TW201842151A - 放熱構件用組成物、放熱構件、電子機器、放熱構件的製造方法 - Google Patents

放熱構件用組成物、放熱構件、電子機器、放熱構件的製造方法 Download PDF

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Publication number
TW201842151A
TW201842151A TW107111173A TW107111173A TW201842151A TW 201842151 A TW201842151 A TW 201842151A TW 107111173 A TW107111173 A TW 107111173A TW 107111173 A TW107111173 A TW 107111173A TW 201842151 A TW201842151 A TW 201842151A
Authority
TW
Taiwan
Prior art keywords
inorganic filler
coupling agent
polymerizable compound
compound
heat
Prior art date
Application number
TW107111173A
Other languages
English (en)
Chinese (zh)
Inventor
氏家研人
藤原武
國信隆史
滝沢和宏
Original Assignee
日商捷恩智股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商捷恩智股份有限公司 filed Critical 日商捷恩智股份有限公司
Publication of TW201842151A publication Critical patent/TW201842151A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
TW107111173A 2017-03-31 2018-03-30 放熱構件用組成物、放熱構件、電子機器、放熱構件的製造方法 TW201842151A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017072255 2017-03-31
JP2017-072255 2017-03-31

Publications (1)

Publication Number Publication Date
TW201842151A true TW201842151A (zh) 2018-12-01

Family

ID=63676210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111173A TW201842151A (zh) 2017-03-31 2018-03-30 放熱構件用組成物、放熱構件、電子機器、放熱構件的製造方法

Country Status (3)

Country Link
JP (1) JPWO2018181838A1 (fr)
TW (1) TW201842151A (fr)
WO (1) WO2018181838A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103980103B (zh) * 2010-01-29 2017-04-12 日本化药株式会社 酚化合物、环氧树脂、环氧树脂组合物、预浸料及它们的固化物
JP2012031402A (ja) * 2010-07-02 2012-02-16 Hitachi Chem Co Ltd 樹脂組成物、ｂステージシート、樹脂付金属箔、金属基板及びｌｅｄ基板
US20160137772A1 (en) * 2013-05-30 2016-05-19 Sumitomo Bakelite Co., Ltd. Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device
JP2015017165A (ja) * 2013-07-10 2015-01-29 住友ベークライト株式会社 封止用エポキシ樹脂組成物、及び半導体装置
JP2015059130A (ja) * 2013-09-17 2015-03-30 明和化成株式会社 エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材
CN106661191B (zh) * 2014-08-27 2019-06-18 捷恩智株式会社 放热构件用组合物、放热构件、电子装置、放热构件的制造方法

Also Published As

Publication number Publication date
WO2018181838A1 (fr) 2018-10-04
JPWO2018181838A1 (ja) 2020-02-20

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