 150,000 to 1.5 million, particularly preferably 200,000 to 1,000,000, particularly preferably 250,000 to 800,000, and among them, particularly preferred It is 300,000 to 600,000. By setting it as the said range, there is no possibility that viscosity will become high too much, coating property or handling property may fall, or cohesion may fall, and durability may fall. In addition, the weight average molecular weight of the said acrylic resin (A) is a weight average molecular weight at the time of completion of manufacture, and is a weight average molecular weight of the acrylic resin (A) which did not heat, etc. after manufacture.

又,丙烯酸系樹脂(A)之分散度(重量平均分子量/數量平均分子量)較佳為15以下,進而較佳為10以下,尤佳為7以下,尤佳為5以下。藉由設為此種範圍內,無各層之耐久性能降低,產生發泡等,或者操作性降低之虞。再者,就製造之極限之方面而言,分散度之下限通常為1.1。The dispersion (weight average molecular weight / number average molecular weight) of the acrylic resin (A) is preferably 15 or less, more preferably 10 or less, particularly preferably 7 or less, and even more preferably 5 or less. By setting it as such a range, there exists no possibility that durability of each layer may fall, foaming, etc. may arise, or workability may fall. Furthermore, in terms of manufacturing limits, the lower limit of dispersion is usually 1.1.

再者,上述重量平均分子量係藉由標準聚苯乙烯分子量換算所獲得之重量平均分子量,為藉由高效液相層析儀(日本Waters公司製造,「Waters 2695(本體)」及「Waters 2414(檢測器)」)使用管柱:Shodex GPC KF-806L(排除極限分子量:2×107 ,分離範圍:100~2×107 ,理論段數:10,000段/根,填充劑材質:苯乙烯-二乙烯基苯共聚物,填充劑粒徑:10 μm)之3根串聯所測得者,數量平均分子量亦可使用相同之方法進行測定。又,分散度係根據重量平均分子量及數量平均分子量求出。In addition, the above weight average molecular weight is a weight average molecular weight obtained by standard polystyrene molecular weight conversion, and is a high performance liquid chromatograph (manufactured by Waters Corporation of Japan, Detector) ") Using a column: Shodex GPC KF-806L (Excluding limit molecular weight: 2 × 10 7 , separation range: 100 ~ 2 × 10 7 , theoretical number of segments: 10,000 segments / piece, filler material: styrene- Divinylbenzene copolymer, filler particle size: 10 μm) measured in series of three, the number average molecular weight can also be measured using the same method. The degree of dispersion is determined from the weight average molecular weight and the number average molecular weight.

上述丙烯酸系樹脂(A)之玻璃轉移溫度(Tg)較佳為-100~50℃,尤佳為-80~0℃,進而較佳為-70~-10℃。藉由設為上述範圍內,無丙烯酸系樹脂(A)之熔融黏度變高,或者塗敷時所需之加熱溫度變高,有損丙烯酸系樹脂(A)之穩定性之虞。 又,亦無階差追隨性或黏著力降低,或者熱耐久性降低之虞。The glass transition temperature (Tg) of the acrylic resin (A) is preferably -100 to 50 ° C, more preferably -80 to 0 ° C, and still more preferably -70 to -10 ° C. By setting it as the said range, there is no possibility that the melt viscosity of an acrylic resin (A) becomes high, or the heating temperature required at the time of coating becomes high, and there exists a possibility that the stability of an acrylic resin (A) may be impaired. In addition, there is no possibility that the step-following property, the adhesive force, or the thermal durability is reduced.

再者,玻璃轉移溫度係根據下述Fox之下述數式1算出者。 [數1]Tg:共聚物之玻璃轉移溫度(K) Tga:單體A之均聚物之玻璃轉移溫度(K) Wa:單體A之重量分率 Tgb:單體B之均聚物之玻璃轉移溫度(K) Wb:單體B之重量分率 Tgn:單體N之均聚物之玻璃轉移溫度(K) Wn:單體N之重量分率(Wa+Wb+・・・+Wn=1)It should be noted that the glass transition temperature is calculated based on the following Equation 1 of Fox. [Number 1] Tg: glass transition temperature (K) of copolymer Tga: glass transition temperature (K) of homopolymer of monomer A Wa: weight fraction of monomer A Tgb: glass transition temperature of homopolymer of monomer B ( K) Wb: weight fraction of monomer B Tgn: glass transition temperature of homopolymer of monomer N (K) Wn: weight fraction of monomer N (Wa + Wb + .... + Wn = 1)

上述丙烯酸系樹脂(A)於100℃下之熔融黏度(mPa・s)較佳為1,000~10,000,000 mPa・s,尤佳為50,000~1,000,000 mPa・s,進而較佳為200,000~600,000 mPa・s。藉由設為上述範圍內,無變得因分子量降低所引起之耐久性不足,或者操作性降低,難以塗敷之虞。The melt viscosity (mPa · s) of the acrylic resin (A) at 100 ° C is preferably 1,000 to 10,000,000 mPa · s, more preferably 50,000 to 1,000,000 mPa · s, and still more preferably 200,000 to 600,000 mPa · s. By setting it as the said range, there is no possibility that the durability may become insufficient due to a molecular weight fall, or a handleability may fall and it may become difficult to apply.

再者,上述黏度係使用島津製作所製造之高化式流變儀,於負載30 kg、孔徑1.0 mm、模具長度10 mm、測定溫度100℃之條件下進行測定所獲得之值。The viscosity is a value obtained by performing measurement under the conditions of a load of 30 kg, a hole diameter of 1.0 mm, a mold length of 10 mm, and a measurement temperature of 100 ° C. using a rheometer manufactured by Shimadzu Corporation.

上述丙烯酸系樹脂(A)較佳為實質上不含有溶劑之無溶劑型丙烯酸系樹脂,丙烯酸系樹脂(A)之溶劑含量較佳為2質量%以下,進而較佳為0.00001~2質量%,尤佳為0.0001~1質量%,尤佳為0.001~0.1質量%。藉由設為上述範圍內,無產生氣泡,或者耐久性降低之虞。The acrylic resin (A) is preferably a solvent-free acrylic resin that does not substantially contain a solvent, and the solvent content of the acrylic resin (A) is preferably 2% by mass or less, and more preferably 0.00001 to 2% by mass. It is particularly preferably 0.0001 to 1% by mass, and particularly preferably 0.001 to 0.1% by mass. By setting it as the said range, there is no possibility that a bubble may generate | occur | produce, or durability may fall.

又,丙烯酸系樹脂(A)中之殘存單體量較佳為2質量%以下,尤佳為0.00001~1.5質量%,進而較佳為0.0001~1.0質量%。藉由設為上述範圍內,無於進行加熱時分子量增加,塗敷性或黏著物性降低,或者產生氣泡,耐久性降低之虞。The amount of residual monomers in the acrylic resin (A) is preferably 2% by mass or less, more preferably 0.00001 to 1.5% by mass, and still more preferably 0.0001 to 1.0% by mass. By setting it as the said range, there is no possibility that molecular weight will increase at the time of heating, coating property or adhesive property will fall, or a bubble may generate | occur | produce and durability may fall.

再者,上述丙烯酸系樹脂(A)中之溶劑含量及殘存單體量係藉由甲苯將丙烯酸系樹脂(A)稀釋20倍,使用氣相層析儀/質量碎片檢測器(GC:Agilent Technologies公司製造 7890A GCsystem,MSD:Agilent Technologies公司製造 5975inert)所測得之值。In addition, the solvent content and the amount of residual monomers in the acrylic resin (A) were diluted 20 times with acrylic resin (A) using toluene, and a gas chromatograph / mass detector (GC: Agilent Technologies) was used. The company manufactured 7890A GCsystem, MSD: 5975inert manufactured by Agilent Technologies).

又,丙烯酸系樹脂(A)中之揮發成分含量(通常,溶劑及殘存單體為主成分)較佳為2質量%以下,尤佳為0.00001~1.5質量%,進而較佳為0.0001~1.0質量%。藉由設為上述範圍內,無於進行加熱時丙烯酸系樹脂(A)之分子量增加,塗敷性降低,或者黏著物性降低,或者產生氣泡,耐久性降低之虞。The content of volatile components in the acrylic resin (A) (usually, the solvent and the residual monomers are the main components) is preferably 2% by mass or less, more preferably 0.00001 to 1.5% by mass, and still more preferably 0.0001 to 1.0% by mass. %. By setting it as the said range, there is no possibility that the molecular weight of an acrylic resin (A) will increase at the time of heating, a coating property may fall, or adhesive physical property may fall, or a bubble may generate | occur | produce, and durability may fall.

再者,上述丙烯酸系樹脂(A)中之揮發成分含量係將丙烯酸系樹脂(A)於熱風乾燥器中,於130℃下加熱1小時,根據加熱前與加熱後之重量變化所算出之值。The content of volatile components in the acrylic resin (A) is a value calculated by heating the acrylic resin (A) in a hot air dryer at 130 ° C. for 1 hour, and based on the change in weight before and after heating. .

<交聯劑> 就用以提昇作為黏著片材之操作性(例如切割性、二次加工性、保管性)之高凝聚力化之方面而言,本黏著片材亦可由除上述丙烯酸系樹脂(A)以外亦含有交聯劑(B)之組合物形成。<Crosslinking agent> In order to improve the cohesiveness of the workability (for example, cutting properties, secondary processability, and storage properties) of the adhesive sheet, the present adhesive sheet can also be obtained by removing the acrylic resin ( A composition containing a crosslinking agent (B) in addition to A) is formed.

作為上述交聯劑(B),例如可列舉具有選自(甲基)丙烯醯基、環氧基、異氰酸基、羧基、羥基、碳二醯亞胺基、㗁唑啉基、氮丙啶基、乙烯基、胺基、亞胺基、醯胺基中之至少1種交聯性官能基之交聯劑,可使用1種或者組合2種以上而使用。 再者,上述交聯性官能基可藉由可去保護之保護基保護。Examples of the crosslinking agent (B) include those having a group selected from (meth) acrylfluorenyl, epoxy, isocyano, carboxyl, hydroxyl, carbodiimide, oxazoline, and aziridine. The crosslinking agent of at least one type of crosslinkable functional group among a pyridyl group, a vinyl group, an amino group, an imino group, and a fluorenyl group may be used singly or in combination of two or more kinds. The crosslinkable functional group can be protected by a deprotectable protecting group.

其中,可較佳地使用具有2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯;具有2個以上之異氰酸基、環氧基、三聚氰胺基、二醇基、矽氧烷基、胺基等有機官能基之多官能有機官能基樹脂;具有鋅、鋁、鈉、鋯、鈣等金屬錯合物之有機金屬化合物。Among them, a polyfunctional (meth) acrylate having two or more (meth) acrylfluorenyl groups; an isocyanate group, an epoxy group, a melamine group, a diol group, Multifunctional organic functional resins with organic functional groups such as siloxyalkyl and amine groups; organometallic compounds with metal complexes such as zinc, aluminum, sodium, zirconium, and calcium.

作為上述多官能(甲基)丙烯酸酯,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、甘油縮水甘油醚二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚烷氧基二(甲基)丙烯酸酯、雙酚F聚烷氧基二(甲基)丙烯酸酯、聚伸烷基二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧乙基(甲基)丙烯酸酯、ε-己內酯改性三(2-羥基乙基)異氰尿酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、丙氧化季戊四醇三(甲基)丙烯酸酯、乙氧化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、異氰尿酸三(丙烯醯氧基乙基)酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、羥基特戊酸新戊二醇二(甲基)丙烯酸酯、羥基特戊酸新戊二醇酯之ε-己內酯加成物之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、烷氧化三羥甲基丙烷三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯等紫外線硬化型多官能單體類;以及聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸酯低聚物類。Examples of the polyfunctional (meth) acrylate include 1,4-butanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and glycerol di (meth) acrylate , Glycerol glycidyl ether di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, tricyclodecane dimethanol (Meth) acrylate, bisphenol A polyethoxydi (meth) acrylate, bisphenol A polyalkoxydi (meth) acrylate, bisphenol F polyalkoxydi (meth) acrylic acid Ester, polyalkylene glycol di (meth) acrylate, trimethylolpropane trioxyethyl (meth) acrylate, ε-caprolactone modified tri (2-hydroxyethyl) isocyanuric acid Tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate ethoxylate, pentaerythritol tetra (meth) acrylate, propionate Pentaerythritol tetra (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, polyethylene glycol di (meth) acrylate, isocyanate Tris (acryloxyethyl) acid, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate , Tripentaerythritol penta (meth) acrylate, neopentyl glycol di (meth) acrylate, ε-caprolactone adduct of neopentyl glycol hydroxypivalate (methyl) ) UV curing type such as acrylate, trimethylolpropane tri (meth) acrylate, alkoxylated trimethylolpropane tri (meth) acrylate, di-trimethylolpropane tetra (meth) acrylate, etc. Polyfunctional monomers; and low polyfunctional acrylates such as polyester (meth) acrylate, epoxy (meth) acrylate, (meth) acrylate urethane, and polyether (meth) acrylate Polymer class.

於上述所列舉之化合物中,就提昇對被黏著體之密接性或濕熱白化抑制之效果之觀點而言,於上述多官能(甲基)丙烯酸酯單體中,較佳為含有羥基或羧基、醯胺基等極性官能基之多官能單體或低聚物。其中,較佳為使用具有羥基或醯胺基之多官能(甲基)丙烯酸酯。Among the above-listed compounds, from the viewpoint of improving the adhesion to the adherend or the effect of suppressing moist heat whitening, it is preferable that the polyfunctional (meth) acrylate monomer contains a hydroxyl group or a carboxyl group, Polyfunctional monomers or oligomers of polar functional groups such as amido. Among these, it is preferable to use a polyfunctional (meth) acrylate having a hydroxyl group or an amido group.

又,為了調整密接性或耐濕熱性、耐熱性等效果,亦可進而加入與交聯劑進行反應之單官能或多官能之(甲基)丙烯酸酯。In addition, in order to adjust effects such as adhesion, moist heat resistance, and heat resistance, a monofunctional or polyfunctional (meth) acrylate that reacts with a crosslinking agent may be further added.

就保持黏著劑組合物之柔軟性與凝聚力之平衡之觀點而言,交聯劑之含量相對於上述丙烯酸系樹脂(A)100質量份,較佳為以0.1~20質量份之比率含有,其中,尤佳為0.5質量份以上或15質量份以下之比率,其中,尤佳為1質量份以上或13質量份以下之比率。From the viewpoint of maintaining the balance between the flexibility and cohesiveness of the adhesive composition, the content of the crosslinking agent is preferably contained in a ratio of 0.1 to 20 parts by mass relative to 100 parts by mass of the acrylic resin (A), wherein , Particularly preferably, a ratio of 0.5 parts by mass or more or 15 parts by mass or less, and particularly preferably, a ratio of 1 part by mass or more or 13 parts by mass or less.

就賦予更優異之操作性(例如切割性、二次加工性、保管性)之方面而言,上述積層構成之本黏著片材較佳為於第i層包含交聯劑(B),其中,最佳為包含於第1及第n層以外之層、即表層及背層之層以外之層。In terms of imparting more excellent workability (for example, cuttability, secondary processability, and storage stability), the present adhesive sheet composed of the above-mentioned laminated layer preferably contains a crosslinking agent (B) in the i-th layer, of which, Most preferably, it is a layer other than the first and nth layers, that is, a layer other than the surface layer and the back layer.

<光聚合起始劑> 本黏著片材含有丙烯酸系樹脂(A),就可使活性能量線照射時之反應穩定化之方面而言,亦可由除丙烯酸系樹脂(A)以外亦含有光聚合起始劑(C)之組合物形成。<Photopolymerization initiator> This adhesive sheet contains an acrylic resin (A), and from the viewpoint of stabilizing the reaction upon irradiation with active energy rays, it may contain photopolymerization in addition to the acrylic resin (A). A composition of the initiator (C) is formed.

作為上述光聚合起始劑(C),只要為藉由光之作用而產生自由基者,則無特別限定,例如可列舉:苯乙酮系、安息香系、二苯甲酮系、9-氧硫系、醯基氧化膦系等之光聚合起始劑,就可於分子間或分子內有效率地交聯之方面而言,較佳為使用奪氫型之二苯甲酮系光聚合起始劑。The photopolymerization initiator (C) is not particularly limited as long as it generates radicals by the action of light. Examples include acetophenone-based, benzoin-based, benzophenone-based, and 9-oxygen. sulfur For photopolymerization initiators such as fluorene-based and fluorenylphosphine oxide-based systems, it is preferable to use a hydrogen-abstracting type benzophenone-based photopolymerization in terms of efficient crosslinking between molecules or molecules. Agent.

作為二苯甲酮系光聚合起始劑,例如可列舉:二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮等。 該等可單獨地使用,亦可併用2種以上。Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzophenone benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and polyvinyldiene. Benzophenone and so on. These can be used alone or in combination of two or more.

又,作為該等光聚合起始劑之助劑,例如亦可併用三乙醇胺、三異丙醇胺、4,4'-二甲基胺基二苯甲酮(米其勒酮)、4,4'-二乙基胺基二苯甲酮、2-二甲基胺基乙基苯甲酸、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸(正丁氧基)乙酯、4-二甲基胺基苯甲酸異戊酯、4-二甲基胺基苯甲酸2-乙基己酯、2,4-二乙基9-氧硫、2,4-二異丙基9-氧硫等。該等助劑亦可單獨地使用,亦可併用2種以上。Moreover, as an auxiliary agent of these photopolymerization initiators, for example, triethanolamine, triisopropanolamine, 4,4'-dimethylaminobenzophenone (Michlerone), 4, 4'-Diethylaminobenzophenone, 2-dimethylaminoethylbenzoic acid, 4-dimethylaminobenzoic acid ethyl ester, 4-dimethylaminobenzoic acid (n-butoxy Methyl) ethyl ester, 4-dimethylaminobenzoic acid isoamyl ester, 4-dimethylaminobenzoic acid 2-ethylhexyl ester, 2,4-diethyl 9-oxysulfide 2,4-diisopropyl 9-oxysulfur Wait. These auxiliaries may be used alone or in combination of two or more.

關於此種光聚合起始劑(C)之調配量,相對於上述丙烯酸系樹脂(A)100質量份,較佳為0.01~10質量份,尤佳為0.1~5質量份,進而較佳為0.5~2質量份。若此種調配量過少,則無硬化速度降低,或者硬化變得不充分之虞。The blending amount of such a photopolymerization initiator (C) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, and even more preferably 100 parts by mass of the acrylic resin (A). 0.5 to 2 parts by mass. If such a blending amount is too small, there is no fear that the curing speed will be reduced or the curing will become insufficient.

<其他成分> 本黏著片材亦可由除上述以外,亦含有通常之黏著組合物中所調配之公知之成分的組合物形成。例如可適當含有黏著賦予樹脂、或加工助劑(油成分等)、矽烷偶合劑、抗氧化劑、光穩定劑、金屬減活劑、紫外線吸收劑(UVA)、光穩定劑(HALS)、防銹劑、防老化劑、吸濕劑、水解防止劑、成核劑等各種添加劑。無機系或有機系奈米微粒子等亦包含於其中。 該等之中,更佳為包含防銹劑或黏著賦予劑。 又,亦可視需要適當含有反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等)。<Other Ingredients> The adhesive sheet may be formed of a composition containing a well-known component formulated in a general adhesive composition in addition to the above. For example, it may suitably contain adhesion-imparting resins or processing aids (such as oil components), silane coupling agents, antioxidants, light stabilizers, metal deactivators, ultraviolet absorbers (UVA), light stabilizers (HALS), and rust prevention. Additives, anti-aging agents, hygroscopic agents, hydrolysis inhibitors, nucleating agents and other additives. Inorganic or organic nanofine particles are also included. Among these, it is more preferable to include a rust inhibitor or an adhesion-imparting agent. Further, a reaction catalyst (a tertiary amine compound, a quaternary ammonium compound, a tin laurate compound, etc.) may be appropriately contained as necessary.

<本黏著片材之製造方法> 本黏著片材可藉由如下方式製造:將含有上述丙烯酸系樹脂(A)以及視需要之交聯劑(B)及光聚合起始劑(C)之樹脂組合物於已藉由熱而熔融之狀態下塗佈(塗敷)於基材片材或脫模片材上,其後進行冷卻。 又,例如積層構成之本黏著片材可藉由如下方法製作:將上述樹脂組合物於已藉由熱而熔融之狀態下塗佈(塗敷)於基材片材或脫模片材上,其後進行冷卻而形成第1層,於所形成之第1層上塗佈(塗敷)該樹脂組合物,其後進行冷卻而形成第2層,反覆進行該操作而形成第i層;或者藉由加熱使該樹脂組合物熔融,以與上述相同之方式預先形成第1層至第i層,其後將各自之塗佈(塗敷)面彼此貼合;或者藉由加熱使該樹脂組合物熔融,藉由共擠出成型而同時形成第1層至第i層。<The manufacturing method of this adhesive sheet> This adhesive sheet can be manufactured by the resin which contains the said acrylic resin (A) and the crosslinking agent (B) and photoinitiator (C) as needed The composition is applied (coated) to a substrate sheet or a release sheet in a state of being melted by heat, and then cooled. In addition, for example, the present adhesive sheet composed of a laminate can be produced by applying (applying) the above-mentioned resin composition to a base material sheet or a release sheet in a state of being melted by heat, Thereafter, cooling is performed to form a first layer, and the resin composition is coated (coated) on the formed first layer, followed by cooling to form a second layer, and this operation is repeatedly performed to form an i layer; or The resin composition is melted by heating, and the first layer to the i-th layer are formed in advance in the same manner as described above, and then the respective coated (applied) surfaces are bonded to each other; or the resin is combined by heating The material is melted, and the first layer to the i-th layer are simultaneously formed by coextrusion.

作為上述塗佈(塗敷)方法,只要為一般之塗敷方法,則無特別限定,例如可列舉:輥式塗佈、模嘴塗佈、凹版塗佈、刮刀式塗佈、網版印刷等方法。The coating (coating) method is not particularly limited as long as it is a general coating method, and examples thereof include roll coating, die coating, gravure coating, doctor blade coating, and screen printing. method.

本黏著片材可為於基材片材上設置有黏著劑層之附基材片材之黏著片材,亦可為於脫模片材上設置有黏著劑層之無基材之黏著片材。The adhesive sheet may be an adhesive sheet with a base material sheet provided with an adhesive layer on a base material sheet, or an adhesive sheet without a base material provided with an adhesive layer on a release sheet. .

作為基材片材,例如可列舉:聚萘二甲酸乙二酯、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚對苯二甲酸乙二酯/間苯二甲酸酯共聚物等聚酯系樹脂;聚乙烯、聚丙烯、聚甲基戊烯等聚烯烴系樹脂;聚氟乙烯(polyvinyl fluoride)、聚偏二氟乙烯、聚氟乙烯(polyfluoroethylene)等聚氟乙烯(polyfluoroethylene)樹脂;尼龍6、尼龍6,6等聚醯胺;聚氯乙烯、聚氯乙烯/乙酸乙烯酯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-乙烯醇共聚物、聚乙烯醇、維尼綸等乙烯基聚合物;三乙酸纖維素、賽璐凡等纖維素系樹脂;聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚丙烯酸乙酯、聚丙烯酸丁酯等丙烯酸系樹脂;聚苯乙烯;聚碳酸酯;聚芳酯;聚醯亞胺等合成樹脂片材,鋁、銅、鐵之金屬箔,道林紙、玻璃紙等紙,包含玻璃纖維、天然纖維、合成纖維等之梭織物或不織布。該等基材片材可以單層體之形式使用、或者以積層有2種以上之複層體之形式使用。該等之中,就輕量化等方面而言,較佳為合成樹脂片材。Examples of the base material sheet include polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate, and polyethylene terephthalate / isophthalic acid. Polyester resins such as ester copolymers; polyolefin resins such as polyethylene, polypropylene, and polymethylpentene; polyvinyl fluoride, polyvinylidene fluoride, and polyvinyl fluoride (polyfluoroethylene) (polyfluoroethylene) resin; polyamides such as nylon 6, nylon 6,6; polyvinyl chloride, polyvinyl chloride / vinyl acetate copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, Vinyl polymers such as vinylon; cellulose resins such as cellulose triacetate and cellulan; acrylic resins such as polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, and polybutyl acrylate; Polystyrene; polycarbonate; polyarylate; polyimide and other synthetic resin sheets, aluminum, copper, iron metal foils, papers such as dory paper, cellophane, including glass fibers, natural fibers, synthetic fibers, etc. Woven or non-woven. These base material sheets may be used in the form of a single layer body, or in the form of a multilayer body in which two or more kinds are laminated. Among these, a synthetic resin sheet is preferable in terms of weight reduction and the like.

作為上述脫模片材,例如可使用對上述基材片材中所例示之各種合成樹脂片材、紙、布、不織布等進行脫模處理所得者。作為脫模片材,較佳為使用矽系脫模片材。As the above-mentioned release sheet, for example, those obtained by subjecting various synthetic resin sheets, papers, cloths, nonwoven fabrics, and the like exemplified in the above-mentioned substrate sheet to a release treatment can be used. As the release sheet, a silicon-based release sheet is preferably used.

<本黏著片材之使用方法> 本黏著片材較佳為於貼合於被黏著構件後,照射活性能量線而使用。 因此,本黏著片材較佳為於以365 nm之累計光量成為2000 mJ以上之方式照射活性能量線之情形時,於照射前後,第1層於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為5 kPa以上,且第i層於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為2 kPa以上。<How to use this adhesive sheet> This adhesive sheet is preferably used after being adhered to an adhered member and irradiated with active energy rays. Therefore, when the adhesive sheet is irradiated with active energy rays in such a way that the accumulated light quantity at 365 nm becomes 2000 mJ or more, the elastic modulus of the first layer is stored at a frequency of 1 Hz and a temperature of 80 ° C before and after the irradiation. The difference between the number G '(the storage elastic modulus G' after irradiation-the storage elastic modulus G 'before irradiation) becomes 5 kPa or more, and the storage elastic modulus G of the i-th layer at a frequency of 1 Hz and a temperature of 80 ° C The difference (the storage elastic modulus G 'after irradiation-the storage elastic modulus G' before irradiation) becomes 2 kPa or more.

又,於上述構成中,就賦予階差吸收及耐發泡可靠性之方面而言,第1層較佳為於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為5 kPa以上,第i層較佳為於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為4 kPa以上。In the above configuration, in terms of imparting step absorption and resistance to foaming reliability, the first layer preferably has a difference in storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 80 ° C. (after irradiation) The storage elastic modulus G '-the storage elastic modulus G' before irradiation becomes 5 kPa or more, and the i-th layer is preferably the difference between the storage elastic modulus G 'at a frequency of 1 Hz and a temperature of 80 ° C (after irradiation The storage elastic modulus G '-the storage elastic modulus G' before irradiation becomes 4 kPa or more.

如此,本黏著片材留有可藉由活性能量線進行硬化之餘地,其中,若以具有上述範圍之儲存彈性模數差之方式預先調整硬化之程度,則可實現低介電常數化,並且具有極高之印刷階差吸收性。 再者,上述儲存彈性模數G'可藉由上述方法進行調節。In this way, this adhesive sheet has room for hardening by active energy rays. Among them, if the degree of hardening is adjusted in advance with a difference in storage elastic modulus within the above range, a low dielectric constant can be achieved, and Has very high absorption of printing steps. Moreover, the storage elastic modulus G ′ can be adjusted by the above method.

(用途) 本黏著片材可用於光學構件用、例如圖像顯示裝置構成構件之貼合。作為圖像顯示裝置構成構件,例如可列舉:個人電腦、行動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等LCD(liquid crystal display,液晶顯示裝置)、PDP(plasma display panel,電漿顯示器)或EL(electroluminescence,電致發光裝置)等圖像顯示裝置之構成構件。(Application) The adhesive sheet can be used for bonding optical components, for example, components of image display devices. Examples of the constituent elements of the image display device include a liquid crystal display (LCD) such as a personal computer, a mobile terminal (PDA), a game machine, a television (TV), a car navigation system, a touch panel, and a tablet. Structural components of image display devices such as PDP (plasma display panel) or EL (electroluminescence).

若列舉具體之一例,則有於行動電話之圖像顯示裝置中,於液晶面板顯示器(LCD)上積層偏光膜等,於其上經由黏著劑或片材而積層塑膠製保護面板之情形。此時,有使用PVA(polyvinyl alcohol,聚乙烯醇)或三乙醯纖維素樹脂作為該偏光膜之構成材料之情形,判明該等容易釋出氣體。To give a specific example, in an image display device of a mobile phone, a polarizing film or the like is laminated on a liquid crystal panel display (LCD), and a plastic protective panel is laminated thereon via an adhesive or a sheet. At this time, PVA (polyvinyl alcohol, polyvinyl alcohol) or triacetam cellulose resin may be used as a constituent material of the polarizing film, and it is judged that these easily release gas.

因此,製作包含保護面板/本黏著片材/偏光膜之構成之積層體,經由該等圖像顯示裝置構成構件(保護面板或偏光膜)照射活性能量線,提高本黏著片材之儲存彈性模數,藉此即便於在高溫下使用之情形時,亦可有效地抑制由自保護面板或偏光膜釋出之氣體所引起之發泡。 [實施例]Therefore, a laminated body including a protective panel / the adhesive sheet / polarizing film is produced, and active energy rays are irradiated through the constituent members (protective panel or polarizing film) of the image display device to improve the storage elasticity of the adhesive sheet. Therefore, even when used at high temperatures, foaming caused by the gas released from the protective panel or the polarizing film can be effectively suppressed. [Example]

以下,藉由實施例具體地說明本發明,但本發明並不受以下之實施例任何限定。Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples.

再者,於以下之實施例及比較例中,關於下述之物性測定、處理,係於下述條件下進行。In addition, in the following examples and comparative examples, the measurement and processing of the following physical properties were performed under the following conditions.

(中間層形成用積層片材1) 準備使甲基丙烯酸月桂酯與甲基丙烯酸十三烷基酯之混合物(SLMA)58.5質量份、甲基丙烯酸2-乙基己酯(2EHMA)15質量份、甲基丙烯酸正硬脂酯(SMA)15質量份、丙烯酸4-羥基丁酯(4HBA)11質量份及4-甲基丙烯醯氧基二苯甲酮(MBP)0.5質量份進行無規共聚而成之丙烯酸系樹脂A。 於1 kg之該丙烯酸系樹脂A中熔融混練作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村化學公司製造之「ATM-4PL」)50 g而製備中間樹脂層用組合物(A-1)。 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(A-1),使用層壓機,於溫度80℃下以成為厚度90 μm之方式賦形為片狀,製作中間層形成用積層片材1(中間樹脂層(A-1)之厚度90 μm)。(Laminate Sheet 1 for Intermediate Layer Formation) 58.5 parts by mass of a mixture of lauryl methacrylate and tridecyl methacrylate (SLMA) and 15 parts by mass of 2-ethylhexyl methacrylate (2EHMA) were prepared. Random copolymerization of 15 parts by mass of n-stearyl methacrylate (SMA), 11 parts by mass of 4-hydroxybutyl acrylate (4HBA), and 0.5 parts by mass of 4-methacryloxyoxybenzophenone (MBP) The resulting acrylic resin A. 50 g of a UV curing resin propoxypentaerythritol triacrylate ("ATM-4PL" manufactured by Shin Nakamura Chemical Co., Ltd.) as a crosslinking agent was melt-kneaded in 1 kg of this acrylic resin A to prepare a composition for an intermediate resin layer ( A-1). 100 µm thick "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. with two release films, that is, two polyethylene terephthalate films that have been peeled off (Thickness: 75 μm), sandwiching the composition (A-1), using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 90 μm, to produce an interlayer forming laminated sheet 1 (intermediate layer) The thickness of the resin layer (A-1) was 90 μm).

(中間層形成用積層片材2) 準備使甲基丙烯酸月桂酯與甲基丙烯酸十三烷基酯之混合物(SLMA)44.5質量份、甲基丙烯酸2-乙基己酯(2EHMA)10質量份、甲基丙烯酸正硬脂酯(SMA)35質量份、丙烯酸4-羥基丁酯(4HBA)10質量份及4-甲基丙烯醯氧基二苯甲酮(MBP)0.5質量份進行無規共聚而成之丙烯酸系樹脂B。 於1 kg之該丙烯酸系樹脂B中熔融混練作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村化學公司製造之「ATM-4PL」)50 g而製備中間樹脂層用組合物(B-1)。 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(B-1),使用層壓機,於溫度80℃下以成為厚度90 μm之方式賦形為片狀,製作中間層形成用積層片材2(中間樹脂層(B-1)之厚度90 μm)。(Laminate Sheet 2 for Intermediate Layer Formation) 44.5 parts by mass of a mixture of lauryl methacrylate and tridecyl methacrylate (SLMA) and 10 parts by mass of 2-ethylhexyl methacrylate (2EHMA) were prepared. Random copolymerization of 35 parts by mass of n-stearyl methacrylate (SMA), 10 parts by mass of 4-hydroxybutyl acrylate (4HBA), and 0.5 parts by mass of 4-methacryloxybenzophenone (MBP) The resulting acrylic resin B. 50 g of a UV-curable resin propoxylate pentaerythritol triacrylate ("ATM-4PL" manufactured by Shin Nakamura Chemical Co., Ltd.) as a crosslinking agent was melt-kneaded in 1 kg of this acrylic resin B to prepare a composition for an intermediate resin layer ( B-1). 100 µm thick "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. with two release films, that is, two polyethylene terephthalate films that have been peeled off (Thickness: 75 μm), sandwiching the composition (B-1), using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 90 μm, to produce an intermediate layer forming laminated sheet 2 (intermediate layer) The thickness of the resin layer (B-1) is 90 μm).

(中間層形成用積層片材3) 準備使甲基丙烯酸月桂酯與甲基丙烯酸十三烷基酯之混合物(SLMA)52.5質量份、甲基丙烯酸2-乙基己酯(2EHMA)20質量份、甲基丙烯酸正硬脂酯(SMA)15質量份、丙烯酸2-羥基乙酯(2HEA)12質量份及4-甲基丙烯醯氧基二苯甲酮(MBP)0.5質量份進行無規共聚而成之丙烯酸系樹脂C。 於1 kg之該丙烯酸系樹脂C中熔融混練作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村化學公司製造之「ATM-4PL」)50 g而製備中間樹脂層用組合物(C-1)。 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(C-1),使用層壓機,於溫度80℃下以成為厚度90 μm之方式賦形為片狀,製作中間層形成用積層片材3(中間樹脂層(C-1)之厚度90 μm)。(Laminate Sheet 3 for Intermediate Layer Formation) 52.5 parts by mass of a mixture (SLMA) of lauryl methacrylate and tridecyl methacrylate and 20 parts by mass of 2-ethylhexyl methacrylate (2EHMA) were prepared. Random copolymerization of 15 parts by mass of n-stearyl methacrylate (SMA), 12 parts by mass of 2-hydroxyethyl acrylate (2HEA), and 0.5 parts by mass of 4-methacryloxyoxybenzophenone (MBP) The resulting acrylic resin C. 50 g of a UV-curable resin propoxylate pentaerythritol triacrylate ("ATM-4PL" manufactured by Shin Nakamura Chemical Co., Ltd.) as a crosslinking agent was melt-kneaded in 1 kg of this acrylic resin C to prepare a composition for an intermediate resin layer ( C-1). 100 µm thick "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. with two release films, that is, two polyethylene terephthalate films that have been peeled off (Thickness: 75 μm), sandwiching the composition (C-1), using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 90 μm, to produce an interlayer forming laminated sheet 3 (intermediate layer) The thickness of the resin layer (C-1) is 90 μm).

(中間層形成用積層片材4) 準備使甲基丙烯酸月桂酯與甲基丙烯酸十三烷基酯之混合物(SLMA)82.6質量份、甲基丙烯酸第三丁酯(tBMA)5質量份、丙烯酸4-羥基丁酯(4HBA)12質量份及4-甲基丙烯醯氧基二苯甲酮(MBP)0.5質量份進行無規共聚而成之丙烯酸系樹脂D。 於1 kg之該丙烯酸系樹脂D中熔融混練作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村化學公司製造之「ATM-4PL」)50 g而製備中間樹脂層用組合物(D-1)。 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(D-1),使用層壓機,於溫度80℃下以成為厚度90 μm之方式賦形為片狀,製作中間層形成用積層片材4(中間樹脂層(D-1)之厚度90 μm)。(Laminate Sheet 4 for Intermediate Layer Formation) 82.6 parts by mass of a mixture of lauryl methacrylate and tridecyl methacrylate (SLMA), 5 parts by mass of third butyl methacrylate (tBMA), and acrylic acid were prepared. An acrylic resin D obtained by random copolymerization of 12 parts by mass of 4-hydroxybutyl ester (4HBA) and 0.5 parts by mass of 4-methacryloxybenzophenone (MBP). 50 g of a UV-curable resin propoxylate pentaerythritol triacrylate ("ATM-4PL" manufactured by Shin Nakamura Chemical Co., Ltd.) as a crosslinking agent was melt-kneaded in 1 kg of this acrylic resin D to prepare a composition for an intermediate resin layer ( D-1). 100 µm thick "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. with two release films, that is, two polyethylene terephthalate films that have been peeled off (Thickness: 75 μm), sandwiching the composition (D-1), using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 90 μm, to produce an intermediate layer forming laminated sheet 4 (intermediate layer) The thickness of the resin layer (D-1) is 90 μm).

(中間層形成用積層片材5) 準備使丙烯酸2-乙基己酯(2EHA)77質量份、乙酸乙烯酯(VA)19質量份及丙烯酸(AA)4質量份進行無規共聚而成之丙烯酸系樹脂E。 於1 kg之該丙烯酸系樹脂E中熔融混練作為交聯劑之紫外線硬化樹脂丙氧化季戊四醇三丙烯酸酯(新中村化學公司製造之「ATM-4PL」)50 g、及作為光起始劑之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造之「Esacure TZT」)15 g而製備中間樹脂層用組合物(E-1)。 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(E-1),使用層壓機,於溫度80℃下以成為厚度90 μm之方式賦形為片狀,製作中間層形成用積層片材5(中間樹脂層(E-1)之厚度90 μm)。(Laminated sheet 5 for intermediate layer formation) Prepared by random copolymerization of 77 parts by mass of 2-ethylhexyl acrylate (2EHA), 19 parts by mass of vinyl acetate (VA), and 4 parts by mass of acrylic acid (AA). Acrylic resin E. 50 g of a UV-curable resin propoxylate pentaerythritol triacrylate ("ATM-4PL" manufactured by Shin Nakamura Chemical Co., Ltd.) as a crosslinking agent was melt-kneaded in 1 kg of this acrylic resin E, and 2 as a photoinitiator. 15 g of a mixture of 4,6-trimethylbenzophenone and 4-methylbenzophenone ("Esacure TZT" manufactured by Lanberti) to prepare a composition (E-1) for an intermediate resin layer. 100 µm thick "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. with two release films, that is, two polyethylene terephthalate films that have been peeled off (Thickness: 75 μm), sandwiching the composition (E-1), using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 90 μm, to produce an intermediate layer forming laminated sheet 5 (intermediate layer) The thickness of the resin layer (E-1) was 90 μm).

(最外層形成用積層片材1) 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述丙烯酸系樹脂A,使用層壓機,以成為厚度30 μm之方式賦形為片狀,製作最外層形成用積層片材1(黏著劑層A之厚度30 μm)。(Laminated sheet 1 for forming the outermost layer) Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm "Diafoil MRQ" manufactured by / Mitsubishi Chemical Co., Ltd., with a thickness of 75 μm) sandwiching the above-mentioned acrylic resin A, and using a laminator, it was shaped into a sheet shape so as to have a thickness of 30 μm to produce a laminated sheet for outermost layer formation 1 (The thickness of the adhesive layer A is 30 μm).

(最外層形成用積層片材2) 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述丙烯酸系樹脂B,使用層壓機,於溫度80℃下以成為厚度30 μm之方式賦形為片狀,製作最外層形成用積層片材2(黏著劑層B之厚度30 μm)。(Laminated sheet 2 for outermost layer formation) Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm "Diafoil MRQ" manufactured by / Mitsubishi Chemical Co., Ltd. with a thickness of 75 μm) sandwiched the above-mentioned acrylic resin B, and using a laminator, it was shaped into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 30 μm to form the outermost layer. A laminated sheet 2 (thickness of the adhesive layer B of 30 μm) was used.

(最外層形成用積層片材3) 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述丙烯酸系樹脂C,使用層壓機,於溫度80℃下以成為厚度30 μm之方式賦形為片狀,製作最外層形成用積層片材3(黏著劑層C之厚度30 μm)。(Laminated sheet 3 for outermost layer formation) Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm "Diafoil MRQ" manufactured by / Mitsubishi Chemical Co., Ltd. with a thickness of 75 μm) sandwiched the above-mentioned acrylic resin C, and using a laminator, it was shaped into a sheet shape at a temperature of 80 ° C so as to have a thickness of 30 μm to form the outermost layer. A laminated sheet 3 (thickness of the adhesive layer C of 30 μm) was used.

(最外層形成用積層片材4) 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述丙烯酸系樹脂D,使用層壓機,於溫度80℃下以成為厚度30 μm之方式賦形為片狀,製作最外層形成用積層片材4(黏著劑層D之厚度30 μm)。(Laminated sheet 4 for outermost layer formation) Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm "Diafoil MRQ" manufactured by / Mitsubishi Chemical Co., Ltd., with a thickness of 75 μm) sandwiching the above-mentioned acrylic resin D, using a laminator, forming into a sheet shape at a temperature of 80 ° C. so as to have a thickness of 30 μm, and forming the outermost layer A laminated sheet 4 (thickness of the adhesive layer D of 30 μm) was used.

(最外層形成用積層片材5) 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住於1 kg之上述丙烯酸系樹脂E中熔融混練作為光起始劑之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造之「Esacure TZT」)15 g而成之最外樹脂層用組合物E',使用層壓機,於溫度80℃下以成為厚度30 μm之方式賦形為片狀,製作最外層形成用積層片材5(黏著劑層E之厚度30 μm)。 [實施例1](Laminated sheet 5 for outermost layer formation) Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm "Diafoil MRQ" manufactured by Mitsubishi Chemical Co., Ltd. (75 μm thick) sandwiched between 1 kg of the above-mentioned acrylic resin E and melt-kneaded 2,4,6-trimethylbenzophenone and 4 as photoinitiators. -Methylbenzophenone mixture ("Esacure TZT" manufactured by Lanberti company) 15 g of the outermost resin layer composition E ', using a laminator, at a temperature of 80 ° C to a thickness of 30 μm The method was shaped into a sheet shape, and a laminated sheet 5 for forming the outermost layer (the thickness of the adhesive layer E was 30 μm) was produced. [Example 1]

<黏著片材1之製作> 依序剝離去除中間樹脂層形成用積層片材1中之中間樹脂層(A-1)之兩側之PET膜,並且剝離最外層形成用積層片材1中之黏著劑層A之一側之PET膜,將露出之黏著面藉由層壓機依序貼合於(A-1)之兩表面,製作包含A/(A-1)/A之多層黏著片材。 於積層後,經由表面殘留之聚對苯二甲酸乙二酯膜,以365 nm之累計光量成為500 mJ之方式藉由高壓水銀燈照射紫外線,使A及(A-1)進行紫外線交聯,製作黏著片材1(總厚度150 μm)。 再者,黏著片材1係調節紫外線之照射量,而為半硬化狀態、即留有進而可硬化之餘地之狀態者。 [實施例2]<Production of Adhesive Sheet 1> The PET films on both sides of the intermediate resin layer (A-1) in the intermediate resin layer forming laminated sheet 1 are peeled off in order, and the outermost layer forming laminated sheet 1 is peeled off. For the PET film on one side of the adhesive layer A, the exposed adhesive surface is sequentially laminated on both surfaces of (A-1) by a laminator to produce a multilayer adhesive sheet including A / (A-1) / A material. After lamination, through the polyethylene terephthalate film remaining on the surface, the ultraviolet light was irradiated with a high-pressure mercury lamp so that the cumulative light quantity at 365 nm became 500 mJ, and A and (A-1) were crosslinked by ultraviolet to produce Adhesive sheet 1 (total thickness 150 μm). In addition, the adhesive sheet 1 adjusts the irradiation amount of ultraviolet rays, and is in a semi-hardened state, that is, a state where there is room for further hardening. [Example 2]

<黏著片材2之製作> 中間樹脂層使用(B-1),最外層使用B,除此以外,藉由與實施例1相同之方法製作黏著片材2。 [實施例3]<Production of Adhesive Sheet 2> An adhesive sheet 2 was produced in the same manner as in Example 1 except that (B-1) was used as the intermediate resin layer and B was used as the outermost layer. [Example 3]

<黏著片材3之製作> 中間樹脂層使用(C-1),最外層使用C,除此以外,藉由與實施例1相同之方法製作黏著片材3。 [實施例4]<Production of Adhesive Sheet 3> An adhesive sheet 3 was produced in the same manner as in Example 1 except that (C-1) was used as the intermediate resin layer and C was used as the outermost layer. [Example 4]

<黏著片材4之製作> 中間樹脂層使用(D-1),最外層使用D,除此以外,藉由與實施例1相同之方法製作黏著片材4。 [實施例5]<Production of Adhesive Sheet 4> An adhesive sheet 4 was produced in the same manner as in Example 1 except that (D-1) was used as the intermediate resin layer and D was used as the outermost layer. [Example 5]

<黏著片材5之製作> 中間樹脂層使用(A-1),最外層使用B,除此以外,藉由與實施例1相同之方法製作黏著片材5。 [實施例6]<Production of Adhesive Sheet 5> An adhesive sheet 5 was produced in the same manner as in Example 1 except that (A-1) was used as the intermediate resin layer and B was used as the outermost layer. [Example 6]

<黏著片材6之製作> 中間樹脂層使用(B-1),最外層使用A,除此以外,藉由與實施例1相同之方法製作黏著片材6。 [實施例7]<Production of Adhesive Sheet 6> An adhesive sheet 6 was produced in the same manner as in Example 1 except that (B-1) was used as the intermediate resin layer and A was used as the outermost layer. [Example 7]

<黏著片材7之製作> 中間樹脂層使用(C-1),最外層使用A,除此以外,藉由與實施例1相同之方法製作黏著片材7。 [實施例8]<Production of Adhesive Sheet 7> An adhesive sheet 7 was produced in the same manner as in Example 1 except that (C-1) was used as the intermediate resin layer and A was used as the outermost layer. [Example 8]

<黏著片材8之製作> 中間樹脂層使用(A-1),最外層使用C,除此以外,藉由與實施例1相同之方法製作黏著片材8。 [實施例9]<Production of Adhesive Sheet 8> An adhesive sheet 8 was produced in the same manner as in Example 1 except that (A-1) was used as the intermediate resin layer and C was used as the outermost layer. [Example 9]

<黏著片材9之製作> 中間樹脂層使用(B-1),最外層使用C,除此以外,藉由與實施例1相同之方法製作黏著片材9。 [實施例10]<Production of Adhesive Sheet 9> An adhesive sheet 9 was produced in the same manner as in Example 1 except that (B-1) was used as the intermediate resin layer and C was used as the outermost layer. [Example 10]

<黏著片材10之製作> 中間樹脂層使用(C-1),最外層使用B,除此以外,藉由與實施例1相同之方法製作黏著片材10。 [比較例1]<Production of Adhesive Sheet 10> An adhesive sheet 10 was produced in the same manner as in Example 1 except that (C-1) was used as the intermediate resin layer and B was used as the outermost layer. [Comparative Example 1]

<黏著片材11之製作> 藉由2片脫模膜、即經剝離處理之2片聚對苯二甲酸乙二酯膜(Mitsubishi Chemical公司製造之「Diafoil MRV-V06」,厚度100 μm/Mitsubishi Chemical公司製造之「Diafoil MRQ」,厚度75 μm)夾住上述組合物(A-1),使用層壓機,以成為厚度150 μm之方式賦形為片狀,製作黏著片材11。 [比較例2]<Production of Adhesive Sheet 11> Two release films, that is, two polyethylene terephthalate films ("Diafoil MRV-V06" manufactured by Mitsubishi Chemical Co., Ltd.), having a thickness of 100 μm / Mitsubishi "Diafoil MRQ" manufactured by Chemical Co., Ltd., having a thickness of 75 μm, sandwiched the above composition (A-1), and was laminated into a sheet shape so as to have a thickness of 150 μm using a laminator to produce an adhesive sheet 11. [Comparative Example 2]

<黏著片材12之製作> 使用組合物(B-1)代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材12。 [比較例3]<Production of Adhesive Sheet 12> An adhesive sheet 12 was produced in the same manner as in Comparative Example 1 except that the composition (B-1) was used instead of the composition (A-1). [Comparative Example 3]

<黏著片材13之製作> 使用組合物(C-1)代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材13。 [比較例4]<Production of Adhesive Sheet 13> An adhesive sheet 13 was produced in the same manner as in Comparative Example 1 except that the composition (C-1) was used instead of the composition (A-1). [Comparative Example 4]

<黏著片材14之製作> 使用組合物(D-1)代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材14。 [比較例5]<Production of Adhesive Sheet 14> An adhesive sheet 14 was produced in the same manner as in Comparative Example 1 except that the composition (D-1) was used instead of the composition (A-1). [Comparative Example 5]

<黏著片材15之製作> 使用丙烯酸系樹脂A代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材15。 [比較例6]<Production of Adhesive Sheet 15> An adhesive sheet 15 was produced in the same manner as in Comparative Example 1 except that the acrylic resin A was used instead of the composition (A-1). [Comparative Example 6]

<黏著片材16之製作> 使用丙烯酸系樹脂B代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材16。 [比較例7]<Production of Adhesive Sheet 16> An adhesive sheet 16 was produced in the same manner as in Comparative Example 1 except that the acrylic resin B was used instead of the composition (A-1). [Comparative Example 7]

<黏著片材17之製作> 使用丙烯酸系樹脂C代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材17。 [比較例8]<Production of Adhesive Sheet 17> An adhesive sheet 17 was produced in the same manner as in Comparative Example 1 except that the acrylic resin C was used instead of the composition (A-1). [Comparative Example 8]

<黏著片材18之製作> 使用丙烯酸系樹脂D代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材18。 [比較例9]<Production of Adhesive Sheet 18> An adhesive sheet 18 was produced in the same manner as in Comparative Example 1 except that the acrylic resin D was used instead of the composition (A-1). [Comparative Example 9]

<黏著片材19之製作> 使用組合物E'代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材19。 [比較例10]<Production of Adhesive Sheet 19> An adhesive sheet 19 was produced in the same manner as in Comparative Example 1 except that the composition E ′ was used instead of the composition (A-1). [Comparative Example 10]

<黏著片材20之製作> 使用組合物(E-1)代替組合物(A-1),除此以外,藉由與比較例1相同之方法製作黏著片材20。 [比較例11]<Production of Adhesive Sheet 20> An adhesive sheet 20 was produced in the same manner as in Comparative Example 1 except that the composition (E-1) was used instead of the composition (A-1). [Comparative Example 11]

<黏著片材21之製作> 中間樹脂層使用(E-1),最外層使用E',除此以外,藉由與實施例1相同之方法製作黏著片材21。<Production of Adhesive Sheet 21> An adhesive sheet 21 was produced in the same manner as in Example 1 except that (E-1) was used as the intermediate resin layer and E 'was used as the outermost layer.

<拉伸彈性模數> 將實施例及比較例中所製作之黏著片材1~21切割為寬度20 mm、長度80 mm,將其貼附於如圖1(A)所示之紙樣(60 mm×80 mm,中央部為窗部),將紙樣上下夾於拉伸試驗機(Intesco公司製造之「205型試驗機」)後,如圖1(B)及圖1(C)所示,於紙樣之兩橫側斜切出切口而將紙樣之上下截斷,以夾頭間距離40 mm、拉伸速度300 mm/min進行拉伸試驗。圖1中之符號1為紙樣,符號2為黏著片材。然後,算出拉伸彈性模數(MPa)。算出結果係示於表3。<Tensile Modulus of Elasticity> The adhesive sheets 1 to 21 produced in the examples and comparative examples were cut into a width of 20 mm and a length of 80 mm, and attached to a paper pattern (60) as shown in FIG. 1 (A). mm × 80 mm, window part in the center), and clamp the paper pattern up and down on a tensile tester ("205 type tester" manufactured by Intesco), as shown in Figure 1 (B) and Figure 1 (C), Cut cuts obliquely on the two lateral sides of the paper sample, cut off the paper sample from top to bottom, and perform a tensile test with a distance between the chucks of 40 mm and a tensile speed of 300 mm / min. Symbol 1 in FIG. 1 is a paper pattern, and symbol 2 is an adhesive sheet. Then, the tensile elastic modulus (MPa) was calculated. The calculation results are shown in Table 3.

<加工性> 使用湯姆森沖裁機,藉由50 mm×80 mm之湯姆森刀片切割實施例及比較例中所製作之黏著片材1~21,藉由目測而觀察剪裁之片材端部之形狀。然後,將片材端部存在糊之溢出者判定為「×」,將不存在者判定為「○」。判定結果係示於表3。<Processability> The Thomson punching machine was used to cut the adhesive sheets 1 to 21 produced in the examples and comparative examples with a Thomson blade of 50 mm × 80 mm, and the cut end portions were visually observed. Its shape. Then, those who have a paste overflow at the end of the sheet are judged as "×", and those who do not exist are judged as "○". The determination results are shown in Table 3.

<保持力試驗> 將實施例及比較例中所製作之黏著片材1~21剪裁為30 mm×80 mm後,剝離單面之剝離膜,以該黏著片材之單面與襯底用聚對苯二甲酸乙二酯膜(厚度38 μm)重疊之方式藉由手壓輥進行貼合,將其剪裁為25 mm×80 mm之短條狀而作為試片。 其次,剝離殘留之剝離膜,以試片與垂直地立設之SUS(不鏽鋼)板(120 mm×50 mm×厚度1.2 mm)重疊20 mm之長度之方式藉由手壓輥進行貼合。此時,透明雙面黏著片材與SUS(不鏽鋼)板之貼合面積成為25 mm×20 mm。 其後,使試片於40℃之環境下固化15分鐘後,於試片於垂直方向安裝並懸掛4.9 N之鉛錘,靜置30分鐘後,測定SUS(不鏽鋼)板與試片之貼合位置向下方偏移之偏移長度(mm)。測定結果係示於表3。<Retention force test> After cutting the adhesive sheets 1 to 21 produced in the examples and comparative examples to 30 mm × 80 mm, the one-sided release film was peeled off, and the one-sided surface of the adhesive sheet was used to gather the substrate. Ethylene terephthalate films (thickness: 38 μm) were laminated by hand pressing and cut into 25 mm × 80 mm short strips as test pieces. Next, the remaining release film was peeled off, and the test piece and the SUS (stainless steel) plate (120 mm × 50 mm × thickness 1.2 mm) standing vertically were overlapped by a length of 20 mm by hand pressing. At this time, the bonding area of the transparent double-sided adhesive sheet and the SUS (stainless steel) plate becomes 25 mm × 20 mm. Thereafter, the test piece was cured at 40 ° C for 15 minutes, and then a 4.9 N lead hammer was mounted and hung on the test piece in a vertical direction. After standing for 30 minutes, the adhesion of the SUS (stainless steel) plate to the test piece was measured. Offset length (mm) of position offset downward. The measurement results are shown in Table 3.

<印刷階差追隨性試驗> 對60 mm×90 mm×厚度0.5 mm之鈉鈣玻璃之周緣部實施寬度10 mm、厚度40 μm之黑色之印刷(全光線透過率0%),製作周緣部具有40 μm之印刷階差之評價用玻璃基板。該評價用玻璃基板係具有高度30 μm~50 μm之階差部,且於貼合面具有平坦面部之圖像顯示裝置構成構件之代替品。 作為與該評價用玻璃基板貼合之試驗用被黏著體,製作將作為圖像顯示裝置構成構件之偏光板(日東電工股份有限公司製造之「NWF-KDSEGHC-ST22」)預先整面貼合於玻璃板上(60×90 mm×t 0.5 mm)之單面而成者。 剝離上述加工性評價中剪裁之黏著片材1~21之一剝離膜,以覆蓋上述玻璃基板之印刷階差部之方式藉由手壓輥而貼合露出之黏著面。繼而,剝離殘留之剝離膜,將未處理之鈉鈣玻璃於減壓下(絕對壓力5 kPa)加壓貼合於露出之黏著面後,實施高壓釜處理(60℃,0.2 MPa,20分鐘)而進行精貼合,製作印刷階差追隨性評價用積層體。 將上述印刷階差追隨性評價用積層體於常態(溫度23℃、濕度50%)下靜置一天後,目測觀察外觀,將印刷階差附近產生黏著片材之隆起或剝離者評價為「×」,將不存在隆起或剝離者評價為「○」。評價結果係示於表3。< Printing step followability test > A black print (full light transmittance of 0%) with a width of 10 mm and a thickness of 40 μm is performed on the peripheral portion of a soda-lime glass of 60 mm × 90 mm × 0.5 mm in thickness. A glass substrate for evaluation of a printing step of 40 μm. The glass substrate for evaluation is a substitute for an image display device constituent member having a stepped portion having a height of 30 μm to 50 μm and a flat surface portion on a bonding surface. A polarizing plate ("NWF-KDSEGHC-ST22" manufactured by Nitto Denko Corporation) was prepared as an adherend for a test to be bonded to the glass substrate for evaluation, and it was laminated on the entire surface in advance. Single-sided glass plate (60 × 90 mm × t 0.5 mm). One of the peeling films of the adhesive sheets 1 to 21 cut in the processability evaluation was peeled, and the exposed adhesive surface was bonded by a hand pressure roller so as to cover the printing step portion of the glass substrate. Next, the remaining release film was peeled off, and the untreated soda-lime glass was pressure-bonded to the exposed adhesive surface under reduced pressure (absolute pressure 5 kPa), and then subjected to an autoclave treatment (60 ° C, 0.2 MPa, 20 minutes) Then, fine bonding was performed to produce a laminated body for evaluation of printing step followability. After the laminated body for follow-up evaluation of printing steps was left to stand for one day under normal conditions (temperature: 23 ° C., humidity: 50%), the appearance was visually observed, and those who raised or peeled the adhesive sheet near the printing steps were evaluated as “× ", And those with no bulge or peeling were evaluated as" ○ ". The evaluation results are shown in Table 3.

<相對介電常數> 將實施例及比較例中所製作之黏著片材1~21切割為直徑25 mm之圓形,於剝離兩面之剝離膜之狀態下貼合於LCR(inductance capacitance resistance,電感電容電阻)測定計(Keysight Technologie公司製造)之測定部,以23℃、50%RH,測定施加電壓1 V、頻率100 kHz下之相對介電常數。測定結果係示於表3。<Relative permittivity> The adhesive sheets 1 to 21 produced in the examples and comparative examples were cut into a circle with a diameter of 25 mm, and bonded to an LCR (inductance capacitance resistance) with the release film on both sides peeled off. Capacitance and resistance) The measuring unit (manufactured by Keysight Technologie) measures the relative dielectric constant at 23 ° C. and 50% RH at an applied voltage of 1 V and a frequency of 100 kHz. The measurement results are shown in Table 3.

<儲存彈性模數(G')> 20℃下之動態儲存彈性模數(G')係分別使用複數片實施例中所獲得之活性能量線硬化型黏著片材1~10以及該等之中間層(半硬化狀態之中間層形成用片材)及最外層(半硬化狀態之最外層形成用片材),以成為1 mm~2 mm之厚度之方式積層,以沖裁為直徑20 mm之圓形者作為測定試樣,使用流變儀(英弘精機股份有限公司製造之「MARS」),以黏著治具:f20 mm平行板、應變:0.5%、頻率:1 Hz、溫度:-50~200℃、升溫速度:3℃/min,測定20℃下之動態儲存彈性模數G'。測定結果係示於表1。 又,對黏著片材11~21,亦以與上述相同之方式測定20℃之動態儲存彈性模數(G')。測定結果係示於表3。 又,80℃下之動態儲存彈性模數(G')係對實施例4中所獲得之活性能量線硬化型黏著片材4之中間層(半硬化狀態之中間層形成用片材4)及最外層(半硬化狀態之最外層形成用片材4),以365 nm之累計光量成為2000 mJ以上之方式照射紫外線,製作紫外線照射後之中間層形成用片材4及最外層形成用片材4,於與上述相同之條件下對各者進行測定。測定結果係記載於表2。<Storage Elastic Modulus (G ')> The dynamic storage elastic modulus (G') at 20 ° C is obtained by using the active energy ray-curable adhesive sheets 1 to 10 obtained in a plurality of examples and the intermediate among them. The layers (sheets for forming the intermediate layer in the semi-hardened state) and the outermost layers (sheets for forming the outermost layer in the semi-hardened state) are laminated so as to have a thickness of 1 mm to 2 mm, and punched to a diameter of 20 mm The round one is used as a measurement sample, and a rheometer ("MARS" manufactured by Hidehiro Seiki Co., Ltd.) is used. An adhesion jig: f20 mm parallel plate, strain: 0.5%, frequency: 1 Hz, temperature: -50 to 200 ° C, heating rate: 3 ° C / min, the dynamic storage elastic modulus G 'at 20 ° C was measured. The measurement results are shown in Table 1. Moreover, the dynamic storage elastic modulus (G ') of 20 degreeC was also measured for the adhesive sheets 11-21 similarly to the above. The measurement results are shown in Table 3. The dynamic storage elastic modulus (G ′) at 80 ° C. refers to the intermediate layer (the sheet 4 for forming an intermediate layer in a semi-hardened state) of the active energy ray-curable adhesive sheet 4 obtained in Example 4 and The outermost layer (the outermost layer forming sheet 4 in the semi-hardened state) is irradiated with ultraviolet rays so that the accumulated light amount at 365 nm becomes 2000 mJ or more, and the intermediate layer forming sheet 4 and the outermost layer forming sheet after ultraviolet irradiation are produced. 4. Each was measured under the same conditions as above. The measurement results are shown in Table 2.

<UV發泡試驗> (UV照射試驗試樣之製作) 剝離實施例及比較例中所製作之黏著片材1~21之一脫模膜,輥式貼合於150 mm×200 mm厚度1 mm之鈉鈣玻璃。繼而,剝離殘留之脫模膜,輥式貼合於238 mm×182 mm×厚度0.8 mm之玻璃板,實施高壓釜處理(80℃,錶壓0.2 MPa,20分鐘)而進行精貼合。 自厚度0.8 mm之玻璃側,以波長365 nm之紫外線達到2000 mJ/cm2 之方式,藉由高壓水銀燈對黏著片材照射紫外線,使黏著片材硬化,製作積層體。<UV foaming test> (Production of UV irradiation test sample) One of the adhesive sheets 1 to 21 produced in the Examples and Comparative Examples was peeled off, and the roll was laminated to a thickness of 150 mm × 200 mm and 1 mm Soda-lime glass. Then, the remaining mold release film was peeled off, and the glass plate was 238 mm × 182 mm × 0.8 mm thick by roll bonding, and subjected to autoclave treatment (80 ° C., gage pressure 0.2 MPa, 20 minutes) for precise bonding. From the glass side with a thickness of 0.8 mm, the ultraviolet ray at a wavelength of 365 nm reached 2000 mJ / cm 2 , and the adhesive sheet was irradiated with ultraviolet rays by a high-pressure mercury lamp to harden the adhesive sheet to produce a laminated body.

(試驗方法) 將上述積層體放入至氙UV照射裝置(Suntest CPS:東洋精機製造)中,觀察以照度765 W/m2 、溫度60℃實施24小時UV照射處理後之外觀。將黏著片材產生直徑5 mm以上之氣泡者判定為「×(較差)」,將可見直徑5 mm以下之氣泡者判定為「△(一般)」,將無發泡且無外觀變化者判定為「○(較佳)」。(Test method) The laminated body was put in a xenon UV irradiation device (Suntest CPS: manufactured by Toyo Seiki), and the appearance after UV irradiation treatment was performed for 24 hours at 765 W / m 2 at a temperature of 60 ° C was observed. Those who produced bubbles with a diameter of 5 mm or more on the adhesive sheet were judged as "× (poor)", those who saw bubbles with a diameter of 5 mm or less as "△ (fair)", and those who had no foam and no change in appearance were judged as "○ (better)".

[表1] [Table 1]

[表2] [Table 2]

[表3] [產業上之可利用性][table 3] [Industrial availability]

本發明之光學構件用活性能量線硬化型黏著片材藉由以具有特定之性質之方式,使用特定之丙烯酸系樹脂(A)而形成,可同時實現低介電常數化及優異之印刷階差吸收性,例如可於形成個人電腦、行動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等之類之圖像顯示裝置時較佳地使用。The active energy ray-curable adhesive sheet for an optical member of the present invention is formed by using a specific acrylic resin (A) in a manner having specific properties, and can achieve both a low dielectric constant and an excellent printing step. Absorptivity can be preferably used when forming an image display device such as a personal computer, a mobile terminal (PDA), a game machine, a television (TV), a car navigation system, a touch panel, a tablet, and the like.

1‧‧‧紙樣1‧‧‧ pattern

2‧‧‧黏著片材2‧‧‧ Adhesive sheet

圖1(A)~(C)係實施例及比較例中之拉伸彈性模數測定試驗之樣本概略圖。1 (A) to (C) are schematic diagrams of samples of a tensile elastic modulus measurement test in Examples and Comparative Examples.

Claims (10)

一種光學構件用活性能量線硬化型黏著片材,其係含有丙烯酸系樹脂(A)者,且 上述丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物, 該光學構件用活性能量線硬化型黏著片材至少具有如下(1)~(3)之所有特性: (1)溫度23℃下之拉伸彈性模數為0.03 MPa以上 (2)基於以25 mm×20 mm之貼合面積貼附於不鏽鋼板,於鉛直方向上施加500 gf(4.9 N)之負載30分鐘之保持力試驗之偏移長度為1 mm以上 (3)頻率100 kHz下之相對介電常數為3.7以下。An active energy ray-curable adhesive sheet for an optical member, which contains an acrylic resin (A), and the acrylic resin (A) contains an active energy ray crosslinkable structure portion and has a carbon number of 10 to 24 The (co) polymer of the monomer component of the linear alkyl (meth) acrylate monomer (a), the optical member has at least the following active energy ray-curable adhesive sheet (1) to (3) All the characteristics: (1) The tensile modulus of elasticity at a temperature of 23 ° C is 0.03 MPa or more (2) Based on a 25 mm × 20 mm bonding area attached to a stainless steel plate, 500 gf (4.9 N) The offset length of the holding force test under load for 30 minutes is 1 mm or more. (3) The relative dielectric constant at a frequency of 100 kHz is 3.7 or less. 一種光學構件用活性能量線硬化型黏著片材,其係含有丙烯酸系樹脂(A)者,且 上述丙烯酸系樹脂(A)係包含具有活性能量線交聯性結構部位且具有碳數10~24之直鏈烷基之(甲基)丙烯酸酯單體(a)之單體成分的(共)聚合物, 該光學構件用活性能量線硬化型黏著片材自至少一片材表面於厚度方向上具有頻率1 Hz、溫度20℃下之儲存彈性模數G'不同之包含上述丙烯酸系樹脂(A)之區域,且 頻率100 kHz下之相對介電常數為3.7以下。An active energy ray-curable adhesive sheet for an optical member, which contains an acrylic resin (A), and the acrylic resin (A) contains an active energy ray crosslinkable structure portion and has a carbon number of 10 to 24 (Co) polymer of a monomer component of a linear alkyl (meth) acrylate monomer (a), the optical member uses an active energy ray-curable adhesive sheet from at least one sheet surface in the thickness direction A region including the above-mentioned acrylic resin (A) having a different storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 20 ° C., and a relative dielectric constant at a frequency of 100 kHz is 3.7 or less. 如請求項2之光學構件用活性能量線硬化型黏著片材,其自至少一片材表面於厚度方向上具有至少n個層, 第1層及第i層於頻率1 Hz、溫度20℃下之儲存彈性模數G'不同, 上述第i層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為40 kPa以上且1 MPa以下, (其中,n及i分別獨立為2以上之整數)。For example, the active energy ray hardening type adhesive sheet for an optical component of claim 2, which has at least n layers in the thickness direction from the surface of at least one sheet, and the first layer and the i layer have a frequency of 1 Hz and a temperature of 20 ° C. The storage elastic modulus G 'of the i-th layer is different from 40 kPa and 1 MPa at a frequency of 1 Hz and a temperature of 20 ° C. (Where n and i are independently 2 or more. Integer). 如請求項3之光學構件用活性能量線硬化型黏著片材,其中上述第1層於頻率1 Hz、溫度20℃下之儲存彈性模數G'為30 kPa以上且70 kPa以下。For example, the active energy ray-curable adhesive sheet for an optical member of claim 3, wherein the storage elastic modulus G 'of the first layer at a frequency of 1 Hz and a temperature of 20 ° C is 30 kPa or more and 70 kPa or less. 如請求項2至4中任一項之光學構件用活性能量線硬化型黏著片材,其中上述第i層係包含交聯劑(B)而成。The active energy ray-curable pressure-sensitive adhesive sheet for an optical member according to any one of claims 2 to 4, wherein the i-th layer comprises a crosslinking agent (B). 如請求項3至5中任一項之光學構件用活性能量線硬化型黏著片材,其中於以365 nm之累計光量成為2000 mJ以上之方式照射活性能量線之情形時,於照射前後,第1層於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為5 kPa以上,且第i層於頻率1 Hz、溫度80℃下之儲存彈性模數G'之差(照射後之儲存彈性模數G'-照射前之儲存彈性模數G')成為2 kPa以上。For example, if the active energy ray-curable adhesive sheet for an optical member according to any one of claims 3 to 5 is irradiated with an active energy ray such that the cumulative light amount at 365 nm becomes 2000 mJ or more, before and after the irradiation, the first The difference between the storage elastic modulus G 'of 1 layer at a frequency of 1 Hz and a temperature of 80 ° C (the storage elastic modulus G' after irradiation-the storage elastic modulus G 'before irradiation) becomes 5 kPa or more, and the i-th layer The difference between the storage elastic modulus G 'at a frequency of 1 Hz and a temperature of 80 ° C (the storage elastic modulus G' after irradiation-the storage elastic modulus G 'before irradiation) becomes 2 kPa or more. 如請求項1至6中任一項之光學構件用活性能量線硬化型黏著片材,其中上述活性能量線交聯性結構部位為二苯甲酮系交聯結構。The active energy ray-curable adhesive sheet for an optical member according to any one of claims 1 to 6, wherein the active energy ray crosslinkable structural site is a benzophenone-based crosslinked structure. 如請求項1至7中任一項之光學構件用活性能量線硬化型黏著片材,其中上述丙烯酸系樹脂(A)係除上述單體(a)以外,進而包含含羥基之(甲基)丙烯酸酯單體(b)之單體成分的共聚物。The active energy ray-curable pressure-sensitive adhesive sheet for an optical member according to any one of claims 1 to 7, wherein the acrylic resin (A) contains a hydroxyl group-containing (methyl) group in addition to the monomer (a). A copolymer of monomer components of the acrylate monomer (b). 如請求項1至8中任一項之光學構件用活性能量線硬化型黏著片材,其中上述丙烯酸系樹脂(A)係除上述單體(b)以外,進而包含具有含支鏈之烷基之(甲基)丙烯酸烷基酯單體(c)之單體成分的共聚物。The active energy ray-curable adhesive sheet for an optical member according to any one of claims 1 to 8, wherein the acrylic resin (A) is in addition to the monomer (b), and further includes a branched alkyl group. A copolymer of monomer components of the alkyl (meth) acrylate monomer (c). 如請求項9之光學構件用活性能量線硬化型黏著片材,其中上述丙烯酸系樹脂(A)其共聚物中之上述單體(a)及(c)之含有比率(重量比)為100/0~70/30。For example, the active energy ray-curable adhesive sheet for an optical member according to claim 9, wherein the content ratio (weight ratio) of the monomers (a) and (c) in the copolymer of the acrylic resin (A) is 100 / 0 to 70/30.
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