TW201831058A - Package for mounting electrical element, array package and electrical device - Google Patents

Abstract

This package for mounting an electrical element is provided with: a planar substrate (10); and at least one mount (11) that projects from a front surface (10a) of the substrate (10) and has a mounting surface (11a) on which an electrical element is mounted. The substrate (10) and the mount (11) are integrally formed from a ceramic. This package for mounting an electrical element is provided with: a terminal (12a) for elements, which is provided on the mounting surface (11a) of the mount (11); a lateral conductor (13) which is provided on a lateral surface (11b) of the mount (11) and extends in the thickness direction of the mount (11); and a substrate-side via conductor (15a) which is provided within the substrate (10) and extends in the thickness direction of the substrate (10). The terminal (12a) for elements, the lateral conductor (13) and the substrate-side via conductor (15a) are connected to each other.

Description

 Package for mounting an electric component, array package, and electrical device  

The disclosed embodiments relate to an electrical component mounting package, an array package, and an electric device.

Conventionally, as a package for mounting an electric component for mounting an electric component, there is known a package including a metal base that discharges heat to the outside and a ceramic material that is fixed to the metal base with a bonding material such as an adhesive. The sub-mount is mounted on the sub-mount and the electric component is mounted on the sub-carrier (for example, refer to Patent Document 1).

Prior technical literature Patent literature

Patent Document 1 Japanese Patent Laid-Open Publication No. 2014-116514

The package system for mounting an electric component according to the embodiment includes a flat plate-shaped substrate, and one or more pedestals protruding from the surface of the substrate and having a mounting surface on which the electric component is mounted, the substrate and the base The seat is integrally formed of ceramic.

Further, in the array type package of one embodiment of the embodiment, a plurality of the above-described packages for mounting the electric component are connected.

Furthermore, the electric device according to the embodiment of the present invention includes the electrical component mounting package described above, and the electrical component mounted on the mounting surface of the electrical component mounting package.

According to an aspect of the embodiment, it is possible to provide an electrical component mounting package, an array package, and an electric device having high heat dissipation properties.

A1~A17‧‧‧Light-emitting device mounting package

C1‧‧‧Array type package

10‧‧‧Substrate

10a‧‧‧ surface

10b‧‧‧back

10c‧‧‧ditch

10d‧‧‧ end face

10e‧‧‧ side

10f, 10g‧‧‧ recess

11‧‧‧Base

11a‧‧‧Jacketing surface

11b‧‧‧ side

11A‧‧‧1st base

11B‧‧‧2nd base

11C‧‧‧Mixed base

11C1‧‧‧Red hybrid base

11C2‧‧‧Green hybrid base

11C3‧‧‧Blue hybrid base

12a, 12b‧‧‧ component terminals

13‧‧‧Side conductor

14‧‧‧ planar conductor

15a, 15b‧‧‧ substrate side via conductor

16a, 16b‧‧‧Power terminals

16c, 16d‧‧‧ edge

17a, 17b‧‧‧ wiring conductor

18a, 18b‧‧‧terminal side via conductor

19‧‧‧Base side via conductor

20‧‧‧Metal film for sealing

21‧‧‧Metal film

30‧‧‧Lighting elements

30a‧‧‧radiation

31‧‧‧Laser diode

31R‧‧‧Red Laser Diode

31G‧‧‧Green Laser Diode

31B‧‧‧Blue Laser Diode

32, 32R, 32G, 32B‧‧‧ light diode

40‧‧‧ Cover

41‧‧‧ horizontal window

Fig. 1A is a perspective view of a package for mounting an electric component according to the first embodiment.

Fig. 1B is a cross-sectional view taken along the line A-A of Fig. 1A.

Fig. 1C is a cross-sectional view taken along the line B-B of Fig. 1A.

2A is a perspective view of a package for mounting an electric component according to a second embodiment.

Fig. 2B is a cross-sectional view taken along the line C-C of Fig. 2A.

Fig. 2C is a cross-sectional view taken along the line D-D of Fig. 2A.

3A is a cross-sectional view of a package for mounting an electric component according to a first modification of the embodiment.

Fig. 3B is a cross-sectional view showing a package for mounting an electric component according to a second modification of the embodiment.

3C is a cross-sectional view of a package for mounting an electric component according to a third modification of the embodiment.

3D is a cross-sectional view of a package for mounting an electric component according to a fourth modification of the embodiment.

Fig. 4A is a perspective view of a package for mounting an electric component according to a fifth modification of the embodiment.

Fig. 4B is an enlarged cross-sectional view showing a package for mounting an electric component according to a fifth modification of the embodiment.

Fig. 4C is an enlarged cross-sectional view showing a connecting portion where the edge of the power supply terminal is not aligned with the edge of the end face.

4D is a perspective view of a package for mounting an electric component according to a sixth modification of the embodiment.

Fig. 5A is a perspective view of a package for mounting an electric component according to a seventh modification of the embodiment.

Fig. 5B is an enlarged cross-sectional view showing a package for mounting an electric component according to a seventh modification of the embodiment.

Fig. 5C is a perspective view of a package for mounting an electric component according to a eighth modification of the embodiment.

Fig. 5D is a perspective view of a package for mounting an electric component according to a ninth modification of the embodiment.

Fig. 5E is a perspective view of a package for mounting an electric component according to a tenth modification of the embodiment.

Fig. 5F is a perspective view of a package for mounting an electric component according to a modification 11 of the embodiment.

Fig. 5G is a perspective view of a package for mounting an electric component according to a twelfth embodiment of the embodiment.

Fig. 6A is a perspective view of a package for mounting an electric component according to a modification 13 of the embodiment.

Fig. 6B is a perspective view of a package for mounting an electric component according to a modification 14 of the embodiment.

Fig. 6C is a side view of the package for mounting an electric component according to a fourteenth embodiment of the embodiment.

Fig. 6D is an enlarged plan view showing a package for mounting an electric component according to a fifteenth modification of the embodiment.

Fig. 7A is a perspective view of a susceptor according to a modification 16 of the embodiment.

Fig. 7B is a perspective view of a susceptor according to a seventeenth modification of the embodiment.

Fig. 7C is a side view of the susceptor according to a seventeenth modification of the embodiment.

Fig. 7D is a plan view showing the array type package of the embodiment.

FIG. 8 is a plan view showing a manufacturing step of one of the packages for mounting an electric component according to the first embodiment.

FIG. 9 is a cross-sectional view showing another manufacturing step of the package for mounting an electric component according to the first embodiment.

FIG. 10 is a plan view showing a manufacturing step of one of the packages for mounting an electric component according to the second embodiment.

FIG. 11 is a plan view showing another manufacturing procedure of the package for mounting an electric component according to the second embodiment.

FIG. 12 is a cross-sectional view showing another manufacturing step of the package for mounting an electric component according to the second embodiment.

FIG. 13 is a cross-sectional view showing a manufacturing step of the package for mounting an electric component according to the first modification of the embodiment.

FIG. 14 is a cross-sectional view showing a manufacturing step of the package for mounting an electric component according to a third modification of the embodiment.

Form for implementing the invention

In the conventional package for mounting an electric component, heat dissipation from the outside of the electric component is extremely low. This is because the thermal resistance of the interface between the sub-carrier and the bonding material, and the thermal resistance of the interface between the bonding material and the metal substrate are large, and heat is not transferred from the sub-carrier to the metal substrate with good efficiency.

In view of the above-mentioned problems, the inventors of the present invention have an object of providing an electric component mounting package, an array type package, and an electric device having high heat dissipation properties.

Hereinafter, embodiments of an electrical component mounting package, an array package, and an electric device disclosed in the present invention will be described with reference to the accompanying drawings. In addition, as an example of the electric component mounting package, the array type package, and the electric device, the light-emitting element is applied to an electric component (hereinafter, referred to as a light-emitting element mounting package and a light-emitting device). However, the present invention is not limited to the light-emitting element, and can be applied to all of the electric elements having heat generation, and needless to say.

Here, examples of the electric elements having heat generation include a large scale integrated circuit (LSI: Large Scale Integrated Circuit), a charge coupled device (CCD: Charge Coupled Device), and a laser diode (Laser Diode). Light Emitting Diode (LED: Light Emitting Diode). Each of the embodiments shown below is particularly useful as a laser diode.

 <First embodiment>  

First, the outline of the light-emitting element mounting package A1 of the first embodiment will be described with reference to FIG. 1A and FIG.

As shown in FIG. 1A and the like, the light-emitting element mounting package A1 of the first embodiment includes a flat substrate 10 and a susceptor 11 projecting upward from the front surface 10a of the substrate 10. Further, a mounting surface 11a is provided on the upper surface of the susceptor 11, and the light-emitting element 30 is mounted on the mounting surface 11a.

In the light-emitting element mounting package A1 of the embodiment, the substrate 10 and the susceptor 11 are integrally formed of ceramic. In the light-emitting element mounting package A1, the susceptor 11 on which the light-emitting element 30 is mounted and the substrate 10 having the function of releasing heat to the outside are not provided with different materials and are large. The interface of the thermal resistance.

Thereby, heat can be efficiently transferred from the susceptor 11 to the substrate 10 since the thermal resistance between the substrate 10 and the susceptor 11 can be reduced. Therefore, it is possible to realize the light-emitting element mounting package A1 having high heat dissipation properties.

In addition, the light-emitting element mounting package A1 does not require a step of bonding the substrate 10 and the susceptor 11, and a bonding material such as an adhesive is not required. Therefore, the light-emitting element mounting package A1 having a low manufacturing cost can be realized.

Here, as shown in FIG. 1B, in the light-emitting element mounting package A1, the side surface conductor 13 can be provided on the side surface 11b of the susceptor 11, and the substrate-side via conductor 15a can be provided inside the substrate 10. Further, the side conductor 13 and the substrate-side via conductor 15a can be connected to the thickness direction of the light-emitting element mounting package A1.

As a result, the heat generated by the light-emitting element 30 mounted on the mounting surface 11a can be dissipated to the substrate 10 having a large surface area and high heat dissipation through the side surface conductor 13 extending in the thickness direction and the substrate-side via conductor 15a at the shortest distance. Back 10b. Therefore, the heat dissipation property of the package for mounting the light-emitting element A1 can be improved.

In this case, the area of the side conductor 13 may be 10% or more, particularly 50% or more, with respect to the area of one side surface 11b of the susceptor 11 on which the side conductor 13 is provided. Further, the area of the side surface conductor 13 is preferably as close as possible to the area of the side surface 11b, and may be equal to the area of the side surface 11b.

Further, as shown in FIG. 1B, the side conductor 13 and the substrate-side via conductor 15a are connected by using the planar conductor 14, but the side conductor 13 and the substrate-side via conductor 15a may be directly connected without using the planar conductor 14.

Next, a more detailed configuration of the light-emitting element mounting package A1 will be described with reference to FIGS. 1A to 1C.

The package A1 for mounting the light-emitting element is formed of ceramic. As the ceramic, for example, alumina, cerium oxide, mullite, cordierite, forsterite, aluminum nitride, tantalum nitride, tantalum carbide or glass ceramics can be used. In addition, it is preferable that the light-emitting element mounting package A1 contains aluminum nitride (AlN) as a main component in view of the fact that the thermal conductivity is high and the thermal expansion coefficient is close to the light-emitting element 30.

Here, the term "containing aluminum nitride as a main component" means that the light-emitting element mounting package A1 contains 80% by mass or more of aluminum nitride. When the aluminum nitride contained in the package for mounting the light-emitting element A1 is less than 80% by mass, the thermal conductivity of the package for mounting the light-emitting element A1 is lowered, which may hinder the heat dissipation.

In addition, it is preferable that the light-emitting element mounting package A1 contains 90% by mass or more of aluminum nitride. By setting the content of the aluminum nitride to 90% by mass or more, the thermal conductivity of the light-emitting element mounting package A1 can be made 150 W/mK or more. Therefore, the light-emitting element mounting package A1 having excellent heat dissipation properties can be realized.

The light-emitting element mounting package A1 includes the substrate 10 and the susceptor 11 as described above, and the element terminal 12a is provided on the mounting surface 11a of the susceptor 11. As shown in FIG. 1B, the element terminal 12a is connected to the back surface 10b via the above-described side surface conductor 13 and the planar conductor 14 provided on the surface 10a of the substrate 10 and the above-described substrate-side via conductor 15a. The power supply terminal 16a of the external power source (not shown) is electrically connected.

Further, as shown in FIG. 1A, on the surface 10a of the substrate 10, another element terminal 12b is provided adjacent to the susceptor 11. Further, as shown in FIG. 1C, the element terminal 12b is also connected to the other side of the substrate 10 via the substrate-side via conductor 15b extending in the thickness direction of the substrate 10, and connected to the external power supply. The power supply terminal 16b is electrically connected. Here, the element terminals 12a and 12b may be formed of a metallized film sintered with metal powder. Since the metallized film can be adhered to the ceramic surface constituting the substrate 10 and the susceptor 11 with high strength, the highly reliable light-emitting element mounting package A1 can be realized.

Further, a plating film of Ni or the like may be formed on the surface of the metallized film. Further, an adhesive or an Au-Sn plating film may be provided on the surface of the plating film.

As shown in FIG. 1A, a metal film for sealing 20 is provided on the surface 10a of the substrate 10 so as to surround the susceptor 11 and the terminal 12b for the element. When the cap 40 is provided so as to cover the surface 10a of the substrate 10, the metal film for sealing 20 is a portion to which the cover 40 is joined.

The light-emitting element 30 and the cover 40 shown in FIG. 1A are mounted on the light-emitting element mounting package A1 described so far to constitute a light-emitting device.

As the light-emitting element 30, for example, a semiconductor laser (also referred to as a laser diode) or the like can be used. The light-emitting element 30 is disposed such that the radiation surface 30a provided on one end surface faces the predetermined direction of the light-emitting element mounting package A1.

The light-emitting element 30 is bonded to the mounting surface 11a of the susceptor 11 by using a conductive bonding material such as an adhesive. At this time, the first electrode (not shown) provided on the lower surface of the light-emitting element 30 can be electrically connected to the element terminal 12a provided on the mounting surface 11a by the conductive bonding material.

Further, the second electrode (not shown) provided on the upper surface of the light-emitting element 30 and the element terminal 12b adjacent to the susceptor 11 are electrically connected by a bonding wire (not shown) or the like.

The cover 40 is a member for hermetically sealing a region surrounded by the sealing metal film 20 such as the light-emitting element 30. The cover 40 may be made of a metal material, ceramics, or the like, and may be made of, for example, Kovar (Fe-Ni-Co alloy) in view of high heat resistance and heat dissipation.

In the cover 40, a lateral window 41 is provided on the side surface, and transparent glass is embedded in the lateral window 41. The cover 40 is disposed such that the lateral window 41 faces the same direction as the radiation surface 30a of the light-emitting element 30. Further, the light emitted from the radiation surface 30a is radiated to the outside through the lateral window 41.

A brazing material can also be used for joining the cover 40 to the metal film 20 for sealing. By using the brazing material as the bonding material, the airtightness of the region sealed by the cover 40 can be improved, so that the reliability of the light-emitting device can be improved.

 <Second embodiment>  

Next, the configuration of the light-emitting element mounting package A2 of the second embodiment will be described with reference to FIGS. 2A to 2C.

The arrangement of the power supply terminals 16a and 16b to be connected to the external power source of the package A2 for mounting the light-emitting element is different from that of the above-described package for mounting the light-emitting element A1. The other points are basically the same as those of the light-emitting element mounting package A1, and the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 2A and the like, the power supply terminals 16a and 16b of the light-emitting element mounting package A2 are provided on the surface 10a of the substrate 10. By providing the power supply terminals 16a and 16b on the front surface 10a of the substrate 10 instead of the back surface 10b, a heat dissipating member such as a heat sink can be provided in contact with the entire back surface 10b of the substrate 10. Therefore, the heat dissipation of the package can be further improved.

Here, when a metal heat dissipating member having high heat dissipation property is provided on the back surface 10b of the substrate 10, the metal film 21 can be provided on the back surface 10b in order to be bonded by using an adhesive or the like. When the heat dissipating member is joined by using an adhesive having a high thermal conductivity or the like, the thermal resistance of the joined portion can be reduced as compared with the case of bonding with a resin-based adhesive having a low thermal conductivity. Therefore, the heat dissipation of the package can be further improved.

In this case, the area ratio of the metal film 21 on the back surface 10b may be 50% or more, particularly 80% or more. Further, the planar shape of the metal film 21 may be a shape similar to the planar shape of the back surface 10b of the substrate 10. Further, when the area of the metal film 21 is smaller than the area of the back surface 10b, the metal film 21 can be disposed such that the central portion is located immediately below the susceptor 11.

In the following, the power supply terminals 16a and 16b provided on the front surface 10a of the substrate 10 and the component terminals 12a and 12b provided inside the sealing metal film 20 are described as differences from the above-described first embodiment. Wiring structure.

As shown in FIG. 2B, similarly to the above-described light-emitting element mounting package A1, the side surface conductor 13, the planar conductor 14, and the substrate-side via conductor 15a are sequentially connected to the element terminal 12a. On the other hand, the substrate-side via conductor 15a does not penetrate the back surface 10b of the substrate 10, but is connected inside the substrate 10 to one end side of the wiring conductor 17a extending in the surface direction of the substrate 10.

The wiring conductor 17a extends below the sealing metal film 20 and the other end side reaches below the power supply terminal 16a. Further, the other end side of the wiring conductor 17a and the power supply terminal 16a are electrically connected by the terminal side via conductor 18a.

In other words, the power supply terminal 16a is electrically connected to the element terminal 12a via the terminal side via conductor 18a, the wiring conductor 17a, the substrate side via conductor 15a, the planar conductor 14, and the side surface conductor 13.

Further, as shown in FIG. 2C, the power supply terminal 16b is electrically connected to the element terminal 12b via the other terminal side via conductor 18b, the other wiring conductor 17b, and the other substrate side via conductor 15b.

In this manner, the light-emitting element mounting package A2 is configured such that the wiring conductors 17a and 17b and the sealing metal film 20 are at least one insulating layer interposed therebetween to constitute the substrate 10, and are three-dimensionally intersected. By this means, the surface of the sealing metal film 20 which is three-dimensionally intersected with the wiring conductors 17a and 17b can be reduced by the barrier insulating layer, and irregularities due to the thickness of the wiring conductors 17a and 17b can be formed.

In other words, when the cover 40 is joined to the surface of the sealing metal film 20, the gap generated in the bonding surface can be reduced, so that the airtightness inside the cover 40 can be improved. Therefore, the reliability of the light-emitting device can be improved.

Further, as shown in FIG. 2B and FIG. 2C, the wiring conductors 17a and 17b can be provided at positions closer to the back surface 10b than the surface 10a of the substrate 10. When the metal wiring conductors 17a and 17b are provided at positions close to the back surface 10b and the metal heat radiation member is provided on the back surface 10b, the difference between the thermal expansion coefficient of the heat radiation member and the thermal expansion coefficient of the substrate 10 can be reduced.

Thereby, it is possible to suppress the joint between the heat radiating member and the back surface 10b, and the joint material provided in the joint portion is deteriorated by the heat cycle generated when the light-emitting device operates. Therefore, the highly reliable light-emitting element mounting package A2 can be realized.

 <Modification>  

Next, various modifications of the package for mounting a light-emitting element of the embodiment will be described with reference to FIGS. 3A to 7C. The light-emitting element mounting package A3 shown in FIG. 3A is a modification of the light-emitting element mounting package A1 of the first embodiment, and FIG. 3A corresponds to the cross-sectional view of FIG. 1B.

The light-emitting element mounting package A3 is not provided by the side surface conductor 13 (see FIG. 1B) but by the pedestal-side via conductor 19 which is provided inside the susceptor 11 and extends in the thickness direction of the susceptor 11. The element terminal 12a and the board-side via conductor 15a are electrically connected to each other.

By providing the columnar base side via conductor 19 having a larger volume than the film side surface conductor 13 to the susceptor 11, the heat generated from the light-emitting element 30 (refer to FIG. 1A) can be more efficiently dissipated to the substrate. 10 back 10b. Therefore, the heat dissipation property of the package A3 for mounting the light-emitting element can be further improved.

The base-side via conductor 19 can be disposed at a central portion of the mounting surface 11a on the upper surface of the susceptor 11. Thereby, the heat inside the susceptor 11 which is farther from the side surface 11b can be more easily dissipated.

Further, as shown in FIG. 3A, the base-side via conductor 19 and the substrate-side via conductor 15a can be integrally formed to penetrate in the thickness direction of the susceptor 11 and the substrate 10. Thereby, the pedestal side via conductor 19 and the substrate side via conductor 15a can be easily formed by the via filling step performed in the manufacturing step described later. Therefore, it is possible to suppress an increase in the manufacturing cost of the light-emitting element mounting package A3.

The light-emitting element mounting package A4 shown in FIG. 3B is a modification of the light-emitting element mounting package A2 of the second embodiment, and FIG. 3B corresponds to the cross-sectional view of FIG. 2B.

In the same manner as in the above-described modification, the light-emitting element mounting package A4 is electrically connected between the element terminal 12a and the substrate-side via conductor 15a by the base-side via conductor 19 provided inside the susceptor 11. Therefore, as described above, the heat dissipation property of the package can be further improved. In this case as well, the shape and arrangement of the metal film 21 disposed on the back surface 10b of the substrate 10 can be the same as in the case of the above-described light-emitting element mounting package A2.

The light-emitting element mounting package A5 shown in FIG. 3C is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the light-emitting element mounting package A5, the groove 10c is formed on the front surface 10a of the substrate 10 so as to surround the susceptor 11 and the element terminal 12b (see FIG. 2A), and the bottom surface of the groove 10c is provided with a seal. Metal film 20.

Here, when the cover 40 (see FIG. 2A) is joined to the metal film 20 for sealing, by providing the cover 40 so as to be engaged with the groove 10c, the joint portion with the cover 40 can be extended to The side of the groove 10c. Thereby, since the airtightness of the area sealed by the cover 40 can be further improved, the reliability of the light-emitting device can be further improved.

Further, by providing the groove 10c in the substrate 10, the surface area of the substrate 10 having the heat releasing function can be increased, so that the heat dissipation property of the package can be further improved.

Further, in FIG. 3C, the metal film 20 for sealing is provided on the bottom surface of the groove 10c, but the arrangement of the metal film 20 for sealing is not limited thereto. For example, the metal film for sealing 20 may be provided to extend from the bottom surface of the groove 10c to the side surface of the groove 10c or the surface 10a of the substrate 10 adjacent to the groove 10c.

The light-emitting element mounting package A6 shown in FIG. 3D is a modification of the light-emitting element mounting package A4 shown in FIG. 3B.

Similarly to the above-described light-emitting element mounting package A5, the light-emitting element mounting package A6 is provided with a sealing metal film 20 formed inside the groove 10c formed on the surface 10a of the substrate 10. Therefore, as described above, the reliability of the light-emitting device can be further improved, and the heat dissipation property of the package can be further improved.

The light-emitting element mounting package A7 shown in FIG. 4A is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the light-emitting element mounting package A7, the edge 16c of the rectangular power supply terminals 16a and 16b opposite to the light emission direction (hereinafter also referred to as "rear side") is provided to be rearward of the substrate 10. The edges of the side end faces 10d are aligned. By shifting the power supply terminals 16a and 16b to the end portions of the substrate 10 in this manner, it is possible to reduce unnecessary substrate regions on the substrate 10, and it is possible to reduce the size of the light-emitting device.

In the light-emitting element mounting package A7, an FPC (Flexible Printed Circuit) can be easily used as an external terminal connected to the power supply terminals 16a and 16b. The reason will be described with reference to Figs. 4B and 4C.

As shown in FIG. 4B, the FPC 200 is formed by sequentially stacking a cover film 201, a copper foil 202, and a base film 203 from above. The copper foil 202 of the center layer is joined to the power supply terminals 16a and 16b by using a conductive bonding material such as a solder, and the power supply terminals 16a and 16b and the FPC 200 are electrically connected.

Here, as shown in FIG. 4B, in the case where the edge 16c of the power supply terminals 16a, 16b is disposed to be aligned with the edge of the end face 10d, the FPC 200 can be kept flat by cutting the front end portion of the base film 203 of the lower layer. In the state, it is easily connected to the power supply terminals 16a and 16b.

On the other hand, as shown in FIG. 4C, when the edge 16c of the power supply terminals 16a, 16b is not aligned with the edge of the end surface 10d, if the curved portion 202a is not provided at the front end portion of the copper foil 202 of the FPC 200, the FPC 200 cannot be used. It is connected to the power supply terminals 16a and 16b. Further, in this case, there is a possibility that the bent portion 202a causes a problem in durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b.

However, in the light-emitting element mounting package A7, the FPC 200 can be connected to the power supply terminals 16a and 16b while being kept flat. Therefore, the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b can be improved.

The light-emitting element mounting package A8 shown in FIG. 4D is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the light-emitting element mounting package A8, the edge 16d on the side perpendicular to the radial direction of the light of the rectangular power supply terminals 16a and 16b (hereinafter, also referred to as "side surface side") is provided to be the substrate 10 The end faces on the side faces, that is, the edges of the side faces 10e are aligned. Thereby, since the degree of freedom of connection with an external terminal such as the FPC 200 (see FIG. 4B) can be improved, the module design of the light-emitting device can be easily performed.

Further, as described above, when the edge 16d of the power supply terminals 16a, 16b is disposed to be aligned with the edge of the side surface 10e, by cutting the front end portion of the base film 203, the FPC 200 can be connected while being kept flat. Power supply terminals 16a, 16b. Therefore, the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b can be improved.

The light-emitting element mounting package A9 shown in FIG. 5A is a modification of the light-emitting element mounting package A7 shown in FIG. 4A. In the light-emitting element mounting package A9, the edge 16c on the rear side of the rectangular power supply terminals 16a and 16b is arranged to be aligned with the edge of the end surface 10d on the rear side of the substrate 10.

In the same manner as the light-emitting element mounting package A7 shown in FIG. 4A, the FPC 200 can be connected to the power supply terminals 16a and 16b while being kept flat. Therefore, the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b can be improved.

In the light-emitting element mounting package A9, the power supply terminals 16a and 16b are provided at a position lower than the surface 10a of the substrate 10. In other words, the concave portion 10f is formed on the edge on the side after the surface 10a of the substrate 10, and the power supply terminals 16a and 16b are disposed on the bottom surface of the concave portion 10f.

Thereby, as shown in FIG. 5B, when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be provided by pushing the front end portion of the FPC 200 against the side wall of the recess 10f. Therefore, the alignment of the FPC 200 becomes easy, and the FPC 200 can be firmly connected to the power supply terminals 16a, 16b.

Further, as shown in FIG. 5B, the depth of the concave portion 10f is set to be equal to or greater than the total value of the thicknesses of the cover film 201 and the copper foil 202 of the FPC 200, and the upper surface of the FPC 200 can be set. It is flush with the surface 10a of the substrate 10 or lower than the surface 10a.

Thereby, since it is not easy to generate scratches or the like in the FPC 200, the durability of the light-emitting device can be improved.

Further, as shown in FIG. 5A, the concave portion 10f may be formed to be separated from the surface 10a of the substrate 10. However, as shown in the light-emitting element mounting package A10 shown in FIG. 5C, the concave portion 10f may be used. Consolidate into a single construct. In this case, since the power supply terminals 16a and 16b can be arranged closer to each other, it is possible to achieve miniaturization of external terminals such as the light-emitting element mounting package A10 and the FPC 200.

The light-emitting element mounting package A11 shown in FIG. 5D is a modification of the light-emitting element mounting package A8 shown in FIG. 4D. In the light-emitting element mounting package A11, the edge 16d on the side surface side of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the side surface 10e of the end surface on the side surface side of the substrate 10. Thereby, since the degree of freedom of connection with an external terminal such as the FPC 200 can be improved, the module design of the light-emitting device can be easily performed.

In the light-emitting element mounting package A11, similarly to the light-emitting element mounting package A9 shown in FIG. 5A, the power supply terminals 16a and 16b are provided at a position lower than the surface 10a of the substrate 10. In other words, the concave portion 10f is formed at the edge on the side surface side of the surface 10a of the substrate 10, and the power supply terminals 16a and 16b are disposed on the bottom surface of the concave portion 10f.

As a result, when the FPC 200 is connected to the power supply terminals 16a and 16b as described above, the FPC 200 can be provided by pushing the front end portion of the FPC 200 against the side wall of the recess 10f. Therefore, the alignment of the FPC 200 becomes easy, and the FPC 200 can be firmly connected to the power supply terminals 16a, 16b.

Further, as described above, by setting the depth of the concave portion 10f to be equal to or greater than the total value of the thicknesses of the cover film 201 and the copper foil 202 of the FPC 200, the upper surface of the FPC 200 can be set to be the same as the substrate. The surface 10a of 10 is flush or lower than the surface 10a.

Thereby, since it is not easy to generate scratches or the like in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A12 shown in FIG. 5E is a modification of the light-emitting element mounting package A9 shown in FIG. 5A. In the light-emitting element mounting package A12, the edge 16C on the rear side of the rectangular power supply terminals 16a and 16b is disposed so as to be aligned with the edge of the end surface 10d on the rear side of the substrate 10.

In the same manner as the light-emitting element mounting package A7 shown in FIG. 4A, the FPC 200 can be connected to the power supply terminals 16a and 16b while being kept in a flat state in the light-emitting element mounting package A12. Therefore, the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b can be improved.

Further, in the light-emitting element mounting package A12, the edge 16d on the side surface side of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the side surface 10e which is the end surface on the side surface side of the substrate 10. Therefore, since the degree of freedom of connection with an external terminal such as the FPC 200 can be improved, the module design of the light-emitting device can be easily performed.

In the light-emitting element mounting package A12, the power supply terminals 16a and 16b are provided at a position lower than the surface 10a of the substrate 10. In other words, the concave portion 10f is formed at the rear side of the front surface side of the surface 10a of the substrate 10, and the power supply terminals 16a and 16b are disposed on the bottom surface of the concave portion 10f.

Thereby, when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be provided by pushing the front end portion of the FPC 200 obliquely to both side walls of the recess 10f. Therefore, the alignment of the FPC 200 becomes easy, and the FPC 200 can be firmly connected from the oblique direction.

Further, as described above, by setting the depth of the concave portion 10f to be equal to or greater than the total value of the thicknesses of the cover film 201 and the copper foil 202 of the FPC 200, the upper surface of the FPC 200 can be set to be the same as the substrate. The surface 10a of 10 is flush or lower than the surface 10a.

Thereby, since it is not easy to generate scratches or the like in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A13 shown in FIG. 5F is a modification of the light-emitting element mounting package A7 shown in FIG. 4A. In the light-emitting element mounting package A13, the region inside the sealing metal film 20 is recessed from the surface 10a of the substrate 10 except for the portion of the susceptor 11. In other words, the concave portion 10g is formed in a region inside the sealing metal film 20, and the susceptor 11 is disposed on the bottom surface of the concave portion 10g. Here, the mounting surface 11a of the susceptor 11 is disposed at a position higher than the surface 10a of the substrate 10.

As a result, in the light-emitting element mounting package A13, since the position of the mounting surface 11a at the highest position can be lowered, the light-emitting device can be further reduced in height.

Here, in order to reduce the height of the package for the light-emitting element mounting, when the recess 10g is not formed and the height of the pedestal is lowered, the distance between the mounting surface and the surface of the substrate is in the region inside the metal film for sealing. Getting closer. In other words, in the region inside the metal film for sealing, the distance between the light-emitting element mounted on the mounting surface and the surface becomes close.

In this way, since the light radiated from the radiation surface of the light-emitting element in the obliquely downward direction is irradiated to the surface of the region inside the metal film for sealing, the amount of light reflected on the surface other than the predetermined irradiation direction also changes. many. Therefore, a problem such as a decrease in luminous efficiency inside the light-emitting device is likely to occur.

However, in the light-emitting element mounting package A13, since the concave portion 10g is formed in the region inside the sealing metal film 20, the mounting surface 11a and the mounting surface 11a can be secured in the region inside the sealing metal film 20. The distance from the concave portion 10g of the surface on the surface 10a side of the substrate 10 is surrounding. Therefore, it is possible to suppress surface reflection of the light on the surface 10a side in the region inside the metal film 20 for sealing.

In other words, according to the light-emitting element mounting package A13, it is possible to simultaneously achieve further lowering of the light-emitting device and to suppress surface reflection of light from the surface 10a side.

The light-emitting element mounting package A14 shown in FIG. 5G is a modification of the light-emitting element mounting package A13 shown in FIG. 5F. In the light-emitting element mounting package A14, the region on the inner side of the sealing metal film 20 is recessed from the surface 10a of the substrate 10 except for the portion of the susceptor 11. Thereby, it is possible to simultaneously achieve further lowering of the light-emitting device and suppressing surface reflection of light from the surface 10a side.

Further, in the light-emitting element mounting package A14, the edge 16c on the rear side of the rectangular power supply terminals 16a and 16b is arranged to be aligned with the edge of the end surface 10d on the rear side of the substrate 10.

In the same manner as the light-emitting element mounting package A12 shown in FIG. 5E, the FPC 200 can be connected to the power supply terminals 16a and 16b while being kept in a flat state in the light-emitting element mounting package A14. Therefore, the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b can be improved.

In the light-emitting element mounting package A14, the edge 16d on the side of the rectangular power supply terminals 16a and 16b is disposed so as to be aligned with the end surface on the side of the substrate 10, that is, the edge of the side surface 10e. Thereby, since the degree of freedom of connection with an external terminal such as the FPC 200 can be improved, the module design of the light-emitting device can be easily performed.

In the light-emitting element mounting package A14, the power supply terminals 16a and 16b are provided at a position lower than the surface 10a of the substrate 10. In other words, the concave portion 10f is formed behind the surface 10a of the substrate 10 and on the side of the side, and the power supply terminals 16a and 16b are disposed on the bottom surface of the concave portion 10f.

Thereby, when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be provided by pushing the front end portion of the FPC 200 obliquely to both side walls of the recess 10f. Therefore, the alignment of the FPC 200 becomes easy, and the FPC 200 can be firmly connected from the oblique direction.

Further, as described above, by setting the depth of the concave portion 10f to be equal to or greater than the total value of the thicknesses of the cover film 201 and the copper foil 202 of the FPC 200, the upper surface of the FPC 200 can be set to be the same as the substrate. The surface 10a of 10 is flush or lower than the surface 10a.

Thereby, since it is not easy to generate scratches or the like in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A15 shown in FIG. 6A is a modification of the light-emitting element mounting package A7 shown in FIG. 4A. In the light-emitting element mounting package A15, a plurality of (two in the drawing) susceptors 11 are provided in a region inside the sealing metal film 20.

Thereby, a plurality of light-emitting elements 30 can be mounted in a region inside the sealing metal film 20. That is, since the light-emitting device can be multi-wafered, the light-emitting device can be miniaturized.

In the light-emitting element mounting package A15, for example, the susceptors 11 are arranged in a direction perpendicular to the radiation direction of the light, and the light-emitting elements 30 are mounted on the mounting surfaces 11a of the plurality of susceptors 11, respectively. In this case, all of the light-emitting elements 30 may be disposed such that all of the radiation surfaces 30a face the radiation direction of the light.

Further, in the embodiment, an example in which two susceptors 11 are provided is shown, but three or more susceptors 11 may be provided. Further, in the embodiment, the susceptor 11 is arranged in a line perpendicular to the radiation direction of the light. However, if the light emitted from one of the plurality of light-emitting elements 30 does not collide with the other light-emitting elements 30 or the susceptor 11 or the like, it is not necessary to arrange them in a direction perpendicular to the radiation direction of the light.

The light-emitting element mounting package A16 shown in FIG. 6B and FIG. 6C is a modification of the light-emitting element mounting package A15 shown in FIG. 6A. In the light-emitting element mounting package A16, a first pedestal 11A for mounting a laser diode 31 which is an example of the light-emitting element 30, and a light-emitting diode 2 are provided in a region inside the sealing metal film 20. The second pedestal 11B of the photodiode 32.

The first pedestal 11A and the second pedestal 11B are combined to form a hybrid susceptor 11C. In the hybrid susceptor 11C, the first susceptor 11A is disposed on the side of the light irradiation direction, and the second susceptor 11B is disposed on the opposite side of the light irradiation direction. Further, the height of the second susceptor 11B is lower than the height of the first susceptor 11A.

The laser diode 31 mounted on the hybrid susceptor 11C has a width of, for example, 0.3 mm × a length of 1.0 mm × a height of 0.1 mm, and the photodiode 32 has a width of, for example, 0.5 mm × a length of 0.5 mm × a height of 0.3 mm. Here, "width" means a dimension on one side in a direction substantially perpendicular to the radiation direction of light, and "length" means a dimension on one side in a direction substantially parallel to the radiation direction of light in the horizontal direction ( The following records are also the same).

Further, as shown in FIG. 6C, the radiation surface 31a of the laser diode 31 is arranged to face the light irradiation direction, and the detection surface 32a of the photodiode 32 is disposed to face upward. Further, the light L1 is radiated from the upper portion of the radiation surface 31a of the laser diode 31 at a width of about 30° on one side. This light L1 is light that is emitted from the light-emitting device toward the outside.

Further, the weak light L2 is radiated from the upper portion of the surface on the opposite side to the radiation surface 31a of the laser diode 31 by a width of about 30° on one side. The amount of light of this light L2 is increased or decreased depending on the amount of light of the light L1.

Here, in the embodiment, as shown in FIG. 6C, by making the height of the second susceptor 11B lower than that of the first pedestal 11A, even if the photodiode 32 having a height higher than that of the laser diode 31 is used, In other cases, the upper detection surface 32a can also be used to detect the light L2.

Thereby, the light L2 from the laser diode 31 can be detected by the detecting surface 32a of the photodiode 32, and the detection result can be fed back to the control portion of the laser diode 31. Therefore, according to the embodiment, feedback control of the amount of light L1 emitted from the laser diode 31 can be performed.

The light-emitting element mounting package A17 shown in FIG. 6D is a modification of the light-emitting element mounting package A16 shown in FIGS. 6B and 6C. In the light-emitting element mounting package A17, three sets of the hybrid pedestals 11C are provided in the inner region of the sealing metal film 20. Further, optical elements 25 and 26 are provided in a region inside the sealing metal film 20, and the optical elements 25 and 26 have a function of combining the incident light and emitting it in a predetermined direction.

These optical elements 25 and 26 are arranged along the irradiation direction of the light (the right side in the drawing), and the optical element 26 is disposed closer to the irradiation direction of the light than the optical element 25.

Further, the three sets of hybrid pedestals 11C include a red mixing pedestal 11C1 for mounting the red laser diode 31R, and a green hybrid pedestal 11C2 for mounting the green laser diode 31G; The blue hybrid pedestal 11C3 of the blue laser diode 31B.

The first pedestal 11A and the second pedestal 11B of the red mixing pedestal 11C1 are arranged side by side in the light irradiation direction so as to face the optical element 25. The red pedestal diode 31R and the red laser detecting photodiode 32R can be mounted on the first pedestal 11A and the second pedestal 11B of the red hybrid pedestal 11C1, respectively.

The first pedestal 11A and the second pedestal 11B of the green hybrid susceptor 11C2 are arranged side by side in a direction perpendicular to the irradiation direction of the light so as to face the optical element 25. Further, the green laser diode 31G and the green laser light detecting diode 32G are mounted on the first pedestal 11A and the second pedestal 11B of the green hybrid pedestal 11C2, respectively.

The first pedestal 11A and the second pedestal 11B of the blue mixing pedestal 11C3 are arranged side by side in a direction perpendicular to the irradiation direction of the light so as to face the optical element 26. In addition, the blue laser diode 31B and the blue laser light detecting diode 32B are mounted on the first pedestal 11A and the second pedestal 11B of the blue hybrid pedestal 11C3, respectively.

In the embodiment having such a configuration, the red light L _R is irradiated to the optical element 25 from the red laser diode 31R, and the green light L _G is irradiated from the green laser diode 31G to the optical element 25. Further, in the optical element 25, the light L _R and the light L _G are combined, and the synthesized light L _{RG is} emitted toward the optical element 26.

Next, the blue light L _B is irradiated from the blue laser diode 31B to the optical elements 26, 26, the light L _RG light L _B are combined in the optical element. The synthesized light L _{RGB is} emitted from the optical element 26 toward the light irradiation direction.

In other words, according to the embodiment, by providing the three sets of the hybrid susceptor 11C in the region inside the sealing metal film 20, the red light L _R and the green light L _G and the blue light L _{B can be} combined. Shoot out the outside. Therefore, an optical device that can be used as a display light source can be realized.

In the embodiment, the photodiode 32R for red laser detection, the photodiode 32G for green laser detection, and the photodiode 32B for blue laser detection are respectively mounted on the corresponding second pedestal. 11B. Thereby, the amount of light of the light L _R from the red laser diode 31R, and the amount of light of the light L _G from the green laser diode 31G, and the light L _B from the blue laser diode 31B can be obtained. The amount of light is separately fed back. Therefore, the adjusted high quality light L _RGB can be emitted.

Further, in the embodiment, the interval between the red mixed base 11C1 and the green mixed base 11C2 or the interval D1 between the red mixed base 11C1 and the blue mixed base 11C3 is greener than the green The interval between the mixing base 11C2 and the blue mixing base 11C3 is also wide.

Thereby, the red laser diode 31R which is susceptible to heat generation from other elements can be disposed apart from the green laser diode 31G and the blue laser diode 31B. Therefore, the light L _R can be stably emitted from the red laser diode 31R.

Furthermore, in the embodiment, the direction of the light L _R emitted from the red laser diode 31R and the direction of the light L _G emitted from the green laser diode 31G and the blue laser diode are obtained. The direction of the light L _B emitted by the 31B is directed in a direction that does not collide with the three sets of the hybrid pedestals 11C. This makes it possible to realize a compact and high-quality RGB integrated module.

In addition, the size and length of the light-emitting element mounting packages A1 to A17 which are displayed so far may be about 2 to 5 mm, and the height may be about 0.2 to 1 mm.

Further, in the light-emitting element mounting packages A1 to A17 displayed so far, the element terminal 12a is provided on the mounting surface 11a of the susceptor 11, and the element terminal 12b is disposed on the pedestal 11 ( That is, the configuration in which the surface 11a) is separated is mounted.

However, the case of the light-emitting element mounting packages A1 to A17 of the present embodiment is not limited thereto, and the element terminal 12a and the element terminal 12b may be placed on the mounting surface 11a of the susceptor 11 as shown in FIG. 7A. The upper sides are arranged apart from each other at a predetermined interval. In this case, the element terminal 12a and the element terminal 12b are in a state of being insulated from each other by the ceramics constituting the susceptor 11 on the mounting surface 11a of the susceptor 11.

When the element terminal 12a and the element terminal 12b are arranged close to each other on the susceptor 11, the connection between the light-emitting element 30 and the component terminals 12a and 12b (in particular, the component terminal 12b) can be shortened. The length of the line.

Therefore, according to the example of FIG. 7A, it is possible to further reduce the size of the light-emitting element mounting packages A1 to A17. Further, according to the example of FIG. 7A, the inductance caused by the current input and output can be reduced.

Further, in the light-emitting element mounting packages A1 to A17 shown so far, as shown in FIG. 7B, the element terminal 12a and the element terminal 12b may be three-dimensionally formed on the susceptor 11 in a predetermined height. On face 11a.

As described above, in order to form the element terminals 12a and 12b three-dimensionally, for example, as shown in FIG. 7B, the small pedestals 11D and 11E corresponding to the area of each of the element terminals 12a and 12b are used as the pedestal. 11 the same material is integrally formed on the mounting surface 11a.

The element terminal 12a and the element terminal 12b are positioned higher on the mounting surface 11a of the susceptor 11 than other areas of the mounting surface 11a. In other words, the region of the element terminal 12a and the element terminal 12b is a convex portion, and the other regions are concave portions.

When the element terminal 12a and the element terminal 12b are formed to be three-dimensionally formed on the mounting surface 11a of the susceptor 11 with a predetermined height, the light-emitting element 30 can be floated from the mounting surface 11a. status.

Thereby, it is possible to suppress the light emitted from the light-emitting element 30 from being reflected or absorbed on the mounting surface 11a. Therefore, according to the example of FIG. 7B, the light emission of the light-emitting element 30 can be stabilized.

In the example of FIG. 7B, as shown in FIG. 7C, in the element terminal 12a and the element terminal 12b, the height h2 of the element terminal 12b with respect to the mounting surface 11a is compared with the mounting surface 11a of the element terminal 12a. The height h1 is also higher and better. Further, the height h2 of the element terminal 12b is preferably higher than the height h1 of the element terminal 12a by an amount corresponding to the thickness t of the light-emitting element 30.

Thereby, as shown in FIG. 7C, the length of the connecting wire W for connecting the light-emitting element 30 to the component terminal 12b can be shortened. Therefore, according to the example of FIG. 7C, the inductance due to the current of the output input can be reduced.

Fig. 7D is a plan view showing the array type package C1 of the embodiment. In the array type package C1 shown in Fig. 7D, the light-emitting element mounting package A1 of the plurality of light-emitting element mounting packages described above is connected.

 <Method for Manufacturing Light-Emitting Element Mounting Package>  

Next, a method of manufacturing the package for mounting a light-emitting element according to each embodiment will be described.

First, a method of manufacturing the light-emitting element mounting package A1 of the first embodiment will be described with reference to FIGS. 8 and 9 . Fig. 8 is a plan view showing the steps of the front half from the top (only (d) of Fig. 8 is from below), and Fig. 9 is a cross-sectional view showing the steps of the rear half in a side sectional view, respectively.

As shown in FIG. 8(a), a green sheet 50 previously processed into a predetermined shape is prepared. Next, the predetermined two portions of the green sheet 50 are punched into a circular shape in plan view, and the two punched portions are filled with the via conductors 51a and 51b (Fig. 8(b)).

Next, on the upper surface of the green sheet 50, the conductor pattern 52a is printed so as to be in contact with the via conductor 51a, and the conductor pattern 52b is printed so as to be in contact with the via conductor 51b. At the same time, the frame-shaped conductor pattern 52c is printed so as to surround the conductor patterns 52a and 52b ((c) of FIG. 8).

Next, the conductor pattern 53a is printed on the lower surface of the green sheet 50 so as to be in contact with the via conductor 51a, and the conductor pattern 53b is printed so as to be in contact with the via conductor 51b ((d) of FIG. 8).

Fig. 9 showing the subsequent steps is a cross-sectional view taken along the line E-E of the line E-E shown in Fig. 8(d). As shown in FIG. 9( a ), the press die 100 of a predetermined shape is used to perform press working from the upper side of the green sheet 50 to form the convex portion 54 ( FIG. 9( b )).

At the same time, the conductor pattern 52a (see FIG. 9(a)) is deformed to form the conductor pattern 52a1 provided on the upper surface of the convex portion 54, and the conductor pattern 52a2 provided on the side surface of the convex portion 54 and adjacent to the convex portion 54. The conductor pattern 52a3 is provided.

Here, the convex portion 54 corresponds to the portion of the susceptor 11 (see FIG. 1B) of the light-emitting element mounting package A1, and the conductor patterns 52a1, 52a2, and 52a3 correspond to the element terminal 12a (see FIG. 1B) and the side surface, respectively. The conductor 13 (see Fig. 1B) and the portion of the planar conductor 14 (see Fig. 1B).

In addition, the via conductor 51a is a portion corresponding to the substrate-side via conductor 15a (see FIG. 1B) of the light-emitting element mounting package A1, and the conductor pattern 53a is a portion corresponding to the power supply terminal 16a (see FIG. 1B), and the conductor pattern 52c It is a part corresponding to the metal film for sealing 20 (refer FIG. 1B).

In the green sheet 50, the via conductor 51b (see FIG. 8(b)) and the substrate-side via conductor 15b of the light-emitting element mounting package A1 are not shown. (Refer to Figure 1C) Corresponding parts.

In addition, the conductor pattern 52b (see FIG. 8(c)) is a portion corresponding to the element terminal 12b (see FIG. 1C) of the light-emitting element mounting package A1, and the conductor pattern 53b (refer to FIG. 8(d)) A portion corresponding to the power supply terminal 16b (see FIG. 1C).

Then, at the end of the manufacturing process, the green sheet 50 formed as shown in FIG. 9(b) is fired at a high temperature (about 1800 ° C) to complete the light-emitting element mounting package A1.

The green sheet 50 used in the above-described manufacturing step is mainly composed of an inorganic powder system containing, for example, a powder of aluminum nitride belonging to a main raw material to contain yttrium oxide (Y ₂ O ₃ ), calcium oxide. Powders such as (CaO) and cerium oxide (Er ₂ O ₃ ) are mixed as a sintering aid. Then, a mixed organic binder, a solvent, and a solvent are added to the inorganic powder to form a slurry, and a raw blade is formed by using a conventionally known doctor blade method and a calendar roll method. Sheet 50.

Further, the conductor patterns 52a, 52b, 52c, 53a, 53b and the via conductors 51a, 51b are formed of a paste which is, for example, tungsten (W) which is a main raw material, and is made of aluminum nitride. An organic binder, a solvent, or the like is mixed as a co-agent.

Next, a method of manufacturing the light-emitting element mounting package A2 of the second embodiment will be described with reference to FIGS. 10 to 12 .

In the light-emitting element mounting package A2, two green sheets are subjected to predetermined processing, and then two green sheets are laminated, and finally the formed body is fired.

Hereinafter, each step of the front half of the upper green sheet 60 of the two green sheets will be described with reference to the plan view of Fig. 10, and the steps of the front half of the lower green sheet 70 will be described based on the plan view of Fig. 11. Finally, the steps of the second half of the green sheets 60, 70 are illustrated in accordance with the top view of FIG.

As shown in (a) of FIG. 10, the green sheet 60 previously processed into a predetermined shape is prepared. Next, the predetermined four portions of the green sheets 60 are punched into a circular shape in plan view, and the four hole portions that are punched are filled with the via conductors 61a, 61b, 61c, and 61d (Fig. 10(b)). .

Next, on the upper surface of the green sheet 60, the conductor pattern 62a is printed so as to be in contact with the via conductor 61a, and the conductor pattern 62b is printed so as to be in contact with the via conductor 61b. At the same time, the frame-shaped conductor pattern 62e is printed so as to surround the conductor patterns 62a and 62b. At the same time, the conductor pattern 62c is printed so as to be in contact with the via conductor 61c, and the conductor pattern 62d is printed so as to be in contact with the via conductor 61d ((c) of FIG. 10).

Further, as shown in FIG. 11(a), the green sheet 70 which has been previously processed into a predetermined shape is prepared. Next, conductor patterns 71a and 71b are printed on the upper surface of the green sheet 70 ((b) of Fig. 11). Further, the conductor pattern 71a is formed at a position corresponding to the via conductors 61a and 61c provided in the green sheet 60, and the conductor pattern 71b is formed at a position corresponding to the via conductors 61b and 61d provided in the green sheet 60.

Next, the conductor pattern 72a is printed so as to cover the lower surface of the green sheet 70 ((c) of Fig. 11).

Fig. 12 showing the subsequent steps is a cross-sectional view taken along the line F-F of the line F-F shown in Fig. 10(c). As shown in FIG. 12( a ), the press die 101 of a predetermined shape is used to perform press working from the upper side of the green sheet 60 to form the convex portion 63 ( FIG. 12( b )).

At the same time, the conductor pattern 62a (see FIG. 12(a)) is deformed to form the conductor pattern 62a1 provided on the upper surface of the convex portion 63, the conductor pattern 62a2 provided on the side surface of the convex portion 63, and the convex portion 63. The conductor pattern 62a3 is disposed adjacent to the conductor pattern 62a3.

Here, the convex portion 63 is a portion corresponding to the susceptor 11 (see FIG. 2B) of the light-emitting element mounting package A2, and the conductor patterns 62a1, 62a2, and 62a3 are respectively connected to the element terminal 12a (see FIG. 2B) and the side conductor. 13 (refer to FIG. 2B) and a portion corresponding to the planar conductor 14 (see FIG. 2B).

Further, the via conductors 61a and 61c are respectively corresponding to the substrate-side via conductor 15a (see FIG. 2B) and the terminal-side via conductor 18a (see FIG. 2B) of the light-emitting element mounting package A2. In addition, the conductor patterns 62c and 62e are respectively corresponding to the power supply terminal 16a (see FIG. 2B) and the sealing metal film 20 (see FIG. 2B) of the light-emitting element mounting package A2.

Then, as shown in FIG. 12(c), the green sheet 70 is placed on the lower side of the press-formed green sheet 60 to be heated and pressurized to form a laminated molded body 80 ((d) of FIG. 12).

Here, the conductor pattern 71a is a portion corresponding to the wiring conductor 17a (see FIG. 2B) of the light-emitting element mounting package A2, and the conductor pattern 72a is a portion corresponding to the metal film 21 (see FIG. 2B).

In addition, in the laminated molded body 80, the via conductors 61b and 61d (see FIG. 10(b)) are respectively on the substrate side of the light-emitting element mounting package A2. A portion corresponding to the via conductor 15b (see FIG. 2C) and the terminal side via conductor 18b (see FIG. 2C).

In addition, the conductor patterns 62b and 62d (see (c) of FIG. 10) are respectively corresponding to the component terminal 12b (see FIG. 2C) and the power supply terminal 16b (see FIG. 2C) of the light-emitting element mounting package A2. The conductor pattern 71b (see (b) of FIG. 11) is a portion corresponding to the wiring conductor 17b (see FIG. 2C).

Then, at the end of the manufacturing process, the laminated molded body 80 formed as shown in FIG. 12(d) is fired at a high temperature (about 1800 ° C) to complete the light-emitting element mounting package A2.

Next, a method of manufacturing the light-emitting element mounting package A3 according to the modification shown in FIG. 3A will be described with reference to FIG. In addition, the manufacturing procedure of the light-emitting element mounting package A3 is basically the same as the manufacturing procedure of the light-emitting element mounting package A1 shown in FIGS. 8 and 9, and the description will be focused on different steps.

As shown in FIG. 13(a), in the green sheet 50 in which a plurality of conductor patterns and via conductors are formed, a press die 102 having a predetermined shape is used, and press forming is performed from above the green sheet 50 to form a convex portion. Part 54 ((b) of Fig. 13).

Here, the conductor pattern 52a provided on the upper surface of the green sheet 50 is printed so as to be disposed only on the upper surface of the convex portion 54, and the via conductor 51a penetrating the green sheet 50 is disposed inside the convex portion 54.

Then, the conductor pattern 52a is a portion corresponding to the element terminal 12a (see FIG. 3A) of the light-emitting element mounting package A3, and the via conductor 51a is a via-side via conductor 19 (see FIG. 3A) and a substrate-side via. The portion corresponding to the conductor 15a (see Fig. 3A). Thereby, the light-emitting element mounting package A3 in which the pedestal-side via conductor 19 is provided can be formed.

Next, a method of manufacturing the light-emitting element mounting package A5 shown in FIG. 3C will be described with reference to FIG. In addition, the manufacturing procedure of the light-emitting element mounting package A5 is basically the same as the manufacturing process of the light-emitting element mounting package A2 shown in FIGS. 10 to 12, and the description will be focused on different steps.

The green sheet 60 on which a plurality of conductor patterns and via conductors are formed is press-formed from the upper side of the green sheet 60 using a press die 103 having a predetermined shape (Fig. 14 (a)).

Here, since the convex portion 103a is provided at the position corresponding to the conductor pattern 62e in the press die 103, the groove portion 64 is provided on the surface of the green sheet 60 by the convex portion 103a, and the conductor pattern is disposed inside the groove 64. 62e ((b) of Fig. 14).

Here, the groove 64 is a portion corresponding to the groove 10c (see FIG. 3C) of the light-emitting element mounting package A5, and the conductor pattern 62e is a portion corresponding to the sealing metal film 20 (see FIG. 3C). Thereby, the light-emitting element mounting package A5 in which the groove 10c is formed on the surface 10a of the substrate 10 and the sealing metal film 20 is provided inside the groove 10c can be formed.

 [Examples]  

In the following, the light-emitting element mounting packages A1 to A6 of the respective embodiments and modifications are specifically produced, and then the light-emitting devices to which the light-emitting element mounting packages A1 to A6 are applied are obtained.

First, a mixed powder obtained by mixing cerium oxide powder in a ratio of 5% by mass and a calcium oxide powder in an amount of 1% by mass in 94% by mass of the aluminum nitride powder was prepared as a mixed powder for forming a green sheet.

To 100 parts by mass of the mixed powder (solid content), 20 parts by mass of an acrylic binder was added as an organic binder, and 50 parts by mass of toluene was added to prepare a slurry, followed by a doctor blade method to obtain a predetermined thickness. Raw embryos.

Further, in the formation of conductors such as a conductor pattern and a via conductor, 20 parts by weight of aluminum nitride powder and 8 parts by weight of an acrylic binder are added to 100 parts by weight of tungsten (W) powder, and a suitable product is added. A conductor formed by a terpineol.

Next, the green sheets 50 and the conductors having the above-described components are used, and the green sheets 50 (see (b) and (b) of FIG. 9) and the laminated bodies are produced by the manufacturing method shown in FIGS. 8 to 14 . 80 (refer to (d) of Fig. 12).

The prepared green sheets 50 and the laminated molded bodies 80 were fired in a reducing gas atmosphere at a maximum temperature of 1800 ° C for 2 hours to obtain light-emitting element mounting packages A1 to A6. Further, the dimensions of the package for mounting the light-emitting element mounting A1 to A6 were 2.5 mm in width × 4.2 mm in length × 0.6 mm in height, and the size of the mounting surface 11a was 0.5 mm in width × 0.5 mm in length.

In the light-emitting element mounting packages A1 to A6, a Ni plating film is formed to a thickness of about 5 μm, and then an Au plating film is formed to a thickness of about 0.1 μm.

Next, the light-emitting elements 30 are mounted on the mounting surface 11a of the light-emitting element mounting packages A1 to A6. Here, an Au-Sn adhesive (melting point: 280 ° C) is used for the bonding of the light-emitting element 30 to the mounting surface 11a.

Next, a cover made of iron-nickel-chromium is bonded to the metal film 20 for sealing. Here, this bonding system uses an Ag-Sn adhesive (melting point: 221 ° C), and the internal ambient gas system of the cover 40 is replaced with He gas. Further, a glass plate of a predetermined size which has been applied as an anti-reflection coating is bonded to the lateral window 41 of the cover 40 at a temperature of about 430 ° C by a low-melting glass paste.

In this manner, the light-emitting device of the package for mounting the light-emitting element mountings A1 to A6 of the embodiment is produced. Moreover, as a comparative example, a light-emitting device using a package for mounting a light-emitting element of a conventional metal substrate was also produced.

Next, the thermal resistance of each of the obtained light-emitting devices was evaluated separately. Here, the number of samples n=5 is set for each structure, and the temperature difference between the temperature of the mounting surface 11a of the susceptor 11 and the temperature of the back surface 10b of the substrate 10 is evaluated. That is, the larger the value indicating the temperature difference, the smaller the thermal resistance and the better heat dissipation.

In the thermal resistance evaluation of each of the light-emitting devices, the case where the heat-dissipating member was not joined to the back surface 10b of the substrate 10 and the heat-dissipating member was bonded to the back surface 10b were evaluated. In the sample in which the power supply terminals 16a and 16b are provided on the surface 10a of the substrate 10, the heat dissipating member to be joined is formed such that the heat dissipating member is attached to the entire surface of the back surface 10b of the substrate 10 (width: 2 mm × length: 3 mm × thickness: 2 mm) .

On the other hand, in the sample in which the power supply terminals 16a and 16b are provided on the back surface 10b of the substrate 10, the heat radiating member is formed to have a size in which the power supply terminals 16a and 16b are removed.

In addition to the thermal resistance evaluation, the leakage of He gas inside the cover 40 was also evaluated. Specifically, the obtained light-emitting device was placed in a vacuum vessel, and the time for detecting He gas was measured by a gas chromatograph. In addition, the value of the evaluation result is a relative time when the sample 1 to which the light-emitting element mounting package A1 is applied and the time when He is first detected is 1.0.

Table 1 shows the results of thermal resistance evaluation of each structure and leakage evaluation of He gas.

The light-emitting element mounting package of the present embodiment is obtained by comparing the sample 7 to which the conventional metal substrate is applied, and the samples 1 to 6 to which the light-emitting element mounting packages A1 to A6 of the respective embodiments are applied. A1~A6 have excellent heat dissipation.

Further, the samples 1, 2, and 5 in which the side conductors 13 are provided on the susceptor 11, and the samples 3, 4, and 6 in which the susceptor 11 is provided with the pedestal-side via conductors 19 are compared with each other. 11 The base side via conductor 19 is disposed, and heat dissipation is further improved.

In addition, the samples to which the light-emitting element mounting packages A7 to A17 were applied were produced and evaluated in the same manner. Regarding the thermal resistance of these samples, the heat-dissipating members and the non-heat-dissipating members were in the range of ±1 ° C for each value of the thermal resistance of the sample 6. Further, the results of the He leak test also stopped in the range of 0.95 ± 0.01.

The embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the light-emitting element 30 and the like are hermetically sealed by the cover 40, but the member that is hermetically sealed is not limited to the cover 40. For example, a frame-shaped seal ring (sealing member) provided with a horizontal window at a predetermined position may be combined with a plate-shaped cover to hermetically seal the light-emitting element 30 or the like.

As described above, the package for mounting an electric component (the package for mounting the light-emitting element A1 to A17) of the embodiment includes the flat substrate 10 and the electric component (light-emitting element 30) that protrudes from the surface 10a of the substrate 10 and is mounted thereon. One or more susceptors 11 of the mounting surface 11a of the laser diode 31, the red laser diode 31R, the green laser diode 31G, and the blue laser diode 31B), and the substrate 10 and the pedestal The 11 series is made of ceramic. Thereby, it is possible to realize a package for mounting an electric component having high heat dissipation properties.

Further, the package for mounting an electric component (the package for mounting the light-emitting element A1, A2, A5, A7 to A17) of the embodiment includes the component terminal 12a provided on the mounting surface 11a of the susceptor 11, and the base 11a. The side surface 11b extending in the thickness direction of the susceptor 11 and the substrate-side via conductor 15a extending inside the substrate 10 and extending in the thickness direction of the substrate 10, and the element terminal 12a and the side surface conductor 13 and the substrate side The via conductors 15a are connected. Thereby, the heat dissipation property of the package for mounting an electric component can be made.

Further, the package for mounting an electric component (the package for mounting the light-emitting element A3, A4, and A6) of the embodiment includes the component terminal 12a provided on the mounting surface 11a of the susceptor 11, and the inside of the pedestal 11 and extending The base-side via conductor 19 in the thickness direction of the susceptor 11 and the substrate-side via conductor 15a extending inside the substrate 10 and extending in the thickness direction of the substrate 10, and the element terminal 12a and the pedestal-side via conductor 19 and the substrate The side via conductors 15a are connected. Thereby, the heat dissipation property of the package for mounting an electric component can be further improved.

In addition, the package (the light-emitting element mounting packages A2, A4 to A17) of the embodiment includes the wiring conductor 17a which is provided inside the substrate 10 and extends in the surface direction of the substrate 10, and the wiring conductor 17a and the substrate The side via conductors 15a are connected. Thereby, the power supply terminal 16a can be disposed not only on the back surface 10b of the substrate 10 but also on the surface 10a of the substrate 10.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A2, A4 to A17) of the embodiment, the wiring conductor 17a is provided closer to the back surface 10b of the substrate 10 than the surface 10a of the substrate 10. Thereby, a highly reliable package for mounting an electric component can be realized.

The package for electrical component mounting (the package for mounting the light-emitting element A2, A4 to A17) of the embodiment includes the metal film for sealing 20 provided on the surface 10a side of the substrate 10 so as to surround the susceptor 11, and the sealing metal film 20 The power supply terminal 16a on the outer side of the sealing metal film 20 is connected to the wiring conductor 17a. Thereby, the heat dissipation of the package can be further improved.

In the package (the light-emitting element mounting package A5, A6) of the embodiment, the groove 10c is provided on the surface 10a of the substrate 10 so as to surround the susceptor 11, and the sealing metal film 20 is provided. Inside the groove 10c. Thereby, the reliability of the electrical device can be further improved, and the heat dissipation of the package can be further improved.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A9 to A12, A14) of the embodiment, the power supply terminals 16a and 16b are provided at a position lower than the surface 10a of the substrate 10. Thereby, the alignment of the FPC 200 becomes easy.

In the package for mounting an electric component (light-emitting element mounting packages A12 and A14) of the embodiment, the outer edges of the power supply terminals 16a and 16b have two linear edges 16c and 16d that intersect each other, and two edges 16c. The 16d is arranged to be aligned with the edges of the end surface 10d and the side surface 10e of the substrate 10, respectively. Thereby, the module design of the electric device can be made easy.

In the package for mounting an electric component (light-emitting element mounting packages A13 and A14) of the embodiment, the region inside the sealing metal film 20 is larger than the surface 10a of the substrate 10 except for the portion of the susceptor 11. Depression. Thereby, it is possible to simultaneously achieve further lowering of the electrical device and suppressing surface reflection of light from the surface 10a side.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A15 to A17) of the embodiment, a plurality of susceptors 11 are provided in a region inside the metal film 20 for sealing. Thereby, the miniaturization of the electric device can be achieved.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A16 and A17) of the embodiment, the first pedestal 11A and the second pedestal 11B are provided in the inner region of the sealing metal film 20. The hybrid base 11C serves as the susceptor 11, and the height of the second pedestal 11B of the hybrid pedestal 11C is lower than the height of the first pedestal 11A. Thereby, the light L1 (L _R , L _G , and the light emitted from the laser diode 31 (the red laser diode 31R, the green laser diode 31G, and the blue laser diode 31B) can be used. The amount of light of L _B ) is fed back.

In the package for mounting an electric component (light-emitting element mounting package A17) of the embodiment, three sets of the hybrid pedestal 11C are provided in the inner region of the sealing metal film 20. Thereby, it is possible to realize an optical device that can emit the adjusted high-quality light L _RGB and use it as a display light source.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A17) of the embodiment, the three-group hybrid pedestal 11C includes the first pedestal 11A for mounting the red laser diode 31R. The red hybrid pedestal 11C1, the green hybrid pedestal 11C2 having the first pedestal 11A for mounting the green laser diode 31G, and the first base for mounting the blue laser diode 31B. The blue mixing base 11C3 of the seat 11A, and the interval between the red mixing base 11C1 and the green mixing base 11C2, or the interval between the red mixing base 11C1 and the blue mixing base 11C3 is narrow. D1 is wider than the interval D2 between the green mixing base 11C2 and the blue mixing base 11C3. Thereby, the stable light L _R can be emitted from the red laser diode 31R.

Further, in the package for mounting an electric component (the package for mounting the light-emitting element A17) of the embodiment, the three types of hybrid pedestals 11C are arranged so as to be mounted from the respective laser diodes (red laser diodes 31R, The directions of the light beams L _R , L _G , and L _B emitted by the green laser diode 31G and the blue laser diode 31B) are directed in a direction that does not collide with the three sets of the hybrid pedestals 11C. This makes it possible to realize a compact and high-quality RGB integrated module.

In the array type package C1 of the embodiment, a plurality of packages for mounting electrical components (light-emitting element mounting packages A1 to A17) are connected. Thereby, an array type electric device can be obtained.

In the array type package C1 of the embodiment, the package for mounting an electric component (the package for mounting the light-emitting element A1 to A17) is integrally sintered. Thereby, an array type electric device having high heat dissipation and high strength can be obtained.

In addition, the electric device of the embodiment includes the package for mounting the electric component (the package for mounting the light-emitting element A1 to A17) and the mounting surface for the package for mounting the component (the package for mounting the light-emitting device A1 to A17) 11a electrical component (light emitting element 30, laser diode 31, red laser diode 31R, green laser diode 31G, blue laser diode 31B). Thereby, an electrical device with high heat dissipation can be realized.

In addition, the electric device of the embodiment includes the package for mounting the electric component (the package for mounting the light-emitting element A1 to A17), and the mounting surface 11a of the package for mounting the component (the package for mounting the light-emitting device A1 to A17) Electrical components (light-emitting element 30, laser diode 31, red laser diode 31R, green laser diode 31G, blue laser diode 31B); and metal film 20 provided for sealing The cover 40 of the upper horizontal window 41. Thereby, a highly reliable electrical device can be realized.

Further, the electric device of the embodiment includes the array type package C1 and the electric components (the light emitting element 30, the laser diode 31, the red laser diode 31R, and the mounting surface 11a of the array type package C1). Green laser diode 31G, blue laser diode 31B). Thereby, an array type electric device having high heat dissipation and high strength can be obtained.

Further efficacies and modifications are readily available to those of ordinary skill in the art to which the invention pertains. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described. Therefore, various modifications may be made without departing from the spirit and scope of the inventions of the invention.

Claims (20)

 A package for mounting an electric component, comprising: a flat plate-shaped substrate; and one or more pedestals protruding from a surface of the substrate and having a mounting surface on which the electric component is mounted, wherein the substrate and the pedestal are ceramic Integrated.    The package for mounting an electric component according to claim 1, comprising: a terminal for the component, which is provided on the mounting surface of the susceptor; and a side conductor that is provided on a side surface of the pedestal and extends in a thickness direction of the susceptor; The substrate-side via conductor is provided inside the substrate and extends in a thickness direction of the substrate, and the element terminal and the side surface conductor are connected to the substrate-side via guide system.    The package for electrical component mounting according to claim 1, comprising: a terminal for the element, which is provided on the mounting surface of the susceptor; and a pedestal-side via conductor that is provided inside the pedestal and extends over the susceptor The thickness direction and the substrate-side via conductor are provided inside the substrate and extend in a thickness direction of the substrate, and the element terminal and the pedestal-side via conductor are connected to the substrate-side via conductive system.    The package for electrical component mounting according to claim 2 or 3, comprising: a wiring conductor provided inside the substrate and extending in a surface direction of the substrate, wherein the wiring conductor and the substrate-side via guide system are connected.    The package for mounting an electric component according to claim 4, wherein the wiring guide system is disposed closer to a rear surface of the substrate than the surface of the substrate.    The package for electrical component mounting of claim 4 or 5, comprising: a metal film for sealing provided on the surface side of the substrate so as to surround the susceptor; and a terminal for power supply provided in the metal film for sealing On the outer side, the power supply terminal and the wiring guide system are connected.    The package for mounting an electric component according to claim 6, wherein the surface of the substrate is provided with a groove so as to surround the susceptor, and the metal film for sealing is provided inside the groove.    The package for electrical component mounting according to claim 6 or 7, wherein the power supply terminal is provided at a position lower than a surface of the substrate.    The package for mounting an electric component according to any one of claims 6 to 8, wherein the outer edge of the power supply terminal has two straight edges that intersect each other, and the two edges are disposed to face and the side faces of the substrate, respectively. The edges are aligned.    The electrical component mounting package according to any one of claims 6 to 9, wherein a region inside the sealing metal film is recessed from the surface of the substrate except for a portion of the susceptor.    The package for mounting an electric component according to any one of claims 6 to 10, wherein a plurality of the susceptors are provided in a region inside the sealing metal film.    The package for mounting an electric component according to claim 11, wherein a mixing base having a first pedestal and a second pedestal is provided in a region inside the sealing metal film, and the pedestal is a susceptor The height of the second pedestal is lower than the height of the first pedestal.    The package for mounting an electric component according to claim 12, wherein three sets of the mixing pedestals are provided in a region inside the sealing metal film.    The package for electrical component mounting of claim 13, wherein the three sets of the hybrid pedestal include: a red hybrid pedestal having the first pedestal for mounting a red laser diode; and a green hybrid pedestal; a first pedestal for mounting a green laser diode; and a blue susceptor having a first pedestal for mounting a blue laser diode, the red hybrid pedestal and The interval between the green mixing pedestals or the interval between the red mixing pedestal and the blue mixing pedestal is smaller than the spacing between the green mixing pedestal and the blue mixing pedestal. Also wide intervals.    The package for mounting an electric component according to claim 13 or 14, wherein the three sets of the hybrid pedestal are arranged such that the orientation of the light emitted from the respective laser diodes mounted thereon does not collide with the three sets of the aforementioned mixture. The direction of the pedestal.    An array type package in which a plurality of packages for mounting an electric component according to any one of claims 1 to 15 are connected.    The array type package according to claim 16, wherein the package for mounting the electric component is integrally sintered with each other.    An electric device according to any one of claims 1 to 15, wherein the electrical component is mounted on the mounting surface of the electrical component mounting package.    An electrical device according to any one of claims 6 to 15, wherein the electrical component is mounted on the mounting surface of the electrical component mounting package, and the cover is provided on the electrical device. The transverse window on the metal film for sealing described above.    An electric device comprising: an array type package according to claim 16 or 17; and an electrical component mounted on a mounting surface of the array type package.