TW201842075A - Compound and photosensitive resin composition comprising the same - Google Patents

Abstract

The present invention relates to a compound having a novel chemical structure, and a photosensitive resin composition including the same, and a photosensitive material, a color filter, and a display device manufactured by using the same.

Description

Compound and photosensitive resin composition containing the same

[Cross-reference to related applications] This application claims the priority right of Korean Patent Application No. 10-2017-0048106, filed on April 13, 2017, and the entire disclosure of the application is incorporated herein by reference. in.

The present invention relates to a compound, a photosensitive resin composition containing the compound, and a photosensitive material, a color filter, and a display element manufactured by using the photosensitive resin composition. More specifically, the present invention relates to a compound having excellent color characteristics, heat resistance, and solvent resistance, a photosensitive resin composition using the same, and a photosensitive material and a color filter manufactured by using the photosensitive resin composition. And display elements.

For recent color filters, high brightness and high contrast performance characteristics are needed. In addition, one of the main objectives of research and development of display elements is to differentiate the performance of the display elements by improving the color purity and to improve the productivity in the manufacturing process.

Since pigments of the type used as a color material of the existing color filter exist in the color photoresist in a state of particle dispersion, it is difficult to adjust brightness and contrast by adjusting the size and distribution of the pigment particles. In the case of pigment particles, the particles are aggregated in the color filter, the dissolution and dispersion characteristics are reduced, and multiple scattering of light occurs due to the large particles that have been aggregated. This scattering of polarized light is seen as a major factor in reducing contrast.

Therefore, research has been conducted to improve brightness and contrast through formation of ultrafine particles and stabilization of pigment dispersion, but there is a limited degree of freedom in selecting a color material for achieving color coordinates of a high-color purity display element.

In addition, pigment dispersion methods using color materials (especially pigments) have been developed to reach the limits of improving the color purity, brightness, and contrast of color filters using this method.

Therefore, there is a need to develop novel color materials capable of improving color reproduction, brightness, and contrast by enhancing color purity.

[Technical Problem] An object of the present invention is to provide a compound having excellent color characteristics, heat resistance, and solvent resistance.

Another object of the present invention is to provide a photosensitive resin composition using the above compound.

Another object of the present invention is to provide a color filter and a display element manufactured by using the above compound or a photosensitive resin composition.

[Technical Solution] This specification provides a compound represented by Chemical Formula 1.

This specification also provides a color material composition including the above compounds.

In addition, the present specification provides a photosensitive resin composition including a compound or a color material composition.

This manual further provides a photosensitive material manufactured by using a photosensitive resin composition, and a color filter or a display element using the photosensitive material.

Hereinafter, a compound according to a specific embodiment of the present invention and a photosensitive resin composition containing the compound will be described in more detail.

Throughout this specification, when a component “includes” a constituent element, unless specifically described otherwise, this does not mean excluding another constituent element, but means that it may further include another constituent element.

In this specification, examples of the substituent are described below, but are not limited thereto.

As used herein, the term "substituted" means that a hydrogen atom bonded to a carbon atom of a compound becomes another substituent, and the position of the substitution is not limited as long as the position is at the position where the hydrogen atom is substituted. Yes, that is, where the substituents may be substituted, and when two or more are substituted, two or more than two substituents may be the same or different from each other.

As used herein, the term "substituted or unsubstituted" means a substitution by one or more substituents selected from the group consisting of: deuterium; halogen group; Cyano group; nitro group; hydroxyl group; carbonyl group; ester group; imide group; amino group; carboxyl group (Carboxy group); sulfonic acid group; sulfonamide group; phosphine oxide group; alkoxy group; aryloxy group; alkyl Alkylthioxy group; arylthioxy group; arylthioxy group; alkylsulfoxy group; arylthiooxy group; silyl group; boron group ); Alkyl group; cycloalkyl group; alkenyl group; aryl group; aralkyl group; aralkenyl group; Alkylaryl group; arylphosphine group; or heterocyclic group containing at least one of N, O, and S atoms, or the absence of substituents, or the substituents exemplified by linkage Two or more of the substituents are substituted or absent. By way of example, the term "substituent which is bonded to two or more substituents" may refer to biphenyl. That is, the biphenyl group may be an aryl group, or may be interpreted as a substituent linking two phenyl groups.

In this manual, or It means a bond to another substituent, and a single bond means that another atom does not exist in the part represented by L.

In the present specification, examples of the halogen group include fluorine, chlorine, bromine, and iodine.

In this specification, the number of carbon atoms in the fluorene imino group is not particularly limited, but is preferably 1 to 30. Specifically, the fluorenimine group may be a compound having the following structure, but is not limited thereto.

In the present specification, in the amido group, the nitrogen in the amido group may be substituted by each of: hydrogen; a linear, branched, or cyclic alkyl group having 1 to 30 carbon atoms; or having 6 to 30 Aryl group of one carbon atom. Specifically, the amido group may be a compound having the following structure, but is not limited thereto.

In this specification, the number of carbon atoms in the carbonyl group is not particularly limited, but is preferably 1 to 30. Specifically, the carbonyl group may be a compound having the following structure, but is not limited thereto.

In this specification, the ester group may have a structure in which oxygen in the ester group may be substituted with a linear, branched, or cyclic alkyl group having 1 to 25 carbon atoms or an aryl group having 6 to 25 carbon atoms. Specifically, the ester group may be a compound having the following structure, but is not limited thereto.

In the present specification, the sulfonamide group may be -SO ₂ NR'R ", wherein R 'and R" are the same or different from each other, and may be independently selected from the group consisting of: hydrogen; deuterium; Nitrile group; a substituted or unsubstituted monocyclic or polycyclic cycloalkyl group having 3 to 30 carbon atoms; a substituted or unsubstituted straight or branched chain having 1 to 30 carbon atoms Alkyl; substituted or unsubstituted monocyclic or polycyclic aryl having 6 to 30 carbon atoms; and substituted or unsubstituted monocyclic or polycyclic heteroaryl having 2 to 30 carbon atoms base.

In this specification, the alkyl group may be a straight chain or a branched chain, and the number of carbon atoms thereof is not particularly limited, but is preferably 1 to 40. According to one embodiment, the alkyl group has 1 to 20 carbon atoms. According to another embodiment, the alkyl group has 1 to 10 carbon atoms. According to yet another embodiment, the alkyl group has 1 to 6 carbon atoms. Specific examples of alkyl include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, third butyl, second butyl, 1-methyl-butyl Base, 1-ethyl-butyl, pentyl, n-pentyl, isopentyl, neopentyl, third pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4 -Methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl, n-heptyl, 1-methylhexyl, cyclopentylmethyl, cycloheptylmethyl , Octyl, n-octyl, third octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, 1-ethyl -Propyl-, 1,1-dimethyl-propyl, isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl, and the like, but are not limited thereto.

In the present specification, the cycloalkyl group is not particularly limited, but the number of carbon atoms thereof is preferably 3 to 60. According to one embodiment, a cycloalkyl group has 3 to 30 carbon atoms. According to another embodiment, a cycloalkyl group has 3 to 20 carbon atoms. According to another embodiment, a cycloalkyl group has 3 to 6 carbon atoms. Specific examples thereof include cyclopropyl, cyclobutyl, cyclopentyl, 3-methylcyclopentyl, 2,3-dimethylcyclopentyl, cyclohexyl, 3-methylcyclohexyl, 4-methylcyclo Hexyl, 2,3-dimethylcyclohexyl, 3,4,5-trimethylcyclohexyl, 4-tert-butylcyclohexyl, cycloheptyl, cyclooctyl and similar groups, but not limited thereto .

In the present specification, an alkoxy group may be a straight chain, a branched chain, or a cyclic chain. The number of carbon atoms of the alkoxy group is not particularly limited, but is preferably 1 to 30. Specific examples thereof include methoxy, ethoxy, n-propoxy, isopropoxy, i-propyloxy, n-butoxy, isobutoxy, third butoxy , Second butoxy, n-pentyloxy, neopentyloxy, isopentyloxy, n-hexyloxy, 3,3-dimethylbutoxy, 2-ethylbutoxy, n-octyloxy, N-nonyloxy, n-decyloxy, benzyloxy, p-methylbenzyloxy and the like are not limited thereto.

In this specification, the amine group can be selected from the group consisting of: -NH ₂ , monoalkylamino group, dialkylamino group, N-alkylarylamino group, monoarylamino group, Arylamino, N-arylheteroarylamine, N-alkylheteroarylamine, monoheteroarylamine, and diheteroarylamine, and the number of carbon atoms of which is not specifically limited, but It is preferably 1 to 30. Specific examples of the amino group include methylamino, dimethylamino, ethylamino, diethylamino, aniline, naphthylamine group, benzidine, anthracenylamine group, 9-methyl -Anthracenylamino, diphenylamino, ditolylamine group, N-biphenylnaphthylamine, N-phenyltolylamine group, N-biphenylnaphthylamine, Xylamino, N-phenyltolylamine, triphenylamine, N-naphthylfluorenylamine group, N-phenylphenanthrenylamine group, N-biphenyl Phenanthramino group, N-phenylamidinoamino group, N-phenyltriphenylamino group, N-phenanthramidoamino group, N-biphenylamidinoamino group and the like, but is not limited thereto.

In the present specification, N-alkylarylamino group means an amine group in which an alkyl group and an aryl group are substituted with N in the amine group.

In the present specification, the N-arylheteroarylamino group means an amine group in which an aryl group and a heteroaryl group are substituted with N of the amine group.

In the present specification, the N-alkylheteroarylamino group means an amino group in which an alkyl group and a heteroarylamino group are substituted with N in the amine group.

In the present specification, alkyl groups in monoalkylamino, dialkylamino, N-arylalkylamino, alkylthiol, alkylthiooxy, and N-alkylheteroarylamino groups The group is the same as the example of the above-mentioned alkyl group. Specifically, examples of the alkyl mercaptan group include a methyl mercaptan group, an ethyl mercaptan group, a third butyl mercaptan group, a hexyl mercaptan group, an octyl mercaptan group, and the like, and an alkyl group Examples of the thiooxy group include methyl, ethylthio, propylthio, butylthio, and the like, but examples thereof are not limited thereto.

In this specification, the alkenyl group may be straight or branched, and the number of carbon atoms thereof is not particularly limited, but is preferably 2 to 40. According to one embodiment, an alkenyl has 2 to 20 carbon atoms. According to another embodiment, an alkenyl has 2 to 10 carbon atoms. According to yet another embodiment, an alkenyl has 2 to 6 carbon atoms. Specific examples thereof include vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-pentenyl, 2-pentenyl, 3-pentene Group, 3-methyl-1-butenyl, 1,3-butadienyl, allyl, 1-phenylvinyl-1-yl, 2-phenylvinyl-1-yl 2,2-diphenylvinyl-1-yl, 2-phenyl-2- (naphthyl-1-yl) vinyl-1-yl, 2,2-bis (diphenyl-1-yl) ) Vinyl-1-yl, stilbenyl group, styrenyl group, and similar groups, but are not limited thereto.

In this specification, the silyl group specifically includes a trimethylsilyl group, a triethylsilyl group, a third butyldimethylsilyl group, a vinyldimethylsilyl group, a propyldimethylsilyl group, and a triphenyl group. Butylsilyl, diphenylsilyl, phenylsilyl, and the like are not limited thereto.

In this specification, the boron group specifically includes a trimethylboryl group, a triethylboryl group, a third butyldimethylboryl group, a triphenylboryl group, a phenylboryl group, and the like, but is not limited to this.

In the present specification, specific examples of the phosphine oxide group include, but are not limited to, a diphenylphosphine oxide group, a dinaphthylphosphine oxide group, and the like.

In this specification, the aryl group is not particularly limited, but preferably has 6 to 60 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group. According to one embodiment, the aryl group has 6 to 30 carbon atoms. According to one embodiment, the aryl group has 6 to 20 carbon atoms. The aryl group may be, but is not limited to, phenyl, biphenyl, bitriphenyl, and the like such as a monocyclic aryl group. Examples of polycyclic aryl groups include naphthyl group, anthracenyl group, phenanthryl group, pyrenyl group, perylenyl group, chrycenyl group, fluorene Group (fluorenyl group) or the like, but is not limited thereto.

In this specification, a fluorenyl group may be substituted, and two substituents may be bonded to each other to form a spiro ring structure. In the case of substituted fluorenyl, it can form And similar groups. However, the structure is not limited to this.

In the present invention, an "adjacent" group may be a substituent substituted by an atom directly bonded to a substituted atom of the corresponding substituent, a substituent placed in space closest to the corresponding substituent, or a corresponding substitution Another substituent substituted with a substituted atom. For example, two substituents substituted at the ortho position in the benzene ring and two substituents substituted with the same carbon in the aliphatic ring can be interpreted as groups "adjacent" to each other.

In this specification, monoarylamino, diarylamino, aryloxy, arylthiol, arylthiooxy, N-arylalkylamino, N-arylheteroarylamine The aryl group in the aryl group and the arylphosphino group is the same as the aryl example described above. Specifically, examples of the aryloxy group include phenoxy, p-tolyloxy, m-tolyloxy, 3,5-dimethyl-phenoxy, 2,4,6-trimethylphenoxy, p- Third butylphenoxy, 3-biphenoxy, 4-biphenoxy, 1-naphthyloxy, 2-naphthyloxy, 4-methyl-1-naphthyloxy, 5-methyl- 2-naphthyloxy, 1-anthraceneoxy, 2-anthraceneoxy, 9-anthraceneoxy, 1-phenanthryloxy, 3-phenanthryloxy, 9-phenanthryloxy and similar groups; arylthiol Examples of radicals include phenylthiol, 2-methylphenylthiol, 4-tert-butylphenylthiol, and the like; examples of arylthiol include phenylthiol, Toluylthiooxy and the like, but examples thereof are not limited thereto.

In the present specification, the heterocyclic group is a heterocyclic group containing at least one of O, N, Se, and S as a hetero atom, and the number of carbon atoms is not particularly limited, but is preferably 2 to 60. Examples of heterocyclic groups include thiophene group, furan group, pyrrole group, imidazole group, thiazole group, oxazole group, oxazole group Oxadiazole group, triazole group, pyridyl group, bipyridyl, pyrimidyl group, triazine group, triazole group, Acridyl group, pyridazine group, pyrazinyl group, quinolinyl group, quinazoline group, quinoxalinyl group, Phthalazinyl group, pyridopyrimidinyl group, pyridopyrazinyl group, pyrazinopyrazinyl group, isoquinolinyl, indole group , Carbazole group, benzoxazolyl, benzimidazolyl, benzothiazolyl, benzocarbazolyl, benzothiophene group), dibenzothienyl, benzofuranyl, phenanthroline group, thiazolyl group, isoxazolyl, oxadiazolyl group, thiadiazolyl group ), Benzothiazoly group, phenothiazinyl group, dibenzofuranyl group and the like, but not limited thereto.

In this specification, a heteroaryl group contains one or more atoms other than carbon, that is, one or more heteroatoms, and in particular, a heteroatom may include a group consisting of O, N, Se, S, and similar atoms. One or more atoms selected from the constituent groups. The number of carbon atoms thereof is not particularly limited, but is preferably 2 to 60, and the heteroaryl group may be monocyclic or polycyclic. Examples of heterocyclic groups include thienyl, furyl, pyrrolyl, imidazolyl, thiazolyl, oxazolyl, oxadiazolyl, pyridyl, dipyridyl, pyrimidinyl, triazinyl, triazolyl, acridine , Pyridazinyl, pyrazinyl, quinoline, quinazolinyl, quinazolinyl, phthalazinyl, pyridopyrimidinyl, pyridopyrazinyl, pyrazinopyrazinyl, isoquinolinyl, Indolyl, carbazolyl, benzoxazolyl, benzimidazolyl, benzothiazolyl, benzocarbazolyl, benzothiophene, dibenzothienyl, benzofuranyl, phenanthroline group), thiazolyl, isoxazolyl, oxadiazolyl, thiadiazolyl, benzothiazolyl, phenothiazinyl, aziridyl group, azaindolyl, isoindolyl , Indazolyl group, purine group, pteridyl group, beta-carboline group, naphthyridyl group, terpyridyl, phenazine (Phenazinyl group), imidazopyridyl, pyrrolopyridyl, azepine group, pyrazolyl (pyr azolyl group), dibenzofuranyl, and the like, but are not limited thereto.

In this specification, examples of the heteroaryl group among the monoheteroarylamino group, the diheteroarylamine group, the N-arylheteroarylamine group, and the N-alkylheteroarylamine group may be exemplified by the heteroaryl group. Selected from the above examples.

In this specification, an alkylene group is a divalent functional group derived from an alkane, and examples thereof include a linear group, a branched group, or a cyclic group such as methylene, ethylidene, or ethylene. Propyl, i-butyl, second-butyl, third-butyl, pentyl, hexyl, and the like.

In the present specification, a haloalkylene group means a halogen-substituted functional group of the above-mentioned alkylene group, such as perfluoropropane-2,2-diyl and the like .

In this specification, arylene means that there are two bonding positions in the aryl group, that is, a divalent group. The above description of the aryl group except that the arylene groups are each a divalent group can be applied.

In the present specification, in a substituted or unsubstituted ring formed by combining adjacent groups with each other, "ring" means a substituted or unsubstituted hydrocarbon ring, or a substituted or unsubstituted Heterocyclic.

In the present specification, the hydrocarbon ring may be an aromatic ring, an aliphatic ring, or a condensed ring of an aromatic ring and an aliphatic ring, and may be selected from examples of a cycloalkyl group or an aryl group, except that it is not a monovalent hydrocarbon ring.

In this specification, the aromatic ring may be monocyclic or polycyclic, and may be selected from examples of the aryl group, except for an aromatic ring that is not a monovalent one.

In the present specification, a heterocyclic ring contains one or more atoms other than carbon, that is, one or more heteroatoms, and in particular, the heteroatoms may include O, N, Se, S, and similar groups Selected from one or more atoms. The heterocyclic ring may be monocyclic or polycyclic, and may be an aromatic ring, an aliphatic ring, or a condensed ring of an aromatic ring and an aliphatic ring, and may be selected from the examples of heteroaryl groups, except for non-monovalent heterocyclic rings.

In this specification, "direct bond" refers to a connection to a bond wire in which no atom or atom group exists at the corresponding position.

According to one embodiment of the present invention, a compound represented by the following Chemical Formula 1 may be provided. [Chemical Formula 1]

In Chemical Formula 1, Y1 and Y2 are each the same or different, and each is independently a direct bond or -CQ1Q2-; A is a direct bond; ether group; carbonyl group; ester group; diester group; peroxy group; amine group; Amine group; Amidino group; Azo group; Amidino group; Amidino group; Alkyl group having 1 to 10 carbon atoms; Heteroalkyl group having 1 to 10 carbon atoms; 1 to 10 carbons A halogenated alkylene group of an atom; an extended aryl group having 6 to 20 carbon atoms; or an extended aryl group having 3 to 20 carbon atoms, R1 to R26, Q1, and Q2 are the same as or different from each other, and are each independently Hydrogen; deuterium; halo; nitrile; nitro; hydroxyl; carbonyl; ester; fluorenimine; fluorenamine; carboxyl (-COOH); -OC (= O) R "'; SO ₃ H); sulfonamide; substituted or unsubstituted alkyl; substituted or unsubstituted cycloalkyl; substituted or unsubstituted alkoxy; substituted or unsubstituted aromatic Oxy; substituted or unsubstituted alkyl thiol; substituted or unsubstituted aryl thiol; substituted or unsubstituted alkyl thiol; substituted or unsubstituted aryl Base sulfur Group; substituted or unsubstituted alkenyl group; substituted or unsubstituted silyl group; substituted or unsubstituted boron group; substituted or unsubstituted amine group; substituted or unsubstituted aromatic group Phosphino; substituted or unsubstituted phosphine oxide; substituted or unsubstituted aryl; or substituted or unsubstituted heteroaryl, or adjacent groups may be bonded to each other to form a substituted Or unsubstituted ring, and R "'is a substituted or unsubstituted alkyl group.

The inventors found through experiments that since the solubility of a compound in a solvent is increased by a sulfonate group contained in a molecular structure as shown in Chemical Formula 1, the compound can be prevented from re-aggregating and foreign matter formation can be suppressed, and therefore it is being used in applications When the color filter is used, the color purity, brightness, and contrast can be improved, thereby completing the present invention.

Specifically, in the compound of one embodiment, two sulfonic acid groups are introduced into the molecular structure due to the formation of a dimer, so that the effect of increasing the solubility by the sulfonic acid ester group can be further enhanced, and in addition, since The spectrum emitted by the light source can be properly combined with the absorption and emission spectrum of the color filter, so that the color purity is improved, and the color reproduction, brightness, and contrast can be improved. In addition, due to the increase in molecular weight, heat resistance is improved, and even after a heat treatment step when a photosensitive material is generated, color purity, brightness, and contrast do not suddenly change, thereby achieving stable display performance.

In addition, since the compound of one embodiment employs an aromatic functional group bonded to the terminal of a sulfonate group, such as an aryl group having 6 to 20 carbon atoms or a heteroaryl group having 3 to 20 carbon atoms, it can be Realize the effect of improving heat resistance.

Specifically, in Chemical Formula 1, Y1 and Y2 are the same or different from each other, and are independently a direct bond or -CQ1Q2-. In -CQ1Q2-, C is a carbon and Q1 and Q2 may each represent a functional group independently bonded to a carbon. Therefore, when Y1 or Y2 is a direct bond, a pentagonal ring having 5 carbon atoms can be formed, and when Y1 or Y2 is -CQ1Q2-, a hexagonal ring having 6 carbon atoms can be formed.

In addition, in Chemical Formula 1, A is a direct bond; an ether group; a carbonyl group; an ester group; a diester group; a peroxy group; an amine group; an imino group; a fluorenimine group; an azo group; ; Alkylene group having 1 to 10 carbon atoms; heteroalkylene group having 1 to 10 carbon atoms; haloalkylene group having 1 to 10 carbon atoms; alkylene group having 6 to 20 carbon atoms ; Or an extended heteroaryl group having 3 to 20 carbon atoms.

More preferably, in Chemical Formula 1, A may be a direct bond; an ether group; a carbonyl group; a diester group; a fluorenyl group; an alkylene group having 1 to 10 carbon atoms; or a halogenyl group having 1 to 10 carbon atoms alkyl;

The diester group is a functional group including two ester functional groups, and examples thereof include a functional group represented by the following Chemical Formula 2. [Chemical Formula 2]

In Chemical Formula 2, X is an alkylene group having 1 to 10 carbon atoms; a heteroalkyl group having 1 to 10 carbon atoms; a haloalkylene group having 1 to 10 carbon atoms; having 6 to 20 Carbon atom extended aryl group; or extended heteroaryl group having 3 to 20 carbon atoms. Preferably, X may be an alkylene group having 1 to 5 carbon atoms, such as methylene, ethylidene, propylidene, or the like.

The haloalkylene group having 1 to 10 carbon atoms means a functional group having an alkylene group having 1 to 10 carbon atoms substituted with a halogen group, and examples thereof include perfluoropropane-2,2-diyl (perfluoropropane- 2,2-diyl) and similar groups.

In Chemical Formula 1, R1 to R26 are the same or different from each other, and are each independently hydrogen; a halogen group; a nitro group; a carboxyl group; an ester group; a hydroxyl group; -OC (= O) R "'; a sulfonic group (-SO ₃ H); substituted or unsubstituted alkyl groups; substituted or unsubstituted alkoxy groups; substituted or unsubstituted aryloxy groups; or substituted or unsubstituted aryl groups, or adjacent groups The groups may be bonded to each other to form a substituted or unsubstituted ring.

R "'is a substituted or unsubstituted alkyl group.

R "'is methyl.

In Chemical Formula 1, R1 to R26 are the same or different from each other, and are independently hydrogen, fluorine, chlorine, bromine, iodine, nitro, carboxyl, alkyl ester group, cycloalkyl ester group, aryl alkyl ester group, Hydroxy; -OC (═O) CH ₃ ; sulfo (-SO ₃ H); methyl; third butyl; methoxy; phenyl; or naphthyl.

In Chemical Formula 1, at least one of Q1, Q2, and R17 to R26 may be combined with an adjacent functional group to form a substituted or unsubstituted aromatic ring.

In particular, in Chemical Formula 1, at least one of Q1, Q2, and R17 to R26 may be combined with adjacent functional groups to form a substituted or unsubstituted benzene ring, or a substituted or unsubstituted naphthalene ring .

In Chemical Formula 1, Y1 and Y2 may be each independently a direct bond.

The compound of one embodiment may be represented by the following Chemical Formula 1-1. [Chemical Formula 1-1]

In Chemical Formula 1-1, A is a direct bond; an ether group; a carbonyl group; a diester group; a fluorenyl group; an alkylene group having 1 to 10 carbon atoms; or a haloalkylene group having 1 to 10 carbon atoms, And R27 and R28 are the same or different from each other and each independently is a phenyl group or a naphthyl group.

In addition, the compound of one embodiment may be represented by the following Chemical Formula 1-2 or Chemical Formula 1-3. [Chemical Formula 1-2] [Chemical Formula 1-3]

In Chemical Formula 1-2 or Chemical Formula 1-3, A is a direct bond; an ether group; a carbonyl group; a diester group; a fluorenyl group; an alkylene group having 1 to 10 carbon atoms; or an alkyl group having 1 to 10 carbon atoms; Haloalkylene, and R28 to R31 are the same or different from each other and are each independently a phenyl or naphthyl group.

The compound of one embodiment may be represented by any one of the following Chemical Formulae 1-4 to 1-15. [Chemical Formula 1-4] [Chemical Formula 1-5] [Chemical Formula 1-6] [Chemical Formula 1-7] [Chemical Formula 1-8] [Chemical Formula 1-9] [Chemical Formula 1-10] [Chemical Formula 1-11] [Chemical Formula 1-12] [Chemical Formula 1-13] [Chemical Formula 1-14] [Chemical Formula 1-15]

Meanwhile, according to another embodiment of the present invention, a color material composition including the compound of one embodiment described above may be provided.

The details of the above compounds include those described above with reference to one example.

The color material composition may further include at least one of a dye and a pigment. For example, the color material composition may include only the compound of the above embodiment, but it may include the compound of one embodiment and one or more types of dyes, or may include the compound of one embodiment and one or more types of dyes. The pigment, or may include the compound of one embodiment and one or more types of dyes and one or more types of pigments.

The specific type of dye or pigment used herein is not particularly limited, and various materials widely used in the field of color filters or displays can be used without limitation.

Meanwhile, according to another embodiment of the present invention, a photosensitive resin composition may be provided. The photosensitive resin composition includes the compound of one embodiment mentioned above or the color material composition of another embodiment mentioned above. Adhesive resins; polyfunctional monomers; photoinitiators; and solvents.

The details of the above compounds include those described above with reference to one embodiment, and the details of the color material composition include those described above with reference to another embodiment.

The binder resin is not particularly limited as long as it can exhibit physical properties such as strength and expandability of a film produced from a resin composition.

The binder resin may be a copolymer resin that imparts mechanical strength to a polyfunctional monomer and a monomer that imparts alkali solubility, and may further include a binder generally used in the art.

The polyfunctional monomer that imparts mechanical strength to the film may be at least one of an unsaturated carboxylic acid ester, an aromatic ethylene, an unsaturated ether, an unsaturated sulfonimine, and an acid anhydride.

Specific examples of unsaturated carboxylic acid esters can be selected from the group consisting of benzyl (meth) acrylate, meth (meth) acrylate, ethyl (meth) acrylate, butyl ( (Meth) acrylate, dimethylaminoethyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (Meth) acrylate, ethylhexyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, (meth) ) Hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-chloropropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, fluorenyl (meth) acrylate Octyloxy-2-hydroxypropyl ester, glycerol (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxydi Ethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxytripropylene glycol (meth) acrylate, poly (ethylene glycol) methyl ether (meth) acrylate Phenoxyethylene (Meth) acrylate, p-nonylphenoxy polyethylene glycol (meth) acrylate, p-nonylphenoxy polypropylene glycol (meth) acrylate, glycidyl (meth) acrylate, (formyl) ) Tetrafluoropropyl acrylate, 1,1,1,3,3,3-hexafluoroisopropyl (meth) acrylate, octafluoropentyl (meth) acrylate, heptafluorofluoro (meth) acrylate Decyl ester, tribromophenyl (meth) acrylate, α-hydroxymethyl methacrylate, α-hydroxymethacrylate, α-hydroxymethacrylate, and α-hydroxymethacrylate, but Not limited to this.

Specific examples of the aromatic vinyl monomer can be selected from the group consisting of: styrene, α-methylstyrene, (o-, m-, p-)-vinyltoluene, (o-, m-, p-)-form Oxystyrene and (o-, m-, p-)-chlorostyrene, but are not limited thereto.

Specific examples of the unsaturated ether may be selected from the group consisting of vinyl methyl ether, vinyl ether, and allyl glycidyl ether, but are not limited thereto.

Specific examples of the unsaturated fluorene imine can be selected from the group consisting of: N-phenylcis butylene diimide, N- (4-chlorophenyl) cis butylene diimide, N- (4-Hydroxyphenyl) maleimide and N-cyclohexylmaleimide, but are not limited thereto.

Examples of the acid anhydride include, but are not limited to, maleic anhydride, methyl maleic anhydride, and tetrahydrophthalic anhydride.

The monomer which imparts alkali solubility is not particularly limited as long as it contains an acid group, and for example, it is preferable to use at least one selected from the group consisting of (meth) acrylic acid, butenoic acid, Itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, 5-norbornene-2-carboxylic acid, Mono-2-(((meth) acryloxy) ethyl) phthalate, mono-2-(((meth) acryl) oxy) ethyl succinate, and ω-carboxy polycaprolactone mono ( (Meth) acrylate, but is not limited to this.

According to an embodiment of the present invention, the binder resin has an acid value of 50 KOH mg / g to 130 KOH mg / g and a weight average molecular weight of 1000 to 50,000.

A polyfunctional monomer is a monomer having a function of forming a photoresist image by light, and specific examples thereof include one or two or more mixtures selected from the group consisting of: propylene glycol a Acrylate, dipentaerythritol hexaacrylate, dipentaerythritol acrylate, neopentyl glycol diacrylate, 6-hexanediol diacrylate, 1,6-hexanediol acrylate tetraethylene glycol methacrylate, Biphenoxyethanol diacrylate, trihydroxyethyl isocyanurate trimethacrylate, trimethylpropane trimethacrylate, diphenyl pentaerythritol hexaacrylate, pentaerythritol trimethacrylate, pentaerythritol Tetramethacrylate and dipentaerythritol hexamethacrylate.

The photoinitiator is not particularly limited as long as it is an initiator that generates a radical upon exposure to trigger crosslinking. For example, the photoinitiator may be at least one selected from the group consisting of: acetophenone compounds, non-imidazole compounds, triazine compounds, and oxime compounds.

The acetophenone compound may be at least one selected from the group consisting of 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1- (4-isopropylbenzene ) -2-hydroxy-2-methylpropane-1-one, 4- (2-hydroxyethoxy) -phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone , Benzoin methyl ether, benzoin ether, benzoin isobutyl ether, benzoin butyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- (4-methyl Thio) phenyl-2-morpholinyl-1-propane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) -butane-1- Ketone, 2- (4-bromo-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) -butane-1-one, 2-methyl-1- [4- ( Methylthio) phenyl] -2-morpholinylpropane-1-one and similar groups, but are not limited thereto.

The non-imidazole compound may be at least one selected from the group consisting of: 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl non-imidazole 2,2'-bis (p-chlorophenyl) -4,4 ', 5,5'-tetra (3,4,5-trimethoxyphenyl) -1,2'-non-imidazole, 2,2 '-Bis (2,3-dichlorophenyl) -4,4', 5,5'-tetraphenyl non-imidazole, 2,2'-bis (o-chlorophenyl) -4,4,5,5 '-Tetraphenyl-1,2'-non-imidazole and similar groups are not limited thereto.

The triazine compound may be at least one selected from the group consisting of the following: 3- {4- [2,4-bis (trichloromethyl) -mesatriazin-6-yl] phenylthio } Propionic acid, 1,1,1,3,3,3-hexafluoroisopropyl-3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] benzenesulfide Methyl} propionate, ethyl-2- {4- [2,4-bis (trichloromethyl) -s-triazine-6-yl] phenylthio} acetate, 2-epoxyethyl- 2- {4- [2,4-bis (trichloromethyl) -mesytriazin-6-yl] phenylthio} acetate, 2- {4- [2,4-bis (trichloromethyl) ) -Mesytriazine-6-yl] phenylthio} cyclohexyl acetate, benzyl-2- {4- [2,4-bis (trichloromethyl) -mesytriazin-6-yl] benzene Thio} acetate, 3- (chloro-4- [2,4-bis (trichloromethyl) -mesatriazin-6-yl] phenylthio} propanoic acid, 3- {4- [2, 4-bis (trichloromethyl) -mesytriazin-6-yl] phenylthio} propanamide, 2,4-bis (trichloromethyl) -6-p-methoxystyryl-mesityl Hydrazine, 2,4-bis (trichloromethyl) -6- (1-p-dimethylaminophenyl) -1,3, -butadienyl-triazine, 2-trichloromethyl-4 -Amino-6-p-methoxystyryl-mesytriazine and the like, but is not limited thereto.

The oxime compound may be at least one selected from the group consisting of: 1,2-octanedione-1- (4-phenylthio) phenyl-2- (o-benzoylhydrazine) (CGI 124, manufactured by Ciba-Geigy), ethyl ketone-1- (9-ethyl) -6- (2-methylbenzylidene-3-yl) -1- ( O-acetylamoxime) (CGI 242, manufactured by Ciba-Geigy) and N-1919 (manufactured by Adeka Corp.), but are not limited thereto.

The solvent may be at least one selected from the group consisting of acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, tetrahydrofuran, 1,4-dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ether Ethyl ether, chloroform, dichloromethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane, 1,1,2-trichloro Ethylene, hexane, heptane, octane, cyclohexane, benzene, toluene, xylene, methanol, ethanol, isopropanol, propanol, butanol, tertiary butanol, 2-ethoxypropanol, 2 -Methoxypropanol, 3-methoxybutanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, 3-methoxybutyl acetate, ethyl 3-ethyl Oxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate, propylene glycol monomethyl ether, and dipropylene glycol monomethyl ether are not limited thereto.

The content of the compound may be 5% to 60% by weight based on the total weight of the solid content in the photosensitive resin composition. In addition, the content of the binder resin may be 1 to 60% by weight, the content of the photoinitiator may be 0.1 to 20% by weight, and the content of the polyfunctional monomer may be 0.1 to 50% by weight.

The total weight of the solid content means the sum of the total weight of the components other than the solvent in the resin composition. Standards based on the solids content and the weight percent of each component can be measured by general analytical methods used in the art, such as liquid chromatography or gas chromatography.

The photosensitive resin composition may further include an antioxidant. The content of the antioxidant may be 0.1% to 20% by weight based on the total weight of the solid content in the photosensitive resin composition.

The antioxidant may be at least one selected from the group consisting of: hindered phenol antioxidants, amine antioxidants, sulfur antioxidants, and phosphine antioxidants, but is not limited thereto.

Specific examples of the antioxidant may include a phosphoric acid-based heat stabilizer such as phosphoric acid, trimethyl phosphate, and triethyl phosphate; a hindered phenol-type main antioxidant such as 2,6-di-tertiary-butyl-para- Cresol, octadecyl-3- (4-hydroxy-3,5-di-tert-butylphenyl) propionate, tetrabis [methylene-3- (3,5-di-tert-butyl) 4-hydroxyphenyl) propionate] methane, 1,3,5-trimethyl-2,4,6-tris (3,5-di-third-butyl-4-hydroxybenzyl) Benzene, 3,5-di-tert-butyl-4-hydroxybenzyl phosphite diethyl ester, 2,2-thiobis (4-methyl-6-tert-butylphenol), 2, 6-Third-butylphenol 4,4'-butylene-bis (3-methyl-6-butylphenol) (2,6-g, t-butylphenol 4,4-butylidene-bis (3-methyl- 6-butylphenol)), 4,4'-thiobis (3-methyl-6-third butylphenol), and bis [3,3-bis (4'-hydroxy-3'-third butylbenzene) Bis [3,3-bis- (4'-hydroxy-3'-tert-butylphenyl) butanoicacid] glycol ester); amine secondary antioxidants, such as phenyl-α-naphthylamine , Phenyl-β-naphthylamine, N, N'-diphenyl-p-phenylene diamine, and N, N'-di-β-naphthyl-p-phenylene diamine; sulfur times Antioxidants such as dilauryl disulfide, dilauryl thiopropionate, distearyl thiopropionate, mercaptobenzothiazole, and tetramethylbismethylthiocarboxamide disulfide tetrabis [Asia Methyl-3- (laurylthio) propionate] methane; and phosphite-type secondary antioxidants such as triphenyl phosphite, tri (nonylphenyl) phosphite, triisodecyl phosphite , Bis (2,4-dibutylphenyl) pentaerythritol diphosphite and (1,1'-biphenyl) -4,4'-diylbis Tetrakis [2,4-bis (1,1-dimethylethyl) phenyl] phosphite ((1,1'-biphenyl) -4,4'-diylbisphosphonous acid tetrakis [2,4-bis (1 , 1-dimethylethyl) phenyl] ester).

In addition, the photosensitive resin composition may further include one or more additives selected from the group consisting of: photocrosslinking sensitizers, curing accelerators, adhesion promoters, surfactants, thermal polymerization inhibitors, ultraviolet rays Absorbent, dispersant and leveling agent. The content of the additive is 0.1 to 20% by weight based on the total weight of the solid content in the photosensitive resin composition.

One or more selected from the group consisting of: benzophenone-based compounds such as benzophenone, 4,4-bis (di (Methylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 2,4,6-trimethylaminobenzophenone, methyl-o-benzoic acid benzoate Fluorenyl ester, 3,3-dimethyl-4-methoxybenzophenone and 3,3,4,4-tetrakis (third butylperoxycarbonyl) benzophenone; fluorenone -based) compounds such as 9-fluorenone, 2-chloro-9-propenone, and 2-methyl-9-fluorenone; thioxantone-based compounds such as thioxanthone, 2,4- Diethylthioxanthone, 2-chlorothioxanthone, 1-chloro-4-propoxythioxanthone, isopropylthioxanthone and diisopropylthioxanthone; oxanthone-based ) Compounds such as oxanthone and 2-methyloxanthone; anthraquinone compounds such as anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, third butyl anthraquinone, and 2,6-di Chloro-9,10-anthraquinone; acridine compounds such as 9-phenylacridine, 1,7-bis (9-acridyl) heptane, 1,5-bis (9-acridylpentane) ) And 1,3- Bis (9-acridyl) propane; dicarbonyl compounds such as benzyl, 1,7,7-trimethyl-bicyclo [2,2,1] heptane-2,3-dione, and 9,10 -Phenanthrenequinone; phosphine oxide compounds, such as 2,4,6-trimethylbenzylidene diphenylphosphine oxide and bis (2,6-dimethoxybenzylidene) -2,4 , 4-trimethylpentylphosphine oxide; benzoate compounds such as methyl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate And 2-n-butoxyethyl-4- (dimethylamino) benzoate; amine synergists such as 2,5-bis (4-diethylaminobenzylidene) cyclohexyl Ketones, 2,6-bis (4-diethylaminobenzylidene) cyclohexanone, and 2,6-bis (4-diethylaminobenzylidene) -4-methyl-cyclopentane Ketones; coumarin-based compounds such as 3,3-carbonylvinyl-7- (diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethyl Amino) Coumarin, 3-benzylidene-7- (diethylamino) coumarin, 3-benzylidene-7-methoxy-coumarin, and 10,10-carbonylbis [ 1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H, 5H, 11H-C1] -benzopiperano [6,7,8-ij] -quinazine- 11-one; chalcone Thereof, such as 4-diethylamino-chalcone and 4-azido acetophenone benzaldehyde; 2- ylmethylene benzoyl; and 3-methyl-naphtho -b- thiazoline.

The curing accelerator is used to enhance curing and mechanical strength, and at least one selected from the group consisting of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and 2-mercaptobenzoxazole may be used. , 2,5-dimercapto-1,3,4-thiadiazole, 2-mercapto-4,6-dimethylaminopyridine, pentaerythritol-tetrakis (3-mercaptopropionate), pentaerythritol-tris (3- Mercaptopropionate), pentaerythritol-tetrakis (2-mercaptoacetate), pentaerythritol-tris (2-mercaptoacetate), trimethylolpropane-tris (2-mercaptoacetate), and trimethylol Propane-tris (3-mercaptopropionate).

As the adhesion promoter used in the present invention, at least one selected from a methacryl fluorenyl silane coupling agent such as the following can be used: methacryl methoxypropyltrimethoxysilane, methacryl methoxysilane Dimethoxysilane, methacryloxypropyltriethoxysilane, and methacryloxypropyldimethoxysilane, and at least one selected from the following can be used as the alkyltrimethoxy Silyl: octyltrimethoxysilane, dodecyltrimethoxysilane, and octadecyltrimethoxysilane.

Surfactants include silicon-based surfactants and fluorine-based surfactants. Specifically, the silicon-based surfactants include BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK- available from BYK-Chemie GmbH. 307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380, BYK-390, etc., and fluorine-based surfactants include commercially available F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F- from Dai Nippon Ink & Chemicals (DIC) 444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF- 1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF-1442, etc., but it is not limited thereto.

The following UV absorbers can be used: 2- (3-Third-butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole, alkoxybenzophenone, and similar groups However, it is not limited thereto, and those ultraviolet absorbents commonly used in the art may be used without limitation.

Examples of the thermal polymerization inhibitor may include at least one selected from the group consisting of: p-anisole, hydroquinone, pyrocatechol, third butyl catechin Phenol (t-butyl catechol), N-nitrosophenylhydroxylamine ammonium salt, N-nitrosophenylhydroxylamine aluminum salt, p-methoxyphenol, di-tertiary butyl-p-cresol, triphenylene Phenol, benzoquinone, 4,4-thiobis (3-methyl-6-third butylphenol), 2,2-methylenebis (4-methyl-6-third butylphenol), 2-mercaptoimidazole and phenothiazine, but are not limited thereto, and those thermal polymerization inhibitors commonly used in the art may be used without limitation.

The dispersant may be used by a method of adding the dispersant internally to the pigment (in the form of subjecting the pigment to a surface treatment in advance) or a method of externally adding the dispersant to the pigment. As the dispersant, a compound of a nonionic, anionic, or cationic dispersant type may be used, and examples thereof include fluorine-based, ester-based, cationic, anionic, nonionic, and amphoteric surfactants. These dispersants can be used alone or in a combination of two or more.

In particular, the dispersant may be at least one selected from the group consisting of polyalkylene glycols and their esters, polyalkylene oxide polyvalent alcohols, ester alkylene oxide adducts, Alkyl alkylene oxide adducts, ester sulfonates, sulfonates, carboxylic acid esters, carboxylates, alkylamidoalkylene oxide adducts, and alkylamines are not limited thereto.

Leveling agents can be polymeric or non-polymeric. Specific examples of the polymeric leveling agent include polyethyleneimine, polyamidoamine, and amine-epoxide reaction products, and specific examples of the non-polymeric leveling agent include non-polymer sulfur compounds and non-polymer compounds The nitrogen compound is not limited thereto, and those leveling agents commonly used in the art may be used without limitation.

The photosensitive resin composition can be used in pigment-dispersed materials such as: photosensitive materials used in the manufacture of color filters for thin film transistor liquid crystal displays (TFT LCDs); and for forming thin film transistor liquid crystal displays (TFTs) LCD) or black matrix photosensitive material for organic light-emitting diodes; photosensitive materials used to form outer coatings; photosensitive materials for column spacers; used for photo-curable coatings, photo-curable inks, photo-curable adhesives, Photosensitive materials for printed boards and printed circuit boards; photosensitive materials for plasma display panels (PDP); and the like, and their uses are not specifically limited.

Meanwhile, according to another embodiment of the present invention, a photosensitive material manufactured by using the photosensitive resin composition of other embodiments can be provided.

Details of the photosensitive resin composition include those described above with reference to other embodiments.

Specifically, the photosensitive resin composition of the embodiment can be coated on a substrate to form a photosensitive material in the form of a film or a pattern. The coating method is not particularly limited, but a spray coating method, a roll coating method, a spin coating method, or the like can be used, and in general, a spin coating method is widely used. In addition, after forming a coating film, a part of the residual solvent may be removed under reduced pressure if necessary.

Mention may be made of, for example, mercury arc, carbon arc, Xe arc, and the like emitting light having a wavelength of 250 nm to 450 nm as a light source for curing the photosensitive resin composition, but is not necessarily limited thereto .

Meanwhile, according to another embodiment of the present invention, an optical filter including the photosensitive material of the embodiment can be provided.

The details of the photosensitive material include those described above with reference to another embodiment.

The color filter can be manufactured by using a photosensitive resin composition containing the compound of one embodiment. A color filter may be formed by applying a photosensitive resin composition on a substrate to form a coating film, and then exposing, developing, and curing the coating film.

The photosensitive resin composition has excellent heat resistance and low color change due to heat treatment, and therefore can provide a color filter having high color reproducibility and high brightness and contrast even in a curing process when manufacturing a color filter.

The substrate may be a glass plate, a silicon wafer, or a plastic substrate such as polyethersulfone (PES), polycarbonate (PC), or the like, and its type is not particularly limited.

The color filter may include a red pattern, a green pattern, a blue pattern, and a black matrix.

According to another embodiment, the color filter may further include an overcoat layer.

For the purpose of improving the contrast, a lattice-shaped black pattern called a black matrix may be arranged between the colored pixels of the color filter. Chromium can be used as a black matrix material. In this case, a method in which chromium is deposited on the entire glass substrate and a pattern is formed by an etching process may be used. However, in consideration of the high cost of the process, the high reflectance of chromium, and the environmental pollution caused by the chromium waste liquid, a resin black matrix according to a pigment dispersion method capable of microfabrication can be used.

The black matrix may be formed using a black pigment or a black dye as a color material according to an embodiment of the present invention. For example, carbon black may be used alone, or a mixture of carbon black and a coloring pigment may be used. In this case, since a coloring pigment having defective light shielding properties is added, even if the amount of the color material is relatively increased, the strength of the film or the adhesion to the substrate is not reduced.

Meanwhile, according to another embodiment of the present invention, a display element including the color filters of the above embodiments can be provided.

The details of the color filter include those described above with reference to other embodiments.

The display element may be any of the following: a plasma display panel (PDP), a light emitting diode (LED) display, an organic light emitting diode (OLED) ) Display, liquid crystal display (LCD), thin film transistor-liquid crystal display (LCD-TFT), and cathode ray tube (CRT).

[Advantageous Effects] According to the present invention, it is possible to provide a compound having excellent color characteristics, heat resistance, and solvent resistance, a photosensitive resin composition using the compound, and a photosensitive material and color filter manufactured by using the photosensitive resin composition. And display elements.

Embodiments of the present invention will now be described in detail by the following examples. However, these examples are provided for illustrative purposes only and are not intended to limit the scope of this disclosure. < Manufacturing Example 1 and Manufacturing Example 2 > Manufacturing Example 1

Compound A-1 was synthesized via a reaction as shown in Reaction Scheme 1 below. [Reaction Scheme 1]

25 grams (g) (157.041 millimoles (mmol), 1 equivalent (eq)) of Compound 1 was added to 200 grams of dichloromethane (MC, manufacturer: DAEJUNG) and stirred. An ice-bath was provided and the reaction solution was changed to 0 ° C. 19.07 grams (188.454 millimoles, 1.2 equivalents) of triethylamine (TEA) was slowly added dropwise to the reaction solution.

Next, 30.787 g (174.321 millimoles, 1.11 equivalents) of Compound 2 was slowly added dropwise to the reaction solution. The mixture was reacted at 0 ° C for 30 minutes and then stirred at room temperature for 24 hours. 300 grams of distilled water (DI-water) was added to the reaction solution and stirred for 30 minutes, and the organic layer was separated from the aqueous layer. 200 milliliters (ml) of MC was added to the separated aqueous layer and further extracted. 200 ml of a 5% K ₂ CO ₃ solution was added to the organic layer and stirred, and then the organic layer was separated. The extraction was repeated until distilled water was added to the organic layer and the solution was neutralized. The organic layer was decompressed and the solvent was removed. The precipitate was added to 500 ml of a 1: 3 ratio of ethyl acetate (EA): n-hexane solution and stirred, and filtered under reduced pressure. The precipitate was dried at 80 ° C for one day to obtain 45.736 g (152.79 mmol) of Compound A-1 as a white solid (yield: 97%).

1H NMR (500 MHz, CDCl ₃ ): 8.00 ~ 7.97 (t, 3H), 7.70 ~ 7.68 (d, 1H), 7.66 ~ 7.65 (d, 1H), 7.59 ~ 7.55 (t, 1H), 7.47 ~ 7.42 ( q, 3H), 7.21 ~ 7.20 (d, 1H), 2.51 (s, 3H) manufacturing example 2

Compound A-2 was synthesized in the same manner as in Example 1 except that 39.339 grams (174.321 millimoles, 1.11 equivalents) of Compound 3 was used instead of Compound 2, as shown in Reaction Scheme 2 below. [Reaction Scheme 2] < Example 1 to Example 12 : Production of compound, photosensitive resin composition, and photosensitive material > Example 1 (1) Production of compound

Compound C-1 was synthesized via a reaction as shown in Reaction Scheme 3 below. [Reaction Scheme 3]

In a 2-neck round bottom flask, add 1 gram (3.399 mmol) of A-1, 0.518 g (1.670 mmol) of B-1, 1 g of benzoic acid, and 10 ml of benzoic acid Methyl benzoate and stirred at 180 ° C for 5 hours. Next, 100 ml of methanol was added, and the precipitated substance was filtered under reduced pressure and then dried in an oven. Thus, 1.05 g (1.2024 mmol) of compound C-1 was obtained (yield: 72%).

The MS measurement results of Compound C-1 are shown below. Ionization mode =: APCI +: m / z = 873 [M + H] +, exact mass: 872 ( 2 ) Preparation of photosensitive resin composition

5.554 grams of compound C-1 synthesized above, 10.376 grams of binder resin [copolymer of benzyl methacrylate and methacrylic acid (with a molar ratio of 70:30, an acid of 113 KOH mg / g Value, weight average molecular weight measured by GPC of 20,000 g / mole, molecular weight distribution (PDI) of 2.0, solid content (SC) of 25%, and including solvent (PGMEA)], 2.018 grams of photoinitiator (I-369, BASF), 1.016 grams of additives (F-475, Dainippon Ink Chemicals), 12.443 grams of photopolymerizable compound (dipentaerythritol hexaacrylate (DPHA), (Manufactured by Nippon Kayaku Co., Ltd.) and 68.593 g of a solvent (propylene glycol monomethyl ether acetate, PGMEA) were mixed to produce a photosensitive resin composition. (3) Manufacturing of a photosensitive material

The photosensitive resin composition was spin-coated on glass (5 cm (cm) × 5 cm) and prebake at 100 ° C for 100 seconds to form a film. The distance between the substrate on which the film was formed and the photo mask was set to 250 micrometers (µm), and the front surface of the substrate was irradiated with an exposure machine at an exposure dose of 40 mJ / cm ² (mJ / cm ² ) . After that, the exposed substrate was developed in a developing solution (KOH, 0.05%) for 60 seconds and post bake at 230 ° C for 20 minutes to produce a substrate. Example 2 (1) Preparation of compound

0.9 g (1.051 mmol) of compound C-2 was synthesized in the same manner as in Example 1, with the exception that 0.493 g (1.590 mmol) of B-2 was used instead of compound B-1, as shown in the following reaction scheme 4. Shown (yield: 66%).

The MS measurement results of Compound C-2 are as follows. Ionization mode =: APCI +: m / z = 857 [M + H] +, exact mass: 856 [Reaction scheme 4] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that the compound C-2 was used instead of the compound C-1. Example 3 (1) Preparation of compound

1.1 g (1.284 mmol) of compound C-3 was synthesized in the same manner as in Example 1, except that 0.493 g (1.590 mmol) of B-3 was used instead of compound B-1, as shown in the following reaction scheme 5. Exhibited (yield: 81%).

The MS measurement results of Compound C-3 are as follows. Ionization mode =: APCI +: m / z = 857 [M + H] +, exact mass: 856 [Reaction scheme 5] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-3 was used instead of Compound C-1. Example 4 (1) Preparation of compound

In the same manner as in Example 1, 1.26 grams (1.343 millimoles) of compound C-4 was synthesized, except that 0.512 grams (1.590 millimoles) of B-4 was used instead of compound B-1, as shown in the following reaction scheme 6. Shown (yield: 85%).

The MS measurement results of Compound C-4 are as follows. Ionization mode =: APCI +: m / z = 884 [M + H] +, exact mass: 885 [Reaction scheme 6] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-4 was used instead of Compound C-1. Example 5 (1) Preparation of compound

0.82 grams (0.843 millimoles) of compound C-5 was synthesized in the same manner as in Example 1, except that 0.652 grams (1.590 millimoles) of B-5 was used instead of compound B-1, as shown in the following reaction scheme 7. Shown (yield: 53%).

The MS measurement results of Compound C-5 are as follows. Ionization mode =: APCI +: m / z = 949 [M + H] +, exact mass: 948 [Reaction scheme 7] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-5 was used instead of Compound C-1. Example 6 ( 1 ) Preparation of compound

In the same manner as in Example 1, 1.3 grams (1.288 millimoles) of compound C-6 was synthesized, except that 0.706 grams (1.590 millimoles) of B-6 was used instead of compound B-1, as shown in the following reaction scheme 8. Exhibited (yield: 81%).

The MS measurement results of Compound C-6 are as follows. Ionization mode =: APCI +: m / z = 949 [M + H] +, exact mass: 948 [Reaction scheme 8] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-6 was used instead of Compound C-1. Example 7 ( 1 ) Preparation of compound

1 gram (1.030 millimoles) of compound C-7 was synthesized in the same manner as in Example 1, except that 1 gram (2.262 millimoles) of A-2 was used instead of compound A-1, and 0.444 grams (1.431) Bm-1), as shown in the following Reaction Scheme 9 (yield: 71.9%).

The MS measurement results of Compound C-7 are as follows. Ionization mode =: APCI +: m / z = 973 [M + H] +, exact mass: 972 [Reaction scheme 9] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-7 was used instead of Compound C-1. Example 8 ( 1 ) Preparation of compound

0.9 g (0.941 mmol) of compound C-8 was synthesized in the same manner as in Example 1, except that 1 g (2.862 mmol) of A-2 was used instead of compound A-1, and 0.421 g (1.431) was used Mol) of B-2, as shown in the following reaction scheme 10 (yield: 65.8%).

The MS measurement results of Compound C-8 are as follows. Ionization mode =: APCI +: m / z = 957 [M + H] +, exact mass: 956 [Reaction scheme 10] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-8 was used instead of Compound C-1. Example 9 ( 1 ) Preparation of compound

0.9 g (0.941 mmol) of compound C-9 was synthesized in the same manner as in Example 1, except that 1 g (2.862 mmol) of A-2 was used instead of compound A-1, and 0.421 g (1.431) was used Mol) of B-3, as shown in the following reaction scheme 11 (yield: 65.8%).

The MS measurement results of Compound C-9 are as follows. Ionization mode =: APCI +: m / z = 957 [M + H] +, exact mass: 956 [Reaction scheme 11] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-9 was used instead of Compound C-1. Example 10 ( 1 ) Preparation of compound

1 gram (1.015 mmol) of compound C-10 was synthesized in the same manner as in Example 1, except that 1 gram (2.862 mmol) of A-2 was used instead of compound A-1, and 0.461 g (1.431) was used Mol) of B-4, as shown in the following reaction scheme 12 (yield: 71%).

The MS measurement results of Compound C-10 are as follows. Ionization mode =: APCI +: m / z = 985 [M + H] +, exact mass: 984 [Reaction scheme 12] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-10 was used instead of Compound C-1. Example 11 ( 1 ) Preparation of compound

0.78 grams (0.730 millimoles) of compound C-11 was synthesized in the same manner as in Example 1, except that 1 grams (2.862 millimoles) of A-2 was used instead of compound A-1, and 0.586 grams (1.431) Mol) of B-5, as shown in the following reaction scheme 13 (yield: 51%).

The MS measurement results of Compound C-11 are as follows. Ionization mode =: APCI +: m / z = 1073 [M + H] +, exact mass: 1072 [Reaction scheme 13] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-11 was used instead of Compound C-1. Example 12 ( 1 ) Preparation of compound

1.16 g (1.045 mmol) of compound C-12 was synthesized in the same manner as in Example 1, except that 1 g (2.862 mmol) of A-2 was used instead of compound A-1, and 0.636 mmol was used (1.431 millimoles) of B-6, as shown in the following reaction scheme 14 (yield: 73%).

The MS measurement results of Compound C-12 are as follows. Ionization mode =: APCI +: m / z = 1107 [M + H] +, exact mass: 1106 [Reaction scheme 14] ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that Compound C-12 was used instead of Compound C-1. < Comparative Example : Production of Compound, Photosensitive Resin Composition, and Photosensitive Material > Comparative Example 1 ( 1 ) Production of Compound

A PY138 pigment having the following chemical structure was used. ( 2 ) Manufacture of photosensitive resin composition and photosensitive material

A photosensitive resin composition and a photosensitive material were produced in the same manner as in Example 1, except that PY138 was used instead of Compound C-1. < Experimental Example: Measurement of physical properties of compounds, photosensitive resin compositions, and photosensitive materials >

The physical properties of the photosensitive resin composition or the photosensitive material obtained in the examples and comparative examples were measured by the following methods, and the results are shown in Tables 1 to 3 below. 1. Solvent resistance

The solubility of each of the compounds obtained in the examples and comparative examples in dimethyl formamide (DMF) as an organic solvent was measured, and the solvent resistance was evaluated according to the following conditions, and the results are shown below in FIG. 1. ◯: Solubility of 1% or more ×: Solubility of less than 1% [Table 1] Results of Experimental Example 1

As shown in Table 1, the compounds of the examples have improved solubility in organic solvents compared to the comparative examples. The increase in solubility appears to be due to the SO ₃ functional group contained in the compounds of the examples.

Therefore, unlike general pigments which need to be dispersed by a derivative, a dispersant, or the like when dissolving an organic solvent, the compounds of the examples do not require a derivative or a dispersant when dissolving an organic solvent, and therefore can be easily commercialized. 2. Heat resistance assessment

The transmittance spectrum of the visible light region of the prebake substrate obtained in the examples in the range of 380 nm to 780 nm was obtained by using a spectroscope (MCPD-OTSUKA).

Next, prebake the substrate at 230 ° C for further post bake for 20 minutes to obtain a transmittance spectrum in the same equipment and measurement range.

Eab was calculated using the obtained transmittance spectrum and the values E (L *, a *, b *) obtained using a C light source backlight, and the results are shown in Table 2 below. ΔE (L *, a *, b *) = ((ΔL *) ² + (Δa *) ² + (Δb *) ² } ^1/2 Eab = {ΔE (L *, a *, b *)}-{ΔE (L *, a *, b *)} after pre-baking

A small ΔE value means excellent color heat resistance. In the case of a color filter-related material, when the ΔEab value is less than 3, it is regarded as an excellent material. [Table 2] Results of Experimental Example 2

As shown in Table 2, the photosensitive material of the example has a smaller Eab value of less than 3, indicating that it exhibits excellent color heat resistance.

no

no

Claims (15)

A compound represented by the following Chemical Formula 1: [Chemical Formula 1] Among them, in Chemical Formula 1, Y1 and Y2 are each the same or different, and each is independently a direct bond or -CQ1Q2-, A is a direct bond; ether group; carbonyl group; ester group; diester group; peroxy group; amine group ; Imino; fluorenimine; azo; fluorenyl; fluorenyl; alkylene having 1 to 10 carbon atoms; heteroalkylene having 1 to 10 carbon atoms; having 1 to 10 Haloalkylene groups of 6 carbon atoms; arylene groups of 6 to 20 carbon atoms; or heteroaryl groups of 3 to 20 carbon atoms; R1 to R26, Q1 and Q2 are the same or different from each other and are independent of each other Ground is hydrogen; deuterium; halo; nitrile; nitro; hydroxyl; carbonyl; ester; fluorenimine; fluorenamine; carboxyl (-COOH); -OC (= O) R "';(-SO3H);sulfonamide; substituted or unsubstituted alkyl; substituted or unsubstituted cycloalkyl; substituted or unsubstituted alkoxy; substituted or unsubstituted aromatic Oxy; substituted or unsubstituted alkyl thiol; substituted or unsubstituted aryl thiol; substituted or unsubstituted alkyl thiol; substituted or unsubstituted aryl Thioxy; substituted or unsubstituted alkenyl; substituted or unsubstituted silyl; substituted or unsubstituted boron; substituted or unsubstituted amine; substituted or unsubstituted Arylphosphino; substituted or unsubstituted phosphine oxide; substituted or unsubstituted aryl; or substituted or unsubstituted heteroaryl, or adjacent groups may be bonded to each other to form A substituted or unsubstituted ring, and R "'is a substituted or unsubstituted alkyl group. The compound represented by Chemical Formula 1 as described in item 1 of the scope of patent application, wherein A may be a direct bond; ether group; carbonyl group; diester group; fluorenyl group; alkylene group having 1 to 10 carbon atoms; or Haloalkylene of 1 to 10 carbon atoms. The compound represented by Chemical Formula 1 as described in item 2 of the scope of patent application, wherein the diester group contains a functional group represented by the following Chemical Formula 2: [Chemical Formula 2] Wherein, in Chemical Formula 2, X is an alkylene group having 1 to 10 carbon atoms; a heteroalkyl group having 1 to 10 carbon atoms; a haloalkylene group having 1 to 10 carbon atoms; having 6 to An arylene group having 20 carbon atoms; or an arylene group having 3 to 20 carbon atoms. The compound represented by Chemical Formula 1 as described in item 1 of the scope of patent application, wherein at least one of Q1, Q2, and R17 to R26 may be combined with adjacent functional groups to form a substituted or unsubstituted aromatic ring. The compound represented by Chemical Formula 1 as described in item 1 of the scope of the patent application, wherein Y1 and Y2 are each a direct bond. The compound represented by Chemical Formula 1 as described in item 1 of the scope of patent application, wherein the compound represented by Chemical Formula 1 is represented by the following Chemical Formula 1-1: [Chemical Formula 1-1] Among them, in Chemical Formula 1-1, A is a direct bond; an ether group; a carbonyl group; a diester group; a fluorenyl group; an alkylene group having 1 to 10 carbon atoms; or a haloalkylene group having 1 to 10 carbon atoms And R27 and R28 are the same or different from each other, and are each independently a phenyl group or a naphthyl group. The compound represented by Chemical Formula 1 as described in item 1 of the scope of patent application, wherein the compound of Chemical Formula 1 is represented by the following Chemical Formula 1-2 or Chemical Formula 1-3: [Chemical Formula 1-2] [Chemical Formula 1-3] Among them, in Chemical Formula 1-2 or Chemical Formula 1-3, A is a direct bond; ether group; carbonyl group; diester group; fluorenyl group; alkylene group having 1 to 10 carbon atoms; or having 1 to 10 carbon atoms Haloalkylene of the atom, and R28 to R31 are the same as or different from each other, and are each independently a phenyl group or a naphthyl group. The compound represented by Chemical Formula 1 as described in item 1 of the scope of patent application, wherein the compound of Chemical Formula 1 is represented by any one of the following Chemical Formulas 1-4 to 1-15: [Chemical Formula 1-4] [Chemical Formula 1-5] [Chemical Formula 1-6] [Chemical Formula 1-7] [Chemical Formula 1-8] [Chemical Formula 1-9] [Chemical Formula 1-10] [Chemical Formula 1-11] [Chemical Formula 1-12] [Chemical Formula 1-13] [Chemical Formula 1-14] [Chemical Formula 1-15] . A color material composition including the compound described in item 1 of the scope of patent application. The color material composition according to item 9 of the scope of patent application, further including at least one of a dye and a pigment. A photosensitive resin composition includes the compound described in item 1 of the patent application scope or the color material composition described in item 9 of the patent application scope; a binder resin; a polyfunctional monomer; a photoinitiator; and a solvent. The photosensitive resin composition according to item 11 of the scope of application for a patent, wherein the content of the compound is 5 to 60% by weight based on the total amount of solid content in the photosensitive resin composition. A photosensitive material includes the photosensitive resin composition according to item 11 of the scope of patent application. A color filter includes the photosensitive material according to item 13 of the scope of patent application. A display element includes a color filter according to item 14 of the scope of patent application.