TW201831913A - Electronic component conveying apparatus and electronic component inspection apparatus having a conveying unit, a first holding unit, and an inspection unit that performs the first inspection for improving its units per hour - Google Patents

Electronic component conveying apparatus and electronic component inspection apparatus having a conveying unit, a first holding unit, and an inspection unit that performs the first inspection for improving its units per hour Download PDF

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TW201831913A
TW201831913A TW107105615A TW107105615A TW201831913A TW 201831913 A TW201831913 A TW 201831913A TW 107105615 A TW107105615 A TW 107105615A TW 107105615 A TW107105615 A TW 107105615A TW 201831913 A TW201831913 A TW 201831913A
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inspection
electronic component
electronic
holding portion
fingerprint identification
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TW107105615A
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TWI668455B (en
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荻原武彥
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日商精工愛普生股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The topic of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus to improve its UPH (units per hour). An electronic component conveying apparatus of the present invention includes: a conveying unit that can convey electronic components; and a first holding unit that can hold electronic components; and an inspection unit that performs the first inspection of the electronic component and the second inspection different from the first inspection, the inspection unit performs the first inspection on the electronic component, when the result of the first inspection satisfies a predetermined condition, the second inspection is performed on the electronic component that has undergone the first inspection, if the result of the first inspection does not satisfy the predetermined condition, the second inspection is not performed on the electronic component that has undergone the first inspection, but the first inspection is performed on the other electronic component that has not undergone the first inspection.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於電子零件搬送裝置及電子零件檢查裝置者。The present invention relates to an electronic component transfer device and an electronic component inspection device.

當前,指紋識別裝置廣泛地使用於建築物之門禁管理、行動裝置、或個人電腦等個人身份之識別與確認。於指紋識別裝置中,使用指紋識別電子零件檢測使用者之指紋圖像,並將指紋圖像與資料庫內之樣本指紋圖像進行比較而識別使用者之身份。於指紋識別電子零件之底面,設置有複數個電連接器,且於頂面設置有可檢測指紋之檢測部。由於指紋識別電子零件經過複數個步驟製作,故本領域技術人員為了確保出貨品質,於指紋識別電子零件之製作結束後,藉由電子零件檢查裝置對手指(指紋)與指紋識別電子零件未相接之狀態及手指(指紋)相接之狀態進行檢查,而排除不良品。 例如,有根據複數個檢查結果將電子零件(CCD(Charge Coupled Device:電荷耦合裝置)感測器)分類之揭示(例如參照專利文獻1)。 又,有於檢查電子零件(CCD感測器)時以有無光之照射進行檢查之揭示(例如參照專利文獻2)。 又,有以複數個檢查項目檢查電子零件(CCD感測器)之揭示(例如參照專利文獻3)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2010-78408號公報 [專利文獻2]日本專利特開2008-135211號公報 [專利文獻3]日本專利特開2006-317280號公報At present, fingerprint identification devices are widely used for the identification and confirmation of personal identities such as building access control management, mobile devices, or personal computers. In a fingerprint recognition device, a fingerprint recognition electronic part is used to detect a user's fingerprint image, and the fingerprint image is compared with a sample fingerprint image in a database to identify the user's identity. A plurality of electrical connectors are provided on the bottom surface of the fingerprint identification electronic part, and a detection portion capable of detecting fingerprints is provided on the top surface. Since the fingerprint identification electronic parts are manufactured through a plurality of steps, in order to ensure the quality of shipment, those skilled in the art, after the production of the fingerprint identification electronic parts, finishes, the fingers (fingerprint) and the fingerprint identification electronic parts are not related by the electronic part inspection device. Check the state of contact and the state of finger (fingerprint) contact to eliminate defective products. For example, there is a disclosure that classifies electronic components (CCD (Charge Coupled Device) sensors) based on a plurality of inspection results (for example, refer to Patent Document 1). In addition, when inspecting electronic components (CCD sensors), it is disclosed that the inspection is performed with or without light irradiation (for example, refer to Patent Document 2). There is also a disclosure that an electronic component (CCD sensor) is inspected by a plurality of inspection items (for example, refer to Patent Document 3). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2010-78408 [Patent Literature 2] Japanese Patent Laid-Open No. 2008-135211 [Patent Literature 3] Japanese Patent Laid-Open No. 2006-317280 Bulletin

[發明所欲解決之問題] 然而,於專利文獻1~3中,無連續進行複數個不同之檢查,且根據上一次檢查結果之好壞而判斷有無下一次檢查之揭示。 [解決問題之技術手段] 本發明係為了解決上述課題之至少一部分而完成者,且可作為以下之形態或應用例而實現。 [應用例1]本應用例之電子零件搬送裝置特徵在於具有:搬送部,其可搬送電子零件;及第1保持部,其可保持上述電子零件;且可配置對上述電子零件進行第1檢查及與上述第1檢查不同之第2檢查之檢查部,上述檢查部對上述電子零件進行上述第1檢查,於上述第1檢查之結果滿足預先決定之條件之情形時,對已進行上述第1檢查之上述電子零件進行上述第2檢查,於上述第1檢查之結果不滿足上述預先決定之條件之情形時,不對已進行上述第1檢查之上述電子零件進行上述第2檢查,而對未進行上述第1檢查之其他上述電子零件進行上述第1檢查。 根據本應用例,若第1檢查之結果不滿足預先決定之條件,則可不實施第2檢查而繼續搬送。藉此,可對一個電子零件同時且連續地進行不同之檢查,從而提升處理能力(UPH;Units Per Hour:單位時間產出量)。 預先決定之條件為例如藉由執行對電子零件進行檢查動作之檢查程式,而排除電子零件之缺陷(不良)。 [應用例2]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第1檢查及上述第2檢查中之至少任一者係進行複數次。 根據本應用例,可進行正確之檢查。 [應用例3]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第1檢查為對上述電子零件不施加物理作用之檢查,上述第2檢查為對上述電子零件施加上述物理作用之檢查。 根據本應用例,可對電子零件進行施加物理作用之檢查。 [應用例4]於上述應用例所記載之電子零件搬送裝置中,較佳為上述物理作用為光及電荷之至少任一者。 根據本應用例,可容易地進行進行物理作用之檢查。 [應用例5]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第1檢查為手指(指紋)與上述電子零件未相接之狀態之檢查,上述第2檢查為上述手指(指紋)與上述電子零件相接之狀態之檢查。 根據本應用例,可進行手指(指紋)與電子零件未相接之狀態及手指(指紋)相接之狀態之檢查。 [應用例6]於上述應用例所記載之電子零件搬送裝置中,較佳為具有與上述第1保持部不同構造之第2保持部。 根據本應用例,可具備專門用於檢查環境之保持部。 [應用例7]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第1保持部具備於進行指紋比對時代替手指之指紋圖案而使用之指紋代用構件,且上述第2保持部不具備上述指紋代用構件。 根據本應用例,可具備專門用於檢查環境之第2保持部。 [應用例8]本應用例之電子零件搬送裝置特徵在於具有:第1保持部,其可保持電子零件;及第2保持部,其可保持上述電子零件,且為與上述第1保持部不同之構造;且可配置具有載置上述電子零件之載置部且可對上述電子零件進行檢查之檢查部;上述第1保持部係將上述電子零件搬送至上述載置部而載置於上述載置部,上述第2保持部係於上述第1保持部將上述電子零件載置於上述載置部後,按壓上述電子零件並進行特定之檢查。 根據本應用例,可具備專門用於檢查環境之第2保持部。藉此,可因應不同形狀之電子零件之檢查。又,即便為第2保持部無法吸附電子零件之構造,亦可利用將電子零件載置於載置部之第1保持部搬送電子零件。 [應用例9]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第1保持部具有吸附機構,且上述第2保持部不具有上述吸附機構。 根據本應用例,可具備專門用於檢查環境之第2保持部。 [應用例10]於上述應用例所記載之電子零件搬送裝置中,較佳為上述第2保持部具有進行電性檢查之端子。 根據本應用例,可具備專門用於檢查環境之第2保持部。 [應用例11]本應用例之電子零件檢查裝置特徵在於具有:搬送部,其可搬送電子零件;第1保持部,其可保持上述電子零件;及檢查部,其對上述電子零件進行第1檢查及與上述第1檢查不同之第2檢查;且上述檢查部係對上述電子零件進行上述第1檢查,於上述第1檢查之結果滿足預先決定之條件之情形時,對已進行上述第1檢查之上述電子零件進行上述第2檢查,於上述第1檢查之結果不滿足上述預先決定之條件之情形時,不對已進行上述第1檢查之上述電子零件進行上述第2檢查,而對未進行上述第1檢查之其他上述電子零件進行上述第1檢查。 根據本應用例,若第1檢查之結果不滿足預先決定之條件,則可不實施第2檢測而繼續搬送。藉此,可對一個電子零件同時且連續地進行不同之檢查,從而可提升處理能力(UPH)。[Problems to be Solved by the Invention] However, in Patent Documents 1 to 3, a plurality of different inspections are not performed continuously, and the existence of the next inspection is judged based on the quality of the previous inspection results. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transfer device of this application example is characterized in that it has a transfer section that can transfer electronic components, and a first holding section that can hold the electronic components, and can be configured to perform the first inspection on the electronic components. And a second inspection section different from the first inspection, the inspection section performs the first inspection on the electronic component, and when the result of the first inspection satisfies a predetermined condition, the first inspection is performed. The electronic component under inspection is subject to the above-mentioned second inspection. When the result of the first inspection does not satisfy the above-mentioned predetermined conditions, the above-mentioned second inspection is not performed on the electronic parts that have undergone the first inspection, and The aforementioned first inspection is performed on the other electronic components in the aforementioned first inspection. According to this application example, if the result of the first inspection does not satisfy a predetermined condition, the second inspection may be continued without carrying out the transportation. In this way, different inspections of an electronic part can be performed simultaneously and continuously, thereby improving processing capacity (UPH; Units Per Hour). The predetermined condition is, for example, that a defect (defect) of the electronic component is eliminated by executing an inspection program for performing an inspection operation on the electronic component. [Application Example 2] In the electronic component conveying device described in the above application example, it is preferable that at least one of the first inspection and the second inspection is performed a plurality of times. According to this application example, a correct inspection can be performed. [Application Example 3] In the electronic component transporting device described in the above application example, it is preferable that the first inspection is an inspection that does not apply a physical action to the electronic part, and the second inspection is that that applies the physical action to the electronic part. Its check. According to this application example, an inspection for applying a physical action to an electronic part can be performed. [Application Example 4] In the electronic component transporting device described in the above application example, the physical action is preferably at least one of light and electric charge. According to this application example, it is possible to easily perform a physical inspection. [Application Example 5] In the electronic component transfer device described in the above application example, it is preferable that the first inspection is an inspection of a state where a finger (fingerprint) and the electronic component are not connected, and the second inspection is an inspection of the finger ( Fingerprint) Inspection of the state of connection with the above electronic parts. According to this application example, the state where the finger (fingerprint) is not connected to the electronic parts and the state where the finger (fingerprint) is connected can be checked. [Application Example 6] In the electronic component transporting device described in the above application example, it is preferable that the second holding portion has a structure different from that of the first holding portion. According to this application example, a holding section dedicated to inspecting the environment may be provided. [Application Example 7] In the electronic component conveying device described in the above application example, it is preferable that the first holding section includes a fingerprint substitute member used in place of a fingerprint pattern of a finger during fingerprint comparison, and the second holding section The unit does not include the above-mentioned fingerprint substitute member. According to this application example, it is possible to provide a second holding section for inspecting the environment. [Application Example 8] The electronic component transporting device of this application example is characterized by having a first holding portion that can hold the electronic component, and a second holding portion that can hold the electronic component, which is different from the first holding portion. Structure; and an inspection unit having a mounting part on which the electronic parts are placed and capable of inspecting the electronic parts may be arranged; the first holding part transports the electronic parts to the mounting part and is placed on the loading part The placement part and the second holding part are after the first holding part puts the electronic component on the placing part, and then presses the electronic part to perform a specific inspection. According to this application example, it is possible to provide a second holding section for inspecting the environment. Therefore, it can respond to the inspection of electronic parts with different shapes. Moreover, even if it is a structure where an electronic component cannot be adsorbed by a 2nd holding | maintenance part, an electronic component can be conveyed by the 1st holding | maintenance part which mounts an electronic component on a mounting part. [Application Example 9] In the electronic component transporting device described in the application example, it is preferable that the first holding portion has a suction mechanism, and the second holding portion does not include the suction mechanism. According to this application example, it is possible to provide a second holding section for inspecting the environment. [Application Example 10] In the electronic component transporting device described in the above application example, it is preferable that the second holding portion includes a terminal for performing electrical inspection. According to this application example, it is possible to provide a second holding section for inspecting the environment. [Application Example 11] The electronic component inspection device of this application example is characterized in that it includes a transfer section that can transport electronic components, a first holding section that can hold the electronic components, and an inspection section that performs the first electronic component inspection. The inspection and a second inspection different from the first inspection; and the inspection unit performs the first inspection on the electronic parts, and when the result of the first inspection satisfies a predetermined condition, the first inspection is performed. The electronic component under inspection is subject to the above-mentioned second inspection. When the result of the first inspection does not satisfy the above-mentioned predetermined conditions, the above-mentioned second inspection is not performed on the electronic parts that have undergone the first inspection, and The aforementioned first inspection is performed on the other electronic components in the aforementioned first inspection. According to this application example, if the result of the first inspection does not satisfy a predetermined condition, it is possible to continue the conveyance without performing the second inspection. As a result, different inspections can be performed on one electronic part simultaneously and continuously, thereby improving processing capacity (UPH).

以下,根據圖式對將本發明具體化之實施形態進行說明。另,使用之圖式為了使說明之部分可供辨識而適當放大或縮小地顯示。 (第1實施形態) 圖1係顯示本實施形態之IC處理器之構造之模式俯視圖,且係顯示將具備可搬送作為本實施形態之電子零件之指紋識別電子零件74之搬送部之電子零件搬送裝置使用作為電子零件檢查裝置之IC處理器之例的圖。 本實施形態之IC處理器於基座80具備:供給托盤82、回收托盤86、檢查部10、測定機器人20、供給機器人90、回收機器人92、及控制裝置(未圖示)。於供給托盤82設置有用以載置至少1個要檢查之指紋識別電子零件74之至少1個凹穴(未圖示)。供給機器人90之供給側機器人手單元94自袋部取出指紋識別電子零件74,且移送至梭子62、68。指紋識別電子零件74具備檢測物理作用之檢測部78。物理作用是指例如光、電荷、壓力、聲音、溫度、振動、電場變化、磁場變化之至少任一者。 於檢查部10設置有具有作為至少1個載置部之檢查用插座14之檢查用電路板12(參照圖2)。檢查部10檢查指紋識別電子零件74。 於梭子62、68設置有載置指紋識別電子零件74之至少1個載置部。於本實施形態中,於檢查部10之供給機器人90側設置有載置檢查前之指紋識別電子零件74之第1載置部64及第3載置部70。於檢查部10之回收機器人92側設置有載置檢查結束之指紋識別電子零件74之第2載置部66及第4載置部72。第1載置部64及第3載置部70藉由供給機器人90之供給側機器人手單元94放入檢查前之指紋識別電子零件74,且將檢查前之指紋識別電子零件74移送至檢查部10之側方。 圖2係顯示本實施形態之測定機器人20之構造之模式前視圖。 於測定機器人20設置有至少向一方向位移之按壓保持部34。按壓保持部34將指紋識別電子零件74放入檢查用插座14,或自檢查用插座14取出,且使指紋識別電子零件74抵接於檢查用插座14。又,於按壓保持部34設置有可位移作動之按壓測定構件48,且抵接於指紋識別電子零件74之檢測部78。 本實施形態之搬送部具備作為可保持指紋識別電子零件74之第1保持部之按壓保持部34。電子零件搬送裝置可配置對指紋識別電子零件74進行第1檢查及與第1檢查不同之第2檢查之檢查部10。檢查部10於對指紋識別電子零件74進行第1檢查,且於第1檢查之結果滿足預先決定之條件之情形時,對已進行第1檢查之指紋識別電子零件74進行第2檢查。檢查部10於第1檢查之結果不滿足預先決定之條件之情形時,不對已進行第1檢查之指紋識別電子零件74進行第2檢查,而對未進行第1檢查之其他指紋識別電子零件74進行第1檢查。 本實施形態之預先決定之條件是指藉由執行對指紋識別電子零件74進行檢查動作之檢查程式,而排除指紋識別電子零件74之缺陷(不良)。 本實施形態之IC處理器具備:可保持指紋識別電子零件74之按壓保持部34、及對指紋識別電子零件74進行第1檢查及與第1檢查不同之第2檢查之檢查部10。 第1檢查及第2檢查中之至少任一者可進行複數次。據此,可進行正確之檢查。例如,於進行複數次檢查之情形時,可綜合判斷合格與否。 第1檢查為不對指紋識別電子零件74施加物理作用之檢查。第2檢查為對指紋識別電子零件74施加物理作用之檢查。據此,可進行對指紋識別電子零件74施加物理作用之檢查。 物理作用可為光及電荷之至少任一者。據此,可容易地進行施加物理作用之檢查。 第1檢查為手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態之檢查。第2檢查為手指(指紋)與指紋識別電子零件74之檢測部78相接之狀態之檢查。據此,可進行手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態及手指(指紋)相接之狀態之檢查。 於檢查部10,設置有具有至少1個檢查用插座14之檢查用電路板12且檢查指紋識別電子零件74。於本實施形態中,於檢查用插座14配置有與檢查用電路板12電性連接之複數個探針18而電性連接於指紋識別電子零件74之電連接器76。電連接器76可為錫球或連接引腳等。 於測定機器人20設置有向至少一方向位移之按壓保持部34。按壓保持部34進行將指紋識別電子零件74對檢查用插座14之取放,且抵接於檢查用插座14內之指紋識別電子零件74之非檢測部位。 於本實施形態中,於測定機器人20設置有向第1方向、第2方向(例如Z方向、Y方向)位移之移送裝置32。於移送裝置32安裝有按壓保持部34。按壓保持部34之一端安裝於移送裝置32之底部。於另一端設置有按壓轉移構件36,且抵接於指紋識別電子零件74之非檢測部位。於按壓轉移構件36之底面設置有複數個吸附部38,進行指紋識別電子零件74之取放。吸附部38經由吸引部61連接於未圖示之吸引泵。 又,於按壓保持部34之內部設置有收納空間40。於收納空間40之底面開設有貫通至按壓轉移構件36之貫通孔42。測定機器人20於按壓保持部34之內部設置有可位移作動之按壓測定構件48。於按壓測定構件48之下方設置有抵壓部52。於抵壓部52之下方設置有作為指紋代用構件之導電構件56。導電構件56抵接於指紋識別電子零件74之檢測部78。導電構件56為進行指紋比對時代替手指之指紋圖案而使用之構件。 於本實施形態中,將設置有彈性構件之按壓測定構件48配置於按壓保持部34之收納空間40內。再者,於按壓測定構件48之一端設置有凸緣50。於按壓測定構件48與空氣室44內之上表面之間設置有拉伸彈簧54即彈性構件。彈簧54使按壓測定構件48朝Z方向之上方彈性復位。 安裝於抵壓部52之底面之導電構件56(於本實施形態中,導電構件56亦可為導電性塑料片材)進行靜電放電。又,於按壓測定構件48之另一端設置有插通於貫通孔42之抵壓部52。安裝於抵壓部52之底面之導電構件56抵壓於指紋識別電子零件74之檢測部78。又,於按壓保持部34設置有驅動按壓測定構件48使其向Z方向位移之至少1個驅動構造。 於本實施形態中,於驅動構造中,於按壓測定構件48之一端之上方設置有連通於至少1個通氣口46之空氣室44。使空氣室44之空氣加壓,將按壓測定構件48向Z方向按壓而使其向下方位移。空氣室44構成為藉由使用密封構件59而可防止空氣室44之經加壓之空氣洩漏。 於本實施形態中,於檢查部10之一側設置有向第3方向(例如X方向)位移之第1梭子62。於第1梭子62之供給機器人90側,設置有載置檢查前之指紋識別電子零件74之至少1個第1載置部64。又,於第1梭子62之回收機器人92側,設置有載置檢查結束之指紋識別電子零件74之至少1個第2載置部66。 於檢查部10之另一側,設置有向第3方向位移之第2梭子68。於第2梭子68之供給機器人90側,設置有載置檢查前之指紋識別電子零件74之至少1個第3載置部70。又,於第2梭子68之回收機器人92側,設置有載置檢查結束之指紋識別電子零件74之至少1個第4載置部72。 使用時,第1梭子62之第1載置部64載置檢查前之指紋識別電子零件74,且向X方向位移,將檢查前之指紋識別電子零件74移送至檢查部10之一側。測定機器人20之移送裝置32驅動按壓保持部34及按壓測定構件48而使其等向Y方向位移。移送裝置32使按壓保持部34位於第1載置部64之上方。藉由移送裝置32進一步驅動按壓保持部34使其向Z方向位移。藉由按壓保持部34之吸附部38接觸並吸附指紋識別電子零件74之非檢測部位。再者,自第1梭子62之第1載置部64取出檢查前之指紋識別電子零件74。 於測定機器人20之按壓保持部34取出檢查前之指紋識別電子零件74後,藉由測定機器人20之移送裝置32驅動按壓保持部34及檢查前之指紋識別電子零件74而使其等向Y方向位移。藉由移送裝置32使檢查前之指紋識別電子零件74位於檢查部10之檢查用插座14之上方。移送裝置32進一步將按壓保持部34向Z方向驅動而使其向下方位移。 按壓保持部34如圖2所示,使檢查前之指紋識別電子零件74配置於檢查用插座14。按壓保持部34使按壓轉移構件36抵接於指紋識別電子零件74。按壓保持部34使指紋識別電子零件74之電連接器76確實地與檢查用插座14之探針18接觸。 按壓保持部34之按壓轉移構件36抵接於指紋識別電子零件74之非檢測部位。由於按壓轉移構件36不會對指紋識別電子零件74之檢測部78帶來影響,故於檢查用插座14內可執行作為第1檢查之手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態(導電構件56不與檢測部78相接之狀態)之檢查。檢查用插座14經由檢查用電路板12將檢查資料發送至控制器(未圖示)。 圖3係顯示本實施形態之測定機器人20之構造之模式前視圖。 測定機器人20如圖3所示,於執行手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態之檢查後,經由通氣口46將空氣注入空氣室44。接著,使空氣室44之空氣加壓,藉由空氣室44之經加壓之空氣之壓力將按壓測定構件48向Z方向按壓而使其向下方位移。按壓測定構件48係使抵壓部52及導電構件56於按壓保持部34之貫通孔42內向下方位移,直至凸緣50抵接於按壓保持部34、或導電構件56與指紋識別電子零件74之檢測部78接觸。藉由導電構件56接觸並按壓於指紋識別電子零件74之檢測部78,而以導電構件56進行靜電放電。於檢查部10之檢查用插座14內執行作為第2檢查之手指(指紋)與指紋識別電子零件74之檢測部78相接之狀態(導電構件56與檢測部78相接之狀態)之檢查。 檢查結束後,測定機器人20首先經由通氣口46使空氣室44內之空氣排出。按壓測定構件48由於不受到來自空氣室44內之空氣之外部力,故可藉由拉伸彈簧54之復位彈力沿著Z方向朝上方位移,驅動導電構件56而自指紋識別電子零件74之檢測部78離開。指紋識別電子零件74仍藉由按壓保持部34之吸附部38保持吸附,故於藉由移送裝置32將按壓保持部34向Z方向驅動而使其向上方位移時,可藉由按壓保持部34之吸附部38吸附檢查結束之指紋識別電子零件74並自檢查部10之檢查用插座14取出。 於藉由測定機器人20之按壓保持部34取出檢查結束之指紋識別電子零件74後,第2梭子68之第4載置部72沿著X方向朝檢查部10之另一側位移。測定機器人20藉由移送裝置32驅動按壓保持部34及檢查結束之指紋識別電子零件74使其等向Y方向位移,將檢查結束之指紋識別電子零件74移送至第4載置部72之上方。藉由移送裝置32進一步使按壓保持部34向Z方向位移,而將檢查結束之指紋識別電子零件74配置於第2梭子68之第4載置部72,藉由第4載置部72取出檢查結束之指紋識別電子零件74。 圖4係顯示本實施形態之IC處理器之檢查步驟之流程圖。 首先,於步驟S10中,控制裝置將指紋識別電子零件74載置於檢查用插座14。 接著,步驟S20中,控制裝置對手指(指紋)未相接之狀態(導電構件56與檢測部78不相接之狀態)之指紋識別電子零件74執行檢查。 接著,於步驟S30中,控制裝置對手指(指紋)未相接之狀態之指紋識別電子零件74判斷是否正常結束檢查。於檢查之結果滿足預先決定之條件之情形時,以是(YES)進行至步驟S40。於檢查之結果不滿足預先決定之條件之情形時,以否(NO)進行至步驟S32。 接著,於步驟S32中,控制裝置對手指(指紋)未相接之狀態之指紋識別電子零件74判斷檢查是否未滿2次。如為第1次,以是(YES)進行至步驟S34。如為第2次,以否(NO)進行至步驟S70。 接著,於步驟S34中,控制裝置於將載置於檢查用插座14之指紋識別電子零件74重新載置之期間,使檢查部10處於待機狀態。控制裝置使測定機器人20將載置於檢查用插座14之指紋識別電子零件74重新載置(步驟S36)。接著,確認檢查結束並復位至步驟S20。 接著,於步驟S40中,控制裝置於變更檢查環境之期間,使檢查部10處於待機狀態。控制裝置使測定機器人20變更檢查環境(步驟S42)。具體而言,測定機器人20使安裝於抵壓部52之底面之導電構件56抵壓於指紋識別電子零件74之檢測部78。 接著,於步驟S50中,控制裝置對手指(指紋)相接之狀態(導電構件56與檢測部78相接之狀態)之指紋識別電子零件74執行檢查。 接著,於步驟S60中,控制裝置對手指(指紋)相接之狀態之指紋識別電子零件74判斷是否正常結束檢查。於檢查之結果滿足預先決定之條件之情形時,以是(YES)進行至步驟S70。於檢查之結果不滿足預先決定之條件之情形時,以否(NO)進行至步驟S62。 接著,於步驟S62中,控制裝置對手指(指紋)相接之狀態之指紋識別電子零件74判斷檢查是否未滿2次。於第1次之情形時,以是(YES)進行至步驟S64。於第2次之情形時,以否(NO)進行至步驟S70。 接著,於步驟S64中,控制裝置於將導電構件56重新抵壓於指紋識別電子零件74之檢測部78之期間,使檢查部10處於待機狀態。控制裝置使測定機器人20將導電構件56重新抵壓於指紋識別電子零件74之檢測部78(步驟S66)。接著,確認檢查結束並復位至步驟S50。 接著,於步驟S70中,控制裝置判斷是否有下一個要測試之指紋識別電子零件74。若有下一個指紋識別電子零件74,以是(YES)復位至步驟S10,反復進行檢查。若無下一個指紋識別電子零件74,以否(NO)結束檢查。 藉由執行上述步驟,控制裝置可判斷檢查對象之指紋識別電子零件74是否正常。另,於上述步驟中,於檢查之結果不滿足預先決定之條件之情形時,將重新檢查設為不滿2次,但重新檢查不限定於不滿2次,亦可為例如進行2次以上之再檢查。 於本實施形態中,如圖1所示,於檢查部10之上方設置有與測定機器人20相同之第1測定機器人22及第2測定機器人24。第1測定機器人22及第2測定機器人24各自將第1載置部64及第3載置部70之檢查前之指紋識別電子零件74以抵接於檢查部10之檢查用插座14之方式放入而進行檢查。 又,取出檢查用插座14內之檢查結束之指紋識別電子零件74且分別移送至第2載置部66及第4載置部72。第2載置部66及第4載置部72藉由回收機器人92之回收側機器人手單元96取出檢查結束之指紋識別電子零件74,且藉由回收側機器人手單元96將檢查結束之指紋識別電子零件74移送至回收托盤86。 於回收托盤86,設置有用以載置至少1個檢查結束之指紋識別電子零件74之至少1個載置部。藉由回收機器人92之回收側機器人手單元96基於檢查之結果將檢查結束之指紋識別電子零件74移送至載置部並進行分類而加以存放。控制裝置控制調整各裝置之動作而執行自動化之檢查,而達成提高生產效率之實用效果。 根據本實施形態,若第1檢查之結果不滿足預先決定之條件,可不實施第2檢查而繼續搬送。藉此,可對一個指紋識別電子零件74同時且連續地進行不同之檢查,從而提升處理能力(UPH)。 另,測定機器人20亦可具備與按壓保持部34不同構造之第2保持部。據此,可具備專門用於檢查環境之保持部。例如,可將按壓保持部34設為搬送專用,將第2保持部設為按壓、檢查用。 又,按壓保持部34可具備於指紋比對時代替手指之指紋圖案而使用之導電構件56。第2保持部可不具備導電構件56。據此,可具備專門用於檢查環境之第2保持部。 (第2實施形態) 圖5係顯示本實施形態之測定機器人26之構造之模式前視圖。圖6係顯示本實施形態之測定機器人28之構造之模式前視圖。圖7係顯示本實施形態之IC處理器之構造之模式俯視圖。 本實施形態之IC處理器與第1實施形態之不同點在於具備:作為第1保持部之第1按壓保持部35,及作為與第1按壓保持部35不同之構造之第2保持部之第2按壓保持部37。以下,對與第1實施形態相同之構成構件標註相同符號,此處省略或簡化該等之說明。 本實施形態之IC處理器具備:第1按壓保持部35,其可保持指紋識別電子零件74;及第2按壓保持部37,其可保持指紋識別電子零件74,且為與第1按壓保持部35不同之構造。第1按壓保持部35係將指紋識別電子零件74搬送至檢查用插座14而載置於檢查用插座14。第2按壓保持部37係於第1按壓保持部35將指紋識別電子零件74載置於檢查用插座14後,按壓指紋識別電子零件74而進行特定之檢查。 於本實施形態中,於檢查部10之上方設置有第1測定機器人26及第2測定機器人28。 於測定機器人26、28設置有至少向一方向位移之按壓保持部35、37。按壓保持部35、37進行指紋識別電子零件74對檢查用插座14之取放,且抵接於檢查用插座14內之指紋識別電子零件74之非檢測部位。於本實施形態中,於測定機器人26、28設置有向第1方向、第2方向(例如Z方向、Y方向)位移之移送裝置32。於移送裝置32安裝有按壓保持部35、37。按壓保持部35、37之一端安裝於移送裝置32之底部,於另一端設置有按壓轉移構件36且抵接於指紋識別電子零件74之非檢測部位。於按壓轉移構件36之底面設置有複數個吸附部38而進行指紋識別電子零件74之取放。 於第2測定機器人28,於第2按壓保持部37之另一端設置有抵壓部52。將安裝於抵壓部52之底面之導電構件56抵壓於指紋識別電子零件74之檢測部78。 於第1測定機器人26,於第1按壓保持部35之另一端,於抵壓部52之底面不設置導電構件。第1測定機器人26之第1按壓保持部35不抵接於指紋識別電子零件74之檢測部78。 本實施形態之指紋識別電子零件74如圖7所示,按照箭頭A、箭頭B、及箭頭C之路徑被搬送。具體而言,於執行手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態之檢查後,第1測定機器人26將指紋識別電子零件74留在檢查用插座14,而與指紋識別電子零件74隔開。第2測定機器人28使按壓轉移構件36抵接於指紋識別電子零件74。第2測定機器人使抵壓部52及導電構件56向下方位移,藉由導電構件56接觸並按壓指紋識別電子零件74之檢測部78,藉由導電構件56進行靜電放電,於檢查部10之檢查用插座14內執行手指(指紋)與指紋識別電子零件74之檢測部78相接之狀態之檢查。 於藉由第2測定機器人28之第2按壓保持部37取出檢查結束之指紋識別電子零件74後,第2梭子68之第4載置部72沿著X方向位移至檢查部10之另一側。第2測定機器人28藉由移送裝置32驅動第2按壓保持部37及檢查結束之指紋識別電子零件74而使其等向Y方向位移,將檢查結束之指紋識別電子零件74移送至第4載置部72之上方。藉由移送裝置32進一步使第2按壓保持部37向Z方向位移,而將檢查結束之指紋識別電子零件74配置於第2梭子68之第4載置部72,藉由第4載置部72取出檢查結束之指紋識別電子零件74。 另,指紋識別電子零件74之搬送路徑亦可自第2梭子68側開始搬送。 又,第2按壓保持部37亦可具備進行電性檢查之端子。據此,可具備專門用於檢查環境之第2按壓保持部37。 (第3實施形態) 圖8係顯示本實施形態之測定機器人30之構造之模式前視圖。圖9係顯示本實施形態之IC處理器之構造之模式俯視圖。 本實施形態之IC處理器與第2實施形態之不同點在於:作為第2保持部之第2按壓保持部39不具備吸附機構。以下,對與第2實施形態相同之構成構件標註相同符號,此處省略或簡化該等之說明。 本實施形態之IC處理器之第1按壓保持部35具備吸附機構,第2按壓保持部39不具備吸附機構。據此,可具備專門用於檢查環境之第2按壓保持部39。 於本實施形態中,於檢查部10之上方設置有第1測定機器人26及第2測定機器人30。 於第2測定機器人30,於第2按壓保持部39之另一端設置有抵壓部52。安裝於抵壓部52之底面之導電構件56抵壓於指紋識別電子零件74之檢測部78。 本實施形態之指紋識別電子零件74如圖9所示,按照箭頭D、箭頭E、箭頭F及箭頭G之路徑被搬送。具體而言,於執行手指(指紋)與指紋識別電子零件74之檢測部78未相接之狀態之檢查後,第1測定機器人26將指紋識別電子零件74留在檢查用插座14,而與指紋識別電子零件74隔開。第2測定機器人30使抵壓部52及導電構件56向下方位移,藉由導電構件56接觸並按壓指紋識別電子零件74之檢測部78,藉由導電構件56進行靜電放電,於檢查部10之檢查用插座14內執行手指(指紋)與指紋識別電子零件74之檢測部78相接之狀態之檢查。 接著,於執行手指(指紋)與指紋識別電子零件74之檢測部78相接之狀態之檢查後,第2測定機器人30將指紋識別電子零件74留在檢查用插座14,而與指紋識別電子零件74隔開。第1測定機器人26使按壓轉移構件36抵接於指紋識別電子零件74。於第1測定機器人26取出檢查結束之指紋識別電子零件74後,第1梭子62之第2載置部66沿著X方向朝檢查部10之另一側位移。第1測定機器人26藉由移送裝置32驅動第1按壓保持部35及檢查結束之指紋識別電子零件74而使其等向Y方向位移,而將檢查結束之指紋識別電子零件74移送至第2載置部66之上方。 藉由移送裝置32進一步使第1按壓保持部35向Z方向位移,將檢查結束之指紋識別電子零件74配置於第1梭子62之第2載置部66,且藉由第2載置部66取出檢查結束之指紋識別電子零件74。 另,指紋識別電子零件74之搬送路徑可自第2梭子68側開始搬送。 又,第2按壓保持部39可具備進行電性檢查之端子。據此,可具備專門用於檢查環境之第2按壓保持部39。 根據本實施形態,可具備專門用於檢查環境之第2按壓保持部39。藉此,可因應不同形狀之指紋識別電子零件74之檢查。又,即便為第2按壓保持部39無法吸附指紋識別電子零件74之構造,亦可利用將指紋識別電子零件74載置於檢查用插座14之第1按壓保持部35搬送指紋識別電子零件74。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the drawings used are appropriately enlarged or reduced in order to make the description part recognizable. (First Embodiment) FIG. 1 is a schematic plan view showing the structure of an IC processor according to this embodiment, and it is a diagram showing an electronic component transfer including a transfer unit having a fingerprint identification electronic component 74 that can be transferred as an electronic component of this embodiment. An example of the device using an IC processor as an electronic component inspection device. The IC processor of this embodiment includes a supply tray 82, a recovery tray 86, an inspection unit 10, a measurement robot 20, a supply robot 90, a recovery robot 92, and a control device (not shown) on the base 80. The supply tray 82 is provided with at least one cavity (not shown) for placing at least one fingerprint identification electronic component 74 to be inspected. The supply-side robot hand unit 94 of the supply robot 90 takes out the fingerprint identification electronic component 74 from the bag portion and transfers it to the shuttles 62 and 68. The fingerprint identification electronic component 74 includes a detection unit 78 that detects a physical action. The physical action means, for example, at least any one of light, charge, pressure, sound, temperature, vibration, electric field change, and magnetic field change. The inspection section 10 is provided with an inspection circuit board 12 (see FIG. 2) having an inspection socket 14 as at least one placement section. The inspection unit 10 inspects the fingerprint identification electronic component 74. At least one mounting portion on which the fingerprint identification electronic component 74 is mounted is provided on the shuttles 62 and 68. In the present embodiment, a first placement section 64 and a third placement section 70 for placing fingerprint identification electronic components 74 before inspection are provided on the supply robot 90 side of the inspection section 10. On the recovery robot 92 side of the inspection unit 10, a second placement unit 66 and a fourth placement unit 72 for placing the fingerprint identification electronic component 74 that has been inspected are placed. The first placing section 64 and the third placing section 70 put the fingerprint identification electronic parts 74 before the inspection by the supply-side robot hand unit 94 of the supply robot 90, and transfer the fingerprint identification electronic parts 74 before the inspection to the inspection section. 10 sides. FIG. 2 is a schematic front view showing the structure of the measurement robot 20 according to this embodiment. The measurement robot 20 is provided with a pressing and holding portion 34 that is displaced at least in one direction. The holding portion 34 is pressed to put the fingerprint identification electronic component 74 into or from the inspection socket 14, and the fingerprint identification electronic component 74 is brought into contact with the inspection socket 14. Further, a pressing measurement member 48 is provided in the pressing holding portion 34 so as to be displaceable, and abuts on the detecting portion 78 of the fingerprint identification electronic component 74. The conveyance section of this embodiment includes a pressing and holding section 34 as a first holding section capable of holding the fingerprint identification electronic component 74. The electronic component transfer device may be provided with an inspection unit 10 that performs a first inspection of the fingerprint identification electronic component 74 and a second inspection different from the first inspection. When the inspection unit 10 performs the first inspection on the fingerprint identification electronic component 74 and when the result of the first inspection satisfies a predetermined condition, the inspection unit 10 performs the second inspection on the fingerprint identification electronic component 74 that has undergone the first inspection. When the result of the first inspection does not satisfy the predetermined conditions, the inspection unit 10 does not perform the second inspection on the fingerprint identification electronic parts 74 that have been subjected to the first inspection, and other fingerprint identification electronic parts 74 that have not undergone the first inspection. Perform the first inspection. The predetermined condition in this embodiment means that a defect (defect) of the fingerprint identification electronic component 74 is eliminated by executing an inspection program that performs an inspection operation on the fingerprint identification electronic component 74. The IC processor according to this embodiment includes a pressing holding portion 34 capable of holding the fingerprint identification electronic component 74 and an inspection portion 10 that performs a first inspection and a second inspection different from the first inspection on the fingerprint identification electronic component 74. At least one of the first inspection and the second inspection may be performed a plurality of times. Accordingly, a correct inspection can be performed. For example, in the case of conducting multiple inspections, it is possible to comprehensively determine whether they have passed or failed. The first inspection is an inspection in which no physical action is applied to the fingerprint identification electronic component 74. The second inspection is an inspection that exerts a physical action on the fingerprint identification electronic component 74. According to this, it is possible to perform an inspection that exerts a physical effect on the fingerprint identification electronic component 74. The physical effect may be at least any of light and charge. This makes it easy to perform a physical inspection. The first inspection is an inspection of a state where the finger (fingerprint) and the detection section 78 of the fingerprint identification electronic component 74 are not connected. The second inspection is an inspection of the state where the finger (fingerprint) is in contact with the detection section 78 of the fingerprint identification electronic component 74. According to this, the state where the finger (fingerprint) is not connected to the detection part 78 of the fingerprint identification electronic component 74 and the state where the finger (fingerprint) is connected can be checked. The inspection unit 10 is provided with an inspection circuit board 12 having at least one inspection socket 14 and an inspection fingerprint identification electronic component 74. In the present embodiment, a plurality of probes 18 electrically connected to the inspection circuit board 12 are disposed in the inspection socket 14 and electrically connected to an electrical connector 76 of the fingerprint identification electronic component 74. The electrical connector 76 may be a solder ball or a connection pin. The measurement robot 20 is provided with a pressing and holding portion 34 that is displaced in at least one direction. The holding portion 34 is pressed to pick up and place the fingerprint identification electronic component 74 on the inspection socket 14, and abut the non-detected portion of the fingerprint identification electronic component 74 in the inspection socket 14. In the present embodiment, the measurement robot 20 is provided with a transfer device 32 that moves in a first direction and a second direction (for example, the Z direction and the Y direction). A pressing and holding portion 34 is attached to the transfer device 32. One end of the pressing and holding portion 34 is mounted on the bottom of the transfer device 32. A pressing transfer member 36 is provided at the other end and abuts on a non-detection portion of the fingerprint identification electronic component 74. A plurality of suction portions 38 are provided on the bottom surface of the pressing transfer member 36 to pick and place the fingerprint identification electronic parts 74. The suction unit 38 is connected to a suction pump (not shown) through the suction unit 61. A storage space 40 is provided inside the pressing and holding portion 34. A through hole 42 is formed in the bottom surface of the storage space 40 and penetrates to the pressing transfer member 36. The measurement robot 20 is provided with a pressure measurement member 48 that is displaceable in the pressure holding portion 34. A pressing portion 52 is provided below the pressing measurement member 48. A conductive member 56 as a fingerprint substitute member is provided below the pressing portion 52. The conductive member 56 is in contact with the detection portion 78 of the fingerprint identification electronic component 74. The conductive member 56 is a member that is used instead of a fingerprint pattern of a finger when performing fingerprint comparison. In this embodiment, the pressing measurement member 48 provided with the elastic member is arranged in the storage space 40 of the pressing holding portion 34. A flange 50 is provided at one end of the pressing measurement member 48. An elastic member, which is a tensile spring 54, is provided between the pressing measurement member 48 and the upper surface of the inside of the air chamber 44. The spring 54 elastically returns the pressing measurement member 48 upward in the Z direction. The conductive member 56 (in this embodiment, the conductive member 56 may be a conductive plastic sheet) attached to the bottom surface of the pressing portion 52 performs electrostatic discharge. In addition, a pressing portion 52 inserted into the through hole 42 is provided at the other end of the pressing measurement member 48. The conductive member 56 mounted on the bottom surface of the pressing portion 52 is pressed against the detection portion 78 of the fingerprint identification electronic component 74. Further, at least one driving structure that drives the pressing measurement member 48 to displace the pressing measurement member 48 in the Z direction is provided in the pressing holding portion 34. In this embodiment, in the driving structure, an air chamber 44 is provided above one end of the pressure measurement member 48 and communicates with at least one vent 46. The air in the air chamber 44 is pressurized, and the pressing measurement member 48 is pressed in the Z direction to be displaced downward. The air chamber 44 is configured to prevent the pressurized air of the air chamber 44 from leaking by using the sealing member 59. In this embodiment, a first shuttle 62 is provided on one side of the inspection unit 10 and is displaced in the third direction (for example, the X direction). On the supply robot 90 side of the first shuttle 62, at least one first placement portion 64 is provided to place the fingerprint identification electronic component 74 before inspection. Further, at least one second mounting portion 66 of the fingerprint identification electronic component 74 on which the inspection is completed is provided on the recovery robot 92 side of the first shuttle 62. On the other side of the inspection section 10, a second shuttle 68 that is displaced in the third direction is provided. On the supply robot 90 side of the second shuttle 68, there is provided at least one third mounting portion 70 for placing fingerprint identification electronic parts 74 before inspection. In addition, at least one fourth placement portion 72 of the fingerprint identification electronic component 74 on which the inspection is completed is provided on the recovery robot 92 side of the second shuttle 68. In use, the first mounting portion 64 of the first shuttle 62 places the fingerprint identification electronic component 74 before the inspection, and moves it in the X direction, and moves the fingerprint identification electronic component 74 before the inspection to one side of the inspection portion 10. The transfer device 32 of the measurement robot 20 drives the pressure holding portion 34 and the measurement member 48 to displace the same in the Y direction. The transfer device 32 positions the pressing and holding portion 34 above the first placing portion 64. The pressing and holding portion 34 is further driven by the transfer device 32 to be displaced in the Z direction. The non-detection portion of the fingerprint identification electronic component 74 is contacted and attracted by the adsorption portion 38 of the pressing holding portion 34. In addition, the fingerprint identification electronic component 74 before inspection is taken out from the first mounting portion 64 of the first shuttle 62. After the pressing and holding part 34 of the measurement robot 20 takes out the fingerprint identification electronic part 74 before the inspection, the pressing and holding part 34 and the fingerprint identification electronic part 74 before the inspection are driven by the transfer device 32 of the measurement robot 20 so as to make the Y direction Displacement. The fingerprint recognition electronic component 74 before the inspection is positioned above the inspection socket 14 of the inspection section 10 by the transfer device 32. The transfer device 32 further drives the pressing and holding portion 34 in the Z direction to displace it downward. As shown in FIG. 2, the pressing and holding portion 34 disposes the fingerprint identification electronic component 74 before the inspection in the inspection socket 14. The pressing holding portion 34 causes the pressing transfer member 36 to abut against the fingerprint identification electronic component 74. By pressing the holding portion 34, the electrical connector 76 of the fingerprint identification electronic component 74 is reliably brought into contact with the probe 18 of the inspection socket 14. The pressing transfer member 36 of the pressing holding portion 34 abuts on a non-detection portion of the fingerprint identification electronic component 74. Since the pressing of the transfer member 36 does not affect the detection section 78 of the fingerprint identification electronic component 74, the first inspection of the finger (fingerprint) and the detection section 78 of the fingerprint identification electronic component 74 can be performed in the inspection socket 14. Inspection of the contact state (state where the conductive member 56 is not in contact with the detection section 78). The inspection socket 14 sends inspection data to a controller (not shown) via the inspection circuit board 12. FIG. 3 is a schematic front view showing the structure of the measurement robot 20 according to this embodiment. As shown in FIG. 3, the measurement robot 20 performs a check that the finger (fingerprint) is not connected to the detection section 78 of the fingerprint identification electronic component 74, and then injects air into the air chamber 44 through the vent 46. Next, the air in the air chamber 44 is pressurized, and the pressure measurement member 48 is pressed in the Z direction by the pressure of the pressurized air in the air chamber 44 to be displaced downward. The pressing measurement member 48 moves the pressing portion 52 and the conductive member 56 downward in the through hole 42 of the pressing holding portion 34 until the flange 50 abuts the pressing holding portion 34, or the conductive member 56 and the fingerprint identification electronic component 74. The detection section 78 comes into contact. When the conductive member 56 contacts and presses the detection portion 78 of the fingerprint identification electronic component 74, the conductive member 56 performs electrostatic discharge. The inspection of the state where the finger (fingerprint) as the second inspection is connected to the detection unit 78 of the fingerprint identification electronic component 74 (the state where the conductive member 56 is connected to the detection unit 78) is performed in the inspection socket 14 of the inspection unit 10. After the inspection is completed, the measurement robot 20 first exhausts the air in the air chamber 44 through the air vent 46. Since the pressing measurement member 48 is not subjected to external force from the air in the air chamber 44, it can be displaced upward in the Z direction by the reset spring force of the tension spring 54 to drive the conductive member 56 to detect the electronic component 74 from the fingerprint. Department 78 left. The fingerprint recognition electronic component 74 is still held by the holding portion 38 of the pressing holding portion 34. Therefore, when the pressing holding portion 34 is driven in the Z direction by the transfer device 32 and moved upward, the holding portion 34 can be pressed. The suction section 38 sucks the fingerprint-identifying electronic component 74 after the inspection and removes it from the inspection socket 14 of the inspection section 10. After the fingerprint recognition electronic component 74 whose inspection is completed is taken out by the pressing and holding portion 34 of the measurement robot 20, the fourth placement portion 72 of the second shuttle 68 is displaced in the X direction toward the other side of the inspection portion 10. The measurement robot 20 drives the holding unit 34 and the fingerprint recognition electronic component 74 after the inspection to move in the Y direction by the transfer device 32, and transfers the fingerprint recognition electronic component 74 after the inspection to the fourth mounting portion 72. The transfer holding device 34 further moves the pressing and holding portion 34 in the Z direction, and the fingerprint identification electronic component 74 after the inspection is disposed on the fourth placement portion 72 of the second shuttle 68, and the inspection is taken out by the fourth placement portion 72 The finished fingerprint identification electronic part 74. FIG. 4 is a flowchart showing the inspection steps of the IC processor in this embodiment. First, in step S10, the control device places the fingerprint identification electronic component 74 on the inspection socket 14. Next, in step S20, the control device performs an inspection on the fingerprint identification electronic part 74 in a state where the finger (fingerprint) is not connected (a state where the conductive member 56 and the detection section 78 are not connected). Next, in step S30, the control device judges whether the fingerprint (fingerprint) is not connected with the fingerprint identification electronic component 74 to end the inspection normally. When the result of the inspection satisfies a predetermined condition, the process proceeds to step S40 with YES. When the result of the inspection does not satisfy a predetermined condition, the process proceeds to NO in step S32. Next, in step S32, the control device judges whether the fingerprint identification electronic part 74 in a state where the finger (fingerprint) is not connected is not checked twice. If it is the first time, go to step S34 with YES. If it is the second time, proceed to step S70 with NO. Next, in step S34, the control device keeps the inspection unit 10 in a standby state while the fingerprint identification electronic component 74 placed in the inspection socket 14 is re-mounted. The control device causes the measurement robot 20 to reposition the fingerprint identification electronic component 74 placed on the inspection socket 14 (step S36). Next, it is confirmed that the inspection is completed and the process returns to step S20. Next, in step S40, the control device puts the inspection unit 10 in a standby state while changing the inspection environment. The control device causes the measurement robot 20 to change the inspection environment (step S42). Specifically, the measurement robot 20 presses the conductive member 56 mounted on the bottom surface of the pressing portion 52 against the detecting portion 78 of the fingerprint identification electronic component 74. Next, in step S50, the control device performs an inspection on the fingerprint identification electronic part 74 in a state where the finger (fingerprint) is in contact (a state where the conductive member 56 is in contact with the detection section 78). Next, in step S60, the control device judges whether the fingerprint identification electronic part 74 in a state where the fingers (fingerprints) are in contact has ended the inspection normally. When the result of the inspection satisfies a predetermined condition, the process proceeds to step S70 with YES. When the result of the inspection does not satisfy a predetermined condition, the process proceeds to NO in step S62. Next, in step S62, the control device judges whether the fingerprint identification electronic part 74 in the state where the finger (fingerprint) is connected is not checked twice. In the first case, the process proceeds to step S64 with YES. In the second case, proceed to step S70 with NO. Next, in step S64, the control device keeps the inspection unit 10 in a standby state while the conductive member 56 is pressed against the detection unit 78 of the fingerprint identification electronic component 74 again. The control device causes the measurement robot 20 to press the conductive member 56 again against the detection section 78 of the fingerprint identification electronic component 74 (step S66). Next, it is confirmed that the inspection is completed and the process returns to step S50. Next, in step S70, the control device determines whether there is a fingerprint identification electronic part 74 next to be tested. If there is the next fingerprint identification electronic component 74, the process returns to step S10 with YES, and the inspection is repeated. If there is no next fingerprint identification electronic part 74, the inspection is ended with NO. By executing the above steps, the control device can determine whether the fingerprint identification electronic part 74 of the inspection object is normal. In addition, in the above steps, when the result of the inspection does not satisfy the pre-determined conditions, the re-inspection is set to be less than two times, but the re-inspection is not limited to two times. an examination. In this embodiment, as shown in FIG. 1, a first measurement robot 22 and a second measurement robot 24 similar to the measurement robot 20 are provided above the inspection unit 10. The first measurement robot 22 and the second measurement robot 24 each place the fingerprint identification electronic component 74 before the inspection of the first placement section 64 and the third placement section 70 so as to abut the inspection socket 14 of the inspection section 10. Check in. In addition, the fingerprint identification electronic component 74 that has completed the inspection in the inspection socket 14 is taken out and transferred to the second placement portion 66 and the fourth placement portion 72, respectively. The second placing portion 66 and the fourth placing portion 72 take out the fingerprint identification electronic parts 74 that have been inspected by the collection-side robot hand unit 96 of the collection robot 92, and recognize the fingerprints that have finished the inspection by the collection-side robot hand unit 96 The electronic parts 74 are transferred to the collection tray 86. At least one mounting portion for placing at least one fingerprint identification electronic component 74 on which the inspection is completed is provided on the recovery tray 86. The collection-side robot hand unit 96 of the collection robot 92 transfers the fingerprint identification electronic parts 74 that have been inspected to the placement section based on the inspection results, sorts them, and stores them. The control device controls and adjusts the operation of each device to perform automatic inspection, thereby achieving the practical effect of improving production efficiency. According to this embodiment, if the result of the first inspection does not satisfy a predetermined condition, the second inspection can be continued without carrying out the transportation. Thereby, different inspections can be performed on one fingerprint identification electronic part 74 simultaneously and continuously, thereby improving the processing capacity (UPH). The measurement robot 20 may include a second holding portion having a structure different from that of the pressing holding portion 34. Accordingly, it is possible to provide a holding unit for inspecting the environment. For example, the pressing and holding portion 34 may be used exclusively for conveyance, and the second holding portion may be used for pressing and inspection. Further, the pressing and holding portion 34 may be provided with a conductive member 56 which is used instead of the fingerprint pattern of the finger during fingerprint comparison. The second holding portion may not include the conductive member 56. Accordingly, it is possible to provide a second holding unit for inspecting the environment. (Second Embodiment) Fig. 5 is a schematic front view showing the structure of the measurement robot 26 according to this embodiment. FIG. 6 is a schematic front view showing the structure of the measurement robot 28 according to this embodiment. FIG. 7 is a schematic plan view showing the structure of the IC processor of this embodiment. The IC processor of this embodiment differs from the first embodiment in that it includes a first pressing and holding section 35 as a first holding section and a second holding section as a second holding section having a structure different from the first pressing and holding section 35. 2Press the holding portion 37. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified here. The IC processor according to this embodiment includes a first pressing and holding section 35 that can hold the fingerprint identification electronic component 74, and a second pressing and holding section 37 that can hold the fingerprint identification electronic component 74 and is the same as the first pressing and holding section 35 different constructions. The first pressing and holding unit 35 conveys the fingerprint identification electronic component 74 to the inspection socket 14 and places it on the inspection socket 14. The second pressing and holding unit 37 is a first inspection and holding unit 35 that places the fingerprint identification electronic component 74 on the inspection socket 14 and presses the fingerprint identification electronic component 74 to perform a specific inspection. In the present embodiment, a first measurement robot 26 and a second measurement robot 28 are provided above the inspection unit 10. The measurement robots 26 and 28 are provided with pressing and holding portions 35 and 37 that are displaced at least in one direction. The holding portions 35 and 37 are pressed to pick and place the fingerprint identification electronic component 74 from the inspection socket 14 and abut the non-detection portion of the fingerprint identification electronic component 74 in the inspection socket 14. In the present embodiment, the measurement robots 26 and 28 are provided with a transfer device 32 that is displaced in the first direction and the second direction (for example, the Z direction and the Y direction). The holding devices 35 and 37 are attached to the transfer device 32. One end of the pressing holding portions 35 and 37 is mounted on the bottom of the transfer device 32, and the other side is provided with a pressing transfer member 36 and abuts on a non-detection portion of the fingerprint identification electronic component 74. A plurality of suction portions 38 are provided on the bottom surface of the pressing transfer member 36 to pick and place the fingerprint identification electronic component 74. In the second measurement robot 28, a pressing portion 52 is provided at the other end of the second pressing and holding portion 37. The conductive member 56 mounted on the bottom surface of the pressing portion 52 is pressed against the detecting portion 78 of the fingerprint identification electronic component 74. In the first measurement robot 26, a conductive member is not provided on the bottom surface of the pressing portion 52 at the other end of the first pressing and holding portion 35. The first pressing and holding portion 35 of the first measurement robot 26 does not contact the detection portion 78 of the fingerprint identification electronic component 74. As shown in FIG. 7, the fingerprint identification electronic component 74 of this embodiment is transported along the paths of arrows A, B, and C. Specifically, after the inspection of the state where the finger (fingerprint) is not connected to the detection section 78 of the fingerprint identification electronic component 74 is performed, the first measurement robot 26 leaves the fingerprint identification electronic component 74 in the inspection socket 14 to communicate with the fingerprint. The identification electronic parts 74 are separated. The second measurement robot 28 abuts the pressing transfer member 36 on the fingerprint identification electronic component 74. The second measuring robot displaces the pressing portion 52 and the conductive member 56 downward, contacts the conductive member 56 and presses the detection portion 78 of the fingerprint identification electronic component 74, performs electrostatic discharge through the conductive member 56, and inspects the inspection portion 10. A check of the state where a finger (fingerprint) is in contact with the detection section 78 of the fingerprint identification electronic component 74 is performed in the socket 14. After the fingerprint identification electronic component 74 that has been inspected is taken out by the second pressing and holding portion 37 of the second measurement robot 28, the fourth placement portion 72 of the second shuttle 68 is moved to the other side of the inspection portion 10 in the X direction . The second measurement robot 28 drives the second pressing and holding portion 37 and the fingerprint identification electronic component 74 after the inspection to move in the Y direction by the transfer device 32, and transfers the fingerprint identification electronic component 74 after the inspection to the fourth placement. Above the section 72. The second pressing and holding portion 37 is further displaced in the Z direction by the transfer device 32, and the fingerprint identification electronic component 74 after the inspection is disposed on the fourth placing portion 72 of the second shuttle 68, and the fourth placing portion 72 Take out the fingerprint identification electronic part 74 after the inspection. The transport path of the fingerprint identification electronic component 74 may be transported from the second shuttle 68 side. In addition, the second pressing and holding portion 37 may be provided with a terminal for performing electrical inspection. According to this, it is possible to provide the second pressing and holding portion 37 for inspecting the environment. (Third Embodiment) Fig. 8 is a schematic front view showing the structure of a measurement robot 30 according to this embodiment. FIG. 9 is a schematic plan view showing the structure of the IC processor of this embodiment. The difference between the IC processor of this embodiment and the second embodiment is that the second pressing and holding portion 39 as the second holding portion does not include a suction mechanism. Hereinafter, the same components as those in the second embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified. The first pressing and holding portion 35 of the IC processor of this embodiment includes a suction mechanism, and the second pressing and holding portion 39 does not include a suction mechanism. According to this, it is possible to provide the second pressing and holding unit 39 for inspecting the environment. In the present embodiment, a first measurement robot 26 and a second measurement robot 30 are provided above the inspection unit 10. In the second measurement robot 30, a pressing portion 52 is provided at the other end of the second pressing and holding portion 39. The conductive member 56 mounted on the bottom surface of the pressing portion 52 is pressed against the detection portion 78 of the fingerprint identification electronic component 74. As shown in FIG. 9, the fingerprint identification electronic component 74 of this embodiment is transported along the paths of the arrows D, E, F, and G. Specifically, after the inspection of the state where the finger (fingerprint) is not connected to the detection section 78 of the fingerprint identification electronic component 74 is performed, the first measurement robot 26 leaves the fingerprint identification electronic component 74 in the inspection socket 14 to communicate with the fingerprint. The identification electronic parts 74 are separated. The second measuring robot 30 displaces the pressing portion 52 and the conductive member 56 downward, contacts the conductive member 56 and presses the detection portion 78 of the fingerprint identification electronic component 74, and performs electrostatic discharge through the conductive member 56. The inspection socket 14 performs an inspection of the state where a finger (fingerprint) is in contact with the detection section 78 of the fingerprint identification electronic component 74. Next, after the inspection of the state where the finger (fingerprint) is in contact with the detection section 78 of the fingerprint identification electronic part 74 is performed, the second measurement robot 30 leaves the fingerprint identification electronic part 74 in the inspection socket 14 to identify the electronic part with the fingerprint. 74 separated. The first measurement robot 26 abuts the pressing transfer member 36 on the fingerprint identification electronic component 74. After the first measurement robot 26 takes out the fingerprint recognition electronic component 74 after the inspection, the second mounting portion 66 of the first shuttle 62 is displaced in the X direction toward the other side of the inspection portion 10. The first measurement robot 26 drives the first pressing and holding portion 35 and the fingerprint identification electronic component 74 after the inspection to move in the Y direction by the transfer device 32, and transfers the fingerprint identification electronic component 74 after the inspection to the second stage. Above the portion 66. The first pressing and holding portion 35 is further displaced in the Z direction by the transfer device 32, and the fingerprint identification electronic component 74 after the inspection is disposed on the second placing portion 66 of the first shuttle 62, and the second placing portion 66 Take out the fingerprint identification electronic part 74 after the inspection. The transport path of the fingerprint identification electronic component 74 can be transported from the second shuttle 68 side. The second pressing and holding unit 39 may be provided with a terminal for performing electrical inspection. According to this, it is possible to provide the second pressing and holding unit 39 for inspecting the environment. According to this embodiment, it is possible to include the second pressing and holding portion 39 for inspecting the environment. Thereby, the inspection of the electronic component 74 can be performed according to the fingerprints of different shapes. In addition, even if the second pressing and holding portion 39 cannot absorb the fingerprint identification electronic component 74, the fingerprint identification electronic component 74 can be transported by the first pressing and holding portion 35 that places the fingerprint identification electronic component 74 on the inspection socket 14.

10‧‧‧檢查部10‧‧‧ Inspection Department

12‧‧‧檢查用電路板12‧‧‧ Inspection circuit board

14‧‧‧檢查用插座14‧‧‧ Inspection socket

18‧‧‧探針18‧‧‧ Probe

20‧‧‧測定機器人20‧‧‧Determination robot

22‧‧‧第1測定機器人22‧‧‧The first measurement robot

24‧‧‧第2測定機器人24‧‧‧The second measurement robot

26‧‧‧第1測定機器人26‧‧‧The first measurement robot

28‧‧‧第2測定機器人28‧‧‧The second measurement robot

30‧‧‧第1測定機器人30‧‧‧The first measurement robot

32‧‧‧移送裝置32‧‧‧ transfer device

34‧‧‧按壓保持部34‧‧‧Press and hold

35‧‧‧第1按壓保持部35‧‧‧The first pressing and holding part

36‧‧‧按壓轉移構件36‧‧‧Press the transfer member

37‧‧‧第2按壓保持部37‧‧‧ 2nd press holding part

38‧‧‧吸附部38‧‧‧ Adsorption Department

39‧‧‧第2按壓保持部39‧‧‧ 2nd press holding part

40‧‧‧收納空間40‧‧‧Storage space

42‧‧‧貫通孔42‧‧‧through hole

44‧‧‧空氣室44‧‧‧ air chamber

46‧‧‧通氣口46‧‧‧Vent

48‧‧‧按壓測定構件48‧‧‧Press the measurement member

50‧‧‧凸緣50‧‧‧ flange

52‧‧‧抵壓部52‧‧‧Relief section

54‧‧‧彈簧54‧‧‧Spring

56‧‧‧導電構件56‧‧‧ conductive members

59‧‧‧密封構件59‧‧‧sealing member

61‧‧‧吸引管61‧‧‧Suction tube

62‧‧‧第1梭子62‧‧‧The first shuttle

64‧‧‧第1載置部64‧‧‧ the first placement section

66‧‧‧第2載置部66‧‧‧ 2nd placement section

68‧‧‧第2梭子68‧‧‧ 2nd shuttle

70‧‧‧第3載置部70‧‧‧ 3rd placement section

72‧‧‧第4載置部72‧‧‧ 4th placement section

74‧‧‧指紋識別電子零件74‧‧‧Fingerprint identification electronic parts

76‧‧‧電連接器76‧‧‧electrical connector

78‧‧‧檢測部78‧‧‧Testing Department

80‧‧‧基底80‧‧‧ substrate

82‧‧‧供給托盤82‧‧‧Supply Tray

86‧‧‧回收托盤86‧‧‧Recycling tray

90‧‧‧供給機器人90‧‧‧ supply robot

92‧‧‧回收機器人92‧‧‧Recycling robot

94‧‧‧供給側機器人手單元94‧‧‧ supply side robot hand unit

96‧‧‧回收側機器人手單元96‧‧‧Recycling robot hand unit

A‧‧‧箭頭A‧‧‧arrow

B‧‧‧箭頭B‧‧‧ Arrow

C‧‧‧箭頭C‧‧‧ Arrow

D‧‧‧箭頭D‧‧‧ Arrow

E‧‧‧箭頭E‧‧‧Arrow

F‧‧‧箭頭F‧‧‧ Arrow

G‧‧‧箭頭G‧‧‧ Arrow

S10‧‧‧步驟S10‧‧‧step

S20‧‧‧步驟S20‧‧‧step

S30‧‧‧步驟S30‧‧‧step

S32‧‧‧步驟S32‧‧‧step

S34‧‧‧步驟S34‧‧‧step

S36‧‧‧步驟S36‧‧‧step

S40‧‧‧步驟S40‧‧‧step

S42‧‧‧步驟S42‧‧‧step

S50‧‧‧步驟S50‧‧‧step

S60‧‧‧步驟S60‧‧‧step

S62‧‧‧步驟S62‧‧‧step

S64‧‧‧步驟S64‧‧‧step

S66‧‧‧步驟S66‧‧‧step

S70‧‧‧步驟S70‧‧‧step

X‧‧‧方向X‧‧‧ direction

Y‧‧‧方向Y‧‧‧ direction

Z‧‧‧方向Z‧‧‧ direction

圖1係顯示第1實施形態之IC處理器之構造之模式俯視圖。 圖2係顯示第1實施形態之測定機器人之構造之模式前視圖。 圖3係顯示第1實施形態之測定機器人之構造之模式前視圖。 圖4係顯示第1實施形態之IC處理器之檢查步驟之流程圖。 圖5係顯示第2實施形態之測定機器人之構造之模式前視圖。 圖6係顯示第2實施形態之測定機器人之構造之模式前視圖。 圖7係顯示第2實施形態之IC處理器之構造之模式俯視圖。 圖8係顯示第3實施形態之測定機器人之構造之模式前視圖。 圖9係顯示第3實施形態之IC處理器之構造之模式俯視圖。FIG. 1 is a schematic plan view showing the structure of the IC processor of the first embodiment. Fig. 2 is a schematic front view showing the structure of the measurement robot according to the first embodiment. Fig. 3 is a schematic front view showing the structure of the measurement robot according to the first embodiment. Fig. 4 is a flowchart showing the inspection procedure of the IC processor of the first embodiment. Fig. 5 is a schematic front view showing the structure of the measurement robot according to the second embodiment. Fig. 6 is a schematic front view showing the structure of a measurement robot according to a second embodiment. Fig. 7 is a schematic plan view showing the structure of the IC processor of the second embodiment. Fig. 8 is a schematic front view showing the structure of a measuring robot according to a third embodiment. FIG. 9 is a schematic plan view showing the structure of the IC processor of the third embodiment.

Claims (11)

一種電子零件搬送裝置,其具有: 搬送部,其可搬送電子零件;及 第1保持部,其可保持上述電子零件;且 可配置對上述電子零件進行第1檢查及與上述第1檢查不同之第2檢查之檢查部; 上述檢查部對上述電子零件進行上述第1檢查, 於上述第1檢查之結果滿足預先決定之條件之情形時,對已進行上述第1檢查之上述電子零件進行上述第2檢查, 於上述第1檢查之結果不滿足上述預先決定之條件之情形時,不對已進行上述第1檢查之上述電子零件進行上述第2檢查,而對未進行上述第1檢查之其他上述電子零件進行上述第1檢查。An electronic component conveying device includes: a conveying section capable of conveying electronic components; and a first holding section capable of retaining the electronic components; and a first inspection of the electronic components and a difference from the first inspection may be arranged. The inspection section of the second inspection; the inspection section performs the first inspection on the electronic parts, and when the result of the first inspection satisfies a predetermined condition, performs the first inspection on the electronic parts that have undergone the first inspection. 2 inspection, when the result of the first inspection does not satisfy the above-mentioned predetermined conditions, the second inspection is not performed on the electronic parts that have undergone the first inspection, and other electronic parts that have not undergone the first inspection The parts are subjected to the first inspection described above. 如請求項1之電子零件搬送裝置,其中上述第1檢查及上述第2檢查中之至少任一者係進行複數次。For example, in the electronic component transfer device of claim 1, at least one of the first inspection and the second inspection is performed a plurality of times. 如請求項1或2之電子零件搬送裝置,其中上述第1檢查為對上述電子零件不施加物理作用之檢查, 上述第2檢查為對上述電子零件施加上述物理作用之檢查。For example, the electronic component transfer device of claim 1 or 2, wherein the first inspection is an inspection that does not exert a physical action on the electronic part, and the second inspection is an inspection that exerts the physical action on the electronic part. 如請求項3之電子零件搬送裝置,其中上述物理作用為光及電荷之至少任一者。The electronic component transfer device according to claim 3, wherein the physical action is at least one of light and electric charge. 如請求項1或2之電子零件搬送裝置,其中上述第1檢查為手指與上述電子零件未相接之狀態之檢查, 上述第2檢查為上述手指與上述電子零件相接之狀態之檢查。For example, the electronic component transfer device of claim 1 or 2, wherein the first inspection is an inspection of a state where a finger is not connected to the electronic component, and the second inspection is an inspection of a state where the finger is connected to the electronic component. 如請求項1或2之電子零件搬送裝置,其中具有與上述第1保持部不同構造之第2保持部。For example, the electronic component transfer device of claim 1 or 2 includes a second holding portion having a structure different from that of the first holding portion. 如請求項6之電子零件搬送裝置,其中上述第1保持部具備於進行指紋比對時代替手指之指紋圖案而使用之指紋代用構件,且 上述第2保持部不具備上述指紋代用構件。For example, the electronic component transfer device according to claim 6, wherein the first holding portion includes a fingerprint replacement member used instead of a fingerprint pattern of a finger when performing fingerprint comparison, and the second holding portion does not include the fingerprint replacement member. 一種電子零件搬送裝置,其具有: 第1保持部,其可保持電子零件;及 第2保持部,其可保持上述電子零件,且為與上述第1保持部不同之構造;且 可配置具有載置上述電子零件之載置部且可對上述電子零件進行檢查之檢查部; 上述第1保持部係將上述電子零件搬送至上述載置部而載置於上述載置部, 上述第2保持部係於上述第1保持部將上述電子零件載置於上述載置部後,按壓上述電子零件並進行特定之檢查。An electronic component conveying device includes: a first holding portion that can hold electronic components; and a second holding portion that can hold the electronic components and has a structure different from that of the first holding portion; An inspection unit that places the mounting part of the electronic part and can inspect the electronic part; the first holding part transports the electronic part to the mounting part and places it on the mounting part, and the second holding part After the electronic component is placed on the placing portion in the first holding portion, the electronic component is pressed and a specific inspection is performed. 如請求項8之電子零件搬送裝置,其中上述第1保持部具有吸附機構,且 上述第2保持部不具有上述吸附機構。According to the electronic component transfer device of claim 8, the first holding portion includes a suction mechanism, and the second holding portion does not include the suction mechanism. 如請求項8或9之電子零件搬送裝置,其中上述第2保持部具有進行電性檢查之端子。For example, the electronic component transfer device of claim 8 or 9, wherein the second holding portion has a terminal for performing an electrical inspection. 一種電子零件檢查裝置,其具有: 搬送部,其可搬送電子零件; 第1保持部,其可保持上述電子零件;及 檢查部,其對上述電子零件進行第1檢查及與上述第1檢查不同之第2檢查;且 上述檢查部係對上述電子零件進行上述第1檢查, 於上述第1檢查之結果滿足預先決定之條件之情形時,對已進行上述第1檢查之上述電子零件進行上述第2檢查, 於上述第1檢查之結果不滿足上述預先決定之條件之情形時,不對已進行上述第1檢查之上述電子零件進行上述第2檢查,而對未進行上述第1檢查之其他上述電子零件進行上述第1檢查。An electronic component inspection device includes: a transporting unit that can transport electronic components; a first holding unit that can hold the electronic components; and an inspection unit that performs a first inspection on the electronic components and is different from the first inspection The second inspection; and the inspection unit performs the first inspection on the electronic parts, and when the result of the first inspection satisfies a predetermined condition, performs the first inspection on the electronic parts that have undergone the first inspection. 2 inspection, when the result of the first inspection does not satisfy the above-mentioned predetermined conditions, the second inspection is not performed on the electronic parts that have undergone the first inspection, and other electronic parts that have not undergone the first inspection The parts are subjected to the first inspection described above.
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