WO2018190526A1 - Compound and photosensitive resin composition containing same - Google Patents

Abstract

The present invention relates to a compound having a novel structure, a photosensitive resin composition containing same, and a photosensitive material, a color filter, and a display element manufactured using same.

Description

 [Name of invention]

 Compound and photosensitive resin composition containing same

 Technical Field

Cross Citation with Related Application (s)

 This application claims the benefit of priority based on Korean Patent Application No. 1 (3-2017-0048106) dated April 13, 2017, and all content disclosed in the documents of that Korean patent application is incorporated as part of this specification.

 The present invention relates to a compound and a photosensitive resin composition including the same, and also a photosensitive material, a color filter, and a display device manufactured using the same. More specifically, the present invention relates to a compound having excellent color characteristics, heat resistance and solvent resistance, a photosensitive resin composition using the same, and a photosensitive material, a color filter, and a display device manufactured using the same.

 [Technique to become background of invention]

 In recent years, the performance of the color filter characterized by high brightness and high contrast ratio has been demanded. In addition, one of the main objectives of the display device development is to differentiate the display device performance by improving color purity and to improve productivity in the manufacturing process.

 Conventionally, the pigment type used as the color material of the color filter is present in the color photoresist in the state of particle dispersion. Therefore, it is difficult to control the brightness and contrast ratio according to the pigment particle size and distribution control. Pigment particles are aggregated in color filters, resulting in poor dissolution and dispersibility, and multi-scattering of light due to large particles that are aggregated. The scattering of the polarized light has been pointed out as a main factor for lowering the contrast ratio.

 As a result, efforts have been made to improve the luminance and contrast ratio through ultrafine atomization and dispersion stabilization of pigments, but the degree of freedom in selecting colorants to implement color coordinates for high color purity display devices is limited.

 In addition, the pigment dispersion method using color materials, especially pigments, which have already been developed, has reached a limit in improving color purity, brightness and contrast ratio of color filters using the same. Accordingly, there is a demand for the development of a new color material that can improve color purity and improve color reproduction, brightness, and contrast ratio.

[Content of invention] Problem to be solved

 The present invention is a color characteristic. It is to provide a compound having excellent heat resistance and solvent resistance.

 In addition, the present invention is to provide a photosensitive resin composition containing the compound.

 In addition, the present invention is to provide a photosensitive material, a color filter and a display device manufactured using the compound or the photosensitive resin composition.

 [Measures of problem]

 In the present specification, a compound represented by Chemical Formula 1 is provided.

 In the present specification, a color material composition including the compound is provided.

 In this specification, the photosensitive resin composition containing the said compound or a color material composition is also provided.

 Also herein. There is provided a photosensitive material manufactured using the photosensitive resin composition, a color filter or a display device using the same.

 Hereinafter, a compound according to a specific embodiment of the present invention and a photosensitive resin composition including the same will be described in more detail. In this specification. When a part `` includes '' a certain component, it means that the component may further include other components without excluding other components unless specifically stated otherwise.

 In this specification, examples of substituents are described below. It is not limited to this.

 In the present specification, the term "substituted" means that another functional group is bonded to the hydrogen atom in the compound, and the position to be substituted is not limited to the position where the hydrogen atom is substituted, that is, the position where the substituent can be substituted, and two or more substitutions If so, two or more substituents may be the same or different from each other.

As used herein, the term "substituted or unsubstituted ¹ " is deuterium; halogen group; cyano group; nitro group; hydroxy group; carbonyl group; ester group; imide group; amide group; amino group; carboxy group; sulfonic acid group; sulfonamide group; phosph Fin oxide Gi; Alkoxy group; Aryloxy group; Alkyl thioxy group; Arylthioxy group; Alkyl sulfoxy group; Arylsulfoxy; Silyl group; boron group; An alkyl group; Cycloalkyl group; Alkenyl group: aryl group; Aralkyl group; Ar alkenyl group; Alkylaryl group; Aryl phosphine group; Or substituted or unsubstituted with one or more substituents selected from the group consisting of heterocyclic groups containing one or more of N, 0, and S atoms, or two or more substituents of the above-described substituents connected to each other. it means. For example, "the substituent to which two or more substituents are linked"'may be a biphenyl group. That is, the biphenyl group may be an aryl group or may be interpreted as a substituent to which two phenyl groups are linked.

 In the present specification, +, or means a bond connected to another substituent, a single bond means a case where no separate atom is present in the portion represented by L.

 In the present specification, examples of the halogen group include fluorine, chlorine, bromine or iodine.

 In this specification, although carbon number of an imide group is not specifically limited, It is preferable that it is C1-C30. Specifically, the compound may have a structure as follows.

In the present specification, the amide group is hydrogen in the nitrogen of the amide group. It may be substituted with a straight, branched or cyclic alkyl group having 1 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms. Specifically, it may be a compound of the following structural formula, but is not limited thereto.

Although carbon number of a carbonyl group in this specification is not specifically limited, It is preferable that it is C1-C30. Specifically, it may be a compound having a structure as follows, but is not limited thereto.

In the present specification, the ester group may be substituted with a linear, branched or cyclic alkyl group having 1 to 25 carbon atoms or an aryl group having 6 to 25 carbon atoms in the oxygen of the ester group. Specifically, it may be a compound of the following structural formula, but is not limited thereto.

In the present specification, the sulfonamide group may be —S0 ₂ NR ′ R ″, wherein R ′ and R ″ are the same as or different from each other, and each independently hydrogen; heavy hydrogen; halogen; Nitrile group; A substituted or unsubstituted monocyclic or polycyclic cycloalkyl group having 3 to 30 carbon atoms; Substituted or unsubstituted C1-C30 linear or branched alkyl group: Substituted or unsubstituted C6-C30 monocyclic or polycyclic aryl group; And it may be selected from the group consisting of a substituted or unsubstituted monocyclic or polycyclic heteroaryl group having 2 to 30 carbon atoms.

In the present specification, the alkyl group may be linear or branched, and the number of carbon atoms is not particularly limited, but is preferably 1 to 40. According to an exemplary embodiment, the alkyl group has 1 to 20 carbon atoms. According to another exemplary embodiment, the alkyl group has 1 to 10 carbon atoms. According to another exemplary embodiment, the alkyl group has 1 to 6 carbon atoms. Specific examples of the alkyl group are methyl. ethyl. Propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl. 1-methyl-butyl, 1-ethyl ᅳ butyl, pentyl, _n -pentyl. Isopentyl, neopentyl, tert-pentyl, nuclear chamber, n-nuclear chamber, 1-merylpentyl, 2-methylpentyl, 4—methyl-2-pentyl, 3.3-dimethylbutyl, 2-ethylbutyl, heptyl, n ᅳ heptyl, 1-methylnuclear chamber, cyclopentylmethyl, cyclonuxylmethyl, octyl. n-octyl, tert-octyl, 1-methylheptyl, 2-ethylnucleyl, 2-propylpentyl, n-nonyl, 2, 2-dimethylheptyl, 1-ethyl-propyl, 1,1-dimethyl-propyl, Micronuclear chamber, 2-methylpentyl, 4-methylnuclear chamber. 5-methylnuclear chamber, etc., but is not limited to these. .

 In the present specification, the cycloalkyl group is not particularly limited, but preferably has 3 to 60 carbon atoms, and according to one embodiment, the cycloalkyl group has 3 to 30 carbon atoms. According to another exemplary embodiment, the cycloalkyl group has 3 to 20 carbon atoms. According to another exemplary embodiment, the cycloalkyl group has 3 to 6 carbon atoms. Specifically cyclopropyl, cyclobutyl. Cyclopentyl. 3-methylcyclopentyl, 2, 3-dimethylcyclopentyl, cyclonuclear chamber, 3-methylcyclonuclear chamber, 4 one methylcyclonuclear chamber, 2, 3-dimethylcyclonuclear chamber, 3, 4, 5-trimethyl cyclonuclear chamber, 4—tert -Butylcyclonucleus, cycloheptyl. Cyclooctyl and the like, but is not limited thereto.

In this specification. Alkoxy groups may be straight, branched or cyclic. Although carbon number of an alkoxy group is not specifically limited, It is preferable that it is C1-C30. Specifically methoxy, ethoxy. n-propoxy, isopropoxy, i-propyloxy. n-butoxy, isobutoxy, tert'butoxy, sec-butoxy, n-pentyloxy, neopentyloxy, isopentyloxy, n-nuxyloxy, 3,3-dimethylbutyloxy, 2-ethylbutyl oxy, n-octyloxy. n—nonyloxy, n ᅳ decyloxy, benzyloxy, p-methylbenzyloxy, etc. There is, but is not limited to this.

In the present specification, the amine group is NH ₂ , monoalkylamine group, dialkylamine group,

N-alkylarylamine group, monoarylamine group. Diarylamine group, N—arylheteroarylamine group,

It may be selected from the group consisting of N-alkylheteroarylamine group, monoheteroarylamine group, and diheteroarylamine group, carbon number is not particularly limited,

It is preferable that it is 1-30. Specific examples of the amine group include methylamine group, dimethylamine group, ethylamine group, diethylamine group, phenylamine group, naphthylamine group, biphenyl amine group, anthracenylamine group, 9-methyl-anthracenylamine group. Diphenylamine group, a di-reel _{amine, N} _ phenyl biphenyl amine N- phenyl-naphthyl amine, N- biphenyl-naphthyl tilah Min - gi, di reel amine, N- penilreul reel amine, triphenylamine Group, N-naphthylfluorenylamine group, N-phenylphenanthrenylamine group, N-biphenylphenanthrenylamine group, N-phenyl fluorenylamine group. N-phenylterphenylamine group. N-phenanthrenyl fluorenyl amine group, N- phenyl fluorenyl amine group and the like, but is not limited thereto.

 In the present specification, the N-alkylarylamine group means an amine group in which an alkyl group and an aryl group are substituted for N in the amine group.

 In the present specification, the N-aryl heteroaryl amine group means an amine group in which an aryl group and a heteroaryl group are substituted for N in the amine group.

 In this specification. An alkylheteroarylamine group means an amine group in which an alkyl group and a heteroarylamine group are substituted for N of the amine group.

 In this specification. The alkyl group in a monoalkylamine group, dialkylamine group, N-arylalkylamine group, alkylthioxy group, alkyl sulfoxy group, and N-alkylheteroarylamine group is the same as the example of the alkyl group mentioned above. Specifically, the alkyl thioxy group is a methyl thioxy group. Ethyl thioxy group, tert one butyl thioxy group, nucleosil thioxy group, octyl thioxy group etc. are mentioned, and alkyl sulfoxy group is mesyl and ethyl sulfoxy group. Propyl sulfoxy group, butyl sulfoxy group, etc., but is not limited thereto.

In the present specification, the alkenyl group may be linear or branched chain, carbon number is not particularly limited, but is preferably 2 to 40. According to one embodiment. Carbon number of the said alkenyl group is 2-20. According to another exemplary embodiment, the alkenyl group has 2 to 10 carbon atoms. According to another exemplary embodiment, the alkenyl group has 2 to 6 carbon atoms. Specific examples Vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl. 3-butenyl, 1-pentenyl, 2kefentenyl, 3-pentenyl, 3-methyl-1-butenyl, 1,3-butadienyl. Allyl, 1'phenylvinyl-1-yl, 2-phenylvinyl- 1-yl, 2.2-diphenylvinyl-1-yl, 2-phenyl-2- (naphthyl-1-yl) vinyl-1-yl, 2,2-bis (diphenyl-1-yl) vinyl-1-yl, stilbenyl group, styrenyl group and the like, but is not limited thereto.

 In the present specification, the silyl group is specifically trimethylsilyl group, triethyl silyl group. t-butyldimethylsilyl group, vinyldimethylsilyl group, propyldimethylsilyl group, triphenylsilyl group, diphenylsilyl group, phenylsilyl group and the like, but is not limited thereto. In the present specification, the boron group is specifically trimethylboron group. Triethyl boron group, t butyl dimethyl boron group, triphenyl boron group, phenyl boron group and the like, but is not limited thereto.

 In the present specification, the phosphine oxide group may include, but is not limited to, diphenylphosphine oxide side group, dinaphthyl phosphine oxide, and the like.

 In this specification. The aryl group is not particularly limited, but preferably has 6 to 60 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group. According to an exemplary embodiment, the aryl group has 6 to 30 carbon atoms. According to one embodiment, the aryl group has 6 to 20 carbon atoms. The aryl group may be, for example, a phenyl group, a biphenyl group, a terphenyl group, etc., but is not limited thereto. Examples of the polycyclic aryl group include naphthyl group, anthracenyl group, phenanthryl group, pyrenyl group, perylenyl group, and chrysenyl group. A fluorenyl group may be used, but the present invention is not limited thereto.

 In the present specification, the fluorenyl group may be substituted, and two substituents may be bonded to each other to form a spiro structure. The fluorenyl group is substituted

If

And so on. However, the present invention is not limited thereto.

In the present specification, a "adjacent" group is directly connected to an atom in which the substituent is substituted. Substituents substituted by tangent atoms. It may mean a substituent which is located closest to the three-dimensional structurally corresponding to the substituent, or another substituent substituted in the atom substituted by the substituent. for example. Two substituents substituted at the ortho position in the benzene ring and two substituents substituted at the same carbon in the aliphatic ring may be interpreted as "adjacent" groups.

In the present specification, a monoarylamine group, a diarylamine group, an aryloxy group. The aryl group in the arylthioxy group, the aryl sulfoxy group, the N'arylalkylamine group, the N- ^{arylheteroarylamine} group, and the arylphosphine group is the same as the examples of the aryl group described above. Specifically, examples of the aryloxy group include a phenoxy group, a p-tolyloxy group, and a m-tolyloxy group. 3, 5-dimethyl-phenoxy group, 2, 4, 6-trimethylphenoxy group, p-tert—butylphenoxy group, 3-biphenyloxy group, 4-biphenyloxy group, 1-naphthyloxy group, 2—naph Tyloxy group, 4-methyl-1-naphthyloxy group, 5-methyl-2-naphthyloxy group, 1-anthryloxy group, 2-anthryloxy group, 9-anthryloxy group, 1-phenanthryloxy group , 3-phenanthryloxy group, 9-phenanthryloxy group, and the like, and the arylthioxy group includes a phenylthioxy group, 2-methylphenylthioxy group, and 4-tertylbutylphenylthioxy group. Is benzene sulfoxy group, p ᅳ luene sulfoxy group, but is not limited thereto.

 In the present specification, the heterocyclic group is a heterocyclic group containing one or more of 0, N, Se, and S as heterologous elements, and the carbon number is not particularly limited, but is preferably 2 to 60 carbon atoms. Examples of the heterocyclic group include thiophene group and furan group. Pyl group, imidazole group, thiazole group, oxazole group. Oxadiazole group, triazole group, pyridyl group, bipyridyl group, pyrimidyl group, triazine group, triazole group, acridil group, pyridazine group, pyrazinyl group, quinolinyl group. Quinazolin group, quinoxalinyl group, phthalazinyl group, pyrido pyrimidinyl group, pyrido pyrazinyl group, pyrazino pyrazinyl group, isoquinoline group, indole group, carbazole group, benzoxazole group, benzoimidazole group, Benzothiazole group, benzocarbazole group, benzothiophene group, dibenzothiophene group. Benzofuranyl group. Phenanthroline, thiazolyl group, isoxoxazolyl group, oxadiazolyl group. Thiadiazolyl group, Benzothiazolyl group. Phenothiazinyl groups, dibenzofuranyl groups, and the like, but are not limited thereto.

In the present specification, the heteroaryl group includes one or more atoms other than carbon and heteroatoms, and specifically, the heteroatoms include 0, N, Se, S, and the like. It may include one or more atoms selected from the group consisting of. The carbon number is not particularly limited, but is preferably 2 to 60 carbon atoms, and the heteroaryl group may be monocyclic or polycyclic. Examples of the heterocyclic group include a thiophene group, a furanyl group, a pyryl group, an imidazolyl group, a thiazolyl group, an oxazolyl group, an oxadiazolyl group pyridyl group, a bipyridyl group, and a pyrimidyl group. Triazinyl groups. Triazolyl group, acridil group, pyridazinyl group, pyrazinyl group. Quinolinyl group, quinazolinyl group, quinolyl noksal Li _{group, a} phthalazine group possess, pyrido pyrimidinyl group, pyrazinyl group pyrido, pyrazino pyrazinyl _group, isoquinolinium group. Indolyl _group, carbazolyl group benzoxazolyl group benzimidazolyl _group, a benzothiazolyl group, a benzo-carbazolyl _group, a benzothiophene group. Dibenzothiophene group. Benzofuranyl group, phenanthrolinyl group (phenanthroline), thiazolyl group, isooxa sazolyl group, oxadiazolyl group, thiadiazolyl group. Benzothiazolyl, phenothiazinyl, aziridyl, azaindolyl, isoindolyl, indazolyl, purine, pteridyl, beta-carbolyl, naphthyridyl ( naphthyr idine), ter-pyridyl groups. Phenazinyl group, imidazopyridyl group, pyropyridyl group, azepin group, pyrazolyl group and dibenzofuranyl group, and the like, but is not limited thereto.

 In the present specification, examples of the heteroaryl group in the monoheteroarylamine group, the diheteroarylamine group, the N-arylheteroarylamine group, and the N-alkylheteroarylamine group may be selected from the examples of the heteroaryl group described above. Can be.

 In the present specification, the alkylene group is a divalent functional group derived from alkane, for example, as a straight chain, branched or cyclic, methylene group. On the methylene group. It may be a propylene group, isobutylene group, sec-butylene group, tert-butylene group, pentylene group, nucleene group, or the like.

 In the present specification, the halo alkylene group means a functional group in which a halogen group is substituted with the above-described alkylene group, and for example, perfluoropropane 2, 2-diyl (perf luoropropane-2,2-diyl), and the like Can be.

 In the present specification, the arylene group refers to a divalent group having two bonding positions in the aryl group. The description of the allyl group described above can be applied except that they are each divalent.

In the present specification, in a substituted or unsubstituted ring in which adjacent groups are bonded to each other, “ring” means a substituted or unsubstituted hydrocarbon ring; or substituted Or an unsubstituted heterocyclic ring.

 In the present specification, the hydrocarbon ring may be an aromatic, aliphatic or a condensed ring of aromatic and aliphatic, and may be selected from examples of the cycloalkyl group or aryl group except for the above-mentioned monovalent one.

 In this specification. The aromatic ring may be monocyclic or polycyclic, and may be selected from examples of the aryl group except that it is not monovalent.

 In the present specification, the heterocycle includes one or more atoms other than carbon and heteroatoms, and specifically, the heteroatoms may include one or more atoms selected from the group consisting of 0, N, Se, and S. The hetero ring may be monocyclic or polycyclic, and may be aromatic, aliphatic or a condensed ring of aromatic and aliphatic. Except for being monovalent, it may be selected from examples of the heteroaryl group.

 In the present specification, "direct bond" 'means that no atom or atom group exists at the corresponding position, and is connected by a bond line. According to one embodiment of the present invention, a compound represented by Chemical Formula 1 may be provided. .

 [Formula 1]

 In Chemical Formula 1,

 Y1 and Y2 are the same as or different from each other, and each independently a direct bond or -CQ1Q2—,

A is a direct bond; Ether group; Carbonyl group; Ester group; Diester group; Peroxyl; Amino group; Imino group; Imide group; Azo; Amide group; Sulfone group; carbon Alkylene groups having 1 to 10 atoms; Heteroalkylene group having 1 to 10 carbon atoms; Halo alkylene group having 1 to 10 carbon atoms; Arylene groups having 6 to 20 carbon atoms; Or a hetero arylene group having 3 to 20 carbon atoms,

R1 to R26. Q1 and Q2 are the same as or different from each other, and each independently hydrogen; Distillate; Halogen group; Nitrile group; Nitro group; Hydroxyl group; Carbonyl group; Ester group; Imide group; Amide group; Carboxyl group (—COOH); -0C (= 0) R '"; sulfonic acid group (-S0 ₃ H); sulfonamide group; substituted or unsubstituted alkyl group; substituted or unsubstituted cycloalkyl group; substituted or unsubstituted alkoxy group; substituted or unsubstituted A substituted aryloxy group, a substituted or unsubstituted alkyl thioxy group, a substituted or unsubstituted arylthioxy group, a substituted or unsubstituted alkyl sulfoxy group, a substituted or unsubstituted aryl sulfoxy group, a substituted or unsubstituted alkenyl group; Substituted or unsubstituted silyl groups; substituted or unsubstituted boron groups; substituted or unsubstituted amine groups; substituted or unsubstituted arylphosphine groups; substituted or unsubstituted phosphine oxide groups; substituted or unsubstituted aryl groups Or a substituted or unsubstituted heteroaryl group, or adjacent groups may combine with each other to form a substituted or unsubstituted ring.

 R ″ 'is a substituted or unsubstituted alkyl group.

 The present inventors, as represented by the formula (1), as the solubility of the compound in the solvent by the sulfonate group contained in the molecular structure increases. It was confirmed through experiments that the compound can be prevented from recombination, and the color purity, brightness, contrast ratio can be improved when applied to the color filter by inhibiting the generation of foreign matters and completed the invention.

 Particularly, the compound of one embodiment may form two dimers, thereby introducing two sulfonate groups into the molecular structure, thereby improving the solubility improvement effect of the sulfonate group, and absorbing and transmitting the spectrum and color filter from the light source. The right combination of spectrum enhances color purity for color reproduction and luminance. Not only can the contrast ratio be improved, but the heat resistance is improved due to the increase in the molecular weight, so that even after the heat treatment process in the manufacture of the photoresist, there is no sudden change in color purity, brightness and contrast ratio, thereby achieving stable display performance.

In addition, the compound of one embodiment is an aromatic functional group bonded to the end of the sulfonate group, for example, an aryl group having 6 to 20 carbon atoms or 3 to By using the heteroaryl group of 20, it is possible to implement the effect of improving the heat resistance.

 Specifically, in Formula 1, Y1 and Y2 are the same as or different from each other, and each independently a direct bond or -CQ1Q2 ', wherein — in CQ1Q2-C is carbon, Ql, Q2 are each independently bonded to carbon, and It can mean a functional group. Accordingly, when Y1 or Y2 is a direct bond, five pentagonal rings are formed, and when Y1 or Y2 is -CQ1Q2-, six carbon atoms may be formed.

 Also. In Formula 1, A is a direct bond; Ether group; Carbonyl group; Ester; Diester group; Peroxy group; Amino group; Imino groups; Imide group; Azo; Amide group; Sulfone groups; Alkylene groups having 1 to 10 carbon atoms; Hetero alkylene groups having 1 to 10 carbon atoms; Halo alkylene group having 1 to 10 carbon atoms; An arylene group having 6 to 20 carbon atoms; Or a hetero arylene group having 3 to 20 carbon atoms.

 More preferably, in Formula 1, A is a direct bond; Ether group; Carbonyl group; Diester machine; Sulfone group; An alkylene group having 1 to 10 carbon atoms; Or a halo alkylene group having 1 to 10 carbon atoms can be used.

 The diester group is a functional group including two ester functional groups, and may include, for example, a functional group represented by Formula 2 below.

[Formula 2]

In Formula 2, X is an alkylene group having 1 to 10 carbon atoms; Heteroalkylene groups having 1 to 10 carbon atoms; Halo alkylene group having 1 to 10 carbon atoms; An arylene group having 6 to 20 carbon atoms; Or a hetero arylene group having 3 to 20 carbon atoms. Preferably, X may be an alkylene group having 1 to 5 carbon atoms, for example, methylene group, ethylene group, propylene group and the like.

The halo alkylene group having 1 to 10 carbon atoms means a functional group in which a halogen group is substituted with an alkylene group having 1 to 10 carbon atoms, for example, perfluoropropane-2,2-diyl (6 110) 1)) 3 ^ -2,2- ^ 1) and so on. In Formula 1, R1 to R26 are the same as or different from each other, and each independently, a hydrogen: halogen group; Nitro group; Carboxyl group; Ester group; Hydroxyl group; 0C (= 0) R "'; sulfonic acid group (ᅳ S0 ₃ H); substituted or unsubstituted alkyl group; substituted or unsubstituted alkoxy group; substituted or unsubstituted aryloxy group: substituted or unsubstituted aryl group Adjacent groups may be bonded to each other to form a substituted or unsubstituted ring.

R ″ ¹ is a substituted or unsubstituted alkyl group.

 R ″ 'is a methyl group.

In Formula 1, R1 to R26 are the same as or different from each other, and each independently hydrogen: fluorine; Goat; bromine; iodine; Nitro group; Carboxyl groups; Alkyl ester group; Cycloalkyl ester group; Arylalkyl ester group; Hydroxyl group; 0C (= 0) CH ₃ ; Sulfonic acid group (_S0 ₃ H); Methyl group; t-butyl group; Methoxy group; Phenyl group; Or may be a methyl group.

 In Formula 1, at least one of Qi, Q2, R17 to R26 may combine with adjacent functional groups to form a substituted or unsubstituted aromatic ring. Specifically, in Chemical Formula 1, at least one of Ql, Q2, R17 to R26 increases in combination with an adjacent functional group and a substituted or unsubstituted benzene ring; Or a substituted or unsubstituted naphthalene ring.

 In Formula 1, Y1 and Y2 may be each independently a direct bond. The compound of one embodiment may be represented by the following Formula 1-1.

 [Formula 1-1]

In Chemical Formula 1-1,

 A is a direct bond; Ether group; Carbonyl group; Diester group; Sulfone group; Alkylene groups having 1 to 10 carbon atoms; Or a halo alkylene group having 1 to 10 carbon atoms. R27 and R28 are the same as or different from each other, and are each independently a phenyl group or a naphthyl group.

 In addition, the compound of one embodiment may be represented by the following Formula 1-2 or Formula 1-3.

 [Formula 1-2]

[Formula 1-3]

 In Formula 1-2 or 1-3, A is a direct bond; Ether groups; carbonyl groups; Diester machine; Sulfone group; Alkylene groups having 1 to 10 carbon atoms; Or a halo alkylene group having 1 to 10 carbon atoms, and R28 to R31 are the same as each other. They are different and are each independently a phenyl group or a naphthyl group.

 The compound of one embodiment may be represented by any one of the following Formula 1-4 to Formula 1-15.

[Formula 1-4]



[Formula 1-9]

[Formula 1-10]

[Formula 1-11]

[Formula 1-12]

-13]

[Formula 1-14]

The content of the compound includes the content described above with respect to the embodiment.

 The color material composition may further include at least one of a dye and a pigment. For example, the colorant composition may include only the compound of the one embodiment. It may include the compound of one embodiment and one or more dyes, or may include the compound of one embodiment and one or more pigments, or may include the compound of one embodiment, one or more dyes and one or more pigments.

 At this time, the specific type of the dye (Dye) or pigment (P i gment) is not limited to a large, and various materials widely used in the color filter or display field can be used without limitation. On the other hand, according to another embodiment of the invention, the compound of one embodiment or the color material composition of the other embodiment; Binder resins; Polyfunctional monomers; Photoinitiator; And a photosensitive resin composition comprising a solvent may be provided.

 The content of the compound includes the content described above with respect to the embodiment, and the content of the colorant composition includes the content described above with respect to the other embodiment.

 The binder resin is not particularly limited as long as it can exhibit physical properties such as strength, developability, and the like of the film made of the resin composition. .

 The binder resin may use a copolymer resin of a polyfunctional monomer imparting mechanical strength and a monomer imparting alkali solubility, and may further include a binder generally used in the art.

 Polyfunctional monomers that impart the mechanical strength of the membrane include unsaturated carboxylic acid esters; Aromatic vinyls; Unsaturated ethers; Unsaturated imides; And acid anhydrides.

Specific examples of the unsaturated carboxylic acid esters include benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate. Dimethylaminoethyl (meth) acrylate, isobutyl (meth) acrylate, t_butyl (meth) acrylate, cyclonuclear (meth) acrylate, isobornyl (meth) acrylate, ethyl nuclear (meth) acrylic Latex, 2-phenoxyethyl (meth (2) acrylate, tetrahydroperpryl (meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2 'hydroxy-3' chloropropyl (meth) acryl Rate. 4-hydroxybutyl (meth) acrylate acyloctyl oxy-2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth ) Acrylate, ethoxy diethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate. Poly (ethylene glycol) methyl ether (meth) acrylate, phenoxy CD glycol (meth) acrylate, P- nonylphenoxy polyethylene glycol (meth) acrylate ^Level byte, P- nonylphenoxy polypropylene glycol (meth) Acrylate, glycidyl (meth) acrylate, tetrapolouropropyl (meth) acrylate, 1,1.1.3.3, 3 'nucleofluoroisopropyl (meth) acrylate, octafluoropentyl (meth) Acrylate, heptadecafluorodecyl (dec) acrylate, tribromophenyl (meth) acrylate, methyl _α -hydroxy meryl acrylate, ethyl α—hydroxymethyl acrylate, propyl α-hydroxymethyl acrylic It may be selected from the group consisting of the rate and butyl α-hydroxymethyl acrylate, but is not limited thereto.

Specific examples of the aromatic vinyl monomers include styrene, α-methylstyrene, (ο.πι.ρ) -vinyl toluene, ( ₀ , _m , p) methoxy styrene, and (omp) -chloro styrene. But may be selected from the group consisting of: It is not limited only to these.

 Specific examples of the unsaturated ethers may be selected from the group consisting of vinyl methyl ether, vinyl ethyl ether, and allyl glycidyl ether, but are not limited thereto.

 Specific examples of the unsaturated imides may be selected from the group consisting of N-phenyl maleimide, N--chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide, and N-cyclonucleosil maleimide. However, the present invention is not limited thereto.

 The acid anhydride is maleic anhydride. Methyl maleic anhydride. Tetrahydro phthalic anhydride and the like, but are not limited thereto.

The monomer which imparts the alkali solubility is particularly It is not limited, for example. (Meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, 5—norbornene—2-carboxylic acid, mono-2-((meth) acryloyloxy) ethyl phthalate, mono-2 — It is preferable to use one or more selected from the group consisting of ((meth) acryloyloxy) ethyl succinate, ω-carboxy polycaprolactone mono (meth) acrylate, but is not limited thereto. .

 According to an exemplary embodiment of the present specification, the acid value of the binder resin is 50 to 130 KOH mg / g, the weight average molecular weight is 1,000 to 50, 000.

 The polyfunctional monomer is a monomer that forms a photoresist image by light, specifically, propylene glycol methacrylate, dipentaerythroxy nucleacrylate, dipentaerythritol acrylate, neopentyl glycol Diacrylate, 6-nucleic acid diol diacrylate, 1, 6-nucleic acid diol acrylate tetraethylene glycol methacrylate, bisphenoxy ethyl alcohol diacrylate, trishydroxyethyl isocyanurate trimethacryl Latex, trimethyl propane trimethacrylate. One or two selected from the group consisting of diphenyl pentaerythritol with nuxaacrylate, pentaerythroxy trimethacrylate, pentaerythroli tetramethacrylate and dipentaerythritol with nuxamethacrylate It may be a combination of the above.

 The photoinitiator is not particularly limited as long as it is an initiator that generates radicals by light to trigger crosslinking. For example, the photoinitiator is a group consisting of an acetophenone compound, a biimidazole compound, a triazine compound, and an oxime compound. It may be one or more selected from.

 The acetophenone-based compound is 2-hydroxy- 2 'methyl-1' phenylpropane-1-one,

1- (4-isopropylphenyl) -2—hydroxy-2-methylpropane-1-one, 4- (2—hydroxyethoxy) —phenyl (2-hydroxy-2-propyl) ketone, 1 -Hydroxycyclonuclear phenyl ketone, benzo inmethyl ether, benzoin ethyl ether, benzoin isobutyl ether, benzoin butyl ether, 2, 2-dimethoxy-2-phenylacetophenone. 2-methyl (4-methylthio) phenyl-2-morpholino-1-propane-1-one, 2-benzyl-2—dimethylamino ᅳ 1— (4-morpholinophenyl) ᅳ butan-1-one ,

2- (4-Bromo-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one or 2-methyl 2- 1- [4- (methylthio) phenyl] ᅳ 2 Morpholino propane-1 on; Don't.

 Examples of the biimidazole-based compound include 2, 2-bis (2-chlorophenyl) -4, 4 '.5, 5' vitratetraphenyl biimidazole, 2, 2'-bis (echlorophenyl) -4, 4 '.5, 5'-tetrakis (3,4,5-trimethoxyphenyl) -1,2'-biimidazole, 2, 2'-bis (2, 3-dichlorophenyl)-4,4 ', 5,5'—tetraphenyl biimidazole, 2, 2'-bis (0—chlorophenyl) -4, 4, 5, 5'-tetraphenyl-1,2'—biimidazole, and the like. It is not limited to this.

 The triazine compound is 3- {4 ′ [2,4—bis (trichloromethyl) -s—triazin-6-yl] phenylthio} propionic acid, 1,1,1.3,3,3-nuxaflo Lysopropyl-3- {4- [2,4-bis (trichloromethyl) triazine-6-yl] phenylthio} propionate, ethyl-2- {4- [2,4—bis (trichloro Rommethyl) -S-triazine-6-yl] phenylthio} acetate,

2-epoxyethyl-2- {4- [2,4-bis (trichloromethyl) —s-triazin-6-yl] phenylthio} acetate, cyclonuxyl-2- {4- [2, 4-bis (Trichloromethyl) —S-triazine-6-yl] phenylthio} acetate, benzyl-2— {4 ′ [2,4-bis (trichloromethyl) -s—triazine-6—yl] phenylthio } Acetate, 3- {chloro- 4 ′ [2,4-bis (trichloromethyl) -S-triazine- 6-yl] phenylthio} propionic acid, 3- {4- [2,4-bis ( Trichloromethyl) -S-triazine-6-yl] phenylthio} propionamide, 2,4-bis (trichloromethyl) -6-p-methoxystyryl—s-triazine, 2,4-bis ( Trichloromethyl) -6— (1—P-dimethylaminophenyl) — 1,3, -butadienyl yl stritriazine, 2-trichloromethyl— 4-amino— 6-p—mesotstyryl- S-triazine and the like, but is not limited thereto.

 The oxime compounds include 1,2-octadione, -1- (4-phenylthio) phenyl, -2- (o-benzo oxime) (Shibagai Co., Shijiai 124), ethanone-1-1 (9 -Ethyl)-6- (2-methylbenzoyl-

3-yl) -1_ (0—acetyloxime) (SCI) 242, N-1919 (Adecasa), and the like.

The solvent is acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, tetrahydrofuran, 1,4-dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether , Propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, chloroform. Methylene chloride, 1,2-dichloroethane, 1.1,1-trichloroethane, 1,1, 2-trichloroethane, 1,1, 2-trichloroethane, nucleic acid, heptane, octane, cyclonucleic acid, benzene , Toluene, xylene, methane Ol, ethane, isopropane, propane, butanol, t-butanol, 2-ethoxy propanol. 2-Methoxy ^' cypropane, 3-methoxybutanol, cyclonuxanone, cyclopentanone, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, 3-methoxybutyl acetate, ethyl 3- It may be one or more selected from the group consisting of oxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate, propylene glycol monomethyl ether and dipropylene glycol monomethyl ether, but is not limited thereto.

 Based on the total increase in the solid content of the photosensitive resin composition, the content of the compound may be 5% by weight to 60% by weight. In addition, the content of the binder resin may be 1% by weight to 60% by weight, the content of the photoinitiator is 0.1% by weight to 20% by weight. The content of the multifunctional monomer is 0.1% by weight to 50% by weight.

 The total weight of the solid content means the sum of the total weight of the components excluding the solvent in the resin composition. The weight percentages based on solids and solids of each component can be measured by common analytical means used in the art, such as liquid chromatography or gas chromatography.

 In addition, the photosensitive resin composition may further include an antioxidant. The content of the antioxidant is 0.1% to 20% by weight based on the total amount of solids in the photosensitive resin composition.

 The antioxidant may be one or more selected from the group consisting of hindered phenol antioxidants, amine antioxidants, thio antioxidants, and phosphine antioxidants, but is not limited thereto.

Specific examples of the antioxidant include phosphoric acid. Phosphoric acid thermal stabilizers such as trimethylphosphate or triethylphosphate; 2,6—di-t-butyl-P-cresol, octadecyl— 3_ (4-hydroxy-3,5-di-t-butylphenyl) propionate, tetrabis [methylene-3- (3,5 -Di- t-butyl-4-hydroxyphenyl) propionate] methane, 1,3,5-trimethyl-2.4, 6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene , 3,5—di-t-butyl yl 4-hydroxybenzylphosphite diethyl ester, 2,2-thiobis (4_methyl-6 -butylphenol). 2,6—g, t-butylphenol 4, 4'-butylidene-bis (3-methyl-6-t-butylphenol), 4,4'-thiobis (3_methyl-6-t-butylphenol) or bis [3,3-bis- (4 'ᅳ hydroxy-3'-tert-butylphenyl) butanoic acid] glycol ester (Bis Hindered phenol based primary antioxidants such as [3,3-bis- (4'-hydroxy-3'-tert-butyl phenyl) butanoicacid] lycol ester); Amines such as phenyl _α_naphthylamine, phenyl-β-naphthylamine, Ν, Ν'-diphenyl Ρ-phenylenediamine or Ν, Ν'-di-β-naphthyl ρ ᅳ phenylenediamine 2 Primary antioxidants; Thio such as dilauryl disulfide, dilaurylthiopropionate, distearylthiopropionate, mercaptobenzothiazole or tetramethylthiurimide disulfide tetrabis [methylene- 3- (laurylthio) propionate] methane System secondary antioxidants; Or triphenyl phosphite, tris (nonylphenyl) phosphite, triisodecyl phosphite, bis (2,4-dibutylphenyl) pentaerythle depot spi (Bis (2, 4-dit bu ty 1 pheny 1) Pen t aery t hr ito 1 Diphosphi te or (1.Γ—biphenyl) -4,4'-diylbisphosphonoic acid tetrakis [2,4visbis (1,1 ᅳ dimethylethyl) phenyl] ester ((1 And phosphite secondary antioxidants such as Γ-Biphenyl) -4,4'-Diylbisphosphonous acid tetrakis [2,4-bis (l, l-dimethylethyl) phenyl] ester).

 In addition, the photosensitive resin composition may further include one or two or more additives selected from the group consisting of photocrosslinking sensitizers, curing accelerators, adhesion promoters, surfactants, thermal polymerization inhibitors, ultraviolet absorbers, dispersants and leveling agents. Can be. The content of the additive is 0.1% by weight to 20% by weight based on the total weight of solids in the photosensitive resin composition.

The photocrosslinking sensitizer is benzophenone, 4, 4-bis (dimethylamino) benzophenone, 4, 4-bis (diethylamino) benzophenone, 2, 4, 6-trimethylaminobenzophenone. Benzophenone compounds such as methyl benzoylbenzoate, 3, 3-dimethyl-4-methoxybenzophenone and 3,3,4,4—tetra (t-butylper oxycarbonyl) benzophenone; 9-florenone, 2-chro-9-prorenone. Fluorenone compounds such as 2-methyl-9-fluorenone; Thioxanthone. Thioxanthone-based compounds such as 2,4-diethyl thioxanthone, 2-chloro thioxanthone, 1-chloro-4-propyloxy thioxanthone, isopropyl thioxanthone and diisopropyl thioxanthone; Xanthone compounds such as xanthone and 2-methylxanthone; Anthraquinone compounds such as anthraquinone 2-methyl anthraquinone, 2-ethyl anthraquinone, t-butyl anthraquinone and 2 ′ 6-dichloro-9,1 anthraquinone; 9-phenylacridine 1,7-bis (9-acridinyl) heptane, 1 '5-bis (9-acridinylpentane) 아크 acridine-based compounds such as 1,3-bis (9-acridinyl) propane; Benzyl, 1,7-trimethyl-bicyclo [2, 2,1] heptane-2, 3-dione. 9.10—dicarbonyl compounds such as phenanthrenequinone; Phosphine oxide compounds such as 2, 4, 6-trimethylbenzoyl diphenylphosphine oxide and bis (2.6-dimethoxybenzoyl) -2,4,4-trimethylpentyl phosphine oxide; Benzoate compounds such as methyl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate and 2-n-butoxyethyl-4- (dimethylamino) benzoate; 2, 5-bis (4-diethylaminobenzal) cyclopentanone, 2, 6-bis (4-diethylaminobenzal) cyclonuxanone, 2, 6-bis (4-diethylaminobenzal) ᅳ 4- Amino synergists such as methyl-cyclopentanone; 3.3-carbonylvinyl-7- (diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethylamino) coumarin, 3-benzoyl-7- (diethylamino) coumarin. 3-Benzoyl-7-methoxy-coumarin, 10, 10-carbonylbis [1,1, 7, 7-tetra methyl— 2,3,6, gtratrahydro-lH, 5H, llH—Cl] -benzo Coumarin-based compounds such as pyrano [6′7.8-ij] -quinolizine-ll-one; Chalcone compounds, such as 4-diethylamino chalcone and 4-azide vanzal acetophenone; One or more kinds selected from the group consisting of 2-benzoylmethylene, 3—methyl—b-naphthothiazoline can be used.

 The curing accelerator is used to increase the curing and mechanical strength, specifically, 2—mergatobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzooxazole, 2,5—dimercapto-1.3, 4—thiadiazole, 2-mercapto—4, 6-dimethylaminopyridine, pentaerythri-tetrakis (3—mercaptopropionate), pentaerythrite—tris (3- mercaptopropionate ), Pentaerythrite—tetrakis (2-mercaptoacetate), pentaerythritol pentris (2-mergatocetate). At least one selected from the group consisting of trimethylolpropane-tris (2-mer mercaptoacetate) and trimethyl-propane-tris (3-mercaptopropionate) can be used.

 As the adhesion promoter used in the present specification, methacryloyloxy propyl trimethoxy silane methacryloyloxy propyldimethoxy silane, methacryloyloxy propyl triethoxy silane, methacryloyloxy propyl dimethyl methacrylate One or more types of methacryloyl silane coupling agents, such as silane, can be selected and used, and it is .1 type from octyl trimethoxy silane, dodecyl trimethoxy silane, octadecyl trimethoxy silane, etc. as an alkyl trimethoxy silane. The above can be selected and used.

The surfactant is a silicone-based surfactant or a fluorine-based surfactant, Specifically, the silicone surfactant is BYK-077, BYK-085, BYK-300, BYK-301, BY-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330. BYK-331, BY -333, BYK-335, BYK-341v344, BY -345v346, BYK— 348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK- 371, BYK-375, BY-380, BYK-390, etc. can be used as the fluorine-based surfactants F-114, F-177, F-410, F-411, F-DIC (Dai Nippon Ink & Chemicals) -450, F-493, F-494, F-443, F-444, F-445.F- 446, F-470, F-471, F-472SF, F-474, F-475, F-477 , F-478, F-479.F-480SF, F-482, F-483, F-484, F-486, F-487. F-172D, MCF-350SF, TF— 1025SF, TF— 1117SF, TF-1026SF, TF-1128, TF— 1127, TF-1129, TF— 1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF1 1442, etc. may be used, but is not limited thereto.

 As the ultraviolet absorber, 2 '(3-t-butyl-5-methyl' 2-hydryphenyl) -5—chloro benzotriazole, alkoxy benzophenone, etc. may be used, but is not limited thereto. Anything commonly used in the industry can be used.

 Examples of the thermal polymerization inhibitor include P-anisole, hydroquinone, pyrocatechol, t-butyl catechol, N-nitrosophenylhydroxy amine ammonium salt, and N-nitrosophenylhydroxy Amine aluminum salt. p—methoxyphenol. Di-t-butyl- P-cresol, pyrogarol, benzoquinone, 4, 4-thiobis (3—methyl-6-t_butylphenol), 2,2-methylenebis (4-methyl-6- t—butylphenol). It may include one or more selected from the group consisting of 2-mercaptomidazole and phenothiazine, but is not limited thereto and may include those generally known in the art.

 The dispersant may be used as a method of internally adding to the pigment in the form of surface treatment of the pigment in advance, or a method of externally adding to the pigment. The dispersant is a compound type, nonionic. Anionic or cationic dispersants can be used, and fluorine, ester, cationic, anionic, nonionic, amphoteric surfactants and the like can be given. These can be used individually or in combination of 2 or more types.

Specifically, the dispersant may be polyalkylene glycol and esters thereof, poly Oxyalkylene polyhydric alcohol, ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylic acid ester, carboxylate. At least one selected from the group consisting of alkylamide alkylene oxide adducts and alkylamines is not limited thereto.

 The leveling agent may be polymeric or nonpolymeric. Specific examples of polymeric leveling agents include polyethyleneimines, polyamideamines, reaction products of amines and epoxides, and specific examples of non-fulmeric polymeric leveling agents are non-polymeric sulfur-containing and non- Any of those commonly used in the art may be used, including but not limited to polymeric nitrogen-containing compounds.

 The photosensitive resin composition may include a pigment dispersion type photosensitive material for manufacturing a thin film transistor liquid crystal display (TFT LCD) color filter, a photosensitive material for forming a black matrix of a thin film transistor liquid crystal display (TFT LCD), or an organic light emitting diode, and an overcoat layer. It can be used for forming photosensitive material, column spacer photosensitive material, photocurable paint, photocurable ink, photocurable adhesive, printing plate, photosensitive material for printed circuit board, photosensitive material for plasma display panel (PDP), and the like. Do not leave. On the other hand, according to another embodiment of the present invention, a photosensitive material prepared using the photosensitive resin composition of the above embodiment may be provided.

 Information on the photosensitive resin composition includes the above-described content with respect to the other embodiment.

 Specifically, the photosensitive resin composition of the above embodiment may be applied onto a substrate to form a photosensitive member in a thin film or pattern form. The coating method is not particularly limited, but the spray method. Coating method, spin coating method, etc. can be used, and spin coating method is generally used. In addition, after forming a coating film, some residual solvent can be removed in some cases under reduced pressure.

Examples of light sources for curing the photosensitive resin composition include, but are not limited to, mercury vapor arcs (arc), carbon arcs, Xe arcs, etc., whose wavelengths emit light of 250 nm to 450 ηπι. Meanwhile. According to another embodiment of the invention, a color filter including the photosensitive material of the embodiment may be provided.

 Information on the photosensitive material includes the above-described content with respect to the other embodiment.

 The color filter may be manufactured using the photosensitive resin composition including the compound of the embodiment. The photosensitive resin composition may be coated on a substrate to form a coating film, and the color filter may be formed by exposing, developing, and curing the coating film.

 The photosensitive resin composition is excellent in heat resistance, and the color change due to heat treatment is small, it is possible to provide a color filter having a high color reproducibility, high luminance and contrast ratio even during the curing process during the manufacture of the color filter.

 The substrate may be a glass plate, a silicon wafer, and a plastic substrate such as polyethersulfone (PES), polycarbonate (Polycarbonate, PC), or the like, and the type thereof is not particularly limited. The color filter may include a red pattern, a green pattern, a blue pattern, and a black matrix.

 According to another exemplary embodiment, the color filter may further include an overcoat layer.

 A lattice deepening pattern called a black matrix can be arranged between the color filters of the color filter for the purpose of improving contrast. Crum can be used as the material of the black matrix. In this case, a method may be used in which the cracks are deposited on the entire glass substrate and a pattern is formed by etching. However, in consideration of high process cost, high reflectance of chromium, and environmental pollution caused by cracked waste liquid, a resin black matrix by pigment dispersion method capable of micromachining may be used.

The black matrix according to the exemplary embodiment of the present specification may use a black pigment or a black dye as the colorant. For example, carbon black may be used alone, or a carbon pigment may be used in combination with a coloring pigment. In this case, a coloring pigment having insufficient light shielding properties may be mixed. There is an advantage that the strength or adhesion to the substrate is not lowered. Meanwhile . According to another embodiment of the invention, a display device including the color filter of the above embodiment may be provided.

 The content of the color filter includes the above-described content with respect to the other embodiment.

 The display device may include a plasma display panel (PDP), a light emitting diode (LED), and an organic light emitting diode (OLED). The liquid crystal display may be one of a liquid crystal display (LCD), a thin film transistor liquid crystal display (LCD— TFT), and a cathode ray tube (CRT).

 【Effects of the Invention】

 According to the present invention, a compound having excellent color characteristics, heat resistance and solvent resistance, a photosensitive resin composition using the same, and a photosensitive material, a color filter, and a display device manufactured using the same can be provided.

 [Specific contents to carry out invention]

 The invention is explained in more detail in the following examples. However, the following examples are merely to illustrate the invention, but the content of the present invention is not limited by the following examples.

<Production Examples 1-2>

 Preparation Example 1

 Compound A-1 was synthesized through a reaction as described in Reaction Formula 1 below.

Scheme 1

25 g (157.041 μl, leq) of compound 1 was added to 200 g of methylene chloride (preparation: tablet). After stirring, an ice-bath (Ice- bath) was installed to make the reaction solution 0 t, and 19.07 g (188.45½ mol, 1.2eq) of triethylamine (Triethylaniine, TEA) was slowly added dropwise to the reaction solution.

Thereafter, 30.787 g (174.321 mmol, l.lleq) of Compound 2 was slowly added to the reaction solution. After reacting at 0 ⁰ C for 30 minutes, the mixture was stirred at room temperature for 24 hours. 300 g of distilled water (DI-water) was added to the reaction solution, and the organic layer and the water layer were separated after stirring for 30 minutes. 200 ml of MC was further added to the separated water layer to further extract the extract. 200 ml of K ₂ CO ₃ 5% solution was added to the organic layer, and the organic layer was separated. Extraction was repeated until neutralization by addition of distilled water to the organic layer. The organic layer was removed under reduced pressure. The precipitate was added and stirred to a solution 500 ᅵ 111 having an ethyl acetate (EA): n-nucleic acid (n—hexane) ratio of 1: 3, filtered under reduced pressure, and the precipitate was dried at 80 ^° C. for 1 day to give a white solid. Compound A-1 45.73 (152.79'01) was obtained. (Yield 97%)

1H NMR (500MHz, CDC1 ₃ ): S.00 ~ 7.97 (t, 3H), 7.70 ~ 7.68 (d, 1H), 7.66 ~ 7.65 (d, 1H), 7.59 ~ 7.55 (t, 1H), 7.47 ~ 7.42 (q, 3H), 7.21-7.20 (d, 1H), 2.51 (s, 3H) Preparation Example 2

As in the following [Scheme 2], except that Compound 39.339g (174.321mmol.lleq) Compound 3 was used instead of Compound 2 Compound A One 2 in the same manner as in Preparation Example 1 Was synthesized.

 [Bungungsik 2]

B

<Examples 12-12: Preparation of a compound photosensitive resin composition and a photosensitive material; Example 1

 (1) Preparation of Compound

 Compound C-1 was synthesized through the same reaction as in Scheme 3 below.

 Scheme 3

 A-

Lg (3.399 瞧 ol) A-1, in a 22-nneecckk isometric bottom flask

0.518 (1.670 隱 01) was added to B-1, Benzoic acid lg, Methyl benzoate 10ml, and stirred at 180 ^° C for 5 hours. Then, 100 ml of methanol was added, and the precipitated material was filtered under reduced pressure and dried in an oven. As a result, compound C-1 of 1.0 (1.2024 Pa ol) was obtained. (Yield 72 «

 MS measurement results of the compound C-1 is as follows.

Ionization mode =: APCI + ■ ηι / z = 873 [M + H] +, Exact Mass: 872 ^'

 (2) Preparation of Photosensitive Resin Composition

Compound C—1.554 g, synthesized in the above, binder resin [benzyl methacrylate] Copolymer of meth and methacrylic acid (molar ratio 70:30, acid value is 113 OH mg / g, weight average molecular weight 20,000g / mol measured by GPC, molecular weight distribution (PDI) 2.0, solid content (SC) 25%, solvent PGMEA) Including)] 10.376 g, photoinitiator (1-369, BASF) 2.018 g, additive (F-475, DIC) 1.016 g, photopolymerizable compound (Dipentaerythr i tol hexaacrylate, DPHA. Japanese Chemical Co., Ltd.) 12.443 g. A photosensitive resin composition was prepared by mixing 68.593 g of a solvent (Propylene Glycol Monomethyl Ether Acetate, PGMEA).

 (3) Manufacture of Photosensitive Material

The photosensitive resin composition was spin-coated on glass (5 cm × 5 cm) and subjected to pi-ebake at 100 ^° C. for 100 seconds to form a film. The distance between the substrate on which the film is formed and the photo mask is 250 / zni. The exposure amount of 40 mJ / cm 'was irradiated to the whole board | substrate using the exposure machine. after. The exposed substrate was developed in developer (K0H, 0.05%) for 60 seconds. The substrate was prepared by post bake ^at 230 ^° C. for 20 minutes. Example 2

 (1) Preparation of Compound

 0.9 g (1.051 ′ iol) of Compound C-2 in the same manner as in Example 1, except that 0.4-2 (1.590′01) B-2 was used instead of Compound B-1 as in the following Reaction Formula 4]. Was synthesized. (Yield 66%)

 MS measurement results of the compound C-2 are as follows.

 Ionization Mode = APCI +: ni / z = 857 [M + H] + Exact Mass: 856

 Scheme 4

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material Except for using the compound C-2 instead of the compound Cl, a photosensitive resin composition and a photosensitive material was prepared in the same manner as in Example 1, Example 3

 (1) Preparation of Compound

 As in the following formula [5], B-3 of 0.493 ^ 1.590'01) was used instead of the compound B1 1. Except for the synthesis of compound C-3 of l.lg (1.284 隱 ol) in the same manner as in Example 1. (Yield 81%)

 MS measurement result of the said compound C-3 is as follows.

 Ionization mode = ： APCI +: m / z = 857 [M + H] +, Exact Mass: 856

 Scheme 5

 A-l Β-3

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were manufactured in the same manner as in Example 1, except that Compound C-3 was used instead of Compound C-1. Example 4

 (1) Preparation of Compound

 As shown in [Reaction Scheme 6], Compound C- of 1.26 g (l, 343 画 ol) in the same manner as in Example 1 except that 0.51¾ (β-4 of 1.59 画 00) was used instead of Compound B-1. 4 was synthesized (yield: 85%).

 MS measurement result of the compound C-4 is as follows.

 Ionization mode = ： APCI +: m / z = 884 [M + H] +, Exact Mass: 885

[Bandungsik 6]

O _A

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that Compound C-4 was used instead of Compound C-1. Example 5

 (1) Preparation of Compound

0.82 g (0.843 μl) of Compound C-5 was prepared in the same manner as in Example 1, except that 0.65 ^ 1.590 ^ ₀ 1) of B-5 was used instead of Compound B-1 as in the reaction group. Synthesized. (Yield 53%)

 MS measurement results of the compound C-5 are as follows.

 Ionization mode = ： APCI +: m / z = 949 [M + H] +, Exact Mass: 948

 Scheme 7

>。

 C-5 n 人) ^

 Β5

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that Compound C-5 was used instead of Compound C-1. City e

 (1) Preparation of Compound

 1.3 g (1.288 隱 ol) of Compound C-6 in the same manner as in Example U, except that 0.706 g (1.590 mmol) of B-6 was used instead of Compound B-1 as shown in [Reaction Formula 8]. Was synthesized. (Yield 81%)

 MS measurement results of the compound C-6 is as follows.

 Ionization mode = ： APCI +: m / z = 949 [M + H] +, Exact Mass: 948

 Scheme 8

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that Compound C-6 was used instead of Compound C-1. Example 7

 (1) Preparation of Compound

 As in [Scheme 9], the same method as in Example 1 was used except that A-2 of lg (2.862 μl) was used instead of Compound A-1, and 0.444 g (1.431 mmol) of Compound B-1 was used. Compound C-7 of lg (1.030 μl ol) was synthesized by the method. (Yield 71.9%)

 MS measurement result of the said compound C-7 is as follows.

 Ionization mode = ： APCI +: m / z = 973 [M + H] +, Exact Mass: 972

Scheme 9

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that Compound C-7 was used instead of Compound C-1. Reality 18

 (1) Preparation of Compound

 As described in Example 1, lg (2.862 ′ ol) A-2 was used instead of Compound A-1 and 0.421 g (1.431 mmol) of Compound B-2 was used in the same manner as in Example 1. 0.9g (0.941 隱 ol) of Compound C-8 was synthesized. (Yield 65.8%)

 MS measurement results of the compound C-8 is as follows.

 Ionization mode = ： APCI +: m / z = 957 [M + H] +, Exact Mass: 956

 [Banungsik 10]

 A-2 B-

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material

A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that Compound C-8 was used instead of Compound C-1. Sissi Example 9 (1) Preparation of Compound

The same method as in Example 1, except that lg (2.862 mmol) A-2 was used instead of compound A-1 and 0.421 g (1.431 μl) of Compound B-3 was used as in Scheme 11 below. Thus synthesized compound C ᅳ 9 of 0.9 _§ (0.941 隱₀ 1). (Yield 65.8%)

 MS measurement results of the compound C-9 is as follows. Silver coin mode = ： APCI +: m / z = 957 [M + H] +, Exact Mass: 956

 A-2 B-3

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

Except for using compound C-9 instead of compound C-1,

The photosensitive resin composition and the photosensitive material were manufactured by the method similar to Example U. Example 10

 (1) Preparation of Compound

As shown in Reaction Formula 12, A-2 of lg (2.862 ′ ol) was used instead of Compound A-1. L _g (1.015 ′ ol) of Compound C-10 was synthesized in the same manner as in Example 1, except that 0.461 g (1.43 l ™ ol) of Compound B ′ 4 was used. (Yield: 71%)

 MS measurement results of the compound C-10 is as follows.

 Ionization mode =: APCI +: m / z = 985 [M + H] +, Exact Mass: 984

Scheme 12

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were manufactured in the same manner as in Example 1, except that Compound C-10 was used instead of Compound C-1. Example 11

 (1) Preparation of Compound

 As in the following [Formula 13] wave, the same as in Example 1 except for using the compound A-1 of lg (2.862 隱 ol) A ᅳ 2 instead of compound A-1 and 0.586 g (1.431 mmol) of the compound B-5 0.7¾ (0.730 mmol) of compound oil was synthesized by the method. (Yield 51%)

 MS measurement result of the said compound C-11 is as follows.

 Ionization mode = ： APCI +: ni / z = 1073 [M + H] +. Exact Mass: 1072

 [

 n-5

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

A photosensitive resin composition and a photosensitive material were manufactured in the same manner as in Example I, except that Compound C-11 was used instead of Compound C-1. Example 12

 (1) Preparation of Compound

As in the following [Formula 14], lg (2.862 대신 ol) A-2 instead of Compound A-1 and 0.636g (1.431 隱 ol) of Compound B-6, except that Example 1 and In the same manner, compound C ᅳ 12 of 1.16 _§ (1.045 隱₀ 1) was synthesized. (Yield 73%)

 MS measurement result of the compound C-12 is as follows.

 Ionization mode =: APCI +: ni / z = 1107 [M + H] +, Exact Mass: 1106

 [Bungungsik

 Α-2 Β-6

 (2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were manufactured in the same manner as in Example 1, except that Compound C-12 was used instead of Compound C-1.

<Comparative example: of a compound, the photosensitive resin composition, and a photosensitive material

 Comparative Example 1

 (1) Preparation of Compound

 A ΡΥΊ38 pigment having the following chemical structure was used.

(2) Preparation of Photosensitive Resin Composition and Photosensitive Material

 A photosensitive resin composition and a photosensitive material were prepared in the same manner as in Example 1, except that the PY138 pigment was used instead of the compound C-1.

<Experimental Example: Measurement of Physical Properties of Compound, Photosensitive Resin Composition, and Photosensitive Material> The physical properties of the photosensitive resin composition or photosensitive material obtained in Examples and Comparative Examples were measured by the following method. The results are shown in Tables 1-3. ^'

1. Solvent resistance

 For each of the compounds obtained in Examples and Comparative Examples, the solubility in dimethylformamide (Dimethy l forniani i de. DMF) organic solvent was measured. The solvent resistance was evaluated according to the following criteria and the results are shown in Table 1.

 O: Solubility 1% or more

 X ： Solubility less than 1%

 [Table 1]

 Results of Experimental Example 1

As shown in Table 1 above. The compound of Examples had improved solubility in organic solvents compared to Comparative Examples. The increase in solubility seems to be due to the so ₃ functionality contained in the compound of the example.

 Accordingly, unlike general pigments that require dispersion through a derivative, a dispersant, or the like when dissolving the organic solvent, the compound of the embodiment does not need a derivative or a dispersant when dissolving the organic solvent, and thus can be easily applied commercially.

2. Heat resistance evaluation

Spectroscope for the prebake substrate obtained in the above embodiment (PD—Otsuka Co., Ltd.) was used to obtain a transmittance spectrum of the visible light region in the range of 380 nm to 780 η (τι).

Thereafter, the prebake substrate was further subjected to post bake at 230 ^° C. for 20 minutes to obtain transmittance spectra in the same equipment and measurement range.

 Eab was calculated using the obtained transmittance spectrum and the values E (L *, a *, b *) obtained using the C light source backlight and are shown in Table 2 below.

ZE (L *, a *, b *) = {(AL *) ² + (Aa *) ² + (Ab *) ² } ^1/2

 Eab = {AE after post-treatment (L *, a *, b *)}-{AE after post-treatment (L *, a *, b *)}

 A small AEab value means excellent color heat resistance, and in the case of a color filter-related material, when the AEab value is less than 3, it is recognized as an excellent material.

Table 2

 Results of Experimental Example 2

It was confirmed that it was small and had excellent color heat resistance.

Claims

Claims Claim 11 Compound represented by the following formula (1):

 [Formula 1]

In Chemical Formula 1 _,

 Y1 and Y2 are the same as or different from each other, and each independently a direct bond or -CQ1Q2—,

 A is a direct bond; Ether group; Carbonyl group; Ester group; Diester group; Peroxyl; Amino group; Imino group; Imide group; Azo; Amide group; Sulfone groups; Alkylene groups having 1 to 10 carbon atoms; Heteroalkylene group having 1 to 10 carbon atoms; Halo alkylene group having 1 to 10 carbon atoms; An arylene group having 6 to 20 carbon atoms; or a hetero arylene group having 3 to 20 carbon atoms,

R1 to R26, Q1 and Q2 are the same as or different from each other, and each independently hydrogen; heavy hydrogen; Halogen group; Nitrile group; Nitro group; Hydroxyl group; Carbonyl group; Ester group; Imide group; Amide group; Carboxyl group (—COOH); -0C (= 0) R "^*; sulfonic acid group (-S0 ₃ H); sulfonamide group; substituted or unsubstituted alkyl group; substituted or unsubstituted cycloalkyl group; substituted or unsubstituted alkoxy group; substituted or unsubstituted A substituted or unsubstituted alkylthioxy group, a substituted or unsubstituted arylthioxy group, a substituted or unsubstituted alkyl sulfoxy group, a substituted or unsubstituted aryl sulfoxy group, a substituted or unsubstituted alkenyl group; Substituted or unsubstituted silyl groups; substituted or unsubstituted boron groups; substituted or unsubstituted amine groups: substituted or unsubstituted arylphosphine groups; substituted or unsubstituted phosphine oxide groups; substituted or unsubstituted aryl groups Or a substituted or unsubstituted heteroaryl group, or adjacent groups are bonded to each other to substitute or Can form an unsubstituted ring,

 R ″ 'is a substituted or unsubstituted alkyl group.

[Claim 21]

 The method of claim 1,

 Λ is a direct bond; Ether group; Carbonyl group; Diester group; Sulfone group; An alkylene group having 1 to 10 carbon atoms; Or a halo alkylene group having 1 to 10 carbon atoms.

[Claim 3]

 According to claim 2,

 The diester group includes a functional group represented by Formula 2 below:

[Formula 2]

In Formula 2, X is an alkylene group having 1 to 10 carbon atoms; Hetero alkylene group having 1 to 10 carbon atoms: halo alkylene group having 1 to 10 carbon atoms; An arylene group having 6 to 20 carbon atoms; Or a hetero arylene group having 3 to 20 carbon atoms.

[Claim 4]

 The method of claim 1,

 Wherein at least one of Q1, Q2, R17 to R26 combines with adjacent functional groups to form a substituted or unsubstituted aromatic ring.

[Claim 5]

 The method of claim 1,

Y 1 and Y 2 are each a direct bond.

[Claim 6]

 The method of claim 1.

 Formula 1 is a compound represented by the following formula 1-1:

 [Formula 1-1]

In Chemical Formula 1-1,

 A is a direct bond; Ether group; Carbonyl group; Diester group; Sulfone group; An alkylene group having 1 to 10 carbon atoms; Or a halo alkylene group having 1 to 10 carbon atoms,

R27 and R28 are the same as or different from each other, and are each independently a phenyl group or a naphthyl group.

[Claim 7]

 The method of claim 1,

 Formula 1 is represented by the following formula 1-2 or formula 1-3, the compound:

 [Formula 1-2]

[Formula 1-3]

 In the above formula 1-2 or 1-3.

 A is a direct bond; Ether group; Carbonyl group; Diester machine; Sulfone groups; Alkylene groups having 1 to 10 carbon atoms; Or halo alkylene group having 1 to 10 carbon atoms

R28 to R31 are the same as or different from each other, and are each independently a phenyl group or a naphthyl group.

[Claim 8]

 The method of claim 1,

 Formula 1 is represented by any one of the following Formula 1-4 to Formula 1-15, Compound:

 [Formula 1-4]

一 5]

45 [Formula 1—10]

[Formula 1-11]

[Formula 1-12]

[Formula 1-13]

[Formula 1-14]

[Claim 9]

 A color material composition comprising the compound of claim 1.

[Claim 10]

 The method of claim 9,

 A color material composition further comprising at least one of a dye and a pigment.

[Claim 111]

 A compound of claim 1 or a colorant composition of claim 9; Binder resins; Polyfunctional monomers; Photoinitiators; And a photosensitive resin composition comprising a solvent.

[Claim 12]

 The method of claim 11,

The content of the compound, based on the total weight of solids in the photosensitive resin composition, is 5% by weight to 60% by weight, photosensitive resin composition.

[Claim 13]

 The photosensitive material containing the photosensitive resin composition of Claim 11

[Claim 14]

 A color filter comprising the photosensitive material of claim 13.

[Claim 15]

 A display device comprising the color filter of claim 14.