在以下章節中更詳細闡述本發明。除非明確指示相反含義，否則所定義之各態樣可與任何其他一或多個態樣組合。具體而言，指示較佳或有利之任何特徵可與任何其他指示較佳或有利之一或多個特徵組合。 在本發明之上下文中，除非上下文另有規定，否則所用術語欲根據以下定義解釋。 在本說明書中，術語「一(a, an)」及「至少一個」與術語「一或多個」相同且可互換使用。如本文所用，「至少一個」及「一或多個」係關於1、2、3、4、5、6、7、8、9或更多個所提及物種。此術語當與化合物或化合物類別組合使用時，其並不涉及分子之總數，而是個別化合物或化合物類別之類型數。 在本說明書中，術語「熱可固化密封劑組合物」及術語「組合物」可互換使用。 本文所用之術語「包含(comprising, comprises, comprised of)」與「包括(including, includes)」、「含有(containing, contains)」係同義的，且係包容或開放式的且並不排除額外、未列舉之成員、要素或製程步驟。 數值終點之列舉包括歸入各別範圍內之所有數值或分數以及所列舉終點。 除非另有定義，否則本發明中所使用之所有術語(包括技術及科學術語)具有與熟習本發明所屬技術者所通常理解之含義。藉助進一步指導，包括術語定義以更好的理解本發明之教示。 除非特定指示，否則本發明中所用之所有材料及試劑均係市場上可購得的。 本發明之熱可固化密封劑組合物包含： a) 熱可固化樹脂，其選自馬來醯亞胺樹脂、經馬來醯亞胺改質之環氧樹脂及其任何組合； b) 潛伏固化劑； c) 含有巰基之聚矽氧烷；及視情況 d) 穩定劑。 熱可固化密封劑組合物之特定調配物、尤其特定熱可固化樹脂與特定聚矽氧烷之組合將適宜膠凝時間及優良儲存穩定性賦予熱可固化密封劑組合物。在一些實施例中，熱可固化密封劑組合物可在至少70℃、例如約70℃至約120℃之溫度固化約2至約4分鐘。 下文將詳細闡述本發明之可固化密封劑組合物之各組分。 組分 a) ：熱可固化樹脂
熱可固化密封劑組合物包含選自馬來醯亞胺樹脂、經馬來醯亞胺改質之環氧樹脂及其任何組合之組分a)熱可固化樹脂。熱可固化樹脂可單獨或以兩種或更多種類之組合使用。 熱可固化樹脂在室溫下穩定。在加熱時，例如在至少70℃之溫度下加熱時，熱可固化樹脂與組分b)潛伏固化劑及組分c)聚矽氧烷反應以形成三維網絡結構。熱可固化樹脂在加熱時提供可固化部分，以及在高溫及高濕度下提供良好黏著力及高可靠性。 在本發明之一些實施例中，熱可固化樹脂係基於熱可固化密封劑組合物之總量以約10重量%至約85重量%、較佳約30重量%至約70重量%之量使用。 術語「環氧樹脂」在本發明之上下文中應理解為每分子具有至少約兩個1,2-環氧基團之聚環氧化物。 在一些實施例中，馬來醯亞胺樹脂具有以下一般結構：式(I) 其中n係1至3之整數，且 X1
選自C1
-C20
脂肪族基團、C4
-C36
脂環族基團、C6
-C40
芳香族基團、胺基甲酸酯基團、脲基團、胺甲酸酯基團、醚基團、羧基、酯基團、羰基、醯胺基團、醯亞胺基團、聚(丁二烯)基團、聚碳酸酯基團、聚胺基甲酸酯基團、聚醚基團、聚酯基團及其任何組合。 如本文所用，術語「脂肪族」或「脂肪族基團」意指視情況經取代之直鏈或具支鏈C1-20
烴，其完全飽和或含有一或多個不飽和單元，但其不為芳香族。舉例而言，適宜脂肪族基團包括視情況經取代之直鏈或具支鏈烷基、烯基、炔基及其混合物。 單獨或作為較大部分之一部分使用之術語「烷基」係指具有1-20、1-18、1-16、1-14、1-12、1-10、1-8、1-6、1-5、1-4、1-3或1-2個碳原子之視情況經取代之直鏈或具支鏈烴基團。 單獨或作為較大部分之一部分使用之術語「烯基」係指具有至少一個碳-碳雙鍵且具有2-20、2-18、2-16、2-14、2-12、2-10、2-8、2-6、2-5、2-4或2-3個碳原子之視情況經取代之直鏈或具支鏈烴基團。 單獨或作為較大部分之一部分使用之術語「炔基」係指具有至少一個碳-碳三鍵且具有2-20、2-18、2-16、2-14、2-12、2-10、2-8、2-6、2-5、2-4或2-3個碳原子之視情況經取代之直鏈或具支鏈烴基團。 應瞭解，片語「視情況經取代」與片語「經取代或未經取代」可互換使用。一般而言，術語「經取代」不論前面是否有術語「視情況」均意指指定部分之氫基團經指定取代基之基團代替，前提係取代產生穩定或化學上可行之化合物。除非另外指示，否則「視情況經取代」之基團可在該基團之每一可取代位置處具有取代基，且在任一既定結構中之一個以上位置可經一個以上選自指定基團之取代基取代時，在每一位置處之取代基可相同或不同。本發明所設想之取代基之組合係(例如)使得形成穩定或化學上可行之化合物的彼等。 如本文所用，術語「脂環族」係指將脂肪族及環狀化合物之性質組合之基團且包括(但不限於)單環或多環脂肪族烴及橋接環烷基，其視情況經一或多個官能基取代。如熟習此項技術者將瞭解，「脂環族」在本文中意欲包括(但不限於) C4
-C36
、較佳C4
-C30
環烷基、環烯基及環炔基部分，其視情況經一或多個官能基取代。 如本文所用，術語「環烷基」特定指具有4至36個、較佳4至30個碳原子、更佳4至18、甚至更佳4至10、最佳4至7個碳原子之基團。適宜環烷基包括(但不限於)環丁基、環戊基、環己基、環庚基及諸如此類。 一般而言，如本文所用，術語「芳香族部分」係指具有較佳6-40個碳原子、較佳6-30個碳原子之穩定的單環或多環不飽和部分，其各自可經取代或未經取代。在某些實施例中，術語「芳香族部分」係指在每一環原子處p-軌道垂直於環平面且滿足休克爾規則(Huckel rule)之平面環，其中環中之π電子數為(4n+2)，其中n係整數。不滿足該等芳香性準則中之一或所有之單環或多環不飽和部分在本文中定義為「非芳香族」，且由術語「脂環族」涵蓋。 馬來醯亞胺樹脂之實例性實施例包括(但不限於)：其中C36
代表具有36個碳原子之直鏈或具支鏈烴鏈(有或沒有環狀部分)；。 在一些實施例中，經馬來醯亞胺改質之環氧樹脂具有以下一般結構：式(II) 其中n1、n2且n3各自獨立地代表約1至約10之整數，且 R1
代表二價連接單元，較佳地，R1
係含有一或多個脂環族環或芳香族環之二價連接單元。 在一些實施例中，R1
可選自C4
-C36
伸環烷基、二伸環烷基、三伸環烷基、伸芳基、伸芳烷基、芳基二伸環烷基、芳基三伸環烷基、二環烷基伸芳基、三環烷基伸芳基、雙伸苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基。 單獨或組合使用之術語「伸環烷基」係指具有4至36、較佳4至30個碳原子、更佳4至18、甚至更佳4至10、最佳4至7個碳原子之二價環烷基部分。實例性伸環烷基部分包括伸環丁基、伸環戊基、伸環己基、伸環庚基及諸如此類。 單獨或作為較大部分(例如「芳烷基」)之一部分使用之術語「芳基」係指包括1至3個芳香族環之視情況經取代芳香族烴部分。芳基包括(但不限於)視情況經取代之苯基、萘基或蒽基。如本文所用，術語「芳基」亦包括芳基環稠合至一或多個環脂族環以形成視情況經取代之環狀結構之基團，例如四氫萘基、茚基或二氫茚基環。 術語「伸芳基」係指具有6至36、較佳6至18環碳原子之二價單環或多環系統，其中至少一個環係芳香族。適宜伸芳基之實例包括(例如)伸苯基二基、萘二基、四氫萘二基、二氫茚二基、在任何適宜位置之茚二基及諸如此類。 在本文中單獨或組合使用之術語「伸雜環烷基」及「伸雜芳基」分別係如上文所定義之伸環烷基及伸芳基，其中鏈或環中之至少一個原子係選自N、S或O之雜原子。 適宜市售經馬來醯亞胺改質之環氧樹脂包括(但不限於)自Henkel Corporation購得之X378538及X27284。為提供良好加工性，經馬來醯亞胺改質之環氧樹脂較佳在室溫(約25℃)為液體。此外，經馬來醯亞胺改質之環氧樹脂亦可為固體，只要其與熱可固化密封劑組合物之其他組分混合為固體狀態即可。 組分 b) ：潛伏固化劑
使用潛伏固化劑以在加熱時固化組分a) 熱可固化樹脂。 潛伏固化劑係熱潛伏固化劑；且較佳選自基於胺之固化劑、基於經改質胺之固化劑、基於經改質咪唑之固化劑及其任何組合。潛伏固化劑可單獨或以兩種或更多種類之組合使用。 基於胺之潛伏固化劑之實例包括雙氰胺、醯肼，例如己二酸二醯肼、草酸二醯肼、丙二酸二醯肼、琥珀酸二醯肼、戊二酸二醯肼、辛二酸二醯肼、壬二酸二醯肼、癸二酸二醯肼及苯二甲酸二醯肼。 經改質之胺及經改質之咪唑基化合物包括核-殼型，其中胺化合物(或胺加合物)核之表面塗佈有經改質胺產物及經改質咪唑產物(表面加合及諸如此類)。核-殼型固化劑與環氧樹脂之摻合物亦稱為母料型固化劑。該等類型之潛伏固化劑能提供具有良好黏度穩定性且可在相對較低溫度(例如約70℃至約120℃)下固化之摻合物。 市售潛伏固化劑之實例包括(但不限於) Adeka硬化劑EH-4357S (經改質胺類型)、Adeka硬化劑EH-4357PK (經改質胺類型)、EH-5057PK (經改質胺類型)、Adeka硬化劑EH-4380S (特殊混合類型)、Fujicure FXR-1081(經改質胺類型)、Fujicure FXR-1020 (經改質胺類型)、Sunmide LH-210 (經改質咪唑類型)、Sun-mide LH-2102 (經改質咪唑類型)、Sunmide LH-2100 (經改質咪唑類型)、Ajicure PN-23 (經改質咪唑類型)、Ajicure PN-F (經改質咪唑類型)、Ajicure PN-23J (經改質咪唑類型)、Ajicure PN-31 (經改質咪唑類型)、Ajicure PN-31J (經改質咪唑類型)、Novacure HX-3722 (母料類型)、Novacure HX-3742 (母料類型)、Novacure HX-3613 (母料類型)、HX3932HP (經改質咪唑類型，自Asahi Kasei Chemicals Corporation購得)及諸如此類。 具有約50℃至約110℃之熔融溫度、具體地具有約60℃至約100℃之熔融溫度的潛伏固化劑係較佳的。隨著熔融溫度落入該等範圍內，潛伏固化劑展現良好黏度穩定性及適宜可使用時間，此進一步避免液晶污染。 組合物中所含潛伏固化劑之量可端視潛伏固化劑之類型及組合物中組分a)之量經適當選擇。在本發明之一些實施例中，潛伏固化劑係基於熱可固化密封劑組合物之總量以約10重量%至約60重量%、較佳約20重量%至約50重量%之量使用。 組分 c) ：含有巰基之聚矽氧烷
含有巰基之聚矽氧烷(在下文中簡寫為聚矽氧烷)可增加熱可固化密封劑組合物之固化速度並避免加熱製程期間之滲透及污染問題。 在一些實施例中，聚矽氧烷具有以下重複單元：式(III) 其中n4代表約1至約20、較佳約3至約10之整數；且 R2
及R3
各自獨立地代表C1
-C10
脂肪族基團、C4
-C30
脂環族基團、C6
-C30
芳香族基及其任何組合。 較佳地，R2
及R3
所有均為C1
-C10
烷基。舉例而言，聚矽氧烷特定地包括包含兩個或更多個硫醇基團之聚二烷基矽氧烷，例如自Gelest Inc.購得之SMS-022、SMS-042及SMS-992 (聚(巰基丙基甲基)矽氧烷)。 除式III代表之重複單元以外，聚矽氧烷可進一步含有其他重複單元，例如一或多種由式IV代表之類型之重複單元：式(IV) 其中m代表約1至約20、較佳約3至約10之整數；且 R4
及R5
各自獨立地代表C1
-C10
脂肪族基團、C4
-C30
脂環族基團、C6
-C30
芳香族基及其任何組合。 由式(III)及式(IV)代表之重複單元可以交替、隨機、接枝及/或嵌段方式分佈。 聚矽氧烷可單獨或以兩種或更多種類之組合使用。 在本發明之一些實施例中，聚矽氧烷係基於熱可固化密封劑組合物之總量以約5重量%至約50重量%、較佳約10重量%至約35重量%之量使用。 組分 d) ：穩定劑
熱可固化密封劑組合物視情況包含組分d)：穩定劑。在室溫下，穩定劑可防止熱可固化樹脂之不期望固化。 在一些實施例中，穩定劑為固體有機酸。較佳地，穩定劑選自脂肪族、脂環族及芳香族羧酸及其衍生物；脂肪族、脂環族及芳香族醌及其衍生物；酚及其衍生物；可烯醇化脂肪族、脂環族及芳香族化合物及其衍生物；及其任何組合。更佳地，穩定劑選自4-硝基癒創木酚、3,4,5-三甲氧基苯甲酸、六氯酚、3,5-二硝基柳酸、4,5,7-三羥基黃烷酮、2,2-二硫代柳酸、間苯三酚、富馬酸、3,4-二羥基苯甲酸、3,4,5-三羥基苯甲酸、6-羥基-2,5,7,8-四甲基𠳭唍-2甲酸、撲酸、抗壞血酸、柳酸、檸檬酸、3,4-二羥基肉桂酸、2,3-二氰基氫醌、巴比妥酸(barbituric acid)、四羥基-對-苯醌、乙二醯脲、苯基酸、米氏酸(Meldrum’s acid)、5-苯基米氏酸及其任何組合。穩定劑可單獨或以兩種或更多種類之組合使用。 在本發明之一些實施例中，穩定劑係基於熱可固化密封劑組合物之總量以0重量%至約10重量%且較佳約0.1重量%至約1重量%之量使用。 組分 e) ：可選添加劑
可視情況包含於組合物中之組分包括(但不限於)熱塑性聚合物、有機或無機填充劑、觸變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑(例如顏料及染料)、表面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、消泡劑、整平劑及諸如此類。具體而言，組合物較佳包含選自由有機或無機填充劑、觸變劑及矽烷偶合劑組成之群之添加劑。 填充劑包括(但不限於)無機填充劑，例如二氧化矽、矽藻土、氧化鋁、氧化鋅、氧化鐵、氧化鎂、氧化錫、氧化鈦、氫氧化鎂、氫氧化鋁、碳酸鎂、硫酸鋇、石膏、矽酸鈣、滑石、玻璃珠、絹雲母活化白土、膨潤土、氮化鋁、氮化矽及諸如此類；及有機填充劑，例如聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚甲基丙烯酸丙酯、聚甲基丙烯酸丁酯、丙烯酸丁酯-甲基丙烯酸-甲基丙烯酸甲酯共聚物、聚丙烯腈、聚苯乙烯、聚丁二烯、聚戊二烯、聚異戊二烯、聚異丙烯及諸如此類。該等填充劑可單獨使用或以其組合使用。 觸變劑包括(但不限於)滑石、發煙二氧化矽、超細表面處理之碳酸鈣、細粒氧化鋁、片狀氧化鋁；層狀化合物，例如蒙脫石；特殊化合物，例如硼酸鋁晶須及諸如此類。在該等觸變劑中，滑石、發煙二氧化矽及細粒氧化鋁係較佳的。適宜市售觸變劑包括自Evonik Industries購得之Aerosil RX200 (發煙二氧化矽)。觸變劑可控制熱固化組合物之觸變性。 矽烷偶合劑包括(但不限於) γ-胺基丙基三乙氧基矽烷、γ-巰基丙基三甲氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷及諸如此類。 除馬來醯亞胺樹脂及經馬來醯亞胺改質之環氧樹脂以外，熱可固化樹脂可進一步含有在分子中不具有馬來醯亞胺基團之環氧樹脂。在分子中不具有馬來醯亞胺基團之環氧樹脂之量可根據實際需要進行選擇，只要其不會不利地影響本發明之期望效應即可。在一些實施例中，在分子中不具有馬來醯亞胺基團之環氧樹脂之量可基於熱可固化密封劑組合物之總量小於約40重量%。較佳地，熱可固化密封劑組合物不含有在分子中不具有馬來醯亞胺基團之環氧樹脂。除含有巰基之聚矽氧烷以外，熱可固化密封劑組合物可進一步含有在分子中不具有矽氧烷基團之硫醇。在分子中不具有矽氧烷基團之硫醇之量可根據實際需要進行選擇，只要其不會不利地影響本發明之期望效應即可。在一些實施例中，在分子中不具有矽氧烷基團之硫醇之量可基於熱可固化密封劑組合物之總量小於約5重量%。較佳地，熱可固化密封劑組合物不含有在分子中不具有矽氧烷基團之硫醇。 熱可固化密封劑組合物
在一些實施例中，熱可固化密封劑組合物包含： a) 約10重量%至約85重量%、較佳約30重量%至約70重量%之熱可固化樹脂，其選自環氧樹脂、馬來醯亞胺樹脂、經馬來醯亞胺改質之環氧樹脂及其任何組合 b) 約10重量%至約60重量%、較佳約20重量%至約50重量%之潛伏固化劑；及 c) 約5重量%至約50重量%、較佳約10重量%至約35重量%含有巰基之聚矽氧烷；及 d) 0重量%至約10重量%、較佳約0.1重量%至約1重量%穩定劑， 該等係基於熱可固化密封劑組合物之總重量。 在一些實施例中，組合物在約25℃下具有50 Pa·s至3,000 Pa·s、較佳100 Pa·s至2000 Pa·s、更佳300 Pa·s至1000 Pa·s之黏度，該黏度係利用旋轉流變儀以50 s-1
之剪切速率量測。 組合物可用作密封劑、尤其用作LCD面板之ODF密封劑。 黏結劑組合物之製備
本發明之黏結劑組合物可藉由將各組分藉助任何適宜方法且以任何適宜順序混合來製備。各組分可連續或間斷地混合。若需要，各組分在混合期間可經攪拌。攪拌速度貫穿整個混合步驟可恆定或可在不同混合階段期間有所變化。 對混合時間無特別限制，其可根據實際需要進行調整。較佳地，混合溫度可低於約40℃，例如室溫(約25℃)。實例
將參照以下實例進一步詳細闡述及說明本發明。該等實例意欲幫助熟習此項技術者更好的理解並實踐本發明，然而，其並不意欲限制本發明之範圍。除非另外規定，否則所有製備及測試實驗均在室溫及大氣壓下實施。材料
X378538：經馬來醯亞胺改質之環氧樹脂，自Henkel Corporation購得。 X27284：經馬來醯亞胺改質之環氧樹脂，自Henkel Corporation購得。 CM1016：馬來醯亞胺樹脂，自Henkel Corporation購得。 Epon828：不含有馬來醯亞胺基團之環氧樹脂；自Aldrich購得。 PN-23：經改質咪唑類型潛伏固化劑，自Ajinomoto Fine-Techno Co., Inc.購得。 EH-4357S：經改質胺類型潛伏固化劑，自ADEKA Corporation購得。 HX3932HP：經改質咪唑類型之潛伏固化劑，自Asahi Kasei Chemicals Corporation購得。 SM-992：聚(巰基丙基甲基)矽氧烷，自Gelest Inc.購得。 丙烷硫醇：在分子中不含有矽氧烷基團之硫醇，自Aldrich購得。 PM182：分散於雙酚-A環氧中之巴比妥酸，穩定劑，自Henkel Corporation購得。 RX200：觸變劑，自Evonik Industries購得。 γ-縮水甘油氧基丙基三甲氧基矽烷：矽烷偶合劑，自Momentive購得實例 1 ( 實例 1)
將5.0 g X378538、0.5 g SMS-992及0.2 g PM-182在室溫下藉由採用高速混合機(2350 rpm, Flacktek, DAC150)混合1分鐘。隨後，將0.5 g PN-23添加至高速混合機並混合4分鐘(2350 rpm)。所獲得組合物樣品在其使用前保持在-20℃下。實例 2-4 及比較實例 1-2
實例2-4及比較實例1-2中之熱可固化密封劑組合物係以上文針對實例1所述之相同方式製備，惟根據下表1改變調配物。 表1：熱可固化密封劑組合物之調配物 性質測試 膠凝時間
將每一組合物樣品置於100℃之熱板上，並將組合物樣品達到膠凝點所花費之時間命名為膠凝時間。為量測膠凝點，使用木棍插入樣品中。當組合物樣品完全硬化時，其達到膠凝點。 表2：熱可固化密封劑組合物之膠凝時間
自表2可看出，本發明之熱可固化密封劑組合物具有適宜膠凝時間，該膠凝時間足夠長以能夠施加組合物，但不會太長以致降低自動生產線之效率。 3 天膠凝測試
將每一組合物樣品儲存在室溫。每天記錄每一樣品之黏度。 表3：熱可固化密封劑組合物之儲存穩定性
自表3可看出，本發明之熱可固化密封劑組合物在3天後未膠凝且展現優良儲存穩定性，而比較實例1及2二者均在3天內膠凝。實例 5-6 及比較實例 3-4
實例5-6及比較實例3-4中之熱可固化密封劑組合物係以上文針對實例1所述之相同方式製備，惟根據下表4改變調配物。 表4：熱可固化密封劑組合物之調配物 性質測試 液晶污染測試
在壓力為約3KPa之真空烘箱(OV11, LabPlant)中，將實例5-6及比較實例3-4之每一組合物樣品分別沿第一玻璃板(50 mm ×50 mm)之四個邊緣分配以形成矩形密封劑框架。然後，將一滴相同組合物樣品滴於第一玻璃板之中央。隨後，藉由使用螺桿分配機(ML-808GX, Musashi)圍繞密封劑框架內之中央樣品液滴分配液晶(LC 52, Merck)。分配噴嘴之直徑為0.2 mm，且分配速度為70 mm/s。液晶與密封劑框架之體積比率為1.05:1。最後，將第二玻璃板置於第一玻璃板上以獲得LCD總成。 釋放真空以使真空烘箱返回至大氣壓。然後，將所獲得LCD總成在烘箱中於120℃加熱60分鐘，以固化密封劑。將3 V電壓施加至LCD總成。然後，藉由使用偏光鏡觀察LCD總成以驗證污染性能。若取向無序之液晶距中央密封劑液滴小於0.2mm，則將最終污染性能記錄為「良好」；若取向無序之液晶距中央密封劑液滴為0.2mm至0.6mm，則將最終污染性能記錄為「一般」；而若取向無序之液晶距中央密封劑液滴大於0.6mm，則將其記錄為「差」。結果顯示於表5中。 表5：熱可固化密封劑組合物之污染性能
自表5可看出，實例5及6之熱可固化密封劑組合物幾乎不污染或僅稍微污染LCD，而比較實例3及4之熱可固化密封劑組合物嚴重污染LCD。實例 7-8 及比較實例 5-6
實例7-8及比較實例5-6中之熱可固化密封劑組合物係以上文針對實例1所述之相同方式製備，惟根據下表6改變調配物。 表6：熱可固化密封劑組合物之調配物 性質測試 液晶滲透測試
在壓力為約3KPa之真空烘箱(OV11, LabPlant)中，將實例5-6及比較實例3-4之每一組合物樣品分別沿第一玻璃板(50 mm ×50 mm)之四個邊緣分配以形成矩形密封劑框架。然後，藉由使用螺桿分配機(ML-808GX, Musashi)將液晶(LC 52, Merck)分配於密封劑框架內。分配噴嘴之直徑為0.2 mm，且分配速度為70 mm/s。液晶與密封劑框架之體積比率為1.05:1。最後，將第二玻璃板置於第一玻璃板上以獲得LCD總成。 釋放真空以使真空烘箱返回至大氣壓。然後，將所獲得LCD總成在烘箱中於120℃加熱60分鐘，以固化密封劑。然後，藉由肉眼觀察LCD總成以驗證滲透性能，包括密封劑框架形狀之維持、液晶滲透及液晶洩漏。若密封劑框架形狀保持良好且無液晶洩漏，則將滲透性能記錄為「良好」，而若液晶洩漏，則將其記錄為「差」。結果顯示於表7中。 表7：熱可固化密封劑組合物之滲透性能
自表7可看出，實例7及8之熱可固化密封劑組合物良好地保持密封劑框架形狀且未發生液晶洩漏。與此相比，比較實例5及6之熱可固化密封劑組合物在相同條件下洩漏液晶。The invention is illustrated in more detail in the following sections. The various aspects defined may be combined with any other aspect or aspects unless explicitly indicated to the contrary. In particular, any feature that is preferred or advantageous may be combined with one or more of the features of any other indication. In the context of the present invention, the terms used are to be interpreted according to the following definitions unless the context dictates otherwise. In the present specification, the terms "a, an" and "at least one" are the same as the term "one or more" and are used interchangeably. As used herein, "at least one" and "one or more" relate to 1, 2, 3, 4, 5, 6, 7, 8, 9, or more of the mentioned species. When used in combination with a compound or class of compounds, this term does not relate to the total number of molecules, but to the number of types of individual compounds or classes of compounds. In the present specification, the term "thermally curable sealant composition" and the term "composition" are used interchangeably. The terms "comprising, including, including" are used synonymously with "including, including," and "containing", and are inclusive or open-ended and do not exclude additional, Unlisted members, elements, or process steps. The enumeration of numerical endpoints includes all values or fractions that fall within the respective ranges and the recited endpoints. Unless otherwise defined, all terms (including technical and scientific terms) used in the present invention have the meaning Further guidance, including definitions of terms, is used to better understand the teachings of the present invention. All materials and reagents used in the present invention are commercially available unless otherwise indicated. The heat curable sealant composition of the present invention comprises: a) a heat curable resin selected from the group consisting of maleic imide resin, maleic imide modified epoxy resin, and any combination thereof; b) latent curing a reagent; c) a polyoxyalkylene containing a mercapto group; and optionally a stabilizer. The combination of a particular formulation of the heat curable sealant composition, particularly a particular heat curable resin, with a particular polyoxyalkylene oxide imparts a suitable gel time and excellent storage stability to the heat curable sealant composition. In some embodiments, the heat curable sealant composition can be cured at a temperature of at least 70 ° C, such as from about 70 ° C to about 120 ° C, for about 2 to about 4 minutes. The components of the curable sealant composition of the present invention are described in detail below. Component a) : The heat curable resin heat curable sealant composition comprises a component selected from the group consisting of maleic imine resin, maleic imide modified epoxy resin, and any combination thereof a) heat curable Resin. The heat curable resin may be used singly or in combination of two or more kinds. The heat curable resin is stable at room temperature. Upon heating, for example at a temperature of at least 70 ° C, the thermally curable resin reacts with component b) latent curing agent and component c) polyoxyalkylene to form a three-dimensional network structure. The heat curable resin provides a curable portion when heated, and provides good adhesion and high reliability at high temperatures and high humidity. In some embodiments of the invention, the heat curable resin is used in an amount of from about 10% by weight to about 85% by weight, preferably from about 30% by weight to about 70% by weight, based on the total of the heat curable sealant composition. . The term "epoxy resin" is understood in the context of the present invention to be a polyepoxide having at least about two 1,2-epoxy groups per molecule. In some embodiments, the maleimide resin has the following general structure: Wherein n is an integer from 1 to 3, and X 1 is selected from a C 1 -C 20 aliphatic group, a C 4 -C 36 alicyclic group, a C 6 -C 40 aromatic group, an amine Carbamate group, urea group, carbamate group, ether group, carboxyl group, ester group, carbonyl group, guanamine group, quinone imine group, poly(butadiene) group, Polycarbonate groups, polyurethane groups, polyether groups, polyester groups, and any combination thereof. As used herein, the term "aliphatic" or "aliphatic group" means a linear or branched C 1-20 hydrocarbon which is optionally substituted, which is fully saturated or contains one or more units of unsaturation, but Not aromatic. By way of example, suitable aliphatic groups include optionally substituted linear or branched alkyl, alkenyl, alkynyl and mixtures thereof. The term "alkyl" as used alone or as part of a larger portion means having 1-20, 1-18, 1-16, 1-14, 1-12, 1-10, 1-8, 1-6, Optionally substituted linear or branched hydrocarbon groups of 1-5, 1-4, 1-3 or 1-2 carbon atoms. The term "alkenyl" used alone or as part of a larger portion means having at least one carbon-carbon double bond and having 2-20, 2-18, 2-16, 2-14, 2-12, 2-10 a linear or branched hydrocarbon group optionally substituted with 2-8, 2-6, 2-5, 2-4 or 2-3 carbon atoms. The term "alkynyl" used alone or as part of a larger portion means having at least one carbon-carbon triple bond and having 2-20, 2-18, 2-16, 2-14, 2-12, 2-10 a linear or branched hydrocarbon group optionally substituted with 2-8, 2-6, 2-5, 2-4 or 2-3 carbon atoms. It should be understood that the phrase "replaced as appropriate" and the phrase "substituted or unsubstituted" are used interchangeably. In general, the term "substituted", whether or not preceded by the term "optionally", means that a specified portion of a hydrogen group is replaced by a group of a specified substituent, provided that the substitution results in a stable or chemically feasible compound. Unless otherwise indicated, a "optionally substituted" group may have a substituent at each substitutable position of the group, and one or more positions in any given structure may be selected from more than one selected group. When substituted with a substituent, the substituents at each position may be the same or different. Combinations of substituents contemplated by the present invention are, for example, such that they form stable or chemically feasible compounds. As used herein, the term "alicyclic" refers to a group that combines the properties of an aliphatic and a cyclic compound and includes, but is not limited to, a monocyclic or polycyclic aliphatic hydrocarbon and a bridged cycloalkyl group, as appropriate One or more functional groups are substituted. As will be appreciated by those skilled in the art, "alicyclic" is intended herein to include (but not limited to) C 4 -C 36, preferably C 4 -C 30 cycloalkyl, cycloalkenyl and cycloalkynyl moieties, It is optionally substituted with one or more functional groups. As used herein, the term "cycloalkyl" specifically refers to a radical having 4 to 36, preferably 4 to 30, more preferably 4 to 18, even more preferably 4 to 10, most preferably 4 to 7 carbon atoms. group. Suitable cycloalkyl groups include, but are not limited to, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and the like. Generally, as used herein, the term "aromatic moiety" refers to a stable monocyclic or polycyclic unsaturated moiety having preferably from 6 to 40 carbon atoms, preferably from 6 to 30 carbon atoms, each of which may be Substituted or unsubstituted. In certain embodiments, the term "aromatic moiety" refers to a planar ring in which the p-orbital is perpendicular to the plane of the ring at each ring atom and satisfies the Huckel rule, wherein the number of π electrons in the ring is (4n). +2), where n is an integer. Monocyclic or polycyclic unsaturated moieties that do not satisfy one or all of these aromaticity criteria are defined herein as "non-aromatic" and are encompassed by the term "alicyclic". Exemplary embodiments of maleic imine resins include, but are not limited to: Wherein C 36 represents a straight or branched hydrocarbon chain having 36 carbon atoms (with or without a cyclic moiety); . In some embodiments, the maleated imine modified epoxy resin has the following general structure: Wherein n1, n2 and n3 each independently represent an integer from about 1 to about 10, and R 1 represents a divalent linking unit, preferably, R 1 contains one or more alicyclic rings or aromatic The two-valent connection unit of the ring. In some embodiments, R 1 may be selected from C 4 -C 36 cycloalkyl, dicycloalkyl, tricycloalkyl, aryl, aralkyl, aryl dicycloalkyl, Aryl tricycloalkylene, bicycloalkyl extended aryl, tricycloalkyl extended aryl, di stretched phenyl, cycloalkyl extended aryl, heterocycloalkyl or heterocyclic aryl. The term "cycloalkylene" used alone or in combination means having from 4 to 36, preferably from 4 to 30, more preferably from 4 to 18, even more preferably from 4 to 10, most preferably from 4 to 7 carbon atoms. A divalent cycloalkyl moiety. Exemplary cycloalkyl groups include cyclopentene, cyclopentyl, cyclohexyl, cycloheptyl and the like. The term "aryl" as used alone or as part of a larger moiety (e.g., "aralkyl") refers to an optionally substituted aromatic hydrocarbon moiety comprising from 1 to 3 aromatic rings. Aryl groups include, but are not limited to, phenyl, naphthyl or anthracenyl which are optionally substituted. The term "aryl" as used herein also includes a group in which an aryl ring is fused to one or more cycloaliphatic rings to form an optionally substituted cyclic structure, such as tetrahydronaphthyl, anthracenyl or dihydrogen.茚 base ring. The term "extended aryl" refers to a divalent monocyclic or polycyclic ring system having from 6 to 36, preferably from 6 to 18 ring carbon atoms, wherein at least one ring is aromatic. Examples of suitable aryl groups include, for example, phenyldiyl, naphthalenediyl, tetrahydronaphthalenediyl, indanyldiyl, fluorenyl in any suitable position, and the like. The terms "cycloheterocycloalkyl" and "heteroaryl", as used herein, alone or in combination, are respectively cycloalkyl and aryl, as defined above, wherein at least one of the chains or rings is selected. A hetero atom from N, S or O. Epoxy resins suitable for commercial maleimide modification include, but are not limited to, X378538 and X27284 available from Henkel Corporation. In order to provide good processability, the maleated imine modified epoxy resin is preferably liquid at room temperature (about 25 ° C). Further, the maleated imide modified epoxy resin may be a solid as long as it is mixed with other components of the heat curable sealant composition in a solid state. Component b) : latent curing agent The latent curing agent is used to cure the component a) the heat curable resin upon heating. The latent curing agent is a thermal latent curing agent; and is preferably selected from the group consisting of amine based curing agents, modified amine based curing agents, modified imidazole based curing agents, and any combination thereof. The latent curing agents may be used singly or in combination of two or more kinds. Examples of amine-based latent curing agents include dicyandiamide, hydrazine, such as diammonium adipate, diterpene oxalate, diammonium malonate, diterpene succinate, diammonium glutarate, octane Dioxalate dihydrate, diterpene sebacate, dioxonium sebacate and dioxonium dicarboxylate. The modified amine and the modified imidazolyl compound include a core-shell type in which the surface of the amine compound (or amine adduct) core is coated with a modified amine product and a modified imidazole product (surface addition) And so on). A blend of a core-shell type curing agent and an epoxy resin is also referred to as a masterbatch type curing agent. These types of latent curing agents provide blends that have good viscosity stability and can be cured at relatively low temperatures (e.g., from about 70 ° C to about 120 ° C). Examples of commercially available latent curing agents include, but are not limited to, Adeka hardener EH-4357S (modified amine type), Adeka hardener EH-4357PK (modified amine type), EH-5057PK (modified amine type) ), Adeka hardener EH-4380S (special blend type), Fujicure FXR-1081 (modified amine type), Fujicure FXR-1020 (modified amine type), Sunmide LH-210 (modified imidazole type), Sun-mide LH-2102 (modified imidazole type), Sunmide LH-2100 (modified imidazole type), Ajicure PN-23 (modified imidazole type), Ajicure PN-F (modified imidazole type), Ajicure PN-23J (modified imidazole type), Ajicure PN-31 (modified imidazole type), Ajicure PN-31J (modified imidazole type), Novacure HX-3722 (master batch type), Novacure HX-3742 (Masterbatch type), Novacure HX-3613 (masterbatch type), HX3932HP (modified imidazole type, available from Asahi Kasei Chemicals Corporation), and the like. A latent curing agent having a melting temperature of from about 50 ° C to about 110 ° C, specifically a melting temperature of from about 60 ° C to about 100 ° C, is preferred. As the melting temperature falls within these ranges, the latent curing agent exhibits good viscosity stability and a suitable usable time, which further avoids liquid crystal contamination. The amount of latent curing agent contained in the composition may be appropriately selected depending on the type of latent curing agent and the amount of component a) in the composition. In some embodiments of the invention, the latent curing agent is used in an amount of from about 10% to about 60% by weight, preferably from about 20% to about 50% by weight, based on the total of the heat curable sealant composition. Component c) : fluorenyl- containing polyoxyalkylene sulfhydryl-containing polyoxyalkylene (hereinafter abbreviated as polyoxyalkylene) increases the curing speed of the heat curable sealant composition and avoids penetration and contamination during the heating process problem. In some embodiments, the polyoxyalkylene has the following repeating units: Wherein n4 represents an integer of from about 1 to about 20, preferably from about 3 to about 10; and R 2 and R 3 each independently represent a C 1 -C 10 aliphatic group, a C 4 -C 30 alicyclic ring Family groups, C 6 -C 30 aromatic groups, and any combination thereof. Preferably, R 2 and R 3 are all C 1 -C 10 alkyl groups. By way of example, polyoxyalkylene specifically includes polydialkyloxiranes comprising two or more thiol groups, such as SMS-022, SMS-042 and SMS-992 available from Gelest Inc. (poly(mercaptopropylmethyl) decane). In addition to the repeating unit represented by Formula III, the polyoxyalkylene may further comprise other repeating units, such as one or more repeating units of the type represented by Formula IV: Wherein m represents an integer of from about 1 to about 20, preferably from about 3 to about 10; and R 4 and R 5 each independently represent a C 1 -C 10 aliphatic group, a C 4 -C 30 alicyclic ring Family groups, C 6 -C 30 aromatic groups, and any combination thereof. The repeating units represented by the formula (III) and the formula (IV) may be distributed alternately, randomly, grafted, and/or blockwise. The polyoxyalkylene can be used singly or in combination of two or more kinds. In some embodiments of the invention, the polyoxyalkylene is used in an amount of from about 5% by weight to about 50% by weight, preferably from about 10% by weight to about 35% by weight, based on the total of the heat curable sealant composition. . Component d) : Stabilizer The heat curable sealant composition optionally comprises component d): a stabilizer. The stabilizer prevents undesired curing of the heat curable resin at room temperature. In some embodiments, the stabilizer is a solid organic acid. Preferably, the stabilizer is selected from the group consisting of aliphatic, alicyclic and aromatic carboxylic acids and derivatives thereof; aliphatic, alicyclic and aromatic hydrazines and derivatives thereof; phenols and derivatives thereof; enolizable aliphatics , alicyclic and aromatic compounds and derivatives thereof; and any combination thereof. More preferably, the stabilizer is selected from the group consisting of 4-nitroguaiacol, 3,4,5-trimethoxybenzoic acid, hexachlorophenol, 3,5-dinitrosalic acid, 4,5,7-three Hydroxyflavanone, 2,2-dithiosalicylic acid, phloroglucinol, fumaric acid, 3,4-dihydroxybenzoic acid, 3,4,5-trihydroxybenzoic acid, 6-hydroxy-2, 5,7,8-tetramethylguanidin-2, formic acid, ascorbic acid, salicylic acid, citric acid, 3,4-dihydroxycinnamic acid, 2,3-dicyanohydroquinone, barbituric acid Barbituric acid), tetrahydroxy-p-benzoquinone, edetate, phenyl Acid, Meldrum's acid, 5-phenylmyric acid, and any combination thereof. The stabilizers may be used singly or in combination of two or more kinds. In some embodiments of the invention, the stabilizer is used in an amount of from 0% by weight to about 10% by weight, and preferably from about 0.1% by weight to about 1% by weight, based on the total of the heat curable sealant composition. Component e) : optional additives may optionally be included in the composition, including but not limited to thermoplastic polymers, organic or inorganic fillers, thixotropic agents, decane coupling agents, diluents, modifiers, coloring Agents (such as pigments and dyes), surfactants, preservatives, stabilizers, plasticizers, lubricants, defoamers, levelers, and the like. In particular, the composition preferably comprises an additive selected from the group consisting of organic or inorganic fillers, thixotropic agents, and decane coupling agents. Fillers include, but are not limited to, inorganic fillers such as cerium oxide, diatomaceous earth, aluminum oxide, zinc oxide, iron oxide, magnesium oxide, tin oxide, titanium oxide, magnesium hydroxide, aluminum hydroxide, magnesium carbonate, Barium sulfate, gypsum, calcium citrate, talc, glass beads, sericite activated clay, bentonite, aluminum nitride, tantalum nitride, and the like; and organic fillers such as polymethyl methacrylate, polyethyl methacrylate , polypropyl methacrylate, polybutyl methacrylate, butyl acrylate-methacrylic acid-methyl methacrylate copolymer, polyacrylonitrile, polystyrene, polybutadiene, polyprene, poly Isoprene, polyisopropene, and the like. These fillers may be used singly or in combination. Thixotropic agents include, but are not limited to, talc, fumed cerium oxide, ultrafine surface treated calcium carbonate, finely divided alumina, flake alumina; layered compounds such as montmorillonite; special compounds such as aluminum borate Whiskers and the like. Among the thixotropic agents, talc, fumed cerium oxide and finely divided alumina are preferred. Commercially available thixotropic agents include Aerosil RX200 (cigarette cerium oxide) available from Evonik Industries. The thixotropic agent controls the thixotropic properties of the thermosetting composition. The decane coupling agent includes, but is not limited to, γ-aminopropyltriethoxydecane, γ-mercaptopropyltrimethoxydecane, γ-methylpropenyloxypropyltrimethoxydecane, γ-glycidol Oxypropyl trimethoxy decane and the like. The heat curable resin may further contain an epoxy resin having no maleimine group in the molecule, in addition to the maleated imine resin and the maleated imine modified epoxy resin. The amount of the epoxy resin having no maleimide group in the molecule can be selected according to actual needs as long as it does not adversely affect the desired effect of the present invention. In some embodiments, the amount of epoxy resin that does not have a maleimide group in the molecule can be less than about 40% by weight based on the total amount of the heat curable sealant composition. Preferably, the heat curable sealant composition does not contain an epoxy resin which does not have a maleimide group in the molecule. The heat curable sealant composition may further contain, in addition to the mercapto-containing polyoxyalkylene oxide, a mercaptan having no alkoxyalkyl group in the molecule. The amount of the mercaptan having no oxyalkylene group in the molecule can be selected according to actual needs as long as it does not adversely affect the desired effect of the present invention. In some embodiments, the amount of thiol having no oxyalkylene group in the molecule can be less than about 5% by weight based on the total amount of the heat curable sealant composition. Preferably, the heat curable sealant composition does not contain a thiol having no oxyalkylene group in the molecule. Heat Curable Encapsulant Composition In some embodiments, the heat curable sealant composition comprises: a) from about 10% to about 85% by weight, preferably from about 30% to about 70% by weight, of heat curable resin , which is selected from the group consisting of epoxy resins, maleimide resins, maleic imide modified epoxy resins, and any combination thereof b) from about 10% by weight to about 60% by weight, preferably about 20% by weight to About 50% by weight of a latent curing agent; and c) from about 5% by weight to about 50% by weight, preferably from about 10% by weight to about 35% by weight of a fluorenyl-containing polyoxyalkylene; and d) from 0% by weight to about 10% The weight percent, preferably from about 0.1% to about 1 weight percent, based on the total weight of the heat curable sealant composition. In some embodiments, the composition has a viscosity of from about 50 Pa·s to 3,000 Pa·s, preferably from 100 Pa·s to 2000 Pa·s, more preferably from 300 Pa·s to 1000 Pa·s at about 25 ° C. The viscosity was measured using a rotary rheometer at a shear rate of 50 s -1 . The composition can be used as a sealant, especially as an ODF sealant for LCD panels. Preparation of the Adhesive Composition The adhesive composition of the present invention can be prepared by mixing the components by any suitable method and in any suitable order. The components can be mixed continuously or intermittently. If desired, the components can be agitated during mixing. The agitation speed may be constant throughout the mixing step or may vary during different mixing stages. There is no particular limitation on the mixing time, which can be adjusted according to actual needs. Preferably, the mixing temperature can be below about 40 ° C, such as room temperature (about 25 ° C). EXAMPLES The invention will be further illustrated and described with reference to the following examples. The examples are intended to provide a better understanding and practice of the invention, and are not intended to limit the scope of the invention. All preparation and testing experiments were carried out at room temperature and atmospheric pressure unless otherwise specified. Material X378538: An epoxy resin modified with maleic imine, available from Henkel Corporation. X27284: An epoxy resin modified with maleic imine, available from Henkel Corporation. CM1016: Maleic imine resin, available from Henkel Corporation. Epon 828: Epoxy resin containing no maleimine groups; commercially available from Aldrich. PN-23: a modified imidazole type latent curing agent available from Ajinomoto Fine-Techno Co., Inc. EH-4357S: Modified amine type latent curing agent available from ADEKA Corporation. HX3932HP: a modified imidazole type latent curing agent available from Asahi Kasei Chemicals Corporation. SM-992: Poly(mercaptopropylmethyl) decane, available from Gelest Inc. Propane thiol: a thiol containing no oxoalkyl group in the molecule, available from Aldrich. PM182: Barbituric acid, a stabilizer dispersed in bisphenol-A epoxy, available from Henkel Corporation. RX200: Thixotropic agent, available from Evonik Industries. Γ-glycidoxypropyltrimethoxydecane: decane coupling agent, purchased from Momentive Example 1 ( Example 1) 5.0 g X378538, 0.5 g SMS-992 and 0.2 g PM-182 were used at room temperature Mix with a high speed mixer (2350 rpm, Flacktek, DAC150) for 1 minute. Subsequently, 0.5 g of PN-23 was added to the high speed mixer and mixed for 4 minutes (2350 rpm). The obtained sample of the composition was kept at -20 ° C before its use. Examples 2-4 and Comparative Examples 1-2 The heat curable sealant compositions of Examples 2-4 and Comparative Examples 1-2 were prepared in the same manner as described above for Example 1, except that the formulations were changed according to Table 1 below. . Table 1: Formulations of heat curable sealant compositions Property Test Gel Time A time for each composition sample was placed on a hot plate at 100 ° C and the time it took for the composition sample to reach the gel point was designated gel time. To measure the gel point, use a wooden stick to insert into the sample. When the composition sample is completely hardened, it reaches the gel point. Table 2: Gel time of the heat curable sealant composition As can be seen from Table 2, the heat curable sealant compositions of the present invention have a suitable gel time that is long enough to enable application of the composition, but not so long as to reduce the efficiency of the automated line. 3- Day Gelation Test Each composition sample was stored at room temperature. The viscosity of each sample was recorded daily. Table 3: Storage stability of heat curable sealant compositions As can be seen from Table 3, the heat curable sealant composition of the present invention did not gel after 3 days and exhibited excellent storage stability, while Comparative Examples 1 and 2 both gelled within 3 days. Examples 5-6 and Comparative Examples 3-4 The heat curable sealant compositions of Examples 5-6 and Comparative Examples 3-4 were prepared in the same manner as described above for Example 1, except that the formulations were modified according to Table 4 below. . Table 4: Formulations of heat curable sealant compositions Nature Test Liquid Crystal Contamination Test Each sample of Examples 5-6 and Comparative Examples 3-4 was placed along the first glass plate (50 mm × 50 mm) in a vacuum oven (OV11, LabPlant) at a pressure of about 3 KPa. The four edges are distributed to form a rectangular sealant frame. A drop of the same composition sample was then dropped into the center of the first glass plate. Subsequently, liquid crystals (LC 52, Merck) were dispensed around the central sample droplets within the sealant frame by using a screw dispenser (ML-808GX, Musashi). The dispensing nozzle has a diameter of 0.2 mm and a dispensing speed of 70 mm/s. The volume ratio of liquid crystal to sealant frame was 1.05:1. Finally, a second glass plate was placed on the first glass plate to obtain an LCD assembly. The vacuum is released to return the vacuum oven to atmospheric pressure. Then, the obtained LCD assembly was heated in an oven at 120 ° C for 60 minutes to cure the sealant. Apply a voltage of 3 V to the LCD assembly. Then, the LCD assembly was observed by using a polarizer to verify the contamination performance. If the orientation disordered liquid crystal is less than 0.2 mm from the central sealant droplet, the final contamination performance is recorded as "good"; if the orientation disordered liquid crystal is 0.2 mm to 0.6 mm from the central sealant droplet, the final contamination will occur. The performance record is "normal"; if the liquid crystal with disordered orientation is greater than 0.6 mm from the central sealant droplet, it is recorded as "poor". The results are shown in Table 5. Table 5: Contamination properties of heat curable sealant compositions As can be seen from Table 5, the thermally curable sealant compositions of Examples 5 and 6 hardly contaminated or only slightly contaminated the LCD, while the heat curable sealant compositions of Comparative Examples 3 and 4 severely contaminated the LCD. Examples 7-8 and Comparative Examples 5-6 The heat curable sealant compositions of Examples 7-8 and Comparative Examples 5-6 were prepared in the same manner as described above for Example 1, except that the formulations were modified according to Table 6 below. . Table 6: Formulations of heat curable sealant compositions Nature Test Liquid Crystal Penetration Test Each sample of Examples 5-6 and Comparative Examples 3-4 was placed along the first glass plate (50 mm × 50 mm) in a vacuum oven (OV11, LabPlant) at a pressure of about 3 KPa. The four edges are distributed to form a rectangular sealant frame. Then, liquid crystal (LC 52, Merck) was dispensed into the sealant frame by using a screw dispenser (ML-808GX, Musashi). The dispensing nozzle has a diameter of 0.2 mm and a dispensing speed of 70 mm/s. The volume ratio of liquid crystal to sealant frame was 1.05:1. Finally, a second glass plate was placed on the first glass plate to obtain an LCD assembly. The vacuum is released to return the vacuum oven to atmospheric pressure. Then, the obtained LCD assembly was heated in an oven at 120 ° C for 60 minutes to cure the sealant. Then, the LCD assembly was visually observed to verify the penetration performance, including the maintenance of the shape of the sealant frame, liquid crystal permeation, and liquid crystal leakage. If the shape of the sealant frame is kept good and there is no liquid crystal leakage, the penetration performance is recorded as "good", and if the liquid crystal leaks, it is recorded as "poor". The results are shown in Table 7. Table 7: Permeability of heat curable sealant compositions As can be seen from Table 7, the thermally curable sealant compositions of Examples 7 and 8 well maintained the sealant frame shape and no liquid crystal leakage occurred. In contrast, the heat curable sealant compositions of Comparative Examples 5 and 6 leaked liquid crystal under the same conditions.