TW201841380A - Apparatus for processing of substrates used in the manufacture of solar cells, system for the manufacture of solar cells, and method for processing of substrates used in the manufacture of solar cells - Google Patents

Apparatus for processing of substrates used in the manufacture of solar cells, system for the manufacture of solar cells, and method for processing of substrates used in the manufacture of solar cells Download PDF

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TW201841380A
TW201841380A TW106145959A TW106145959A TW201841380A TW 201841380 A TW201841380 A TW 201841380A TW 106145959 A TW106145959 A TW 106145959A TW 106145959 A TW106145959 A TW 106145959A TW 201841380 A TW201841380 A TW 201841380A
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laser beam
transportation
substrate processing
substrate
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路易吉 迪桑堤
迪亞哥 托尼尼
丹尼爾 吉絲隆
馬可 卡立亞魯
馬可 法費洛
安德烈 巴西尼
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義大利商應用材料意大利有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0445PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H01L31/0463PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present disclosure provides an apparatus (100) for processing of substrates (10) used in the manufacture of solar cells. The apparatus (100) includes a transport arrangement (110) having at least a first transport line (112) and a second transport line (114) configured for transportation of the substrates (10), and a substrate processing arrangement (120) at the transport arrangement (110). The substrate processing arrangement (120) includes a laser device (122) configured to provide a laser beam for processing of the substrates (10), and a deflection device (124) having a first operational state and a second operational state, wherein the deflection device (124) is configured to direct the laser beam towards the first transport line (112) in the first operational state and towards the second transport line (114) in the second operational state.

Description

用於處理在太陽能電池的製造中使用的基板的設備、用於太陽能電池製造的系統以及用於處理在太陽能電池的製造中使用的基板的方法Apparatus for processing substrates used in the manufacture of solar cells, systems for solar cell manufacture, and methods for processing substrates used in manufacture of solar cells

本發明的實施方式涉及一種用於處理在太陽能電池的製造中使用的基板的設備、用於太陽能電池製造的系統以及用於處理在太陽能電池的製造中使用的基板的方法。本發明的實施方式尤其涉及一種用於搭接的太陽能電池的製造的設備、系統及方法。Embodiments of the present invention relate to an apparatus for processing a substrate used in the manufacture of solar cells, a system for solar cell manufacture, and a method for processing a substrate used in the manufacture of solar cells. Embodiments of the present invention particularly relate to an apparatus, system, and method for the manufacture of overlapping solar cells.

太陽能電池是將陽光直接轉換成電能的光伏(PV)元件。用於太陽能電池處理的設備可以具有含多條運輸線路的線路配置,其中多個製程站可沿運輸線路提供。為了增大設備產量,多個運輸線路可平行地佈置,每個運輸線路具有相應的製程站。這種設備耗費相當大的安裝空間。另外,例如產生關於操作和維護的成本。Solar cells are photovoltaic (PV) elements that directly convert sunlight into electrical energy. Equipment for solar cell processing may have a line configuration with multiple transport lines, where multiple process stations may be provided along the transport line. In order to increase the output of the equipment, multiple transportation lines can be arranged in parallel, and each transportation line has a corresponding process station. This equipment consumes considerable installation space. In addition, costs related to operation and maintenance are generated, for example.

鑒於上述內容,克服本技術領域的問題中至少一些的用於處理在太陽能電池的製造中使用的基板的新型設備、用於太陽能電池製造的系統以及用於處理在太陽能電池的製造中使用的基板的方法是有益的。本發明的目標尤其在於提供可提供較高產量和/或降低複雜程度的設備、系統和方法。In view of the above, new devices for processing substrates used in the manufacture of solar cells, systems for solar cell manufacture, and substrates used in the manufacture of solar cells that overcome at least some of the problems in the technical field The method is helpful. The object of the present invention is in particular to provide devices, systems and methods that can provide higher yields and / or reduce complexity.

鑒於上述內容,提供一種用於處理在太陽能電池的製造中使用的基板的設備、一種用於太陽能電池製造的系統,以及一種用於處理在太陽能電池的製造中使用的基板的方法。本發明的進一步的態樣、益處和特徵從申請專利範圍、說明書和附圖顯而易見。In view of the above, an apparatus for processing a substrate used in the manufacture of solar cells, a system for solar cell manufacture, and a method for processing a substrate used in the manufacture of solar cells are provided. Further aspects, benefits and features of the present invention will be apparent from the scope of patent application, specification and drawings.

根據本發明的態樣,提供一種用於處理在太陽能電池的製造中使用的基板的設備。所述設備包括:運輸佈置,所述運輸佈置具有至少第一運輸線路和第二運輸線路並且被配置成用於基板的運輸;以及基板處理佈置,所述基板處理佈置在運輸佈置處。所述基板處理佈置包括:鐳射裝置,所述鐳射裝置被配置成提供用於基板的處理的鐳射射束;以及偏轉裝置,所述偏轉裝置具有第一操作狀態和第二操作狀態,其中所述偏轉裝置被配置成在第一操作狀態下將鐳射射束朝第一運輸線路引導並且在第二操作狀態下將鐳射射束朝第二運輸線路引導。According to an aspect of the present invention, there is provided an apparatus for processing a substrate used in the manufacture of solar cells. The apparatus includes: a transportation arrangement having at least a first transportation line and a second transportation line and configured for transportation of substrates; and a substrate processing arrangement arranged at the transportation arrangement. The substrate processing arrangement includes: a laser device configured to provide a laser beam for processing of a substrate; and a deflection device, the deflection device having a first operating state and a second operating state, wherein the The deflection device is configured to guide the laser beam toward the first transport line in the first operating state and to direct the laser beam toward the second transport line in the second operating state.

根據本發明的進一步的態樣,提供一種用於太陽能電池製造的系統。所述系統包括:一或多個製程站;以及根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板的設備。所述一或多個製程站中的至少一個製程站包括基板處理佈置。According to a further aspect of the present invention, a system for solar cell manufacturing is provided. The system includes: one or more process stations; and an apparatus for processing substrates used in the manufacture of solar cells according to embodiments described herein. At least one process station of the one or more process stations includes a substrate processing arrangement.

根據本發明的另一態樣,提供一種用於處理在太陽能電池的製造中使用的基板的方法。該方法包括:使用具有第一操作狀態的偏轉裝置將鐳射射束朝第一運輸線路引導,及將該偏轉裝置的該第一操作狀態改變為第二操作狀態,以將該鐳射射束朝該第二運輸線路引導,以便進行基板處理。According to another aspect of the present invention, a method for processing a substrate used in the manufacture of solar cells is provided. The method includes: using a deflection device having a first operating state to guide the laser beam toward a first transportation line, and changing the first operating state of the deflecting device to a second operating state to direct the laser beam toward the The second transport route is guided for substrate processing.

實施方式還針對用於執行揭露的方法的設備,且包括用於執行每個揭露的方法態樣的設備部件。這些方法態樣可以通過硬體組件、由適當軟體程式編程的電腦、兩者的任何組合或以任何其他方式進行。此外, 根據本發明的實施方式還針對所描述設備的操作方法。所述設備的操作方法包括執行設備各功能的方法態樣。The embodiments are also directed to an apparatus for performing the disclosed method, and include apparatus components for performing each disclosed method aspect. These methodological aspects can be performed by hardware components, computers programmed with appropriate software programs, any combination of the two, or in any other way. Furthermore, the embodiments according to the invention are also directed to the method of operation of the described device. The operation method of the device includes a method aspect of performing various functions of the device.

現將詳細參考本發明的各種實施方式,這些實施方式的一或多個實例在附圖中說明。在以下對附圖的描述內,相同附圖標記是指相同部件。一般來說,僅描述了相對於個體實施方式的差異。每個實例以解釋本發明內容的方式提供,而不表示本發明的限制。另外,說明或描述為一個實施方式的部分的特徵可以用於其他實施方式或與它們結合產生另一實施方式。預期的是,描述包括此類修改和變化。Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same reference numerals refer to the same components. In general, only the differences with respect to individual implementations are described. Each example is provided by way of explanation of the contents of the invention and does not represent the limitations of the invention. In addition, features illustrated or described as part of one embodiment may be used in other embodiments or combined with them to produce another embodiment. It is expected that the description includes such modifications and changes.

在用於太陽能電池處理的設備中,可提供兩條運輸線路來用於多個太陽能電池的並行處理。可沿每條運輸線路提供多個製程站。可將每個製程站提供兩個,即,兩條運輸線路中的每者各設一個。為每條運輸線路提供了相應的製程站增大設備佔用面積並耗費了相當大的安裝空間。另外,例如,就操作和維護來說,產生成本,因為每個製程站有兩個。In the equipment for solar cell processing, two transportation lines can be provided for parallel processing of multiple solar cells. Multiple process stations can be provided along each transport route. Each process station can be provided with two, that is, one for each of the two transportation routes. A corresponding process station is provided for each transportation line to increase the equipment occupation area and consume a considerable installation space. In addition, for example, in terms of operation and maintenance, costs are incurred because there are two for each process station.

本發明使用了用於基板處理(諸如鐳射劃線)的鐳射裝置,還有可偏轉由鐳射裝置提供的鐳射射束的偏轉裝置。偏轉裝置可將鐳射射束朝第一運輸線路或第二運輸線路引導,這取決於偏轉裝置的操作狀態。切換操作狀態可將鐳射射束從第一運輸線路重新定向到第二運輸線路,反之亦然。可使用相同鐳射裝置來處理定位在第一運輸線路和第二運輸線路兩者上的基板。該設備的複雜程度和/或佔用面積可以減小。鐳射裝置的工作週期可以增大。The present invention uses a laser device for substrate processing (such as laser scribing) and a deflection device that can deflect the laser beam provided by the laser device. The deflection device can guide the laser beam towards the first transportation line or the second transportation line, depending on the operating state of the deflection device. Switching the operating state can redirect the laser beam from the first transportation line to the second transportation line, and vice versa. The same laser device can be used to process substrates positioned on both the first transportation line and the second transportation line. The complexity and / or footprint of the device can be reduced. The working cycle of the laser device can be increased.

圖1示出根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板10的設備100的示意性頂視圖。基板10可為晶圓,如矽晶圓。FIG. 1 shows a schematic top view of an apparatus 100 for processing a substrate 10 used in the manufacture of solar cells according to embodiments described herein. The substrate 10 may be a wafer, such as a silicon wafer.

設備100包括:運輸佈置110,所述運輸佈置具有至少第一運輸線路112和第二運輸線路114並且被配置成用於運輸基板10;以及基板處理佈置120,所述基板處理佈置在運輸佈置110處。基板處理佈置120包括:鐳射裝置122,所述鐳射裝置被配置成提供用於基板10的處理的鐳射射束123;以及偏轉裝置124,所述偏轉裝置具有第一操作狀態和第二操作狀態。偏轉裝置124被配置成在第一操作狀態下將鐳射射束123朝第一運輸線路112引導,並且在第二操作狀態下將鐳射射束朝第二運輸線路114引導。The apparatus 100 includes a transportation arrangement 110 having at least a first transportation line 112 and a second transportation line 114 and configured to transport the substrate 10; and a substrate processing arrangement 120 that is arranged in the transportation arrangement 110 Office. The substrate processing arrangement 120 includes: a laser device 122 configured to provide a laser beam 123 for processing of the substrate 10; and a deflection device 124 that has a first operating state and a second operating state. The deflection device 124 is configured to guide the laser beam 123 toward the first transportation line 112 in the first operating state and direct the laser beam toward the second transportation line 114 in the second operating state.

設備100可將由單個鐳射裝置提供的相同鐳射射束向第一運輸線路112和第二運輸線路114兩者引導以交替地處理在第一運輸線路112和第二運輸線路114上運輸的基板。具體來說,代替使用單獨地在每條運輸線路上工作的兩個鐳射裝置,本發明使用了單個鐳射裝置並透過切換偏轉裝置124的操作狀態將鐳射射束123遞送到一側和另一側。在一些實現方式中,切換操作狀態可以包括切換鏡子的位置或取向。鐳射裝置122的工作週期可以增大。舉例而言,在基板在一條運輸線路上移動過程中,鐳射裝置可以處理另一運輸線路上的基板。The apparatus 100 may guide the same laser beam provided by a single laser device to both the first transportation line 112 and the second transportation line 114 to alternately process the substrates transported on the first transportation line 112 and the second transportation line 114. Specifically, instead of using two laser devices that operate separately on each transportation line, the present invention uses a single laser device and delivers the laser beam 123 to one side and the other side by switching the operating state of the deflection device 124 . In some implementations, switching the operating state may include switching the position or orientation of the mirror. The duty cycle of the laser device 122 can be increased. For example, during the movement of the substrate on one transportation line, the laser device can process the substrate on another transportation line.

根據一些實施方式,第一運輸線路112和第二運輸線路114可鄰近於彼此和/或基本上平行於彼此延伸。可將基板處理佈置120提供在第一運輸線路112和第二運輸線路114之間。在一些實施方式中,基板處理佈置120可設置在第一運輸線路112和第二運輸線路114的至少一部分上方和/或可延伸過第一運輸線路112和第二運輸線路114的至少一部分。According to some embodiments, the first transportation line 112 and the second transportation line 114 may extend adjacent to each other and / or substantially parallel to each other. The substrate processing arrangement 120 may be provided between the first transportation line 112 and the second transportation line 114. In some embodiments, the substrate processing arrangement 120 may be disposed above at least a portion of the first transportation line 112 and the second transportation line 114 and / or may extend over at least a portion of the first transportation line 112 and the second transportation line 114.

運輸佈置110可配置成用於運輸基板,例如沿基本線型路徑來進行運輸。具體來說,第一運輸線路112可以提供第一運輸方向,並且第二運輸線路114可以提供第二運輸方向(以下稱為「運輸方向1」)。第一運輸方向和第二運輸方向可為基本上平行於彼此。由第一運輸線路112和第二運輸線路114提供的運輸方向可為或對應於運輸方向1。運輸方向1可為基本上水平的方向。The transport arrangement 110 may be configured for transporting substrates, for example, along a substantially linear path. Specifically, the first transportation route 112 may provide a first transportation direction, and the second transportation route 114 may provide a second transportation direction (hereinafter referred to as "transportation direction 1"). The first transport direction and the second transport direction may be substantially parallel to each other. The transportation direction provided by the first transportation line 112 and the second transportation line 114 may be or correspond to the transportation direction 1. The transport direction 1 may be a substantially horizontal direction.

術語「基本上平行的」涉及例如運輸線路和/或運輸方向的基本上平行的取向,其中與精確平行取向的幾度(例如,最多1°或甚至最多5°)偏差仍被示為「基本上平行的」。偏差可由例如設備100的製造公差造成。The term "substantially parallel" refers to a substantially parallel orientation, such as a transportation route and / or a transportation direction, where a deviation of several degrees (eg, at most 1 ° or even at most 5 °) from a precise parallel orientation is still shown as "essentially In parallel". Deviations can be caused by manufacturing tolerances of the device 100, for example.

術語「水平方向」被理解為與「豎直方向」做區分。亦即,「水平方向」涉及基本上水平的方向,其中與完全水平方向的幾度(例如,最多5°或甚至最多10°)偏差仍被視為「基本上水平的方向」。豎直方向可基本平行於重力。The term "horizontal direction" is understood as a distinction from "vertical direction". That is, the "horizontal direction" refers to a substantially horizontal direction, in which a deviation of a few degrees from the completely horizontal direction (for example, at most 5 ° or even at most 10 °) is still regarded as "a substantially horizontal direction". The vertical direction may be substantially parallel to gravity.

根據一些實施方式,第一運輸線路112和/或第二運輸線路114可以是輸送機,諸如皮帶輸送機。皮帶輸送機可以包括可圍繞旋轉軸線旋轉的滾子和設在滾子上的一或多條皮帶。一或多條皮帶被配置成用於在基板10沿運輸方向1的運輸期間支撐基板10,運輸方向1可為基本上水平的方向。According to some embodiments, the first transportation line 112 and / or the second transportation line 114 may be a conveyor, such as a belt conveyor. The belt conveyor may include a roller rotatable about an axis of rotation and one or more belts provided on the roller. One or more belts are configured to support the substrate 10 during transportation of the substrate 10 in the transportation direction 1, which may be a substantially horizontal direction.

根據進一步的實施方式,第一運輸線路112和/或第二運輸線路114包括一或多個導軌和可沿一或多個導軌移動的滑梭。滑梭被配置成用於沿導軌支撐和運輸基板10。According to a further embodiment, the first transportation line 112 and / or the second transportation line 114 includes one or more guide rails and a shuttle movable along the one or more guide rails. The shuttle is configured to support and transport the substrate 10 along the guide rail.

根據可與本文所述其他實施方式相組合的一些實施方式,設備100包括被配置成改變或切換偏轉裝置124的操作狀態的控制器。具體來說,該控制器可配置成將第一操作狀態改變為第二操作狀態和將第二操作狀態改變為第一操作狀態。參考圖2A和圖2B進一步地說明操作狀態的切換。According to some embodiments that can be combined with other embodiments described herein, the apparatus 100 includes a controller configured to change or switch the operating state of the deflection device 124. Specifically, the controller may be configured to change the first operating state to the second operating state and the second operating state to the first operating state. The switching of the operating state is further explained with reference to FIGS. 2A and 2B.

在一些實現方式中,當朝第一運輸線路112引導鐳射射束123以供進行基板處理時,第一運輸線路112和定位在其上的基板是基本靜止的。同樣,當鐳射射束123被引導到第二運輸線路114以供進行基板處理時,第二運輸線路114和定位在其上的基板可以是基本靜止的。基板處理(諸如鐳射劃線)可以在基板靜止、即不移動的情況下執行。可使基板處理的品質(諸如精度)改進。舉例而言,可使透過鐳射射束123在基板上產生的特徵的對準改進。然而,本發明並不限於此,並且基板處理可以在相應運輸線路和定位在其上的基板移動時執行。In some implementations, when the laser beam 123 is directed toward the first transportation line 112 for substrate processing, the first transportation line 112 and the substrate positioned thereon are substantially stationary. Likewise, when the laser beam 123 is directed to the second transportation line 114 for substrate processing, the second transportation line 114 and the substrate positioned thereon may be substantially stationary. Substrate processing (such as laser scribing) can be performed while the substrate is stationary, ie, not moving. The quality (such as accuracy) of substrate processing can be improved. For example, the alignment of features created on the substrate through the laser beam 123 can be improved. However, the present invention is not limited to this, and substrate processing may be performed when the corresponding transportation route and the substrate positioned thereon are moved.

另外或替代地,當朝第二運輸線路114引導鐳射射束123以供進行基板處理時,第一運輸線路112是非靜止的,即在運輸方向1上移動/運輸基板。同樣,當朝第一運輸線路112引導鐳射射束123以供進行基板處理時,第二運輸線路114可以是非靜止的,即在運輸方向1上移動/運輸基板。鐳射裝置122的工作週期可以增大。具體來說,在基板在一條運輸線路上移動的過程中,鐳射裝置122可以處理另一運輸線路上的基板。Additionally or alternatively, when the laser beam 123 is directed toward the second transportation line 114 for substrate processing, the first transportation line 112 is non-stationary, that is, the substrate is moved / transported in the transportation direction 1. Similarly, when the laser beam 123 is directed toward the first transport line 112 for substrate processing, the second transport line 114 may be non-stationary, that is, move / transport the substrate in the transport direction 1. The duty cycle of the laser device 122 can be increased. Specifically, during the movement of the substrate on one transportation line, the laser device 122 can process the substrate on the other transportation line.

在一些實現方式中,設備100被配置成獨立於彼此來操作第一運輸線路112和第二運輸線路114。舉例而言,如上所述,第一運輸線路112和第二運輸線路114可非同步地和/或可交替地操作,例如,使得在基板在一條運輸線路上移動過程中,鐳射裝置122可以處理另一(例如,靜止)運輸線路上的基板。In some implementations, the device 100 is configured to operate the first transportation line 112 and the second transportation line 114 independently of each other. For example, as described above, the first transport line 112 and the second transport line 114 can be operated asynchronously and / or alternately, for example, so that the laser device 122 can process the substrate while it is moving on one transport line Substrates on another (for example, stationary) transport line.

根據可與本文所述其他實施方式相組合的一些實施方式中,鐳射裝置122被配置成用於鐳射劃線。鐳射劃線可以用於構造基板10的表面。舉例而言,可形成微型通道以提高太陽能電池的效率。另外,可使用鐳射劃線來局部燒蝕提供在基板10上的材料,諸如局部燒蝕介電質層。在進一步的實現方式中,鐳射裝置122可配置成將基板切割或劃分成兩個或更多件,例如用於製造搭接的太陽能電池。According to some embodiments that can be combined with other embodiments described herein, the laser device 122 is configured for laser scribing. Laser scribing can be used to construct the surface of the substrate 10. For example, micro channels can be formed to increase the efficiency of solar cells. In addition, laser scribing may be used to locally ablate materials provided on the substrate 10, such as partially ablating the dielectric layer. In a further implementation, the laser device 122 may be configured to cut or divide the substrate into two or more pieces, for example for manufacturing overlapping solar cells.

在一些實現方式中,鐳射裝置122可配置成提供具有在200 nm與1500 nm之間、並具體地在300 nm與1100nm之間的波長的鐳射射束123。舉例而言,鐳射裝置122可配置成提供具有約355 nm、約532 nm和/或約1064 nm的波長的鐳射射束123。鐳射射束123的寬度和直徑可為在10 µm與500 µm之間、特別是在10 µm與100 µm之間並更特別是在30 µm與70 µm之間的範圍內。由鐳射裝置122提供的功率可為在10 W與500W並具體地在50 W與200 W之間的範圍內,諸如約50 W、約100 W或約200 W。In some implementations, the laser device 122 may be configured to provide a laser beam 123 having a wavelength between 200 nm and 1500 nm, and specifically between 300 nm and 1100 nm. For example, the laser device 122 may be configured to provide a laser beam 123 having a wavelength of about 355 nm, about 532 nm, and / or about 1064 nm. The width and diameter of the laser beam 123 may be in the range between 10 µm and 500 µm, especially between 10 µm and 100 µm and more particularly between 30 µm and 70 µm. The power provided by the laser device 122 may be in the range between 10 W and 500 W and specifically between 50 W and 200 W, such as about 50 W, about 100 W, or about 200 W.

圖2A和圖2B示出根據本文所述實施方式的說明用於處理在太陽能電池的製造中使用的基板的設備的第一操作狀態和第二操作狀態的示意圖。2A and 2B show schematic diagrams illustrating a first operating state and a second operating state of an apparatus for processing substrates used in the manufacture of solar cells according to embodiments described herein.

根據可與本文所述其他實施方式相組合的一些實施方式,偏轉裝置124可配置成在第一操作狀態與第二操作狀態之間切換。舉例而言,設備、並尤其是偏轉裝置124可配置成交替地將鐳射射束123朝第一運輸線路112和第二運輸線路114引導,以便進行基板處理。根據一些實施方式,偏轉裝置124可配置成以0.1 Hz與100 Hz之間的頻率、特別是以0.1 Hz與10 Hz之間的頻率並更特別是以1 Hz和8 Hz之間的頻率在第一操作狀態與第二操作狀態之間切換。頻率可基於單獨基板的基板處理的時間和用於切換操作狀態的時間來選擇。舉例而言,若用於單獨基板的處理的時間為0.8 s並且用於切換操作狀態(光束切換)的時間為0.2s,則總體時間可為至少1 s,並且所得頻率為至少1 Hz。According to some embodiments that can be combined with other embodiments described herein, the deflection device 124 may be configured to switch between a first operating state and a second operating state. For example, the apparatus, and in particular the deflection device 124, may be configured to alternately direct the laser beam 123 toward the first transportation line 112 and the second transportation line 114 for substrate processing. According to some embodiments, the deflection device 124 may be configured to operate at a frequency between 0.1 Hz and 100 Hz, in particular at a frequency between 0.1 Hz and 10 Hz and more particularly at a frequency between 1 Hz and 8 Hz. Switch between an operating state and a second operating state. The frequency may be selected based on the time of substrate processing of the individual substrates and the time for switching the operation state. For example, if the time for the processing of the individual substrates is 0.8 s and the time for switching the operating state (beam switching) is 0.2s, the overall time may be at least 1 s, and the resulting frequency is at least 1 Hz.

在一些實現方式中,偏轉裝置124可為鐳射射束123提供樞轉點125(或樞轉軸線)。鐳射裝置(未圖示)可配置成引導鐳射射束123到樞轉點125上,其中鐳射射束123在樞轉點125處在第一操作狀態下朝向第一運輸線路112偏轉,並且在第二操作狀態下朝向第二運輸線路114偏轉。可將樞轉點125提供在第一運輸線路112和第二運輸線路114之間。In some implementations, the deflection device 124 may provide a pivot point 125 (or pivot axis) for the laser beam 123. The laser device (not shown) may be configured to direct the laser beam 123 to the pivot point 125, where the laser beam 123 is deflected toward the first transportation line 112 in the first operating state at the pivot point 125, and at the first In the second operating state, it deflects toward the second transportation line 114. The pivot point 125 may be provided between the first transportation line 112 and the second transportation line 114.

根據一些實施方式,鐳射射束123可以是相對於基板(例如,待處理的基板表面)不垂直的。舉例而言,鐳射射束123相對於基板法線或表面法線11的入射角可以大於0°。具體來說,入射角可為在1°和60°之間的範圍內,並更特別是在10°和45°之間的範圍內。According to some embodiments, the laser beam 123 may not be perpendicular to the substrate (eg, the surface of the substrate to be processed). For example, the incident angle of the laser beam 123 with respect to the substrate normal or surface normal 11 may be greater than 0 °. In particular, the angle of incidence may be in the range between 1 ° and 60 °, and more particularly in the range between 10 ° and 45 °.

根據可與本文所述其他實施方式相組合的一些實施方式,偏轉裝置124被配置成至少在提供第一操作狀態的第一方向與提供第二操作狀態的第二方向之間能夠移動。偏轉裝置124可配置成在第一取向上將鐳射射束123朝第一運輸線路112引導,並且在第二取向上將鐳射射束朝第二運輸線路114引導。在一些實現方式中,偏轉裝置124可至少在第一取向和第二取向之間繞旋轉軸線旋轉。舉例而言,旋轉軸線可以基本上平行於樞轉軸線,或者與之重合。具體來說,旋轉軸線可以穿過樞轉點125。旋轉軸線可為基本上水平的軸線。According to some embodiments that can be combined with other embodiments described herein, the deflection device 124 is configured to be movable at least between a first direction providing a first operating state and a second direction providing a second operating state. The deflection device 124 may be configured to direct the laser beam 123 toward the first transportation line 112 in the first orientation and direct the laser beam toward the second transportation line 114 in the second orientation. In some implementations, the deflection device 124 can rotate about the axis of rotation at least between the first orientation and the second orientation. For example, the axis of rotation may be substantially parallel to or coincide with the pivot axis. Specifically, the axis of rotation may pass through the pivot point 125. The axis of rotation may be a substantially horizontal axis.

根據可與本文所述其他實施方式相組合的一些實施方式,偏轉裝置124包括一或多個鏡子,諸如可旋轉鏡。舉例而言,一或多個可旋轉鏡可至少在第一取向和第二取向之間繞旋轉軸線旋轉,以分別將鐳射射束123朝第一運輸線路112和第二運輸線路114偏轉。According to some embodiments that can be combined with other embodiments described herein, the deflection device 124 includes one or more mirrors, such as rotatable mirrors. For example, one or more rotatable mirrors can be rotated about the axis of rotation at least between the first orientation and the second orientation to deflect the laser beam 123 toward the first and second transport lines 112 and 114, respectively.

儘管偏轉裝置被描述為可移動以改變操作狀態,但是本發明並不限於此,並且可以使用適於將鐳射射束重新定向的其他偏轉裝置,諸如可在反射狀態與透射狀態之間切換的裝置。Although the deflection device is described as movable to change the operating state, the present invention is not limited to this, and other deflection devices suitable for redirecting the laser beam, such as a device that can be switched between a reflective state and a transmissive state, can be used .

根據可與本文所述其他實施方式相組合的一些實施方式,偏轉裝置124被配置成在單獨基板的基板處理的至少一部分期間,並具體地在單獨基板的基本整個基板處理期間,保持鐳射射束基本靜止。在一些實現方式中,偏轉裝置124可配置成在單獨基板的基板處理的至少一部分期間(諸如在單獨基板的基本上整個基板處理期間)例如透過圍繞樞轉軸線和/或旋轉軸線的旋轉來移動鐳射射束。According to some embodiments that can be combined with other embodiments described herein, the deflection device 124 is configured to maintain the laser beam during at least a portion of the substrate processing of the individual substrates, and specifically during substantially the entire substrate processing of the individual substrates Basically still. In some implementations, the deflection device 124 may be configured to move during at least a portion of the substrate processing of the individual substrates (such as during substantially the entire substrate processing of the individual substrates), for example by rotation about a pivot axis and / or an axis of rotation Laser beam.

術語「操作狀態」在某種意義上被理解為朝第一運輸線路112或第二運輸線路114引導鐳射射束123,不管鐳射射束123在單獨基板的處理期間是靜止還是移動的。舉例而言,偏轉裝置124(諸如可旋轉鏡)可以在單獨基板的處理期間在相應操作狀態中圍繞旋轉軸線旋轉,例如,以便在基板上形成劃線。The term "operational state" is understood in a sense to guide the laser beam 123 toward the first transportation line 112 or the second transportation line 114 regardless of whether the laser beam 123 is stationary or moving during the processing of the individual substrates. For example, the deflection device 124 (such as a rotatable mirror) may be rotated about the axis of rotation in the corresponding operating state during the processing of the individual substrate, for example, to form a scribe line on the substrate.

在一些實現方式中,本發明的設備、特別是偏轉裝置124可配置成用於點處理、線處理和它們的組合。對於點處理,偏轉裝置124可在基板處理期間保持鐳射射束123基本靜止,以便局部處理基板。舉例而言,可將材料的局部區域從基板上去除或燒蝕掉。對於線處理,偏轉裝置124可以例如透過圍繞樞轉軸線和/或旋轉軸線的旋轉來在基板表面上移動鐳射射束123。舉例而言,在基板表面上可形成線結構。在組合的點和線處理中,可沿基板上的線提供多個局部點。在一些實現方式中,可提供多條線,諸如基本上平行於彼此延伸的多條線。In some implementations, the apparatus of the present invention, particularly the deflection device 124, can be configured for point processing, line processing, and combinations thereof. For spot processing, the deflection device 124 may keep the laser beam 123 substantially stationary during substrate processing in order to locally process the substrate. For example, localized areas of material can be removed or ablated from the substrate. For line processing, the deflection device 124 can move the laser beam 123 on the substrate surface, for example, by rotation about a pivot axis and / or a rotation axis. For example, a line structure may be formed on the surface of the substrate. In combined point and line processing, multiple local points can be provided along the line on the substrate. In some implementations, multiple lines may be provided, such as multiple lines extending substantially parallel to each other.

圖3示出根據本文所述實施方式的用於太陽能電池製造的系統300的示意性頂視圖。Figure 3 shows a schematic top view of a system 300 for solar cell manufacturing according to embodiments described herein.

系統300包括:一或多個製程站;以及根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板的設備。一或多個製程站中的至少一個製程站(諸如鐳射劃線站)包括該設備的基板處理佈置。System 300 includes: one or more process stations; and an apparatus for processing substrates used in the manufacture of solar cells according to embodiments described herein. At least one of the one or more process stations (such as a laser scribing station) includes the substrate processing arrangement of the device.

在一些實現方式中,一或多個製程站選自由以下項組成的組:裝載站、檢查站(諸如光學檢查站)、對準站、鐳射劃線站、印刷站、乾燥站、緩衝站、電氣測試站、分揀站、卸載站和它們的任何組合。In some implementations, one or more process stations are selected from the group consisting of: loading stations, inspection stations (such as optical inspection stations), alignment stations, laser scribing stations, printing stations, drying stations, buffer stations, Electrical test station, sorting station, unloading station and any combination of them.

舉例而言,系統300可以包括在第一運輸線路上的第一製程站302、第二製程站304和第三製程站306。第一製程站302、第二製程站304和第三製程站306可沿第一運輸線路在運輸方向(諸如第一運輸方向)上順序佈置。舉例而言,第一運輸線路可至少部分地延伸透過第一製程站302、第二製程站304和/或第三製程站306。For example, the system 300 may include a first process station 302, a second process station 304, and a third process station 306 on the first transportation line. The first processing station 302, the second processing station 304, and the third processing station 306 may be sequentially arranged along the first transportation line in the transportation direction (such as the first transportation direction). For example, the first transportation line may extend at least partially through the first process station 302, the second process station 304, and / or the third process station 306.

系統300還可包括在在第二運輸線路上的另一第一製程站302'、另一第二製程站304'和另一第三製程站306'。另一第一製程站302'、另一第二製程站304'和另一第三製程站306'可沿第二運輸線路在運輸方向(諸如第二運輸方向)上順序佈置。第二運輸線路可至少部分地延伸透過另一第一製程站302'、另一第二製程站304'和/或另一第三製程站306'。The system 300 may also include another first process station 302 ', another second process station 304', and another third process station 306 'on the second transportation line. Another first process station 302 ', another second process station 304', and another third process station 306 'may be sequentially arranged in a transport direction (such as a second transport direction) along the second transport line. The second transportation line may extend at least partially through another first process station 302 ', another second process station 304', and / or another third process station 306 '.

第一運輸線路和第二運輸線路可以具有類似或相同的製程站。舉例而言,第一製程站302和另一第一製程站302'可類似地或相同地配置。同樣,第二製程站304和另一第二製程站304'可類似地或相同地配置,並且第三製程站306和另一第三製程站306'可類似地或相同地配置。The first transportation line and the second transportation line may have similar or the same process station. For example, the first process station 302 and another first process station 302 'may be configured similarly or the same. Likewise, the second process station 304 and another second process station 304 'may be configured similarly or the same, and the third process station 306 and another third process station 306' may be configured similarly or the same.

根據一些實施方式,具有鐳射裝置322和偏轉裝置324的基板處理佈置320可分配給兩個製程站,諸如分別在第一運輸線路和第二運輸線路上的第二製程站304和另一第二製程站304'。具體來說,基板處理佈置320可配置成用於在兩個製程站中的每個製程站中處理(諸如鐳射劃線)基板。兩個製程站可提供為單獨製程站,或者可集成到跨第一運輸線路和第二運輸線路延伸的單個製程站中。According to some embodiments, the substrate processing arrangement 320 with the laser device 322 and the deflection device 324 may be assigned to two process stations, such as a second process station 304 and another second on the first and second transport lines, respectively Process station 304 '. In particular, the substrate processing arrangement 320 may be configured for processing (such as laser scribing) the substrate in each of the two processing stations. The two process stations may be provided as separate process stations or may be integrated into a single process station extending across the first transportation line and the second transportation line.

在一些實施方式中,基板處理佈置320可配置成用於將鐳射射束323朝第二製程站304導向或偏轉以在第一運輸線路上處理基板,並且將鐳射射束323朝另一第二製程站304'導向或偏轉以用於在第二運輸線路上處理基板。為了在第一運輸線路上進行基板處理與在第二運輸線路上進行基板處理之間切換,偏轉裝置324(諸如可旋轉鏡)可圍繞旋轉軸線325來旋轉。第一製程站302和另一第一製程站302'可為用於在基板處理前對準基板的對準站。鐳射處理(諸如鐳射劃線)精度可以得到提高。舉例而言,由鐳射射束323形成的圖案可相對於基板對準。In some embodiments, the substrate processing arrangement 320 may be configured to direct or deflect the laser beam 323 toward the second process station 304 to process the substrate on the first transportation line and direct the laser beam 323 toward another second The process station 304 'is guided or deflected for processing the substrate on the second transportation line. In order to switch between substrate processing on the first transportation line and substrate processing on the second transportation line, the deflection device 324 (such as a rotatable mirror) may be rotated around the rotation axis 325. The first process station 302 and the other first process station 302 'may be alignment stations for aligning substrates before substrate processing. The accuracy of laser processing (such as laser scribing) can be improved. For example, the pattern formed by the laser beam 323 may be aligned with respect to the substrate.

根據可與本文所述其他實施方式相組合的一些實施方式,基板處理佈置320可以包括第一光學路徑和第二光學路徑,所述第一光學路徑被配置成將鐳射射束323從偏轉裝置324引導到第一運輸線路以供進行基板處理,所述第二光學路徑被配置成用於將鐳射射束323從偏轉裝置324引導到第二運輸線路以供進行基板處理。第一光學路徑可以包括用於將鐳射射束323朝第一運輸線路偏轉和導向的一或多個第一輔助偏轉裝置326。同樣,第二光學路徑可以包括用於將鐳射射束323朝第二運輸線路偏轉和導向的一或多個第二輔助偏轉裝置326’。According to some embodiments that may be combined with other embodiments described herein, the substrate processing arrangement 320 may include a first optical path and a second optical path, the first optical path configured to direct the laser beam 323 from the deflection device 324 Guided to the first transportation line for substrate processing, the second optical path is configured to guide the laser beam 323 from the deflection device 324 to the second transportation line for substrate processing. The first optical path may include one or more first auxiliary deflection devices 326 for deflecting and guiding the laser beam 323 toward the first transportation line. Likewise, the second optical path may include one or more second auxiliary deflection devices 326 'for deflecting and guiding the laser beam 323 toward the second transportation line.

在一些實現方式中,系統300包括在基板處理佈置320上游的一或多個製程站(諸如第一製程站302和另一第一製程站302'),以及在基板處理佈置320下游的一或多個製程站(諸如第三製程站306和另一第三製程站306')。術語「上游」和「下游」可相對於由第一運輸線路和第二運輸線路提供的運輸方向限定。In some implementations, the system 300 includes one or more process stations upstream of the substrate processing arrangement 320 (such as the first process station 302 and another first process station 302 ′), and one or more downstream of the substrate processing arrangement 320 Multiple process stations (such as a third process station 306 and another third process station 306 '). The terms "upstream" and "downstream" may be defined relative to the direction of transportation provided by the first transportation line and the second transportation line.

舉例而言,在基板處理佈置320上游的一或多個製程站可以包括裝載站和檢查站,諸如光學檢查站或自動光學檢查(AOI)站。在一些實現方式中,光學檢查站可為AOI站,所述AOI站被配置成執行對基板的光學檢查。例如,檢查站可以包括一或多個相機,諸如高解析度相機,所述相機被配置為獲得太陽能電池的圖像以供用於光學檢查。檢查站可配置成用於檢查太陽能電池的導電線路的定位、導電線路的印刷品質、導電線路的幾何形狀、基板的結構條件(包括但不限於基板裂紋或微裂紋,以及基板的顏色)中的至少一個。根據一些實施方式,檢查站可配置成偵測用於由基板處理佈置320處理的基板的光學檢查的電致發光和/或光致發光。For example, one or more process stations upstream of the substrate processing arrangement 320 may include loading stations and inspection stations, such as optical inspection stations or automatic optical inspection (AOI) stations. In some implementations, the optical inspection station may be an AOI station configured to perform optical inspection of the substrate. For example, the inspection station may include one or more cameras, such as high-resolution cameras, which are configured to obtain images of the solar cells for optical inspection. The inspection station can be configured to check the positioning of the conductive lines of the solar cell, the printing quality of the conductive lines, the geometric shape of the conductive lines, the structural conditions of the substrate (including but not limited to substrate cracks or micro-cracks, and the color of the substrate) at least one. According to some embodiments, the inspection station may be configured to detect electroluminescence and / or photoluminescence for optical inspection of the substrate processed by the substrate processing arrangement 320.

在基板處理佈置320下游的一或多個製程站可以包括印刷站。印刷站可配置成用於在太陽能電池的製造中使用的基板上印刷(諸如絲網印刷)導電圖案。導電圖案可以選自指狀物、匯流條和它們的任何組合組成的組。舉例而言,印刷站可配置成用於雙重印刷。One or more process stations downstream of the substrate processing arrangement 320 may include printing stations. The printing station may be configured for printing (such as screen printing) a conductive pattern on a substrate used in the manufacture of solar cells. The conductive pattern may be selected from the group consisting of fingers, bus bars, and any combination thereof. For example, the printing station may be configured for dual printing.

乾燥站可提供在印刷站之後。乾燥站可配置成用於乾燥在印刷站中沉積在太陽能電池基板上的材料。舉例而言,乾燥站可為烘箱。可任選地在生產線後端提供分揀站,分揀站被配置成用於基於透過例如電氣測試站和/或檢查站獲得的測試結果來分揀已處理的基板,諸如太陽能電池。The drying station can be provided after the printing station. The drying station may be configured to dry the material deposited on the solar cell substrate in the printing station. For example, the drying station may be an oven. A sorting station may optionally be provided at the back end of the production line, the sorting station being configured for sorting processed substrates, such as solar cells, based on test results obtained through, for example, electrical test stations and / or inspection stations.

根據可與本文所述其他實施方式相組合的一些實施方式,系統300被配置成用於製造搭接的太陽能電池,所述搭接的太陽能電池亦可稱為「超單元」或「超級單元」。搭接的太陽能電池可用於太陽能電池模組中。搭接的太陽能電池可由多個部分地重疊的太陽能電池件(亦稱「太陽能電池元件」)製成。相鄰太陽能電池件在重疊區域中電連接至彼此。太陽能電池件串聯連接,使得由單獨太陽能電池件產生的電流沿要收集的一系列的太陽能電池件流動,例如在太陽能電池裝佈置的端部處。重疊配置可提供高效率太陽能電池佈置。具體來說,搭接的太陽能電池允許透過增大使用面積或有效面積來增大模組功率。通常,重疊配置可使模組功率增大例如20至40瓦特。使用面積或有效面積可對應於被陽光輻照並參與功率產生的面積。舉例而言,使用面積或有效面積可對應於未被例如導電線路圖案(諸如指狀物和/或匯流條)覆蓋的太陽能電池的面積。According to some embodiments that can be combined with other embodiments described herein, the system 300 is configured to manufacture lapped solar cells, which can also be referred to as "super-units" or "super-units" . The overlapping solar cells can be used in solar cell modules. The overlapping solar cells can be made of a plurality of partially overlapping solar cells (also called "solar cell elements"). Adjacent solar cells are electrically connected to each other in the overlapping area. The solar cells are connected in series so that the current generated by the individual solar cells flows along a series of solar cells to be collected, for example at the end of the solar cell arrangement. The overlapping configuration can provide a high-efficiency solar cell arrangement. Specifically, the overlapping solar cells allow the module power to be increased by increasing the use area or effective area. Generally, overlapping configurations can increase module power by, for example, 20 to 40 watts. The use area or effective area may correspond to the area irradiated by sunlight and participating in power generation. For example, the use area or effective area may correspond to the area of the solar cell that is not covered by, for example, conductive wiring patterns such as fingers and / or bus bars.

根據可與本文所述其他實施方式相組合的一些實施方式,鐳射裝置322可配置成將基板切割或劃分成兩個或更多件。舉例而言,基板可為用於製造搭接的太陽能電池的太陽能電池。鐳射裝置322可配置成將太陽能電池切割成太陽能電池件。According to some embodiments that can be combined with other embodiments described herein, the laser device 322 may be configured to cut or divide the substrate into two or more pieces. For example, the substrate may be a solar cell used to manufacture overlapping solar cells. The laser device 322 may be configured to cut the solar cell into solar cell pieces.

圖4示出根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板的方法400的流程圖。方法400可利用根據本發明的設備和系統來實現。4 shows a flowchart of a method 400 for processing a substrate used in the manufacture of solar cells according to embodiments described herein. The method 400 may be implemented using the device and system according to the present invention.

方法400包括在方塊410使用有第一操作狀態的偏轉裝置將鐳射射束朝第一運輸線路引導以供進行基板處理,並且在方塊420改變偏轉裝置的第一操作狀態為第二操作狀態,以便將鐳射射束朝第二運輸線路引導以供進行基板處理。改變第一操作狀態為第二操作狀態可以包括使偏轉裝置的一或多個鏡子旋轉,例如,圍繞旋轉軸線旋轉,以將鐳射射束重新定向。The method 400 includes using a deflection device with a first operating state at block 410 to direct the laser beam toward a first transportation line for substrate processing, and at block 420 changing the first operating state of the deflection device to a second operating state, so that The laser beam is directed toward the second transportation line for substrate processing. Changing the first operating state to the second operating state may include rotating one or more mirrors of the deflection device, for example, about the axis of rotation, to redirect the laser beam.

根據一些實施方式,方法400還進一步包括在第一操作狀態與第二操作狀態之間重複切換,以交替地處理在第一運輸線路和第二運輸線路上的基板。透過以交替的方式處理在第一運輸線路和第二運輸線路上的基板,可僅提供單個鐳射裝置,並且可以降低設置的複雜程度,同時可以增大鐳射裝置的工作週期。According to some embodiments, the method 400 further includes repeatedly switching between the first operating state and the second operating state to alternately process the substrates on the first transportation line and the second transportation line. By processing the substrates on the first transportation line and the second transportation line in an alternating manner, only a single laser device can be provided, and the complexity of setting can be reduced, while the duty cycle of the laser device can be increased.

在一些實現方式中,方法400還進一步包括在鐳射射束被引導到第二運輸線路以供進行基板處理時操作第一運輸線路以沿第一運輸方向運輸基板和/或在鐳射射束被引導到第一運輸線路以供進行基板處理時操作第二運輸線路以沿第二運輸方向運輸基板。第一運輸方向和第二運輸方向可為基本上平行於彼此。在一些實現方式中,第一運輸方向和第二運輸方向可以是相同的。上述操作方案可優化用於太陽能電池製造的系統的產量。In some implementations, the method 400 further includes operating the first transport line to transport the substrate in the first transport direction when the laser beam is directed to the second transport line for substrate processing and / or guided by the laser beam When reaching the first transportation line for substrate processing, the second transportation line is operated to transport the substrate in the second transportation direction. The first transport direction and the second transport direction may be substantially parallel to each other. In some implementations, the first transportation direction and the second transportation direction may be the same. The above operation scheme can optimize the output of the system for solar cell manufacturing.

在一些實施方式中,方法400包括在朝第一運輸線路引導鐳射射束以供進行基板處理時停止第一運輸線路和/或在朝第二運輸線路引導鐳射射束以供進行基板處理時停止第二運輸線路。停止相應運輸線路允許基板處理,諸如鐳射劃線,同時基板是靜止的、即不移動。基板處理精度、諸如由鐳射裝置在基板上產生的處理結構的對準可以得到改進。然而,本發明並不限於此,並且第一運輸線路和/或第二運輸線路(即,基板)可在基板處理期間移動。In some embodiments, the method 400 includes stopping the first transport line when directing the laser beam toward the first transport line for substrate processing and / or stopping when directing the laser beam toward the second transport line for substrate processing The second transportation route. Stopping the corresponding transport line allows substrate processing, such as laser scribing, while the substrate is stationary, ie does not move. The substrate processing accuracy, such as the alignment of the processing structure produced on the substrate by the laser device, can be improved. However, the present invention is not limited to this, and the first transportation line and / or the second transportation line (ie, the substrate) may be moved during substrate processing.

根據本文描述的實施方式,可使用電腦程式、軟體、電腦軟體產品和相關控制器進行用於處理在太陽能電池的製造中使用的基板的方法400,該相關控制器可以具有CPU、記憶體、使用者介面和與用於處理(如測試)太陽能電池的設備的相應組件通信的輸入和輸出裝置。According to the embodiments described herein, a method 400 for processing a substrate used in the manufacture of solar cells may be performed using computer programs, software, computer software products, and related controllers, which may have a CPU, memory, use Interface and input and output devices that communicate with the corresponding components of the equipment used to process (eg test) solar cells.

圖5示出根據本文所述實施方式的製程序列的示意圖。「A」指示第一運輸線路,並且「B」指示第二運輸線路。FIG. 5 shows a schematic diagram of a manufacturing sequence according to embodiments described herein. "A" indicates the first transportation route, and "B" indicates the second transportation route.

如就第一運輸線路所示,可將第一基板裝載到例如被配置成用於使用基板處理佈置在第一運輸線路處進行基板處理的製程站中(510)。接著,可對第一基板進行處理(520),並且例如從製程站卸載第一基板(530)。可將第二基板裝載到製程站中(540),並且可對第二基板進行處理(550)。舉例而言,第一基板的卸載(530)和第二基板的裝載(540)可以花費大約1.25 s。As shown with respect to the first transportation line, the first substrate may be loaded into, for example, a processing station configured to perform substrate processing at the first transportation line using substrate processing (510). Next, the first substrate may be processed (520), and unloaded from the process station (530), for example. The second substrate may be loaded into the process station (540), and the second substrate may be processed (550). For example, the unloading of the first substrate (530) and the loading of the second substrate (540) may take about 1.25 s.

關於第二運輸線路,在第一運輸線路上處理第一基板期間,可使用基板處理佈置(510')將另一第一基板裝載到例如被配置成用於基板處理的製程站和第二運輸線路中。在卸載第一基板和在第一運輸線路上裝載第二基板期間,可對另一第一基板進行處理(520')。可將另一第一基板卸載(530'),並且可在第二運輸線路處將另一第二基板裝載(540'),同時執行在第一運輸線路處的第二基板的處理。如圖5中的示例性的製程序列所示,鐳射裝置的工作週期可以增大,因為鐳射裝置甚至在例如裝載和/或卸載過程中亦在操作。Regarding the second transport line, during processing of the first substrate on the first transport line, another first substrate may be loaded to a process station configured for substrate processing and a second transport using a substrate processing arrangement (510 '), for example In line. During unloading of the first substrate and loading of the second substrate on the first transport line, another first substrate may be processed (520 '). Another first substrate may be unloaded (530 '), and another second substrate may be loaded (540') at the second transportation line, while processing of the second substrate at the first transportation line is performed. As shown in the exemplary manufacturing process column in FIG. 5, the duty cycle of the laser device can be increased because the laser device is operated even during, for example, loading and / or unloading.

本發明使用了用於基板的處理(諸如鐳射劃線)的鐳射裝置還有可偏轉由鐳射裝置提供的鐳射射束的偏轉裝置。偏轉裝置可將鐳射射束朝第一運輸線路或第二運輸線路引導,這取決於偏轉裝置的操作狀態。切換操作狀態可將鐳射射束從第一運輸線路重新定向到第二運輸線路,或反之亦然。可使用相同鐳射裝置來處理定位在第一運輸線路和第二運輸線路兩者上的基板。該設備的複雜程度和/或佔用面積可以減小。鐳射裝置的工作週期可以增大。The present invention uses a laser device for substrate processing (such as laser scribing) and also a deflection device that can deflect the laser beam provided by the laser device. The deflection device can guide the laser beam towards the first transportation line or the second transportation line, depending on the operating state of the deflection device. Switching the operating state can redirect the laser beam from the first transportation line to the second transportation line, or vice versa. The same laser device can be used to process substrates positioned on both the first transportation line and the second transportation line. The complexity and / or footprint of the device can be reduced. The working cycle of the laser device can be increased.

儘管上述內容針對本發明的實施方式,但亦可在不脫離本發明的基本範圍的情況下設計本發明的進一步的實施方式,並且本發明的範圍是由隨附申請專利範圍來決定。Although the foregoing is directed to the embodiments of the present invention, further embodiments of the present invention can be designed without departing from the basic scope of the present invention, and the scope of the present invention is determined by the scope of the accompanying patent application.

1‧‧‧運輸方向1‧‧‧ Transportation

10‧‧‧基板10‧‧‧ substrate

11‧‧‧基板法線或表面法線11‧‧‧ substrate normal or surface normal

100‧‧‧設備100‧‧‧ Equipment

110‧‧‧運輸佈置110‧‧‧Transportation

112‧‧‧第一運輸線路112‧‧‧ First Transportation Line

114‧‧‧第二運輸線路114‧‧‧Second Transportation Line

120‧‧‧基板處理佈置120‧‧‧Substrate processing layout

122‧‧‧鐳射裝置122‧‧‧Laser device

123‧‧‧鐳射射束123‧‧‧Laser beam

124‧‧‧偏轉裝置124‧‧‧Deflection device

125‧‧‧樞轉點125‧‧‧ pivot point

300‧‧‧系統300‧‧‧ system

302‧‧‧第一工藝製程站302‧‧‧The first process station

304‧‧‧第二工藝製程站304‧‧‧Second process station

306‧‧‧第三工藝製程站306‧‧‧The third process station

320‧‧‧基板處理佈置320‧‧‧Substrate processing layout

322‧‧‧鐳射裝置322‧‧‧Laser device

323‧‧‧鐳射射束323‧‧‧Laser beam

324‧‧‧偏轉裝置324‧‧‧Deflection device

325‧‧‧旋轉軸線325‧‧‧axis of rotation

326‧‧‧第一輔助偏轉裝置326‧‧‧First auxiliary deflection device

400‧‧‧方法400‧‧‧Method

410‧‧‧方塊410‧‧‧block

420‧‧‧方塊420‧‧‧box

510‧‧‧步驟510‧‧‧Step

520‧‧‧步驟520‧‧‧step

530‧‧‧步驟530‧‧‧Step

540‧‧‧步驟540‧‧‧step

550‧‧‧步驟550‧‧‧ steps

302’‧‧‧另一第一工藝製程站302’‧‧‧Another First Process Station

304’‧‧‧另一第二工藝製程站304’‧‧‧ another second process station

306’‧‧‧另一第三工藝製程站306’‧‧‧ Another third process station

326’‧‧‧第二輔助偏轉裝置326’‧‧‧second auxiliary deflection device

510’‧‧‧步驟510’‧‧‧Step

520’‧‧‧步驟520’‧‧‧step

530’‧‧‧步驟530’‧‧‧step

540’‧‧‧步驟540’‧‧‧step

因此,為了能夠詳細理解本發明的上述特徵結構的方式,可以參考實施方式得出上文所簡要概述的本發明的更具體的描述。附圖涉及本發明的各個實施方式,並且描述如下: 圖1示出根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板的設備的示意性頂視圖; 圖2A和圖2B示出根據本文所述實施方式的說明用於處理在太陽能電池的製造中使用的基板的設備的第一操作狀態和第二操作狀態的示意圖; 圖3示出根據本文所述實施方式的用於太陽能電池製造的系統的示意性頂視圖; 圖4示出根據本文所述實施方式的用於處理在太陽能電池的製造中使用的基板的方法流程圖;以及 圖5示出根據本文所述實施方式的製程順序的示意圖。Therefore, in order to be able to understand the manner of the above-mentioned characteristic structure of the present invention in detail, a more specific description of the present invention briefly summarized above can be obtained with reference to the embodiments. The drawings relate to various embodiments of the present invention and are described as follows: FIG. 1 shows a schematic top view of an apparatus for processing a substrate used in the manufacture of solar cells according to embodiments described herein; FIGS. 2A and 2B A schematic diagram showing the first and second operating states of the apparatus for processing substrates used in the manufacture of solar cells according to the embodiments described herein; FIG. 3 shows A schematic top view of a system for solar cell manufacturing; FIG. 4 shows a flowchart of a method for processing a substrate used in the manufacture of solar cells according to embodiments described herein; and FIG. 5 shows an embodiment according to this description. Schematic diagram of the process sequence.

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Claims (20)

一種用於處理在太陽能電池的製造中使用的基板的設備,該設備包括: 一運輸佈置,該運輸佈置具有至少一第一運輸線路和一第二運輸線路並且被配置成用於運輸該基板;以及一基板處理佈置,該基板處理佈置在該運輸佈置處,其中該基板處理佈置包括:一鐳射裝置,該鐳射裝置被配置成提供用於該基板的處理的一鐳射射束;以及一偏轉裝置,該偏轉裝置具有一第一操作狀態和一第二操作狀態,其中該偏轉裝置被配置成在該第一操作狀態下將該鐳射射束朝該第一運輸線路引導並且在該第二操作狀態下將該鐳射射束朝該第二運輸線路引導。An apparatus for processing a substrate used in the manufacture of solar cells, the apparatus includes: a transportation arrangement having at least a first transportation line and a second transportation line and configured to transport the substrate; And a substrate processing arrangement disposed at the transportation arrangement, wherein the substrate processing arrangement includes: a laser device configured to provide a laser beam for processing of the substrate; and a deflection device , The deflection device has a first operating state and a second operating state, wherein the deflecting device is configured to guide the laser beam towards the first transport line in the first operating state and in the second operating state Next, guide the laser beam toward the second transportation line. 如請求項1所述的設備,其中該偏轉裝置被配置成至少在提供該第一操作狀態的一第一取向與提供該第二操作狀態的一第二取向之間能夠移動,其中該偏轉裝置被配置成在該第一取向上將該鐳射射束朝該第一運輸線路引導並且在該第二取向上將該鐳射射束朝該第二運輸線路引導。The apparatus of claim 1, wherein the deflection device is configured to be movable between at least a first orientation providing the first operating state and a second orientation providing the second operating state, wherein the deflection device It is configured to direct the laser beam toward the first transportation line in the first orientation and direct the laser beam toward the second transportation line in the second orientation. 如請求項1或2所述的設備,其中該偏轉裝置包括一或多個鏡子。The apparatus according to claim 1 or 2, wherein the deflection device includes one or more mirrors. 如請求項3所述的設備,其中該一或多個鏡子是可旋轉鏡。The apparatus of claim 3, wherein the one or more mirrors are rotatable mirrors. 如請求項1或2所述的設備,其中該設備被配置成交替地將該鐳射射束朝該第一運輸線路和該第二運輸線路引導,以便進行基板處理。The apparatus according to claim 1 or 2, wherein the apparatus is configured to alternately guide the laser beam toward the first transportation line and the second transportation line for substrate processing. 如請求項3所述的設備,其中該設備被配置成交替地將該鐳射射束朝該第一運輸線路和該第二運輸線路引導,以便進行基板處理。The apparatus according to claim 3, wherein the apparatus is configured to alternately guide the laser beam toward the first transportation line and the second transportation line for substrate processing. 如請求項4所述的設備,其中該設備被配置成交替地將該鐳射射束朝該第一運輸線路和該第二運輸線路引導,以便進行基板處理。The apparatus according to claim 4, wherein the apparatus is configured to alternately guide the laser beam toward the first transportation line and the second transportation line for substrate processing. 如請求項1或2所述的設備,其中該鐳射裝置被配置成用於鐳射劃線。The apparatus according to claim 1 or 2, wherein the laser device is configured for laser scribing. 如請求項3所述的設備,其中該鐳射裝置被配置成用於鐳射劃線。The apparatus of claim 3, wherein the laser device is configured for laser scribing. 如請求項1或2所述的設備,其中該第一運輸線路在朝該第一運輸線路引導該鐳射射束以供進行基板處理時是靜止的,並且其中該第二運輸線路在朝該第二運輸線路引導該鐳射射束以供進行基板處理時是靜止的。The apparatus according to claim 1 or 2, wherein the first transport line is stationary when the laser beam is directed toward the first transport line for substrate processing, and wherein the second transport line is directed toward the first The second transport line is stationary when guiding the laser beam for substrate processing. 如請求項5所述的設備,其中該第一運輸線路在朝該第一運輸線路引導該鐳射射束以供進行基板處理時是靜止的,並且其中該第二運輸線路在朝該第二運輸線路引導該鐳射射束以供進行基板處理時是靜止的。The apparatus according to claim 5, wherein the first transport line is stationary when the laser beam is directed toward the first transport line for substrate processing, and wherein the second transport line is transported toward the second transport line The line is stationary when guiding the laser beam for substrate processing. 如請求項1或2所述的設備,其中該第一運輸線路在朝該第二運輸線路引導該鐳射射束以供進行基板處理時是非靜止的,並且其中該第二運輸線路在朝該第一運輸線路引導該鐳射射束以供進行基板處理時是非靜止的。The apparatus according to claim 1 or 2, wherein the first transport line is non-stationary when guiding the laser beam toward the second transport line for substrate processing, and wherein the second transport line is directed toward the first A transport line guiding the laser beam for substrate processing is non-stationary. 如請求項5所述的設備,其中該第一運輸線路在朝該第二運輸線路引導該鐳射射束以供進行基板處理時是非靜止的,並且其中該第二運輸線路在朝該第一運輸線路引導該鐳射射束以供進行基板處理時是非靜止的。The apparatus of claim 5, wherein the first transport line is non-stationary when guiding the laser beam toward the second transport line for substrate processing, and wherein the second transport line is transported toward the first transport line The line is non-stationary when guiding the laser beam for substrate processing. 一種用於太陽能電池的製造的系統,該系統包括: 一或多個製程站; 如請求項1-13所述的設備,其中一或多個製程站中的至少一個製程站包括該基板處理佈置。A system for the manufacture of solar cells, the system comprising: one or more process stations; the apparatus of claim 1-13, wherein at least one of the one or more process stations includes the substrate processing arrangement . 如請求項14所述的系統,其中該一或多個製程站選自由以下各項組成的組:一裝載站、一檢查站、一對準站、一鐳射劃線站、一印刷站、一乾燥站、一緩衝站、一電氣測試站、一分揀站、一卸載站和上述各項的任何組合。The system of claim 14, wherein the one or more process stations are selected from the group consisting of: a loading station, an inspection station, an alignment station, a laser scribing station, a printing station, a Drying station, a buffer station, an electrical test station, a sorting station, an unloading station and any combination of the above. 如請求項14或15所述的系統,其中該系統被配置成用於製造搭接的太陽能電池。The system according to claim 14 or 15, wherein the system is configured for manufacturing overlapping solar cells. 一種用於處理在太陽能電池的製造中使用的基板的方法,該方法包括以下步驟: 使用具有一第一操作狀態的一偏轉裝置將一鐳射射束朝一第一運輸線路引導; 將該偏轉裝置的該第一操作狀態改變為一第二操作狀態,以將該鐳射射束朝該第二運輸線路引導,以便進行基板處理。A method for processing a substrate used in the manufacture of solar cells, the method comprising the following steps: using a deflection device having a first operating state to direct a laser beam toward a first transportation line; The first operating state is changed to a second operating state to guide the laser beam toward the second transportation line for substrate processing. 如請求項17所述的方法,進一步包括以下步驟: 在該第一操作狀態與該第二操作狀態之間重複切換,以交替地處理在該第一運輸線路與該第二運輸線路上的基板。The method according to claim 17, further comprising the steps of: repeatedly switching between the first operating state and the second operating state to alternately process substrates on the first transportation line and the second transportation line . 如請求項17或18所述的方法,其中將該第一操作狀態改變為該第二操作狀態之步驟包括以下步驟:使該偏轉裝置的一或多個鏡子旋轉。The method according to claim 17 or 18, wherein the step of changing the first operating state to the second operating state includes the step of rotating one or more mirrors of the deflection device. 如請求項17或18中任一項所述的方法,進一步包括至少一個以下步驟: 在朝該第二運輸線路引導該鐳射射束以供進行基板處理時,操作該第一運輸線路以沿一第一運輸方向運輸基板; 在朝該第一運輸線路引導該鐳射射束以供進行基板處理時,操作該第二運輸線路以沿一第二運輸方向運輸基板; 在朝該第一運輸線路引導該鐳射射束以供進行基板處理時,停止該第一運輸線路;以及 在朝該第二運輸線路引導該鐳射射束以供進行基板處理時,停止該第二運輸線路。The method according to any one of claims 17 or 18, further comprising at least one of the following steps: while guiding the laser beam toward the second transportation line for substrate processing, operating the first transportation line to follow a Transport the substrate in the first transport direction; when guiding the laser beam toward the first transport line for substrate processing, operate the second transport line to transport the substrate in a second transport direction; guide toward the first transport line When the laser beam is used for substrate processing, the first transport line is stopped; and when the laser beam is directed toward the second transport line for substrate processing, the second transport line is stopped.
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